Package and electronic device

Abstract

The present application relates to the technical field of electronic element packaging. Disclosed is a package, comprising a substrate, a first electronic element, a second electronic element, at least one conductive assembly and a heat-conducting member. The substrate comprises a first surface and a second surface that are oppositely arranged in a first direction. The first electronic element is embedded in the substrate. The second electronic element is disposed on the first surface. The conductive assembly penetrates the substrate in the first direction; and comprises a first conductive pillar extending in the first direction, and a first electrical conductor and a second electrical conductor that are provided at two ends of the first conductive pillar. The heat-conducting member is embedded in the substrate. One part of the structure of the heat-conducting member is connected to any one of the first electrical conductor and the second electrical conductor, and the other part of the structure of the heat-conducting member is connected to a heat dissipation object. The present application can enhance the heat dissipation performance of the package, thereby improving the electrical performance and reliability of the package. Further disclosed in the present application is an electronic device.

Description

Packaging structure and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410434287.2, filed on April 11, 2024, and entitled "Packaging structure and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic component packaging, in particular to a packaging structure and an electronic device. BACKGROUND

[0003] Embedded Component Package (ECP) is a form of packaging electronic components such as chips by embedding them inside a substrate. It can package and power electronic components, and has been widely used in industrial production and people's lives.

[0004] For embedded component package, miniaturization and high power density are the development goals in the future. However, some problems have also arisen, such as the electrical performance of the embedded component package being adversely affected, resulting in the module being unable to function properly. SUMMARY

[0005] The present application provides a packaging structure and an electronic device, which can enhance the electrical performance of the embedded component package, thereby improving the reliability of the embedded component package.

[0006] In a first aspect, the present application provides a packaging structure, comprising a substrate, a first electronic component, a second electronic component, at least one conductive component, and a heat conduction component. The substrate comprises a first surface and a second surface arranged in opposite directions along a first direction, the thickness direction of the substrate being the first direction, and the extension direction of the substrate being a second direction. The first electronic component is embedded in the substrate. The second electronic component is arranged on the first surface. The conductive component penetrates the substrate along the first direction, and comprises a first conductive column extending along the first direction, and a first conductive body and a second conductive body arranged at both ends of the first conductive column, the first conductive body being connected to the second electronic component. The heat conduction component is embedded in the substrate, and a part of the structure of the heat conduction component is connected to any one of the first conductive body and the second conductive body, and another part of the structure of the heat conduction component is connected to a heat dissipation object.

[0007] In the present application, the heat dissipation object refers to the first electronic component or the second electronic component, and the heat conduction member can be directly connected with the first electronic component or the second electronic component or indirectly connected with the first electronic component or the second electronic component, which is not limited in the present application. When the heat dissipation object is the first electronic component, part of the structure on the heat conduction member is connected with the first electronic component, and the other part of the structure is connected with the first heat conduction body or the second heat conduction body, so as to conduct the heat generated by the first electronic component to the conductive assembly, thereby enhancing the heat dissipation effect of the first electronic component. When the heat dissipation object is the second electronic component, the two ends of the heat conduction member are respectively connected with the first conductive body and the second conductive body located in the same conductive assembly, so as to reduce the thermal resistance of the conductive assembly and enhance the heat dissipation effect of the second electronic component. Therefore, by arranging the heat conduction member, the heat dissipation effect of the first electronic component or the second electronic component can be enhanced, the temperature of the entire packaging structure can be reduced, and the problem of poor working stability caused by the excessively high temperature of the packaging structure can be solved.

[0008] In some implementations of the present application, the heat conduction member extends along the first direction, one end of the heat conduction member is connected with the first conductive body, and the other end of the heat conduction member is connected with the second conductive member.

[0009] In some implementations of the present application, the substrate includes a frame and a packaging member. The frame extends along the second direction, and the frame is provided with a mounting slot and at least one hole body penetrating through the frame along the first direction. The packaging member is made of a packaging material, and the packaging material is filled in the mounting slot and covers the upper surface and the lower surface of the frame. The first electronic component is embedded in the mounting slot, the first conductive column is arranged in the hole body, and each of the first conductive body and the second conductive body is embedded in the packaging material on the two sides of the frame. The heat conduction member is arranged on the inner wall of the mounting slot along the first direction.

[0010] In some implementations of the present application, the heat conduction member extends along the second direction, one end of the heat conduction member is connected with the first electronic component, and the other end of the heat conduction member is connected with any one of the first conductive body and the second conductive body.

[0011] In some implementations of the present application, the first electronic component has a front surface and a back surface arranged in opposite directions along the first direction, and the front surface of the first electronic component is provided with a plurality of pins extending along the first direction.

