Electronic circuit, and method for manufacturing an electronic circuit

Abstract

The invention relates to an electronic circuit (100) comprising a first printed circuit board (105), a second printed circuit board (110), and a connection device (115). The first printed circuit board (105) has an outer side (118) and an inner side (120) opposite the outer side (118). The first printed circuit board (105) has at least one first conductor track (130) and / or at least one through-hole (190). The second printed circuit board (110) has an outer side (122) and an inner side (128) opposite the outer side (122). The second printed circuit board (110) has a second conductor track (135), the inner side (128) of the second printed circuit board (110) facing the inner side (120) of the first printed circuit board (105). The connection device (115) is arranged in a gap (125) between the first printed circuit board (105) and the second printed circuit board (110). The connection device (115) is designed to be removable and forms at least one connection element (165) having a base (175) and a bent element (165) adjoining the base (175). A bottom side of the base (174) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100). The bent element (165) is at least partially guided out through the through-hole (190) in the first printed circuit board (105) of the electronic circuit (100). Alternatively, a top side of the bent element (165) is contacted with the inner side (120) of the first printed circuit board (105).

Description

[0001] Electronic circuit and method for producing an electronic circuit

[0002] The present invention relates to an electronic circuit and to a method for manufacturing an electronic circuit.

[0003] Parasitic stray inductances can occur in power electronics.

[0004] The document DE 10 2015 215 084 A1 discloses a seal for vias.

[0005] The document DE 10 2016 205 169 A1 discloses a method for producing a circuit (electronics), system and electrical connectors therefor.

[0006] The document DE 10 2016 218 788 A1 discloses a printed circuit board connection.

[0007] The document EP 1544954 A2 discloses various variants of a contact spring for an antenna amplifier.

[0008] The document US 2009 / 0190319 A1 discloses a three-dimensional module.

[0009] The document JP 2010-206 505 A discloses a piezoelectric device and a method for its manufacture.

[0010] Against this background, the present invention provides an improved electronic circuit and an improved method for manufacturing an electronic circuit according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0011] The advantages achievable with the approach presented here consist in particular in that an electronic circuit is created which can reduce stray inductance, in particular parasitic stray inductance. An electronic circuit has a first circuit board, a second circuit board and a connecting device. The first circuit board has an outer side and an inner side opposite the outer side. The first circuit board has a first conductor track and / or at least one through-opening. The second circuit board has an outer side and an inner side opposite the outer side. The second circuit board has a second conductor track, wherein the inner side of the second circuit board faces the inner side of the first circuit board. The connecting device is arranged in a space between the first circuit board and the second circuit board.The connecting device is detachable and forms at least one connecting element with a base and an arc element adjacent to the base. A bottom side of the base is arranged on the inside of the second circuit board of the electronic circuit. The arc element extends at least partially out of the through-opening of the first circuit board of the electronic circuit. Alternatively, a top side of the arc element is contacted on the inside of the first circuit board.

[0012] The circuit boards can be manufactured cost-effectively and in large quantities. The connecting device can also be referred to as a board-to-board connector and, due to its shape, can reduce the height in the gap such that stray inductance can be reduced. The first circuit board and the second circuit board can, for example, be designed to be separable so that they can be separated without great effort. The connecting device can therefore be removable. A removable connecting device can significantly simplify assembly and disassembly. In addition, maintenance and repairs can be simplified. Adjustments to the populated components, for example of gate resistors, can also be made easier. The base can be soldered to the second circuit board, and the curved element can be soldered to the first circuit board.Alternatively, the top side of the arc element can be clamped to the inside of the first printed circuit board. The electronic circuit can enable a small overall size of the assembly through better space utilization. Furthermore, the electronic circuit can enable a small overall size of the assembly through higher current carrying capacity of the connecting device, thus enabling a smaller size of the connecting device. The approach presented here can also be referred to as optimized, low-parasitic layouts using a connecting device, which can also be referred to as a pitch-optimized, detachable board-to-board connector, and can also include concepts for this detachable connecting device.

[0013] The approach presented here of an optimized, low-parasitic layout through the use of a pitch-optimized interconnect device can also be used for other substrate combinations, such as DBC (direct bonded copper), a connection technology that enables a close electrical / thermal connection via copper, and / or AMB (active metal brazed), a connection technology or a form of brazing in which metal and ceramic can be joined without metallization, and not only for PCBs in combination with IMS or other printed circuit boards.

[0014] The connecting device may comprise a metallic material. The metallic material may, in particular, be formed as an electrically conductive sheet. The metallic material may, for example, be copper sheet with or without a coating.

