Processing system, processing method, and transport device

Abstract

This processing system for processing a plurality of dies comprises: a transfer device that has a transfer component for transferring a plurality of dies that are held by a first object to a second object; and a transport device that is provided to the exterior of the transfer device for transporting the transfer component of the transfer device.

Description

Processing system, processing method, and transport device

[0001] The present disclosure relates to a processing system, a processing method, and a transport device.

[0002] Patent Document 1 discloses a die bonding equipment having a die bonding module that picks up a die from a die stage and bonds it to a substrate.

[0003] Japanese Patent Application Laid-Open No. 2023-098635

[0004] The technology according to the present disclosure efficiently replaces transfer components used when transferring multiple dies to a target body.

[0005] One aspect of the present disclosure is a processing system for processing multiple dies, comprising a transfer device having transfer parts for transferring the multiple dies held on a first object to a second object, and a transport device provided outside the transfer device for transporting the transfer parts in the transfer device.

[0006] According to the present disclosure, it is possible to efficiently replace transfer components used when transferring a plurality of dies to a target body.

[0007] 1 is a side view showing an outline of the configuration of a wafer on which a plurality of dies are mounted; FIG. 2 is a side view showing an outline of the configuration of a dicing tape and a dicing frame that hold a plurality of dies; FIG. 3 is a side view showing an outline of the configuration of a carrier that holds a plurality of dies; FIG. 4 is a plan view showing an outline of the configuration of a processing system according to this embodiment; FIG. 5 is a perspective view showing an outline of the configuration of a die placement apparatus; FIG. 6 is a side view showing an outline of the configuration of a portion of the die placement apparatus; FIG. 7 is a perspective view showing an outline of the configuration of a release section of the die placement apparatus; FIG. 8 is a perspective view showing an outline of the configuration of a collet section of the die placement apparatus; FIG. 9 is a perspective view showing an outline of the configuration of a die bonding apparatus; FIG. 10 is a side view showing an outline of the configuration of a portion of the die bonding apparatus; FIG. 11 is a perspective view showing an outline of the configuration of a release section of the die bonding apparatus; FIG. 12 is a perspective view showing an outline of the configuration of a collet section and a head section of the die bonding apparatus; FIG. 13 is an explanatory diagram schematically showing some steps in a die-on-wafer manufacturing process; FIG. 14 is a side view showing an outline of the configuration of a transfer arm; FIG. 15 is a side view showing an outline of the configuration of a transfer arm; FIG. 16 is a plan view showing an outline of the configuration of a first surface of the transfer arm; FIG. 17 is a plan view showing an outline of the configuration of a second surface of the transfer arm; FIG. 18 is a plan view showing an outline of the configuration of a support wafer on which a plurality of release sections and a collet section are supported. 10A to 10C are a plan view and a side view showing an outline of the configuration of a processing system according to another embodiment of the present invention; a side view showing an outline of the configuration of a first transfer device; a side view showing an outline of the configuration of a first finger; and a side view showing an outline of the configuration of a second finger.

[0008] Hereinafter, a processing system and a processing method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0009] In this embodiment, a die-on process is performed to mount a plurality of dies D on a wafer W as shown in Fig. 1. Specifically, first, a plurality of dies D held on a dicing tape T as shown in Fig. 2 are placed on a carrier C as shown in Fig. 3. Next, the plurality of dies D placed on the carrier C are bonded to the wafer W to be mounted.

[0010] 1 to 3, the die D has a configuration in which, for example, a silicon layer S and a device layer E are stacked. A circuit is formed in the device layer E. Note that the surface of the die D on which the device layer E is formed is referred to as the front surface Da, and the surface opposite to the front surface Da is referred to as the back surface Db.

[0011] As shown in Fig. 1, the wafer W on which the die D is mounted is a semiconductor wafer such as a silicon substrate or a glass substrate used in the manufacturing process of semiconductor devices. For example, the diameter of the wafer W is 300 mm and the thickness is approximately 800 µm. The surface of the wafer W on which the die D is mounted is referred to as the front surface Wa, and the surface opposite to the front surface Wa is referred to as the back surface Wb. The device layer E on the front surface Da side of the die D is bonded to the front surface Wa.

[0012] The number and arrangement of the dies D mounted on the front surface Wa of the wafer W are set to a desired pattern. A device layer (not shown) may be formed on the front surface Wa. The device layer is formed to correspond to the device layer E of the die D.

[0013] 2, the dicing frame F has an annular shape, and the dicing tape T is fixed to the back surface of the dicing frame F. The surface of the dicing tape T is adhesive, and multiple dies D are held on the surface (adhesive surface) of the dicing tape T. The dicing tape T holds the silicon layer S on the back surface Db side of the dies D.

[0014] 3, the carrier C has an upper surface that is an adsorption surface for electrostatically and vacuum-adsorbing and holding a plurality of dies D. The carrier C adsorbs and holds the silicon layer S on the back surface Db side of the die D. The carrier C has a configuration in which a substrate M and a holding layer N are stacked.

[0015] The substrate M has approximately the same diameter and thickness as the wafer W on which the die D is to be mounted, for example, a diameter of 300 mm and a thickness of approximately 800 μm. The substrate M is made of any conductive material, such as silicon, aluminum, an aluminum alloy, stainless steel, alumina, zirconia, SiC, or titanium. In other words, a silicon substrate may be used as the substrate M. The substrate M may also be made of approximately the same diameter as the wafer W on which the die D is to be mounted, but with a thickness different from that of the wafer W (for example, 500 μm to 1000 μm).

[0016] The substrate M has a plurality of through holes H formed therethrough in the thickness direction. The plurality of through holes H can be formed at any position on the suction surface of the carrier C. For example, the plurality of through holes H may be formed one for each of the plurality of dies D held by the carrier C, in other words, the same number as the plurality of dies D held by the carrier C. Furthermore, for example, the plurality of through holes H may be formed in a number corresponding to each of the plurality of dies D held by the carrier C, in other words, a number greater than the plurality of dies D held by the carrier C.

[0017] Furthermore, the number, size, spacing, and arrangement of the through holes H are not particularly limited, but it is desirable to determine the number, size, and spacing so as to ensure the strength (rigidity) to prevent deformation such as bending of the carrier C. For example, the diameter of the through holes H is 0.5 mm to 5.0 mm, and the spacing (the center-to-center distance between adjacent through holes H) is 0.5 mm to 5.0 mm.

[0018] The retaining layer N is a layer formed on the surface of the substrate M, and constitutes an adsorption surface for the die D on the carrier C. The retaining layer N does not have through holes formed therein, and covers the surface of the substrate M. The thickness of the retaining layer N is such that the die D can be held on the carrier C by electrostatic adsorption, for example, several tens of μm.

[0019] The retaining layer N is made of a material that is thermoplastic, flexible, and insulating, such as polyimide or EVA (ethylene-vinyl acetate copolymer). In this embodiment, "the retaining layer N is thermoplastic" means that it flows, softens, and can be reshaped at a predetermined temperature, for example, 80°C. Furthermore, "the retaining layer N is flexible" means that the elastic modulus of the retaining layer N on the substrate M is 2 GPa or less, preferably 0.5 GPa or less. Furthermore, "the retaining layer N is insulating" means that the dielectric breakdown voltage of the retaining layer N on the substrate M is 30 kV or more, preferably 40 kV or more.

[0020] The carrier C in this embodiment is configured as described above, and generates an electrostatic (Coulomb) force between the carrier C and the die D, thereby attracting and holding the die D on the attracting surface.

[0021] Furthermore, in the carrier C of this embodiment, the holding layer N is formed of a flexible material with a small elastic modulus. After the die D is placed on the carrier C, a gap is formed between the die D and the holding layer N before the die D is attracted and held by electrostatic force. Due to the flexibility of the holding layer N, when the die D is attracted to the holding layer N by electrostatic force, air is released from between the die D and the holding layer N due to the force of attraction of the die D to the holding layer N, and a pseudo-vacuum state is formed between the die D and the holding layer N. As a result, in addition to electrostatic attraction due to electrostatic force, a vacuum attraction force formed by the pseudo-vacuum state is generated between the carrier C and the die D, and a strong holding state is formed using both the electrostatic attraction force and the vacuum attraction force.

