Conductive paste, multilayer electronic device, and method for manufacturing multilayer electronic device

Abstract

An embodiment of the present invention relates to a conductive paste that can be buried in a hole provided in a sheet of a multilayer electronic device. The conductive paste comprises a conductive composition and a binder, wherein the conductive composition can comprise greater than 0.5 wt% and less than 50 wt% of palladium (Pd) and greater than 50 wt% and less than 99.5 wt% of silver (Ag). Therefore, according to embodiments of the present invention, shrinkage of the conductive paste, which serves as a raw material for via electrodes, can be suppressed or prevented. Therefore, a gap can be suppressed or prevented from being generated between the plurality of via electrodes disposed adjacent to each other. The plurality of via electrodes disposed adjacent to each other can be connected. Therefore, the electrical characteristics of the multilayer electronic device can be improved and reliability can be improved.

Description

Conductive paste, laminated electronic device, and method for manufacturing laminated electronic device

[0001] The present invention relates to a conductive paste, a laminated electronic device, and a method for manufacturing a laminated electronic device, and more particularly, to a conductive paste capable of suppressing shrinkage, a laminated electronic device manufactured using the same, and a method for manufacturing a laminated electronic device.

[0002] A common mode noise filter includes at least a plurality of noise filter sections including a plurality of internal conductors formed within a laminate in which a plurality of sheets are laminated, and an external electrode provided on the outside of the laminate and connected to the noise filter sections. In addition, the noise filter sections include electrode bodies formed within holes provided in each of the plurality of sheets and connected to the internal conductors.

[0003] Briefly describing a method for manufacturing a common mode noise filter, first, a plurality of sheets are prepared, and internal conductors and holes are formed in the plurality of sheets. Then, conductive paste is filled into the holes. Thereafter, the plurality of sheets are laminated to form a laminate. Next, a conductive material is applied to one side and the other side of the laminate to form external electrodes. Then, the laminate with the external electrodes formed is heated and sintered, and at this time, the conductive paste is sintered to become a conductor. Thus, a laminated electronic device including a plurality of noise filter sections is manufactured.

[0004] However, during the sintering process of the laminate, the conductive paste embedded in the hole may shrink. That is, even though the conductive paste was filled to completely fill the hole, the conductive paste shrinks during the sintering process. Consequently, the conductive particles formed in the holes of multiple sheets fail to connect with each other, resulting in short circuits or disconnections. In other words, adjacent conductive particles fail to make contact.

[0005] Therefore, the internal conductors provided on multiple sheets are not connected to each other, which may cause the noise filter unit to not operate or its quality to deteriorate.

[0006] (Prior art literature) (Patent literature 1) Korean Patent No. 10-0876206

[0007] The present invention provides a conductive paste capable of suppressing or preventing shrinkage and a laminated electronic device manufactured using the same.

[0008] The present invention provides a method for manufacturing a laminated electronic device capable of suppressing or preventing the occurrence of gaps between via electrodes.

[0009] An embodiment of the present invention is a conductive paste that can be filled into a hole provided in a sheet of a laminated electronic device, wherein the conductive paste includes a conductive composition and a binder, and the conductive composition can include palladium (Pd) in an amount of more than 0.5 wt% and less than 50 wt% and silver (Ag) in an amount of more than 50 wt% and less than 99.5 wt%.

[0010] Among the entire conductive composition, the content of palladium (Pd) may be 5 wt% to 30 wt%, and the content of silver (Ag) may be 70 wt% to 95 wt%.

[0011] The difference (T) between the thickness (T1) of the conductive paste embedded in the inside of the hole and the thickness (T2) of the conductive paste sintered at a temperature of 850°C to 950°C 1-2 ) may be 10% to 19% of the thickness (T1) of the conductive paste filled into the interior of the hole before sintering.

[0012]

[0013] An embodiment of the present invention is a method for manufacturing a conductive paste that can be filled into a hole provided in a sheet of a laminated electronic device, the method comprising: a process for manufacturing a conductive composition including more than 0.5 wt% and less than 50 wt% of palladium (Pd) and more than 50 wt% and less than 99.5 wt% of silver (Ag); and a process for mixing the conductive composition with a binder.

[0014] In manufacturing the above conductive composition, the content of palladium (Pd) can be manufactured to be 5 wt% to 30 wt%, and the content of silver (Ag) can be manufactured to be 70 wt% to 95 wt%.

[0015]

[0016] A laminated electronic device according to an embodiment of the present invention may include a laminate in which a plurality of sheets are laminated; internal conductors provided on at least some of the plurality of sheets; and via electrodes installed through the sheets to connect at least some of the plurality of internal conductors, the via electrodes including more than 0.5 wt% and less than 50 wt% of palladium (Pd) and more than 50 wt% and less than 99.5 wt% of silver (Ag).

[0017] The above via electrode may have a palladium (Pd) content of 5 wt% to 30 wt% and a silver (Ag) content of 70 wt% to 95 wt%.

[0018] The above-mentioned layered electronic device may include either a noise filter or an inductor.

[0019] The above-described stacked electronic device includes a noise filter, and the noise filter includes a noise filter section including two or more of the internal conductors and the via electrode connecting the two or more internal conductors, and the noise filter section may be provided in three or more numbers.

[0020] The above-described laminated electronic device includes a noise filter, and the noise filter includes a first filter portion in which at least three sheets on which the internal conductors are formed and an extraction electrode sheet on which an extraction electrode is formed are laminated; at least some of the internal conductors are connected to the extraction electrode by the via electrode, and the number of via electrodes positioned on the inner side of the internal conductor formed on at least one sheet among the sheets may be characterized in that three.

[0021] After stacking the plurality of sheets, it may be manufactured by integrally sintering the plurality of sheets, the internal conductor, and the via electrode.

[0022] In integrally sintering the above plurality of sheets, internal conductors and via electrodes, the sintering may be performed at a temperature of 850°C to 950°C.

[0023] The difference (T) between the thickness (T1) of the via electrode before sintering and the thickness (T2) of the via electrode after sintering 1-2 ) may be 10% to 19% of the thickness (T1) of the via electrode before sintering.

[0024] According to embodiments of the present invention, shrinkage of the conductive paste that serves as the raw material for the via electrode can be suppressed or prevented. This can suppress or prevent the formation of gaps between adjacently arranged via electrodes. In other words, the adjacently arranged via electrodes can be interconnected. Consequently, the electrical characteristics of the stacked electronic device can be improved, and its reliability can be enhanced.

[0025] FIG. 1 is a perspective view showing the appearance of a laminated electronic device according to an embodiment of the present invention.

[0026] Figure 2 is an exploded perspective view of a stacked electronic device according to an embodiment of the present invention.

[0027] Figure 3 is a cross-sectional view taken along line AA' of Figure 1.

[0028] FIG. 4 (a) is a conceptual diagram illustrating a laminated electronic device according to an embodiment of the present invention illustrated in FIGS. 2 and 3, in which conductive paste is filled into holes provided in the second sheet and the third sheet.

[0029] Figure 4 (b) is a conceptual diagram showing an example of a gap being created between via electrodes arranged vertically when Figure 4 (a) is sintered, and is an enlarged view of 'B' of Figure 3.

[0030] Figure 5 is a perspective view of a stacked electronic device according to a second embodiment of the present invention.

[0031] FIG. 6 is a drawing schematically showing the appearance of each sheet included in a laminated electronic device according to the second embodiment of the present invention.

[0032] FIG. 7 is a drawing for explaining the internal structure of a laminated electronic device according to a second embodiment of the present invention.

[0033] FIG. 8 is an optical microscope photograph and experimental data summarizing shrinkage rates for via electrodes sintered at 900°C after filling conductive pastes according to Comparative Examples 1 to 5 and Embodiments 1 and 2 into holes respectively prepared on multiple sheets.

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In the drawings, the thickness is enlarged to clearly represent various layers and each region, and the same reference numerals indicate the same elements.

[0035]

[0036] A laminated electronic device according to an embodiment of the present invention may include a laminate formed by laminating a plurality of sheets, an internal conductor provided on at least some of the plurality of sheets, and a via electrode installed through the sheets to connect the plurality of internal conductors.

[0037] More specifically, the multilayer electronic device according to an embodiment of the present invention may be either a noise filter or an inductor. When the multilayer electronic device is a noise filter, the multilayer electronic device may be either a C-phy filter or a common mode ESD filter (CMF). As another example, when the multilayer electronic device is an inductor, the inductor may be either a power inductor or a high frequency ferrite bead.

[0038]

[0039] Hereinafter, a multilayer electronic device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. Hereinafter, a C-phy filter, which is one of the noise filters, will be described as an example of a multilayer electronic device according to one embodiment.

[0040] Fig. 1 is a perspective view of a stacked electronic device according to a first embodiment of the present invention, and Fig. 2 is an exploded perspective view. In addition, Fig. 3 is a cross-sectional view taken along line AA' according to the first embodiment. The stacked electronic device illustrated in Figs. 1 to 3 is a C-phy filter, which is one of the noise filters, as described above.

[0041] Referring to FIGS. 1 to 3, a laminated electronic device according to a first embodiment of the present invention may include a laminate (1000) in which a plurality of sheets (101 to 110; 100) are laminated, at least three noise filter units (2100, 2200, 2300; 2000) including internal conductors (210 to 270; 200) provided on at least some of the sheets (101 to 110; 100), and external electrodes (3100, 3200; 3000) provided on the outside of the laminate (1000) and connected to the noise filter unit (2000).

[0042] Additionally, the laminated electronic device may further include a surface modification member (not shown) provided at least in a portion between the laminate (1000) and the external electrode (3000).

[0043] The noise filter unit (2000) may be provided in multiple numbers, for example, three noise filter units may be provided. In addition, the plurality of noise filter units may be provided at predetermined intervals in the stacking direction of the sheet (100). That is, the stacked electronic device may have at least three noise filter units (2000) provided within the stacked body (1000), and the noise filter units (2000) may be connected to external electrodes (3000) and may be connected to signal lines through the external electrodes (3000).

