Suspended hollow shaft magnetic levitation wafer manufacturing apparatus

Abstract

Disclosed in the embodiments of the present disclosure is a suspended hollow shaft magnetic levitation wafer manufacturing apparatus, which comprises a process chamber, a support component, a hollow shaft, an isolation sleeve, a holder, and an active magnetic levitation motor. The isolation sleeve is sealingly connected to a first opening at the top of the process chamber; the active magnetic levitation motor comprises a magnetic levitation stator and a magnetic levitation rotor, the magnetic levitation rotor, the hollow shaft and the holder being all arranged in a vacuum environment; the magnetic levitation rotor is fixedly connected to the hollow shaft, and the support component is provided in the hollow shaft; the magnetic levitation stator is arranged outside the isolation sleeve and drives, in a contactless active control mode, the magnetic levitation rotor to achieve stable levitation and rotation; one end of the holder is fixedly connected to the hollow shaft, and the other end of the holder is configured to bear a wafer, such that the wafer is arranged in the process chamber in a suspended manner. The present disclosure does not need to provide mechanical bearings and thus does not generate particle contamination, thereby remarkably improving the quality of films, greatly extending the overall service life of apparatuses, and further reducing the costs of maintenance and cleaning for apparatuses.

Description

A suspended hollow shaft magnetic levitation wafer manufacturing equipment

[0001] Cross Reference to Related Applications

[0002] The present disclosure claims priority to the Chinese patent application No. 202410838108.1, entitled "A suspended hollow shaft magnetic levitation wafer manufacturing equipment", filed on June 26, 2024 with the China Patent Office, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of magnetic levitation, in particular to a suspended hollow shaft magnetic levitation wafer manufacturing equipment. BACKGROUND

[0004] Wafer manufacturing equipment is one of the most important equipment in the semiconductor production process, mainly divided into two categories of front-end process equipment and back-end process equipment. Front-end process equipment is an important equipment in the semiconductor manufacturing process, mainly used in the wafer manufacturing link, mainly including thin film deposition equipment, etching equipment, lithography equipment, CMP equipment and heat treatment equipment, etc. Thin film deposition equipment is an important component in front-end process equipment, used for depositing various thin film materials such as metal, oxide, etc. on the wafer surface. Thin film deposition equipment usually adopts physical vapor deposition (PVD) or chemical vapor deposition (CVD) technology to achieve uniform and stable thin film deposition. According to the process, PVD can be further divided into vacuum evaporation, sputtering coating, arc plasma coating, ion coating and molecular beam epitaxy, etc. Chemical vapor deposition (CVD) refers to the chemical reaction of different partial pressure of multiple gas phase state reactants at a certain temperature and pressure, and the generated solid material is deposited on the substrate material surface, thereby obtaining the required thin film process technology. According to the classification of the reaction source, CVD can be divided into silane-based chemical vapor deposition (Silane-based CVD), polyester-based chemical vapor deposition (TEOS-based CVD) and metal organic chemical vapor deposition (MOCVD).

[0005] Molecular beam epitaxy (MBE) is a special vacuum coating process that grows thin films layer by layer along the crystal axis direction of the substrate material under appropriate conditions. MBE equipment is a high-end thin film preparation technology used to precisely grow single atomic layer of crystalline materials, mainly applied in the fields of semiconductors, optoelectronics, quantum technology, superconductors, and other precision material science. The core components of MBE equipment include: ultra-high vacuum system, material source (various molecular beam sources), wafer (substrate), control system and analysis tools (mass spectrometer, electron diffraction device, electron spectrometer, mass analyzer), etc. For example, in one embodiment, the MBE equipment includes a process chamber and a plurality of molecular beam sources, a heatable wafer and holder, a mass spectrometer, an electron diffraction device, an electron spectrometer, a mass analyzer, etc. arranged in the process chamber. In addition to using an ion pump system for exhaust, the entire device can be baked and degassed to ensure a vacuum of 10-8 Pa.

[0006] A thermal processing apparatus is used to heat treat wafers to achieve desired chemical reactions and physical changes. Thermal processing apparatuses typically employ rapid thermal processing (RTP) or high-temperature annealing techniques to achieve efficient and stable heat treatment operations. The key feature of RTP is the ability to rapidly heat wafers to the desired high temperature (typically reaching hundreds to thousands of degrees Celsius within a few seconds) and rapidly cool them after processing is complete. This reduces heat treatment time, shortens process cycle time, and reduces the wafer's residence time at high temperature, thereby reducing the damage to the wafer caused by thermal stress. To improve temperature uniformity, the wafer needs to be rotated during rapid thermal processing to promote uniform distribution of heat source radiation, reduce the formation of hot and cold spots, and ensure the uniformity of wafer surface temperature. In RTP, due to the extremely fast heating rate, wafer rotation can effectively reduce process inconsistencies caused by local overheating or underheating, which is crucial for forming high-quality thin films or performing precise thermal processing on semiconductor wafers. Rotating the wafer also helps reduce the temperature difference between the center and the edge of the wafer, avoiding problems such as lattice mismatch, stress concentration caused by excessive temperature gradients, which is particularly important for semiconductor devices that require high uniformity processing.

[0007] Therefore, in the prior art, in order to achieve more uniform and precise thin film growth, control the quality of the thin film, improve temperature uniformity, reduce temperature gradient, etc., the wafer needs to be stably rotated and lifted in the process chamber. For example, in one embodiment, the wafer (substrate) and its holder are suspended in the process chamber through a hollow shaft, the hollow shaft is connected with a rotating motor through a magnetic shaft or a magnetic coupling, and the magnetic shaft and the rotating motor are used to drive the hollow shaft to rotate. The magnetic coupling is composed of a first magnetic assembly arranged outside the isolation sleeve and a second magnetic assembly arranged inside the isolation sleeve, and the isolation sleeve is sealingly connected with the process chamber. The hollow shaft is arranged inside the isolation sleeve and is fixedly connected with the second magnetic assembly, and at least one set of mechanical bearings is needed to be used for rotation support and guidance to inhibit the inclination and eccentricity (lateral movement) of the hollow shaft. On the one hand, the mechanical bearing wear is easy to produce particle pollution, which causes the quality of wafer products to be unable to be further improved. On the other hand, due to the long axial length of the hollow shaft, gravity imbalance is easy to occur, which causes a larger load than expected to act on the mechanical bearing, thereby shortening the service life of the mechanical bearing, and further causing problems such as short equipment maintenance period, high maintenance and cleaning cost, etc.

[0008] DISCLOSURE

[0009] In order to overcome the defects in the prior art, the embodiments of the present disclosure provide a suspended hollow shaft magnetic suspension wafer manufacturing equipment for solving at least one of the above problems.

[0010] In a first aspect, the embodiments of the present disclosure provide a suspended hollow shaft magnetic suspension wafer manufacturing equipment, which comprises a process chamber, a support component arranged at the top of the process chamber, a hollow shaft, an isolation sleeve, a holder and an active magnetic suspension motor. The isolation sleeve is sealingly connected with a first opening at the top of the process chamber, the inside of the isolation sleeve and the process chamber is a vacuum environment, and the outside of the isolation sleeve and the process chamber is a non-vacuum environment. The active magnetic suspension motor comprises a magnetic suspension stator and a magnetic suspension rotor. The magnetic suspension rotor, the hollow shaft and the holder are arranged in the vacuum environment. The magnetic suspension rotor is fixedly connected with the hollow shaft. The support component is arranged in the hollow shaft and is fixedly connected with the isolation sleeve. The magnetic suspension stator is arranged in the non-vacuum environment outside the isolation sleeve and drives the magnetic suspension rotor to stably suspend and rotate in a non-contact active control manner. One end of the holder is fixedly connected with the hollow shaft, and the other end of the holder is configured to carry a wafer, so that the wafer is arranged in the process chamber in a suspended manner.

