Electronic component and method for manufacturing electronic component

Abstract

[Problem] To provide an electronic component that is easily made into an individual piece from an aggregate. [Solution] An electronic component having a base, an element body that is positioned in the interior of the base, and a terminal electrode that is exposed to the exterior of the base, wherein the base has an embedded section in which the element body is embedded, and an outer packaging section that covers a portion other than a lead extraction surface of the embedded section.

Description

Electronic component and method for manufacturing the same

[0001] The present disclosure relates to electronic components and methods for manufacturing electronic components.

[0002] Electronic components are known in which an element body such as a coil is disposed inside a base formed of a resin material containing magnetic particles. For example, Patent Document 1 describes a coil component in which a coil conductor made of a rectangular wire wound with an insulating film is embedded inside a base containing magnetic particles and resin. Electronic components in which an element body is encapsulated in a material such as resin are widely used as chip components suitable for miniaturization (miniaturization) and surface mounting.

[0003] A commonly known method for manufacturing this type of electronic component is to arrange multiple coil conductors in a matrix, embed the multiple coil conductors together inside a base, produce an assembly including multiple coil components, and then singulate this into individual coil components. Furthermore, when singulating the assembly of coil components into individual coil components, it is common to cut between the coil components using a cutting tool such as a dicing blade or a laser.

[0004] In this type of electronic component, the method of using a cutting tool such as a dicing blade to separate an assembly of coil components into individual coil components may deteriorate the magnetic properties of soft magnetic materials such as coils, may make the cut portions prone to rust (become prone to oxidation), or may cause particle contamination due to cutting debris. Furthermore, separating coil components using a dicing blade, laser, or the like is a time-consuming and expensive process, and may increase the cost of the manufactured coil components.

[0005] Japanese Patent Application Laid-Open No. 2021-158297

[0006] An object of the present disclosure is to provide an electronic component and a manufacturing method thereof that can reduce costs without degrading the characteristics of the element body, such as the magnetic characteristics of a coil component.

[0007] An electronic component according to one embodiment of the present disclosure is an electronic component having a base, an element body disposed inside the base, and terminal electrodes exposed to the outside of the base, wherein the base has an embedded portion in which the element body is embedded, and an exterior portion that covers all but the lead extraction surface of the embedded portion.

[0008] Furthermore, a method for manufacturing an electronic component according to the present disclosure includes the steps of: using a frame member having a plurality of compartments, forming an exterior portion having a recess in each of the compartments, and forming an exterior portion connecting portion that connects the plurality of exterior portions formed in the plurality of compartments; arranging an element body in the recess of the exterior portion formed in each of the plurality of compartments; filling an embedding portion material into the recess in which the element body is arranged, thereby forming an element accommodating base in each of the plurality of compartments, the element accommodating base having the exterior portion and the embedding portion and in which the element body is arranged; and separating the frame member from an element accommodating base assembly having a plurality of the element accommodating bases and the connecting portion formed in the plurality of compartments, thereby individualizing the element accommodating bases.

[0009] In the electronic component and the method for manufacturing the electronic component having such characteristics, the element housing bases can be separated from the element housing base assembly by separating the frame member, so that the electronic component can be manufactured without a dicing process using, for example, a dicing blade. Therefore, high-performance electronic components can be manufactured without degrading the characteristics of the element body, such as the magnetic characteristics of the coil component. Furthermore, high-performance electronic components can be manufactured without degrading such characteristics. Furthermore, it is possible to provide an electronic component and a manufacturing method thereof that can reduce costs.

[0010] FIG. 1A is an external perspective view of a coil component according to an embodiment of the present disclosure. FIG. 1B is a see-through perspective view of the coil component shown in FIG. 1A. FIG. 1C is an external perspective view of the coil component shown in FIG. 1A, as seen from the mounting surface side. FIG. 1D is a cross-sectional view of the coil component shown in FIG. 1A, taken along line II-II in FIG. 1B. FIG. 2A is a diagram illustrating a first modified example of a coil component according to the present disclosure. FIG. 2B is a diagram illustrating a second modified example of a coil component according to the present disclosure. FIG. 2C is a diagram illustrating a third modified example of a coil component according to the present disclosure. FIG. 2D is a diagram illustrating a fourth modified example of a coil component according to the present disclosure. FIG. 2E is a diagram illustrating a fifth modified example of a coil component according to the present disclosure. FIG. 2F is a diagram illustrating a sixth modified example of a coil component according to the present disclosure. FIG. 2G is a first diagram illustrating a seventh modified example of a coil component according to the present disclosure. FIG. 2H is a second diagram illustrating a seventh modified example of a coil component according to the present disclosure. FIG. 3 is a flowchart illustrating an example of a method for manufacturing a coil component according to the present disclosure. FIG. 4 is a diagram illustrating an example of a frame member used in the manufacturing method of a coil component according to the present disclosure. FIG. 5A is a first diagram illustrating a collective pot forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5B is a first diagram illustrating the collective pot forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5C is a first diagram illustrating the collective pot forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5D is a first diagram illustrating the collective pot forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5E is a first diagram illustrating the collective pot forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5F is a diagram illustrating a coil arrangement step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5G is a first diagram illustrating a core forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 5H is a first diagram illustrating the core forming step in the manufacturing method of the coil component shown in FIG. 3. FIG. 6A is a diagram illustrating an example of a collective pot formed in the manufacturing method of the coil component shown in FIG. 3. FIG. 6B is a diagram illustrating an example of a state in which a coil is arranged in the collective pot in the manufacturing method of the coil component shown in FIG. 3.6C is a diagram showing an example of a state in which an embedded portion assembly is formed by filling with embedded portion material in the method for manufacturing the coil component shown in FIG. 3 . FIG. 6D is a diagram showing an example of an element housing base assembly whose upper surface has been polished in the method for manufacturing the coil component shown in FIG. 3 . FIG. 6E is a diagram showing an example of an element housing base singulated in the method for manufacturing the coil component shown in FIG. 3 . FIG. 6F is a diagram showing an example of an element housing base on which electrodes have been formed in the method for manufacturing the coil component shown in FIG. 3 . FIG. 7A is a first diagram for describing a first modified example of the method for manufacturing a coil component according to the present disclosure. FIG. 7B is a second diagram for describing the first modified example of the method for manufacturing a coil component according to the present disclosure. FIG. 7C is a third diagram for describing the first modified example of the method for manufacturing a coil component according to the present disclosure. FIG. 7D is a fourth diagram for describing the first modified example of the method for manufacturing a coil component according to the present disclosure. FIG. 7E is a first diagram for describing a second modified example of the method for manufacturing a coil component according to the present disclosure. FIG. 7F is a second diagram for describing the second modified example of the method for manufacturing a coil component according to the present disclosure. Fig. 7G is a first diagram for explaining a third modified example of the method for manufacturing a coil component according to the present disclosure. Fig. 7H is a second diagram for explaining the third modified example of the method for manufacturing a coil component according to the present disclosure. Fig. 7I is a first diagram for explaining a fourth modified example of the method for manufacturing a coil component according to the present disclosure. Fig. 7J is a second diagram for explaining the fourth modified example of the method for manufacturing a coil component according to the present disclosure. Fig. 7K is a second diagram for explaining the fourth modified example of the method for manufacturing a coil component according to the present disclosure.

