Electronic device including sealer

Abstract

The present invention relates to a foldable electronic device comprising: a foldable housing including a first and a second housing; a hinge allowing the first housing and the second housing to be rotatably coupled to each other; a flexible circuit board including first and second portions extending across the hinge in a first direction so as to be connected to circuits inside the first and second housings, each of the first and second portions including at least one signal line; and a sealer fastened between the flexible circuit board and a portion of a support member inside the first housing, wherein the first and second portions are arranged side by side in a second direction perpendicular to the first direction, the thickness of the second portion smaller than the thickness of the first portion is configured to be compressed, the sealer includes a first sealing portion pressing the first portion and a second sealing portion pressing the second portion, and the thickness of the second sealing portion is greater than the thickness of the first sealing portion.

Description

Electronic devices containing sealers

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including a sealer.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0004] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0006] According to one embodiment of the present disclosure, a foldable electronic device may include a foldable housing including a first housing and a second housing, a hinge for rotatably coupling the first housing and the second housing, a flexible circuit board extending across the hinge in a first direction to be connected to a first circuit within the first housing and a second circuit within the second housing, the flexible circuit board including a first portion including at least one signal line and a second portion including at least one signal line, and a sealer fastened between the flexible circuit board and a portion of a support member within the first housing, the sealer configured to prevent moisture from penetrating into the first housing. The first and second portions of the flexible circuit board may be arranged side by side in a second direction perpendicular to the first direction, and the second portion may have a second thickness that is smaller than a first thickness of the first portion, or may be configured to be compressed to a second thickness that is smaller than the first thickness. The sealer includes a first sealing portion that presses the first portion of the flexible circuit board and a second sealing portion that presses the second portion of the flexible circuit board, and the second sealing portion may have a thickness greater than that of the first sealing portion.

[0007] An electronic device according to one embodiment of the present disclosure includes a housing; a flexible circuit board configured to be deformable; and a sealer disposed between the flexible circuit board and the housing, wherein the flexible circuit board includes a first portion having a first thickness and configured to transmit a first signal; and a second portion having a second thickness smaller than the first thickness and configured to transmit a second signal, wherein the sealer may include a first sealing portion disposed at a position corresponding to the first portion and having a third thickness; and a second sealing portion disposed at a position corresponding to the second portion and having a fourth thickness larger than the third thickness.

[0008] An electronic device according to one embodiment of the present disclosure comprises a housing including a support portion; a sealer spaced apart from the support portion; and a flexible circuit board disposed between the support portion and the sealer, wherein the flexible circuit board comprises a first portion having a first thickness and configured to process data; and a second portion having a second thickness smaller than the first thickness and configured to transmit a signal, wherein the support portion may include a first support portion disposed corresponding to the first portion and having a third thickness; and a second support portion disposed corresponding to the second portion and having a fourth thickness larger than the third thickness.

[0009] An electronic device according to one embodiment of the present disclosure includes a housing; a flexible circuit board configured to be deformable; and a sealer disposed between the flexible circuit board and the housing, wherein the flexible circuit board includes a first portion having a first thickness and configured to process data; and a second portion having a second thickness smaller than the first thickness and configured to transmit a signal, wherein the sealer may include a first sealing portion disposed corresponding to the first portion and having a first modulus; and a second sealing portion disposed corresponding to the second portion and having a second modulus larger than the first modulus.

[0010] An electronic device according to one embodiment of the present disclosure comprises: a housing; a flexible circuit board configured to be deformable; a support member disposed within the housing; and a sealer disposed between the flexible circuit board and a portion of the support member, wherein the flexible circuit board comprises: a first portion configured to transmit a first signal and having a first thickness; and a second portion configured to transmit a second signal, wherein the second portion has a second thickness smaller than the first portion or can be compressed to a second thickness smaller than the first thickness, and the sealer may include: a first sealing portion disposed at a position corresponding to the first portion and having a third thickness; and a second sealing portion disposed at a position corresponding to the second portion and having a fourth thickness larger than the third thickness.

[0011] An electronic device according to one embodiment of the present disclosure comprises: a housing; a flexible circuit board configured to be deformable; a support member disposed within the housing; and a sealer disposed between the flexible circuit board and a portion of the support member, wherein the flexible circuit board comprises: a first portion configured to transmit a first signal and having a first thickness; and a second portion configured to transmit a second signal, the second portion having a second thickness smaller than the first thickness, and the sealer may include: a first sealing portion disposed to correspond to the first portion and having a first elastic modulus; and a second sealing portion disposed to correspond to the second portion and having a second elastic modulus larger than the first elastic modulus.

[0012] An electronic device according to one embodiment of the present disclosure comprises: a housing; a flexible printed circuit board configured to be changeable; a support member disposed within the housing, the support member including a first support portion and a second support portion; and a sealer disposed between the flexible printed circuit board and the first portion of the support member, wherein the flexible printed circuit board includes: a first portion configured to transmit a first signal with a first thickness; and a second portion configured to transmit a second signal, the second portion having a second thickness smaller than the first thickness, and the second support portion may include: a first region disposed at a position corresponding to the first portion and having a third thickness; and a second region disposed at a position corresponding to the second portion and having a fourth thickness larger than the third thickness.

[0013] An electronic device according to one embodiment of the present disclosure comprises: a housing; a flexible circuit board configured to be changeable; a support member disposed within the housing; and a sealer disposed between the flexible circuit board and a first portion of the support member, wherein the flexible circuit board comprises: a first portion configured to transmit a first signal and having a first thickness; and a second portion configured to transmit a second signal, the second portion having a second thickness smaller than the first thickness, and at least one of the sealer or the second portion of the support member comprises: a first surface configured to be aligned with or in contact with the first portion of the flexible circuit board; and a second surface configured to be aligned with or in contact with the second portion of the flexible circuit board, wherein the second surface can be offset from the first surface.

[0014] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0015] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0016] FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 3 is a front view, a side view, and a rear view of a folded state of an electronic device according to an embodiment of the present disclosure.

[0018] FIG. 4 is an exploded perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0019] FIG. 5 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 6 is a part of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 7 is a portion of a flexible circuit board according to one embodiment of the present disclosure.

[0022] FIG. 8 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0023] Figure 9 is an exploded view of the structure shown in Figure 8.

[0024] FIG. 10 is a conceptual diagram of a portion of a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 11a is a conceptual diagram of a cross-section of a flexible circuit board according to one embodiment of the present disclosure.

[0026] FIG. 11b is a conceptual diagram of a cross-section of a flexible circuit board according to one embodiment of the present disclosure.

[0027] FIG. 11c is a conceptual diagram of a cross-section of a flexible circuit board according to one embodiment of the present disclosure.

[0028] Figure 12 is an enlarged view of a portion of the structure illustrated in Figure 5.

[0029] FIG. 13 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 14 is an exploded view of a portion of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 15 is an exploded view of a portion of an electronic device according to one embodiment of the present disclosure.

[0032] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0033] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0034] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0059] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0060] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0062] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0063] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0064] FIG. 2 illustrates a front view, a side view, and a rear view of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 illustrates a front view, a side view, and a rear view of an electronic device (101) in a folded state according to one embodiment of the present disclosure.

[0065] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a first housing (210), a second housing (220), a flexible or foldable display (230) (hereinafter, simply referred to as “the first display (230)”) disposed in the first housing (210) and the second housing (220) (e.g., the display module (160) of FIG. 1), and a hinge cover (260). The electronic device (101) may include a housing (201). The housing (201) may include a first housing (210) and a second housing (220).

[0066] According to one embodiment, a surface on which the first display (230) is disposed may be defined as a front surface of the electronic device (101). The front surface of the electronic device (101) may be formed by a front plate (e.g., a glass plate or a polymer plate including various coating layers) having at least a portion that is substantially transparent. In addition, a surface opposite to the front surface may be defined as a rear surface of the electronic device (101). The rear surface of the electronic device (101) may be formed by a substantially opaque rear plate (hereinafter referred to as a “rear cover”). The rear cover may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device (101). The side surface may be formed by a side bezel structure (or “side member”) that is coupled to the front plate and the rear cover and includes a metal and / or a polymer. In some embodiments, the rear cover and side bezel structures may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0067] The electronic device (101) may include at least one of a first display (230), an audio module (241, 243, 245), a sensor module (255), a camera module (253), a key input device (211, 212, 213), and a connector hole (214). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (211, 212, 213)) or additionally include another component (e.g., a light-emitting element).

[0068] According to one embodiment of the present disclosure, the first display (230) may be a display in which at least a portion of the display area can be transformed into a flat or curved surface. According to one embodiment, the first display (230) may include a folding area (231c), a first area (231a) disposed on one side (e.g., the upper side of the folding area (231c) illustrated in FIG. 2) with respect to the folding area (231c), and a second area (231b) disposed on the other side (e.g., the lower side of the folding area (231c) illustrated in FIG. 2). However, the division of the areas of the first display (230) illustrated in FIG. 2 is exemplary, and the first display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the areas of the first display (230) may be divided by the folding area (231c) or the folding axis (A), but in other embodiments, the first display (230) may be divided by the areas based on another folding area (231c) or another folding axis (e.g., a folding axis perpendicular to the folding axis (A)). The first area (231a) may be arranged in the first housing (210). The second area (231b) may be arranged in the second housing (220).

[0069] According to one embodiment of the present disclosure, a microphone hole (241) may be arranged inside a microphone for acquiring external sound, and in some embodiments, a plurality of microphones may be arranged to detect the direction of the sound.

[0070] According to one embodiment of the present disclosure, the speaker holes (243, 245) may include an external speaker hole (243) and a call receiver hole (245). In some embodiments, the speaker holes (243, 245) and the microphone hole (241) may be implemented as a single hole, or a speaker may be included without the speaker hole (243, 245) (e.g., a piezo speaker). The positions and numbers of the microphone hole (241) and the speaker holes (243, 245) may vary depending on the embodiment.

[0071] According to one embodiment of the present disclosure, the camera module (253) may include a first camera device (251) disposed on a first surface (210a) of a first housing (210) of the electronic device (101), and a second camera device (253) disposed on a second surface (210b). In addition, the electronic device (101) may further include a flash (not shown). The camera devices (251, 253) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp.

[0072] According to one embodiment of the present disclosure, the sensor module (255) may generate an electric signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. Although not illustrated in the drawing, the electronic device (101) may additionally or alternatively include another sensor module (e.g., the sensor module (176) of FIG. 1) in addition to the sensor module (255) provided on the second surface (210b) of the first housing (210). The electronic device (101) may include, as a sensor module, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, for example.

[0073] According to one embodiment of the present disclosure, the key input devices (211, 212, 213) may be disposed on a side of a foldable housing (e.g., hinge cover (260), first housing (210), and / or second housing (220)). In another embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (211, 212, 213), and the key input devices that are not included may be implemented in another form, such as soft keys, on the first display (230). In some embodiments, the key input devices may be configured such that key input is implemented by a sensor module (e.g., gesture sensor).

[0074] According to one embodiment of the present disclosure, the connector hole (214) may be configured to accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, or, additionally or alternatively, a connector for transmitting and receiving audio signals to and from an external electronic device.

[0075] According to one embodiment of the present disclosure, a foldable housing may be implemented by combining a first housing (210), a second housing (220), a first back cover (240, back cover), a second back cover (250, back cover) and / or a hinge module (e.g., a hinge structure (270) of FIG. 4 described below). The foldable housing of the electronic device (101) is not limited to the shape and combination illustrated in FIG. 2, and may be implemented by combining and / or combining other shapes or parts. For example, in another embodiment, the first housing (210) and the first back cover (240) may be formed integrally, and the second housing (220) and the second back cover (250) may be formed integrally. According to one embodiment of the present disclosure disclosed in this document, the term 'housing' may mean a combination and / or combined configuration of various other parts that are not mentioned. For example, the first area (231a) of the first display (230) may be described as forming one side of the first housing (210), and in another embodiment, the first area (231a) of the first display (230) may be described as being arranged or attached to one side of the first housing (210).

[0076] According to one embodiment of the present disclosure, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and may include a first side (210a) facing a first direction and a second side (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and includes a third side (220a) facing a third direction and a fourth side (220b) facing a fourth direction opposite to the third direction, and may rotate or pivot with respect to the first housing (210) about the hinge structure (or folding axis (A)).

