Heat dissipation film and electronic device comprising same

Abstract

An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board arranged inside the housing; an antenna module which is arranged inside the housing and which includes an antenna pattern unit electrically connected to the circuit board; and a heat dissipation film attached to the antenna module. The heat dissipation film can include: a first layer made of a conductive material; a second layer which has a predetermined width so as to encompass the antenna pattern unit, and which is arranged on one surface of the first layer; and a third layer which is arranged on one surface of the second layer, and which is made of an insulating material. The second layer can be hydrogen-bonded to the first layer and can be covalently bonded to the third layer.

Description

Heat-dissipating film and electronic device including the same

[0001] The present disclosure relates to a heat dissipating film and an electronic device including the same.

[0002] With the advancement of electronics, information, and communication technologies, a single electronic device is incorporating diverse functions. For example, smartphones, in addition to communication functions, include functions such as audio playback, imaging, and electronic notebooks. Furthermore, the installation of additional applications can enable even more diverse functions. Electronic devices can not only execute pre-installed applications or stored files, but also access servers or other electronic devices via wired or wireless means to receive a variety of information in real time.

[0003] As the integration of electronic devices increases, they can perform various functions while being miniaturized. As integration increases, electronic components that perform various signals and controls within the device (e.g., processors or communication modules) or wireless communication (e.g., antenna modules) can become smaller, more integrated, or more sophisticated. For example, as various electronic components become more integrated and sophisticated, electronic devices can achieve higher performance.

[0004] Electronic components or devices can operate stably in an appropriate temperature environment. However, integrated and sophisticated electronic components can generate heat during operation, and this self-heating can degrade power efficiency or operating performance. Electronic devices such as desktop computers and laptop computers utilize mechanical devices, such as cooling fans, to quickly cool internal spaces or self-heating electronic components (hereinafter, "heat-generating components"). However, miniaturized electronic devices intended for portable or wearable use may face challenges in incorporating such cooling devices.

[0005] In order to cool (or dissipate heat) a heat-generating component, a heat-radiating film having high thermal conductivity may be attached to the surface of the heat-generating component, or the heat-radiating film may be placed adjacent to the heat-generating component. In the case of a component having an antenna attached among the heat-generating components, the heat-radiating film may be composed of a material having thermal conductivity and insulation properties in consideration of the radiation characteristics of the antenna. For example, the heat-radiating film may be composed based on graphene fluoride. However, in the case of a heat-radiating film based on fluorine graphene, when producing particles of fluorine graphene, fluorine (F, fluoride) atoms having insulating properties are non-uniformly bonded to the graphene surface, making it difficult to secure uniform insulating properties. In addition, when implementing a film, the brittleness due to low bonding strength is strong, making it difficult to implement the film with a desired thickness.

[0006] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0007] Aspects of the present disclosure address at least the problems and / or disadvantages mentioned above and provide at least the advantages described below. Additionally, according to one aspect of the present disclosure, a heat dissipation film having a patterned insulating region and an electronic device including the same can be provided, wherein the heat dissipation film is attachable to an electronic component coupled to an antenna.

[0008] Additional aspects will be partly explained in the following description, partly will be obvious from the description, or may be learned by practice of the presented embodiments.

[0009] According to one aspect of the present disclosure, an electronic device may be provided. The electronic device may include a housing, a circuit board disposed inside the housing, an antenna module disposed inside the housing and including an antenna pattern portion electrically connected to the circuit board, and a heat dissipation film attached to the antenna module. The heat dissipation film may include a first layer made of a conductive material, a second layer having a predetermined width to surround the antenna pattern portion and disposed on one surface of the first layer, and a third layer made of an insulating material and disposed on one surface of the second layer. The second layer may be configured to be hydrogen-bonded with the first layer and covalently bonded with the third layer.

[0010] According to another aspect of the present disclosure, a heat dissipation film attached to an antenna module having an antenna pattern portion may be provided. The heat dissipation film may include a first layer made of the heat dissipation film conductive material, a second layer having a predetermined width to surround the antenna pattern portion and disposed on one surface of the first layer, and a third layer made of an insulating material and disposed on one surface of the second layer. The second layer may be hydrogen bonded to the first layer and covalently bonded to the third layer.

[0011] Other aspects, advantages and important features of the present disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the present disclosure taken in conjunction with the accompanying drawings.

[0012] Other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0013] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0014] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 4 is an exploded perspective view of an electronic device viewed from the front according to one embodiment of the present disclosure.

[0017] FIG. 5 is an exploded perspective view of an electronic device viewed from the rear, according to one embodiment of the present disclosure.

[0018] FIG. 6 is a plan view of a speaker module according to one embodiment of the present disclosure.

[0019] FIG. 7 is a bottom view of a speaker module according to one embodiment of the present disclosure.

[0020] Figure 8 is a perspective view of a heat dissipation film according to one embodiment of the present disclosure.

[0021] FIG. 9 is a cross-sectional view of a heat dissipating film according to one embodiment of the present disclosure.

[0022] FIG. 10 is an enlarged view of an area of ​​an antenna pattern portion of the speaker module illustrated in FIG. 7 according to one embodiment of the present disclosure.

[0023] FIG. 11a is a drawing showing a bonding structure of layers constituting a heat dissipating film according to one embodiment of the present disclosure.

[0024] FIG. 11b is a drawing showing a bonding structure of layers constituting a heat dissipating film according to one embodiment of the present disclosure.

[0025] FIG. 12 is a drawing showing a laminated structure of a heat dissipation film according to one embodiment of the present disclosure.

