Interface apparatus, driving mechanism therefor, and semiconductor process device

Abstract

The present disclosure belongs to the technical field of semiconductor devices, and provides an interface apparatus, a driving mechanism therefor, and a semiconductor process device. The interface apparatus comprises an opening and closing apparatus for opening and closing a wafer transfer box, and a driving mechanism. The driving mechanism comprises a sleeve, a first sliding member and a second sliding member. The first sliding member is sleeved outside the sleeve, a first gap being provided between the first sliding member and the outer wall surface of the sleeve. The second sliding member is slidably arranged in the sleeve, the first sliding member or the sleeve being used for connecting to the opening and closing apparatus. The first sliding member is provided with a first magnetic member, and the second sliding member is provided with a second magnetic member, the first magnetic member magnetically fitting the second magnetic member. When the second sliding member slides with respect to the sleeve in the axial direction of the sleeve, by means of the first magnetic member and the second magnetic member, the second sliding member drives the first sliding member to slide with respect to the sleeve. The semiconductor process device comprises the interface apparatus. In this way, production of particles is fundamentally avoided, thereby avoiding water contamination.

Description

Interface device and driving mechanism thereof, and semiconductor process equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor equipment, and particularly relates to an interface device and a driving mechanism thereof, and a semiconductor process equipment. BACKGROUND

[0002] In the field of semiconductor technology, a FIMS (Front-opening Interface Mechanical Standard) module as an interface device is an important component of a semiconductor process equipment. Currently, a FOUP (Front Opening Unified Pod) is mostly used as a container for wafer transfer and temporary storage. In the process of placing and taking out wafers, the FIMS module is used to fix, purge, open and close the wafer transfer box, so as to ensure the sealing of the wafer transfer box before and after opening, and to enable the wafer to be transferred between the wafer carrying area and the wafer transfer box in a clean manner.

[0003] In the related art, the interface device includes a driving mechanism for driving the movement of the component capable of opening and closing the wafer transfer box. However, the driving mechanism is usually a pneumatic driving member, and the components thereof are prone to contact friction during relative movement, thereby generating particles. The diffusion of the particles in the vacuum environment will contaminate the wafer, thereby affecting the process effect of the wafer. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide an interface device and a driving mechanism thereof, and a semiconductor process equipment, which can solve the problem that the driving mechanism of the interface device in the related art is prone to generate particles and contaminate the wafer when working.

[0005] In a first aspect, the embodiments of the present application provide a driving mechanism applied to an interface device, the interface device including an opening and closing cover device for opening and closing a wafer transfer box, the driving mechanism being configured to drive the opening and closing cover device to perform linear motion, the driving mechanism including a sleeve, a first sliding member and a second sliding member, the first sliding member being sleeved outside the sleeve, and a first gap being provided between the first sliding member and the outer wall surface of the sleeve, the second sliding member being slidably arranged in the sleeve, and the first sliding member or the sleeve being configured to connect the opening and closing cover device.

[0006] The first sliding member is provided with a first magnetic member, the second sliding member is provided with a second magnetic member, the first magnetic member and the second magnetic member magnetically cooperate, and when the second sliding member slides relative to the sleeve along the axial direction of the sleeve, the second sliding member drives the first sliding member to synchronously slide relative to the sleeve through the first magnetic member and the second magnetic member.

[0007] In a second aspect, the embodiments of the present application further provide an interface device, comprising an opening and closing cover device and the driving mechanism described above, the opening and closing cover device is used to open and close a wafer transfer box, and one of the first sliding member and the sleeve of the driving mechanism is connected with the opening and closing cover device.

[0008] In a third aspect, the embodiments of the present application further provide a semiconductor process equipment, comprising the interface device described above.

[0009] In the embodiments of the present application, the first sliding member outside the sleeve and the sleeve have a first gap therebetween, so that the first sliding member and the sleeve do not directly contact each other during the working process of the driving mechanism, i.e., the sliding process of the first sliding member relative to the sleeve, thereby avoiding the generation of particles due to the direct contact and friction between the first sliding member and the sleeve, and further avoiding the pollution of the wafer due to the diffusion of the particles, and ensuring the process effect of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a structural schematic diagram of a driving mechanism applied to an interface device according to an embodiment of the present application;

[0011] FIG. 2 is a structural schematic diagram of the outside of a sleeve according to an embodiment of the present application;

[0012] FIG. 3 is a structural schematic diagram of a second sliding member according to an embodiment of the present application;

[0013] FIG. 4 is a side view of an interface device according to an embodiment of the present application;

[0014] FIG. 5 is a sectional view of D-D in FIG. 4;

[0015] FIG. 6 is an enlarged view of E in FIG. 4;

[0016] FIG. 7 is an enlarged view of F in FIG. 4.

[0017] Explanation of reference signs: 10-driving mechanism, 10'-first driving member, 10"-second driving member, 100-sleeve, 110-lid, 110a-first opening, 111-end cover, 112-interface block, 210-first sliding member, 210a-first gap, 220-first magnetic member, 220a-second gap, 230-first spacer, 230a-third gap, 241-first stop block, 242-second stop block, 240a-fourth gap, 251-first stop ring, 252-second stop ring, 250a-fifth gap, 300-second sliding member, 310-second magnetic member, 320-second spacer, 331-first piston, 332-second piston, 340-wear-resistant ring, 400-cylinder, 400a-channel, 510-first sealing member, 520-second sealing member, 530-third sealing member, a-gas flow channel, 20-opening and closing lid device, 21-fifth sealing member, 31-fixed plate, 31a-second opening, 32-supporting frame, 32a-supporting seat, 32b-supporting plate, 40-first guide rail, 41-first guide member, 42-second guide rail, 43-second guide member, 44-moving member, 45-connecting member, 45a-annular protrusion, 45b-fourth sealing member, 51-third driving member, 52-fourth driving member, 53-clamping assembly, 54-supporting plate, 60-wafer transfer box, A-first direction, B-second direction, C-third direction. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0019] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in a "or" relationship.