[0044] In addition, at least one of the noise filter units (2000) may be formed with a different number of internal conductors (200) from the rest. For example, the first noise filter unit (2100) may be formed by connecting three internal conductors, and the second and third noise filter units (2200, 2300) may be formed by connecting two internal conductors. More specifically, the first noise filter unit (2100) may be formed by connecting the first, fourth, and seventh internal conductors (210, 240, 270), the second noise filter unit (2200) may be formed by connecting the second and fifth internal conductors (220, 250), and the third noise filter unit (2300) may be formed by connecting the third and sixth internal conductors (230, 260).

[0045] In this way, by providing the first noise filter unit (2100) with a structure formed by connecting three internal conductors (210, 240, 270), the impedance of the stacked electronic element can be more easily controlled. That is, the seventh internal conductor (270) may be an internal conductor for controlling the impedance of the stacked electronic element. However, the noise filter unit (2000) may be formed by connecting the internal conductors in various forms, and the number of connections of the internal conductors (200) of at least one noise filter unit (2000) is different from the number of connections of the internal conductors (200) of the remaining noise filter units (2000). That is, one noise filter unit (2000) is formed by at least one internal conductor (200) and is formed by a plurality of noise filter units (2000), and the number of noise filter units (2000) smaller than the total number of noise filter units (2000) has a different number of connections of internal conductors (200) than the number of connections of internal conductors (200) of the remaining noise filter units (2000). At this time, the seventh internal conductor (270), i.e., the impedance adjusting internal conductor, may be provided on the upper side of the sixth internal conductor (260) as described above, but may be provided at any position between the second to sixth internal conductors (220 to 260). In particular, the seventh internal conductor (270) may be provided at a position adjacent to the third internal conductor (230).

[0046] An embodiment of the present invention is described in more detail as follows.

[0047]

[0048] 1. Laminate

[0049] The laminate (1000) may be provided in an approximately hexahedral shape. That is, the laminate (1000) may be provided in an approximately hexahedral shape having a predetermined length and width in one direction (e.g., X direction) and the other direction (e.g., Y direction) that are orthogonal to each other in the horizontal direction, respectively, and a predetermined height in the vertical direction (e.g., Z direction). Here, the length in the X direction may be the same as or different from the width in the Y direction, and the width in the Y direction may be the same as or different from the height in the Z direction. For example, the length and width may be the same or different, and the height may be different with respect to the length, and the ratio of the length, width, and height may be 1 to 5:1:0.2 to 2. That is, the length may be 1 to 5 times larger than the width, and the height may be 0.2 to 2 times larger than the width. However, the sizes in the X, Y, and Z directions are just one example and may be variously modified depending on the internal structure of an electronic device to which the laminated electronic element is connected, the shape of the laminated electronic element, etc.

[0050] The laminate (1000) can be formed by stacking a plurality of sheets (101 to 110; 100). That is, the laminate (1000) can be formed by stacking a plurality of sheets (100) having a predetermined length in the X direction, a predetermined width in the Y direction, and a predetermined thickness in the Z direction. Accordingly, the length and width of the laminate (1000) can be determined by the length and width of the sheets (100), and the height of the laminate (1000) can be determined by the number of sheets (100) stacked. Meanwhile, the plurality of sheets (100) can be magnetic sheets or non-magnetic sheets. That is, the plurality of sheets (100) can be all magnetic sheets or non-magnetic sheets. However, at least some of the plurality of sheets (100) can be magnetic sheets, and the remainder can be non-magnetic sheets. For example, the sheets on which the noise filter unit (2000) is implemented, that is, the first to eighth sheets (101 to 108), may be non-magnetic sheets, and the ninth and tenth sheets (109, 110) provided on the lower and upper portions thereof may be magnetic sheets. Here, the non-magnetic sheets may have a relative permittivity of 2 to 10, and the magnetic sheets may have a permeability of 2 to 1000 or a relative permittivity of 2 to 100. Meanwhile, the magnetic sheets may be formed using, for example, NiZnCu or NiZn-based magnetic ceramics. For example, the NiZnCu-based magnetic sheets may be formed by mixing Fe2O3, ZnO, NiO, and CuO, and the Fe2O3, ZnO, NiO, and CuO may be mixed in a ratio of, for example, 5:2:2:1. Additionally, non-magnetic sheets can be manufactured using, for example, low temperature co-fired ceramics (LTCC). LTCC materials can include Al2O3, SiO2, and glass materials.

[0051] The plurality of sheets (100) may be provided in a rectangular plate shape having a predetermined thickness. For example, they may be provided in a square plate shape with the same length and width, or they may be provided in a rectangular plate shape with different lengths and widths. In addition, the plurality of sheets (100) may all be formed with the same thickness, or at least one of them may be formed thicker or thinner than the others. Meanwhile, the plurality of sheets (100) may be formed with a thickness of, for example, 1 μm to 4000 μm, or may be formed with a thickness of 3000 μm or less. That is, depending on the thickness of the laminate (1000), the thickness of each of the sheets (100) may be 1 μm to 4000 μm, for example, 1 μm to 300 μm, preferably 5 μm to 100 μm. The spacing between adjacent internal conductors (200) may be adjusted depending on the thickness of each of the sheets (100). That is, the spacing between the internal conductors (200) can be adjusted according to the thickness of the sheets (100). At this time, the differential impedance can be adjusted according to the spacing between the internal conductors (200), that is, the thickness of each sheet (100). That is, the smaller the spacing between the internal conductors (200), that is, the thinner the thickness of each sheet (100), the lower the differential impedance, and the wider the spacing between the internal conductors (200), that is, the thicker the thickness of each sheet (100), the higher the differential impedance. However, the thickness and the number of layers of the sheets (100) can be adjusted according to the size of the laminated electronic device. That is, when applied to a laminated electronic device having a thin thickness or a small size, the sheet (100) can be formed with a thin thickness, and when applied to a laminated electronic device having a thick thickness or a large size, the sheet (100) can be formed with a thick thickness. In addition, when the sheets (100) are stacked in the same number, the size of the stacked electronic element may be small, so the lower the height, the thinner the thickness, and the larger the size of the stacked electronic element, the thicker the thickness.Of course, thin sheets can also be applied to large-sized laminated electronic devices, in which case the number of sheets stacked increases.

[0052] In addition, the laminate (1000) may further include a cover layer (not shown) provided on at least one of the lower and upper layers. That is, the laminate (1000) may include a cover layer provided on the lowermost layer and the uppermost layer, respectively. At this time, only one cover layer may be provided on the upper or lower layer, or both may be provided on the upper and lower layers. Of course, separate cover layers may not be provided, and the lowermost sheet, i.e., the ninth sheet (109), may function as the lower cover layer, and the uppermost sheet, i.e., the tenth sheet (110), may function as the upper cover layer. The ninth and tenth sheets (109, 110) functioning as the lower and upper cover layers may be thicker than the thickness of each of the sheets (101 to 108) therebetween. At this time, the ninth and tenth sheets (109, 110), i.e., the cover layers, may be formed by laminating a plurality of sheets having the same thickness as the sheets (101 to 108). In addition, the 9th and 10th sheets (109, 110) may be formed with different thicknesses, for example, the 10th sheet (110) may be thicker than the 9th sheet (109). Here, the 9th and 10th sheets (109, 110) may be formed of magnetic sheets, and may be formed by laminating at least two magnetic sheets. Meanwhile, a glassy layer may be formed on at least one surface of the laminate (1000). For example, a glassy sheet may be formed on either the lower surface of the 9th sheet (109) or the upper surface of the 10th sheet (110).

[0053]

[0054] 2. Noise filter section

[0055] The noise filter unit (2000) may include a plurality of internal conductors (210 to 270; 200) selectively formed on a plurality of sheets (100), a vertical connection wire (300a, 300b, 300c) formed of via electrodes (310 to 360; 300) installed to penetrate the sheet (100) so as to connect at least two or more internal conductors (200), and an extraction electrode (410 to 470; 400) that is extracted from the internal conductor (200) to be exposed to the outside of the sheet (100).

[0056] That is, internal conductors (210 to 270; 200) are formed on the upper portions of the plurality of sheets (100), and at least two or more internal conductors (200) are connected through via electrodes (310 to 360; 300). In other words, at least two or more internal conductors (200) are connected through vertical connection wires (300a, 300b, 300c). Therefore, two or three internal conductors (200) connected in the vertical direction each form one noise filter unit (2000), and three noise filter units (2100, 2200, 2300; 2000) are stacked in the vertical direction. That is, at least three noise filter units (2000) are formed in the stacking direction of the sheets (100). In addition, at least three noise filter units (2000) are connected to external electrodes (3000).

[0057] A first internal conductor (210) and a first lead electrode (410) are formed on a first sheet (101). A second internal conductor (220), a via electrode (310), and a second lead electrode (420) are formed on a second sheet (102) provided on an upper side of the first sheet (101). A third internal conductor (230), a plurality of horizontally spaced via electrodes (321, 322; 320), and a third lead electrode (430) are formed on a third sheet (230) provided on an upper side of the second sheet (102). A fourth internal conductor (240), a plurality of horizontally spaced via electrodes (331, 332, 333; 330), and a fourth lead electrode (440) are formed on a fourth sheet (104) provided on an upper side of a third sheet (103). A fifth internal conductor (250), a plurality of horizontally spaced via electrodes (341, 342, 343; 340), and a fifth lead electrode (450) are formed on a fifth sheet (105) provided on an upper side of a fourth sheet (104). A sixth internal conductor (260), a plurality of horizontally spaced via electrodes (351, 352; 350), and a sixth lead electrode (460) are formed on a sixth sheet (106) provided on an upper side of a fifth sheet (105). A seventh internal conductor (270), a via electrode (360), and a seventh lead electrode (470) are formed on a seventh sheet (107) provided on the upper side of the sixth sheet (106).