[0022] The method of holding the die D by the carrier C is not limited to this embodiment. For example, the die D may be pressed against the carrier C to be pressure-bonded. In this case, by pressing the die D against the carrier C, air is removed from between the die D and the holding layer N, and a vacuum suction force is generated between the die D and the holding layer N, resulting in the die D being adsorbed and held by the carrier C. When pressing the die D against the carrier C, the holding layer N may be heated. In this case, since the holding layer N has thermoplasticity, the holding layer N softens, making it easier for the die D to be adsorbed and held by the carrier C. The material of the substrate M in the carrier C does not need to be conductive and is optional. The material of the holding layer N also need only be thermoplastic and flexible, and does not need to be insulating and is optional.

[0023] Furthermore, for example, an adhesive sheet may be used for the holding layer N of the carrier C. In such a case, adhesive force is generated between the die D and the holding layer N, and the die D is held on the carrier C. A thermal release sheet may also be used for the holding layer N. The thermal release sheet is a sheet that has adhesive force at room temperature but is released when heated. As will be described later, when the die D is bonded to the wafer W, the die D is released from the carrier C, and at this time, heating the holding layer N can make it easier to release the die D.

[0024] Next, the processing system 1 according to this embodiment will be described. FIG. 4 is a plan view showing the outline of the configuration of the processing system 1.

[0025] 4, the processing system 1 has a first processing system 2 as a transfer system and a second processing system 3 as a transfer system. In the first processing system 2, a plurality of dies D held on a dicing tape T is placed on a carrier C, and the carrier C for holding the plurality of dies D is prepared. In the second processing system 3, the plurality of dies D held on the carrier C prepared in the first processing system 2 is bonded to a wafer W for mounting.

[0026] The first processing system 2 has a configuration in which a carry-in / out station 10 and a processing station 11 are integrally connected. In the carry-in / out station 10, for example, FOUPs Ff, Fc, each capable of accommodating a plurality of dicing frames F and a plurality of carriers C, are carried in and out between the station 10 and the outside. The processing station 11 is equipped with processing equipment for implementing the processing described below.

[0027] The loading / unloading station 10 is provided with a FOUP mounting table 20. In the illustrated example, a plurality of FOUPs, for example, two FOUPs Ff and two FOUPs Fc, are placed on the FOUP mounting table 20, aligned in a line in the Y-axis direction. Note that the number and arrangement of FOUPs Ff and Fc placed on the FOUP mounting table 20 are not limited to those in this embodiment and can be determined arbitrarily.

[0028] A transfer device 30 is provided adjacent to the FOUP mounting table 20 on the positive side of the X-axis. The transfer device 30 is configured to be movable on a transfer path 31 extending in the Y-axis direction. The transfer device 30 also has, for example, two transfer arms 32 that hold and transfer the dicing frame F and carrier C. Each transfer arm 32 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. Note that the configuration of the transfer arms 32 is not limited to this embodiment and may have any configuration. The transfer device 30 is configured to be able to transfer the dicing frame F and carrier C to the FOUPs Ff, Fc on the FOUP mounting table 20, a transition device 50 (described later), and a buffer device 51 (described later).

[0029] The processing station 11 is provided with a conveying device 40, a transition device 50, a buffer device 51, and a die placement device 60 as a transfer device. The number and arrangement of these various processing devices are not limited to this embodiment and can be determined arbitrarily.

[0030] The transfer device 40 has, for example, two transfer arms 41 that hold and transfer the dicing frame F and carrier C, and a turntable 42 that rotatably supports the transfer arms 41. Each transfer arm 41 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. The transfer device 40 is configured to be able to transfer the dicing frame F and carrier C to the transition device 50, buffer device 51, and die placement device 60. The transfer device 40 corresponds to the object transfer device in this disclosure.

[0031] The transition device 50 and the buffer device 51 are disposed on the negative side of the X-axis of the transport device 40. The transition device 50 and the buffer device 51 are stacked in this order vertically from the top. Note that a plurality of buffer devices 51 may be stacked.

[0032] The transition device 50 transfers the dicing frame F and the carrier C between the transfer device 30 and the transfer device 40. The buffer device 51 temporarily stores the dicing frame F and the carrier C.

[0033] One die placement device 60 is disposed in the positive direction of the Y-axis of the transport device 40, and another is disposed in the negative direction of the Y-axis of the transport device 40. The die placement device 60 has a chamber 61. A shutter 62 is provided on the side of the chamber 61 facing the transport device 40 to open and close the loading and unloading ports for the dicing frame F and the carrier C. Inside the chamber 61, multiple dies D held by a dicing tape T are placed on the carrier C. In the die placement device 60, the dicing frame F and dicing tape T correspond to the first object in this disclosure, and the carrier C corresponds to the second object in this disclosure. The configuration of the die placement device 60 will be described later.

[0034] The second processing system 3 has a configuration in which a load / unload station 70 and a processing station 71 are integrally connected. In the load / unload station 70, for example, FOUPs Fc and Fw, each capable of accommodating a plurality of carriers C and a plurality of wafers W, are loaded and unloaded between the load / unload station 70 and the outside. The processing station 71 is equipped with processing devices for performing the processes described below.

[0035] The loading / unloading station 70 is provided with a FOUP mounting table 80. In the illustrated example, a plurality of FOUPs, for example, two FOUPs Fc and two FOUPs Fw, are placed on the FOUP mounting table 80, aligned in a line in the Y-axis direction. Note that the number and arrangement of FOUPs Fc and Fw placed on the FOUP mounting table 80 are not limited to those in this embodiment and can be determined arbitrarily.

[0036] A transfer device 90 is provided adjacent to the FOUP mounting table 80 on the positive side of the X-axis. The transfer device 90 is configured to be movable on a transfer path 91 extending in the Y-axis direction. The transfer device 90 also has, for example, two transfer arms 92 for holding and transferring the carriers C and wafers W. Each transfer arm 92 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. Note that the configuration of the transfer arms 92 is not limited to this embodiment and may have any configuration. The transfer device 90 is configured to be able to transfer the carriers C and wafers W to the FOUPs Fc and Fw on the FOUP mounting table 80, a transition device 110 (described later), and a buffer device 111 (described later).

[0037] The processing station 11 is provided with a transport device 100, a transition device 110, a buffer device 111, and a die bonding device (die bonding device) 120 as a transfer device. The number and arrangement of these various processing devices are not limited to this embodiment and can be determined arbitrarily.

[0038] The transfer device 100 has, for example, two transfer arms 101 that hold and transfer the carriers C and wafers W, and a rotary table 102 that rotatably supports the transfer arms 101. Each transfer arm 101 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. The transfer device 100 is configured to be able to transfer the carriers C and wafers W to the transition device 110, the buffer device 111, and the die bonding device 120. The transfer device 100 corresponds to the object transfer device in this disclosure.

[0039] The transition device 110 and the buffer device 111 are disposed on the negative side of the X-axis of the transport device 100. The transition device 110 and the buffer device 111 are stacked in this order vertically from the top. Note that a plurality of buffer devices 111 may be stacked.

[0040] The transition device 110 transfers the carriers C and wafers W between the transfer device 90 and the transfer device 100. The buffer device 111 temporarily stores the carriers C and wafers W.

[0041] Two die bonding devices 120 are arranged in the positive direction of the Y axis of the transfer device 100, and two are arranged in the negative direction of the Y axis of the transfer device 100. The die bonding device 120 has a chamber 121. A shutter 122 for opening and closing a loading / unloading port for the carrier C and the wafer W is provided on the side of the chamber 121 facing the transfer device 100. Inside the chamber 121, multiple dies D held in the carrier C are bonded to the wafer W. In the die bonding device 120, the carrier C corresponds to a first object in this disclosure, and the wafer W corresponds to a second object in this disclosure. The configuration of the die bonding device 120 will be described later.

[0042] The above-described processing system 1 (first processing system 2 and second processing system 3) is provided with at least one control device 130. The control device 130 processes computer-executable instructions that cause the processing system 1 to perform the various processes described in this disclosure. The control device 130 may be configured to control each element of the processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device 130 may be included in the processing system 1. The control device 130 may include a processing unit, a storage unit, and a communication interface. The control device 130 is implemented, for example, by a computer. The processing unit may be configured to read from the storage unit a program that provides logic or routines that enable various control operations and execute the read program to perform various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processing unit for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the processing system 1 via a communication line such as a LAN (Local Area Network).

