Insert carrier for ESD prevention

Abstract

The present invention provides an insert carrier for ESD prevention, comprising: a body having a pocket portion formed so as to accommodate a semiconductor package, and a connecting projection protruding from the pocket portion; a support sheet having a through hole formed so as to allow a terminal of the semiconductor package to pass through and an escape hole into which the connecting projection escapes, and formed so as to support the semiconductor package accommodated in the pocket portion; and an insulating film laminate positioned between the pocket portion and the support sheet in a state attached to the support sheet and made of a plurality of layers of electrically insulating films in which an accommodation step hole is formed into which a portion of the connecting projection passing through the escape hole is inserted and deformed.

Description

Insert carrier for ESD protection

[0001] The present invention relates to an insert carrier used for testing semiconductor packages.

[0002]

[0003] Typically, semiconductor packages completed through the manufacturing process undergo a testing process to ensure proper implementation of their operating characteristics. Only those products classified as good are shipped. During the inspection process, the insert carrier accommodates the semiconductor package and maintains its alignment with the socket.

[0004] As semiconductor packages become smaller and finer, a method of supporting the semiconductor package by combining a supporter with the lower part of the body is being used instead of exposing the semiconductor package directly from the carrier body.

[0005] A metal frame is used to bond the carrier body and the support. However, this metal frame raises concerns about electrostatic discharge (ESD) during semiconductor package testing. EDS can cause electrical interference during semiconductor package testing.

[0006] The background technology described above is technical information that the inventor possessed for the purpose of deriving embodiments of the present invention or acquired during the derivation process, and cannot necessarily be said to be publicly known technology disclosed to the general public prior to the present application.

[0007]

[0008] One object of the present invention is to provide an insert carrier for ESD prevention, in which the carrier's joint structure does not protrude toward the socket without causing an ESD problem.

[0009]

[0010] An insert carrier for ESD prevention according to one aspect of the present invention for realizing the above-described task may include a body having a pocket portion formed to accommodate a semiconductor package and a connecting projection protruding from the pocket portion; a support sheet having a through hole formed to allow a terminal of the semiconductor package to pass through and an escape hole for escaping the connecting projection, and formed to support the semiconductor package accommodated in the pocket portion; and an insulating film laminate made of a plurality of layers of electrically insulating films, which are positioned between the pocket portion and the support sheet in a state of being attached to the support sheet, and in which an accommodation step hole is formed into which a portion of the connecting projection that has passed through the escape hole is deformed and inserted.

[0011] Here, the portion of the connecting protrusion that passes through the escape hole may be hot-stamped and thermally deformed.

[0012] Here, the insulating film laminate includes a first film having a first hole; and a second film having a second hole and positioned closer to the support sheet than the first film, wherein the first hole and the second hole have different inner diameters to form the receiving step hole.

[0013] Here, the second hole may have an inner diameter larger than that of the first hole.

[0014] Here, the insulating film laminate may further include an adhesive layer disposed between the second film and the support sheet.

[0015] Here, the adhesive layer may be formed only in correspondence to the area occupied by the second film so as not to act on the semiconductor package supported on the support sheet.

[0016] Here, the first film and the second film may be ESD coated.

[0017] Here, the first film and the second film may be formed of a polyimide material.

[0018] Here, the first film, the second film, and the support sheet may be formed of the same material.

[0019] Here, the insulating film laminate may have a thickness greater than that of the support sheet.

[0020] An insert carrier for ESD prevention according to another aspect of the present invention may include a body having a pocket portion formed to accommodate a semiconductor package, a connecting protrusion formed to protrude from the pocket portion, and a fixing piece fixed to the connecting protrusion; a support sheet having a through hole formed to allow a terminal of the semiconductor package to pass through and formed to support the semiconductor package accommodated in the pocket portion; and an insulating film laminate formed of a plurality of layers of electrically insulating films that are combined with the support sheet and have a receiving step hole formed to accommodate the fixing piece.

[0021] Here, the insulating film laminate may be positioned between the pocket portion and the support sheet.

[0022] Here, the connecting protrusion may include an insertion groove, and the fixing piece may include a shank portion that is inserted and fixed into the insertion groove; and a head portion that has a width greater than the shank portion and is received in the receiving step hole.

