Semiconductor inspection device

Abstract

A collet (5) clamps the upper surface of a semiconductor element (1). An inspection jig (11) has an inspection terminal (12) connected to an electrode on the lower surface of the semiconductor element (1), and a GND block (13) in contact with the lower surface of the semiconductor element (1). A first heat dissipation mechanism (14) dissipates heat from the inspection jig (11). A second heat dissipation mechanism (16) dissipates heat from the collet (5).

Description

Semiconductor inspection equipment

[0001] The present disclosure relates to a semiconductor inspection apparatus used to inspect the characteristics of semiconductor elements.

[0002] In conventional semiconductor inspection devices, the GND pattern on the underside of the semiconductor element is brought into contact with a GND block to dissipate heat generated during inspection (see, for example, Patent Document 1).

[0003] Japanese Patent Application Publication No. 2019-86425

[0004] Conventional semiconductor inspection equipment can dissipate heat from semiconductor elements with a backside cooling structure in which a heat sink such as a GND pattern is provided on the underside of the element, but it cannot ensure heat dissipation from semiconductor elements with a topside cooling structure in which a heat sink is provided on the top side of the element.

[0005] The present disclosure has been made to solve the above-mentioned problems, and its purpose is to obtain a semiconductor inspection device that can ensure heat dissipation during characteristic inspection regardless of whether the heat dissipation surface of the semiconductor element is the top or bottom surface.

[0006] The semiconductor inspection device according to the present disclosure is characterized by comprising an inspection jig having a collet that adsorbs the upper surface of a semiconductor element, an inspection terminal that is connected to an electrode on the lower surface of the semiconductor element, and a GND block that contacts the lower surface of the semiconductor element, a first heat dissipation mechanism that dissipates heat from the inspection jig, and a second heat dissipation mechanism that dissipates heat from the collet.

[0007] In the present disclosure, not only is a first heat dissipation mechanism provided on the inspection jig that contacts the underside of the semiconductor element, but a second heat dissipation mechanism is also provided on the collet that adsorbs the top surface of the semiconductor element, thereby ensuring heat dissipation during characteristic inspection regardless of whether the heat dissipation surface of the semiconductor element is the top or bottom.

[0008] 1. A cross-sectional view showing a semiconductor element with a backside heat dissipation structure. 2. A cross-sectional view showing a semiconductor element with a topside cooling structure. 3. A cross-sectional view showing a semiconductor inspection device according to embodiment 1. 4. A bottom view showing a suction portion of a collet. 5. A cross-sectional view showing a semiconductor inspection device according to embodiment 1. 6. A cross-sectional view showing a semiconductor inspection device according to embodiment 1. 7. A cross-sectional view showing a semiconductor inspection device according to embodiment 1. 8. A cross-sectional view showing a modified example of the semiconductor inspection device according to embodiment 1. 9. A bottom view showing a modified example of the suction portion of the collet. 10. A cross-sectional view showing a modified example of the semiconductor inspection device according to embodiment 1. 11. A cross-sectional view showing a semiconductor inspection device according to embodiment 2. 12. A cross-sectional view showing a semiconductor inspection device according to embodiment 3. 13. A cross-sectional view showing a semiconductor inspection device according to embodiment 3. 14. A cross-sectional view showing a semiconductor inspection device according to embodiment 4. 15. A cross-sectional view showing a semiconductor inspection device according to embodiment 4. 16. A cross-sectional view showing a semiconductor inspection device according to embodiment 5. 17. A cross-sectional view showing a semiconductor inspection device according to embodiment 5. 18. A cross-sectional view showing a semiconductor inspection device according to embodiment 6. 19. A cross-sectional view showing a semiconductor inspection device according to embodiment 7.

[0009] A semiconductor inspection device according to an embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0010] 1 is a cross-sectional view showing a semiconductor element with a backside heat dissipation structure. The semiconductor element 1 is, for example, a GaN high-frequency device. An electrode 2 and a GND pattern 3 are provided on the bottom surface of the semiconductor element 1. The electrode 2 is an input terminal, output terminal, power supply terminal, etc. of the semiconductor element 1. The GND pattern 3 is not only connected to the GND potential but also functions as a heat sink that dissipates heat from the semiconductor element 1.