[0011] Optionally, the magnetic suspension stator comprises a motor stator and at least one radial active magnetic bearing. The motor stator is configured to drive the magnetic suspension rotor to rotate. The radial active magnetic bearing is configured to generate an electromagnetic force for driving the magnetic suspension rotor to radially displace.

[0012] Optionally, two of the radial active magnetic bearings are arranged at two ends of the motor stator.

[0013] Optionally, the magnetic suspension rotor comprises a first permanent magnet rotor, and the first permanent magnet rotor and the motor stator are configured as a permanent magnet motor.

[0014] Optionally, the magnetic suspension stator comprises at least one bearing and driving stator, the bearing and driving stator comprises a plurality of stator teeth and a plurality of second winding coils, the plurality of stator teeth are arranged around the outside of the isolation sleeve, and at least one second winding coil is arranged on each stator tooth; the magnetic suspension rotor comprises a second permanent magnet rotor, and the bearing and driving stator is configured to drive the second permanent magnet rotor to suspend and rotate.

[0015] Optionally, an axial active magnetic bearing is further arranged, and the axial active magnetic bearing is configured to generate an electromagnetic force for driving the axial displacement of the magnetic suspension rotor.

[0016] Optionally, one of the axial active magnetic bearings is arranged, a step is arranged at the top of the isolation sleeve, the magnetic suspension rotor comprises a third annular magnetic yoke, the third annular magnetic yoke is arranged in the isolation sleeve and fixedly connected with the hollow shaft, the axial active magnetic bearing is arranged outside the isolation sleeve and located at the step, the axial active magnetic bearing comprises a third magnetic core and a plurality of third winding coils, and the third magnetic core and the plurality of third winding coils are arranged in axial opposite to the third magnetic yoke.

[0017] Optionally, a limiting device is further arranged, and the limiting device is configured to limit the axial movement of the magnetic suspension rotor when the magnetic suspension stator is separated from the magnetic suspension rotor.

[0018] Optionally, the limiting device comprises a stator limiting assembly and a rotor limiting piece, the stator limiting assembly comprises an upper limiting piece and a lower limiting piece arranged in axial interval, and the rotor limiting piece is configured to be able to pass through the upper limiting piece after rotating by a first angle and be limited between the upper limiting piece and the lower limiting piece after rotating by a second angle.

[0019] Optionally, the rotor limiting piece comprises one or more first limiting blocks, the upper limiting piece comprises one or more second limiting blocks, and the projection of the first limiting block in a radial plane does not overlap with the projection of the second limiting block in the radial plane after the first limiting block rotates by the first angle.

[0020] Optionally, a first guide surface configured to guide the first limiting block is formed on the side of the second limiting block facing the lower limiting piece, and a second guide surface matched with the first guide surface is formed on the first limiting block.

[0021] Optionally, the lower limit part is configured as a first annular body arranged on the inner side of the isolation sleeve; or the lower limit part is configured as a plurality of third limit blocks, the plurality of third limit blocks are arranged on the inner surface of the isolation sleeve in a circumferential direction and correspond to the plurality of second limit blocks one by one, and the first limit block is limited between the second limit block and the third limit block after rotating the second angle.

[0022] Optionally, the upper limit part and the lower limit part are detachably fixedly connected with the isolation sleeve, and the stator limiting part further comprises a fixing ring, and the upper limit part and the lower limit part are arranged on the inner side of the fixing ring.

[0023] Optionally, the support part comprises a conductive hollow shaft, the isolation sleeve is provided with a conductive through hole, the conductive hollow shaft is sealingly arranged in the conductive through hole, one end of the conductive hollow shaft is located in the non-vacuum environment, the other end of the conductive hollow shaft is located in the vacuum environment, and the other end of the conductive hollow shaft is provided with a first heating device configured to heat the wafer.

[0024] Optionally, a power cable of the first heating device is led out to the non-vacuum environment through the conductive hollow shaft.

[0025] Optionally, further comprising a lifting mechanism configured to drive the magnetic levitation stator to move axially.

[0026] Optionally, the magnetic levitation stator is detachably fixedly connected with the process chamber.

[0027] Optionally, the wafer manufacturing equipment is configured as a PVD device or a CVD device, and the bottom of the process chamber is provided with a material source.

[0028] Optionally, the wafer manufacturing equipment is configured as a heat treatment device, and the bottom of the process chamber is provided with a second heating device.

[0029] The beneficial effects of the embodiments of the present disclosure are as follows: the embodiments of the present disclosure provide a suspension type hollow shaft magnetic suspension wafer manufacturing device, the active control of the active magnetic suspension motor can realize the non-contact stable suspension and rotation of the hollow shaft, and further drive the retainer and wafer to suspend and rotate, realize the complete magnetic suspension of the hollow shaft, the retainer and the wafer, compared with the non-contact rotation driving realized by the magnetic force shaft and the magnetic force coupling in the prior art, the hollow shaft in the present disclosure does not need to be provided with a mechanical bearing, and the stable rotation and suspension of the hollow shaft can be realized, the suspension center is actively controlled, and the inclination and eccentricity (lateral movement) of the hollow shaft can be effectively inhibited. Since the mechanical bearing is not needed to be arranged in the present disclosure, the particle pollution caused by mechanical wear is avoided, and the film quality is significantly improved. Since the mechanical bearing is a part that needs to be maintained and limits the service life of the equipment, the mechanical bearing is not needed to be arranged in the present disclosure, and the service life of the whole equipment is greatly improved, so that the equipment maintenance and cleaning cost can be reduced. And through the magnetic coupling between the magnetic suspension stator and the magnetic suspension rotor, the axial movement of the hollow shaft can be driven, so that the bellows and other components are not needed to be arranged, the structure is simplified, and the equipment cost is further reduced.

[0030] In order to make the above and other objects, features and advantages of the present disclosure more apparent, the following will specifically describe a preferred embodiment in combination with the accompanying drawings, and the detailed description is as follows. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0032] Fig. 1 is a schematic diagram of the structure of the suspension type hollow shaft magnetic suspension wafer manufacturing device provided by the embodiments of the present disclosure;

[0033] Fig. 2 is a schematic diagram of the structure of the suspension type hollow shaft magnetic suspension wafer manufacturing device provided by the embodiments of the present disclosure;

[0034] Fig. 3 is a schematic diagram of the structure of the active magnetic suspension motor provided by the embodiments of the present disclosure;

[0035] Fig. 4 is a schematic diagram of the structure of the active magnetic suspension motor provided by the embodiments of the present disclosure;

[0036] Fig. 5 is a perspective view of the limiting device provided by the embodiments of the present disclosure;

[0037] Fig. 6 is a schematic diagram of the structure of the suspension type hollow shaft magnetic suspension wafer manufacturing device provided by the embodiments of the present disclosure;

[0038] Fig. 7 is a structural schematic diagram of a suspended hollow shaft magnetic suspension wafer manufacturing device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present disclosure.

[0040] In the description of the present disclosure, it should be noted that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship described based on the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. The terms "comprise", "comprising", "have", "having", "include", "including", "contain", "containing", and any variations thereof in the specification and claims of the present disclosure and the above drawings are intended to cover not only the inclusion of the listed elements but also the inclusion of other elements not clearly listed or inherent to such products or devices.

