Wafer work device

Abstract

This wafer work device 100 comprises: a wafer work part 301; a rotation table part 306 including a mount part 306b, a holding part 306e that holds a frame Wf of a wafer We which is mounted on the mount part 306b, a rotation part 306c that rotates the mount part 306b, and a base part 306d that supports the rotation part 306c without rotating in accordance with driving of the rotation part 306c; and a switching drive part 305 that switches, to a release position Pr where holding of the frame Wf is released, the holding part 306e which is positioned at a holding position Pf where the frame Wf is held. The holding part 306e is disposed on the mount part 306b, and the switching drive part 305 is disposed on the base part 306d.

Description

Wafer Work Device

[0001] The present invention relates to a wafer working device, and more particularly to a wafer working device having a wafer working section that performs work on a wafer.

[0002] 2. Description of the Related Art Conventionally, there has been known a wafer working apparatus having a wafer working section for working on a wafer, such as that disclosed in Japanese Patent No. 5653183.

[0003] The above-mentioned Japanese Patent Publication No. 5653183 discloses a processing apparatus (wafer working apparatus) equipped with a cutting unit (wafer working section) that performs cutting processing on wafers. This processing apparatus includes the cutting unit, a chuck table, a frame clamp, and an air actuator.

[0004] The cutting unit of Japanese Patent No. 5653183 is configured to divide a wafer into multiple chips by cutting the wafer held by suction on a chuck table. Here, the wafer has multiple first streets and multiple second streets that are perpendicular to each other. The chuck table is configured to be movable horizontally and rotatable about a rotation axis that extends vertically. The frame clamp is configured to clamp (hold) an annular frame of the wafer held by suction on the chuck table. The air actuator is configured to move the frame clamp between a clamping position that holds the annular frame of the wafer and a release position that releases the clamp. The frame clamp and the air actuator are attached to the chuck table.

[0005] Patent No. 5653183

[0006] However, in the machining device disclosed in Japanese Patent No. 5653183, an air actuator that moves a frame clamp that holds the frame between a clamped position and a released position is attached to a rotating chuck table. This requires routing of piping to supply air to the air actuator attached to the rotating chuck table, making the frame holding structure complex. Therefore, it is desirable to prevent the frame holding structure from becoming too complicated, thereby preventing the device configuration from becoming too complex.

[0007] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a wafer working device that can prevent the structure for holding the annular frame from becoming complicated, thereby preventing the device configuration from becoming complicated.

[0008] A wafer working device according to one aspect of the present invention comprises a wafer working unit that performs work on a wafer placed inside a ring-shaped frame, a loading unit on which the wafer is placed when the wafer working unit performs work, a holding unit that holds the frame of the wafer placed on the loading unit, a rotating unit that rotates the loading unit, and a rotary table unit that includes a base unit that supports the rotating unit without rotating in conjunction with the drive of the rotating unit, and a switching drive unit that switches the holding unit, which is located at a holding position that holds the frame, to a release position that releases its hold on the frame, wherein the holding unit is located on the loading unit and the switching drive unit is located on the base unit.

[0009] In a wafer working apparatus according to one aspect of the present invention, as described above, the holding section is disposed on the mounting section, and the switching drive section is disposed on the base section. As a result, since the switching drive section is disposed on the base section that does not rotate, unlike when the switching drive section that moves the holding section that holds the annular frame between the holding position and the release position is attached to the rotating mounting section, there is no need to route components such as piping to the switching drive section that is attached to the rotating mounting section. This makes it possible to prevent the structure for holding the annular frame from becoming complicated, thereby preventing the apparatus configuration from becoming complicated.

[0010] In the wafer working device according to the above aspect, the switching drive unit preferably includes an abutment part that switches the holding part to the release position by moving in one direction while in contact with the holding part, and that moves in another direction opposite to the one direction when switching to the holding position. With this configuration, the holding part can be switched between the holding position and the release position simply by moving the abutment part back and forth between the one direction and the other direction opposite to the one direction, so that the structure of the switching drive unit for switching the holding part can be simplified.

[0011] In this case, preferably, the holding portion includes a biasing member that biases the holding portion toward the holding position, and the holding portion is configured to switch from the holding position to the release position against the biasing force of the biasing member when the switch drive portion moves the abutment portion in one direction. With this configuration, the holding portion can be maintained at the holding position with the biasing force of the biasing member keeping the abutment portion of the switch drive portion away from the holding portion, so that the wafer can be reliably held on the mounting portion when the rotating portion rotates the mounting portion.

[0012] In the wafer working device including the biasing member that biases the holding portion toward the holding position, the holding portion preferably includes a rotational movement conversion member that converts the linear movement of the abutting portion in one direction into rotational movement. Here, when the holding portion is positioned at the holding position, the wafer cannot be carried upward from the mounting portion by a suction head or the like, so the holding portion must be moved from above the annular frame. Therefore, by providing a rotational movement conversion member, the holding portion can be retracted from above the annular frame placed on the mounting portion simply by rotating the holding portion with the rotational movement conversion member, so that the annular frame on the mounting portion can be easily sucked by a suction head or the like.

[0013] In the wafer working device including the above-described pivotal movement conversion member, the pivotal movement conversion member preferably has a rotation axis offset from the abutment portion when viewed from one side. Here, if the rotation axis of the pivotal movement conversion member is positioned directly above the abutment portion when viewed from one side, the one-directional force applied from the abutment portion to the pivotal movement conversion member is converted into only one-directional force, and therefore no circumferential force about the rotation axis can be generated. Therefore, by abutting the abutment portion against the pivotal movement conversion member while offset from the rotation axis and linearly moving in one direction, a circumferential force about the rotation axis can be generated by the one-directional force of the abutment portion generated by the linear movement in one direction, thereby rotating the pivotal movement conversion member disposed on the mounting portion.

[0014] In this case, preferably, the pivotal movement conversion member is provided on the base portion side and includes an abutted surface against which the abutment portion abuts, and the pivotal movement conversion member rotates relative to the abutment portion moving in one direction while changing the contact position with the abutment portion on the abutted surface as the abutment portion moves in one direction. With this configuration, the contact position with the abutment portion on the abutted surface changes as the abutment portion moves in one direction, so that the pivotal movement conversion member can be rotated as the abutment portion moves in one direction, and therefore the linear movement of the abutment portion in one direction can be easily converted into pivotal movement by the abutment surface of the pivotal movement conversion member.

