Electronic device comprising antenna

Abstract

In embodiments, an electronic device is provided. The electronic device comprises: a metal bracket including a support portion disposed inside the electronic device and a conductive portion connected to the support portion and forming at least a portion of a housing of the electronic device; a printed circuit board (PCB) disposed on the support portion; at least one element; a near field communication (NFC) circuit disposed on the PCB; and a radiator electrically connected to the NFC circuit and forming a loop. The loop of the radiator may be disposed in a space between the support portion and at least a portion of the conductive portion when viewed in a direction perpendicular to the rear surface of the electronic device. The at least one element may be disposed to electrically connect the conductive portion and the ground of the PCB. The at least one element may be used to control the direction of a current induced in at least a portion of the conductive portion by the radiator.

Description

Electronic device including an antenna

[0001] The descriptions below relate to electronic devices that include antennas.

[0002] NFC (near field communication) is a short-range communication that can be used to transfer data between devices over short distances using the NFC standard protocol.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a metal bracket including a support portion disposed inside the electronic device and a conductive portion connected to the support portion and forming at least a portion of a housing of the electronic device; a printed circuit board (PCB) disposed on the support portion; at least one element; a near field communication (NFC) circuit disposed on the PCB; and an radiator forming a loop and electrically connected to the NFC circuit. The loop of the radiator may be disposed in a space between the support portion and at least a portion of the conductive portion when viewed in a direction perpendicular to a rear surface of the electronic device. The at least one element may be arranged to electrically connect the conductive portion to a ground of the PCB. The at least one element may be used to control a direction of a current induced from the radiator to at least a portion of the conductive portion.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a hinge assembly; and a foldable housing including a first housing part and a second housing part rotatably connected to the hinge assembly; a first printed circuit board (PCB) disposed on the first housing part; a second PCB disposed on the second housing part; at least one first element disposed on the first PCB; at least one second element disposed on the second PCB; an NFC circuit disposed on the first PCB; and an radiator electrically connected to the NFC circuit within the first housing part and forming a loop. The first housing part may include a first support part disposed within the first housing part and a first conductive part connected to the first support part and forming at least a portion of the first housing part. The second housing part may include a second support part disposed within the second housing part and a second conductive part connected to the second support part and forming at least a portion of the second housing part. The loop of the radiator may be disposed in a space between at least a portion of the first support portion and the first conductive portion within the first housing part. When the foldable housing is unfolded and viewed in a direction perpendicular to the rear surface of the first housing part, the radiator may not be disposed in the space between at least a portion of the second support portion and the second conductive portion. When the foldable housing is folded and viewed in a direction perpendicular to the rear surface of the first housing part, the radiator may be disposed in the space between at least a portion of the second support portion and the second conductive portion.

[0006] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a ring-shaped housing having an outer surface and an inner surface, the ring-shaped housing including a first conductive portion corresponding to the outer surface and a second conductive portion corresponding to the inner surface, a printed circuit board (PCB) disposed within the ring-shaped housing, an element configured to electrically connect a first point of the first conductive portion to a first point of the second conductive portion, a connecting member configured to connect a second point of the first conductive portion to a second point of the second conductive portion, a near field communication (NFC) circuit disposed on the PCB, and a radiator connected to the NFC circuit within the ring-shaped housing. The radiator may be disposed between at least a portion of the first conductive portion between the first point of the first conductive portion and the second point of the first conductive portion, and at least a portion of the second conductive portion between the second point of the second conductive portion and the second point of the second conductive portion, when viewed in the axial direction of the ring-shaped housing.

[0007] Figure 1 is a block diagram of an electronic device within a network environment.

[0008] FIG. 2 illustrates an example of an electronic device including a near field communication (NFC) circuit, a conductive portion, and an emitter.

[0009] Figure 3 shows an example of a loop formed along a conductive portion and a loop of a radiator.

[0010] Figure 4 is a drawing for explaining the function of a resonant circuit using conductive parts and elements.

[0011] Figures 5a and 5b are graphs showing the function of a resonant circuit using conductive parts and elements.

[0012] Figures 6a and 6b show examples of bar-type electronic devices.

[0013] Figure 7 illustrates an example of an electronic device including antennas for NFC communication.

[0014] Figures 8a to 8d show examples of arrangement structures of antennas for NFC communication.

[0015] Figures 9a and 9b show examples of the direction of current in the conductive portion according to the resonant circuit.

[0016] Figure 10 shows examples of radiation patterns of signals in the NFC frequency band at the front and back of an electronic device.

[0017] Figures 11a to 11d show examples of NFC communication performance according to the location of the element.

[0018] Figures 12 to 19 illustrate examples of electronic devices including resonant circuits and antennas for NFC communication.

[0019] Figures 20a, 20b, and 20c illustrate examples of foldable-type electronic devices.

[0020] FIGS. 21A, 21B, and 21C illustrate examples of foldable-type electronic devices including a resonant circuit and an antenna for NFC communication.

[0021] FIGS. 22a, 22b, and 22c illustrate examples of multi-foldable-type electronic devices including a resonant circuit and an antenna for NFC communication.

[0022] Figures 23a, 23b, and 23c illustrate examples of other foldable-type electronic devices.

[0023] FIGS. 24a, 24b, and 24c illustrate examples of other foldable-type electronic devices including a resonant circuit and an antenna for NFC communication.

[0024] FIGS. 25a, 25b, 25c, and 25d illustrate examples of bar-type electronic devices including a resonant circuit and an antenna for NFC communication in various segmented structures.

[0025] FIG. 26 illustrates an example of another ring-type electronic device including a resonant circuit and an antenna for NFC communication.

[0026] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0027] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0028] Terms referring to parts of electronic devices used in the following description (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), printed board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to antennas (e.g., antenna radiator, radiator, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating part, antenna structure, antenna structure), terms referring to the shape of parts (e.g., structure, structure, support, contact, or protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, or assembly), terms referring to open structures (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, Terms such as splitter, divider, coupler, or combiner are provided for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... machine', '... object', or '... body' used below may mean at least one shape structure or a unit that processes a function.

[0029] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0030] Figure 1 is a block diagram of an electronic device within a network environment.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB (decibel) or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] FIG. 2 illustrates an example of an electronic device (e.g., electronic device (101)) including a near field communication (NFC) circuit, a conductive portion, and a emitter.

[0054] Referring to FIG. 2, the electronic device (101) may include a metal bracket (200). The metal bracket (200) may include a support portion (201) and a conductive portion (202). The support portion (201) may be disposed inside the electronic device (101). The support portion (201) may be disposed to support a component (e.g., a PCB (205)) inside the electronic device (101). For example, the conductive portion (202) may refer to a portion of the metal bracket (200) that forms at least a portion of a housing of the electronic device (101). For example, the conductive portion (202) may be formed on a side surface of the electronic device (101). For example, the conductive portion (202) may extend from a first point (251) of the support portion (201) and be formed on the side surface of the electronic device (101). When viewed from the outside, the conductive portion (202) may be adjacent to the non-conductive portion (211). For example, the non-conductive portion (211) may correspond to a portion of the non-conductive dielectric. For example, a bridge portion extending from the support portion (201) may be coupled to the conductive portion (202) forming the side surface. Although not illustrated in FIG. 2, as a non-limiting example, the conductive portion (202) may be electrically connected to the support portion (201) via a separate connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern). The metal bracket (200) may be referred to as a bracket, a metal frame, a metal housing, a frame, a housing, a chassis, and / or equivalent technical terms thereof in addition to a metal bracket. The support portion (201) may be referred to as a support member, a metal body, a support frame, a support housing, an internal metal, an internal frame, and / or equivalent technical terms thereof in addition to a support portion. The conductive portion (202) may be referred to as a metal antenna, a side frame, an outer frame, an outer metal, a peripheral portion, a peripheral frame, and / or equivalent technical terms other than the conductive portion.

[0055] An electronic device (101) may include an NFC circuit (220) (e.g., an NFC IC) and a radiator (230). The NFC circuit (220) may be configured to generate and process signals according to NFC communication. The NFC communication refers to a short-range wireless communication technology that transmits and receives signals in a band of approximately 13.56 MHz (e.g., approximately 13.56 MHz to 13.57 MHz). The NFC communication is a wireless communication technology that enables two devices to recognize each other and exchange data in the frequency band. For example, the two devices may be referred to as a reader and a terminal. The reader generates a magnetic field, and the terminal may transmit and / or receive information from the reader via the magnetic field. The electronic device (101) may operate as the reader or the terminal depending on the operating mode. The radiator (230) may be configured to transmit or receive signals according to NFC communication. For example, the radiator (230) may be a component of an NFC antenna.

[0056] In one embodiment, the radiator (230) may be arranged to form a loop. For example, the radiator (230) may include a conductor. The conductor may form a loop having a magnetic flux plane. For example, the conductor may be arranged in a shape (e.g., a solenoid) that wraps around an electrical object (e.g., a camera or a speaker). For example, the radiator (230) may include a conductive pattern. The conductive pattern may be arranged on a dielectric substrate. For example, the radiator (230) may be arranged on an FPCB.

[0057] The NFC circuit (220) may include a first terminal (221) and a second terminal (222). The first terminal (221) of the NFC circuit (220) may be connected to a radiator (230) through a first signal path (231). The second terminal (222) of the NFC circuit (220) may be connected to the radiator (230) through a second signal path (232). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output through the first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the radiator (230) through the first signal path (231). The NFC circuit (220) can output a second signal of the differential output through the second terminal (222). The NFC circuit (220) can transmit the second signal to the radiator (230) through the second signal path (232) from the second terminal (222). The first phase of the first signal and the second phase of the second signal may differ by approximately 180 degrees. For example, in terms of signal output through the terminals, the first terminal (221) may be referred to as a (+) Tx output terminal or a TX1 output terminal, and the second terminal (222) may be referred to as a (-) Tx output terminal or a TX2 output terminal. For example, the first signal may be a positive signal and the second signal may be a negative signal. For another example, the first signal may be a negative signal and the second signal may be a positive signal.

[0058] In one embodiment, the radiator (230) may be disposed in a space (217) between the support portion (201) and the conductive portion (202) of the metal bracket (200). The space (217) between the support portion (201) and the conductive portion (202) of the metal bracket (200) may be referred to as a slit, a slot, or an opening. For example, the support portion (201) may be located inside the electronic device (101) and the conductive portion (202) may form a part of the housing of the electronic device (101). The space (217) between the support portion (201) and the conductive portion (202) may be filled with a non-conductive material or a separate component (e.g., an electrical component such as a camera, a speaker, or a coil) may be disposed therein. A portion of the non-conductive material may form a non-conductive portion (211) that is exposed to the outside of the electronic device (101). The above non-conductive portion (211) may be referred to as a segmented portion or a segmented area. In order to improve the coverage of a radiated signal or to improve the recognition distance of a signal provided from an external electronic device (e.g., a terminal) on both the front and the back of the electronic device (101), the radiator (230) may be placed in the space. For example, when looking at the back of the electronic device (101) in a direction perpendicular to the direction of the electronic device (101) (e.g., in the (-) z-axis direction), the radiator (230) may be placed in the space between at least a portion of the support portion (201) and the conductive portion (202).

[0059] The electronic device (101) may include a PCB (205). Various electronic components of the electronic device (101) may be arranged on the PCB (205). For example, an NFC circuit (220) may be arranged on the PCB (205). The NFC circuit (220) may be electrically connected to the radiator (230) through wiring on the PCB (205). For example, the NFC circuit (220) may be electrically connected to the radiator (230) as part of a first signal path (231) through wiring on the PCB (205), a connector on the PCB (205) (e.g., a connector (841) of FIGS. 8A to 8D), and an FPCB (e.g., an FPCB (842) of FIGS. 8A to 8D) connected to the connector. Although not shown in FIG. 2, the electronic device (101) may include a wireless communication circuit for non-NFC communication (e.g., cellular communication). For example, the wireless communication circuit may be disposed on a PCB (205). In one embodiment, the wireless communication circuit may be configured to supply a signal to a conductive portion (202). The conductive portion (202) connected to the wireless communication circuit may be used as an antenna radiator. The PCB (205) may include a ground (245). For example, the ground (245) may include a ground layer or a ground area of ​​the PCB (205). A second ground portion (245b) of the ground (245) may be electrically connected to a support portion (201) of the metal bracket (200). For example, the support portion (201) may be connected to the second ground portion (245b) of the PCB (205) at a second point (252). Although not shown in FIG. 2, the support portion (201) may be electrically connected to the ground portion (245b) of the PCB (205) via a connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern). The metal bracket (200) may be used as a conductor that provides a ground for a reference potential (e.g., 0 V) ​​of the electronic device (101).

[0060] According to one embodiment, the electronic device (101) may include a component (240). For example, the component (240) may be a lumped element. For example, the component (240) may include at least one of a capacitor and an inductor. For example, the component (240) may be disposed on a PCB (205). The component (240) may be electrically connected to a ground (245) of the PCB (205) (e.g., a first ground portion (245a)). The component (240) may be electrically connected to a conductive portion (202). For example, one end of the element (240) may be connected to a first ground portion (245a) of the PCB (205), and the other end of the element (240) may be electrically connected to a conductive portion (202) (e.g., point (253) of the conductive portion (202)) via a wiring and connecting member (e.g., a C-clip) on the PCB (205). In one embodiment, at least a portion of the element (240) and the conductive portion (202) may function as a resonant circuit (250). For example, the element (240) may include a capacitor. At least a portion of the conductive portion (202) (e.g., between a portion connected to the first point (251) of the support portion (201) and a point (253) connected to the element (240)) may be understood as an inductor. The value (e.g., capacitance) of the element (240) and the electrical length of at least a portion of the conductive portion (202) can affect the current flowing in the conductive portion (202).

[0061] FIG. 3 illustrates an example of a loop formed along a conductive portion (e.g., conductive portion (202)) and a loop of a radiator (e.g., radiator (230)). For each component of FIG. 3, reference may be made to the description of FIG. 2. Like reference numerals may represent like descriptions.

[0062] Referring to FIG. 3, the electronic device (101) may include a metal bracket (200), an NFC circuit (220), a radiator (230), and an element (240). The radiator (230) may be positioned within a space (217) between a support portion (201) and a conductive portion (202). Due to a first signal (e.g., a positive signal) and a second signal (e.g., a negative signal) from the NFC circuit (220), a current may flow in the radiator (230). The current flowing in the radiator (230) may cause inductive coupling. Lenz's law may be referred to to explain the inductive coupling.

[0063]

[0064] E represents electric force, B represents magnetic field, C represents a closed loop with current flowing through it, and S represents the flux plane of the magnetic field.

[0065] Referring to [Mathematical Formula 1], when a closed loop C having an S-plane exists in a stationary state in a magnetic field that varies with time, the result of the integration of the negative increase rate of the magnetic flux passing orthogonally through the S-plane is equal to the integration of the induced electric force of the closed loop C. Here, the negative sign indicates that the current flows in the loop in a direction in which the induced electromotive force opposes the change in the coupled magnetic flux. The current flowing in the loop (330) of the radiator (230) can cause an induced current in at least a part of the conductive portion (202).

[0066] Assuming that a current is induced in the conductive portion (202) of the metal bracket (200), a loop (350) may be formed as an electrical path of the current. For example, the loop (350) may be formed along a boundary of a portion of the metal bracket (200) adjacent to a non-conductive material within a space (217). For example, the loop (350) may be formed along at least a portion of the support portion (201) (e.g., a boundary portion adjacent to a non-conductive material within a space (217)) and at least a portion of the conductive portion (202) (e.g., between a portion connected to the first point (251) of the support portion (201) and a point (253) connected to the element (240)) based on a point (e.g., point (253)) where the support portion (201) and the conductive portion (202) of the metal bracket (200) are connected. In one embodiment, the loop (330) may be positioned within the loop (350). Since the radiator (230) is positioned in the space between at least a portion of the support portion (201) and the conductive portion (202), the loop (330) of the radiator (230) may be positioned within the loop (350) formed by components of the metal bracket (200) (e.g., the support portion (201), the conductive portion (202)). Hereinafter, the loop (330) may be referred to as an inner loop, an inner loop, an internal loop, and / or structural terms equivalent thereto in terms of being positioned within the loop (350). Alternatively, the loop (330) may be referred to as a primary loop, a first loop, a main loop, a leading loop, an element loop, and / or technical terms equivalent thereto in terms of flowing a signal provided from the NFC circuit (220). The loop (350) may be referred to as an outer loop, an outer loop, an external loop, and / or equivalent structural terms in that it is located outside the loop (330). Alternatively, the loop (350) may be referred to as a secondary loop, a second loop, a sub-loop, an inductive loop, a parasitic loop, and / or equivalent technical terms in that it is located outside the loop (330) and through which current induced from the loop (330) flows.The structure forming both the loop (330) and the loop (350) may be referred to as a nested loop structure, a double loop structure, a multi-loop structure, and / or equivalent technical / structural terms. The electronic device (101) may utilize the nested structure to improve NFC communication performance (e.g., increase recognition distance).

[0067] The rotational direction (e.g., clockwise) of the current flowing in the loop (330) of the radiator (230) can form a magnetic flux in one direction (e.g., the (+) z-axis direction). Through the magnetic flux in the opposite direction to the direction of the magnetic flux, an induced current can be induced in the loop (350). For example, the rotational direction of the induced current in the loop (350) can be opposite (e.g., counterclockwise) to the rotational direction (e.g., clockwise) of the current flowing in the loop (330). The induced current can degrade the performance (e.g., recognition distance) of the NFC due to the reverse current. In order to improve the performance of the NFC, the rotational direction of the current flowing in the loop (350) is required to be the same as the rotational direction of the current flowing in the loop (330). When the components of the loop (350) have a capacitive load, the rotational direction of the current in the loop (350) can match the rotational direction of the current in the loop (330). When the components of the loop (350) have capacitive loads, the direction of rotation of the current of the loop (350) may be different from the direction of rotation of the current of the loop (330). Therefore, the components of the loop (350) are required to have capacitive loads.

[0068] To control the direction of rotation of the current flowing in the loop (350), a resonant circuit (e.g., resonant circuit (250)) may be used. The electronic device (101) may include a resonant circuit (250) that utilizes components of the electronic device (101). In one embodiment, at least a portion of the element (240) and the conductive portion (202) may function as the resonant circuit (250). For example, the element (240) may include a capacitor, and at least a portion of the conductive portion (202) (e.g., between a portion connected to the first point (251) of the support portion (201) and a point (253) connected to the element (240)) may be understood as an inductor. The value (e.g., capacitance) of the element (240) and the electrical length of at least a portion of the conductive portion (202) may form a resonant frequency. When operating at a resonant frequency higher than the operating frequency of the NFC circuit (220) (e.g., about 13.56 MHz), the resonant circuit (250) may operate in a conductive region. If the resonant frequency is lower than the operating frequency of the NFC circuit (e.g., about 13.56 MHz), the resonant circuit (250) may operate in an inductive region. In order to match the rotational direction of the current in the loop (330) with the rotational direction of the current in the loop (350), the resonant frequency of the resonant circuit (250) may be higher than the operating frequency of the NFC communication. In one embodiment, the element (240) may be used to control the direction of the current induced in at least a portion of the conductive portion (202). For example, the element (240) may be used for a resonant circuit (250) having a resonant frequency higher than the operating frequency of the NFC communication. For example, the element (240) may include a capacitor (C). The capacitance of the capacitor may be determined such that a resonant circuit (250) utilizing the capacitor and at least a portion of the conductive portion (202) has a resonant frequency higher than the operating frequency of NFC communication.A description for a resonant circuit (250) for controlling the direction of current in a loop (350) is specifically described through FIGS. 4, 5a, and 5b.