[0041] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more, unless otherwise explicitly limited.

[0042] The drawings in the present disclosure are not strictly drawn according to the actual proportions, and the specific size and quantity of each structure can be determined according to actual needs. The drawings described in the present disclosure are only schematic diagrams.

[0043] Referring to FIG. 1, according to an embodiment of the present disclosure, a kind of suspended hollow shaft magnetic suspension wafer manufacturing equipment is provided, including process chamber 1 and support component 2 set in the top of process chamber 1, hollow shaft 3, isolation sleeve 4, retainer 5 and active magnetic suspension motor 6, isolation sleeve 4 is sealed with the first opening 11 in the top of process chamber 1 Connection, the inside of isolation sleeve 4 and process chamber 1 is vacuum environment, the outside of isolation sleeve 4 and process chamber 1 is non-vacuum environment.Active magnetic suspension motor 6 includes magnetic suspension stator 61 and magnetic suspension rotor 62, magnetic suspension rotor 62, hollow shaft 3 and retainer 5 are all set in vacuum environment, magnetic suspension rotor 62 is fixedly connected with hollow shaft 3, support component 2 is set in hollow shaft 3 and is fixedly connected with isolation sleeve 4, magnetic suspension stator 61 is set in the non-vacuum environment outside isolation sleeve 4 and drives magnetic suspension rotor 62 to stably suspend and rotate in the mode of contactless active control.The one end of retainer 5 is fixedly connected with hollow shaft 3, and the other end of retainer 5 is configured to carry wafer 100, so that wafer 100 is arranged in process chamber 1 in the mode of suspension.In this way, the active control of active magnetic suspension motor can realize the contactless stable suspension and rotation of hollow shaft, and further drive the suspension and rotation of retainer and wafer, to realize the complete magnetic suspension of hollow shaft, retainer and wafer.Compared with the contactless rotary drive of magnetic force shaft and magnetic force coupling in the prior art, the present disclosure does not need to set mechanical bearing in the process chamber, so as to realize the stable rotation and suspension of hollow shaft, and the suspension center is actively controlled, so as to effectively inhibit the inclination and eccentricity (lateral movement) of hollow shaft.The present disclosure does not need to set mechanical bearing, so that the particle pollution caused by mechanical wear is avoided, so as to significantly improve the film quality.Mechanical bearing is a part that needs to be maintained and limited in use in the equipment, and the service life of the whole equipment is greatly improved by not setting mechanical bearing, so as to reduce the equipment maintenance and cleaning cost.Further, the axial movement of hollow shaft can be driven by the magnetic coupling between magnetic suspension stator and magnetic suspension rotor, so that the bellows and other components are not needed, the structure is simplified, and the equipment cost is further reduced.

[0044] The wafer manufacturing equipment in the present disclosure is not limited to molecular beam epitaxy equipment, and according to an embodiment of the present disclosure, the wafer manufacturing equipment provided by the embodiment of the present disclosure can be any PVD equipment, CVD equipment and heat treatment equipment, etc., which meets the above structural features.The PVD equipment is, for example, vacuum evaporation, sputtering coating, arc plasma coating, ion coating and molecular beam epitaxy equipment.The CVD equipment is, for example, silane-based chemical vapor deposition (Silane-based CVD), polyester-based chemical vapor deposition (TEOS-based CVD) and metal organic chemical vapor deposition (MOCVD) equipment.The heat treatment equipment is, for example, rapid thermal processing (RTP) equipment or high-temperature annealing equipment, etc.

[0045] Referring to FIG. 2, a suspended hollow shaft magnetic levitation wafer manufacturing equipment is schematically shown according to the structural features of a molecular beam epitaxy (MBE) equipment. Referring to FIG. 6, a suspended hollow shaft magnetic levitation wafer manufacturing equipment is schematically shown according to the structural features of a metal organic chemical vapor deposition (MOCVD) equipment. Referring to FIG. 7, a suspended hollow shaft magnetic levitation wafer manufacturing equipment is schematically shown according to the structural features of a rapid thermal processing (RTP) equipment, but not limited thereto.

[0046] In order to achieve active control of the stable suspension and rotation of the hollow shaft, according to the embodiments of the present disclosure, referring to FIG. 3, the magnetic levitation stator 61 of the active magnetic levitation motor 6 includes a motor stator 611 configured to drive the magnetic levitation rotor 62 to rotate, and at least one radial active magnetic bearing 612 configured to generate an electromagnetic force to drive the radial displacement of the magnetic levitation rotor 62. By changing the current to dynamically adjust the size and direction of the electromagnetic force, the magnetic levitation rotor is ensured to be stably suspended in the radial direction, while also providing the necessary radial positioning force and dynamic / static stability.

[0047] According to the embodiments of the present disclosure, referring to FIG. 3, the radial active magnetic bearing includes a first magnetic core 6121 and a plurality of first winding coils 6122, the first magnetic core 6121 and the plurality of first winding coils 6122 are arranged around the outside of the isolation sleeve 4, the magnetic levitation rotor 62 includes an annular first yoke 621 arranged around the outside of the hollow shaft 3, and the first yoke 61 is arranged in radial opposition to the first magnetic core 6121 and the plurality of first winding coils 6122. The first magnetic core is usually composed of a plurality of magnetic poles and an annular second yoke, the plurality of magnetic poles are arranged in an annular shape around the first yoke of the magnetic levitation rotor. The first magnetic core and the first yoke are configured to guide the magnetic flux, construct the magnetic field loop, and enhance the magnetic field. The first winding coils are arranged on the plurality of magnetic poles of the first magnetic core to generate electromagnetic force by energization, and the current in each first winding coil can be adjusted by a driving circuit to achieve dynamic stable suspension and precise position control of the magnetic levitation rotor in the radial direction. The driving circuit is connected to a control system, and the control system often has a fast response capability to cope with the radial dynamic displacement of the magnetic levitation rotor and external disturbances.

[0048] The motor stator 611 is configured to drive the magnetic suspension rotor 62 to rotate, and is a motor body of the active magnetic suspension motor. For example, the motor stator 611 can be configured as a direct current motor, an alternating current motor or a brushless motor, and a suitable motor type is selected according to application requirements. Alternatively, according to an embodiment of the present disclosure, referring to FIG. 3, the magnetic suspension rotor 62 includes a first permanent magnet rotor 622, and the first permanent magnet rotor 622 is configured with the motor stator 611 as a permanent magnet motor. The permanent magnet motor of the embodiment of the present disclosure, also known as a permanent magnet synchronous motor (PMSM), is a motor that utilizes the permanent magnet of the magnetic suspension rotor to generate a magnetic field. Since no additional excitation device is required, the permanent magnet motor has a compact structure, and the volume and weight are relatively small, which is beneficial to improve the power density of the equipment. In the thin film deposition equipment, the motor body driving the hollow shaft to rotate adopts a permanent magnet motor with a compact structure, which does not occupy a large space on the top of the process chamber, and the corresponding size is relatively easy to integrate and install when replacing the magnetic force shaft or the magnetic force coupling.

[0049] According to an embodiment of the present disclosure, referring to FIG. 3, the active magnetic suspension motor is provided with two radial active magnetic bearings 612 and one motor stator 611, and the two radial active magnetic bearings 612 are arranged at the two axial ends of the motor stator 611. Since in the hollow shaft thin film deposition equipment, the hollow shaft extends in the axial direction in the process chamber, the hollow shaft is usually relatively long, and the two radial active magnetic bearings are arranged at the two ends of the motor stator to form a symmetrical structure, which can better suppress the lateral movement and tilting of the hollow shaft, thereby further improving the stability of the active magnetic suspension motor. Alternatively, under the condition that the installation size space allows, the distance between the two radial active magnetic bearings in the axial direction is increased as much as possible to obtain better stability.