[0015] In a wafer working device including a rotational movement conversion member including an abutted surface against which the abutment portion abuts, the abutted surface is preferably formed so that the distance to the rotational axis of the rotational movement conversion member in the radial direction of the rotational axis of the rotational movement conversion member increases as the abutted surface approaches the base portion when the holding portion is placed in the holding position. With this configuration, the distance from the contact position with the abutment portion on the abutted surface to the rotational axis decreases, so that the abutted surface can easily convert linear movement of the abutment portion in one direction into rotational movement of the rotational movement conversion member.

[0016] In the wafer working device having a rotational movement conversion member including a contacted surface against which the contact portion contacts, the contact portion preferably includes a roller rotatable about a rotation axis extending parallel to the rotation axis of the rotational movement conversion member. With this configuration, the roller rotates in accordance with the rotation of the rotational movement conversion member, so that the contact position between the contact portion and the contacted surface can be smoothly changed.

[0017] In the wafer working device including the above-mentioned rotary movement conversion member, the rotary table preferably further includes a rotation angle sensor for detecting the rotation angle position of the rotating member, and further includes a control unit that controls, based on the detected value of the rotation angle sensor, to rotate the rotating member to a position where the abutment portion can abut against the rotary movement conversion member when the holding member is switched to the release position. With this configuration, the rotation angle position of the rotating member can be controlled so that the rotary movement conversion member is positioned at a position where the abutment portion can abut against the rotary movement conversion member, so that the abutment portion can reliably abut against the rotary movement conversion member when the holding member is switched to the release position.

[0018] In this case, preferably, the base further includes a detection unit for detecting whether the holding unit is disposed in the holding position, and the control unit is configured to rotate the rotating unit to a position where the abutment unit can abut against the rotational movement conversion member based on the detection value of the rotation angle sensor, and then determine whether the holding unit is disposed in the holding position based on the detection value of the detection unit. With this configuration, the detection unit can be used to detect a state where the holding unit is not disposed in the holding position, making it possible to detect an abnormality in the holding state of the holding unit (for example, a foreign object being trapped).

[0019] In the wafer working device including the rotational movement conversion member, the contact portion preferably includes a resin member, and the rotational movement conversion member preferably includes a metal member. With this configuration, the resin roller can reduce the impact and noise generated when the contact portion contacts the rotational movement conversion member.

[0020] According to the present invention, as described above, it is possible to prevent the structure for holding the annular frame from becoming complicated, and thus to prevent the device configuration from becoming complicated.

[0021] 5 is a plan view of a laser processing apparatus according to an embodiment; FIG. 6 is a plan view of a wafer before laser processing in the laser processing apparatus according to an embodiment; FIG. 7 is a block diagram showing a control configuration of the laser processing apparatus according to an embodiment; FIG. 8 is a perspective view of a chuck table unit of the laser processing apparatus according to an embodiment; FIG. 9 is a cross-sectional view taken along line V-V of FIG. 4; FIG. 10 is a cross-sectional view taken along line VI-VI of FIG. 5; FIG. 11 is a cross-sectional view showing a state in which the holding unit of the laser processing apparatus according to an embodiment is arranged at the release position; FIG. 12 is a cross-sectional view showing a contacted surface of a rotational movement conversion member of the holding unit of the laser processing apparatus according to an embodiment; FIG. 13 is a plan view showing a state in which the holding unit and the switching drive unit of the laser processing apparatus according to an embodiment are aligned; FIG. 14 is a side view showing a state in which the holding unit of the laser processing apparatus according to an embodiment is arranged at the holding position; FIG. 15 is a side view showing a state in which a foreign object is caught between a pressing unit of the holding unit and a frame of the laser processing apparatus according to an embodiment; FIG. 16 is a side view showing a state in which the abutment unit of the laser processing apparatus according to an embodiment abuts against a rotational movement conversion member; FIG. 17 is a side view showing a state in which the holding unit of the laser processing apparatus according to an embodiment is arranged at the release position; FIG. 18 is a side view showing a state in which the abutment unit of the laser processing apparatus according to an embodiment is in the middle of descending; FIG. 19 is a flowchart showing a wafer processing method by a control unit of the laser processing apparatus according to an embodiment.

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0023] The configuration of a laser processing apparatus 100 according to an embodiment of the present invention will be described with reference to Figures 1 to 15. The laser processing apparatus 100 is an example of the "wafer working apparatus" in the claims.

[0024] (Configuration of Laser Processing Apparatus) As shown in FIG. 1, the laser processing apparatus 100 is configured to form a modified layer inside the wafer We for dividing the wafer We.

[0025] The laser processing apparatus 100 includes a cassette unit 1, a wafer transport unit 2, a dicing unit 3, and a control unit 4.

[0026] Here, the up-down direction is the Z direction, the up direction is the Z1 direction, and the down direction is the Z2 direction. The horizontal direction perpendicular to the Z direction is the X direction, one side of the X direction is the X1 direction, and the other side of the X direction is the X2 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The Z1 direction is an example of "one direction" in the claims. The Z2 direction is an example of "another direction" in the claims.

[0027] The cassette unit 1 is configured to accommodate a plurality of cassettes each containing a wafer ring structure W, each of which includes a wafer We attached to a sheet member Wt (see FIG. 2) and a frame Wf. The frame Wf is annular. The wafer We is disposed inside the annular frame Wf.

[0028] The cassette unit 1 includes a plurality of cassette placement units 11 and a Z-direction movement mechanism 12 .

[0029] The multiple cassette placement units 11 include one cassette placement unit (not shown) and another cassette placement unit (not shown). A cassette containing multiple unprocessed wafers We is placed on one cassette placement unit. A cassette containing multiple processed wafers We is placed on another cassette placement unit. The Z-direction movement mechanism 12 is configured to move the multiple cassette units 1 integrally in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 12 includes, for example, a linear conveyor module or a drive unit including a ball screw and an encoder-equipped motor. A cassette containing multiple unprocessed wafers We may be placed on one cassette placement unit, and processed wafers We may be removed from one cassette placement unit and placed back at the same position. Similarly, other cassette loading sections may be loaded with cassettes containing multiple unprocessed wafers We, and processed wafers We may be removed from other cassette loading sections and loaded again at the same position from which they were removed.

[0030] The wafer transport unit 2 is configured to transport the wafer ring structure W between the cassette unit 1 and the dicing unit 3. Specifically, the wafer transport unit 2 has a clamp hand unit 21, a Y-direction movement mechanism 22, rail units 23 and 24, a transfer head unit 25, a transfer head unit 26, and a Z-direction movement mechanism 27.