[0012] When the front surface of the first electronic component is located on the side close to the second surface, one end of the heat conduction member is connected with the front surface of the first electronic component, and the other end of the heat conduction member is connected with the second conductive body.

[0013] When the front surface of the first electronic component is located on the side close to the first surface, one end of the heat conduction member is connected with the front surface of the first electronic component, and the other end of the heat conduction member is connected with the first conductive body.

[0014] In some embodiments of the present application, the number of the conductive assemblies is two, the two conductive assemblies are respectively arranged on two sides of the second electronic component along the second direction, the heat conduction member extends along the second direction, two ends of the heat conduction member are respectively connected with the two first conductive bodies or the two second conductive bodies, and the middle part of the heat conduction member is in contact with the at least partial first electronic component.

[0015] In some embodiments of the present application, the first electronic component has a front surface and a back surface arranged oppositely along the first direction, and the front surface of the first electronic component is provided with a plurality of pins extending along the first direction.

[0016] When the front surface of the first electronic component is located on the side close to the second surface, the two ends of the heat conduction member are respectively connected with the two first conductive bodies, and the middle part of the heat conduction member is fitted with the back surface of the first electronic component.

[0017] When the front surface of the first electronic component is located on the side close to the first surface, the two ends of the heat conduction member are respectively connected with the two second conductive bodies, and the middle part of the heat conduction member is fitted with the back surface of the first electronic component.

[0018] In some embodiments of the present application, the packaging structure further comprises a plurality of second conductive pillars, the second conductive pillars are at least partially embedded in the substrate, the number of the second conductive pillars is equal to the number of the pins and corresponds to the positions of the pins one by one, and each pin is connected with a second conductive pillar.

[0019] In some embodiments of the present application, the number of the heat conduction members is multiple, a part of the heat conduction members extend along the first direction to interconnect the first conductive body and the second conductive body on the same conductive assembly, and the other part of the heat conduction members extend along the second direction to interconnect the first electronic component and the first conductive body or the second conductive body.

[0020] In some embodiments of the present application, the conductive body is a plurality of metal layers stacked along the first direction.

[0021] In some embodiments of the present application, the first electronic component is a chip, and the second electronic component is an inductor.

[0022] In some embodiments of the present application, the first electronic component is a power supply chip.

[0023] In the second aspect, the present application provides an electronic device, comprising a shell, a mainboard and a packaging structure as in the first aspect, wherein the mainboard and the packaging structure are arranged in the shell, and the packaging structure is connected with the mainboard. BRIEF DESCRIPTION OF DRAWINGS

[0024] FIG. 1 shows a schematic diagram of the appearance of the packaging structure;

[0025] FIG. 2 shows a cross-sectional view of the packaging structure in some embodiments of the present application;

[0026] Figure 3 shows a cross-sectional view of a package structure in some embodiments of the present application;

[0027] Figure 4 shows a cross-sectional view of a package structure in a first embodiment of the present application;

[0028] Figure 5 shows a schematic view of a chip with the front face down in the first embodiment of the present application;

[0029] Figure 6(a) shows a schematic view of the side wall of the mounting groove in Figure 5 in the direction of A;

[0030] Figure 6(b) shows a schematic view of the side wall of the mounting groove in Figure 5 in the direction of A;

[0031] Figure 7(a) shows a cross-sectional view of a frame in the first embodiment of the present application;

[0032] Figure 7(b) shows a cross-sectional view of a frame in the first embodiment of the present application;

[0033] Figure 8 shows a schematic view of a chip with the front face up in the first embodiment of the present application;

[0034] Figure 9(a) shows a cross-sectional view of a frame in the first embodiment of the present application;

[0035] Figure 9(b) shows a cross-sectional view of a frame in the first embodiment of the present application;

[0036] Figure 10(a) shows a cross-sectional view of a package structure in a second embodiment of the present application;

[0037] Figure 10(b) shows a cross-sectional view of a package structure in the second embodiment of the present application;

[0038] Figure 11 shows an elevational view of the front face of a chip in Figure 2;

[0039] Figure 12(a) shows an elevational view of the front face of a chip in Figures 10(a) and 10(b) in a first aspect;

[0040] Figure 12(b) shows an elevational view of the front face of a chip in Figures 10(a) and 10(b) in a second aspect;

[0041] Figure 13(a) shows a cross-sectional view of a package structure in a third embodiment of the present application;

[0042] Figure 13(b) shows a cross-sectional view of a package structure in the third embodiment of the present application;

[0043] Figure 14(a) shows a cross-sectional view of a package structure in some embodiments of the present application in a first aspect;

[0044] Figure 14(b) shows a cross-sectional view of a package structure in some embodiments of the present application in a second aspect;

[0045] Figure 15 shows a cross-sectional view of a package structure according to some embodiments of the present application;

[0046] Figure 16 shows a front view of the chip in Figure 15;

[0047] Figure 17 shows a cross-sectional view of a package structure according to some embodiments of the present application;

[0048] Figure 18 shows a front view of the chip in Figure 17. DETAILED DESCRIPTION

[0049] For the purpose of making the objects, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the drawings.