[0043] Although the processing system 1 according to this embodiment is configured as described above, the configuration of the processing system 1 is not limited to this. For example, the first processing system 2 and the second processing system 3 may be combined into an integrated configuration. Furthermore, for example, each of the first processing system 2 and the second processing system 3 may further include other processing devices depending on the purpose.

[0044] For example, the first processing system 2 may be provided with a die cleaning device that cleans the surface Da of the die D held on the dicing tape T. The cleaning method in the die cleaning device is arbitrary, but a cleaning liquid may be supplied to the surface Da, or ultraviolet light may be irradiated onto the surface Da.

[0045] For example, the second processing system 3 may be provided with a die cleaning device that cleans the surface Da of the die D held in the carrier C, and a wafer cleaning device that cleans the surface Wa of the wafer W. The cleaning methods used in these die cleaning devices and wafer cleaning devices are arbitrary, and may include supplying a cleaning liquid to the surfaces Da and Wa, or irradiating the surfaces Da and Wa with ultraviolet light.

[0046] For example, the second processing system 3 may be provided with a die modification device, a wafer modification device, a die hydrophilization device, and a wafer hydrophilization device. The wafer modification device and the die modification device use plasma to modify the surface Da of the die D held on the carrier C and the surface Wa of the wafer W, respectively. The die hydrophilization device and the wafer hydrophilization device supply pure water to the surface Da of the die D held on the carrier C and the surface Wa of the wafer W, respectively, to hydrophilize the surfaces Da and Wa. By modifying the surfaces Da and Wa, van der Waals forces (intermolecular forces) are generated between the surfaces Da and Wa when the die D is bonded to the wafer W, thereby bonding the surfaces Da and Wa together. Furthermore, by hydrophilizing the surfaces Da and Wa, hydrophilic groups between the surfaces Da and Wa form hydrogen bonds (intermolecular forces), thereby firmly bonding the surfaces Wa and Da together.

[0047] Furthermore, for example, the second processing system 3 may be provided with an inspection device that inspects the wafer W on which the die D is mounted. The inspection device takes an image of the wafer W using, for example, an IR camera, and inspects for the presence or absence of voids between the surface Wa of the wafer W and the die D.

[0048] Next, a description will be given of the configuration of the die placement apparatus 60. Fig. 5 is a perspective view showing an outline of the configuration of the die placement apparatus 60. Fig. 6 is a side view showing an outline of a portion of the configuration of the die placement apparatus 60.

[0049] As shown in Fig. 5, the die placement device 60 has a stage 200. The stage 200 is divided into a pickup area 201 and an arrange area 202. The pickup area 201 and the arrange area 202 are arranged side by side in the horizontal direction (X-axis direction). In the pickup area 201, a die D held on a dicing tape T is removed from the dicing tape T and picked up. In the arrange area 202, the die D picked up in the pickup area 201 is placed on a carrier C.

[0050] A frame holding unit 210 is provided in the pickup area 201. The frame holding unit 210 has the holding surface of the dicing frame F on its upper surface, and holds the dicing tape T and dicing frame F that hold the die D with the surface Da of the die D facing upward.

[0051] A mounting area 211 is formed on the upper surface of the frame holding part 210, on the positive X-axis side of the holding surface of the dicing frame F. A replacement release part 220 and collet part 230, which will be described later, are temporarily placed on the mounting area 211.

[0052] A movement mechanism 212 is provided below the frame holding unit 210. The frame holding unit 210 is configured to be movable in the horizontal direction (X-axis direction and Y-axis direction) by the movement mechanism 212. The drive unit of the movement mechanism 212 is not particularly limited, but a linear motor, for example, is used.

[0053] As shown in Fig. 6, a detachable portion 220 is provided inside the frame holding portion 210. The detachable portion 220 is configured to be detachable from the frame holding portion 210 and is configured to be replaceable. As shown in Fig. 7, the detachable portion 220 has, for example, a substantially cylindrical shape. A push-up pin 221 configured to be movable up and down is provided on the top surface of the detachable portion 220.

[0054] The detachment section 220 is provided with an elevation mechanism 222 that raises and lowers the push-up pins 221. The elevation mechanism 222 allows the push-up pins 221 to freely protrude from the upper surface of the detachment section 220. The push-up pins 221 can push up the die D on the dicing tape T held by the frame holding section 210 from below, thereby detaching the die D from the suction surface of the dicing tape T.

[0055] 6, a collet unit 230 is provided above the frame holding unit 210. The collet unit 230 picks up a die D from the dicing tape T, transports it, and places the die D on the carrier C. Specifically, the collet unit 230 holds the die D that has been pushed up and lifted by the removing unit 220, removes it from the dicing tape T, and transports the held die D from the pickup area 201 to the arrangement area 202.

[0056] 8, the collet member 230 has a chuck 231, a base 232, and a joint 233. The collet member 230 is configured to be detachable from a support member 241 of a moving mechanism 240 (described later) and is configured to be replaceable.

[0057] The chuck 231 receives and holds the die D on the dicing tape T from above. The method of holding the die D by the chuck 231 is arbitrary. However, since the surface Da of the die D held by the chuck 231 is the device surface of the device layer E, the chuck 231 must hold the die D without damaging the device surface. For example, the chuck 231 may be a non-contact chuck that can hold the die D from above without contact using the Bernoulli effect or ultrasonic squeeze effect. Alternatively, instead of holding the surface Da of the die D, the chuck 231 may be configured to clamp and hold the side surface of the die D that has been raised by, for example, supplying air.

[0058] The base 232 is larger than the chuck 231 and supports the entire upper surface of the chuck 231. The joint 233 is provided on the upper surface side of the base 232 and is fitted into and supported by a support portion 241, which will be described later.

[0059] 5, the collet member 230 is supported by a movement mechanism 240. The movement mechanism 240 supports and moves the collet member 230. The movement mechanism 240 has a support portion 241, an arm 242, a rail 243, a base 244, and a drive portion 245.

[0060] The support unit 241 supports the joint 233 of the collet unit 230. The tip of the arm 242 supports the support unit 241, and the base end is attached to the rail 243. The rail 243 is supported by the base 244. The rail 243 and the base 244 extend in the X-axis direction between the pickup area 201 and the arrange area 202. The drive unit 245 moves the support unit 241, the arm 242, and the collet unit 230 along the rail 243 in the X-axis direction. The drive unit 245 also moves the support unit 241, the arm 242, and the collet unit 230 in the Y-axis direction. Furthermore, the drive unit 245 rotates the collet unit 230 supported by the support unit 241 around the horizontal axis (around the X-axis), allowing the collet unit 230 to flip the front and back surfaces of the die D it holds. The drive source of the drive unit 245 is not particularly limited, but a linear motor, for example, may be used.

[0061] A carrier holding unit 250 is provided in the arrangement area 202. The carrier holding unit 250 has a holding surface for the carrier C on its upper surface, and holds the carrier C with the holding surface, on which the die D is arranged, facing upward. The carrier holding unit 250 is supported by a support plate 251.

[0062] A movement mechanism 252 is provided below the support plate 251. The carrier holding unit 250 and the support plate 251 are configured to be movable in the horizontal direction (X-axis direction and Y-axis direction) by the movement mechanism 252. The drive unit of the movement mechanism 252 is not particularly limited, but a linear motor, for example, is used.

[0063] The configuration of the die placement device 60 is not limited to this embodiment. For example, the frame holder 210 holds the dicing frame F horizontally, but it may hold it vertically. Similarly, the carrier holder 250 holds the carrier C horizontally, but it may hold it vertically.

[0064] Furthermore, for example, the die placement device 60 may be provided with a plurality of imaging units for alignment. For example, by imaging the die D on the dicing tape T, the position of the collet unit 230 is adjusted when picking up the die D. Furthermore, by imaging the die D and the carrier C held by the collet unit 230, the position of the collet unit 230 is adjusted when placing the die D on the carrier C.

[0065] Next, a description will be given of the configuration of the die bonding apparatus 120. Fig. 9 is a perspective view showing an outline of the configuration of the die bonding apparatus 120. Fig. 10 is a side view showing an outline of a partial configuration of the die bonding apparatus 120.