[0020] In the related art, the interface device includes a driving mechanism, which drives the movement of the component capable of opening and closing the wafer transfer box by the driving mechanism. Specifically, the driving mechanism usually includes a sleeve, a first sliding member and a second sliding member, wherein the first sliding member is located outside the sleeve, and the second sliding member is located inside the sleeve. Both the first sliding member and the second sliding member are slidably arranged, and the first sliding member or the sleeve is connected with the component capable of opening and closing the wafer transfer box. When the gas is introduced into the sleeve, the gas drives the second sliding member to move relative to the sleeve. At the same time, the second sliding member drives the first sliding member to move relative to the sleeve by means of the magnetic matching magnetic group.

[0021] However, the sleeve and the first sliding member are easy to contact and generate friction, and then generate particles. The diffusion of the particles in the vacuum environment will contaminate the wafer, and then affect the process effect of the wafer.

[0022] The embodiments of the present application can solve the problem that the driving mechanism of the interface device in the related art is easy to generate particles and then contaminate the wafer. The interface device, the driving mechanism thereof and the semiconductor process equipment provided by the embodiments of the present application will be described in detail below in combination with the drawings, through specific embodiments and application scenarios.

[0023] Please refer to FIGS. 1-7, the driving mechanism 10 disclosed by the embodiments of the present application is applied to the interface device, which can be a FIMS module. Specifically, the interface device includes an opening and closing cover device 20 for opening and closing the wafer transfer box 60. The driving mechanism 10 is connected with the opening and closing cover device 20, and is used to drive the opening and closing cover device 20 to perform linear motion, so as to make the opening and closing cover device 20 close to the wafer transfer box 60, and then facilitate the opening and closing cover device 20 to open the wafer transfer box 60.

[0024] Referring to FIG. 1, the driving mechanism 10 includes a sleeve 100, a first sliding member 210 and a second sliding member 300. The sleeve 100 provides a mounting basis for the first sliding member 210 and the second sliding member 300. The first sliding member 210 is sleeved outside the sleeve 100, and the second sliding member 300 is slidably arranged in the sleeve 100. Both the first sliding member 210 and the second sliding member 300 can move along the axial direction of the sleeve 100. Moreover, the first sliding member 210 or the sleeve 100 is used to connect the opening and closing cover device 20. Specifically, when the second sliding member 300 is driven to move by the gas, the first sliding member 210 can be driven to move relative to the sleeve 100. When the sleeve 100 is fixedly arranged, the first sliding member 210 is connected with the opening and closing cover device 20. Alternatively, when the first sliding member 210 is fixedly arranged, the sleeve 100 is connected with the opening and closing cover device 20.

[0025] In some embodiments, one of the first sliding member 210 and the sleeve 100 can be directly connected with the opening and closing cover device 20, and further, in some embodiments, one of the first sliding member 210 and the sleeve 100 can be fixedly connected with the opening and closing cover device 20 by welding, bonding or the like; or in other embodiments, one of the first sliding member 210 and the sleeve 100 can be indirectly connected with the opening and closing cover device 20.

[0026] The first sliding member 210 and the outer wall surface of the sleeve 100 are provided with a first gap 210a, and in some embodiments, the first gap 210a can be greater than or equal to 0.5 mm, i.e., the first gap 210a is not less than 0.5 mm, so as to avoid that the first gap 210a is too small to cause the first sliding member 210 to contact the outer wall surface of the sleeve 100, and at the same time, the first gap 210a cannot be too large to affect the magnetic attraction force between the first magnetic member 220 and the second magnetic member 310. In some embodiments, in the axial direction of the sleeve 100, the first gap 210a can be provided between the local region of the first sliding member 210 and the outer wall surface of the sleeve 100, or the first gap 210a can be provided between each position of the first sliding member 210 and the outer wall surface of the sleeve 100. In summary, the first sliding member 210 is completely isolated from the sleeve 100 to avoid contact between the first sliding member 210 and the sleeve 100 during the sliding process of the first sliding member 210.

[0027] It should be noted that the first sliding member 210 and the sleeve 100 are connected to different components of the interface device, and the two components of the interface device naturally form the first gap 210a between the first sliding member 210 and the sleeve 100, so the outer portion of the sleeve 100 does not need to be provided with other structures to support the first sliding member 210 to form the first gap 210a. In some embodiments, the two components of the interface device are the connecting member 45 and the support plate 32b in the following.

[0028] Specifically, the first sliding member 210 is provided with the first magnetic member 220, the second sliding member 300 is provided with the second magnetic member 310, and the first magnetic member 220 and the second magnetic member 310 are magnetically matched. In the case that the second sliding member 300 slides relative to the sleeve 100 along the axial direction of the sleeve 100, the second sliding member 300 drives the first sliding member 210 to synchronously slide relative to the sleeve 100 through the first magnetic member 220 and the second magnetic member 310. Further, in some embodiments, the magnetic poles of the first magnetic member 220 and the second magnetic member 310 are different. According to the principle of opposite poles attract each other, the first magnetic member 220 and the second magnetic member 310 generate an attractive magnetic force, so that the second magnetic member 310 attracts the first magnetic member 220 during the movement of the second magnetic member 310 with the second sliding member 300, and then the first magnetic member 220 drives the first sliding member 210 to synchronously slide relative to the sleeve 100.

[0029] In the embodiment of the present application, the first gap 210a exists between the first sliding member 210 outside the sleeve 100 and the sleeve 100. Therefore, during the operation of the driving mechanism 10, i.e. during the sliding of the first sliding member 210 relative to the sleeve 100, the first sliding member 210 and the sleeve 100 do not directly contact each other, thereby avoiding the generation of particles due to the direct contact and friction between the first sliding member 210 and the sleeve 100, and further avoiding the pollution of the wafer due to the diffusion of the particles, and ensuring the process effect of the wafer.

[0030] In an embodiment, the first sliding member 210 is a sliding cylinder, the first magnetic member 220 is arranged in the sliding cylinder, and the first magnetic member 220 is in contact with the outer wall surface of the sleeve 100, i.e. the first magnetic member 220 protrudes from the inner wall surface of the sliding cylinder.

