Bonding device and method and storage medium

Abstract

Provided in the present invention are a bonding device and method and a storage medium. The bonding device comprises a first suction disc, a second suction disc and a controller. The first suction disc comprises a suction part and a light reflection part, the suction part being located in the central area of the first suction disc, and the light reflection part surrounding the edge of the suction part. The second suction disc is used for suctioning a second sample to be bonded. The controller is connected to a light source and a detection module, and is configured to: provide to the first suction disc located at a first sampling position vertical illumination light rays by means of the light source, and, by means of the detection module, acquire first reflected light rays provided by the light reflection part of the first suction disc, so as to determine a first position of a first sample; move the second suction disc to a second sampling position before the first suction disc, and acquire corresponding second reflected light rays by means of the detection module, so as to determine a second position of a second sample; and bond the first sample and the second sample on the basis of the first position and the second position.

Description

Bonding apparatus, method and storage medium TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor device processing, and in particular to a bonding apparatus, a bonding method, and a computer readable storage medium. BACKGROUND

[0002] In the process of processing a semiconductor wafer, a chamfer is usually formed at the edge of the wafer to improve the quality and stability of the wafer. In the existing alignment technology for wafer bonding by edge detection, a backlight illumination method is usually used to image the edge of the wafer to overcome the problem that the reflected light at the edge of the wafer cannot return to the detection device due to the chamfer.

[0003] This backlight illumination method usually requires a hole to be formed at the edge of the chuck to allow the illumination light to pass through the chuck to form an image of the edge of the wafer. However, the structure of the hole formed at the edge of the chuck can cause the edge of the wafer to be unable to be effectively adsorbed, thereby affecting the flatness of the wafer during the bonding process, affecting the alignment accuracy between the wafers to be bonded, and generating bubbles on the bonding surface.

[0004] In order to overcome the above-mentioned defects of the prior art, there is an urgent need in the field for an improved wafer bonding technology to overcome the problem of uneven adsorption of the edge of the wafer, poor flatness and bubbles on the bonding surface caused by the need for a hole to be formed at the edge of the chuck in the backlight edge imaging technology.

[0005] SUMMARY

[0006] The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0007] In order to overcome the above-mentioned defects of the prior art, the present application provides a bonding apparatus, a bonding method and a computer readable storage medium, which can break through the limitation that the wafer with chamfered edge cannot be positioned by reflection imaging by providing the probe with reflected light describing the pose information of the wafer by using the reflection part, thereby overcoming the problem of uneven adsorption of the edge of the wafer, poor flatness and bubbles on the bonding surface caused by the need for a hole to be formed at the edge of the chuck in the backlight edge imaging technology.

[0008] Specifically, the bonding device according to the first aspect of the present application comprises a first chuck, a second chuck and a controller. The first chuck comprises an adsorption portion and a reflective portion. The adsorption portion is located in a central region of the first chuck and is used for adsorbing a first sample to be bonded. The reflective portion is located around an edge of the adsorption portion and is used for reflecting illumination light received thereby. The second chuck is used for adsorbing a second sample to be bonded. The controller is connected to a light source and a detection module and is configured to: provide vertical illumination light to the first chuck located at a first sampling position via the light source, and collect first reflected light provided by the reflective portion of the first chuck via the detection module, so as to determine a first position of the first sample adsorbed by the first chuck; move the second chuck to a second sampling position in front of the first chuck, and collect corresponding second reflected light via the detection module, so as to determine a second position of the second sample adsorbed by the second chuck; and bond the first sample and the second sample according to the first position and the second position.

[0009] Further, in some embodiments of the present application, the first sample is circular and has at least one first marker portion located at an edge thereof. The reflective portion is located at at least three characteristic positions of the edge of the adsorption portion and is used for providing first reflected light indicating an edge profile of the first sample to the detection module, so that the controller determines the first position of the first sample according to the first reflected light of the at least three characteristic positions. The first marker portion is located at at least one of the at least three characteristic positions, so that the controller determines a first angle of the first sample according to the first reflected light of the characteristic position where the first marker portion is located.

[0010] Further, in some embodiments of the present application, the second sample is circular and has at least one second marker portion located at an edge thereof. A first diameter of the second sample is greater than a second diameter of the second chuck and is less than a third diameter of the reflective portion. The reflective portion is further used for providing second reflected light indicating an edge profile of the second sample to the detection module, so that the controller determines the second position of the second sample according to the second reflected light of the at least three characteristic positions. The second marker portion is located at at least one of the at least three characteristic positions, so that the controller determines a second angle of the second sample according to the second reflected light of the characteristic position where the second marker portion is located.

[0011] Further, in some embodiments of the present application, the bonding device further comprises a mirror and a first transverse driving mechanism. The first transverse driving mechanism is connected to the mirror and is used for moving the mirror transversely between the first chuck and the second chuck after the second chuck reaches the second sampling position, so as to provide the second reflected light to the detection module via the mirror.

[0012] Further, in some embodiments of the present application, the second sample is circular, and at least one second mark is provided at the edge of the second sample. A first diameter of the second sample is greater than a second diameter of the second chuck and less than a fourth diameter of the reflection member. The reflection member is located at at least three characteristic positions of the edge of the second chuck for providing second reflected light rays indicative of the edge profile of the second sample to the detection module, so that the controller determines the second position of the second sample according to the second reflected light rays of the at least three characteristic positions. The second mark is located at at least one of the at least three characteristic positions, so that the controller determines the second angle of the second sample according to the second reflected light rays of the characteristic position where the second mark is located.