[0031] The clamp hand unit 21 is configured to clamp the frame Wf of the wafer ring structure W and remove it from the cassette unit 1 or store it in the cassette unit 1. The clamp hand unit 21 is moved in the Y1 direction and the Y2 direction by a Y-direction movement mechanism 22. The Y-direction movement mechanism 22 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0032] The clamp hand unit 21 transports the wafer ring structure W removed from the cassette unit 1 to the rail unit 23 using the Y-direction movement mechanism 22. The clamp hand unit 21 transports the wafer ring structure W removed from the cassette unit 1 to the rail unit 24 using the Y-direction movement mechanism 22. The clamp hand unit 21 stores the processed wafer ring structure W placed on the rail unit 24 into the cassette unit 1 using the Y-direction movement mechanism 22.

[0033] Rail portion 23 is configured to support, from the Z2 direction, the wafer ring structure W placed by clamp hand portion 21. Rail portion 24 is configured to support, from the Z2 direction, the wafer ring structure W placed by clamp hand portion 21. Rail portion 23 and rail portion 24 are arranged side by side in this order from the Y2 direction side toward the Y1 direction side.

[0034] Each of the transfer and placement head units 25 and 26 is configured to adsorb the frame Wf of the wafer ring structure W. Each of the transfer and placement head units 25 and 26 is provided with an adsorption unit having suction holes or the like for adsorbing the frame Wf of the wafer ring structure W. The Z-direction movement mechanism 27 is configured to independently move each of the transfer and placement head units 25 and 26 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 27 includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0035] 1, the dicing unit 3 includes a laser irradiation unit 301, a Z-direction moving unit 302, a Y-direction moving unit 303, an X-direction moving unit 304, a switching drive unit 305 (see FIG. 3), a chuck table unit 306, a detection unit 307 (see FIG. 3), a low-magnification imaging unit 308, a high-magnification imaging unit 309, a Z-direction moving mechanism 310, and a frame 311. The laser irradiation unit 301 is an example of a "wafer working unit" in the claims. The chuck table unit 306 is an example of a "rotary table" in the claims.

[0036] The laser irradiation unit 301 is configured to irradiate a wafer We, on which a plurality of semiconductor chips Ch (see FIG. 2) are provided, with a laser beam to form a modified layer inside the wafer We. Specifically, the laser irradiation unit 301 is configured to irradiate the wafer We with a laser beam along each of a plurality of streets Ws (see FIG. 2) on the wafer We while moving the wafer We relative to the laser irradiation unit 301 using the chuck table unit 306. The laser irradiation unit 301 is attached to the frame 311 via a Z-direction moving unit 302. The Z-direction moving unit 302 is configured to move the laser irradiation unit 301 in each of the Z1 direction and the Z2 direction. The Z-direction moving unit 302 includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0037] The Y-direction moving unit 303 is configured to move the chuck table unit 306, the switching drive unit 305, and the detection unit 307 in the Y1 and Y2 directions, respectively. The Y-direction moving unit 303 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The X-direction moving unit 304 is configured to move the chuck table unit 306, the switching drive unit 305, and the detection unit 307 in the X1 and X2 directions, respectively. The X-direction moving unit 304 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0038] The X-direction moving section 304 is attached to the Y-direction moving section 303. As a result, the X-direction moving section 304 is moved in the Y1 direction and the Y2 direction by the Y-direction moving section 303.

[0039] The switching drive unit 305 is configured to switch the holding unit 306e, which will be described later and is positioned at a holding position Pf (see Figure 5) that holds the frame Wf, to a release position Pr (see Figure 7) that releases the holding of the frame Wf.

[0040] The chuck table 306 is configured to hold the wafer We attached to the sheet member Wt by suction. The chuck table 306 is attached to the X-direction moving unit 304. This allows the chuck table 306 to move in the X1 and X2 directions by the X-direction moving unit 304. The chuck table 306 is also moved in the Y1 and Y2 directions together with the X-direction moving unit 304 by the Y-direction moving unit 303. The chuck table 306 is configured to rotate about a rotation axis C (see FIG. 4) that runs vertically. As a result, the chuck table 306 is configured to be rotatable and movable in each horizontal direction while holding the frame Wf by suction.

[0041] The chuck table 306 includes a negative pressure switching section 306a (see FIG. 3), a placing section 306b, a holding section 306e, a rotating section 306c (see FIG. 3), and a base section 306d (see FIG. 4).

[0042] The detection unit 307 is a sensor for detecting whether the holding unit 306e is located at the holding position Pf. The switching drive unit 305, the chuck table unit 306, and the detection unit 307 will be described in detail later.

[0043] The low-magnification imaging unit 308 and the high-magnification imaging unit 309 are each configured to capture an image of the wafer We held on the chuck table unit 306. Each of the low-magnification imaging unit 308 and the high-magnification imaging unit 309 is a near-infrared imaging camera. Each of the low-magnification imaging unit 308 and the high-magnification imaging unit 309 is attached to a frame 311 via a Z-direction movement mechanism 310. The Z-direction movement mechanism 310 is configured to move the low-magnification imaging unit 308 and the high-magnification imaging unit 309 integrally in each of the Z1 direction and the Z2 direction. The Z-direction movement mechanism 310 includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0044] 3, the control unit 4 is configured to control each of the cassette unit 1, wafer transport unit 2, and dicing unit 3 to process the wafer We in the laser processing apparatus 100. The control unit 4 is electrically connected to each of the cassette unit 1, wafer transport unit 2, laser irradiation unit 301, Z-direction movement unit 302, Y-direction movement unit 303, X-direction movement unit 304, switching drive unit 305, chuck table unit 306, detection unit 307, low-magnification image capture unit 308, high-magnification image capture unit 309, and Z-direction movement mechanism 310.

[0045] Specifically, the control unit 4 includes a CPU (Central Processing Unit), a storage unit having a HDD (Hard Disk Drive) and an SSD (Solid State Drive), etc., and a memory having a ROM (Read Only Memory), a RAM (Random Access Memory), etc. The storage unit stores a control program for the laser processing apparatus 100, including the processing of the wafer We with a laser.

[0046] 4, a plurality of (four) switching drivers 305 are arranged at equal angular intervals of approximately 90 degrees when viewed from the Z1 direction side. Here, each of the multiple switching drivers 305 has a similar structure, and therefore, the structure of only one of the multiple switching drivers 305 will be described.