[0026] FIG. 13 is a manufacturing flowchart of a basic unit structure constituting a heat dissipating film according to one embodiment of the present disclosure.

[0027] Figure 14 is a manufacturing flowchart of a heat dissipating film according to one embodiment of the present disclosure.

[0028] FIG. 15 is a plan view of an antenna according to one embodiment of the present disclosure.

[0029] FIG. 16 is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 17 is a plan view of the rear side of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 18 is an exploded perspective view of a portion of the electronic device of FIGS. 16 and 17 including a hinge device according to various embodiments of the present disclosure.

[0032] FIG. 19 is a plan view of a connector according to one embodiment of the present disclosure.

[0033] FIGS. 20A and 20B are drawings showing the bonding force between particles constituting a heat dissipating film according to embodiments of the present disclosure.

[0034] FIG. 21 is a graph showing the tensile strength of a heat dissipating film according to one embodiment of the present disclosure.

[0035] FIG. 22 is a graph showing the storage elastic modulus of a heat dissipating film according to one embodiment of the present disclosure.

[0036] The same reference numbers are used throughout the drawing to indicate the same elements.

[0037] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention defined by the claims and their equivalents. While it includes numerous specific details to aid this understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0038] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are used solely to ensure a clear and consistent understanding of the disclosure by the inventors. Therefore, it should be clear to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure, which is defined by the appended claims and their equivalents.

[0039] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to "a component surface" includes a reference to one or more of those surfaces.

[0040] In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0041] The term “and / or” includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0042] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not limit the components in any other respect (e.g., importance or order).

[0043] In addition, terms such as 'front', 'rear', 'top', 'bottom', 'side', 'left', 'right', 'upper', and 'lower' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0044] The terms “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the present disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0045] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0046] When we say that a component is “on” another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0047] It should be recognized that each block in a flowchart and its combination can be performed by one or more computer programs containing instructions. The entirety of one or more computer programs may be stored in a single memory device, or the one or more computer programs may be divided into different parts stored in different memory devices.

[0048] Any of the functions or operations described herein may be performed by a processor or a combination of processors. A processor or a combination of processors is a circuit that performs processing and includes an application processor (AP, e.g., a central processing unit (CPU)), a communications processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near-field communication (NFC) chip, a connection chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), an integrated circuit (IC), or similar circuits.

[0049] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0050] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0051] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0052] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0053] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0054] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0055] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0056] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0057] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0058] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0059] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0061] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0063] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0064] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0065] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0066] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0067] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0068] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0069] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0070] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0071] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0072] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0073] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0074] The components of the electronic device (101) of FIGS. 2 and 3 may be partially or completely identical to the components of the electronic device (101) of FIG. 1.

[0075] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0076] In one embodiment, the first side (110A) may be formed by a front plate (502) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (502) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0077] In one embodiment, the front plate (502) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (502) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (502)) at one edge of the first side (110A). In one embodiment, the front plate (502) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (502) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than the thickness of the other portions.

[0078] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (504), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (508), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.

[0079] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (502)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (502) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (502). In one embodiment (not shown), in order to expand the area in which the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (502) may be formed to be substantially the same.

[0080] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (115), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (504)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (504)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on a back surface of the screen display area of ​​the display (115). In one embodiment (not shown), the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0081] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0082] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (504) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (115)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (504) (e.g., a first sensor module (504)).

[0083] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0084] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0085] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0086] According to one embodiment, the connector hole (e.g., the first connector hole (508), the second connector hole (109)) may include a first connector hole (508) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0087] FIG. 4 is an exploded perspective view of an electronic device viewed from the front according to one embodiment of the present disclosure.

[0088] FIG. 5 is an exploded perspective view of an electronic device viewed from the rear, according to one embodiment of the present disclosure.

[0089] The components of the electronic device (101) of FIGS. 4 and 5 may be partially or completely identical to the components of the electronic device (101) of FIGS. 1 to 3.

[0090] Referring to FIGS. 4 and 5, the electronic device (101) (e.g., the electronic device (101) of FIG. 1, FIG. 2 or FIG. 3) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (502) of FIG. 2), a display (230) (e.g., the display (115) of FIGS. 2 and 3), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207) and a rear plate (280) (e.g., the rear plate (111) of FIG. 3).

[0091] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0092] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0093] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user on the exterior of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear' of the housing (201) may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0094] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0095] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0096] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0097] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module (e.g., the speaker module (300) of FIGS. 6 and 7) and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (260b) may be arranged corresponding to an audio module (e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114))) or a connector hole (e.g., a first connector hole (508), a second connector hole (109)) of FIG. 2.

[0098] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0099] According to one embodiment, the electronic device (101) may further include a separate sub-circuit board (290) spaced apart from the printed circuit board (240) within the first support member (211). The sub-circuit board (290) may be electrically connected to the printed circuit board (240) via a connecting member such as a connecting flexible board or cable. The sub-circuit board (290) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (289) or a speaker, a USB connector, an antenna connector, and / or a SIM socket, to transmit signals and power.

[0100] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0101] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0102] FIG. 6 is a plan view of a speaker module according to one embodiment of the present disclosure.

[0103] FIG. 7 is a bottom view of a speaker module according to one embodiment of the present disclosure.

[0104] The embodiments of FIGS. 6 and 7 can be optionally combined with the embodiments of FIGS. 1 to 5, and FIGS. 8 to 10, FIGS. 11a, 11b, and FIGS. 12 to 22.