[0058] The first to seventh inner conductors (210 to 270; 200) may be, for example, in the shape of a spiral or coil pattern. More specifically, each of the first to seventh inner conductors (210 to 270; 200) may be formed by rotating in one direction from the central region of each of the first to seventh sheets (101 to 107) with a predetermined number of turns.

[0059] The first internal conductor (210) can be formed by rotating in one direction from an area corresponding to the via electrode (310) of the second sheet (102), and the second internal conductor (220) can be formed by rotating in one direction from an area spaced apart from the via electrode (310) by a predetermined distance and corresponding to the via electrode (321) of the third sheet (103). In addition, the third internal conductor (230) can be formed by rotating in one direction from an area spaced apart from the mutually spaced apart via electrodes (321, 322) by a predetermined distance and corresponding to the via electrode (331) of the fourth sheet (104). The fourth internal conductor (240) can be formed by rotating in one direction from a via electrode (333) formed in an area corresponding to the via electrode (310) of the second sheet (102) and the via electrode (322) of the third sheet (103). The fifth internal conductor (250) can be formed by rotating in one direction from a via electrode (342) formed in an area corresponding to the via electrode (332) of the fourth sheet (104). The sixth internal conductor (260) can be formed by rotating in one direction from a via electrode (351) formed in an area corresponding to the via electrode (341) of the fifth sheet (105). In addition, the seventh internal conductor (270) can be formed by rotating in one direction from a via electrode (360) formed in an area corresponding to the via electrode (352) of the sixth sheet (106).

[0060] In addition, the internal conductor (200) may be formed with a predetermined rotational speed, and may be formed with a rotational speed of 2 to 20. At this time, the rotational speeds of the internal conductors (200) may be different by at least one, for example, the first, third, and fifth internal conductors (210, 230, 250) may be formed with a rotational speed of 3 to 20, and the second, fourth, and sixth internal conductors (220, 240, 260) may be formed with a rotational speed of 2.5 to 18, respectively. That is, the rotational speeds of the first, third, and fifth internal conductors (210, 230, 250) may be equal to or greater than the rotational speeds of the second, fourth, and sixth internal conductors (220, 240, 260). In addition, the seventh internal conductor (270) may be formed with the same number of turns as the odd internal conductors (210, 230, 250) or may be formed with the same number of turns as the even internal conductors (220, 240, 260). However, the seventh internal conductor (270) may be formed with a different number of turns from the odd internal conductors (210, 230, 250) and the even internal conductors (220, 240, 260). Here, the impedance of the stacked electronic element can be controlled by controlling the number of turns of the impedance controlling internal conductor, i.e., the seventh internal conductor (270). The cause of the change in impedance of the multilayer electronic device is the mismatch between the impedance-adjusting internal conductor, i.e., the seventh internal conductor (270), which is arranged in parallel with the remaining internal conductors, i.e., the first to sixth internal conductors (210 to 260). Therefore, as the number of turns of the impedance-adjusting internal conductor decreases, the impedance increases. That is, as the mismatch section between the impedance-adjusting internal conductor and the remaining internal conductors becomes longer, the impedance changes rapidly. In other words, as the number of turns of the impedance-adjusting internal conductor decreases, the impedance changes rapidly.At this time, when the number of turns of the impedance-adjusting internal conductor changes, it has an intermediate impedance characteristic between the case where there is no impedance-adjusting internal conductor and the case where there is an impedance-adjusting internal conductor with the same number of turns as the remaining internal conductors.

[0061] In addition, the impedance of the stacked electronic device can be controlled depending on the spacing between the impedance-controlling internal conductor, i.e., the seventh internal conductor (270), and the internal conductor adjacent thereto on the lower side, i.e., the sixth internal conductor (260). For example, when the spacing between the first to seventh internal conductors (210 to 270) is the same, i.e., when the thicknesses of the first to seventh sheets (101 to 107) are the same, compared to the case where the spacing between the sixth internal conductor (260) and the seventh internal conductor (270) is wider, i.e., when the thickness of the seventh sheet (107) is thicker than the thicknesses of the first to sixth sheets (101 to 106), the coupling between the internal conductors is reduced, thereby increasing the impedance. Conversely, if the gap between the sixth internal conductor (260) and the seventh internal conductor (270) is narrow, i.e., if the thickness of the seventh sheet (107) is thinner than the thickness of the first to sixth sheets (101 to 106), the coupling between the internal conductors increases and the impedance decreases.

[0062] In addition, the inner conductor (200) may have a predetermined line width and spacing, and may be formed in a coil pattern or spiral that rotates outward in at least one direction, counterclockwise or clockwise. At this time, the line width of the inner conductor (200) may be the same or different, and the spacing may be the same or different. That is, the line spacing of the same inner conductor (200) may be different depending on the number of turns of the inner conductor (200). In addition, the inner conductor (200) may be formed with a line width of 5 ㎛ to 50 ㎛. At this time, the impedance can be adjusted depending on the line width and spacing of the inner conductor (200). That is, as the line width of the inner conductor (200) becomes narrower, the impedance increases, and as the line width becomes wider, the impedance decreases. In addition, as the spacing of the inner conductor (200) becomes narrower, the impedance decreases, and as the spacing becomes wider, the impedance increases. Meanwhile, the internal conductors (200) may have different rotation directions. For example, the first, second, and third internal conductors (210, 220, 230) may rotate clockwise, and the fourth, fifth, sixth, and seventh internal conductors (240, 250, 260, 270) may rotate counterclockwise. However, all internal conductors (200) may rotate in the same direction, clockwise or counterclockwise, or at least one internal conductor (200) may rotate in a different direction. Meanwhile, the internal conductors (200) may be formed in various shapes, such as straight lines and curved lines, in addition to a spiral shape. That is, the noise filter unit (2000) of the present invention may have a plurality of internal conductors that are connected vertically, and at least one of the plurality of internal conductors may have a spiral shape, and at least one may have a shape other than a spiral shape. Additionally, although not shown, a core structure may be formed on the inside of at least one internal conductor (300). That is, a magnetic material may be embedded in the central portion of the sheet (100) to form a core, and an internal conductor may be formed to surround the core. In this case, a via electrode may be formed on the outside of the core.That is, the via electrode can be formed on the outside of the core so that a plurality of internal conductors (200) can be formed to surround the core.

[0063] The inner conductor (200) can be connected to the lead electrodes (410 to 470; 400) that are led outward from the sheet (100). The first lead electrode (410) connected to the first inner conductor (210) is formed to be exposed to a predetermined area of ​​one long side of the first sheet (101). The second lead electrode (420) connected to the second inner conductor (220) is formed to be exposed to one long side of the second sheet (102) and is formed to be spaced apart from the first lead electrode (410). The third lead electrode (430) connected to the third inner conductor (230) is formed to be exposed to one long side of the third sheet (103) and is formed to be spaced apart from the first and second lead electrodes (410, 420). The fourth lead electrode (440) connected to the fourth internal conductor (240) is formed to be exposed to the other long side of the fourth sheet (104) and is formed to be exposed in an area corresponding to the first lead electrode (410). The fifth lead electrode (450) connected to the fifth internal conductor (250) is formed to be exposed to the other long side of the fifth sheet (105), is spaced apart from the fourth lead electrode (440), and is formed to correspond to the second lead electrode (420). The sixth lead electrode (460) connected to the sixth internal conductor (260) is formed to be exposed to the other long side of the sixth sheet (106), is spaced apart from the fourth and fifth lead electrodes (440, 450), and is formed to correspond to the third lead electrode (430). The seventh lead electrode (470) connected to the seventh internal conductor (270) is formed to be exposed to one long side of the seventh sheet (106) and is formed to overlap with the first lead electrode (410). Meanwhile, the lead electrode (400) is formed to have a width wider than the width of the internal conductor (200), and preferably, can be formed to have a width narrower than or equal to the width of the external electrode (3000).By forming the width of the extraction electrode (400) wider than the width of the internal conductor (200), the contact area with the external electrode (3000) can be increased, and accordingly, the contact resistance between the extraction electrode (400) and the external electrode (3000) can be reduced.

[0064]

[0065] As illustrated in FIGS. 2 and 3, the first, fourth, and seventh internal conductors (210, 240, 270) are connected through vertical connection wires (300a) to form a first noise filter unit (2100). That is, the seventh internal conductor (270) and the fourth internal conductor (240) are connected through a via electrode (360) formed on the seventh sheet (107), a via electrode (352) formed on the sixth sheet (106), a via electrode (343) formed on the fifth sheet (105), and a via electrode (333) formed on the fourth sheet (104). Additionally, the fourth internal conductor (240) and the first internal conductor (210) are connected through the via electrode (333) formed on the fourth sheet (104), the via electrode (322) formed on the third sheet (103), and the via electrode (310) formed on the second sheet (102). Accordingly, the first internal conductor (210), the fourth internal conductor (240), and the seventh internal conductor (270) are connected.

[0066] The second and fifth internal conductors (220, 250) are connected via vertical connection wiring (300b) to form a second noise filter unit (2200). That is, the via electrode (332) formed on the fourth sheet (104), the via electrode (321) formed on the third sheet (103) are connected to the fifth internal conductor (250) and the second internal conductor (220).

[0067] And, the third and sixth internal conductors (230, 260) are connected through vertical connection wiring (300c) to form a third noise filter unit (2300). That is, the sixth internal conductor (260) and the third internal conductor (230) are connected through a via electrode (351) formed on the sixth sheet (105), a via electrode (341) formed on the fifth sheet (104), and a via electrode (331) formed on the fourth sheet (104).

[0068] The method of connecting the internal conductors spaced apart from each other is not limited to the examples described above and can be changed in various ways.

[0069]

[0070] The via electrodes (310 to 360: 300) are formed to penetrate the sheet in the thickness direction. That is, as shown in the enlarged view of Fig. 2, a hole (h) is provided to penetrate the sheet (102 to 109), and when a conductive paste is filled or buried inside the hole (h) and then the laminate is sintered, the via electrodes (310 to 360: 300) are formed. That is, the via electrodes (310 to 360: 300) may be a sintered body obtained by sintering the conductive paste filled or buried in the hole (h).

