Electronic circuit, and method for manufacturing an electronic circuit

Abstract

The invention relates to an electronic circuit (100) comprising a first printed circuit board (105), a second printed circuit board (110), and a connection device (115). The first printed circuit board (105) has an outer side (118) and an inner side (120) opposite the outer side (118). The first printed circuit board (105) has at least one first conductor track (130) and / or at least one through-hole (190). The second printed circuit board (110) has an outer side (122) and an inner side (128) opposite the outer side (122). The second printed circuit board (110) has a second conductor track (135), the inner side (128) of the second printed circuit board (110) facing the inner side (120) of the first printed circuit board (105). The connection device (115) is arranged in a gap (162) between the first printed circuit board (105) and the second printed circuit board (110). The connection device (115) forms at least one connection element (165) having a base (175) and a contact element (165) adjoining the base (175). A bottom side of the base (174) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100). The contact element (165) is at least partially guided out through the through-hole (190) in the first printed circuit board (105) of the electronic circuit (100). Alternatively, a top side of the contact element (165) is contacted with the inner side (120) of the first printed circuit board (105).

Description

[0001] Electronic circuit and method for producing an electronic circuit

[0002] The present invention relates to an electronic circuit and to a method for manufacturing an electronic circuit.

[0003] Parasitic stray inductances can occur in power electronics.

[0004] The document JP 2004 -281 804 A discloses a printed circuit board.

[0005] The document DE 102019 125 108 A1 discloses a power electronics arrangement comprising a printed circuit board and a power module, a method for producing a power electronics arrangement and a motor vehicle comprising a power electronics arrangement.

[0006] The document DE 4422 787 A1 discloses pins that are attached to the surface of printed circuits.

[0007] The document US 2008 / 0142571 A1 discloses an electronic device.

[0008] Against this background, the present invention provides an improved electronic circuit and an improved method for manufacturing an electronic circuit according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0009] The advantages achievable with the approach presented here are, in particular, that an electronic circuit is created that can reduce stray inductance, in particular parasitic stray inductance.

[0010] An electronic circuit has a first circuit board, a second circuit board, and a connecting device. The first circuit board has an outer side and an inner side opposite the outer side. The first circuit board has a first conductor track and / or at least one through-opening. The second circuit board has an outer side and an inner side opposite the outer side. The second circuit board has a second conductor track, wherein the inner side of the second circuit board faces the inner side of the first circuit board. The connecting device is arranged in a space between the first circuit board and the second circuit board. The connecting device forms at least one connecting element with a base and a contact element adjacent to the base. An underside of the base is arranged on the inner side of the second circuit board of the electronic circuit.The contact element extends at least partially through the through-hole of the first printed circuit board of the electronic circuit. Alternatively, an upper side of the contact element is connected to the inside of the first printed circuit board.

[0011] The circuit boards can be manufactured cost-effectively and in large quantities. The connecting device can also be referred to as a board-to-board connector and, due to its shape, can reduce the height in the gap such that stray inductance can be reduced. The bottom can be soldered to the second circuit board, whereby the contact element can be soldered to the first circuit board. Alternatively, the top of the contact element can be clamped to the inside of the first circuit board. The electronic circuit can enable a small overall size of the assembly through better use of space. In addition, the electronic circuit can enable a small overall size of the assembly through a higher current carrying capacity of the connecting device and thus a smaller size of the connecting device.

[0012] The approach presented here can enable optimized, low-parasitic layouts using the interconnect device, which can also be referred to as pitch-optimized, board-to-board connectors, and can also include concepts for this interconnect device.

[0013] The approach presented here for an optimized, low-parasitic layout through the use of a pitch-optimized interconnect device can also be used for other substrate combinations, such as DBC (direct bonded copper), a bonding technique that enables a tight electrical / thermal connection via copper, and / or AMB (active metal brazed), a bonding technique or a form of brazing in which metal and ceramic can be bonded without metallization, and not only for PCBs in combination with IMS or other printed circuit boards. Furthermore, the individual soldering steps can be partially or fully combined. For example, all three soldering processes—first circuit board, second circuit board, and interconnect device—can be performed simultaneously, for example, in a vapor-phase soldering process.

[0014] The connecting device may comprise a metallic material. The metallic material may, in particular, be formed as an electrically conductive sheet. The metallic material may, for example, be copper sheet with or without a coating.

[0015] The connecting element can be at least partially L-shaped and / or T-shaped and / or parabolic and / or omega-shaped and / or U-shaped and / or rectangular and / or spherical. The connecting element can be easily bent into the desired shape according to the space requirements of the electrical circuit and inserted into the space between the circuit boards.

[0016] The connecting element may have a bend with a bending radius between the base and the contact element.

[0017] The connecting element can be molded in one piece. This allows the connecting element to be manufactured quickly and cost-effectively.

[0018] The connecting element can form at least one mechanical stop, in particular on an outer edge of the connecting element. For example, the first circuit board can rest on the stop. The stop can thus define the height between the circuit boards.

[0019] The connecting element can form a plurality of sections, in particular, wherein the sections can be pin-shaped or the connecting element can be comb-shaped. The distance between the sections can be identical. The sections can be designed, for example, as stops for the first circuit board, on which the first circuit board can rest. The sections can thus define the height between the circuit boards. The sections can better enable a good clamp connection or press connection because tolerances can be better compensated, thus increasing the contact area.

[0020] The base can be divided into at least two sections, in particular, wherein the sections can protrude from the connecting element on different sides. In this way, the stability of the connecting device can be improved.

[0021] The base can be divided into at least three sections, with a central section extending from the connecting element to a different side than two sections arranged at opposite edges. This can also improve the stability of the connecting device.

[0022] The central section can be wider than the two sections located at opposite edges. Alternatively, the two sections located at opposite edges can be wider than the central section. This can also improve the stability of the connecting device.

[0023] The connecting device can form a further connecting element with a further base and a further contact element adjacent to the further base. A further underside of the further base can be arranged on the inside of the second printed circuit board of the electronic circuit. The further contact element can be led at least partially through from the through-opening or a further through-opening of the first printed circuit board of the electronic circuit. Alternatively, a further upper side of the further contact element can be contacted on the inside of the first printed circuit board. The further connecting element and the connecting element can be shaped identically and / or can be produced cost-effectively in large quantities. A method for producing an embodiment of an electronic circuit mentioned herein comprises a step of providing and a step of arranging.In the providing step, the first circuit board, the second circuit board, and the connecting device are provided. In the arranging step, the connecting device is arranged between the circuit boards. The base of the connecting element is arranged on the second circuit board, with the contact element of the connecting element being at least partially guided through a through-opening in the first circuit board in order to produce the electronic circuit. Alternatively, a top side of the contact element is contacted on the inside of the first circuit board. In the arranging step, the base can be arranged on the second circuit board using a surface-mounted technology method.

[0024] The approach presented here further provides a device designed to perform, control, or implement the steps of a variant of a method presented here in corresponding devices. This embodiment of the invention in the form of a device also allows the problem underlying the invention to be solved quickly and efficiently.