[0050] According to an embodiment of the present disclosure, referring to FIG. 3, the active magnetic suspension motor further includes an axial active magnetic bearing 613, which is configured to generate an electromagnetic force driving the axial displacement of the magnetic suspension rotor 62. In this way, the electromagnetic force is utilized to actively control and support the axial (along the rotation axis direction) position of the magnetic suspension rotor. For example, in the thin film deposition process, the axial position of the wafer can be adjusted by axial active control, the deposition layer thickness is accurately controlled, and nanometer-level accuracy can be achieved by adjusting the growth rate and time.

[0051] According to the embodiment of the present disclosure, referring to FIG. 3, the active magnetic suspension motor is provided with an axial active magnetic bearing 613, the top of the isolation sleeve 4 is provided with a step 41, the magnetic suspension rotor 62 comprises a ring-shaped third magnetic yoke 623, the third magnetic yoke 623 is arranged in the isolation sleeve 4 and is fixedly connected with the hollow shaft 3, the axial active magnetic bearing 613 is arranged outside the isolation sleeve 4 and is located at the step 41, the axial active magnetic bearing 613 comprises a third magnetic core 6131 and a plurality of third winding coils 6132, the third magnetic core and the plurality of third winding coils are arranged in axial opposite to the third magnetic yoke. The top of the isolation sleeve 4 is usually a flange structure, a step is formed at the flange position of the top of the isolation sleeve, and the axial active magnetic bearing is arranged at the step, so that the axial active magnetic bearing and the isolation sleeve are designed compactly, the axial active magnetic bearing realizes the function of axial active control, does not occupy additional design space, and the active magnetic suspension motor maintains the characteristics of compact structure. In the embodiment, the third magnetic yoke of the magnetic suspension rotor is fixedly connected with the hollow shaft, and optionally, the third magnetic yoke is arranged at the top end of the hollow shaft to be opposite to the position of the third magnetic core of the axial active magnetic bearing to guide the magnetic flux, construct a magnetic field loop, and enhance the magnetic field. Similarly, the plurality of third winding coils 6132 can generate electromagnetic force, and the current in the third winding coil can be adjusted by the driving circuit to realize the axial dynamic stable suspension and precise position control of the magnetic suspension rotor. The driving circuit is connected with the control system, and the control system usually has a fast response capability to cope with the axial dynamic deviation of the magnetic suspension rotor and external disturbance.

[0052] In order to realize the active control of the stable suspension and rotation of the hollow shaft, according to the embodiment of the present disclosure, referring to FIG. 4, the magnetic suspension stator 61 of the active magnetic suspension motor 6 comprises at least one bearing and driving stator 614, the bearing and driving stator comprises a plurality of stator teeth 6141 and a plurality of second winding coils 6142, the plurality of stator teeth 6141 are arranged around the outside of the isolation sleeve 4, and at least one second winding coil 6142 is arranged on each stator tooth 6141; the magnetic suspension rotor 62 comprises a second permanent magnet rotor 624, and the bearing and driving stator is configured to drive the second permanent magnet rotor to suspend and rotate. In this way, the bearing and driving stator and the corresponding second permanent magnet rotor jointly constitute a bearingless sheet motor, which is a special bearingless motor that eliminates the axial active magnetic bearing and the radial active magnetic bearing, the motor stator and the active magnetic bearing are integrated together, and the rotation and the radial active control of the rotor are realized at the same time. The magnetic circuit formed by the mechanical structure realizes the passive suspension of the other three degrees of freedom except the radial and the rotation degrees of freedom of the rotor.

[0053] According to different winding structures, the bearingless sheet motor can be divided into a single-winding structure and a double-winding structure, and the winding structure of the bearingless sheet motor is not limited in the disclosure and can be a single-winding structure or a double-winding structure. According to an embodiment of the disclosure, the bearing and driving stator 614 includes a plurality of stator teeth 6141 (second magnetic cores) and a plurality of second winding coils 6142. The bearing and driving stator 614 includes a ring-shaped second magnetic yoke. The stator teeth 6141 are in a linear type. The outer ends of the plurality of stator teeth 6141 are magnetically connected to the ring-shaped second magnetic yoke. The second winding coils 6142 are sleeved on the corresponding stator teeth 111. The inner ends (stator magnetic poles) of the plurality of stator teeth 6141 enclose a rotor cavity. Optionally, two second winding coils are arranged on each stator tooth. The two second winding coils can be both concentrated winding or one second winding coil is concentrated winding and the other second winding coil is distributed winding. The two second winding coils on the stator tooth are stacked together. One second winding coil is configured as a rotation control, and the other second winding coil is configured as a suspension control to form a double-winding structure of the active magnetic suspension motor. Optionally, one second winding coil is arranged on each stator tooth. The second winding coil is concentrated winding. The second winding coil is configured as a rotation control and a suspension control to form a single-winding structure of the active magnetic suspension motor. In the figure, only the case of two second winding coils is shown.

[0054] According to an embodiment of the disclosure, referring to FIG. 4, the second permanent magnet rotor 624 includes a permanent magnet. In other embodiments, the permanent magnet can also be arranged in the sheath. Optionally, the sheath is integrally formed with the hollow shaft, and the permanent magnet is embedded in the sheath. The second permanent magnet rotor can be a permanent magnet rotor with one magnetic pole pair, for example, a magnetic pole pair with N and S poles magnetized in the radial direction, but the permanent magnet rotor is not limited to one magnetic pole pair. The permanent magnet rotor can also include M magnetic pole pairs, where M is a non-zero natural number. When M is an odd number, each magnetic pole pair includes two magnetic poles with opposite polarities, and the two magnetic poles are arranged in the radial direction. When M is an even number, each magnetic pole pair includes two magnetic poles with the same polarity, and the two magnetic poles are arranged in the radial direction. For example, when M is equal to 1, the permanent magnet rotor includes one magnetic pole pair, which includes two magnetic poles with opposite polarities, i.e., N and S poles. However, it is not limited to this. In other embodiments, the magnetic suspension rotor can also be configured as two magnetic pole pairs or multiple magnetic pole pairs.

[0055] According to an embodiment of the disclosure, the active magnetic suspension motor is not limited to the structure of the bearing and driving stator 614. For example, the bearing and driving stator 614 can be a linear stator magnetic suspension stator structure in which a ring-shaped second magnetic yoke connects the outer ends of a plurality of linear stator teeth. The bearing and driving stator 614 can also be an L-shaped stator magnetic suspension stator structure in which a ring-shaped second magnetic yoke connects the longitudinal portions of a plurality of L-shaped stator teeth.