[0031] In another embodiment, a second gap 220a is arranged between the first magnetic member 220 and the outer wall surface of the sleeve 100. In some embodiments, the second gap 220a can also be greater than or equal to 0.5 mm, i.e. the second gap 220a is not less than 0.5 mm, so as to avoid the too small second gap 220a leading to the contact between the first magnetic member 220 and the outer wall surface of the sleeve 100. Meanwhile, the second gap 220a cannot be too large, so as to avoid affecting the magnetic attraction force between the first magnetic member 220 and the second magnetic member 310. In some embodiments, the inner wall surface of the sliding cylinder can be provided with a first slot, and the first magnetic member 220 is arranged in the first slot, so as to ensure the formation of the second gap 220a between the first magnetic member 220 and the sleeve 100.

[0032] In this way, during the operation of the driving mechanism 10, the first magnetic member 220 also does not directly contact the sleeve 100, thereby avoiding the generation of particles due to the direct contact and friction between the first magnetic member 220 and the sleeve 100, optimizing the environment of the wafer, and further ensuring the cleanliness degree and process effect of the wafer.

[0033] In an embodiment, the number of the first magnetic member 220 and the second magnetic member 310 is one.

[0034] In another embodiment, the number of the first magnetic member 220 and the second magnetic member 310 is multiple, and the first magnetic member 220 and the second magnetic member 310 are one-to-one magnetically matched. In this way, by arranging multiple groups of the first magnetic member 220 and the second magnetic member 310, it is beneficial to increase the magnetic action force between the first sliding member 210 and the second sliding member 300, and it is more beneficial to smoothly drive the first sliding member 210 to slide when the second sliding member 300 slides, thereby improving the synchronization of the sliding of the first sliding member 210 and the second sliding member 300.

[0035] In some embodiments, the driving mechanism 10 further comprises a first spacer 230 for isolating two adjacent first magnetic members 220, the first spacer 230 is arranged on the inner wall of the sliding cylinder, the first magnetic members 220 are arranged at intervals, and the first spacer 230 isolates the two adjacent first magnetic members 220. Further, in some embodiments, the first spacer 230 can be made of rubber or other materials. In this way, the two adjacent first magnetic members 220 are isolated by the first spacer 230, avoiding the magnetic force of the two adjacent first magnetic members 220 affecting each other due to the close distance.

[0036] Further, in some embodiments, a third gap 230a is provided between the first spacer 230 and the outer wall of the sleeve 100, for example, the third gap 230a can also be greater than or equal to 0.5 mm, that is, the third gap 230a is not less than 0.5 mm, avoiding the first spacer 230 contacting the outer wall of the sleeve 100 due to the too small third gap 230a, at the same time, the third gap 230a cannot be too large, avoiding affecting the magnetic attraction force between the first magnetic member 220 and the second magnetic member 310. In some embodiments, the inner wall of the sliding cylinder can be provided with a first slot, and the first spacer 230 and the plurality of first magnetic members 220 are arranged in the first slot, so that the third gap 230a is formed between the first spacer 230 and the sleeve 100.

[0037] In this way, during the operation of the driving mechanism 10, the first spacer 230 will not directly contact the sleeve 100, avoiding the generation of particles due to the friction between the two, optimizing the environment of the wafer, and further ensuring the cleanliness and process effect of the wafer.

[0038] Of course, in other embodiments, the first spacer 230 can protrude from the inner wall of the sliding cylinder, and the first spacer 230 can contact the outer wall of the sleeve 100.

[0039] In some embodiments, referring to FIG. 1 and FIG. 2, the driving mechanism 10 further comprises a first stopper 241 and a second stopper 242, which are located on both sides of the first magnetic member 220 along the axial direction of the slide cylinder. In some embodiments, the first stopper 241 and the second stopper 242 can both be ring-shaped structures. The number of the first magnetic members 220 is multiple, and each first magnetic member 220 is arranged along the axial direction of the slide cylinder. The first stopper 241 and the second stopper 242 are located on both sides of the magnetic group formed by the multiple first magnetic members 220. Moreover, the first stopper 241 and the second stopper 242 are connected to the slide cylinder, and the first stopper 241 and the second stopper 242 are fixed relative to the slide cylinder, so as to limit the first magnetic member 220 between the first stopper 241 and the second stopper 242. In some embodiments, the first stopper 241 and the second stopper 242 can be directly connected to the inner wall surface of the slide cylinder by welding, bonding or other methods, or indirectly connected to the slide cylinder through other components.

[0040] As shown in FIG. 2, the fourth gap 240a is provided between the first stopper 241 and the outer wall surface of the sleeve 100, and between the second stopper 242 and the outer wall surface of the sleeve 100. In some embodiments, the fourth gap 240a can be greater than or equal to 0.5 mm, i.e., the fourth gap 240a is not less than 0.5 mm, so as to avoid the first stopper 241 and the second stopper 242 contacting the outer wall surface of the sleeve 100 due to the fourth gap 240a being too small, and at the same time, the fourth gap 240a cannot be too large, so as to avoid affecting the magnetic attraction force between the first magnetic member 220 and the second magnetic member 310.

[0041] In this embodiment, during the operation of the driving mechanism 10, the first stopper 241 and the second stopper 242 do not directly contact the sleeve 100, so as to avoid generating particles due to friction between the first stopper 241 and the second stopper 242, optimize the environment of the wafer, and further ensure the cleanliness of the wafer and the process effect.

[0042] In further embodiments, referring to FIG. 1 and FIG. 2, the driving mechanism 10 further comprises a first stop ring 251 and a second stop ring 252, which are located on both sides of the first stopper 241 and the second stopper 242 away from each other along the axial direction of the slide cylinder, so as to limit the first stopper 241 and the second stopper 242 between the first stop ring 251 and the second stop ring 252. Moreover, the first stop ring 251 and the second stop ring 252 are connected to the slide cylinder. In some embodiments, the first stop ring 251 and the second stop ring 252 are directly connected to the slide cylinder. Further, in some embodiments, the inner wall surface of the slide cylinder is provided with a first annular groove and a second annular groove, the first stop ring 251 extends into the first annular groove and protrudes from the inner wall surface of the slide cylinder, and the second stop ring 252 extends into the second annular groove and protrudes from the inner wall surface of the slide cylinder.

