Electronic device including flexible printed circuit board

Abstract

A wearable electronic device is provided. The wearable electronic device includes a frame accommodating at least one lens or at least one display, a temple connected to an end of the frame, and a flexible printed circuit board (FPCB) having at least a portion disposed on the temple and extending along the longitudinal direction. The flexible printed circuit board includes: a plurality of substrate layers which have one or more circuit lines formed on a surface thereof and are disposed to overlap each other along the thickness direction; and at least one connection layer disposed between the plurality of substrate layers and connecting the surfaces of the substrate layers adjacent to each other. When the flexible printed circuit board is viewed in the thickness direction, the flexible printed circuit board includes a first circuit area having formed therein a data line for transmitting a data signal, and the at least one connection layer does not overlap the first circuit area.

Description

Electronic devices including flexible circuit boards

[0001] The disclosure relates to an electronic device including a flexible circuit board.

[0002] Advances in electronic technology have led to the development and proliferation of various types of electronic products. For example, the proliferation of wearable electronic devices, such as wearable electronics, is increasing.

[0003] The above information is provided solely as background information to aid in understanding the disclosure. No claim is made, and no determination has been made, as to whether the above-mentioned content constitutes prior art in connection with the present disclosure.

[0004] Aspects of the present disclosure address at least the aforementioned problems and / or disadvantages and provide at least the advantages described below. Accordingly, one aspect of the present disclosure provides an electronic device including a flexible printed circuit board (FPCB).

[0005] According to one aspect of the disclosure, a wearable electronic device is provided. The wearable electronic device may include a frame that accommodates at least one lens or at least one display, a temple connected to an end of the frame, and a flexible printed circuit board (FPCB) at least a portion of which is disposed on the temple and extends in a longitudinal direction. The flexible printed circuit board may include a plurality of substrate layers having one or more circuit lines formed on a surface thereof and arranged to overlap each other in a thickness direction, and at least one connection layer disposed between the plurality of substrate layers and connecting surfaces of adjacent substrate layers. In one embodiment, the flexible printed circuit board includes a first circuit region in which a data line for transmitting a data signal is formed when the flexible printed circuit board is viewed in the thickness direction. The at least one connection layer is arranged to not overlap the first circuit region.

[0006] According to one aspect of the disclosure, a flexible circuit board is provided. The flexible circuit board may include a plurality of substrate layers having circuit lines formed on surfaces thereof and arranged to overlap in a thickness direction, and at least one connection layer connecting at least a portion between the plurality of substrate layers. In one embodiment, each of the substrate layers may include a first circuit region in which a data line for transmitting a data signal along a longitudinal direction of the flexible circuit board is formed, and a second circuit region in which a power line for transmitting a power signal along a longitudinal direction of the flexible circuit board is formed. In one embodiment, the at least one connection layer may be arranged to not overlap the first circuit region.

[0007] According to one aspect of the disclosure, an electronic device is provided. The electronic device may include a housing in which a component element is disposed therein, and a flexible circuit board disposed inside the housing, electrically connected to the component element, and at least partially bendable in a longitudinal direction. The flexible circuit board may include a plurality of substrate layers arranged to overlap in a thickness direction and having circuits formed on surfaces thereof, and at least one connection layer arranged between at least a portion of the plurality of substrate layers and connecting a pair of adjacent substrate layers. In one embodiment, the flexible circuit board may include, when viewed in a thickness direction, a first circuit region in which a data line formed to transmit a data signal along the longitudinal direction is located, and a second circuit region in which a power line formed to transmit a power signal along the longitudinal direction is located. In one embodiment, the at least one connection layer may be arranged to not overlap the first circuit region.

[0008] Other aspects, advantages and important features of the disclosure will become apparent to those skilled in the art from the following description of various embodiments of the present disclosure taken in conjunction with the accompanying drawings.

[0009] The above and other aspects, features and advantages according to specific embodiments of the disclosure will become more apparent from the following description with reference to the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIG. 2 is a perspective view illustrating the internal configuration of a wearable electronic device according to an embodiment of the present disclosure.

[0012] FIG. 3A is a drawing showing the front side of a wearable electronic device according to an embodiment of the present disclosure.

[0013] FIG. 3b is a drawing showing the back of a wearable electronic device according to an embodiment of the present disclosure.

[0014] FIG. 4A is a perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0015] FIG. 4b is a side view of a flexible circuit board according to one embodiment of the present disclosure.

[0016] FIG. 4c is a partial enlarged view of a flexible circuit board according to an embodiment of the present disclosure, showing an enlarged area A of FIG. 4a.

[0017] FIG. 4d is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure.

[0018] FIG. 4e is a cross-sectional view of a flexible circuit board taken along line II-II of FIG. 4c according to an embodiment of the present disclosure.

[0019] FIG. 4f is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure.

[0020] FIG. 4g is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure.

[0021] FIG. 4h is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure.

[0022] FIG. 4i is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to one embodiment of the present disclosure.

[0023] FIG. 4J is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4C according to an embodiment of the present disclosure.

[0024] FIG. 5A is a partial perspective view illustrating a bending portion of a flexible circuit board according to one embodiment of the present disclosure.

[0025] FIG. 5b is a partial perspective view illustrating a bending portion of a flexible circuit board according to one embodiment of the present disclosure.

[0026] FIG. 5c is a partial perspective view illustrating a bending portion of a flexible circuit board according to one embodiment of the present disclosure.

[0027] FIG. 6A is a partial enlarged view of a flexible circuit board according to one embodiment of the present disclosure.

[0028] FIG. 6b is a cross-sectional view of a flexible circuit board taken along line Ⅲ-Ⅲ of FIG. 6a according to an embodiment of the present disclosure.

[0029] FIG. 6c is a cross-sectional view of a flexible circuit board taken along line Ⅲ-Ⅲ of FIG. 6a according to one embodiment of the present disclosure.

[0030] FIG. 7a is a partial enlarged view of a flexible circuit board according to one embodiment of the present disclosure.

[0031] FIG. 7b is a side view of a flexible circuit board according to one embodiment of the present disclosure.

[0032] FIG. 7c is a cross-sectional view of a flexible circuit board taken along line IV-IV of FIG. 7a according to an embodiment of the present disclosure.

[0033] FIG. 7d is a cross-sectional view of a flexible circuit board according to area D of FIG. 7b according to one embodiment of the present disclosure.

[0034] FIG. 7e is a cross-sectional view of a flexible circuit board according to area D of FIG. 7b according to one embodiment of the present disclosure.

[0035] FIG. 8A is a perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0036] FIG. 8b is a partial enlarged view of a flexible circuit board according to an embodiment of the present disclosure, showing an enlarged area C of FIG. 8a.

[0037] FIG. 8c is a cross-sectional view of a flexible circuit board taken along line V-V of FIG. 8b according to an embodiment of the present disclosure.

[0038] FIG. 8d is a partial enlarged view of a flexible circuit board according to an embodiment of the present disclosure, showing an enlarged area C of FIG. 8a.

[0039] FIG. 8e is a cross-sectional view of a flexible circuit board taken along line VI-VI of FIG. 8d according to an embodiment of the present disclosure.

[0040] FIG. 9A is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0041] FIG. 9b is a rear view of an electronic device according to an embodiment of the present disclosure.

[0042] FIG. 9c is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0043] FIG. 9d is a partial perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0044] FIG. 9e is a cross-sectional view of a flexible circuit board taken along line Ⅶ-Ⅶ of FIG. 9d according to an embodiment of the present disclosure.

[0045] FIG. 10A is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0046] FIG. 10b is a rear view of an electronic device according to an embodiment of the present disclosure.

[0047] FIG. 10c is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0048] FIG. 10d is a perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0049] FIG. 10e is a cross-sectional view of a flexible circuit board taken along line Ⅸ-Ⅸ of FIG. 10d according to an embodiment of the present disclosure.

[0050] FIG. 11A is a perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0051] FIG. 11b is a rear view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0052] FIG. 11c is a perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0053] FIG. 11d is a partial perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0054] FIG. 11e is a cross-sectional view of a flexible circuit board taken along line XIe-XIe of FIG. 11d according to one embodiment of the present disclosure.

[0055] FIG. 12A is a front perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0056] FIG. 12b is a front perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0057] FIG. 12c is a rear perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0058] FIG. 12d is a rear perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0059] FIG. 12e is a side perspective view of an electronic device for illustrating a flexible circuit board according to one embodiment of the present disclosure.

[0060] FIG. 12f is a partial perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0061] FIG. 12g is a cross-sectional view of a flexible circuit board taken along line XIIg-XIIg of FIG. 12f according to an embodiment of the present disclosure.

[0062] The same reference numerals are used throughout the drawing to indicate the same elements.

[0063] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While the description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope of the appended drawings and the spirit of the present disclosure. Furthermore, like reference numerals designate like elements, and repetitive descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0064] The terms and words used in the following description and claims are not limited to their dictionary meanings, but are used solely to enable the inventor to clearly and consistently understand the contents of the present disclosure. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the contents of the present disclosure, which are defined by the appended claims and their equivalents.

[0065] The singular forms "a," "an," and "the" should be understood to include the plural unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more such surfaces.

[0066] It should be understood that each block of the flowchart and the combination of the flowcharts can be performed by one or more computer programs containing instructions. One or more computer programs may be stored entirely in a single memory device, or one or more computer programs may be divided into multiple parts and stored in multiple different memory devices.

[0067] The functions or operations described in this document may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing and includes circuits such as an application processor (AP) (e.g., a central processing unit (CPU)), a communication processor (CP) (e.g., a modem), a graphic processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, a Bluetooth® chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec (CODEC) chip, a USB controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), an IC, and the like.

[0068] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to an embodiment of the present disclosure.

[0069] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a wireless power transmission / reception module (187), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may include one or more other components. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into one component (e.g., display module (160)).

[0070] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0071] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0072] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0073] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0074] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0075] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0076] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0077] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0078] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0079] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0080] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0081] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0082] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0083] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0084] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0085] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0086] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, for example, new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., millimeter wave (mmWave) band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 eB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0087] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0088] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0089] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0090] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (e.g., the external electronic devices (102, 104), or the server (108)). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform the function or at least a part of the service instead of executing the function or service on its own or in addition. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (104) or server (108) may be included in the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0091] According to one embodiment, each of the external electronic devices (102, 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more external electronic devices (e.g., external electronic devices (102, 104) or server (108)). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to perform the function or at least a part of the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a part of a response to the request.

[0092] For example, an external electronic device (102) can render content data executed in an application and transmit it to the electronic device (101), and the electronic device (101) that receives the data can output the content data to the display module (160). If the electronic device (101) detects a user's movement through a sensor, the processor (120) of the electronic device (101) can correct the rendering data received from the external electronic device (102) based on the movement information and output it to the display module (160). Alternatively, the processor (120) of the electronic device (101) can transmit the movement information to the external electronic device (102) and request rendering so that the screen data is updated accordingly. According to an embodiment, the external electronic device (102) may be various types of devices, such as a smartphone or a case device that can store and charge the electronic device (101).

[0093] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0094] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0095] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0096] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0097] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0098] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0099] FIG. 2 is a perspective view illustrating the internal configuration of a wearable electronic device according to an embodiment of the present disclosure.

[0100] Referring to FIG. 2, a wearable electronic device (201) according to one embodiment may include at least one of a light output module (211), a display member (213), and a camera module (250). An electronic device (e.g., the electronic device (101) of FIG. 1) may be implemented in the form of a wearable electronic device (201).

[0101] In one embodiment, a wearable electronic device (201) may include a pair of frames (210-1, 210-2) on which a pair of lenses are each mounted, and a bridge (210-3) connecting the pair of frames (210-1, 210-2). Temples may be provided at the ends of each frame for wearing by a user.

[0102] According to one embodiment, the light output module (211) may include a light source capable of outputting an image, and a lens that guides the image to a display member (213). According to one embodiment, the light output module (211) may include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCos), an organic light emitting diode (OLED), or a micro light emitting diode (micro LED).

[0103] According to one embodiment, the display member (213) may include an optical waveguide (e.g., a waveguide). According to one embodiment of the present disclosure, an output image of the optical output module (211) incident on one end of the optical waveguide may be propagated inside the optical waveguide and provided to a user. According to one embodiment, the optical waveguide may include at least one diffractive element (e.g., a diffractive optical element (DOE), a holographic optical element (HOE)) or at least one reflective element (e.g., a reflective mirror). For example, the optical waveguide may guide the output image of the optical output module (211) to the user's eyes by using at least one diffractive element or reflective element.

[0104] According to one embodiment, the camera module (250) can capture still images and / or moving images. According to one embodiment, the camera module (250) can be positioned within the lens frame and can be positioned around the display member (213).

[0105] According to one embodiment, the first camera module (251) can capture and / or recognize the trajectory of the user's eye (e.g., pupil, iris) or gaze. According to one embodiment, the first camera module (251) can periodically or aperiodically transmit information related to the trajectory of the user's eye or gaze (e.g., trajectory information) to a processor (e.g., processor (120) of FIG. 1).

[0106] According to one embodiment, the second camera module (253) can capture an external image.

[0107] According to one embodiment, the third camera module (255) can be used for hand detection and tracking, and user gesture (e.g., hand movement) recognition. According to one embodiment, the third camera module (255) can be used for 3 degrees of freedom (3DoF), 6DoF head tracking, position (spatial, environmental) recognition, and / or movement recognition. According to one embodiment, the second camera module (253) can also be used for hand detection and tracking, and user gesture recognition. According to one embodiment, at least one of the first camera module (251) to the third camera module (255) can be replaced with a sensor module (e.g., a LiDAR sensor). For example, the sensor module can include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and / or a photodiode.

[0108] FIG. 3A is a diagram illustrating a front side of a wearable electronic device according to an embodiment of the present disclosure. FIG. 3B is a diagram illustrating a rear side of a wearable electronic device according to an embodiment of the present disclosure.

[0109] Referring to FIGS. 3A and 3B, an electronic device (e.g., the electronic device (101) of FIG. 1) may be implemented in the form of a wearable electronic device (301) (e.g., the wearable electronic device (201) of FIG. 2). Camera modules (311, 312, 313, 314, 315, 316) and / or a depth sensor (317) for obtaining information related to the surrounding environment of the wearable electronic device (301) may be arranged on a first surface (310) of the housing.

[0110] In one embodiment, the camera modules (311, 312) can acquire images related to the environment surrounding the wearable electronic device (301).