[0025] A device can be an electrical device that processes electrical signals, for example, sensor signals, and outputs control signals depending on them. The device can have one or more suitable interfaces, which can be implemented in hardware and / or software. In a hardware implementation, the interfaces can, for example, be part of an integrated circuit in which functions of the device are implemented. The interfaces can also be separate integrated circuits or consist at least partially of discrete components. In a software implementation, the interfaces can be software modules that are present, for example, on a microcontroller alongside other software modules.

[0026] Also advantageous is a computer program product with program code that can be stored on a machine-readable medium such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above when the program is executed on a computer or device.

[0027] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show:

[0028] Fig. 1 is a representation of an embodiment of an electronic circuit;

[0029] Fig. 2 is a representation of a stray inductance to explain an embodiment of an electronic circuit;

[0030] Fig. 3 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0031] Fig. 4 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0032] Fig. 5 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0033] Fig. 6 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0034] Fig. 7 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0035] Fig. 8 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0036] Fig. 9 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0037] Fig. 10 is a diagram of an embodiment of an electronic circuit;

[0038] Fig. 11 is a diagram of an embodiment of an electronic circuit;

[0039] Fig. 12 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 13 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0040] Fig. 14 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0041] Fig. 15 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0042] Fig. 16 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0043] Fig. 17 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0044] Fig. 18 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0045] Fig. 19 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0046] Fig. 20 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0047] Fig. 21 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0048] Fig. 22 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0049] Fig. 23 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0050] Fig. 24 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0051] Fig. 25 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0052] Fig. 26 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0053] Fig. 27 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0054] Fig. 28 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 29 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0055] Fig. 30 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0056] Fig. 31 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0057] Fig. 32 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0058] Fig. 33 is a diagram of an embodiment of an electronic circuit;

[0059] Fig. 34 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0060] Fig. 35 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0061] Fig. 36 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0062] Fig. 37 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0063] Fig. 38 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0064] Fig. 39 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0065] Fig. 40 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0066] Fig. 41 is a diagram of an embodiment of an electronic circuit;

[0067] Fig. 42 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0068] Fig. 43 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0069] Fig. 44 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 45 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0070] Fig. 46 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0071] Fig. 47 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0072] Fig. 48 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0073] Fig. 49 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0074] Fig. 50 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0075] Fig. 51 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0076] Fig. 52 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0077] Fig. 53 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0078] Fig. 54 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0079] Fig. 55 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0080] Fig. 56 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0081] Fig. 57 is a diagram of an embodiment of an electronic circuit;

[0082] Fig. 58 is a diagram of an embodiment of an electronic circuit;

[0083] Fig. 59 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0084] Fig. 60 shows an illustration of an embodiment of an electronic circuit; Fig. 61 shows a flowchart of an embodiment of a method for manufacturing an electronic circuit;

[0085] Fig. 62 is a block diagram of an embodiment of a control device for manufacturing an electronic circuit;

[0086] Fig. 63 is a circuit diagram of an embodiment of an electronic circuit; and

[0087] Fig. 64 is a representation of an embodiment of an electronic circuit.

[0088] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0089] Fig. 1 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a longitudinal section through the electronic circuit 100 is shown.

[0090] The electronic circuit 100 comprises a first circuit board 105, a second circuit board 110 and a connecting device 115.

[0091] The first circuit board 105 has an outer side 118 and an inner side 120 opposite the outer side 118. The second circuit board 110 has an outer side 122 and an inner side 128 opposite the outer side 122. The inner side 128 of the second circuit board 110 faces the inner side 120 of the first circuit board 105, with a gap 125 formed between the first circuit board 105 and the second circuit board 110. The connecting device 115 is arranged in the gap 125, which enables a low height hcc of the electronic circuit 100.

[0092] The first circuit board 105, which may be referred to as a PCB, for example, has a first conductive trace 130, and the second circuit board 110, which may be referred to as an IMS, for example, has a second conductive trace 135. According to one embodiment, the second conductive trace 135 is arranged on the inner side 128 of the second circuit board 110, and the first conductive trace 130 is arranged on the inner side 120 of the first circuit board 105.

[0093] For example, a component 138 is arranged in the gap 125 between the circuit boards 105, 110. This component is designed, for example, as a snubber, which can also be referred to as a Csnubb. The component 138 is electrically contacted to the second conductor track 135.

[0094] According to a further embodiment, a further component 140 is arranged in the intermediate space 125. The further component 140 has, for example, a greater height than the component 138. The further component 140 is designed merely as an example as a transistor, more precisely as a semiconductor transistor and / or a high-side transistor, which can also be referred to as an HS transistor, wherein the further component 140 is electrically contacted with the second conductor track 135. Between the further component 140 and the second conductor track 135, for example, a thermally conductive material is arranged. 155 arranged.

[0095] According to a further embodiment, a third component 150 is arranged in the gap 125 between the first circuit board 105 and the second circuit board 110. The third component 150 is designed, for example, as a transistor and has an identical height to the further component 140. The third component 150 is designed, for example, as a low-side transistor and can be referred to, for example, as an LS transistor. Between the third component 150 and the second conductor track 135, for example, a further thermally conductive material is arranged. 160 arranged.

[0096] The third component 150 is arranged, for example, adjacent to the further component 140, wherein the further component 140 is arranged merely by way of example between the component 138 and the third component 150. According to one embodiment, the connecting device 115 forms two connecting elements 165, 168 with bases 175, 178 and contact elements 185, 188.

[0097] The connecting element 165 is arranged, for example, adjacent to the component 138 in the intermediate space 125, wherein the contact element 185 is pin-shaped and extends at least partially through a through-opening 190 of the first circuit board 105. An underside of the base 175 is arranged on the inner side 128 of the second circuit board 110 of the electronic circuit 100, merely by way of example on the second conductor track 135. For example, the base 175 is soldered to the second circuit board 110. The contact element 185 is, for example, soldered from above and / or electrically contacted or contactable to the first circuit board 105.

[0098] The further connecting element 168 is, for example, shaped identically to the connecting element 165, wherein the further connecting element 168 is arranged adjacent to the third component 150 in the intermediate space 125. The further base 178 of the further connecting element 168 is contacted to the second circuit board 110, and the further contact element 188 of the further connecting element 168 is at least partially guided through a further through-opening 195 of the first circuit board 105.

[0099] The connecting device 115 is shown and illustrated in more detail in the following figures. The connecting device 115 shown in Fig. 1 is similar to or corresponds, for example, to the connecting device shown in Figs. 12 to 25 and / or Figs. 42 to 48.

[0100] In an operational state of the electronic circuit 100, a current path 198 runs through the circuit boards 105, 110, which is shown merely by way of example using arrows. More precisely, the current path 198 runs through the conductor tracks 135, 135 and, according to the exemplary embodiment shown here, counterclockwise. The current path 198 runs through the connecting element 165 and through the further connecting element 168. The arrangement of the connecting device 115 in the electronic circuit 100 reduces the height hcc in the intermediate space 125, whereby the low height hcc leads to an advantageous geometry of the current path 198, thereby enabling a low stray inductance.