[0071] The hole (h) may have a shape in which the inner diameter or width narrows downward, as illustrated in the enlarged view of Fig. 2, for example. Furthermore, the cross-sectional shape may be circular. Of course, the shape of the hole (h) is not limited to the above-described example and may be varied in various ways.

[0072] The materials of the conductive paste and via electrodes filled with holes (h) will be described in detail later.

[0073]

[0074] The first lead electrode (410) connected to the first internal conductor (210) is connected to the 1-1 external electrode (3110), and the fourth lead electrode (440) connected to the 4th internal conductor (240) is connected to the 2-1 external electrode (3210). In addition, the second lead electrode (420) connected to the 2nd internal conductor (220) is connected to the 1-2 external electrode (3120), and the 4th lead electrode (450) connected to the 5th internal conductor (250) is connected to the 2-2 external electrode (3220). Additionally, the third lead electrode (430) connected to the third internal conductor (230) is connected to the 1-3 external electrode (3130), and the sixth lead electrode (460) connected to the 6th internal conductor (260) is connected to the 2-3 external electrode (3230). In addition, the seventh lead electrode (470) connected to the 7th internal conductor (270) is connected to the 1-1 external electrode (3110) together with the 1st lead electrode (410). Accordingly, the first noise filter unit (2100) is connected between the 1-1 and 2-1 external electrodes (3110, 3210), the second noise filter unit (2200) is connected between the 1-2 and 2-2 external electrodes (3120, 3220), and the third noise filter unit (2300) is connected between the 1-3 and 2-3 external electrodes (3130, 3230).

[0075] The number of turns of the internal conductors (200) constituting each of the first to third noise filter units (2100, 2200, 2300) may be the same or different. Since the number of turns of the internal conductors (200) constituting the noise filter unit (2000) is different, a single stacked electronic element may have at least two or more impedance characteristics. In addition, the internal conductors (200) and the lead electrodes (400) formed on the plurality of sheets (100) according to the embodiment of the present invention may be formed of a conductive material such as a metal. Here, the internal conductors (200) and the lead electrodes (400) may be formed by a plating process, or may be formed by a printing or deposition process. For example, the internal conductors (200) and the lead electrodes (400) may be formed by a copper plating process, and at least a portion of the external electrodes (3000) connected to the lead electrodes (400) may be formed by a copper plating process. That is, at least a portion of the extraction electrode (400) and the external electrode (3000) in contact therewith can be formed of the same material and through the same process.

[0076] As described above, in the multilayer electronic device of the present invention, the number of connections of the internal conductors (200) of at least one noise filter unit (2000) among the plurality of noise filter units (2000) may be greater than the number of connections of the internal conductors (200) of the remaining noise filter units (2000). For example, the first noise filter unit (2100) may be formed by connecting three internal conductors (210, 240, 270), and the second and third noise filter units (2200, 2300) may be formed by connecting two internal conductors. In this way, the number of connections of the internal conductors of the first noise filter unit (2100) may be greater than the number of connections of the internal conductors of the second and third noise filter units (2200, 2300), thereby controlling the impedance of the multilayer electronic device. That is, by having at least one noise filter unit (2100) further include an impedance-adjusting internal conductor, the impedance can be improved compared to a structure without an impedance-adjusting internal conductor. However, the number of connected internal conductors (200) of the noise filter unit (2000) can be varied.

[0077]

[0078] 3. External electrode

[0079] The external electrodes (3000) may be provided on two opposing sides of the laminate (1000). That is, when the stacking direction of the sheets (100) is a vertical direction (i.e., Z direction), the external electrodes (3000) may be formed on two opposing sides in the horizontal direction (i.e., Y direction) that is opposite to the vertical direction of the laminate (1000). In addition, three external electrodes (3000) may be provided on each of the two sides. That is, two external electrodes (3000) may be formed on each of the two sides for the three noise filter units (2100, 2200, 2300). At this time, the external electrodes (3110, 3120, 3130) formed on one side of the laminate (1000) are referred to as the first external electrode (3100), and the external electrodes (3210, 3220, 3230) formed on the other side are referred to as the second external electrode (3200). These external electrodes (3000) are connected to the first to third noise filter units (2100, 2200, 2300) inside the laminate (1000), and can be connected to one terminal and another terminal, for example, a signal input terminal and a signal output terminal, outside the laminate (1000).

[0080] The first and second external electrodes (3100, 3200) may be formed to extend to the upper and lower surfaces of the laminate (1000). That is, the first and second external electrodes (3100, 3200) may be formed to extend to two surfaces of the laminate (1000) that face each other in the Z direction, that is, the upper and lower surfaces. Accordingly, the external electrodes (3000) may be formed to extend from the side surfaces of the laminate (1000) to the upper and lower surfaces, for example, to form a “ㄷ” shape. Of course, the external electrodes (3000) may also be formed on the side surfaces of the laminate (1000) and the surface on which the laminated electronic device of the present invention is mounted, for example, the lower surface, to form an “L” shape, for example. That is, the external electrodes (3000) may not be formed to extend to the upper surface of the laminate (1000), but may be formed to extend to the side surfaces and the lower surfaces of the laminate (1000).

[0081] The external electrode (3000) may be formed of at least one layer. The external electrode (3000) may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode (3000) may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. That is, the external electrode (3000) may be formed of a plurality of layers, and at least one layer formed on the surface of the laminate (1000) and connected to the lead electrode (400) may be formed of the same material and by the same process as the lead electrode (400). For example, the first layer of the external electrode (3000) that comes into contact with the surface of the laminate (1000) may be formed of copper plating, similar to the internal conductor (200) and the lead electrode (400). In this way, since the first layer of the external electrode (3000) is formed of the same material and the same method as the internal conductor (200) and the lead electrode (400), for example, by copper plating, the bonding strength between the external electrode (3000) and the lead electrode (400) can be improved. In addition, the external electrode (3000) can be formed by mixing a multi-component glass frit containing, for example, 0.5% to 20% of Bi2O3 or SiO2 as a main component with a metal powder. At this time, the mixture of the glass frit and the metal powder can be manufactured in a paste form and applied to two opposing surfaces of the laminate (1000). In this way, since the glass frit is included in the external electrode (3000), the adhesion strength of the external electrode (3000) laminate (1000) can be improved, and the contact reaction between the lead electrode (400) and the external electrode (3000) can be improved. In addition, after a conductive paste containing glass is applied, at least one plating layer may be formed on top of the conductive paste to form an external electrode (3000). That is, an external electrode (3000) may be formed by forming a metal layer containing glass and at least one plating layer on top of the metal layer.For example, the external electrode (3000) can be formed by sequentially forming a Ni plating layer and a Sn plating layer through electrolytic or electroless plating after forming a layer including glass frit and at least one of Ag and Cu. At this time, the Sn plating layer can be formed to a thickness equal to or thicker than the Ni plating layer. Meanwhile, the external electrode (3000) can be formed to a thickness of 2 µm to 100 µm, the Ni plating layer can be formed to a thickness of 1 µm to 10 µm, and the Sn or Sn / Ag plating layer can be formed to a thickness of 2 µm to 10 µm.

[0082]

[0083] 4. Surface modification member

[0084] The surface modification member (not shown) may be formed on at least a portion of the surface of the laminate (1000). That is, the surface modification member may be formed on the entire surface of the laminate (1000), or may be formed only in an area that is in contact with the external electrode (3000) of the laminate (1000). In other words, the surface modification member formed on a portion of the surface of the laminate (1000) may be formed between the laminate (1000) and the external electrode (3000). At this time, the surface modification member may be formed in contact with an extended area of ​​the external electrode (3000). That is, the surface modification member may be provided between an area of ​​the external electrode (3000) that is formed to extend to the upper and lower surfaces of the laminate (1000) and the laminate (1000). This surface modification member may be formed on the surface of the laminate (1000) on which at least a portion of the glass layer is formed, or may be formed on the surface of the laminate (1000) on which the glass layer is not formed. In addition, the surface modification member may be provided with a size equal to or different from that of the external electrode (3000) formed thereon. For example, the surface modification member may be formed with an area that is 50% to 150% larger than the area of ​​a portion of the external electrode (3000) that extends to the upper and lower surfaces of the laminate (1000). That is, the surface modification member may be formed with a size smaller or larger than the size of the extended region of the external electrode (3000), or may be formed with the same size. Of course, the surface modification member may also be formed between the external electrode (3000) formed on the side surface of the laminate (1000). This surface modification member may include a glass material. For example, the surface modification member may include non-borosilicate glass (SiO2-CaO-ZnO-MgO glass) that can be fired at a predetermined temperature, for example, 950°C or lower. In addition, the surface modification member may further include a magnetic material.That is, if the area where the surface modification member is to be formed is made of a magnetic sheet, a magnetic material may be included in the surface modification member to facilitate bonding between the surface modification member and the magnetic sheet. At this time, the magnetic material includes, for example, a NiZnCu-based magnetic powder, and may include, for example, 1 to 15 wt% of the magnetic material with respect to 100 wt% of the glass material. Meanwhile, at least a portion of the surface modification member may be formed on the surface of the laminate (1000). At this time, at least a portion of the glass material may be evenly distributed on the surface of the laminate (1000), or at least a portion may be irregularly distributed with different sizes. Of course, the surface modification member may be continuously formed on the surface of the laminate (1000) to have a film shape. In addition, a concave portion may be formed on at least a portion of the surface of the laminate (1000). That is, the glass material may be formed to form a convex portion, and at least a portion of an area where the glass material is not formed may be sunken to form a concave portion. At this time, the glass material may be formed at a predetermined depth from the surface of the laminate (1000), and at least a portion thereof may be formed higher than the surface of the laminate (1000). That is, at least a portion of the surface modification member may be flush with the surface of the laminate (1000), and at least a portion thereof may be maintained higher than the surface of the laminate (1000). In this way, by distributing the glass material in a portion of the laminate (1000) before forming the external electrode (3000) to form the surface modification member, the surface of the laminate (1000) may be modified, and thus the resistance of the surface may be made uniform. Therefore, the shape of the external electrode may be controlled, and thus the formation of the external electrode may be facilitated. Meanwhile, in order to form the surface modification member in a predetermined region of the surface of the laminate (1000), a paste including the glass material may be printed or applied to a predetermined region of a predetermined sheet.For example, a glass paste may be applied to six areas on the lower surface of the 8th sheet (108) and six areas on the upper surface of the 9th sheet (109), and then cured to form a surface modification member. In addition, the glass paste may be applied to a predetermined area of ​​a ceramic green sheet before cutting to the size of a laminated electronic device. That is, after applying a glass paste to multiple areas of a ceramic green sheet, the green sheet may be cut along a cutting line of a laminated electronic device unit, including a portion where the glass paste is formed, and this may be laminated with a sheet on which a noise filter portion or the like is formed, thereby manufacturing a laminated electronic device. At this time, since the surface modification member is formed at the edge of the laminate (1000), it may be cut into laminated electronic device units centered around the area where the glass paste is applied.