[0015] The connecting element can be at least partially parabolic, omega, C, and / or O-shaped. The connecting element can be easily bent into the desired shape.

[0016] The connecting element can be molded in one piece. This allows the connecting element to be manufactured quickly and cost-effectively.

[0017] The connecting element can form at least one mechanical stop, in particular on an outer edge of the connecting element. For example, the first circuit board can rest on the stop. The stop can thus define the height between the circuit boards. The connecting element can form a plurality of sections, in particular wherein the sections can be pin-shaped or the connecting element can be comb-shaped. A distance between the sections can be identical. The sections can be designed, for example, as stops for the first circuit board, on which the first circuit board can rest. The sections can thus define the height between the circuit boards. The sections can better enable a good clamp connection or press connection because tolerances can be better compensated and the contact area can thus be increased.

[0018] The connecting device can form a further connecting element with a further base and a further curved element adjacent to the further base. A further underside of the further base can be arranged on the inside of the second printed circuit board of the electronic circuit. The further curved element can be led at least partially through the through-opening or a further through-opening of the first printed circuit board of the electronic circuit. Alternatively, a further upper side of the further curved element can be contacted on the inside of the first printed circuit board. The further connecting element and the connecting element can be shaped identically and / or manufactured cost-effectively in large quantities.

[0019] A method for producing an embodiment of an electronic circuit mentioned herein comprises a providing step and a arranging step. In the providing step, the first circuit board, the second circuit board, and the connecting device are provided. In the arranging step, the connecting device is arranged between the circuit boards. The base of the connecting element is arranged on the second circuit board, wherein the curved element of the connecting element is at least partially passed through a through-opening of the first circuit board in order to produce the electronic circuit. Alternatively, an upper side of the curved element is contacted on the inside of the first circuit board. In the arranging step, the base can be arranged on the second circuit board using a surface-mounted technology method.For example, the circuit boards can be designed to be separable, allowing them to be separated without great effort. This allows the interconnect device to be removable. A removable interconnect device can significantly simplify assembly and disassembly. Maintenance and repairs can also be simplified. Adjustments to the mounted components, such as gate resistors, can also be made easier.

[0020] The approach presented here further provides a device designed to perform, control, or implement the steps of a variant of a method presented here in corresponding devices. This embodiment of the invention in the form of a device also allows the problem underlying the invention to be solved quickly and efficiently.

[0021] A device can be an electrical device that processes electrical signals, for example, sensor signals, and outputs control signals depending on them. The device can have one or more suitable interfaces, which can be implemented in hardware and / or software. In a hardware implementation, the interfaces can, for example, be part of an integrated circuit in which functions of the device are implemented. The interfaces can also be separate integrated circuits or consist at least partially of discrete components. In a software implementation, the interfaces can be software modules that are present, for example, on a microcontroller alongside other software modules.

[0022] Also advantageous is a computer program product with program code that can be stored on a machine-readable medium such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above when the program is executed on a computer or device.

[0023] The invention will be explained in more detail by way of example with reference to the accompanying drawings. In the drawings: Fig. 1 shows an illustration of an embodiment of an electronic circuit;

[0024] Fig. 2 is a representation of a stray inductance to explain an embodiment of an electronic circuit;

[0025] Fig. 3 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0026] Fig. 4 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0027] Fig. 5 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0028] Fig. 6 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0029] Fig. 7 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0030] Fig. 8 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0031] Fig. 9 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0032] Fig. 10 is a diagram of an embodiment of an electronic circuit;

[0033] Fig. 11 is a diagram of an embodiment of an electronic circuit;

[0034] Fig. 12 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0035] Fig. 13 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0036] Fig. 14 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0037] Fig. 15 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0038] Fig. 16 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 17 is a diagram of an embodiment of an electronic circuit;

[0039] Fig. 18 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0040] Fig. 19 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0041] Fig. 20 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0042] Fig. 21 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0043] Fig. 22 is a diagram of a connecting device for explaining an embodiment of an electronic circuit;

[0044] Fig. 23 is a diagram of an embodiment of an electronic circuit;

[0045] Fig. 24 is a flowchart of an embodiment of a method for manufacturing an electronic circuit;

[0046] Fig. 25 is a block diagram of an embodiment of a control device for producing an electronic circuit;

[0047] Fig. 26 is a circuit diagram of an embodiment of an electronic circuit; and

[0048] Fig. 27 is a representation of an embodiment of an electronic circuit.

[0049] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0050] Fig. 1 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a longitudinal section through the electronic circuit 100 is shown. The electronic circuit 100 comprises a first circuit board 105, a second circuit board 110, and a connecting device 115.