[0056] According to the embodiment of the present disclosure, referring to FIG. 4, the active magnetic levitation motor includes two bearings and driving stators 614, but is not limited thereto, and one or three or more bearings and driving stators can also be provided. According to the number of bearings and driving stators, a corresponding second permanent magnet rotor is configured. In view of the space limitation and the complexity of control of multiple bearings and driving stators, in order to achieve better axial stiffness, and when a large number of bearings and driving stators cannot be provided, the active magnetic levitation motor can also include an axial active magnetic bearing 613, which is configured to generate an electromagnetic force for driving the axial displacement of the magnetic levitation rotor 62. In this way, the electromagnetic force is further utilized to actively control and support the axial (along the direction of the rotation axis) position of the magnetic levitation rotor, so as to cope with the axial dynamic deviation and external disturbance of the magnetic levitation rotor. Optionally, referring to FIG. 4, the active magnetic levitation motor is also provided with an axial active magnetic bearing, the top of the isolation sleeve 4 is provided with a step 41, the magnetic levitation rotor 62 includes a third annular magnetic yoke 623, the third annular magnetic yoke 623 is arranged in the isolation sleeve 4 and is fixedly connected with the hollow shaft 3, and the axial active magnetic bearing is arranged outside the isolation sleeve 4 and located at the step 41. The axial active magnetic bearing includes a third magnetic core 6131 and a plurality of third winding coils 6132, and the third magnetic core and the plurality of third winding coils are arranged in axial opposition with the third magnetic yoke.

[0057] In order to maintain the vacuum degree of the process chamber of the thin film deposition equipment, the entire equipment needs to be baked at a high temperature for degassing. For example, molecular beam epitaxy requires extremely high vacuum degree to ensure the purity during the growth process. High-temperature baking can drive out the residual gas inside the system (including the cavity, pipeline, valve, etc.), including the moisture, organic matter and other volatile impurities adsorbed on the inner wall of the process chamber. If these impurities are not removed, they will affect the purity and quality of the thin film in the subsequent growth process, and may cause thin film contamination and increase defects. Since high-temperature baking usually requires heating the system to a very high temperature, such as several hundred degrees Celsius or even higher, in order to effectively remove the residual gas and impurities. Such high temperature can damage the insulation materials, lubricating oil, and plastic or rubber parts inside the magnetic levitation motor, causing the performance of the magnetic levitation motor to decrease or age prematurely. Therefore, when the thin film deposition equipment such as the molecular beam epitaxy equipment is periodically baked at a high temperature for degassing, the magnetic levitation motor needs to be removed from the process chamber to avoid damage caused by high temperature. When the active magnetic levitation motor is removed, the magnetic levitation rotor in the isolation sleeve will follow the magnetic levitation stator and rise under the action of the magnetic field force of the magnetic levitation stator. When the magnetic levitation stator is removed and moves away, the magnetic levitation rotor will fall down under the influence of gravity, which may collide with and damage the process chamber.

[0058] According to the embodiments of the present disclosure, referring to FIGS. 1-4, the suspended hollow shaft magnetic levitation wafer manufacturing apparatus further comprises a limiting device 7 configured to limit the axial movement of the magnetic levitation rotor 62 when the magnetic levitation stator 61 needs to be detached from the magnetic levitation rotor 62. In this way, when the magnetic levitation stator is removed, and the isolation sleeve and the interior thereof are baked and degassed, the magnetic levitation rotor can be prevented from falling, colliding and damaging the process chamber. The limiting device can be implemented in various ways. For example, the limiting device can be a simple buffer type washer. The washer is arranged in the isolation sleeve and close to one end of the first opening at the top of the process chamber for easy installation. A relief hole for avoiding the hollow shaft is formed in the middle of the washer. The washer is, for example, an elastic rubber ring with supporting force. When the magnetic levitation rotor falls, the washer plays a role of bearing and buffering. In addition, the limiting device can also be other structural members capable of supporting, which are not limited herein.

[0059] According to the embodiment of the present disclosure, referring to FIG. 3, FIG. 4 and FIG. 5, optionally, the limiting device 7 comprises a stator limiting assembly 71 and a rotor limiting piece 72, the stator limiting assembly comprises an upper limiting piece 711 and a lower limiting piece 712 arranged at intervals along the axial direction, and the rotor limiting piece is configured to be able to pass through the upper limiting piece after rotating by a first angle and be limited between the upper limiting piece and the lower limiting piece after rotating by a second angle. In this way, when the magnetic suspension stator is taken away for high-temperature baking and outgassing of the isolation sleeve and the like, the magnetic suspension rotor is limited by the cooperation of the upper and lower limiting pieces and the rotor limiting piece, which can directly hinder the axial movement of the rotor and avoid the impact caused by the falling of the magnetic suspension rotor. When baking and outgassing is needed, the control system drives the magnetic suspension rotor to rotate by the first angle through the magnetic suspension stator, and keeps the first angle to lock the magnetic suspension rotor to descend so that the rotor limiting piece passes through the upper limiting piece (for example, the gap between adjacent two upper limiting pieces), and then the magnetic suspension rotor is driven by the magnetic suspension stator to rotate by the second angle, at this time, the rotor limiting piece can be limited between the upper limiting piece and the lower limiting piece, that is, the rotor limiting piece is hindered by the upper limiting piece, and the magnetic suspension rotor and the hollow shaft will be locked by the limiting device, so that the magnetic suspension stator can be taken away freely. After baking and outgassing, the magnetic suspension stator is reassembled to the corresponding position of the magnetic suspension rotor, at this time, the magnetic suspension rotor is reversely rotated by the second angle through the magnetic suspension stator, the rotor limiting piece will be opposite to the gap between adjacent two upper limiting pieces, keeping the second angle to lock and driving the magnetic suspension rotor to ascend can make the rotor limiting piece pass through the upper limiting piece reversely, at this time, the magnetic suspension rotor has been separated from the limiting device, and can rotate and suspend freely. In the embodiment, the first angle can be the included angle between the rotation zero position of the magnetic suspension rotor and the hollow shaft and the gap position between adjacent two upper limiting pieces. The first angle can also be zero degrees, at this time, the rotation zero position of the magnetic suspension rotor and the hollow shaft is the gap position between adjacent two upper limiting pieces. When the magnetic suspension rotor stops rotating, the rotor limiting piece on the hollow shaft is located at the gap position between adjacent two upper limiting pieces, in this case, the magnetic suspension rotor and the hollow shaft can directly descend and rotate by the second angle after passing through. The second angle can be the same as or different from the first angle. When the rotation zero position of the magnetic suspension rotor and the hollow shaft is the same as the gap position between adjacent two upper limiting pieces, the second angle is different from the first angle.

[0060] The shape and structure of the rotor limiting member, the upper limiting member and the lower limiting member are not limited, in order to realize the above functions of the limiting device, referring to FIG. 5, the rotor limiting member is arranged on the outer side of the hollow shaft and extends towards the isolation sleeve, and there is no contact between the rotor limiting member and the isolation sleeve; the upper limiting member and the lower limiting member are arranged on the inner side of the isolation sleeve and extend towards the hollow shaft, and there is no contact between the upper limiting member and the lower limiting member and the hollow shaft; the radial inner end of the upper limiting member and the radial inner end of the lower limiting member both fall into the axial space defined by the radial inner end and the radial outer end of the rotor limiting member. In this way, the rotor limiting member, the upper limiting member and the lower limiting member have an overlapping part from top to bottom, and when the rotor limiting member rotates to between the upper limiting member and the lower limiting member, the rotor limiting member can be limited, thereby realizing the function of limiting the hollow shaft and the magnetic levitation rotor.