[0043] As shown in FIG. 2, the first stop ring 251 and the second stop ring 252 are respectively provided with a fifth gap 250a between the outer wall surface of the sleeve 100. In some embodiments, the fifth gap 250a can also be greater than or equal to 0.5 mm, i.e., the fifth gap 250a is not less than 0.5 mm, so as to avoid that the first stop ring 251 and the second stop ring 252 are in contact with the outer wall surface of the sleeve 100 due to the too small fifth gap 250a, while the fifth gap 250a cannot be too large, so as to avoid affecting the magnetic attraction force between the first magnetic member 220 and the second magnetic member 310. In the embodiment, the fifth gap 250a is greater than the fourth gap 240a.

[0044] By using the embodiment, during the operation of the driving mechanism 10, the first stop ring 251 and the second stop ring 252 will not be in direct contact with the sleeve 100, so as to avoid that particles are generated due to the friction between the first stop ring 251 and the second stop ring 252, optimize the environment of the wafer, and further ensure the cleanliness of the wafer and the process effect.

[0045] In an embodiment, the port of the sleeve 100 is in an open state, and a part of the second sliding member 300 can extend out of the sleeve 100.

[0046] In another embodiment, as shown in FIG. 1, the driving mechanism 10 further comprises a cover 110 connected to the end of the sleeve 100 to close the port of the sleeve 100. The cover 110 is relatively fixed with the sleeve 100, so that, due to the cover 110 closing the port of the sleeve 100, the second sliding member 300 only slides in the internal space of the sleeve 100. Moreover, the cover 110 is provided with an airflow passage a, which communicates with the internal space of the sleeve 100. Then, external gas flows into the sleeve 100 through the airflow passage a, and the gas as a power source can push the second sliding member 300 to slide relative to the sleeve 100. In some embodiments, both ends of the sleeve 100 are provided with the cover 110, and both of the covers 110 are provided with the airflow passage a. The gas flows into the sleeve 100 through different airflow passages a, so as to drive the second sliding member 300 to slide relative to the sleeve 100 in different directions. The cover 110 or the first sliding member 210 is used for connecting the opening and closing cover device 20.

[0047] Further, in some embodiments, the cover 110 comprises an end cover 111 and an interface block 112, the end cover 111 closes the port of the sleeve 100, and the interface block 112 is arranged on the end cover 111.

[0048] By using the embodiment, the particles generated by the friction between the second sliding member 300 and the inner wall surface of the sleeve 100 during the relative sliding of the two will not be discharged to the outside of the sleeve 100, so as to avoid the particles spreading to the surface of the wafer, which is more conducive to optimizing the environment of the wafer and ensuring the process effect of the wafer.

[0049] In some embodiments, referring to FIG. 1, the driving mechanism 10 further comprises a cylinder 400, which penetrates the cover 110 and the second sliding member 300 in sequence along the axial direction of the sleeve 100, the cylinder 400 forms a passage 400a for the gas or the line to pass through, and the cover 110 is provided with a first opening 110a in communication with the passage 400a. The opening and closing cover device 20 generally comprises a lock opening component, which needs to be connected to an external power supply device through a line, so that the line can directly pass through the first opening 110a and penetrate the cylinder 400, avoiding the line directly falling and contacting other components to generate particles, thereby avoiding pollution of the wafer. Moreover, the cylinder 400 penetrates the second sliding member 300 to naturally form a regular-shaped passage 400a, without the need to separately open the passage 400a in the second sliding member 300, which is beneficial to reduce the processing difficulty. In some embodiments, the first opening 110a is opened in the interface block 112, the cylinder 400 penetrates the first opening 110a, the end cover 111 and the second sliding member 300 in sequence, and the material of the cylinder 400 can be stainless steel. Of course, the cylinder 400 can also be made of other materials.

[0050] Of course, in other embodiments, the driving mechanism 10 can not be provided with the cylinder 400, and the inside of the second sliding member 300 is a solid structure, that is, the second sliding member 300 is not provided with the passage 400a, and the line connected to the opening and closing cover device 20 is directly arranged to fall.

[0051] In some embodiments, referring to FIG. 1, the driving mechanism 10 further comprises at least one of a first sealing member 510, a second sealing member 520 and a third sealing member 530, the first sealing member 510 is arranged between the second sliding member 300 and the cylinder 400; the second sealing member 520 is arranged between the cover 110 and the cylinder 400, and further, in some embodiments, the second sealing member 520 is arranged between the end cover 111 and the cylinder 400; and the third sealing member 530 is arranged on the outer circumferential surface of the second sliding member 300.

[0052] In an embodiment, the second sliding member 300 comprises a piston, and the third sealing member 530 is arranged on the outer circumferential surface of the piston. That is, the driving mechanism 10 can be provided with only one of the first sealing member 510, the second sealing member 520 and the third sealing member 530, or can be provided with only two of the first sealing member 510, the second sealing member 520 and the third sealing member 530, or can be provided with all of the first sealing member 510, the second sealing member 520 and the third sealing member 530. Among them, the first sealing member 510, the second sealing member 520 and the third sealing member 530 can be sealing rings, which can be rubber rings or other components that have a sealing effect.

[0053] By adopting the first sealing member 510 to seal the gap between the second sliding member 300 and the barrel 400, and the second sealing member 520 to seal the gap between the cover 110 and the barrel 400, the sealing performance of the barrel 400 can be improved. Meanwhile, by adopting the third sealing member 530 to seal the gap between the second sliding member 300 and the sleeve 100, the sealing performance of the sleeve 100 can be improved.

[0054] Of course, in other embodiments, the driving mechanism 10 can not be provided with the first sealing member 510, the second sealing member 520 and the third sealing member 530, and the driving mechanism 10 can be sealed in other manners.

[0055] In the scheme of the present application, the second sliding member 300 comprises a piston and a second spacer 320, the outer circumferential surface of the piston can be provided with a second slot, each second magnetic member 310 is arranged in the second slot in a spaced manner, and the second spacer 320 is located between two adjacent second magnetic members 310 to isolate the two adjacent second magnetic members 310. In some embodiments, any two adjacent second magnetic members 310 are isolated by the second spacer 320 respectively.