[0111] In one embodiment, the camera modules (313, 314, 315, 316) can acquire images while the wearable electronic device is worn by a user. The camera modules (313, 314, 315, 316) can be used for hand detection, tracking, and recognition of user gestures (e.g., hand movements). The camera modules (313, 314, 315, 316) can be used for 3DoF, 6DoF head tracking, position (spatial, environmental) recognition, and / or movement recognition. In one embodiment, the camera modules (311, 312) can also be used for hand detection and tracking, and user gestures.

[0112] In one embodiment, the depth sensor (317) may be configured to transmit a signal and receive a signal reflected from a subject, and may be used for purposes such as time of flight (TOF) to determine the distance to an object. Instead of or in addition to the depth sensor (217), the camera modules (313, 314, 315, 316) may determine the distance to an object.

[0113] In one embodiment, a camera module (325, 326) for facial recognition and / or a display (321) (and / or a lens) may be disposed on the second side (320) of the housing.

[0114] In one embodiment, a face recognition camera module (325, 326) adjacent to the display may be used to recognize a user's face, or may recognize and / or track both eyes of the user.

[0115] In one embodiment, the display (321) (and / or lens) may be disposed on the second side (320) of the wearable electronic device (301). In one embodiment, the wearable electronic device (301) may not include camera modules (315, 316) among the plurality of camera modules (313, 314, 315, 316). Although not illustrated in FIGS. 3A and 3B , the wearable electronic device (301) may further include at least one of the configurations illustrated in FIG. 2 .

[0116] As described above, according to one embodiment, the wearable electronic device (301) may have a form factor for being worn on a user's head. The wearable electronic device (301) may further include a strap and / or a wearing member for being secured on a body part of the user. The wearable electronic device (301) may provide a user experience based on augmented reality, virtual reality, and / or mixed reality while being worn on the user's head.

[0117] FIG. 4A is a perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0118] FIG. 4b is a side view of a flexible circuit board according to one embodiment of the present disclosure.

[0119] FIG. 4c is a partial enlarged view of a flexible circuit board according to an embodiment of the present disclosure, showing an enlarged area A of FIG. 4a.

[0120] FIG. 4d is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure.

[0121] FIG. 4e is a cross-sectional view of a flexible circuit board taken along line II-II of FIG. 4c according to an embodiment of the present disclosure.

[0122] FIG. 4f is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure. FIG. 4g is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c.

[0123] FIG. 4h is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to an embodiment of the present disclosure.

[0124] FIG. 4i is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4c according to one embodiment of the present disclosure.

[0125] FIG. 4J is a cross-sectional view of a flexible circuit board taken along line II of FIG. 4C according to an embodiment of the present disclosure.

[0126] Referring to FIG. 4A, a wearable electronic device (401) according to an embodiment (e.g., the electronic device (101) of FIG. 1, the wearable electronic device (201) of FIG. 2, the wearable electronic device (301) of FIG. 3A) may include a housing (400) forming an exterior of the wearable electronic device (401), and a flexible circuit board (4400) disposed within the housing (400).

[0127] In one embodiment, the housing (400) may include a frame (4100) and a temple (4200). In one embodiment, the frame (4100) may be positioned on the user's face while the wearable electronic device (401) is worn on the user's head. The frame (4100) may be mounted on the user's head to cover the user's eyes, for example. In one embodiment, the frame (4100) may have at least one lens or at least one display (e.g., the display (321) of FIG. 3B) positioned at a portion corresponding to the user's eyes.

[0128] The temples (4200) may extend from each end (e.g., in the + / - Z direction) of the frame (4100). In one embodiment, the temples (4200) may be mounted on the side of the user's head while the wearable electronic device (401) is worn on the user's head. For example, the temples (4200) may be mounted to be hooked onto the user's ears, thereby supporting the wearable electronic device (401) to be fixed on the user's head. In one embodiment, the temples (4200) may be formed as a pair, each formed at each end of the frame (4100). In another example, the temples (4200) may be formed as a single member that is connected to each end of the frame (4100) and wraps around the user's head. For example, the temples (4200) may be formed of a flexible material and may be formed in a form that is mounted to wrap around the user's head. In one embodiment, the temple (4200) may be formed to be foldable or partially bendable relative to the frame (4100). As the connection shape of the temple (4200) to the frame (4100) changes, the shape of the wearable electronic device (401) may change during use.

[0129] One or more electronic components may be placed inside the housing (400). For example, the wearable electronic device (401) may be placed inside the frame (4100) and may include a printed circuit board (4408) on which one or more component elements are mounted. For example, a processor (e.g., the processor (120) of FIG. 1) for controlling the operation of the wearable electronic device (401) may be placed on the printed circuit board (4408). The wearable electronic device (401) may include a speaker (4300), a microphone, a battery, an antenna, and / or various types of sensors placed inside the housing (400).

[0130] In one embodiment, the wearable electronic device (401) may include one or more connection terminals (4409) for connection to an external electronic device and / or an external power source. In one embodiment, the connection terminals (4409) may be formed in the form of a connector. In one embodiment, the connection terminals (4409) may be positioned at an extended end of the temple (4200), but the location is not limited thereto.

[0131] In one embodiment, a flexible printed circuit board (FPCB) (4400) can electrically connect two or more component elements within a wearable electronic device (401). For example, the flexible circuit board (4400) can be arranged to span a frame (4100) and a temple (4200) of the wearable electronic device (401), and a first end (4400A) can be connected to a printed circuit board (4408) arranged on the frame (4100) and a second end (4400B) can be connected to a connection terminal (4409) arranged on the temple (4200). The flexible circuit board (4400) can electrically connect two component elements connected to each other, for example, the printed circuit board (4408) and the connection terminal (4409), and transmit data signals and / or power signals between them. The arrangement position and shape of the flexible circuit board (4400) disposed inside the wearable electronic device (401) illustrated in the drawing are exemplary, and the arrangement position and shape of the flexible circuit board (4400) may be changed in various ways. For example, in the structure of the wearable electronic device (wearable electronic device (201) of FIG. 2) illustrated in FIG. 2, the flexible circuit board may be disposed with at least a portion formed in a curve within a bridge (210-3) connecting a pair of lens frames (210-1, 210-2).

[0132] In one embodiment, the flexible circuit board (4400) may be formed to be flexible so as to be partially bendable. The flexible circuit board (4400) may be placed in a partially bent state within the housing (400). For example, as illustrated in FIG. 4A, when the flexible circuit board (4400) is placed in the temple (4200) so that a portion thereof overlaps the speaker (4300), the portion of the flexible circuit board (4400) that overlaps the speaker (4300) may be partially bent in accordance with the thickness of the speaker (4300). In one embodiment, the flexible circuit board (4400) may be configured to be partially bendable in accordance with changes in the shape of the wearable electronic device (401) or its form factor depending on use.

[0133] Referring to FIGS. 4b, 4c, 4d, and 4e, in one embodiment, a flexible circuit board (4400) may include a plurality of substrate layers (4410) arranged to overlap in a thickness direction (e.g., in the Z-axis direction), and one or more connecting layers (4420) that partially connect the plurality of substrate layers (4410) along the thickness direction (e.g., in the Z-axis direction). In one embodiment, the flexible circuit board (4400) may include one or more bending portions (4430) that are partially bent along the thickness direction (e.g., in the Z-axis direction). For example, when a flexible circuit board (4400) is placed across a frame (4100) and a temple (4200) of a wearable electronic device (401) as illustrated in FIG. 4A, a bending portion (4430) of the flexible circuit board (4400) can be formed at a location where the frame (4100) and the temple (4200) are connected.

[0134] In one embodiment, a plurality of substrate layers (4410) may extend along the longitudinal direction of the flexible circuit board (4400). The plurality of substrate layers (4410) may be formed with substantially the same area and may be sequentially stacked along the thickness direction. For example, the plurality of substrate layers (4410) may include a first substrate layer (4410a), a second substrate layer (4410b), and a third substrate layer (4410c) that are sequentially overlapped along the -Z direction. In one embodiment, each substrate layer may be formed of a flexible material, for example, a polyimide (PI) material. A metal pattern for forming a circuit line may be formed on the surface of each substrate layer. The metal pattern may be formed of, for example, a copper (Cu) material.

[0135] In one embodiment, one or more connection layers (4420) can be disposed between at least a portion of a plurality of substrate layers (4410) to connect adjacent substrate layers (4410) to each other. For example, the connection layers (4420) can bond adjacent substrate layers (4410) along the thickness direction. In one embodiment, when the flexible circuit board (4400) includes three substrate layers (4410a, 4410b, 4410c), the connection layers (4420) can include one or more first connection layers (4420a) disposed between a first substrate layer (4410a) and a second substrate layer (4410b), and one or more second connection layers (4420b) disposed between the second substrate layer (4410b) and a third substrate layer (4410c). In one embodiment, each connecting layer (4420) can mutually bond portions of a pair of substrate layers (4410) that are in contact with each other on both sides. For example, the connecting layer (4420) can be formed of a prepreg (PP) material or a bonding sheet that performs a bonding function. In one embodiment, each connecting layer (4420) can be formed of only one of a prepreg material and a bonding sheet, but can also be formed by mixing prepreg materials and bonding sheets. However, this is merely an example, and the material of the connecting layer (4420) is not limited thereto.

[0136] In one embodiment, a plurality of first connection layers (4420a) are arranged at different locations between a first substrate layer (4410a) and a second substrate layer (4410b), and the first substrate layer (4410a) and the second substrate layer (4410b) can be mutually bonded in an area overlapping with the plurality of first connection layers (4420a) (e.g., an area overlapping in the Z-axis direction). A plurality of second connection layers (4420b) are arranged at different locations between a second substrate layer (4410b) and a third substrate layer (4410c), and the second substrate layer (4410b) and the third substrate layer (4410c) can be mutually bonded in an area overlapping with the plurality of second connection layers (4420b) (e.g., an area overlapping in the Z-axis direction).

[0137] In one embodiment, a plurality of connection layers (4420) can bond a plurality of substrate layers (4410) in the thickness direction with a bending portion (4430) of a flexible circuit board (4400) interposed therebetween. Accordingly, the flexible circuit board (4400) can have at least a portion of the substrate layers (4410) bonded at a portion adjacent to the bending portion (4430), thereby reducing or preventing a phenomenon in which a gap is formed between each substrate layer (4410) at the bending portion (4430).

[0138] In one embodiment, each connecting layer (4420) may be formed with a plurality of through holes (e.g., slits (74201) in FIG. 7C) or a plurality of recesses (e.g., recesses (740202) in FIG. 7D). For example, the through holes, slits, or recesses formed in the connecting layer (4420) may form a gap between the portion of the substrate layer (4410) that overlaps the connecting layer (4420).

[0139] Hereinafter, a description will be given of an embodiment in which a flexible circuit board (4400) includes three substrate layers (4410) and a plurality of connection layers (4420) arranged between each substrate layer (4410). However, this is merely an example for convenience of explanation, and it should be noted that the number of layers of the flexible circuit board (4400) is not limited thereto. For example, as illustrated in FIG. 4h, a flexible circuit board (4400F) may be formed with a structure in which two substrate layers (4410) are overlapped, and as illustrated in FIG. 4i, a flexible circuit board (4400G) may be formed with a structure in which four or more substrate layers (4410) are overlapped.

[0140] In one embodiment, one or more circuit lines (4411) may be formed on the surface of each substrate layer (4410), as illustrated in FIG. 4C. With respect to one substrate layer (4410), the circuit lines (4411) may be formed on both surfaces of the substrate layer (4410), or may be formed on only one surface. In one embodiment, the circuit lines (4411) formed on the substrate layer (4410) may include a data line (4411-1) for transmitting a data signal, a power line (4411-2) for transmitting a power signal, and a ground line (4411-3) for grounding. In one embodiment, each of the data line (4411-1), the power line (4411-2), and the ground line (4411-3) may be formed on the substrate layer (4410) so as to extend along the longitudinal direction of the flexible circuit board (4400).

[0141] In one embodiment, each circuit line (4411) formed on a plurality of substrate layers (4410) may be formed in a different shape and number. In one embodiment, the data line (4411-1) formed on the surface of each substrate layer (4410) may be formed at a position where they overlap each other in the thickness direction of the flexible circuit board (4400). The power line (4411-2) formed on the surface of each substrate layer (4410) may be formed at a position where they overlap each other in the thickness direction of the flexible circuit board (4400). The ground line (4411-3) formed on the surface of each substrate layer (4410) may be formed at a position where they overlap each other in the thickness direction of the flexible circuit board (4400). Hereinafter, for convenience of explanation, an embodiment in which data lines (4411-1), power lines (4411-2), and ground lines (4411-3) formed on multiple substrate layers (4410) of a flexible circuit board (4400) overlap each other along the thickness direction will be described. However, it should be noted that this is only one example, and the arrangement of circuit lines formed on each substrate layer (4410) is not limited thereto.

[0142] In one embodiment, when the flexible circuit board (4400) is viewed in the thickness direction (T) (e.g., the Z-axis), for example, when the surface of the flexible circuit board (4400) (e.g., the first substrate layer (4410a)) is viewed, the flexible circuit board (4400) may include a first circuit region (4510) in which a data line (4411-1) is located, a second circuit region (4520) in which a power line (4411-2) is located, and a third circuit region (4530a, 4530b) in which a ground line (4411-3) is located. In one embodiment, the first circuit region (4510), the second circuit region (4520), and the third circuit region (4530) may not overlap each other when the flexible circuit board (4400) is viewed in the thickness direction (T). In one embodiment, the third circuit region (4530a, 4530b) may be formed integrally or may be formed as a plurality of separate regions. For example, the third circuit region (4530a, 4530b) may include a 3-1 circuit region (4530a) and a 3-2 circuit region (4530b) located on both sides in the width direction (e.g., X-axis direction) of the first circuit region (4510) in which the data line (4411-1) is formed.

[0143] In one embodiment, the flexible circuit board (4400) may be divided into one or more connection regions (4540) in which at least one pair of substrate layers (4410) are mutually connected by a connection layer (4420) when viewed in the thickness direction (T), and a non-connection region (4550) in which the substrate layers (4410) are not mutually connected. For example, it may be understood that the connection layer (4420) is positioned in a region of the flexible circuit board (4400) corresponding to the connection region (4540). In one embodiment, a plurality of connection regions (4540) may be formed in the flexible circuit board (4400). The plurality of connection regions (4540) may be respectively formed in different regions of the flexible circuit board (4400). In one embodiment, the connection regions (4540) in the flexible circuit board (4400) may be formed in a region that does not overlap with the first circuit region (4510). For example, the connection layer (4420) may be omitted from the surface of the substrate layer (4410) on which the data line (4411-1) is formed, and the first circuit area (4510) of the flexible circuit board (4400) may be formed as a non-connection area (4550).