[0050] The present application provides a package structure, which can be applied in various electronic devices, such as supercomputer servers, wireless devices, routers, etc. It should be noted that the package structure according to the embodiments of the present application can be applied in these and any other suitable types of electronic devices.

[0051] As shown in Figure 1, in some embodiments, an electronic device includes a mainboard 100 and a package structure 200 arranged above the mainboard 100. The package structure 200 has electronic components and metal conductive structures arranged therein. Exemplarily, the electronic components can be one or more of a chip, an inductor, a resistor, and a capacitor. The metal conductive structures are used to interconnect the electronic components to form conductive paths. The bottom of the package structure 200 is connected to the mainboard 100 to electrically connect the electronic components inside the package structure 200 to the mainboard 100.

[0052] Figure 2 shows a schematic view of the internal structure of the package structure 200. Referring to Figure 2, the package structure 200 includes a substrate 1, which has an upper surface 11 (as an example of a first surface) and a lower surface 12 (as an example of a second surface) arranged oppositely along the thickness direction (denoted as the X direction, as an example of a first direction) of the substrate 1. The extension direction of the substrate 1 is the Y direction (as an example of a second direction). The upper surface 11 of the substrate 1 has a second electronic component arranged thereon. The substrate 1 has a first electronic component and at least one conductive assembly 4 embedded therein. The present application does not limit the specific types of the first and second electronic components, which can be an inductor, a chip, a resistor, or a capacitor, etc. The chip 2 will be taken as an example of the first electronic component, and the inductor 3 will be taken as an example of the second electronic component in the following description of the present application.

[0053] Further, referring to FIG. 2, the conductive assembly 4 is arranged on one side of the chip 2 along the Y direction, and the conductive assembly 4 penetrates the substrate 1 along the X direction. Specifically, the conductive assembly 4 includes a conductive column 41 (as an example of a first conductive column) extending along the X direction, and a conductive body 42 (as an example of a first conductive body) and a conductive body 43 (as an example of a second conductive body) arranged at both ends of the conductive column 41. The conductive body 42 is connected to the inductor 3, that is, the conductive body 42 is directly or indirectly connected to the inductor 3 to realize electrical connection between the conductive body 42 and the inductor 3. The heat generated by the inductor 3 is sequentially conducted to the outside through the conductive body 42, the conductive column 41, and the conductive body 43. The conductive body 42 and the conductive body 43 are both a plurality of metal layers stacked along the X direction, and the conductive column 41 can be a solid column or a hollow column. The conductive assembly 4 is used to provide current for the inductor 3 and conduct the heat generated by the inductor 3. The chip 2 has a front surface 21 and a back surface 22 arranged in opposite directions along the X direction, and the front surface 21 of the chip 2 is provided with a plurality of pins 23 extending along the X direction. A plurality of conductive columns 5 (as an example of a second conductive column) are also embedded in the substrate 1. The number of conductive columns 5 is equal to the number of pins 23 and corresponds one-to-one in position. One end of each pin 23 is connected to one conductive column 5 to realize electrical connection between the pin 23 and the conductive column 5, and the other end of the pin 23 is exposed to the outside of the packaging structure 200. The pin 23 is used to provide current for the chip 2 and conduct the heat generated by the chip 2.

[0054] In some implementations of the present application, referring to FIG. 2, the substrate 1 includes a frame 13 and a packaging member 14. The frame 13 is made of resin material. The frame 13 is provided with a mounting groove 131 and a plurality of hole bodies 132 penetrating the frame 13 along the X direction. The packaging member 14 is made of packaging material. The packaging material can be thin composite material ABF, for example. The packaging material is filled in the mounting groove 131 and covers the upper surface 133 and the lower surface 134 of the frame 13. The chip 2 is embedded in the packaging material in the mounting groove 131. The number of conductive assemblies 4 is equal to the number of hole bodies 132 and corresponds one-to-one in position. Each conductive column 41 is arranged in the corresponding hole body 132, and the conductive body 42 and the conductive body 43 are embedded in the packaging material on the upper and lower sides of the frame 13.