[0105] Referring to FIGS. 6 and 7, a speaker module (300) according to one embodiment may be disposed on a support member (e.g., a lower support member (260b) of FIGS. 4 and 5) or a printed circuit board (e.g., a sub-circuit board (290) of FIGS. 4 and 5) of an electronic device (e.g., an electronic device (101) of FIGS. 1 to 5). The speaker module (300) may be electrically connected to the printed circuit board.

[0106] According to one embodiment, the speaker module (300) may include a speaker housing (310), a speaker component (320) disposed on a first side (310a) of the speaker housing (310), and an antenna pattern portion (330) disposed on a second side (310b) of the speaker housing (310) opposite to the first side (310a). The speaker housing (310) may be referred to as an enclosure.

[0107] In one embodiment, the antenna pattern portion (330) may be formed of a conductor or a conductive pattern on the surface of the speaker housing (310) (e.g., the second surface (310b)). The antenna pattern portion (330) may be a laser direct structuring (LDS) pattern. The antenna pattern portion (330) may be formed of a conductive material including, for example, a metal material such as copper or nickel. The LDS pattern may be formed by selectively processing a pattern using a laser on an injection-molded product (e.g., a material including a thermoplastic resin), and then through a plating and coating process. Laser processing may facilitate plating of a metal material on a micro-unit rough resin surface. The antenna pattern portion (330) may be electrically connected to a communication module of an electronic device (e.g., the communication module (192) of FIG. 1). The speaker module (300) may function as an antenna by having the antenna pattern portion (330) on its surface. At this time, the speaker module (300) may be called an antenna (or antenna module and antenna radiator).

[0108] According to one embodiment, the speaker module (300) may be an electronic component (hereinafter, a heat-generating component) that generates heat when the speaker module (300) operates. In the case of a heat-generating component such as the speaker module (300), a heat-radiating film (e.g., a heat-radiating film (340) of FIGS. 8 to 10) may be attached to its surface to dissipate heat generated during operation to the outside.

[0109] The heat dissipation film may include, for example, a graphite film or a copper film. The graphite film or copper film may be effective in heat dissipation because it has high thermal conductivity. The graphite film or copper film may have not only high thermal conductivity but also high electrical conductivity. However, in the case of the graphite film or copper film, when attached to an electronic component having an antenna (e.g., a speaker module (300)), the high electrical conductivity may affect the radiation characteristics of the antenna, and thus, it cannot be used for the electronic component having the antenna. Therefore, in the case of the electronic component having the antenna, a heat dissipation film based on fluorine graphene (GF) having high thermal conductivity and insulating properties may be attached. However, in the case of the heat dissipation film based on fluorine graphene, there is a problem that it is difficult to uniformly secure insulating properties because fluorine atoms having insulating properties are non-uniformly bonded to the surface of the graphene during the production of fluorine graphene particles. Furthermore, in the case of heat-dissipating films based on fluorine graphene, there is a problem in that it is difficult to form a film due to the low bonding strength (or surface energy) between fluorine graphene particles during the production of the heat-dissipating film. In addition, in the case of heat-dissipating films based on fluorine graphene, a polymer-based binder composed of carbon, oxygen, and / or hydrogen can be used for film formation, but in this case, there is a problem in that the thermal conductivity of the film is reduced.

[0110] Below, a heat dissipating film having high thermal conductivity and insulation that can solve the above problems is described.

[0111] Figure 8 is a perspective view of a heat dissipation film according to one embodiment of the present disclosure.

[0112] FIG. 9 is a cross-sectional view of a heat dissipating film according to one embodiment of the present disclosure.

[0113] FIG. 10 is an enlarged view of an area of ​​an antenna pattern portion of the speaker module illustrated in FIG. 7 according to one embodiment of the present disclosure.

[0114] The embodiments of FIGS. 8 to 10 can be optionally combined with the embodiments of FIGS. 1 to 7, FIGS. 11a, 11b, and FIGS. 12 to 22.

[0115] Referring to FIGS. 8 and 9, a heat dissipation film (340) according to one embodiment may be composed of a first layer (341) having high thermal conductivity, a second layer (342) laminated (or coated) on one surface of the first layer (341) and having adhesiveness, and a third layer (343) laminated (or coated) on one surface of the second layer (342) and having insulating properties.

[0116] According to one embodiment, the first layer (341) may be composed of graphene or graphite. The first layer (341) may include, for example, graphene oxide (GO) in which oxygen (or -0 functional group) is bonded to the carbon atom structure of graphene. The first layer (341) may be referred to as a base layer.

[0117] According to one embodiment, the second layer (342) may be laminated only in a specific area (e.g., an insulating area) on one surface of the first layer (341). The specific area may refer to an area that comes into contact with the antenna pattern portion (330) of the speaker module within a predetermined width range. For example, the second layer (342) may be patterned only in the specific area for insulation from the antenna pattern portion (330). In one embodiment, the second layer (342) may be composed of a dopamine base. The second layer (342) may include, for example, polydopamine (PDA) formed by polymerizing dopamine molecules and having hydroxyl groups (or -OH functional groups) and / or hydrogen atoms on the surface. The second layer (342) may be a layer connecting the first layer (341) and the third layer (343). The second layer (342) may be called an interface layer or an adhesive layer.

[0118] In one embodiment, the third layer (343) may be laminated on one surface of the second layer (342) patterned on the first layer (341). For example, the third layer (343) may be positioned only in a specific area (e.g., an insulating area) on the one surface of the first layer (341) and may be patterned on the first layer (341) together with the second layer (342). In one embodiment, the third layer (343) may be composed of a fluorocarbon-based polymer (FP) (or fluoropolymer). The third layer (343) may be referred to as an insulation layer.

