Chemical liquid supply device, cleaning system, and control valve adjustment method
The chemical liquid supply device addresses liquid supply inconsistencies by using feedback control and throttling adjustments to ensure consistent flow rates across multiple pipes, preventing shortages and improving system reliability.
Patent Information
- Application Number
- PCT/JP2025/020341
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-19
- Filing Date
- 2025-06-05
- Publication Date
- 2025-12-26
AI Technical Summary
Existing chemical liquid supply devices face issues with insufficient liquid supply to certain pipes due to energy loss, pipe length, bends, or diameter variations, leading to flow rate control failures.
A chemical liquid supply device with a confluence, first main pipe, secondary pipe, and control valves, employing feedback control and throttling adjustments to maintain set flow rates across multiple pipes, ensuring adequate liquid supply to nozzles.
Prevents liquid shortages by dynamically adjusting flow rates and maintaining consistent supply to all pipes, enhancing the reliability and efficiency of the liquid distribution system.
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Figure JP2025020341_26122025_PF_FP_ABST
Abstract
Description
Chemical solution supply device, cleaning system, and control valve adjustment method
[0001] The present invention relates to a chemical liquid supply device, a cleaning system, and a method for adjusting a control valve.
[0002] In semiconductor manufacturing processes, a chemical mechanical polishing (CMP) apparatus is used to planarize a substrate surface. The CMP apparatus may include a polishing apparatus for polishing the surface of the substrate and a cleaning apparatus for cleaning the substrate. The cleaning apparatus is connected to a chemical liquid supplying apparatus. The chemical liquid supplying apparatus supplies a cleaning liquid to the cleaning apparatus. For example, Patent Document 1 discloses an example of a chemical liquid supplying apparatus.
[0003] As shown in FIG. 1 and claim 1, the chemical liquid supply device disclosed in Patent Document 1 includes a first cleaning chemical liquid supply pipe, a first mixer that mixes the first cleaning chemical liquid with water to generate the first cleaning chemical liquid, and a first supply amount control device. The first cleaning chemical liquid supply pipe includes an upstream pipe that forms a flow path from the first mixer to a first branch point, a first pipe that forms a flow path from the first branch point to a first nozzle, and a second pipe that forms a flow path from the first branch point to a second nozzle. The first supply amount control device is configured to feedback control the flow rate of the first cleaning chemical liquid flowing through the first pipe of the first cleaning chemical liquid supply pipe to a set flow rate based on the flow rate of the first cleaning chemical liquid in the first pipe of the first cleaning chemical liquid supply pipe. With this configuration, the chemical liquid supply device of Patent Document 1 can supply liquid to the first nozzle and the second nozzle.
[0004] JP 2023-116395 A JP 2017-216483 A Japanese Patent No. 6212253 A
[0005] As described above, the chemical liquid supply device of Patent Document 1 supplies the liquid to the first nozzle and the second nozzle. At this time, the first supply amount control device performs feedback control so that the flow rate in the first pipe becomes the set flow rate.
[0006] However, if the second nozzle is located lower than the first nozzle, the liquid flowing through the first pipe connected to the first nozzle may lose more energy. As a result, more liquid may try to flow through the second pipe, which experiences less energy loss. In such a case, even if the valve of the first supply amount control device is fully open, the liquid may not be sufficiently supplied to the first pipe. In other words, there may be a shortage of liquid supplied to the first pipe. In this case, the first supply amount control device cannot control the flow rate. In other words, the liquid cannot flow through the first pipe at the set flow rate.
[0007] Furthermore, this problem can occur in cases other than when the second nozzle is located lower than the first nozzle. For example, when the first pipe is longer than the second pipe, the energy loss of the liquid flowing through the first pipe is greater. As a result, there is a risk that the liquid supplied to the first pipe will be insufficient, and the liquid will not flow through the first pipe at the set flow rate. Furthermore, there may be a shortage of liquid supplied to the first pipe if the first pipe has many bends or if the diameter of the first pipe is small.
[0008] Therefore, one of the objects of the present disclosure is to provide a chemical liquid supply device, a cleaning system, and a method for adjusting a control valve that can prevent a shortage of liquid supplied to the first main pipe (first pipe).
[0009] A chemical liquid supplying device according to the present disclosure is a chemical liquid supplying device comprising: a confluence, a first main pipe located downstream of the confluence, a secondary pipe located downstream of the confluence and parallel to the first main pipe, a first supply amount control device attached to the first main pipe, a control valve attached to the secondary pipe, and a control device, wherein the first supply amount control device is configured to feedback control the flow rate of the liquid flowing through the first main pipe to a set flow rate based on the flow rate of the liquid in the first main pipe, and the control device is configured to execute the following steps: a first step of causing the first supply amount control device to start control so that the flow rate of the liquid flowing through the first main pipe becomes a first set flow rate; a second step of controlling the control valve so that throttling adjustment of the control valve starts when the flow rate of the liquid flowing through the first main pipe is less than the first set flow rate after the first step; and a third step of controlling the control valve so that throttling adjustment of the control valve stops when the flow rate of the liquid flowing through the first main pipe becomes equal to or greater than the first set flow rate after the second step.
[0010] The cleaning system according to the present disclosure is a cleaning system comprising the above-described chemical liquid supply device and a substrate cleaning device for cleaning a substrate, the substrate cleaning device having a first nozzle through which liquid is supplied from the first main pipe and a second nozzle through which liquid is supplied from the secondary pipe.
[0011] A method for adjusting a control valve according to the present disclosure is a method for adjusting a control valve using the above-described chemical liquid supply device, in which the control device executes the first step, the second step, and the third step.
[0012] 1A is a fluid circuit diagram of a cleaning system according to an embodiment of the present disclosure; FIG. 1B is a fluid circuit diagram showing the substrate cleaning apparatus of FIG. 1A in detail; FIG. 1C is a schematic front view of the chemical liquid supply apparatus shown in FIG. 1A; FIG. 1D is a fluid circuit diagram showing the configuration of a flow rate control device; FIG. 1E is a fluid circuit diagram showing the configuration of a control valve; FIG. 1F is a flow chart showing one procedure of a control process of the control device of FIG. 1A; FIG. 1G is a fluid circuit diagram of a cleaning system according to another embodiment of the present disclosure; FIG. 1H is a flow chart showing one procedure of a control process of the control device of FIG. 6;
[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant description will be omitted.
[0014] <Cleaning System 500> <Configuration> Fig. 1A is a fluid circuit diagram of a cleaning system 500 according to an embodiment of the present disclosure. Fig. 1B is a fluid circuit diagram showing in detail the substrate cleaning apparatus 400 of Fig. 1A. Referring to Fig. 1A, the cleaning system 500 includes a chemical liquid supplying apparatus 100, a substrate cleaning apparatus 400, and a control device 320. The chemical liquid supplying apparatus 100 is an apparatus for supplying water and a supply liquid to the substrate cleaning apparatus 400. The substrate cleaning apparatus 400 is an apparatus for cleaning a substrate W using the water and supply liquid supplied from the chemical liquid supplying apparatus 100. The configurations of the chemical liquid supplying apparatus 100 and the substrate cleaning apparatus 400 will be described below.
[0015] 1A, the substrate cleaning apparatus 400 includes a water cleaning unit 410 and a cleaning module 418. The water cleaning unit 410 is configured to clean the substrate W polished by the polishing apparatus with water (DIW). As an example, the water cleaning unit 410 is configured to ultrasonically clean the substrate W.