[0061] The number of rotor limiting members is not limited in the present disclosure, and the rotor limiting member includes one or more first limiting blocks 721, and the upper limiting member includes one or more second limiting blocks 7111. After the first limiting block rotates by a first angle, the projection of the first limiting block in the radial plane does not overlap the projection of the second limiting block in the radial plane. For example, one first limiting block and one second limiting block can be provided, and the first limiting block can be a radial strip block extending in the radial direction or an arc-shaped strip block extending in the circumferential direction. In order to ensure that the first limiting block can pass through the second limiting block, it is required that the projection of the first limiting block in the radial plane does not overlap the projection of the second limiting block in the radial plane after rotating by the first angle. Here, the first angle can be an angle range composed of multiple angles. In addition, it can also be a one-to-many, many-to-one or many-to-many combination, such as one first limiting block and multiple second limiting blocks or multiple first limiting blocks and one second limiting block. Optionally, multiple first limiting blocks are arranged circumferentially and spaced apart along the outer surface of the hollow shaft, for example, uniformly distributed, and multiple second limiting blocks are arranged circumferentially and spaced apart along the inner surface of the isolation sleeve and correspond one-to-one to the multiple first limiting blocks, and the multiple second limiting blocks are also uniformly distributed, and the circumferential length of the gap between two adjacent second limiting blocks is greater than or equal to the circumferential length of the first limiting block. In this way, after rotating by the first angle, the multiple first limiting blocks are just opposite the gap between the corresponding two adjacent second limiting blocks, and when the hollow shaft and the magnetic levitation rotor descend, the multiple first limiting blocks can pass through the multiple second limiting blocks. Circumferential arrangement of multiple first limiting blocks and multiple second limiting blocks can provide more stable support.

[0062] The lower limiting piece in the above-mentioned limiting device is mainly configured as a rotor limiting piece, and the structure and shape thereof are not limited. Optionally, the lower limiting piece is configured as a first annular body 7121 arranged on the inner side of the isolation sleeve; or the lower limiting piece is configured as a plurality of third limiting blocks which are arranged in a circumferential direction on the inner surface of the isolation sleeve and correspond to the plurality of second limiting blocks one by one, and the first limiting block is limited between the second limiting block and the third limiting block after rotating by a second angle.

[0063] The fixed connection mode between the rotor limiting piece and the hollow shaft is not limited. In order to reduce the influence of the added parts on the vacuum environment, optionally, the rotor limiting piece and the hollow shaft are integrally formed.

[0064] The fixed connection mode between the upper limiting piece, the lower limiting piece and the isolation sleeve is not limited. In order to facilitate the magnetic levitation rotor and the rotor limiting piece to be loaded into the isolation sleeve, according to the embodiment of the present disclosure, optionally, the upper limiting piece and the lower limiting piece are detachably fixedly connected with the isolation sleeve. The detachable fixed connection mode is, for example, fastener locking, bonding or buckle. In order to reduce the influence of the added parts on the vacuum environment, optionally, the upper limiting piece and the lower limiting piece are fixedly connected with the isolation sleeve through the buckle mode.

[0065] In the thin film deposition device, on the one hand, the hollow shaft helps to reduce the overall weight of the device, reduce the moment of inertia, and make the device easier to operate and control. On the other hand, it also provides space for the installation of other components, which helps to design the device compactly. For example, the support component is arranged in the hollow shaft and fixedly connected with the isolation sleeve, which can be configured to provide suspension support for other components such as heating devices, cooling devices, heat insulation devices, etc. According to the embodiment of the present disclosure, the support component includes a conductive hollow shaft 21, the isolation sleeve 4 is provided with a conductive through hole 42, the conductive hollow shaft 21 is sealingly arranged in the conductive through hole 42, one end of the conductive hollow shaft is located in a non-vacuum environment, and the other end of the conductive hollow shaft is located in a vacuum environment. The other end of the conductive hollow shaft is provided with a first heating device 200, which can provide suspension support for the first heating device. The first heating device 200 is configured to heat the wafer 100, for example, the first heating device is arranged above the wafer, and the first heating device generates heat radiation to heat the wafer. In this way, the conductive hollow shaft provides suspension support for the first heating device, and on the other hand, provides installation space for the cable of the first heating device, that is, the cable of the first heating device can be led out to the external non-vacuum environment through the conductive hollow shaft. In other embodiments, the other end of the conductive hollow shaft can also be provided with a cooling device, a heat insulation device, etc. For example, in the embodiment in which a cooling device is arranged in the process chamber, the cooling pipeline of the cooling device can be led out to the external non-vacuum environment through the conductive hollow shaft.

[0066] According to the embodiments of the present disclosure, referring to FIG. 1-6, the suspended hollow shaft magnetic levitation wafer manufacturing device further comprises a lifting mechanism 300 configured to drive the magnetic levitation stator to move axially. In this way, the lifting mechanism can help load and unload the wafer before starting growth and after ending growth, especially under the condition of needing to maintain high vacuum degree, which can avoid unnecessary environmental exposure and reduce the risk of contamination. For example, before starting growth, the magnetic levitation stator is driven to move upward by the lifting mechanism, and then the magnetic levitation rotor is driven to move axially by the magnetic levitation stator, which can realize large-range adjustment of the axial position of the magnetic levitation rotor and the hollow shaft, so that the wafer integrated with the hollow shaft through the retainer moves axially, and the wafer is adjusted to an appropriate position in the radiation range of the heating source to accurately control the wafer temperature and start normal thin film growth. After growth, the magnetic levitation stator is driven to move downward by the lifting mechanism, and then the magnetic levitation rotor is driven to move axially by the magnetic levitation stator, which can realize large-range adjustment of the axial position of the magnetic levitation rotor and the hollow shaft, so that the wafer integrated with the hollow shaft through the retainer moves axially downward, and the wafer is adjusted to a position away from the heating source to facilitate unloading of the grown wafer and loading of a new wafer. The lifting mechanism is, for example, a hydraulic lifting mechanism, a pneumatic lifting mechanism, an electric lifting mechanism, a screw lifting mechanism, etc. Among them, the hydraulic lifting mechanism uses hydraulic oil to transfer pressure to realize lifting through the interaction of the oil pump and the oil cylinder. The pneumatic lifting mechanism uses compressed air as a power source to drive lifting through the extension and retraction of the air cylinder. The electric lifting mechanism drives the mechanical transmission mode such as worm gear, gear rack, chain or steel wire rope through the electric motor to realize lifting action. The screw lifting mechanism uses the screw motion principle of the screw and the nut to drive electrically or manually.

[0067] Since the thin film deposition device such as the molecular beam epitaxy device needs to be removed from the process chamber during periodic high-temperature baking and outgassing to avoid damage caused by high temperature, the magnetic levitation motor. Therefore, optionally, the magnetic levitation stator is detachably fixedly connected to the process chamber. The detachable fixed connection mode is, for example, fastener locking, bonding or buckle. In an embodiment, the magnetic levitation stator further comprises a housing, and the housing of the magnetic levitation stator is locked to the flange of the process chamber by fasteners.

[0068] According to the embodiments of the present disclosure, the suspended hollow shaft magnetic levitation wafer manufacturing device of the present disclosure is configured as a PVD device or a CVD device. The PVD device is, for example, a vacuum evaporation, sputtering, arc plasma, ion plating and molecular beam epitaxy device. The CVD device is, for example, a silane-based chemical vapor deposition (Silane-based CVD), polyester-based chemical vapor deposition (TEOS-based CVD) and metal organic chemical vapor deposition (MOCVD) device.