[0077] According to one embodiment of the present disclosure, the first housing (210) and the second housing (220) may be arranged on both sides (or upper / lower sides) with respect to the folding axis (A). The angle or distance at which the first housing (210) and the second housing (220) intersect each other may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state.

[0078] According to one embodiment of the present disclosure, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic material or a non-metallic material having a rigidity of a size selected to support the first display (230). At least a portion formed of the metallic material may serve as a ground plane or a radiating conductor of the electronic device (101), and when served as a ground plane, may be electrically connected to a ground line formed on a printed circuit board (e.g., printed circuit boards 216 and 226 of FIG. 4).

[0079] According to one embodiment of the present disclosure, a first rear cover (240) is disposed on one side (e.g., the upper side in FIG. 2) of the folding axis (A) on the rear side of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing (210) (and / or a side bezel structure). Similarly, a second rear cover (250) is disposed on the other side (e.g., the lower side in FIG. 2) of the folding axis (A) on the rear side of the electronic device (101) and may have its periphery wrapped by the second housing (220) (and / or a side bezel structure).

[0080] According to one embodiment of the present disclosure, the first rear cover (240) and the second rear cover (250) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (240) and the second rear cover (250) do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device (101) may include the first rear cover (240) and the second rear cover (250) of various shapes. In yet another embodiment, the first rear cover (240) may be formed integrally with the first housing (210), and the second rear cover (250) may be formed integrally with the second housing (220).

[0081] According to one embodiment of the present disclosure, the first rear cover (240), the second rear cover (250), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (101) (e.g., the printed circuit boards (216, 226) or the batteries (215, 225) of FIG. 4) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the second display (239) may be visually exposed through the first rear cover (240). In another embodiment, one or more components or sensors may be visually exposed through the first rear cover (240). In various embodiments, the components or sensors may include a proximity sensor, a rear camera, and / or a flash. In addition, although not shown separately in the drawing, one or more components or sensors may be visually exposed through the second rear cover (250).

[0082] According to one embodiment of the present disclosure, a front camera (251) exposed on the front side of the electronic device (101) through one or more openings or a rear camera (253) exposed through the first rear cover (240) may include one or more lenses, an image sensor, and / or an image signal processor. A flash (not shown) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0083] According to one embodiment of the present disclosure, the foldable housing (210, 220, 260) may include a hinge cover (260), a first housing (210), and a second housing (220). The first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270). When the electronic device (101) is changed from an unfolded state to a folded state, the first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270) to bring them closer to each other. When the electronic device (101) is changed from a folded state to an unfolded state, a portion of the first housing (210) and a portion of the second housing (220) may be rotated with respect to the hinge cover (260) to move away from each other. According to one embodiment of the present disclosure, the folding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and / or the second housing (220) transitions from an unfolded state to a folded state. The unfolding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and / or the second housing (220) transitions from a folded state to an unfolded state.

[0084] According to one embodiment of the present disclosure, the electronic device (101) can be configured to have a folded state of the first display (230) or an unfolded state of the first display (230). For example, the first housing (210) and the second housing (220) can rotate about the folding axis (A) between a folded state in which the first region (231a) and the second region (231b) of the first display (230) face each other, and a state in which the first display (230) is unfolded by a specified angle from the folded state (e.g., the unfolded state of the electronic device (101) illustrated in FIG. 2).

[0085] According to one embodiment of the present disclosure, as the first housing (210) and the second housing (220) rotate about the folding axis (A), the electronic device (101) may include a folded state and an unfolded state. The folded state may be a state in which the first housing (210) and the second housing (220) face each other, and an angle formed by the first housing (210) and the second housing (220) may be less than a predetermined angle (e.g., 10 degrees). The unfolded state may be a state in which the electronic device (101) is fully unfolded or partially unfolded, and an angle formed by the first housing (210) and the second housing (220) may be greater than or equal to the predetermined angle.

[0086] Fig. 2 illustrates an unfolded state of the electronic device (101) in which the first housing (210) and the second housing (220) form an angle of approximately 180°. Fig. 3 illustrates a folded state of the electronic device (101) in which the first housing (210) and the second housing (220) are positioned parallel to each other and facing each other. In the folded state, the first region (231a) and the second region (231b) of the first display (230) can be positioned to face each other, and the folding region (231c) can be bent.

[0087] According to one embodiment of the present disclosure, folding of the electronic device (101) can be implemented in two ways: 'in-folding', in which the first region (231a) and the second region (231b) are folded to face each other, and 'out-folding', in which the first region (231a) and the second region (231b) are folded to face opposite directions. For example, in a folded state in the in-folding manner, the first region (231a) and the second region (231b) can be substantially concealed, and in a fully unfolded state, the first region (231a) and the second region (231b) can be arranged to face substantially the same direction. For example, in the folded state in an out-folding manner, the first region (231a) and the second region (231b) may be arranged facing in opposite directions and exposed to the outside, and in the fully unfolded state, the first region (231a) and the second region (231b) may be arranged facing in substantially the same direction.

[0088] According to one embodiment of the present disclosure, the first display (230) may include a display panel (not shown) and a window member (not shown), and at least a portion of which may be formed to be flexible. Although not separately illustrated, it will be readily understood by those skilled in the art that the first display (230) or the display panel includes various layers, such as a light-emitting layer, a substrate(s) encapsulating the light-emitting layer, an electrode or wiring layer, and / or an adhesive layer(s) bonding adjacent different layers. When the first display (230) (e.g., the folding area (231c)) is deformed into a flat shape and a curved shape, a relative displacement may occur between the layers forming the first display (230). The relative displacement due to the deformation of the first display (203) may increase as the point is further from the folding axis (A) and / or as the thickness of the first display (230) increases.

[0089] According to one embodiment of the present disclosure, a window member, for example, a thin film plate, may function as a protective film for protecting a display panel. As a protective film, the thin film plate may be made of a material that protects the display panel from external impact, is scratch-resistant, and reduces wrinkles in the folding area (231c) even during repeated folding and unfolding operations of the housings (210, 220). For example, the material of the thin film plate may include a transparent polyimide film (CPI) or an ultra-thin glass (UTG).

[0090] According to one embodiment of the present disclosure, the electronic device (101) may further include a protective member (206)(s) or a decorative cover (218, 228)(s) disposed on at least a portion of an edge of the first display (230) on the front surface (e.g., the first side (210a) or the third side (220a)). As an example, the protective member (206) and the decorative cover (218, 228) may be connected to each other to surround an edge of the first display (230). The protective member (206) or the decorative cover (218, 228) may prevent at least a portion of an edge of the first display (230) from contacting a mechanical structure (e.g., the first housing (210) or the second housing (220)). The protective member (206) or the decorative cover (218, 228) may be visually exposed to the outside of the electronic device (101).

[0091] According to one embodiment of the present disclosure, the decorative covers (218, 228) and the protective member (206) may be connected to each other. As an example, the decorative covers (218, 228) and the protective member (206) may be formed integrally. The decorative covers (218, 228) may extend along the folding axis (A). The decorative covers (218, 228) may include a first decorative cover (218) disposed between a portion of an edge of a first area (231a) of the first display (230) and an inner wall of the first housing (210). The decorative covers (218, 228) may include a second decorative cover (228) disposed between a portion of an edge of a second area (231b) of the first display (230) and an inner wall of the second housing (220). As an example, the first decorative cover (218) and the second decorative cover (228) can extend substantially parallel along the folding axis (A).

[0092] According to one embodiment of the present disclosure, a speaker hole (245) may be formed in a decorative cover (218) or a protective member (206) interposed between an edge of a first area (231a) of a first display (230) and an inner wall of a first housing (210). As an example, the speaker hole (245) may be formed in the first decorative cover (218).

[0093] FIG. 4 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0094] The description of the first housing (210) and the second housing (220) described with reference to FIGS. 2 and 3 can be equally applied to the first housing (210) and the second housing (220) of the same name, which are illustrated in FIG. 4.

[0095] According to one embodiment, the first display (230) may be visually exposed through a significant portion of the front surface of the electronic device (101). In some embodiments, the shape of the first display (230) may be formed to be substantially identical to the outer shape of the front surface of the electronic device (101).

[0096] In FIG. 4, 'Y' may mean the longitudinal direction of the electronic device (101) in the second state. In addition, in one embodiment of the present invention, '+Y' may mean the upward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101), and '-Y' may mean the downward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101).

[0097] According to one embodiment of the present disclosure, a foldable housing of an electronic device (101) may include a first housing (210) and a second housing (220). According to one embodiment, the first housing (210) may include a first surface (210a) and a second surface (210b) facing in an opposite direction to the first surface (210a), and the second housing (220) may include a third surface (220a) and a fourth surface (220b) facing in an opposite direction to the third surface (220a). The electronic device (101) or the foldable housing (210, 220, 260) may additionally or alternatively include a bracket assembly (217, 227). The bracket assembly (217, 227) may include a first bracket assembly (217) disposed in a first housing (210) and a second bracket assembly (227) disposed in a second housing (220). At least a portion of the bracket assembly (217, 227), for example, at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227), may serve as a plate for supporting the hinge structure (270).

[0098] According to one embodiment of the present disclosure, various electrical components may be arranged on the printed circuit board (216, 226). For example, the printed circuit board (216, 226) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0099] According to one embodiment of the present disclosure, the printed circuit board (216, 226) may include a first printed circuit board (216) disposed on the side of the first bracket assembly (217) and a second printed circuit board (226) disposed on the side of the second bracket assembly (227). The first printed circuit board (216) and the second printed circuit board (226) may be disposed inside a space formed by the foldable housing (210, 220, 260), the bracket assembly (217, 227), the first rear cover (240) and / or the second rear cover (250). Components for implementing various functions of the electronic device (101) may be separately disposed on the first printed circuit board (216) and the second printed circuit board (226). For example, a processor may be placed on a first printed circuit board (216), and an audio interface may be placed on a second printed circuit board (226).

[0100] According to one embodiment of the present disclosure, a battery (215, 225) for supplying power to an electronic device (101) may be disposed adjacent to a printed circuit board (216, 226). At least a portion of the battery (215, 225) may be disposed, for example, substantially coplanar with the printed circuit board (216, 226). According to one embodiment, a first battery (215) may be disposed adjacent to a first printed circuit board (216), and a second battery (225) may be disposed adjacent to a second printed circuit board (226). The battery (215, 225) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (215, 225) may be integrally placed inside the foldable housing (210, 220, 260), or may be detachably placed in the foldable housing (210, 220, 260).

[0101] According to one embodiment of the present disclosure, the hinge structure (270) may be configured to provide a folding axis (e.g., the folding axis (A) of FIG. 2) and rotatably connect or couple the foldable housing (210, 220, 260) and / or the bracket assembly (217, 227). The hinge structure (270) may include a first hinge structure (271) disposed on the first printed circuit board (216) side and a second hinge structure (272) disposed on the second printed circuit board (226) side. The hinge structure (270) may be disposed between the first printed circuit board (216) and the second printed circuit board (226). According to one embodiment, the hinge structure (270) may be substantially integrally formed with at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227).

[0102] According to one embodiment of the present disclosure, a 'housing structure' may refer to a foldable housing (210, 220, 260), and at least one component disposed inside the foldable housing (210, 220, 260) assembled and / or coupled. The housing structure may include a first housing structure and a second housing structure. For example, an assembled configuration including at least one component among a first housing (210), a first bracket assembly (217) disposed inside the first housing (210), a first printed circuit board (216), and a first battery (215) may be referred to as a 'first housing structure'. In another example, an assembled configuration including at least one component among a second housing (220), a second bracket assembly (227) disposed inside the second housing (220), a second printed circuit board (226), and a second battery (225) may be referred to as a 'second housing structure'. However, it should be noted that the 'first housing structure and second housing structure' here are not limited to the addition of the above-described components, and may additionally include or omit various other components.