[0066] As shown in Fig. 9, the die bonding apparatus 120 has a stage 300. The stage 300 is divided into a pickup area 301 and a bonding area 302. The pickup area 301 and the bonding area 302 are arranged side by side in the horizontal direction (X-axis direction). In the pickup area 301, a die D held by a carrier C is removed from the carrier C and picked up. In the bonding area 302, the die D picked up in the pickup area 301 is bonded to a wafer W.

[0067] A carrier holding section 310 is provided in the pickup area 301. The carrier holding section 310 has a holding surface for a carrier C on its upper surface, and holds the carrier C holding a die D with the surface Da of the die D facing upward.

[0068] A mounting area 311 is formed on the upper surface of the carrier holding part 310, on the positive X-axis side of the holding surface of the carrier C. A replacement release part 320 and collet part 330, which will be described later, are temporarily placed in the mounting area 311.

[0069] A movement mechanism 312 is provided below the carrier holding unit 310. The carrier holding unit 310 is configured to be movable in the horizontal direction (X-axis direction and Y-axis direction) by the movement mechanism 312. The drive unit of the movement mechanism 312 is not particularly limited, but a linear motor, for example, is used.

[0070] As shown in Fig. 10, a detachable portion 320 is provided inside the carrier holding portion 310. The detachable portion 320 is configured to be detachable from the carrier holding portion 310 and to be replaceable. As shown in Fig. 11, the detachable portion 320 has, for example, a substantially cylindrical shape. On the top surface of the detachable portion 320, a push-up pin 321 configured to be able to move up and down and an air supply hole 322 for supplying air are provided.

[0071] The release section 320 is provided with an elevation mechanism 323 that raises and lowers the push-up pin 321. The elevation mechanism 323 allows the push-up pin 321 to freely protrude from the upper surface of the release section 320. The push-up pin 321 can push up the die D on the carrier C held by the carrier holding section 310 from below, thereby releasing the die D from the suction surface of the carrier C.

[0072] An air supply source 324 that supplies air to the air supply hole 322 is connected to the release section 320. The air supply hole 322 supplies air to the through-hole H of the carrier C held by the carrier holding section 310, and further supplies air to the back surface Db side of the die D on the carrier C via the through-hole H. In this way, air pressure is applied to the die D, which reduces the adhesion between the die D and the holding layer N on the suction surface of the carrier C. Then, the die D can be released from the suction surface of the carrier C.

[0073] Although the release portion 320 of this embodiment includes both the push-up pin 321 and the air supply hole 322, it may include only one of the push-up pin 321 and the air supply hole 322.

[0074] 9 , a collet unit 330 is provided above the carrier holding unit 310. The collet unit 330 picks up and transports a die D from the carrier C, and then transfers the die D, which will be described later, to the head unit 360. Specifically, the collet unit 330 holds the die D that has floated up due to a decrease in adhesion between the collet unit 330 and the holding layer N caused by the release unit 320, releases the die D from the carrier C, and then transports the held die D from the pickup region 301 to the bonding region 302.

[0075] 12, the collet member 330 has a chuck 331, a base 332, and a joint 333. The collet member 330 is configured to be detachable from a support member 341 of a moving mechanism 340 (described later) and is configured to be replaceable.

[0076] The chuck 331 receives and holds the die D on the carrier C from above. The method of holding the die D by the chuck 331 is arbitrary. However, since the surface Da of the die D held by the chuck 331 is the device surface of the device layer E, the chuck 331 needs to hold the die D by the chuck 331 without damaging the device surface. For example, the chuck 331 may be a non-contact chuck that can hold the die D from above without contact using the Bernoulli effect or ultrasonic squeeze effect. Alternatively, instead of holding the surface Da of the die D, the chuck 331 may be configured to clamp and hold the side surface of the die D that has been raised by, for example, supplying air.

[0077] The base 332 is larger than the chuck 331 and supports the entire upper surface of the chuck 331. The joint 333 is provided on the upper surface side of the base 332 and is fitted into and supported by a support portion 341, which will be described later.

[0078] 9, the collet member 330 is supported by a moving mechanism 340. The moving mechanism 340 supports and moves the collet member 330. The moving mechanism 340 has a support portion 341, an arm 342, a rail 343, a base 344, and a drive portion 345.

[0079] The support 341 supports the joint 333 of the collet 330. The tip of the arm 342 supports the support 341, and the base is attached to a rail 343. The rail 343 extends in the X-axis direction and is supported by a base 344. The drive unit 345 moves the support 341, the arm 342, and the collet 330 in the X-axis direction along the rail 343. The drive unit 345 also moves the support 341, the arm 342, and the collet 330 in the Y-axis direction. Furthermore, the drive unit 345 rotates the collet 330 supported by the support 341 around a horizontal axis (around the X-axis), allowing the collet 330 to flip the front and back surfaces of the die D it holds. The drive source of the drive unit 345 is not particularly limited, but a linear motor, for example, may be used.

[0080] A wafer holding unit 350 is provided in the bonding region 302. The wafer holding unit 350 has a holding surface for the wafer W on its upper surface, and holds the wafer W with its front surface Wa, which is the mounting surface for the die D, facing upward. The wafer holding unit 350 is supported by a support plate 351.

[0081] A mounting area 352 is formed on the upper surface of the support plate 351 on the X-axis positive side of the wafer holding part 350. A replacement head part 360 (described later) is temporarily placed on the mounting area 352.

[0082] A moving mechanism 353 is provided below the support plate 351. The moving mechanism 353 is configured to move the wafer holder 350 and the support plate 351 in horizontal directions (X-axis direction and Y-axis direction). The driving unit of the moving mechanism 353 is not particularly limited, but a linear motor, for example, is used.

[0083] A head unit 360, which is a bonding bed, is provided above the wafer holding unit 350. The head unit 360 receives and holds the die D from the collet unit 330, transports the held die D to the wafer W, and bonds the die D to the wafer W.

[0084] 12, the head unit 360 has a chuck 361, a base 362, and a joint 363. The head unit 360 is configured to be detachable from a support unit 371 of a moving mechanism 370 (described later) and is configured to be replaceable.

[0085] The chuck 361 receives and holds the die D held by the collet part 330 from above. The method of holding the die D by the chuck 361 is arbitrary. Because the back surface Db of the die D held by the chuck 361 is a silicon layer S, the chuck 361 does not necessarily have to be configured as a non-contact chuck or the like like the collet part 330. For example, a vacuum chuck may be used for the chuck 361, and the chuck 361 may suck and hold the die D by vacuuming it using a vacuum mechanism (not shown).

[0086] The base 362 is larger than the chuck 361 and holds the entire upper surface of the chuck 361. The joint 363 is provided on the upper surface side of the base 362 and is fitted into and supported by a support portion 371, which will be described later.

[0087] 9 , the head unit 360 is supported by a movement mechanism 370. The movement mechanism 370 supports and moves the head unit 360. The movement mechanism 370 has a support unit 371, an arm 372, a rail 373, a base 374, and a drive unit 375.

[0088] The support unit 371 supports the joint 363 of the head unit 360. The tip of the arm 372 supports the support unit 371, and the base end is attached to a rail 373. The rail 373 extends in the X-axis direction and is supported by a base 374. The drive unit 375 moves the support unit 371, the arm 372, and the head unit 360 in the X-axis direction along the rail 373. The drive unit 375 also moves the support unit 371, the arm 372, and the head unit 360 in the Y-axis direction. The drive source of the drive unit 375 is not particularly limited, but a linear motor, for example, is used.

[0089] The configuration of the die bonding apparatus 120 is not limited to this embodiment. For example, the die bonding apparatus 120 may be provided with multiple imaging units for alignment. For example, the position of the collet unit 330 is adjusted when picking up the die D by imaging the die D on the carrier C. Furthermore, the position of the collet unit 330 is adjusted when transferring the die D to the head unit 360 by imaging the die D held by the collet unit 330. Furthermore, the position of the head unit 360 is adjusted when bonding the die D to the wafer W by imaging the die D and the wafer W held by the head unit 360.

[0090] Next, a description will be given of a die-ion wafer manufacturing process carried out in the processing system 1 configured as above. Figure 13 is an explanatory diagram showing a schematic diagram of some steps in the die-ion wafer manufacturing process.