[0011] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that the contents shown in the drawings are merely shown schematically and exemplarily to facilitate understanding of the present disclosure, and the appearance, dimensional ratio, etc. may differ from the actual product. Furthermore, the present disclosure is not limited to the following embodiment.

[0012] In this embodiment, as one embodiment of the present disclosure, a coil component 1 that functions as, for example, an inductor and is mounted in the power supplies of various electrical devices will be described. The structure of the coil component 1 of this embodiment is shown in FIGS. 1A to 1D . As shown in FIG. 1B , the coil component 1 has a coil 11 as an element main body, a base 21 in which the coil 11 is disposed, and terminal electrodes 511, 512. The base 21 has a core (embedded portion) 41 in which the coil 11 is embedded, and an exterior portion 31 that covers the core 41 except for its lead extraction surface (underside of the embedded portion) 41b.

[0013] As shown in FIG. 1A, the coil component 1 is an electronic component having a substantially rectangular parallelepiped (hexahedral) shape, which has a mounting surface 1b connected to an external circuit formed on a substrate or the like, an upper surface 21a facing (located on the opposite side of) the mounting surface 1b, and first to fourth side surfaces 21c to 21f connecting the mounting surface 1b and the upper surface 21a.

[0014] The top surface 21a and the first side surface 21c to the fourth side surface 21f of the coil component 1 are formed by the top surface 31a and the first side surface 31c to the fourth side surface 31f of the exterior part 31. That is, the top surface 21a and the first side surface 21c to the fourth side surface 21f of the coil component 1 are the same as the top surface 30b and the first side surface 31c to the fourth side surface 31f of the exterior body 30. On the other hand, the mounting surface 1b of the coil component 1 is formed by the bottom surface 31b of the exterior part 31, the bottom surface 41b of the core 41, and the terminal electrodes 511 and 512.

[0015] In the coil component of this embodiment, the mounting surface 1b is slightly smaller (has a smaller area) than the top surface 21a, and the first side surface 21c to the fourth side surface 21f are inclined. The inclination angles of the first side surface 21c to the fourth side surface 21f may be any angle, but in this embodiment, they are, for example, about 0.5°. Therefore, the shape of the coil component 1 of this embodiment can be considered to be substantially a rectangular parallelepiped.

[0016] In the present disclosure, the direction in which the mounting surface 1b and the top surface 21a of the coil component 1 face each other is defined as the Z-axis direction, the direction in which the second side surface 31d and the fourth side surface 31f face each other is defined as the X-axis direction, and the direction in which the first side surface 31c and the third side surface 31e face each other is defined as the Y-axis direction. These X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0017] The size of the coil component 1 is not particularly limited, but for example, the length of the coil component 1 in the X-axis direction is 0.6 mm to 6.5 mm, the length of the coil component 1 in the Y-axis direction is 0.6 mm to 6.5 mm, and the length of the coil component 1 in the Z-axis direction is 0.5 mm to 5.0 mm.

[0018] The configuration of each part of the coil component 1 will be described below.

[0019] 1B and 1D , the coil 11 has a winding portion 110 wound in a coil shape and a pair of leads (drawing portions) 111, 112 drawn out from the winding portion 110. The winding portion 110 is embedded in the core 41 and disposed inside the exterior portion 31.

[0020] The wire forming the winding portion 110 can be, for example, a conductive core wire made of copper or the like, such as a rectangular wire, round wire, twisted wire, Litz wire, or braided wire, or an insulating-coated wire in which such a conductive core wire is coated with an insulating coating. Specifically, known winding wires such as AIW (polyamide-imide wire) and USTC can be used. The diameter of the wire is not particularly limited, but in the case of a round wire, it is, for example, 50 μm to 2 mm. In the case of a rectangular wire, the thickness of the wire is, for example, 20 μm to 2 mm, and the width of the wire is, for example, 40 μm to 2 mm.

[0021] 1D , the number of layers in the winding axis direction of the winding portion 110 is, for example, 3, and the number of layers in the radial direction is, for example, 3. The winding axis direction of the winding portion 110 corresponds to the Z-axis direction, i.e., the direction perpendicular to the mounting surface 1b of the coil component 1.

[0022] A pair of leads 111, 112 constitute one end and the other end of the wire forming the coil 11, and are pulled out from the winding portion 110 at spaced apart positions on one end side of the winding axis direction (Z-axis direction) of the winding portion 110, exposed to the outside of the base 21 at the lower surface (lead extraction surface) 41b of the core 41, and connected to terminal electrodes (mounting surface attachment portions) 511, 512.

[0023] 1B and 1D , the core 41 has a cylindrical shape and has the coil 11 embedded therein. A lower surface (lead extraction surface) 41b of the core 41 is exposed from the lower surface 31b of the exterior part 31 and forms the mounting surface 1b of the coil component 1 together with the lower surface 31b of the exterior part 31. The portion of the core 41 other than the lower surface (lead extraction surface) 41b is disposed inside the exterior part 31. In other words, the core 41, together with the coil 11, is entirely covered by the exterior part 31.

[0024] The core 41 is made of a material with a higher relative magnetic permeability than the exterior part 31 described below, but may be made of the same material as the exterior part 31. Furthermore, it is preferable that the thermal expansion coefficient of the core 41 is small (for example, 45 ppm / K or less, or 10 ppm / K or less) compared to the thermal expansion coefficient of the exterior part 31. When the difference between the thermal expansion coefficients of the core 41 and the exterior part 31 is small, it is possible to prevent cracks from occurring in the exterior part 31 around the winding core part 21.

[0025] The shape of the core 41 is not limited to a cylindrical shape, and may be, for example, a square prism, an octagonal prism, or any other polygonal prism. Also, the core 41 may have a configuration in which a flange having a circular or rectangular cross section is provided at one or both ends of the cylindrical shape, i.e., a T-shaped core 41 or a drum-shaped core.

[0026] The exterior part 31 is a member that forms the outer shape of the base body 21, and has the coil 11 and the core 41 disposed therein, and a pair of terminal electrodes 511, 512 attached to the outer surface.

[0027] 1B , the exterior part 31 has a bottom surface 31b on which the terminal electrodes 511 and 512 are arranged, an top surface 31a opposite the bottom surface 31b, and first to fourth side surfaces 31c to 31f connecting the bottom surface 31b and the top surface 31a. The exterior shape of the exterior part 31 is a hexahedron that is a substantially rectangular parallelepiped, but is not limited to a hexahedron and may be another polyhedron such as an octahedron. Alternatively, the exterior shape of the exterior part 31 may be a cylindrical shape such as a cylinder from the perspective of effective magnetic flux. In the case of a cylinder, the bottom surface 31b and the top surface 31a may be a three-dimensional shape in which they are not congruent, such as a truncated cone.