[0144] In one embodiment, the connection region (4540) may be formed in a portion overlapping the second circuit region (4520) and / or the third circuit region (4530). For example, the connection layer (4420) may be disposed on a surface portion of the substrate layer (4410) where the power line (4411-2) is formed, or may be disposed on a surface portion of the substrate layer (4410) where the ground line (4411-3) is formed. In this case, at least a portion of the second circuit region (4520) of the flexible circuit board (4400) may be formed as the connection region (4540), and the remaining portion may be formed as the non-connection region (4550). At least a portion of the third circuit region (4530) of the flexible circuit board (4400) may be formed as the connection region (4540), and the remaining portion may be formed as the non-connection region (4550).

[0145] In one embodiment, when the connection area (4540) in the flexible circuit board (4400) is formed at a non-overlapping position with the first circuit area (4510), the portion where the data line (4411-1) of each substrate layer (4410) is formed may be spaced apart from the other substrate layers (4410). In this case, the phenomenon in which signals transmitted through the data lines (4411-1) arranged in the first circuit areas (4510) of adjacent substrate layers mutually interfere with each other and the data transmission performance of the flexible circuit board (4400) deteriorates can be reduced or prevented.

[0146] In one embodiment, the connection area (4540) of the flexible circuit board (4400) may be formed at an edge in the width direction (e.g., the X-axis direction in FIG. 4D) of the flexible circuit board (4400). For example, based on a cross-section of a portion of the flexible circuit board (4400) where the connection area (4540) is located, as shown in FIG. 4D, a pair of connection areas (4540) may be formed at each of the width direction ends of the flexible circuit board (4400). In the connection area (4540), a first connection layer (4420a) may be disposed between a first substrate layer (4410a) and a second substrate layer (4410b), and a second connection layer (4420b) may be disposed between a second substrate layer (4410b) and a third substrate layer (4410c). An empty space (G) may be formed between each substrate layer (4410a, 4410b, 4410c) in the non-connected region (4550).

[0147] Referring to FIG. 4d, the connection area (4540) may be formed to not overlap the first circuit area (4510) of the flexible circuit board (4400) in the thickness direction (T). For example, the connection area (4540) located at the -X-axis end of the flexible circuit board (4400) may be formed to overlap the 3-1 circuit area (4530a) of the flexible circuit board (4400) in the thickness direction (T), and in the 3-1 circuit area (4530a), each substrate layer (4410a, 4410b, 4410c) may be mutually bonded through the connection layers (4420a, 4420b) disposed therebetween. The connection area (4540) located at the +X-axis end of the flexible circuit board (4400) may be formed to overlap the second circuit area (4520) of the flexible circuit board (4400), and each substrate layer (4410a, 4410b, 4410c) in a part of the second circuit area (4520) may be connected through the connection layers (4420a, 4420b) disposed therebetween. In the example illustrated in FIG. 4d, the first connection layer (4420a) and the second connection layer (4420b) disposed in the connection area are illustrated as having the same thickness and width, but this is exemplary, and it should be noted that the first connection layer (4420a) and the second connection layer (4420b) may have different thicknesses and / or widths at positions where they do not overlap the first circuit area (4510). A non-connected region (4550) may be formed between a pair of connection regions (4540) located at the widthwise end of the flexible circuit board (4400), and an empty space (G) may be formed between each substrate layer (4410) of the flexible circuit board (4400) in the non-connected region (4550).

[0148] As illustrated in FIG. 4e, the portion of the flexible circuit board (4400) in which no connection area (4540) is formed along the width direction is formed only as a non-connection area (4550), so that each substrate layer (4410a, 4410b, 4410c) can overlap in the thickness direction (T) while being separated from each other.

[0149] In one embodiment, the flexible circuit board (4400) can maintain the flexible performance of the flexible circuit board (4400) by preventing excessive gaps between the plurality of substrate layers (4410) by bonding only a portion of the plurality of substrate layers (4410) through a connection area (4540) where a connection layer (4420) is disposed, while enabling individual bending of each substrate layer (4410a, 4410b, 4410c) through a non-connection area (4550) where a connection layer (4420) is omitted.

[0150] In one embodiment, when a plurality of connection layers (4420) are arranged on a flexible circuit board (4400), at least some of the plurality of connection layers (4420) may be formed of different materials. For example, the connection layers (4420) may be formed of at least one of a prepreg sheet formed of a prepreg material and / or a bonding sheet formed of a bonding material, depending on the arrangement position on the flexible circuit board (4400). For example, as in the cross-section of FIG. 4d, when a pair of connection regions (4540) are formed at both ends in the width direction (e.g., X-axis) of the first circuit region (4510), the connection layer (4420) arranged to overlap the 3-1 circuit region (4530a) relatively adjacent to the first circuit region (4510) may be formed as a bonding sheet, and the connection layer (4420) arranged to overlap the 2nd circuit region (4520) relatively spaced apart from the first circuit region (4510) may be formed as a prepreg sheet. Of course, the opposite is also possible.

[0151] In one embodiment, the plurality of connection layers (4420) may be formed of different materials depending on their placement on the flexible circuit board (4400). For example, when the connection layer (4420) is placed on a curved portion of the flexible circuit board (4400), such as region B illustrated in FIG. 4C, the connection layer (4420) may be formed of a bonding sheet, and when the connection layer (4420) is placed on a portion of the flexible circuit board (4400) where it extends in a straight line, the connection layer (4420) may be formed of a prepreg material. Of course, the opposite is also possible.

[0152] Referring to FIG. 4F, in a flexible circuit board (4400F) according to one embodiment, at least one of the connection layers (4420) disposed in one connection area (4540) may be formed by mixing a plurality of materials. A plurality of connection layers (4420) may be disposed on both ends of the flexible circuit board (4400F) in the width direction (e.g., X-axis) to overlap the 3-1 circuit area (4530a) and the 3-2 circuit area (4530b), respectively. The connection layer (4420) may include, for example, a first connection layer (4420a) disposed between a first substrate layer (4410a) and a second substrate layer (4410b), and a second connection layer (4420b) disposed between the second substrate layer (4410b) and the third substrate layer (4410c). In one embodiment, at least one connection layer (4420) may be formed of a first connection portion (4420-1) formed of a first material and a second connection portion (4420-2) formed of a second material different from the first material. The first connection portion (4420-1) may be positioned closer to the first circuit area (4510) than the second connection portion (4420-2). The first material may include, for example, a bonding material, and the second material may include, for example, a prepreg material. Of course, the opposite is also possible. An empty space (G) may be formed between the first substrate layer (4410a) and the second substrate layer (4410b) corresponding to the non-connection area (4550).

[0153] Referring to FIG. 4G, in one embodiment, when a flexible circuit board (4400G) includes three substrate layers (4410) that are arranged to overlap in the thickness direction (T), for example, a first substrate layer (4410a), a second substrate layer (4410b), and a third substrate layer (4410c), a first connection layer (4420a) may be arranged between the first substrate layer (4410a) and the second substrate layer (4410b), and a second connection layer (4420b) may be arranged between the second substrate layer (4410b) and the third substrate layer (4410c). In one embodiment, the connection layer (4420) may be arranged to not overlap the first circuit region (4510) in the thickness direction (T). For example, the connection layer (4420) may be arranged to overlap the second circuit region (4520) and / or the third-second circuit region (4530b) located on the right side (e.g., in the +X direction) of the first circuit region (4510), as illustrated in FIG. 4g, to form a connection region (4540). In another example, the connection layer (4420) may be arranged to overlap the third-first circuit region (4530a) located on the left side (e.g., in the -X direction) of the first circuit region (4510), to form a connection region (4540). For example, the connection region (4540) may be formed on only one of the left and right sides of the first circuit region (4510) based on the cross-section of the flexible circuit board (4400G) as illustrated in FIG. 4g. A non-connected region (4550) may be formed in a region that does not overlap with the connecting layer (4420) along the thickness direction (T).

[0154] Although not shown, in one embodiment, in the connection area (4540) of the flexible circuit board (4400G), at least one of the first connection layer (4420a) and the second connection layer (4420b) may be omitted. In another example, the first connection layer (4420a) and the second connection layer (4420b) may be made of different materials or have different areas.

[0155] Referring to FIG. 4h, in one embodiment, when a flexible circuit board (4400H) includes two substrate layers (4410) that are arranged to overlap in the thickness direction (T), for example, a first substrate layer (4410a) and a second substrate layer (4410b), a first connection layer (4420a) may be arranged between the first substrate layer (4410a) and the second substrate layer (4410b) corresponding to the connection region (4540). In one embodiment, when a pair of connection regions (4540) are formed at both ends of the width direction of the flexible circuit board (4400H) as illustrated in FIG. 4h, each connection region (4540) may overlap the 3-1 circuit region (4530a) and / or the second circuit region (4520) within a range that does not overlap the first circuit region (4510). A non-connected region (4550) is formed between a pair of connected regions (4540), and the non-connected region (4550) may overlap at least a portion of the first circuit region (4510), the third-second circuit region (4530b), and / or the second circuit region (4520) except for the +X direction end. An empty space (G) may be formed between the first substrate layer (4410a) and the second substrate layer (4410b) corresponding to the non-connected region (4550).

[0156] Referring to FIG. 4i, in one embodiment, the flexible circuit board (4400I) may include a first substrate layer (4410a), a second substrate layer (4410b), a third substrate layer (4410c), and a fourth substrate layer (4410d) that are sequentially overlapped along the thickness direction (T). In one embodiment, a first connection layer (4420a), a second connection layer (4420b), and a third connection layer (4430b) may be respectively disposed between each of the substrate layers (4410) corresponding to the connection area (4540). In one embodiment, when a pair of connection regions (4540) are formed at both ends in the width direction of the flexible circuit board (4400F) as illustrated in FIG. 4i, each connection region (4540) may overlap the 3-1 circuit region (4530a) and / or the 2nd circuit region (4520) within a range that does not overlap the 1st circuit region (4510). A non-connection region (4550) is formed between the pair of connection regions (4540), and the non-connection region (4550) may overlap at least a portion of the 1st circuit region (4510), the 3-2nd circuit region (4530b), and / or the 2nd circuit region (4520) except for the +X direction end. An empty space (G) may be formed between the first substrate layer (4410a), the second substrate layer (4410b), the third substrate layer (4410c), and the fourth substrate layer (4410d) corresponding to the non-connected area (4550).

[0157] Referring to FIG. 4J, in one embodiment, the flexible circuit board (4400J) may include a pair of connection regions (4540) formed at each of the widthwise ends. In one embodiment, the connection regions (4540) may include a first connection layer (4420a) connecting between the first substrate layer (4410a) and the second substrate layer (4410b), a second connection layer (4420b) connecting between the second substrate layer (4410b) and the third substrate layer (4410c), and a side connection layer (4420e) formed to surround the side surfaces of each connection layer (4420a, 4420b) and each substrate layer (4410) (e.g., the + / - X direction side surfaces of the flexible circuit board (4400H)). In one embodiment, the side connection layer (4420e) may be formed by interconnecting a first connection layer (4420a) and a second connection layer (4420b) that protrude and extend to the side of the flexible circuit board (4400H), but may also be formed separately from the first connection layer (4420a) and the second connection layer (4420b) and bonded to the side of the flexible circuit board (4400J).

[0158] In one embodiment, each connection region (4540) may overlap the 3-1 circuit region (4530a) and / or the 2nd circuit region (4520) to a non-overlapping extent with the 1st circuit region (4510). A non-connected region (4550) is formed between a pair of connection regions (4540), and the non-connected region (4550) may overlap at least a portion of the 1st circuit region (4510), the 3-2 circuit region (4530b), and / or the 2nd circuit region (4520) except for the +X direction end. An empty space (G) may be formed between the 1st substrate layer (4410a), the 2nd substrate layer (4410b), and the 3rd substrate layer (4410c) corresponding to the non-connected region (4550).

[0159] FIG. 5A is a partial perspective view illustrating a bending portion of a flexible circuit board according to one embodiment of the present disclosure.

[0160] FIG. 5b is a partial perspective view illustrating a bending portion of a flexible circuit board according to one embodiment of the present disclosure.

[0161] FIG. 5c is a partial perspective view illustrating a bending portion of a flexible circuit board according to one embodiment of the present disclosure.

[0162] Referring to FIGS. 5A to 5C , a flexible circuit board (5400A, 5400B, 5400C) according to one embodiment may include a plurality of substrate layers (5410) sequentially overlapping each other in a thickness direction (e.g., Z-axis direction), and a plurality of connecting layers (5420) disposed between the plurality of substrate layers (5410) and bonding at least a portion between adjacent substrate layers (5410). For example, the plurality of substrate layers (5410) may include a first substrate layer (5410a), a second substrate layer (5410b), and a third substrate layer (5410c). For example, the plurality of connection layers (5420) may include one or more first connection layers (5420a) positioned between a first substrate layer (5410a) and a second substrate layer (5410b), and a second connection layer (5420b) positioned between a second substrate layer (5410b) and a third substrate layer (5410c).

[0163] In one embodiment, a data line (5411-1) for transmitting a data signal, a power line (5411-2) for transmitting a power signal, and a ground line (5411-3) for grounding may be formed on the surface of each substrate layer (5410). In one embodiment, when the flexible circuit board (5400A, 5400B, 5400C) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (5400A) may include a first circuit region (5510) in which the data line (5411-1) is positioned, a second circuit region (5520) in which the power line (5411-2) is positioned, and a third circuit region (5530a, 5530b) in which the ground line (5411-3) is positioned. In one embodiment, the third circuit region (5530a, 5530b) may include a 3-1 circuit region (5530a) located to the left of the first circuit region (5510) in the width direction (e.g., in the -X direction), and a 3-2 circuit region (5530b) located to the right of the first circuit region (5510) in the width direction (e.g., in the +X direction). For example, the 3-2 circuit region (5530b) may be located between the first circuit region (5510) and the second circuit region (5520).

[0164] In one embodiment, the flexible circuit board (5400A, 5400B, 5400C) may be divided into one or more connection regions (5540) in which at least one pair of substrate layers (5410) are mutually connected by a connection layer (5420) when viewed from the surface, and non-connection regions (5550) in which a plurality of substrate layers (5410) are not mutually connected. For example, it may be understood that the connection layer (5420) is arranged in a portion of the flexible circuit board (5400A) corresponding to the connection region (5540). In one embodiment, the connection region (5540) may be formed in a portion that does not overlap with the first circuit region (5510) of the flexible circuit board (5400A, 5400B, 5400C). For example, the connection layer (5420) may be omitted from the surface of each substrate layer (5410) on which the data line (5411-1) is formed.