[0069] Referring to FIG. 2, according to an embodiment of the present disclosure, the suspended hollow shaft magnetic levitation wafer manufacturing device of the present disclosure is configured as a molecular beam epitaxy device, which includes a process chamber 1 and a plurality of substance sources 600 arranged at the bottom of the process chamber 1. The substance source is, for example, a molecular beam source, which is a core component for realizing precise deposition of materials, and is responsible for evaporating or dissociating the required materials into atomic or molecular beams, and then shooting them at a heated wafer in an ultra-high vacuum environment to realize precise growth at the atomic level. The molecular beam epitaxy device further includes a support component 2, a hollow shaft 3, an isolation sleeve 4, a holder 5, and an active magnetic levitation motor 6. The isolation sleeve 4 is sealingly connected to a first opening 11 at the top of the process chamber 1, the magnetic levitation rotor 62 of the active magnetic levitation motor is fixedly connected to the hollow shaft 3, the support component 2 is arranged in the hollow shaft 3 and fixedly connected to the isolation sleeve 4, the magnetic levitation stator 61 of the active magnetic levitation motor is arranged in a non-vacuum environment outside the isolation sleeve 4 and drives the magnetic levitation rotor 62 to stably levitate and rotate in a contactless active control manner, one end of the holder 5 is fixedly connected to the hollow shaft 3, and the other end of the holder 5 is configured to carry a wafer 100, so that the wafer 100 is arranged in the process chamber 1 in a suspended manner.

[0070] The support component 2 includes a conductive hollow shaft 21, one end of the conductive hollow shaft 21 is located in a non-vacuum environment, the other end of the conductive hollow shaft 21 is located in a vacuum environment, the other end of the conductive hollow shaft 21 is provided with a first heating device 200, and the first heating device 200 is configured to heat the wafer. The side of the process chamber is also provided with an evacuation system 400 and a transition chamber 500. The evacuation system mainly includes a dry pump, a molecular pump, a cold pump, vacuum pipelines, and an electric control system. The evacuation system can almost completely extract gas molecules in the process chamber, forming an almost impurity-free ultra-clean environment. This helps to avoid pollution of foreign gas molecules during thin film growth, ensuring high purity and excellent crystal quality of the deposited thin film. In addition, the side of the process chamber is also provided with analysis tools such as a mass spectrometer, an electron diffraction device, an electron spectrometer, and a mass analyzer. For example, the side of the process chamber is provided with a reflection high-energy electron diffraction (RHEED) electron gun 700 and a display screen 800, which play a key role in real-time monitoring of the thin film growth process.

[0071] Referring to FIG. 6, according to an embodiment of the present disclosure, the suspended hollow shaft magnetic levitation wafer manufacturing device is configured as a MOCVD device, which includes a process chamber 1 and a plurality of substance sources 600 arranged at the bottom of the process chamber 1. The process chamber is the reaction chamber of the MOCVD, and the substance sources 600 are configured as gas inlet devices connected to the gas sources of the process gas used in the wafer processing of the MOCVD. The gas inlet devices are arranged at the bottom of the reaction chamber. The gas inlet devices are connected to the gas sources configured to supply the process gas used in the wafer processing, such as carrier gas and reaction gas, such as metal organic compounds and source substances of group V metal elements. In a typical metal organic chemical vapor deposition process, the carrier gas can be nitrogen, hydrogen or a mixture of nitrogen and hydrogen, so the process gas at the bottom of the wafer and the holder can mainly consist of nitrogen and / or hydrogen, and contain some amount of reaction gas components. The gas inlet devices are arranged to receive various gases and guide the process gas to flow in a generally upward direction.

[0072] The MOCVD device further includes a support component 2, a hollow shaft 3, an isolation sleeve 4, a holder 5 and an active magnetic levitation motor 6. The isolation sleeve 4 is sealingly connected to the first opening 11 at the top of the process chamber 1, the magnetic levitation rotor 62 of the active magnetic levitation motor is fixedly connected to the hollow shaft 3, the support component 2 is arranged in the hollow shaft 3 and fixedly connected to the isolation sleeve 4, the magnetic levitation stator 61 of the active magnetic levitation motor is arranged in a non-vacuum environment outside the isolation sleeve 4 and drives the magnetic levitation rotor 62 to stably levitate and rotate in a contactless active control manner, one end of the holder 5 is fixedly connected to the hollow shaft 3, and the other end of the holder 5 is configured to carry a wafer 100, so that the wafer 100 is arranged in the process chamber 1 (reaction chamber) in a suspended manner. The support component 2 includes a conductive hollow shaft 21, one end of the conductive hollow shaft 21 is located in a non-vacuum environment, the other end of the conductive hollow shaft 21 is located in a vacuum environment, the other end of the conductive hollow shaft 21 is provided with a first heating device 200, and the first heating device 200 is configured to heat the wafer. The top of the reaction chamber is also provided with a vacuum pumping system 400, which mainly consists of a dry pump, a molecular pump, a cold pump and a vacuum pipeline, and an electric control system. The vacuum pumping system can almost completely pump out the gas molecules in the process chamber, forming an almost impurity-free ultra-clean environment. This helps to avoid the pollution of foreign gas molecules during film growth, ensuring the high purity and excellent crystal quality of the deposited film. The top of the reaction chamber is also provided with an exhaust device 500', which is configured to discharge gas from the inside of the reaction chamber, including waste gas generated by the reaction and part of the gas that has not participated in the reaction.

[0073] Referring to FIG. 7, according to an embodiment of the present disclosure, the suspended hollow shaft magnetic levitation wafer manufacturing device is configured as a thermal treatment device, such as an RTP device, which includes a process chamber 1 and a second heating device 600' arranged at the bottom of the process chamber 1. The process chamber is a vacuum chamber, and the second heating device is configured to heat the bottom of the wafer, providing rapid, uniform and precise heating. For example, the second heating device is an array of infrared lamps, which are configured to rapidly heat the wafer to the required high temperature, usually reaching hundreds or even thousands of degrees Celsius within a few seconds. In order to ensure the uniformity of the wafer surface temperature, the infrared lamp array needs to ensure uniform heat distribution. This can be achieved through radiant heating (using an infrared lamp array), annular heating element layout, or special optical design to reduce hot and cold spots, improve the uniformity and repeatability of thermal treatment. The heating device needs to be closely matched with a precise temperature control system, which adjusts the heating power in real time through a feedback mechanism to ensure that the temperature can be accurately controlled according to the predetermined temperature curve during the entire thermal treatment process, meeting different process requirements.

[0074] The thermal treatment device further includes a support component 2, a hollow shaft 3, an isolation sleeve 4, a retainer 5, and a magnetic levitation motor 6. The isolation sleeve 4 is sealingly connected to the first opening 11 at the top of the process chamber 1, the magnetic levitation rotor 62 of the magnetic levitation motor is fixedly connected to the hollow shaft 3, the support component 2 is arranged in the hollow shaft 3 and is fixedly connected to the isolation sleeve 4, the magnetic levitation stator 61 of the magnetic levitation motor is arranged in a non-vacuum environment outside the isolation sleeve 4 and drives the magnetic levitation rotor 62 to stably levitate and rotate in a contactless active control manner, one end of the retainer 5 is fixedly connected to the hollow shaft 3, and the other end of the retainer 5 is configured to carry the wafer 100, so that the wafer 100 is arranged in the process chamber 1 in a suspended manner. The support component 2 includes a conductive hollow shaft 21, one end of the conductive hollow shaft 21 is located in a non-vacuum environment, the other end of the conductive hollow shaft 21 is located in a vacuum environment, and the other end of the conductive hollow shaft 21 is provided with a first heating device 200 configured to heat the top of the wafer. The first heating device cooperates with the second heating device to form a double-sided heating structure, which can further optimize temperature uniformity and reduce thermal gradients in the case of extreme uniformity or special material processing. The double-sided heating structure can also be applied to some complex processes that require precise control of the overall temperature distribution of the wafer. The process chamber is provided with a vacuum pumping system 400, which mainly includes a dry pump, a molecular pump, a cold pump, vacuum pipelines, and an electric control system. The vacuum pumping system can almost completely pump out the gas molecules in the process chamber to form an almost impurity-free ultra-clean environment. This helps to avoid contamination by foreign gas molecules during film growth, ensuring high purity and excellent crystal quality of the deposited film.