[0013] Further, in some embodiments of the present application, the bonding device further comprises a second lateral driving mechanism. The second lateral driving mechanism is connected to the second chuck for moving the second chuck laterally to a second sampling position before the first chuck after the first position of the first sample is determined.

[0014] Further, in some embodiments of the present application, the bonding device further comprises a first longitudinal driving mechanism and / or a second longitudinal driving mechanism. The first longitudinal driving mechanism is connected to the first chuck for moving the first chuck longitudinally to a bonding position away from the detection module after the first position of the first sample is determined. The second longitudinal driving mechanism is connected to the detection module for moving the detection module longitudinally to a third sampling position away from the first chuck after the first position of the first sample is determined.

[0015] Further, in some embodiments of the present application, the bonding device further comprises a third lateral driving mechanism and / or a rotating mechanism. The third lateral driving mechanism is connected to the first chuck. The rotating mechanism is connected to the first chuck and / or the second chuck. The controller is connected to the second lateral driving mechanism, the third lateral driving mechanism and / or the rotating mechanism, and is further configured to: drive the third lateral driving mechanism to move the first chuck laterally and / or drive the second lateral driving mechanism to move the second chuck laterally for position compensation according to the difference between the first position and the second position; and / or drive the rotating mechanism to rotate the first chuck and / or the second chuck for angle compensation according to the difference between the first angle of the first sample and the second angle of the second sample; and bond the first sample and the second sample after the position compensation and / or the angle compensation are completed.

[0016] Further, in some embodiments of the present application, the detection module further comprises a microscope objective and an imaging unit. The microscope objective is arranged to face the first sampling position and the second sampling position. The imaging unit is arranged to be located at an image side of the microscope objective, and configured to sequentially collect the first reflected light and the second reflected light via the microscope objective to generate the edge profile images of the first sample and the second sample, respectively.

[0017] Further, in some embodiments of the present application, the detection module further comprises a half mirror. The half mirror is arranged between the microscope objective and the imaging unit, and configured to sequentially transmit the illumination light provided by the light source to the image side of the microscope objective to illuminate the first sampling position and the second sampling position located at the object side of the microscope objective, and sequentially transmit the first reflected light and the second reflected light outputted from the image side of the microscope objective to the imaging unit.

[0018] Further, in some embodiments of the present application, the detection module further comprises a half mirror. The half mirror is arranged between the microscope objective and the imaging unit, and configured to sequentially transmit the illumination light provided by the light source to the image side of the microscope objective to illuminate the first sampling position and the second sampling position located at the object side of the microscope objective, and sequentially transmit the first reflected light and the second reflected light outputted from the image side of the microscope objective to the imaging unit.

[0019] Further, in some embodiments of the present application, the step of collecting the corresponding second reflected light to determine the second position of the second sample adsorbed by the second chuck comprises: after moving the second chuck to the second sampling position in front of the first chuck, moving the reflector laterally between the first chuck and the second chuck via a first lateral driving mechanism to collect the second reflected light provided by the reflector; and performing reflective imaging positioning according to the second reflected light provided by the reflector to determine the second position of the second sample adsorbed by the second chuck.

[0020] Further, in some embodiments of the present application, the step of moving the second chuck to the second sampling position in front of the first chuck comprises: after determining the first position of the first sample adsorbed by the first chuck, moving the second chuck laterally to the second sampling position in front of the first chuck via a second lateral driving mechanism.

[0021] Further, in some embodiments of the present application, after determining the first position of the first sample, and before moving the second chuck to the second sampling position before the first chuck, the bonding method further comprises the following steps: moving the first chuck longitudinally away from the detection module to a bonding position via a first longitudinal driving mechanism; and / or moving the detection module longitudinally away from the first chuck to a third sampling position via a second longitudinal driving mechanism.

[0022] Further, in some embodiments of the present application, the step of bonding the first sample and the second sample according to the first position and the second position comprises: driving a third lateral driving mechanism to move the first chuck laterally and / or driving a second lateral driving mechanism to move the second chuck laterally according to the difference between the first position and the second position, to perform position compensation; and / or driving the rotating mechanism to rotate the first chuck and / or the second chuck according to the difference between the first angle of the first sample and the second angle of the second sample, to perform angle compensation; and bonding the first sample and the second sample after the position compensation and / or the angle compensation is completed.

[0023] In addition, the above computer readable storage medium according to the third aspect of the present application has computer instructions stored thereon. When the computer instructions are executed by a processor, the bonding method according to the first aspect of the present application is implemented. BRIEF DESCRIPTION OF DRAWINGS

[0024] The above features and advantages of the present application can be better understood by reading the detailed description of embodiments of the present application in conjunction with the following drawings, in which: the components are not necessarily drawn to scale, and components of similar or identical function or features can have the same or similar reference label.

[0025] FIG. 1 shows a structural schematic diagram of a bonding device according to some embodiments of the present application.

[0026] FIG. 2 shows a schematic diagram of a sample according to some embodiments of the present application.

[0027] FIG. 3 shows a schematic diagram of a reflection principle according to some embodiments of the present application.

[0028] FIG. 4 shows a top view of a sample according to some embodiments of the present application.

[0029] FIG. 5 shows a flowchart of a bonding method according to some embodiments of the present application.

[0030] FIG. 6 shows a schematic diagram of determining a first position of a first sample according to some embodiments of the present application.

[0031] FIG. 7 shows a structural schematic diagram of a bonding device according to some embodiments of the present application.