[0165] Referring to FIG. 5A, the flexible circuit board (5400A) may include a bending portion (5430) in which a plurality of substrate layers (5410) are partially bent. In one embodiment, the connection area (5540) of the flexible circuit board (5400A) may not be formed in the bending portion (5430). For example, the connection layer (5420) may be omitted so as not to be disposed on the surface of each substrate layer (5410) forming the bending portion (5430).

[0166] In one embodiment, the connection area (5540) of the flexible circuit board (5400A) may be formed at a portion adjacent to the bending portion (5430). For example, the connection layer (5420) may be positioned to bond the substrate layers (5410) of the flexible circuit board (5400A) at a portion adjacent to the bending portion (5430). In one embodiment, one or more connection areas (5540) may be formed at both sides of the bending portion (5430) (e.g., in the + / - Y-axis direction of the bending portion (5430)) based on the longitudinal direction of the flexible circuit board (5400A), so as to bond the connection layers (5420) around the bending portion (5430). For example, in a bending portion (5430) of a flexible circuit board (5400A), a plurality of substrate layers (5410) may not be mutually bonded, and on both sides of the bending portion (5430), the plurality of substrate layers (5410) may be bonded by a connecting layer (5420). In one embodiment, when the connecting layer (5420) is arranged so as not to overlap with the bending portion (5430) of the printed circuit board (5400), the bending stiffness acting on the bending portion (5430) of the flexible circuit board (5400) may be relatively reduced compared to when bonded by the connecting layer (5420). In this case, the phenomenon of cracks occurring in the pattern of the signal line located in the bending portion (5430) may be reduced or prevented. At the same time, when a plurality of substrate layers (5410) are bonded by a connecting layer (5420) at a portion adjacent to the bending portion (5430), the phenomenon of the plurality of substrate layers (5410) being excessively spread apart at the bending portion (5430) can be reduced or prevented.

[0167] Referring to FIG. 5B, the connection area (5540) in the flexible circuit board (5400B) may not be formed in the bending portion (5430). For example, the connection layer (5420) may be omitted from the surface of each substrate layer (5410) forming the bending portion (5430). In one embodiment, the connection area (5540) may be formed in a portion of the flexible circuit board (5400B) adjacent to the bending portion (5430). For example, with respect to the longitudinal direction of the flexible circuit board (5400A), one or more connection areas (5540) may be formed on both sides of the bending portion (5430) (e.g., in the + / - Y-axis direction of the bending portion (5430), so that the connection layers (5420) may be joined around the bending portion (5430).

[0168] In one embodiment, in one connection area (5540) formed adjacent to the bending portion (5430), each of the connection layers (5420) arranged to overlap in the thickness direction (e.g., Z-axis) may have different areas depending on the bending shape of the bending portion (5430). For example, as illustrated in FIG. 5B, when the -Y-side end portion of the bending portion (5430) of the flexible circuit board (5400B) is bent in the +Z direction, a greater bending stiffness may be applied to the first substrate layer (5410a) than to the third substrate layer (5410c) in the connection area (5430A) located in the -Y direction of the bending portion (5430). In this case, since the first-first connection layer (5420a-1) has a larger area than the second-first connection layer (5420b-1), the bonding area of ​​the first substrate layer (5410a) and the second substrate layer (5410b) can be formed to be larger than the bonding area of ​​the second substrate layer (5410b) and the third substrate layer (5410c). Conversely, when the +Y-side end portion of the bending portion (5430) of the flexible circuit board (5400B) is bent in the -Z direction, a greater bending stiffness can be applied to the third substrate layer (5410c) than to the first substrate layer (5410a) in the connection area (5430B) located in the +Y direction of the bending portion (5430). In this case, the first-second connection layer (5420a-2) has a smaller area than the second-second connection layer (5420b-2), so that the bonding area of ​​the first substrate layer (5410a) and the second substrate layer (5410b) can be formed smaller than the bonding area of ​​the second substrate layer (5410b) and the third substrate layer (5410c). For example, depending on the bending shape of the bending portion (5430) of the flexible circuit board (5400B), the area of ​​each connection layer (5420) bonding each substrate layer (5410) can be formed differently in consideration of the bending rigidity applied to each substrate layer (5410).

[0169] Referring to FIG. 5C, in one embodiment, the connection layers (5420a-1, 5420a-2, 5420b-1, 5420b-2) may be disposed on a portion of the flexible circuit board (5400C) adjacent to the bending portion (5430) to form a first connection area (5540A) and / or a second connection area (5540B). For example, based on the longitudinal direction of the flexible circuit board (5400C), the first-first connection layer (5420a-1) and the second-first connection layer (5420b-1) may be disposed on the first connection area (5540A) located in the -Y-axis direction of the bending portion (5430), thereby bonding a plurality of substrate layers (5410). A first-second connection layer (5420a-2) and a second-second connection layer (5420b-2) are arranged in the second connection area (5540B) located in the +Y-axis direction of the bending portion (5430), so that a plurality of substrate layers (5410) can be joined.

[0170] In one embodiment, the connecting layer (5420) may be disposed on at least a portion of the bending portion (5430) to form a third connecting region (5540C) on the bending portion (5430). For example, the third connecting region (5540C) located on the bending portion (5430) may include a first-third connecting layer (5420a-3) and a second-third connecting layer (5420b-3), thereby bonding a plurality of substrate layers (5410). In one embodiment, the thickness of the connection layers (5420a-3, 5420b-3) disposed in the third connection area (5540C) formed in the bending portion (5430) may be relatively thinner than the connection layers (5420a-1, 5420b-1) disposed in the first connection area (5540A) formed adjacent to the bending portion (5430) and the connection layers (5420a-2, 5420b-2) disposed in the second connection area (5540B). For example, the 1-1 connection layer (5420a-1) may have a 1-1 thickness (t1), and the 1-3 connection layer (5420a-3) may have a 1-3 thickness (t2) thinner than the 1-1 thickness (t1). The second-first connection layer (5420b-1) may have a second-first thickness (t1'), and the second-third connection layer (5420b-3) may have a second-third thickness (t2') that is thinner than the second-first thickness (t1'). In one embodiment, even if the third connection area (5540C) is formed in the bending portion (5430), the third connection area (5540C) of the flexible circuit board (5400C) has a relatively thin thickness compared to the first and second connection areas (5540A, 5540B) adjacent to the bending portion (5430), thereby reducing or preventing the pattern crack phenomenon of the signal line that may occur in the bending portion (5430) by relatively reducing the bending rigidity of the bending portion (5430) compared to the surrounding area.

[0171] In one embodiment, in at least one connection area (5540), each of the connection layers (5420) that are arranged to overlap in the thickness direction (e.g., Z-axis) may have different thicknesses depending on the bending stiffness of the adjacent substrate layer (5410). For example, taking the first connection area (5540A) as an example, when the bending portion (5430) adjacent to the +Y direction of the first connection area (5540A) is bent in the +Z direction, a greater bending stiffness may be applied to the first substrate layer (5410a) than to the third substrate layer (5410c) in the first connection area (5540A). In this case, the second-first connection layer (5420b-1) may be formed to have a thinner thickness than the first-first connection layer (5420a-1).

[0172] FIG. 6A is a partial enlarged view of a flexible circuit board according to one embodiment of the present disclosure.

[0173] FIG. 6b is a cross-sectional view of a flexible circuit board taken along line Ⅲ-Ⅲ of FIG. 6a of the present disclosure.

[0174] FIG. 6c is a cross-sectional view of a flexible circuit board taken along line Ⅲ-Ⅲ of FIG. 6a according to one embodiment of the present disclosure.

[0175] Referring to FIGS. 6A, 6B, and 6C, in one embodiment, a flexible circuit board (6400, 6400C) may include a plurality of substrate layers (6410) that are arranged to overlap in a thickness direction (T) (e.g., in the Z-axis direction), and a plurality of connecting layers (6420) that partially bond the plurality of substrate layers (6410) in the thickness direction (T). For example, the plurality of substrate layers (6410) may include a first substrate layer (6410a), a second substrate layer (6410b), and a third substrate layer (6410c). For example, the plurality of connection layers (6420) may include one or more first connection layers (6420a) positioned at least partially between a first substrate layer (6410a) and a second substrate layer (6410b), and one or more second connection layers (6420b) positioned at least partially between a second substrate layer (6410b) and a third substrate layer (6410c).

[0176] In one embodiment, a data line (6411-1) for transmitting a data signal, a power line (6411-2) for transmitting a power signal, and a ground line (6411-3) for grounding may be formed on the surface of each substrate layer (6410). In one embodiment, when the flexible circuit board (6400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (6400) may include a first circuit region (6510) in which the data line (6411-1) is positioned, a second circuit region (6520) in which the power line (6411-2) is positioned, and a third circuit region (6530a, 6530b) in which the ground line (6411-3) is positioned. In one embodiment, the third circuit region (6530a, 6530b) may include a 3-1 circuit region (6530a) located to the left of the first circuit region (6510) in the width direction (e.g., in the -X direction), and a 3-2 circuit region (6530b) located to the right of the first circuit region (6510) in the width direction (e.g., in the +X direction). For example, the 3-2 circuit region (6530b) may be located between the first circuit region (6510) and the second circuit region (6520).

[0177] In one embodiment, the flexible circuit board (6400, 6400C) may be divided into one or more connection regions (6540) in which at least one pair of substrate layers (6410) are mutually connected by a connection layer (6420) when viewed from the surface, and non-connection regions (6550) in which a plurality of substrate layers (6510) are not mutually connected. In one embodiment, the connection regions (6540) may be formed in a non-overlapping portion with the first circuit region (6510) of the flexible circuit board (6400). For example, the connection layer (6420) may be omitted from the surface of each substrate layer (6410) in which the data line (6411-1) is formed.

[0178] In one embodiment, the connection area (6540) of the flexible circuit board (6400, 6400C) may be formed at an edge in the width direction (e.g., X-axis direction) of the flexible circuit board (6400). For example, based on a cross-section of a portion of the flexible circuit board (6400) where the connection area (6540) is located, as shown in FIG. 6B, a pair of connection areas (6540) may be formed at each of the width direction ends of the flexible circuit board (6400). An empty space (G) may be formed between each of the substrate layers (6410a, 6410b, 6410c) in the non-connection area (6550).

[0179] In one embodiment, a pair of connection regions (6540) may be formed to have a width extending from a widthwise edge of the flexible circuit board (6400) to both widthwise ends of the first circuit region (6510), based on a cross-section such as FIG. 6b. For example, a connection region (6540) formed on a widthwise left side (e.g., in the -X direction) of the flexible circuit board (6400) may be formed to overlap with a 3-1 circuit region (6530a) located on the left side of the first circuit region (6510). In this case, the first connection layer (6420a) and the second connection layer (6420b) may have a width corresponding to the 3-1 circuit region (6530a) of the flexible circuit board (6400). For example, the connection area (6540) formed on the right side in the width direction (e.g., +X direction) of the flexible circuit board (6400) may be formed to overlap simultaneously with the 3-2 circuit area (6530b) and the 2nd circuit area (6520) located on the right side of the 1st circuit area (6510). In this case, the 1st connection layer (6420a) and the 2nd connection layer (6420b) may have a width substantially the same as the combined width of the 3-2 circuit area (6530b) and the 2nd circuit area (6520) of the flexible circuit board (6400). For example, the connection area (6540) may be formed to bond between areas of each substrate layer (6410) excluding the 1st circuit area (6510), based on a cross-section of the flexible circuit board (6400) as in FIG. 6b. In the case of such a structure, it is possible to effectively prevent the phenomenon of lifting between each substrate layer (6410) due to bending of the flexible circuit board (6400) while reducing or preventing deterioration of data transmission performance in the flexible circuit board (6400).

[0180] Referring to FIG. 6C, in one connection area (6540), the first connection layer (6420a') and the second connection layer (6420') may have the same or different widths. For example, in the connection area (6540) formed on the left side in the width direction (e.g., -X axis) of the flexible circuit board (6400C), the first connection layer (6420a') and the second connection layer (6420b') may have the same widths. On the other hand, in the connection area (6540) formed on the right side in the width direction (e.g., +X axis) of the flexible circuit board (6400C), the first connection layer (6420a') may be formed to have a smaller width than the second connection layer (6420b'). However, this is only one example to explain that in one connection area (6540), each connection layer (6420a', 6420b') may have a different width, and it should be noted that the width of each connection layer (6420a', 6420b') located in each connection area (6540) is not limited to the illustrated embodiment.

[0181] FIG. 7a is a partial enlarged view of a flexible circuit board according to one embodiment of the present disclosure.

[0182] FIG. 7b is a side view of a flexible circuit board according to one embodiment of the present disclosure.

[0183] FIG. 7c is a cross-sectional view of a flexible circuit board taken along line IV-IV of FIG. 7a according to an embodiment of the present disclosure.

[0184] FIG. 7d is a cross-sectional view of a flexible circuit board illustrating area D of FIG. 7b according to one embodiment of the present disclosure.

[0185] FIG. 7e is a cross-sectional view of a flexible circuit board illustrating area D of FIG. 7b according to one embodiment of the present disclosure.

[0186] Referring to FIGS. 7A to 7E, a flexible circuit board (7400) according to one embodiment may include a plurality of substrate layers (7410) sequentially overlapping in a thickness direction (T) (e.g., a Z-axis direction), and a plurality of connecting layers (7420) disposed between the plurality of substrate layers (7410) and bonding at least a portion between adjacent substrate layers (7410). For example, the plurality of substrate layers (7410) may include a first substrate layer (7410a), a second substrate layer (7410b), and a third substrate layer (7410c). For example, the plurality of connection layers (7420) may include a first connection layer (7420a) disposed between a first substrate layer (7410a) and a second substrate layer (7410b), and a second connection layer (7420b) disposed between a second substrate layer (7410b) and a third substrate layer (7401c).

[0187] In one embodiment, a data line (7411-1) for transmitting a data signal, a power line (7411-2) for transmitting a power signal, and a ground line (7411-3) for grounding may be formed on the surface of each substrate layer (7410). Each circuit line (7411-1, 7411-2, 7411-3) may be formed to extend from a first end (7400A) to a second end (7400B) along the length direction of the flexible circuit board (7400).

[0188] In one embodiment, when the flexible circuit board (7400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (7400) may include a first circuit region (7510) in which a data line (7411-1) is positioned, a second circuit region (7520) in which a power line (7411-2) is positioned, and a third circuit region (7530a, 7530b) in which a ground line (7411-3) is positioned. In one embodiment, the third circuit region (7530a, 7530b) may include a 3-1 circuit region (7530a) positioned to the left of the first circuit region (7510) in the width direction (e.g., -X direction), and a 3-2 circuit region (7530b) positioned to the right of the first circuit region (7510) in the width direction (e.g., +X direction). For example, the third-second circuit region (7530b) may be located between the first circuit region (7510) and the second circuit region (7520). In one embodiment, each of the circuit regions (7510, 7520, 7530) may extend along the length of the flexible circuit board (7400).