[0051] The first circuit board 105 has an outer side 118 and an inner side 120 opposite the outer side 118.

[0052] The second circuit board 110 has an outer side 122 and an inner side 128 opposite the outer side 122. The inner side 128 of the second circuit board 110 faces the inner side 120 of the first circuit board 105, with a gap 125 formed between the first circuit board 105 and the second circuit board 110. The connecting device 115 is arranged in the gap 125, enabling a low height hcc of the electronic circuit 100.

[0053] The first circuit board 105, which may be referred to as a PCB, for example, has a first conductive trace 130, and the second circuit board 110, which may be referred to as an IMS, for example, has a second conductive trace 135. According to one embodiment, the second conductive trace 135 is arranged on the inner side 128 of the second circuit board 110, and the first conductive trace 130 is arranged on the inner side 120 of the first circuit board 105.

[0054] For example, a component 138 is arranged in the gap 125 between the circuit boards 105, 110. This component is designed, for example, as a snubber, which can also be referred to as a Csnubb. The component 138 is electrically contacted to the second conductor track 135.

[0055] According to a further embodiment, a further component 140 is arranged in the intermediate space 125. The further component 140 has, for example, a greater height than the component 138. The further component 140 is embodied, merely by way of example, as a transistor, more precisely as a semiconductor transistor and / or a high-side transistor, which can also be referred to as an HS transistor, wherein the further component 140 is electrically contacted with the second conductor track 135. A thermally conductive material 155, for example, is arranged between the further component 140 and the second conductor track 135.

[0056] According to a further embodiment, a third component 150 is arranged in the gap 125 between the first circuit board 105 and the second circuit board 110. The third component 150 is designed, for example, as a transistor and has an identical height to the further component 140. The third component 150 is designed, for example, as a low-side transistor and can be referred to, for example, as an LS transistor. A further thermally conductive material 160 is arranged, for example, between the third component 150 and the second conductor track 135.

[0057] The third component 150 is arranged, for example, adjacent to the further component 140, wherein the further component 140 is arranged merely by way of example between the component 138 and the third component 150.

[0058] According to one embodiment, the connecting device 115 forms two connecting elements 165, 168 with floors 175, 178 and arch elements 185, 188.

[0059] The connecting element 165 is arranged, for example, adjacent to the component 138 in the intermediate space 125, wherein the curved element 185 is pin-shaped and extends at least partially through a through-opening 190 of the first circuit board 105. An underside of the base 175 is arranged on the inner side 128 of the second circuit board 110 of the electronic circuit 100, merely by way of example on the second conductor track 135. For example, the base 175 is soldered to the second circuit board 110. The curved element 185 is, for example, soldered from above and / or electrically contacted or contactable to the first circuit board 105.

[0060] The further connecting element 168 is, for example, shaped identically to the connecting element 165, wherein the further connecting element 168 is arranged adjacent to the third component 150 in the intermediate space 125. The further base 178 of the further connecting element 168 is contacted to the second circuit board 110, and the further curved element 188 of the further connecting element 168 is at least partially guided through a further through-opening 195 of the first circuit board 105. The connecting elements 165, 168 are shaped identically merely by way of example.

[0061] The connecting device 115 is shown and illustrated in more detail in the following figures.

[0062] In an operational state of the electronic circuit 100, a current path 198 runs through the circuit boards 105, 110, which is shown only as an example by means of arrows. More precisely, the current path 198 runs through the conductor tracks 135, 135 and, according to the embodiment shown here, in a counterclockwise direction. The current path 198 runs through the connecting element 165 and through the further connecting element 168.

[0063] By arranging the connecting device 115 in the electronic circuit 100, the height hcc in the gap 125 is reduced, wherein the low height hcc leads to an advantageous geometry of the current path 198, thereby enabling a low stray inductance.

[0064] In other words, when designing power electronics for fast-switching applications, such as a gallium nitride transistor, correct layout design is a crucial aspect to consider. Due to the layout geometry of current path 198 shown in Fig. 1, parasitic stray inductances are reduced or eliminated, thus leaving the switching behavior of the fast-switching power electronics unaffected.

[0065] Fig. 1 shows a design of a vertical commutation loop with bottom-cooled components 140, 150, which can also be referred to as transistors, with the connecting device 115, which can also be referred to as a board-to-board connector, and with the use of the first circuit board 105, which can also be referred to as a PCB, and the second circuit board 110, which can also be referred to as an IMS (Insulated Metal Substrate). Therefore, the height hcc of the design is limited by the height of the tallest component, here the connecting device 115, which can also be referred to as a signal board-to-board connector, which is soldered to the second circuit board 110, and the minimum lee of the design is determined.Dynamic switching tests of such designs show a slight influence of the stray inductance, which can also be referred to as fixed Lee, on the switching behavior of the power electronics, which greatly improves their fast switching capability.