[0056] In another embodiment, referring to FIG. 1 and FIG. 3, the second sliding member 300 comprises a first piston 331, a second piston 332 and a second spacer 320, the number of the second magnetic members 310 is at least two, and each second magnetic member 310 is arranged in a spaced manner between the first piston 331 and the second piston 332. In this embodiment, the barrel 400 penetrates the combined structure of the first piston 331, the second magnetic member 310 and the second spacer 320, and the second piston 332 in sequence. In some embodiments, the first piston 331 and the second magnetic member 310, the second magnetic member 310 and the adjacent second spacer 320, and the second magnetic member 310 and the second piston 332 are connected by welding, bonding or other manners respectively.

[0057] In this way, the first piston 331 and the second piston 332 jointly clamp each second magnetic member 310 and each second spacer 320, and limit each second magnetic member 310 and each second spacer 320, without separately opening the structure of the piston for installing the second magnetic member 310 and the second spacer 320, which is conducive to simplifying the structure of the second sliding member 300.

[0058] In some embodiments, the outer circumferential surface of the first piston 331 and the second piston 332 is provided with the third sealing member 530, and the third sealing member 530 is arranged adjacent to the second magnetic member 310.

[0059] In some embodiments, the driving mechanism 10 further comprises a wear-resistant ring 340 sleeved on the outside of the piston 330. Further, in some embodiments, the wear-resistant ring 340 is sleeved on the outside of each of the first piston 331 and the second piston 332, and in addition, in some embodiments, the outer circumferential surface of each of the first piston 331 and the second piston 332 is provided with a third annular groove for mounting the wear-resistant ring 340.

[0060] With the present embodiment, the piston is in sliding fit with the inner wall surface of the sleeve 100 through the wear-resistant ring 340, avoiding the direct contact between the piston and the sleeve 100 for a long time, which leads to serious wear of the piston, thereby prolonging the service life of the piston.

[0061] Based on the driving mechanism 10 disclosed in the present application, the present embodiment further provides an interface device, which is shown in FIGS. 4-7, and comprises the opening and closing cover device 20 and the above-mentioned driving mechanism 10. FIG. 4 only schematically shows the overall structure of the driving mechanism 10, and does not show the structure inside the sleeve 100, such as the second sliding member 300. The opening and closing cover device 20 is used to open and close the wafer transfer box 60, and one of the first sliding member 210 of the driving mechanism 10 and the sleeve 100 is connected with the opening and closing cover device 20. In this way, when one of the first sliding member 210 of the driving mechanism 10 and the sleeve 100 is fixed, and the second sliding member 300 and the sleeve 100 slide relative to each other under the driving action of the external gas flowing into the sleeve 100, the other one of the first sliding member 210 and the sleeve 100 drives the opening and closing cover device 20 to move relative to the one of the first sliding member 210 and the sleeve 100 which is fixed, so as to make the opening and closing cover device 20 close to the wafer transfer box 60, thereby facilitating the opening and closing cover device 20 to open the wafer transfer box 60. Specifically, in one example, the first sliding member 210 of the driving mechanism 10 is fixed, the sleeve 100 is connected with the opening and closing cover device 20, the second sliding member 300 is fixed under the magnetic attraction force generated between the first magnetic member 220 and the second magnetic member 310, and the sleeve 100 slides relative to the second sliding member 300 under the driving action of the external gas flowing into the sleeve 100, so as to make the opening and closing cover device 20 close to the wafer transfer box 60, thereby facilitating the opening and closing cover device 20 to open the wafer transfer box 60. In another example, the sleeve 100 of the driving mechanism 10 is fixed, the first sliding member 210 is connected with the opening and closing cover device 20, and when the second sliding member 300 slides relative to the sleeve 100 under the driving action of the external gas flowing into the sleeve 100, the first sliding member 210 is driven to move relative to the sleeve 100, so as to make the opening and closing cover device 20 close to the wafer transfer box 60, thereby facilitating the opening and closing cover device 20 to open the wafer transfer box 60.

[0062] In the embodiment, the first gap 210a exists between the first sliding member 210 of the driving mechanism 10 and the sleeve 100 of the interface device, so that the first sliding member 210 and the sleeve 100 are not in direct contact during the operation of the driving mechanism 10, i.e. during the sliding of the first sliding member 210 relative to the sleeve 100. Thus, the direct contact between the first sliding member 210 and the sleeve 100 is avoided, so that the friction between the first sliding member 210 and the sleeve 100 is avoided, and thus the particles are avoided. In turn, the particles are avoided to contaminate the wafer, and the environment of the interface device is optimized, and the process effect of the wafer is ensured.

[0063] In some embodiments, the interface device comprises a fixed plate 31 and a driving mechanism 10, the driving mechanism 10 is arranged on the fixed plate 31, and the driving mechanism 10 is connected with the cover opening and closing device 20, and the driving mechanism 10 can drive the cover opening and closing device 20 to move relative to the fixed plate 31 along the first direction A. Specifically, the first sliding member 210 of the driving mechanism 10 can be connected with other components (for example, the support frame 32 (i.e. the support plate 32b) in the following description), and the sleeve 100 of the driving mechanism 10 can be connected with the cover opening and closing device 20. In some embodiments, the sleeve 100 of the driving mechanism 10 is connected with the cover opening and closing device 20 through the cover 110. Further, in some embodiments, the first sliding member 210 and the support frame 32 (i.e. the support seat 32a or the support plate 32b), and the sleeve 100 and the cover 110 can be connected through welding, bonding or the like.

[0064] In another embodiment, referring to FIG. 4 and FIG. 5, the interface device further comprises a support frame 32, a first driving member 10' and a second driving member 10''. The first driving member 10' is arranged on the support frame 32, and the first driving member 10' is connected with the cover opening and closing device 20, and the first driving member 10' can drive the cover opening and closing device 20 to move relative to the support frame 32 along the first direction A. The second driving member 10'' is arranged on the fixed plate 31, and the second driving member 10'' is connected with the support frame 32, and the second driving member 10'' can drive the support frame 32 to move relative to the fixed plate 31 along the second direction B, and the first direction A intersects with the second direction B. In some embodiments, the first direction A intersects with the second direction B, the first direction A is perpendicular to the plane where the cover opening and closing device 20 is located, and the second direction B is parallel to the plane where the cover opening and closing device 20 is located.