[0055] The packaging structure shown in FIG. 2 has the characteristics of high density and miniaturization, and can be applied to power devices in electronic equipment. However, the electrical performance of the packaging structure is poor, which may sometimes cause the module to be unable to function normally. The applicant has found through exploration that the main reason for the poor electrical performance of the packaging structure is that when the packaging structure is working, the chip 2 and the inductor 3 generate a large amount of heat, and the conductive assembly 4 and the conductive column 5 cannot conduct the heat generated by the chip 2 and the inductor 3 to the outside of the module in time, so that the overall heat dissipation of the module is poor, the temperature is high, and the electrical performance of the module is poor.

[0056] To solve the above problems, referring to FIG. 3, the packaging structure provided by the application further comprises a heat-conducting member 6. The heat-conducting member 6 is embedded in the substrate, and the heat-conducting member 6 is connected with any one of the electrically-conductive body 42 and the electrically-conductive body 43 and is also connected with the heat-dissipating object. In the application, the heat-dissipating object refers to the chip 2 or the inductor 3, and the heat-conducting member 6 can be directly connected with the chip 2 or the inductor 3 or can be indirectly connected with the chip 2 or the inductor 3 through the metal electrically-conductive member in the substrate 1, and the application does not limit this. The heat-conducting member 6 can enhance the heat-dissipating effect of the chip 2 or the inductor 3. For example, the heat-conducting member 6 can be made of metal material. When the heat-dissipating object is the chip 2, the heat-conducting member 6 can be as shown in 6b in FIG. 3, one end of which is connected with the chip 2 and the other end is connected with the heat-conducting body 43, or can be as shown in 6c in FIG. 3, the middle part of which is in contact with the chip 2 and the two ends are respectively connected with the two heat-conducting bodies 42, so as to conduct the heat generated by the chip 2 to the electrically-conductive assembly 4, thereby enhancing the heat-dissipating effect of the chip 2. When the heat-dissipating object is the inductor 3, the heat-conducting member 6 is as shown in 6a in FIG. 3, the two ends of the heat-conducting member 6 are respectively connected with the electrically-conductive body 42 and the electrically-conductive body 43 in the same electrically-conductive assembly 4, so as to reduce the thermal resistance of the electrically-conductive assembly 4 and enhance the heat-dissipating effect of the inductor 3. Therefore, by arranging the heat-conducting member 6, the heat-dissipating effect of the chip 2 or the inductor 3 can be enhanced, the temperature of the whole packaging structure can be reduced, and the problem of poor working stability caused by the excessively high temperature of the packaging structure can be solved.

[0057] To enable those skilled in the art to better understand, the structure of the heat-conducting member 6 is described in detail through several embodiments.

[0058] Embodiment one

[0059] Referring to FIG. 4, the heat-conducting member 6a is embedded in the mounting groove 131, one end of the heat-conducting member 6a is connected with the electrically-conductive body 42, and the other end of the heat-conducting member 6a is connected with the electrically-conductive body 43. The heat generated by the inductor 3 can be conducted to the electrically-conductive body 43 through the electrically-conductive body 42 and the electrically-conductive pillar 41 in sequence or through the electrically-conductive body 42 and the heat-conducting member 6a in sequence. By arranging the heat-conducting member 6a, the heat-conducting path in the electrically-conductive assembly 4 can be increased, thereby reducing the thermal resistance of the electrically-conductive assembly 4 and improving the heat-dissipating property.

[0060] In some embodiments, the thermal resistance of the electrically-conductive assembly 4 can also be reduced by changing the structure of the electrically-conductive pillar 41. For example, when the electrically-conductive pillar 41 is a solid column (as shown in 41a in FIG. 5), the thermal resistance of the solid column is lower than that of a hollow column (as shown in 41b in FIG. 5). However, designing the electrically-conductive pillar 41 as a solid column will increase the cost of the frame 13. By arranging the heat-conducting member 6a, the application can meet the requirements of current flow, heat dissipation and low cost, and realize the optimal strategy of high performance and low cost.

[0061] Further, referring to FIG. 4, the heat-conducting member 6a is arranged on the inner wall of the mounting groove 131. FIG. 6(a) and FIG. 6(b) are both A-directional views of the inner wall of the mounting groove 131 in FIG. 5. Referring to FIG. 6(a) and FIG. 6(b), the heat-conducting member 6a is formed by plating a metal material on the inner wall of the mounting groove. For example, the inner wall of the mounting groove can be entirely plated with a metal material (as shown in FIG. 6(a)), or can be partially plated with a metal material (as shown in FIG. 6(b)). For example, the heat-conducting member 6a can be made of any one of copper, gold, nickel, and tin.