[0119] According to one embodiment, a heat dissipation film (340) may be attached to the surface of a heat-generating component (or electronic component) (e.g., a speaker module (300)) having an antenna (e.g., an antenna pattern portion (330)).

[0120] Referring to FIG. 10, the second layer (342) and / or the third layer (343) may be arranged to surround at least a portion of the antenna pattern portion (330) of the speaker module (300). The second layer (342) and / or the third layer (343) may space a portion of the first layer (341) exposed to the surface of the heat dissipation film (340) from the antenna pattern portion (330) by a predetermined distance range so that the portion of the first layer (341) exposed to the surface of the heat dissipation film (340) does not affect the antenna radiation performance. For example, the second layer (342) and / or the third layer (343) may be laminated on the first layer (341) so as to have a width (w) that is substantially the same as the distance between the portion of the first layer (341) and the antenna pattern portion (330). The width (w) of the second layer (342) and / or the third layer (343) may be designed within a range that does not affect the radiation performance of the antenna, and may be designed, for example, within 2 mm.

[0121] According to one embodiment, the first layer (341), the second layer (342), and the third layer (343) may form a plurality of basic unit structures constituting the heat-dissipating film (340). For example, the plurality of basic unit structures composed of layers (341, 342, 343) may be repeatedly laminated in an order such as “first layer (341) - second layer (342) - third layer (343) - second layer (342) - first layer (341)…” by the second layer (342) functioning as an adhesive layer. That is, the second layer (342) may be arranged between the plurality of basic unit structures. The thickness of the basic unit structures may be designed to be, for example, within 0.1 to 1 um. The heat-dissipating film (340) may have a required predetermined thickness by continuously laminating the basic unit structures. The thickness of the heat dissipation film (340) can be designed to be, for example, within 10 um.

[0122] The heat dissipation film (340) can have a high thermal conductivity of 1000 W / mK or more by being manufactured to a predetermined thickness through lamination of basic unit structures. In addition, the heat dissipation film (340) can have insulating properties through patterned second and third layers (342, 343).

[0123] Hereinafter, the bonding structure and laminated structure between the layers (341, 342, 343) constituting the heat dissipation film (340) will be described with reference to FIGS. 11a, 11b, and 12.

[0124] FIG. 11a is a drawing showing the bonding structure of layers constituting a heat dissipating film according to one embodiment of the present disclosure.

[0125] FIG. 11b is a drawing showing a bonding structure of layers constituting a heat dissipating film according to one embodiment of the present disclosure.

[0126] FIG. 12 is a drawing showing a laminated structure of a heat dissipation film according to one embodiment of the present disclosure.

[0127] According to one embodiment, the heat dissipating film (340, 340') may include a first layer (341, 341'), a second layer (342), and a third layer (343).

[0128] The configuration of the heat dissipation films (340, 340') of FIGS. 11a, 11b and 12 may be all or part of the same as the configuration of the heat dissipation films (340) of FIGS. 8 to 10.

[0129] The embodiments of FIGS. 11a, 11b and 12 can be optionally combined with the embodiments of FIGS. 1 to 10 and FIGS. 13 to 22.

[0130] Referring to FIG. 11A, according to one embodiment, the second layer (342) may be chemically bonded to one side of the graphene-based first layer (341). For example, when the first layer (341) is composed of graphene oxide (GO) and the second layer (342) is composed of polydopamine (PDA), the first layer (341) and the second layer (342) may be bonded to each other by hydrogen bonding between oxygen atoms present on the surface of the first layer (341) and hydroxyl groups present on the surface of the second layer (342). According to one embodiment, the third layer (343) may be chemically bonded to one side of the second layer (342). For example, if the second layer (342) is composed of polydopamine (PDA) and the third layer (343) is composed of a fluorine-based polymer (FP), the hydroxyl groups and / or hydrogen atoms present on the surface of the second layer (342) and the fluorine (F) atoms present on the surface of the third layer (343) can be covalently bonded to each other. Accordingly, the first layer (341), the second layer (342), and the third layer (343) can be sequentially laminated to form one basic unit structure.

[0131] Referring to FIG. 11b, according to one embodiment, the first layer (341') ​​may be composed of graphite (GR), unlike the first layer (341) composed of graphene oxide illustrated in FIG. 11a. In this case, hydrogen atoms and / or hydroxyl groups may exist on the surface of the first layer (341') ​​of FIG. 11b instead of the oxygen atoms present on the surface of the first layer (341) of FIG. 11a. In one embodiment, the second layer (342) may be chemically bonded to one side of the first layer (341') ​​composed of graphite (GR). For example, when the first layer (341') ​​is composed of graphite (GR) and the second layer (342) is composed of polydopamine (PDA), the first layer (341') ​​and the second layer (342) can be bonded to each other by hydrogen bonding between hydrogen atoms and / or hydroxyl groups present on the surface of the first layer (341') ​​and hydroxyl groups present on the surface of the second layer (342). As for the third layer (343), as described above, it can be covalently bonded to the second layer (342). Accordingly, the first layer (341'), the second layer (342), and the third layer (343) can be sequentially laminated to form one basic unit structure.

[0132] Referring to Fig. 12, a plurality of basic unit structures (340-1, 340-2) composed of a first layer (341), a second layer (342), and a third layer (343) as illustrated in Fig. 11a may be repeatedly stacked via a second layer (342) as an adhesive layer, thereby forming a heat dissipation film (340) of a predetermined thickness. For example, a plurality of basic unit structures (340-1, 340-2, ...) may be stacked so that the thickness of the heat dissipation film (340) satisfies 10 μm or less.