[0016] 1B , the cleaning module 418 includes a first nozzle 421, a second nozzle 422, a standby unit 423, and a cleaning tank 420. The first nozzle 421 is configured to supply the supply liquid supplied from the chemical liquid supply device 100 to a first surface of the substrate W. The second nozzle 422 is configured to supply the supply liquid supplied from the chemical liquid supply device 100 to a second surface of the substrate W. This allows the substrate cleaning apparatus 400 to simultaneously clean both surfaces of the substrate W with the supply liquid. Note that, as an example, the first surface of the substrate W is a pattern surface on which wiring is formed, and the second surface is a surface opposite to the first surface. Furthermore, when cleaning the substrate W, the substrate W may be placed so that the first surface faces in any direction, such as vertically or horizontally, depending on the specifications. Furthermore, as an example, the first nozzle 421 is positioned vertically higher than the second nozzle 422.
[0017] The standby section 423 is configured to supply the supply liquid to the waiting substrate W before it is cleaned by the first nozzle 421 and the second nozzle 422. This prevents oxidation of the waiting substrate W. The standby section 423 may have a nozzle for supplying the supply liquid to the substrate W or the wafer cleaning sponge. The cleaning tank 420 is configured to accommodate the first nozzle 421, the second nozzle 422, and the standby section 423.
[0018] Next, reference will be made to Figure 2. As shown in Figure 2, the chemical solution supplying device 100, for example, includes a frame 105, a dilution water CLC box 110, a first chemical solution CLC box 120, a second chemical solution CLC box 140, and a plurality of utility boxes 170 and 180. The dilution water CLC box 110, the first chemical solution CLC box 120, the second chemical solution CLC box 140, and the plurality of utility boxes 170 and 180 are housed in the frame 105.
[0019] 1A again, the chemical solution supplying apparatus 100 includes a water pipe 201, a valve 191, a regulator 192, and a pressure gauge 193. The water pipe 201 is connected to a water supply source 902 and the water cleaning unit 410. The water supply source 902 has a function of supplying water, such as DIW, for example. This allows the chemical solution supplying apparatus 100 to supply water to the water cleaning unit 410. The valve 191 is provided upstream of a connection port 221 on the water pipe 201. The valve 191 is controlled by the control device 320 and controls the flow rate of water flowing through the water pipe 201. The regulator 192 has a function of adjusting the supply pressure of water supplied to the water cleaning unit 410. The pressure gauge 193 has a function of measuring the pressure of water passing through the water pipe 201.
[0020] Chemical solution supply device 100 also includes, for example, supply module 108. Supply module 108 includes junction M, first chemical solution pipe 240, and second chemical solution pipe 242. First chemical solution pipe 240 connects first chemical solution supply source 903 and junction M. As a result, first chemical solution supply source 903 and junction M are fluidically connected. Also, first chemical solution supply source 903 has, for example, a function of supplying the first chemical solution. As a result, the first chemical solution is supplied from first chemical solution supply source 903 to junction M. On the other hand, second chemical solution pipe 242 connects second chemical solution supply source 904 and junction M. As a result, second chemical solution supply source 904 and junction M are fluidically connected. Also, second chemical solution supply source 904 has, for example, a function of supplying the second chemical solution. As a result, the second chemical liquid is supplied from the second chemical liquid supply source 904 to the confluence M.
[0021] The supply module 108 also includes dilution water pipes 202 and 203. The dilution water pipe 202 extends from a connection port 221 provided on the water pipe 201 to a connection port 225. The dilution water pipe 203 extends from a connection port 222 provided on the dilution water pipe 202 to a junction M. This places the water supply source 902 in fluid communication with the junction M. As a result, water is supplied to the junction M from the water supply source 902.
[0022] The supply module 108 also includes a flow rate control device (an example of a dilution water control device, a CLC: Closed Loop Controller) 111 and a valve 112. The valve 112 is attached to the dilution water pipe 203. The valve 112 is controlled and opened and closed by the control device 320. The flow rate control device 111 is also attached to the dilution water pipe 203. The flow rate control device 111 is configured to perform feedback control based on the flow rate of water in the dilution water pipe 203 so that the flow rate of water flowing through the dilution water pipe 203 becomes a set flow rate. In other words, the flow rate control device 111 is configured to perform feedback control so that the flow rate of water supplied from the water supply source 902 to the junction M becomes a set flow rate.
[0023] More specifically, the flow control device 111 has the configuration shown in FIG. 3 as an example. FIG. 3 is a fluid circuit diagram showing the configuration of the flow control device 111 shown in FIG. 1A. The flow control device 111 includes a flow meter 1112, a valve assembly 1111, and a control unit 1113. The flow meter 1112 is, for example, a differential pressure flow meter (orifice flow meter). In another embodiment according to the present disclosure, the flow meter 1112 may be another type of flow meter, such as an ultrasonic flow meter. The valve assembly 1111 is, for example, a motor valve and includes a valve 1111a and a drive source 1111b. The opening of the valve 1111a is controlled by the power of the drive source 1111b including a motor. In another embodiment according to the present disclosure, the valve assembly 1111 may be any valve whose opening is adjustable, and may be another type of variable flow valve (for example, an electromagnetic valve driven by a solenoid or the like). The control unit 1113 is configured to receive a fluid flow rate set value iT from the control device 320 (see FIG. 1A ), receive a fluid flow rate detection value io from the flow meter 1112, and perform feedback control of the valve assembly 1111 so that the fluid flow rate detection value io coincides with the flow rate set value iT. The control unit 1113 also receives a valve position control value ivd from the valve assembly 1111, converts the valve position control value ivd to a valve position control value iva, and transmits the valve position control value iva to the control device 320. This allows the control device 320 to obtain position information for the valve assembly 1111 of the flow control device 111. In this disclosure, the valve position of the flow control device refers to the position of a valve included in the flow control device and may refer to the position of the valve 1111a. Other flow control devices 121, 141, 152, and 157 described below have the same configuration as the flow control device 111 described herein, for example.
[0024] 1A again, supply module 108 includes flow control device 121 (an example of a first chemical liquid control device) and valve 122 (see FIG. 1A ). Valve 122 is attached to first chemical liquid pipe 240. Valve 122 is controlled and opened / closed by control device 320. Flow control device 121 is also attached to first chemical liquid pipe 240. Flow control device 121 is configured to feedback-control the flow rate of the first chemical liquid flowing through first chemical liquid pipe 240 based on the flow rate of the first chemical liquid in first chemical liquid pipe 240 so that the flow rate becomes a set flow rate. In other words, flow control device 121 is configured to feedback-control the flow rate of the first chemical liquid supplied from first chemical liquid supply source 903 to junction M so that the flow rate becomes a set flow rate.
[0025] Supply module 108 also includes flow rate control device 141 (an example of a second chemical liquid control device) and valve 142 (see FIG. 1A ). Valve 142 is attached to second chemical liquid piping 242. Valve 142 is controlled and opened / closed by control device 320. Flow rate control device 141 is also attached to second chemical liquid piping 242. Flow rate control device 141 is configured to perform feedback control, based on the flow rate of the second chemical liquid in second chemical liquid piping 242, to adjust the flow rate of the second chemical liquid flowing through second chemical liquid piping 242 to a set flow rate. In other words, flow rate control device 141 is configured to perform feedback control to adjust the flow rate of the second chemical liquid supplied from second chemical liquid supply source 904 to junction M to a set flow rate.