[0069] Although the structure in which the conductive portion (202) extends from the first point (251) of the support portion (201) is described in FIGS. 2 and 3, the embodiments of the present disclosure are not limited thereto. The conductive portion (202) may not be a structure extending from the support portion (201), but may be electrically connected to the second ground portion (245b) of the ground (245) of the PCB (205) through a separate connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern). In this case, a loop may be formed between the connecting member and the point (253) along at least a portion of the conductive portion (202) and at least a portion of the support portion (201). At least a portion of the support portion (201) of the loop may represent a portion forming a boundary with a non-conductive material between the support portion (201) and the space (217). At least a portion of the conductive portion (202) of the above loop may represent a portion forming a boundary with a non-conductive material between the conductive portion (202) and the space (217). Although FIGS. 2 and 3 illustrate an example in which the element (240) is electrically connected to the ground (245), embodiments of the present disclosure are not limited thereto. In one embodiment, the element (240) illustrated in FIGS. 2 and 3 may be understood as an equivalent circuit, and instead of a single element, a plurality of elements may be used as the element (240). For example, a plurality of capacitors may be arranged in parallel to provide high capacitance. In another embodiment, one end of the element (240) may not be directly connected to the ground portion (e.g., the first ground portion (245a)), but may be electrically connected to the ground (245) through a separate circuit (e.g., a switching circuit).

[0070] FIG. 4 is a drawing for explaining the function of a resonant circuit (e.g., resonant circuit (250)) using a conductive portion (e.g., conductive portion (202)) and an element (e.g., element (240)). To explain the function of the resonant circuit (250), reference may be made to the descriptions of FIGS. 2 and 3.

[0071] Referring to FIG. 4, a first example (410) represents a loop (e.g., loop (330)) of a coil (401) (e.g., radiator (230)). As signals for NFC communication are provided, current may flow along the loop of the coil (401). As an example, the direction (411) of the current may be counterclockwise. A first pattern (415) represents a magnetic field strength distribution (e.g., distribution of the root mean square (RMS) strength of the magnetic field in the z-axis direction) in the first example (410). A second example (402) represents the coil (401) and an outer loop (402) arranged to include the coil (401) outside the coil (401). The outer loop (402) above represents a loop that does not include an element (e.g., element (240)) of the resonant circuit (e.g., resonant circuit (250)) described in FIGS. 2 and 3. Due to the inner loop of the coil (401), an induced current can flow along the outer loop (402). For example, the direction (421) of the induced current can be clockwise. The second pattern (425) represents the magnetic field strength distribution in the second example (420). The third example (403) represents a resonant circuit (250) using the coil (401) and a resonant circuit (e.g., at least a part of a conductive portion (e.g., conductive portion (202)) and an element (e.g., element (240)). The resonant circuit may be formed based on at least a portion of the element (e.g., element (240)) connected in series to a portion of the loop of the second example (402) and a conductive portion (e.g., conductive portion (202)) of the loop. Due to the resonant circuit, the direction of the current flowing in the outer loop (402) may be changed. For example, the direction (431) of the current flowing in the outer loop (402) may be clockwise. The third pattern (435) represents the magnetic field strength distribution in the third example (430).

[0072] Referring to the first pattern (415), the second pattern (425), and the third pattern (435), it can be confirmed that the magnetic field strength is strengthened due to the resonant circuit. A higher magnetic field strength can indicate improved NFC performance (e.g., increased recognition distance). For example, referring to [Table 1], it can be confirmed that the magnetic field strength is enhanced due to the resonant circuit.

[0073]

[0074] FIGS. 5A and 5B are graphs showing the function of a resonant circuit (e.g., a resonant circuit (250)) using a conductive portion (e.g., a conductive portion (202)) and an element (e.g., an element (240)). The resonant frequency represents a frequency that causes a resonance phenomenon in the resonant circuit. The operating frequency represents the frequency of a signal, and since the current coupled to the conductive portion is induced from a radiator (230) connected to the NFC circuit (220), the operating frequency may be an NFC communication frequency (e.g., about 13.56 MHz).

[0075] Referring to FIG. 5A, a graph (500) represents the current intensity of a resonant circuit according to an operating frequency. The horizontal axis of the graph (500) represents the operating frequency (unit: MHz (megahertz)), and the vertical axis of the graph (500) represents the current intensity (unit: ampere (A)). A line (511) represents the current intensity in the resonant circuit (250). When the operating frequency is lower than the resonant frequency (521), the resonant circuit (250) can operate in a capacitive region. When the operating frequency is higher than the resonant frequency (522), the resonant circuit (250) can operate in an inductive region. For example, the resonant frequency of the resonant circuit (250) can be higher than the operating frequency (e.g., about 13.56 MHz). Due to the resonant frequency higher than the above operating frequency, in an electronic device (101) having a nested loop structure (e.g., loop (330) and loop (350)), the magnetic flux direction of the loop (330) and the magnetic flux direction of the loop (350) may be identical.

[0076] Referring to FIG. 5b, a graph (550) represents current intensity according to operating frequency. The horizontal axis of the graph (550) represents the operating frequency (unit: MHz), and the vertical axis of the graph (550) represents the current intensity (unit: ampere). A first line (561) represents the current intensity when the magnitude of the impedance of the resonant circuit is about 0.01. When the magnitude of the impedance is about 0.01, at an operating frequency (e.g., about 13.56 MHz), the current intensity may be about 3.112. A second line (562) represents the current intensity when the magnitude of the impedance of the resonant circuit is about 0.1. When the magnitude of the impedance is about 0.1, at an operating frequency (e.g., about 13.56 MHz), the current intensity may be about 0.311. The third line (563) represents the current intensity when the impedance of the resonant circuit is approximately . When the impedance is approximately 1, the current intensity may be approximately 0.031 at an operating frequency (e.g., approximately 13.56 MHz). Through the graph (550), it can be confirmed that as the impedance of the resonant circuit decreases, the intensity of the current flowing in the conductive portion (e.g., the conductive portion (202)) due to resonance increases. Due to the increase in the current intensity, the intensity of the magnetic field for NFC communication may increase. Due to the high magnetic field, NFC communication performance (e.g., coverage or recognition distance) may be improved.

[0077] Figures 6a and 6b illustrate examples of bar-type electronic devices (e.g., electronic device (101)).

[0078] Referring to FIG. 6A, for example, the electronic device (101) may include a housing (610) forming an exterior of the electronic device (101). For example, the housing (610) may include a front surface (600A), a rear surface (600B), and a side surface (600C) surrounding a space between the front surface (600A) and the rear surface (600B). For example, the housing (610) may also refer to a structure forming at least a portion of the front surface (600A), the rear surface (600B), and / or the side surface (600C).

[0079] For example, the electronic device (101) may include a substantially transparent front plate (602). For example, the front plate (602) may form at least a portion of the front surface (600A). For example, the front plate (602) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0080] For example, the electronic device (101) may include a substantially opaque back plate (611). For example, the back plate (611) may form at least a portion of the back surface (600B). For example, the back plate (611) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0081] For example, the electronic device (101) may include a side bezel structure (or side member) (618). For example, the side bezel structure (618) may be coupled with the front plate (602) and / or the back plate (611) to form at least a portion of the side surface (600C) of the electronic device (101). For example, the side bezel structure (618) may form the entire side surface (600C) of the electronic device (101), or, for another example, the side bezel structure (618) may form the side surface (600C) of the electronic device (101) together with the front plate (602) and / or the back plate (611). As an example, the side bezel structure (618) may include a conductive portion (e.g., conductive portion (202)) that forms a portion of the housing.

[0082] Unlike the illustrated embodiment, when the side surface (600C) of the electronic device (101) is partially formed by the front plate (602) and / or the rear plate (611), the front plate (602) and / or the rear plate (611) may include a region that extends seamlessly from its edge toward the rear plate (611) and / or the front plate (602). The extending region of the front plate (602) and / or the rear plate (611) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0083] For example, the side bezel structure (618) may include a metal and / or a polymer. For example, the back plate (611) and the side bezel structure (618) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but are not limited thereto. For example, the back plate (611) and the side bezel structure (618) may be formed as separate components and / or may include different materials.

[0084] For example, the electronic device (101) may include at least one of a display (601) (e.g., the display module (160) of FIG. 1), an audio module (603, 604, 607) (e.g., the audio module (170) of FIG. 1), a sensor module (not shown) (e.g., the sensor module (176) of FIG. 1), a camera module (605, 612) (e.g., the camera module (180) of FIG. 1), a key input device (617) (e.g., the input module (150) of FIG. 1), a light emitting element (not shown), and / or a connector hole (608). For example, the electronic device (101) may omit at least one of the above components (e.g., the key input device (617) or the light emitting element (not shown)), or may additionally include other components.

[0085] For example, the display (601) may be visually exposed through a significant portion of the front plate (602). For example, at least a portion of the display (601) may be visible through the front plate (602) forming the front surface (600A). For example, the display (601) may be disposed on the back surface of the front plate (602).

[0086] For example, the outer shape of the display (601) may be formed to be substantially the same as the outer shape of the front plate (602) adjacent to the display (601). For example, in order to expand the area where the display (601) is visually exposed, the gap between the outer shape of the display (601) and the outer shape of the front plate (602) may be formed to be substantially the same.

[0087] For example, the display (601) (or the front surface (600A) of the electronic device (101)) may include a screen display area (601A). For example, the display (601) may provide visual information to the user through the screen display area (601A). In the illustrated embodiment, when the front surface (600A) is viewed from the front, the screen display area (601A) is depicted as being positioned on the inside of the front surface (600A) and spaced apart from the outer edge of the front surface (600A), but is not limited thereto. In another embodiment, when the front surface (600A) is viewed from the front, at least a portion of an edge of the screen display area (601A) may substantially coincide with an edge of the front surface (600A) (or the front plate (602)).

[0088] For example, the screen display area (601A) may include a sensing area (601B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (601A) includes the sensing area (601B)" may be understood to mean that at least a portion of the sensing area (601B) may overlap the screen display area (601A). For example, the sensing area (601B) may be an area that, like other areas of the screen display area (601A), can display visual information by the display (601) and additionally acquire the user's biometric information (e.g., a fingerprint). For example, the sensing area (601B) may also be formed in the key input device (617).

[0089] For example, the display (601) may include an area where the first camera (605) is positioned. For example, an opening may be formed in the area of ​​the display (601), and the first camera (605) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (600A). In this case, the screen display area (601A) may surround at least a portion of an edge of the opening. For example, the first camera (605) (e.g., an under display camera (UDC)) may be positioned below the display (601) so as to overlap the area of ​​the display (601). In this case, the display (601) may provide visual information to the user through the area, and additionally, the first camera (605) may acquire an image corresponding to a direction facing the front (600A) through the area of ​​the display (601).

[0090] For example, the display (601) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0091] For example, the audio module (603, 604, 607) may include a microphone hole (603, 604) and a speaker hole (607).

[0092] For example, the microphone holes (603, 604) may include a first microphone hole (603) formed in a portion of the side (600C) and a second microphone hole (604) formed in a portion of the rear (600B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (603, 604). The microphone may include multiple microphones to detect the direction of the sound.

[0093] For example, a second microphone hole (604) formed in a portion of the rear (600B) may be positioned adjacent to a camera module (605). For example, the second microphone hole (604) may acquire sound according to the operation of the camera module (605). However, this is not limited thereto.

[0094] The speaker hole (607) may include an external speaker hole (607) and a call receiver hole (not shown). The external speaker hole (607) may be formed in a part of the side surface (600C) of the electronic device (101). For example, the external speaker hole (607) may be implemented as a single hole with the microphone hole (603). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (600C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (607) in the side surface (600C). For example, with reference to the illustration in FIG. 6A, the external speaker hole (607) may be formed in the side surface (600C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (600C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and for example, the call receiver hole may be formed in a location other than the side (600C). For example, the call receiver hole may be formed by a spaced space between the front plate (602) (or display (601)) and the side bezel structure (618).

[0095] For example, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (607) and / or a call receiver hole (not shown). For example, the speaker may include a piezo speaker configured to output audio by vibrating a diaphragm within the speaker using a piezoelectric element, but is not limited thereto.

[0096] For example, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0097] For example, the camera module (605, 612) may include a first camera (605) positioned to face the front (600A) of the electronic device (101), and a second camera (612) positioned to face the rear (600B).

[0098] For example, the second camera (612) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (612) is not necessarily limited to including multiple cameras and may include one camera.

[0099] For example, the first camera (605) and the second camera (612) may include one or more lenses, image sensors, and / or image signal processors.

[0100] For example, the electronic device (101) may include a flash (613) positioned to face the rear (600B). For example, the flash (613) may include, for example, a light-emitting diode or a xenon lamp. For example, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be positioned on one side of the electronic device (101).

[0101] For example, the key input device (617) may be positioned on a side (600C) of the electronic device (101). For example, the electronic device (101) may not include some or all of the key input devices (617), and the key input devices (617) that are not included may be implemented in another form, such as soft keys, on the display (601).

[0102] For example, a connector hole (608) may be formed on a side surface (600C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to a connector of an external device may be arranged within the connector hole (608). For example, the electronic device (101) may include an interface module (e.g., an interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0103] For example, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (600A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. For example, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (605). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0104] Figure 6b is an exploded perspective view of the electronic device (101). In the following, redundant descriptions of components having the same reference numerals as those described above are omitted.

[0105] Referring to FIG. 6B, for example, the electronic device (101) may include a display (601), a front plate (602), a rear plate (611), a frame structure (640) (e.g., a metal bracket (200) of FIG. 2), a first printed circuit board (650), a second printed circuit board (652), a cover plate (660), and a battery (670) (e.g., a battery (189) of FIG. 1).

[0106] For example, a frame structure (640) (e.g., a metal bracket (200) of FIG. 2) may include a side bezel structure (618) (e.g., a portion including a conductive portion (202) of FIG. 2) forming an exterior of an electronic device (101) (e.g., a side surface (600C) of FIG. 6A) and a support structure (643) (e.g., a support portion (201) of FIG. 2) extending inward from the side bezel structure (618). For example, the frame structure (640) may be disposed between a display (601) and a rear plate (611). For example, the side bezel structure (618) of the frame structure (640) can surround a space between the back plate (611) and the front plate (602) (and / or the display (601)), and the support structure (643) of the frame structure (640) can extend from the side bezel structure (618) within the space.

[0107] For example, the frame structure (640) may support or accommodate other components included in the electronic device (101). For example, a display (601) may be disposed on one side of the frame structure (640) facing one direction (e.g., +z direction), and the display (601) may be supported by a support structure (643) of the frame structure (640). For example, a first printed circuit board (650), a second printed circuit board (652), a battery (670), and a second camera (612) may be disposed on the other side of the frame structure (640) facing the opposite direction (e.g., (-)z direction). The first printed circuit board (650), the second printed circuit board (652), the battery (670), and the second camera (612) can be mounted in recesses defined by the side bezel structure (618) and / or the support structure (643) of the frame structure (640).

[0108] For example, the first printed circuit board (650), the second printed circuit board (652), and the battery (670) may be respectively coupled to the frame structure (640). For example, the first printed circuit board (650) and the second printed circuit board (652) may be fixedly disposed to the frame structure (640) through a coupling member such as a screw. For example, the battery (670) may be fixedly disposed to the frame structure (640) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0109] For example, the cover plate (660) may be placed between the first printed circuit board (650) and the back plate (611). For example, the cover plate (660) may be placed on the first printed circuit board (650). For example, the cover plate (660) may be placed on a surface of the first printed circuit board (650) facing the -z direction.

[0110] For example, the cover plate (660) may at least partially overlap the first printed circuit board (650) with respect to the z-axis. For example, the cover plate (660) may cover at least a portion of the first printed circuit board (650). In this way, the cover plate (660) may protect the first printed circuit board (650) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (650).

[0111] For example, the cover plate (660) may be fixedly positioned on the first printed circuit board (650) via a joining member (e.g., a screw), or may be joined to the frame structure (640) together with the first printed circuit board (650) via the joining member.

[0112] For example, the display (601) may be positioned between the frame structure (640) and the front plate (602). For example, the front plate (602) may be positioned on one side (e.g., in the +z direction) of the display (601), and the frame structure (640) may be positioned on the other side (e.g., in the -z direction).

[0113] For example, the front plate (602) can be coupled with the display (601). For example, the front plate (602) and the display (601) can be bonded to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0114] For example, the front plate (602) may be coupled with the frame structure (640). For example, the front plate (602) may include an outer portion extending outside the display (601) when viewed in the z-axis direction, and may be coupled to the frame structure (640) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (602) and the frame structure (640) (e.g., side bezel structure (618)). However, the present invention is not limited to the above-described examples.

[0115] For example, the first printed circuit board (650) and / or the second printed circuit board (652) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a nonvolatile memory (e.g., the nonvolatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. For example, the first printed circuit board (650) and the second printed circuit board (652) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0116] For example, the battery (670) may power at least one component of the electronic device (101). For example, the battery (670) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (670) may be disposed substantially coplanar with the first printed circuit board (650) and / or the second printed circuit board (652).

[0117] For example, the electronic device (101) may include an antenna module (not shown). For example, the antenna module may be disposed between the rear plate (611) and the battery (670). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0118] For example, a first camera (605) (e.g., a front camera) may be positioned on at least a portion of a frame structure (640) (e.g., a support structure (643)) such that the lens can receive external light through a portion of the front plate (602) (e.g., the camera area (637)) (e.g., the front (600A) of FIG. 6A).

[0119] For example, a second camera (612) (e.g., a rear camera) may be positioned between the frame structure (640) and the rear plate (611). For example, the second camera (612) may be electrically connected to the first printed circuit board (650) via a connecting member (e.g., a connector). For example, the second camera (612) may be positioned such that the lens can receive external light through the camera area (684) of the rear plate (611) of the electronic device (101).

[0120] For example, the camera area (684) may be formed on a surface of the rear plate (611) (e.g., the rear surface (600B) of FIG. 6A). For example, the camera area (684) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (612). For example, at least a portion of the camera area (684) may protrude from the surface of the rear plate (611) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (684) may form a substantially same plane as the surface of the rear plate (611).

[0121] For example, the housing (e.g., the housing (610) of FIG. 6A) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (602), the frame structure (640), and / or the rear plate (611) that form the exterior of the electronic device (101) may be referred to as the housing (610) of the electronic device (101).

[0122] FIG. 7 illustrates an example of an electronic device (e.g., electronic device (101)) including antennas for NFC communication. The antennas may include a first NFC antenna and a second NFC antenna. As a component of the first NFC antenna, the electronic device (101) may include a radiator (230). For example, as a component of the second NFC antenna, the electronic device (101) may include a radiator (730). For a description of each component of the electronic device (101), reference may be made to the descriptions of FIGS. 2, 3, 6A, and 6B.

[0123] Referring to FIG. 7, the electronic device (101) may include a metal bracket (200) (e.g., a frame structure (640) of FIG. 6b). For example, the metal bracket (200) may include a support portion (201) and a conductive portion (202). The metal bracket (200) may be referred to as the frame structure (640) of FIG. 6. The support portion (201) may be referred to as the support structure (643) of FIG. 6a and / or FIG. 6b. The conductive portion (202) may be referred to as a part of the side bezel structure (618) of FIG. 6a and / or FIG. 6b. The device (101) may include a PCB (205). The PCB (205) may be connected to the metal bracket (200). PCB (205) may be referred to as the first printed circuit board (650) of FIG. 6a and / or FIG. 6b.

[0124] According to one embodiment, the electronic device (101) may include an NFC circuit (220) (e.g., an NFC IC), a matching circuit (720), a radiator (230), and the radiator (730). The NFC circuit (220) may be configured to generate and process signals in a frequency band (e.g., about 13.56 MHz band) for NFC communication. The matching circuit (720) may be used for impedance matching of signals of the NFC circuit (220). The matching circuit (720) may be referred to as an impedance matching circuit, an impedance tuning circuit, a matching network, a matching network circuit, and / or equivalent technical terms in addition to the matching circuit. For example, the matching circuit (720) may include at least one passive element (e.g., an inductor or a capacitor). The NFC circuit (220) and the matching circuit (720) may be disposed on the PCB (205). For example, the matching circuit (720) may be electrically connected to each of the radiator (230) and the radiator (730).