[0085] Meanwhile, the surface modification member may be formed using an oxide. That is, the surface modification member may be formed using at least one of a glassy material and an oxide, and may further include a magnetic material. At this time, the surface modification member may be a crystalline or amorphous oxide dispersed and distributed on the surface of the laminate (1000), and at least a portion of the oxide distributed on the surface may be melted. In addition, even when the surface modification member is formed of an oxide, the oxides may be spaced apart from each other and distributed in an island form, and may be formed in a film form in at least one region. Here, the oxide in a particle state or a molten state may use at least one or more of, for example, Bi2O3, BO2, B2O3, ZnO, Co3O4, SiO2, Al2O3, MnO, H2BO3, H2BO3, Ca(CO3)2, Ca(NO3)2, and CaCO3.

[0086]

[0087] As described above, in an embodiment of the present invention, a plurality of internal conductors (200) are formed in a laminate (1000) in which a plurality of sheets (100) are laminated, and at least two or more of the internal conductors (200) are connected to each other to form one noise filter unit (2000), and at least three or more of these noise filter units (2000) are implemented in the laminate (1000). In addition, the plurality of noise filter units (2000) are connected to a plurality of external electrodes (3000) formed on the outside of the laminate (1000) and are provided between signal lines. Therefore, common mode noise occurring simultaneously in three signal lines and common mode noise occurring between two signal lines can be removed, and thus, it can be applied to a C-PHY.

[0088] In addition, the number of connections of at least one internal conductor (200) among the plurality of noise filter units (2000) may be greater than the number of connections of the internal conductors (200) of the remaining noise filter units (2000). For example, the first noise filter unit (2100) may be formed by connecting three internal conductors (210, 240, 270), and the second and third noise filter units (2200, 2300) may be formed by connecting two internal conductors. In this way, since the number of connections of the internal conductors of the first noise filter unit (2100) is greater than the number of connections of the internal conductors of the second and third noise filter units (2200, 2300), the impedance of the stacked electronic device can be more easily controlled. That is, since at least one noise filter unit (2100) further includes an impedance-controlling internal conductor, the impedance can be improved compared to a structure without an impedance-controlling internal conductor.

[0089]

[0090] In the above-described embodiment, a case is described where the number of connections of at least one internal conductor (200) among a plurality of noise filter units (2000) is greater than the number of connections of the internal conductors (200) of the remaining noise filter units (2000).

[0091] However, the present invention is not limited thereto, and a plurality of noise filter units (2000) may have the same number of internal conductors (2000) connected. For example, the first to third noise filter units (2100 to 2300) may be formed by connecting two internal conductors.

[0092] In this case, the first internal conductor (210) and the seventh internal conductor (210, 240, 270) may be connected through a vertical connection wire (300a) to form a first noise filter unit (2100). More specifically, the stacked electronic device may not have a seventh sheet and a seventh internal conductor. In addition, the fourth internal conductor (240) and the first internal conductor (210) may be connected through a via electrode (333) formed on the fourth sheet (104), a via electrode (322) formed on the third sheet (103), and a via electrode (310) formed on the second sheet (102), to form a first noise filter unit (2100).

[0093] In addition, the above description describes that each of the plurality of noise filter units (2000) is formed with a structure in which two internal conductors are connected. However, this is not limited thereto, and each of the plurality of noise filter units (2000) may be formed by connecting various numbers of internal conductors exceeding two.

[0094]

[0095] FIG. 4(a) is a conceptual diagram illustrating a conductive paste filled into holes provided in the second sheet and the third sheet in the laminated electronic device according to the embodiment of the present invention illustrated in FIGS. 2 and 3. FIG. 4(b) is a conceptual diagram illustrating an example in which a gap is generated between via electrodes arranged vertically when FIG. 4(a) is sintered, and is an enlarged view of 'B' in FIG. 3.

[0096] Hereinafter, a method for manufacturing a laminated electronic device according to an embodiment is briefly described. Here, the Si-Fi filter illustrated in FIGS. 1 to 4 is described as an example.

[0097] First, the first to seventh sheets (101 to 107) are prepared. Then, internal conductors (210 to 270) are formed in each of the first to seventh sheets, and holes (h) are provided. That is, holes (h) are provided in each of the second to seventh sheets (102 to 107). The holes (h) may have a shape in which the width or inner diameter decreases downward toward the lower surface, as illustrated in (a) or (b) of FIG. Then, conductive paste is embedded or filled into the holes (h). Thereafter, the first to seventh sheets (101 to 107) are laminated to form a laminate (1000). Next, the laminate (1000) is heated and sintered. More specifically, the laminate (1000) is heated to a temperature of 850°C to 950°C, more preferably 880°C to 920°C, and sintered. After the sintering process is completed, a conductive material is applied to one side and the other side of the laminate (1000) to form first and second external electrodes (3100, 3200). Thus, a laminated electronic device including first to third noise filter units (2100 to 2300) is manufactured.

[0098] For convenience of explanation, in the following, conductive paste in a sintered state or conductive paste that has gone through a sintering process is defined as a ‘via electrode.’

[0099] Meanwhile, during the process of sintering the laminate (1000), the conductive paste embedded in the interior of the hole (h) may shrink. More specifically, referring to Fig. 4, when the conductive paste (P) is embedded in the interior of the hole (h), the conductive paste (P) is embedded so that it is distributed throughout the interior of the hole (h), as shown in Fig. 4 (a). For example, the conductive paste (P) is embedded so that there is no empty space inside the hole (h).

[0100] However, during the sintering process of the laminate (1000), the conductive paste (P) shrinks. Accordingly, the area occupied by the via electrode after the sintering process is smaller than the area occupied by the conductive paste (P) inside the hole (h) before the sintering process. More specifically, the thickness (T2) of the via electrode after the sintering process is smaller than the thickness (T1) of the conductive paste embedded inside the hole before the sintering process.

[0101] Here, the thickness (T1) of the conductive paste may be the same as the thickness of the hole, and the thickness of the hole may be the same in the width direction or the horizontal direction. The thickness (T2) of the via electrode may refer to the thickness at the center in the width direction. In addition, since the via electrode is formed by sintering the conductive paste, the 'thickness (T2) of the via electrode' may have the same meaning as the 'thickness (T2) of the sintered conductive paste.' In addition, since the via electrode is formed by sintering the conductive paste, the 'thickness (T2) of the conductive paste before the sintering process' may have the same meaning as the 'thickness (T2) of the via electrode before the sintering process.'

[0102] In this way, the thickness (T2) of the via electrode (310 to 360; 300) after the sintering process is smaller than the thickness (T1) of the conductive paste (P) before the sintering process because the conductive paste (P) shrinks due to the sintering process.

[0103] Accordingly, a plurality of via electrodes (310 to 360; 300) provided on a plurality of sheets (102 to 107) may not be in contact or connected to each other, or a via electrode (310 to 360; 300) and an internal conductor (310 to 360; 300) may not be in contact or connected.

[0104] For example, as illustrated in (b) of FIG. 4, the via electrode (310) provided on the second sheet (102) and the via electrode (322) provided on the third sheet (103) may not be in contact, or the via electrode (322) provided on the third sheet (103) and the via electrode (333) provided on the fourth sheet (104) may not be in contact. In addition, the via electrode (310) provided on the second sheet (102) and the first internal conductor (210) provided on the first sheet (101) may not be in contact. Accordingly, the vertical connection wiring (300a) may be short-circuited, and as a result, the seventh internal conductor (270) and the fourth internal conductor (240) may not be connected, or the fourth internal conductor (240) and the first internal conductor (210) may not be connected. Due to this, the first noise filter unit (2100) may not operate.

[0105] The above describes a case where the via electrodes constituting the first noise filter unit (2100) are not connected, or where the via electrodes and the internal conductor are not connected. However, the problem due to shrinkage of the conductive paste during sintering may also occur in the second noise filter unit (2200) and the third noise filter unit (2300).

[0106]

[0107] A conductive paste according to an embodiment of the present invention can suppress or prevent shrinkage due to sintering. Hereinafter, a conductive paste according to an embodiment of the present invention will be described.

[0108] A conductive paste according to an embodiment of the present invention comprises a conductive composition and a binder. The binder may include, for example, at least one of an acrylic material and an ethylene carbonate (EC) material.

[0109] The conductive composition includes silver (Ag) and palladium (Pd). Of the total (100 wt%) of the conductive composition, silver (Ag) may be included in an amount of more than 50 wt% and less than 99.5 wt%, and palladium (Pd) may be included in an amount of more than 0.5 wt% and less than 50 wt%. More preferably, of the total (100 wt%) of the conductive composition, silver (Ag) may be included in an amount of 70 wt% to 95 wt%, and palladium (Pd) may be included in an amount of 5 wt% to 30 wt%.