[0023]

[0024] According to the insert carrier for ESD prevention according to the present invention configured as described above, the connection between the body and the support sheet is achieved by some of the connecting protrusions of the body being deformed and accommodated in the accommodation step holes of the electrically insulating film laminate attached to the support sheet, so that the possibility of an ESD problem occurring due to the above connection structure can be structurally prevented. In addition, since the above connection structure does not protrude beyond the support sheet toward the socket, it may not cause a problem of structural interference during the testing process.

[0025]

[0026] FIG. 1 is an assembled perspective view of an insert carrier for ESD prevention according to one embodiment of the present invention.

[0027] Figure 2 is an exploded perspective view of the insert carrier of Figure 1.

[0028] Figure 3 is a cross-sectional view of the insert carrier of Figure 1 before final assembly.

[0029] Figure 4 is a cross-sectional view of the main part of Figure 3.

[0030] Figure 5 is a partial cross-sectional view of the support sheet and film laminate of Figure 3.

[0031] Figure 6 is a cross-sectional view of the final assembled state of the insert carrier in Figure 4.

[0032] FIG. 7 is a partially exploded cross-sectional view showing an insert carrier according to a modified example of the insert carrier of FIG. 4.

[0033]

[0034] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0035] The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and with various modifications. However, these embodiments are provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but should be understood to include all modifications, equivalents, and substitutes included within the technical spirit and scope of the present invention, as well as substitutions or additions of the components of one embodiment with those of another embodiment.

[0036] The attached drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification, but should be understood to encompass all modifications, equivalents, and substitutes included within the spirit and technical scope of the present invention. In the drawings, the components may be expressed in exaggerated sizes or thicknesses for ease of understanding, but the scope of protection of the present invention should not be construed as being limited thereby.

[0037] The terminology used in this specification is only used to describe specific implementations or examples and is not intended to limit the present invention. In addition, the singular expressions include plural expressions unless the context clearly indicates otherwise. In the specification, terms such as "comprises" and "consists of" are intended to indicate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. In other words, it should be understood that terms such as "comprises" and "consists of" do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0038] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0039] When a component is referred to as being "connected / connected" or "connected" to another component, it should be understood that it may be directly connected / connected to that other component, or that there may be other components in between. Conversely, when a component is referred to as being "directly connected / connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0040] When a component is referred to as being "above" or "below" another component, it should be understood that it is not only positioned directly above that other component, but that there may also be other components present in between.

[0041] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0042] FIG. 1 is an assembled perspective view of an insert carrier for ESD prevention according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view of the insert carrier of FIG. 1.

[0043] Referring to these drawings, the insert carrier (100) may include a body (110), a support sheet (130), and a film laminate (150).

[0044] The body (110) may have a pocket portion (111) for accommodating a semiconductor package. The pocket portion (111) may have a cavity that is open from top to bottom along a vertical direction (V). The vertical direction (H) may be a direction that substantially vertically penetrates the support sheet (130). The cavity may have a substantially rectangular cross-section corresponding to the semiconductor package. The cavity may have a shape in which the cross-sectional area narrows from the top to the bottom.

[0045] A connecting protrusion (115) may be formed to protrude from the pocket portion (111). Specifically, the connecting protrusion (115) may protrude downward along the vertical direction (V) from the bottom surface of the pocket portion (111). The connecting protrusion (115) may be formed integrally with the pocket portion (111), or may be manufactured separately and then coupled to the pocket portion (111).

[0046] A support sheet (130) is positioned to block the lower portion of the cavity. The support sheet (130) can support the semiconductor package accommodated in the cavity. The support sheet (130) can have a through hole (131) formed to allow a terminal of the semiconductor package to pass through. The terminal can be electrically connected to a terminal of the socket through the through hole (131). The support sheet (130) can be formed of an electrically insulating material.

[0047] The film laminate (150) is a configuration that serves as a base for connection between the pocket portion (111) and the support sheet (130). The film laminate (150) is attached to the support sheet (130). The film laminate (150) may also be positioned between the pocket portion (111) and the support sheet (130). The film laminate (150) may have a loop shape, for example, a square ring shape, when viewed from above along the vertical direction (H).