[0101] In other words, when designing power electronics for fast-switching applications, such as a gallium nitride transistor, correct layout design is a crucial aspect to consider. Due to the layout geometry of current path 198 shown in Fig. 1, parasitic stray inductances are reduced or eliminated, thus leaving the switching behavior of the fast-switching power electronics unaffected.

[0102] Fig. 1 shows a design of a vertical commutation loop with bottom-cooled components 140, 150, which can also be referred to as transistors, with the connecting device 115, which can also be referred to as a board-to-board connector, and with the use of the first circuit board 105, which can also be referred to as a PCB, and the second circuit board 110, which can also be referred to as an IMS (Insulated Metal Substrate). Therefore, the height hcc of the design is limited by the height of the tallest component, here the connecting device 115, which can also be referred to as a signal board-to-board connector, which is soldered to the second circuit board 110, and the minimum lee of the design is determined.Dynamic switching tests of such designs show a slight influence of the stray inductance, which can also be referred to as fixed Lee, on the switching behavior of the power electronics, which greatly improves their fast switching capability.

[0103] The connecting device 115 is optimized for a low-noise layout with a vertical commutation loop. The height hcc is advantageous for the design, and the distance between the two circuit boards 105, 110 can be less than three millimeters, less than two millimeters, and / or less than one millimeter to reduce the height hcc, which is necessary for a low-parasitic layout. The current carrying capacity is relatively high compared to the space required, thus also providing a high current density, which leads to significantly shorter and / or smaller plug-in distances. With the connecting device 115 presented here, it is possible to define the height hcc between the two circuit boards 105, 110 with a sufficiently precise tolerance when the connecting device 115 is used as a spacer element. The connecting device 115 is designed to be sufficiently small, for example, and thus meets the requirements for high-current applications.

[0104] The connecting device 115 is mounted, for example, using SMT (surface-mounted technology) on the second circuit board 110, which can also be referred to as an IMS board, or non-conductive connectors through the second circuit board 110, since otherwise the top and bottom of the second circuit board 110 would be electrically connected, which is to be avoided. The connecting device 115 sits self-positioning on the solder pad and does not float away during soldering.

[0105] Fig. 1 shows an optimized, low-parasitic layout using a pitch-optimized interconnect device 115. This allows the first circuit board 105 to be arranged closer to the second circuit board 110, optimizing the parasitic layout and improving the following design aspects: By reducing the height hcc, the parasitic leakage inductance Lee is significantly reduced. The reduced Lee reduces parasitic influences on the fast switching behavior of the power electronics. By increasing the capable switching speeds, the switching losses of the power electronics are reduced, and the efficiency of the electrical system is improved.

[0106] In addition, the current carrying capacity of the connecting device 115 is relatively high compared to the required space, which results in significantly smaller or shorter connecting elements 165, 168, which can also be referred to as connectors. This enables better layout options and further improves the design. In addition, the height hcc between the two circuit boards 105, 110 is defined with a sufficiently precise tolerance by using the connecting elements 165, 168 as spacer elements. Fig. 2 shows a representation of a stray inductance to explain an embodiment of an electronic circuit. An optimized distance 200 of the connecting device is shown, wherein the distance is merely exemplary 1.4 millimeters and ~6.4 nH stray inductance. The distance 200 corresponds, for example, to the height shown in Fig. 1.

[0107] The improvements in drain-source voltage oscillations during turn-off are shown. By reducing the distance 200 between the two printed circuit boards, which can also be referred to as circuit boards, the stray inductance is reduced by more than half. While the distance was previously only 3.6 millimeters for an old signal board to the board terminals, the distance 200 in Fig. 2 is reduced to just 1.4 millimeters, for example.

[0108] Fig. 3 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device shown in Fig. 1, except that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as an L-bent-sheet connector, or L-BSC for short.

[0109] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185, wherein the connecting element 165 is formed, for example, in one piece. The connecting element 165 is, by way of example only, at least partially L-shaped and designed to be inserted into the space of the electronic circuit, as shown and described in more detail in Fig. 10 by way of example only. The connecting element 165 forms, for example, a bend 300 with a bending radius between the base 175 and the contact element 185.

[0110] Fig. 4 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3, except that the connecting device 115 is shown in a side view. Fig. 5 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3 and / or Fig. 4, except that the connecting device 115 is shown in a rear view.

[0111] Fig. 6 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 3 to 5. The connecting device 115 can also be referred to as an L-distancekeeping bent-sheet connector, or LD-BSC for short.

[0112] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is, for example, formed in one piece, wherein the connecting element 165 forms at least one mechanical stop 600.

[0113] According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the contact element 185. A further mechanical stop 605 is formed, for example, on a further outer edge of the contact element 185. The mechanical stop 600 and / or the further mechanical stop 605 define the height between the circuit boards and / or are designed to enable the first circuit board to rest on the stop 600 and / or the further stop 605.

[0114] Fig. 7 shows a representation of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from Fig. 6, with the exception that a section of the connecting device 115 is shown in side view. The mechanical stop 600 is thus clearly visible. Fig. 8 shows a representation of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figs. 3 to 7, with the exception that the connecting device 115 forms a plurality of sections 800. The connecting device 115 can also be referred to as an L-distancekeeping bent pin sheet connector, or LD-BPSC for short.

[0115] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are, for example, identically shaped and formed along the contact element 185. The sections 800 serve, for example, as stops for at least one of the circuit boards.

[0116] In other words, the contact element 185, which can also be referred to as the contact side for the circuit board, is divided into individual pins or shorter sections, for example, to increase the design options of the circuit board. This also allows for mechanical stops between the sections 800 on which the circuit board rests, thus defining the height between the circuit boards.

[0117] Fig. 9 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 8, except that a section of the connecting device 115 is shown in a side view.

[0118] The sections 800 extend, for example, through the contact element 185 and terminate above the base 175. The first circuit board can, for example, rest on the sections 800.

[0119] Fig. 10 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 1, except that the connecting device 115 is similar to or corresponds to the connecting device of one of the Figs. 3 to 9.

[0120] The connecting device 115 forms the connecting element 165 and the further connecting element 168. The connecting elements 165, 168 are formed similarly for illustrative purposes only, more precisely, they are at least partially L-shaped.

[0121] The base 175 of the connecting element 165 is, for example, in contact with the second conductor track 135 of the second circuit board 110. The contact element 185 of the connecting element 165 protrudes at least partially through the through-opening 190 of the first circuit board 105. The connecting element 165 is arranged adjacent to the component 138.

[0122] The further connecting element 168 is arranged adjacent to the third component 150, wherein the further base 178 of the further connecting element 168 is in contact with the second conductor track 135 of the second circuit board 110. The further contact element 188 of the further connecting element 168 is at least partially guided out of the further through-opening 195 of the first circuit board 105.

[0123] The connecting elements 165, 168 are arranged mirrored to each other merely as an example.