[0091] First, a description will be given of the processing in the first processing system 2. In the first processing system 2, a carrier C for holding a plurality of dies D is prepared.

[0092] First, the hoops Ff and Fc, each housing a dicing frame F and a carrier C, are placed on the hoop mounting table 20 of the carry-in / out station 10. At this time, as shown in Fig. 13(a), a plurality of dies D are held on the dicing tape T, and the dicing tape T is stored with its surface (dies D) facing upward. The carrier C is also stored with its surface (holding layer N) facing upward.

[0093] Next, the transfer device 30 removes the dicing frame F from the FOUP Ff, transfers it to the transition device 50, and then transfers it to the die placement device 60 by the transfer device 40. Also, the transfer device 30 removes the carrier C from the FOUP Fc, transfers it to the transition device 50, and then transfers it to the die placement device 60 by the transfer device 40.

[0094] In the die placement device 60, the dicing frame F is held by the carrier holding part 310 with the surface Da of the die D facing upward. The carrier C is held by the wafer holding part 350 with the surface (holding layer N) facing upward.

[0095] Next, the release unit 220 lifts one die D to be joined from the suction surface of the dicing tape T among the multiple dies D on the dicing tape T held by the frame holding unit 210 .

[0096] Next, the collet member 230 is lowered, and the surface Da of one of the die D to be joined that has been raised is held by the collet member 230. The die D may be held by the collet member 230 before the die D is raised by the release member 220, or may be held at the same time as the die D is raised by the release member 220. Next, the collet member 230 is raised, and the die D is picked up from the dicing tape T, as shown in FIG. 13(b).

[0097] Next, the collet member 230 is moved in the positive direction of the X axis until it is moved above the carrier C held by the carrier holding member 250 .

[0098] Next, the collet member 230 is lowered, and the die D is placed on the carrier C with the surface Da (device layer E) facing upward, as shown in Fig. 13(c). Subsequently, the collet member 230 is raised.

[0099] In this manner, the die D is placed on the carrier C. The process of picking up the die D from the dicing tape T and placing the die D on the carrier C is repeated until a plurality of dies D are arranged side by side on the carrier C as shown in FIG.

[0100] Next, the carrier C is transported to the transition device 50 by the transport device 40, and further transported to the FOUP Fc by the transport device 30. In this way, the processing in the first processing system 2 is completed, and the carrier C holding a plurality of dies D is prepared.

[0101] The FOUP from which the carrier C is retrieved does not necessarily have to be the same FOUP that housed the carrier C when it was brought in. That is, for example, the FOUPs that housed the carriers C may each carry out different components, or a new FOUP or the like for carrying out the carriers C may be carried into the first processing system 2.

[0102] Next, a description will be given of the processing in the second processing system 3. In the second processing system 3, a plurality of dies D held in the carrier C prepared in the first processing system 2 are mounted on a wafer W.

[0103] First, the FOUPs Fc and Fw, each containing a carrier C and a wafer W, are placed on the FOUP placement table 80 of the carry-in / out station 70. At this time, as shown in Fig. 13(d), a plurality of dies D are held in the carrier C, and the carrier C is stored with its front surface (dies D) facing upward. The wafers W are also stored with their front surfaces Wa facing upward.

[0104] Next, the carrier C in the FOUP Fc is removed by the transfer device 90, transferred to the transition device 110, and further transferred to the die bonding device 120 by the transfer device 100. Also, the wafer W in the FOUP Fw is removed by the transfer device 90, transferred to the transition device 110, and further transferred to the die bonding device 120 by the transfer device 100.

[0105] In the die bonding apparatus 120, the carrier C is held by the carrier holder 310 with the surface Da of the die D facing upward. The wafer W is held by the wafer holder 350 with the surface Wa facing upward.

[0106] Next, the release unit 320 lifts one die D to be bonded from the suction surface of the carrier C among the plurality of dies D on the carrier C held by the carrier holding unit 310 .

[0107] Next, the collet member 330 is lowered, and the surface Da of one of the floating die D to be joined is held by the collet member 330. The die D may be held by the collet member 330 before the die D is raised by the release member 320, or may be held at the same time as the die D is raised by the release member 320. Next, the collet member 330 is raised, and the die D is picked up from the carrier C, as shown in FIG. 13( e).

[0108] Next, the collet part 330 is rotated around the horizontal axis (around the X axis), thereby inverting the front and back surfaces of the die D. Then, the back surface Db of the die D held by the collet part 330 is brought into a state facing upward.

[0109] Next, the collet part 330 is moved in the positive direction of the X axis to a position below the chuck 361 of the head part 360. Subsequently, the die D is transferred from the collet part 330 to the chuck 361.

[0110] Next, the chuck 361 is lowered, and as shown in Fig. 13(f), the surface Da of the die D held by the chuck 361 is brought into contact with the surface Wa of the wafer W, and the die D is pressed, thereby bonding the die D to the wafer W. Subsequently, the chuck 361 is raised.

[0111] In this manner, the die D is bonded to the wafer W. The process of picking up the die D from the carrier C and bonding the die D to the wafer W is repeated until a plurality of dies D are bonded and mounted on the wafer W, as shown in FIG.

[0112] Next, the wafer W is transferred to the transition device 110 by the transfer device 100, and further transferred to the FOUP Fw by the transfer device 90. In this way, the processing in the second processing system 3 is completed, and the series of die-on wafer manufacturing processes is completed.

[0113] The FOUP into which the wafers W are recovered does not necessarily have to be the same FOUP that housed the wafers W when they were carried in. That is, for example, the FOUPs that housed the wafers W may each carry out different members, or a new FOUP or the like for carrying out the wafers W may be carried into the second processing system 3.

[0114] In a die-on-wafer manufacturing process, different types of dies may be mounted on multiple wafers. Also, multiple types of dies may be mounted on a single wafer. The multiple types of dies may include dies of different sizes. In such cases, the die placement device 60 must replace the release part 220 and the collet part 230 according to the size of the die D. Furthermore, the die bonding device 120 must replace the release part 320, the collet part 330, and the head part 360 according to the size of the die D. The release part 220, the collet part 230, the release part 320, the collet part 330, and the head part 360 correspond to transfer parts in this disclosure.

[0115] Conventionally, such replacement of transfer parts has been performed manually by, for example, an operator. However, when an operator replaces a transfer part, particles are generated, which may contaminate the inside of the die placement apparatus 60 or the die bonding apparatus 120. Furthermore, when an operator replaces a transfer part, it takes time before the operator can start the work, and the work itself also takes time.

[0116] In addition, conventionally, replacement transfer parts have been stored within the die placement device 60 or the die bonding device 120, and the replacement of the transfer parts has been automatically performed within the device. However, when storing transfer parts within the device, the device size is limited, and the storage space is also limited, so there is a limit to the number of transfer parts that can be stored. For this reason, the number of types of die D that can be mounted on a wafer W by automatic operation of the device is limited, and there are cases where the required number of types cannot be met.

[0117] Although Patent Document 1 discloses a die bonding module that picks up a die and bonds it to a substrate, it does not mention or suggest automatic replacement of transfer components of the die bonding module.

[0118] Therefore, in this embodiment, the parts to be transferred are replaced using a transfer device external to the die placement device 60 or the die bonding device 120. Two patterns will be described below: a case where the transfer device 40 inside the first processing system 2 or the transfer device 100 inside the second processing system 3 is used (first embodiment), and a case where the transfer device 500 (described later) outside the first processing system 2 or the transfer device 501 (described later) outside the second processing system 3 is used (second embodiment).

[0119] A method for replacing transfer components according to the first embodiment will be described. In the first embodiment, the transfer component of the die placement device 60, that is, at least one of the release unit 220 and the collet unit 230, is replaced using the transport device 40 inside the first processing system 2. Also, the transfer component of the die bonding device 120, that is, at least one of the release unit 320, the collet unit 330, and the head unit 360, is replaced using the transport device 100 inside the second processing system 3.

[0120] First, a description will be given of a method for replacing the detachment unit 220 and the collet unit 230 of the die placement device 60 in the first processing system 2. As shown in Figures 14 to 17, the transfer arm 41 of the transfer device 40 has a target object holder 400 and a component holder 401.

