Device

Abstract

This device comprises: an acquisition unit that acquires arrangement information about each component in a package including a plurality of the components; a determination unit that determines a cooling intensity at each position of the components among the plurality of components on the basis of the arrangement information about each component; and a plurality of cooling devices that cool the plurality of components at each position of the components on the basis of the cooling intensities determined at each position of the components. The acquisition unit may acquire measured temperature information about each component and target temperature information about each component. The determination unit may update the cooling intensity at each position of the components on the basis of a comparison result between the measured temperature information about each component and the target temperature information about each component, and the initial values of the cooling intensities.

Description

Device

[0001] The present invention relates to an apparatus.

[0002] A method for determining the position of equipment to be installed in a server room so that the physical and thermo-fluid dynamic conditions within the server room are satisfied is disclosed in Patent Document 1. Also, Patent Document 2 discloses an apparatus aimed at providing a cooling mechanism for electrical equipment that consumes low power and is highly reliable.

[0003] 6 is a diagram showing an example configuration of the device 201. The device 201 is a communications device. The device 201 includes one or more packages 202 (communications packages) and multiple cooling devices 203. The packages 202 are inserted into empty slots (not shown) provided in the device 201. The packages 202 include multiple components 204. For example, package 202-1-1 includes components 204-1-1, 204-1-2, and 204-1-3. Each cooling device 203 is disposed in a position in the device 201 where it can cool one or more packages 202 associated with the cooling device, regardless of the positions of the components 204 in the package 202.

[0004] JP 2015-114768 A JP 2013-219072 A

[0005] 6, a plurality of packages 202-1 are grouped. Also, a plurality of packages 202-2 are grouped. For example, the grouped plurality of packages 202-1 are associated with cooling devices 203-1-1 and 203-1-2. That is, the grouped plurality of packages 202-1 are cooled by cooling devices 203-1-1 and 203-1-2.

[0006] Here, the cooling devices 203-1-1 and 203-1-2 uniformly cool all of the components 204-1 in the grouped packages 202-1 based on the measured temperature of a specific component 204-1 in the grouped packages 202-1.

[0007] Similarly, the other cooling devices 203 provided in the device 201 uniformly cool all of the components 204 in the multiple packages 202 associated with the cooling device itself. In this way, each cooling device uniformly cools all of the components in the package, including components that do not require much cooling in a package containing multiple components. This results in a problem of an unnecessarily large increase in power required to cool a package containing multiple components.

[0008] In view of the above circumstances, an object of the present invention is to provide an apparatus that can prevent an unnecessary increase in the power required to cool a package that includes multiple components.

[0009] One aspect of the present invention is an apparatus that includes an acquisition unit that acquires placement information of each component in a package that includes multiple components; a determination unit that determines a cooling intensity for each position of the multiple components based on the placement information of each component; and multiple cooling devices that cool the multiple components for each position of the components based on the cooling intensity determined for each position of the components.

[0010] The present invention makes it possible to prevent the power required to cool a package containing multiple components from increasing more than necessary.

[0011] 1 is a diagram illustrating an example of the configuration of an apparatus in an embodiment; FIG. 2 is a diagram illustrating an example of the configuration of a control device in an embodiment; FIG. 3 is a diagram illustrating an example of a cooling intensity table in an embodiment; FIG. 4 is a flowchart illustrating an example of the operation of an apparatus in an embodiment; FIG. 5 is a diagram illustrating an example of the hardware configuration of a control device in an embodiment; and FIG. 6 is a diagram illustrating an example of the configuration of an apparatus.

[0012] An embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a diagram (front view, side view, and perspective top view) showing an example of the configuration of an apparatus 1 in an embodiment. The apparatus 1 is an apparatus for cooling a predetermined cooling target. The apparatus 1 is not limited to an apparatus for a specific purpose, but may be, for example, a communication apparatus.

[0013] The device 1 includes one or more packages 11, a plurality of cooling devices 12 (small cooling devices) for each package 11, and a control device 13. When the device 1 is a communication device, the package 11 is a communication package. The package 11 may include a memory (not shown). The memory of the package 11 stores the type of package 11 in advance.

[0014] The package 11 is inserted into an empty slot (not shown) provided in the device 1. The package 11 includes a plurality of components 14 (predetermined cooling targets). The package 11 may include a temperature sensor (not shown) for each component 14. In the package 11, for example, a position that is not a position of a component 14 with a high processing load and where a plurality of components 14 are interconnected is a position that needs to be cooled with a "weak" cooling strength. Also, for example, a position where components 14 with a high processing load are concentrated is a position that needs to be cooled with a "strong" cooling strength.