[0047] 5, the switching drive unit 305 includes a drive unit 305a, a cylinder unit 305b, a fixed unit 305c, a guide unit 305d, a connecting member 305e, a roller 305f, and a shaft 305g. The roller 305f is an example of the "contact unit" in the claims.

[0048] <Driver, Cylinder, Fixed Part, Guide, and Connecting Member> The driver 305a is an air cylinder drive source that uses air pressure to move the cylinder 305b in the Z1 and Z2 directions. The Z1-side portion of the cylinder 305b is connected to a connecting member 305e. The fixed part 305c is fixed to the Z1-side end of the driver 305a. The guide 305d is a member that guides the movement of the connecting member 305e, which moves integrally with the cylinder 305b as it moves in the Z1 and Z2 directions. The guide 305d includes an attachment part 3051d and a moving part 3052d. The attachment part 3051d is attached to the fixed part 305c. The moving part 3052d is disposed within the attachment part 3051d and is movable in the Z1 and Z2 directions. The connecting member 305e is a member that connects the cylinder portion 305b and the guide portion 305d.

[0049] <Roller and Shaft> The roller 305f is attached to the connecting member 305e via the shaft 305g. As a result, the roller 305f moves integrally with the connecting member 305e in the Z1 and Z2 directions, and therefore moves integrally in the Z1 and Z2 directions in response to the movement of the cylinder portion 305b in the Z1 and Z2 directions, respectively. The shaft 305g extends along a rotation axis Cr. The rotation axis Cr is an axis extending along a tangential direction Dt (see FIG. 4). The tangential direction Dt is a horizontal direction perpendicular to the direction D (radial direction) of the rotation axis C. One end of the shaft 305g in the direction along which the rotation axis Cr extends is attached to the connecting member 305e. The other end of the shaft 305g in the direction along which the rotation axis Cr extends is attached to the connecting member 305e. The rotation axis Cr extends parallel to the pivot axis Cf. The roller 305f is rotatably attached to the shaft 305g around a rotation axis Cr. The roller 305f is a member made of resin.

[0050] (Chuck Table) As shown in FIG. 4, the chuck table 306 has a negative pressure switching section 306a (see FIG. 3), a placing section 306b, a rotating section 306c, a base section 306d, and a holding section 306e.

[0051] <Negative Pressure Switching Unit> The negative pressure switching unit 306a is configured to switch between generating a negative pressure that attracts the wafer We placed on the placement unit 306b and cutting off the negative pressure.

[0052] <Placement Section> As shown in FIG. 5, the placement section 306b is a section on which the wafer We is placed when the laser irradiation section 301 performs laser processing. The placement section 306b has a first placement section 3061b, a second placement section 3062b, a connection section 3063b, a connection section 3064b, and a support section 3065b. The first placement section 3061b is configured to adsorb the sheet member Wt of the wafer ring structure W while supporting it. The first placement section 3061b is formed with a suction hole 3066b (see FIG. 4) connected to a negative pressure source. The second placement section 3062b is configured to support the frame Wf of the wafer ring structure W. The surface of the second placement section 3062b facing in the Z1 direction has a support surface Su that supports the frame Wf of the wafer ring structure W. When viewed from the Z1 direction side, multiple (four) second mounting portions 3062b are attached to the first mounting portion 3061b at equal angular intervals of approximately 90 degrees (see FIG. 4). The connecting portion 3063b connects the first mounting portion 3061b and the second mounting portion 3062b. The connecting portion 3064b connects the first mounting portion 3061b and the support portion 3065b via the connecting portion 3063b. A pair of support portions 3065b are attached to the connecting portion 3064b. The pair of support portions 3065b support a shaft 3063e (described later) of the holding portion 306e. The pair of support portions 3065b are members that connect the first mounting portion 3061b and the holding portion 306e via the connecting portion 3063b and the connecting portion 3064b.

[0053] <Rotating Unit and Base Unit> As shown in FIG. 5, the rotating unit 306c is configured to rotate the mounting unit 306b around the rotation axis C (see FIG. 4). The rotating unit 306c is a direct drive motor configured to directly transmit rotational force without using a transmission mechanism (e.g., a reduction mechanism including gears, a belt, etc.). The first mounting unit 3061b is coupled to the motor shaft of the rotating unit 306c. The rotating unit 306c is configured to rotate the first mounting unit 3061b in the circumferential direction around the rotation axis C, thereby moving the plurality of second mounting units 3062b together. This changes the rotational angle position of the wafer We in the circumferential direction around the rotation axis C.

[0054] The rotating unit 306c has a rotation angle sensor 3061c (see FIG. 3). The rotation angle sensor 3061c is a sensor for detecting the rotation angle position of the rotating unit 306c. The rotation angle sensor 3061c is configured to detect information for detecting the rotation angle position of the rotating unit 306c and output the detected information to the control unit 4. The rotation angle sensor 3061c is an encoder or the like.

[0055] The base portion 306d is a portion attached to the X-direction moving portion 304. The base portion 306d supports the multiple switching drive units 305 and the rotating portion 306c. The base portion 306d does not rotate in response to the driving of the rotating portion 306c. Specifically, the multiple switching drive units 305 and the rotating portion 306c are attached to the surface of the base portion 306d on the Z1 direction side.

[0056] <Holding Unit> As shown in FIG. 5 , the holding unit 306e in this embodiment is disposed on the mounting unit 306b. Specifically, the holding unit 306e is attached to the connecting unit 3063b via the connecting unit 3064b and a pair of support units 3065b. The switching drive unit 305 is disposed on the base unit 306d. Specifically, as described above, the switching drive unit 305 is attached to the surface of the base unit 306d on the Z1 direction side. The switching drive unit 305 is attached to the outer end portion of the base unit 306d in the direction D (radial direction) of the rotation axis C. In this way, the holding unit 306e rotates integrally with the mounting unit 306b in conjunction with the rotation of the rotating unit 306c, but the switching drive unit 305 does not rotate in conjunction with the rotation of the rotating unit 306c.

[0057] The holding portions 306e are arranged at equal angular intervals of approximately 90 degrees as viewed from the Z1 direction (see FIG. 4). Since each of the holding portions 306e has a similar structure, only the structure of one of the holding portions 306e will be described.

[0058] The holder 306e is configured to hold the frame Wf of the wafer We placed on the support surface Su of the second placement portion 3062b.

[0059] As shown in FIG. 5, specifically, the holding portion 306e includes a pressing portion 3061e, an arm portion 3062e, a shaft 3063e, a biasing member 3064e, and a rotation movement conversion member 3065e.