[0026] As described above, the supply module 108 is configured to supply the first chemical liquid, the second chemical liquid, and water to the junction M. The supply module 108 has a function of preparing a supply liquid (an example of a liquid) at the junction M as needed from the first chemical liquid, the second chemical liquid, and the water supplied to the junction M. The supply liquid includes the first chemical liquid, the second chemical liquid, a first cleaning chemical liquid obtained by mixing the first chemical liquid and water, a second cleaning chemical liquid obtained by mixing the second chemical liquid and water, and a third cleaning chemical liquid obtained by mixing the first chemical liquid, the second chemical liquid, and water. The supply module 108 also includes a mixer 123, for example. The mixer 123 is, for example, an in-line mixer, and is attached to the upstream pipe 261 of the cleaning chemical supply pipe 260 downstream of the junction M. The mixer 123 has a function of mixing the supply liquids prepared at the junction M so that the supply liquid is uniform.
[0027] Furthermore, supply module 108 includes manual valve 171 and valve 172. Manual valve 171 and valve 172 are provided on first chemical liquid pipe 240 and housed in utility box 170. Valve 172 is controlled to open and close by air control device 300, which will be described later.
[0028] The supply module 108 also includes a flushing water pipe 207, a valve 174, and a check valve 175. The flushing water pipe 207 connects a connection port 224 provided on the dilution water pipe 202 with a connection port 230 provided on the first chemical liquid pipe 240. The connection port 230 is located on the first chemical liquid pipe 240 between the flow control device 121 and the valve 172. The valve 174 and the check valve 175 are provided on the flushing water pipe 207 and housed in the utility box 170. The valve 174 is configured to be opened and closed under the control of the control device 320. The check valve 175 is configured to block the flow from the connection port 230 to the connection port 224. When the valve 174 is opened, the flushing water flows from the connection port 230 into the first chemical liquid pipe 240. This allows chemical liquid supplying apparatus 100 to replace the first chemical liquid in first chemical liquid pipe 240 with water, thereby flushing (pipe cleaning) the inside of first chemical liquid pipe 240.
[0029] The supply module 108 also includes a manual valve 181 and a valve 182. The manual valve 181 and the valve 182 are provided on the second chemical liquid pipe 242 and housed in the utility box 180. The valve 182 is controlled to be opened and closed by an air control device 300, which will be described later.
[0030] The supply module 108 also includes a flushing water pipe 208, a valve 184, and a check valve 185. The flushing water pipe 208 connects a connection port 225 provided on the dilution water pipe 202 with a connection port 231 provided on the second chemical liquid pipe 242. The connection port 231 is located on the second chemical liquid pipe 242 between the flow control device 141 and the valve 182. The valve 184 and the check valve 185 are also provided on the flushing water pipe 208 and housed in the utility box 180. The valve 184 is configured to be opened and closed under the control of the control device 320. The check valve 185 is configured to block the flow from the connection port 231 to the connection port 225. When the valve 184 is opened, the flushing water flows from the connection port 231 into the second chemical liquid pipe 242. This allows the chemical liquid supplying device 100 to replace the second chemical liquid in the second chemical liquid pipe 242 with water, thereby flushing (pipe cleaning) the inside of the second chemical liquid pipe 242.
[0031] The supply module 108 also includes a cleaning chemical liquid supply pipe 260. The cleaning chemical liquid supply pipe 260 is located downstream of the junction M and can supply the supply liquid to the substrate cleaning apparatus 400. More specifically, the cleaning chemical liquid supply pipe 260 includes an upstream pipe 261, a first pipe (an example of a first main pipe) 262, a second pipe (an example of a secondary pipe) 263, and a third pipe 264. The upstream pipe 261 forms a flow path from the junction M to a branch point 271. The first pipe 262 is located downstream of the junction M and forms a flow path from the branch point 271 to a first nozzle 421 (see FIG. 1B ). The second pipe 263 is located downstream of the junction M and is parallel to the first pipe 262. Furthermore, the second pipe 263 forms a flow path from the branch point 271 to a second nozzle 422 (see FIG. 1B ). The third pipe 264 is located downstream of the junction M and is parallel to the first pipe 262 and the second pipe 263. Furthermore, the third pipe 264 forms a flow path from the connection port 272 on the upstream pipe 261 to the standby section 423 (see FIG. 1B ). In other words, the cleaning chemical liquid supply pipe 260 is configured to connect the junction M and the standby section 423 via the third pipe 264. This allows the supply liquid to flow from the junction M to the first nozzle 421, the second nozzle 422, and the standby section 423. That is, the chemical liquid supply device 100 can supply the supply liquid to the first nozzle 421, the second nozzle 422, and the standby section 423.
[0032] The supply module 108 also includes a flow rate control device (an example of a first supply amount control device) 152. The flow rate control device 152 is attached to the first pipe 262. The flow rate control device 152 is configured to perform feedback control based on the flow rate of the supply liquid in the first pipe 262 so that the flow rate of the supply liquid flowing through the first pipe 262 becomes a set flow rate. This allows the chemical solution supply device 100 to supply the supply liquid to the first nozzle 421 at a set flow rate.
[0033] The supply module 108 also includes valves 151 and 155. Valve 151 is provided on the first pipe 262 between the flow control device 152 and valve 153. Valve 155 is provided on the third pipe 264. Valves 151 and 155 are configured to be controlled by the control device 320 and opened and closed. More specifically, valves 151 and 155 are, for example, on / off valves. In the present disclosure, an on / off valve refers to a valve that can only be configured in two stages: a fully open configuration and a fully closed configuration. In another embodiment of the present disclosure, valves 151 and 155 may be continuous control valves that can continuously change the valve opening, rather than on / off valves.
[0034] The supply module 108 also includes a control valve 160. The control valve 160 is provided downstream of the flow meter 154 on the second pipe 263. The control valve 160 is configured to be controlled by the control device 320 to open and close. More specifically, the control valve 160 has the configuration shown in FIG. 4, for example. FIG. 4 is a fluid circuit diagram showing the configuration of the control valve 160. The control valve 160 includes a valve assembly 1121 and a control unit 1123. The valve assembly 1121 is, for example, a motor valve and includes a valve 1121a and a drive source 1121b. The valve 1121a is, for example, a needle valve. The opening degree of the valve 1121a is configured to be controlled by the power of the drive source 1121b, which includes a motor. In another embodiment of the present disclosure, the valve assembly 1121 may be any type of variable flow valve (e.g., an electromagnetic valve driven by a solenoid or the like) as long as the valve opening is adjustable. The control unit 1123 is configured to receive a valve opening set value ivt from the control device 320 (see FIG. 1A ) and control the valve assembly 1121 based on the valve opening set value ivt. The control unit 1123 also receives a valve opening control value ivd from the valve assembly 1121, converts the valve opening control value ivd to a valve opening control value iva, and transmits the valve opening control value iva to the control device 320. This allows the control device 320 to obtain valve opening information for the control valve 160. In this disclosure, the valve opening of the control valve refers to the valve opening of the control valve, and may refer to the opening of the valve 1121a. The control valve 162, which will be described later, has the same configuration as the control valve 160 described herein, as an example.
[0035] The supply module 108 also includes a valve 153. The valve 153 is provided downstream of the valve 151 on the first pipe 262. The valve 153 is, for example, a suck-back valve. The valve 153 is configured to perform a suck-back operation of sucking back the liquid in the first pipe 262 downstream of the valve 153 when the valve 151 is closed.