[0110] The content of palladium (Pd) in the total (100 wt%) of the conductive composition can be varied within a range of 0.5 wt% to 50 wt%, and thus the remaining balance can be varied so that the content is silver (Ag). That is, in manufacturing the conductive composition, the content of palladium (Pd) can be varied within a range of 0.5 wt% to 50 wt% depending on the desired purpose of improving sinterability and suppressing shrinkage. For example, the content of palladium (Pd) can be adjusted to any one of more than 0.5 wt% and less than 5 wt%, 5 wt% to 30 wt%, 30 wt% to less than 50 wt%, more than 0.5 wt% and less than 10 wt%, 5 wt% to 10 wt%, 10 wt% to 20 wt%, 5 wt% to 15 wt%, 20 wt% to 30 wt%, 15 wt% to 30 wt%, 30 wt% to 40 wt%, 25 wt% to 35 wt%, 40 wt% to less than 50 wt%, 45 wt% to less than 50 wt%, and 30 wt% to less than 50 wt%. Of course, the content of palladium (Pd) can be variously changed within the range of more than 0.5 wt% and less than 50 wt%.

[0111] The temperature at which silver (Ag) included in the conductive composition is sintered is 800°C to 920°C, and the temperature at which palladium (Pd) is sintered is 1100°C to 1200°C. In addition, silver (Ag) may shrink at a temperature of 850°C to 950°C, which is the temperature at which the laminate (1000) is sintered. On the other hand, palladium (Pd) may expand at a temperature of 850°C to 950°C, which is the temperature at which the laminate (1000) is sintered.

[0112] Therefore, when a conductive composition containing more than 50 wt% and less than 99.5 wt% of silver (Ag) and more than 0.5 wt% and less than 50 wt% of palladium (Pd) is sintered at 850°C to 950°C, shrinkage due to silver (Ag) can be compensated for by expansion due to palladium (Pd). Therefore, when sintering the laminate (1000), shrinkage of the conductive composition, i.e., the conductive paste, can be suppressed or prevented.

[0113] When the conductive paste is sintered, all or most of the binder may be vaporized and removed. Accordingly, the component content of the via electrode formed by sintering the conductive paste may be the same as or similar to the conductive composition. That is, the via electrode may include more than 50 wt% and less than 99.5 wt% of silver (Ag) and more than 0.5 wt% and less than 50 wt% of palladium (Pd).

[0114] Meanwhile, if the content of palladium (Pd) is 0.5 wt% or less among the total (100 wt%) of the conductive composition, the shrinkage suppression effect due to palladium (Pd) may be absent or minimal. Accordingly, the conductive paste may shrink significantly during sintering of the laminate (1000). Accordingly, at least one of the plurality of vertical connection wires (300a to 300c) may be short-circuited.

[0115] For example, at least one of the conductive paste embedded in the hole of the seventh sheet (107), the conductive paste embedded in the hole of the sixth sheet (106), and the conductive paste embedded in the hole of the fifth sheet (105) may shrink significantly. Accordingly, a gap may be generated between the via electrode (360) formed in the hole of the seventh sheet (107) and the via electrode (352) formed in the hole of the sixth sheet (106), and thus they may not be connected. In addition, a gap may be generated between the via electrode (352) formed in the hole of the sixth sheet (106) and the via electrode (343) formed in the hole of the fifth sheet (105), and thus they may not be connected. As a result, the seventh internal conductor (270) and the fourth internal conductor (240) may not be connected, and thus the first noise filter unit (2100) may not operate.

[0116] Conversely, if the content of palladium (Pd) is 50 wt% or more among the total (100 wt%) of the conductive composition, the conductive paste may not be sufficiently sintered during the sintering process of the laminate (1000). That is, the sintering of the conductive paste may be insufficient. In this case, the outermost surface of the via electrode may not be uniform, which may increase the resistance of the via electrode. This may deteriorate the reliability of the laminated device.

[0117]

[0118] The stacked electronic device including a via electrode formed using a conductive paste according to an embodiment of the present invention is not limited to those shown in FIGS. 1 to 3.

[0119] A laminated electronic device including a via electrode formed using a conductive paste according to an embodiment of the present invention may be a laminated electronic device as illustrated in FIGS. 5 to 7.

[0120] Fig. 5 is a perspective view of a laminated electronic device according to a second embodiment of the present invention. Fig. 6 is a drawing schematically showing the appearance of each sheet included in a laminated electronic device according to a second embodiment of the present invention. Fig. 7 is a drawing for explaining the internal structure of a laminated electronic device according to a second embodiment of the present invention.

[0121] Referring to FIGS. 5 to 7, a laminated electronic device according to a second embodiment of the present invention includes a laminate (1000) including a first filter portion (1100) in which at least three sheets each having internal conductors formed thereon and an outgoing electrode sheet each having an outgoing electrode formed thereon are laminated, and an external electrode portion (2000) provided on the outside of the laminate (1000) and connected to the first filter portion (1100), wherein at least some of the internal conductors are connected to the outgoing electrode sheet by a via electrode, and the number of via electrodes positioned on the inside of the internal conductor formed on at least one sheet among the sheets is characterized in that three. The laminated electronic device according to the second embodiment may be a noise filter.

[0122] The external electrodes (2000) may be provided on each of two opposing sides of the laminate (1000). That is, the external electrodes (2000) may be formed on two opposing sides of the laminate (1000) in the other direction (for example, the Y direction). In addition, three external electrodes (2000) may be provided on each of the two sides. That is, the external electrodes may include a first external electrode (2100), a second external electrode (2200), and a third external electrode (2300) provided on one side, and a fourth external electrode (2400), a fifth external electrode (2500), and a sixth external electrode (2600) provided on the other side.

[0123] The external electrodes (2000) may be formed to extend to the upper and lower surfaces of the laminate (1000), respectively. That is, each external electrode (2000) may be formed to extend to the upper and lower surfaces that face each other in the vertical direction (e.g., Z direction) of the laminate (1000), and may be formed, for example, in a “ㄷ” shape.

[0124] Hereinafter, a laminate (1000) according to a second embodiment of the present invention will be described in more detail.

[0125] The laminate (1000) may include a first filter unit (1100) in which a plurality of sheets and an output electrode sheet are laminated. Here, an internal conductor may be formed on each of the plurality of sheets, and an output electrode may be formed on each of the output electrode sheets. In the second embodiment of the present invention, the first filter unit (1100) included in the laminate (1000) may include at least three sheets and output electrode sheets. That is, the first filter unit (1100) may include at least three sheets and output electrode sheets to form three signal lines. As such, the first filter unit (1100) may generate a first resonant frequency capable of removing frequency noise within the laminated electronic device. For example, the first filter unit (1100) may generate the first resonant frequency in a band of 1.5 to 3 GHz.

[0126] Below, the first filter unit (1100) is formed with a first sheet (1110) having a first internal conductor (111) formed, a second sheet (1120) having a second internal conductor (112) formed, a third sheet (1130) having a third internal conductor (113) formed, a fourth sheet (1140) having a fourth internal conductor (114) formed, a fifth sheet (1150) having a fifth internal conductor (115) formed, and a sixth sheet (1160) having a sixth internal conductor (116) formed, and an upper lead electrode sheet (1170) having a first lead electrode (117-1), a second lead electrode (117-2), and a third lead electrode (117-3) formed, and a fourth lead electrode (118-1), a fifth lead electrode (118-2), and a sixth lead electrode A structure including a lower electrode sheet (1180) on which an electrode (118-3) is formed will be described as an example. However, it goes without saying that the number of sheets and electrode sheets included in the first filter unit (1100) can be varied and applied within the range of forming three signal lines within the first filter unit (1100).

[0127] As illustrated in FIG. 6, the first filter unit (1100) according to the second embodiment of the present invention is formed by sequentially stacking, from top to bottom, an upper lead electrode sheet (1170), a first sheet (1110), a second sheet (1120), a fifth sheet (1150), a third sheet (1130), a sixth sheet (1160), a fourth sheet (1140), and a lower lead electrode sheet (1180). In addition, the first filter unit (1100) may further include a cover layer (1190) provided on the upper surface of the first sheet (1110). Such a cover layer may be formed of ferrite.

[0128] Three extraction electrodes are formed on the upper extraction electrode sheet (1170). That is, the upper extraction electrode sheet (1170) includes a first extraction electrode (117-1), a second extraction electrode (117-2), and a third extraction electrode (117-3), the outer ends of which are respectively connected to the first external electrode (2100), the second external electrode (2200), and the third external electrode (2300). At this time, the inner ends of the first extraction electrode (117-1), the second extraction electrode (117-2), and the third extraction electrode (117-3) may be arranged on the center side of the upper extraction electrode sheet (1170), and more specifically, the other end of the second extraction electrode (117-2) may be arranged on the right side of the other end of the first extraction electrode (117-1), and the other end of the third extraction electrode (117-3) may be arranged on the left side of the other end of the first extraction electrode (117-1). Such extraction electrodes may be formed with a width wider than the inner conductor formed on the sheet, and preferably, may be formed with a width narrower than or equal to the width of the outer electrode (2000).

[0129] A first sheet (1110) is provided on the lower side of the upper lead electrode sheet (1170), and a first internal conductor (111) is formed on the first sheet (1110). The first internal conductor (111) can be formed by rotating in one direction at the inner center of the first sheet (1110) with a predetermined number of turns. That is, the first internal conductor (111) can be formed to extend toward the outside of the first sheet (1110) so that the inner end is positioned at the inner center of the first sheet (1110) and the outer end is connected to the fourth external electrode (2400).

[0130] Here, the inner end of the first internal conductor (111) is connected to the first lead electrode (117-1) by the first via electrode (11). That is, the first via electrode (11) can extend downward from the inner end of the first lead electrode (117-1) and penetrate the upper lead electrode sheet (1170) to be connected to the inner end of the first internal conductor (111).