[0133] Although not shown, even in the case of the basic unit structure in which the first layer (341') ​​illustrated in FIG. 11b is composed of graphite, a plurality of basic unit structures composed of the first layer (341'), the second layer (342), and the third layer (343) are repeatedly stacked through the second layer (342), which is an adhesive layer, thereby forming a heat dissipation film (340') of a predetermined thickness.

[0134] 12345678910AverageA2.112.032.242.092.132.172.052.082.162.122.12B2.882.922.842.852.952.92.892.842.862.872.88

[0135] The above [Table 1] is a table showing the dielectric constants of samples of a single basic unit structure (A) and a heat-dissipating film (B) having a thickness of approximately 10 μm by laminating multiple basic unit structures. Referring to the above [Table 1], it can be confirmed that a single basic unit structure (A) has an average dielectric constant of 2.12 F / m, and a heat-dissipating film (B) having a thickness of approximately 10 μm has an average dielectric constant of 2.88 F / m, thereby confirming that the insulating properties are maintained before and after laminating the basic unit structures.

[0136] FIG. 13 is a manufacturing flowchart of a basic unit structure constituting a heat dissipating film according to one embodiment of the present disclosure.

[0137] Figure 14 is a manufacturing flowchart of a heat dissipating film according to one embodiment of the present disclosure.

[0138] The embodiments of FIGS. 13 and 14 can be optionally combined with the embodiments of FIGS. 1 to 10, FIGS. 11a, 11b, FIG. 12, and FIGS. 15 to 22.

[0139] According to one embodiment, the process of patterning the second layer (342) and / or the third layer (343) on the first layer (341) may be performed by at least one of a spray coating, dip coating and / or screen printing process based on a masking process.

[0140] Referring to Fig. 13, a mask (M) is attached to an area of ​​a surface area of ​​a first layer (341) (e.g., graphene oxide (GO)) where insulation is not required. Then, a raw material (342a) (e.g., polydopamine (PDA)) of a second layer (342) is sprayed (or applied) to one side of the first layer (341) to which the mask (M) is attached, so that the second layer (342) (e.g., polydopamine (PDA)) is laminated on the area (or insulating area) where the mask (M) is not placed. Thereafter, a raw material (343a) (e.g., fluorine-based polymer (FP)) of a third layer (343) is sprayed (or applied) to one side of the first layer (341), so that the mask (M) and the raw material (343a) of the second layer (342) and the third layer (343) are laminated on the upper surface of the first layer (341). Thereafter, when the mask (M) attached to the surface of the first layer (341) is removed, the second layer (342) and the third layer (343) can be patterned only in the insulating region where insulation is required. By repeating the above process, the second layer (342) and the third layer (343) can be patterned only in the insulating region on the other side (341b) of the first layer (341) opposite to the one side (341a) of the first layer (341).

[0141] Referring to FIG. 14, a second layer (342) and a third layer (343) may be sequentially laminated on an area of ​​the surface of the first layer (341) where insulation is required in the same manner as illustrated in FIG. 13 to form a basic unit structure (340-1) constituting a heat-dissipating film (340). Thereafter, a second layer (342) is laminated again on the third layer (343) of the basic unit structure (340-1), and then another basic unit structure (340-2) is laminated on the basic unit structure (340-1), thereby sequentially stacking the basic unit structures (340-1, 340-2). That is, a heat-dissipating film (340) having a desired thickness may be formed by stacking the basic unit structures (340-1, 340-2) in the manner described above.

[0142] FIG. 15 is a plan view of an antenna according to one embodiment of the present disclosure.

[0143] The embodiment of FIG. 15 can optionally be combined with the embodiments of FIGS. 1 to 10, 11a, 11b and 12 to 14 or the embodiments of FIGS. 16 to 22.

[0144] Referring to FIG. 15, according to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 4 and 5) may include one or more antennas (e.g., an NFC antenna, a wireless charging antenna, or an MST antenna) (350) disposed between a back plate of the electronic device (e.g., the back plate (280) of FIGS. 3 and 4) and a battery (e.g., the battery (250) of FIGS. 3 and 4).

[0145] According to one embodiment, the antenna (350) may be provided in the form of a thin film. Although not shown, the antenna (350) may include a printed circuit pattern, a wireless charging circuit, or a heat dissipation sheet formed on the surface of the thin film.

[0146] According to one embodiment, an antenna (350) (e.g., an MST antenna) (e.g., a first antenna) may include a heat dissipation film (340) arranged to overlap with another antenna (e.g., a mmWave antenna module) (e.g., a second antenna) provided in an electronic device. The heat dissipation film (340) may be provided integrally with a thin film of the antenna. As described above, the heat dissipation film (340) has high thermal conductivity and insulation, and by being provided integrally with the antenna (350), it can additionally secure a heat transfer path and improve heat generation of another antenna provided in the electronic device.

[0147] In this document, a speaker module (e.g., speaker module (300) of FIGS. 6 and 8) and an antenna (350) are described as examples of electronic components (or heat-generating components) to which a heat-radiating film (340) is attached, but the present disclosure is not limited thereto, and the heat-radiating film (340) may be applied to components related to the radiation characteristics of an antenna as heat-generating components.

[0148] FIG. 16 is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0149] FIG. 17 is a plan view of the rear side of an electronic device according to one embodiment of the present disclosure.