[0125] According to one embodiment, each of the radiator (230) and the radiator (730) may be used as a component of an antenna for NFC communication (hereinafter, referred to as an NFC antenna). The electronic device (101) may include the radiator (230) as a component of a first NFC antenna. The electronic device (101) may include the radiator (730) as a component of a second NFC antenna. Each of the radiator (230) and the radiator (730) may include a conductive wire through which a current flows. For example, the radiator (230) may include a coil having a loop or a conductive pattern of an FPCB. The radiator (230) may be arranged to face both the front and the back of the electronic device (101). For example, the radiator (730) may include a coil having a loop, a conductive pattern of an FPCB, or a conductive pattern of an LDS. The radiator (730) may be positioned to face the rear of the electronic device (101) (e.g., in the (-)z-axis direction).

[0126] The radiator (730) may include a conductive wire disposed on a dielectric substrate that is arranged to face the rear surface of the electronic device (101) (e.g., in the (-) z-axis direction). In one embodiment, to expand the communication area of ​​NFC, the radiator (230) may be disposed in a space between the support portion (201) and the conductive portion (202) at the top of the electronic device (101) to provide sufficient coverage not only on the rear surface (e.g., in the (-) z-axis direction) but also on the front surface (e.g., in the (+) z-axis direction) of the electronic device (101). When viewed in a direction perpendicular to the rear surface of the electronic device (101) (e.g., in the (-) z-axis direction), the radiator (230) may not overlap the metal bracket (200). For example, the radiator (230) may include a conductor arranged to surround an electrical material (e.g., the first camera (605) of FIG. 6A and / or FIG. 6B) disposed in the space between the support portion (201) and the conductive portion (202).

[0127] The NFC circuit (220) can operate in a differential mode. The NFC circuit (220) can transmit a first signal of the differential mode to the radiator (230) through a first signal path (231). The first signal can be transmitted to the radiator (230) through a first signal path (231) via a matching circuit (720). The NFC circuit (220) can transmit a second signal of the differential mode to the radiator (230) through a second signal path (232). The second signal can be transmitted to the radiator (230) through a second signal path (232) via a matching circuit (720). The first phase of the first signal and the second phase of the second signal can be about 180 degrees apart. The first signal and the second signal of the NFC circuit (220) can also be transmitted to the radiator (730). The NFC circuit (220) can transmit the first signal of the differential mode to the radiator (730) through the first signal path (731). The first signal can be transmitted to the radiator (730) through the first signal path (731) via the matching circuit (720). The NFC circuit (220) can transmit the second signal of the differential mode to the radiator (730) through the second signal path (732). The second signal can be transmitted to the radiator (730) through the second signal path (732) via the matching circuit (720).

[0128] Figures 8a to 8d illustrate examples of antenna arrangement structures for NFC communication. To explain each component, reference may be made to the descriptions of Figures 2, 3, 6a, 6b, and 7. Like reference numerals may represent like descriptions. However, the referenced descriptions are not construed as limiting the embodiments in the corresponding drawings.

[0129] Referring to FIG. 8A, the electronic device (101) may include a metal bracket (200). The metal bracket (200) (e.g., the frame structure (640) of FIG. 6A and / or FIG. 6B) may include a support portion (201) (e.g., the support structure (643) of FIG. 6A and / or FIG. 6B). The metal bracket (200) (e.g., the frame structure (640) of FIG. 6A and / or FIG. 6B) may include a conductive portion (202) (e.g., a portion of the side bezel structure (618) of FIG. 6A and / or FIG. 6B) and a conductive portion (802). For example, when viewed from the outside of the electronic device (101), the conductive portion (202) may be disposed between a first non-conductive portion (811) and a second non-conductive portion (812). For example, when viewed from the outside of the electronic device (101), the conductive portion (802) can be positioned between the second non-conductive portion (812) and the third non-conductive portion (813). For example, the space between the support portion (201) and the conductive portions (e.g., the conductive portion (202) or the conductive portion (802)) can be filled with a non-conductive dielectric. For example, each of the first non-conductive portion (811), the second non-conductive portion (812), or the third non-conductive portion (813) can correspond to a portion of the non-conductive dielectric. Hereinafter, in order to explain the overlapping structure for NFC communication, the conductive portion (202) is described as an example, but embodiments of the present disclosure are not limited thereto. A loop using the conductive portion (802) and the support portion (201) can be used as a component of the overlapping structure for NFC communication.

[0130] According to one embodiment, the electronic device (101) may include a PCB (205). For example, the electronic device (101) may include an NFC circuit (220) and a matching circuit (720). For example, the NFC circuit (220) and the matching circuit (720) may be disposed on the PCB (205). The radiator (230) and the radiator (730) may be electrically connected to the NFC circuit (220) and the matching circuit (720), respectively. According to one embodiment, the conductive portion (202) of the metal bracket (200) may be used as a radiator for communication other than NFC communication (hereinafter, referred to as non-NFC communication), such as cellular communication. The electronic device (101) may include a wireless communication circuit (820). For example, the wireless communication circuit (820) may be disposed on the PCB (205). For example, the wireless communication circuit (820) may be configured to process (e.g., use a DAC, an ADC, upconversion, downconversion, frequency filtering, or phase shifting) an RF signal in the frequency band of WiFi communication or the cellular communication. The wireless communication circuit (820) may radiate the RF signal through the conductive portion (202) or receive the RF signal from an external electronic device (e.g., an electronic device (102), an electronic device (104), or a server (108)).

[0131] In one embodiment, the electronic device (101) may include a tuning circuit (830) (or may be referred to as an X-GND (ground) circuit, a pewter, an impedance tuner, an impedance matching circuit, and / or equivalent technical terms) of the conductive portion (202) which is a radiator of the cellular communication. For example, the tuning circuit (830) may include a plurality of elements (e.g., a first passive element (831), a second passive element (832), a third passive element (833), or a fourth passive element (834)) and a switching circuit (835). The plurality of elements may be connected to a ground (e.g., ground (245) of FIG. 2). The switching circuit (835) may be configured to electrically connect the element (240) to one of the plurality of elements. In one embodiment, the switching circuit (835) may be controlled to electrically connect the element (240) to a designated element (e.g., the first element (831)) when the electronic device (101) is operating in a mode for NFC communication. The switching circuit (835) may be controlled to electrically connect the element (240) to an element other than the designated element (e.g., the second element (832), the third element (833), or the fourth element (834)) when the electronic device (101) is operating in a mode for non-NFC communication (e.g., cellular communication).

[0132] According to one embodiment, the electronic device (101) may include a radiator (230). The radiator (230) may be disposed in a space (817) between the supporting portion (201) and the conductive portion of the metal bracket (200) (e.g., the space (217) of FIG. 2). The space (817) between the supporting portion (201) and the conductive portion (202) of the metal bracket (200) may be referred to as a slit, a slot, or an opening. The space (817) between the supporting portion (201) and the conductive portion (202) may be filled with a non-conductive material or a separate component (e.g., an electrical material such as a camera, a speaker, or a coil) may be disposed. A portion of the non-conductive material may form a first non-conductive portion (811) that is exposed to the outside of the electronic device (101). For example, the radiator (230) may be disposed in an electrical material (850) (e.g., a first camera (605)) disposed in the space between the supporting portion (201) and the conductive portion (202). A wire surrounding the electrical object (e.g., a battery, or a speaker) may be included. The wire may be arranged in a form that wraps around the electrical object (e.g., a solenoid). According to one embodiment, a magnetic sheet (861) (e.g., a ferrite sheet) may be arranged between the radiator (230) and the electrical object (850). The electrical object (850) may be understood as a metal ground. In addition to the examples described above, and as a non-limiting example, the electrical object (850) may be a metal housing of the camera, a ground member (e.g., a ground layer) of the PCB (205), a part of the support portion (201) of the metal bracket (200), or a separate component connected thereto. As the distance between the radiator (230) and the electrical object (850) gets closer, the signal strength of the NFC antenna may decrease. To prevent the NFC communication performance from being degraded, the magnetic sheet (861) may be arranged between the radiator (230) and the electrical object (850). In order to reduce the interaction between the radiator (230) and the electrical material (850), the magnetic sheet (861) may be composed of a material having a relatively higher permeability than the medium of other surrounding components.Since the magnetic sheet (861) concentrates the magnetic field, the effective distance between the radiator (230) and the electric object (850) can increase. The arrangement structure of the radiator (230) and the electric object (850) is described in detail through FIGS. 8b and 8c.

[0133] According to one embodiment, the electronic device (101) may include a radiator (730). The radiator (730) may be positioned to face the rear surface of the electronic device (101). For example, the radiation direction of the radiator (730) may be a direction perpendicular to the rear surface of the electronic device (101) (e.g., the (-) z-axis direction). For example, the radiator (730) may be positioned over the support portion (201). For example, the radiator (730) may be positioned on a dielectric substrate (872) over the support portion (201). For example, the radiator (730) may include a conductive pattern formed on the dielectric substrate (872). According to one embodiment, a magnetic sheet (862) (e.g., a ferrite sheet) may be positioned between the radiator (730) and the support portion (201). The support portion (201) may function as a ground. Accordingly, as the distance between the radiator (730) and the support portion (201) becomes closer, the signal strength of the radiator (730) may decrease. To prevent the NFC communication performance from deteriorating, a magnetic sheet (862) may be placed between the radiator (230) and the support portion (201). In order to reduce the interaction between the radiator (730) and the support portion (201), the magnetic sheet (862) may be formed of a material having a relatively higher permeability than the medium of other surrounding components. Since the magnetic sheet (862) concentrates the magnetic field, the effective distance between the radiator (730) and the support portion (201) may increase. The arrangement structure of the support portion (201), the radiator (730), and the dielectric substrate (872) is described in detail through FIG. 8D.

[0134] In one embodiment, the electronic device (101) may include a component (240). The component (240) may be disposed on a PCB (205). The component (240) may be electrically connected to a conductive portion (202). For example, the component (240) may be electrically connected to the conductive portion (202) through a connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern) and the PCB (205) connected to the connecting member. One end of the component (240) may be connected to the conductive portion (202), and the other end of the component (240) may be electrically connected to a ground (245) of the PCB (205) through a tuning circuit (830). In one embodiment, the component (240) may include a capacitor. For example, at least a portion of the conductive portion (202) connected to the component (240) may be understood as an inductor. The resonant circuit (250) including the above inductor and the above capacitor can be used to control the direction of the current induced in the conductive portion (202). The direction of the current is described in detail with reference to FIGS. 9a and 9b.

[0135] The electronic device (101) may include a display (801) (e.g., the display (601) of FIGS. 6A and / or 6B). For example, when a non-conductive member is not disposed in the space (817), at least a portion of the display (801) may be exposed in the space (817) between the support portion (201) and the conductive portion (202) when viewed in a direction perpendicular to the rear surface of the electronic device (101) (e.g., in the (+)z direction). The display (801) may be positioned below the metal bracket (200) when viewed in a direction perpendicular to the rear surface of the electronic device (101) (e.g., in the (+)z direction). In one embodiment, a non-conductive portion may be formed between a conductive portion of the metal bracket (200) (e.g., the conductive portion (202) or the conductive portion (802)) and at least a portion (e.g., an edge area) of the display (801). If at least a portion of the radiation pattern of the non-conductive portion and the radiator (e.g., the radiator (230)) overlap, the radiator can transmit and / or receive signals from both the rear side (e.g., the side facing the (-) z-axis) as well as the front side (e.g., the side facing the (+) z-axis) of the electronic device (101). This is because the radiated signal is not interfered by the display (810). In one embodiment, the radiator (230) may be positioned closer to the edge area of ​​the display (801) than the radiator (730).

[0136] In Fig. 8a, a coil surrounding an electrical material (850) is described as an example of a radiator of the first NFC antenna, but embodiments of the present disclosure are not limited thereto. For example, the radiator (230) may be an LDS pattern on a non-conductive material or a conductor on a PCB, which is arranged in a space between the support portion (201) and the conductive portion (202). In addition, in Fig. 8a, an example is described in which at least a portion of a conductive portion used for non-NFC communication (e.g., cellular communication) is used for the resonant circuit (250), but embodiments of the present disclosure are not limited thereto. Even a portion (e.g., the conductive portion (802)) of a side bezel structure (e.g., the side bezel structure of Figs. 6a and / or 6b) that is not connected to the wireless communication circuit (820) may be used as a component of the resonant circuit (250).

[0137] Referring to FIG. 8B, the radiator (230) may include a coil arranged to surround an electrical object (850) (e.g., a camera module, or the first camera (605) of FIG. 6A and / or FIG. 6B). The coil may include a conductor that wraps around the electrical object (850) in a solenoid shape. For example, when the electronic device (101) is viewed in one direction (e.g., the (-) y-axis direction), the loop of the radiator (230) may include a portion in which current flows in a direction protruding from a surface and a portion in which current flows in a direction entering the surface. As mentioned in FIG. 8A, a magnetic sheet (861) may be arranged between the conductor and the electrical object (850). The magnetic sheet (861) may be used to increase the strength of the magnetic field of the NFC antenna and to reduce mutual interference between an NFC signal and a camera signal. The radiator (230) may be electrically connected to the NFC circuit (220). The electronic device (101) may include a connector (841). For example, the connector (841) may be connected to a PCB (205). An NFC circuit (220) and a matching circuit (720) may be connected to the connector (841) through wiring on the PCB (205). The connector (841) may be connected to a radiator (230) through a connecting member (842) (e.g., FPCB). For example, the NFC circuit (220) may transmit an NFC signal to the radiator (230) through the connector (841) and the connecting member (842).

[0138] Referring to FIG. 8C, a radiator (230) and an electrical material (850) may be placed on a display (801) with respect to one axis (e.g., the z-axis). The display (801) may include a display glass (801a) and a display panel (801b). With respect to one axis (e.g., the z-axis), the display panel (801b) may be placed on the display glass (801a). A metal bracket (200) may be placed on the display glass (801a). For example, a conductive portion (202) of the metal bracket (200) may be exposed to the outside of the electronic device (101), and a support portion (201) of the metal bracket (200) may be placed inside the electronic device (101). In the space between the support portion (201) and the conductive portion (202), components of the NFC antenna mentioned in FIG. 8b, such as a radiator (230), an electric material (850), or a magnetic sheet (861), may be placed. A waterproof member (844) (e.g., a waterproof tape) may be placed on the display panel (801b), and a non-conductive material (845) (e.g., a dielectric) may be filled in the space between the support portion (201) and the conductive portion (202). According to one embodiment, when the electronic device (101) is viewed in one direction (e.g., the (+) z-axis direction), the radiator (230) may be placed so as not to overlap with the PCB (205) or the support portion (201). For example, at least a portion of the radiator (230) and the display (801) overlap with each other based on the front surface of the electronic device (101) (e.g., the surface on which the display (801) is placed, the surface facing the (+) z-axis), but the radiation pattern of the radiator (230) can pass through a non-conductive portion between a portion of the display (801) (e.g., an edge region) and the conductive portion (202). In addition, the rear surface of the electronic device (101) (e.g., the surface opposite to the front surface) may have an open structure without a separate obstacle (e.g., a PCB (205) or a support portion (201)) other than the rear housing.Therefore, the coverage of NFC communication can include both the front area and the back area of ​​the electronic device (101).

[0139] Referring to FIG. 8D, the electronic device (101) may include a dielectric substrate (872). In one embodiment, the radiator (730) may include a conductive pattern formed on the dielectric substrate (872). For example, the radiator (730) may be disposed on a first surface of the dielectric substrate (872) (e.g., a surface facing the (-) z-axis), and a magnetic sheet (862) may be disposed on a second surface of the dielectric substrate (872) opposite to the first surface (e.g., a surface facing the (+) z-axis). In one example, the magnetic sheet (862) may be disposed between the second surface of the dielectric substrate (872) and the support portion (201). As mentioned in FIG. 8A, the magnetic sheet (862) (e.g., a ferrite sheet) may be disposed between the radiator (730) and the support portion (201). To prevent NFC communication performance degradation, the emitter (730) may be placed on the dielectric substrate (872). As a non-limiting example, when the electronic device (101) is viewed in one direction (e.g., in the (-) z-axis direction), the magnetic sheet (862) may be placed so as to overlap all closed surfaces of the loops of the conductive pattern.

[0140] FIGS. 9A and 9B illustrate examples of the direction of current in a conductive portion (e.g., conductive portion (202)) according to a resonant circuit. To explain each component, reference may be made to the descriptions of FIGS. 2, 3, 6A, 6B, 7, and 8A to 8D. Like reference numerals may indicate like descriptions. However, the referenced descriptions are not construed as limiting the embodiments in the corresponding drawings.

[0141] Referring to FIGS. 9A and 9B , the electronic device (101) may include a metal bracket (200). The metal bracket (200) (e.g., the frame structure (640) of FIGS. 6A and / or 6B ) may include a support portion (201) (e.g., the support structure (643) of FIGS. 6A and / or 6B ). The metal bracket (200) (e.g., the frame structure (640) of FIGS. 6A and / or 6B ) may include a conductive portion (202) (e.g., a portion of the side bezel structure (618) of FIGS. 6A and / or 6B ) and / or a conductive portion (802). The electronic device (101) may include a PCB (205). For example, the electronic device (101) may include an NFC circuit (220) and a matching circuit (720) on the PCB (205). For example, the electronic device (101) may include a radiator (230) and / or a radiator (730) connected to an NFC circuit (220) and a matching circuit (720). The radiator (230) may be a component of a first NFC antenna for NFC communication. The radiator (730) may be a component of a second NFC antenna for NFC communication.

[0142] A first signal (e.g., a positive signal) and a second signal (e.g., a negative signal) from the NFC circuit (220) may be provided to the radiator (230). A current may flow in the loop (330) of the radiator (230). Considering Lenz's law described above, the current flowing in the loop (330) of the radiator (230) may cause a current to flow in the conductive portion (202) of the metal bracket (200). The electronic device (101) may include the element (240). For example, a loop (350) may be formed by coupling in a slot area formed along the conductive portion (202), the element (240), the ground (245) of the PCB (205), and / or the support portion (201). The above slot region may refer to a region of the metal bracket (200) that forms a boundary with a non-conductive material of a space (817) between a conductive portion (202) and a support portion (201) of the metal bracket (200). A loop (350) may be formed along the region of the metal bracket (200). According to one embodiment, the loop (330) may be disposed within the loop (350). Due to a change in a magnetic field passing through a magnetic flux plane of the loop (330), a current may be induced in the loop (350). For example, the rotational direction (930) of the current of the loop (330) may be a first direction (e.g., clockwise). The direction of the current of the loop (330) forms a magnetic flux in one direction (e.g., the (+) z-axis direction). Through the formed magnetic flux, an induced current may be caused in the loop (350). The loop (350) may include an element (240). For example, the element (240) may be placed on the PCB (205). The element (240) may be electrically connected to the conductive portion (202). For example, the element (240) may include a capacitor. At least a portion of the conductive portion (202) connected to the element (240) may be understood as an inductor. A resonant circuit (250) using the inductor and the capacitor may affect the direction of current flowing in the conductive portion (202).

[0143] Referring to FIG. 9A, as an example, the element (240) may include an element (940a) having a first capacitance. A resonant frequency determined through the element (940a) and at least a portion of the conductive portion (202) may be lower than an operating frequency of NFC communication. The loop (350) including the element (940a) may operate in an inductive region. The rotational direction (941) of the current induced in the loop (350) may be different from the rotational direction (930) of the loop (330). As an example, the rotational direction (941) of the current of the loop (350) may be a second direction (e.g., counterclockwise). Since the current in the opposite direction forms a magnetic flux in the opposite direction, it may cause a deterioration of NFC communication performance (e.g., a reduction in coverage and recognition distance).