[0062] Further, FIG. 7(a) and FIG. 7(b) are both sectional views of the frame 13. Referring to FIG. 7(a) and FIG. 7(b), the surface of the heat-conducting member 6a plated on the inner wall of the mounting groove is not limited to a plane. For example, the heat-conducting member 6a can be formed with a recess 61a (as shown in FIG. 7(a)) or a protrusion 61b (as shown in FIG. 7(b)), and can still ensure heat conduction between the electrically-conductive body 42 and the electrically-conductive body 43, and can achieve the technical effects described in the present application.

[0063] In some embodiments, referring to FIG. 8, the inside of the frame 13 is further provided with one or more metal layers 44 arranged at intervals along the X direction, and each metal layer 44 extends along the Y direction and is connected to the electrically-conductive column 41. The metal layer 44 is not easy to bend, and can increase the overall strength of the module, thereby improving the reliability of the module. Further, the heat-conducting member 6a is connected to at least one metal layer 44, thereby forming a heat-dissipating network in the frame 13, and further enhancing the heat-dissipating performance. For example, the heat-conducting member 6a can be connected to each metal layer 44 (as shown in FIG. 8), or can be connected to part of the metal layers 44 (as shown in FIG. 9(a) and FIG. 9(b)), which are not limited in the present application.

[0064] Further, in the case where the metal layer 44 is arranged inside the frame 13, the present application does not limit the heat-conducting member 6a to cover the entire inner wall of the mounting groove 131 along the X direction, as long as the heat-conducting member 6a can ensure heat conduction between the electrically-conductive body 42 and the electrically-conductive body 43, and can achieve the technical effects described in the present application. For example, in the structure shown in FIG. 9(a), the heat-conducting member 6a covers the upper half of the mounting groove 131, the upper end of the heat-conducting member 6a is directly connected to the electrically-conductive body 42, and the lower end of the heat-conducting member 6a is connected to the metal layer 44 and indirectly connected to the electrically-conductive body 43 through the metal layer 44. In the structure shown in FIG. 9(b), the heat-conducting member 6a covers the lower half of the mounting groove 131, the lower end of the heat-conducting member 6a is directly connected to the electrically-conductive body 43, and the upper end of the heat-conducting member 6a is connected to the metal layer 44 and indirectly connected to the electrically-conductive body 42 through the metal layer 44.

[0065] The applicant has proved by experiments that, based on the module 1.7W loss, the mainboard temperature 100℃, and the external environment 45℃ without wind, the junction temperature of the chip 2 is reduced by 0.7℃, the temperature of the inductor 3 is reduced by 3.2℃, and the current-carrying capacity of the conductive assembly 4 is increased by 10 times. Therefore, the technical solution of the embodiment one can balance the cost and the current-carrying and heat dissipation capacity requirements, thereby meeting the low-cost and high-performance requirements.

[0066] Embodiment two

[0067] Referring to FIG. 10(a) and FIG. 10(b), the heat-conducting member 6b extends along the Y direction, one end of the heat-conducting member 6b is connected with the conductive body 42 or the conductive body 43, and the other end is connected with the front surface 21 of the chip 2. Since the heat generated by the chip 2 is mostly concentrated on the front surface 21 of the chip 2, the heat-conducting member 6b can conduct the heat generated by the chip 2 to the conductive assembly 4, thereby enhancing the heat dissipation effect of the chip 2.

[0068] Further, the application preferentially connects the heat-conducting member 6b with the conductive body close to the front surface 21, so as to shorten the length of the heat-conducting member 6b along the Y direction, thereby reducing the thermal resistance.

[0069] Further, the extension direction of the chip 2 is parallel to the extension direction of the substrate 1 in the application, but the application does not limit the orientation of the chip 2. The front surface 21 of the chip 2 can be upwardly arranged (i.e., facing the upper surface 11 of the substrate 1, as shown in FIG. 10(b)), or downwardly arranged (i.e., facing the lower surface 12 of the substrate 1, as shown in FIG. 10(a)).

[0070] Referring to FIG. 10(a), when the front surface 21 is arranged downwardly, the conductive body 43 is closer to the front surface 21, at this time, one end of the heat-conducting member 6b is connected with the front surface 21, and the other end is connected with the conductive body 43.

[0071] Referring to FIG. 10(b), when the front surface 21 is arranged upwardly, the conductive body 42 is closer to the front surface 21, one end of the heat-conducting member 6b is connected with the front surface 21, and the other end is connected with the conductive body 42.