[0103] According to one embodiment of the present disclosure, the flexible connecting member (280) may be, for example, a flexible printed circuit board (FPCB). The flexible connecting member (280) may connect various electrical components arranged on the first printed circuit board (216) and the second printed circuit board (226). To this end, the flexible connecting member (280) may be arranged to cross the 'first housing structure' and the 'second housing structure'. According to one embodiment, the flexible connecting member (280) may be arranged to cross at least a portion of the hinge structure (270). According to one embodiment, the flexible connecting member (280) may be configured to connect the first printed circuit board (216) and the second printed circuit board (226) across the hinge structure (270), for example, along a direction parallel to the y-axis of FIG. 4. For another example, the flexible connecting member (280) may be extended or arranged through an opening (273, 274) formed in the hinge structure (270). At this time, a part (281) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the first hinge structure (271), and another part (282) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the second hinge structure (272). In addition, another part (283) of the flexible connecting member (280) may be arranged on the other side (e.g., the lower side) of the first hinge structure (271) and the second hinge structure (272). A space (hereinafter referred to as a “wiring space”) surrounded by at least a portion of the first hinge structure (271), at least a portion of the second hinge structure (272), and at least a portion of the hinge cover (260) may be formed adjacent to the first hinge structure (271) and the second hinge structure (272). According to one embodiment, at least a portion (283) of the flexible connecting member (280) may be disposed within the wiring space.

[0104] According to one embodiment of the present disclosure, the hinge cover (260) may be configured to accommodate or enclose at least a portion of the hinge structure (270) or the wiring space. In some embodiments, the hinge cover (260) may form a wiring space together with the hinge structure (270) and protect a component (e.g., at least a portion (283) of the flexible connecting member (280)) disposed within the wiring space from external impact. According to one embodiment, the hinge cover (260) may be disposed between the first housing (210) and the second housing (220). In the in-folding type electronic device (101), the hinge cover (260) may be at least partially concealed by the foldable housing (210, 220, 260). For example, in the folded state, the hinge cover (260) may be visually exposed to the external space between the rear surface of the first housing (210) (e.g., the first rear cover (240)) and the rear surface of the second housing (220) (e.g., the second rear cover (250)), and in the unfolded state, it may be substantially accommodated within the interior of the first housing (210) or the second housing (220) and visually concealed.

[0105] According to one embodiment of the present disclosure, an antenna module (219, 229) (e.g., antenna module (197) of FIG. 1) may be disposed between a rear cover (240, 250) and a battery (215, 225). According to one embodiment, the antenna module (219, 229) may include a first antenna module (219) disposed on the side of the first housing (210) and a second antenna module (229) disposed on the side of the second housing (220). The antenna module (219, 229) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna, thereby enabling short-range communication with an external device or wirelessly transmitting and receiving power required for charging. In other embodiments, the antenna structure may be formed by a portion or combination of the side bezel structure and / or the bracket assembly of the foldable housing (210, 220, 260).

[0106] According to one embodiment of the present disclosure, the rear cover (240, 250) may include a first rear cover (240) and a second rear cover (250). The rear cover (240, 250) may be combined with the foldable housing (210, 220, 260) to protect the above-described components (e.g., a printed circuit board (216, 226), a battery (215, 225), a flexible connecting member (280), or an antenna module (219, 229)) disposed within the foldable housing (210, 220, 260). As described above, the rear cover (240, 250) may be formed substantially integrally with the foldable housing (210, 220, 260).

[0107] According to one embodiment of the present disclosure, the protective member (206) and / or the decorative cover (218, 228) can protect at least a portion of an edge of the first display (230). The protective member (206) can be positioned between an edge of a first area (231a, see FIG. 2) of the first display (230) and an inner wall of the first housing (210) and / or between an edge of a second area (231b, see FIG. 2) of the first display (230) and an inner wall of the second housing (220) to prevent the edge of the first display (230) from directly contacting the inner walls of the housings (210, 220).

[0108] FIG. 5 is a part of a cross-sectional view of an electronic device (101) in an unfolded state (e.g., the state of the electronic device (101) of FIG. 2). The components described with reference to FIG. 5 may be partially or entirely identical to the components described with reference to FIGS. 1 to 4. The components described with reference to FIG. 5 may be partially or entirely identical to the components described with reference to FIGS. 6 to 15.

[0109] According to one embodiment, the electronic device (101) may include a housing (201) including a first housing (210) and a second housing (220). The electronic device (101) may include a hinge (270) that rotatably connects the first housing (210) and the second housing (220). The electronic device (101) may include a display (230). The description of the housing (201), the display (230), and the hinge (270) may be applied equally to the description of the components described with reference to FIGS. 1 to 4 (e.g., the housing (201), the display (230), and the hinge structure (270)).

[0110] According to one embodiment, the electronic device (101) may include a flexible circuit board (300). The flexible circuit board (300) may be disposed within the housing (201). The flexible circuit board (300) may be disposed correspondingly to each of the first housing (210) and the second housing (220). The flexible circuit board (300) may be disposed across the hinge (270). At least a portion of the flexible circuit board (300) may be deformable.

[0111] According to one embodiment, the flexible circuit board (300) may include a first substrate portion (301). The first substrate portion (301) may be positioned corresponding to the hinge (270). The first substrate portion (301) may be deformable. The first substrate portion (301) may be deformed by rotation of the hinge (270). The first substrate portion (301) may be referred to as a "deformable portion."

[0112] In one embodiment, the flexible circuit board (300) may include a second substrate portion (302). The second substrate portion (302) may extend in a curved manner. The second substrate portion (302) may extend away from the hinge (270) from the first substrate portion (301).

[0113] In one embodiment, the flexible circuit board (300) may include a third substrate portion (303). The third substrate portion (303) may extend in a curved manner. The third substrate portion (303) may be positioned within each of the first housing (210) and the second housing (220). The second substrate portion (302) may be positioned between the first substrate portion (301) and the third substrate portion (303). The third substrate portion (303) may be positioned offset from the hinge (270). The third substrate portion (303) may be referred to as a “bending portion.”

[0114] According to one embodiment, the electronic device (101) may include a support member (2010). The support member (2010) may be disposed within the housing (201) and may be a part of a bracket assembly (217, 227) disposed within the housing (201). The support member (2010) according to an embodiment of the present disclosure may include a first support portion (2012) and a second support portion (2011) adjacent to a flexible circuit board (300). The second support portion (2011) may face at least a portion of the flexible circuit board (300). The second support portion (2011) may face a fourth substrate portion (304). The fourth substrate portion (304) may be in contact with the second support portion (2011). At least a portion of the flexible circuit board (300) may be positioned between the second support portion (2011) and the sealer (310). The fourth substrate portion (304) may be positioned between the second support portion (2011) and the sealer (310).

[0115] In one embodiment, the flexible circuit board (300) may include a fourth substrate portion (304). The fourth substrate portion (304) may extend from the bending portion (303). The fourth substrate portion (304) may be disposed between a portion (2011) of a support member within the housing (201) and a sealer (310). The fourth substrate portion (304) may be pressed by the portion (2011) of the support member and the sealer (310). The fourth substrate portion (304) may be referred to as an “extending portion.” The fourth substrate portion (304) may be referred to as a “pressed portion.”

[0116] In one embodiment, the electronic device (101) may include a sealer (310). The sealer (310) may be configured to block water (and / or other substances) from passing into the housing. The sealer (310) may include a waterproofing material. The sealer (310) may include a sealing material. The sealer (310) may be disposed within the housing (201). The sealer (310) may be in contact with the flexible circuit board (300). The sealer (310) may press against at least a portion of the flexible circuit board (300). The sealer (310) may press against the fourth substrate portion (304).

[0117] In one embodiment, the electronic device (101) may include a gasket (320). The gasket (320) may include a cured in place gasket (CIPG). The gasket (320) may contact the flexible circuit board (300). The gasket (320) may press against at least a portion of the flexible circuit board (300). The gasket (320) may fill a void formed by the flexible circuit board (300).

[0118] Fig. 6 is a drawing showing a portion of a housing (201) and a flexible circuit board (300). Fig. 7 is an enlarged view of a portion of the flexible circuit board (300). The components described with reference to Figs. 6 and 7 may be partially or entirely identical to the components described with reference to Figs. 1 to 5. The components described with reference to Figs. 6 and 7 may be partially or entirely identical to the components described with reference to Figs. 8 to 15.

[0119] In one embodiment, the flexible circuit board (300) may be arranged across the housing (201). A portion of the flexible circuit board (300) may be arranged to correspond to the hinge (270). The flexible circuit board (300) may extend from the first housing (210) across the hinge (270) toward the second housing (220). When the electronic device (101) is in an unfolded state, the direction in which the flexible circuit board (300) extends from the first housing (210) toward the second housing (220) across the hinge (270) may be referred to as a “first direction,” a “longitudinal direction,” or a “y direction” (as illustrated in FIG. 4).

[0120] According to one embodiment, the flexible circuit board (300) may be connected to an antenna module (219, 229). The description of the antenna module (219, 229) may be identical to the description of the antenna module described with reference to FIGS. 1 to 4 (e.g., the antenna module (197) of FIG. 1 and the antenna module (219, 229) of FIG. 2). The flexible circuit board (300) may be connected to a printed circuit board (e.g., the printed circuit board (216, 226) of FIG. 4). The flexible circuit board (300) may connect the antenna module (219, 229) to the printed circuit board (216, 226). The antenna module (219, 229) may be referred to as an “antenna” or a “conductive portion.”

[0121] According to one embodiment, the flexible circuit board (300) may include a third substrate portion (303) and a fourth substrate portion (304). At least a portion of the flexible circuit board (300) may be curved. The flexible circuit board (300) may extend toward the ends of the first housing (210) and the second housing (220) in a state in which at least a portion of the flexible circuit board (300) is curved. The flexible circuit board (300) may be connected to antenna modules (219, 229) disposed at the ends of the first housing (210) and the second housing (220), respectively.

[0122] According to one embodiment, the flexible circuit board (300) may include a first portion (305). The flexible circuit board (300) may include a second portion (306). The first portion (305) and the second portion (306) may be formed integrally. The first portion (305) may be configured to transmit a first signal. The second portion (306) may be configured to transmit a second signal. The type of the first signal may be different from the type of the second signal. The first signal may include a signal transmitted from (or to) the display (230). The first signal may include a signal transmitted from the battery (215, 225). For example, the first signal may include a signal transmitted from (or to) an external storage medium (e.g., USB). The second signal may include an RF signal. The second signal may include a signal transmitted from outside the electronic device (101) (or to the outside of the electronic device (101). The second signal may include a communication signal external to the electronic device (101) (from the outside of the electronic device (101) or to the outside of the electronic device (101).

[0123] According to one embodiment, the first part (305) may include a plurality of logic lines for processing data. The second part (306) may include a plurality of signal lines for transmitting signals. The first part (305) may be connected to a display (e.g., the display (230) of FIG. 4), a battery (e.g., the batteries (215, 225) of FIG. 4), or an external storage medium (e.g., a USB). The first part (305) may supply power to the display (230) and the batteries (215, 225). The first part (305) may process data generated from the display (230). The first part (305) may process data from an external storage medium (e.g., a USB). The second part (306) may be connected to an antenna module (219, 229). The second portion (306) can transmit a signal through the antenna module (219, 229) (or to or from the antenna module (219, 229)). The second portion (306) can transmit an RF signal.

[0124] According to one embodiment, the flexible circuit board (300) may include a first wiring (3001) and a second wiring (3002). The first wiring (3001) and the second wiring (3002) may be formed as an integral body. The first wiring (3001) may include a plurality of logic lines for processing the above-described data. The first wiring (3001) may be referred to as a “logic wiring.” The second wiring (3002) may include a plurality of signal lines for transmitting the above-described signal. The second wiring (3002) may be referred to as a “signal wiring.” The first wiring (3001) and the second wiring (3002) may extend from a position corresponding to the first housing (210) across the hinge (270) toward a position corresponding to the second housing (220).

[0125] In one embodiment, the thickness of the first portion (305) and the thickness of the second portion (306) may be different from each other. The first portion (305) may be a portion of the first wiring (3001). The second portion (306) may be a portion of the second wiring (3002). The thickness may be defined by a third direction perpendicular to the first and second directions. The third direction may be perpendicular to the display representations (210a, 210b) when the electronic device (101) is in an unfolded state. The third direction may be referred to as a “thickness direction” or a “z direction” (as illustrated in FIG. 4).