[0121] 16, the target object holders 400 are provided at, for example, three locations on the first surface 41a of the transfer arm 41. The target object holders 400 are connected to, for example, a vacuum mechanism (not shown), and suction-hold the back surface of the dicing frame F (the surface opposite the holding surface of the die D) and the back surface of the carrier C (the surface opposite the holding layer N) by vacuuming.

[0122] As shown in Fig. 17, the component holder 401 is provided, for example, at one location on the second surface 41b opposite the first surface 41a of the transfer arm 41. As shown in Fig. 14, the component holder 401 is connected, for example, to a vacuum mechanism (not shown) and sucks and holds the upper surface of the release part 220 by vacuuming. Also, as shown in Fig. 15, the component holder 401 sucks and holds the joint 233 of the collet part 230.

[0123] The method of holding release portion 220 and collet member 230 by component holder 401 is not limited to this embodiment. For example, component holder 401 may hold release portion 220 and collet member 230 by sandwiching them. Furthermore, for example, if joint 233 of collet member 230 is made of a magnet, component holder 401 may hold joint 233 by magnetic force.

[0124] Furthermore, the component holding unit 401 may be provided with a component holding unit that holds the release unit 220 and a component holding unit that holds the collet unit 230. Furthermore, the component holding unit 401 may be provided with a component holding unit that holds used release units 220 and collet units 230 and a component holding unit that holds unused release units 220 and collet units 230.

[0125] In this embodiment, the transport arm 41 has the object holder 400 and the component holder 401, but the object holder 400 and the component holder 401 may be provided on separate transport arms. For example, the transport arm 41 may have the object holder 400, and another transport arm (not shown) may have the component holder 401.

[0126] In the first processing system 2, the buffer device 51 stores the replacement release member 220 and the collet member 230. In this case, the buffer device 51 functions as the internal storage device in the present disclosure. The transport device 40 transports the release member 220 and the collet member 230 between the buffer device 51 and the die placement device 60.

[0127] When replacing the detachable part 220, first, the collet part 230 is used to place the used detachable part 220 provided inside the frame holding part 210 on the placement area 211. Next, the transfer arm 41 holding the unused detachable part 220 enters the chamber 61 and places the unused detachable part 220 on the placement area 211. Next, the transfer arm 41 holds the used detachable part 220 and exits the chamber 61. Also, the collet part 230 is used to install the unused detachable part 220 from the placement area 211 on the frame holding part 210. In this way, the replacement of the detachable part 220 is completed.

[0128] The method for replacing the collet member 230 is the same as the method for replacing the detachment member 220. That is, first, the used collet member 230 supported by the support member 241 is placed in the placement area 211. Next, the transfer arm 41 holding the unused collet member 230 enters the chamber 61 and places the unused collet member 230 in the placement area 211. Next, the transfer arm 41 holds the used collet member 230 and exits the chamber 61. Furthermore, the support member 241 supports the unused collet member 230 in the placement area 211. In this way, the replacement of the collet member 230 is completed.

[0129] The method of replacing the detachment part 220 and the collet part 230 is not limited to this embodiment. For example, the transfer arm 41 of the transfer device 40 may be used to directly replace the detachment part 220 relative to the frame holding part 210. In such a case, the transfer arm 41 may have component holding parts 401 in two locations and be configured to hold both a used detachment part 220 and an unused detachment part 220. Similarly, for example, the transfer arm 41 may be used to directly replace the collet part 230 relative to the support part 241, and in such a case, the transfer arm 41 may be configured to hold a used collet part 230 and an unused collet part 230.

[0130] 18 , the detachment part 220 may be replaced using a support wafer Ws as a support body on which the detachment part 220 is supported. The support wafer Ws is configured to be able to support a plurality of detachment parts 220 on its front surface. The buffer device 51 stores the support wafer Ws supporting the detachment parts 220. The transfer device 40 holds the back surface of the support wafer Ws with the target object holding part 400 of the transfer arm 41, and transfers the support wafer Ws between the buffer device 51 and the die placement device 60.

[0131] In such a case, first, transfer arm 41 holding support wafer Ws supporting unused detachment part 220 enters chamber 61. Next, collet part 230 is used to place used detachment part 220 provided inside frame holding part 210 on support wafer Ws, and further collet part 230 is used to install unused detachment part 220 on support wafer Ws onto frame holding part 210. In this way, replacement of detachment part 220 is completed.

[0132] 18 , for example, the collet member 230 may be replaced using a support wafer Ws on which the collet member 230 is supported. In such a case, first, the transfer arm 41 holding the support wafer Ws supporting the unused collet member 230 enters the chamber 61. Next, the support member 241 places the used collet member 230 on the support wafer Ws, and then the support member 241 supports the unused collet member 230 on the support wafer Ws. In this way, the replacement of the collet member 230 is completed.

[0133] The method of storing replacement detachment parts 220 and collet parts 230 is not limited to this embodiment. For example, the detachment parts 220 and collet parts 230 may be stored inside a FOUP (not shown) placed on the FOUP mounting table 20. In such a case, the FOUP containing the detachment parts 220 and collet parts 230 is transported between the first processing system 2 and the outside. This allows for an increase in the types of detachment parts 220 and collet parts 230 that can be stored, improving the flexibility of replacing the detachment parts 220 and collet parts 230.

[0134] 5, a storage area 260 for storing the release unit 220 and the collet unit 230 may be formed inside the die placement device 60. The storage area 260 is formed, for example, in the pickup area 201 of the stage 200, on the positive side of the X-axis of the frame holding unit 210.

[0135] In such a case, first, the transfer arm 41 enters the chamber 61. Next, the transfer arm 41 transfers the used detachable part 220 provided inside the frame holding part 210 to the storage area 260 and places it there. Furthermore, the transfer arm 41 transfers the unused detachable part 220 from the storage area 260 to the frame holding part 210 and places it there. In this way, the replacement of the detachable part 220 is completed.

[0136] Similarly, for example, the transport arm 41 transports and places the used collet member 230 supported by the support member 241 in the storage area 260. Furthermore, the transport arm 41 transports the unused collet member 230 from the storage area 260 to the support member 241, and the support member 241 supports the collet member 230. In this way, the replacement of the collet member 230 is completed.

[0137] Next, a description will be given of a method for replacing the release part 320, the collet part 330, and the head part 360 of the die bonding apparatus 120 in the second processing system 3. The method for replacing the release part 320, the collet part 330, and the head part 360 of the die bonding apparatus 120 is the same as the method for replacing the release part 220 and the collet part 230 of the die placement apparatus 60 described above.

[0138] The transfer arm 101 of the transfer device 100 has a configuration similar to that of the transfer arm 41 of the transfer device 40, and includes a target object holder 400 and a component holder 401. The target object holder 400 holds the back surface of the carrier C (the surface opposite to the holding layer N) and the back surface Wb of the wafer W. The component holder 401 holds the upper surface of the release part 320, the joint 333 of the collet part 330, and the joint 363 of the head part 360. The transfer device 100 then transfers the release part 320, the collet part 330, and the head part 360 to the die bonding device 120.

[0139] The storage method of the release unit 320, the collet unit 330, and the head unit 360 is the same as the storage method of the release unit 220 and the collet unit 230 of the die placement apparatus 60 described above. For example, the release unit 320, the collet unit 330, and the head unit 360 may be stored inside the buffer apparatus 111. In such a case, the buffer apparatus 111 functions as the internal storage apparatus in the present disclosure. Furthermore, for example, the release unit 320, the collet unit 330, and the head unit 360 may be stored inside a FOUP (not shown) placed on the FOUP mounting table 80. Furthermore, for example, as shown in FIG. 9 , the release unit 320 and the collet unit 330 may be stored in a storage area 380 formed on the positive X-axis side of the carrier holding unit 310 in the pickup area 301 of the stage 300. Furthermore, the head unit 360 may be stored in a storage area 381 formed on the positive X-axis side of the wafer holding unit 350 in the bonding area 302.

[0140] The method for replacing the detachment part 320 is the same as the method for replacing the detachment part 220 of the die placement device 60 described above. For example, the transfer device 100 may be used to replace the detachment part 320 via the placement area 311. Alternatively, for example, the transfer device 100 may be used to directly replace the detachment part 320. Furthermore, for example, the support wafer Ws that supports the detachment part 320 may be used to replace the detachment part 320.

