Wet cleaning device and method

Abstract

Disclosed in the present application are a wet cleaning device and method. The device comprises: a turntable disposed in a cavity, a fixture disposed on the top of the turntable, and a tank arranged around the turntable, wherein the tank is configured to hold a circulating medium liquid; and before an object to be processed is transferred to the fixture for cleaning, the surface of said object is submerged by means of raising the liquid level of the medium liquid, so that charges carried on said object are conducted away by means of the circulating flow of the medium liquid. The present application can effectively overcome the defect of existing single-wafer wet cleaning apparatuses causing additional arc breakdown to wafers.

Description

Wet cleaning apparatus and method

[0001] This application claims priority from the Chinese patent application No. 202410449052.0 filed on April 15, 2024, and entitled "Wet cleaning apparatus and method", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of semiconductor processing, in particular to a wet cleaning apparatus and method. BACKGROUND

[0003] Although the single-wafer wet cleaning equipment is superior to the tank-type wet cleaning equipment in terms of process technology, the single-wafer wet cleaning equipment also has the defect of causing arc breakdown to the wafer. The cause of the arc breakdown defect is mainly from the electric charge carried by the wafer itself and the electric charge carried by the cleaning equipment. Among them, the electric charge of the cleaning equipment itself can be improved by grounding. As for the electric charge carried by the wafer itself, although the grounding mode of the clamping rod of the clamp has been adopted, since the wafer itself is a semiconductor material, and the shallow trench isolation technology is mostly used in the current process to isolate each pattern on the wafer surface, the conductive effect of the clamping rod is very limited, so it is difficult to effectively solve the defect of causing arc breakdown. SUMMARY

[0004] The present application aims to overcome the above-mentioned defects existing in the prior art, and provides a wet cleaning apparatus and method.

[0005] To achieve the above-mentioned purpose, the technical solution of the present application is as follows:

[0006] The present application provides a wet cleaning apparatus, comprising:

[0007] a turntable arranged in a cavity, a clamp arranged on the top of the turntable, and a tank arranged around the turntable;

[0008] The tank is used to load the circulating medium liquid, and before the processing object is conveyed to the clamp for cleaning, the surface of the processing object is immersed by rising the liquid level of the medium liquid, so as to guide the electric charge carried on the processing object away through the circulating flow of the medium liquid.

[0009] Further, during standby, the clamp is exposed from the liquid level of the medium liquid by keeping the liquid level of the medium liquid below the top of the turntable; during cleaning, the processing object is cleaned after being exposed from the liquid level of the medium liquid by lowering the liquid level of the medium liquid and keeping it below the top of the turntable.

[0010] Further, the tank body is provided with a liquid inlet and a liquid outlet, the liquid inlet is used for introducing the medium liquid into the tank body, and the liquid outlet is used for discharging the medium liquid in the tank body. By combining the opening and closing states of the liquid inlet and the liquid outlet, different controls of the rising, falling or keeping of the liquid level of the medium liquid in the tank body are realized.

[0011] Further, the liquid inlet is arranged on the bottom of the tank body, the liquid inlet is provided with a flow control valve, the liquid outlet includes a first liquid outlet arranged on the bottom of the tank body, and a second liquid outlet and a third liquid outlet arranged on the side wall of the tank body from bottom to top, respectively, and the first liquid outlet to the third liquid outlet are respectively provided with on-off valves. When on standby, the flow control valve is controlled to introduce the medium liquid into the tank body at a first flow rate, the on-off valve of the first liquid outlet is closed, and the on-off valve of the second liquid outlet is opened, so that the liquid level of the medium liquid is kept below the top of the turntable. When charge is guided away, the flow control valve is controlled to introduce the medium liquid into the tank body at a second flow rate greater than the first flow rate, the on-off valves of the first liquid outlet and the second liquid outlet are closed, and the on-off valve of the third liquid outlet is opened, so that the liquid level of the medium liquid rises to immerse the surface of the processing object. When cleaning, the liquid inlet is closed by the flow control valve, and the on-off valves of the first liquid outlet and the second liquid outlet are opened, so that the liquid level of the medium liquid falls and is kept below the top of the turntable, and then the processing object exposed on the surface is cleaned.