[0075] In the above embodiments, the retainer is configured to carry the wafer, also known as wafer carrier, and its structure is not limited, as shown in FIG. 2, FIG. 6 and FIG. 7, it can be designed to carry a single wafer structure according to the specific structure of the wafer manufacturing equipment, or it can be designed to carry multiple wafers structure.

[0076] The principles and implementation manners of the present disclosure are described in the specific embodiments in the present disclosure, and the above embodiment descriptions are only used to help understand the technical solutions of the present disclosure and its core ideas; meanwhile, for those skilled in the art, according to the ideas of the present disclosure, the specific implementation manners and application ranges will have changes, and in summary, the content of the specification should not be understood as a limitation of the present disclosure. Industrial applicability

[0077] In summary, the present embodiment provides a suspension type hollow shaft magnetic levitation wafer manufacturing equipment, which does not need to set mechanical bearings, the service life of the whole equipment is greatly improved, thereby the equipment maintenance and cleaning cost can be reduced. And the suspension type hollow shaft magnetic levitation wafer manufacturing equipment simplifies the structure, further reduces the equipment cost.

Claims

1. A suspended hollow-axis magnetic levitation wafer manufacturing equipment, characterized in that, The system includes a process chamber (1) and a support component (2), a hollow shaft (3), an isolation sleeve (4), a cage (5), and an active magnetic levitation motor (6) located on the top of the process chamber. The isolation sleeve is sealed to the first opening (11) at the top of the process chamber. The isolation sleeve and the interior of the process chamber are in a vacuum environment, while the exterior of the isolation sleeve and the process chamber is in a non-vacuum environment. The active magnetic levitation motor includes a magnetic levitation stator (61) and a magnetic levitation rotor (62). The magnetic levitation rotor, the hollow shaft, and the cage are all located in the vacuum environment. The magnetic levitation rotor is fixedly connected to the hollow shaft. The support component is located inside the hollow shaft and fixedly connected to the isolation sleeve. The magnetic levitation stator is located in the non-vacuum environment outside the isolation sleeve and drives the magnetic levitation rotor to levitate and rotate stably in a non-contact active control manner. One end of the cage is fixedly connected to the hollow shaft, and the other end of the cage is configured to carry a wafer (100) so that the wafer is suspended in the process chamber.

2. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 1, characterized in that, The magnetic levitation stator includes a motor stator (611) and at least one radial active magnetic bearing (612), the motor stator being configured to drive the magnetic levitation rotor to rotate, and the radial active magnetic bearing being configured to generate an electromagnetic force that drives the magnetic levitation rotor to radial displacement.

3. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 2, characterized in that, The system includes two radial active magnetic bearings and a motor stator, with the two radial active magnetic bearings located at both ends of the motor stator.

4. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 2 or 3, characterized in that, The magnetic levitation rotor includes a first permanent magnet rotor (622), which is configured with the motor stator as a permanent magnet motor.

5. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 1, characterized in that, The magnetic levitation stator includes at least one bearing and a drive stator (614). The bearing and drive stator include a plurality of stator teeth (6141) and a plurality of second winding coils (6142). The plurality of stator teeth are arranged around the outside of the isolation sleeve, and at least one second winding coil is provided on each stator tooth. The magnetic levitation rotor includes a second permanent magnet rotor (624). The bearing and drive stator are configured to drive the second permanent magnet rotor to levitate and rotate.

6. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to any one of claims 2-5, characterized in that, It also includes an axial active magnetic bearing (613) configured to generate an electromagnetic force that drives the magnetically levitated rotor to axial displacement.

7. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 6, characterized in that, An axial active magnetic bearing is provided, and a step (41) is provided on the top of the isolation sleeve. The magnetic levitation rotor includes an annular third magnetic yoke (623). The third magnetic yoke is located inside the isolation sleeve and is fixedly connected to the hollow shaft. The axial active magnetic bearing is located outside the isolation sleeve and at the step. The axial active magnetic bearing includes a third magnetic core (6131) and a plurality of third winding coils (6132). The third magnetic core and the plurality of third winding coils are arranged axially opposite to the third magnetic yoke.

8. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 1-7, characterized in that, It also includes a limiting device (7) configured to limit the axial movement of the magnetic levitation rotor when the magnetic levitation stator detaches from the magnetic levitation rotor.

9. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 8, characterized in that, The limiting device includes a stator limiting assembly (71) and a rotor limiting member (72). The stator limiting assembly includes an upper limiting member (711) and a lower limiting member (712) spaced apart along the axial direction. The rotor limiting member is configured to pass through the upper limiting member after rotating a first angle and to be limited between the upper limiting member and the lower limiting member after rotating a second angle.

10. The suspended hollow shaft magnetic levitation wafer manufacturing equipment according to claim 9, characterized in that, The rotor limiting member includes one or more first limiting blocks, and the upper limiting member includes one or more second limiting blocks. After the first limiting block rotates by the first angle, the projection of the first limiting block in the radial plane does not overlap with the projection of the second limiting block in the radial plane.

11. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to claim 10, characterized in that, The second limiting block has a first guide surface (7111) on the side facing the lower limiting member, which is configured to guide the first limiting block, and the first limiting block has a second guide surface (721) that cooperates with the first guide surface.

12. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to claim 11, characterized in that, The lower limiting member is configured as a first annular body, which is disposed on the inner side of the isolation sleeve; or, the lower limiting member is configured as a plurality of third limiting blocks, which are circumferentially spaced along the inner surface of the isolation sleeve and correspond one-to-one with the plurality of second limiting blocks, and the first limiting block is positioned between the second limiting block and the third limiting block after being rotated by the second angle.

13. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 9-12, characterized in that, The upper limit member and the lower limit member are detachably and fixedly connected to the isolation sleeve. The stator limit member also includes a fixing ring (713), and the upper limit member and the lower limit member are located inside the fixing ring.

14. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 1-13, characterized in that, The support component includes a conductive hollow shaft (21), and the isolation sleeve is provided with a conductive through hole (42). The conductive hollow shaft is sealed and inserted into the conductive through hole. One end of the conductive hollow shaft is located in the non-vacuum environment, and the other end of the conductive hollow shaft is located in the vacuum environment. A first heating device (200) is installed at the other end of the conductive hollow shaft. The first heating device is configured to heat the wafer.

15. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to claim 14, characterized in that, The power supply cable of the first heating device is led out to the non-vacuum environment through the hollow conductive shaft.

16. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 1-15, characterized in that, It also includes a lifting mechanism (300) configured to drive the magnetic levitation stator to move axially.

17. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 1-16, characterized in that, The magnetically levitated stator is detachably and fixedly connected to the process chamber.

18. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 1-17, characterized in that, The wafer manufacturing equipment is configured as a PVD or CVD equipment, and a material source (600) is provided at the bottom of the process chamber.

19. The suspended hollow-axis magnetic levitation wafer manufacturing equipment according to any one of claims 1-17, characterized in that, The wafer manufacturing equipment is configured as a heat treatment equipment, and a second heating device (600') is provided at the bottom of the process chamber.

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