[0144] Referring to FIG. 9B, as an example, the element (240) may include an element (940b) having a first capacitance. A resonant frequency determined through the element (940b) and at least a portion of the conductive portion (202) may be higher than an operating frequency of NFC communication. The loop (350) including the element (940b) may operate in a capacitive mode. The rotational direction (942) of the current induced in the loop (350) may be the same as the rotational direction (930) of the loop (330). As an example, the rotational direction (942) of the current of the loop (350) may be a second direction (e.g., clockwise). Since currents in the same rotational direction form magnetic flux in the same direction, NFC communication coverage may be increased.

[0145] According to one embodiment, the resonant circuit (250) using at least a portion of the element (240) and the conductive portion (202) may have a resonant frequency set higher than the operating frequency of NFC communication. This allows the resonant circuit (250) to operate in a capacitive region, allowing current to flow in the same direction in each of the loop (330) and the loop (350). However, if the frequency of the resonant circuit (250) is set excessively higher than the communication frequency of NFC, the intensity of the current flowing in at least a portion of the conductive portion (202) may be reduced due to the impedance of the resonant circuit (250), thereby reducing the performance effect due to the superposition of magnetic fluxes. Therefore, the frequency of the resonant circuit (250) (e.g., ) can be designed to be within a certain range (e.g., above the operating frequency of NFC communication (13.56 MHz) and below the upper limit threshold). For example, at the location where the element (240) is placed, the input impedance for the conductive portion (202) (e.g., impedance according to the length of at least a portion of the conductive portion (202)) can be about 0.79+j3.78Ω for the NFC communication frequency (e.g., about 13.56 MHz) (f). For example, the impedance (X) of the inductor (L) L Considering =j·2f·L), the inductance can be confirmed to be approximately 44.4 nH. In order for the resonant circuit (250) to operate in a capacitive service, the capacitance of the element (240) may be required to be smaller than a threshold value (e.g., approximately 3.1 nF). At this time, in order to lower the overall impedance of the resonant circuit (250), the element (240) may be designed to have a value close to the threshold value.

[0146] FIG. 10 shows examples of radiation patterns of signals in the NFC frequency band at the front and back of an electronic device (e.g., electronic device (101)).

[0147] Referring to FIG. 10, a first example (1011), a second example (1021), and a third example (1031) represent coverage of NFC communication (hereinafter, referred to as rear coverage) on the rear side (e.g., the opposite side of the display) of an electronic device (101). The first example (1011) represents rear coverage of NFC communication using only a radiator disposed on the rear side (e.g., radiator (730)). The second example (1012) represents rear coverage of NFC communication using the radiator disposed on the rear side and the radiator disposed on the top side (e.g., the radiator (230) surrounding the first camera (605) of FIG. 6A and / or FIG. 6B), the electrical object (850). The third example (1013) represents rear coverage of NFC communication using the radiator disposed on the rear side, the radiator disposed on the top side, and a resonant circuit (e.g., the resonant circuit (250)).

[0148] A fourth example (1014), a fifth example (1015), and a sixth example (1016) illustrate coverage of NFC communication on the front side (e.g., the side including the display) of an electronic device (101) (hereinafter, referred to as front side coverage). The fourth example (1014) illustrates front side coverage of NFC communication using only a radiator disposed on the back side (e.g., radiator (730)). The fifth example (1015) illustrates front side coverage of NFC communication using a radiator disposed on the back side and a radiator disposed on the top side (e.g., an electric object (850), radiator (230) surrounding the first camera (605) of FIG. 6A and / or FIG. 6B). The sixth example (1016) illustrates front side coverage of NFC communication using a radiator disposed on the back side, a radiator disposed on the top side, and a resonant circuit (e.g., a resonant circuit (250)).

[0149] The electronic device (101) can operate in card mode or reader mode through an NFC circuit (e.g., NFC circuit (220)). For example, when the electronic device (101) operates in reader mode, the electronic device (101) can communicate with an external electronic device (e.g., a card). The electronic device (101) can transmit a wireless signal through a coil (e.g., radiator (230) or radiator (730)). The external electronic device that receives the wireless signal can perform load modulation. Due to the load modulation in the external electronic device, the voltage induced in the electronic device (101) can change. The electronic device (101) can obtain information about the external electronic device through the change in the voltage. In the reader mode, the NFC communication performance can be referred to as the coverage or recognition distance of the wireless signal. For another example, the external electronic device is an NFC reader, and the electronic device (101) can operate in card mode. In this case, load modulation can be performed in the electronic device (101) according to the wireless signal transmitted from the NFC reader. Due to the load modulation, the magnetic field can change. Due to the change in the magnetic field, the NFC reader can obtain information about the electronic device (101) through the induced voltage. In the card mode, the NFC communication performance can be referred to as the coverage or recognition distance of the wireless signal.

[0150] For example, the NFC communication performance in each of the first example (1011) and the fourth example (1014) is as shown in the table below.

[0151]

[0152] For example, the NFC communication performance in each of the second example (1012) and the fifth example (1015) is as shown in the table below.

[0153]

[0154] For example, the NFC communication performance in each of the third example (1013) and the sixth example (1016) is as shown in the table below.

[0155]

[0156] Referring to [Table 2], [Table 3], and [Table 4], it can be confirmed that the coverage of NFC communication is improved through the resonant circuit (250) using the conductive portion (202) of the metal bracket (200) according to one embodiment of the present invention in each of the card mode and the reader mode.

[0157] Figures 11a to 11d illustrate examples of NFC communication performance depending on the location of a component (e.g., component (240)). To explain each component, reference may be made to the descriptions of Figures 2, 3, 6a, 6b, 7, 8a to 8d, 9a, and 9b. The same reference numerals may indicate the same description. However, the referenced description is not construed as limiting the embodiments in the corresponding drawings.

[0158] Referring to FIG. 11A, the electronic device (101) may include a metal bracket (200). The metal bracket (200) (e.g., the frame structure (640) of FIG. 6A and / or FIG. 6B) may include a support portion (201) (e.g., the support structure (643) of FIG. 6A and / or FIG. 6B). The metal bracket (200) (e.g., the frame structure (640) of FIG. 6A and / or FIG. 6B) may include a conductive portion (202) and a conductive portion (802) (e.g., a portion of the side bezel structure (618) of FIG. 6A and / or FIG. 6B). The electronic device (101) may include a PCB (205). For example, the electronic device (101) may include an NFC circuit (220) and a matching circuit (720) on the PCB (205). For example, the electronic device (101) may include a radiator (230) and a radiator (730) connected to an NFC circuit (220) and a matching circuit (720). The radiator (230) may be a component of a first NFC antenna for NFC communication. The radiator (730) may be a component of a second NFC antenna for NFC communication.

[0159] In one embodiment, the electronic device (101) may include a component (240). For example, the electronic device (101) may include a tuning circuit (830). The tuning circuit (830) may include a plurality of components (e.g., a first passive component (831), a second passive component (832), a third passive component (833), or a fourth passive component (834)) and a switching circuit (835). The switching circuit (835) may be configured to electrically connect the component (240) to one of the plurality of components.

[0160] In one embodiment, the element (240) may be electrically connected to the conductive portion (202). For example, the point on the conductive portion (202) that is electrically connected to the element (240) may vary. In FIG. 8A, an example is described in which a point (e.g., point (253)) on a side of the conductive portion (202) of the electronic device (101) facing one direction (e.g., the (+) x-axis direction) is electrically connected to the element (240), but embodiments of the present disclosure are not limited thereto. For example, the element (240) may be electrically connected to a point (e.g., point (1153)) on a side of the conductive portion (202) facing another direction (e.g., the (+) y-axis direction). For example, the element (240) may be electrically connected to a point (1153) of the conductive portion (202) via a wiring and connecting member (e.g., a C-clip) on the PCB (205). Depending on the position of the conductive portion (202) to which the element (240) is connected, the radiation performance of the NFC may vary. Hereinafter, examples of the radiation performance of the NFC according to the point of the conductive portion (202) to which the element (240) is connected are described through FIGS. 11b, 11c, and 11d.

[0161] Referring to FIG. 11B, the conductive portion (202) of the electronic device (101) may include a first point (1111) (A), a second point (1112) (B), a third point (1113) (C), a fourth point (1114) (D), or a fifth point (1115) (E). Hereinafter, a point where the conductive portion (202) is connected to the element (240) may be referred to as a connection point. The element (240) may be electrically connected to the conductive portion (202) at the connection point of the conductive portion (202). The element (240) may connect the ground (245) of the PCB (205) and the conductive portion (202). At this time, depending on the position of the connection point, the size of the outer loop formed through at least a portion of the support portion (201) and at least a portion of the conductive portion (202) may vary. Additionally, since the length of at least a portion of the conductive portion (202) forming the outer loop (e.g., the distance between the first point (251) connected to the support portion (201) and the connection point) varies, the inductance value of the resonant circuit (250) may vary. The varying size of the outer loop and / or the varying inductance may affect the magnetic flux.

[0162] Referring to FIG. 11c, a graph (1150) represents a recognition distance for each connection point. The horizontal axis of the graph (1150) represents a connection point, and NC (no connect) represents a recognition distance when not connected. Among the vertical axes of the graph (1150), a first vertical axis (1151) represents a maximum recognition distance (unit: mm) when the electronic device (101) operates in card mode, and a second vertical axis (1152) represents a maximum recognition distance (unit: mm) when the electronic device (101) operates in reader mode. A first line (1161) represents a maximum recognition distance at the front of the electronic device (101) in the card mode. A second line (1162) represents a maximum recognition distance at the front of the electronic device (101) in the reader mode. Referring to the graph (1150), it can be confirmed that as the location of the element (240) becomes farther from the radiator (230), the area of ​​the resonant circuit (250) increases, and thus the overall coupling increases, thereby increasing the recognition distance. Meanwhile, as the location of the element (240) becomes farther from the radiator (230), the magnetic flux generated from the radiator (230) can pass through a wider closed surface of the outer loop (e.g., the space between the support portion (201) and the conductive portion (202) when looking at the electronic device (101) in the (+) z-axis direction). Referring to FIG. 11d, for example, when current flows clockwise in the radiator (230), a magnetic field may be formed in a direction (1191) (e.g., in the (-) z-axis direction) entering one surface (e.g., in the xy plane) within the closed surface of the loop (330) of the radiator (230), and a magnetic field may be formed between the loop (330) and the loop (350) including at least a portion of the conductive portion (202) in a direction (1192) exiting the one surface (e.g., in the (+) z-axis direction). Depending on the position of the element (240), the area of ​​the closed surface between the loop (330) and the loop (350) of the radiator (230) may vary.

[0163] According to one embodiment, the position of the element (240) may be determined by considering the impedance of the resonant circuit (250), the coupling area of ​​the resonant circuit (250), the area of ​​the closed surface of the resonant circuit (250), or the resonant frequency according to the value (e.g., capacitance) of the element (240). The element (240) may be electrically connected to a connection point of the conductive portion (202) that provides a recognition distance of a certain distance or more through a connection member.

[0164] Figures 12 to 19 illustrate examples of electronic devices including resonant circuits and antennas for NFC communication. For the purpose of describing each component, reference may be made to the descriptions of Figures 2, 3, 6A, 6B, and 7. Like reference numerals may represent like descriptions. However, the referenced descriptions are not to be construed as limiting the embodiments in the drawings.

[0165] The electronic device (101) may include a metal bracket (200). The metal bracket (200) (e.g., the frame structure (640) of FIG. 6A and / or FIG. 6B) may include a support portion (201) (e.g., the support structure (643) of FIG. 6A and / or FIG. 6B). For example, the metal bracket (200) (e.g., the frame structure (640) of FIG. 6A and / or FIG. 6B) may include a conductive portion (202) and a conductive portion (802) (e.g., a portion of the side bezel structure (618) of FIG. 6A and / or FIG. 6B). The electronic device (101) may include a PCB (205). For example, the electronic device (101) may include an NFC circuit (220) and a matching circuit (720) on the PCB (205). The electronic device (101) may include a radiator (230) and a radiator (730) connected to an NFC circuit (220) and a matching circuit (720). The radiator (230) may be a component of a first NFC antenna for NFC communication. The radiator (730) may be a component of a second NFC antenna for NFC communication. The electronic device (101) may include a wireless communication circuit (820). For example, the wireless communication circuit (820) may be disposed on a PCB (205). For example, the wireless communication circuit (820) may radiate the RF signal through the conductive portion (202) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)).

[0166] Referring to FIG. 12, the electronic device (101) may include a component (1240) connected to a tuning circuit (1230) and a component (240) disposed separately from the tuning circuit (1230). According to one embodiment, the electronic device (101) may include the component (1240) and the tuning circuit (1230) connected to the component (1240) for non-NFC communication (e.g., cellular communication or WiFi communication). The component (1240) may be connected at a point (1241) of the conductive portion (202). For example, the component (1240) may be connected to the point (1241) of the conductive portion (202) via a connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern) that contacts the point (1241) of the conductive portion (202). For example, the tuning circuit (1230) may include a plurality of elements (e.g., a first passive element (1231), a second passive element (1232), a third passive element (1233), or a fourth passive element (1234)) and a switching circuit (1235). The switching circuit (1235) may be configured to electrically connect the element (1240) to one of the plurality of elements. According to one embodiment, the electronic device (101) may include a resonant circuit (250) that uses the element (240) for NFC communication. The resonant circuit (250) may be configured to control the direction of a current flowing in at least a portion of the conductive portion (202) in a frequency band of NFC communication through the element (240). Through the current flowing in at least a portion of the conductive portion (202), a recognition distance of an NFC antenna including the radiator (230) may increase.

[0167] According to one embodiment, since the switching circuit (1235) is positioned independently from the element (240), the switching circuit (1235) may operate differently depending on the operating mode of the electronic device (101). According to one embodiment, when the switching circuit (1235) operates in a mode for NFC communication, the tuning circuit (1230) for non-NFC communication may be in an open state. For example, the switching circuit (125) may be controlled such that the element (1240) is not connected to any element. In other words, the switching circuit (835) may be controlled such that when the switching circuit (835) operates in a mode for NFC communication, the element (1240) is in a neutral state (which may be referred to as an open state) (e.g., a state in which the element (1240) is not connected to any of the first element (1231), the second element (1232), the third element (1233), or the fourth element (1234). The switching circuit (1235) may be controlled to connect the element (240) to a specific element (e.g., a first element (1231), a second element (1232), a third element (1233), or a fourth element (1234)) when operating in a mode for non-NFC communication (e.g., cellular communication).

[0168] Referring to FIG. 13, the wireless communication circuit (820) can be electrically connected to a point (1301) of the conductive portion (202). For example, the electronic device (101) can include a connecting member (1310) (e.g., a C-clip, a metal sheet, a conductive pattern) that contacts the point (1301) of the conductive portion (202) (e.g., a protruding portion of the conductive portion (202)). The connecting member (1310) can contact the PCB (205). A point on the PCB (205) that contacts the connecting member (1310) can be electrically connected to the wireless communication circuit (820) through a wire. Through the connecting member (1310) and the wire, the wireless communication circuit (820) can be configured to supply signals of a frequency band of non-NFC communication to the conductive portion (202). The electronic device (101) may include a component (240). The component (240) may be electrically connected to the conductive portion (202). In one embodiment, the component (240) may be electrically connected to the conductive portion (202) by being connected to an electrical path between the wireless communication circuit (820) and the conductive portion (202). For example, the component (240) may be electrically connected to a point (1301) of the conductive portion (202). As an example, a point on the PCB (205) that contacts the connecting member (1310) may be electrically connected to the component (240) through a separate wire.

[0169] Referring to FIG. 14, the electronic device (101) may include a wireless communication circuit (1420). For example, the wireless communication circuit (1420) may be disposed on a PCB (205). For example, the wireless communication circuit (1420) may be configured to process (e.g., use a DAC, an ADC, up-conversion, down-conversion, frequency filtering, or phase shifting) an RF signal in a frequency band of WiFi communication or the cellular communication. As a non-limiting example, the wireless communication circuit (1420) may be configured to transmit or receive an RF signal in a different communication method from the wireless communication circuit (820) or in a different frequency band from the frequency band supported by the wireless communication circuit (820). The wireless communication circuit (1420) may radiate the RF signal through the conductive portion (802) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). Hereinafter, in FIG. 14, the wireless communication circuit (1420) is illustrated as being independent from the wireless communication circuit (820), but embodiments of the present disclosure are not limited thereto. As a non-limiting example, a signal provided from the same wireless communication circuit (820) (e.g., wireless communication circuit (1420)) may be provided to each of the conductive portion (202) and the conductive portion (802) through different power supply paths.

[0170] In one embodiment, the electronic device (101) may include a component (1440). For example, the component (1440) may be a lumped component. As an example, the component (1440) may include at least one of a capacitor and an inductor. The electronic device (101) may include a resonant circuit (1450) that utilizes the component (1440) and at least a portion of the conductive portion (802) (e.g., from the bridge portion (1415) to the point (1451) of the conductive portion (802). A loop may be formed through at least a portion of the conductive portion (802), the bridge portion (1415), and at least a portion of the support portion (201) (connected to the ground (1445). A magnetic field generated from a radiator for NFC communication (e.g., radiator (230) or radiator (730)) may cause an induced current in the loop. In the same manner as the resonant circuit (250), the resonant circuit (1450) may be configured to control the direction of current flowing through at least a portion of the conductive portion (802). As the direction of current flowing through the loop is controlled, the amount of magnetic flux passing through the closed surface of the radiator (230) may increase. Due to the increased amount of magnetic flux, the recognition distance of NFC communication may increase.

[0171] Referring to FIG. 15, the electronic device (101) may include a nested loop structure using a conductive portion (202) and a radiator (230), as well as a nested loop structure using a conductive portion (802) and a radiator (730). According to one embodiment, the radiator (730) may have a loop-shaped conductive pattern including a loop (hereinafter, referred to as an inner loop) formed through the element (1440), at least a portion of the conductive portion (802), the bridge portion (1415), or the ground of the PCB (205) in FIG. 14. The loop (hereinafter, referred to as an outer loop) of the radiator (730) may include the inner loop. A magnetic field generated from the radiator (e.g., the radiator (730)) for NFC communication may cause an induced current in the inner loop. In substantially the same manner as the resonant circuit (250), the resonant circuit (1450) may be configured to control the direction of the induced current. For example, the element (1440) may include a capacitor. At least a portion of the conductive portion (802) (e.g., between the bridge portion (1415) and the point (1451) of the conductive portion (802)) may be understood as an inductor. The value (e.g., capacitance) of the element (1440) and the electrical length of at least a portion of the conductive portion (802) may affect the current flowing in the conductive portion (802). Since the rotational direction of the current flowing in the inner loop and the rotational direction of the current flowing in the outer loop are the same, the magnetic flux passing through the closed surface may increase. As the magnetic flux increases, the coupling amount of the radiator (730) increases, so that the recognition distance of NFC communication may be improved.

[0172] Referring to FIG. 16, the radiator (230) may be implemented in a shape other than a solenoid-shaped conductor surrounding the electrical material (850). According to one embodiment, the radiator (230) may include a conductive pattern formed on a dielectric (1620) (e.g., a rear cover, a rear carrier). The conductive pattern formed on the dielectric (1620) may be arranged in a space between the support portion (201) and the conductive portion (202). For example, when the electronic device (101) is viewed in one direction (e.g., the (+) z-axis direction), the conductive pattern may not overlap with the support portion (201), the conductive portion (202), and the PCB (205).

[0173] Referring to FIG. 17, the radiator (230) may be implemented in a shape other than a solenoid-shaped conductor surrounding the electrical material (850). According to one embodiment, the NFC antenna may be a PEA (PCB embedded antenna). The radiator (230) may be a component of the PEA. The radiator (230) may include a conductive pattern formed on a PCB (1705). The electronic device (101) may include a PCB (1705) for the NFC antenna. The PCB (1705) may be disposed in a space between the support portion (201) and the conductive portion (202). For example, when the electronic device (101) is viewed in one direction (e.g., the (+) z-axis direction), the PCB (1705) may not overlap with the support portion (201), the conductive portion (202), and the PCB (205).