[0131] A second sheet (1120) is provided on the lower side of the first sheet (1110), and a second internal conductor (112) is formed on the second sheet (1120). The second internal conductor (112) can be formed by rotating in one direction on the right side of the inner center of the second sheet (1120) with a predetermined number of turns. That is, the second internal conductor (112) can be formed to extend toward the outside of the second sheet (1120) so that the inner end is positioned on the right side of the inner center of the second sheet (1120) and the outer end is connected to the fifth external electrode (2500).

[0132] Here, the inner end of the second internal conductor (112) is connected to the second lead electrode (117-2) by the second via electrode (12). That is, the second via electrode (12) can extend downward from the inner end of the second lead electrode (117-2) and penetrate the upper lead electrode sheet (1170) and the first sheet (1110) to be connected to the inner end of the second internal conductor (112).

[0133] A fifth sheet (1150) is provided on the lower side of the second sheet (1120), and a fifth internal conductor (115) is formed on the fifth sheet (1150). The fifth internal conductor (115) is connected in parallel with the second internal conductor (112), and the fifth internal conductor (115) can be formed to rotate in one direction on the right side of the inner center of the fifth sheet (1150) with a predetermined number of turns. That is, the fifth internal conductor (115) can be formed to extend toward the outside of the second sheet (1120) so that the inner end is located on the right side of the inner center of the fifth sheet (1150) and the outer end is connected to the fifth external electrode (2500).

[0134] Here, the inner end of the fifth internal conductor (115) is connected to the inner end of the second internal conductor (112) by the second via electrode (12). That is, the second via electrode (12) can extend downward from the inner end of the second lead electrode (117-2) and penetrate the upper lead electrode sheet (1170), the first sheet (1110), and the second sheet (1120) to be connected to the inner end of the fifth internal conductor (115).

[0135] A third sheet (1130) is provided on the lower side of the fifth sheet (1150), and a third internal conductor (113) is formed on the third sheet (1130). The third internal conductor (1130) can be formed by rotating in one direction from the left side of the inner center of the third sheet (1130) with a predetermined number of turns. That is, the third internal conductor (113) can be formed to extend toward the outside of the third sheet (1130) so that the inner end is positioned at the left side of the inner center of the third sheet (1130) and the outer end is connected to the sixth external electrode (2600).

[0136] Here, the inner end of the third internal conductor (113) is connected to the sixth lead electrode (118-3) by the sixth via electrode (16). That is, the sixth via electrode (16) can extend upward from the inner end of the sixth lead electrode (118-3) and penetrate the fourth sheet (1140), the sixth sheet (1160), and the third sheet (1130) to be connected to the inner end of the third internal conductor (113).

[0137] The sixth sheet (1160) is provided on the lower side of the third sheet (1130), and a sixth internal conductor (116) is formed on the sixth sheet (1160). The sixth internal conductor (116) is connected in parallel with the third internal conductor (113), and the sixth internal conductor (116) can be formed to rotate in one direction at the left side of the inner center of the sixth sheet (1160) with a predetermined number of turns. That is, the sixth internal conductor (116) can be formed to extend toward the outside of the second sheet (1120) so that the inner end is located at the left side of the inner center of the sixth sheet (1160) and the outer end is connected to the sixth external electrode (2600).

[0138] Here, the inner end of the sixth internal conductor (116) is connected to the sixth lead electrode (118-3) by the sixth via electrode (16). That is, the sixth via electrode (16) can extend upward from the inner end of the sixth lead electrode (118-3) and penetrate the fourth sheet (1140) and the sixth sheet (1160) to be connected to the inner end of the sixth internal conductor (116).

[0139] A fourth sheet (1140) is provided on the lower side of the sixth sheet (1160), and a fourth internal conductor (114) is formed on the fourth sheet (1140). The fourth internal conductor (114) is connected in parallel with the first internal conductor (111), and the fourth internal conductor (114) can be formed to rotate in one direction at the inner center of the fourth sheet (1140) with a predetermined number of turns. That is, the fourth internal conductor (114) can be formed to extend toward the outside of the fourth sheet (1140) so that the inner end is positioned at the inner center of the fourth sheet (1140) and the outer end is connected to the fourth external electrode (2400).

[0140] Here, the inner end of the fourth internal conductor (114) is connected to the fourth lead electrode (118-1) by the fourth via electrode (14). That is, the fourth via electrode (14) can extend upward from the inner end of the fourth lead electrode (118-1) and penetrate the fourth sheet (1140) to be connected to the inner end of the fourth internal conductor (114).

[0141] Three extraction electrodes are formed on the lower extraction electrode sheet (1180). That is, the lower extraction electrode sheet (1180) includes a fourth extraction electrode (118-1), a fifth extraction electrode (118-2), and a sixth extraction electrode (118-3), the outer ends of which are respectively connected to the fourth external electrode (2400), the fifth external electrode (2500), and the sixth external electrode (2600). At this time, the inner ends of the fourth extraction electrode (118-1), the fifth extraction electrode (118-2), and the sixth extraction electrode (118-3) may be arranged on the center side of the lower extraction electrode sheet (1180), and more specifically, the other end of the fifth extraction electrode (118-2) may be arranged on the right side of the other end of the fourth extraction electrode (118-1), and the other end of the sixth extraction electrode (118-3) may be arranged on the left side of the other end of the fourth extraction electrode (118-1). Such extraction electrodes may be formed with a width wider than the inner conductor formed on the sheet, and preferably, may be formed with a width narrower than or equal to the width of the outer electrode (2000).

[0142] In the second embodiment of the present invention, the third via electrode (13) extends from the inner end of the third lead electrode (117-3) to penetrate the first sheet (1110), so that the number of via electrodes positioned on the inner side of the first internal conductor (111) can be three. Here, the third via electrode (13) extending from the inner end of the third lead electrode (117-3) has an open stub structure that is not connected to the internal conductors. The third via electrode (13) having the open stub structure in this way can form a capacitance with an adjacent internal conductor, that is, the first internal conductor (111), the first via electrode (11), or the second via electrode (12) surrounding the third via electrode (13). That is, the third via electrode (13) forms a capacitor with the first internal conductor (111), the first via electrode (11), or the second via electrode (12), thereby removing noise located at a low frequency compared to the case where the capacitor is not formed in this way. That is, it allows the peak in the filter insertion loss curve to be moved to a lower frequency. Accordingly, when the length of the coil cannot be increased any further due to the limited space characteristic of the stacked electronic device, the noise removal band selectivity can be broadened by adding such an open stub structure. When such a third via electrode is formed to extend through not only the first sheet (1110) but also the second sheet (1120), the capacitance can be further improved.

[0143] In addition, in the second embodiment of the present invention, the fifth via electrode (15) may be extended from the inner end of the fifth lead electrode (118-2) to penetrate the fourth sheet (1140), so that the number of via electrodes positioned on the inner side of the fourth internal conductor (114) may be three. Here, the fifth via electrode (15) extending from the inner end of the fifth lead electrode (118-2) has an open stub structure that is not connected to the internal conductors. The fifth via electrode (15) having the open stub structure in this way may form a capacitance with an adjacent internal conductor, that is, the fourth internal conductor (114), the fourth via electrode (14), or the sixth via electrode (16) surrounding the fifth via electrode (15). That is, the fifth via electrode (15) forms a capacitor with the fourth internal conductor (114), the fourth via electrode (14), or the sixth via electrode (16), thereby removing noise located at a low frequency compared to the case where the capacitor is not formed in this way. That is, it allows the peak in the filter insertion loss curve to be moved to a lower frequency. Accordingly, when the length of the coil cannot be increased any further due to the limited space characteristic of the stacked electronic device, the noise removal band selectivity can be broadened by adding such an open stub structure. When such a fifth via electrode is formed to extend through not only the fourth sheet (1140) but also the sixth sheet (1160), the capacitance can be further improved.

[0144] The second filter unit (1200) may include a capacitor and an inductor formed to be spaced apart from the first filter unit (1100) in the vertical direction (Z direction). Here, a ground electrode unit (3000) connected to a portion of the second filter unit (1200) may be formed on the outside of the laminate (1000).

[0145] The second filter unit (1200) is formed on a different sheet from the first filter unit (1100), and may be formed by stacking sheets in which a capacitor and an inductor are formed on the lower side of the first filter unit (1200) in the stacking direction. This second filter unit (1200) can generate a second resonant frequency in a frequency band higher than the frequency band that the first filter unit (1100) can remove within the stacked electronic device due to the capacitance of the capacitors (121, 122) and the inductance of the inductors (123-1, 123-2). For example, the second filter unit (1200) can generate a second resonant frequency in a frequency band exceeding 3 GHz or 4 GHz to 7 GHz. It goes without saying that the second filter unit (1200) can be modified into various forms in addition to the illustrated structure.

[0146] In this way, according to the second embodiment of the present invention, noise removal performance can be improved by positioning three via electrodes on the inner side of the internal conductor formed on at least one sheet.

[0147] That is, at least one of the three via electrodes located on the inner side of the internal conductor forms a capacitor with the adjacent via electrode or the internal conductor, thereby removing noise in an extended frequency band.

[0148] In addition, it is possible to remove noise in a more extended frequency band by including a first filter section capable of removing noise in a specific frequency band and a second filter section capable of removing noise in a different frequency band from the first filter section.

[0149] Accordingly, wideband frequency noise can be removed from portable electronic devices using various frequency bands.

[0150]

[0151] In the laminated electronic device according to the second embodiment, the via electrodes (11 to 16) can be formed with a conductive paste according to the embodiment. That is, a conductive paste is filled in each of a plurality of holes provided in the first sheet (1110) and a plurality of holes provided in the fourth sheet (1140), and then the laminate is sintered to form the first to sixth via electrodes (11 to 16). Therefore, shrinkage of the conductive paste, which is a raw material for the via electrodes, can be suppressed or prevented during sintering. Accordingly, a gap can be prevented from occurring between the via electrodes and internal conductors arranged vertically, or between the via electrodes and the lead electrodes.