[0060] <Pressing Section> The pressing section 3061e is configured to press the frame Wf from the Z1 direction side. The tip of the pressing section 3061e, including a pair of protrusions (see FIG. 4), abuts against the surface of the frame Wf on the Z1 direction side, and presses the frame Wf with the biasing force of the biasing member 3064e. The frame Wf is supported from the Z2 direction side by the support surface Su of the second mounting section 3062b, and is therefore held by being sandwiched between the pressing section 3061e and the second mounting section 3062b.

[0061] <Arm> The arm 3062e is a member that connects the presser 3061e and the rotational movement conversion member 3065e. A pair of arm 3062e is provided on each of one side and the other side of the shaft 3063e in the direction in which the rotational axis Cf extends (see FIG. 6). Here, the rotational axis Cf is an axis extending along the tangential direction Dt (see FIG. 4). The tangential direction Dt is a horizontal direction perpendicular to the direction D (radial direction) of the rotational axis C. One of the pair of arm 3062e is attached to one end of the presser 3061e in the direction in which the rotational axis Cf extends, and is also attached to one end of the rotational movement conversion member 3065e in the direction in which the rotational axis Cf extends. The other arm portion 3062e of the pair of arm portions 3062e is attached to the other end of the holding portion 3061e in the direction in which the rotation axis Cf extends, and is also attached to the other end of the rotation movement conversion member 3065e in the direction in which the rotation axis Cf extends.

[0062] 6, the arm portion 3062e is rotatably attached to the shaft 3063e. One of the pair of arm portions 3062e is attached to one end of the shaft 3063e in the direction in which the rotation axis Cf extends by a bolt B1. The other of the pair of arm portions 3062e is attached to the other end of the shaft 3063e in the direction in which the rotation axis Cf extends by a bolt B2.

[0063] <Shaft> The shaft 3063e is supported by the support portion 3065b so as not to rotate. One portion of the shaft 3063e in the direction in which the rotation axis Cf extends is supported by the support portion 3065b arranged on one side so as not to rotate. The other portion of the shaft 3063e in the direction in which the rotation axis Cf extends is supported by the support portion 3065b arranged on the other side so as not to rotate.

[0064] As a result, as shown in FIG. 5, the pair of arm portions 3062e rotates relatively to the shaft 3063e in directions R1 and R2 about the rotation axis Cf.

[0065] <Using Member> The urging member 3064e is configured to urge the holding portion 306e toward the holding position Pf. The urging member 3064e is a torsion spring.

[0066] The Z1-side end of the biasing member 3064e abuts against the Z2-side surface of the connecting portion 3064b. Specifically, the Z1-side end of the biasing member 3064e abuts against portions of the Z2-side surface of the connecting portion 3064b on one side and the other side in the direction of extension of the rotation axis Cf (see FIG. 6). The Z2-side end of the biasing member 3064e abuts against the Z1-side surface of the rotation movement conversion member 3065e. Specifically, the Z2-side end of the biasing member 3064e abuts against portions of the Z1-side surface of the rotation movement conversion member 3065e on one side and the other side in the direction of extension of the rotation axis Cf (see FIG. 6). The biasing member 3064e is supported by the shaft 3063e so as to be extendable and retractable. As a result, the biasing member 3064e biases the rotational movement conversion member 3065e in the R1 direction so that the rotational movement conversion member 3065e rotates in the R1 direction relative to the connecting portion 3064b.

[0067] <Pivot Movement Conversion Member> As shown in FIG. 5, the pivot movement conversion member 3065e is a metal plate-shaped member against which the resin roller 305f abuts. The pivot movement conversion member 3065e converts the linear movement of the roller 305f in the Z1 direction into pivot movement in the R2 direction. The movement of the roller 305f in the Z1 direction is from the lowered position Low (see FIG. 5) to the raised position Up (see FIG. 7). As a result, the holding portion 306e is configured to switch from the holding position Pf to the release position Pr (see FIG. 7) against the biasing force of the biasing member 3064e by the movement of the roller 305f in the Z1 direction by the switching drive unit 305.

[0068] Here, the holding position Pf and the release position Pr are rotational angle positions (postures) of the holding portion 306e in the R2 direction around the rotation axis Cf. The holding position Pf is the rotational angle position of the holding portion 306e when the tip of the pressing portion 3061e abuts against the surface of the frame Wf on the Z1 direction side. The release position Pr is the rotational angle position of the holding portion 306e when the roller 305f has moved to the up position Up (see FIG. 7).

[0069] The rotation axis Cf of the rotational movement conversion member 3065e is disposed at a position offset from the roller 305f when viewed from one side in the direction in which the rotation axis Cf extends, in order to convert a force applied from the roller 305f in the Z1 direction into a force in the R2 direction. Specifically, the rotation axis Cf of the rotational movement conversion member 3065e is disposed at a position offset from the roller 305f, outward in direction D (radial direction) perpendicular to the direction in which the rotation axis C (see FIG. 4) extends, when viewed from one side in the direction in which the rotation axis Cf extends. The rotation axis Cf of the rotational movement conversion member 3065e is disposed at a position not overlapping with the roller 305f when viewed from the Z1 direction.

[0070] The rotational movement conversion member 3065e has an abutment surface Sc for converting the linear movement of the roller 305f into rotational movement in the R2 direction. The abutment surface Sc is the surface on the Z2 direction side (the base portion 306d side) of the rotational movement conversion member 3065e. The abutment surface Sc is the surface with which the roller 305f abuts.

[0071] As the roller 305f moves in the Z1 direction, the rotational movement conversion member 3065e rotates relative to the roller 305f moving in the Z1 direction while changing the contact position Pc (see Figures 5 and 7) with the roller 305f on the contact surface Sc.

[0072] That is, as shown in Fig. 8, the position of the roller 305f in a direction perpendicular to the Z direction does not change with movement in the Z1 direction, but the rotational movement conversion member 3065e rotates in the R2 direction relative to the roller 305f, so that the contact position Pc with the roller 305f on the contact surface Sc changes continuously. In Fig. 8, contact position Pc1, contact position Pc2, contact position Pc3, and contact position Pc4 are shown as examples of the contact position Pc. Here, the contact position Pc changes continuously in the order of contact position Pc1, contact position Pc2, contact position Pc3, and contact position Pc4.