[0174] Referring to FIG. 18, the electronic device (101) may include a component (1240) connected to a tuning circuit (1230) and a component (240) disposed separately from the tuning circuit (1230). For a description of the component (1240) and the component (240), the descriptions of FIG. 12 may be referenced. In one embodiment, the electronic device (101) may include a switching circuit (1820) connected to the component (240). The switching circuit (1820) may be configured to electrically connect or not connect the component (240) and the ground (245). For example, while signals in a frequency band of non-NFC communication are transmitted through the conductive portion (202), the switching circuit (1820) may be controlled to disconnect the component (240) and the ground (245). While signals of the frequency band of NFC communication are transmitted through the emitter (230), the switching circuit (1820) can be controlled to connect the element (240) and the ground (245). For example, the connection point (1241) of the conductive portion (202) connected to the element (1240) for the tuning circuit (1230) can be located between the connection point (253) of the conductive portion (202) connected to the element (240) of the resonant circuit (250) and the connection point (851) of the conductive portion (202) connected to the wireless communication circuit (820).

[0175] Referring to FIG. 19, the electronic device (101) may include a switching circuit (1820) connected to an element (240). The circuit (1820) may be controlled to connect the element (240) and the ground (245). For example, the connection point (253) of the conductive portion (202) connected to the element (240) of the resonant circuit (250) may be located between the connection point (1241) of the conductive portion (202) connected to the element (1240) for the tuning circuit (1230) and the connection point (851) of the conductive portion (202) connected to the wireless communication circuit (820). For a description of the switching circuit (1820), reference may be made to the descriptions of FIG. 18.

[0176] FIGS. 20A, 20B, and 20C illustrate examples of foldable-type electronic devices (e.g., electronic devices (101)) (hereinafter, referred to as foldable electronic devices). FIG. 20A illustrates an example of an unfolded state of an exemplary foldable electronic device. FIG. 20B illustrates an example of a folded state of an exemplary foldable electronic device. FIG. 20C is an exploded view of an exemplary foldable electronic device.

[0177] FIG. 20A illustrates an example of an unfolded state of an exemplary foldable electronic device. FIG. 20B illustrates an example of a folded state of an exemplary foldable electronic device. FIG. 20C is an exploded view of an exemplary foldable electronic device.

[0178] Referring to FIGS. 20A, 20B, and 20C, a foldable electronic device (e.g., electronic device (101) of FIG. 1) may include a housing (2001), a flexible display (2030) (e.g., display module (160) of FIG. 1), and at least one camera (2040).

[0179] For example, the housing (2001) may form the exterior of the foldable electronic device (101). For example, the housing (2001) may be a physical exterior of the foldable electronic device (101) that is exposed to the outside, and may be disposed inside the foldable electronic device (101) to enclose components that are not exposed to the outside. For example, the housing (2001) may include a first housing portion (2010), a second housing portion (2020), and a hinge structure (2050).

[0180] For example, the first housing portion (2010) may include a first surface (2011), a second surface (2012) opposite the first surface (2011), and a first side surface (2013) surrounding at least a portion of the first surface (2011) and the second surface (2012). For example, the first surface (2011) may be referred to as a front surface of the first housing portion (2010), and the second surface (2012) may be referred to as a rear surface of the first housing portion (2010). The first side surface (2013) may be connected to a periphery of the first surface (2011) and a periphery of the second surface (2012). The first side (2011), the second side (2012), and the first side (2013) may form an interior space of the first housing portion (2010). For example, at least one component may be placed within the space enclosed by the first side (2011), the second side (2012), and the first side (2013).

[0181] For example, the second housing portion (2020) may include a third face (2021), a fourth face (2022) opposite the third face (2021), and a second side surface (2023) surrounding at least a portion of the third face (2021) and the fourth face (2022). For example, the third face (2021) may be referred to as a front surface of the second housing portion (2020), and the fourth face (2022) may be referred to as a rear surface of the second housing portion (2020). The second side surface (2023) may be connected to a periphery of the third face (2021) and a periphery of the fourth face (2022). The third side (2021), the fourth side (2022), and the second side (2023) may form an interior space of the second housing portion (2020). For example, at least one component may be placed within the space enclosed by the third side (2021), the fourth side (2022), and the second side (2023).

[0182] For example, the flexible display (2030) may be configured to display visual information. For example, the flexible display (2030) may include a display area including a plurality of pixels. For example, the active area may be referred to as an active area that displays visual information. For example, the flexible display (2030) may form at least a portion of the front surface of the housing (2001). For example, the flexible display (2030) may at least partially form the first surface (2011) and the third surface (2021).

[0183] For example, the flexible display (2030) may include a first display area (2031) forming at least a portion of a first side (2011) of a first housing portion (2010), a second display area (2032) forming at least a portion of a third side (2021) of a second housing portion (2020), and a third display area (2033) disposed between the first display area (2031) and the second display area (2032). For example, the first display area (2031), the second display area (2032), and the third display area (2033) may at least partially form a front surface of the housing (2001). For example, the foldable electronic device (101) may further include a sub-display (2035) distinct from the flexible display (2030). The sub-display (2035) may be placed on the fourth side (2022) of the second housing portion (2020). The sub-display (2035) may be referred to as a cover display.

[0184] For example, at least one camera (2040) may be configured to acquire an image based on receiving light from a subject outside the foldable electronic device (101). For example, the at least one camera (2040) may include first cameras (2041), second cameras (2042), or third cameras (2043). For example, the first cameras (2041) may be disposed within the first housing portion (2010). For example, the first housing portion (2010) may include at least one opening (2041a) that overlaps the first cameras (2041) when the foldable type electronic device (101) is viewed from above. The first cameras (2041) may acquire an image based on receiving light from the outside of the foldable electronic device (101) through the at least one opening (2041a).

[0185] For example, the second camera (2042) may be positioned within the second housing portion (2020). The second housing portion (2020) may include at least one opening (2042a) that overlaps the second camera (2042) when the foldable electronic device (101) is viewed from above. The second camera (2042) may acquire an image based on receiving light from the outside of the foldable electronic device (101) through the at least one opening (2042a).

[0186] For example, the third camera (2043) may be positioned within the first housing portion (2010). For example, the first display area (2031) of the flexible display (2030) may include at least one opening that overlaps the third camera (2043) when the flexible display (2030) is viewed from above. The third camera (2043) may acquire an image based on receiving light from the outside of the flexible display (2030) through the at least one opening.

[0187] For example, the second camera (2042) and the third camera (2043) may be positioned below (e.g., in the (+) z-axis direction) the flexible display (2030). For example, the second camera (2042) and / or the third camera (2043) may include an under-display camera (UDC) and / or a punch-hole camera.

[0188] For example, the first housing portion (2010) and the second housing portion (2020) may be rotatably coupled. For example, the second housing portion (2020) may be rotatably coupled to the first housing portion (2010) via a hinge structure (2050) with respect to the first housing portion (2010).

[0189] For example, the hinge structure (2050) can rotatably connect the first housing portion (2010) and the second housing portion (2020). The hinge structure (2050) can be disposed between the first housing portion (2010) and the second housing portion (2020) of the foldable electronic device (101) so that the foldable electronic device (101) can be folded. The hinge structure (2050) can enable the foldable electronic device (101) to change from an unfolding state to a folding state. The hinge structure (2050) can enable the foldable electronic device (101) to change from a folded state to an unfolding state. The hinge structure (2050) can maintain the foldable electronic device (101) in an intermediate state between the unfolding state and the folded state.

[0190] For example, the unfolded state may be referred to as a state in which the first direction toward which the first display area (2030a) faces and the second direction toward which the second display area (2030b) faces are the same. For example, the folded state may be referred to as a state in which the first direction is opposite to the second direction. When the foldable electronic device (101) is in the folded state, the first housing portion (2010) and the second housing portion (2020) may be covered or overlapped.

[0191] For example, when the foldable electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the foldable electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the foldable electronic device (101) is in an intermediate state, the first direction may have an inclination (e.g., an angle between 0 and 180 degrees) with respect to the second direction.

[0192] For example, the foldable electronic device (101) may be rotatable about a folding axis (f). The folding axis (f) may be referred to as an imaginary line extending along a direction parallel to the longitudinal direction of the foldable electronic device (101) (e.g., the y-axis) or a direction parallel to the width direction of the foldable electronic device (101) (e.g., the x-axis).

[0193] For example, the foldable electronic device (101) may include at least one conductive portion (2014a, 2024a) and at least one non-conductive portion (2014bb, 2024b) included within the first side (2013) and / or the third side (2023). For example, at least one conductive portion (2014a, 2024a) may be separated from other conductive portions within the first side (2013) and / or the third side (2023) by contacting at least one non-conductive portion (2014b, 2024b). At least one conductive portion (2014a, 2024a) may operate as an antenna radiator to be used for communication with an external electronic device.

[0194] Referring to FIG. 20c, the hinge structure (2050) may include a hinge cover (2051), a first hinge plate (2052), a second hinge plate (2053), and a hinge module (2054). The hinge cover (2051) may surround internal components of the hinge structure (2050) and form an outer surface of the hinge structure (2050). For example, when the foldable electronic device (101) is in a folded state, at least a portion of the hinge cover (2051) may be exposed to the outside of the foldable electronic device (101) through a space between the first housing portion (2010) and the second housing portion (2020). According to another embodiment, when the foldable electronic device (101) is in an unfolded state, the hinge cover (2051) may be covered by the first housing portion (2010) and the second housing portion (2020) and may not be exposed to the outside of the foldable electronic device (101).

[0195] For example, the first hinge plate (2052) and the second hinge plate (2053) can be operatively coupled with the first housing portion (2010) and the second housing portion (2020), respectively, thereby rotatably connecting the first housing portion (2010) and the second housing portion (2020). For example, the first hinge plate (2052) can be operatively coupled with the first frame (2015) of the first housing portion (2010), and the second hinge plate (2053) can be operatively coupled with the second frame (2027) of the second housing portion (2020). As the first hinge plate (2052) and the second hinge plate (2053) are operatively coupled to the first frame (2015) and the second frame (2027), respectively, the first housing portion (2010) and the second housing portion (2020) can be rotated according to the rotation of the first hinge plate (2052) and the second hinge plate (2053).

[0196] The hinge module (2054) can rotate the first hinge plate (2052) and the second hinge plate (2053). For example, the hinge module (2054) can rotate the first hinge plate (2052) and the second hinge plate (2053) about the folding axis (f) by including gears that are interlocked with each other and can rotate.

[0197] For example, the first housing portion (2010) may include a first frame (2015) and a rear cover (2016). The first frame (2015) may be disposed within the first housing portion (2010) and may support at least one component disposed within the first housing portion (2010). The rear cover (2016) may at least partially form a second surface (2022) of the first housing portion (2010). For example, the second housing portion (2020) may include a second frame (2027). The second frame (2027) may be disposed within the second housing portion (2020) and may support at least one component disposed within the second housing portion (2020). For example, the sub-display (2035) may be disposed below (e.g., in the (+) z-axis direction) the second frame (2027).

[0198] An exemplary foldable electronic device (101) may include a plurality of electronic components for implementing various functions, in addition to at least one camera (2040) described above. For example, the foldable electronic device (101) may include a first printed circuit board (2061), a second printed circuit board (2062), a connection structure (e.g., a flexible printed circuit board) (2063), and / or a battery (189). The electronic components described above are merely exemplary and are not limited thereto.

[0199] For example, the first printed circuit board (2061) and the second printed circuit board (2062) may each provide electrical connections between components within the foldable electronic device (101). For example, the first printed circuit board (2061) may be disposed within the first housing portion (2010), and the second printed circuit board (2062) may be disposed within the second housing portion (2020). The first printed circuit board (2061) may provide electrical connections between electronic components disposed within the first housing portion (2010). The second printed circuit board (2062) may provide electrical connections between electronic components disposed within the second housing portion (2020). The connection structure (2063) may electrically connect the first printed circuit board (2061) and the second printed circuit board (2062). For example, the connection structure (2063) may extend from the first printed circuit board (2061) across the hinge structure (2050) to the second printed circuit board (2062). For example, the connection structure (2063) may at least partially overlap the hinge structure (2050).

[0200] For example, the battery (189) may be a device for supplying power to at least one component of the foldable electronic device (101), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0201] For example, the foldable electronic device (101) may include a plurality of antennas (ANT1, ANT2, ANT3, ANT4) to be used for communication with an external electronic device. For example, the foldable electronic device (101) may include a main antenna (ANT1), a sub antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna for short-range wireless communication (ANT4). However, the present invention is not limited thereto.

[0202] Hereinafter, one or more components to be described with reference to the drawings may be implemented together with components of the foldable electronic device (101) described with reference to FIGS. 20a, 20b, and 20c. The same reference numerals are assigned to components identical to those described above, and redundant descriptions may be omitted.

[0203] In this disclosure, relative terms such as "above" and "under" may be used to describe relative positions between components. For example, if the foldable electronic device (101) illustrated in the drawing is flipped over, "above" and "under" may be interchanged.

[0204] FIGS. 21A, 21B, and 21C illustrate examples of foldable-type electronic devices (e.g., electronic devices (101)) including a resonant circuit (e.g., resonant circuit (250)) and an antenna for NFC communication.

[0205] Referring to FIG. 21A, an unfolded state of the electronic device (101) is illustrated. The electronic device (101) may include a first housing part (2010) and a second housing part (2020). The second housing part (2020) may include a second metal bracket. The second metal bracket may include a second support part (2102) and a plurality of conductive parts. For example, the plurality of conductive parts may include a first conductive part (2111), a second conductive part (2112), a third conductive part (2113), and / or a fourth conductive part (2114). The second housing part (2020) may include a plurality of non-conductive parts. For example, the plurality of non-conductive portions may include a first non-conductive portion (2121), a second non-conductive portion (2122), and / or a third non-conductive portion (2123). The first non-conductive portion (2121) may be disposed between the first conductive portion (2111) and the second conductive portion (2112). The second non-conductive portion (2122) may be disposed between the second conductive portion (2112) and the third conductive portion (2113). The third non-conductive portion (2123) may be disposed between the third conductive portion (2113) and the fourth conductive portion (2114). The first housing part (2010) may include a first metal bracket. The first metal bracket may include a first support portion (2101) and a plurality of conductive portions. For example, the plurality of conductive portions may include a fifth conductive portion (2115), a sixth conductive portion (2116), a seventh conductive portion (2117), and an eighth conductive portion (2118). The second housing part (2020) may include a plurality of non-conductive portions. For example, the plurality of non-conductive portions may include a fourth non-conductive portion (2124), a fifth non-conductive portion (2125), and a sixth non-conductive portion (2126).The fourth non-conductive portion (2124) may be positioned between the fifth conductive portion (2115) and the sixth conductive portion (2116). The fifth non-conductive portion (2125) may be positioned between the sixth conductive portion (2116) and the seventh conductive portion (2117). The sixth non-conductive portion (2126) may be positioned between the seventh conductive portion (2117) and the eighth conductive portion (2118).

[0206] According to one embodiment, a radiator (230) may be disposed in a space between the sixth conductive portion (2116) of the first housing part (2010) and the first support portion (2101). The radiator (230) may include a loop-shaped conductor. When the electronic device (101) is viewed in one direction (e.g., in the (+) z-axis direction), the radiator (230) may be disposed in a space between the sixth conductive portion (2116) of the first housing part (2010) and the first support portion (2101). The electronic device (101) may include an element (2141) (e.g., an inductor) and an element (2142) (e.g., a capacitor) connected to the sixth conductive portion (2116). The elements (2141) and (2142) can be connected to ground (2145) (which can be connected to the PCB ground to have the same potential, even though the actual physical parts to be connected are different). For example, the elements (2141) and (2142) can be placed on a PCB (not shown) on the first support portion (2101). A loop (hereinafter, a metal loop) can be formed along the boundary of the first support portion (2101) and the boundary of the sixth conductive portion (2116), adjacent to the slot area (e.g., an opening area filled with a non-conductive portion). The metal loop can be formed to include the loop of the radiator (230). As current flows in the loop of the radiator (230), current can flow in the metal loop. To control the direction of the current, the element (2141), the sixth conductive portion (2116), and the element (2142) can function as a resonant circuit (2172). Since the resonant frequency of the resonant circuit (2171) is higher than the frequency of NFC communication by a certain range or more, the rotational direction of the current flowing in the loop (e.g., metal loop) of the resonant circuit (2172) can be the same as the rotational direction of the current flowing in the loop of the radiator (230).

[0207] According to one embodiment, the second housing part (2020) may include an opening (2130) (e.g., a slot, a slit, an opening, or a void, which may be referred to by the same terms) having a size greater than a predetermined size. The opening (2130) represents a space between the third conductive portion (2113) and the second support portion (2102). The second metal bracket of the second housing part (2020) may include an opening (2230) that penetrates in a direction perpendicular to a magnetic flux plane of the loop of the radiator (230) when the electronic device (101) is in a folded state. When the electronic device (101) is in a folded state, the magnetic flux inside the loop of the radiator (230) may pass through the opening (2230). As the area of ​​the metal portion coupled to the radiator (230) increases, the coupling amount may increase. An increase in the coupling amount may increase the coverage of NFC communication. In one embodiment, the first housing part (2020) may include a component (240) (e.g., a capacitor) and a component (2140) (e.g., an inductor) to form additional loops in addition to the loop including the sixth conductive portion (2116). The component (240) and the component (2140) may be connected to ground (245). For example, the component (240) and the component (2140) may be disposed on a PCB (not shown) on the second support portion (2102). A loop may be formed along the boundary of the second support portion (2102) and the boundary of the third conductive portion (2113), adjacent to a slot area (e.g., an opening area filled with a non-conductive portion). A magnetic flux plane may be formed within the first housing part (2010) in a folded state along the loop. A current may flow in the metal loop due to a magnetic field of a current flowing in the radiator (230). To control the direction of the current, the element (2141), the sixth conductive portion (2116), and the element (2142) can function as a resonant circuit (2172).

[0208] Referring to FIG. 21B, a folded state of the electronic device (101) of FIG. 21A is illustrated. FIG. 21B is a drawing of the electronic device (101) in the folded state when viewed in one direction (e.g., in the (-) x-axis direction). As signals of NFC communication are provided to the radiator (230), when the electronic device (101) is viewed in one direction, the direction (2190) of the current flowing in the conductor of the radiator (230) may be a first direction (e.g., in the (-) y-axis direction). The magnetic flux of the radiator (230) may pass through the closed surface of the loop in one direction (e.g., in the (-) z-axis direction). According to the resonant circuit (2172), the direction (2196) of the current flowing in the sixth conductive portion (2116) may be a first direction (e.g., in the (-) y-axis direction). The magnetic flux due to the current can pass through the magnetic flux surface of the metal loop formed in the sixth conductive portion (2216) and the first support portion (2101) in one direction (e.g., the (-) z-axis direction). The direction (2193) of the current flowing in the third conductive portion (2113) according to the resonant circuit (2171) can be the first direction (e.g., the (-) y-axis direction). The magnetic flux due to the current can pass through the magnetic flux surface of the loop formed in the third conductive portion (2113) and the second support portion (2102) in one direction (e.g., the (-) z-axis direction). As the magnetic flux directions of the loop including the radiator (230), the loop including the resonant circuit (2171), and the loop including the resonant circuit (2172) are aligned, the coverage of NFC communication can increase compared to the coverage when using the radiator (230) without the resonant circuit (2171) and the resonant circuit (2172).

[0209] In FIGS. 21A and 21B , elements (240) and (2140) are illustrated for the resonant circuit (2171), but embodiments of the present disclosure are not limited thereto. As a non-limiting example, element (2140) may be omitted. Similarly, elements (2141) and (2142) are illustrated for the resonant circuit (2172), but embodiments of the present disclosure are not limited thereto. As a non-limiting example, element (2141) may be omitted.