[0011] 2 is a cross-sectional view showing a semiconductor element with a top-side cooling structure. In a semiconductor element with a top-side cooling structure, a heat sink 4 is provided on the top surface of the semiconductor element 1. Because the product number and other information are printed on the heat sink 4 on the top surface of the semiconductor element 1, the top surface of the element is sometimes called the front surface and the bottom surface of the element is sometimes called the back surface. An electrode 2 is provided on the bottom surface of the semiconductor element 1, but a GND pattern 3 is not provided.

[0012] Figures 3 and 5 to 7 are cross-sectional views showing the semiconductor inspection device according to the first embodiment. Figure 3 shows the state in which a semiconductor element 1 with a backside heat dissipation structure has been picked up. Figure 4 is a bottom view showing the suction portion of the collet. Collet 5 has suction portion 6 that suctions semiconductor element 1. A suction hole 7 is provided in the center of the underside of suction portion 6 of collet 5. An external vacuum pump applies suction through suction hole 7 via vacuum pipe 8. This causes collet 5 to suction the top surface of semiconductor element 1. The upper end of collet 5 is attached to pressing jig 10 via spring 9. Pressing jig 10 presses down collet 5. Conventional collets are made of resin and have low thermal conductivity, but collet 5 of this embodiment is a metal collet made of Cu or the like, which has high thermal conductivity.

[0013] The inspection jig 11 has an inspection terminal 12 and a GND block 13. A heat sink 15 is thermally connected to the GND block 13 as a first heat dissipation mechanism 14. The first heat dissipation mechanism 14 dissipates heat from the inspection jig 11. A plurality of heat dissipation fins 17 are provided on the upper surface of the flat suction part 6 as a second heat dissipation mechanism 16. The second heat dissipation mechanism 16 dissipates heat from the collet 5.

[0014] 5 shows a state in which a semiconductor element 1 with a back surface heat dissipation structure is pressed against an inspection jig 11. The characteristics of the semiconductor element 1 are inspected by electrically connecting inspection terminals 12 of the inspection jig 11 to electrodes 2 of the semiconductor element 1. A GND block 13 contacts the GND pattern 3 on the underside of the semiconductor element 1. Heat absorbed by the GND block 13 from the underside of the semiconductor element 1 is dissipated by a heat sink 15.

[0015] Figure 6 shows the state in which a semiconductor element 1 with a top-side cooling structure has been picked up. Figure 7 shows the state in which a semiconductor element 1 with a top-side cooling structure is being pressed against an inspection jig 11. The collet 5 comes into contact with the heat sink 4 on the top surface of the semiconductor element 1. The heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated by the heat dissipation fins 17.

[0016] As described above, in this embodiment, not only is the inspection jig 11 that contacts the underside of the semiconductor element 1 provided with the first heat dissipation mechanism 14, but the collet 5 that suctions the top surface of the semiconductor element 1 is also provided with the second heat dissipation mechanism 16. This ensures heat dissipation during characteristic inspection whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Therefore, whether the semiconductor element 1 has a backside heat dissipation structure or a topside cooling structure, it can be inspected at a constant temperature using a single semiconductor inspection device.

[0017] 8 and 10 are cross-sectional views showing modified examples of the semiconductor inspection device according to embodiment 1. Fig. 8 shows a state in which the semiconductor element 1 has been picked up, and Fig. 10 shows a state in which the semiconductor element 1 is being pressed against an inspection jig 11.

[0018] The collet 5 has a suction portion 6 that suctions the semiconductor element 1, and an overhanging portion 18 that overhangs the side of the suction portion 6. The width of the suction portion 6 that protrudes downward in a convex shape is approximately the same as the width of the semiconductor element 1. Heat dissipation fins 17 are provided on the overhanging portion 18 as a second heat dissipation mechanism 16. Providing the overhanging portion 18 increases the heat capacity of the collet 5 and also ensures an area for providing the heat dissipation fins 17. Heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated by the heat dissipation fins 17 via the overhanging portion 18.

[0019] 9 is a bottom view showing a modified example of the suction portion of the collet. Heat-conductive rubber 19 is provided on the underside of the suction portion 6 of the collet 5 that contacts the upper surface of the semiconductor element 1. The heat-conductive rubber 19 can absorb the tilt of the semiconductor element 1 relative to the inspection jig. Note that the heat-conductive rubber 19 may also be provided on the collet 5 of other embodiments.