[0015] In this way, the degree to which each position of the component 14 needs to be cooled immediately after the package 11 is inserted into the slot (not shown) (initial state) is determined depending on the type of package 11 (type of arrangement of the component 14).

[0016] For example, package 11-1-1 includes components 14-1-1, 14-1-2, and 14-1-3. The position of component 14-1-1 is, for example, a position that needs to be cooled with a "strong" cooling strength. The position of component 14-1-2 is, for example, a position that needs to be cooled with a "medium" cooling strength. The position of component 14-1-3 is, for example, a position that needs to be cooled with a "weak" cooling strength.

[0017] The method by which the cooling device 2 cools the package 11 is not limited to a specific method, but may be, for example, an air-cooling method, a water-cooling method, or a heat pump method. When the method by which the cooling device 2 cools the package 11 is an air-cooling method, that is, when the cooling device 2 is a fan, the cooling strength is expressed by the rotation speed of the fan.

[0018] Each cooling device 12 is disposed in the device 1 at a position where it can cool one or more packages 11 associated with the cooling device for each position of each component 14 in the package 11 .

[0019] For example, the cooling device 12-1-1 is disposed in a position in the device 1 where it can cool the component 14-1-1 of the package 11-1-1 and the component 14-1-4 (not shown) of the package 11-1-2. Here, the position of the component 14-1-4 (not shown) of the package 11-1-2 corresponds to the position of the component 14-1-1 in the package 11-1-1 (the front position of the package 11-1-1).

[0020] For example, the cooling device 12-1-2 is disposed in a position in the device 1 where it can cool the component 14-1-2 in the package 11-1-1 and the component 14-1-5 (not shown) in the package 11-1-2. Here, the position of the component 14-1-5 (not shown) in the package 11-1-2 corresponds to the position of the component 14-1-2 in the package 11-1-1 (the central position in the package 11-1-1).

[0021] For example, the cooling device 12-1-3 is disposed in a position in the device 1 where it can cool the component 14-1-3 in the package 11-1-1 and the component 14-1-6 (not shown) in the package 11-1-2. Here, the position of the component 14-1-6 (not shown) in the package 11-1-2 corresponds to the position of the component 14-1-3 in the package 11-1-1 (the rear position in the package 11-1-1).

[0022] Note that which cooling device 12 each package 11 is associated with varies depending on the insertion status of the package 11 into a slot (not shown) in the device 1, the number of cooling devices 12, and the cooling capacity of the cooling devices 12.

[0023] 2 is a diagram showing an example of the configuration of the control device 13 in the embodiment. The control device 13 includes a communication unit 131, an acquisition unit 132, a storage device 133, a determination unit 134, and a control unit 135.

[0024] The control device 13 controls the cooling intensity of each cooling device 12 associated with the package 11 according to the type of package 11 (arrangement information of the components 14). For example, when the package 11 is inserted into an empty slot, the communication unit 131 communicates with the package 11. The communication unit 131 communicates with the cooling device 12. For example, the communication unit 131 transmits an instruction signal generated by the control unit 135 to the cooling device 12 that is the destination of the instruction signal.

[0025] When a package 11 is inserted into an empty slot (when a new package 11 is detected), the acquisition unit 132 (collection unit) acquires placement information "A" of the components 14 in the inserted package 11 (the type of placement of the components 14) from a memory (not shown) of the inserted package 11. The acquisition unit 132 acquires the placement information "A" of the components 14 from the memory (not shown) of the inserted package 11 via the communication unit 131, for example, using an acquisition command. The acquisition unit 132 acquires measured temperature information (current temperature information) of each component 14 from a temperature sensor (not shown) of the package 11 equipped with each component 14.

[0026] The storage device 133 stores in advance programs to be executed by the acquisition unit 132, the determination unit 134, and the control unit 135. The storage device 133 stores in advance a target temperature for each component 14. The target temperature is determined in advance for each component 14 based on the guaranteed operating temperature of the component 14. The target temperature may be determined in advance for each component 14 based on at least one of the type of device 1, the amount of communication of the device 1, the position of the packages 11 in the device 1, and the number of packages 11 in the device 1. The storage device 133 stores in advance a cooling intensity table.