[0072] FIG. 11 shows a horizontal cross-sectional view of a packaging structure without the heat-conducting member 6b, and FIG. 12(a) and FIG. 12(b) show horizontal cross-sectional views of packaging structures with the heat-conducting member 6b. In the technical solution shown in FIG. 11, the chip 2 and the conductive assembly 4 are separated by the packaging member 14, so that the chip 2 cannot conduct heat to the conductive assembly 4, affecting the heat dissipation of the chip 2. In the technical solutions shown in FIG. 12(a) and FIG. 12(b), the chip 2 and the conductive assembly 4 are connected through the heat-conducting member 6b, so that the chip 2 can conduct the heat of the front surface 21 to the conductive assembly 4 through the heat-conducting member 6b, and then the conductive assembly 4 can conduct the heat to the mainboard, thereby effectively reducing the heat of the chip 2.

[0073] Exemplarily, the heat-conducting member 6a can be made of any one of copper, gold, nickel, and tin. The application does not limit the specific structure of the heat-conducting member 6b. The heat-conducting member 6b can be an entire metal sheet completely covering the edge of the chip 2 along the Z1 or Z2 direction (as shown in FIG. 12(a)), or a plurality of metal sheets arranged in sequence and at intervals along the Z1 or Z2 direction (as shown in FIG. 12(b)).

[0074] The applicant has proved by experiments that, based on the module 1.7W loss, the mainboard temperature 100℃, and the external environment 45℃ without wind, the junction temperature of the chip 2 is reduced by 1.7℃ under the condition of the technical solution of the second embodiment of the application. Therefore, the technical solution of the second embodiment can improve the horizontal heat dissipation capacity of the chip, and can effectively prevent moisture.

[0075] Embodiment Three

[0076] Referring to FIGS. 13(a) and 13(b), in some implementations of the application, the number of the hole bodies 132 and the conductive assemblies 4 is two and the positions are one-to-one corresponding, one conductive column 41 is arranged in each hole body 132, and the two conductive assemblies 4 are arranged on the two sides of the chip 2 along the Y direction. The heat-conducting member 6c extends along the Y direction, the two ends of the heat-conducting member 6c are connected with the two conductive bodies 42 or the two conductive bodies 43, and the middle part of the heat-conducting member 6c is in contact with the back surface 22 of the chip 2. This structure can use the heat-conducting member 6c to conduct the heat generated by the chip 2 to the two conductive assemblies 4, thereby enhancing the heat dissipation effect of the chip 2.

[0077] Further, the application preferentially connects the heat-conducting member 6c with the conductive body close to the back surface 22, so as to shorten the length of the heat-conducting member 6c along the Y direction, thereby reducing the thermal resistance.

[0078] The application does not limit the orientation of the chip 2. When the front surface 21 is arranged downward, as shown in FIG. 13(a), the distance between the conductive body 42 and the back surface 22 is close, at this time, the two ends of the heat-conducting member 6c are connected with the two conductive bodies 42, and the middle part of the heat-conducting member 6c is in contact with the back surface 22. When the front surface 21 is arranged upward, as shown in FIG. 13(b), the distance between the conductive body 43 and the back surface 22 is close, at this time, the two ends of the heat-conducting member 6c are connected with the two conductive bodies 43, and the middle part of the heat-conducting member 6c is in contact with the back surface 22.

[0079] Fig. 14(a) and Fig. 14(b) show schematic diagrams of packaging structures without the heat-conducting member 6c in some comparative embodiments. In the technical solution shown in Fig. 14(a), the back surface 22 of the chip 2 faces upward, and the heat-conducting member 62 is arranged above the back surface 22, which conducts the heat of the chip 2 upward to the upper surface 11, so that the inductor installed on the upper surface 11 has better heat dissipation conditions. In the technical solution shown in Fig. 14(b), the back surface 22 of the chip 2 faces downward, and the heat-conducting member 62 is arranged below the back surface 22, and a pin is arranged between the heat-conducting member and the PCB, so as to conduct the heat of the chip 2 downward to the lower surface 12 through the heat-conducting member and the bottom pin. However, the lower surface of the substrate 1 can interfere with the bottom pin due to the arrangement of other electronic elements, so it is necessary to lengthen the length of the heat-conducting member 62 in the Y direction to bypass the interfering elements, which will result in a longer heat dissipation path and deteriorate the heat dissipation efficiency.

[0080] In the technical solutions shown in Fig. 13(a) and Fig. 13(b), the heat-conducting member 6c conducts the heat generated by the chip 2 to the two conductive components 4, so that the heat can be conducted upward and downward along the conductive components 4, forming a bidirectional heat dissipation path, thereby reducing the requirements for the heat dissipation conditions of the inductor 3 and the layout restrictions of the bottom pin, and improving the heat dissipation effect. The applicant has proved through experiments that, when the back surface 22 of the chip 2 faces upward, based on 1.7W loss of the module 1, 100℃ of the mainboard temperature, and 45℃ of the external environment without wind, the temperature of the inductor 3 is reduced by 2.3℃ in the technical solution of Fig. 13(a) compared with the technical solution of Fig. 14(a).