[0028] In this embodiment, since the exterior shape of the exterior part 31 is a hexahedron, the exterior part 31 has four side faces, namely, first side face 31c to fourth side face 31f, but if the exterior part is another polyhedron such as an octahedron (the horizontal cross section of the exterior part is a hexagon) or a decahedron (the horizontal cross section of the exterior part is an octagon), the exterior part 31 will have a corresponding number of side faces. Also, if the exterior part 31 is cylindrical or truncated cone, the exterior part 31 will have one side face (curved surface) connecting the lower surface 31b and the upper surface 31a.

[0029] The exterior part 31 has a pot part (recess) 310 with an opening on the lower surface 31b. The core 41 with the coil 11 embedded therein is disposed in a fitted state in the pot part 310. The lead extraction surface (lower surface) 41b of the core 41, from which the leads 111, 112 of the coil 11 are drawn, is disposed flush with the opening surface 310a of the pot part 310. In other words, the exterior part 31 covers the core 41 except for the lead extraction surface 41b with the structure of the pot part 310.

[0030] Terminal electrodes 511 and 512, which will be described later, are electrically connected to the leads 111 and 112 of the coil 11 exposed at the opening surface 310a (lead extraction surface 41b of the core 41) of the pot portion 310. The terminal electrodes 511 and 512 are respectively bonded across the lower surface 21b of the base 21, which includes the lower surface 31b of the exterior part 31 and the lower surface (lead extraction surface) 41b of the core 41, and the first side surface 31c of the exterior part 31, and are attached to the base 21.

[0031] In this embodiment, the exterior part 31 is configured to accommodate the coil 11 together with the core 41 inside the base 21, but the coil 11 may be accommodated inside the base 21 so as to be sealed by the exterior part 31 and the core 41, or may be configured to be exposed to the outside of the base 21 through some kind of opening or communicating part (i.e., not sealed by the base 21).

[0032] The exterior part 31 is formed from an exterior material containing magnetic particles and resin. The magnetic particles that form the exterior part 31 are not particularly limited, but may be, for example, ferrite or a metallic magnetic material. The particle size of the magnetic particles that form the exterior part 31 is not particularly limited, but may be, for example, 1 μm to 50 μm. The resin that forms the exterior part 31 is not particularly limited, but may be, for example, a thermosetting resin such as an epoxy resin or a phenol resin. When the electronic component is a coil component or the like, the relative magnetic permeability of the exterior part 31 is not particularly limited, but may be, for example, 1 to 20,000.

[0033] In the first side surface 31c to the fourth side surface 31f of the exterior portion 31, the edge portion close to the side connected to the lower surface 31b (i.e., the mounting surface 1b of the coil component 1) is formed at a predetermined height (height in the Z-axis direction) as a rough surface portion 210 with high surface roughness. In the first side surface 31c to the fourth side surface 31f, the majority of the range on the upper surface 31a (upper surface 21a of the base 21) side is formed as a smooth surface, and the edge portion on the side connected to the lower surface 31b (mounting surface 1b) is formed as a rough surface portion 210 with a surface roughness relatively higher than that of the majority of the smooth surface portion.

[0034] The only difference between the smooth surface portions of the first to fourth side surfaces 31c to 31f (the portions of the first to fourth side surfaces 31c to 31f other than the rough surface portion 210) and the rough surface portion 210 is the surface roughness, but the exterior material is the same. That is, both the portion on the surface where the first region is formed and the portion on the surface where the second region is formed contain the same type of magnetic particles and the same type of thermosetting resin.

[0035] Such rough surface portion 210 is effective for improving adhesion with other members. In the present embodiment, as will be described later, terminal electrodes 511, 512 have mounting surface mounting portions (first principal surface mounting portions) 511 a, 512 a and side surface mounting portions 511 b, 512 b, and side surface mounting portions 511 b, 512 b are joined to a first side surface 31 c of exterior portion 31. In this case, since the rough surface portion 210 of the first side surface 31 c of exterior portion 31 is included in the location where side surface mounting portions 511 b, 512 b are joined with an adhesive or the like, adhesion between side surface mounting portions 511 b, 512 b can be improved, and the joining strength of terminal electrodes 511, 512 can be increased.

[0036] Furthermore, even when, for example, the coil component 1 is mounted on a substrate or the like and then the entire peripheral circuit of the coil component 1, or the entire substrate on which the coil component 1 is mounted, is covered and sealed with exterior resin, the formation of the rough surface portion 210 on the first side surface 31c to the fourth side surface 31f of the exterior component 31 improves the adhesion between the exterior component 31 (base 21, and therefore the coil component 1) and the exterior resin, thereby increasing the bonding strength.

[0037] The rough surface portion 210 is disposed within a range of a predetermined height (Hr) on the side closer to the lower surface 31b (mounting surface 1b of the coil component 1) of the side surfaces 31c to 31f of the exterior portion 31. The ratio (Hr / H) of the height (Hr) of the rough surface portion 210 to the height (H) of the base 21 (exterior portion 31) may be any ratio within the range of 0.01≦(Hr / H)≦0.5, for example, or may be within the range of 0.05≦(Hr / H)≦0.1.

[0038] Regarding the actual surface roughness Ra of the smooth surface portion and the rough surface portion 210, when no surface treatment is performed on the exterior portion 31, the surface roughness Ra of the smooth surface portion is, for example, 1.4 μm or less, and the surface roughness Ra of the rough surface portion 210 is greater than 1.4 μm. The relationship between the surface roughness of the smooth surface portion and the rough surface portion 210 is such that the surface roughness of the rough surface portion 210 is 1.2 times or more, or may be 1.5 times or more, or may be 2 to 2.5 times, that of the smooth surface portion.

[0039] When the surface of exterior portion 31 is subjected to a surface treatment such as plating, the surface roughness Ra of the smooth surface portion is, for example, 1.2 μm or less, and the surface roughness Ra of rough surface portion 210 is greater than 1.2 μm. In this case, the relationship between the surface roughness of the smooth surface portion and that of rough surface portion 210 may be such that the surface roughness of rough surface portion 210 is 1.5 times or more, or may be 3 to 5 times, the surface roughness of smooth surface regions 30c1 to 30f1.

[0040] In the coil component 1 of this embodiment, the rough surface portion 210 is formed continuously along the entire circumference of the first to fourth side surfaces 31c to 31f of the exterior portion 31, but the rough surface portion 210 may be selectively formed on some of the side surfaces, such as one, two, or three of the first to fourth side surfaces 31c to 31f. Also, the range of the height (Hr) of the rough surface portion 210 may be changed for each of the first to fourth side surfaces 31c to 31f.

[0041] The pair of terminal electrodes 511, 512 are connection portions between the coil 11 and an external circuit. The first terminal electrode 511 and the second terminal electrode 512 are attached to the surface of the base 21 with a gap between them, and are electrically insulated.

[0042] 1B, the terminal electrodes 511 and 512 are L-shaped metal terminals having mounting surface attachment portions 511a and 512a and side surface attachment portions 511b and 512b, respectively. As shown in FIGS. 1B and 1D, the mounting surface attachment portions 511a and 512a are provided on the mounting surface 1b of the coil component 1 and are electrically connected to the leads 111 and 112 of the coil 11 that are drawn out from the lead extraction surface 41b of the core 41. The leads 111 and 112 may be connected to the terminal electrodes 511 and 512 by thermocompression bonding, soldering, a conductive adhesive, or the like.