[0027] 3 is a diagram showing an example of a cooling strength table in an embodiment. In the cooling strength table, cooling device identification information, component placement information, slot numbers, component position information, and cooling strength are associated with each other. Here, "component placement information" is information indicating the type of placement of the component 14 in the package 11, and is expressed, for example, as "A" or "B." "Component position information" is information indicating the position of the component 14 in the package 11, and is expressed, for example, as "coordinates (code)." "Component position information" may be expressed, for example, as "front," "center," and "rear."

[0028] For example, the identification information "12-1-1" of the cooling device 12 on the front side in package 11-1-1 and package 11-1-2, the placement information "A" of the component 14, the slot numbers "11-1-1, 11-1-2" of package 11-1-1 and package 11-1-2, the position information "14-1-1, 14-1-4" of the component 14 (the front position in package 11-1-1), and the cooling strength "strong" are associated with each other.

[0029] For example, the identification information "12-1-2" of the central cooling device 12 in package 11-1-1 and package 11-1-2, the placement information "A" of the component 14, the slot numbers "11-1-1, 11-1-2" of package 11-1-1 and package 11-1-2, the position information "14-1-2, 14-1-5" of the component 14 (the central position in package 11-1-1), and the cooling strength "medium" are associated with each other.

[0030] For example, the identification information "12-1-3" of the rear cooling device 12 in package 11-1-1 and package 11-1-2, the placement information "A" of the component 14, the slot numbers "11-1-1, 11-1-2" of package 11-1-1 and package 11-1-2, the position information "14-1-3, 14-1-6" of the component 14 (the rear position in package 11-1-1), and the cooling strength "weak" are associated with each other.

[0031] Based on the cooling strength table, the determination unit 134 determines the initial value of the cooling strength for each position of the component 14. Here, the determination unit 134 determines the initial value of the cooling strength for each position of the component 14 based on the "slot number" assigned to the slot into which the package 11 is inserted and the "component placement information" (type of package 11).

[0032] For example, when the slot number is "11-1-1" and the component placement information is "A", the determination unit 134 determines that the initial value of the cooling strength at each position of components 14-1-1 and 14-1-4 (not shown) cooled by the cooling device 12-1-1 is "strong".

[0033] For example, when the slot number is "11-1-1" and the component placement information is "A", the determination unit 134 determines that the initial value of the cooling strength at each position of components 14-1-2 and 14-1-5 (not shown) cooled by the cooling device 12-1-2 is "medium".

[0034] For example, when the slot number is "11-1-1" and the component placement information is "A," the determination unit 134 determines that the initial value of the cooling strength at each position of components 14-1-3 and 14-1-6 (not shown) cooled by the cooling device 12-1-3 is "weak."

[0035] The determination unit 134 identifies a cooling device 12 capable of cooling the component based on the “component position information” associated with the “slot number” assigned to the slot into which the package 11 is inserted. The determination unit 134 notifies the control unit 135 of the initial value of the cooling strength determined for each position of the component 14.

[0036] The determination unit 134 updates the cooling strength based on the measured temperature information of each component 14, the target temperature information of each component 14, and the initial value of the cooling strength. For example, the determination unit 134 determines the measured temperature "T ｃ ” and target temperature “T ｔ "Comparison result "T ｃ / T ｔ" may be multiplied by the initial value of the cooling intensity, and the result may be determined as the next cooling intensity. Here, the larger the value of the multiplication result, the stronger the cooling intensity. The determination unit 134 notifies the control unit 135 of the updated cooling intensity for each position of the component 14.

[0037] The control unit 135 instructs the determined initial value of cooling intensity to the cooling device 12 capable of cooling the position of the component 14 for each position of the component 14. The control unit 135 instructs the updated cooling intensity to the cooling device 12 capable of cooling the position of the component 14 for each position of the component 14.

[0038] Next, an example of the operation of the device 1 will be described. Fig. 4 is a flowchart showing an example of the operation of the device 1 in this embodiment. The acquisition unit 132 determines whether or not a new package 11 inserted into the device 1 has been detected (step S101). If a new package 11 has not been detected (step S101: NO), the acquisition unit 132 executes step S101 again.

[0039] If a new package 11 is detected (step S101: YES), the acquiring unit 132 acquires the layout information of each component 14 from the inserted package 11 (step S102).The acquiring unit 132 records the layout information of each component 14 and the slot number assigned to the slot into which the package 11 is inserted in the storage device 133 (step S103).