[0081] The above three embodiments respectively describe three connection structures of the heat-conducting member 6, i.e., the connection structures of the heat-conducting member 6a, the heat-conducting member 6b, and the heat-conducting member 6c. In some implementations of the present application, any one of the heat-conducting member 6a, the heat-conducting member 6b, and the heat-conducting member 6c can be arranged in the substrate 1, or any two or three of the heat-conducting member 6a, the heat-conducting member 6b, and the heat-conducting member 6c can be arranged in the substrate 1 (as shown in Fig. 3), which is not limited in the present application.

[0082] The applicant has proved through experiments that, based on 1.7W loss of the module 1, 100℃ of the mainboard temperature, and 45℃ of the external environment without wind, the junction temperature of the chip 2 is reduced by 4.2℃, the temperature of the inductor 3 is reduced by 4.7℃, and the overall thermal resistance of the module is reduced by 30% when the technical solution shown in Fig. 3 is adopted.

[0083] Fig. 15 shows a schematic diagram of the packaging structure in some embodiments, and Fig. 16 shows a front view of the chip front surface 21 in Fig. 15. Referring to Fig. 16, the pins 23 include functional pins 23a and heat dissipation pins 23b, wherein the heat of the heat dissipation pins 23b is significantly higher than that of the functional pins 23a. Referring to Fig. 15, the lower end of each heat dissipation pin 23b is connected to a conductive column 5 embedded in the bottom of the substrate 1, and the conductive column 5 can conduct the heat of the heat dissipation pin 23b to the mainboard 100 below to dissipate the heat of the chip 2. However, as shown in Fig. 16, in the chip design, the number of functional pins 23a is large, and at the same time, the QFN packaging and the ECP packaging need to be met. For this case, the heat dissipation pins 23b cannot be directly provided with the conductive column 5 extending in the X direction below the heat dissipation pins 23b due to the close spacing. Generally, a metal piece 51 extending in the Y direction (as shown in Fig. 16) is provided below most of the heat dissipation pins 23b, one end of the metal piece 51 is connected to the heat dissipation pin 23b, and the other end is connected to the conductive column 5, so as to conduct the heat of the heat dissipation pin 23b to the metal piece 51 through the metal piece 51. However, this design lengthens the heat dissipation path, thereby resulting in poor heat dissipation effect. Based on this, in addition to enhancing the heat dissipation by providing the heat conduction piece 6, the number of heat dissipation pins 23b can be increased in the embodiments of the present application.

[0084] Fig. 17 shows a schematic diagram of the packaging structure after adding the heat dissipation pins 23b, and Fig. 18 shows a front view of the chip front surface 21 in Fig. 17. Referring to Fig. 18, by adding the heat dissipation pins 23b in the internal area (as shown by the S area in Fig. 18) of the chip 2, the number of heat dissipation pins 23b can be increased, and the heat dissipation effect can be enhanced. In addition, referring to Fig. 17, in the ECP packaging structure, the conductive column 5 extending in the X direction can be directly provided at the lower end of the newly added heat dissipation pin 23b, so as to increase the vertical heat dissipation path of the chip 2, reduce the thermal resistance, and realize the optimal heat flow channel in the chip 2.

[0085] The applicant has proved by experiments that, based on the module 1.7W loss, the mainboard temperature 100℃, and the external environment 45℃ without wind, the junction temperature of the chip 2 is reduced by 3.5℃, and the thermal resistance is reduced by 25% by adding the heat dissipation pins 23b.

[0086] In some embodiments of the present application, the packaging structure is applied to a power supply device, and the chip 2 is a power supply chip.

[0087] The present application also provides an electronic device, as shown in Fig. 1, which includes a shell (not shown in the figure), a mainboard 100, and any one of the foregoing packaging structures 200, wherein the mainboard 100 and the packaging structure 200 are arranged in the shell, and the packaging structure 200 is connected to the mainboard 100.

[0088] The above describes the embodiments of the present application by specific examples, and other advantages and effects of the present application can be easily understood by those skilled in the art from the disclosure of the present application. Although the description of the present application is introduced in combination with some examples, this does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the present application in combination with the embodiments is to cover other options or modifications that can be extended based on the claims of the present application. The present application can also not use these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details are omitted in the description. It should be noted that the examples and features in the examples in the present application can be combined with each other without conflict.