[0043] 1A to 1C, in this embodiment, the side surface mounting portions 511b, 512b are joined to the first side surface 31c of the exterior portion 31. The side surface mounting portions 511b, 512b may be formed so as to be joined to the third side surface 31e of the exterior portion 31, or may be disposed on both the first side surface 31c and the third side surface 31e. Furthermore, in the first terminal electrode 511, the side surface mounting portion 511b may be formed so as to be joined to the second side surface 31d of the exterior portion 31, and in the second terminal electrode 512, the side surface mounting portion 512b may be formed so as to be joined to the fourth side surface 31f of the exterior portion 31.

[0044] The side surface mounting portions 511b and 512b of these terminal electrodes 511 and 512 allow fillets of solder or the like to be formed on the terminal electrodes 511 and 512 when the coil component 1 is connected to a substrate by solder or the like.

[0045] The terminal electrodes 511, 512 are attached to the base 21 of the coil component 1 by arranging the mounting surface attachment portions 511a, 512a and the side surface attachment portions 511b, 512b opposite the lower surface 21b of the base 21 (the lower surface 31b of the exterior part 31 and the lower surface (lead extraction surface) 41b of the core 41) and the first side surface 31c of the exterior part 31, respectively, and joining them with an adhesive or the like. At this time, the side surface attachment portions 511b, 512b of the terminal electrodes 511, 512 include, as joining targets, the rough surface portion 210 formed around the entire periphery of the side surfaces 31c to 31f of the exterior part 31, so that the adhesion and bonding between the terminal electrodes 511, 512 and the exterior part 31 can be improved, and the bonding strength of the terminal electrodes 511, 512 can be increased.

[0046] The terminal electrodes 511, 512 are formed, for example, by machining a conductive metal plate, but the method for forming the terminal electrodes 511, 512 is not particularly limited. The material of the terminal electrodes 511, 512 is not particularly limited as long as it is a conductive metal material, and examples thereof include iron, nickel, copper, silver, and alloys containing these. Furthermore, the surfaces of the terminal electrodes 511, 512 may be coated with a metal film made of Ni, Sn, Cu, or the like.

[0047] Instead of using metal terminals, the terminal electrodes 511, 512 may be formed on the exterior portion 31 or the core 41 by plating. In this case, the terminal electrodes 511, 512 are formed, for example, by a laminated electrode film made of a base electrode film and a plating film formed on the base electrode film. The base electrode film is, but is not limited to, a conductive paste film containing a metal such as Sn, Ag, Ni, or Cu, or an alloy thereof. The plating film is, but is not limited to, a metal such as Sn, Au, Ni, Pt, Ag, or Pd, or an alloy thereof.

[0048] Next, an example of a method for manufacturing such a coil component 1 will be described with reference to FIGS. 3 to 6F.

[0049] 3 is a flowchart showing an example of a method for manufacturing the coil component 1 according to the present disclosure. As shown in FIG. 3, the method according to the present disclosure includes the steps of aggregate pot molding (step S1), coil arrangement (step S2), core molding (step S3), upper surface polishing (step S4), singulation (step S5), and electrode formation (step S6).

[0050] In the collective pot molding process (step S1), first, a frame member 70 as shown in FIG. 4 is prepared. The frame member 70 is a plate-like member having a plurality of compartments (through holes) 75 separated by partition walls 71. Each compartment 75 is a bottomless cylindrical space surrounded by the partition walls 71. The plurality of compartments 75 may be arranged in a matrix along the X-axis and the Y-axis. The cross-sectional shape of each of the plurality of compartments 75 perpendicular to the axial direction (Z-axis direction) corresponds to the shape of the base 21 of the coil component 1. In this embodiment, the cross-sectional shape is rectangular, but may be other polygonal shapes, a circle, or the like, depending on the shape of the coil component 1.

[0051] The frame member 70 having such a configuration is manufactured by processing, for example, a plate-shaped member. By forming openings corresponding to the compartments 75 in the plate-shaped member and processing the inner peripheral surface of the openings by any surface processing treatment, the frame member 70 as shown in FIG. 4 can be formed. The plate-shaped member may be, for example, a metallic plate-shaped member. Furthermore, the frame member 70 having such a configuration can be easily manufactured by punching out the plate-shaped member. The plate-shaped member may be, for example, a metallic plate-shaped member.

[0052] After preparing the frame member 70 as shown in Fig. 4, the frame member 70 is placed in a mold 80. To do this, first, as shown in Fig. 5A, an adhesive sheet 90 is placed on a lower mold 81 having a cavity 810 shaped along the outer diameter of the frame member 70. The cavity 810 is a space (recess) surrounded by the inner wall and bottom surface of the lower mold 81.

[0053] A double-sided adhesive sheet can be used as the adhesive sheet 90. In this case, in a subsequent process, the adhesive sheet 90 is exposed to a heated atmosphere, thereby peeling the frame member 70 from the adhesive sheet 90 and allowing the frame member 70 to be easily removed from the lower mold 81. However, instead of the adhesive sheet 90, an adhesive or the like may be used to adhere the frame member 70 to the lower mold 81. Alternatively, the frame member 70 may be fixed to the lower mold 81 by mechanical or magnetic means.

[0054] In the mold 80, an upper mold 82 having a pressurizing unit base and a pot portion-forming convex portion 83 is provided relative to a lower mold 81. The pot portion-forming convex portion 83 is a convex portion having a shape corresponding to the pot portion 310 of the exterior part 31, and is provided at a position corresponding to each section 75 of the frame member 70 provided in the cavity 810 of the mold 81.

[0055] After the adhesive sheet 90 is placed in the cavity 810 of the lower mold 81, the frame member 70 is then placed on the adhesive sheet 90 of the lower mold 81, as shown in Figure 5B, and the frame member 70 is fixedly installed within the cavity 810 of the lower mold 81.

[0056] The frame member 70 is placed in the cavity 810 so that the upper ends of the partition walls 71 are slightly lower than the opening of the cavity 810 of the lower mold 81. By setting the upper ends of the partition walls 71 lower than the opening of the cavity 810 of the lower mold 81, the exterior part material 301 extruded from each compartment 75 of the frame member 70 flows onto the partition walls 71 of the frame member 70, allowing exterior part connecting portions 351 that connect the exterior parts 31 formed in each compartment 75 to be formed on the partition walls 71. Furthermore, when forming the core 41 in step S3, as described below, it becomes possible to further form a core connecting portion 451 on the exterior part connecting portion 351. Therefore, the upper end surface of the partition walls 71 may be lower than the opening of the cavity 810 of the lower mold 81 by the height of the exterior part connecting portion 351 and the core connecting portion 451. In other words, the lower mold 81 may be a mold in which the height of the opening surface of the cavity 810 is higher than the position of the upper end surface of the partition wall 71 of the frame member 70 by the height of the exterior portion connecting portion 351 and the core connecting portion 451.