[0066] The interconnect device 115 is optimized for a low-noise layout with a vertical commutation loop. The height hcc is advantageous for the design, and the distance between the two circuit boards 105, 110 can be less than three millimeters, less than two millimeters, and / or less than one millimeter to reduce the height hcc, which is required for a low-parasitic layout. The current carrying capacity is relatively high compared to the space required, thus also providing a high current density, which leads to significantly shorter and / or smaller mating distances.

[0067] With the connecting device 115 presented here, it is possible to define the height hcc between the two printed circuit boards 105, 110 with a sufficiently precise tolerance when using the connecting device 115 as spacer elements. The connecting device 115 is designed to be sufficiently small, for example, and thus meets the requirements for high-current applications.

[0068] The connecting device 115 is mounted, for example, using SMT (surface-mounted technology) on the second circuit board 110, which can also be referred to as an IMS board, or non-conductive connectors are mounted through the second circuit board 110, since otherwise the top and bottom of the second circuit board 110 would be electrically connected, which is to be avoided. The connecting device 115 sits self-positioning on the solder pad and does not float away during soldering.

[0069] The first circuit board 105 and the second circuit board 110 are designed to be separable, for example, so that they can be separated without great effort, and the connecting device 115, which can also be referred to as a connector, is therefore removable. A removable connecting device 115 significantly simplifies assembly and disassembly. Maintenance and repairs are also simplified. Adjustments to the assembled components, such as the gate resistors, during development are simplified.

[0070] Fig. 1 shows the novel solution of an optimized, low-parasitic layout using a distance-optimized connecting device 115. This allows the first circuit board 105 to be arranged closer to the second circuit board 110, optimizing the parasitic layout and improving the following design aspects: By reducing the height hcc, the parasitic stray inductance Lee is significantly reduced. The reduced Lee reduces parasitic influences on the fast switching behavior of the power electronics. By increasing the capable switching speeds, the switching losses of the power electronics are reduced, and the efficiency of the electrical system is improved.

[0071] Furthermore, the current carrying capacity of the connecting device 115 is relatively high compared to the required space, resulting in significantly smaller and shorter connectors. This enables better layout options and further improves the design. Furthermore, the height hcc between the two circuit boards 105, 110 is defined with a sufficiently precise tolerance by using the spacers 165, 168 as connecting elements.

[0072] Fig. 2 shows a representation of a stray inductance to explain an embodiment of an electronic circuit. It shows an optimized spacing 200 of the connecting device, with the spacing being merely 1.4 millimeters and a stray inductance of approximately 6.4 nH. The spacing 200 corresponds, for example, to the height shown in Fig. 1.

[0073] The improvements in the drain-source voltage oscillations during switch-off are shown. By reducing the distance 200 between the two circuit boards, which can also be referred to as printed circuit boards, the stray inductance is reduced by more than half. Whereas the distance was previously only 3.6 millimeters, for example, in the case of an old signal board to the board connections, the distance 200 in Fig. 2 is reduced to only 1.4 millimeters, for example. Fig. 3 shows an illustration of a connecting device 115 to explain an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from Fig. 1, with the exception that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as a Q-bent sheet connector.

[0074] The connecting device 115 forms the connecting element 165 with the base 175 and the curved element 185. The connecting element 165 is, by way of example only, at least partially parabolic or omega-shaped and designed to be inserted into the space of the electronic circuit, as shown and described in more detail in Fig. 6.

[0075] Fig. 4 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3, except that the connecting device 115 is shown in a frontal view.

[0076] Fig. 5 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3 and / or Fig. 4, except that the connecting device 115 is shown in a side view.

[0077] Fig. 6 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 3 to 5.

[0078] The connecting device 115 forms the connecting element 165 with the base 175 and the curved element 185. The connecting element 165 is formed, for example, in one piece, wherein the connecting element 165 forms at least one mechanical stop 600. According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the curved element 185. A further mechanical stop 605 is formed, for example, on a further outer edge of the curved element 185.

[0079] In other words, the connecting device 115 can also be referred to as a 0-spacer bent-sheet connector (QD-BSC) and has mechanical stops 600, 605 on the outer edges, on which, for example, the first circuit board rests, and thus defines the distance or height between the circuit boards.

[0080] Figure 7 shows a diagram of a connecting device 115 for illustrating an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device shown in Figure 6, except that a section of the connecting device 115 is shown in a side view. The mechanical stop 600 is thus clearly visible.