[0124] The height hcc is reduced accordingly due to the shape of the connecting elements 165, 168. The through openings 190, 195, for example, are electrically insulated.

[0125] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. In other words, Fig. 3 to Fig. 10 show the connecting device 115, which can also be referred to as an L-bent sheet connector, abbreviated to L-BSC, LD-BSC, LD-BPSC, for a description of the connecting device 115, which can also be referred to as a distance-optimized board-to-board connection concept.

[0126] The connecting device 115 is made, for example, from an electrically conductive sheet metal, for example, copper sheet with or without a coating, and is bent, for example, into the desired L-shape. The connecting device 115 is soldered flat on one side, i.e., with the base 175, 178, onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor-phase soldering process. On the other side, i.e., the contact elements 185, 188 are contacted through the through-openings 190, 195, which can also be referred to as elongated holes, in the first circuit board 105 and soldered from above.

[0127] Fig. 11 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Figure 10, except that a top view of the first circuit board 105 is shown. More specifically, for example, the through-openings 190, 195 are shown, through which the contact elements of the connecting device can be passed.

[0128] Fig. 12 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as a T1-bent-sheet connector, or T1-BSC for short, and is at least partially T-shaped.

[0129] According to one embodiment, the connecting device 115 forms two sections 1200, 1205 in the region of the base 175. The base 175 is thus divided into three sections 1200, 1205, 1210. The two outer sections 1200, 1205 are identical for illustrative purposes only and are narrower than the section 1210. The sections 1200, 1205 extend in an opposite direction to the section 1210, with the section 1210 being arranged between the sections 1200, 1205.

[0130] In other words, Figures 12 to 18 show the connecting device 115, which can also be referred to as T1-Bent-Sheet connector, T1-BSC, T1-D-BSC, T1-D-BPSC for short.

[0131] The connecting device 115 is made, for example, from an electrically conductive sheet metal, such as copper sheet with or without a coating, and is bent, for example, into the desired T-shape. The connecting device 115 can be soldered flat to the second circuit board on one side, i.e., with the base 175, for example, together with the other components using a vapor-phase soldering process. On the other side, i.e., the contact elements 185 can be contacted through the through-holes in the first circuit board and soldered from above.

[0132] The connecting device 115 can be extended, for example, into several sections that are alternately bent forward and backward in order to be soldered to several smaller pads on the first circuit board.

[0133] Fig. 13 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 12, except that the connecting device 115 is shown in a side view.

[0134] Fig. 14 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 12 and / or Fig. 13, except that the connecting device 115 is shown in a rear view.

[0135] Fig. 15 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 12, with the exception that the connecting device 115 forms a mechanical stop 600. The connecting device 115 can also be referred to as a T1 spacer bent-sheet connector, or T1-D-BSC for short.

[0136] According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the contact element 185, more precisely on the first section 1200. A further mechanical stop 605 is formed, for example, on a further outer edge of the contact element 185, more precisely on the second section 1205. The mechanical stop 600 and / or the further mechanical stop 605 define the height between the circuit boards and / or are designed to enable the first circuit board to rest on the stop 600 and / or the further stop 605.

[0137] Fig. 16 shows a diagram of a connecting device 115 for illustrating an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device shown in Fig. 16, except that a section of the connecting device 115 is shown in a side view. The mechanical stop 600 is thus clearly visible.

[0138] Fig. 17 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 12 to 16, with the exception that the connecting device 115 forms a plurality of sections 800.

[0139] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are shaped identically, for example, and are formed along the contact element 185. The sections 800 serve, for example, as stops for a printed circuit board. The connecting device 115 can also be referred to as a T1 Distancekeeping Bent Pin Sheet Connector, or T1-D-BPSC for short. The contact element 165 for the printed circuit board is divided, for example, into individual pins or shorter sections 800 to increase the design options of the printed circuit board. This also enables mechanical stops between the sections 800, on which the printed circuit board rests, thus defining the distance between the printed circuit boards.

[0140] Fig. 18 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 17, except that a section of the connecting device 115 is shown in a side view. The sections 800 are formed, for example, radially to the longitudinal axis of the contact element 185.

[0141] Fig. 19 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as a T2 bent-sheet connector, or T2-BSC for short.

[0142] According to one embodiment, the connecting device 115 forms three sections 1200, 1205, 1210 in the region of the base 175. The two outer sections 1200, 1205 are identical and wider than section 1210, merely by way of example. Sections 1200, 1205 extend in an opposite direction to section 1210, with section 1210 being arranged between sections 1200, 1205.

[0143] In other words, Figures 19 to 25 show the connecting device 115, which can also be referred to as a T2 bent-sheet connector, or T2-BSC, T2-D-BSC, or T2-D-BPSC for short. The connecting device 115 is made, for example, from an electrically conductive sheet, for example copper sheet with or without a coating, and is bent, for example, into the desired T-shape. The connecting device 115 can be soldered on one side, i.e. with the base 175 flat, onto the second circuit board, for example together with the other components using a vapor phase soldering process, and on the other side, i.e. the contact elements 185, can be contacted through the through-openings in the first circuit board and soldered from above.

[0144] The connecting device 115 can be extended, for example, into several sections that are alternately bent forward and backward in order to be soldered to several smaller pads on the first circuit board.

[0145] Fig. 20 shows a connection device 115 for illustrating an embodiment of an electronic circuit. The connection device 115 is similar to or corresponds to the connection device of Fig. 19, except that the connection device 115 is shown in a side view.

[0146] Fig. 21 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 19 and / or Fig. 20, except that the connecting device 115 is shown in a rear view.

[0147] Fig. 22 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 19, with the exception that the connecting element 165 forms at least one mechanical stop 600.

[0148] According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the contact element 185, more precisely on the first section 1200. A further mechanical stop 605 is formed, for example, on a further outer edge of the contact element 185, more precisely on the second section 1205. The mechanical stop 600 and / or the further mechanical stop 605 define the height between the circuit boards and / or are designed to enable the first circuit board to rest on the stop 600 and / or the further stop 605.

[0149] Fig. 23 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 22, except that a section of the connecting device 115 is shown in a side view. The mechanical stop 600 is thus clearly visible.

[0150] Fig. 24 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 19 to 23, with the exception that the connecting device 115 forms a plurality of sections 800.

[0151] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are, for example, identically shaped and formed along the contact element 185. The sections 800 serve, for example, as stops for a printed circuit board.

[0152] The connecting device 115 can also be referred to as a T2 Distancekeeping Bent Pin Sheet Connector, or T2-D-BPSC for short. The contact element 165 for the printed circuit board is divided, for example, into individual pins or shorter sections 800 to increase the design options of the printed circuit board. This also enables mechanical stops between the sections 800 on which the printed circuit board rests, thus defining the distance or height between the printed circuit boards.

[0153] Fig. 25 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 24, except that a section of the connecting device 115 is shown in a side view. The sections 800 extend, for example, halfway through the contact element 185 and terminate above the base 175. The first circuit board can rest, for example, on the sections 800.

[0154] Fig. 26 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device shown in Fig. 1, except that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as a Q-bent sheet connector.