[0040] The determination unit 134 determines an initial value of cooling strength for each position of the component 14 (step S104). The determination unit 134 notifies the control unit 135 of the initial value of cooling strength determined for each position of the component 14 (step S105). The control unit 135 notifies the determined initial value of cooling strength for each position of the component 14 to the cooling device 12 capable of cooling that position (step S106).

[0041] The acquiring unit 132 acquires measured temperature information (current temperature information) of each component 14 from a temperature sensor (not shown) in the package 11 including each component 14 (step S107). The acquiring unit 132 records the measured temperature information of each component 14 in the storage device 133 (step S108). The acquiring unit 132 acquires target temperature information of each component 14 from the storage device 133 (step S109).

[0042] The determination unit 134 updates the cooling strength based on the measured temperature information of each component 14, the target temperature information of each component 14, and the initial value of the cooling strength (step S110). The determination unit 134 notifies the control unit 135 of the updated cooling strength for each position of the component 14 (step S111). The control unit 135 instructs the cooling device 12 capable of cooling each position of the component 14 to use the updated cooling strength (step S112). The control unit 135 returns the process to step S107.

[0043] As described above, the acquisition unit 132 acquires the layout information of each component 14 in the package 11 including the multiple components 14, for example, from the package 11. The acquisition unit 132 may acquire the layout information of each component 14 in the package 11 including the multiple components 14 from the storage device 133. The determination unit 134 determines the cooling intensity for each position of the component 14 in the multiple components 14 based on the layout information of each component 14. The multiple cooling devices 12 cool the multiple components 14 for each position of the component 14 based on the cooling intensity determined for each position of the component 14.

[0044] In this way, the device 1 dynamically cools each component 14 in the inserted package 11. This makes it possible to prevent the power required to cool the package 11 containing multiple components from increasing more than necessary.

[0045] The acquisition unit 132 acquires the measured temperature information “T ｃ ,” and target temperature information “T ｔ " may be acquired. ｔ " is determined in advance for each component 14. The determination unit 134 determines the result "T ｃ / Tｔ ” and the initial value of the cooling strength (for example, the number of rotations of the fan “R”), the temperature of the component 14 is set to “T ｃｔ For example, the determination unit 134 may update the cooling intensity for each position of the component 14, such that the comparison result "T ｃ / T ｔ Based on the result of multiplying " by the initial value of the cooling intensity, the temperature of the component 14 is set to "T ｔ The cooling intensity may be updated for each position of the component 14, for example.

[0046] The control device 13 (determination function unit) of the present invention can also be realized by a computer and a program, and the program can be recorded on a recording medium or provided via a network.

[0047] (Hardware Configuration) FIG. 5 is a diagram illustrating an example of the hardware configuration of the control device 13 in an embodiment. The control device 13 is realized as software by a processor 101, such as a CPU (Central Processing Unit), executing a program stored in a storage device 133 having a non-volatile recording medium (non-transitory recording medium) and the memory 102. The program may be recorded on a computer-readable recording medium. Examples of computer-readable recording media include portable media such as a flexible disk, a magneto-optical disk, a ROM (Read Only Memory), and a CD-ROM (Compact Disc Read Only Memory), and non-transitory recording media such as a hard disk or a solid-state drive (SSD) built into a computer system. The communication unit 131 executes predetermined communication processing.

[0048] The control device 13 may be realized using hardware including an electronic circuit (electronic circuit or circuitry) using, for example, an LSI (Large Scale Integrated circuit), an ASIC (Application Specific Integrated Circuit), a PLD (Programmable Logic Device), or an FPGA (Field Programmable Gate Array).

[0049] Although an embodiment of the present invention has been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and includes designs within the scope of the gist of the present invention.

[0050] The present invention is applicable to communication devices.

[0051] 1...device, 11...package, 12...cooling device, 13...control device, 14...component, 101...processor, 102...memory, 131...communication unit, 132...acquisition unit, 133...storage device, 134...determination unit, 135...control unit, 201...device, 202...package, 203...cooling device, 204...component

Claims

1. An apparatus comprising: an acquisition unit that acquires location information of each component in a package containing multiple components; a determination unit that determines a cooling strength for each component position in the multiple components based on the location information of each component; and multiple cooling devices that cool the multiple components for each component position based on the cooling strength determined for each component position.

2. The device described in claim 1, wherein the acquisition unit acquires measured temperature information of each of the components and target temperature information of each of the components, and the determination unit updates the cooling strength for each position of the components based on a comparison result between the measured temperature information of each of the components and the target temperature information of each of the components and an initial value of the cooling strength.

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