[0057] 5C , the cavity 810, in other words, each compartment 75 of the frame member 70, is filled with the exterior material 301. The exterior material 301 is a material containing magnetic particles and a resin, and specifically, a composite magnetic material containing a binder such as a thermoplastic resin or a thermosetting resin and magnetic particles (magnetic filler) may be used. The exterior material 301 may be, for example, a material that is granular or particulate at room temperature and becomes fluid (for example, becomes a highly viscous liquid) when heated (for example, to 80° C. or higher).

[0058] The exterior portion material 301 may be poured into each compartment 75 of the frame member 70 in an amount slightly larger than the amount corresponding to the volume of the exterior portion 31 of the coil device 1. In this way, when the pot portion-forming convex portions 83 are inserted into each compartment (through hole) 75 to form the pot portion 310 in each compartment 75, the exterior portion material 301 does not run short in each compartment (through hole) 75, i.e., no voids are generated, and the pot portion 310 can be reliably formed.

[0059] After the exterior part material 301 is injected into the compartments 75 of the frame member 70, the exterior part material 301 is compressed and hardened as shown in Fig. 5D. The lower mold 81 and the upper mold 82 are heated to a predetermined mold temperature, and the upper mold 82 is moved toward the lower mold 81 with a predetermined pressure applied, so that the exterior part material 301 fills the spaces corresponding to the shapes of the pot-forming convex portions 83 in each compartment 75 of the frame member 70, and the exterior part material 301 is compressed and hardened at a predetermined temperature for a predetermined time.

[0060] After the exterior part material 301 has been compressed and cured at a predetermined temperature for a predetermined time, the upper mold 82 including the pot part-forming convex parts 83 is separated from the lower mold 81. As a result, as shown in Fig. 5E, an exterior part 31 having pot parts 310 formed in accordance with the shape of the pot part-forming convex parts 83 is formed in each compartment 75 of the frame member 70. In addition, an exterior part connecting part 351 is formed on the upper surface of the partition wall 71 between the compartments 75 by connecting the exterior part material 301 that has overflowed from each compartment 75.

[0061] In other words, this results in the formation of an aggregate pot (exterior part aggregate) 300 having a plurality of exterior parts 31 formed in a plurality of compartments 75 throughout the entire cavity 810 of the lower mold 81, in other words, throughout the entire frame member 70, and an exterior part connecting part 351 formed on the upper surface of the partition wall 71 and connecting the plurality of exterior parts 31.

[0062] 6A is a diagram showing the produced assembly pot 300 as viewed from above the cavity 810 of the lower mold 81. As shown in Fig. 6A, the assembly pot 300 is formed in the cavity 810 of the lower mold 81, with the pot portions 310 formed at positions corresponding to the positions of the compartments 75 of the frame member 70.

[0063] In another embodiment, the injection (filling) of the exterior part material 301 into each compartment 75 of the frame member 70 installed in the cavity 810 of the lower mold 81 and the compression and hardening of the injected exterior part material 301 may proceed simultaneously.

[0064] After the collective pot (exterior assembly) 300 is formed in the cavity 810 of the lower mold 81, a coil 11 is then placed in each pot portion 310 of the collective pot 300 (step S2), as shown in Figures 5F and 6B. Figure 6B is a diagram showing the state in which the coils 11 are placed in each pot portion 310 of the produced collective pot 300, as viewed from above the cavity 810 of the lower mold 81.

[0065] The coil 11 to be placed may be any coil, but the pair of leads 111, 112 may be configured to be drawn out in a predetermined direction relative to the winding portion 110 of the coil 11. In this embodiment, an air-core coil is used as the coil 11. In this embodiment, the coil 11 is placed so that the tips of the leads 111, 112 protrude above the top surface of the collective pot (exterior portion assembly) 300 relative to the pot portion 310 of the exterior portion 31 formed in each compartment 75 of the frame member 70. In other words, the coil 11, whose size and height are specified to achieve this placement, is placed in each pot portion 310 of the collective pot 300.

[0066] After the coil 11 is placed in each pot portion 310, the core (embedded portion) 41 is then formed (step S3). First, each of the pot portions 310 in which the coil 11 is placed is filled with a core material (embedded portion material). The core material, like the exterior portion material 301, contains magnetic particles and resin, has fluidity, and may be a composite magnetic material containing a binder such as a thermoplastic resin or a thermosetting resin, and magnetic particles (magnetic filler).

[0067] After filling each pot portion 310 with the core material, the core material is compressed and hardened using an upper mold (not shown). The pressing surface of the upper mold may be flat. The upper and lower molds are heated to a predetermined temperature, and the upper mold is moved toward the lower mold 81 with a predetermined pressure, compressing and hardening the core material at the predetermined temperature for a predetermined time.

[0068] As a result, as shown in Fig. 5G, cores 41 are formed in each compartment 75 of the frame member 70 so as to embed the coil 11 in the pot portion 310. Furthermore, core portion connecting portions 451 are formed by connecting the core material that has overflowed from each compartment 75 on top of the exterior portion connecting portions 351 on the upper surfaces of the partition walls 71 between the compartments 75. That is, a core portion assembly 400 is thus formed throughout the entire interior of the cavity 810 of the lower mold 81, in other words, throughout the entire frame member 70, having a plurality of cores 41 formed in the plurality of compartments 75 and the core portion connecting portions 451 formed on the upper surfaces of the partition walls 71. In this state, when observed from above the cavity 810 of the lower mold 81, the embedded portion assembly 400 appears to be spread over the entire surface, as shown in Fig. 6C.

[0069] After the core assembly 400 is formed, its upper surface is polished to expose the leads 111, 112 of the coil 11 from the core 41, as shown in FIG. 5H (step S4). The polishing amount may be any amount as long as the leads 111, 112 of the coil 11 are exposed from the core 41. For example, as shown in FIG. 5H , the core assembly connecting portion 451 formed above the exterior assembly connecting portion 351 on the upper surface of the partition wall 71 of the frame member 70 may be polished to the extent that the exterior assembly connecting portion 351 is exposed. As a result, as shown in FIG. 6D , a coil-receiving base assembly (element-receiving base assembly) 200 is formed in the cavity 810 of the lower mold 81, with the lead extraction surface 41 b of the core 41 exposed between the assembly pots 300, and with the leads 111, 112 of the coil 11 exposed from the lead extraction surface 41 b.

[0070] Next, each coil housing base 21 is singulated from the coil housing base assembly 200. Singulating the coil housing base 21 is performed by first removing the coil housing base assembly 200 together with the frame member 70 from the lower mold 81, and then removing each individual coil housing base 21 from the frame member 70. Removal of each coil main base may be performed by punching using, for example, a punch having substantially the same planar shape as the base 21 (strictly speaking, slightly smaller) and a die having substantially the same arrangement as the partition walls 71 of the frame member 70. By singulating each coil housing base 21 using this method, multiple coil housing bases 21 can be easily singulated at once, as shown in FIG. 6E . Singulating is particularly easy compared to dicing using a dicing blade.