[0126] According to one embodiment, the flexible circuit board (300) may include a first region (300a). The first region (300a) may be a portion of the flexible circuit board (300) positioned corresponding to the hinge (270). The flexible circuit board (300) may include a second region (300b). The second region (300b) may be a portion of the flexible circuit board (300) that is connected to an electrical component (e.g., a printed circuit board or an antenna module). The flexible circuit board (300) may include a third region (300c). The third region (300c) may connect the first region (300a) and the second region (300b).

[0127] According to one embodiment, the first region (300a) of the flexible circuit board (300) may be divided into a first portion (305) and a second portion (306) having different thicknesses. The second region (300b) of the flexible circuit board (300) may be divided into a first portion (305) and a second portion (306) having different thicknesses. The third region (300c) of the flexible circuit board (300) may include portions of the first wiring (3001) and the second wiring (3002) having substantially the same thickness. As illustrated in FIG. 7, the first portion (305) and the second portion (306) of the flexible circuit board (300) may be arranged in a second direction that is perpendicular to the first direction. The first portion (305) and the second portion (306) of the flexible circuit board (300) may be arranged side by side in a second direction, and in some embodiments, a third portion (307) may be arranged between the first portion (305) and the second portion (306). The second direction may be referred to as the “width direction” or the “x direction” (as shown in FIG. 4).

[0128] Fig. 8 is a cross-sectional view taken along the line A-A' illustrated in Fig. 5. Fig. 9 is an exploded view of the structure of Fig. 8. The components described with reference to Figs. 8 and 9 may be partially or entirely identical to the components described with reference to Figs. 1 to 7. The components described with reference to Figs. 8 and 9 may be partially or entirely identical to the components described with reference to Figs. 10 to 15.

[0129] According to one embodiment, the first part (305) and the second part (306) may be formed integrally. The flexible circuit board (300) may include a third part (307). The third part (307) may be a portion of the flexible circuit board (300) that connects the first part (305) and the second part (306). The third part (307) may be a connecting portion between the first part (305) and the second part (306).

[0130] According to one embodiment, the first portion (305) may be positioned between the sealer (310) and the second support portion (2011). The second portion (306) may be positioned between the sealer (310) and the second support portion (2011). The third portion (307) may be positioned between the sealer (310) and the second support portion (2011).

[0131] According to one embodiment, the flexible circuit board (300) may include a recess (308). The recess (308) may be formed due to a thickness difference between the first portion (305) and the second portion (306). The recess (308) may be formed in the third portion (307). At least a portion of the gasket (320) may be disposed in an inner space of the recess (308). The gasket (320) may be in contact with the recess (308). The gasket (320) may fill the space formed by the recess (308). For example, at least a portion of the gasket (320) may be disposed between the recess (308) and the second support portion (2011). For example, at least a portion of the gasket (320) may be disposed between the recess (308) and the sealer (310).

[0132] In one embodiment, the first support portion (2012) may be in contact with the sealer (310). The sealer (310) may be positioned between the first support portion (2012) and the flexible circuit board (300). The first support portion (2012) may provide a compressive force to the sealer (310) toward the flexible circuit board (300).

[0133] In one embodiment, the gasket (320) may include a first gasket (321) and a second gasket (322). The first gasket (321) may be disposed between the sealer (310) and the second support portion (2011). At least a portion of the first gasket (321) may be disposed between the recess (308) and the second support portion (2011). At least a portion of the first gasket (321) may be disposed between the recess (308) and the sealer (310). The first gasket (321) may seal between the second support portion (2011) and the flexible circuit board (300). The first gasket (321) may seal between the sealer (310) and the flexible circuit board (300). A second gasket (322) may be placed between the sealer (310) and the first support portion (2012). The second gasket (322) may seal between the sealer (310) and the first support portion (2012).

[0134] According to one embodiment, the sealer (310) may include a first sealing portion (311) and a second sealing portion (312). The first sealing portion (311) may include a first surface (311a) that contacts the first portion (305). The second sealing portion (312) may include a second surface (312a) that contacts the second portion (306). The second surface (312a) may be arranged to be offset from the first surface (311a). For example, the second surface (312a) and the first surface (311a) may be located on different planes. The second surface (312a) and the first surface (311a) may be located on different planes with respect to a third direction (e.g., a “thickness” direction). The different planes may be parallel. The second sealing portion (312) may include a protruding portion (312b). The protruding portion (312b) may protrude from the first surface (311a) toward the second portion (306). The protruding portion (312b) may include the second surface (312a). The protruding portion (312b) may protrude toward the flexible circuit board (300) by a protruding distance (G) greater than the first surface (311a). The protruding distance (G) may be greater than the thickness of the metal layer (3063) described with reference to FIGS. 11A to 11C. The sealer (310) according to the embodiment of the present disclosure may compensate for the compressive force on the second portion (306), which has become thinner than the first portion (305) due to the removal of the metal layer (3063), through the protruding portion (312b).

[0135] Fig. 10 is a conceptual diagram illustrating a cross-section taken along the A-A' reference line illustrated in Fig. 5. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 1 to 9. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 11a to 15.

[0136] According to one embodiment, the flexible circuit board (300) may include a first portion (305) and a second portion (306) having different thicknesses. The flexible circuit board (300) may include a third portion (307) connecting the first portion (305) and the second portion (306).

[0137] According to one embodiment, the first portion (305) may have a first thickness (t1). The second portion (306) may have a second thickness (t2) that is less than the first thickness (t1).

[0138] According to one embodiment, the sealer (310) may include a first sealing portion (311) and a second sealing portion (312). The first sealing portion (311) and the second sealing portion (312) may be integral. The thickness of the first sealing portion (311) and the thickness of the second sealing portion (312) may be different from each other. The first sealing portion (311) may have a third thickness (t3). The second sealing portion (312) may have a fourth thickness (t4) greater than the third thickness (t3).

[0139] According to one embodiment, the first sealing portion (311) may correspond to the first portion (305). The first sealing portion (311) may be in contact with the first portion (305). The second sealing portion (312) may correspond to the second portion (306). The second sealing portion (312) may be in contact with the second portion (306). According to an embodiment of the present disclosure, the sealer (310) may form the first sealing portion (311) and the second sealing portion (312) to have different thicknesses so as to correspond to the first portion (305) and the second portion (306) of the flexible circuit board (300) having different thicknesses, thereby reducing the penetration of fluid through the flexible circuit board (300).

[0140] In one embodiment, the sealer (310) may include a corner portion (313). The corner portion (313) may connect the first sealing portion (311) and the second sealing portion (312). The corner portion (313) may extend in a curved manner or form a step. The corner portion (313) may correspond to the third portion (307) of the flexible circuit board (300).

[0141] In one embodiment, the sealer (310) may include an overlap portion (314). The overlap portion (314) may overlap the flexible circuit board (300). The overlap portion (314) may be a portion of the sealer (310) aligned with at least a portion of the flexible circuit board (300) with respect to the third direction (z direction). The overlap portion (314) may be a portion of the sealer (310) that covers at least a portion of the flexible circuit board (300).

[0142] In one embodiment, the sealer (310) may include a first overlap portion (315). The first overlap portion (315) may overlap the first portion (305). The first overlap portion (315) may be a portion of the sealer (310) aligned with a portion of the first portion (305) with respect to the third direction (z direction). The first overlap portion (315) may be a portion of the first sealing portion (311) that covers at least a portion of the first portion (305).

[0143] In one embodiment, the sealer (310) can include a second overlap portion (316). The second overlap portion (316) can overlap the second portion (306). The second overlap portion (316) can be a portion of the sealer (310) that is aligned with a portion of the second portion (306) with respect to the third direction (z direction). The second overlap portion (316) can be a portion of the second sealing portion (312) that covers at least a portion of the second portion (306).

[0144] In one embodiment, the first gasket (321) may include a first gasket portion (3211). The first gasket portion (3211) may be positioned between the second portion (306) and the second support portion (2011).

[0145] In one embodiment, the first gasket (321) may include a second gasket portion (3212). The second gasket portion (3212) may be positioned between the sealer (310) and the second portion (306). The second gasket portion (3212) may be positioned between the second sealing portion (312) and the second portion (306). The second gasket portion (3212) may overlap the second overlap portion (316).

[0146] In one embodiment, the first gasket (321) may include a third gasket portion (3213). The third gasket portion (3213) may be positioned between the corner portion (313) and the third portion (307). The third gasket portion (3213) may be positioned between the first portion (305) and the second sealing portion (312).

[0147] In one embodiment, the sealer (310) can compress the second portion (306). The sealer (310) can apply a force to the second portion (306) of the flexible circuit board toward the second support portion (2011). The second portion (306) of each layer of the flexible circuit board (300) can be compressed by the sealer (310). When the second portion (306) is compressed by the sealer (310), the plurality of layers (3091) can contact each other without gaps.

[0148] Fig. 11a is a drawing conceptually illustrating a layer structure (309) of a first portion (305) and a second portion (306) of a flexible circuit board (300). Fig. 11b is a drawing explaining a shape change of the layer structure (309) of Fig. 11a. Fig. 11c is a drawing explaining a shape change of the layer structure (309) of Fig. 11b. The components described with reference to Figs. 11a to 11c may be partly or entirely the same as the components described with reference to Figs. 1 to 10. The components described with reference to Figs. 11a to 11c may be partly or entirely the same as the components described with reference to Figs. 12 to 15.

[0149] According to one embodiment, the flexible circuit board (300) may include a plurality of layers (3091). The plurality of layers (3091) may include a first portion (305) and a second portion (306). Each layer (3091a, 3091b, 3091c, 3091d) constituting the plurality of layers (3091) of the flexible circuit board (300) may include a plurality of sub-layers (3051, 3052, 3053, 3054). The first portion (305) and the second portion (306) may include different types of signal lines. A signal line disposed in the first portion (305) may be named a first signal line, and a signal line disposed in the second portion (306) may be named a second signal line.

[0150] According to one embodiment, the signal line disposed in the first portion (305) may be located in the metal layer (3053) of the first portion (305). The signal line disposed in the second portion (306) may be located in the metal layer (3063) of the second portion (306). The first signal line and the second signal line may transmit different types of signals. The first signal may be transmitted through the first signal line. The second signal may be transmitted through the second signal line.

[0151] According to one embodiment, the second portion (306) may be formed by removing at least one sub-layer from among the plurality of sub-layers constituting each layer. That is, at least one sub-layer may be removed from at least one layer of the second portion (306). The thickness of the first portion (305) and the thickness of the second portion (306) may be different from each other (for example, the first thickness (t1) of the first portion (305) and the second thickness (t2) of the second portion (306) illustrated in FIG. 11C).

[0152] According to one embodiment, the first portion (305) may include a metal sub-layer (3063). The metal sub-layer (3063) may include a copper material. A portion corresponding to the second portion (306) in at least one of the plurality of layers (3091) may not include the metal sub-layer (3063) of the first portion (305). In the flexible circuit board (300) according to an embodiment of the present disclosure, the thicknesses of the first portion (305) and the second portion (306) of the flexible circuit board (300) may be different by removing the metal sub-layer (3063) from a portion (3062) corresponding to the second portion (306) in at least one of the plurality of layers (3091).

[0153] According to an embodiment of the present disclosure, a flexible circuit board (300) can reduce signal interference between signal lines arranged in the second portion (306) by removing a metal sub-layer (3063) of a portion corresponding to the second portion (306) in at least one layer among a plurality of layers (3091). According to an embodiment of the present disclosure, the flexible circuit board (300) can use the first portion (305) as a signal line for processing data, and the second portion (306) can be used as a signal line for communication via an antenna. A sealer according to an embodiment of the present disclosure (e.g., a sealer (310) of FIG. 10) can remove a space formed between the plurality of layers (3091) due to the removal of a portion corresponding to the metal sub-layer (3063) by providing a compressive force to the second portion (306). By removing the spaces, the sealer (310) according to an embodiment of the present disclosure can reduce the penetration of fluid through the second portion (306).

[0154] According to one embodiment, a portion corresponding to the second portion (306) in at least one layer of the plurality of layers (3091) may include a metal sub-layer (3063). A thickness of the layer (3091d) of the second portion (306) including the metal sub-layer (3063) may be substantially the same as a thickness of the layer (3091d) of the first portion (305) including the metal sub-layer (3063).