[0150] Referring to FIGS. 16 and 17, the electronic device (400) may include a first housing (410) (e.g., a first housing structure) including a first side member (413) (e.g., a side bezel) and a second housing (420) (e.g., a second housing structure) including a second side member (423) (e.g., a side bezel) that are foldably coupled to each other with respect to a folding axis (F) through at least one hinge device (440, 440-1) (e.g., a hinge module or a hinge structure). For example, the first housing (410) and the second housing (420) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (400) may include a first display (430) (e.g., a flexible display, a foldable display, or a main display) arranged to be supported by a first housing (410) and a second housing (420). For example, the first housing (410) may include a first side (411) and a second side (412) facing in an opposite direction (e.g., a -z-axis direction) of the first side (411). For example, the second housing (420) may include a third side (421) and a fourth side (422) facing in an opposite direction (e.g., a -z-axis direction) of the third side (421). For example, the first housing (410) may include a first rear cover (414) coupled with a first side member (413). For example, the second housing (420) may include a second rear cover (424) coupled with a second side member (423). For example, when the electronic device (400) is in a fully unfolded first state (e.g., an unfolded state or an unfolded state), the first side (411) and the third side (421) may be operated so that they face substantially the same direction (e.g., a z-axis direction). For example, when the electronic device (400) is in a fully folded second state (e.g., a folded state or a folded state), the first side (411) and the third side (421) may face each other or face opposite directions.For example, the electronic device (400) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0151] According to one embodiment, the electronic device (400) may include a first receiver (401), at least one first sensor module (404) (e.g., an ambient light sensor) and / or at least one first camera module (405) (e.g., a UDC, under display camera) disposed on a first side (411) of the first housing (410). For example, the electronic device (400) may include at least one key (406) disposed on a first side member (413). For example, the electronic device (400) may include at least one second camera module (408) and / or a flash (409) disposed on a second side (412) of the first housing (410) (e.g., a first rear cover (414)). For example, the electronic device (400) may include a second display (431) disposed on a fourth side (422) of a second housing (420), at least one third camera module (425) (e.g., UDC, under display camera), at least one second sensor module (426), and / or a second receiver (427). For example, the second display (431) may be disposed to be visible from the outside through at least a portion of the second rear cover (424). For example, the electronic device (400) may include a speaker (402) disposed on a second side member (423), a microphone (403) disposed on a first side member (413), and / or a connector port (407). At least some of the components described above may be disposed in the first housing (410) and / or the second housing (420).

[0152] According to one embodiment, the first display (430) (e.g., a flexible display) may include a first area (430a) (e.g., a first planar portion) corresponding to at least a portion of the first surface (411), a second area (430b) (e.g., a second planar portion) corresponding to at least a portion of the third surface (421), and a third area (430c) (e.g., a flexible portion) connecting the first area (430a) and the second area (430b) and allowing the electronic device (400) to be deformed in a second state (e.g., a folded state) and / or a third state. For example, the third area (430c) may be positioned to at least partially overlap at least one hinge device (440, 440-1) when the first display (430) is viewed from above (e.g., in the z-axis direction). For example, the first display (430) may be arranged so that it is not visible from the outside in the second state by having the first side (411) and the third side (421) face each other (e.g., inward-fold type). For example, the first display (430) may be arranged so that it is visible from the outside in the second state by having the first side (411) and the third side (421) face each other in opposite directions (e.g., outward-fold type).

[0153] FIG. 18 is an exploded perspective view of a portion of the electronic device of FIGS. 16 and 17 including a hinge device according to various embodiments of the present disclosure.

[0154] The embodiment of FIG. 18 can be optionally combined with the embodiments of FIGS. 16 and 17, and FIGS. 19 to 22.

[0155] Referring to FIG. 18, the electronic device (400) may include at least one hinge device (440, 440-1) (e.g., a hinge module or a hinge structure) connecting the first housing (410) and the second housing (420) under the first display (430) (e.g., in the -z-axis direction). For example, the at least one hinge device (440, 440-1) may include a first hinge device (440) and a second hinge device (440-1) spaced apart from the first hinge device (440) along a direction parallel to the folding axis (F) (e.g., in the ±y-axis direction). For example, at least one hinge device (440, 440-1) may be supported by a first support member (4131) extending from the first side member (413) to the first space (4101) of the first housing (410) and a second support member (4231) extending from the second side member (423) to the second space (4201) of the second housing (420). For example, at least one hinge device (440, 440-1) may be arranged between the first housing (410) and the second housing (420) so as to be invisible from the outside through a hinge housing (450) (e.g., a hinge cover).

[0156] According to one embodiment, the first hinge device (440) may include a first rotation member (441) (e.g., a first arm or a first rotator) disposed on a first support member (4131) of the first housing (410), a second rotation member (442) (e.g., a second arm or a second rotator) disposed on a second support member (4231) of the second housing (420), and a gear assembly (443) connected to the first rotation member (441) and the second rotation member (442) such that the first housing (410) and the second housing (420) rotate symmetrically with respect to each other. For example, the gear assembly (443) may include a plurality of gears (e.g., spur gears and / or worm gears) gear-coupled with respect to one another. For example, the gear assembly (443) may include a cam coupling structure for urging the first housing (410) and the second housing (420) in a direction in which they are to transition from a first state (e.g., an unfolded state or an unfolded state) to a second state (e.g., a folded state or a folded state) or in a direction in which they are to transition from the second state to the first state, based on a predetermined angle, and for providing a free stop at various folding angles. For example, the second hinge device (440-1) may have substantially the same configuration as the first hinge device (440).

[0157] According to one embodiment, the electronic device (400) may include a first hinge plate (461) connected to a first support member (4131) and / or a first rotation member (441). The electronic device (400) may include a second hinge plate (462) connected to a second support member (4231) and / or a second rotation member (442). For example, at least one hinge device (440, 440-1), the first rotation member (441), the second rotation member (442), the first hinge plate (461), and the second hinge plate (462) may form substantially the same plane as the first support member (4131) and the second support member (4231) when the electronic device (400) is in a first state. For example, the second hinge device (440-1) may be substantially symmetrical with the first hinge device (440) or may have a substantially identical configuration.