[0012] Further, the tank body is provided with a liquid inlet and a liquid outlet, the liquid inlet is used for introducing the medium liquid into the tank body, and the liquid outlet is used for discharging the medium liquid in the tank body. By combining the opening and closing states of the liquid inlet and the liquid outlet, different controls of the rising, falling or keeping of the liquid level of the medium liquid in the tank body are realized.

[0013] Further, the liquid inlet is connected to a liquid inlet pipeline, and the liquid inlet pipeline is used for introducing deionized water or carbon dioxide aqueous solution as the medium liquid into the tank body through the liquid inlet.

[0014] Further, the liquid inlet pipeline is provided with a carbon dioxide generator, the carbon dioxide generator is used for blowing carbon dioxide into the flowing deionized water to form carbon dioxide aqueous solution as the medium liquid, the tank body is provided with a water resistance detection element, the water resistance of the carbon dioxide aqueous solution is detected by the water resistance detection element, and compared with a threshold value, so that when the detected water resistance of the carbon dioxide aqueous solution exceeds the threshold value, the carbon dioxide generator is controlled to adjust the amount of generated carbon dioxide correspondingly.

[0015] The application also provides a wet cleaning method, comprising:

[0016] A cavity is provided with a turntable inside, and a clamp is provided on the top of the turntable;

[0017] A groove is formed around the turntable, and a circulating medium liquid is loaded in the groove;

[0018] Before the processing object is conveyed to the clamp for cleaning, the liquid level of the medium liquid is raised to immerse the surface of the processing object, so that the charges carried on the processing object are guided away through the circulating flow of the medium liquid.

[0019] Further, when on standby, the liquid level of the medium liquid is kept below the top of the turntable, so that the clamp is exposed from the liquid level of the medium liquid; when cleaning, the liquid level of the medium liquid is lowered and kept below the top of the turntable, so that the processing object is cleaned after being exposed from the liquid level of the medium liquid.

[0020] Further, when cleaning, the liquid level of the medium liquid is first lowered and kept below the top of the turntable, and then the turntable is raised to spray cleaning liquid on the surface of the processing object through the open upper end of the groove for cleaning.

[0021] As can be seen from the above technical solution, the present application sets a groove around the turntable, and loads a circulating medium liquid in the groove, so that before the processing object (such as a wafer) is conveyed to the clamp for cleaning, the surface of the processing object is first immersed by raising the liquid level of the medium liquid, so that the charges carried on the processing object can be completely guided away through the continuous contact of the flowing medium liquid on the surface of the processing object, and then when the conventional cleaning process is performed, the problem of arc breakdown of the processing object will not occur, thus effectively solving the defect that the existing single wafer wet cleaning equipment will cause arc breakdown of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0022] Fig. 1 is a structural schematic diagram of a wet cleaning device according to a preferred embodiment of the present application;

[0023] Figs. 2-5 are working state schematic diagrams of a wet cleaning device according to a preferred embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the scope of protection of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the common meanings thereof by those skilled in the art. The similar words such as "comprise" used herein mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects.

[0025] The specific embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0026] Referring to FIG. 1, a wet cleaning device according to the present application includes a cavity 10, a turntable (rotary platform) 13 arranged in the cavity 10, a clamp 14 arranged on the top of the turntable 13, and a groove 12 arranged around the turntable 13.

[0027] The cavity 10 is used for wet cleaning processing of the surface of a processing object 100 (for example, a wafer / chip). The clamp 14 is used for clamping the processing object 100 conveyed onto the clamp 14. The turntable 13 is connected to a rotating mechanism below, and when the rotating mechanism is driven (for example, by a rotating motor arranged outside below the cavity 10), the turntable 13 is horizontally rotated, thereby synchronously horizontally rotating the processing object 100 clamped by the clamp 14 to perform the cleaning process.