[0032] FIG. 8 shows a schematic diagram of a bonding device with the reflecting member removed according to some embodiments of the present application. DETAILED DESCRIPTION

[0033] Those skilled in the art will readily understand that the application is well adapted to carry out the objects and obtain the ends and advantages mentioned, as well as those inherent therein. While the application has been described with reference to a preferred embodiment, it is understood that various modifications can be made therein by those skilled in the art. Accordingly, the application is not to be limited by the above description, but is only limited by the scope of the patent claims. It will be understood that, although the terms "first", "second", etc. can be used herein to describe various components, regions, layers and / or sections, these components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one component, region, layer or section from another. Thus, a first component, region, layer or section discussed below could be termed a second component, region, layer or section without departing from the scope of the application.

[0034] In the description of the present application, it is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting, save for the appended claims. Unless specifically defined, terms are to be given their broadest interpretation consistent with the context. It must be noted that, as used in the specification and the appended claims, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. The term "comprises" and variations thereof, do not exclude the presence of other elements or materials. The word "comprising" and variations

[0035] In addition, the use of "about" and "substantially" herein is intended to convey that the description is accurate within a reasonable amount of deviation, such as, for example, a margin of error inherent in any measuring process, or a margin of error that is acceptable in the art. In addition, "upper" and "lower" in the following description are understood to be the orientation as shown in the figures and related drawings. Such relative terms are used for convenience only and do not require the device to be manufactured or operated in a particular orientation. Thus, the application should not be construed as being limited to the specific embodiments described herein.

[0036] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various components, regions, layers and / or sections, these components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one component, region, layer or section from another. Thus, a first component, region, layer or section discussed below could be termed a second component, region, layer or section without departing from the scope of the application.

[0037] As described above, since a chamfer is usually opened at the edge of the semiconductor wafer during the processing of the semiconductor wafer to improve the quality and stability of the wafer, in the existing alignment technology for wafer bonding by edge detection, a backlight illumination method is usually used to image the edge of the wafer to overcome the problem that the reflected light of the wafer edge cannot return to the detection device due to the chamfer. However, since the backlight illumination method usually needs to open a hole at the edge of the chuck that carries the wafer, the hole will cause the wafer edge to be unable to be effectively adsorbed, which will affect the flatness of the wafer during the bonding process, thereby affecting the alignment accuracy between the wafers to be bonded and generating bubbles on the bonding surface.

[0038] In order to overcome the above-mentioned defects of the prior art, the present application provides a bonding device, a bonding method and a computer readable storage medium, which can break through the limitation that the wafer with chamfered edge cannot be positioned by reflection imaging by providing the probe with reflected light describing the pose information of the wafer by the reflecting part, thereby overcoming the problem that the backlight edge imaging technology needs to open a hole at the edge of the chuck, which easily causes uneven adsorption of the wafer edge, poor flatness and bubbles on the bonding surface.

[0039] In some non-limiting embodiments, the above-mentioned bonding method provided by the second aspect of the present application can be implemented based on the above-mentioned bonding device provided by the first aspect of the present application. Specifically, the bonding device can be configured with a memory and a controller. The memory includes but is not limited to the above-mentioned computer readable storage medium provided by the third aspect of the present application, and the computer instructions are stored on the computer readable storage medium. The controller is connected to the memory and is configured to execute the computer instructions stored on the memory to implement the above-mentioned bonding method provided by the second aspect of the present application.

[0040] For details, please refer to FIGS. 1-4. FIG. 1 shows a structural schematic diagram of a bonding device according to some embodiments of the present application. FIG. 2 shows a schematic diagram of a sample according to some embodiments of the present application. FIG. 3 shows a reflection principle schematic diagram according to some embodiments of the present application. FIG. 4 shows a top view of a sample according to some embodiments of the present application.

[0041] In the embodiment shown in FIG. 1, the bonding device according to the first aspect of the present application comprises a first chuck, a second chuck 12, a light source 13 and a detection module 14. The first chuck comprises an adsorption portion 111 and a reflective portion 112. Here, the adsorption portion 111 is located at the center of the first chuck, and is used to adsorb a first sample 15 (e.g., a first wafer with a chamfered edge) to be bonded. The reflective portion 112 is located around the edge of the adsorption portion 111, and is used to reflect the illumination light received thereby. The second chuck 12 is used to adsorb a second sample 16 (e.g., a second wafer with a chamfered edge) to be bonded. The light source 13 is used to provide vertical illumination light to the first chuck located at a first sample position. The detection module 14 is used to collect first reflected light provided by the reflective portion 112 of the first chuck, so as to determine a first position of the first sample 15 adsorbed by the first chuck, and to collect corresponding second reflected light, so as to determine a second position of the second sample 16 adsorbed by the second chuck 12.

[0042] Further, as shown in FIG. 2, the first sample is a first wafer with a chamfered edge, and the light emitted by the light source 13 cannot be reflected back to the detection module 14 after being reflected by the chamfer. As shown in FIG. 3, the light emitted by the light source 13 can be collected by the detection module 14 after being reflected by the reflective portion 112 of the first chuck, so as to determine the first position of the first sample 15 adsorbed by the first chuck.

[0043] Further, as shown in FIG. 4, the first sample 15 is a circular sample with at least one first marking portion (e.g., a notch or a protrusion with a specific shape) located at the edge thereof. Here, the reflective portion 112 is located at at least three characteristic positions at the edge of the adsorption portion 111, and is used to provide first reflected light indicating the edge profile of the first sample 15 to the detection module 14. The first marking portion is located at at least one of the at least three characteristic positions, so as to allow the controller to determine the first angle of the first sample 15 according to the first reflected light of the characteristic position where the first marking portion is located.