[0065] At least one of the first driving member 10' and the second driving member 10" is the driving mechanism 10. Specifically, only the first driving member 10' or only the second driving member 10" can adopt the driving mechanism 10 as above; or, both the first driving member 10' and the second driving member 10" can adopt the driving mechanism 10 as above. In some embodiments, the first sliding member 210 of the first driving member 10' is connected with the support frame 32, the sleeve 100 of the first driving member 10' is connected with the cover opening and closing device 20, and further, in some embodiments, the sleeve 100 of the first driving member 10' is connected with the cover opening and closing device 20 through the sealing cover 110; the sleeve 100 of the second driving member 10" is connected with the fixed plate 31, the first sliding member 210 of the second driving member 10" is connected with the support frame 32, and further, in some embodiments, the sleeve 100 of the second driving member 10" is connected with the fixed plate 31 through the sealing cover 110.

[0066] The first sliding member 210 of the first driving member 10' and the support frame 32, the sealing cover 110 of the first driving member 10' and the cover opening and closing device 20, the sealing cover 110 of the second driving member 10" and the fixed plate 31, and the first sliding member 210 of the second driving member 10" and the support frame 32 can be connected through welding, bonding or the like.

[0067] By adopting the present embodiment, the first driving member 10' and the second driving member 10" can respectively drive the cover opening and closing device 20 to move in different directions, which is conducive to the relative movement between the cover opening and closing device 20 and the opening of the wafer transfer box 60, and is more conducive to the opening of the wafer transfer box 60 by the cover opening and closing device 20.

[0068] In the embodiments in which both the first driving member 10' and the second driving member 10" are the driving mechanism 10 as above, when at least two driving mechanisms 100 work at the same time, the first sliding member 210 and the sleeve 100 of each driving mechanism 100 do not directly contact each other, which is conducive to further optimizing the environment of the interface device and ensuring the process effect of the wafer.

[0069] In some embodiments, as shown in FIG. 4, the fixed plate 31 is provided with a second opening 31a, which is used to be opposite to the opening of the wafer transfer box 60, and the opening and closing device 20 can extend into the second opening 31a to be opposite to the opening of the wafer transfer box 60. In addition, the interface device further comprises a support plate 54, a clamping assembly 53, a third driving member 51 and a fourth driving member 52, wherein the third driving member 51 and the fourth driving member 52 are both arranged on the fixed plate 31, the third driving member 51 is connected with the support plate 54, the third driving member 51 can drive the support plate 54 to move, the support plate 54 is used to carry the wafer transfer box 60, and the fourth driving member 52 is connected with the clamping assembly 53, the fourth driving member 52 can drive the clamping assembly 53 to move, and the clamping assembly 53 is used to clamp the wafer transfer box 60 in cooperation with the support plate 54.

[0070] Specifically, the third driving member 51 can drive the support plate 54 to move the wafer transfer box 60 along the first direction A, when the opening of the wafer transfer box 60 is opposite to the second opening 31a, the fourth driving member 52 drives the clamping assembly 53 to move along the third direction C, so that the clamping assembly 53 clamps the wafer transfer box 60 in cooperation with the support plate 54, and the position of the wafer transfer box 60 is fixed. Wherein, the third direction C can be perpendicular to the first direction A and the second direction B.

[0071] In some embodiments, as shown in FIG. 4 and FIG. 5, the first driving member 10' is the driving mechanism 10, the first sliding member 210 of the first driving member 10' is connected with the support frame 32, and the sleeve 100 of the first driving member 10' is connected with the opening and closing device 20; the interface device further comprises a first guide rail 40 and a first guide member 41, the first guide rail 40 extends along the first direction A, one of the first guide rail 40 and the first guide member 41 is arranged on the support frame 32, and the other is connected with the sleeve 100 of the first driving member 10', and the first guide member 41 is guided and matched with the first guide rail 40, so that the first gap 210a is formed between the first sliding member 210 and the sleeve 100 of the first driving member 10'.

[0072] Specifically, the first guide rail 40 is arranged on the support frame 32, and the first guide member 41 is connected with the sleeve 100 of the first driving member 10'; or the first guide member 41 is arranged on the support frame 32, and the first guide rail 40 is connected with the sleeve 100 of the first driving member 10'.

[0073] Thus, the sleeve 100 of the first driving member 10' and the support frame 32 can only move in the first direction A due to the cooperation between the first guide rail 40 and the first guide 41, and the sleeve 100 of the first driving member 10' and the first sliding member 210 can only move in the first direction A, so that the first sliding member 210 and the sleeve 100 cannot move in other directions, and the first gap 210a can be maintained between the first sliding member 210 and the sleeve 100 of the first driving member 10'.

[0074] Of course, in other embodiments, the interface device can not be provided with the first guide rail 40 and the first guide 41, and the first gap 210a between the sleeve 100 of the first driving member 10' and the first sliding member 210 can be formed by other structures.

[0075] In some embodiments, the second driving member 10" is the driving mechanism 10, the sleeve 100 of the second driving member 10" is connected to the fixed plate 31, and the interface device further comprises a second guide rail 42 and a second guide 43, the second guide rail 42 extends in the second direction B, one of the second guide rail 42 and the second guide 43 is arranged on the fixed plate 31, and the other is connected to the support frame 32 and the first sliding member 210 of the second driving member 10", respectively, and the second guide 43 is in guiding cooperation with the second guide rail 42, so that the first gap 210a is formed between the first sliding member 210 and the sleeve 100 of the second driving member 10".

[0076] Specifically, the second guide rail 42 is arranged on the fixed plate 31, and the second guide 43 is connected to the support frame 32 and the first sliding member 210 of the second driving member 10", respectively; or, the second guide 43 is arranged on the fixed plate 31, and the second guide rail 42 is connected to the support frame 32 and the first sliding member 210 of the second driving member 10", respectively.

[0077] Thus, the first sliding member 210 of the second driving member 10" can only move relative to the fixed plate 31 in the second direction B due to the cooperation between the second guide rail 42 and the second guide 43, so that the first sliding member 210 and the sleeve 100 of the second driving member 10" cannot move in other directions, and the first gap 210a can be maintained between the first sliding member 210 and the sleeve 100 of the second driving member 10".