[0036] The supply module 108 also includes flow meters 154 and 156. The flow meter 154 is provided on the second pipe 263 and measures the flow rate of the supply liquid flowing through the second pipe 263. The flow meter 156 is provided on the third pipe 264 and measures the flow rate of the supply liquid flowing through the third pipe 264.
[0037] The supply module 108 also includes a supply box 150. The supply box 150 houses a flow controller 152, valves 151, 153, 155, a control valve 160, and flow meters 154, 156.
[0038] Furthermore, since the supply module 108 has the above-described configuration, the flow rate of the liquid flowing through the upstream pipe 261 is equal to the sum of the flow rate of the liquid flowing through the first pipe 262, the flow rate of the liquid flowing through the second pipe 263, and the flow rate of the liquid flowing through the third pipe 264. In other words, when the valve 155 is completely closed, the flow rate of the liquid flowing through the upstream pipe 261 is equal to the sum of the flow rate of the liquid flowing through the first pipe 262 and the flow rate of the liquid flowing through the second pipe 263. Furthermore, when the valve 151 and the control valve 160 are completely closed, the flow rate of the liquid flowing through the upstream pipe 261 is equal to the flow rate of the liquid flowing through the third pipe 264.
[0039] Furthermore, chemical liquid supply device 100 includes an IN-side pressure gauge 173, an IN-side pressure gauge 183, an IN-side pressure gauge 195, and an OUT-side pressure gauge 124. IN-side pressure gauge 173 is provided between first chemical liquid supply source 903 and flow control device 121. This allows IN-side pressure gauge 173 to measure the pressure upstream of flow control device 121. IN-side pressure gauge 183 is provided between second chemical liquid supply source 904 and flow control device 141. This allows IN-side pressure gauge 183 to measure the pressure upstream of flow control device 141. IN-side pressure gauge 195 is provided at a position between water supply source 902 and flow control device 111. This allows IN-side pressure gauge 195 to measure the pressure upstream of flow control device 111. The outlet pressure gauge 124 is provided at a position between the flow rate control device 111 and the flow rate control device 152, at a position between the flow rate control device 121 and the flow rate control device 152, and at a position between the flow rate control device 141 and the flow rate control device 152. This allows the outlet pressure gauge 124 to measure the pressure inside the upstream pipe 261 of the cleaning chemical liquid supply pipe 260.
[0040] In the chemical supply device 100, the first chemical CLC box 120 houses, for example, a flow control device 121, a valve 122, a mixer 123, and an outlet pressure gauge 124. The second chemical CLC box 140 houses, for example, a flow control device 141 and a valve 142. The dilution water CLC box 110 houses, for example, a flow control device 111 and a valve 112.
[0041] The chemical solution supplying device 100 also includes a regulator 194. The regulator 194 is provided downstream of the connection port 221 on the dilution water piping 202 and upstream of the in-side pressure gauge 195. The regulator 192 has a function of adjusting the supply pressure of the water supplied to the flow rate control device 111.
[0042] The chemical solution supply device 100 also includes an air control device 300 and air pipes 301 and 302. The air control device 300 is connected to an air supply source 901. The air supply source 901 has a function of supplying gas to the air control device 300. The air pipe 301 connects the air control device 300 to a valve 172. The air pipe 302 connects the air control device 300 to a valve 182. The air control device 300 controls the valves 172 and 182 by sending air to the valves 172 and 182 via the air pipes 301 and 302.
[0043] 1A , the chemical liquid supply apparatus 100 includes only one supply module 108. However, the chemical liquid supply apparatus 100 is not limited to this configuration. In other embodiments according to the present disclosure, the chemical liquid supply apparatus 100 may include two or more supply modules 108 as needed. Similarly, the substrate cleaning apparatus 400 may include two or more cleaning modules 418 as needed.
[0044] <Operation> Figure 5 is a flow chart showing one procedure of the control process of the control device 320. The operational flow when the control device 320 performs the control process shown in Figure 5 will be described below. Note that when the control device 320 operates according to the operational flow of Figure 5, the valve 155 is, as an example, completely closed. Therefore, liquid does not flow through the third pipe 264. However, in another embodiment according to the present disclosure, the valve 155 does not have to be completely closed.
[0045] When the control device 320 starts operation, in step S102, the control device 320 receives information on the set flow rates of the flow rate control devices 111, 121, 141, and 152 from the user. Next, in step S104, the control device 320 checks whether the received information on the set flow rates of the flow rate control devices 111, 121, 141, and 152 matches the stored information. If they match, the control device 320 proceeds to step S124. The operation flow from step S124 onwards will be described later. On the other hand, if they do not match, the control device 320 proceeds to step S106.
[0046] In step S106, the control device 320 controls the control valve 160 so that the valve opening of the control valve 160 is fully open. Next, in step S108 (an example of a first step), the control device 320 sends information on each set flow rate to each of the flow control devices 111, 121, 141, and 152. As a result, the control device 320 causes each of the flow control devices 111, 121, 141, and 152 to begin controlling the flow rate of the pipe to which each is attached to the set flow rate. Next, in step S110, the control device 320 determines whether the flow rate of the liquid flowing through the first pipe 262 to which the flow control device 152 is attached has reached the set flow rate (an example of a first set flow rate). If the flow rate of the liquid flowing through the first pipe 262 has not reached the set flow rate (if it is less than the set flow rate), the control device 320 proceeds to step S112. On the other hand, if not, the control device 320 proceeds to step S122.
[0047] In step S122, the control device 320 stores the valve opening information of each of the flow rate control devices 111, 121, 141, and 152 and the control valve 160 in association with the information on the set flow rates of each of the flow rate control devices 111, 121, 141, and 152. After step S122, the control device 320 ends the operation flow.
[0048] On the other hand, in step S112 (an example of a fourth step), the control device 320 controls the flow control device 152 so that the valve opening of the flow control device 152 is a first opening. Here, the first opening is, for example, a valve opening that is smaller than the opening when the valve is fully open. For example, the first opening may be 95% or less, 90% or less, 80% or less, 70% or less, or 60% or less of the opening when the valve of the flow control device 152 is fully open. Furthermore, the first opening is not an opening at which the first pipe 262 is completely closed. In other words, when the valve opening of the flow control device 152 is the first opening, liquid can flow through the first pipe 262.
[0049] Next, in step S114 (an example of a second process), the control device 320 controls the control valve 160 to start throttling the control valve 160. As a result, the valve opening of the control valve 160 gradually begins to close, and the flow rate of the liquid flowing through the second pipe 263 to which the control valve 160 is attached gradually decreases. Furthermore, in accordance with this, the flow rate of the liquid flowing through the first pipe 262 gradually increases.
[0050] Next, in step S116 (an example of a third process), the control device 320 controls the control valve 160 so that the throttling adjustment of the control valve 160 stops when the flow rate of the liquid flowing through the first pipe 262 becomes equal to or greater than the set flow rate. In other words, when the control device 320 executes the process of step S116, the flow rate of the liquid flowing through the first pipe 262 is equal to or greater than the set flow rate. That is, there is no shortage of liquid supplied to the first pipe 262. Therefore, the chemical solution supplying device 100 can prevent a shortage of liquid supplied to the first pipe 262. Note that in the present disclosure, a shortage of liquid supplied to a pipe means that the flow rate of the liquid flowing through the pipe is less than the set flow rate of a flow control device attached to the pipe, even if the valve of the flow control device is fully open.