[0155] According to one embodiment, the layer structure (309) may include a plurality of layers (3091). The plurality of layers (3091) may include a first layer (3091a), a second layer (3091b), a third layer (3091c), and a fourth layer (3091d). The plurality of layers (3091) may be spaced apart from each other. The layer structure (309) may include a space (3092) formed between the layers of the plurality of layers (3091). The flexible circuit board (300) may include a spacer (3093) disposed in the space (3092) formed between the layers of the plurality of layers (3091). The spacer (3093) may connect each of the layers (3091a, 3091b, 3091c, 3091d) to each other. Each layer (3091a, 3091b, 3091c, 3091d) may be separated from each other by a spacer (3093). The spacer (3093) may include a polymer material. The spacer (3093) may include a rubber material that can expand or contract. The spacer (3093) may include a sealer or a waterproofing material.

[0156] According to one embodiment, the space (3092) between the layers (3091) may include a first space (3092a) corresponding to the first portion (305) and a second space (3092b) corresponding to the second portion (306). The first space (3092a) may be a portion of the space (3092) located within the first portion (305). The second space (3092b) may be a portion of the space (3092) located within the second portion (306). The spacer (3093) may fill the first and second spaces (3092a, 3092b).

[0157] According to one embodiment, the first portion (305) may include a portion of the layers (3091), and the second portion (306) may include the remaining portion of the layers (3091). The layer structure (309) may be divided into a portion corresponding to the first portion (305) and a portion corresponding to the second portion (306).

[0158] According to one embodiment, the first portion (305) may include a first film sub-layer (3051), a first adhesive sub-layer (3052), a metal sub-layer (3053), and a first polymer sub-layer (3054). A portion corresponding to the first portion (305) of each layer (3091a, 3091b, 3091c, 3091d) may include a first film sub-layer (3051), a first adhesive sub-layer (3052), a metal sub-layer (3053), and a first polymer sub-layer (3054).

[0159] According to one embodiment, the portion corresponding to the second portion (306) of each layer (3091a, 3091b, 3091c, 3091d) may include a second film sub-layer (3061a), a second adhesive sub-layer or line (3061b), and a second polymer sub-layer (3061c).

[0160] In one embodiment, the second film sub-layer (3061a) of the second portion (306) can be formed integrally with the first film sub-layer (3051) of the first portion (305). The second film sub-layer (3061a) of the second portion (306) can be aligned with the first film sub-layer (3051) of the first portion (305). The second adhesive sub-layer (3061b) of the second portion (306) can be formed integrally with the first adhesive sub-layer (3052) of the first portion (305). The second adhesive sub-layer (3061b) of the second portion (306) can be aligned with the first adhesive sub-layer (3052) of the first portion (305). The second polymer sub-layer (3061c) of the second portion (306) can be formed integrally with the first polymer sub-layer (3054) of the first portion (305). The second polymer sub-layer (3061c) of the second portion (306) can be aligned with the first polymer sub-layer (3054) of the first portion (305).

[0161] According to one embodiment, a portion corresponding to the second portion (306) in at least one layer of the plurality of layers (3091) may include a portion formed by bonding the second adhesive sub-layer (3061b) and the second polymer sub-layer (3061c) to each other after the metal sub-layer (3063) between the second adhesive sub-layer (3061b) and the second polymer sub-layer (3061c) is removed. For example, referring to the change from the state of FIG. 11a to the state of FIG. 11b, after the metal sub-layer is removed, the second adhesive sub-layer (3061b) of the second portion (306) can move in the first direction (D5) toward the second polymer sub-layer (3061c), and the second polymer sub-layer (3061c) of the second portion (306) can move in the second direction (D6) toward the second adhesive sub-layer (3061b), and the second adhesive sub-layer (3061b) and the second polymer sub-layer (3061c) can be bonded to each other.

[0162] In one embodiment, the layers (3091a, 3091b, 3091c, 3091d) can be spaced apart from one another, and a space (3092) can be formed between the layers (3091a, 3091b, 3091c, 3091d). For example, at least a portion of the first layer (3091a) can be separated from at least a portion of the second layer (3091b). A spacer (3093) can be positioned in the space (3092) and fill the space (3092). For example, a space (3092) can be formed between the first layer (3091a) and the second layer (3091b). The space (3092) between the layers (3091) may include a first space (3092a) corresponding to the first portion (305) and a second space (3092b) corresponding to the second portion (306). A spacer (3093) may be disposed in each of the first space (3092a) and the second space (3092b). The first width (w1) of the first space (3092a) may be smaller than the second width (w2) of the second space (3092b). For example, the first distance (w1) between the layers (3091a, 3091b, 3091c, 3091d) within the first portion (305) may be smaller than the second distances (w2, w3) between the layers (3091a, 3091b, 3091c, 3091d) within the second portion (306). In the flexible circuit board (300) according to the embodiment of the present disclosure, the second distance (w2) may be formed to be larger than the first distance (w1) due to the removal of the gap (3062) illustrated in FIG. 11A.

[0163] According to one embodiment, the sealer (310) may include a first sealing portion (311) corresponding to the first portion (305) and a second sealing portion (312) corresponding to the second portion (306). The first sealing portion (311) may compress the first portion (305). The second sealing portion (312) may compress the second portion (306). The third thickness (t3) of the first sealing portion (311) may be smaller than the fourth thickness (t4) of the second sealing portion (312).

[0164] According to one embodiment, the layers (3091a, 3091b, 3091c, 3091d) of the flexible circuit board (300) can be compressed by the sealer (310).

[0165] According to one embodiment, when referring to the change in the layer structure (309) from FIG. 11b to FIG. 11c, due to the difference between the first distance (w1) of the first space (3092a) formed in the first part (305) and the second distance (w2) of the second space (3092b) formed in the second part (306), the first thickness (t1) of the first part (305) may be greater than the second thickness (t2) of the second part (306). The sealer (310) according to the embodiment of the present disclosure may form the first sealing part (311) and the second sealing part (312) to have different thicknesses to correspond to the first part (305) and the second part (306) having different thicknesses (t1, t2), respectively.

[0166] According to an embodiment of the present disclosure, the flexible circuit board (300) can have different uses for the first part (305) and the second part (306) of the flexible circuit board (300) by removing the metal layer from the second part (306). In the flexible circuit board (300) according to an embodiment of the present disclosure, a thickness difference may occur between the first part (305) and the second part (306) due to the removal of the metal layer. In the flexible circuit board (300) according to an embodiment of the present disclosure, the size of the first space (3092a) formed in the first part (305) and the size of the second space (3092b) formed in the second part (306) may be different due to the removal of the metal layer. The sealer (310) according to the embodiment of the present disclosure may form the first sealing portion (311) and the second sealing portion (312) to have different thicknesses to correspond to the thickness difference between the first portion (305) and the second portion (306). The sealer (310) according to the embodiment of the present disclosure may form the first sealing portion (311) and the second sealing portion (312) to have different thicknesses, thereby compensating for the thickness difference between the first portion (305) and the second portion (306) of the flexible circuit board (300) having different thicknesses, thereby reducing the penetration of fluid into the flexible circuit board (300).

[0167] Fig. 12 is an enlarged view of a portion (M) of Fig. 5. Fig. 13 is a cross-sectional view taken along the line B-B' illustrated in Fig. 6. The components described with reference to Figs. 12 and 13 may be partially or entirely identical to the components described with reference to Figs. 1 to 11. The components described with reference to Figs. 12 and 13 may be partially or entirely identical to the components described with reference to Figs. 14 and 15.

[0168] In one embodiment, the fourth substrate portion (304) may extend from the curved third substrate portion (303). The fourth substrate portion (304) may pass between the sealer (310) and the second support portion (2011). The gasket (320) may fill the empty space formed by the fourth substrate portion (304).

[0169] In one embodiment, the sealer (310) may be positioned between the second support portion (2011) and the first support portion (2012). The sealer (310) may be compressed by the second support portion (2011) and the first support portion (2012). The sealer (310) may include an elastic material. The sealer (310) may press the first portion (305) and the second portion (306) of the flexible circuit board (300). The gasket (320) may fill the space between the sealer (310) and the first support portion (2012).

[0170] FIG. 14 is an exploded view of a second support portion (2011), a sealer (410), a flexible circuit board (300), and a first support portion (2012) according to one embodiment of the present disclosure. The components described with reference to FIG. 14 may be partially or entirely identical to the components described with reference to FIGS. 1 to 13.

[0171] According to one embodiment, the electronic device (101) may include a flexible circuit board (300) and a support member (2010) including a first support portion (2012) and a second support portion (2011). The second support portion (2011) may have a thickness of a region (2011a) that contacts the first portion (305) of the flexible circuit board (300) smaller than a thickness of a region (2011b) that contacts the second portion (306). A contact surface of the region (2011a) that contacts the first portion (305) of the flexible circuit board (300) may be recessed from a contact surface of the region (2011b) that contacts the second portion (306).

[0172] According to one embodiment, the electronic device (101) may include a sealer (410). The sealer (410) may include a first sealing portion (411) corresponding to the first portion (305) and a second sealing portion (412) corresponding to the second portion (306). The thickness of the first sealing portion (411) and the thickness of the second sealing portion (412) may be the same.

[0173] According to one embodiment, the first support portion (2011) may include a step portion (2011c). The step portion (4011c) may be formed to be curved.

[0174] According to the embodiment of FIG. 14, by forming the thickness of the first support portion (2011) differently, the penetration of fluid through the first portion (305) and the second portion (306) of the flexible circuit board (300) having different thicknesses can be reduced.

[0175] FIG. 15 is an exploded view of a support member (2010), a sealer (510), and a flexible circuit board (300) according to one embodiment of the present disclosure. The components described with reference to FIG. 15 may be partially or entirely identical to the components described with reference to FIGS. 1 to 13.

[0176] According to one embodiment, the electronic device (101) may include a flexible circuit board (300) and a support member (2010) including a first support portion (2012) and a second support portion (2011). The description of the flexible circuit board (300) and the support member (2010) may be identical to the description of the flexible circuit board (300) and the support member (2010) described with reference to FIGS. 1 to 13.

[0177] According to one embodiment, the electronic device (101) may include a sealer (510). The sealer (510) may include a first sealing portion (511) corresponding to the first portion (305) and a second sealing portion (512) corresponding to the second portion (306). The first sealing portion (511) and the second sealing portion (512) may be joined to each other based on the boundary surface (B). As an example, the sealer (510) may be manufactured by joining the first sealing portion (511) and the second sealing portion (512) having different modulus values ​​(e.g., elastic modulus values) through a dual injection molding process. The thickness of the first sealing portion (511) and the thickness of the second sealing portion (512) may be the same.

[0178] According to one embodiment, the first modulus (e.g., elastic modulus) of the first sealing portion (511) may be smaller than the second modulus (e.g., elastic modulus) of the second sealing portion (512). The first strain of the first sealing portion (511) may be larger than the second strain of the second sealing portion (512). The first sealing portion (511) may have a greater strain than the second sealing portion (512) because the thickness of the first portion (305) is greater than the thickness of the second portion (306). The second sealing portion (512) may have a less strain than the first sealing portion (511) because the thickness of the second portion (306) is smaller than the thickness of the first portion (305). The pressure acting on the first portion (305) and the pressure acting on the second portion (306) may be the same. Since the first modulus is smaller than the second modulus and the first strain is larger than the second strain, the pressure acting on the first portion (305) and the pressure acting on the second portion (306) may be equal. The pressure may be a product of the modulus and the strain.

[0179] An electronic device may include a first housing and a second housing that are rotatable relative to each other. The electronic device may include a hinge that rotatably connects the first housing and the second housing. The electronic device may include a deformable flexible circuit board that crosses the hinge. The flexible circuit board may include a first portion and a second portion that have different thicknesses. The flexible circuit board may be disposed within the housing, and when the first portion and the second portion have different thicknesses, a fluid may permeate toward the flexible circuit board.

[0180] The problem to be solved in the present disclosure may be to improve the waterproof performance of an electronic device.

[0181] A problem to be solved in the present disclosure may be to reduce the penetration of fluid into a flexible circuit board.