[0158] According to one embodiment, the electronic device (400) may include a plurality of printed circuit boards, which are each separately arranged in housings (410, 420), although not shown. The plurality of printed circuit boards may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1).

[0159] According to one embodiment, the electronic device (400) may include a plurality of connectors (470) for electrical connection (e.g., transmission of control signals, power, or communication signals) between various components or electrical connection between printed circuit boards. The plurality of connectors (470) may employ various types of connection structures (or connector structures), such as an FPC (flexible printed circuit) or FFC (flexible flat cable) type, a B to B type (board to board type), a zip type, a bonding type formed through a hot bar process, a LIF (low insertion force), and a ZIF (zero insertion force), through which related components may be electrically coupled or respective printed circuit boards may be electrically coupled. In addition to the above-described various types of connection structures, the plurality of connectors (470) may employ an electrical connection structure (or connector structure) of a C to C type (connector to connector type) (or C2C type) that connects two different connectors (470).

[0160] FIG. 19 is a plan view of a connector according to one embodiment of the present disclosure.

[0161] FIGS. 20A and 20B are drawings showing the bonding force between particles constituting a heat dissipating film according to one embodiment and a comparative example of the present disclosure.

[0162] FIG. 21 is a graph showing the tensile strength of a heat dissipating film according to one embodiment of the present disclosure.

[0163] FIG. 22 is a graph showing the storage elastic modulus of a heat dissipating film according to one embodiment of the present disclosure.

[0164] The embodiments of FIGS. 19 to 22 can be optionally combined with the embodiments of FIG. 1 and FIGS. 16 to 18.

[0165] The configuration of the heat dissipation film (480) of Fig. 19 may be all or part of the same as the configuration of the heat dissipation film (340) of Figs. 8 to 10, Figs. 11a, 11b, and Figs. 12 to 14.

[0166] Referring to FIG. 19, according to one embodiment, a connector (470) may include a first connection portion (471) electrically connected to various components or a printed circuit board at one end thereof, a second connection portion (472) electrically connected to various components or a printed circuit board at the other end thereof, and a flexible portion (473) that connects the first connection portion (471) and the second connection portion (472) and is bendable. The flexible portion (473) of the connector (470) may be a portion that overlaps a third area (e.g., a third area (430c) of FIG. 16) of a first display (e.g., a first display (430) of FIG. 16) of an electronic device (e.g., an electronic device (400) of FIG. 16). The flexible portion (473) of the connector (470) can be deformed together with the first display when the housing of the electronic device (e.g., the first housing (410) and the second housing (420) of FIG. 16) rotates.

[0167] According to one embodiment, a heat dissipation film (480) may be attached to the flexible portion (473) of the connector (470). The heat dissipation films (480a, 480b) may be separately attached to the flexible portion (473) of the connector (470). The heat dissipation film (480) attached to the flexible portion (473) of the connector (470) may be used as a heat transfer path for various electronic components and / or printed circuit boards that are connected to each other through the connector (470). The heat dissipation film (480) may be a film composed of a graphite base. However, in the case of the graphite-based heat dissipation film (480), the graphite may be peeled off from the connector (470) when the flexible portion (473) of the connector (470) is deformed due to low bonding strength between graphite particles, and signal loss may occur due to high electrical conductivity. Accordingly, the heat dissipation film (480) may be composed of a first layer composed of a graphene-based material (e.g., the first layer (341) of FIG. 8), a second layer composed of a polydopamine-based material (e.g., the second layer (342) of FIG. 8), and a third layer composed of a fluorine-based polymer (e.g., the third layer (343) of FIG. 8), as described above with reference to FIGS. 8 to 10, 11a, 11b, 12, and 13. In the heat dissipation film (480), the third layer composed of a fluorine-based polymer may be omitted if necessary.

[0168] When the heat dissipation film (480) is composed of graphene and polydopamine, the polydopamine functions as an adhesive when bonding graphene particles together, and can compensate for defects that may occur during the bonding. As a result, the bonding force between the graphene particles increases, and the flexibility of the heat dissipation film (480) can be improved (see FIGS. 20A and 20B). In addition, when the heat dissipation film (480) is composed of graphene and polydopamine (Example), compared to when the heat dissipation film (480) is composed of graphite (Comparative Example), the tensile strength of the heat dissipation film can be improved from 0.7 kgf to 1.24 kgf (see FIG. 21), and the storage modulus can also be improved from 4885 MPA (@25°C) to 14069 MPA (@25°C) (see FIG. 22).

[0169] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0170] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together with the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0171] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0172] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0173] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0174] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0175] An electronic device (101) according to one embodiment of the present disclosure may include a housing (110), a circuit board disposed inside the housing (110), an antenna module (300) disposed inside the housing (110) and including an antenna pattern portion (330) electrically connected to the circuit board, and a heat dissipation film (340) attached to the antenna module (300). The heat dissipation film (340) may include a first layer (341) made of a conductive material, a second layer (342) having a predetermined width so as to surround the antenna pattern portion (330) and disposed on one surface of the first layer (341), and a third layer (343) made of an insulating material and disposed on one surface of the second layer (342). The second layer (342) may be configured to be hydrogen-bonded with the first layer (341) and covalently bonded with the third layer (343).