[0078] In some embodiments, the second guide rail 42 and the fixed plate 31, the second guide 43 and the first sliding member 210 of the second driving member 10", the first guide rail 40 and the support frame 32, and the first guide 41 and the sleeve 100 of the first driving member 10' can be connected by welding, bonding or the like.

[0079] Of course, in other embodiments, the interface device can not be provided with the second guide rail 42 and the second guide 43, and the interface device can use other structures to form the first gap 210a between the sleeve 100 of the second drive 10" and the first sliding member 210.

[0080] In further embodiments, the interface device further comprises a moving member 44, the moving member 44 is in sliding connection with the second guide 43 along the first direction A, and the moving member 44 is connected with the support frame 32, that is, the second guide 43 is in sliding connection with the support frame 32 through the moving member 44. Moreover, the moving member 44 is driven by a separate drive member to move along the first direction A, so that the moving member 44 can drive the support frame 32, the first drive 10' and the cover opening and closing device 20 to move along the first direction A. In this way, after the first drive 10' drives the cover opening and closing device 20 to open the wafer transport box 60, the moving member 44 can drive the support frame 32, the first drive 10' and the cover opening and closing device 20 to move away from the wafer transport box 60 along the first direction A, so as to provide space for the wafer transport device to extend into the wafer transport box 60 and take out the wafer, ensuring the smooth progress of the wafer transport process.

[0081] In some embodiments, as shown in FIG. 4, the support frame 32 can comprise a support plate 32b and a support seat 32a connected with each other, the first sliding member 210 of the first drive 10' is connected with the support plate 32b, the first sliding member 210 of the second drive 10" is connected with the support seat 32a, and the first guide rail 40 is arranged on the support plate 32b.

[0082] Of course, in other embodiments, the interface device can not be provided with the moving member 44, that is, the guide is directly connected with the support frame 32, and the support frame 32 can only move relative to the fixed plate 31 along the second direction B.

[0083] In some embodiments, as shown in FIG. 4 and FIG. 6, the interface device further comprises a connecting member 45, the other one of the first guide rail 40 and the first guide 41 is connected with the sleeve 100 of the first drive 10' through the connecting member 45, that is, the other one of the first guide rail 40 and the first guide 41 is indirectly connected with the sleeve 100 of the first drive 10'. In some embodiments, the connecting member 45 can be a connecting plate or the like structure, which can be used to connect the first guide rail 40 and the sleeve 100.

[0084] In further embodiments, the connecting member 45 is provided with an annular protrusion 45a, the annular protrusion 45a is used to form a space for the first sliding member 210 of the first drive 10' to extend into, specifically, the sleeve 100 of the first drive 10' penetrates through the space of the annular protrusion 45a and is connected with the connecting member 45. In the working process of the first drive 10', the first sliding member 210 slides relative to the annular protrusion 45a, and then extends into the annular protrusion 45a or separates from the annular protrusion 45a.

[0085] The interface device further comprises a fourth seal 45b, as shown in FIG. 6, the fourth seal 45b is arranged on the annular protrusion 45a, when the first sliding member 210 of the first driving member 10' extends into the annular protrusion 45a, the support frame 32 and the annular protrusion 45a are close to each other, the fourth seal 45b seals the gap between the support frame 32 and the annular protrusion 45a, and in some embodiments, the fourth seal 45b seals the gap between the support plate 32b and the annular protrusion 45a. The fourth seal 45b can be a sealing ring, which can be a rubber ring, and of course other structures of the seal can also be used.

[0086] In this embodiment, the gap between the support frame 32 and the annular protrusion 45a is sealed by the fourth seal 45b, so that the particles generated during the relative movement of the first guide rail 40 and the first guide member 41 cannot enter the gap between the first sliding member 210 of the first driving member 10' and the sleeve 100, and then avoid the spread of the particles to contaminate the wafer, and ensure the process effect of the wafer.

[0087] Of course, in other embodiments, the connecting member 45 can not be provided with the annular protrusion 45a, and the interface device can not be provided with the fourth seal 45b, that is, the other one of the first guide rail 40 and the first guide member 41 is connected to the sleeve 100 of the first driving member 10' only through the connecting member 45.

[0088] In some embodiments, as shown in FIGS. 4 and 7, the interface device further comprises a fifth seal 21, the fifth seal 21 is arranged on the opening and closing cover device 20, and the fifth seal 21 is located outside the sleeve 100 of the first driving member 10', the fifth seal 21 can seal the gap between the opening and closing cover device 20 and the support frame 32, and in some embodiments, the fifth seal 21 can seal the gap between the opening and closing cover device 20 and the support plate 32b. During the operation of the first driving member 10', the opening and closing cover device 20 moves relative to the support frame 32, and when the first driving member 10' works to the position where the opening and closing cover device 20 contacts the support frame 32, the fifth seal 21 seals the gap between the opening and closing cover device 20 and the support frame 32.

[0089] In some embodiments, the fifth seal 21 can be a sealing ring, which can be a rubber ring, and the sealing ring is located at the periphery of the sleeve 100 of the first driving member 10', and of course, the fifth seal 21 can also use other structures of the seal.

[0090] In the embodiment, the fifth sealing member 21 is used to seal the gap between the opening and closing device 20 and the support frame 32, so that the particles generated by the relative movement between the first guide rail 40 and the first guide member 41 do not enter the gap between the opening and closing device 20 and the support frame 32, and then the particles are prevented from spreading to contaminate the wafer, and the process effect of the wafer is ensured.

[0091] Of course, in other embodiments, the interface device can not be provided with the fifth sealing member 21, and the opening and closing device 20 directly contacts the support frame 32 during the operation of the first driving member 10'.

[0092] In some embodiments, the second driving member 10" is the driving mechanism 10, and the number of the second driving member 10" is one.

[0093] In another embodiment, as shown in FIG. 5, the number of the second driving member 10" is at least two, and each second driving member 10" is distributed on the support frame 32. Further, each second driving member 10" is distributed on the support plate 32b. In the embodiment, the at least two second driving members 10" are used to simultaneously drive the opening and closing device 20 to move, which is beneficial to increase the driving force and move the opening and closing device 20. In addition, each second driving member 10" is the driving mechanism 10, so that no particles are generated during the operation of each second driving member 10", the wafer is prevented from being contaminated, the environment is further optimized, and the process effect of the wafer is improved.