[0028] The groove 12 is used for loading the circulating flowing medium liquid 11. Moreover, before the processing object 100 is conveyed onto the clamp 14 for cleaning, by rising the liquid level of the medium liquid 11 loaded in the groove 12, that is, by increasing the loading amount of the medium liquid 11 in the groove 12, the surface of the processing object 100 is submerged, so that the medium liquid 11 loaded in the groove 12 can directly contact the processing object 100. In this way, by the circulating flow of the medium liquid 11, the electric charges carried on the processing object 100 can be guided away, and all carried out of the cavity 10 along with the flow of the medium liquid 11. Therefore, when the processing object 100 is subjected to the conventional cleaning process later, the problem of additional arc breakdown of the processing object 100 will not occur. In particular, when the processing object 100 with metal patterns on the surface is subjected to the wet cleaning, the wet cleaning device according to the present application has the obvious advantage of effectively eliminating the arc breakdown defect.

[0029] Referring to Figs. 2-5 and in combination with Fig. 1. In some embodiments, the liquid level of the medium liquid 11 loaded in the tank 12 is adjusted and controlled according to different working states of the wet cleaning device (i.e. the dynamic loading amount of the medium liquid 11 in the tank 12 is adjusted and controlled). When in standby state (i.e. the gripper 14 does not hold the processing object 100), the liquid level of the medium liquid 11 loaded in the tank 12 is kept below the top of the turntable 13, i.e. the medium liquid 11 is in a low liquid level state, so that the gripper 14 on the top of the turntable 13 is exposed from the liquid level of the medium liquid 11, and the robot can deliver the processing object 100 to the gripper 14, as shown in Fig. 2.

[0030] When the processing object 100 is delivered to the gripper 14 and charge dissipation is needed, the liquid level of the medium liquid 11 loaded in the tank 12 is raised until the surface of the processing object 100 is submerged, i.e. the medium liquid 11 is in a high liquid level state with the liquid level higher than the surface of the processing object 100, so that the charges carried on the processing object 100 are dissipated and taken out of the cavity 10 by the circulating medium liquid 11, and the preparation for the subsequent normal chemical liquid cleaning operation is made to prevent arc breakdown, as shown in Fig. 3.

[0031] After charge dissipation, the liquid level of the medium liquid 11 loaded in the tank 12 is lowered from the high liquid level state to the low liquid level state and kept in a dynamic equilibrium state below the top of the turntable 13, so that the processing object 100 is exposed from the liquid level of the medium liquid 11, as shown in Fig. 4. Then, the turntable 13 is raised and the surface of the processing object 100 is sprayed with chemical liquid by the nozzle 22, and the cleaning operation is performed, as shown in Fig. 5. After cleaning, the processing object 100 is delivered out of the cavity 10 by the gripper 14, and the turntable 13 is lowered to the initial position, so that the standby state shown in Fig. 2 is restored.

[0032] Referring to Figs. 1-5. In some embodiments, the tank 12 is provided with a liquid inlet 21 and a liquid outlet 18. The liquid inlet 21 is used to introduce the medium liquid 11 into the tank 12, and the liquid outlet 18 is used to discharge the medium liquid 11 in the tank 12. By combination control of the opening and closing states of the liquid inlet 21 and the liquid outlet 18, different control of the rising, falling or keeping of the liquid level of the medium liquid 11 loaded in the tank 12 can be achieved, so that the dynamic adjustment of the liquid level height of the medium liquid 11 loaded in the tank 12 is realized by the difference in the flow state of the medium liquid 11.

[0033] In some embodiments, the liquid inlet 21 is arranged on the bottom of the tank 12. The liquid inlet 21 is provided with a flow control valve 19 for adjusting and controlling the flow of the medium liquid 11 entering the tank 12 through the liquid inlet 21 (also including opening and closing control of the liquid inlet 21).