[0189] In one embodiment, the flexible circuit board (7400) may be divided into a connection region (7540) in which at least one pair of substrate layers (7410) are mutually bonded by a connection layer (7420) when viewed from the surface, and a non-connection region (7550) in which a plurality of substrate layers (7410) are not mutually bonded. For example, a connection layer (7420) may be disposed in a portion of the flexible circuit board (7400) corresponding to the connection region (7540).

[0190] In one embodiment, the connection area (7540) in the flexible circuit board (7400) may be formed at a location that does not overlap with the first circuit area (7510). For example, the connection layer (7420) may be omitted on the surface where the data line (7411-1) of each substrate layer (7410) is formed. In one embodiment, the connection area (7540) may be formed in a form that extends along the longitudinal direction of the flexible circuit board (7400). For example, the connection layer (7420) may be arranged to mutually bond a plurality of substrate layers (7410) along the longitudinal direction of the flexible circuit board (7400) without overlapping with the first circuit area (7510), as illustrated in FIG. 7B.

[0191] In one embodiment, the connection region (7540) may be formed to overlap the remaining region of the flexible circuit board (7400) excluding the first circuit region (7510). For example, as shown in FIG. 7A, when looking at the surface of the flexible circuit board (7400), a non-connection region (7550) in which the connection layer (7420) is omitted may be formed in a region corresponding to the first circuit region (7510), and a connection layer (7420) may be arranged in regions corresponding to the second circuit region (7520) and the third circuit region (7530), thereby forming a connection region (7540) in which a plurality of substrate layers (7410) are mutually bonded. In one embodiment, when the second circuit region (7520) and the third circuit region (7530) extend along the length direction of the flexible circuit board (7400), the connection region (7540) may be formed integrally along the length direction of the flexible circuit board (7400) by wrapping around the edge of the first circuit region (7510). An empty space (G) may be formed between the substrate layers (7410) corresponding to the first circuit region (7510) at a portion where the non-connection region (7550) is formed.

[0192] Referring to FIG. 7c, when the 3-1 circuit region (7530a) is located on the left side (e.g., in the -X direction) of the 1st circuit region (7510) based on the width-wise cross-section of the flexible circuit board (7400), a first connection layer (7420a) and a second connection layer (7420b) having a width substantially the same as the width of the 3-1 circuit region (7530a) may be arranged in the portion of the flexible circuit board (7400) corresponding to the 3-1 circuit region (7530a) to form a connection region (7540). When the 3-2 circuit region (7530b) and the 2nd circuit region (7520) are located on the right side (e.g., in the +X direction) of the 2nd circuit region (7510), a first connection layer (7420a) and a second connection layer (7420b) having a width substantially the same as the width connecting the 3-2 circuit region (7530b) and the 2nd circuit region (7520) may be arranged on the right side of the 1st circuit region (7510) to form a connection region (7540). However, it should be noted that this is merely an example, and the connection region (7540) is not necessarily formed in the entire remaining region of the flexible circuit board (7400) excluding the 1st circuit region (7510). For example, the connection region (7540) may be omitted from the 3-2 circuit region (7530b). For example, the connection region (7540) may be formed to overlap only at least a portion of the 3-1 circuit region (7530a) and the 2nd circuit region (7520). For example, the connection region (7540) may be formed to extend integrally along the length direction of the flexible circuit board (7400) and may be formed in various arrangements capable of joining the respective board layers (7410).

[0193] In one embodiment, in a flexible circuit board (7400), when a connection region (7540) is formed integrally along the longitudinal direction of the flexible circuit board (7400) without overlapping with the first circuit region (7510), for example, when a connection layer (7420) bonds the substrate layers (7410) along the longitudinal direction of the flexible circuit board (7400), a phenomenon in which data transmission performance of a data line (7411-1) formed in each substrate layer (7410) is deteriorated can be reduced or prevented, while maintaining a constant spacing between each substrate layer (7410) of the flexible circuit board (7400).

[0194] In one embodiment, a plurality of slits (74201) may be formed in at least a portion of the connection layer (7420). For example, as illustrated in FIG. 7D, a plurality of slits (74201) may be formed in a connection layer (7420) disposed at a bending portion of a flexible circuit board (7400), so as to partially bond adjacent substrate layers (7410). The shape of the connection layer (7420) illustrated in FIG. 7D is exemplary, and the widths of the plurality of slits (74201) formed in the connection layer (7420) and the widthwise (e.g., X-axis direction) spacing between the plurality of slits (74201) may be formed differently depending on the degree of bending of each bending portion. For example, as the degree of bending of the bending portion increases, the width of the slits (74201) increases and the spacing between the slits (74201) becomes narrower, thereby reducing the bending rigidity of the corresponding bending portion. Meanwhile, in FIG. 7d, the spacing and width of each slit (74201) are shown to be constant, but this is exemplary, and it should be noted that at least some of the plurality of slits (74201) may have different widths, and the spacing between each slit (74201) may also be formed differently.

[0195] In one embodiment, as illustrated in FIG. 7e, a plurality of recesses (74202) may be formed in at least a portion of the connection layer (7420). For example, a plurality of partially concave recesses (74202) may be formed in a portion of the connection layer (7420) disposed at a bend portion of the flexible circuit board (7400). The width of each recess (74202) and the spacing between adjacent recesses (74202) may be formed differently depending on the degree of bending of the corresponding bend portion of the flexible circuit board (7400). In one embodiment, in a portion of the flexible circuit board (7400) where it is not bent (e.g., FIG. 7c), no slits or recesses may be formed in the connection layer (7420).

[0196] FIG. 8A is a perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0197] FIG. 8b is a partial enlarged view of a flexible circuit board according to an embodiment of the present disclosure, showing an enlarged area C of FIG. 8a.

[0198] FIG. 8c is a cross-sectional view of a flexible circuit board taken along line V-V of FIG. 8b according to an embodiment of the present disclosure.

[0199] FIG. 8d is a partial enlarged view of a flexible circuit board according to an embodiment of the present disclosure, showing an enlarged area C of FIG. 8a.

[0200] FIG. 8e is a cross-sectional view of a flexible circuit board taken along line VI-VI of FIG. 8d according to an embodiment of the present disclosure.

[0201] Referring to FIGS. 8A to 8E, a wearable electronic device (801) according to an embodiment (e.g., the electronic device (201) of FIG. 1, the wearable electronic device (201) of FIG. 2, the wearable electronic device (301) of FIG. 3A) may include a housing (800) forming an exterior of the wearable electronic device (801), and a flexible circuit board (8400, 8400D) disposed within the housing (800).

[0202] In one embodiment, the housing (800) may include a frame (8100) (e.g., frame (4100) of FIG. 4A) and a temple (8200) (e.g., temple (4200) of FIG. 4A). In one embodiment, one or more electronic components may be disposed inside the housing (800). For example, the wearable electronic device (801) may include a printed circuit board (8408) (e.g., printed circuit board (4408) of FIG. 4A) disposed within the frame (8100) and having one or more component elements mounted thereon. A processor (e.g., processor (120) of FIG. 1) for controlling the operation of the wearable electronic device (801) may be disposed on the printed circuit board (8408). In one embodiment, the wearable electronic device (801) may include one or more connection terminals (8409) for connection to an external electronic device and / or an external power source (e.g., connection terminal (4409) of FIG. 4A).

[0203] In one embodiment, a flexible circuit board (8400, 8400D) can electrically connect two or more elements within a wearable electronic device (801). For example, the flexible circuit board (8400) can be arranged to span across a frame (8100) and a temple (8200) of the wearable electronic device (800). The flexible circuit board (8400) can have, for example, a first end (8400A) connected to a printed circuit board (8408), and a second end (8400B) connected to a connection terminal (8409). In one embodiment, the flexible circuit board (8400) can be formed to be flexible so as to be bendable. In one embodiment, the flexible circuit board (8400) may be at least partially secured within the housing (800) by a connecting member (not shown) such that the position of the flexible circuit board (8400) is fixed within the housing (800).

[0204] Referring to FIGS. 8b and 8c, in one embodiment, a flexible circuit board (8400, ) may include a plurality of substrate layers (8410) that are arranged to overlap in a thickness direction (T) (e.g., Z-axis), and a plurality of connection layers (8420) that partially connect the plurality of substrate layers (8410) along the thickness direction (T). For example, the plurality of substrate layers (8410) may include a first substrate layer (8410a), a second substrate layer (8410b), and a third substrate layer (8410c). For example, the plurality of connection layers (8420) may include one or more first connection layers (8420a) positioned between a first substrate layer (8410a) and a second substrate layer (8410b), and one or more second connection layers (8420a) positioned between a second substrate layer (8410b) and a third substrate layer (8410c).

[0205] In one embodiment, a data line (8411-1) for transmitting a data signal, a power line (8411-2) for transmitting a power signal, and a ground line (8411-3) for grounding may be formed on the surface of each substrate layer (8410). In one embodiment, when the flexible circuit board (8400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (8400) may include a first circuit region (8510) in which the data line (8411-1) is positioned, a second circuit region (8520) in which the power line (8411-2) is positioned, and a third circuit region (8530a, 8530b) in which the ground line (8411-3) is positioned. In one embodiment, the third circuit region (8530a, 8530b) may include a 3-1 circuit region (8530a) located to the left of the first circuit region (8510) in the width direction (e.g., in the -X direction), and a 3-2 circuit region (8530b) located to the right of the first circuit region (8510) in the width direction (e.g., in the +X direction). For example, the 3-2 circuit region (8530b) may be located between the first circuit region (8510) and the second circuit region (8520).

[0206] In one embodiment, the flexible circuit board (8400) may include one or more protruding portions (8412) that protrude outwardly in a width direction perpendicular to the length direction (e.g., X-axis). In one embodiment, the one or more protruding portions (8412) may be used to fix a placement position of the flexible circuit board (8400) with respect to the housing (800). For example, the flexible circuit board (8400) may be fixed inside the housing (800) through the protruding portions (8412). In one embodiment, each protruding portion (8412) may include at least one guide hole (8412a) that is formed to penetrate along the thickness direction (T). For example, the guide hole (8412a) may be used to insert a guide member (not shown) (e.g., a screw) for fixing the flexible circuit board (8400) when the flexible circuit board (8400) is installed inside the housing (800).

[0207] In one embodiment, the flexible circuit board (8400) may be divided into one or more connection regions (8540) in which at least one pair of substrate layers (8410) are mutually connected by a connection layer (8420) when viewed from the surface, and non-connection regions (8550) in which a plurality of substrate layers (8410) are not mutually connected. In one embodiment, the connection regions (8540) may be formed in a portion that does not overlap with the first circuit region (8510) of the flexible circuit board (8400). For example, the connection layers (8420) may be omitted from the surface of each substrate layer (8410) in which the data lines (8411-1) are formed.

[0208] In one embodiment, the connection area (8540) in the flexible circuit board (8400) may be formed in the protruding portion (8412). For example, in the protruding portion (8412), a plurality of substrate layers (8410) may be integrally bonded through a plurality of connection layers (8420). In one embodiment, when a guide hole (8412a) is formed in the protruding portion (8412), the guide hole (8412a) may be formed by penetrating through the plurality of substrate layers (8410) and the connection layer (8420) forming the protruding portion (8412).

[0209] In one embodiment, when a protruding portion (8412) is formed at a widthwise end portion (e.g., -X direction end) of a flexible circuit board (8400) as shown in FIG. 8c, the connection layers (8420a, 8420b) arranged on the widthwise left side (e.g., -X direction end) of the flexible circuit board (8400) may be arranged to overlap only the substrate layers (8410a, 8410b, 8410c) forming the protruding portion (8412). In this case, a non-connected region (8550) may be formed in the 3-1 circuit region (8530a). As shown in Fig. 8c, when a protruding portion (8412) is not formed on the right side in the width direction (e.g., the + X direction end) of the flexible circuit board (8400), connection layers (8420) may be arranged in at least a portion of the second circuit area (8520) and / or the third-second circuit area (8530b) to form a connection area (8540). An empty space (G) may be formed between the substrate layers (8410) corresponding to the non-connection area (8550).

[0210] Referring to FIG. 8C, a case is exemplified where a connection area (8540) is formed in a part of a second circuit area (8520) located on the right side of a first circuit area (8510). However, in contrast, in the flexible circuit board (8400), the connection area (8540) may be formed only in the protruding portion (8412). According to this structure, the portion of the substrate layer where the circuit pattern is formed in the flexible circuit board (8400) can be formed as a non-connecting area (8550) and separated from each other, so that a decrease in signal transmission performance can be minimized or prevented, and since each substrate layer (8410) is mutually bonded only in the protruding portion (8412), lifting and shaking phenomena between the plurality of substrate layers (8410) can be reduced or prevented.

[0211] Referring to FIGS. 8D and 8E , in one embodiment, the flexible circuit board (8400D) may include one or more via holes (8812b) formed in the protruding portion (8412). In one embodiment, the one or more via holes (8412b) may be formed to penetrate the protruding portion (8412) in the thickness direction (T). In one embodiment, the via holes (8412b) may function as a ground path for connecting the flexible circuit board (8400D) to the ground of the wearable electronic device (801). For example, the via holes (8412b) may be filled with a metal material such as a conductive material (e.g., copper). In one embodiment, when the protruding portion (8412) is formed as a connecting area (8540), for example, when a plurality of substrate layers (8410) are joined by a connecting layer (8420), the metal material filled in the via hole (8412b) can reinforce the bonding strength of the plurality of substrate layers (8410) and the connecting layers (8420) in the protruding portion (8412) of the flexible circuit board.

[0212] Hereinafter, embodiments of various types of electronic devices will be described. In describing each embodiment of various types of electronic devices, it will be apparent to those skilled in the art that the structures of various embodiments of the flexible circuit board described above, for example, embodiments of the flexible circuit board in which a plurality of substrate layers are partially bonded through a connection layer, can be applied to various types of electronic devices described below. For example, it should be noted that the embodiments of the flexible circuit board described through FIGS. 4A to 8E can be easily changed, modified, and combined by those skilled in the art and applied identically or similarly to the electronic devices described below.

[0213] FIG. 9A is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0214] FIG. 9b is a rear view of an electronic device according to an embodiment of the present disclosure.

[0215] FIG. 9c is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0216] FIG. 9d is a partial perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0217] FIG. 9e is a cross-sectional view of a flexible circuit board taken along line Ⅶ-Ⅶ of FIG. 9d according to an embodiment of the present disclosure.