[0044] Similarly, as shown in FIG. 2, the second sample is a second wafer with a chamfered edge, and the light emitted by the light source 13 cannot be reflected back to the detection module 14 after being reflected by the chamfer. As shown in FIG. 1, the controller can control a large distance between the first sample 15 and the second sample 16 when observing the second sample 16. Since the light reflected by the reflective portion 112 of the first chuck is divergent, the second reflected light indicating the profile of the second sample 16 can be collected by the detection module 14, so as to determine the second position of the second sample 16 adsorbed by the second chuck 12.

[0045] Further, as shown in FIG. 4, the second sample 16 is circular, and its edge is provided with at least one second marking part. Here, the first diameter of the second sample 16 is greater than the second diameter of the second chuck 12, and is less than the third diameter of the reflective part 112. The reflective part 112 is also used to provide the detection module 14 with second reflected light rays indicative of the edge profile of the second sample 16, so that the controller can determine the second position of the second sample 16 according to the second reflected light rays of the at least three feature positions. The second marking part is located at at least one of the at least three feature positions, so that the controller can determine the second angle of the second sample 16 according to the second reflected light rays of the feature position where the second marking part is located.

[0046] In addition, in some embodiments, the above-mentioned bonding device provided by the first aspect of the present application can also optionally comprise a second lateral driving mechanism. Here, the second lateral driving mechanism is connected to the second chuck 12, and is used to laterally move the second chuck 12 to a second sampling position before the first chuck after the first position of the first sample 15 is determined, so as to avoid the second chuck from blocking the illumination light rays of the light source 13 to the first chuck.

[0047] In addition, in some embodiments, the above-mentioned bonding device provided by the first aspect of the present application can also optionally comprise a first longitudinal driving mechanism. Here, the first longitudinal driving mechanism is connected to the first chuck, and is used to longitudinally move (e.g., downward) the first chuck to a bonding position away from the detection module 14 after the first position of the first sample 15 is determined, so as to vacate the first sampling position, so that the second lateral driving mechanism can laterally move the second chuck 12 to the second sampling position before the first chuck for reflective imaging positioning.

[0048] Further, in embodiments where only the first longitudinal driving mechanism is provided, the second sampling position is preferably spatially coincident with the first sampling position, so as to eliminate alignment errors caused by different sampling distances by performing reflective imaging positioning at the same sampling distance.

[0049] Alternatively, in some other embodiments, the above-mentioned bonding device provided by the first aspect of the present application can also optionally comprise a second longitudinal driving mechanism. Here, the second longitudinal driving mechanism is connected to the detection module 14, and is used to longitudinally move (e.g., upward) the detection module 14 to a third sampling position away from the first chuck after the first position of the first sample 15 is determined, so as to vacate the space of the second sampling position, so that the second lateral driving mechanism can laterally move the second chuck 12 to the second sampling position before the first chuck for reflective imaging positioning.

[0050] Further, in the embodiment where only the second longitudinal driving mechanism is provided, or the first longitudinal driving mechanism and the second longitudinal driving mechanism are both provided, the sampling distance of the detection module 14 to the second sampling position is preferably equal to the sampling distance of the detection module 14 to the first sampling position, so as to eliminate the alignment error caused by different sampling distances by positioning through reflection imaging at the same sampling distance.

[0051] In addition, in some embodiments, the bonding device provided by the first aspect of the present application can further optionally comprise a third lateral driving mechanism and / or a rotating mechanism. In this case, the third lateral driving mechanism is connected to the first chuck. The rotating mechanism is connected to the first chuck and / or the second chuck, which can be one rotating mechanism connected to the first chuck and / or the second chuck, or two rotating mechanisms connected to the first chuck and the second chuck respectively.

[0052] In addition, in the embodiment shown in FIG. 1, the detection module 14 comprises at least three microscopic objectives 141 and an imaging unit. In this case, the at least three microscopic objectives 141 are respectively aligned with the at least three characteristic positions of the reflecting part 111, and the object side thereof faces the first sampling position and the second sampling position. The imaging unit is located on the image side of the microscopic objectives 141, and is used to sequentially collect the first reflected light and the second reflected light via the microscopic objectives 141, so as to generate the edge profile images of the first sample 15 and the second sample 16 respectively.

[0053] Further, in the embodiment shown in FIG. 1, the detection module 14 further comprises a half mirror 142 located between the microscopic objectives 141 and the imaging unit (not shown), which is used to sequentially transmit the illumination light provided by the light source 13 to the image side of the microscopic objectives 141, so as to sequentially irradiate the first sampling position and the second sampling position located on the object side of the microscopic objectives 141, and then sequentially transmit the first reflected light and the second reflected light output from the image side of the microscopic objectives 141 to the imaging unit above. In this way, the half mirror 142 can ensure the vertical illumination of the light source 13 while allowing the imaging unit to vertically collect the edge profile images of the first sample 15 and the second sample 16, so as to eliminate the sampling error caused by oblique illumination or oblique sampling.

[0054] The working principle of the above bonding device will be described below in combination with some embodiments of the bonding method. Those skilled in the art can understand that these embodiments of the bonding method are only some non-limiting embodiments provided by the present application, which are intended to clearly demonstrate the main concept of the present application and provide some specific schemes for facilitating the public to implement, but not to limit the overall function or overall working mode of the bonding device. Similarly, the bonding device is also only a non-limiting embodiment provided by the present application, which does not limit the execution subject and execution order of each step in these bonding methods.