[0051] Next, in step S118, the control device 320 causes each of the flow rate control devices 111, 121, 141, and 152 to start control so as to maintain each set flow rate.
[0052] Next, in step S120 (an example of a fifth process), when the flow rates in the pipes to which the flow control devices 111, 121, 141, and 152 are attached have stabilized, the control device 320 stores the valve opening information for the flow control devices 111, 121, 141, and 152 and the control valve 160 in association with the information on the set flow rates for the flow control devices 111, 121, 141, and 152. The control device 320 ends the operational flow after step S120.
[0053] Furthermore, as described above, if the received information on the set flow rates of the flow control devices 111, 121, 141, and 152 in step S104 matches the stored information, the control device 320 proceeds to step S124. Then, in step S124 (an example of a sixth step), the control device 320 adjusts the valve openings of the flow control devices 111, 121, 141, and 152 and the control valve 160 to the stored openings. Next, in step S126, the control device 320 starts control of the flow control devices 111, 121, 141, and 152 to maintain the set flow rates. The control device 320 ends the operation flow after step S126. The above is the operation flow when the control device 320 performs control processing.
[0054] As described above, in the chemical liquid supplying apparatus 100, the control device 320 controls the flow rate control device 152 so that the valve opening degree of the flow rate control device 152 is the first opening degree (step S112). This allows the chemical liquid supplying apparatus 100 to prevent the flow rate control device 152 from being unable to control the flow rate when the flow rate of the liquid supplied from the junction M to the cleaning chemical liquid supply pipe 260 decreases. The reason for this will be explained below.
[0055] First, consider a case where the control device 320 does not execute step S112. In this case, the control device 320 executes the processes of steps S114 and S116 while the valve of the flow control device 152 is fully open. Therefore, when the shortage of liquid supplied to the first pipe 262 is resolved, the valve of the flow control device 152 is fully open. In this state, if the flow rate of the liquid supplied from the junction M to the cleaning chemical liquid supply pipe 260 becomes turbulent and decreases, the amount of liquid supplied to the first pipe 262 also decreases. However, because the valve of the flow control device 152 is fully open, the flow control device 152 cannot further increase the valve opening. Therefore, the flow control device 152 cannot increase the flow rate and cannot control the flow rate.
[0056] In contrast, when the control device 320 executes step S112, the valve opening of the flow control device 152 is in a more closed state than when it was fully open when the shortage of liquid supplied to the first pipe 262 is resolved. Therefore, when the amount of liquid supplied to the first pipe 262 decreases, the flow control device 152 can increase the valve opening and control the flow rate of the first pipe 262. In other words, because the control device 320 executes step S112, the chemical solution supply device 100 can prevent the flow control device 152 from being unable to control the flow rate.
[0057] Furthermore, if the flow from step S106 to step S120 were executed every time, the operating time of the chemical solution supplying device 100 would be excessively extended. In contrast, the operating flow of the control device 320 includes steps S104, S120, and S124. As a result, if the information on the set flow rates of the flow control devices 111, 121, 141, and 152 received by the control device 320 in step S102 matches the stored information, the control device 320 can determine the valve openings of the flow control devices 111, 121, 141, and 152 and the control valve 160 without executing the flow from step S106 to step S120. In other words, the operating time of the chemical solution supplying device 100 can be shortened.
[0058] <Cleaning System 502> <Configuration> Next, reference will be made to FIG. 6 . FIG. 6 is a fluid circuit diagram of a cleaning system 502 according to another embodiment, which is different from the cleaning system 500. As shown in FIG. 6 , the cleaning system 502 includes a chemical liquid supplying apparatus 102, a substrate cleaning apparatus 400, and a control device 322. That is, the substrate cleaning apparatus 400 included in the cleaning system 502 is the same as the substrate cleaning apparatus 400 included in the cleaning system 500 described above. Therefore, a description of the substrate cleaning apparatus 400 will be omitted. Furthermore, the chemical liquid supplying apparatus 102 has a portion of the same configuration as the chemical liquid supplying apparatus 100. The following description of the chemical liquid supplying apparatus 102 will focus on the parts that are different from the chemical liquid supplying apparatus 100, and the same components will be denoted by the same reference numerals in the figure and will not be described again.
[0059] 6 , the chemical liquid supply apparatus 102 includes a supply module 109. The supply module 109 includes a cleaning chemical liquid supply pipe 260. The cleaning chemical liquid supply pipe 260 is located downstream of a junction M and can supply the supply liquid to the substrate cleaning apparatus 400. More specifically, the cleaning chemical liquid supply pipe 260 includes an upstream pipe 261, a first pipe (an example of a first main pipe) 262, a second pipe (an example of a second main pipe) 263, and a third pipe (an example of a secondary pipe) 264. The upstream pipe 261 forms a flow path from the junction M to a branch point 271. The first pipe 262 is located downstream of the junction M and forms a flow path from the branch point 271 to a first nozzle 421 (see FIG. 1B ). The second pipe 263 is located downstream of the junction M and is parallel to the first pipe 262. Furthermore, the second pipe 263 forms a flow path from the branch point 271 to the second nozzle 422 (see FIG. 1B ). The third pipe 264 is located downstream of the junction M and is parallel to the first pipe 262 and the second pipe 263. Furthermore, the third pipe 264 forms a flow path from the connection port 272 on the upstream pipe 261 to the standby section 423 (see FIG. 1B ). In other words, the cleaning chemical liquid supply pipe 260 is configured to connect the junction M and the standby section 423 via the third pipe 264. This allows the supply liquid to flow from the junction M to the first nozzle 421, the second nozzle 422, and the standby section 423. That is, the chemical liquid supply device 100 can supply the supply liquid to the first nozzle 421, the second nozzle 422, and the standby section 423.
[0060] The supply module 109 also includes a flow rate control device 152 (an example of a first supply rate control device) and a flow rate control device 157 (an example of a second supply rate control device). The flow rate control device 152 is attached to the first pipe 262. The flow rate control device 152 is configured to perform feedback control of the flow rate of the supply liquid flowing through the first pipe 262 based on the flow rate of the supply liquid in the first pipe 262 so that the flow rate becomes a set flow rate. This allows the chemical solution supplying device 100 to supply the supply liquid to the first nozzle 421 at a set flow rate. The flow rate control device 157 is attached to the second pipe 263. The flow rate control device 157 is configured to perform feedback control of the flow rate of the supply liquid flowing through the second pipe 263 based on the flow rate of the supply liquid in the second pipe 263 so that the flow rate becomes a set flow rate. This allows the chemical solution supplying device 102 to supply the supply liquid to the second nozzle 422 at a set flow rate.
[0061] The supply module 109 also includes valves 151 and 158 and a flow meter 156. The valve 151 is provided on the first pipe 262 between the flow control device 152 and the valve 153. The valve 158 is provided on the second pipe 263 downstream of the flow control device 157. The valves 151 and 158 are configured to be opened and closed under the control of the control device 320. More specifically, the valves 151 and 158 are, for example, on / off valves. In another embodiment according to the present disclosure, the valves 151 and 158 may be continuous control valves capable of continuously changing the valve opening degree instead of on / off valves. The flow meter 156 is provided on the third pipe 264 and measures the flow rate of the first cleaning chemical liquid flowing through the third pipe 264.