[0081] Figure 8 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described Figures 3 to 7, except that the connecting device 115 forms a plurality of sections 800.

[0082] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are, for example, identically shaped and formed along the curved element 185. The sections 800 serve, for example, as stops for a printed circuit board.

[0083] In other words, the connecting device 115 can also be referred to as an O-spacer bent pin sheet connector (O-D-BPSC). The curved element 185, which can also be referred to as the contact side for the circuit board, is divided, for example, into individual pins or shorter sections 800 to increase the design options of the circuit board. This also enables mechanical stops between the sections 800 on which the circuit board rests, thus defining the distance or height between the circuit boards. Individual sections 800 also have the advantage that the clamp connection or press connection functions better because tolerances can be better compensated, thereby increasing the contact area.

[0084] Fig. 9 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 8, except that a section of the connecting device 115 is shown in a side view.

[0085] The sections 800 extend, for example, through the arched element 185 and terminate above the base 175. The first circuit board rests, for example, on the sections 800.

[0086] Fig. 10 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 1, except that the connecting device 115 is similar to or corresponds to the connecting device of one of the Figs. 3 to 9.

[0087] The connecting device 115 forms the connecting element 165 and the further connecting element 168. The connecting elements 165, 168 are shaped similarly merely by way of example, more precisely, they are at least partially parabolic or omega-shaped.

[0088] The base 175 of the connecting element 165 is, for example, in contact with the second conductor track 135 of the second circuit board 110. The curved element 185 of the connecting element 165 protrudes at least partially through the through-opening 190 of the first circuit board 105. The connecting element 165 is arranged adjacent to the component 138.

[0089] The further connecting element 168 is arranged adjacent to the third component 150, wherein the further base 178 of the further connecting element 168 is in contact with the second conductor track 135 of the second circuit board 110. The further curved element 188 of the further connecting element 168 is at least partially guided out of the further through-opening 195 of the first circuit board 105.

[0090] The height hcc is reduced accordingly due to the shape of the connecting elements 165, 168. The through openings 190, 195, for example, are electrically insulated.

[0091] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path runs through the spaces that the arc elements 185, 188 have due to their parabolic and / or omega-shaped shape.

[0092] In other words, Fig. 3 to Fig. 10 show the connecting device 115, which can also be referred to as a Q-Bent-Sheet-Connector (Q-BSC, QD-BSC) for a description of the connecting device 115, which can also be referred to as a distance-optimized board-to-board connection concept.

[0093] The connecting device 115 is made, for example, from an electrically conductive sheet metal, for example, copper sheet with or without a coating, and is bent, for example, into the desired Q-shape. The connecting device 115 is soldered flat on one side, i.e., with the base 175, 178, onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor-phase soldering process. On the other side, i.e., the curved elements 185, 188, can be contacted and clamped, i.e., pressed in or soldered from above, through the through-openings 190, 195, which can also be referred to as elongated holes (see also Fig. 7), in the first circuit board 105.

[0094] Figure 11 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or equivalent to the electronic circuit of Figure 10, except that a top view of the first circuit board 105 is shown. More specifically, for example, the through-openings 190, 195 are shown, through which the curved elements of the connecting device can be passed.

[0095] Fig. 12 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that the connecting device 115 has a different shape.

[0096] The connecting device 115 forms the connecting element 165 with the base 175 and the curved element 185. The connecting element 165 is at least partially omega-shaped and / or O-shaped. The connecting device 115 can also be referred to, for example, as an O-bent pin-sheet connector.

[0097] Fig. 13 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 12, except that the connecting device 115 is shown in a frontal view.

[0098] Fig. 14 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 11 and / or Fig. 12, except that the connecting device 115 is shown in a rear view.

[0099] Fig. 15 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of Figures 12 to 14, with the exception that the connecting element 165 forms a plurality of sections 800. The connecting device 115 is similar to or corresponds, for example, to the connecting device from Fig. 10, with the exception that the connecting element 165 is at least partially omega-shaped and / or O-shaped.

[0100] The connecting device 115 can be referred to, for example, as an O-bent pin sheet connector (O-BPSC). The curved element 185, which can also be referred to as the contact side for the circuit board, is divided into individual, shorter sections 800 to increase the design options of the circuit board. Individual sections 800 also have the advantage that contacting by pressure on an electrically conductive outer layer of the circuit board works better because tolerances are better compensated, thus increasing the contact area.

[0101] Figure 16 shows a diagram of a connecting device 115 for illustrating an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device shown in Figure 15, except that a section of the connecting device 115 is shown in a side view.