[0055] Specifically, please refer to FIG. 1, FIG. 5 and FIG. 6. FIG. 5 shows a flowchart of a bonding method according to some embodiments of the present application. FIG. 6 shows a schematic diagram of determining a first position of a first sample according to some embodiments of the present application.

[0056] As shown in FIG. 4 and FIG. 6, the controller of the bonding device can first adsorb the first sample 15 to be bonded via the first chuck, and adsorb the second sample 16 to be bonded via the second chuck 12. Then, the controller can provide vertical illumination light to the first chuck at the first sampling position via the light source 13, and collect the first reflected light provided by the reflective part 112 of the first chuck to determine the first position of the first sample 15 adsorbed by the first chuck.

[0057] As shown in FIG. 1, after determining the first position of the first sample 15 adsorbed by the first chuck, the controller can move the second chuck 12 to the second sampling position in front of the first chuck via the second transverse driving mechanism, and collect the corresponding second reflected light to determine the second position of the second sample 16 adsorbed by the second chuck.

[0058] In addition, in some preferred embodiments, before moving the second chuck 12 to the second sampling position in front of the first chuck, the controller can also move the first chuck longitudinally away from the detection module to a bonding position via the first longitudinal driving mechanism, so as to vacate the first sampling position for the second transverse driving mechanism to move the second chuck 12 transversely to the second sampling position in front of the first chuck for reflection imaging positioning.

[0059] In addition, in some preferred embodiments, before moving the second chuck 12 to the second sampling position in front of the first chuck, the controller can also move the detection module 14 longitudinally away from the first chuck to a third sampling position via the second longitudinal driving mechanism, so as to vacate the space of the second sampling position for the second transverse driving mechanism to move the second chuck transversely to the second sampling position in front of the first chuck for reflection imaging positioning.

[0060] After that, the controller can bond the first sample 15 and the second sample 16 according to the first position and the second position. Specifically, during the bonding process, the controller can drive the third transverse driving mechanism to move the first chuck transversely and / or drive the second transverse driving mechanism to move the second chuck transversely according to the difference between the first position and the second position, so as to perform position compensation.

[0061] Alternatively, the controller can also drive the rotating mechanism to rotate the first chuck and / or the second chuck according to the difference between the first angle of the first sample and the second angle of the second sample, so as to perform angle compensation.

[0062] Subsequently, the controller can bond the first sample 15 and the second sample 16 which have completed the position compensation and / or the angle compensation.

[0063] Those skilled in the art can understand that the embodiment shown in FIGS. 1-6, which aligns and bonds the first sample 15 and the second sample 16 based on the single reflective portion 112, is only a non-limiting embodiment provided by the present application, which is intended to clearly demonstrate the main concept of the present application and provide some specific solutions for the public to implement, rather than to limit the protection scope of the present application.

[0064] Optionally, please refer to FIGS. 2, 4 and 7, FIG. 7 shows a structural schematic diagram of a bonding device provided according to some embodiments of the present application.

[0065] In the embodiments shown in FIGS. 2, 4 and 7, the above bonding device provided by the first aspect of the present application includes a first chuck, a second chuck 22, a light source 23 and a detection module 24. The first chuck includes an adsorption portion 211 and a reflective portion 212. Here, the adsorption portion 211 is located at the central region of the first chuck, which is used to adsorb the first sample 25 (for example, a first wafer with chamfered edges) to be bonded. The reflective portion 212 surrounds the edge of the adsorption portion 211, which is used to reflect the illumination light received thereby. The second chuck 22 is used to adsorb the second sample 26 (for example, a second wafer with chamfered edges) to be bonded. The light source 23 is used to provide vertical illumination light to the first chuck located at the first sampling position. The detection module 24 is used to collect the first reflected light provided by the reflective portion 212 of the first chuck to determine the first position of the first sample 25 adsorbed by the first chuck, and to collect the corresponding second reflected light to determine the second position of the second sample 26 adsorbed by the second chuck 22.

[0066] Similarly, as shown in FIG. 2, the first sample 25 is a first wafer with chamfered edges, and the light emitted by the light source 23 cannot be reflected back to the detection module 24 after being reflected by the chamfer. As shown in FIG. 3, the light emitted by the light source 23 can be collected by the detection module 24 after being reflected by the reflective portion 212 of the first chuck, that is, the first position of the first sample 25 adsorbed by the first chuck can be determined.

[0067] Further, as shown in FIG. 4, the first sample 25 is circular, and its edge is provided with at least one first marker (e.g. a notch or a protrusion of a specific shape). Here, the reflective member 212 is located at at least three characteristic positions of the edge of the adsorption member 211, at least for providing the detection module 24 with first reflected light rays indicative of the edge profile of the first sample 25, so as for the controller to determine the first position of the first sample 25 according to the first reflected light rays of the at least three characteristic positions. The first marker is located at at least one of the at least three characteristic positions, so as for the controller to determine the first angle of the first sample 25 according to the first reflected light rays of the characteristic position where the first marker is located.