[0218] Referring to FIGS. 9A, 9B, and 9C, an electronic device (901) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may include a first housing (910) (e.g., a first housing structure) and a second housing (920) (e.g., a second housing structure) that are foldable with respect to each other via at least one hinge device (970, 970-1) (e.g., a hinge module or a hinge structure) with respect to a folding axis (F). For example, the first housing (910) and the second housing (920) may be configured as a foldable housing (e.g., a housing structure). In an embodiment, the first housing (910) may include a first surface (911) and a second surface (912) facing in an opposite direction (e.g., a -Z direction of FIG. 9A) of the first surface (911). The second housing (920) may include a third side (921) and a fourth side (922) facing in an opposite direction (e.g., the -Z direction of FIG. 9A) of the third side (921). In one embodiment, the first housing (910) may include a first side formed between the first side (911) and the second side (912). The second housing (920) may include a second side formed between the third side (921) and the fourth side (922).

[0219] In one embodiment, the first housing (910) can include a first side member (940a) forming at least a portion of the first side (e.g., a first side bezel). The first side member (940a) can include a conductive portion. In one embodiment, the first housing (910) can include a first rear cover (914) coupled with the first side member (940a) and forming a second side (912). In one embodiment, the second housing (920) can include a second side member (940b) forming at least a portion of the second side (e.g., a second side bezel). The second side member (940b) can include a conductive portion. In one embodiment, the second housing (920) may include a second rear cover (924) coupled with the second side member (940b) and forming a fourth surface (922).

[0220] In one embodiment, the electronic device (901) may change shape as the relative angles of the first housing (910) and the second housing (920) about the folding axis (F) change. For example, the electronic device (901) may change shape between a first state (e.g., an unfolded state or an unfolded state) in which the first side (911) and the second side (912) are completely unfolded so that they are positioned substantially on the same plane, and a second state (e.g., a folded state or a folded state) in which the first side (911) and the second side (912) are completely folded inward so that they face each other or completely folded outward so that they face each other in opposite directions. In one embodiment, the electronic device (901) may be operated to have a shape in a third state (e.g., an intermediate unfolded state) between the first state and the second state.

[0221] In one embodiment, the electronic device (901) may include a first receiver (901), at least one first sensor module (904) (e.g., an ambient light sensor) and / or at least one first camera module (905) (e.g., an under display camera; UDC) disposed through a first side (911) of the first housing (910). In one embodiment, the electronic device (901) may include at least one button (906) formed on the first side member (940a). In one embodiment, the electronic device (901) may include at least one second camera module (908) and / or a flash (909) disposed through a second side (912) of the first housing (910) (e.g., a first rear cover (914)).

[0222] In one embodiment, the electronic device (901) may include a first display (936) (e.g., a flexible display, a foldable display, or a main display) supported by the first housing (910) and the second housing (920) and arranged to be visually visible through the first side (911) and the third side (921).

[0223] In one embodiment, the first display (936) may include a first area (936a) corresponding to at least a portion of the first surface (911) (e.g., a first planar area), a second area (936b) corresponding to at least a portion of the third surface (921) (e.g., a second planar area), and a folding area (936c) (e.g., a folding area) that connects the first area (936a) and the second area (936b) and whose shape is deformed during the folding process of the electronic device (901). In one embodiment, the folding area (936c) may be positioned to at least partially overlap at least one hinge device (970, 970-1) when the first display (936) is viewed from above (e.g., in the +Z direction of FIG. 9A). For example, the first display (936) may be arranged so as not to be visible from the outside in a second state of the electronic device (901) in which the first side (911) and the third side (921) face each other (e.g., in the case of an in-folding type). For example, the first display (936) may be arranged so as to be visible from the outside in a second state of the electronic device (901) in which the first side (911) and the third side (921) face opposite directions (e.g., in the case of an out-folding type).

[0224] In one embodiment, the electronic device (901) may include a second display (931) (e.g., an auxiliary display) disposed through a fourth side (922) of the second housing (920), at least one third camera module (925), at least one second sensor module (926), and / or a second receiver (927). For example, the second display (931) may be disposed to be visually visible from the outside through at least a portion of the second rear cover (924).

[0225] In one embodiment, the electronic device (901) may include a speaker (902) positioned through the second side member (940b), a microphone (903) positioned through the first side member (940a), and / or a connector port (907). At least some of the components described above may be arranged and / or modified between the first housing (910) and / or the second housing (920).

[0226] In one embodiment, at least one hinge device (970, 970-1) may be disposed at the lower portion (e.g., in the -Z direction of FIG. 8C) of the first display (936) and may connect the first housing (910) and the second housing (920). For example, the at least one hinge device (970, 970-1) may include a first hinge device (970) disposed along the folding axis (F) and a second hinge device (970-1) disposed spaced apart from the first hinge device (970). In one embodiment, the first hinge device (970) may be formed in a configuration that is substantially symmetrical or substantially identical to the second hinge device (970-1). For example, at least one hinge device (970, 2270-1) may be supported by a first support member (981) extending from the first side member (940a) to the first space of the first housing (910), and a second support member (982) extending from the second side member (940b) to the second space of the second housing (920). In one embodiment, at least one hinge device (970, 970-1) may be covered by a hinge housing (950) between the first housing (910) and the second housing (920) and may not be visible from the outside.

[0227] In one embodiment, the first hinge device (970, 970-1) may include a first rotational member (951) (e.g., a first arm or a first rotator) disposed on a first support member (981) of a first housing (910), a second rotational member (952) (e.g., a second arm or a second rotator) disposed on a second support member (982) of a second housing (920), and a gear assembly (943) connecting the first rotational member (951) and the second rotational member (952) and symmetrically rotating the first housing (910) and the second housing (920) relative to each other. For example, the gear assembly may include a plurality of gears (e.g., spur gears and / or worm gears) that are gear-coupled with respect to each other. For example, the gear assembly may include a cam coupling structure and / or a spring structure for urging the first housing (910) and the second housing (920) to move in a direction in which the first state is to be transitioned to the second state or in a direction in which the second state is to be transitioned to the first state, based on a predetermined angle with respect to each other.

[0228] In one embodiment, the electronic device (901) may be coupled with at least one hinge device (970, 970-1) and may include at least one detent module for providing a stopping sensation at various folding angles of the electronic device (901). For example, the at least one hinge device (970, 2270-1) and / or the detent module may form substantially the same plane as the first support member and the second support member when the electronic device (901) is in the first state.

[0229] In one embodiment, the electronic device (901) may include a first hinge plate (961) connected to the first support member (981) and / or the first rotation member (951). The electronic device (901) may include a second hinge plate (962) connected to the second support member (982) and / or the second rotation member (952). For example, at least one hinge device (970, 970-1), the first rotation member (951), the second rotation member (952), the first hinge plate (961), and the second hinge plate (962) may form substantially the same plane as the first support member (981) and the second support member (982) when the electronic device (901) is in the first state.

[0230] In one embodiment, the electronic device (901) may further include one or more flexible circuit boards (9400) disposed within the electronic device (901). In one embodiment, the flexible circuit boards (9400) may be disposed to extend from the first housing (910) of the electronic device (901) across the folding axis (F) to the second housing (920). In one embodiment, the flexible circuit boards (9400) may electrically connect component elements disposed in the first housing (910) (e.g., a first printed circuit board disposed in the first housing (910)) and component elements disposed in the second housing (920) (e.g., a second printed circuit board disposed in the second housing (920)). In one embodiment, the flexible circuit board (9400) is formed to be at least partially flexible and can at least partially bend to conform to changes in shape of the electronic device (901) when the electronic device (901) changes between the first state and the second state.

[0231] Referring to FIGS. 9D and 9E , a flexible circuit board (9400) according to an embodiment may be formed in a structure in which a plurality of layers are overlapped in a thickness direction (T) (e.g., Z-axis). In an embodiment, the flexible circuit board (9400) may include a plurality of substrate layers (9410) that are sequentially overlapped in the thickness direction (T), and a plurality of connecting layers (9420) that are disposed between the plurality of substrate layers (9410) and that bond at least a portion between adjacent substrate layers (9410). For example, the plurality of substrate layers (9410) may include a first substrate layer (9410a), a second substrate layer (9410b), and a third substrate layer (9410c). For example, the plurality of connection layers (9420) may include one or more first connection layers (9420a) positioned between a first substrate layer (9410a) and a second substrate layer (9410b), and a second connection layer (9420b) positioned between a second substrate layer (9410b) and a third substrate layer (9410c).

[0232] In one embodiment, a data line (9411-1) for transmitting a data signal, a power line (9411-2) for transmitting a power signal, and a ground line (9411-3) for grounding may be formed on the surface of each substrate layer (9410). In one embodiment, when the flexible circuit board (9400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (9400) may include a first circuit region (9510) in which the data line (9411-1) is positioned, a second circuit region (9520) in which the power line (9411-2) is positioned, and a third circuit region (9530a, 9530b) in which the ground line (9411-3) is positioned.

[0233] In one embodiment, the flexible circuit board (9400) may be divided into one or more connection regions (9540) in which at least one pair of substrate layers (9410) are mutually connected by a connection layer (9420) when viewed from the surface, and non-connection regions (9550) in which a plurality of substrate layers (9510) are not mutually connected. For example, it may be understood that the connection layer (9420) is arranged in a portion of the flexible circuit board (9400) corresponding to the connection region (9540). In one embodiment, the connection region (9540) may be formed in a portion that does not overlap with the first circuit region (9510) of the flexible circuit board (9400). For example, the connection layer (9420) may be omitted from the surface of each substrate layer (9410) in which the data line (9411-1) is formed. In one embodiment, the connection area (9540) may be formed in the second circuit area (9520) and / or the third circuit area (9530) of the flexible circuit board (9400). Based on the cross-section of the flexible circuit board (9400) as shown in FIG. 9E, the connection area (9540) may be formed only in a portion of the second circuit area (9520), but may alternatively be formed in the entire second circuit area (9520). In the portion of the flexible circuit board (9400) corresponding to the non-connection area (9550), an empty space (G) may be formed between each substrate layer (9410).

[0234] In one embodiment, when the connection area (9540) of the flexible circuit board (9400) is formed in a non-overlapping portion with the first circuit area (9510), a phenomenon in which the transmission performance of data signals through the data lines (9411-1) of each substrate layer (9410) of the flexible circuit board (9400) is deteriorated can be reduced or prevented. At the same time, since each substrate layer (9410) of the flexible circuit board (9400) is partially bonded through the connection area (9540), a phenomenon in which the gap between each substrate layer (9410) becomes excessively wide when the flexible circuit board (9400) is bent according to a folding operation of the electronic device (901) can be reduced or prevented.

[0235] In one embodiment, the arrangement structure of the connection region (9540) and the non-connection region (9550) formed on the flexible circuit board (9400) can be implemented through various embodiments of the flexible circuit board illustrated in FIGS. 4a to 4j, 5a to 5c, 6a to 6c, 7a to 7e, and 8a to 8e described above.

[0236] FIG. 10A is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0237] FIG. 10b is a rear view of an electronic device according to an embodiment of the present disclosure.

[0238] FIG. 10c is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 10d is a perspective view of a flexible circuit board according to an embodiment.

[0239] FIG. 10e is a cross-sectional view of a flexible circuit board taken along line Ⅸ-Ⅸ of FIG. 10d according to an embodiment of the present disclosure.

[0240] Referring to FIGS. 10A, 10B, and 10C, an electronic device (1001) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may include a first housing (1010) (e.g., a first housing structure) and a second housing (1020) (e.g., a second housing structure) that are foldable with respect to each other via at least one hinge device (1060, 1060-1) (e.g., a hinge module or a hinge structure) with respect to a folding axis (F). For example, the first housing (1010) and the second housing (1020) may be configured as a foldable housing (e.g., a housing structure). In one embodiment, the first housing (1010) may include a first surface (1011) and a second surface (1012) facing in an opposite direction (e.g., the -Z direction of FIG. 10A) of the first surface (1011). The second housing (1020) may include a third surface (1021) and a fourth surface (1022) facing in an opposite direction (e.g., the -Z direction of FIG. 10A) of the third surface (1021). In one embodiment, the first housing (1010) may include a first side surface formed between the first surface (1011) and the second surface (1012). The second housing (1020) may include a second side surface formed between the third surface (1021) and the fourth surface (1022).

[0241] In one embodiment, the first housing (1010) can include a first side member (1040a) forming at least a portion of the first side (e.g., a first side bezel). The first side member (1040a) can include a conductive portion. In one embodiment, the first housing (1010) can include a first rear cover (1014) coupled with the first side member (1040a) and forming a second side (1012). In one embodiment, the second housing (1020) can include a second side member (1040b) forming at least a portion of the second side (e.g., a second side bezel). The second side member (1040b) can include a conductive portion. In one embodiment, the second housing (1020) may include a second rear cover (1024) coupled with the second side member (1040b) and forming a fourth surface (1022).

[0242] In one embodiment, the electronic device (1001) may change shape as the relative angle between the first housing (1010) and the second housing (1020) about the folding axis (F) changes. For example, the electronic device (1001) may change shape between a first state (e.g., an unfolded state or an unfolded state) in which the first surface (1011) and the second surface (1012) are completely unfolded so that they are positioned substantially on the same plane, and a second state (e.g., a folded state or a folded state) in which the first surface (1011) and the second surface (1012) are completely folded inward so that they face each other or completely folded outward so that they face each other in opposite directions. In one embodiment, the electronic device (1001) may be operated to have a shape in a third state (e.g., an intermediate unfolded state) between the first state and the second state.

[0243] In one embodiment, the electronic device (1001) may include a first receiver (1081), at least one first sensor module (1004) (e.g., an ambient light sensor) and / or at least one first camera module (1005) (e.g., an under display camera; UDC) disposed through a first side (1011) of the first housing (1010). In one embodiment, the electronic device (1001) may include at least one button (1006) formed on the first side member (1040a). In one embodiment, the electronic device (1001) may include at least one second camera module (1008) and / or a flash (1009) disposed through a second side (1012) of the first housing (1010) (e.g., the first rear cover (1014)).

[0244] In one embodiment, the electronic device (1001) may include a first display (1036) (e.g., a flexible display, a foldable display, or a main display) supported by the first housing (1010) and the second housing (1020) and arranged to be visually displayed through the first side (1011) and the third side (1021).