[0073] Furthermore, as the contact position Pc of the abutment surface Sc with the roller 305f changes from contact position Pc1 to contact position Pc2 to contact position Pc3 to contact position Pc4, the roller 305f moves in the Z1 direction, thereby decreasing the distance between the roller 305f and the rotation axis Cf. Therefore, the rotational movement conversion member 3065e does not rotate smoothly unless the distance between the contact position Pc and the rotation axis Cf decreases by the same amount. For this reason, the abutment surface Sc is formed such that the distance Di to the rotation axis Cf in the Df direction increases as the abutment surface Sc approaches the base portion 306d when the holding portion 306e is positioned at the holding position Pf (see FIG. 5). That is, the distance Di increases in the order of distance Di1, distance Di2, distance Di3, and distance Di4.

[0074] Here, the direction Df is a radial direction perpendicular to the direction in which the rotation axis Cf of the rotational movement conversion member 3065e extends. The distances Di1, Di2, Di3, and Di4 are the distances between the rotation axis Cf and the contact position Pc4, the distances between the rotation axis Cf and the contact position Pc3, the distances between the rotation axis Cf and the contact position Pc2, and the distances between the rotation axis Cf and the contact position Pc1, respectively, in the direction Df.

[0075] 6, the detection unit 307 is a sensor for detecting whether the holding unit 306e is positioned at the holding position Pf. The detection unit 307 detects whether the rotational movement conversion member 3065e of the holding unit 306e is positioned within a detection range Ra from the upper end of the detection unit 307. The detection unit 307 is configured to output a detection signal to the control unit 4 when it detects the rotational movement conversion member 3065e of the holding unit 306e. The detection unit 307 is configured not to output a detection signal to the control unit 4 when it cannot detect the rotational movement conversion member 3065e of the holding unit 306e. The detection unit 307 is, for example, a magnetic proximity sensor.

[0076] (Control of Holding and Releasing Frame) Next, with reference to FIGS. 9 to 15, control of holding and releasing the frame Wf of the wafer We using the switching driver 305 and the holder 306e will be described.

[0077] 9, the control unit 4 controls the rotation of the rotating unit 306c to a position where the roller 305f can contact the pivotal movement conversion member 3065e when the holding unit 306e switches to the release position Pr, based on the detection value of the rotational angle sensor 3061c. The control unit 4 controls the rotation of the rotating unit 306c to a position where the rotational angle position of the rotating unit 306c about the rotation axis C becomes a predetermined rotational angle position (for example, 0 degrees). As a result, the roller 305f is positioned directly below the pivotal movement conversion member 3065e, as shown in FIG.

[0078] 11 , the control unit 4 rotates the rotating unit 306c to a position where the roller 305f can contact the rotational movement conversion member 3065e based on the detection value of the rotation angle sensor 3061c, and then determines whether the holding unit 306e is located at the holding position Pf based on the detection value of the detection unit 307. If the detection signal is not output from the detection unit 307 to the control unit 4, the control unit 4 determines that the holding unit 306e is not located at the holding position Pf. As a result, the control unit 4 performs control to determine that an abnormality has occurred, such as a foreign object Ob being caught between the pressing unit 3061e and the frame Wf of the wafer We.

[0079] Furthermore, when a detection signal is output from the detector 307 to the controller 4, the controller 4 determines that the holding portion 306e is located at the holding position Pf. In this case, as shown in FIG. 12 , when the controller 4 determines that the holding portion 306e is located at the holding position Pf, the controller 4 controls the switching drive unit 305 to drive the roller 305f to move the roller 305f in the Z1 direction. As a result, the holding portion 306e rotates as the roller 305f moves in the Z1 direction, and the holding portion 306e rotates to the release position Pr shown in FIG. 13 . That is, as the switching drive unit 305 moves the roller 305f in the Z1 direction, the holding portion 306e switches from the holding position Pf to the release position Pr against the biasing force of the biasing member 3064e. At this time, the roller 305f in contact with the contact surface Sc of the rotational movement conversion member 3065e rotates in the circumferential direction around the rotation axis Cr as the rotational movement conversion member 3065e rotates in the R2 direction.

[0080] Then, after the roller 305f has moved to the up position Up, the control unit 4 controls the transfer head unit 25 to transfer the wafer We.

[0081] 14, after the transfer head 26 transfers the next wafer We onto the chuck table 306, the control unit 4 controls the rollers 305f to move to the lowered position Low. As a result, the holder 306e rotates in accordance with the movement of the rollers 305f in the Z2 direction, thereby rotating the holder 306e to the holding position Pf shown in FIG. 10. That is, the movement of the rollers 305f in the Z2 direction by the switching drive unit 305 switches the holder 306e from the release position Pr to the holding position Pf due to the biasing force of the biasing member 3064e. Then, the frame Wf of the wafer We is held by the holder 306e due to the biasing force of the biasing member 3064e.

[0082] In this way, the switching drive unit 305 is configured to switch the holding portion 306e to the release position Pr by moving the roller 305f in the Z1 direction while it is in contact with the holding portion 306e, and to move the roller 305f in the Z2 direction when switching to the holding position Pf.

[0083] (Wafer Processing Method) Here, with reference to FIG. 15, a wafer processing method executed in the control unit 4 will be described.

[0084] 15, in step S1, the clamp hand unit 21 pulls out the wafer We from the cassette unit 1. In step S2, the chuck table unit 306 moves to directly below the transfer head unit 26. In step S3, the rail unit 24 opens. In step S4, the roller 305f of the switching drive unit 305 moves (raises) in the Z1 direction to rotate the holding unit 306e to the release position Pr.

[0085] In step S5, the transfer head 26 moves (lowers) in the Z2 direction to transfer the wafer We to the chuck table 306. In step S6, the roller 305f of the switching drive unit 305 moves in the Z2 direction to rotate the holding unit 306e to the holding position Pf. In step S7, the transfer head 26 moves (rises) in the Z1 direction.

[0086] In step S8, the laser irradiation unit 301 performs laser processing on the wafer We.

[0087] In step S9, after laser processing, the chuck table 306 moves directly below the transfer head 25. In step S10, the rails 24 are opened. In step S11, the transfer head 25 adsorbs the frame Wf of the wafer We after laser processing. In step S12, the rollers 305f of the switching drive unit 305 are moved (raised) in the Z1 direction to rotate the holding unit 306e to the release position Pr. In step S13, the transfer head 26 moves (raises) in the Z1 direction. In step S14, the rollers 305f of the switching drive unit 305 are moved in the Z2 direction to rotate the holding unit 306e to the holding position Pf. In step S15, the chuck table 306 moves directly below the transfer head 26.

[0088] After the above-described process is performed for a predetermined number of wafers We, the wafer processing method ends.