[0210] Referring to FIG. 21C, the electronic device (101) may include an element (240) (e.g., a capacitor) connected to a third conductive portion (2113). The third conductive portion (2113) may be directly connected to the ground through a connecting member (C-clip, metal sheet) without a separate centralized element (e.g., element (2140)). For example, the third conductive portion (2113) may be directly connected to the second support portion (2102) of the second metal bracket or to the ground (245) on the PCB through the connecting member. The electronic device (101) may include an element (2142) (e.g., a capacitor) connected to a sixth conductive portion (2114). The sixth conductive portion (2116) may be directly connected to the ground through a connecting member (C-clip, metal sheet) without a separate centralized element (e.g., element (2142)). For example, the sixth conductive portion (2116) may be directly connected to the first support portion (2101) of the first metal bracket through the connecting member or may be connected to the ground (245) on the PCB.

[0211] In FIG. 21A, FIG. 21B, and FIG. 21C, in describing a foldable electronic device to explain the direction of the current, it is illustrated that the non-conductive portions of the second housing part (2020) (e.g., the second non-conductive portion (2122), the third non-conductive portion (2123)) are aligned with each of the non-conductive portions of the first housing part (2010) (e.g., the fifth non-conductive portion (2125), the fourth non-conductive portion (2124)) in one direction (e.g., the z-axis direction). As a non-limiting example, the point of the third conductive portion (2113) to which the element (240) is connected and the point of the sixth conductive portion (2116) to which the element (2142) is connected may be aligned in one axis (e.g., the z-axis). In addition, the point of the third conductive portion (2113) to which the element (2140) is connected and the element (2141) may be aligned in one direction (e.g., the z-axis). The points of the sixth conductive portion (2116) to be connected can be aligned along an axis (e.g., the z-axis). As the points to be connected are aligned, the amount of magnetic flux that is unnecessarily leaked is reduced, thereby improving NFC communication performance.

[0212] While the preceding embodiments have described examples in which connection points or non-conductive portions are aligned, the embodiments of the present disclosure are not limited thereto. Even if at least some of the non-conductive portions of the first housing part (2010) are not aligned with the non-conductive portions of the second housing part (2020), if the loop formed through the point of connection with each element includes the loop of the radiator (230), it can be understood as an embodiment of the present disclosure.

[0213] FIGS. 22a, 22b, and 22c illustrate examples of multi-foldable-type electronic devices (e.g., electronic devices (101)) including a resonant circuit (e.g., resonant circuit (250)) and an antenna for NFC communication.

[0214] Referring to FIG. 22A, the electronic device (101) may include a first housing part (2200a), a second housing part (2200b), and a third housing part (2200c). The electronic device (101) may include a first hinge structure (2251) and a second hinge structure (2252). The first housing part (2200a) and the second housing part (2200b) may be coupled to the first hinge structure (2251). The first housing part (2200a) and the second housing part (2200b) may be pivotally connected to each other with respect to the folding axis of the first hinge structure (2251). The second housing part (2200b) and the third housing part (2200c) may be coupled to the second hinge structure (2252). Based on the folding axis of the second hinge structure (2252), the second housing part (2200b) and the third housing part (2200c) can be rotatably connected to each other. FIG. 22a illustrates the unfolded state of the electronic device (101).

[0215] The first housing part (2200a) may include a first metal bracket. The first metal bracket may include a first support part (2201) and a plurality of conductive parts. For example, the plurality of conductive parts may include a first conductive part (2211), a second conductive part (2212), a third conductive part (2213), and / or a fourth conductive part (2214). The first housing part (2200a) may include a plurality of non-conductive parts. For example, the plurality of non-conductive parts may include a first non-conductive part (2221), a second non-conductive part (2222), and / or a third non-conductive part (2223). The first non-conductive part (2221) may be disposed between the first conductive part (2211) and the second conductive part (2212). The second non-conductive portion (2222) may be disposed between the second conductive portion (2212) and the third conductive portion (2213). The third non-conductive portion (2223) may be disposed between the third conductive portion (2213) and the fourth conductive portion (2114).

[0216] The second housing part (2200b) may include a second metal bracket. The second metal bracket may include a second support part (2202) and a plurality of conductive parts. For example, the plurality of conductive parts may include a fifth conductive part (2215), a sixth conductive part (2216), and / or a seventh conductive part (2217). The second housing part (2200b) may include a plurality of non-conductive parts. For example, the plurality of non-conductive parts may include a fourth non-conductive part (2224) and a fifth non-conductive part (2225). The fourth non-conductive part (2224) may be positioned between the fifth conductive part (2215) and the sixth conductive part (2216). The fifth non-conductive portion (2225) can be positioned between the sixth conductive portion (2216) and the seventh conductive portion (2217).

[0217] The third housing part (2200c) may include a third metal bracket. The third metal bracket may include a third support part (2203) and a plurality of conductive parts. For example, the plurality of conductive parts may include an eighth conductive part (2218), a ninth conductive part (2219), a tenth conductive part (2220), and / or an eleventh conductive part (2210). The third housing part (2200c) may include a plurality of non-conductive parts. For example, the plurality of non-conductive parts may include a sixth non-conductive part (2226), a seventh non-conductive part (2227), and / or an eighth non-conductive part (2228). The sixth non-conductive part (2226) may be positioned between the eighth conductive part (2218) and the ninth conductive part (2219). The seventh non-conductive portion (2227) may be positioned between the ninth conductive portion (2219) and the tenth conductive portion (2220). The eighth non-conductive portion (2228) may be positioned between the tenth conductive portion (2290) and the eleventh conductive portion (2210).

[0218] According to one embodiment, a radiator (230) may be disposed in a space between a third conductive portion (2213) of a first housing part (2200a) and a first support portion (2201). The radiator (230) may include a loop-shaped conductor. When the electronic device (101) is viewed in one direction (e.g., in the (+) z-axis direction), the radiator (230) may be disposed in a space between the third conductive portion (2213) of the first housing part (2200a) and the first support portion (2201). For example, the electronic device (101) may include an element (240) (e.g., a capacitor) and an element (2240) (e.g., an inductor) connected to the third conductive portion (2213). The element (240) and the element (2240) can be connected to the ground (245) (which can be connected to the PCB ground to have the same potential, even though the actual physical parts to be connected are different). For example, the element (240) and the element (2240) can be placed on a PCB (not shown) on the first support portion (2201). Through the ground (245), a loop (hereinafter, a metal loop) according to the element (240), the third conductive portion (2213), the element (2240), and the ground (245) can be formed. The metal loop can be formed to include the loop of the radiator (230). As current flows in the loop of the radiator (230), current can flow in the metal loop. To control the direction of the current, the element (240), the third conductive portion (2213), and the element (2240) can function as a resonant circuit (2271). As the resonant frequency of the resonant circuit (2271) is higher than the frequency of NFC communication by a certain range, the rotational direction of the current flowing in the loop (e.g., metal loop) of the resonant circuit (2271) may be the same as the rotational direction of the current flowing in the loop of the radiator (230).

[0219] According to one embodiment, the second housing part (2200b) may include an opening (2230) (e.g., a slot, a slit, an opening, or a void, which may be referred to by the same terms) having a certain size or larger. The opening (2230) represents a space between the sixth conductive part (2216) and the second support part (2200b). The second metal bracket of the second housing part (2200b) may include an opening (2230) that penetrates in a direction perpendicular to the magnetic flux plane of the loop of the radiator (230) when the electronic device (101) is in a folded state. When the electronic device (101) is in a folded state, the magnetic flux inside the loop of the radiator (230) may pass through the opening (2230). As the area of ​​the metal part coupled to the radiator (230) increases, the coupling amount may increase. An increase in the coupling amount may increase the coverage of NFC communication. The second housing part (2200b) may include an element (2241) (e.g., an inductor) and / or an element (2242) (e.g., a capacitor) to form an additional loop in addition to the loop including the third conductive portion (2213). The elements (2241) and (2242) may be connected to a ground (2245). For example, the elements (2241) and (2242) may be placed on a PCB (not shown) on the second support part (2200b). A loop (hereinafter, a metal loop) may be formed according to the element (2242), the sixth conductive portion (2216), the element (2242), and the ground (2245). According to the metal loop, a magnetic flux plane may be formed within the second housing part (2200b) in a folded state. Due to the magnetic field of the current flowing in the radiator (230), a current may flow in the metal loop. To control the direction of the current, the element (2241), the sixth conductive portion (2216), and the element (2242) may function as a resonant circuit (2272).

[0220] According to one embodiment, the third housing part (2200c) may include an opening (2260) (e.g., a slot, a slit, an opening, or a void, which may be referred to by the same terms) having a certain size or larger. The opening (2260) represents a space between the ninth conductive part (2219) and the third support part (2200c). The third metal bracket of the third housing part (2200c) may include an opening (2260) that penetrates in a direction perpendicular to the magnetic flux plane of the loop of the radiator (230) when the electronic device (101) is in a folded state. When the electronic device (101) is in a folded state, the magnetic flux inside the loop of the radiator (230) may pass through the opening (2260). As the area of ​​the metal part coupled to the radiator (230) increases, the coupling amount may increase. An increase in the coupling amount may increase the coverage of NFC communication. The third housing part (2200c) may include an element (2243) (e.g., an inductor) and / or an element (2244) (e.g., a capacitor) to form an additional loop in addition to the loop including the ninth conductive portion (2219). The elements (2243) and (2244) may be connected to a ground (2246). For example, the elements (2243) and (2244) may be placed on a PCB (not shown) on the third support part (2200c). A loop (hereinafter, a metal loop) may be formed according to the element (2243), the ninth conductive portion (2219), the element (2244), and the ground (2246). According to the metal loop, a magnetic flux plane may be formed within the third housing part (2200c) in a folded state. Due to the magnetic field of the current flowing in the radiator (230), a current may flow in the metal loop. To control the direction of the current, the element (2243), the ninth conductive portion (2219), and the element (2244) may function as a resonant circuit (2273).

[0221] According to one embodiment, a radiator (230) may be disposed in a space between a third conductive portion (2213) of a first housing part (2200a) and a first support portion (2201). The radiator (230) may include a loop-shaped conductor. When the electronic device (101) is viewed in one direction (e.g., in the (+) z-axis direction), the radiator (230) may be disposed in a space between the third conductive portion (2213) of the first housing part (2200a) and the first support portion (2201). The electronic device (101) may include an element (240) (e.g., a capacitor) and an element (2240) (e.g., an inductor) connected to the third conductive portion (2213). The element (240) and the element (2240) can be connected to the ground (245) (which can be connected to the PCB ground to have the same potential, even though the actual physical parts to be connected are different). For example, the element (240) and the element (2240) can be placed on a PCB (not shown) on the first support portion (2201). Through the ground (245), a loop (hereinafter, a metal loop) according to the element (240), the third conductive portion (2213), the element (2240), and the ground (245) can be formed. The metal loop can be formed to include the loop of the radiator (230). As current flows in the loop of the radiator (230), current can flow in the metal loop. To control the direction of the current, the element (240), the third conductive portion (2213), and the element (2240) can function as a resonant circuit (2271). As the resonant frequency of the resonant circuit (2271) is higher than the frequency of NFC communication by a certain range, the rotational direction of the current flowing in the loop (i.e., metal loop) of the resonant circuit (2271) may be the same as the rotational direction of the current flowing in the loop of the radiator (230).

[0222] According to one embodiment, the second housing part (2200b) may include an opening (2230) (e.g., a slot, a slit, an opening, or a void, which may be referred to by the same terms) having a certain size or larger. The opening (2230) represents a space between the sixth conductive part (2216) and the second support part (2200b). The second metal bracket of the second housing part (2200b) may include an opening (2230) that penetrates in a direction perpendicular to the magnetic flux plane of the loop of the radiator (230) when the electronic device (101) is in a folded state. When the electronic device (101) is in a folded state, the magnetic flux inside the loop of the radiator (230) may pass through the opening (2230). As the area of ​​the metal part coupled to the radiator (230) increases, the coupling amount may increase. An increase in the coupling amount may increase the coverage of NFC communication. The second housing part (2200b) may include an element (2241) (e.g., an inductor) and an element (2242) (e.g., a capacitor) to form an additional loop in addition to the loop including the third conductive portion (2213). The elements (2241) and (2242) may be connected to a ground (2245). For example, the elements (2241) and (2242) may be placed on a PCB (not shown) on the second support part (2200b). A loop (hereinafter, a metal loop) may be formed according to the element (2242), the sixth conductive portion (2216), the element (2242), and the ground (2245). According to the metal loop, a magnetic flux plane may be formed within the second housing part (2200b) in a folded state. Due to the magnetic field of the current flowing in the radiator (230), a current may flow in the metal loop. To control the direction of the current, the element (2241), the sixth conductive portion (2216), and the element (2242) can function as a resonant circuit (2272).

[0223] According to one embodiment, the third housing part (2200c) may include an opening (2260) (e.g., a slot, a slit, an opening, or a void, which may be referred to by the same terms) having a certain size or larger. The opening (2260) represents a space between the ninth conductive part (2219) and the third support part (2200c). The third metal bracket of the third housing part (2200c) may include an opening (2260) that penetrates in a direction perpendicular to the magnetic flux plane of the loop of the radiator (230) when the electronic device (101) is in a folded state. When the electronic device (101) is in a folded state, the magnetic flux inside the loop of the radiator (230) may pass through the opening (2260). As the area of ​​the metal part coupled to the radiator (230) increases, the coupling amount may increase. An increase in the coupling amount may increase the coverage of NFC communication. The third housing part (2200c) may include an element (2243) (e.g., an inductor) and an element (2244) (e.g., a capacitor) to form an additional loop in addition to the loop including the ninth conductive portion (2219). The elements (2243) and (2244) may be connected to a ground (2246). For example, the elements (2243) and (2244) may be placed on a PCB (not shown) on the third support part (2200c). A loop (hereinafter, a metal loop) may be formed according to the element (2243), the ninth conductive portion (2219), the element (2244), and the ground (2246). According to the metal loop, a magnetic flux plane may be formed within the third housing part (2200c) in a folded state. Due to the magnetic field of the current flowing in the radiator (230), a current may flow in the metal loop. To control the direction of the current, the element (2243), the ninth conductive portion (2219), and the element (2244) can function as a resonant circuit (2273).

[0224] Referring to FIG. 22B, a folded state of the electronic device (101) of FIG. 22A is illustrated. The electronic device (101) may be a first type (e.g., “G” type) foldable electronic device. FIG. 22B is a drawing of the first type electronic device (101) when viewed in one direction (e.g., in the (-) x-axis direction) when the electronic device (101) is in a folded state. As NFC communication signals are provided to the radiator (230), when the electronic device (101) is viewed in one direction, the direction (2285) of the current flowing in the wire of the radiator (230) may be in the first direction (e.g., in the (-) y-axis direction). The magnetic flux of the radiator (230) may pass through the closed surface of the loop in one direction (e.g., in the (-) z-axis direction). According to the resonant circuit (2271), the direction (2281) of the current flowing in the third conductive portion (2213) may be a first direction (e.g., (-) y-axis direction). The magnetic flux due to the current may pass through a magnetic flux surface of a loop formed by the element (240), the third conductive portion (2213), the element (2240), and the ground (245) in one direction (e.g., (-) z-axis direction). According to the resonant circuit (2272), the direction (2282) of the current flowing in the sixth conductive portion (2216) may be a first direction (e.g., (-) y-axis direction). The magnetic flux due to the current may pass through a magnetic flux surface of a loop formed by the element (2242), the sixth conductive portion (2216), the element (2243), and the ground (2245) in one direction (e.g., (-) z-axis direction). According to the resonant circuit (2273), the direction (2283) of the current flowing in the ninth conductive portion (2219) may be a first direction (e.g., (-) y-axis direction). The magnetic flux due to the current may pass through the magnetic flux surface of the loop formed by the element (2244), the ninth conductive portion (2219), the element (2245), and the ground (2246) in one direction (e.g., (-) z-axis direction).Since the directions of magnetic flux passing through the magnetic flux planes of each of the loop including the radiator (230), the loop including the resonant circuit (2271) of the first housing part (2200a), the loop including the resonant circuit (2272) of the second housing part (2200b), and the loop including the resonant circuit (2273) of the third housing part (2200c) are consistent, the coverage of NFC communication can be increased compared to the coverage when NFC communication is performed simply using the radiator (230).

[0225] Referring to FIG. 22C, a folded state of the electronic device (101) of FIG. 22A is illustrated. The electronic device (101) may be a first type (e.g., “Z” type) foldable electronic device. FIG. 22C is a drawing of the first type electronic device (101) when viewed in one direction (e.g., in the (-) x-axis direction) when the electronic device (101) is in a folded state. As NFC communication signals are provided to the radiator (230), when the electronic device (101) is viewed in one direction, the direction (2295) of the current flowing in the wire of the radiator (230) may be in the first direction (e.g., in the (-) y-axis direction). The magnetic flux of the radiator (230) may pass through the closed surface of the loop in one direction (e.g., in the (-) z-axis direction). According to the resonant circuit (2271), the direction (2291) of the current flowing in the third conductive portion (2213) may be a first direction (e.g., (-) y-axis direction). The magnetic flux due to the current may pass through a magnetic flux surface of a loop formed by the element (240), the third conductive portion (2213), the element (2240), and the ground (245) in one direction (e.g., (-) z-axis direction). According to the resonant circuit (2272), the direction (2292) of the current flowing in the sixth conductive portion (2216) may be a first direction (e.g., (-) y-axis direction). The magnetic flux due to the current may pass through a magnetic flux surface of a loop formed by the element (2242), the sixth conductive portion (2216), the element (2243), and the ground (2245) in one direction (e.g., (-) z-axis direction). According to the resonant circuit (2273), the direction (2293) of the current flowing in the ninth conductive portion (2219) may be a first direction (e.g., the (-) y-axis direction). The magnetic flux due to the current may pass through the magnetic flux surface of the loop formed by the element (2244), the ninth conductive portion (2219), the element (2245), and the ground (2246) in one direction (e.g., the (-) z-axis direction).Since the directions of magnetic flux passing through the magnetic flux planes of each of the loop including the radiator (230), the loop including the resonant circuit (2271) of the first housing part (2200a), the loop including the resonant circuit (2272) of the second housing part (2200b), and the loop including the resonant circuit (2273) of the third housing part (2200c) are consistent, the coverage of NFC communication can be increased compared to the coverage when NFC communication is performed simply using the radiator (230).

[0226] In FIGS. 22A, 22B, and 22C, elements (240) and (2240) are illustrated for the resonant circuit (2271), but embodiments of the present disclosure are not limited thereto. As a non-limiting example, element (2240) may be omitted. For example, elements (2241) and (2242) are illustrated for the resonant circuit (2272), but embodiments of the present disclosure are not limited thereto. For example, elements (2243) and (2244) are illustrated for the resonant circuit (2273), but embodiments of the present disclosure are not limited thereto.

[0227] Figures 23a, 23b, and 23c illustrate examples of other foldable-type electronic devices (e.g., electronic device (101)). Figure 23a illustrates an unfolded state of the electronic device (101). Figure 23b illustrates a folded state of the electronic device (101). Figure 23c is an exploded view of the electronic device (101).

[0228] Referring to FIGS. 23a, 23b, and 23c, the electronic device (101) may include a first housing portion (2310), a second housing portion (2320), and a display (2330).

[0229] The first housing portion (2310) may include a first surface (2311), a second surface (2312) facing away from the first surface (2311), and a first side surface (2313) surrounding at least a portion of the first surface (2311) and the second surface (2312). The first housing portion (2310) may further include at least one camera (2334) and a display panel (2335) exposed through a portion of the second surface (2312). The first housing portion (2310) may provide a space formed by the first surface (2311), the second surface (2312), and the first side surface (2313) as a space for arranging components of the electronic device (101). The second housing portion (2320) can include a third side (2321), a fourth side (2322) facing and spaced from the third side (2321), and a second side (2323) surrounding at least a portion of the third side (2321) and the fourth side (2322). The fourth side (2322) can further include a back plate (2390) disposed on the fourth side (2322). The first side (2313) and the second side (2323) can include a conductive material, a non-conductive material, or a combination thereof. For example, the first side (2313) and the second side (2323) can include a conductive portion (2328) and a non-conductive portion (2329). The conductive portion (2328) can include a plurality of conductive members, and the plurality of conductive members can be spaced apart from each other. A non-conductive portion (2329) may be positioned between a plurality of conductive members. An antenna structure may be formed by a portion or combination of the plurality of conductive members and the plurality of non-conductive members.