[0155] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is, by way of example only, at least partially parabolic or omega-shaped and designed to be inserted into the space of the electronic circuit, as shown and described in more detail in Fig. 33.

[0156] Fig. 27 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 26, except that the connecting device 115 is shown in a side view.

[0157] Fig. 28 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 26 and / or Fig. 27, except that the connecting device 115 is shown in a side view.

[0158] Fig. 29 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 26 to 28.

[0159] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is formed, for example, in one piece, wherein the connecting element 165 forms at least one mechanical stop 600. According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the contact element 185. A further mechanical stop 605 is formed, for example, on a further outer edge of the contact element 185.

[0160] In other words, the connecting device 115 can also be referred to as an O-spacer bent-sheet connector, QD-BSC for short, and has mechanical stops 600, 605 on the outer edges, on which, for example, the first circuit board rests, and thus defines the distance or height between the circuit boards.

[0161] Fig. 30 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 29, except that a section of the connecting device 115 is shown in a side view. The mechanical stop 600 is thus clearly visible.

[0162] Fig. 31 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 26 to 30, except that the connecting device 115 forms a plurality of sections 800.

[0163] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are, for example, identically shaped and formed along the contact element 185. The sections 800 serve, for example, as stops for a printed circuit board.

[0164] In other words, the connecting device 115 can also be referred to as an O-spacer bent-pin-sheet connector, or O-D-BPSC for short. The contact element 185, which can also be referred to as the contact side for the circuit board, is divided, for example, into individual pins or shorter sections 800 to increase the design options of the circuit board. This also enables mechanical stops between the sections 800 on which the circuit board rests, thus defining the distance or height between the circuit boards. Individual sections 800 also have the advantage that the clamp connection or press connection functions better because tolerances can be better compensated, thereby increasing the contact area.

[0165] Fig. 32 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 31, except that a section of the connecting device 115 is shown in a side view.

[0166] The sections 800 terminate above the base 175. The first circuit board can, for example, rest on the sections 800.

[0167] Fig. 33 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 1 and / or Fig. 10, with the exception that the connecting device 115 is similar to or corresponds to the connecting device of one of Figs. 26 to 32.

[0168] The connecting device 115 forms the connecting element 165 and the further connecting element 168. The connecting elements 165, 168 are shaped similarly merely by way of example, more precisely, they are at least partially parabolic or omega-shaped.

[0169] The base 175 of the connecting element 165 is in contact, for example, with the second conductor track 135 of the second circuit board 110. The contact element 185 of the connecting element 165 protrudes at least partially from the through-opening 190 of the first circuit board 105. The connecting element 165 is arranged adjacent to the component 138. The further connecting element 168 is arranged adjacent to the third component 150, wherein the further base 178 of the further connecting element 168 is in contact with the second conductor track 135 of the second circuit board 110. The further contact element 188 of the further connecting element 168 is at least partially led out of the further through-opening 195 of the first circuit board 105.

[0170] The height hcc is reduced accordingly due to the shape of the connecting elements 165, 168. The through openings 190, 195, for example, are electrically insulated.

[0171] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path runs through the spaces formed by the contact elements 185, 188 due to their parabolic and / or omega-shaped configuration.

[0172] In other words, Fig. 26 to Fig. 33 show the connecting device 115, which can also be referred to as Q-Bent-Sheet-Connector, Q-BSC for short, QD-BSC, for a description of the connecting device 115, which can also be referred to as a distance-optimized board-to-board connection concept.

[0173] The connecting device 115 is made, for example, from an electrically conductive sheet, for example copper sheet with or without a coating, and is bent, for example, into the desired Q-shape. The connecting device 115 is soldered on one side, i.e. with the base 175, 178, flat onto the second circuit board 110, for example together with the other components 138, 140, 150 using a vapor phase soldering process, and on the other side, i.e. the contact elements 185, 188 can be contacted and clamped, i.e. pressed in or soldered from above, through the through-openings 190, 195, which can also be referred to as elongated holes (see also Fig. 7), in the first circuit board 105. Fig. 34 shows an illustration of a connecting device 115 to explain an exemplary embodiment of an electronic circuit.The connecting device 115 is similar to or corresponds to the connecting device from one of the figures described above, with the exception that the connecting device 115 is shaped differently.

[0174] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is, by way of example only, at least partially U-shaped and designed to be inserted into the space of the electronic circuit, as shown and described in more detail in Fig. 41 by way of example only. The contact element 185 forms a first contact side 3400 and a second contact side 3405, which are arranged opposite one another due to the U-shaped configuration. The connecting device 115 can be referred to as a U-bent-sheet connector, or U-BSC for short.

[0175] Fig. 35 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 34, except that the connecting device 115 is shown in a side view.

[0176] Fig. 36 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 34 and / or Fig. 35, except that the connecting device 115 is shown in a rear view.

[0177] Fig. 37 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 34 to 36. The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is, for example, formed in one piece, wherein the connecting element 165 forms at least one mechanical stop 600.

[0178] According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the contact element 185. A further mechanical stop 605 is formed, for example, on a further outer edge of the contact element 185.

[0179] In other words, the connecting device 115 can also be referred to as a 11-spacer bent-sheet connector, abbreviated to UD-BSC, and has mechanical stops 600, 605 on the outer edges, on which, for example, the first circuit board rests, and thus defines the distance or height between the circuit boards.

[0180] Fig. 38 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 37, except that a section of the connecting device 115 is shown in a side view. The mechanical stop 600 is thus clearly visible.

[0181] Fig. 39 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figs. 34 to 38, with the exception that the connecting device 115 forms a plurality of sections 800.

[0182] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are shaped identically, for example, and are formed along the contact element 185. The sections 800 serve, for example, as stops for a printed circuit board. In other words, the connecting device 115 can also be referred to as a U-distancekeeping bent pin sheet connector, or UD-BPSC for short. The contact element 185 is divided, for example, into individual pins or shorter sections 800 to increase the design options of the printed circuit board. This also enables mechanical stops between the sections 800, on which the printed circuit board rests, thus defining the distance or height between the printed circuit boards.

[0183] Fig. 40 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 39, except that a section of the connecting device 115 is shown in a side view.

[0184] The sections 800 extend, for example, through the contact element 185 and terminate above the base 175. The first circuit board can, for example, rest on the sections 800.

[0185] Fig. 41 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 1 and / or Fig. 10 and / or Fig. 33, except that the connecting device 115 is similar to or corresponds to the connecting device of one of Figs. 34 to 40.

[0186] The connecting device 115 forms the connecting element 165 and the further connecting element 168. The connecting elements 165, 168 are formed similarly for illustrative purposes only, more precisely, they are at least partially U-shaped.

[0187] The connecting element 165 is arranged adjacent to the component 138. The base 175 of the connecting element 165 is contacted, for example, with the second conductor track 135 of the second circuit board 110. Due to its U-shaped configuration, the contact element 185 has two contact sides 3400, 3405. The first contact side 3400 is, for example, at least partially passed through the through-opening 190 of the first circuit board 105. The second contact side 3405 is, for example, at least partially passed through a second through-opening 4100 of the first circuit board 105.