[0182] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0183] Electronic devices according to various embodiments of the present disclosure can improve waterproof performance by forming the thickness of the sealer partially differently.

[0184] Electronic devices according to various embodiments of the present disclosure can reduce the penetration of fluid into a flexible circuit board by making the thickness of the sealer correspond to the thickness of the flexible circuit board.

[0185] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0186] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a housing (e.g., 201 of FIGS. 1 to 15).

[0187] An electronic device according to one embodiment of the present disclosure (e.g., 101 of FIGS. 1 to 15) may include a flexible circuit board (e.g., 300 of FIGS. 1 to 15) configured to be deformable.

[0188] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a sealer (e.g., 310 of FIGS. 1 to 15) disposed between the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and the housing (e.g., 201 of FIGS. 1 to 15).

[0189] The flexible circuit board (e.g., 300 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first portion (e.g., 305 of FIGS. 1 to 15) having a first thickness and configured to process data.

[0190] The flexible circuit board according to one embodiment of the present disclosure (e.g., 300 of FIGS. 1 to 15) may include a second portion (e.g., 306 of FIGS. 1 to 15) having a second thickness smaller than the first thickness and configured to transmit a signal.

[0191] The sealer (e.g., 310 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first sealing portion (e.g., 311 of FIGS. 1 to 15) disposed corresponding to the first portion (e.g., 305 of FIGS. 1 to 15) and having a third thickness.

[0192] The sealer (e.g., 310 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a second sealing portion (e.g., 312 of FIGS. 1 to 15) disposed corresponding to the second portion (e.g., 306 of FIGS. 1 to 15) and having a fourth thickness greater than the third thickness.

[0193] The flexible circuit board (e.g., 300 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a third portion (e.g., 307 of FIGS. 1 to 15) connecting the first portion (e.g., 305 of FIGS. 1 to 15) and the second portion (e.g., 306 of FIGS. 1 to 15).

[0194] The sealer (e.g., 310 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a corner portion (e.g., 313 of FIGS. 1 to 15) that connects the first sealing portion (e.g., 311 of FIGS. 1 to 15) and the second sealing portion (e.g., 312 of FIGS. 1 to 15) and is arranged to correspond to the third portion (e.g., 307 of FIGS. 1 to 15).

[0195] The sealer (e.g., 310 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first overlap portion (e.g., 315 of FIGS. 1 to 15) in contact with the first portion (e.g., 305 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15).

[0196] The sealer (e.g., 310 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a second overlap portion (e.g., 316 of FIGS. 1 to 15) that is in contact with the second portion (e.g., 306 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and is positioned misaligned with the first overlap portion (e.g., 315 of FIGS. 1 to 15).

[0197] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a gasket (e.g., 320 of FIGS. 1 to 15) partially disposed between the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and the sealer (e.g., 310 of FIGS. 1 to 15).

[0198] The gasket (e.g., 320 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first gasket (e.g., 321 of FIGS. 1 to 15) disposed between the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and the sealer (e.g., 310 of FIGS. 1 to 15).

[0199] The gasket (e.g., 320 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a second gasket (e.g., 322 of FIGS. 1 to 15) disposed between the sealer (e.g., 310 of FIGS. 1 to 15) and the housing (e.g., 201 of FIGS. 1 to 15).

[0200] The flexible circuit board (e.g., 300 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a third portion (e.g., 307 of FIGS. 1 to 15) that connects the first portion (e.g., 305 of FIGS. 1 to 15) and the second portion (e.g., 306 of FIGS. 1 to 15) and extends in a curved manner in a direction away from the sealer (e.g., 310 of FIGS. 1 to 15).

[0201] At least a portion of the gasket (e.g., 320 of FIGS. 1 to 15) according to one embodiment of the present disclosure may be disposed between the third portion (e.g., 307 of FIGS. 1 to 15) and the sealer (e.g., 310 of FIGS. 1 to 15).

[0202] The gasket (e.g., 320 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first gasket portion (e.g., 3211 of FIGS. 1 to 15) disposed between the sealer (e.g., 310 of FIGS. 1 to 15) and the flexible circuit board (e.g., 300 of FIGS. 1 to 15).

[0203] The gasket (e.g., 320 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a second gasket portion (e.g., 3212 of FIGS. 1 to 15) disposed between the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and the housing (e.g., 201 of FIGS. 1 to 15).

[0204] The flexible circuit board (e.g., 300 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a recess (e.g., 308 of FIGS. 1 to 15) that is sunken in a direction away from the sealer (e.g., 310 of FIGS. 1 to 15).

[0205] At least a portion of the gasket (e.g., 320 of FIGS. 1 to 15) according to one embodiment of the present disclosure may be disposed between the recess (e.g., 308 of FIGS. 1 to 15) and the sealer (e.g., 310 of FIGS. 1 to 15).

[0206] According to one embodiment of the present disclosure, the first and second parts (e.g., 305 and 306 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15) may be disposed between the second support part (e.g., 2011 of FIGS. 1 to 15) and the sealer (e.g., 310 of FIGS. 1 to 15).

[0207] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a printed circuit board (e.g., 216, 226 of FIGS. 1 to 15) disposed inside the housing (e.g., 201 of FIGS. 1 to 15).

[0208] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include an antenna (e.g., 219, 229 of FIGS. 1 to 15) spaced apart from the printed circuit board (e.g., 216, 226 of FIGS. 1 to 15).

[0209] According to one embodiment of the present disclosure, the first and second portions (e.g., 305 and 306 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15) may extend from the printed circuit board (e.g., 216 and 226 of FIGS. 1 to 15) toward the antenna (e.g., 219 and 229 of FIGS. 1 to 15).

[0210] The housing (e.g., 201 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first housing (e.g., 210 of FIGS. 1 to 15).

[0211] According to one embodiment of the present disclosure, the housing (e.g., 201 of FIGS. 1 to 15) may include a second housing (e.g., 220 of FIGS. 1 to 15) rotatably arranged with respect to the first housing (e.g., 210 of FIGS. 1 to 15).

[0212] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a hinge (e.g., 270 of FIGS. 1 to 15) that rotatably connects the first housing (e.g., 210 of FIGS. 1 to 15) and the second housing (e.g., 220 of FIGS. 1 to 15).

[0213] According to one embodiment of the present disclosure, the flexible circuit board (e.g., 300 of FIGS. 1 to 15) may extend from the first housing (e.g., 210 of FIGS. 1 to 15) toward the second housing (e.g., 220 of FIGS. 1 to 15) across the hinge (e.g., 270 of FIGS. 1 to 15).

[0214] The flexible circuit board according to one embodiment of the present disclosure (e.g., 300 of FIGS. 1 to 15) may include a bending portion (e.g., 303 of FIGS. 1 to 15) that extends at least partially in a curved manner.

[0215] The flexible circuit board (e.g., 300 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include an extension portion (e.g., 304 of FIGS. 1 to 15) extending from the banding portion (e.g., 303 of FIGS. 1 to 15) and in contact with the sealer (e.g., 310 of FIGS. 1 to 15).

[0216] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a housing (e.g., 201 of FIGS. 1 to 15) including a support member (e.g., 2010 of FIGS. 1 to 15).

[0217] According to one embodiment of the present disclosure, the sealer (e.g., 310 of FIGS. 1 to 15) can press the flexible circuit board (e.g., 300 of FIGS. 1 to 15) toward the support member (e.g., 2010 of FIGS. 1 to 15).

[0218] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a sealer (e.g., 410 of FIGS. 1 to 15) spaced apart from the support member (e.g., 2010 of FIGS. 1 to 15).

[0219] An electronic device according to one embodiment of the present disclosure (e.g., 101 of FIGS. 1 to 15) may include a flexible circuit board (e.g., 300 of FIGS. 1 to 15) disposed between a second support portion (e.g., 2011 of FIGS. 1 to 15) which is a part of the support member and the sealer (e.g., 410 of FIGS. 1 to 15).

[0220] According to one embodiment of the present disclosure, the second support portion (e.g., 2011 of FIGS. 1 to 15) may be formed such that the thickness of the portion corresponding to the first portion (e.g., 305 of FIGS. 1 to 15) is smaller than the thickness of the portion corresponding to the second portion (e.g., 306 of FIGS. 1 to 15).

[0221] An electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a gasket (e.g., 320 of FIGS. 1 to 15) partially disposed between the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and the support member (e.g., 2010 of FIGS. 1 to 15).

[0222] The sealer (e.g., 510 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a first sealing portion (e.g., 511 of FIGS. 1 to 15) disposed corresponding to the first portion (e.g., 305 of FIGS. 1 to 15) and having a first modulus.

[0223] The sealer (e.g., 510 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a second sealing portion (e.g., 512 of FIGS. 1 to 15) disposed corresponding to the second portion (e.g., 306 of FIGS. 1 to 15) and having a second modulus greater than the first modulus.

[0224] A foldable electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a foldable housing (e.g., 201 of FIGS. 1 to 15) including a first housing (e.g., 210 of FIGS. 1 to 15), a second housing (e.g., 220 of FIGS. 1 to 15), and a hinge housing (e.g., 270 of FIGS. 1 to 15) for rotatably coupling the first housing (e.g., 210 of FIGS. 1 to 15) and the second housing (e.g., 220 of FIGS. 1 to 15).

[0225] A foldable electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a flexible circuit board (e.g., 300 of FIGS. 1 to 15) including a first portion (e.g., 305 of FIGS. 1 to 15) including at least one signal line and a second portion (e.g., 306 of FIGS. 1 to 15) extending across the hinge housing in a first direction to be connected to a first circuit within the first housing (e.g., 210 of FIGS. 1 to 15) and a second circuit within the second housing (e.g., 220 of FIGS. 1 to 15) and including at least one signal line.

[0226] A foldable electronic device (e.g., 101 of FIGS. 1 to 15) according to one embodiment of the present disclosure may include a sealer (e.g., 310 of FIGS. 1 to 15) configured to interfere with a portion of the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and the first housing (e.g., 210 of FIGS. 1 to 15) and to block the flow of fluid into the first housing (e.g., 210 of FIGS. 1 to 15).

[0227] According to one embodiment of the present disclosure, the first and second portions (e.g., 305 and 306 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15) are arranged side by side in a second direction perpendicular to the first direction, and the first portion (e.g., 305 of FIGS. 1 to 15) may have a thickness greater than that of the second portion (e.g., 306 of FIGS. 1 to 15).

[0228] According to one embodiment of the present disclosure, the sealer (e.g., 310 of FIGS. 1 to 15) includes a first sealing portion (e.g., 311 of FIGS. 1 to 15) that presses the first portion (e.g., 305 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15) and a second sealing portion (e.g., 312 of FIGS. 1 to 15) that presses the second portion (e.g., 306 of FIGS. 1 to 15) of the flexible circuit board (e.g., 300 of FIGS. 1 to 15), and the second sealing portion (e.g., 312 of FIGS. 1 to 15) may have a thickness greater than a thickness of the first sealing portion (e.g., 311 of FIGS. 1 to 15).

[0229] In a first example, a foldable electronic device (e.g., 101) comprises: a foldable housing (e.g., 201) including a first housing (e.g., 210) and a second housing (e.g., 220); a hinge (e.g., 270) that allows the first housing (e.g., 210) and the second housing (e.g., 220) to be rotatably coupled; a flexible circuit board (e.g., 300) that extends across the hinge in a first direction to be connected to a first circuit within the first housing (e.g., 210) and a second circuit within the second housing (e.g., 220), the flexible circuit board comprising a first portion (e.g., 305) including at least one signal line and a second portion (e.g., 306) including at least one signal line; And a sealer (e.g., 310) fastened between the flexible circuit board (e.g., 300) and a part (e.g., 2012) of a support member (e.g., 2010) inside the first housing (e.g., 210), configured to prevent moisture penetration into the inside of the first housing (e.g., 210), wherein the first and second parts (e.g., 305 and 306) of the flexible circuit board (e.g., 300) are arranged side by side in a second direction perpendicular to the first direction, and the first part (e.g., 305) has a thickness greater than that of the second part (e.g., 306), and the sealer (e.g., 310) includes a first sealing part (e.g., 311) that presses the first part (e.g., 305) of the flexible circuit board (e.g., 300) and the A second sealing portion (e.g., 312) is included that presses the second portion (e.g., 306) of the flexible circuit board (e.g., 300), and the second sealing portion (e.g., 312) has a thickness greater than that of the first sealing portion (e.g., 311).