[0048] The relationship between the film laminate (150) and other components is explained with reference to Fig. 3. Fig. 3 is a cross-sectional view of the insert carrier of Fig. 1 before final assembly.

[0049] Referring to this drawing, the film laminate (150) can be combined with the pocket portion (111) while being attached to the support sheet (130). Specifically, the film laminate (150) (and the support sheet (130) attached thereto) can be positioned so as to face the bottom surface of the pocket portion (111). The connecting protrusion (115) passes through the film laminate (150) and the support sheet (130) and protrudes downward along the vertical direction (V).

[0050] This arrangement relationship is based on the intermediate bonding state. The bonding relationship between the connecting protrusion (115), the film laminate (150), and the support sheet (130) is described in more detail with reference to FIGS. 4 and 5.

[0051] Fig. 4 is a cross-sectional view of the main body of Fig. 3, and Fig. 5 is a partial cross-sectional view of the support sheet and film laminate of Fig. 3.

[0052] Referring to these drawings, a film laminate (150) can be accommodated in a concave portion of the bottom surface of the pocket portion (111). The film laminate (150) is formed by laminating multiple layers of electrically insulating films (151, 155). Specifically, the multiple layers of insulating films (151, 155) can have a first film (151) and a second film (155). The second film (155) can be arranged closer to the support sheet (130) than the first film (151).

[0053] The first film (151) and the second film (155) may be made of, for example, a polyimide material. The support sheet (130) may also be made of a polyimide material. In this case, since the film laminate (150) and the support sheet (130) are made of the same polyimide material, their electrical properties are unified. The first film (151) and the second film (155) may additionally be subjected to an ESD coating treatment, thereby meeting higher standards related to ESD.

[0054] The first film (151) has a first hole (152), and the second film (155) has a second hole (156). The first hole (152) and the second hole (156) have different inner diameters, so that a receiving step hole (153) can be formed. The receiving step hole (153) is a hole having a stepped cross-section along the vertical direction (H). Specifically, the inner diameter of the second hole (156) can be larger than that of the first hole (152). The first hole (152) and the second hole (156) can be formed by laser hole processing. Since the inner diameters of the first hole (152) and the second hole (156) are different, they (151, 155) can be bonded to each other after hole processing that is performed independently for each.

[0055] In order to attach the second film (155) to the support sheet (130), an adhesive layer (159) may be disposed between them. The adhesive layer (159) may be formed by thermally curing an adhesive sheet. The adhesive layer (159) may be formed only in a region corresponding to the region occupied by the second film (155), and may not be disposed beyond that region to the region of the support sheet (130) where the semiconductor package is placed. Accordingly, when the semiconductor package is placed on the support sheet (130), the problem of the semiconductor package being adhered to the adhesive layer (159) and thus not being properly picked up will not occur. The adhesive layer (159) may be disposed not only between the second film (155) and the support sheet (130), but also between the second film (155) and the first film (151).

[0056] The support sheet (130) may have an escape hole (135) for escaping the connecting protrusion (115). The escape hole (135) may have a size corresponding to the second hole (156). The escape hole (135) may also be concentric with the first hole (152) and the second hole (156) when projected in a vertical direction (H) on the ground. Alternatively, if the edge area of ​​the support sheet (130) corresponding to the connecting protrusion (115) is removed, a separate escape hole (135) may not be formed.

[0057] The form of the final connection between the above connecting protrusion (115) and the film laminate (150) {and the support sheet (130)} is described with reference to Fig. 6. Fig. 6 is a cross-sectional view of the final assembled state of the insert carrier in Fig. 4.

[0058] Referring to this drawing, a portion of the connecting projection (115) that passes through the escape hole (135) can be deformed. The portion can be thermally deformed, and specifically, can be deformed by hot stamping. The deformed portion (115') can be spread in the horizontal direction (H) to fill the receiving step hole (153, see FIG. 5). Accordingly, the portion (115') does not protrude downward beyond the support sheet (130), and thus may not structurally interfere with the socket. The horizontal direction (H) is a direction generally perpendicular to the vertical direction (V), and may be a direction parallel to the main surface of the support sheet (130).

[0059] The deformed portion (115') can support the first film (151) of the film laminate (150). The first film (151) (and the film laminate (150)) can be caught by the deformed portion (115') and not fall off from the pocket portion (111). Here, the film laminate (150), and further the first film (151), can have a thickness greater than that of the support sheet (130). This allows the film laminate (150), and further the first film (151), to pull the support sheet (130) with sufficient strength.