[0188] The further connecting element 168 is arranged adjacent to the third component 150, wherein the further base 178 of the further connecting element 168 is in contact with the second conductor track 135 of the second printed circuit board 110. Due to its U-shaped configuration, the further contact element 168 has two further contact sides 4105, 4110. The further first contact side 4105 is, for example, at least partially passed through the further through-opening 195 of the first printed circuit board 105. The further second contact side 4110 is, for example, at least partially passed through a further second through-opening 4115 of the first printed circuit board 105.

[0189] The height hcc is reduced accordingly due to the shape of the connecting elements 165, 168. The through openings 190, 195, 4100, 4115, for example, are electrically insulated.

[0190] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path runs through the spaces formed by the contact elements 185, 188 due to their U-shaped configuration.

[0191] In other words, Fig. 34 to Fig. 41 show the connecting device 115, which can also be referred to as a U-bent sheet connector, or U-BSC, UD-BSC, or UD-BPSC for short. The connecting device 115 is made, for example, from an electrically conductive sheet, for example copper sheet with or without a coating, and is bent, for example, into the desired U-shape. The connecting device 115 is soldered flat on one side, i.e. with the base 175, 178, onto the second printed circuit board 110, for example together with the other components 138, 140, 150 using a vapor phase soldering process, and on the other side, i.e. the contact elements 185, 188, are contacted through the through-openings 190, 195, 4100, 4115, which can also be referred to as two parallel elongated holes, in the first printed circuit board 105 and soldered from above.

[0192] Fig. 42 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as a T-piece connector, or T-PC for short.

[0193] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is, by way of example only, at least partially T-shaped and designed to be inserted into the space of the electronic circuit, as shown and described in more detail in Fig. 1.

[0194] Figures 42 to 48 show the connecting device 115, which can also be referred to as a T-part connector, abbreviated to T-PC, TD-PC, or TD-PPC. The connecting device 115 is made, for example, from an electrically conductive sheet, for example, copper sheet with or without a coating, and is milled, for example, into the desired T-shape. The connecting device 115 can be soldered on one side, i.e., with the base 175 flat, onto the second circuit board, for example, together with the other components using a vapor-phase soldering process. On the other side, i.e., the contact element 185 can be contacted through the through-hole in the first circuit board and soldered from above.

[0195] Fig. 43 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 42, except that the connecting device 115 is shown in a side view. Fig. 44 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 42 and / or Fig. 43, except that the connecting device 115 is shown in a rear view.

[0196] Fig. 45 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figs. 42 to 44. The connecting device 115 can also be referred to as a T-spacer connector, or TD-PC for short.

[0197] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is formed, for example, in one piece, wherein the connecting element 165 forms at least one mechanical stop 600. According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the contact element 185. A further mechanical stop 605 is formed, for example, on a further outer edge of the contact element 185.

[0198] The mechanical stop 600 and / or the further mechanical stop 605 define the height between the circuit boards and / or are designed to allow the first circuit board to rest on the stop 600 and / or the further stop 605.

[0199] Fig. 46 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 45, except that a section of the connecting device 115 is shown in a side view. The mechanical stop 600 is thus clearly visible.

[0200] Fig. 47 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figs. 42 to 46, except that the connecting device 115 forms a plurality of sections 800.

[0201] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are, for example, identically shaped and formed along the contact element 185. The sections 800 serve, for example, as stops for a printed circuit board.

[0202] The connecting device 115 can also be referred to as a T-spacer-part-pin connector, or TD-PPC for short. The contact element 165 for the printed circuit board is divided, for example, into individual pins or shorter sections 800 to increase the design options of the printed circuit board. This also allows for mechanical stops between the sections 800 on which the printed circuit board rests, thus defining the spacing between the printed circuit boards.

[0203] Fig. 48 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 47, except that a section of the connecting device 115 is shown in a side view.

[0204] Fig. 49 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the figures described above. The connecting device can also be referred to as a II-part connecting piece, or II-PC for short.

[0205] The connecting device 115 forms the connecting element 165 with the base 175 and the contact element 185. The connecting element 165 is formed, for example, in one piece. The base 175 is rectangular in shape only by way of example. The contact element 185 forms, for example, two contact sides 3400, 3405, which form a plurality of pin elements 4900. The pin elements 4900 extend along the base 175.

[0206] Figures 49 to 53 show the connecting device 115, which can also be referred to as the II-part connection point, abbreviated to II-PC, II-D-PC. The arrangement of the connecting device 115 shown in Figures 49 to 53 is shown merely as an example in Fig. 41.

[0207] The connecting device 115 is made, for example, of a conductive material, such as copper with or without a coating, and is, for example, 3D-printed or milled into the desired II shape. The connecting device 115 can be soldered flat to the second circuit board on one side, i.e., with the base 175, for example, together with the other components using a vapor-phase soldering process. On the other side, i.e., the contact element 185 can be contacted through the through-holes in the first circuit board and soldered from above.

[0208] Fig. 50 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 49, except that the connecting device 115 is shown in a side view.

[0209] Fig. 51 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 49 and / or Fig. 50, except that the connecting device 115 is shown in a rear view.

[0210] Fig. 52 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 49, except that the pin-shaped sections are shorter and thicker. The connecting device 115 can also be referred to as a II-spacer-part connector, or II-D-PC for short. The connecting device 115 has mechanical stops 600 in the area of ​​the base 175 due to the height of the rectangular body of the base 175, on which the circuit board can rest. In this way, the distance or height between the circuit boards is defined.

[0211] Fig. 53 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 52, except that a section of the connecting device 115 is shown.

[0212] Fig. 54 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 52, except that the connecting device 115 is rectangular in shape.

[0213] Fig. 55 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 54, except that the connecting device 115 is shown in a side view.

[0214] Fig. 56 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 54 and / or Fig. 55, except that the connecting device 115 is shown in a rear view.

[0215] Fig. 57 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 1 and / or Fig. 10 and / or Fig. 33 and / or Fig. 41, with the exception that the connecting device 115 is similar to or corresponds to the connecting device of one of Figs. 54 to 56. The connecting device 115 forms the connecting element 165 and the further connecting element 168. The connecting elements 165, 168 are shaped similarly merely by way of example, more precisely, they are at least partially rectangular.

[0216] The connecting element 165 is arranged adjacent to the component 138. The bottom 175 of the connecting element 165 is in contact, for example, with the second conductor track 135 of the second circuit board 110. The contact element 185 is in contact with a top side of the contact element 185 on the inside 120 of the first circuit board 105. The first circuit board 105 has the through-opening 190, but the connecting element 165 is not guided through the through-opening 190.

[0217] The further connecting element 168 is arranged adjacent to the third component 150, wherein the further base 178 of the further connecting element 168 is in contact with the second conductor track 135 of the second circuit board 110. The further contact element 188 is in contact with a top side of the further contact element 188 on the inner side 120 of the first circuit board 105. The first circuit board 105 has the further through-opening 195, but the further connecting element 168 is not guided through the further through-opening 195. The through-openings 190, 195 are, for example, narrower than the connecting elements 165, 168.