[0141] The method of replacing the collet member 330 and the head member 360 is also similar to the method of replacing the collet member 230 of the die placement device 60 described above. For example, the transfer device 100 may be used to replace the collet member 330 and the head member 360 via the placement areas 311, 352. Alternatively, the transfer device 100 may be used to directly replace the collet member 330 and the head member 360. Furthermore, for example, the collet member 330 and the head member 360 may be replaced using a support wafer Ws that supports the collet member 330 and the head member 360.

[0142] A method for replacing transfer components according to the second embodiment will be described. In the second embodiment, as shown in Fig. 19, a first transfer device 500 external to the first processing system 2 is used to replace at least one of the release unit 220 and the collet unit 230, which are transfer components of the die placement device 60. Also, a second transfer device 501 external to the second processing system 3 is used to replace at least one of the release unit 320, the collet unit 330, and the head unit 360, which are transfer components of the die bonding device 120.

[0143] The processing system 1 has a first storage 510 that stores a first transfer device 500 and a second storage 511 that stores a second transfer device 501. The first storage 510 and the second storage 511 are provided outside the first processing system 2 and the second processing system 3, respectively. The first transfer device 500 is self-propelled and travels between the first processing system 2 and the first storage 510. A shutter 63 that opens and closes an entrance for parts to be transferred is provided on the side of the chamber 61 of the die placement device 60 opposite the transfer device 40. With the shutter 63 open, the first transfer device 500 can move forward and backward inside the die placement device 60. The second transfer device 501 is also self-propelled and travels between the second processing system 3 and the second storage 511. In the chamber 121 of the die bonding device 120, a shutter 123 for opening and closing the loading / unloading port for the parts to be transferred is provided on the side opposite the conveying device 100, and when the shutter 123 is open, the second conveying device 501 can move forward and backward inside the die bonding device 120.

[0144] First, a description will be given of a method for replacing the detachment unit 220 and the collet unit 230 of the die placement device 60 in the first processing system 2. As shown in Figures 20 to 22, the first transfer device 500 has a first finger 520, a second finger 521, an arm 522, a carriage unit 523, a traveling mechanism 524, a finger storage unit 525, and a part storage unit 526.

[0145] 21 , the first finger 520 has a support portion 530 and two component holders 531. The support portion 530 is detachable from the arm 522 and is replaceable. The two component holders 531 are supported by the support portion 530 and connected to, for example, a vacuum mechanism (not shown). One of the component holders 531 suction-holds the top surface of a used detachment portion 220 by vacuuming it, and the other component holder 531 suction-holds the top surface of an unused detachment portion 220 by vacuuming it.

[0146] 22 , second finger 521 has a support portion 540 and two component holders 541. Support portion 540 is detachable from arm 522 and is replaceable. Two component holders 541 are supported by support portion 540 and connected to, for example, a vacuum mechanism (not shown). One component holder 541 suction-holds joint 233 of a used collet member 230 by vacuuming, while the other component holder 541 suction-holds the upper surface of joint 233 of an unused collet member 230 by vacuuming.

[0147] The method of holding the release portion 220 and the collet portion 230 by the first finger 520 and the second finger 521 is not limited to this embodiment. For example, the first finger 520 and the second finger 521 may hold the release portion 220 and the collet portion 230 by sandwiching them therebetween. Furthermore, for example, if the joint 233 of the collet portion 230 is made of a magnet, the second finger 521 may hold the joint 233 by magnetic force.

[0148] The first finger 520 and the second finger 521 may be shared to hold the release portion 220 and the collet portion 230. Furthermore, the two component holders 531 in the first finger 520 may be shared to hold a used release portion 220 and an unused release portion 220. Similarly, the two component holders 541 in the second finger 521 may be shared to hold a used collet portion 230 and an unused collet portion 230.

[0149] 20 , arm 522 is an articulated arm having, for example, a six-axis structure. Arm 522 is configured to be able to access finger storage unit 525 and to be able to interchange first finger 520 and second finger 521 at the tip. Arm 522 is also configured to be able to access part storage unit 526 and to be able to hold release member 220 or collet member 230 using first finger 520 or second finger 521.

[0150] The cart section 523 supports the arm 522, the finger storage section 525 and the part storage section 526 on its upper surface.

[0151] The traveling mechanism 524 is a self-propelled robot that supports the carriage part 523 and allows it to travel.

[0152] The finger storage unit 525 stores the first finger 520 or the second finger 521. That is, when the first finger 520 is attached to the arm 522, the finger storage unit 525 stores the second finger 521. When the second finger 521 is attached to the arm 522, the finger storage unit 525 stores the first finger 520.

[0153] The parts storage section 526 stores replacement release parts 220 and collet parts 230 .

[0154] When replacing the detachable part 220, first, the first finger 520 holding an unused detachable part 220 enters the chamber 61. Next, the first finger 520 holds the used detachable part 220 provided inside the frame holding part 210. Next, the first finger 520 installs the unused detachable part 220 in the frame holding part 210. In this way, replacement of the detachable part 220 is completed.

[0155] The method for replacing the collet member 230 is the same as the method for replacing the detachment member 220. That is, first, the second finger 521 holding the unused collet member 230 enters the chamber 61. Next, the second finger 521 holds the used collet member 230 supported by the support member 241. Subsequently, the support member 241 receives and supports the unused collet member 230 from the second finger 521. In this way, replacement of the collet member 230 is completed.

[0156] The method of replacing the detachment part 220 and the collet part 230 is not limited to this embodiment. For example, the detachment part 220 may be replaced using the placement area 211. In this case, first, the collet part 230 is used to place a used detachment part 220 provided inside the frame holding part 210 on the placement area 211. Next, the first finger 520 holding an unused detachment part 220 enters the chamber 61 and places the unused detachment part 220 on the placement area 211. Next, the first finger 520 holds the used detachment part 220 and exits the chamber 61. Furthermore, the collet part 230 is used to install the unused detachment part 220 from the placement area 211 on the frame holding part 210. In this manner, replacement of the detachment part 220 is completed.

[0157] The method for replacing the collet part 230 is the same as the method for replacing the detachment part 220. That is, first, the used collet part 230 supported by the support part 241 is placed in the placement area 211. Next, the first finger 520 holding the unused collet part 230 enters the chamber 61 and places the unused collet part 230 in the placement area 211. Next, the first finger 520 holds the used collet part 230 and exits the chamber 61. Furthermore, the support part 241 supports the unused collet part 230 in the placement area 211. In this way, the replacement of the collet part 230 is completed.

[0158] The method for storing the replacement release part 220 and collet part 230 is not limited to this embodiment. For example, the above-mentioned storage area 260 formed inside the die placement device 60 as shown in FIG. 5 may be used. In this case, first, the first finger 520 enters the chamber 61. Next, the first finger 520 transports the used release part 220 provided inside the frame holding part 210 to the storage area 260 and places it there. The first finger 520 then transports the unused release part 220 from the storage area 260 to the frame holding part 210 and places it there. In this way, the replacement of the release part 220 is completed.

[0159] Similarly, for example, second finger 521 transports and places used collet member 230 supported by support member 241 in storage area 260. Furthermore, second finger 521 transports unused collet member 230 from storage area 260 to support member 241, and support member 241 supports collet member 230. In this way, replacement of collet member 230 is completed.

[0160] 19 , the processing system 1 may have a first external storage device 550 that stores the replacement detachment part 220 and collet part 230. The first external storage device 550 is provided outside the first processing system 2. The first transfer device 500 travels between the first processing system 2 and the first external storage device 550.

[0161] Next, a description will be given of a method for replacing the release part 320, the collet part 330, and the head part 360 of the die bonding apparatus 120 in the second processing system 3. The method for replacing the release part 320, the collet part 330, and the head part 360 of the die bonding apparatus 120 is the same as the method for replacing the release part 220 and the collet part 230 of the die placement apparatus 60 described above.

[0162] The second transfer device 501 has a configuration similar to that of the first transfer device 500, and includes a first finger 520, a second finger 521, an arm 522, a carriage unit 523, a traveling mechanism 524, a finger storage unit 525, and a component storage unit 526. The first finger 520 holds the upper surface of the release unit 320. The second finger 521 holds the joint 333 of the collet unit 330 and the joint 363 of the head unit 360. The second transfer device 501 may also include a third finger (not shown), in which the second finger 521 holds the joint 333 of the collet unit 330 and the third finger holds the joint 363 of the head unit 360. The second transfer device 501 then transports the release unit 320, the collet unit 330, and the head unit 360 to the die bonding device 120.