[0068] Further, in the embodiment shown in FIG. 7, the bonding apparatus provided by the first aspect of the present application can further optionally comprise a reflective member 27 and a first lateral driving mechanism. Here, the first lateral driving mechanism is connected to the reflective member 27, at least for moving the reflective member 27 laterally between the first adsorption member and the second adsorption member 22 after the second adsorption member 22 reaches the second sampling position, so as for the detection module 24 to provide the second reflected light rays via the reflective member 27, thereby for the detection module 24 to determine the second position of the second sample 26 adsorbed by the second adsorption member 22. Moreover, the first lateral driving mechanism can further move the reflective member 27 laterally away from between the first adsorption member and the second adsorption member 22 after the second position of the second sample adsorbed by the second adsorption member 22 is determined, so as to avoid the reflective member 27 from blocking the illumination light rays of the light source 23 to the first adsorption member, and to avoid the reflective member from affecting the subsequent bonding operation.

[0069] Further, as shown in FIG. 4, the second sample 26 is circular, and its edge is provided with at least one second marker. Here, the first diameter of the second sample 26 is greater than the second diameter of the second adsorption member 22, and is less than the fourth diameter of the reflective member 27. The reflective member 27 is located at at least three characteristic positions of the edge of the second adsorption member 22, at least for providing the detection module 24 with second reflected light rays indicative of the edge profile of the second sample 22, so as for the controller to determine the second position of the second sample 26 according to the second reflected light rays of the at least three characteristic positions. The second marker is located at at least one of the at least three characteristic positions, so as for the controller to determine the second angle of the second sample 26 according to the second reflected light rays of the characteristic position where the second marker is located.

[0070] Further, in some embodiments, the bonding apparatus provided by the first aspect of the present application can further optionally comprise a second lateral driving mechanism. Here, the second lateral driving mechanism is connected to the second adsorption member 22, at least for moving the second adsorption member 22 laterally to the second sampling position before the first adsorption member after the first position of the first sample 25 is determined, so as to avoid the second adsorption member from blocking the illumination light rays of the light source 23 to the first adsorption member.

[0071] In addition, in some embodiments, the bonding apparatus provided by the first aspect of the present application can further optionally comprise a first longitudinal driving mechanism. Here, the first longitudinal driving mechanism is connected to the first chuck, for moving the first chuck longitudinally (e.g. downward) to a bonding position away from the detection module 24 after determining the first position of the first sample 25, which can be used to clear the first sampling position for the second lateral driving mechanism to move the second chuck 22 laterally to the second sampling position before the first chuck for reflective imaging positioning.

[0072] Further, in embodiments with only the first longitudinal driving mechanism, the second sampling position is preferably spatially coincident with the first sampling position, so that the alignment error caused by different sampling distances is eliminated by performing reflective imaging positioning at the same sampling distance.

[0073] Alternatively, in other embodiments, the bonding apparatus provided by the first aspect of the present application can further optionally comprise a second longitudinal driving mechanism. Here, the second longitudinal driving mechanism is connected to the detection module 24, for moving the detection module 24 longitudinally (e.g. upward) to a third sampling position away from the first chuck after determining the first position of the first sample 25, which can be used to clear the space of the second sampling position for the second lateral driving mechanism to move the second chuck 22 laterally to the second sampling position before the first chuck for reflective imaging positioning.

[0074] Further, in embodiments with only the second longitudinal driving mechanism, or with both the first longitudinal driving mechanism and the second longitudinal driving mechanism, the sampling distance of the detection module 24 to the second sampling position is preferably equal to the original sampling distance of the detection module 24 to the first sampling position, so that the alignment error caused by different sampling distances is eliminated by performing reflective imaging positioning at the same sampling distance.

[0075] In addition, in some embodiments, the bonding apparatus provided by the first aspect of the present application can further optionally comprise a third lateral driving mechanism and / or a rotating mechanism. Here, the third lateral driving mechanism is connected to the first chuck. The rotating mechanism is connected to the first chuck and / or the second chuck, which can be one rotating mechanism connected to the first chuck and / or the second chuck, or two rotating mechanisms connected to the first chuck and the second chuck respectively.

[0076] In addition, in the embodiment shown in FIG. 7, the detection module 24 comprises at least three microscopic objectives 242 and an imaging unit. Here, the at least three microscopic objectives 242 are respectively aligned to the at least three characteristic positions of the reflective portion 222, with their object sides facing the first sampling position and the second sampling position. The imaging unit is located at the image side of the microscopic objectives 242, for sequentially collecting the first reflected light and the second reflected light via the microscopic objectives 242 to generate the edge profile images of the first sample 25 and the second sample 26 respectively.

[0077] Further, in the embodiment shown in FIG. 7, the detection module 24 further comprises a half mirror 242 between the microscope objective 242 and the imaging unit, for transmitting the illumination light provided by the light source 23 to the image side of the microscope objective 242, to sequentially irradiate the first sampling position and the second sampling position on the object side of the microscope objective 242, and then transmitting the first reflected light and the second reflected light output from the image side of the microscope objective 242 to the imaging unit. In this way, the half mirror 242 can ensure vertical illumination of the light source 23 while allowing the imaging unit to vertically collect the edge profile images of the first sample 25 and the second sample 26, thereby eliminating the sampling errors caused by oblique illumination or oblique sampling.

[0078] The working principle of the bonding device will be described below in combination with some embodiments of the bonding method. Those skilled in the art can understand that the embodiments of the bonding method are only some non-limiting embodiments provided by the present application, which are intended to clearly demonstrate the main concept of the present application and provide some specific schemes for facilitating the public to implement, but not to limit the overall function or overall working mode of the bonding device. Similarly, the bonding device is also only a non-limiting embodiment provided by the present application, which does not limit the execution subject and execution order of each step in the bonding method.

[0079] For details, please refer to FIGS. 5-8, and FIG. 8 shows a schematic diagram of the bonding device with the reflecting member removed according to some embodiments of the present application.