[0071] Furthermore, by dividing the coil accommodating base 21 into individual pieces using this method, a fracture surface is formed at the location of the exterior part 31 that is separated from the exterior part connecting part 351, and this can be used as is as the rough surface part 210.

[0072] Next, as shown in FIG. 6F , the terminal electrodes 511 and 512 are attached to the lower surface 31b of each of the exterior parts 31. As described above, in this embodiment, the terminal electrodes 511 and 512 are L-shaped metal terminals having mounting surface mounting portions 511a and 512a and side surface mounting portions 511b and 512b, respectively. The mounting surface mounting portions 511a and 512a and the side surface mounting portions 511b and 512b are respectively positioned opposite the lower surface (mounting surface) 21b of the base 21 and the first side surface 31c of the exterior part 31, and are joined using an adhesive or the like to attach the terminal electrodes 511 and 512 to the exterior part 31. At this time, the side surface mounting portions 511b and 512b of the terminal electrodes 511 and 512 are joined to the rough surface portions 210 of the first to fourth side surfaces 31c to 31f of the exterior part 31. This improves the adhesion between the terminal electrodes 511 and 512 and the exterior part 31, and increases the bonding strength of the terminal electrodes 511 and 512 to the exterior part 31.

[0073] As described above, in the coil component 1 and the method for manufacturing the coil component 1 according to the present disclosure, it is possible to manufacture an electronic component without a dicing step using, for example, a dicing blade, and therefore it is possible to manufacture a high-performance electronic component without degrading the characteristics of the element body, such as the magnetic characteristics of the coil component. Furthermore, it is possible to manufacture a high-performance electronic component without degrading such characteristics.

[0074] Furthermore, in the coil component 1 and the manufacturing method for the coil component 1 according to the present disclosure, the rough surface portion 210 is formed on the mounting surface 1b side of the exterior portion side surfaces 31c to 31f of the base 21, which can improve adhesion when the terminal electrodes 511, 512, which are L-shaped metal terminals, are joined to the exterior portion 31 with an adhesive or the like, thereby increasing the bonding strength of the terminal electrodes 511, 512. Furthermore, even when, for example, the coil component 1 is mounted on a substrate or the like and then the entire peripheral circuit of the coil component 1 or the entire substrate on which the coil component 1 is mounted is covered and sealed with an exterior resin, it is possible to improve adhesion with the exterior resin at the location of the rough surface portion 210, and the bonding strength of the exterior resin to the coil component 1 can also be increased.

[0075] The present disclosure is not limited to the above-described embodiments, and various modifications can be made within the scope of the present disclosure.

[0076] For example, in the above-described embodiment, in the upper surface polishing step S4, the mounting surface of the core portion assembly 400 is polished until the exterior portion connecting portion 351 is exposed. Therefore, in each individual coil component 1, the lead extraction surface 41b is exposed on the mounting surface 1b in a shape corresponding to the planar shape of the cylindrical core 41 corresponding to the shape of the pot portion 310, i.e., in a circular shape, as shown in FIG. 1C . However, polishing of the core portion assembly 400 only needs to expose at least the leads 111 and 112 of the coil 11, and may be completed without exposing the exterior portion connecting portion 351. In that case, the mounting surface 1b of the coil component 1 is entirely covered by the lead extraction surface 42b of the core 42, as shown in FIG. 2A . The present disclosure may also be applicable to such a method.

[0077] Furthermore, in the above-described embodiment, the coil component 1 in which L-shaped terminal electrodes 511, 512 are attached to the base 21 in which the coil 11 is embedded has been described, but the electronic component according to the present disclosure may also be configured as a coil component 3 in which flat terminal electrodes 531, 532 are attached to the lower surface 21b of the base 21, as shown in Fig. 2B, for example. In the coil component 3 configured in this manner, the rough surface portions 210 formed on the first side surface 21c to the fourth side surface 21f can improve the adhesion between the coil component 3 and the exterior resin when the substrate on which the coil component 3 is mounted is covered with the exterior resin.

[0078] Furthermore, the coil component and the manufacturing method thereof according to the present disclosure may use a coil 14 wound with a rectangular wire, as the coil, as in the coil component 4 shown in FIG. 2C.

[0079] Furthermore, in the coil component and manufacturing method thereof according to the present disclosure, the coil 15 may be arranged so that the winding axis direction of the winding portion 150 is parallel to the mounting surface 35b of the exterior portion 35, as in the coil component 5 shown in FIG. 2D.

[0080] Furthermore, the coil component and its manufacturing method according to the present disclosure may be configured as in the coil component 6 shown in FIG. 2E, in which the exterior portion 36 has a core portion 321 disposed inside the winding portion 160 of the coil 16.

[0081] To manufacture such a coil component 6, in the collective pot molding step S1, as shown in Fig. 7A, an upper mold 82 having a recess (recess for forming a center core) 841 formed in a pot-forming protrusion 84 is used to compress and harden the exterior material 301 as shown in Fig. 7B. This makes it possible to easily manufacture an exterior 36 having a pot 360 in which a center core (bottom protrusion) 321 is formed as shown in Fig. 7C.

[0082] In this case, in the coil placement process S2, the coil 11 may be placed in the pot portion 360 so that the hollow core portion of the coil 11 is positioned around the central core portion (bottom surface convex portion) 321, as shown in Figure 7D.

[0083] In the embodiment in which the center core is formed on the bottom surface of the pot, the center core 321 does not need to be cylindrical, and for example, by using a pot-forming convex portion 85 having a truncated conical recess 851 formed therein as shown in Fig. 7E, it is possible to form a pot having a truncated conical center core 322 as shown in Fig. 7F. Alternatively, by using a pot-forming convex portion 86 having a large diameter and a curved bottom center core forming recess 861 formed therein as shown in Fig. 7G, it is possible to form a pot having a large diameter center core 326 having a curved bottom as shown in Fig. 7H.

[0084] Furthermore, in the coil component and the manufacturing method thereof according to the present disclosure, the exterior part 31 or the pot part (recess) of the collective pot (exterior part assembly) 300 may have a guide part (side convex part) 327 that protrudes from its inner peripheral side surface toward the center of the pot part (a direction parallel to the opening surface of the pot part), as shown in FIG. 7K.

[0085] To manufacture a coil part having such a guide portion 327 or an aggregate pot used in the manufacturing stage, in the aggregate pot molding step S1, as shown in Figures 7I and 7J, an upper mold 82 having grooves (guide portion-forming recessed grooves) 871, 871 formed on the outer peripheral surface of a pot portion-forming protrusion 87 may be used to compress and harden the exterior portion material. This makes it possible to easily manufacture an exterior portion having a pot portion (recessed portion) with guide portions (protrusions) 327, 327 formed on the inner peripheral surface, as shown in Figure 7K.

[0086] The formation of these guide portions (protrusions) 327, 327 on the inner peripheral surface of each pot portion of the collective pot (exterior portion assembly) allows accurate positioning of the coil in the process of placing the coil in the pot portion. Furthermore, a gap is formed inside the pot portion between the lower end of the guide portion 327 and the bottom surface of the pot portion, so the coil placed in the pot portion can be engaged and held in this gap, preventing the position and orientation of the coil from changing when the core material is subsequently filled into the pot portion.