[0034] In some embodiments, the liquid outlet 18 includes a first liquid outlet 181 arranged on the bottom of the tank 12, and a second liquid outlet 182 and a third liquid outlet 183 arranged on the sidewall of the tank 12 in sequence from bottom to top. The first liquid outlet 181 to the third liquid outlet 183 are respectively provided with an on-off valve 16 for opening or closing control of the first liquid outlet 181 to the third liquid outlet 183.

[0035] Wherein, as shown in FIG. 2, when in standby mode, the flow control valve 19 is opened to control the medium liquid 11 to flow into the tank 12 from the liquid inlet 21 at a first flow rate, the on-off valve 16 on the first liquid outlet 181 is closed, and the on-off valve 16 on the second liquid outlet 182 is opened, so that the first liquid outlet 181 is in a closed state, and the second liquid outlet 182 is in an open state, to load a certain volume of medium liquid 11 in the tank 12, and when the liquid level of the medium liquid 11 reaches the height of the second liquid outlet 182 due to the open state of the second liquid outlet 182, the medium liquid 11 can be discharged from the cavity 10 through the second liquid outlet 182, so that the liquid level of the medium liquid 11 is always kept below the top of the turntable 13, and in practice, the liquid level of the medium liquid 11 can be kept at a low liquid level corresponding to the height of the second liquid outlet 182, and the cleanliness of the water quality and the low liquid level can be maintained through the small flow of the medium liquid 11. The on-off valve 16 on the second liquid outlet 182 functions as a low liquid level overflow drain valve, that is, the second liquid outlet 182 functions as a low liquid level overflow drain.

[0036] As shown in FIG. 3, when charging is conducted, the flow control valve 19 is controlled to control the medium liquid 11 to flow into the tank 12 at a second flow rate greater than the first flow rate, the on-off valves 16 on the first liquid outlet 181 and the second liquid outlet 182 are closed, and the on-off valve 16 on the third liquid outlet 183 is opened, so that the first liquid outlet 181 and the second liquid outlet 182 are in a closed state, and the third liquid outlet 183 is in an open state, to load more volume of medium liquid 11 in the tank 12, and when the liquid level of the medium liquid 11 reaches the height of the third liquid outlet 183 due to the open state of the third liquid outlet 183, the medium liquid 11 can be discharged from the cavity 10 through the third liquid outlet 183, so that the liquid level of the medium liquid 11 rises to submerge the surface of the processing object 100, and in practice, the liquid level of the medium liquid 11 can be kept at a high liquid level corresponding to the height of the third liquid outlet 183, so that the medium liquid 11 can directly contact the pattern surface on the processing object 100 to carry away the charges carried by the processing object 100 itself. The on-off valve 16 on the third liquid outlet 183 functions as a high liquid level overflow drain valve, that is, the third liquid outlet 183 functions as a high liquid level overflow drain.

[0037] As shown in FIGS. 4-5, when cleaning, the liquid inlet 21 is closed by the flow control valve 19, and the switch valve 16 of the first liquid outlet 181 and the second liquid outlet 182 is opened, so that the first liquid outlet 181 and the second liquid outlet 182 are in an open state, and the liquid level of the medium liquid 11 in the tank 12 drops rapidly until a low liquid level below the top of the rotary table 13 and remains. The first liquid outlet 181 and the second liquid outlet 182 can be closed when the low liquid level is reached. The first liquid outlet 181 can also be closed when the low liquid level is reached, and the second liquid outlet 182 is in an open state, and the medium liquid 11 is introduced into the first flow through the liquid inlet 21, so that the liquid level of the medium liquid 11 in the tank 12 remains at the low liquid level. Then, the rotary table 13 is raised, and the processing object 100 exposed on the surface is cleaned.

[0038] In some embodiments, the pipe diameter of the liquid inlet 21 and the pipe diameter of the first liquid outlet 181 to the third liquid outlet 183 are at least 3 / 4 inch (sixth pipe).