[0176] According to one embodiment, the heat dissipation film (340) may include a plurality of basic unit structures in which the first layer (341), the second layer (342), and the third layer (343) are sequentially laminated. The heat dissipation film (340) is configured by repeatedly laminating the plurality of basic unit structures, and the second layer (342) may be arranged between the plurality of basic unit structures.

[0177] According to one embodiment, the first layer (341) may be composed of graphene or graphite-based units.

[0178] According to one embodiment, the second layer (342) may be composed of dopamine-based units.

[0179] According to one embodiment, the third layer (343) may be composed of fluoride-based units.

[0180] According to one embodiment, the third layer (343) may be composed of a fluorocarbon-based polymer (FP).

[0181] According to one embodiment, the second layer (342) may have a width substantially the same as a predetermined width of the third layer (343).

[0182] According to one embodiment, the predetermined width of the second layer (342) may be within 2 mm.

[0183] According to one embodiment, the antenna module (300) may include a speaker module or a camera module having an antenna pattern portion electrically connected to the circuit board.

[0184] According to one embodiment, the electronic device (101) may further include a first antenna (350) and a second antenna. The first antenna (350) may include a heat dissipation film (340) arranged to overlap with the second antenna.

[0185] A heat dissipation film (340) attached to an antenna module (300) having an antenna pattern portion (330) according to one embodiment of the present disclosure may include a first layer (341) made of a conductive material, a second layer (342) having a predetermined width to surround the antenna pattern portion (330) and disposed on one surface of the first layer (341), and a third layer (343) made of an insulating material and disposed on one surface of the second layer (342). The second layer (342) may be hydrogen-bonded with the first layer (341) and covalently bonded with the third layer (343).

[0186] According to one embodiment, the first layer (341) may be composed of graphene or graphite-based units.

[0187] According to one embodiment, the second layer (342) may be composed of dopamine-based units.

[0188] According to one embodiment, the third layer (343) may be composed of fluoride-based units.

[0189] According to one embodiment, the third layer (343) may be composed of a fluorocarbon-based polymer (FP).

[0190] According to one embodiment, the second layer (342) may have a width substantially the same as a predetermined width of the third layer (343).

[0191] According to one embodiment, the predetermined width of the second layer (342) may be within 2 mm.

[0192] According to one embodiment, the antenna pattern portion (330) may include a thin film antenna.

[0193] According to one embodiment, the antenna pattern portion (330) may include one of an NFC antenna, a wireless charging antenna, or an MST antenna.

[0194] While the present disclosure has been shown and described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. In an electronic device (101), Housing (110); A circuit board placed inside the above housing (110); An antenna module (300) disposed inside the housing (110) and including an antenna pattern portion (330) electrically connected to the circuit board; and Includes a heat dissipation film (340) attached to the above antenna module (300), The above heat dissipation film (340) is A first layer (341) composed of a conductive material; A second layer (342) having a predetermined width to surround the antenna pattern portion (330) and arranged on one side of the first layer (341); and A third layer (343) is disposed on one side of the second layer (342) and is made of an insulating material, An electronic device in which the second layer (342) is configured to be hydrogen-bonded with the first layer (341) and covalently bonded with the third layer (343).

2. In paragraph 1, The above heat dissipation film (340) includes a plurality of basic unit structures in which the first layer (341), the second layer (342), and the third layer (343) are sequentially laminated, An electronic device in which the heat dissipation film (340) is configured by repeatedly stacking the plurality of basic unit structures, and the second layer (342) is arranged between the plurality of basic unit structures.

3. In paragraph 1 or 2, The above first layer (341) is an electronic device composed of a graphene or graphite-based unit.

4. In any one of paragraphs 1 to 3, The second layer (342) is an electronic device composed of dopamine-based units.

5. In any one of paragraphs 1 to 4, The third layer (343) is an electronic device composed of a fluoride-based unit.

6. In paragraph 5, The third layer (343) is an electronic device composed of a fluorocarbon-based polymer (FP).

7. In any one of paragraphs 1 to 6, An electronic device wherein the second layer (342) has a width substantially the same as a predetermined width of the third layer (343).

8. In any one of paragraphs 1 to 7, An electronic device in which the predetermined width of the second layer (342) is less than 2 mm.

9. In any one of paragraphs 1 to 8, The above antenna module (300) is an electronic device including a speaker module or a camera module having an antenna pattern portion electrically connected to the circuit board.

10. In any one of paragraphs 1 to 9, Further comprising a first antenna (350) and a second antenna, An electronic device, wherein the first antenna (350) includes a heat dissipation film (340) arranged to overlap the second antenna.

11. In the heat dissipation film (340) attached to the antenna module (300) having the antenna pattern portion (330), The above heat dissipation film (340) is A first layer (341) composed of a conductive material; A second layer (342) having a predetermined width to surround the antenna pattern portion (330) and arranged on one side of the first layer (341); and A third layer (343) is disposed on one side of the second layer (342) and is comprised of an insulating material, The second layer (342) is a heat-dissipating film that is hydrogen-bonded with the first layer (341) and covalently bonded with the third layer (343).

12. In paragraph 11, The above heat dissipation film (340) includes a plurality of basic unit structures composed of the first layer (341), the second layer (342), and the third layer (343), The heat dissipation film (340) is a heat dissipation film in which the plurality of basic unit structures are repeatedly laminated, and the second layer (342) is arranged between the plurality of basic unit structures.

13. In paragraph 11 or 12, The above first layer (341) is a heat dissipating film composed of graphene or graphite-based units.

14. In any one of paragraphs 11 to 13, The second layer (342) is a heat-dissipating film composed of dopamine-based units.

15. In any one of paragraphs 11 to 14, The third layer (343) is a heat-dissipating film composed of fluoride-based units.

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