[0089] In the embodiments of the present application, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0090] In the embodiments of the present application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can represent the existence of A alone, the existence of A and B together, and the existence of B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are in an "or" relationship.

[0091] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or indirect connection through intermediate medium.

[0092] In the description of the present application, it should be noted that the terms "upper", "lower", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0093] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "setting", "mounting", "connecting", "fitting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between the two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0094] Obviously, numerous modifications and variations of the present application are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A packaging structure, characterized in that: include: A substrate comprising a first surface and a second surface arranged opposite to each other along a first direction, wherein a thickness direction of the substrate is the first direction, and an extension direction of the substrate is the second direction; A first electronic component embedded in the substrate; a second electronic component disposed on the first surface; at least one conductive component extending through the substrate along the first direction, the conductive component comprising a first conductive post extending along the first direction and a first conductor and a second conductor disposed at both ends of the first conductive post, the first conductor being connected to the second electronic component; A heat conducting member is embedded in the substrate and is connected to any one of the first conductor and the second conductor and a heat dissipation object.

2. The packaging structure according to claim 1, wherein: The heat conducting member extends along a first direction, one end of the heat conducting member is connected to the first conductor, and the other end of the heat conducting member is connected to the second conductor.

3. The packaging structure according to claim 2, wherein: The substrate comprises: a frame extending along the second direction, the frame being provided with a mounting slot and at least one hole penetrating the frame along the first direction; a packaging member made of a packaging material, the packaging material filling the mounting groove and covering the upper and lower surfaces of the frame; the first electronic component embedded in the mounting groove, the first conductive column disposed in the hole, and each of the first conductor and the second conductor respectively embedded in the packaging material on both sides of the frame; The heat conducting member is arranged on the inner wall of the mounting groove along the first direction.

4. The packaging structure according to claim 1, wherein: The heat conducting member extends along the second direction, one end of the heat conducting member is connected to the first electronic component, and the other end of the heat conducting member is connected to any one of the first conductor and the second conductor.

5. The packaging structure according to claim 4, wherein: The first electronic component has a front surface and a back surface arranged opposite to each other along the first direction, and a plurality of pins extending along the first direction are provided on the front surface of the first electronic component; When the front surface of the first electronic component is located on the side close to the second surface, one end of the heat conductive member is connected to the front surface of the first electronic component, and the other end of the heat conductive member is connected to the second conductor; When the front surface of the first electronic component is located on the side close to the first surface, one end of the heat conductor is connected to the front surface of the first electronic component, and the other end of the heat conductor is connected to the first conductor.

6. The packaging structure according to claim 1, wherein: There are two conductive components, and the two conductive components are respectively arranged on both sides of the second electronic component along the second direction. The heat conductor extends along the second direction, and the two ends of the heat conductor are respectively connected to the two first conductors or the two second conductors, and the middle part of the heat conductor is in contact with at least part of the first electronic component.

7. The packaging structure according to claim 6, wherein: The first electronic component has a front surface and a back surface arranged opposite to each other along the first direction, and a plurality of pins extending along the first direction are provided on the front surface of the first electronic component; When the front surface of the first electronic component is located on the side close to the second surface, the two ends of the heat conductive member are respectively connected to the two first electrical conductors, and the middle portion of the heat conductive member is in contact with the back surface of the first electronic component; When the front surface of the first electronic component is located on the side close to the first surface, both ends of the heat conductive member are respectively connected to two second conductors, and the middle portion of the heat conductive member is in contact with the back surface of the first electronic component.

8. The packaging structure according to claim 5 or 7, characterized in that: The packaging structure further includes a plurality of second conductive pillars, which are at least partially embedded in the substrate. The number of the second conductive pillars is equal to the number of the pins and their positions correspond one to one. Each of the pins is connected to a second conductive pillar.

9. The packaging structure according to any one of claims 1 to 7, characterized in that: There are multiple heat conductors, some of which extend along the first direction to interconnect the first conductor and the second conductor located on the same conductive component, and another part of the heat conductors extend along the second direction to interconnect the first electronic component with the first conductor or the second conductor.

10. The packaging structure according to any one of claims 1 to 7, characterized in that: The conductor is a plurality of metal layers stacked along the first direction.

11. The packaging structure according to any one of claims 1 to 7, characterized in that: The first electronic component is a chip, and the second electronic component is an inductor.

12. The packaging structure according to claim 11, wherein: The first electronic component is a power chip.

13. An electronic device, characterized in that: The invention comprises a housing, a main board and the packaging structure according to any one of claims 1 to 12, wherein the packaging structure is arranged on the main board.

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