[0089] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0090] In the present embodiment, as described above, the holding portion 306e is disposed on the mounting portion 306b, and the switching drive portion 305 is disposed on the base portion 306d. As a result, because the switching drive portion 305 is disposed on the non-rotating base portion 306d, the switching drive portion 305, which moves the holding portion 306e that holds the annular frame Wf between the holding position Pf and the release position Pr, does not need to route components such as piping around the switching drive portion 305 that is attached to the rotating mounting portion 306b, unlike when the switching drive portion 305 is attached to the rotating mounting portion 306b. This makes it possible to prevent the structure for holding the annular frame Wf from becoming complicated, thereby preventing the device configuration from becoming complicated.

[0091] Furthermore, in this embodiment, as described above, the switching drive unit 305 includes the roller 305f that switches the holding portion 306e to the release position Pr by moving in the Z1 direction while in contact with the holding portion 306e, and that moves in the Z2 direction when switching to the holding position Pf. This allows the holding portion 306e to be switched between the holding position Pf and the release position Pr simply by reciprocating the roller 305f in the Z1 direction (one direction) and the Z2 direction, so the structure of the switching drive unit 305 for switching the holding portion 306e can be simplified.

[0092] Furthermore, in this embodiment, as described above, the holding portion 306e includes the biasing member 3064e that biases the holding portion 306e toward the holding position Pf. The holding portion 306e is configured to switch from the holding position Pf to the release position Pr against the biasing force of the biasing member 3064e when the roller 305f of the switching drive unit 305 is moved in the Z1 direction. This allows the holding portion 306e to be maintained at the holding position Pf with the roller 305f of the switching drive unit 305 separated from the holding portion 306e by the biasing force of the biasing member 3064e, so that the wafer We can be reliably held on the mounting portion 306b when the rotating unit 306c rotates the mounting portion 306b.

[0093] Furthermore, in this embodiment, as described above, the holder 306e includes a rotational movement conversion member 3065e that converts the linear movement of the rollers 305f in the Z1 direction into rotational movement. Here, when the holder 306e is positioned at the holding position Pf, the wafer We cannot be transferred upward from the mounting portion 306b by the transfer head 25 (suction head) or the like, so the holder 306e must be moved from above the frame Wf. Therefore, by providing the rotational movement conversion member 3065e, the holder 306e can be retracted from above the frame Wf mounted on the mounting portion 306b simply by rotating the holder 306e using the rotational movement conversion member 3065e. Therefore, the frame Wf on the mounting portion 306b can be easily attracted by the transfer head 25 (suction head) or the like.

[0094] Furthermore, in this embodiment, as described above, the rotation axis Cf of the rotational movement conversion member 3065e is positioned offset from the roller 305f when viewed from the Z1 direction. Here, if the rotation axis Cf of the rotational movement conversion member 3065e is positioned directly above the roller 305f when viewed from the Z1 direction, the force in the Z1 direction applied from the roller 305f to the rotational movement conversion member 3065e is entirely converted into a force in the Df direction, and therefore no circumferential force around the rotation axis Cf can be generated. Therefore, by abutting the rotational movement conversion member 3065e while offset from the rotation axis Cf and linearly moving in the Z1 direction, the force of the roller 305f in the Z1 direction generated by the linear movement in the Z1 direction can generate a force in the R2 direction around the rotation axis Cf, thereby rotating the rotational movement conversion member 3065e positioned on the mounting portion 306b.

[0095] Furthermore, in this embodiment, as described above, the rotational movement conversion member 3065e is provided on the base portion 306d side and includes a contact surface Sc against which the roller 305f contacts. The rotational movement conversion member 3065e rotates relative to the roller 305f, which moves in the Z1 direction, while changing the contact position Pc with the roller 305f on the contact surface Sc as the roller 305f moves in the Z1 direction. As a result, the contact position Pc with the roller 305f on the contact surface Sc changes as the roller 305f moves in the Z1 direction, causing the rotational movement conversion member 3065e to rotate as the roller 305f moves in the Z1 direction. Therefore, the linear movement of the roller 305f in the Z1 direction can be easily converted into rotational movement by the contact surface Sc of the rotational movement conversion member 3065e.

[0096] Furthermore, in the present embodiment, as described above, the contact surface Sc is formed so that the distance Di to the rotation axis Cf of the rotation movement conversion member 3065e in the direction Df of the rotation axis Cf of the rotation movement conversion member 3065e increases as the contact surface Sc approaches the base portion 306d when the holding portion 306e is placed at the holding position Pf. This reduces the distance Di from the contact position Pc with the roller 305f to the rotation axis Cf of the contact surface Sc, so that the linear movement of the roller 305f in the Z1 direction can be easily converted into rotational movement of the rotation movement conversion member 3065e by the contact surface Sc.

[0097] In addition, in this embodiment, as described above, the roller 305f is rotatable about the rotation axis Cr that extends parallel to the rotation axis Cf of the rotational movement conversion member 3065e. As a result, the roller 305f rotates in conjunction with the rotation of the rotational movement conversion member 3065e, so that the contact position Pc with the roller 305f on the contact surface Sc can be smoothly changed.

[0098] Furthermore, in this embodiment, as described above, the chuck table 306 includes a rotation angle sensor 3061c for detecting the rotation angle position of the rotating unit 306c. The laser processing apparatus 100 is equipped with a control unit 4 that, based on the detection value of the rotation angle sensor 3061c, controls the rotating unit 306c to rotate to a position where the roller 305f can contact the pivotal movement conversion member 3065e when the holding unit 306e is switched to the release position Pr. This allows the rotation angle position of the rotating unit 306c to be controlled so that the pivotal movement conversion member 3065e is positioned at a position where the roller 305f can contact, thereby ensuring that the roller 305f can contact the pivotal movement conversion member 3065e when the holding unit 306e is switched to the release position Pr.

[0099] Furthermore, in this embodiment, as described above, the laser processing apparatus 100 includes a detection unit 307 that is provided on the base unit 306d and that detects whether the holding unit 306e is positioned at the holding position Pf. The control unit 4 rotates the rotation unit 306c to a position where the roller 305f can contact the rotational movement conversion member 3065e based on the detection value of the rotation angle sensor 3061c, and then determines whether the holding unit 306e is positioned at the holding position Pf based on the detection value of the detection unit 307. This makes it possible to detect a state in which the holding unit 306e is not positioned at the holding position Pf using the detection unit 307, and therefore to detect an abnormality in the holding state of the holding unit 306e (for example, pinching of a foreign object Ob).