[0230] In a second example, the flexible circuit board (e.g., 300) of the electronic device according to the first example includes a plurality of layers (e.g., 3091) including a first layer (e.g., 3091a) and a second layer (e.g., 3091b), and at least a portion of the first layer (e.g., 3091a) is separated from at least a portion of the second layer (e.g., 3091b).

[0231] In a third example, the number of the plurality of sublayers (e.g., 3051, 3052, 3053, 3054) included in the first layer (e.g., 3091a) of the first part (e.g., 305) of the electronic device according to the second example is greater than the number of the plurality of sublayers (e.g., 3061a, 3061b, 3061c) included in the first layer (e.g., 3091a) of the second part (e.g., 306).

[0232] In the fourth example, the thickness of the first space (e.g., 3092a) formed between the first layer (e.g., 3091a) and the second layer (e.g., 3091b) of the first part (e.g., 305) of the electronic device according to the second example or the third example is smaller than the thickness of the second space (e.g., 3092b) formed between the first layer (e.g., 3091a) and the second layer (e.g., 3092b) of the second part (e.g., 306).

[0233] In the fifth example, the first thickness of the first part (e.g., 305) of the electronic device according to any one of the first to fourth examples is greater than the second thickness of the second part (e.g., 306), and the third thickness of the first sealing part (e.g., 311) is less than the fourth thickness of the second sealing part (e.g., 312).

[0234] In a sixth example, the flexible circuit board (e.g., 300) of the electronic device according to any one of examples 1 to 5 includes a third part (e.g., 307) connecting the first part (e.g., 305) and the second part (e.g., 306), and the sealer (e.g., 310) includes a corner part (e.g., 313) connecting the first sealing part (e.g., 311) and the second sealing part (e.g., 312) and positioned corresponding to the third part (e.g., 307).

[0235] In a seventh example, the sealer (e.g., 310) of the electronic device according to any one of examples 1 to 6 includes a first overlapping portion (e.g., 315) in contact with the first portion (e.g., 305) of the flexible circuit board (e.g., 300); and a second overlapping portion (e.g., 316) in contact with the second portion (e.g., 306) of the flexible circuit board (e.g., 300) and positioned misaligned with the first overlapping portion (e.g., 315).

[0236] In an eighth example, the electronic device according to any one of examples 1 to 7 further includes a gasket (e.g., 320) partially disposed between the flexible circuit board (e.g., 300) and the sealer (e.g., 310).

[0237] In the ninth example, the gasket (e.g., 320) of the electronic device according to the eighth example includes a first gasket (e.g., 321) disposed between the flexible circuit board (e.g., 300) and the sealer (e.g., 310); and a second gasket (e.g., 322) disposed between the sealer (e.g., 310) and the housing (e.g., 201).

[0238] In the tenth example, the flexible circuit board (e.g., 300) of the electronic device according to the eighth or ninth example includes a recess (e.g., 308) that is sunken in a direction away from the sealer (e.g., 310), and at least a portion of the gasket (e.g., 320) is disposed between the recess (e.g., 308) and the sealer (e.g., 310).

[0239] In the eleventh example, the first and second parts (e.g., 305, 306) of the flexible circuit board (e.g., 300) of the electronic device according to any one of the first to tenth examples are disposed between the second support part (e.g., 2011) which is a part of the support member (e.g., 2010) and the sealer (e.g., 310).

[0240] In a twelfth example, an electronic device according to any one of examples 1 to 11 includes a printed circuit board (e.g., 216, 226) disposed inside the housing (e.g., 201); and an antenna (e.g., 219, 229) spaced apart from the printed circuit board (e.g., 216, 226), wherein the flexible circuit board (e.g., 300) extends from the printed circuit board (e.g., 216, 226) toward the antenna (e.g., 219, 229), and the second portion (e.g., 306) of the flexible circuit board (e.g., 300) is formed at a position connected to the printed circuit board (e.g., 216, 226) or the antenna (e.g., 219, 229).

[0241] In the 13th example, the housing (e.g., 201) of the electronic device according to any one of the first to twelfth examples comprises: a first housing (e.g., 210); And a second housing (e.g., 220) rotatably disposed with respect to the first housing (e.g., 210), the electronic device (e.g., 101) includes a hinge (e.g., 270) rotatably connecting the first housing (e.g., 210) and the second housing (e.g., 220), the flexible circuit board (e.g., 300) extends from the first housing (e.g., 210) toward the second housing (e.g., 220) across the hinge (e.g., 270), and the second portion (e.g., 306) of the flexible circuit board (e.g., 300) is formed at a position crossing the hinge (e.g., 270).

[0242] In the 14th example, the flexible circuit board (e.g., 300) of the electronic device according to any one of the first to 13th examples includes a bending portion (e.g., 303) extending at least partly in a curved manner; and an extension portion (e.g., 304) extending from the bending portion (e.g., 303) and in contact with the sealer (e.g., 310).

[0243] In the 15th example, the flexible circuit board (e.g., 300) of the electronic device according to any one of the first to fourteenth examples includes a first wiring (e.g., 3001); and a second wiring (e.g., 3002) formed integrally with the first wiring (e.g., 3001), and the second portion (e.g., 306) is a part of the second wiring (e.g., 3002).

[0244] In a 16th example, an electronic device (e.g., 101) includes a housing (e.g., 201); a flexible printed circuit board (e.g., 300) configured to be deformable; a support member (e.g., 2010) disposed inside the housing (e.g., 201); and a sealer (e.g., 310) disposed between the flexible printed circuit board (e.g., 300) and a portion (e.g., 2011) of the support member, wherein the flexible printed circuit board (e.g., 300) includes a first portion (e.g., 305) having a first thickness and configured to transmit a first signal; and a second portion (e.g., 306) having a second thickness smaller than the first thickness and configured to transmit a second signal, wherein the sealer (e.g., 310) includes a first sealing portion (e.g., 311) disposed at a position corresponding to the first portion (e.g., 305) and having a third thickness; And a second sealing portion (e.g., 312) is positioned corresponding to the second portion (e.g., 306) and has a fourth thickness greater than the third thickness.

[0245] In the 17th example, the flexible circuit board (e.g., 300) of the electronic device according to the 16th example includes a third part (e.g., 307) connecting the first part (e.g., 305) and the second part (e.g., 306), and the sealer (e.g., 310) connects the first sealing part (e.g., 311) and the second sealing part (e.g., 312) and includes a corner part (e.g., 313) arranged corresponding to the third part (e.g., 307).

[0246] In the 18th example, the sealer (e.g., 310) of the electronic device according to the 16th example or the 17th example includes a first overlapping portion (e.g., 315) in contact with the first portion (e.g., 305) of the flexible circuit board (e.g., 300); and a second overlapping portion (e.g., 316) in contact with the second portion (e.g., 306) of the flexible circuit board (e.g., 300) and positioned misaligned with the first overlapping portion (e.g., 315).

[0247] In the 19th example, the electronic device according to any one of the 16th to 18th examples further includes a gasket (e.g., 320) partially disposed between the flexible circuit board (e.g., 300) and the support member (e.g., 2010).

[0248] In a 20th example, an electronic device (e.g., 101) includes a housing (e.g., 201); a flexible printed circuit board (e.g., 300) configured to be deformable; a support member (e.g., 2010) disposed inside the housing (e.g., 201); and a sealer (e.g., 510) disposed between the flexible printed circuit board (e.g., 300) and a portion (e.g., 2011) of the support member, wherein the flexible printed circuit board (e.g., 300) includes a first portion (e.g., 305) having a first thickness; and a second portion (e.g., 306) having a second thickness smaller than the first thickness, and wherein the sealer (e.g., 510) includes a first sealing portion (e.g., 511) disposed corresponding to the first portion (e.g., 305) and having a first modulus; And a second sealing portion (e.g., 512) disposed corresponding to the second portion (e.g., 306) and having a second modulus greater than the first modulus.

[0249] In a twenty-first example, an electronic device (e.g., 101) comprises: a housing (e.g., 201); a flexible circuit board (e.g., 300) configured to be changeable; a support member (e.g., 2010) disposed within the housing (e.g., 201); and a sealer (e.g., 310) disposed between the flexible circuit board (e.g., 300) and a portion (e.g., 2012) of the support member, wherein the flexible circuit board (e.g., 300) comprises: a first portion (e.g., 305) having a first thickness and configured to transmit a first signal; And a second portion (e.g., 306) configured to transmit a second signal, wherein the second portion (e.g., 306) has a second thickness smaller than the first thickness or is compressed to a second thickness smaller than the first thickness, and the sealer (e.g., 310) includes: a first sealing portion (e.g., 311) disposed at a position corresponding to the first portion (e.g., 305) and having a third thickness; and a second sealing portion (e.g., 312) disposed at a position corresponding to the second portion (e.g., 306) and having a fourth thickness larger than the third thickness.

[0250] In the 22nd example, the flexible circuit board (e.g., 300) of the electronic device according to the 21st example includes a plurality of layers (e.g., 3091a, 3091b, 3091c, 3091d) including a first layer (e.g., 3091a) and a second layer (e.g., 3091b), and at least a portion of the first layer (e.g., 3091a) is separated from at least a portion of the second layer (e.g., 3091b) to form a space between a portion of the first layer (e.g., 3091a) and a portion of the second layer (e.g., 3091b).

[0251] In the 23rd example, the number of the plurality of sublayers (e.g., 3051, 3052, 3053, 3054) included in the first layer (e.g., 3091a) of the first part (e.g., 305) of the electronic device according to the 22nd example is greater than the number of the plurality of sublayers (e.g., 3061a, 3061b, 3061c) included in the first layer (e.g., 3091a) of the second part (e.g., 306).

[0252] In the 24th example, the thickness of the first space (e.g., 3092a) formed between the first layer (e.g., 3091a) and the second layer (e.g., 3091b) of the first part (e.g., 305) of the electronic device according to the 22nd or 23rd example is smaller than the thickness of the second space (e.g., 3092b) formed between the first layer (e.g., 3091a) and the second layer (e.g., 3092b) of the second part (e.g., 306).

[0253] In Example 25, the flexible circuit board (e.g., 300) of the electronic device according to any one of Examples 21 to 24 includes a third portion (e.g., 307) connected to the first portion (e.g., 305) and the second portion (e.g., 306), and the sealer (e.g., 310) includes a corner portion (e.g., 313) connected to the first sealing portion (e.g., 311) and the second sealing portion (e.g., 312) and arranged to correspond to the third portion (e.g., 307).

[0254] In the 26th example, the first sealing portion (e.g., 311) of the electronic device according to any one of the 21st to 25th examples includes a first surface (e.g., 311a) configured to be in contact with the first portion (e.g., 305) of the flexible circuit board (e.g., 300), or a first overlapping portion (e.g., 315) configured to be aligned with the first portion (e.g., 305) of the flexible circuit board (e.g., 300), and the second sealing portion (e.g., 312) includes a first surface (e.g., 312a) configured to be in contact with the second portion (e.g., 306) of the flexible circuit board (e.g., 300), and a second surface (e.g., 312a) positioned offset from the first surface (e.g., 311a), or a second surface (e.g., 312a) of the flexible circuit board (e.g., A second overlap portion (e.g., 316) configured to align with the second portion (e.g., 306) of the first overlap portion (e.g., 300), wherein the second overlap portion (e.g., 316) is positioned offset from the first overlap portion (e.g., 315).

[0255] In example 27, the electronic device according to any one of examples 21 to 26 further comprises a gasket (e.g., 320), wherein the gasket comprises at least one of a first gasket (e.g., 321) at least partially disposed between the flexible circuit board (e.g., 300) and the sealer (e.g., 310), or a second gasket (e.g., 322) at least partially disposed between the sealer (e.g., 310) and the housing (e.g., 201).

[0256] In the 28th example, the flexible circuit board (e.g., 300) of the electronic device according to the 27th example includes a recess (e.g., 308) that is sunken in a direction away from the sealer (e.g., 310), and at least a portion of the gasket (e.g., 320) is disposed between the recess (e.g., 308) and the sealer (e.g., 310).