[0020] 11 is a cross-sectional view showing a semiconductor inspection device according to embodiment 2. As the second heat dissipation mechanism 16, a circulation mechanism 20 is provided that circulates dry air or cooling water inside the collet 5. The circulation mechanism 20 is a flexible hose, and moves in accordance with the up and down movement of the collet 5.

[0021] The heat absorbed by the GND block 13 from the bottom surface of the semiconductor element 1 is dissipated by the heat sink 15. The heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated by the circulation mechanism 20. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Other configurations and effects are the same as those of the first embodiment.

[0022] 12 to 14 are cross-sectional views showing a semiconductor inspection device according to a third embodiment. Figures 12 and 13 show a semiconductor element 1 having a backside heat dissipation structure, while Figure 14 shows a semiconductor element 1 having a topside cooling structure. Figure 12 shows a state in which the semiconductor element 1 has been picked up. Figures 13 and 14 show a state in which the semiconductor element 1 is pressed against an inspection jig 11.

[0023] The first heat dissipation mechanism 14 has a heat sink 15 and a vapor chamber 21 that thermally connects the GND block 13 and the heat sink 15. The second heat dissipation mechanism 16 has a heat sink 22 and a vapor chamber 23 that thermally connects the collet 5 and the heat sink 22.

[0024] Heat absorbed by the GND block 13 from the underside of the semiconductor element 1 is dissipated from the heat sink 15 via the vapor chamber 21. Heat absorbed by the collet 5 from the upper surface of the semiconductor element 1 is dissipated from the heat sink 22 via the vapor chamber 23. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the upper or lower surface. Furthermore, the use of the vapor chambers 21 and 23 increases the design freedom for the placement of the heat sinks 15 and 22. Other configurations and effects are the same as those of the first embodiment.

[0025] 15 and 16 are cross-sectional views showing a semiconductor inspection device according to embodiment 4. Fig. 15 shows a semiconductor element 1 having a backside heat dissipation structure, and Fig. 16 shows a semiconductor element 1 having a topside cooling structure. Both figures show a state in which the semiconductor element 1 is pressed against an inspection jig 11.

[0026] The first heat dissipation mechanism 14 further includes a Peltier cooler 24 provided between the GND block 13 and the heat sink 15. The Peltier cooler 24 promotes heat transfer from the GND block 13 to the heat sink 15, further improving the heat dissipation capacity of the first heat dissipation mechanism 14.

[0027] A Peltier cooler 25 is provided between the collet 5 and the spring 9 as a second heat dissipation mechanism 16. The bottom surface of the Peltier cooler 25 contacts the collet 5, and heat dissipation fins 17 are provided on the top surface of the Peltier cooler 25. The Peltier cooler 25 promotes heat transfer from the collet 5 to the top surface side of the Peltier cooler 25, and the heat dissipation fins 17 dissipate the heat. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Other configurations and effects are the same as those of the first embodiment.

[0028] 17 and 18 are cross-sectional views showing a semiconductor inspection device according to embodiment 5. Fig. 17 shows a state in which a semiconductor element 1 has been picked up, and Fig. 18 shows a state in which the semiconductor element 1 is being pressed against an inspection jig 11.

[0029] The second heat dissipation mechanism 16 has an inclined portion 26 provided on the inspection jig 11 and a positioning plate 28 provided on the underside of the pressing jig 10 via rails 27. The positioning plate 28 is movable laterally along the rails 27. When the pressing jig 10 is lowered and the inclined surface of the positioning plate 28 is pressed against the inclined surface of the inclined portion 26, the positioning plate 28 moves laterally and comes into contact with the sides of the semiconductor element 1 and the collet 5. This allows the positioning plate 28 to position the semiconductor element 1. Heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated from the heat sink 15 via the thermally connected positioning plate 28, inclined portion 26, and inspection jig 11. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Other configurations and effects are the same as those of the first embodiment.

[0030] 19 and 20 are cross-sectional views showing a semiconductor inspection device according to embodiment 6. Fig. 19 shows a state in which a semiconductor element 1 has been picked up, and Fig. 20 shows a state in which the semiconductor element 1 is being pressed against an inspection jig 11.