[0062] The supply module 109 also includes a valve 153. The valve 153 is provided downstream of the valve 151 on the first pipe 262. The valve 153 is, for example, a suck-back valve. The valve 153 is configured to perform a suck-back operation of sucking back the liquid in the first pipe 262 downstream of the valve 153 when the valve 151 is closed.
[0063] The supply module 109 also includes a control valve 162. The control valve 162 is provided upstream of the flow meter 156 on the third pipe 264. The control valve 162 is configured to be opened and closed under the control of the control device 320. The control valve 162 has the same configuration as the control valve 160 described above, for example.
[0064] <Operation> Fig. 7 is a flowchart showing one procedure of the control processing of the control device 322. Below, the operation flow when the control device 322 performs the control processing shown in Fig. 7 will be described.
[0065] When the control device 322 starts operation, in step S202, the control device 322 receives information on the set flow rates of the flow control devices 111, 121, 141, 152, and 157 from the user. Next, in step S204, the control device 322 checks whether the received information on the set flow rates of the flow control devices 111, 121, 141, 152, and 157 matches the stored information. If they match, the control device 322 proceeds to step S224. The operation flow from step S224 onwards will be described later. On the other hand, if they do not match, the control device 322 proceeds to step S206.
[0066] In step S206, the control device 322 controls the control valve 162 so that the valve opening of the control valve 162 is fully open. Next, in step S208 (an example of a first step), the control device 322 sends information on each set flow rate to each of the flow control devices 111, 121, 141, 152, and 157. As a result, the control device 322 causes each of the flow control devices 111, 121, 141, 152, and 157 to start controlling the flow rate of the pipe to which each is attached to reach the set flow rate. Next, in step S210, the control device 322 determines whether the flow rate of the liquid flowing through the first pipe 262 to which the flow control device 152 is attached has reached the set flow rate (an example of a first set flow rate), and whether the flow rate of the liquid flowing through the second pipe 263 to which the flow control device 157 is attached has reached the set flow rate (an example of a second set flow rate). Then, in at least one of the cases where the flow rate of the liquid flowing through the first pipe 262 does not reach the set flow rate (is less than the set flow rate) and where the flow rate of the liquid flowing through the second pipe 263 does not reach the set flow rate (is less than the set flow rate), the control device 322 proceeds to step S212. On the other hand, if this is not the case, the control device 322 proceeds to step S222.
[0067] In step S222, the control device 322 stores the valve opening information of each of the flow rate control devices 111, 121, 141, 152, and 157 and the control valve 162 in association with the information on the set flow rates of each of the flow rate control devices 111, 121, 141, 152, and 157. After step S222, the control device 322 ends the operation flow.
[0068] On the other hand, in step S212 (an example of a fourth step), when the flow rate of the liquid flowing through the first pipe 262 is not the set flow rate (when the flow rate is less than the set flow rate), the control device 322 controls the flow control device 152 so that the valve opening of the flow control device 152 is set to a first opening. Furthermore, in step S212, when the flow rate of the liquid flowing through the second pipe 263 is not the set flow rate (when the flow rate is less than the set flow rate), the control device 322 controls the flow control device 157 so that the valve opening of the flow control device 157 is set to a second opening. Here, the first and second openings are, for example, valve openings that are smaller than the opening when the valve of the flow control device 152 is fully open. For example, the first opening may be 95% or less, 90% or less, 80% or less, 70% or less, or 60% or less of the opening when the valve of the flow control device 152 is fully open. The second degree of opening may be 95% or less, 90% or less, 80% or less, 70% or less, or 60% or less of the degree of opening when the valve of the flow control device 157 is fully open. The first degree of opening and the second degree of opening may be the same or different. The first degree of opening is not a degree of opening at which the first pipe 262 is completely closed. In other words, when the valve of the flow control device 152 is at the first degree of opening, liquid can flow through the first pipe 262. On the other hand, the second degree of opening is not a degree of opening at which the second pipe 263 is completely closed. In other words, when the valve of the flow control device 157 is at the second degree of opening, liquid can flow through the second pipe 263.
[0069] Next, in step S214 (an example of a second process), the control device 322 controls the control valve 162 to start throttling the control valve 162. As a result, the valve opening of the control valve 162 gradually begins to close, and the flow rate of the liquid flowing through the third pipe 264 to which the control valve 162 is attached gradually decreases. Furthermore, in accordance with this, the flow rate of the liquid flowing through the first pipe 262 and the second pipe 263 gradually increases.
[0070] Next, in step S216 (an example of a third process), the control device 322 controls the control valve 162 so that the throttling adjustment of the control valve 162 stops when the flow rate of the liquid flowing through the first pipe 262 becomes equal to or greater than the set flow rate and when the flow rate of the liquid flowing through the second pipe 263 becomes equal to or greater than the set flow rate. In other words, when the control device 322 executes the processing of step S216, the flow rate of the liquid flowing through the first pipe 262 becomes equal to or greater than the set flow rate, and the flow rate of the liquid flowing through the second pipe 263 becomes equal to or greater than the set flow rate. In other words, there is no shortage of the liquid supplied to the first pipe 262 or the second pipe 263. Therefore, the chemical liquid supply device 102 can prevent a shortage of the liquid supplied to the first pipe 262. Furthermore, the chemical liquid supply device 102 can prevent a shortage of the liquid supplied to the second pipe 263.
[0071] Next, in step S218, the control device 322 causes each of the flow rate control devices 111, 121, 141, 152, and 157 to start control so as to maintain each set flow rate.
[0072] Next, in step S220 (an example of a fifth process), when the flow rates in the pipes to which the flow control devices 111, 121, 141, 152, and 157 are attached have stabilized, the control device 322 stores the valve opening information for the flow control devices 111, 121, 141, 152, and 157 and the control valve 162 in association with the information on the set flow rates of the flow control devices 111, 121, 141, 152, and 157. The control device 322 ends the operational flow after step S220.
[0073] As described above, if the received information on the set flow rates of the flow control devices 111, 121, 141, 152, and 157 in step S204 matches the stored information, the control device 322 proceeds to step S224. Then, in step S224 (an example of a sixth step), the control device 322 adjusts the valve openings of the flow control devices 111, 121, 141, 152, and 157 and the control valve 162 to the stored openings. Next, in step S226, the control device 322 starts control of the flow control devices 111, 121, 141, 152, and 157 to maintain the set flow rates. The control device 322 ends the operation flow after step S226. The above is the operation flow when the control device 322 performs control processing.
[0074] As described above, in the chemical liquid supplying apparatus 102, the control device 322 controls the flow control device 152 so that the valve opening of the flow control device 152 is the first opening (step S212), and controls the flow control device 157 so that the valve opening of the flow control device 157 is the second opening (step S212). This allows the chemical liquid supplying apparatus 102 to prevent the flow control devices 152 and 157 from being unable to control the flow rate when the flow rate of the liquid supplied from the junction M to the cleaning chemical liquid supplying pipe 260 decreases. The reason for this is the same as that of the chemical liquid supplying apparatus 100 described above, and therefore a description thereof will be omitted.
[0075] Furthermore, the operation flow of the control device 322 includes steps S204, S220, and S224. As a result, if the information on the set flow rates of the flow control devices 111, 121, 141, 152, and 157 received by the control device 322 in step S202 matches the stored information, the control device 322 can determine the valve openings of the flow control devices 111, 121, 141, 152, and 157 and the control valve 162 without executing the flow from step S206 to step S220. That is, the chemical solution supply device 102 can shorten its operation time.
[0076] [Supplementary Notes] Part or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.