[0100] In this embodiment, as described above, the roller 305f includes a resin member, and the rotational movement conversion member 3065e includes a metal member. This allows the resin roller 305f to reduce the impact and noise generated when the roller 305f comes into contact with the rotational movement conversion member 3065e.

[0101] [Modifications] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above-mentioned embodiments, and further includes all modifications (modifications) within the meaning and scope of the claims.

[0102] For example, in the above embodiment, the "rotary table" in the claims is a chuck table that holds the wafer We when laser processing the wafer We, but the present invention is not limited to this. In the present invention, the rotary table may be a chuck table that holds the wafer when cleaning or cutting the wafer. Furthermore, the rotary table does not have to be a chuck table that holds the wafer by suction.

[0103] Furthermore, in the above embodiment, the biasing member 3064e is a torsion spring that biases the rotational movement conversion member 3065e in the R1 direction, but the present invention is not limited to this. In the present invention, the biasing member may be a coil spring that biases the rotational movement switching member from one side to the other in a linear direction. In this case, the switching drive unit is configured to move the holding portion from the holding position to the release position by moving the contact portion to linearly move the rotational movement switching member from the other side to the one side in the linear direction against the biasing force of the biasing member. Furthermore, the switching drive unit may include rubber or the like other than a spring as a component that moves the contact portion.

[0104] In the above embodiment, the switching drive unit 305 moves the roller 305f (contact portion) in the vertical direction, but the present invention is not limited to this. In the present invention, the switching drive unit may move the contact portion in the horizontal direction. In this case, the switching drive unit is disposed radially outward relative to the holding unit in a direction perpendicular to the direction in which the rotation axis of the rotating unit extends.

[0105] In the above embodiment, the rotating unit 306c includes a direct drive motor, but the present invention is not limited to this. In the present invention, the rotating unit may be configured to transmit the rotational force of the motor via a transmission mechanism (for example, a reduction mechanism including gears, a belt, or the like).

[0106] In the above embodiment, the driving unit 305a is an air cylinder driving source that moves the cylinder unit 305b in each of the Z1 direction and the Z2 direction using air pressure, but the present invention is not limited to this. In the present invention, the driving unit may be a solenoid driving source that moves the cylinder unit using magnetic force, or a motor that generates a driving force to move the contact unit.

[0107] In the above embodiment, the detecting unit 307 is, for example, a magnetic proximity sensor, but the present invention is not limited to this. In the present invention, the detecting unit may be a laser sensor having a light-emitting unit and a light-receiving unit, and the wafer working device may not be equipped with a detecting unit.

[0108] In the above embodiment, an example in which a plurality of (four) holding portions 306e are arranged is shown, but the present invention is not limited to this. In the present invention, the number of holding portions may be one to three or five or more.

[0109] In the above embodiment, the "contact portion" in the claims is the roller 305f that rotates around the rotation axis Cr, but the present invention is not limited to this. In the present invention, the "contact portion" in the claims may be a member that does not rotate around the rotation axis.

[0110] In the above embodiment, for convenience of explanation, the control processing of the control unit 4 is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven processing.

[0111] 4 Control unit 100 Laser processing device (wafer working device) 301 Laser irradiation unit (wafer working unit) 305 Switching drive unit 305a Drive unit 305f Roller (contact unit) 306 Chuck table unit (rotary table unit) 306b Placement unit 306c Rotation unit 306d Base unit 306e Holding unit 307 Detection unit 3061c Rotation angle sensor 3064e Urging member 3065e Rotation movement conversion member C Rotation axis Cf Rotation axis Di Distance Pc Contact position Pf Holding position Pr Release position Sc Contacted surface We Wafer Wf Frame

Claims

1. A wafer working device comprising: a wafer working unit that works on a wafer placed inside a ring-shaped frame; a placing unit on which the wafer is placed when the wafer working unit works; a rotating table unit including a holding unit that holds the frame of the wafer placed on the placing unit; a rotating unit that rotates the placing unit; and a base unit that supports the rotating unit without rotating in response to the driving of the rotating unit; and a switching drive unit that switches the holding unit, which is located in a holding position that holds the frame, to a release position that releases the holding of the frame, wherein the holding unit is located on the placing unit and the switching drive unit is located on the base unit.

2. A wafer working device as described in claim 1, wherein the switching drive unit switches the holding unit to the release position by moving in one direction while in contact with the holding unit, and includes an abutment unit that moves in another direction opposite to the one direction when switching to the holding position.

3. A wafer working device as described in claim 2, wherein the holding portion includes a biasing member that biases the holding portion toward the holding position, and the holding portion is configured to switch from the holding position to the release position against the biasing force of the biasing member when the switching drive portion moves the abutment portion in the one direction.

4. A wafer working device according to claim 3, wherein said holding portion includes a rotational movement conversion member that converts the linear movement of said contact portion in one direction into rotational movement.

5. A wafer working device according to claim 4, wherein the rotation axis of said rotational movement conversion member is disposed at a position offset from said contact portion when viewed from said one side.

6. A wafer working device as described in claim 5, wherein the rotational movement conversion member is provided on the base portion side and includes an abutted surface against which the abutting portion abuts, and the rotational movement conversion member rotates relative to the abutting portion moving in the one direction while changing the contact position with the abutting portion on the abutted surface as the abutting portion moves in the one direction.

7. A wafer working device as described in claim 6, wherein the abutment surface is formed so that the distance to the rotation axis of the rotation movement conversion member in the radial direction of the rotation axis of the rotation movement conversion member increases as it approaches the base portion when the holding portion is positioned at the holding position.

8. A wafer working device according to claim 6, wherein said contact portion includes a roller rotatable about a rotation axis extending parallel to the rotation axis of said rotation movement conversion member.

9. A wafer working device as described in claim 4, wherein the rotary table section further includes a rotation angle sensor for detecting the rotation angle position of the rotating section, and further comprising a control section that controls, based on the detection value of the rotation angle sensor, to rotate the rotating section to a position where the abutment section can abut against the rotary movement conversion member when the holding section switches to the release position.

10. A wafer working device as described in claim 9, further comprising a detection unit provided on the base unit for detecting whether or not the holding unit is positioned at the holding position, wherein the control unit is configured to rotate the rotating unit to a position where the abutment unit can abut against the rotational movement conversion member based on the detection value of the rotation angle sensor, and then determine whether or not the holding unit is positioned at the holding position based on the detection value of the detection unit.

11. A wafer working device according to claim 4, wherein the contact portion includes a resin member, and the rotational movement conversion member includes a metal member.

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