[0218] The height hcc is reduced accordingly due to the shape of the connecting elements 165, 168. The through openings 190, 195, for example, are electrically insulated.

[0219] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188.

[0220] In other words, Figs. 54 to 57 show the connecting device 115, which can also be referred to as a _-spacer-spacer connector, or _-D-SC for short. The connecting device 115 is made, for example, from a conductive material, for example copper with or without a coating, and is, for example, 3D-printed or milled into the desired _-shape. The connecting device 115 is soldered on one side, i.e. with the base 175 flat onto the second circuit board 110, for example together with the other components 138, 140, 150 using a vapor phase soldering process, and on the other side, i.e. the contact element 185 is soldered through the through-openings 190, 195 in the first circuit board and soldered from above.

[0221] Fig. 58 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or equivalent to the electronic circuit of Fig. 57, except that the first circuit board 105 has no through holes.

[0222] In other words, Fig. 58 shows the connecting device 115, which can also be referred to as a _-spacer-spacer connector, _-D-SC for short, and / or system soldering process. The connecting device 115 is made, for example, from a conductive material, for example copper with or without a coating, and is, for example, 3D-printed or milled into the desired _-shape. The connecting device 115 is soldered flat on one side, i.e. with the base 175, onto the second circuit board 110, and on the other side, i.e. with the contact element 185, onto an outer layer of the first circuit board 105. In this soldering process, all components are soldered one on top of the other, and both the first circuit board 105 and the second circuit board 110 can be soldered in the same process step, for example using a vapor phase soldering process. The connecting device 115 can also be designed, for example, as a solder preform, as shown, for example, in Fig.59 is shown.

[0223] Fig. 59 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 54 to 58. The connecting device 115 is embodied as a solder preform merely by way of example.

[0224] The solder preform is solid and flat.

[0225] Fig. 60 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or equivalent to the electronic circuit of Fig. 57, except that the connecting device 115 is shaped differently.

[0226] The connecting device 115 is, for example, at least partially spherically shaped. More specifically, the contact element 185 and the further contact element 188 are spherically shaped. The contact elements 185, 188 extend at least partially into the through-openings 190, 195 of the first circuit board 105.

[0227] The connecting device 115 can also be referred to as a solder connector and / or solder connector, abbreviated to SC. The connecting device 115 is made of solder, for example, and is simply soldered from the first circuit board 105 to the second circuit board 110 through slotted holes in the circuit board, as shown merely by way of example in Fig. 11.

[0228] Fig. 61 shows a flowchart of an embodiment of a method 6100 for manufacturing an electronic circuit. The electronic circuit is similar to or corresponds to the electronic circuit from one of the figures described above.

[0229] The method 6100 comprises a step 6105 of providing and a

[0230] Arranging step 6110. In providing step 6105, the first circuit board, the second circuit board, and the connecting device are provided. In arranging step 6110, the connecting device is arranged between the circuit boards. The base of the connecting element is arranged on the second circuit board, with the contact element of the connecting element being at least partially guided through a through-opening in the first circuit board to produce the electronic circuit. Alternatively, a top side of the contact element is contacted to the inside of the first circuit board.

[0231] Fig. 62 shows a block diagram of an embodiment of a control device 6200 for manufacturing an electronic circuit. The control device 6200 is configured to control and / or execute the method of Fig. 24 or a similar method.

[0232] For this purpose, the control device 6200 has a provision unit 6205 and a placement unit 6210. The provision unit 6205 is designed to provide the first circuit board, the second circuit board, and the connecting device. The placement unit 6210 is designed to arrange the connecting device between the circuit boards. The base of the connecting element is arranged on the second circuit board, wherein the contact element of the connecting element is at least partially guided through a through-opening of the first circuit board in order to produce the electronic circuit. Alternatively, an upper side of the contact element is contacted on the inside of the first circuit board.

[0233] Fig. 63 shows a circuit diagram of an embodiment of an electronic circuit 100. The electronic design of the electronic circuit 100 is similar to or corresponds to one of the figures described above.

[0234] The electronic circuit 100 has a first supply voltage terminal 6302 and a second supply voltage terminal 6304, wherein a capacitor 6306 is connected between the supply voltage terminals 6302, 6304.

[0235] The electronic circuit 100 comprises, for example, a bridge circuit unit 6300, which comprises a first half-bridge 6305 and a second half-bridge 6310. The first half-bridge 6310 comprises a first switch 6315 and a second switch 6320, wherein the switches 6315, 6320 are connected to each other via a tapping point 6325. The first switch 6315 represents a high-side switch, and the second switch 6320 represents a low-side switch; the switches 6315, 6320 are embodied as transistors.

[0236] The first switch 6315 represents the additional component 140, the second switch 6320 represents the third component 150. The electronic circuit 100 comprises, for example, a first comparator 6330 and a second comparator 6335. The first comparator 6330 is connected, for example, to the first switch 6315, with a first inductance 6340 connected between the first switch 6315 and the first comparator 6330. The second comparator 6335 is connected, for example, to the second switch 6320, with a second inductance 6345 connected between the second switch 6320 and the second comparator 6335.

[0237] The second switch 6320, together with the second inductance 6345 and the second comparator 6335, forms, for example, a gate loop 6350, which can also be referred to as a gate loop.

[0238] The second half-bridge 6310 has the component 138, wherein the component 138 represents a series circuit of a capacitor 6355 and a resistor 6360.

[0239] For example, a third inductance 6365, which can also be referred to as a leakage inductance and / or leeway, is connected between the first half-bridge 6305 and the second half-bridge 6310. In an operational state, the current path 198, as described, for example, in Fig. 1, runs through the bridge circuit unit 6300 and forms a commutation loop 6370.

[0240] In other words, Fig. 63 shows the most common parasitic stray inductances. In fast-switching applications, the stray inductance Lee of the commutation loop 6370 has the greatest influence on the switching behavior and can be reduced by a correct layout, as shown and described, for example, in Fig. 1. Fig. 64 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit from one of the figures described above. In other words, Fig. 64 shows a minimalist vertical commutation loop and its geometric parameters.

[0241] Shown is the current path 198, which runs along the first circuit board 105 and the second circuit board 110. All four parameters Icc, hcc, i.e., the height hcc, wcc, and tcc, have a direct influence on the total leakage inductance Lcc. The height hcc, which can also be referred to as the distance hcc, between the current paths 198 of the vertical commutation loop is significantly reduced to also reduce the corresponding leakage inductance Lcc.

[0242] For example, the parameter Icc represents the length of the electronic circuit 100, hcc represents the height of the electronic circuit 100, wcc the width and tcc the thickness.

[0243] The exemplary embodiments described and shown in the figures are selected only as examples. Different exemplary embodiments can be combined with each other in their entirety or with regard to individual features. Furthermore, one exemplary embodiment can be supplemented by features of another exemplary embodiment.