[0102] Fig. 17 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 10, except that the connecting device 115 is arranged differently. The connecting device 115 is similar to or corresponds to the connecting device of one of Figs. 12 to 16.

[0103] The connecting elements 165, 168 are arranged in the intermediate space 125 of the electronic circuit 100 such that a surface of the curved elements 185, 188 contacts the inner side 120 of the first circuit board 105. The first circuit board 105, for example, has no through-holes.

[0104] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path runs through the spaces that the arc elements 185, 188 have due to their O-shaped and / or omega-shaped configuration.

[0105] In other words, Fig. 12 to Fig. 17 show the connecting device 115, which may also be referred to as O-Bent-Sheet-Connector (O-BSC, O-BPSC) for describing the connecting device 115.

[0106] The connecting device 115 is made, for example, from an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired Q-shape. The connecting device 115 is soldered flat on one side, i.e., with the base 175, 178, onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor-phase soldering process. On the other side, i.e., the curved elements 185, 188, are contacted by pressure with the inner side 120, which can also be referred to as the electrically conductive outer layer, of the first circuit board 105. Such a connection can be removed particularly easily because no solder is melted.

[0107] Fig. 18 shows a diagram of a connecting device 115 for illustrating an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, with the exception that the connecting element 165 is at least partially C-shaped. The connecting device 115 can also be referred to as a C-bent pin sheet connector (C-BSC).

[0108] Fig. 19 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 18, except that the connecting device 115 is shown in a frontal view.

[0109] Fig. 20 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 18 and / or Fig. 19, except that the connecting device 115 is shown in a rear view.

[0110] Fig. 21 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of Figures 18 to 20, with the exception that the connecting element 165 forms a plurality of sections 800.

[0111] The connecting device 115 is similar to or corresponds, for example, to the connecting device of Fig. 10 and / or Fig. 16, with the exception that the connecting element 165 is at least partially C-shaped.

[0112] The connecting device 115 can also be referred to as a C-bent pin sheet connector (C-BPSC). The curved element 185, which can also be referred to as the contact side for the circuit board, is divided into individual, shorter sections 800 to increase the design options of the circuit board. Individual sections 800 also have the advantage that contacting by pressure on an electrically conductive outer layer of the circuit board works better because tolerances are better compensated, thus increasing the contact area.

[0113] Fig. 22 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 22, except that a section of the connecting device 115 is shown in a side view.

[0114] Fig. 23 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar to or corresponds to the electronic circuit of Fig. 15, except that the connecting device 115 is designed differently. The connecting device 115 is similar to or corresponds to the connecting device 115 of one of Figs. 18 to 22. The connecting elements 165, 168 are arranged in the intermediate space 125 of the electronic circuit 100 such that a surface of the curved elements 185, 188 contacts the inner side 120 of the first printed circuit board 105. The first printed circuit board 105, for example, has no through-holes.

[0115] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path 198 runs, for example, through the arc elements 185, 188.

[0116] In other words, Fig. 18 to Fig. 23 show the connecting device 115, which may also be referred to as C-bent sheet connector (C-BSC, C-BPSC) for a description of the connecting device 115.

[0117] The connecting device 115 is made, for example, from an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired C-shape. The connecting device 115 is soldered flat on one side, i.e., with the base 175, 178, onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor-phase soldering process. On the other side, i.e., the curved elements 185, 188, are contacted by pressure with the inner side 120, which can also be referred to as the electrically conductive outer layer, of the first circuit board 105. Such a connection can be removed particularly easily because no solder is melted.

[0118] Figure 24 shows a flowchart of an embodiment of a method 2400 for manufacturing an electronic circuit. The electronic circuit is similar to or corresponds to the electronic circuit from one of the figures described above.

[0119] The method 2400 includes a step 2405 of providing and a

[0120] Arranging step 2410. In providing step 2405, the first circuit board, the second circuit board, and the connecting device are provided. In arranging step 2410, the connecting device is arranged between the circuit boards. The bottom of the connecting element is arranged on the second circuit board, with the curved element of the connecting element extending at least partially out of a through-opening in the first circuit board to produce the electronic circuit. Alternatively, a top side of the curved element is contacted to the inside of the first circuit board.

[0121] Fig. 25 shows a block diagram of an embodiment of a control device 2500 for manufacturing an electronic circuit. The control device 2500 is configured to control and / or execute the method of Fig. 24 or a similar method.

[0122] For this purpose, the control device 2500 has a provision unit 2505 and a placement unit 2510. The provision unit 2505 is designed to provide the first circuit board, the second circuit board, and the connecting device. The placement unit 2510 is designed to arrange the connecting device between the circuit boards. The bottom of the connecting element is arranged on the second circuit board, wherein the curved element of the connecting element is at least partially guided through a through-opening of the first circuit board in order to produce the electronic circuit. Alternatively, an upper side of the curved element is contacted to the inside of the first circuit board.