[0077] (Appendix 1) A chemical liquid supplying device according to Supplementary Note 1 is a chemical liquid supplying device comprising: a junction, a first main pipe located downstream of the junction, a secondary pipe located downstream of the junction and parallel to the first main pipe, a first supply amount control device attached to the first main pipe, a control valve attached to the secondary pipe, and a control device, wherein the first supply amount control device is configured to feedback control the flow rate of the liquid flowing through the first main pipe to a set flow rate based on the flow rate of the liquid in the first main pipe, and the control device is configured to execute the following steps: a first step of causing the first supply amount control device to start control so that the flow rate of the liquid flowing through the first main pipe becomes a first set flow rate; a second step of controlling the control valve so that throttling adjustment of the control valve starts when the flow rate of the liquid flowing through the first main pipe is less than the first set flow rate after the first step; and a third step of controlling the control valve so that throttling adjustment of the control valve stops when the flow rate of the liquid flowing through the first main pipe becomes equal to or greater than the first set flow rate after the second step.
[0078] The chemical liquid supply device according to Supplementary Note 1 can prevent shortage of the liquid supplied to the first main pipe.
[0079] (Supplementary Note 2) The chemical liquid supply device according to Supplementary Note 2 is the chemical liquid supply device described in Supplementary Note 1, wherein the first supply amount control device has a valve for adjusting the flow rate in the first main pipe, and the control device is configured to execute a fourth step, after the first step and before the second step, of controlling the first supply amount control device so that the opening degree of the valve of the first supply amount control device becomes a first opening degree that is smaller than the opening degree when the valve is fully open.
[0080] The chemical liquid supplying device according to Supplementary Note 2 can prevent the occurrence of a problem such as the first supply amount control device being unable to control the flow rate.
[0081] (Supplementary Note 3) The chemical liquid supply device according to Supplementary Note 3 is the chemical liquid supply device according to Supplementary Note 1 or 2, and includes a dilution water piping for supplying water to the junction, a first chemical liquid piping for supplying a first chemical liquid to the junction, a second chemical liquid piping for supplying a second chemical liquid to the junction, a dilution water control device attached to the dilution water piping for feedback-controlling the flow rate of the water supplied to the junction to a set flow rate, a first chemical liquid control device attached to the first chemical liquid piping for feedback-controlling the flow rate of the first chemical liquid supplied to the junction to a set flow rate, and a second chemical liquid control device attached to the second chemical liquid piping for feedback-controlling the flow rate of the second chemical liquid supplied to the junction to a set flow rate.
[0082] (Supplementary Note 4) The chemical liquid supply device according to Supplementary Note 4 is the chemical liquid supply device according to Supplementary Note 3, wherein the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, and the first supply amount control device each have a valve, and the control device is configured to execute, after the third step, a fifth step of storing valve opening information of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, and the control valve in association with information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, and the first supply amount control device, and a sixth step of adjusting the valve openings of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, and the control valve to the stored openings when the received information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, and the first supply amount control device matches the stored information.
[0083] The chemical solution supplying device according to Supplementary Note 4 can shorten the operation time.
[0084] (Supplementary Note 5) The chemical liquid supplying device according to Supplementary Note 5 is the chemical liquid supplying device according to Supplementary Note 1, further comprising: a second main pipe located downstream of the junction and parallel to the first main pipe and the sub-pipe; the chemical liquid supplying device comprises a second supply amount control device, and the second supply amount control device is configured to perform feedback control, based on the flow rate of the liquid in the second main pipe, to control the flow rate of the liquid flowing through the second main pipe to a set flow rate; the first step further comprises a step of causing the second supply amount control device to start control so that the flow rate of the liquid flowing through the second main pipe becomes a second set flow rate; the second step further comprises a step of controlling the control valve so that throttling adjustment of the control valve starts when the flow rate of the liquid flowing through the second main pipe is less than the second set flow rate; and the third step further comprises a step of controlling the control valve so that throttling adjustment of the control valve stops when the flow rate of the liquid flowing through the first main pipe becomes equal to or greater than the first set flow rate and the flow rate of the liquid flowing through the second main pipe becomes equal to or greater than the second set flow rate.
[0085] The chemical liquid supplying device according to Supplementary Note 5 can prevent shortage of the liquid supplied to the first main pipe. Furthermore, this chemical liquid supplying device can prevent shortage of the liquid supplied to the second main pipe.
[0086] (Supplementary Note 6) The chemical liquid supplying device according to Supplementary Note 6 is the chemical liquid supplying device according to Supplementary Note 5, wherein the first supply amount control device has a valve for adjusting the flow rate in the first main pipe, the second supply amount control device has a valve for adjusting the flow rate in the second main pipe, and the control device is configured to execute a fourth step after the first step and before the second step, wherein in the fourth step, when the flow rate of liquid flowing through the first main pipe is less than the first set flow rate, the control device controls the first supply amount control device so that the opening of the valve of the first supply amount control device becomes a first opening that is smaller than the opening when the valve is fully open, and when the flow rate of liquid flowing through the second main pipe is less than the second set flow rate, the control device controls the second supply amount control device so that the opening of the valve of the second supply amount control device becomes a second opening that is smaller than the opening when the valve is fully open.
[0087] The chemical liquid supplying device according to Supplementary Note 6 can prevent the occurrence of a malfunction in which the first supply amount control device and the second supply amount control device cannot control the flow rate.
[0088] (Supplementary Note 7) The chemical solution supplying device according to Supplementary Note 7 is the chemical solution supplying device according to Supplementary Note 5 or 6, and includes a dilution water piping for supplying water to the junction, a first chemical solution piping for supplying a first chemical solution to the junction, a second chemical solution piping for supplying a second chemical solution to the junction, a dilution water control device attached to the dilution water piping for feedback-controlling the flow rate of the water supplied to the junction to a set flow rate, a first chemical solution control device attached to the first chemical solution piping for feedback-controlling the flow rate of the first chemical solution supplied to the junction to a set flow rate, and a second chemical solution control device attached to the second chemical solution piping for feedback-controlling the flow rate of the second chemical solution supplied to the junction to a set flow rate, Each of the devices has a valve, and the control device is configured to execute, after the third step, a fifth step of storing valve opening information of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, the second supply amount control device, and the control valve in association with information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, and the second supply amount control device, and a sixth step of adjusting the valve openings of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, the second supply amount control device, and the control valve to the stored openings when the received information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, and the second supply amount control device matches the stored information.
[0089] The chemical solution supplying device according to Supplementary Note 7 can shorten the operation time.
[0090] (Appendix 8) A cleaning system according to Appendix 8 is a cleaning system comprising: a chemical liquid supply device according to any one of Appendices 1 to 4; and a substrate cleaning device for cleaning a substrate, wherein the substrate cleaning device has a first nozzle through which liquid is supplied from the first main pipe and a second nozzle through which liquid is supplied from the sub-pipe.
[0091] The cleaning system according to Supplementary Note 8 can prevent shortage of liquid supplied to the first main pipe.
[0092] (Appendix 9) A cleaning system according to Appendix 9 is a cleaning system comprising: a chemical liquid supply device according to any one of Appendices 5 to 7; and a substrate cleaning device for cleaning a substrate, wherein the substrate cleaning device has a first nozzle through which liquid is supplied from the first main pipe, and a second nozzle through which liquid is supplied from the second main pipe.