[0087] 2F, the lead ends 173, 174 may be bent parallel to the lead extraction surface 41b and polished in the upper surface polishing step S4 so that a predetermined length of the lead ends 173, 174 is exposed. This configuration can improve the reliability of the joint between the terminal electrodes and the lead ends 173, 174.

[0088] Furthermore, the shape of the pot portion 310, in other words, the cross-sectional shape of the core 41, is not limited to a cylinder (circle), and may be a square pillar (square) as shown in Fig. 2G. In this case, the lower surface (lead extraction surface) 48b of the rectangular embedded portion (core) 48 is exposed on the mounting surface 1b of the coil component 1 as shown in Fig. 2H. The present disclosure may be in such a form.

[0089] In the above-described embodiments, the terminal electrodes of the coil components are formed by joining electrode members made of metal plates to the exterior parts with adhesives, etc. However, the terminal electrodes may be formed by a paste method, plating method, sputtering, screen printing, etc.

[0090] In the manufacturing method of the coil component according to the present disclosure, the exterior portion and the core (embedded portion) are formed by compressing and curing the exterior portion material and the embedded portion material. However, the molding method of the exterior portion or the core is not limited to this, and various molding techniques such as transfer molding, injection molding, and dry molding may be used.

[0091] In the above-described embodiment, an inductor having a coil as an element body was exemplified as an electronic component according to the present disclosure. However, the electronic component according to the present disclosure is not limited to this, and may be a semiconductor component having a semiconductor integrated circuit (IC chip) as an element body, packaged in resin. Furthermore, the element body may be a sensor having any sensor element, such as a temperature / humidity sensor, a pressure sensor, an acceleration sensor, a photoelectric conversion element, or a piezoelectric element. Furthermore, the element body may be a capacitor having a polymer aluminum electrolytic capacitor element.

[0092] This specification discloses the following:

[0093] [1] An electronic component having a base, an element body disposed inside the base, and terminal electrodes exposed to the outside of the base, wherein the base has an embedded portion in which the element body is embedded, and an exterior portion that covers the embedded portion except for a lead extraction surface.

[0094] [2] The electronic component according to [1], wherein the exterior portion has a recess with an opening at the position of the lead extraction surface, the element body is accommodated in the recess, and the embedded portion is filled in the recess to embed the element body in the recess.

[0095] [3] The electronic component according to [2], wherein the exterior portion further has a bottom surface protrusion protruding from a bottom surface of the recess toward the opening surface.

[0096] [4] The electronic component according to [2], wherein the exterior portion further has a side projection portion that projects from a side surface of the recess in a direction parallel to the opening surface.

[0097] [5] The electronic component according to any one of [1] to [4], wherein the base has a first main surface including the lead extraction surface of the embedded portion, a second main surface opposite to the first main surface, and one or more base side surfaces connecting the first main surface and the second main surface, the first main surface being a mounting surface, and the base side surfaces are inclined so that the area of ​​the first main surface is smaller than that of the second main surface.

[0098] [6] The electronic component according to [5], wherein an edge of the base side surface close to the side connected to the first main surface of the base side surface is formed into a rough surface having a large surface roughness.

[0099] [7] The electronic component according to [6], wherein a part of the terminal electrode is attached to the rough surface of the side surface of the base.

[0100] [8] The electronic component according to any one of [1] to [7], wherein an exterior material forming the exterior portion and an embedded portion material forming the embedded portion are the same material.

[0101] [9] The electronic component according to any one of [1] to [8], wherein the element body is a coil, and the exterior portion and the embedded portion are formed of a magnetic core material.

[0102]

[10] The electronic component according to any one of [1] to [8], wherein the element body is any one of a semiconductor integrated circuit, a sensor element, and a polymer aluminum electrolytic capacitor element.

[0103]

[11] A method for manufacturing an electronic component, comprising: a step of using a frame member having a plurality of compartments to form an exterior portion having a recess in each of the compartments, and forming an exterior portion connecting portion that connects the plurality of exterior portions formed in the plurality of compartments; a step of arranging an element body in the recess of the exterior portion formed in each of the plurality of compartments; a step of filling an embedding portion material into the recess in which the element body is arranged, to form an element housing base in each of the plurality of compartments, the element housing base having the exterior portion and the embedding portion, and having the element body arranged therein; and a step of separating the frame member from an element housing base assembly having the plurality of element housing bases and the connecting portion formed in the plurality of compartments, to individualize the element housing bases.

[0104]

[12] The method for manufacturing an electronic component according to

[11] , wherein the step of forming the element housing base further includes forming embedded portion connecting portions that connect the embedded portions formed in the compartments.

[0105]

[13] The method for manufacturing an electronic component according to

[11] or

[12] , wherein the frame member is a member in which partition walls that form boundaries between the compartments are formed in a lattice pattern.

[0106]

[14] The method for manufacturing an electronic component according to any one of

[11] to

[13] , wherein the frame member has a first opening surface on which an opening surface of the recess of the exterior part is disposed, a second opening surface opposite the first opening surface, and one or more compartment side surfaces that are side surfaces of a partition wall that forms a boundary of the compartment and connect the first opening surface and the second opening surface, and the compartment side surfaces are inclined so that the area of ​​the first opening surface is smaller than that of the second opening surface.

[0107]

[15] A method for manufacturing an electronic component according to any one of

[11] to

[14] , wherein in the step of singulating the element accommodating substrates from the element accommodating substrate assembly, the individual element accommodating substrates are detached from the element accommodating substrate assembly formed on the frame member by punching.

[0108]

[16] The method for manufacturing an electronic component according to any one of

[11] to

[15] , wherein in the step of arranging the element body in the recess, the element body is arranged in the recess such that the leads of the element body extend in the direction of the opening surface of the recess of the exterior body; in the step of forming the element housing base, an element housing base assembly is formed having a plurality of the element housing bases formed in a plurality of the compartments and the connecting portion; and the method further includes a step of polishing the surface of the element housing base assembly on the side where the opening surface of the recess of the exterior body is located so that the leads are exposed in each of the plurality of element housing bases formed in the plurality of compartments; and in the step of singulating the element housing bases, the element housing base assembly is polished so that the leads are exposed, by separating the frame member from the element housing base assembly having the plurality of element housing bases formed in a plurality of the compartments and the connecting portion.

[0109]

[17] The method for manufacturing an electronic component according to any one of

[11] to

[16] , wherein the step of forming the exterior part and the exterior part connecting part in each of the plurality of compartments further comprises forming at least one or both of a bottom surface convex part that protrudes from the bottom surface of the recess in the direction of the opening surface of the recess and a side surface convex part that protrudes from the side surface of the convex part in a direction parallel to the opening surface, and the step of arranging the element body in the recess comprises arranging the element body in the recess along at least one or both of the bottom surface convex part and the side surface convex part that have been formed.

[0110]

[18] The method for manufacturing an electronic component according to any one of

[11] to

[17] , further comprising the step of forming terminal electrodes connected to the leads of the element body on the element housing base.