[0123] Fig. 26 shows a circuit diagram of an embodiment of an electronic circuit 100. The electronic design of the electronic circuit 100 is similar to or corresponds to one of the figures described above.

[0124] The electronic circuit 100 has a first supply voltage terminal 2602 and a second supply voltage terminal 2604, wherein a capacitor 2606 is connected between the supply voltage terminals 2602, 2604.

[0125] The electronic circuit 100 comprises, for example, a bridge circuit unit 2600, which comprises a first half-bridge 2605 and a second half-bridge 2610. The first half-bridge 2610 comprises a first switch 2615 and a second switch 2620, wherein the switches 2615, 2620 are connected to one another via a tapping point 2625. The first switch 2615 represents a high-side switch, and the second switch 2620 represents a low-side switch; the switches 2615, 2620 are embodied as transistors.

[0126] The first switch 2615 represents the additional component 140, the second switch 2620 represents the third component 150. The electronic circuit 100 comprises, for example, a first comparator 2630 and a second comparator 2635. The first comparator 2630 is connected, for example, to the first switch 2615, with a first inductance 2640 connected between the first switch 2615 and the first comparator 2630. The second comparator 2635 is connected, for example, to the second switch 2620, with a second inductance 2645 connected between the second switch 2620 and the second comparator 2635.

[0127] The second switch 2620, together with the second inductance 2645 and the second comparator 2635, forms, for example, a gate loop 2650, which can also be referred to as a gate loop.

[0128] The second half-bridge 2610 has the component 138, wherein the component 138 represents a series circuit of a capacitor 2655 and a resistor 2660.

[0129] For example, a third inductance 2665, which can also be referred to as a leakage inductance and / or leeway, is connected between the first half-bridge 2605 and the second half-bridge 2610. In an operational state, the current path 198, as described, for example, in Fig. 1, runs through the bridge circuit unit 2600 and forms a commutation loop 2670.

[0130] In other words, Fig. 23 shows the most common parasitic stray inductances. In fast-switching applications, the stray inductance Lee of the commutation loop 2670 has the greatest influence on the switching behavior and can be reduced by a correct layout, as shown and described, for example, in Fig. 1.

[0131] Fig. 27 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit from one of the figures described above. In other words, Fig. 27 shows a minimalist vertical commutation loop and its geometric parameters.

[0132] Shown is the current path 198, which runs along the first circuit board 105 and the second circuit board 110. All four parameters Icc, hcc, i.e., the height hcc, wcc, and tcc, have a direct influence on the total leakage inductance Lee. The height hcc, which can also be referred to as the distance hcc, between the current paths 198 of the vertical commutation loop is significantly reduced to also reduce the corresponding leakage inductance LCC.

[0133] For example, the parameter Icc represents the length of the electronic circuit 100, hcc represents the height of the electronic circuit 100, wcc the width and tcc the thickness.

[0134] The exemplary embodiments described and shown in the figures are selected only as examples. Different exemplary embodiments can be combined with each other in their entirety or with regard to individual features. Furthermore, one exemplary embodiment can be supplemented by features of another exemplary embodiment.

[0135] Furthermore, method steps according to the invention can be repeated and carried out in a different order than that described.

[0136] If an embodiment includes an "and / or" link between a first feature and a second feature, this can be interpreted as meaning that the embodiment, according to one embodiment, has both the first feature and the second feature, and according to another embodiment, has either only the first feature or only the second feature. Reference symbol: electronic circuit, first circuit board, second circuit board

[0137] Connecting device

[0138] Outside of the first circuit board

[0139] Inside of the first circuit board

[0140] Outside of the second circuit board

[0141] space

[0142] Inside of the second circuit board first conductor track second conductor track

[0143] component further component third component

[0144] Thermally conductive material additional thermally conductive material

[0145] Connecting element additional connecting element

[0146] Bottom of the connecting element further bottom of the further connecting element

[0147] Arch element of the connecting element further arch element of the further connecting element

[0148] Through hole of the first circuit board further through hole of the first circuit board