[0093] The cleaning system according to Supplementary Note 9 can prevent a shortage of liquid supplied to the first main pipe. Furthermore, this cleaning system can prevent a shortage of liquid supplied to the second main pipe.
[0094] (Appendix 10) The method for adjusting a control valve according to Appendix 10 is a method for adjusting a control valve using a chemical liquid supply device according to any one of Appendices 1 to 7, wherein the control device executes the first step, the second step, and the third step.
[0095] The method for adjusting the control valve according to Supplementary Note 10 can prevent a shortage of liquid supplied to the first main pipe.
[0096] Although the embodiments of the present invention and various modifications thereof have been described above, it goes without saying that the above examples are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be appropriately modified and improved without departing from the spirit of the invention, and equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-mentioned problems or achieving at least part of the effects.
[0097] 100, 102: Chemical liquid supply device 108, 109: Supply module 111: Flow rate control device (dilution water control device) 121: Flow rate control device (first chemical liquid control device) 123: Mixer 141: Flow rate control device (second chemical liquid control device) 152: Flow rate control device (first supply amount control device) 157: Flow rate control device (second supply amount control device) 160, 162: Control valves 240: First chemical liquid piping 242: Second chemical liquid piping 260: Cleaning chemical liquid supply piping 261: Upstream piping 262: First piping (first main piping) 263: Second piping (auxiliary piping in cleaning system 500, second main piping in cleaning system 502) 264: Third piping (auxiliary piping in cleaning system 502) 320, 322: Control device 400: Substrate cleaning device 418: Cleaning module 421: First nozzle 422: Second nozzle 500, 502: Cleaning system M: Confluence point W: Substrate
Claims
1. A chemical liquid supply device comprising: a junction; a first main pipe located downstream of the junction; a secondary pipe located downstream of the junction and parallel to the first main pipe; a first supply amount control device attached to the first main pipe; a control valve attached to the secondary pipe; and a control device, wherein the first supply amount control device is configured to feedback control the flow rate of liquid flowing through the first main pipe to a set flow rate based on the flow rate of liquid in the first main pipe, and the control device is configured to execute the following steps: a first step of causing the first supply amount control device to start control so that the flow rate of liquid flowing through the first main pipe becomes a first set flow rate; a second step of controlling the control valve so that throttling adjustment of the control valve begins when the flow rate of liquid flowing through the first main pipe is less than the first set flow rate after the first step; and a third step of controlling the control valve so that throttling adjustment of the control valve stops when the flow rate of liquid flowing through the first main pipe becomes equal to or greater than the first set flow rate after the second step. Chemical liquid supply device.
2. A chemical liquid supply device as defined in claim 1, wherein the first supply amount control device has a valve for adjusting the flow rate in the first main pipe, and the control device is configured to execute a fourth step, after the first step and before the second step, of controlling the first supply amount control device so that the opening of the valve of the first supply amount control device becomes a first opening degree that is smaller than the opening degree when the valve is fully open.
3. A chemical liquid supply device as defined in claim 1, comprising: a dilution water pipe for supplying water to the junction; a first chemical liquid pipe for supplying a first chemical liquid to the junction; a second chemical liquid pipe for supplying a second chemical liquid to the junction; a dilution water control device attached to the dilution water pipe for feedback controlling the flow rate of water supplied to the junction to a set flow rate; a first chemical liquid control device attached to the first chemical liquid pipe for feedback controlling the flow rate of the first chemical liquid supplied to the junction to a set flow rate; and a second chemical liquid control device attached to the second chemical liquid pipe for feedback controlling the flow rate of the second chemical liquid supplied to the junction to a set flow rate.
4. A chemical liquid supply device as defined in claim 3, wherein the dilution water control device, the first chemical liquid control device, the second chemical liquid control device and the first supply amount control device each have a valve, and the control device is configured to execute the following steps after the third step: a fifth step of storing valve opening information of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device and the control valve in association with information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device and the first supply amount control device; and a sixth step of adjusting the valve openings of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device and the control valve to the stored openings when the received information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device and the first supply amount control device matches the stored information.
5. A chemical liquid supply device according to claim 1, comprising a second main pipe located downstream of the junction and parallel to the first main pipe and the sub-pipe, the chemical liquid supply device comprising a second supply amount control device configured to feedback control the flow rate of liquid flowing through the second main pipe to a set flow rate based on the flow rate of liquid in the second main pipe, the first step further comprising the step of causing the second supply amount control device to start control so that the flow rate of liquid flowing through the second main pipe becomes a second set flow rate, the second step further comprising the step of controlling the control valve so that throttling adjustment of the control valve begins when the flow rate of liquid flowing through the second main pipe is less than the second set flow rate, and the third step further comprising the step of controlling the control valve so that throttling adjustment of the control valve stops when the flow rate of liquid flowing through the first main pipe becomes equal to or greater than the first set flow rate and the flow rate of liquid flowing through the second main pipe becomes equal to or greater than the second set flow rate.
6. A chemical liquid supply device as defined in claim 5, wherein the first supply amount control device has a valve for adjusting the flow rate in the first main pipe, and the second supply amount control device has a valve for adjusting the flow rate in the second main pipe, and the control device is configured to execute a fourth step after the first step and before the second step, and in the fourth step, when the flow rate of liquid flowing through the first main pipe is less than the first set flow rate, the control device controls the first supply amount control device so that the opening of the valve of the first supply amount control device is a first opening that is smaller than the opening when fully open, and when the flow rate of liquid flowing through the second main pipe is less than the second set flow rate, the control device controls the second supply amount control device so that the opening of the valve of the second supply amount control device is a second opening that is smaller than the opening when fully open.
7. A chemical liquid supply device according to claim 5, comprising: a dilution water pipe for supplying water to the junction; a first chemical liquid pipe for supplying a first chemical liquid to the junction; a second chemical liquid pipe for supplying a second chemical liquid to the junction; a dilution water control device attached to the dilution water pipe for feedback-controlling the flow rate of water supplied to the junction to a set flow rate; a first chemical liquid control device attached to the first chemical liquid pipe for feedback-controlling the flow rate of the first chemical liquid supplied to the junction to a set flow rate; and a second chemical liquid control device attached to the second chemical liquid pipe for feedback-controlling the flow rate of the second chemical liquid supplied to the junction to a set flow rate, wherein the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device and the second supply amount control device each have a valve, and the control devices a fifth step of storing, after the third step, valve opening information of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, the second supply amount control device, and the control valve in association with information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, and the second supply amount control device; and a sixth step of adjusting the valve openings of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, the second supply amount control device, and the control valve to the stored openings when the received information of the set flow rates of the dilution water control device, the first chemical liquid control device, the second chemical liquid control device, the first supply amount control device, and the second supply amount control device matches the stored information.
8. A cleaning system comprising: a chemical liquid supply device according to any one of claims 1 to 4; and a substrate cleaning device for cleaning a substrate, wherein the substrate cleaning device has a first nozzle through which liquid is supplied from the first main pipe; and a second nozzle through which liquid is supplied from the sub-pipe.
9. A cleaning system comprising: a chemical liquid supply device according to any one of claims 5 to 7; and a substrate cleaning device for cleaning a substrate, wherein the substrate cleaning device has: a first nozzle through which liquid is supplied from the first main pipe; and a second nozzle through which liquid is supplied from the second main pipe.
10. A method for adjusting a control valve using the chemical liquid supply device according to any one of claims 1 to 7, wherein the control device executes the first step, the second step, and the third step.
Citation Information
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