[0031] A recess 29 is provided on the underside of the collet 5. Suction holes 7 are provided on the underside of the collet 5 outside the recess 29. A heat dissipation block 30 is provided in the recess 29 of the collet 5 as a second heat dissipation mechanism 16. The heat dissipation block 30 comes into contact with both the collet 5 and the semiconductor element 1 when the collet 5 adsorbs the semiconductor element 1. Heat is dissipated from the top surface of the semiconductor element 1 via the heat dissipation block 30 and the collet 5 that are in contact with each other.

[0032] Because the heat dissipation block 30 is independent of the suction function of the collet 5, a material with high thermal conductivity can be selected for the heat dissipation block 30. The heat dissipation block 30 is easy to process because it does not interfere with the vacuum piping of the collet 5. The other configurations and effects are the same as those of the first embodiment.

[0033] Seventh Embodiment Figure 21 is a cross-sectional view showing a semiconductor inspection device according to a seventh embodiment. The heat dissipation block 30 is water-cooled. A water pipe 31 circulates cold water inside the heat dissipation block 30. The water pipe 31 is a flexible hose, and moves in accordance with the vertical movement of the heat dissipation block 30 relative to the collet 5. This further improves the heat dissipation capacity of the heat dissipation block 30. The other configurations and effects are the same as those of the sixth embodiment.

[0034] REFERENCE SIGNS LIST 1 semiconductor element, 4 heat sink, 5 collet, 6 suction portion, 10 pressing jig, 11 inspection jig, 12 inspection terminal, 13 GND block, 14 first heat dissipation mechanism, 15 heat sink, 16 second heat dissipation mechanism, 17 heat dissipation fin, 18 protruding portion, 20 circulation mechanism, 23 vapor chamber, 25 Peltier cooler, 26 inclined portion, 28 positioning plate, 29 recessed portion, 30 heat dissipation block

Claims

1. A semiconductor inspection device comprising: an inspection jig having a collet that suctions the top surface of a semiconductor element; inspection terminals that connect to electrodes on the bottom surface of the semiconductor element; and a GND block that contacts the bottom surface of the semiconductor element; a first heat dissipation mechanism that dissipates heat from the inspection jig; and a second heat dissipation mechanism that dissipates heat from the collet.

2. The semiconductor inspection device according to claim 1, characterized in that when a heat sink is provided on the underside of the semiconductor element, the GND block comes into contact with the heat sink, and when the heat sink is provided on the top surface of the semiconductor element, the collet comes into contact with the heat sink.

3. A semiconductor inspection device according to claim 1 or 2, characterized in that the collet has a suction part that suctions the semiconductor element, and the second heat dissipation mechanism has heat dissipation fins provided on the upper surface of the suction part.

4. A semiconductor inspection device as described in claim 1 or 2, characterized in that the collet has a suction portion that suctions the semiconductor element and a protruding portion that protrudes from the side of the suction portion, and the second heat dissipation mechanism has heat dissipation fins provided on the protruding portion.

5. A semiconductor inspection device according to claim 1 or 2, characterized in that the second heat dissipation mechanism has a circulation mechanism for circulating dry air or cooling water inside the collet.

6. A semiconductor inspection device according to claim 1 or 2, wherein the second heat dissipation mechanism comprises a heat sink and a vapor chamber that thermally connects the collet and the heat sink.

7. A semiconductor inspection device according to claim 1 or 2, wherein the second heat dissipation mechanism has a Peltier cooler.

8. A semiconductor inspection device as described in claim 1 or 2, further comprising a pressing jig that presses down on the collet, wherein the second heat dissipation mechanism has an inclined portion provided on the inspection jig and a positioning plate that is provided on the underside of the pressing jig so as to be movable laterally and that positions the semiconductor element, and when the pressing jig is lowered and the positioning plate is pressed against the inclined portion, the positioning plate moves laterally and comes into contact with the semiconductor element and the side of the collet.

9. A semiconductor inspection device as described in claim 1 or 2, characterized in that a recess is provided on the underside of the collet, and the second heat dissipation mechanism has a heat dissipation block that is placed in the recess of the collet and comes into contact with both the collet and the semiconductor element when the collet adsorbs the semiconductor element.

10. The semiconductor inspection device according to claim 9, wherein the heat dissipation block is of a water-cooled type.

11. A semiconductor inspection device according to any one of claims 1 to 10, wherein the collet is a metal collet.

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