[0149] Current path

[0150] Distance mechanical stop further mechanical stop 800 section

[0151] 1600 gap

[0152] 2400 Method for producing an electronic circuit

[0153] 2405 Deployment step

[0154] 2410 Arranging step

[0155] 2500 Control device for producing an electronic circuit

[0156] 2505 Unit for provision

[0157] 2510 Unit for arranging

[0158] 2600 bridge circuit unit

[0159] 2602 first supply voltage connection

[0160] 2604 second supply voltage connection

[0161] 2605 first half bridge

[0162] 2606 Capacitor

[0163] 2610 second half bridge

[0164] 2615 first switch

[0165] 2620 second switch

[0166] 2625 tapping point

[0167] 2630 first comparator

[0168] 2635 second comparator

[0169] 2640 first inductance

[0170] 2645 second inductance

[0171] 2650 gate loop

[0172] 2655 capacitor

[0173] 2660 resistance

[0174] 2665 third inductance

[0175] 2670 Commutation loop

[0176] Lee leakage inductance

[0177] Ice Length wcc Width hcc Height tcc Thickness

Claims

Patent claims 1. An electronic circuit (100) comprising the following features: a first circuit board (105) having an outer side (118) and an inner side (120) opposite the outer side (118), wherein the first circuit board (105) has at least one first conductor track (130), and wherein the first circuit board (105) has at least one through-opening (190); a second circuit board (110) having an outer side (122) and an inner side (128) opposite the outer side (122), wherein the second circuit board (110) has a second conductor track (135), wherein the inner side (128) of the second circuit board (110) faces the inner side (120) of the first circuit board (105); and a connecting device (115) arranged in a space (125) between the first circuit board (105) and the second circuit board (110).wherein the connecting device (115) is detachable and forms at least one connecting element (165) with a base (175) and an arc element (185) adjacent to the base (175), wherein a bottom side of the base (175) is arranged on the inside (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the arc element (185) is at least partially guided through the through-opening (190) of the first printed circuit board (105) of the electronic circuit (100) or wherein a top side of the arc element (185) is contacted on the inside (120) of the first printed circuit board (105), characterized in that the connecting device (115) forms a further connecting element (168) with a further base (178) and a further arc element (188) adjacent to the further base (178),wherein a further underside of the further base (178) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the further arc element (188) protrudes at least partially from the through-opening (190) or a further through-opening (195) of the first printed circuit board (105) of the electronic circuit (100), is passed through or wherein a further upper side of the further arc element (188) is contacted on the inside (120) of the first printed circuit board (105), wherein the connecting element (165) and the further connecting element (168) are arranged and connected in such a way that the first conductor track (130), the second conductor track (135), the connecting element (165) and the further connecting element (168) are electrically contacted.

2. Electronic circuit (100) according to claim 1, wherein the connecting device (115) comprises a metallic material, in particular wherein the metallic material is formed as an electrically conductive sheet.

3. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) is at least partially parabolic and / or omega-shaped and / or C-shaped and / or O-shaped.

4. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) is formed in one piece.

5. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) forms at least one mechanical stop (600), in particular on an outer edge of the connecting element (165).

6. Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) forms a plurality of sections (800), in particular wherein the sections (800) are pin-shaped or form the connecting element (165) comb-like.

7. A method (2400) for manufacturing an electronic circuit (100) according to any one of claims 1 to 6, wherein the method (2400) comprises the following steps: Providing (2405) the first circuit board (105), the second circuit board (110) and the connecting device (115); and Arranging (2410) the connecting device (115) between the printed circuit boards (105, 110), wherein the base (175) of the connecting element (165) is arranged on the second printed circuit board (110), wherein the curved element (185) of the connecting element (165) is at least partially guided through a through-opening (190) of the first printed circuit board (105) in order to produce the electronic circuit (100), wherein the curved element (185) is at least partially guided through the through-opening (190) of the first printed circuit board (105) of the electronic circuit (100) or wherein an upper side of the curved element (185) is contacted on the inner side (120) of the first printed circuit board (105), wherein furthermore, for the connecting device (115), a further connecting element (168) with a further base (178) and a further curved element (188) adjacent to the further base (178) is arranged,wherein a further underside of the further base (178) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the further curved element (188) is at least partially guided through the through-opening (190) or a further through-opening (195) of the first printed circuit board (105) of the electronic circuit (100), or wherein a further upper side of the further curved element (188) is contacted on the inner side (120) of the first printed circuit board (105), wherein the connecting element (165) and the further connecting element (168) are arranged and connected in such a way that the first conductor track (130), the second conductor track (135), the connecting element (165) and the further connecting element (168) are electrically contacted.

8. Control device (2500) which is designed to carry out and / or control the steps of the method (2400) according to claim 7 in corresponding units (2505, 2510).

9. Computer program product with program code for carrying out the method (2400) according to claim 7, when the computer program product is executed on a control device (2500).

10. A machine-readable storage medium on which the computer program according to claim 9 is stored.

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