[0244] Furthermore, method steps according to the invention can be repeated and carried out in a different order than that described.

[0245] If an embodiment includes an "and / or" link between a first feature and a second feature, this can be interpreted as meaning that the embodiment, according to one embodiment, has both the first feature and the second feature, and according to another embodiment, has either only the first feature or only the second feature. Reference symbol: electronic circuit, first circuit board, second circuit board

[0246] Connecting device

[0247] Outside of the first circuit board

[0248] Inside of the first circuit board

[0249] Outside of the second circuit board

[0250] space

[0251] Inside of the second circuit board first conductor track second conductor track

[0252] component further component third component

[0253] Thermally conductive material additional thermally conductive material

[0254] Connecting element additional connecting element

[0255] Bottom of the connecting element further bottom of the further connecting element

[0256] Contact element of the connecting element further contact element of the further connecting element

[0257] Through hole of the first circuit board further through hole of the first circuit board

[0258] Current path

[0259] Distance

[0260] Bending mechanical stop 605 additional mechanical stop

[0261] 800 Section

[0262] 1200 first section

[0263] 1205 second section

[0264] 1210 third section

[0265] 1600 gap

[0266] 3400 first contact page

[0267] 3405 second contact page

[0268] 4100 second passage opening

[0269] 4105 additional first contact page

[0270] 4110 additional second contact page

[0271] 4115 further second passage opening

[0272] 4900 pin elements

[0273] 6100 Method for producing an electronic circuit

[0274] 6105 Deployment step

[0275] 6110 Arranging step

[0276] 6200 Control device for producing an electronic circuit

[0277] 6205 Unit for providing

[0278] 6210 Unit for arranging

[0279] 6300 bridge circuit unit

[0280] 6302 first supply voltage connection

[0281] 6304 second supply voltage connection

[0282] 6305 first half bridge

[0283] 6306 Capacitor 6310 Second half-bridge 6315 First switch 6320 Second switch 6362 Tapping point

[0284] 6330 first comparator 6335 second comparator 6340 first inductance 6345 second inductance

[0285] 6350 gate loop

[0286] 6355 Capacitor 6360 Resistor 6365 Third Inductor 6370 Commutation Loop

[0287] Lee leakage inductance

[0288] Ice Length wcc Width hcc Height tcc Thickness

Claims

Patent claims 1. An electronic circuit (100) comprising the following features: a first circuit board (105) having an outer side (118) and an inner side (120) opposite the outer side (118), wherein the first circuit board (105) has at least one first conductor track (130), and wherein the first circuit board (105) has at least one through-opening (190); a second circuit board (110) having an outer side (122) and an inner side (128) opposite the outer side (122), wherein the second circuit board (110) has a second conductor track (135), wherein the inner side (128) of the second circuit board (110) faces the inner side (120) of the first circuit board (105); and a connecting device (115) arranged in a space (162) between the first circuit board (105) and the second circuit board (110).wherein the connecting device (115) forms at least one connecting element (165) with a base (175) and a contact element (185) adjacent to the base (175), wherein a lower side of the base (175) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the contact element (185) is at least partially guided through the through-opening (190) of the first printed circuit board (105) of the electronic circuit (100) or wherein a top side of the contact element (185) is contacted on the inner side (120) of the first printed circuit board (105), characterized in that the connecting device (115) forms a further connecting element (168) with a further base (178) and a further contact element (188) adjacent to the further base (178), wherein a further lower side of the further base (178) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100),wherein the further contact element (188) is at least partially formed from the through-opening (190) or a further through-opening (195) of the first printed circuit board (105) of the electronic circuit (100), is passed through or wherein a further upper side of the further contact element (188) is contacted on the inside (120) of the first printed circuit board (105), wherein the connecting element (165) and the further connecting element (168) are arranged and connected in such a way that the first conductor track (130), the second conductor track (135), the connecting element (165) and the further connecting element (168) are electrically contacted by clamping, pressing in or soldering.

2. Electronic circuit (100) according to claim 1, wherein the connecting device (115) comprises a metallic material, in particular wherein the metallic material is formed as an electrically conductive sheet.

3. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) is at least partially L-shaped and / or T-shaped and / or parabolic-shaped and / or omega-shaped and / or U-shaped and / or rectangular and / or spherical.

4. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) between the base (175) and the contact element (185) has a bend (300) with a bending radius, 5. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) is formed in one piece.

6. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) forms at least one mechanical stop (600), in particular on an outer edge of the connecting element (165).

7. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) forms a plurality of sections (800), in particular wherein the sections (800) are pin-shaped or form the connecting element (165) comb-like.

8. Electronic circuit (100) according to one of the preceding claims, wherein the base (175) is divided into at least two sections (1200, 1205), in particular wherein the sections (1200, 1205) protrude on different sides from the connecting element (165).

9. Electronic circuit (100) according to one of the preceding claims, wherein the base (175) is divided into at least three sections (1200, 1205, 1210), wherein a central section (1210) protrudes from the connecting element (165) on a different side than two sections (1200, 1205) arranged on opposite edges.

10. The electronic circuit (100) according to claim 10, wherein the central portion (1210) is wider than the two portions (1200, 1205) arranged at opposite edges, or wherein the two portions (1200, 1205) arranged at opposite edges are wider than the central portion (1210).

11. A method (6100) for manufacturing an electronic circuit (100) according to any one of claims 1 to 10, wherein the method (6100) comprises the following steps: Providing (6105) the first circuit board (105), the second circuit board (110) and the connecting device (115); and Arranging (6110) the connecting device (115) between the printed circuit boards (105, 110), wherein the bottom (175) of the connecting element (165) is arranged on the second printed circuit board (110), wherein the contact element (185) of the connecting element (165) is led at least partially through a through-opening (190) of the first printed circuit board (105) in order to produce the electronic circuit (100), wherein the contact element (185) is led at least partially through the through-opening (190) of the first printed circuit board (105) of the electronic circuit (100) or wherein a top side of the contact element (185) is contacted on the inside (120) of the first printed circuit board (105), wherein furthermore for the Connecting device (115), a further connecting element (168) with a further base (178) and a further contact element (188) adjacent to the further base (178) is arranged, wherein a further underside of the further base (178) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the further contact element (188) is led at least partially through from the through-opening (190) or a further through-opening (195) of the first printed circuit board (105) of the electronic circuit (100) or wherein a further upper side of the further contact element (188) is contacted on the inner side (120) of the first printed circuit board (105), wherein the connecting element (165) and the further connecting element (168) are arranged and connected in such a way that the first conductor track (130), the second conductor track (135), the connecting element (165) and the further connecting element (168) are connected by a clamping,Pressing or soldering electrically contacted., 12. Control device (6200) which is designed to carry out and / or control the steps of the method (6100) according to claim 11 in corresponding units (6205, 6210).

13. Computer program product with program code for carrying out the method (6100) according to claim 11, when the computer program product is executed on a control device (6200).

14. A machine-readable storage medium on which the computer program according to claim 13 is stored.

Images