[0111] DESCRIPTION OF SYMBOLS 1 to 8... Coil components 1b... Mounting surface 11, 14, 15, 16... Coil 110, 140, 150, 160... Winding portion 111, 112, 141, 142, 151, 152, 161, 162... Leads (drawing portion) 173, 174... Lead ends 21, 22, 24, 25, 26, 28... Core (base) 210... Rough surface 21a... Upper surface (second main surface) 21b... Mounting surface (first main surface, lower surface) 21c to 21f... Side surfaces 200... Element-accommodating base assembly 31, 32, 34, 35, 36, 38... Exterior portion 31a, 36a... Exterior portion upper surface 31b, 36b... Exterior portion lower surface 31c to 31f, 32c, 32d, 36d, 36f... exterior part side surface 300... exterior part assembly 301... exterior part material 301a... excess exterior part material 310... pot part (recess) 310a... pot part opening surface (recess opening surface) 310b... pot part bottom surface (recess bottom surface) 310c... pot part inner peripheral side surface (recess inner peripheral side surface) 321, 322... core part (convex part) 326 327 351... exterior part connecting part 41, 42, 44, 45, 46, 48... embedded part 41a, 46a... 41b, 42b, 46b... lead extraction surface 41c, 46c... embedded part side surface (embedded part outer peripheral side surface) 400... embedded part assembly 410c... embedded part inner peripheral side surface 511, 512...Terminal electrodes 511a, 512a...Mounting surface mounting portion 511b, 512b...Side surface mounting portion 531, 532, 541, 542, 551, 552, 561, 562...Terminal electrodes (mounting surface mounting portion) 70...Frame member 71...Partition wall 71c...Compartment side surface 75...Compartment (through hole) 71a...Compartment first opening surface 71b...Compartment second opening surface 80...Mold 81...Lower mold 82...Upper mold 83, 84, 85, 86, 87...Pot portion forming convex portion 841...Concave portion (core portion forming concave portion) 851...Trapezoidal concave portion (core portion forming concave portion) 861...Sloped concave portion (core portion forming concave portion) 871...Groove portion (guide portion forming concave groove) 90...Adhesive sheet

Claims

1. An electronic component having a base, an element body disposed inside the base, and terminal electrodes exposed to the outside of the base, wherein the base has an embedded portion in which the element body is embedded, and an exterior portion that covers all of the embedded portion except for the lead extraction surface.

2. The electronic component according to claim 1, wherein the exterior portion has a recess with an opening at the position of the lead extraction surface, the element body is housed in the recess, and the embedding portion is filled into the recess to embed the element body in the recess.

3. The electronic component according to claim 2, wherein the exterior portion further has a bottom surface protrusion that protrudes from the bottom surface of the recess toward the opening surface.

4. The electronic component according to claim 2, wherein the exterior portion further has a side projection that projects from a side surface of the recess in a direction parallel to the opening surface.

5. The electronic component according to claim 1, wherein the base has a first main surface including the lead extraction surface of the embedded portion, a second main surface opposite the first main surface, and one or more base side surfaces connecting the first main surface and the second main surface, the first main surface being a mounting surface, and the base side surfaces being inclined so that the area of ​​the first main surface is smaller than that of the second main surface.

6. An electronic component according to claim 5, wherein an edge of the side surface of the base body adjacent to the side connected to the first main surface is formed as a rough surface having a large surface roughness.

7. The electronic component according to claim 6, wherein a portion of said terminal electrode is attached to said rough surface of said side surface of said base.

8. The electronic component according to claim 1, wherein the exterior material forming the exterior portion and the embedded portion material forming the embedded portion are the same material.

9. An electronic component according to any one of claims 1 to 8, wherein the element body is a coil, and the exterior portion and the embedded portion are formed from a magnetic core material.

10. The electronic component according to any one of claims 1 to 8, wherein the element body is one of a semiconductor integrated circuit, a sensor element, or a polymer aluminum electrolytic capacitor element.

11. A method for manufacturing an electronic component, comprising the steps of: using a frame member having a plurality of compartments, forming an exterior portion having a recess in each of the compartments, and forming an exterior portion connecting portion that connects the plurality of exterior portions formed in the plurality of compartments; arranging an element body in the recess of the exterior portion formed in each of the plurality of compartments; filling the recess in which the element body is arranged with an embedding portion material to form an embedding portion in which the element body is embedded, thereby forming an element housing base in each of the plurality of compartments, which has the exterior portion and the embedding portion and in which the element body is arranged; and separating the frame member from an element housing base assembly having a plurality of the element housing bases formed in the plurality of compartments and the connecting portion, thereby individualizing the element housing bases.

12. The method for manufacturing an electronic component according to claim 11, wherein the step of forming the element-accommodating substrate further comprises forming embedded portion connecting portions that connect the plurality of embedded portions formed in the plurality of compartments.

13. The method for manufacturing an electronic component according to claim 11, wherein the frame member is a member in which partition walls that form the boundaries of the compartments are formed in a lattice pattern.

14. A method for manufacturing an electronic component as described in claim 11, wherein the frame member has a first opening surface on which the opening surface of the recess of the exterior portion is disposed, a second opening surface opposite the first opening surface, and one or more compartment side surfaces which are sides of a partition wall forming the boundary of the compartment and connect the first opening surface and the second opening surface, and the compartment side surfaces are inclined so that the area of ​​the first opening surface is smaller than that of the second opening surface.

15. A method for manufacturing an electronic component as described in claim 11, wherein in the step of singulating the element accommodating substrates from the element accommodating substrate assembly, the individual element accommodating substrates are detached from the element accommodating substrate assembly formed on the frame member by punching.

16. A method of manufacturing an electronic component as set forth in claim 11, wherein in the step of arranging the element body in the recess, the element body is arranged in the recess so that the leads of the element body extend in the direction of the opening surface of the recess of the exterior body; in the step of forming the element housing base, an element housing base assembly is formed having a plurality of the element housing bases formed in a plurality of the compartments and the connecting portion; and the element housing base assembly is polished on the surface on the side where the opening surface of the recess of the exterior body is located so that the leads are exposed in each of the plurality of element housing bases formed in the plurality of compartments; and in the step of singulating the element housing base, the element housing base assembly is polished so that the leads are exposed, and the element housing base is singulated by separating the frame member from the element housing base assembly having the plurality of element housing bases formed in a plurality of the compartments and the connecting portion.

17. A method for manufacturing an electronic component as described in claim 11, wherein the step of forming the exterior portion in each of the multiple compartments and forming the exterior portion connecting portion further comprises forming at least one or both of a bottom surface convex portion that protrudes from the bottom surface of the recess toward the opening surface of the recess and a side surface convex portion that protrudes from the side surface of the convex portion in a direction parallel to the opening surface, and the step of placing the element body in the recess comprises placing the element body in the recess along at least one or both of the bottom surface convex portion and the side surface convex portion that have been formed.

18. The method for manufacturing an electronic component according to claim 11, further comprising the step of forming terminal electrodes on the element housing base, the terminal electrodes being connected to the leads of the element body.

Images