[0257] In Example 29, an electronic device according to any one of Examples 21 to 28 includes a printed circuit board (e.g., 216, 226) disposed inside the housing (e.g., 201); and an antenna (e.g., 219, 229) spaced apart from the printed circuit board (e.g., 216, 226), wherein the flexible circuit board (e.g., 300) extends from the printed circuit board (e.g., 216, 226) toward the antenna (e.g., 219, 229), and the second portion (e.g., 306) of the flexible circuit board (e.g., 300) is formed at a position connected to the printed circuit board (e.g., 216, 226) or the antenna (e.g., 219, 229).

[0258] In the 30th example, the housing (e.g., 201) of the electronic device according to any one of the 21st to 29th examples comprises: a first housing (e.g., 210); And a second housing (e.g., 220) rotatably disposed with respect to the first housing (e.g., 210), the electronic device (e.g., 101) includes a hinge (e.g., 270) rotatably connecting the first housing (e.g., 210) and the second housing (e.g., 220), the flexible circuit board (e.g., 300) extends from the first housing (e.g., 210) in a first direction toward the second housing (e.g., 220) so as to cross the hinge (e.g., 270), and the second portion (e.g., 306) of the flexible circuit board (e.g., 300) is formed at a position crossing the hinge (e.g., 270).

[0259] In the 31st example, the first part (e.g., 305) and the second part (e.g., 306) of the flexible circuit board (e.g., 300) of the electronic device according to the 30th example are arranged parallel in a second direction perpendicular to the first direction.

[0260] In Example 32, the first sealing portion (e.g., 311) of the electronic device according to any one of Examples 21 to 31 is configured to pressurize the first portion (e.g., 305) of the flexible circuit board (e.g., 300), the second sealing portion (e.g., 312) is configured to pressurize the second portion (e.g., 306) of the flexible circuit board (e.g., 300), and the sealer is configured to block water from passing into the housing.

[0261] In the 33rd example, the flexible circuit board (e.g., 300) of the electronic device according to any one of the 21st to 32nd examples includes a bending portion (e.g., 303) extending at least partly in a curved manner; and an extension portion (e.g., 304) extending from the bending portion (e.g., 303) and configured to contact the sealer (e.g., 310).

[0262] In example 34, an electronic device (e.g., 101) comprises: a housing (e.g., 201); a flexible circuit board (e.g., 300) configured to be deformable; a support member (e.g., 2010) disposed within the housing (e.g., 201); and a sealer (e.g., 510) disposed between the flexible circuit board (e.g., 300) and a portion (e.g., 2012) of the support member, wherein the flexible circuit board (e.g., 300) comprises: a first portion (e.g., 305) having a first thickness and configured to transmit a first signal; And a second portion (e.g., 306) configured to transmit a second signal, wherein the second portion (e.g., 306) has a second thickness smaller than the first thickness, and the sealer (e.g., 510) includes: a first sealing portion (e.g., 511) arranged to correspond to the first portion (e.g., 305) and having a first elastic modulus; and a second sealing portion (e.g., 512) arranged to correspond to the second portion (e.g., 306) and having a second elastic modulus larger than the first elastic modulus.

[0263] In example 35, an electronic device (e.g., 101) comprises: a housing (e.g., 201); a flexible circuit board (e.g., 300) configured to be deformable; a support member (e.g., 2010) disposed within the housing (e.g., 201) and including a first support portion (e.g., 2012) and a second support portion (e.g., 2011); and a sealer (e.g., 510) disposed between the flexible circuit board (e.g., 300) and the first support portion (e.g., 2012) of the support member, wherein the flexible circuit board (e.g., 300) comprises: a first portion (e.g., 305) having a first thickness and configured to transmit a first signal; And a second portion (e.g., 306) configured to transmit a second signal and having a second thickness smaller than the first thickness, wherein the second support portion (e.g., 2011) includes a first region (e.g., 2011a) disposed at a position corresponding to the first portion (e.g., 305) and having a third thickness; and a second region (e.g., 2011b) disposed at a position corresponding to the second portion (e.g., 306) and having a fourth thickness larger than the third thickness.

[0264] In example 36, an electronic device (e.g., 101) comprises: a housing (e.g., 201); a flexible circuit board (e.g., 300) configured to be deformable; a support member (e.g., 2010) disposed within the housing (e.g., 201); and a sealer (e.g., 310) disposed between the flexible circuit board (e.g., 300) and a first portion (e.g., 2012) of the support member, wherein the flexible circuit board (e.g., 300) comprises: a first portion (e.g., 305) having a first thickness and configured to transmit a first signal; And a second portion (e.g., 306) configured to transmit a second signal, wherein the second portion (e.g., 306) has a second thickness smaller than the first thickness, and at least one of the second portions (e.g., 310) or the support member (e.g., 2010) comprises: a first surface (e.g., 311a, 315, 2011a) configured to contact or be aligned with the first portion (e.g., 305) of the flexible circuit board (e.g., 300); And a second surface (e.g., 312a, 316, 2011b) configured to contact or be aligned with the second portion (e.g., 306) of the flexible circuit board (e.g., 300), wherein the second surface (e.g., 312a, 316, 2011b) is arranged to be misaligned from the first surface (e.g., 311a, 315, 2011a).

[0265] In Example 37, an electronic device according to any one of Examples 34 to 35 may be combined with a feature of any one of Examples 21 to 33.

[0266] In Example 38, the type of the first signal of the electronic device according to any one of Examples 21 to 37 is different from the type of the second signal.

[0267] In the 39th example, the first signal of the electronic device according to the 38th example includes at least one of a signal transmitted from or to a display (e.g., 230) of the electronic device, a signal transmitted from or to a battery (e.g., 215, 225) of the electronic device, a signal transmitted from or to an external storage medium connected to the electronic device, and a signal transmitted using at least one logic circuit that processes data, and the second signal includes at least one of a radio frequency (e.g., RF) signal, a signal transmitted from outside the electronic device, a communication signal external to the electronic device, a signal transmitted using at least one signal transmission line, and a signal transmitted from or to an antenna module (e.g., 219, 229) of the electronic device.

[0268] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0269] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In a foldable electronic device (101), A foldable housing (201) including a first housing (210) and a second housing (220); A hinge (270) that allows the first housing (210) and the second housing (220) to be rotatably connected; A flexible circuit board (300) including a first portion (305) extending across the hinge in a first direction to be connected to a first circuit within the first housing (210) and a second circuit within the second housing (220), and including at least one signal line, and a second portion (306) including at least one signal line; and A sealer (310) is fastened between the flexible circuit board (300) and a portion (2012) of the support member (2010) inside the first housing (210), and is configured to prevent moisture from penetrating into the inside of the first housing (210). The first and second parts (305, 306) of the flexible circuit board (300) are arranged side by side in a second direction perpendicular to the first direction, and the second part (306) has a second thickness smaller than the first thickness of the first part (305), or is configured to be compressed to a second thickness smaller than the first thickness. An electronic device in which the sealer (310) includes a first sealing portion (311) that presses the first portion (305) of the flexible circuit board (300) and a second sealing portion (312) that presses the second portion (306) of the flexible circuit board (300), and the second sealing portion (312) has a thickness greater than that of the first sealing portion (311).

2. In paragraph 1, The above flexible circuit board (300) includes a plurality of layers (3091a, 3091b, 3091c, 3091d) including a first layer (3091a) and a second layer (3091b), An electronic device wherein at least a portion of the first layer (3091a) is separated from at least a portion of the second layer (3091b).

3. In paragraph 2, An electronic device in which the number of sublayers (3051, 3052, 3053, 3054) included in the first layer (3091a) of the first part (305) is greater than the number of sublayers (3061a, 3061b, 3061c) included in the first layer (3091a) of the second part (306).

4. In paragraph 2 or paragraph 3, An electronic device in which the thickness of the first space (3092a) formed between the first layer (3091a) and the second layer (3091b) of the first part (305) is smaller than the thickness of the second space (3092b) formed between the first layer (3091a) and the second layer (3092b) of the second part (306).

5. In any one of paragraphs 1 to 4, An electronic device in which the third thickness of the first sealing portion (311) is smaller than the fourth thickness of the second sealing portion (312).

6. In any one of paragraphs 1 to 5, The above flexible circuit board (300) is Including a third part (307) connecting the first part (305) and the second part (306), The above sealer (310) is An electronic device that connects the first sealing portion (311) and the second sealing portion (312) and includes a corner portion (313) positioned corresponding to the third portion (307).

7. In any one of paragraphs 1 to 6, The above first sealing portion (311) is A first surface (311a) configured to be in contact with the first portion (305) of the flexible circuit board (300), or a first overlapping portion (315) configured to be aligned with the first portion (305) of the flexible circuit board (300), The above second sealing portion (312) is A first second surface (312a) configured to be in contact with the second portion (306) of the flexible circuit board (300), a second surface (312a) positioned offset from the first surface (311a), or An electronic device including a second overlap portion (316) configured to be aligned with the second portion (306) of the flexible circuit board (300), the second overlap portion (316) being positioned offset from the first overlap portion (315).

8. In any one of paragraphs 1 to 7, Including a gasket (320), The above gasket, An electronic device comprising at least one of a first gasket (321) at least partially disposed between the flexible circuit board (300) and the sealer (310), or a second gasket (322) at least partially disposed between the sealer (310) and the housing (201).

9. In paragraph 8, The above flexible circuit board (300) is Includes a recess (308) sunken in a direction away from the sealer (310), An electronic device wherein at least a portion of the gasket (320) is disposed between the recess (308) and the sealer (310).

10. In any one of paragraphs 1 to 9, A printed circuit board (216, 226) placed inside the housing (201); and It includes an antenna (219, 229) spaced apart from the printed circuit board (216, 226), An electronic device in which the flexible circuit board (300) extends from the printed circuit board (216, 226) toward the antenna (219, 229), and the second part (306) of the flexible circuit board (300) is formed at a position connected to the printed circuit board (216, 226) or the antenna (219, 229).

11. In any one of paragraphs 1 to 10, The above housing (201) is, First housing (210); and It includes a second housing (220) rotatably arranged with respect to the first housing (210), The electronic device (101) includes a hinge (270) that rotatably connects the first housing (210) and the second housing (220), The above flexible circuit board (300) extends across the hinge (270) in the first direction from the first housing (210) toward the second housing (220), An electronic device in which the second part (306) of the above flexible circuit board (300) is formed at a position crossing the hinge (270).

12. In any one of paragraphs 1 to 11, The above flexible circuit board (300) is At least a portion of the banding portion (303) extending in a curved manner; and An electronic device including an extension portion (304) extending from the above banding portion (303) and configured to come into contact with the sealer (310).

13. In any one of paragraphs 1 to 12, The above flexible circuit board (300) is First wiring (3001); and Including a second wiring (3002) formed integrally with the first wiring (3001), The above second part (306) is an electronic device that is a part of the above second wiring (3002).

14. In the electronic device (101), Housing (201); A flexible circuit board (300) configured to be deformable; A support member (2010) arranged inside the housing (201); and Including a sealer (510) placed between the flexible circuit board (300) and a portion (2012) of the support member, The above flexible circuit board (300) is A first portion (305) configured to transmit a first signal having a first thickness; and A second portion (306) configured to transmit a second signal and having a second thickness smaller than the first thickness, The above sealer (510) is A first sealing portion (511) arranged corresponding to the first portion (305) and having a first elastic modulus; and An electronic device comprising a second sealing portion (512) arranged corresponding to the second portion (306) and having a second elastic modulus greater than the first elastic modulus.

15. In the electronic device (101), Housing (201); A flexible circuit board (300) configured to be deformable; A support member (2010) disposed inside the housing (201) and including a first support portion (2012) and a second support portion (2011); and Including a sealer (510) placed between the flexible circuit board (300) and the first support portion (2012) of the support member, The above flexible circuit board (300) is A first portion (305) configured to transmit a first signal having a first thickness; and A second portion (306) configured to transmit a second signal and having a second thickness smaller than the first thickness, The above second support part (2011) is, A first region (2011a) positioned corresponding to the first portion (305) and having a third thickness; and An electronic device including a second region (2011b) positioned corresponding to the second portion (306) and having a fourth thickness greater than the third thickness.

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