[0230] The first housing portion (2310) can be pivotally connected to the second housing portion (2320) via a hinge structure (2350) disposed on the hinge cover (2355). The hinge structure (2350) can include a hinge plate. For example, the hinge plate can include a first hinge plate and a second hinge plate. The first hinge plate can be connected to the first housing portion (2310), and the second hinge plate can be connected to the second housing portion (2320). The second housing portion (2320) may provide a space formed by a third surface (2321), a fourth surface (2322) facing and separated from the third surface (2321), and a side surface (2323) surrounding at least a portion of the third surface (2321) and the fourth surface (2322), as a space for arranging components of the electronic device (101). The display (2330) may include a window exposed to the outside. The window may protect a surface of the display (2330) and may be formed of a transparent material to transmit visual information provided from the display (2330) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI). The display (2330) may include a first display area (2331) disposed on a first surface (2311) of a first housing portion (2310), a second display area (2332) disposed on a third surface (2321) of a second housing portion (2320), and a third display area (2333) between the first display area (2331) and the second display area (2332). At least a portion of the third display area (2333) may be disposed on a hinge structure (2350).

[0231] For example, an opening may be formed in a portion of a screen display area of ​​the display (2330), or a recess or opening may be formed in a support portion (e.g., a bracket) that supports the display (2330). The electronic device (101) may include at least one camera aligned with the recess or opening. For example, the first display area (2331) may further include at least one camera (2336) that can acquire an image from the outside through a portion of the first display area (2331). For example, at least one camera (2336) may be included on the back of the display (2330) corresponding to the first display area (2331) or the second display area (2332) of the display (2330). For example, the at least one camera (2336) may be disposed below the display (2330) and surrounded by the display (2330). At least one camera (2336) may be enclosed by the display (2330) and not exposed to the outside. However, the display (2330) may include an opening that exposes the at least one camera (2336) to the outside. Although not shown in FIGS. 23A and 23B , the display (2330) may further include a back surface opposite the front surface. The display (2330) may be supported by a first support portion (2315) of the first housing portion (2310) and a second support portion (2327) of the second housing portion (2320).

[0232] The hinge structure (2350) may be configured to rotatably connect a first support portion (2315) coupled to a first hinge plate and a second support portion (2327) coupled to a second hinge plate. A hinge cover (2355) surrounding the hinge structure (2350) may be at least partially exposed between the first housing portion (2310) and the second housing portion (2320) while the electronic device (101) is in a folded state. The hinge cover (2355) may be covered by the first housing portion (2310) and the second housing portion (2320) while the electronic device (101) is in an unfolded state.

[0233] The electronic device (101) can be folded about a folding axis (f) passing through the hinge cover (2355). For example, the hinge cover (2355) can be disposed between a first housing portion (2310) and a second housing portion (2320) of the electronic device (101) to enable the electronic device (101) to be bent, curved, or folded. For example, the first housing portion (2310) is connected to the second housing portion (2320) through a hinge structure (2350) disposed in the hinge cover (2355) and can rotate about the folding axis (f).

[0234] The electronic device (101) can be folded so that the first housing portion (2310) and the second housing portion (2320) face each other by rotating around the folding axis (f). The electronic device (101) can be folded so that the first housing portion (2310) and the second housing portion (2320) cover or overlap each other.

[0235] Referring to FIG. 23c, the electronic device (101) may include a first housing portion (2310), a second housing portion (2320), a hinge structure (2350), a display (2330), a printed circuit board (2361), a display panel (2335), and a back plate (2390). For example, the electronic device (101) may omit at least one of the components or additionally include other components.

[0236] For example, the hinge structure (2350) may include a hinge plate. For example, the hinge structure (2350) may include a hinge gear that allows the first housing portion (2310) and the second housing portion (2320) to pivot.

[0237] For example, the first support portion (2315) may be partially wrapped by the first side (2313). For example, the first support portion (2315) may be formed integrally with the first side (2313). For example, the second support portion (2327) may be partially wrapped by the second side (2323). For example, the second support portion (2327) may be formed integrally with the second side (2323). However, the present invention is not limited thereto. For example, the first support portion (2315) may be formed separately from the first side (2313). For example, the second support portion (2327) may be formed separately from the second side (2323).

[0238] For example, one side of the first support portion (2315) may be coupled with a display (2330), and the other side of the first support portion (2315) may be coupled with a display panel (2335). One side of the second support portion (2327) may be coupled with a display (2330), and the other side of the second support portion (2327) may be coupled with a rear plate (2390).

[0239] For example, a printed circuit board (2361) and a battery may be placed between a surface formed by the first support portion (2315) and the second support portion (2327) and a surface formed by the display panel (2335) and the rear plate (2390). The printed circuit board (2361) may be electrically connected to components for implementing various functions of the electronic device (101).

[0240] FIGS. 24a, 24b, and 24c illustrate examples of other foldable-type electronic devices (e.g., electronic devices (101)) including a resonant circuit (e.g., resonant circuit (250)) and an antenna for NFC communication.

[0241] Referring to FIG. 24a, an unfolded state of the electronic device (101) is illustrated. The electronic device (101) may include a first housing part (2310) and a second housing part (2320).

[0242] The first housing part (2310) may include a first metal bracket. The first metal bracket may include a first support part (2401) and a plurality of conductive parts. For example, the plurality of conductive parts may include a first conductive part (2411a), a second conductive part (2412a), a third conductive part (2413a), a fourth conductive part (2414a), a fifth conductive part (2415a), a sixth conductive part (2416a), and / or a seventh conductive part (2417a). The first housing part (2310) may include a plurality of non-conductive parts. For example, the plurality of non-conductive portions may include a first non-conductive portion (2421a), a second non-conductive portion (2422a), a third non-conductive portion (2423a), a fourth non-conductive portion (2424a), a fifth non-conductive portion (2425a), and / or a sixth non-conductive portion (2426a). The first non-conductive portion (2421a) may be positioned between the first conductive portion (2411a) and the second conductive portion (2412a). The second non-conductive portion (2422a) may be positioned between the second conductive portion (2412a) and the third conductive portion (2413a). The third non-conductive portion (2423a) may be positioned between the third conductive portion (2413a) and the fourth conductive portion (2414a). The fourth non-conductive portion (2424a) may be positioned between the fourth conductive portion (2414a) and the fifth conductive portion (2415a). The fifth non-conductive portion (2425a) may be positioned between the fifth conductive portion (2415a) and the sixth conductive portion (2416a). The sixth non-conductive portion (2426a) may be positioned between the sixth conductive portion (2416a) and the seventh conductive portion (2417a).

[0243] The second housing part (2320) may include a second metal bracket. The second metal bracket may include a second support part (2402) and a plurality of conductive parts. For example, the plurality of conductive parts may include a first conductive part (2411b), a second conductive part (2412b), a third conductive part (2413b), a fourth conductive part (2414b), a fifth conductive part (2415b), a sixth conductive part (2416b), and / or a seventh conductive part (2417b). The second housing part (2320) may include a plurality of non-conductive parts. For example, the plurality of non-conductive portions may include a first non-conductive portion (2421b), a second non-conductive portion (2422b), a third non-conductive portion (2423b), a fourth non-conductive portion (2424b), a fifth non-conductive portion (2425b), and / or a sixth non-conductive portion (2426b). The first non-conductive portion (2421b) may be positioned between the first conductive portion (2411b) and the second conductive portion (2412b). The second non-conductive portion (2422b) may be positioned between the second conductive portion (2412b) and the third conductive portion (2413b). The third non-conductive portion (2423b) may be positioned between the third conductive portion (2413b) and the fourth conductive portion (2414b). The fourth non-conductive portion (2424b) may be positioned between the fourth conductive portion (2414b) and the fifth conductive portion (2415b). The fifth non-conductive portion (2425b) may be positioned between the fifth conductive portion (2415b) and the sixth conductive portion (2416b). The sixth non-conductive portion (2426b) may be positioned between the sixth conductive portion (2416b) and the seventh conductive portion (2417b).

[0244] According to one embodiment, a radiator (230) may be disposed in a space between a fourth conductive portion (2414a) of a first housing part (2310) and a first support portion (2401). The radiator (230) may include a loop-shaped conductor. When the electronic device (101) is viewed in one direction (e.g., in the (+) z-axis direction), the radiator (230) may be disposed in a space between the fourth conductive portion (2414a) of the first housing part (2310) and the first support portion (2401). The electronic device (101) may include a component (240) (e.g., a capacitor) and / or a component (2440) (e.g., an inductor) connected to the fourth conductive portion (2414a). The element (240) and the element (2440) can be connected to the ground (245) (which can be connected to the PCB ground to have the same potential, even though the actual connected physical parts are different). For example, the element (240) and the element (2440) can be placed on a PCB (not shown) on the first support portion (2401). Through the ground (245), a loop (hereinafter, a metal loop) according to the element (240), the fourth conductive portion (2414a), the element (2440), and the ground (245) can be formed. The metal loop can be formed to include the loop of the radiator (230). As current flows in the loop of the radiator (230), current can flow in the metal loop. To control the direction of the current, the element (240), the fourth conductive portion (2414a), and the element (2440) can function as a resonant circuit (2471). As the resonant frequency of the resonant circuit (2471) is higher than the frequency of NFC communication by a certain range, the rotational direction of the current flowing in the loop (e.g., metal loop) of the resonant circuit (2471) may be the same as the rotational direction of the current flowing in the loop of the radiator (230).

[0245] According to one embodiment, the second housing part (2320) may include an opening (2430) (e.g., a slot, a slit, an opening, or a void, which may be referred to by the same terms) having a certain size or larger. The opening (2430) represents a space between the fourth conductive portion (2414b) and the second support portion (2402). The second metal bracket of the second housing part (2320) may include an opening (2430) that penetrates in a direction perpendicular to a magnetic flux plane of the loop of the radiator (230) when the electronic device (101) is in a folded state. When the electronic device (101) is in a folded state, the magnetic flux inside the loop of the radiator (230) may pass through the opening (2430). As the area of ​​the metal portion coupled to the radiator (230) increases, the coupling amount may increase. An increase in the coupling amount may increase the coverage of NFC communication. The second housing part (2320) may include an element (2441) (e.g., an inductor) and an element (2442) (e.g., a capacitor) to form an additional loop in addition to the loop including the fourth conductive portion (2414b). The elements (2441) and (2442) may be connected to a ground (2445). For example, the elements (2441) and (2442) may be placed on a PCB (not shown) on the second support part (2402). A loop may be formed according to the element (2441), the fourth conductive portion (2414b), the element (2442), and the ground (2445). A magnetic flux plane may be formed within the second housing part (2320) in a folded state according to the loop. Due to the magnetic field of the current flowing in the radiator (230), a current may flow in the metal loop. To control the direction of the current, the element (2441), the fourth conductive portion (2414b), and the element (2442) can function as a resonant circuit (2472).

[0246] Referring to Fig. 24b, a folded state of the electronic device (101) of Fig. 24a is illustrated. Fig. 24b is a drawing of the electronic device (101) in the folded state when viewed in one direction (e.g., in the (-) x-axis direction). As signals of NFC communication are provided to the radiator (230), when the electronic device (101) is viewed in one direction, the direction (2495) of the current flowing in the conductor of the radiator (230) may be a first direction (e.g., in the (+) y-axis direction). The magnetic flux of the radiator (230) may pass through the closed surface of the loop in one direction (e.g., in the (+) z-axis direction based on the folded state). According to the resonant circuit (2471), the direction (2491) of the current flowing in the fourth conductive portion (2414a) of the first housing part (2310) may be a first direction (e.g., in the (+) y-axis direction). The magnetic flux due to the current can pass through the magnetic flux surface of the loop formed by the element (240), the fourth conductive portion (2414a), the element (2440), and the ground (245) in one direction (e.g., the (-) z-axis direction). The direction (2492) of the current flowing in the fourth conductive portion (2414b) of the second housing part (2320) according to the resonant circuit (2472) can be the first direction (e.g., the (-) y-axis direction). The magnetic flux due to the current can pass through the magnetic flux surface of the loop formed by the element (2441), the fourth conductive portion (2414b), the element (2442), and the ground (2445) in one direction (e.g., the (-) z-axis direction). As the magnetic flux directions of the loop including the radiator (230), the loop including the resonant circuit (2471), and the loop including the resonant circuit (2472) are aligned, the coverage of NFC communication can increase compared to the coverage when using the radiator (230) without the resonant circuit (2471) and the resonant circuit (2472).

[0247] In FIGS. 24A and 24B , elements (240) and (2440) are illustrated for the resonant circuit (2471), but embodiments of the present disclosure are not limited thereto. As a non-limiting example, element (2440) may be omitted. For example, elements (2441) and (2442) are illustrated for the resonant circuit (2472), but embodiments of the present disclosure are not limited thereto. As a non-limiting example, element (2442) may be omitted.

[0248] Referring to FIG. 24c, the electronic device (101) may include an element (240) (e.g., a capacitor) connected to a fourth conductive portion (2414a) of the first housing part (2310). The fourth conductive portion (2414a) of the first housing part (2310) may be directly connected to the ground through a connecting member (e.g., a C-clip or a metal sheet) without a separate centralized element (e.g., element (2440)). For example, the fourth conductive portion (2414a) of the first housing part (2310) may be directly connected to the first support portion (2401) of the first metal bracket or to the ground (245) on the PCB through the connecting member. The electronic device (101) may include an element (2441) (e.g., a capacitor) connected to a fourth conductive portion (2414b) of the second housing part (2320). The fourth conductive portion (2414b) of the second housing part (2320) may be directly connected to the ground through a connecting member (e.g., a C-clip or a metal sheet) without a separate centralized element (e.g., element (2442)). For example, the fourth conductive portion (2414b) of the second housing part (2320) may be directly connected to the second support portion (2402) of the second metal bracket through the connecting member or may be connected to the ground (2445) on the PCB.

[0249] In FIGS. 24a, 24b, and 24c, in describing a foldable electronic device to explain the direction of current, it is exemplified that the non-conductive portions (e.g., the third non-conductive portion (2423b) or the fourth non-conductive portion (2424b)) of the second housing part (2320) are aligned with the non-conductive portions (e.g., the third non-conductive portion (2423a) or the fourth non-conductive portion (2424a)) of the first housing part (2310) in one direction (e.g., the z-axis direction). As a non-limiting example, the point of the fourth conductive portion (2414a) of the first housing part (2310) to which the element (240) is connected and the point of the fourth conductive portion (2414b) of the second housing part (2320) to which the element (2441) is connected may be aligned in one axis (e.g., the z-axis). Additionally, the point of the fourth conductive portion (2414a) to which the element (2440) is connected and the point of the fourth conductive portion (2414b) to which the element (2442) is connected may be aligned along an axis (e.g., the z-axis). As the connecting points are aligned, the amount of magnetic flux that is unnecessarily leaked is reduced, thereby improving NFC communication performance.

[0250] While the preceding embodiments have described examples in which connection points or non-conductive portions are aligned, the embodiments of the present disclosure are not limited thereto. Even if at least some of the non-conductive portions of the first housing part (2310) are not aligned with the non-conductive portions of the second housing part (2320), if the loop formed through the point of connection with each element includes the loop of the radiator (230), it can be understood as an embodiment of the present disclosure.

[0251] FIGS. 25a, 25b, 25c, and 25d illustrate examples of bar-type electronic devices (e.g., electronic devices (101)) including a resonant circuit and an antenna for NFC communication in various segmented structures.

[0252] Referring to FIG. 25A, the electronic device (101) may have an upper three-segment structure. The electronic device (101) may include a metal bracket (e.g., the metal bracket (200) of FIG. 2). The metal bracket may include a support portion (201) and a plurality of conductive portions. The plurality of conductive portions may include a first conductive portion (2511), a second conductive portion (2512), a third conductive portion (2513), a fourth conductive portion (2514), and / or a fifth conductive portion (2515). The electronic device (101) may include a plurality of non-conductive portions. The plurality of non-conductive portions may include a first non-conductive portion (2521), a second non-conductive portion (2522), a third non-conductive portion (2523), and / or a fourth non-conductive portion (2524). The first non-conductive portion (2521) may be disposed between the first conductive portion (2511) and the second conductive portion (2512). The second non-conductive portion (2522) may be disposed between the second conductive portion (2512) and the third conductive portion (2513). The third non-conductive portion (2523) may be disposed between the third conductive portion (2513) and the fourth conductive portion (2514). The fourth non-conductive portion (2523) may be disposed between the fourth conductive portion (2514) and the fifth conductive portion (2515).

[0253] According to one embodiment, a radiator (230) may be disposed in a space between the third conductive portion (2513) and the support portion (201). The radiator (230) may include a loop-shaped conductor. When the electronic device (101) is viewed in one direction (e.g., the (+) z-axis direction), the radiator (230) may be disposed in a space between the third conductive portion (2513) and the support portion (201). The electronic device (101) may include a component (240) (e.g., a capacitor) connected to the third conductive portion (2513). One point of the third conductive portion (2513) may be connected to the ground (245) through the component (240), and another point may be directly connected to the ground (245) (even if the actual physical parts to be connected are different, they may be connected to the PCB ground to have the same potential). For example, the element (240) may be placed on a PCB (not shown) on the support portion (201). Through the ground (245), a loop (hereinafter, a metal loop) may be formed by coupling in a slot area formed according to the element (240), the third conductive portion (2513), and the ground (245). The metal loop may be formed to surround the loop of the radiator (230). As current flows in the loop of the radiator (230), current may flow in the metal loop. In order to control the direction of the current, the element (240) and the third conductive portion (2513) may function as a resonant circuit (2571). As the resonant frequency of the resonant circuit (2571) is higher than the frequency of NFC communication by a certain range, the rotational direction of the current flowing in the metal loop of the resonant circuit (2571) may be the same as the rotational direction of the current flowing in the loop of the radiator (230).

[0254] Referring to FIG. 25B, the electronic device (101) may have an upper two-segment structure. The electronic device (101) may include a metal bracket (e.g., the metal bracket (200) of FIG. 2). The metal bracket may include a support portion (201) and a plurality of conductive portions. For example, the plurality of conductive portions may include a first conductive portion (2581), a second conductive portion (2582), a third conductive portion (2583), and / or a fourth conductive portion (2584). For example, the electronic device (101) may include a plurality of non-conductive portions. The plurality of non-conductive portions may include a first non-conductive portion (2591), a second non-conductive portion (2592), and / or a third non-conductive portion (2593). The first non-conductive portion (2591) may be disposed between the first conductive portion (2581) and the second conductive portion (2582). The second non-conductive portion (2592) may be disposed between the second conductive portion (2582) and the third conductive portion (2583). The third non-conductive portion (2593) may be disposed between the third conductive portion (2583) and the fourth conductive portion (2584).