[0080] As shown in FIGS. 5 and 6, the controller of the bonding device can first adsorb the first sample 15 to be bonded via the first suction disc, and adsorb the second sample 16 to be bonded via the second suction disc 12. Then, the controller can provide vertical illumination light to the first suction disc at the first sampling position via the light source 13, and collect the first reflected light provided by the reflecting part 112 of the first suction disc, to determine the first position of the first sample 15 adsorbed by the first suction disc.

[0081] As shown in FIG. 7, after determining the first position of the first sample 15 adsorbed by the first suction disc, the controller can move the second suction disc 12 to the second sampling position in front of the first suction disc via the second lateral driving mechanism, and collect the corresponding second reflected light, to determine the second position of the second sample 16 adsorbed by the second suction disc.

[0082] After moving the second suction disc 22 to the second sampling position in front of the first suction disc, the controller can move the reflecting member 27 laterally between the first suction disc and the second suction disc 22 via the first lateral driving mechanism, to collect the second reflected light provided by the reflecting member 27, and then perform reflection imaging positioning according to the second reflected light provided by the reflecting member 27, to determine the second position of the second sample 26 adsorbed by the second suction disc 22.

[0083] In some preferred embodiments, before moving the second chuck 12 to the second sampling position in front of the first chuck, the controller can further move the first chuck longitudinally away from the detection module via the first longitudinal driving mechanism to vacate the first sampling position for the second lateral driving mechanism to move the second chuck 12 laterally to the second sampling position in front of the first chuck for reflective imaging positioning.

[0084] In some preferred embodiments, before moving the second chuck 12 to the second sampling position in front of the first chuck, the controller can further move the detection module longitudinally away from the first chuck via the second longitudinal driving mechanism to vacate the space of the second sampling position for the second lateral driving mechanism to move the second chuck laterally to the second sampling position in front of the first chuck for reflective imaging positioning.

[0085] Afterwards, as shown in FIG. 8, the controller can further move the reflector 27 laterally away from between the first chuck and the second chuck 22 via the first lateral driving mechanism for bonding the first sample 25 and the second sample 26.

[0086] Afterwards, the controller can bond the first sample 15 and the second sample 16 according to the first position and the second position. Specifically, during the bonding, the controller can drive the third lateral driving mechanism to move the first chuck laterally and / or drive the second lateral driving mechanism to move the second chuck laterally according to the difference between the first position and the second position for position compensation.

[0087] Alternatively, the controller can further drive the rotating mechanism to rotate the first chuck and / or the second chuck according to the difference between the first angle of the first sample and the second angle of the second sample for angle compensation.

[0088] Afterwards, the controller can bond the first sample and the second sample after the position compensation and / or the angle compensation.

[0089] In summary, the bonding device, the bonding method and the computer readable storage medium provided by the present application can break through the limitation that the wafer with chamfered edge cannot be used for reflective imaging positioning by providing the probe with the reflective light describing the wafer pose information via the reflector, thereby overcoming the problems of uneven wafer edge adsorption, poor flatness and air bubbles on the bonding surface caused by the hole on the edge of the chuck in the backlight edge imaging technology.

[0090] Although the above methods have been illustrated and described as a series of acts taken by one or more entities, it is to be understood that the methodologies are not limited by the order of the acts specified unless specified otherwise. Some acts can occur in different orders and / or concurrently with other acts from that depicted herein. In addition, those acts can also occur from a different apparatus or agency.

[0091] Those skilled in the art will appreciate that information, signals, and data can be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that can be referenced throughout the above description can be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0092] Those skilled in the art will further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans can implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0093] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding apparatus characterized by comprising: The application comprises: a first chuck, comprising an adsorption part and a light reflection part, wherein the adsorption part is located in the central area of the first chuck for adsorbing a first sample to be bonded, and the light reflection part is located around the edge of the adsorption part for reflecting the illumination light rays received thereby; a second chuck for adsorbing a second sample to be bonded; and a controller connected to a light source and a detection module, and configured to: provide vertical illumination light rays to the first chuck located at a first sampling position via the light source, and collect first reflection light rays provided by the light reflection part of the first chuck via the detection module to determine the first position of the first sample adsorbed by the first chuck; move the second chuck to a second sampling position before the first chuck, and collect corresponding second reflection light rays via the detection module to determine the second position of the second sample adsorbed by the second chuck; and bond the first sample and the second sample according to the first position and the second position.

2. The bonding apparatus according to claim 1, wherein The first sample is circular, and at least one first marker is arranged at the edge of the first sample, wherein the light reflection part is located at at least three characteristic positions of the edge of the adsorption part, and is used at least to provide first reflection light rays indicating the edge profile of the first sample to the detection module, so that the controller determines the first position of the first sample according to the first reflection light rays of the at least three characteristic positions, the first marker is located at at least one of the at least three characteristic positions, so that the controller determines the first angle of the first sample according to the first reflection light rays of the characteristic position where the first marker is located.

3. The bonding apparatus of claim 2, wherein The second sample is circular, and at least one second marker is arranged at the edge of the second sample, wherein the first diameter of the second sample is greater than the second diameter of the second chuck and less than the third diameter of the light reflection part, and the light reflection part is also used to provide second reflection light rays indicating the edge profile of the second sample to the detection module, so that the controller determines the second position of the second sample according to the second reflection light rays of the at least three characteristic positions, the second marker is located at at least one of the at least three characteristic positions, so that the controller determines the second angle of the second sample according to the second reflection light rays of the characteristic position where the second marker is located.