[0060] An insert carrier of a different form from the above will be described with reference to Fig. 7. Fig. 7 is a partially exploded cross-sectional view showing an insert carrier according to a modified example of the insert carrier of Fig. 4.

[0061] Referring to this drawing, the insert carrier (100A) is generally the same as the insert carrier (100, see FIG. 4) according to the previous embodiment, but the bonding structure between the body (110a) and the film laminate (150) is different.

[0062] Specifically, an insertion groove (116) may be formed in the body (110a) at a position corresponding to the connecting protrusion (115a). The insertion groove (116) may extend generally along the vertical direction (V).

[0063] A fixing piece (117) can be fixed to the insertion groove (116). The fixing piece (117) can specifically have a shank portion (118) and a head portion (119). The shank portion (118) can be inserted into and fixed in the insertion groove (116). The head portion (119) can have a width (diameter) larger than that of the shank portion (118) along the horizontal direction (H). The head portion (119) can be accommodated in the second hole (156, see FIG. 5) while supporting the first film (151) in the accommodation step hole (153, see FIG. 5). The head portion (119) may also not protrude beyond the support sheet (130) toward the socket.

[0064]

[0065] The present invention has industrial applicability in the field of manufacturing semiconductor package test equipment.

Claims

1. A body having a pocket formed to accommodate a semiconductor package and a connecting protrusion formed to protrude from the pocket; A support sheet formed to support the semiconductor package accommodated in the pocket portion, having a through hole formed to allow the terminal of the semiconductor package to pass through and an escape hole to escape the connecting protrusion; and An insert carrier for ESD prevention, comprising an insulating film laminate made of a plurality of layers of electrically insulating films, positioned between the pocket portion and the supporting sheet while attached to the supporting sheet, and in which a receiving step hole is formed by deforming a portion of the connecting protrusion that passes through the escape hole.

2. In paragraph 1, An insert carrier for ESD prevention, wherein the portion of the above connecting projections that passes through the escape hole is hot-stamped and thermally deformed.

3. In paragraph 1, The above insulating film laminate is, A first film having a first hole; and A second film having a second hole and positioned closer to the support sheet than the first film, The above first hole and the above second hole, An insert carrier for ESD prevention, having different inner diameters to form the above-described receiving step hole.

4. In paragraph 3, The above second hole is, An insert carrier for ESD protection having an inner diameter larger than the first hole.

5. In paragraph 3, The above insulating film laminate is, An insert carrier for ESD prevention, further comprising an adhesive layer disposed between the second film and the support sheet.

6. In paragraph 5, The above adhesive layer is, An insert carrier for ESD prevention, which is formed only in correspondence to the area occupied by the second film so as not to act on the semiconductor package supported on the support sheet.

7. In paragraph 3, The above first film and the above second film, Insert carrier for ESD protection with ESD coating.

8. In paragraph 3, The above first film and the above second film, An insert carrier for ESD protection, formed of polyimide material.

9. In paragraph 3, The first film, the second film, and the support sheet, An insert carrier for ESD protection, formed from the same material.

10. In paragraph 1, The above insulating film laminate is, An insert carrier for ESD protection having a thickness greater than that of the above support sheet.

11. A body having a pocket formed to accommodate a semiconductor package, a connecting projection formed to protrude from the pocket, and a fixing piece fixed to the connecting projection; A support sheet having a through hole formed to allow the terminal of the semiconductor package to pass through and formed to support the semiconductor package accommodated in the pocket portion; and An insert carrier for ESD prevention, comprising an insulating film laminate made of a plurality of layers of electrically insulating films, which are combined with the support sheet and have a receiving step hole formed therein for receiving the fixed piece.

12. In paragraph 11, The above insulating film laminate is, An insert carrier for ESD prevention, located between the pocket portion and the support sheet.

13. In paragraph 11, The above connecting protrusion is, Includes an insertion groove, The above fixed piece is, A shank portion inserted and fixed into the above insertion groove; and An insert carrier for ESD prevention, comprising a head portion that is accommodated in the accommodation step hole and has a width greater than the shank portion.

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