[0245] In one embodiment, the first display (1036) may include a first area (1036a) corresponding to at least a portion of the first surface (1011) (e.g., a first planar area), a second area (1036b) corresponding to at least a portion of the third surface (1021) (e.g., a second planar area), and a folding area (1036c) (e.g., a folding area) that connects the first area (1036a) and the second area (1036b) and whose shape is deformed during the folding process of the electronic device (1001). In one embodiment, the folding area (1036c) may be positioned to at least partially overlap at least one hinge device (1060, 1060-1) when the first display (1036) is viewed from above (e.g., in the +Z direction of FIG. 10A). For example, the first display (1036) may be arranged so as not to be visually visible from the outside in a second state of the electronic device (1001) in which the first side (1011) and the third side (1021) face each other (e.g., in the case of an in-folding type). For example, the first display (1036) may be arranged so as to be visually visible from the outside in a second state of the electronic device (1001) in which the first side (1011) and the third side (1021) face opposite directions (e.g., in the case of an out-folding type).

[0246] In one embodiment, the electronic device (1001) may include a second display (1031) (e.g., an auxiliary display) disposed through a third side (1012) of the first housing (1010), at least one second camera module (1008), and a flash (1009). For example, the second display (1031) may be disposed to be visually visible from the outside through at least a portion of the first rear cover (1014). In one embodiment, the electronic device (1001) may include a speaker (1002) disposed through a second side member (1040b), a microphone (1003) disposed through the second side member (1040b), and / or a connector port (1007). At least some of the components described above may be arranged and / or modified between the first housing (1010) and / or the second housing (1020).

[0247] In one embodiment, at least one hinge device (1060, 1060-1) may be disposed at a lower portion (e.g., in the -Z direction of FIG. 10c) of the first display (1036) and may connect the first housing (1010) and the second housing (1020). For example, the at least one hinge device (1060, 1060-1) may include a first hinge device (1060) disposed along a folding axis (F) and a second hinge device (1060-1) disposed spaced apart from the first hinge device (1060). In one embodiment, the first hinge device (1060) may be formed in a configuration that is substantially symmetrical or substantially identical to the second hinge device (1060-1). For example, at least one hinge device (1060, 1060-1) may be supported by a first support member (10131) extending from the first side member (1040a) to the first space (10101) of the first housing (1010), and a second support member (10231) extending from the second side member (1040b) to the second space (10201) of the second housing (1020). In one embodiment, at least one hinge device (1060, 1060-1) may be covered by a hinge housing (1050) between the first housing (1010) and the second housing (1020) and may not be visible from the outside.

[0248] In one embodiment, the first hinge device (1060) may include a first rotational member (1064a) (e.g., a first arm or a first rotator) disposed on a first support member (10131) of a first housing (1010), a second rotational member (1064b) (e.g., a second arm or a second rotator) disposed on a second support member (10132) of a second housing (1020), and a gear assembly (1063) that connects the first rotational member (1064a) and the second rotational member (1064b) and symmetrically rotates the first housing (1010) and the second housing (1020) relative to each other. For example, the gear assembly (1063) may include a plurality of gears (e.g., spur gears and / or worm gears) that are gear-engaged with respect to one another. For example, the gear assembly (1063) may include a cam coupling structure and / or a spring structure for urging the first housing (1010) and the second housing (1020) at a predetermined angle with respect to one another in a direction in which the first state is to be transitioned to the second state or in a direction in which the second state is to be transitioned to the first state.

[0249] In one embodiment, the electronic device (1001) may be coupled with at least one hinge device (1060, 1060-1) and may include at least one detent module for providing a stopping sensation at various folding angles of the electronic device (1001). For example, the at least one hinge device (1060, 1060-1) and / or the detent module may form substantially the same plane as the first support member (10131) and the second support member (10231) when the electronic device (1001) is in the first state.

[0250] In one embodiment, the electronic device (1001) may further include one or more flexible circuit boards (10400) disposed within the electronic device (1001). In one embodiment, the flexible circuit boards (10400) may be disposed to extend from the first housing (1010) of the electronic device (1001) across the folding axis (F) to the second housing (1020). In one embodiment, the flexible circuit boards (10400) may electrically connect component elements (e.g., the first printed circuit board (1041)) disposed in the first housing (1010) and component elements (e.g., the second printed circuit board (1042)) disposed in the second housing (1020). In one embodiment, the flexible circuit board (10400) is formed to be at least partially flexible and can at least partially bend to conform to changes in shape of the electronic device (1001) when the electronic device (1001) changes between the first state and the second state.

[0251] Referring to FIGS. 10d and 10e, a flexible circuit board (10400) according to an embodiment may be formed in a structure in which a plurality of layers are overlapped in a thickness direction (T) (e.g., Z-axis). In an embodiment, the flexible circuit board (10400) may include a plurality of substrate layers (10410) that are sequentially overlapped in the thickness direction (T), and a plurality of connecting layers (10420) that are disposed between the plurality of substrate layers (10410) and that bond at least a portion between adjacent substrate layers (10410). For example, the plurality of substrate layers (10410) may include a first substrate layer (10410a), a second substrate layer (10410b), and a third substrate layer (10410c). For example, the plurality of connection layers (10420) may include one or more first connection layers (10420a) positioned between a first substrate layer (10410a) and a second substrate layer (10410b), and a second connection layer (10420b) positioned between a second substrate layer (10410b) and a third substrate layer (10410c).

[0252] In one embodiment, a data line (10411-1) for transmitting a data signal, a power line (10411-2) for transmitting a power signal, and a ground line (10411-3) for grounding may be formed on the surface of each substrate layer (10410). In one embodiment, when the flexible circuit board (10400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (10400) may include a first circuit region (10510) in which the data line (10411-1) is positioned, a second circuit region (10520) in which the power line (10411-2) is positioned, and a third circuit region (10530a, 10530b) in which the ground line (10411-3) is positioned.

[0253] In one embodiment, the flexible circuit board (10400) may be divided into one or more connection areas (10540) in which at least one pair of substrate layers (10410) are mutually connected by a connection layer (10420) when viewed from the surface, and non-connection areas (10550) in which a plurality of substrate layers (10410) are not mutually connected. For example, it may be understood that the connection layer (10420) is arranged in a portion of the flexible circuit board (10400) corresponding to the connection area (10540). In one embodiment, the connection area (10540) may be formed in a portion that does not overlap with the first circuit area (10510) of the flexible circuit board (10400). For example, the connection layer (10420) may be omitted from the surface of each substrate layer (10410) in which the data line (10411-1) is formed. In one embodiment, the connection area (10540) may be formed in the second circuit area (10520) and / or the third circuit area (10530) of the flexible circuit board (10400). In the portion of the flexible circuit board (10400) corresponding to the non-connection area (10550), an empty space (G) may be formed between each of the substrate layers (10410).

[0254] In one embodiment, when the connection area (10540) of the flexible circuit board (10400) is formed in a non-overlapping portion with the first circuit area (10510), a phenomenon in which the transmission performance of data signals through the data lines (10411-1) of each substrate layer (10410) of the flexible circuit board (10400) is deteriorated can be reduced or prevented. At the same time, since each substrate layer (10410) of the flexible circuit board (10400) is partially bonded through the connection area (10540), a phenomenon in which the gap between each substrate layer (10410) becomes excessively wide when the flexible circuit board (10400) is bent according to a folding operation of the electronic device (1001) can be reduced or prevented.

[0255] In one embodiment, the arrangement structure of the connection area (10540) and the non-connection area (10550) formed on the flexible circuit board (10400) can be implemented through various embodiments of the flexible circuit board illustrated in FIGS. 4A to 8E described above.

[0256] FIG. 11A is a perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0257] FIG. 11b is a rear view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0258] FIG. 11c is a perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0259] FIG. 11d is a partial perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0260] FIG. 11e is a cross-sectional view of a flexible circuit board taken along line XIe-XIe of FIG. 11d according to one embodiment of the present disclosure.

[0261] Referring to FIGS. 11A to 11E, an electronic device (1101) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may have a shape that may be transformed depending on a usage state. For example, the electronic device (1101) may be provided as a foldable type that may be folded or unfolded depending on a usage state. In an embodiment, the electronic device may include a first housing (1110), a second housing (1120), a third housing (1130), a display (1160), a first hinge housing (1115), and a second hinge housing (1125).

[0262] Hereinafter, in describing FIGS. 10A to 10C, for convenience of explanation, the surface of the display (1160) that is visually visible to the outside is referred to as the front surface (1101a) of the electronic device (e.g., the surface facing the +Z direction in FIG. 11A), the surface opposite to the front surface (1101a) is referred to as the rear surface (1101b) of the electronic device (1101) (e.g., the surface facing the -Z direction in FIG. 10A), and the outer surface of the electronic device (1101) that surrounds the internal space between the front surface (1101a) and the rear surface (1101b) is referred to as the side surface (1101c).

[0263] In one embodiment, the first housing (1110), the second housing (1120), and the third housing (1130) may form the exterior of the electronic device (1101). In one embodiment, the first housing (1110) may include a first front surface (1110a) and a first rear surface (1110b). The second housing (1120) may include a second front surface (1120a) and a second rear surface (1120b). The third housing (1130) may include a third front surface (1130a) and a third rear surface (1130b). In one embodiment, the first front surface (1110a) of the first housing (1110), the second front surface (1120a) of the second housing (1120), and the third front surface (1130a) of the third housing may form the front surface (1101a) of the electronic device (1101) based on the unfolded state of the electronic device (1101) as shown in FIG. 11A. In one embodiment, the front surface (1101a) of the electronic device (1101) may be formed so that most of the area is open so that the display (1160) is visually visible to the outside. In one embodiment, the first rear surface (1110b) of the first housing (1110), the second rear surface (1120b) of the second housing (1120), and the third rear surface (1130b) of the third housing may form the rear surface (1101b) of the electronic device (1101) based on the unfolded state of the electronic device (1101) as shown in FIG. 11b. In one embodiment, the first housing (1110), the second housing (1120), and the third housing (1130) may form a side surface (1101c) that surrounds an internal space between the front surface (1101a) and the rear surface (1101b) of the electronic device (1101), respectively.

[0264] In one embodiment, the first housing (1110) may include a first side member (1141) forming a portion of a side surface (1101c) of the electronic device (1101). The first side member (1140a) may include a conductive portion. In one embodiment, the second housing (1120) may include a second side member (1142) forming a portion of a side surface (1101c) of the electronic device (1101). The second side member (1142) may include a conductive portion. In one embodiment, the third housing (1130) may include a third side member (1143) forming a portion of a side surface (1101c) of the electronic device (1101). The third side member (1143) may include a conductive portion.

[0265] In one embodiment, a first rear cover (1151) may be disposed on a first rear surface (1110b) of a first housing (1110). At least a portion of an edge of the first rear cover (1151) may be surrounded by the first housing (1110). In one embodiment, a second rear cover (1152) may be disposed on a second rear surface (1120b) of a second housing (1120). At least a portion of an edge of the second rear cover (1152) may be surrounded by the second housing (1120). In one embodiment, a third rear cover (1153) may be disposed on a third rear surface (1130b) of a third housing (1130). At least a portion of an edge of the third rear cover (1153) may be surrounded by the third housing (1130). In one embodiment, the first rear cover (1151), the second rear cover (1152), and the third rear cover (1153) may be formed integrally with the first housing (1110), the second housing (1120), and the third housing (1130), respectively.

[0266] In one embodiment, the first housing (1110), the second housing (1120), the third housing (1130), the first rear cover (1151), the second rear cover (1152), and the third rear cover (1153) may be coupled to each other to form a space in which various components of the electronic device (1101) (e.g., circuit boards (1150a, 1150b, 1150c) of FIG. 11A) may be placed. In one embodiment, at least one component may be placed so as to be visually visible on the rear surface (1101b) of the electronic device (1101). For example, at least one component (e.g., a proximity sensor, a rear camera module, and / or a flash) may be visually visible to the outside through the second rear area (1152a) of the second rear cover (1152). In one embodiment, at least a portion of the sub-display (1170) may be visually exposed through the third rear area (1153a) of the third rear cover (1153).

[0267] In one embodiment, the first hinge housing (1115) can rotatably connect the first housing (1110) and the second housing (1120) about the first folding axis (F1). In one embodiment, the second hinge housing (1125) can rotatably connect the second housing (1120) and the third housing (1130) about the second folding axis (F2). In one embodiment, the first folding axis (F1) and the second folding axis (F2) can be parallel to each other.

[0268] In one embodiment, the display (1160) may be configured to have at least a portion of its shape deformable so that the shape can change in response to an opening and closing operation of the electronic device (1101) between the first state (e.g., unfolded state, or fully open state) of FIG. 11a and the second state (e.g., folded state, or fully closed state) of FIG. 11c. In one embodiment, the display (1160) may be supported by the first housing (1110), the second housing (1120), the third housing (1130), the first hinge housing (1115), and the second hinge housing (1125), and may be arranged to be visually visible to the outside through the front surface (1101a) of the electronic device (1101).

[0269] In one embodiment, the display (1160) may include a first planar portion (1161) corresponding to the first housing (1110), a second planar portion (1162) corresponding to the second housing (1120), a third planar portion (1163) corresponding to the third housing (1130), a first folding portion (1164) connecting the first planar portion (1161) and the second planar portion (1162) and corresponding to the first hinge housing (1115), and a second folding portion (1165) connecting the second planar portion (1162) and the third planar portion (1163) and corresponding to the second hinge housing (1125). In one embodiment, the first folding portion (1164) and the second folding portion (1165) may be at least partially bendable to conform to a change in shape of the electronic device (1101).

[0270] In one embodiment, the electronic device (1101) may include a connector port (1178) (e.g., connection terminal (178) of FIG. 1) disposed through a side (1101c), and an audio output module (1155) including one or more holes formed in the side (1101c).

[0271] In one embodiment, the electronic device (1101) may include a plurality of flexible circuit boards (11400) disposed therein. In one embodiment, the plurality of flexible circuit boards (11400) may include a first flexible circuit board (11400a) disposed to extend from a first housing (1110) across a first folding axis (F1) to a second housing (1120), and a second flexible circuit board (11400b) disposed to extend from the second housing (1120) across a second folding axis (F2) to a third housing (1130). In one embodiment, the first flexible circuit board (11400a) can electrically connect a component element (e.g., a first printed circuit board (1150a)) disposed in the first housing (1110) and a component element (e.g., a second printed circuit board (1150b)) disposed in the second housing (1120). In one embodiment, the second flexible circuit board (11400b) can electrically connect a component element (e.g., a second printed circuit board (1150b)) disposed in the second housing (1120) and a component element (e.g., a third printed circuit board (1150c)) disposed in the third housing (1130). In one embodiment, each flexible circuit board (11400) is formed to be at least partially flexible and can be at least partially bent to conform to a change in shape of the electronic device (1101).