[0152]

[0153] Fig. 8 is an optical microscope photograph and experimental data summarizing the shrinkage ratio for a via electrode sintered at 900°C after filling conductive paste according to Comparative Examples 1 to 5 and Embodiments 1 and 2 into holes respectively prepared in a plurality of sheets. At this time, the experiment was conducted using the laminated electronic device according to Embodiment 1 illustrated in Figs. 1 to 3 as a model. That is, holes were prepared in a plurality of sheets constituting the laminated electronic device according to Embodiment 1, and conductive paste was filled in the holes to form via electrodes.

[0154] The conductive pastes according to Comparative Examples 1 to 5 and Embodiments 1 and 2 include a conductive composition and a binder. In this case, Comparative Examples 1 to 5 and Embodiments 1 and 2 have the same content of the conductive composition and binder for the entire conductive paste.

[0155] The conductive composition according to Comparative Example 1 contains silver (Ag) and does not contain palladium (Pd). That is, the conductive composition according to Comparative Example 1 contains 100 wt% silver (Ag) and 0 wt% palladium (Pd).

[0156] The conductive compositions according to the second to fifth comparative examples and the first and fourth embodiments contain silver (Ag) and palladium (Pd).

[0157] At this time, in terms of the content of palladium (Pd) in the conductive composition, the second comparative example is 0.3 wt% (0.5 wt% or less), the third comparative example is 0.5 wt% (0.5 wt% or less), the fourth comparative example is 50 wt% (50 wt% or more), and the fifth comparative example is 55 wt% (50 wt% or more).

[0158] And, in terms of the content of palladium (Pd) in the conductive composition, the first embodiment is 5 wt%, and the second embodiment is 30 wt%.

[0159]

[0160] After the conductive paste according to the first to fifth comparative examples and the first and second embodiments described above was inserted into the hole of the sheet, a sintering process was performed at 900°C. After the sintering process was completed, the interior and surrounding area of ​​the hole were photographed using an optical microscope, and the results are shown in Fig. 8.

[0161] In addition, the shrinkage ratio for Comparative Examples 1 to 5 and Embodiments 1 and 2 was measured. More specifically, referring to (a) and (b) of Fig. 4, the thickness (T1) of the conductive paste filled into the hole is measured before sintering (see (a) of Fig. 4). Here, the thickness (T1) of the conductive paste filled into the hole may be the same as the thickness of the hole. Then, the thickness (T2) of the via electrode is measured after the sintering process is completed (see (b) of Fig. 4). At this time, the thickness (T1) of the conductive paste filled into the hole and the thickness (T2) of the via electrode were measured before sintering. That is, the thickness (T1) of the conductive paste and the thickness (T2) of the via electrode at the center of the width direction of the hole were measured.

[0162] For the convenience of the following explanation, the thickness (T1) of the conductive paste filled into the inside of the hole before sintering is named the first thickness (T1), and the thickness (T2) of the via electrode measured after the sintering process is named the second thickness (T2).

[0163] Next, the difference (T) between the first thickness (T1) and the second thickness (T2) 1-2 ) is produced. And, the difference (T) for the first thickness (T1) 1-2 ) can be expressed as a ratio to calculate the shrinkage rate (see Equation 1). In this way, the shrinkage rates for the first to fifth comparative examples and the first and second embodiments were calculated and shown in Fig. 8.

[0164] [Formula 1]

[0165]

[0166]

[0167]

[0168] Referring to Fig. 8, in Comparative Examples 1 to 3, a gap was generated between the via electrodes arranged vertically. In addition, in Comparative Examples 1 to 3, the shrinkage ratio was large, exceeding 19%. This is because in Comparative Examples 1 to 2, the conductive paste shrank significantly during the sintering process. That is, in Comparative Examples 1 to 2, the conductive composition did not contain palladium (Pd) (wt%) or contained less than 0.5 wt%, so that the effect of reducing shrinkage due to expansion of palladium (Pd) during the sintering process was absent or minimal.

[0169] In Comparative Examples 4 and 5, no gaps were found between the via electrodes arranged vertically. However, it can be confirmed that the outer surface of the via electrode is uneven. That is, the height of the outer surface of the via electrode is uneven, and accordingly, the shape of the via electrode itself is also uneven. This is because, in Comparative Examples 4 and 5, the content of palladium (Pd) is high, 50 wt% or more, and the content of silver (Ag) is low, 50 wt% or less, so that the conductive paste is not sufficiently sintered. In other words, the sintering of the conductive paste is insufficient. When the height of the outer surface of the via electrode or the shape of the via electrode is uneven, as in Comparative Examples 4 and 5, the resistance of the via electrode is high. This reduces the reliability of the stacked device.

[0170] On the other hand, in the first and second embodiments, no gaps were formed between the plurality of via electrodes arranged vertically. That is, in the first and second embodiments, the via electrodes provided on each of the plurality of sheets are in contact or connected to each other. In other words, adjacent via electrodes among the plurality of via electrodes are in contact or connected to each other. In addition, the first and second embodiments have a small shrinkage ratio of 10% to 19%. This is because the content of palladium (Pd) in the conductive composition is more than 0.5 wt% and less than 50 wt%, and the remainder is composed of silver (Ag), thereby suppressing or preventing shrinkage of the conductive paste. That is, shrinkage of the conductive paste is suppressed or prevented due to expansion of palladium (Pd) during sintering of the conductive paste.

[0171] In addition, the first and second embodiments have a uniform height of the outer surface of the via electrode or a uniform shape of the via electrode. In this way, when a gap does not occur between a plurality of via electrodes and the shape of the via electrode is uniform, the noise filter unit can operate normally, and resistance can be reduced and reliability can be improved.

[0172]

[0173] According to embodiments of the present invention, shrinkage of the conductive paste that serves as the raw material for the via electrode can be suppressed or prevented. This can suppress or prevent the formation of gaps between adjacently arranged via electrodes. In other words, the adjacently arranged via electrodes can be interconnected. Consequently, the electrical characteristics of the stacked electronic device can be improved, and its reliability can be enhanced.

[0174] According to embodiments of the present invention, shrinkage of the conductive paste that serves as the raw material for the via electrode can be suppressed or prevented. This can suppress or prevent the formation of gaps between adjacently arranged via electrodes. In other words, the adjacently arranged via electrodes can be interconnected. Consequently, the electrical characteristics of the stacked electronic device can be improved, and its reliability can be enhanced.

Claims

1. A conductive paste that can be filled into the interior of a hole provided in a sheet of a laminated electronic device. The conductive paste comprises a conductive composition and a binder, The conductive composition is a conductive paste comprising palladium (Pd) in an amount of more than 0.5 wt% and less than 50 wt% and silver (Ag) in an amount of more than 50 wt% and less than 99.5 wt%.

2. In claim 1, Among the entire conductive composition, A conductive paste in which the content of palladium (Pd) is 5 wt% to 30 wt% and the content of silver (Ag) is 70 wt% to 95 wt%.

3. In claim 1 or claim 2, The difference (T) between the thickness (T1) of the conductive paste embedded in the inside of the hole and the thickness (T2) of the conductive paste sintered at a temperature of 850°C to 950°C 1-2 ) is a conductive paste having a thickness (T1) of 10% to 19% of the thickness of the conductive paste filled into the inside of the hole before sintering.

4. A method for manufacturing a conductive paste that can be filled into the interior of a hole provided in a sheet of a laminated electronic device, A process for preparing a conductive composition comprising more than 0.5 wt% and less than 50 wt% of palladium (Pd) and more than 50 wt% and less than 99.5 wt% of silver (Ag); and A method for producing a conductive paste, comprising: a process of mixing the conductive composition and a binder.

5. In claim 4, A method for producing a conductive paste, wherein the content of palladium (Pd) is 5 wt% to 30 wt% and the content of silver (Ag) is 70 wt% to 95 wt% in producing the conductive composition.

6. A laminate in which multiple sheets are laminated; An internal conductor provided on at least some of the plurality of sheets; A laminated electronic device comprising palladium (Pd) in an amount greater than 0.5 wt% and less than 50 wt% and silver (Ag) in an amount greater than 50 wt% and less than 99.5 wt%, and a via electrode installed through the sheet to connect at least some of the plurality of internal conductors.

7. In claim 6, The above via electrode is a laminated electronic device in which the content of palladium (Pd) is 5 wt% to 30 wt% and the content of silver (Ag) is 70 wt% to 95 wt%.

8. In claim 6 or claim 7, The above-mentioned laminated electronic device is a laminated electronic device including one of a noise filter and an inductor.

9. In claim 6 or claim 7, The above-mentioned laminated electronic device includes a noise filter, The above noise filter is, A noise filter unit including two or more of the internal conductors and the via electrode connecting the two or more internal conductors, The above noise filter section is a stacked electronic element comprising three or more.

10. In claim 6 or claim 7, The above-mentioned laminated electronic device includes a noise filter, The above noise filter is, A first filter part comprising at least three sheets on which the internal conductor is formed and a lead electrode sheet on which the lead electrode is formed are laminated; At least some of the internal conductors are connected to the lead electrode by the via electrode, A laminated electronic device characterized in that the number of via electrodes positioned on the inner side of the internal conductor formed on at least one sheet in the above sheets is three.

11. In claim 6 or claim 7, A laminated electronic device manufactured by stacking the plurality of sheets and then integrally sintering the plurality of sheets, internal conductors, and via electrodes.

12. In claim 11, A laminated electronic device sintered at a temperature of 850°C to 950°C in which the plurality of sheets, internal conductors and via electrodes are integrally sintered.

13. In claim 12, The difference (T) between the thickness (T1) of the via electrode before sintering and the thickness (T2) of the via electrode after sintering 1-2 ) is a laminated electronic device having a thickness (T1) of 10% to 19% of the thickness of the via electrode before sintering.

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