[0039] In some embodiments, the first flow is 5 to 10 liters per minute. The second flow is 30 to 40 liters per minute.

[0040] In some embodiments, the medium liquid 11 includes deionized water or carbon dioxide aqueous solution.

[0041] In some embodiments, a plurality of liquid level detection elements are arranged in the tank 12 to correspondingly detect the liquid level height state of the medium liquid 11 in the tank 12. For example, the liquid level detection elements are arranged on the upper and lower sides of the second liquid outlet 182 and the upper side of the third liquid outlet 183 to form high, medium, and low liquid level detection.

[0042] In some embodiments, the liquid level detection element includes a liquid level sensor. The liquid level sensor can be a capacitive liquid level sensor or a nitrogen blowing liquid level sensor.

[0043] In some embodiments, the liquid inlet 21 is connected to the liquid inlet pipeline 20; the liquid inlet pipeline 20 is used to introduce deionized water as the medium liquid 11 into the tank 12 through the liquid inlet 21. When charging the ions, the liquid level of the deionized water loaded in the tank 12 is raised to immerse the processing object 100 clamped on the clamp 14, so that the charges carried by the processing object 100 itself can be completely removed through the direct contact of the flowing deionized water with the processing object 100.

[0044] In some embodiments, the first liquid outlet 181 to the third liquid outlet 183 is connected to the liquid outlet pipeline 17; the medium liquid 11 discharged from the first liquid outlet 181 to the third liquid outlet 183 is recycled for recycling through the liquid outlet pipeline 17.

[0045] In some embodiments, the liquid inlet pipeline 20 is further provided with a carbon dioxide generator; the carbon dioxide generator is used to blow carbon dioxide into the deionized water flowing through the liquid inlet pipeline 20, so as to further form a carbon dioxide aqueous solution as the medium liquid 11. When the electric charge is guided away, the liquid level of the carbon dioxide aqueous solution loaded in the tank body 12 is raised, and the processing object 100 clamped on the clamp 14 is immersed, so that the processing object 100 itself carrying the electric charge can be completely removed through the direct contact between the flowing carbon dioxide aqueous solution and the processing object 100.

[0046] Further, the tank body 12 is further provided with a water resistance detection element. The water resistance of the medium liquid 11 (carbon dioxide aqueous solution) is detected by the water resistance detection element, and compared with a threshold value, so as to correspondingly adjust and control the amount of carbon dioxide generated by the carbon dioxide generator when the detected water resistance of the medium liquid 11 exceeds the threshold value.

[0047] In some embodiments, the threshold value is 0.05 to 0.15 megaohm / square centimeter.

[0048] In some embodiments, the wet cleaning device further comprises a splash-proof cover 15. The splash-proof cover 15 is arranged in the cavity 10 and surrounds the rotary table 13. The tank body 12 is located on the inner side of the splash-proof cover 15, or the tank body 12 is surrounded by the splash-proof cover 15.

[0049] When the splash-proof cover 15 adopts a multi-ring structure, the tank body 12 is located on the inner side of the innermost ring of the splash-proof cover 15, or the tank body 12 is surrounded by the innermost ring of the splash-proof cover 15. For example, Figures 1-5 show a three-ring splash-proof cover 15 structure with an inner ring splash-proof cover 151, an intermediate splash-proof cover 152, and an outer ring splash-proof cover 153. The tank body 12 can be arranged on the inner side of the inner ring splash-proof cover 151, or directly formed by the inner ring splash-proof cover 151.

[0050] In some embodiments, the rotary table 13 is connected to the lifting mechanism through a rotating mechanism; the rotating mechanism and the lifting mechanism are arranged outside the bottom of the cavity 10. When cleaning after the electric charge is guided away, the liquid level of the medium liquid 11 is first lowered from the high liquid level and maintained at a low liquid level below the top of the rotary table 13, and then the rotary table 13 together with the rotating mechanism is raised by the lifting mechanism, so that the processing object 100 can be normally cleaned by the spray nozzle 22 swinging above the opening upper end of the splash-proof cover 15 to spray the cleaning liquid on the surface of the processing object 100, thereby eliminating the electric charge carried by the wet cleaning device and the processing object 100, and preventing the occurrence of arc breakdown defects (see Figures 4-5).