[0255] According to one embodiment, a radiator (230) may be disposed in a space between the third conductive portion (2583) and the support portion (201). The radiator (230) may include a loop-shaped conductor. When the electronic device (101) is viewed in one direction (e.g., in the (+) z-axis direction), the radiator (230) may be disposed in the space between the third conductive portion (2583) and the support portion (201). The electronic device (101) may include an element (240) (e.g., a capacitor) connected to the third conductive portion (2583). The element (240) may be connected to a point (2599a) of the third conductive portion (2583). For example, the element (240) may be disposed on a PCB (not shown) on the support portion (201). The element (240) may be connected to a ground (245). A point (2599b) of the third conductive portion (2583) may be connected to the ground (245). A loop (hereinafter, a metal loop) may be formed between at least a portion of the third conductive portion (2583) (e.g., between the point (2599a) of the third conductive portion (2583) and the point (2599b) of the third conductive portion (2583)) and the support portion (201). Due to the current flowing in the loop of the radiator (230), when a magnetic field passing through the magnetic flux plane of the loop changes, a current may flow in the metal loop including the loop. In order to control the direction of the current flowing in the metal loop, at least a portion of the third conductive portion (2583) (e.g., between the point (2599a) of the third conductive portion (2583) and the point (2599b) of the third conductive portion (2583)) and the element (240) can function as a resonant circuit (2572). Since the resonant frequency of the resonant circuit (2572) is higher than the frequency of NFC communication by a certain range or more, the rotational direction of the current flowing in the metal loop of the resonant circuit (2572) can be the same as the rotational direction of the current flowing in the loop of the radiator (230).

[0256] Although FIGS. 25A and 25B illustrate a configuration in which the location of the conductive portion (e.g., the third conductive portion (2583)) to which the ground (245) is connected is on a side facing the top of the electronic device (101) (e.g., toward the (+) x-axis), the embodiments of the present disclosure are not limited thereto. Referring to FIG. 25C, for example, a point on a side facing the right side of the electronic device (101) (e.g., toward the (-) y-axis) may be connected to the ground (245). As an example, the ground (245) may be connected to a point (2599c) of the third conductive portion (2583). As the location to which the ground (245) is connected changes, the size of the metal loop (e.g., the outer loop) including the loop of the radiator (230) may change.

[0257] Although FIGS. 25a, 25b, and 25c illustrate a configuration in which the element (240) is connected to the third conductive portion (2583) on the left side (e.g., in the (+) y-axis direction) of the radiator (230), embodiments of the present disclosure are not limited thereto. Referring to FIG. 25d, for example, at a point (2599c) of the third conductive portion (2583), the third conductive portion (2583) may be connected to the element (240) via a connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern). The point (2599a) of the third conductive portion (2583) may be electrically connected to the ground (245) via the connecting member (e.g., a C-clip, a metal sheet, or a conductive pattern).

[0258] FIG. 26 illustrates an example of another ring-type electronic device (e.g., electronic device (101)) including a resonant circuit (e.g., resonant circuit (250)) and an antenna for NFC communication.

[0259] Referring to FIG. 26, the electronic device (101) may include a ring-shaped housing (2610). The housing (2610) may have an outer surface (2611) and an inner surface (2612). The housing (2610) may include a first conductive portion (2621) corresponding to the outer surface (2611) and a second conductive portion (2622) corresponding to the inner surface (2612). The interior of the second conductive portion (2622) is a space where a user's finger is worn, and the second conductive portion (2622) may include a ground (2645). A first point (2641) of the first conductive portion (2621) may be electrically connected to an element (240). The element (240) may be connected to the ground (2645). A second point (2642) of the first conductive portion (2621) can be electrically connected to a connecting member (2640). The connecting member (2640) can be connected to a ground (2645). At least a portion (2650) of the first conductive portion (2621) can correspond to a region between the first point (2641) and the second point (2642). A loop having an electrical path can be formed through at least a portion (2650) of the first conductive portion (2621) and at least a portion of the second conductive portion (2622) including the ground (2645).

[0260] According to one embodiment, the electronic device (101) may include a PCB (not shown). An NFC circuit (e.g., NFC circuit (220)) may be disposed on the PCB. The NFC circuit may be electrically connected to a radiator (230). The radiator (230) may include a wire having a loop shape. A closed surface formed by the wire may be substantially perpendicular to an axial direction (e.g., z-axis direction) of the ring-shaped housing (2610). For example, the loop of the radiator (230) may be disposed within a loop formed by at least a portion (2650) of a first conductive portion (2621) and at least a portion of a second conductive portion (2622) including a ground (2645), when the electronic device (101) is viewed in one direction (e.g., (-) x-axis). For example, the element (240) may include a capacitor. At least a portion (2650) of the first conductive portion (2621) may be understood as an inductor. The value (e.g., capacitance) of the element (240) and the electrical length of at least a portion (2650) of the first conductive portion (2621) may affect the current flowing in the first conductive portion (2621). A resonant circuit (2670) including the inductor and the capacitor may be used to control the direction of the current induced in the first conductive portion (2621). For example, if the current in the loop of the radiator (230) rotates clockwise, and the current in the metal loop also rotates clockwise according to the resonant circuit (2670), the magnetic flux directions of each of the two loops may be aligned. As the directions of the magnetic flux are aligned, the amount of magnetic flux passing through the closed surface may increase according to the overlapping loop structure. The recognition distance performance of the NFC communication of the electronic device (101) may be improved.

[0261] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a metal bracket (200) including a support portion (201) disposed inside the electronic device (101) and a conductive portion (202) connected to the support portion (201) and forming at least a portion of a housing of the electronic device (101); a printed circuit board (PCB) (205) disposed on the support portion (201); at least one element (240); a near field communication (NFC) circuit (220) disposed on the PCB (205); and a radiator (230) forming a loop and electrically connected to the NFC circuit (220). The loop of the radiator (230) may be disposed in a space between at least a portion of the support portion (201) and the conductive portion (202) when viewed in a direction perpendicular to the rear surface of the electronic device (101). The at least one element (240) may be arranged to electrically connect the conductive portion (202) and the ground (245) of the PCB (205). The at least one element (240) may be used to control the direction of a current induced from the radiator (230) to at least a portion of the conductive portion (202).

[0262] For example, a resonant frequency formed through at least one element (240) and at least a portion of the conductive portion (202) may be higher than an operating frequency of the NFC circuit (220). A direction of a current induced from the radiator (230) to at least a portion of the conductive portion (202) may be the same as a direction of a current flowing in a loop of the radiator (230). The at least one element (240) may include a capacitor.

[0263] For example, the electronic device (101) may include a connecting member arranged to contact a point of the conductive portion (202) and the PCB (205). A first end of the capacitor may be electrically connected to the connecting member via a transmission line on the PCB (205), and a second end of the capacitor may be electrically connected to a ground (245) on the PCB (205).

[0264] For example, the radiator (230) may be positioned within a loop formed along a slot area between the support portion (201) and the conductive portion (202), based on a point of the conductive portion (202) that contacts the connecting member.

[0265] For example, the electronic device (101) may include an electronic component (850); a flexible printed circuit board (FPCB) (842) coupled to the electronic component (850); a connector (841) configured to connect the FPCB (842) and the PCB (205); and a ferrite sheet. The radiator (230) may include a conductor surrounding the electronic component (850). The ferrite sheet may be disposed between the radiator (230) and the electronic component (850).

[0266] For example, the electronic component (850) may include a camera positioned to face the front of the electronic device (101).

[0267] For example, the electronic device (101) may include a plurality of elements; a switching circuit (830) configured to selectively connect one of the plurality of elements with the at least one element (240); and a non-NFC communication circuit (820). The non-NFC communication circuit (820) may be configured to radiate signals in a frequency band of non-NFC communication through the conductive portion (202). The switching circuit (830) may be controlled to connect a designated element (831) among the plurality of elements with the at least one element while a signal is transmitted or received through the NFC circuit (220). The switching circuit may be controlled to connect an element (832; 833; 834) among the plurality of elements with the at least one element (@40) while a signal is transmitted or received through the non-NFC communication circuit.

[0268] For example, the electronic device (101) may include a connecting member arranged to be in contact with a point of the conductive portion (202) and the PCB (205). The connecting member may be electrically connected to each of the non-NFC communication circuit on the PCB (205) and the at least one element on the PCB (205).

[0269] For example, the electronic device (101) may include a radio frequency (RF) switching circuit (1820). The RF switching circuit (1820) may be controlled to electrically connect the at least one element (240) and the ground (245) of the PCB (205) while the electronic device (101) operates in an NFC card mode or an NFC reader mode. The RF switching circuit (1820) may be controlled to electrically disconnect the at least one element (240) and the ground (245) of the PCB (205) while the electronic device (101) operates in a mode other than the NFC card mode and the NFC reader mode.

[0270] For example, the electronic device (101) may include a display (801). The radiator (230) may not overlap with the support portion (201), the conductive portion (202), and the PCB (205) when viewed in a direction perpendicular to the rear surface of the electronic device (101). The radiator (230) may overlap with the display when viewed in a direction perpendicular to the rear surface of the electronic device (101).

[0271] For example, the electronic device (101) may include a dielectric substrate (872); and a second radiator (230) disposed on the dielectric substrate (872). A first terminal of the NFC circuit (220) and a first end of the radiator (230) may be electrically connected, and a second terminal of the NFC circuit (220) and a second end of the radiator (230) may be electrically connected. A first terminal of the NFC circuit (220) and a first end of the second radiator (230) may be electrically connected, and a second terminal of the NFC circuit (220) and a second end of the second radiator (230) may be electrically connected. When viewed in a direction perpendicular to the rear surface of the electronic device (101), the radiator (230) may not overlap the support portion (201), and the second radiator (230) may overlap the support portion (201).

[0272] For example, the electronic device (101) may include a ferrite sheet. The second radiator (230) may be disposed on a first surface of the dielectric substrate (872). The ferrite sheet may be disposed on a second surface of the dielectric substrate (872) opposite to the first surface.

[0273] For example, when viewed in a direction perpendicular to the rear of the electronic device (101), the rotation direction from the first end of the radiator (230) to the second end of the radiator (230) may be the same as the rotation direction from the first end of the second radiator (230) to the second end of the second radiator (230).

[0274] For example, the electronic device (101) may include a first connecting member; and a second connecting member. The at least one element (240) may include an inductor and a capacitor. A first point of the conductive portion (202) may contact the PCB (205) through the first connecting member. A second point of the conductive portion (202) may contact the PCB (205) through the second connecting member. A first end of the capacitor may be electrically connected to the first connecting member, and a second end of the capacitor may be electrically connected to a ground (245) on the PCB (205). A first end of the inductor may be electrically connected to the second connecting member, and a second end of the inductor may be electrically connected to a ground (245) on the PCB (205).

[0275] In embodiments, an electronic device (101) is provided. The electronic device (101) may include: a hinge assembly; and a foldable housing including a first housing part (2010; 2200a; 2310) and a second housing part (2020; 2200b; 2320) rotatably connected to the hinge assembly; a first printed circuit board (PCB) disposed on the first housing part (2010; 2200a; 2310); a second PCB disposed on the second housing part (2020; 2200b; 2320); at least one first element disposed on the first PCB; at least one second element disposed on the second PCB; an NFC circuit disposed on the first PCB; and an radiator electrically connected to the NFC circuit within the first housing part (2010; 2200a; 2310) and forming a loop. The first housing part (2010; 2200a; 2310) may include a first support portion disposed inside the first housing part and a first conductive portion connected to the first support portion and at least partially exposed to the outside of the first housing part. The second housing part (2020; 2200b; 2320) may include a second support portion disposed inside the second housing part (2020; 2200b; 2320) and a second conductive portion connected to the second support portion and at least partially exposed to the outside of the electronic device (101). The loop of the radiator may be disposed in a space between the first support portion and at least a portion of the first conductive portion within the first housing part (2010; 2200a; 2310). When the foldable housing is unfolded and viewed in a direction perpendicular to the rear surface of the first housing part (2010; 2200a; 2310), the radiator may not be positioned in a space between at least a portion of the second support part and the second conductive part.When the foldable housing is folded, and when viewed in a direction perpendicular to the rear surface of the first housing part (2010; 2200a; 2310), the radiator can be positioned in a space between at least a portion of the second support part and the second conductive part.

[0276] For example, the at least one first element may be arranged to electrically connect the first conductive portion and the ground of the first PCB. The at least one second element may be arranged to electrically connect the second conductive portion and the ground of the second PCB.

[0277] For example, the electronic device (101) may include an electronic component disposed within the first housing part; a flexible printed circuit board (FPCB) coupled to the electronic component within the first housing part; a connector configured to connect the FPCB and the PCB; and a ferrite sheet. The radiator may include a conductor surrounding the electronic component. The ferrite sheet may be disposed between the radiator and the electronic component.

[0278] For example, the at least one first element may include a first capacitor. The at least one second element may include a second capacitor. When the foldable housing is unfolded and viewed in a direction perpendicular to the rear surface of the first housing part, the first capacitor may be located on a first side with respect to the radiator, and the second capacitor may be located on a second side opposite to the first side with respect to the radiator. When the foldable housing is folded and viewed in a direction perpendicular to the rear surface of the first housing part, the first capacitor and the second capacitor may be located on the first side with respect to the radiator.

[0279] For example, the at least one first element may further include a first inductor. The at least one second element may further include a second inductor. When the foldable housing is unfolded and viewed in a direction perpendicular to the rear surface of the first housing part, the first inductor may be positioned on the second side with respect to the radiator, and the second inductor may be positioned on the first side with respect to the radiator. When the foldable housing is folded and viewed in a direction perpendicular to the rear surface of the first housing part, the first inductor and the second inductor may be positioned on the second side with respect to the radiator.

[0280] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a ring-shaped housing (2610) having an outer surface (2611) and an inner surface (2612), the ring-shaped housing (2610) may include a first conductive portion (2621) corresponding to the outer surface (2611) and a second conductive portion (2622) corresponding to the inner surface (2612), a printed circuit board (PCB) disposed within the ring-shaped housing (2610); an element configured to electrically connect a first point of the first conductive portion (2621) to a first point of the second conductive portion (2622); a connecting member configured to connect a second point of the first conductive portion (2621) to a second point of the second conductive portion (2622); an NFC (near field communication) circuit disposed on the PCB; And it may include a radiator connected to the NFC circuit within the ring-shaped housing (2610). The radiator may be disposed between at least a portion of the first conductive portion (2621) between the first point of the first conductive portion (2621) and the second point of the first conductive portion (2621) when viewed in the axial direction of the ring-shaped housing (2610) and at least a portion of the second conductive portion (2622) between the second point of the second conductive portion (2622) and the second point of the second conductive portion.

[0281] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0282] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0283] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0284] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0285] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0286] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A metal bracket comprising a supporting portion disposed inside the electronic device and a conductive portion connected to the supporting portion and forming at least a portion of a housing of the electronic device; A printed circuit board (PCB) placed on the above support portion; At least one element; NFC (near field communication) circuit placed on the above PCB; comprising a radiator forming a loop, electrically connected to the NFC circuit; The loop of the above radiator is disposed in a space between the support portion and at least a portion of the conductive portion when viewed in a direction perpendicular to the rear surface of the electronic device, wherein at least one of the elements is arranged to electrically connect the conductive portion and the ground of the PCB, wherein said at least one element is used to control the direction of a current induced from said radiator to at least a portion of said conductive portion; Electronic devices.

2. In claim 1, The resonant frequency formed through at least one of the elements and at least a portion of the conductive portion is higher than the operating frequency of the NFC circuit, The direction of the current induced from the above radiator to at least a portion of the conductive portion is the same as the direction of the current flowing in the loop of the above radiator, wherein at least one of the elements comprises a capacitor, Electronic devices.

3. In claim 2, Further comprising a connecting member arranged to contact one point of the conductive portion and the PCB, A first end of the capacitor is electrically connected to the connecting member through a transmission line on the PCB, and a second end of the capacitor is electrically connected to a ground on the PCB. Electronic devices.

4. In claim 3, The above-mentioned radiator is arranged within a loop formed along a slot area between the supporting portion and the conductive portion, based on a point of the conductive portion that contacts the connecting member. Electronic devices.

5. In claim 1, electronic components; FPCB (flexible printed circuit board) combined with the above electronic components; A connector configured to connect the FPCB and the PCB; and Including more ferrite sheets, The above radiator includes a wire surrounding the electronic component, The above ferrite sheet is placed between the radiator and the electronic component. Electronic devices.

6. In claim 5, the electronic component includes a camera arranged to face the front of the electronic device. Electronic devices.

7. In claim 1, Multiple elements; A switching circuit configured to selectively connect one of the plurality of elements to the at least one element; and Further including non-NFC communication circuitry, The above non-NFC communication circuit is configured to radiate signals in the frequency band of non-NFC communication through the conductive portion, The switching circuit is controlled to connect a designated element among the plurality of elements to at least one element while a signal is transmitted or received through the NFC circuit, The switching circuit is controlled to connect an element other than the designated element among the plurality of elements to the at least one element while a signal is transmitted or received through the non-NFC communication circuit. Electronic devices.

8. In claim 7, Further comprising a connecting member arranged to contact one point of the conductive portion and the PCB, The connecting member is electrically connected to each of the non-NFC communication circuit on the PCB and the at least one element on the PCB. Electronic devices.

9. In claim 1, Further comprising an RF (radio frequency) switching circuit, The above RF switching circuit: While the electronic device is operating in NFC card mode or NFC reader mode, the at least one element is controlled to electrically connect the ground of the PCB, While the electronic device is operating in a mode other than the NFC card mode and the NFC reader mode, the at least one element is controlled to electrically disconnect the ground of the PCB. Electronic devices.

10. In claim 1, Including more displays, The above radiator, when viewed in a direction perpendicular to the rear surface of the electronic device, does not overlap the support portion, the conductive portion, and the PCB. The above radiator overlaps the display when viewed in a direction perpendicular to the rear of the electronic device. Electronic devices.

11. In claim 1, dielectric substrate; and Further comprising a second radiator disposed on the dielectric substrate, The first terminal of the NFC circuit and the first end of the emitter are electrically connected, and the second terminal of the NFC circuit and the second end of the emitter are electrically connected, The first terminal of the NFC circuit and the first end of the second emitter are electrically connected, and the second terminal of the NFC circuit and the second end of the second emitter are electrically connected, The above-mentioned radiator does not overlap the support portion when viewed in a direction perpendicular to the rear surface of the electronic device, and the second radiator overlaps the support portion. Electronic devices.

12. In claim 11, Including more ferrite sheets, The second radiator is disposed on the first surface of the dielectric substrate, The above ferrite sheet is disposed on a second surface opposite to the first surface of the dielectric substrate, Electronic devices.

13. In claim 11, When viewed in a direction perpendicular to the rear surface of the electronic device, the direction of rotation from the first end of the radiator to the second end of the radiator is the same as the direction of rotation from the first end of the second radiator to the second end of the second radiator. Electronic devices.

14. In claim 1, first connecting member; and Including a second connecting member, wherein at least one of the elements comprises an inductor and a capacitor, The first point of the above conductive portion contacts the PCB through the first connecting member, The second point of the above conductive portion is in contact with the PCB through the second connecting member, A first end of the capacitor is electrically connected to the first connecting member, and a second end of the capacitor is electrically connected to a ground on the PCB. The first end of the inductor is electrically connected to the second connecting member, and the second end of the inductor is electrically connected to the ground on the PCB. Electronic devices.

15. In electronic devices, hinge assembly; and A foldable housing comprising a first housing part and a second housing part rotatably connected to the hinge assembly; A first PCB (printed circuit board) disposed on the first housing part; A second PCB placed on the second housing part; At least one first element disposed on the first PCB; At least one second element disposed on the second PCB; An NFC circuit arranged on the first PCB; and Including an emitter electrically connected to the NFC circuit within the first housing part and forming a loop; The first housing part includes a first support portion disposed inside the first housing part and a first conductive portion connected to the first support portion and at least partially exposed to the outside of the first housing part, The second housing part includes a second supporting portion disposed inside the second housing part and a second conductive portion connected to the second supporting portion and at least partially exposed to the outside of the electronic device, The loop of the radiator is disposed in a space between at least a portion of the first support portion and the first conductive portion within the first housing part, When the foldable housing is unfolded and viewed in a direction perpendicular to the rear surface of the first housing part, the radiator is not disposed in the space between the second support part and at least a portion of the second conductive part, When the foldable housing is folded and viewed in a direction perpendicular to the rear surface of the first housing part, the radiator is disposed in a space between at least a portion of the second support part and the second conductive part. Electronic devices.

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