[0163] The storage method of the release unit 320, the collet unit 330, and the head unit 360 is the same as the storage method of the release unit 220 and the collet unit 230 of the die placement device 60 described above. For example, the release unit 320, the collet unit 330, and the head unit 360 may be stored inside the component storage unit 526. Alternatively, for example, as shown in FIG. 9 , the release unit 320 and the collet unit 330 may be stored in a storage area 380 formed on the X-axis positive side of the carrier holding unit 310 in the pickup area 301 of the stage 300. Alternatively, the head unit 360 may be stored in a storage area 381 formed on the X-axis positive side of the wafer holding unit 350 in the bonding area 302. Furthermore, for example, as shown in FIG. 19 , the release unit 320, the collet unit 330, and the head unit 360 may be stored inside a second external storage device 551 provided outside the second processing system 3.

[0164] The method for replacing the detachment unit 320 is the same as the method for replacing the detachment unit 220 of the die placement device 60 described above. For example, the detachment unit 320 may be replaced directly using the second conveying device 501. Alternatively, for example, the detachment unit 320 may be replaced via the placement area 311 using the second conveying device 501.

[0165] The method for replacing the collet member 330 and the head member 360 is also the same as the method for replacing the collet member 230 of the die placement device 60 described above. For example, the collet member 330 and the head member 360 may be replaced directly using the second conveying device 501. Alternatively, for example, the collet member 330 and the head member 360 may be replaced via the placement areas 311 and 352 using the second conveying device 501.

[0166] In the second embodiment, the first conveying device 500 and the second conveying device 501 are provided separately, but these conveying devices may be shared. Also, the first storage 510 and the second storage 511 may be shared. By reducing the number of conveying devices and storages installed in this way, the cost of the device can be reduced.

[0167] According to the first embodiment, the release unit 220 and the collet unit 230 can be replaced using the transport device 40, and the release unit 320, the collet unit 330, and the head unit 360 can be replaced using the transport device 100. According to the second embodiment, the release unit 220 and the collet unit 230 can be replaced using the first transport device 500, and the release unit 320, the collet unit 330, and the head unit 360 can be replaced using the second transport device 501. Therefore, in both the first and second embodiments, the replacement of transfer components can be performed automatically. This reduces particle generation inside the die placement device 60 and the die bonding device 120, thereby maintaining the interior cleanliness compared to when an operator manually replaces transfer components. Furthermore, the work time can be reduced compared to when an operator manually replaces transfer components. Furthermore, even when the number of die D varieties increases, transfer components can be replaced according to the die D. Therefore, the replacement of transfer components can be performed efficiently in the die-on-wafer manufacturing process.

[0168] Furthermore, in the first embodiment, the transfer device 40 inside the first processing system 2 holds the dicing frame F and the carrier C in the object holding unit 400, and holds the release unit 220 and the collet unit 230 in the component holding unit 401. Similarly, the transfer device 100 of the second processing system 3 holds the carrier C and the wafer W in the object holding unit 400, and holds the release unit 320, the collet unit 330, and the head unit 360 in the component holding unit 401. In this way, the transfer devices 40 and 100 each transport the object and also transport the components to be transferred, resulting in high transport efficiency.

[0169] Furthermore, in the first embodiment, since transfer parts can be replaced inside the first processing system 2, particles do not enter from the outside of the die placement apparatus 60, and the inside of the die placement apparatus 60 can be kept clean. Similarly, since transfer parts can be replaced inside the second processing system 3, particles do not enter from the outside of the die bonding apparatus 120, and the inside of the die bonding apparatus 120 can be kept clean.

[0170] In the above embodiment, the first processing system 2 places the multiple dies D held on the dicing tape T on the carrier C, and the second processing system 3 bonds and mounts the multiple dies D held on the carrier C to the wafer W. However, the multiple dies D held on the dicing tape T may also be directly bonded and mounted to the wafer W. In such a case, the carrier C is omitted, and the first processing system 2 is omitted from the processing system 1. Furthermore, in the second processing system 3, a dicing frame F and a dicing tape T are transported and processed instead of the carrier C. Even when multiple dies D are directly mounted from the dicing tape T to the wafer W in this manner, the method of replacing transfer components of the die bonding apparatus 120 disclosed herein can be applied.

[0171] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0172] Furthermore, the effects described in this specification are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0173] REFERENCE SIGNS LIST 1 Processing system 2 First processing system 3 Second processing system 40 Transfer device 60 Die placement device 100 Transfer device 120 Die bonding device 220 Removal section 230 Collet section 320 Removal section 330 Collet section 360 Head section 500 First transfer device 501 Second transfer device C Carrier D Die F Dicing frame T Dicing tape W Wafer

Claims

1. A processing system for processing a plurality of dies, comprising: a transfer device having transfer parts for transferring the plurality of dies held on a first object to a second object; and a transport device provided outside the transfer device for transporting the transfer parts in the transfer device.

2. The processing system according to claim 1, wherein the transport device transports the first object and the second object to the transfer device.

3. The processing system according to claim 2, wherein the transport device has an object holder that holds the first object and the second object, and a component holder that holds the component to be transferred.

4. The processing system according to claim 2, wherein the transfer device has a support part that supports the part to be transferred, and the transport device transports the part to be transferred relative to the support part for replacement.

5. The processing system according to claim 4, wherein the transfer device has a storage area for storing the parts to be transferred, and the transport device transports the parts to be transferred between the storage area and the support section.

6. The processing system according to claim 2, wherein the transfer device has a placement area for temporarily placing the parts to be transferred, and the transport device transports the parts to the placement area.

7. The processing system according to claim 2, wherein the transfer part is supported by a support, and the transport device transports the support that supports the transfer part.

8. The processing system according to claim 2, further comprising an internal storage device for storing the parts to be transferred, and the transport device transports the parts to be transferred between the internal storage device and the transfer device.

9. The processing system of claim 1, further comprising a transfer system having the transfer device and an object transport device that transports the first object and the second object to the transfer device, wherein the transport device is provided outside the transfer system.

10. The processing system according to claim 9, wherein the transfer device has a support part that supports the part to be transferred, and the transport device transports the part to be transferred relative to the support part for replacement.

11. The processing system according to claim 10, wherein the transfer device has a storage area for storing the parts to be transferred, and the transport device transports the parts to be transferred between the storage area and the support section.

12. The processing system according to claim 9, wherein the transfer device has a placement area for temporarily placing the parts to be transferred, and the transport device transports the parts to the placement area.

13. The processing system according to claim 9, wherein the transport device has a storage section for storing the parts to be transferred.

14. The processing system according to claim 9, further comprising an external storage device provided outside the transfer system for storing the parts to be transferred, and the transport device transports the parts to be transferred between the external storage device and the transfer device.

15. A processing system according to any one of claims 1 to 14, wherein the transfer device is a die placement device that places a plurality of the dies on the second object, the transfer parts include a removal section that removes the die from the first object, and a collet section that picks up the die from the first object and places it on the second object, and the transport device transports at least one of the removal section and the collet section.

16. The processing system described in any one of claims 1 to 14, wherein the transfer device is a die bonding device that bonds a plurality of the dies to the second object, the transfer parts include a detachment section that detaches the die from the first object, a collet section that picks up the die from the first object, and a head section that receives the die from the collet section and bonds the die to the second object, and the transport device transports at least one of the detachment section, the collet section, and the head section.

17. A processing method for processing a plurality of dies, comprising: transferring the plurality of dies held on a first object to a second object using transfer parts in a transfer device; transporting the transfer parts using a transport device provided outside the transfer device; and replacing the transfer parts in the transfer device.

18. The processing method according to claim 17, further comprising using the transport device to transport the first object and the second object to the transfer device.

19. The processing method described in claim 17, comprising transporting the first object and the second object to the transfer device using an object transport device, wherein the transport device is provided outside a transfer system having the transfer device and the object transport device.

20. A transport device that transports transfer parts provided inside a transfer device, wherein the transfer parts are parts used to transfer a plurality of dies held on a first object to a second object, and the transport device is provided outside the transfer device and transports the transfer parts in the transfer device.

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