[0051] The wet cleaning method of the present application is further described in detail below through specific embodiments and in conjunction with the accompanying drawings.

[0052] The wet cleaning method of the present application comprises:

[0053] A cavity is provided with a turntable inside, and a clamp is provided on the top of the turntable;

[0054] A groove is formed around the turntable, and a circulating medium liquid is loaded in the groove;

[0055] Before the processing object is conveyed to the clamp for cleaning, the liquid level of the medium liquid is raised to immerse the surface of the processing object, so that the charges carried on the processing object are guided away through the circulating flow of the medium liquid.

[0056] A wet cleaning method of the present application can be implemented using the wet cleaning device of the present application described above.

[0057] Referring to Figures 2-5 and in combination with Figure 1. In some embodiments, when the wet cleaning method of the present application is implemented, as shown in Figure 2, when the wet cleaning device is in standby state, by combining the opening and closing states of the liquid inlet 21 and the liquid outlet 18, the liquid level of the medium liquid 11 is kept below the top of the turntable 13, for example, the liquid level of the medium liquid 11 is kept at a low liquid level corresponding to the height of the second liquid outlet 182, so that the clamp 14 is exposed from the liquid level of the medium liquid 11.

[0058] As shown in Figure 3, before the processing object 100 is conveyed to the clamp 14 for cleaning, the charge is guided away. At this time, by combining the opening and closing states of the liquid inlet 21 and the liquid outlet 18, the liquid level of the medium liquid 11 is raised from the low liquid level to the high liquid level reaching the height of the third liquid outlet 183, so that the liquid level of the medium liquid 11 immerses the surface of the processing object 100, so that the medium liquid 11 can directly contact the pattern surface on the processing object 100, thus the charges carried by the processing object 100 itself can be removed.

[0059] As shown in Figures 4-5, after the charge is guided away, the cleaning is performed, by combining the opening and closing states of the liquid inlet 21 and the liquid outlet 18, the liquid level of the medium liquid 11 is lowered again and kept at a low liquid level corresponding to the height of the second liquid outlet 182 below the top of the turntable 13, so that the processing object 100 is exposed from the liquid level of the medium liquid 11, and then the cleaning is performed.

[0060] Further, when the liquid level of the medium liquid 11 is lowered to keep at a low liquid level corresponding to the height of the second liquid outlet 182 below the top of the turntable 13 during the cleaning, the turntable 13 is raised by the rotating mechanism, so that the processing object 100 is cleaned by spraying the cleaning liquid on the surface of the processing object 100 using the nozzle 22 through the open upper end of the groove 12 (inner circle splash shield 151).

[0061] In summary, by arranging the groove 12 around the rotary table 13 and loading the medium liquid 11 in a circulating flow state in the groove 12, the surface of the processing object 100 can be immersed by rising the liquid level of the medium liquid 11 before the processing object 100 (for example, a wafer) is conveyed onto the clamp 14 for cleaning, so that the charges carried on the processing object 100 can be completely conducted away by the continuous contact of the processing object 100 surface with the flowing medium liquid 11, and then the problem of arc breakdown of the processing object 100 will not occur during the conventional cleaning process, thus effectively solving the defect that the existing single wafer wet cleaning equipment can cause arc breakdown of the wafer.

[0062] Although the embodiments of the present application have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to the embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the present application described in the claims. Moreover, the present application described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. A wet cleaning apparatus, characterized by, The application relates to a device for removing charges from a processing object, which comprises: a rotating table arranged in a cavity, a clamp arranged on the top of the rotating table, and a groove arranged around the rotating table; the groove is used for loading a circulating medium liquid, and before the processing object is conveyed to the clamp for cleaning, the surface of the processing object is immersed by rising the liquid level of the medium liquid, so that the charges carried on the processing object are guided away by the circulating flow of the medium liquid.