4. The bonding apparatus according to claim 2, wherein The application further comprises: a reflection member; and a first transverse driving mechanism connected to the reflection member, and used to move the reflection member transversely between the first chuck and the second chuck after the second chuck reaches the second sampling position, so as to provide the second reflection light rays to the detection module via the reflection member. The second sample is circular, and at least one second marker is arranged at the edge of the second sample, wherein the first diameter of the second sample is greater than the second diameter of the second chuck and less than the fourth diameter of the reflection member, and the reflection member is located at at least three characteristic positions of the edge of the second chuck, and is used to provide second reflection light rays indicating the edge profile of the second sample to the detection module, so that the controller determines the second position of the second sample according to the second reflection light rays of the at least three characteristic positions, 5. The bonding apparatus of claim 4, wherein ​ ​ The second mark is located in at least one of the at least three characteristic positions, so that the controller determines a second angle of the second sample according to a second reflected light ray of the characteristic position where the second mark is located.

6. The bonding apparatus of claim 1, wherein Further comprising: A second lateral driving mechanism connected to the second chuck, for moving the second chuck laterally to a second sampling position before the first chuck after determining the first position of the first sample.

7. The bonding apparatus of claim 6, wherein Further comprising: A first longitudinal driving mechanism connected to the first chuck, for moving the first chuck longitudinally to a bonding position away from the detection module after determining the first position of the first sample. And / or A second longitudinal driving mechanism connected to the detection module, for moving the detection module longitudinally to a third sampling position away from the first chuck after determining the first position of the first sample.

8. The bonding apparatus of claim 6, wherein The bonding device further comprises a third lateral driving mechanism connected to the first chuck and / or a rotating mechanism connected to the first chuck and / or the second chuck, and the controller is further configured to: According to the difference between the first position and the second position, drive the third lateral driving mechanism to move the first chuck laterally and / or drive the second lateral driving mechanism to move the second chuck laterally for position compensation; and / or According to the difference between the first angle of the first sample and the second angle of the second sample, drive the rotating mechanism to rotate the first chuck and / or the second chuck for angle compensation; and The first sample and the second sample after the position compensation and / or the angle compensation are completed.

9. The bonding apparatus of claim 1, wherein The detection module comprises: A microscope objective facing the first sampling position and the second sampling position; and An imaging unit located on the image side of the microscope objective, for sequentially collecting the first reflected light ray and the second reflected light ray via the microscope objective to generate edge profile images of the first sample and the second sample, respectively.

10. The bonding apparatus of claim 9, wherein The detection module further comprises: A half-mirror located between the microscope objective and the imaging unit, for sequentially transmitting the illumination light ray provided by the light source to the image side of the microscope objective to irradiate the first sampling position and the second sampling position located on the object side of the microscope objective, and then sequentially transmitting the first reflected light ray and the second reflected light ray output from the image side of the microscope objective to the imaging unit.

11. A bonding method characterized by, The method comprises the following steps: Sucking a first sample to be bonded via a first chuck, and sucking a second sample to be bonded via a second chuck, wherein the first chuck comprises a sucking portion and a light reflecting portion, the sucking portion is located in the central region of the first chuck, and the light reflecting portion surrounds the edge of the sucking portion; Providing vertical illumination light ray to the first chuck located at the first sampling position, and collecting the first reflected light ray provided by the light reflecting portion of the first chuck to determine the first position of the first sample sucked by the first chuck; moving the second chuck to a second sampling position in front of the first chuck, and collecting a corresponding second reflected light to determine a second position of a second sample sucked by the second chuck; and bonding the first sample and the second sample according to the first position and the second position.

12. The bonding method of claim 11, wherein, The step of collecting the corresponding second reflected light to determine the second position of the second sample sucked by the second chuck comprises: after moving the second chuck to the second sampling position in front of the first chuck, moving the reflector laterally between the first chuck and the second chuck via a first lateral driving mechanism to collect a second reflected light provided by the reflector; and performing reflective imaging positioning according to the second reflected light provided by the reflector to determine the second position of the second sample sucked by the second chuck.

13. The bonding method of claim 11, wherein, The step of moving the second chuck to the second sampling position in front of the first chuck comprises: after determining the first position of the first sample sucked by the first chuck, moving the second chuck laterally to the second sampling position in front of the first chuck via a second lateral driving mechanism.

14. The bonding method of claim 13, wherein, After determining the first position of the first sample, and before moving the second chuck to the second sampling position in front of the first chuck, the bonding method further comprises the steps of: moving the first chuck longitudinally away from the detection module to a bonding position via a first longitudinal driving mechanism; and / or moving the detection module longitudinally away from the first chuck to a third sampling position via a second longitudinal driving mechanism.

15. The bonding method of claim 13, wherein, The step of bonding the first sample and the second sample according to the first position and the second position comprises: driving a third lateral driving mechanism to move the first chuck laterally and / or driving the second lateral driving mechanism to move the second chuck laterally to perform position compensation according to a difference between the first position and the second position; and / or driving the rotating mechanism to rotate the first chuck and / or the second chuck to perform angle compensation according to a difference between a first angle of the first sample and a second angle of the second sample; and bonding the first sample and the second sample after the position compensation and / or the angle compensation are completed.

16. A computer readable storage medium having stored thereon computer instructions, wherein, The computer instructions, when executed by the processor, implement the bonding method according to any one of claims 11-15. The computer instructions, when executed by the processor, implement the bonding method according to any one of claims 11-15.

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