[0094] Based on the interface device disclosed in the application, the embodiment of the application further provides a semiconductor process equipment, which comprises the above-mentioned interface device. In the embodiment, the interface device of the semiconductor process equipment relies on the driving mechanism 10 to prevent the wafer from being contaminated by the particles, the environment is optimized, and the process effect of the wafer is improved.

[0095] The embodiments of the application are described above with reference to the drawings, but the application is not limited to the specific embodiments described above, and the specific embodiments described above are only illustrative but not restrictive, and those skilled in the art can make many forms under the guidance of the application without departing from the purpose of the application and the scope protected by the claims, which all belong to the protection of the application.

Claims

1. A drive mechanism applied to an interface device, the interface device comprising an open-close lid device for opening and closing a wafer transfer cassette, the drive mechanism being used to drive the open-close lid device to perform linear motion, characterized in that, The driving mechanism comprises a sleeve, a first sliding member and a second sliding member, the first sliding member is sleeved outside the sleeve, a first gap is arranged between the first sliding member and the outer wall surface of the sleeve, and the second sliding member is slidably arranged in the sleeve. The first sliding member is provided with a first magnetic member, the second sliding member is provided with a second magnetic member, the first magnetic member and the second magnetic member are magnetically matched, and in the case that the second sliding member slides relative to the sleeve along the axial direction of the sleeve, the second sliding member drives the first sliding member to synchronously slide relative to the sleeve through the first magnetic member and the second magnetic member.

2. The drive mechanism of claim 1, wherein, The first sliding member is a sliding cylinder, the first magnetic member is arranged in the sliding cylinder, and a second gap is arranged between the first magnetic member and the outer wall surface of the sleeve.

3. The drive mechanism of claim 2, wherein, The number of the first magnetic members and the second magnetic members is multiple, and the first magnetic members and the second magnetic members are one-to-one magnetically matched. The driving mechanism further comprises a first spacer sleeve, the first spacer sleeve is arranged on the inner wall surface of the sliding cylinder, each first magnetic member is arranged at intervals, the first spacer sleeve separates the adjacent two first magnetic members, and a third gap is arranged between the first spacer sleeve and the outer wall surface of the sleeve.

4. The drive mechanism of claim 1, wherein, The driving mechanism further comprises a cover, the cover is connected with the end of the sleeve to close the port of the sleeve, the cover is provided with an airflow channel, the airflow channel communicates the internal space of the sleeve, and the cover or the first sliding member is used for connecting the opening and closing cover device.

5. The drive mechanism of claim 4, wherein, The driving mechanism further comprises a cylinder, the cylinder penetrates the cover and the second sliding member along the axial direction of the sleeve in sequence, the cylinder forms a channel for the passage of gas or lines, and the cover is provided with a first opening communicating with the channel.

6. The drive mechanism of claim 5, wherein, The driving mechanism further comprises at least one of a first sealing member, a second sealing member and a third sealing member, the first sealing member is arranged between the second sliding member and the cylinder, the second sealing member is arranged between the cover and the cylinder, and the third sealing member is arranged on the outer circumferential surface of the second sliding member.

7. The drive mechanism of claim 1, wherein, The second sliding member comprises a first piston, a second piston and a second spacer sleeve, the number of the second magnetic members is at least two, each second magnetic member is arranged at intervals between the first piston and the second piston, and the second spacer sleeve is located between the adjacent two second magnetic members to separate the adjacent two second magnetic members.

8. An interface device, characterized by The interface device further comprises a fixed plate, a support frame, a first driving member and a second driving member, the first driving member is arranged on the support frame, the first driving member is connected with the opening and closing cover device, the first driving member can drive the opening and closing cover device to move relative to the support frame along a first direction, 9. The interface device of claim 8, wherein, ​ The second driving member is arranged on the fixed plate, and the second driving member is connected with the support frame. The second driving member can drive the support frame to move the first driving member and the cover opening and closing device relative to the fixed plate along a second direction. The first direction intersects with the second direction. At least one of the first driving member and the second driving member is the driving mechanism.

10. The interface device of claim 9, wherein, The first driving member is the driving mechanism. The first sliding member of the first driving member is connected with the support frame. The sleeve of the first driving member is connected with the cover opening and closing device. The interface device further comprises a first guide rail and a first guide member. The first guide rail extends along the first direction. One of the first guide rail and the first guide member is arranged on the support frame, and the other is connected with the sleeve of the first driving member. The first guide member is in guiding cooperation with the first guide rail, so that the first gap is formed between the first sliding member and the sleeve of the first driving member. The second driving member is the driving mechanism. The sleeve of the second driving member is connected with the fixed plate. The interface device further comprises a second guide rail and a second guide member. The second guide rail extends along the second direction. One of the second guide rail and the second guide member is arranged on the fixed plate, and the other is connected with the first sliding member of the second driving member and the support frame respectively. The second guide member is in guiding cooperation with the second guide rail, so that the first gap is formed between the first sliding member and the sleeve of the second driving member.

11. The interface device of claim 10, wherein, The interface device further comprises a connecting member and a fourth sealing member. The other of the first guide rail and the first guide member is connected with the sleeve of the first driving member through the connecting member. The connecting member is provided with an annular protrusion. The annular protrusion is used to form a space for the first sliding member of the first driving member to extend into. The fourth sealing member is arranged on the annular protrusion. When the first sliding member of the first driving member extends into the annular protrusion, the fourth sealing member seals the gap between the support frame and the annular protrusion.

12. The interface device of claim 9, wherein, The interface device further comprises a fifth sealing member. The fifth sealing member is arranged on the cover opening and closing device, and the fifth sealing member is located outside the sleeve of the first driving member. The fifth sealing member can seal the gap between the cover opening and closing device and the support frame.

13. The interface device of claim 9, wherein, The second driving member is the driving mechanism, and the number of the second driving members is at least two. Each of the second driving members is distributed on the support frame.

14. A semiconductor process apparatus characterized by comprising: The interface device comprises any one of claims 8-13.

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