2. The wet cleaning apparatus according to claim 1, wherein During standby, the clamp is exposed from the liquid level of the medium liquid by keeping the liquid level below the top of the rotating table; during cleaning, the processing object is cleaned after being exposed from the liquid level of the medium liquid by lowering the liquid level and keeping the liquid level below the top of the rotating table.

3. The wet cleaning apparatus according to claim 2, wherein The groove is provided with an inlet and an outlet, the inlet is used for feeding the medium liquid into the groove, and the outlet is used for discharging the medium liquid in the groove; the rising, lowering or keeping of the liquid level of the medium liquid in the groove is realized by combination control of the opening and closing states of the inlet and the outlet.

4. The wet cleaning apparatus according to claim 3, wherein The inlet is arranged on the bottom of the groove, the inlet is provided with a flow control valve, the outlet comprises a first outlet arranged on the bottom of the groove, and a second outlet and a third outlet arranged on the sidewall of the groove from bottom to top, respectively, and the first outlet to the third outlet are respectively provided with on-off valves; during standby, the medium liquid is fed into the groove at a first flow rate by the flow control valve, and the on-off valves of the first outlet are closed and the on-off valves of the second outlet are opened, so that the liquid level of the medium liquid is kept below the top of the rotating table; during charge guiding, the medium liquid is fed into the groove at a second flow rate greater than the first flow rate by the flow control valve, and the on-off valves of the first outlet and the second outlet are closed and the on-off valves of the third outlet are opened, so that the liquid level of the medium liquid is raised to immerse the surface of the processing object; during cleaning, the inlet is closed by the flow control valve, and the on-off valves of the first outlet and the second outlet are opened, so that the liquid level of the medium liquid is lowered and kept below the top of the rotating table, and then the processing object exposed on the surface is cleaned.

5. The wet cleaning apparatus according to claim 4, wherein The groove is provided with a liquid level detection element arranged on the upper and lower sides of the second outlet and the upper side of the third outlet.

6. The wet cleaning apparatus according to claim 3, wherein The inlet is connected to an inlet pipeline, and the inlet pipeline is used for feeding deionized water or carbon dioxide solution as the medium liquid into the groove through the inlet.

7. The wet cleaning apparatus according to claim 6, wherein The liquid inlet pipeline is provided with a carbon dioxide generator, which is used to blow carbon dioxide into the deionized water flowing therethrough to form carbon dioxide aqueous solution as the medium liquid. The tank is provided with a water resistance detection element, which is used to detect the water resistance of the carbon dioxide aqueous solution and compare it with a threshold value. When the detected water resistance of the carbon dioxide aqueous solution exceeds the threshold value, the carbon dioxide generator is controlled to adjust the amount of carbon dioxide generated correspondingly.

8. A wet cleaning method characterized by, Comprise: A cavity is provided with a turntable, and a clamp is arranged on the top of the turntable; A tank is formed around the turntable and loaded with circulating medium liquid; Before the processing object is conveyed to the clamp for cleaning, the liquid level of the medium liquid is raised to immerse the surface of the processing object, so that the charges carried on the processing object are guided away by the circulating flow of the medium liquid.

9. The wet cleaning method according to claim 8, wherein Also include: When on standby, the liquid level of the medium liquid is kept below the top of the turntable, so that the clamp is exposed from the liquid level of the medium liquid; when cleaning, the liquid level of the medium liquid is lowered and kept below the top of the turntable, so that the processing object is exposed from the liquid level of the medium liquid for cleaning.

10. The wet cleaning method according to claim 9, wherein, When cleaning, the liquid level of the medium liquid is first lowered and kept below the top of the turntable, and then the turntable is raised to spray cleaning liquid on the surface of the processing object through the open upper end of the tank for cleaning.

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