[0272] Referring to FIGS. 11D and 11E , a flexible circuit board (11400) according to an embodiment may be formed in a structure in which a plurality of layers are overlapped in a thickness direction (T) (e.g., Z-axis). In an embodiment, the flexible circuit board (11400) may include a plurality of substrate layers (11410) that are sequentially overlapped in the thickness direction (T), and a plurality of connecting layers (11420) that are disposed between the plurality of substrate layers (11410) and that bond at least a portion between adjacent substrate layers (11410). For example, the plurality of substrate layers (11410) may include a first substrate layer (11410a), a second substrate layer (11410b), and a third substrate layer (11410c). For example, the plurality of connection layers (11420) may include one or more first connection layers (11420a) positioned between a first substrate layer (11410a) and a second substrate layer (11410b), and a second connection layer (11420b) positioned between a second substrate layer (11410b) and a third substrate layer (11410c).

[0273] In one embodiment, a data line (11411-1) for transmitting a data signal, a power line (11411-2) for transmitting a power signal, and a ground line (11411-3) for grounding may be formed on the surface of each substrate layer (11410). In one embodiment, when the flexible circuit board (11400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (11400) may include a first circuit region (11510) in which the data line (11411-1) is positioned, a second circuit region (11520) in which the power line (11411-2) is positioned, and a third circuit region (11530a, 10530b) in which the ground line (11411-3) is positioned.

[0274] In one embodiment, the flexible circuit board (11400) may be divided into one or more connection areas (11540) in which at least one pair of substrate layers (11410) are mutually connected by a connection layer (11420) when viewed from the surface, and non-connection areas (11550) in which a plurality of substrate layers (11510) are not mutually connected. For example, it may be understood that the connection layer (11420) is arranged in a portion of the flexible circuit board (11400) corresponding to the connection area (11540). In one embodiment, the connection area (11540) may be formed in a portion that does not overlap with the first circuit area (11510) of the flexible circuit board (11400). For example, the connection layer (11420) may be omitted from the surface of each substrate layer (11410) in which the data line (11411-1) is formed. In one embodiment, the connection area (11540) may be formed in the second circuit area (11520) and / or the third circuit area (11530) of the flexible circuit board (11400). In the portion of the flexible circuit board (11400) corresponding to the non-connection area (11550), an empty space (G) may be formed between each of the substrate layers (11410).

[0275] In one embodiment, when the connection area (11540) of the flexible circuit board (11400) is formed in a non-overlapping portion with the first circuit area (11510), a phenomenon in which the transmission performance of data signals through the data lines (11411-1) of each substrate layer (11410) of the flexible circuit board (11400) is deteriorated can be reduced or prevented. At the same time, since each substrate layer (11410) of the flexible circuit board (11400) is partially bonded through the connection area (11540), a phenomenon in which the gap between each substrate layer (11410) becomes excessively wide when the flexible circuit board (11400) is bent according to a folding operation of the electronic device (1101) can be reduced or prevented.

[0276] In one embodiment, the arrangement structure of the connection area (11540) and the non-connection area (11550) formed on the flexible circuit board (11400) can be implemented through various embodiments of the flexible circuit board illustrated in FIGS. 4A to 8E described above.

[0277] FIG. 12A is a front perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0278] FIG. 12b is a front perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0279] FIG. 12c is a rear perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0280] FIG. 12d is a rear perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0281] FIG. 12e is a side perspective view of an electronic device for illustrating a flexible circuit board according to one embodiment of the present disclosure.

[0282] FIG. 12f is a partial perspective view of a flexible circuit board according to one embodiment of the present disclosure.

[0283] FIG. 12g is a cross-sectional view of a flexible circuit board taken along line XIIg-XIIg of FIG. 12f according to an embodiment of the present disclosure.

[0284] Referring to FIGS. 12A, 12B, 12C, 12D, and 12E, an electronic device (1201) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may be deformable. In an embodiment, the electronic device (1201) may change in size by expanding and contracting along a movement direction (e.g., a direction parallel to the Y-axis of FIG. 12A). For example, the electronic device (1201) may be deformed between a first state (e.g., a slide-in state) as in FIG. 12A and a second state (e.g., a slide-out state) as in FIG. 12B.

[0285] In one embodiment, the electronic device (1201) may include housings (1210, 2820) that form an exterior and accommodate components therein. In one embodiment, the housings (1210, 2820) may include a first housing (1210) and a second housing (1220) that are movably connected to each other. In one embodiment, the first housing (1210) may be slidably connected to the second housing (1220). For example, the first housing (1210) may move relative to the second housing (1220) in a first movement direction (①) (e.g., -Y direction) or may slide in a second movement direction (②) (e.g., +Y direction) opposite to the first movement direction (①). Hereinafter, the state transformation of the electronic device (1201) illustrated in FIGS. 12a to 12d is described based on the slide in / out motion of the first housing (1210) with respect to the second housing (1220), but this is for describing the relative movement motion between the first housing (1210) and the second housing (1220), and can also be understood as the second housing (1220) moving with respect to the first housing (1210).

[0286] In one embodiment, the state of the electronic device (1201) can change between a first state (e.g., a slide-in state) and a second state (e.g., a slide-out state) depending on the relative movement of the second housing (1210) with respect to the second housing (1220). In one embodiment, the electronic device (1201) can have a minimum exposure area of ​​the display (1261) in the first state, and the electronic device (1201) can have a maximum exposure area of ​​the display (1261) in the second state. In one embodiment, the electronic device (1201) can be used in the first state and the second state, but can also be used in an intermediate state between the first state and the second state.

[0287] In one embodiment, the first housing (1210) includes a first-first side (1210a) (e.g., a first front side), a first-second side (1210b) opposite to the first-first side (1210a) (e.g., a first rear side), a first-first side (1210c) facing a first side direction (e.g., +X direction) and formed between the first-first side (1210a) and the first-second side (1210b), a second side (1210d) facing a second side direction opposite to the first side direction (e.g., -X direction) and formed between the first-first side (1210a) and the first-second side (1210b), and a third side direction (e.g., +Y direction) intersecting the first side direction and formed between the first-first side (1210a) and the first-second side (1210b). It may include a third aspect (1210e).

[0288] In one embodiment, the first housing (1210) may include a first plate (1211) and a first side member (1240a) extending substantially in the thickness direction (e.g., +Z direction) along the edge of the first plate (1211). In one embodiment, the first plate (1211) may form a first-second surface (1210b), and the first side member (1240a) may form side surfaces (1210c, 1210d, 1210e) of the first housing (1210). In one embodiment, the first plate (1211) and the first side member (1240a) may be formed integrally, or may be formed separately and then joined. In one embodiment, the first side member (1240a) may include a conductive portion.

[0289] In one embodiment, the second housing (1220) includes a 2-1 side (1220a) (e.g., a second front side), a 2-2 side (1220b) opposite to the 2-1 side (1220a) (e.g., a second rear side), a 2-1 side (1220c) facing a first side direction (e.g., +X direction) and formed between the 2-1 side (1220a) and the 2-2 side (1220b), a 2-2 side (1220d) facing a second side direction opposite to the first side direction (e.g., -X direction) and formed between the 2-1 side (1220a) and the 2-2 side (1220b), and a 4th side direction (e.g., -Y direction) intersecting the first side direction and formed between the 2-1 side (1220a) and the 2-2 side (1220b). It may include the fourth aspect (1220e).

[0290] In one embodiment, the second housing (1220) may include a second plate (1221) and a second side member (1240b) extending substantially in the thickness direction (e.g., +Z direction) along the edge of the second plate (1221). In one embodiment, the second plate (1221) may form a second-second surface (1220b), and the second side member (1240b) may form side surfaces (1220c, 1220d, 1220e) of the second housing (1220). In one embodiment, the second plate (1221) and the second side member (1240b) may be formed integrally, or may be formed separately and then joined. In one embodiment, the second side member (1240b) may include a conductive portion.

[0291] In one embodiment, the first housing (1210) and the second housing (1220) may form a first side (front side) (1201a) (e.g., a side facing +Z) of the electronic device (1201) through the first-first side (1210a) and the second-first side (1220a), and may form a second side (rear side) (1201b) (e.g., a side facing -Z) of the electronic device (1201) through the first-second side (1210b) and the second-second side (1220b). In one embodiment, the first side (1201a) of the electronic device (1201) may be opened to expose the display (1261). In one embodiment, the first housing (1210) and the second housing (1220) may form a first side (1201c) (e.g., a side facing +X) of the electronic device (1201) through the first-first side (1210c) and the second-first side (1220c), and may form a second side (1201d) (e.g., a side facing -X) of the electronic device (1201) through the first-second side (1210d) and the second-second side (1220d).

[0292] In one embodiment, the first housing (1210) can be withdrawn or inserted into the second housing (1220) while being partially inserted into the second housing (1220). In one embodiment, the second housing (1220) can include an open portion (1220g) that is formed to be open in a fourth side direction (e.g., +Y direction) opposite to the third side direction so that the first housing (1210) can be inserted. In one embodiment, during the process of introducing the first housing (1210) into the second housing (1220), at least a portion of the first-first side (1210c) and the first-second side (1210d) of the first housing (1210) may be introduced into the interior of the second housing (1220) and may be covered by the second-first side (1220c) and the second-second side (1220d). Accordingly, the first side (1201c) and the second side (1201d) of the electronic device (1201) may change in length depending on the state of the electronic device.

[0293] In one embodiment, the electronic device (1201) may include a display (1261) (e.g., a flexible display or a rollable display) for displaying visual information. In one embodiment, the display (1261) may be exposed to the outside, for example, the front, of the electronic device (1201) through a display area. In one embodiment, the display area may include a first area (1261a) positioned on the first-first side (1210a) and the second-first side (1220a), a second area (1261b) positioned adjacent to the fourth side (1220e), and a third area (1261c) positioned adjacent to the third side (1210e). In one embodiment, the second area (1261b) and / or the third area (1261c) may form a flexibly curved surface. In one embodiment, the display area of ​​the display (1261) can be expanded or reduced according to the change in the size of the first area (1261a). In one embodiment, the display (1261) can display a screen in the display area. In one embodiment, the display (1261) can display a single connected screen through the display area, or can display a screen using only a portion of the display area. In one embodiment, the display (1261) can display a plurality of distinct screens on the display area.

[0294] In one embodiment, the display (1261) may form at least a portion of the display area (e.g., the first area (1261a) in the first state of FIG. 12A) and may include a planar portion (12611) supported by the first housing (1210) and the second housing (1220), and a rolling portion (12612) (or bending portion) extending in the first movement direction from the planar portion (12611) and supported by the second housing (1220). In one embodiment, the planar portion (12611) may be visually exposed to the first surface (1201a) of the housings (1210, 1220) to form the display area regardless of a change in the state of the electronic device (1201). In one embodiment, the rolling portion (12612) may be introduced into the interior of the electronic device (1201) or may be withdrawn to the exterior of the electronic device (1201) according to the movement motion of the first housing (1210) with respect to the second housing (1220). In one embodiment, the rolling portion (12612) withdrawn to the exterior of the electronic device (1201) may be arranged on the second-first surface (1220a) of the second housing (1220) so as to be visually exposed to the exterior of the electronic device (1201) and may form a display area together with the flat portion (12611). For example, the area of ​​the display area may change depending on the degree of withdrawal of the rolling portion (12612).

[0295] In one embodiment, the display (1261) may change the area of ​​the display area (e.g., the first area (1261a), the second area (1261b), and the third area (1261c)) in response to a change in the state of the electronic device (1201). In one embodiment, the display area of ​​the display (1261) may form a first area (e.g., a minimum area) that is minimized in a first state of the electronic device (1201) (e.g., a slide-in state of FIG. 12a), and may form a second area (e.g., a maximum area) that is maximized in a second state of the electronic device (1201) (e.g., a slide-out state of FIG. 12b). When the electronic device (1201) is in a state between the first state and the second state, the display (1261) may change its state in response to the state of the electronic device (1201), thereby causing the display area to have an area between the first area and the second area. For example, in an operation in which the state of the electronic device (1201) changes from a first state to a second state, when the first housing (1210) moves in the second movement direction (②) with respect to the second housing (1220) by a certain length (d), the length of the display area parallel to the second movement direction (②) (e.g., the length parallel to the Y-axis) may change from the first length (d1) to a second length (d2) that is increased by a certain length (d), thereby expanding the display area. For example, when the state of the electronic device (1201) changes from the second state to the first state, and the first housing (1210) moves by a predetermined length (d) in the first movement direction (①) with respect to the second housing (1220), the length of the display area parallel to the first movement direction (①) (e.g., the length parallel to the Y-axis) may change from the second length (d2) to the first length (d1) that is reduced by the predetermined length (d), thereby reducing the display area. In one embodiment, regardless of the state change of the electronic device (1201), the sizes of the second region (1261b) and the third region (1261c) may be maintained substantially constant.

[0296] In one embodiment, the electronic device (1201) may include an input button (B) (e.g., input module (150) of FIG. 1), an audio output module (e.g., audio output module (155) of FIG. 1), a camera module (1280) (e.g., camera module (180) of FIG. 1), and a connector port (1208). In one embodiment, the electronic device (1201) may omit at least one of the above-described components or may additionally include other components.

[0297] In one embodiment, the input button (B) can receive an input signal according to a user's operation. The input button (B) is arranged on the outside of the electronic device (1201) and can be pressed by the user to transmit the input signal to a processor (e.g., the processor (120) of FIG. 1). In one embodiment, the input button (B) can be formed on the side surfaces of the housings (1210, 1220). For example, the input button (B) can be formed on at least one of the second-third side surface (1220c) or the second-fourth side surface (1220d) of the second housing (1220). In the drawing, for the convenience of explanation, an embodiment is shown in which one input button (B) is formed on the 2-3 side (1220c) of the second housing (1220). However, it should be noted that the arrangement position and number of input buttons (B) for the electronic device (1201) shown in the drawing are for the convenience of explanation and are not limited to the illustrated embodiment.

[0298] In one embodiment, the sound output module can be radiated to the outside through sound holes (H1, H2) that are in communication with the outside of the housings (1210, 1220). In one embodiment, the sound holes (H1, H2) can include, for example, a first sound hole (H1) formed in the first housing (1210) and a second sound hole (H2) formed in the second housing (1220). In one embodiment, the first sound hole (H1) and the second sound hole (H2) can be substantially aligned to be in communication with each other in the first state of the electronic device (1201).

[0299] In one embodiment, the electronic device (1201) may include a flexible circuit board (12400) disposed therein. In one embodiment, the flexible circuit board (12400) may be disposed to extend from the interior of the first housing (1210) to the interior of the second housing (1220). In one embodiment, the flexible circuit board (12400) may electrically connect a first component element (e.g., a first printed circuit board (1290-1)) disposed in the first housing (1210) and a second component element (e.g., a second printed circuit board (1290-2)) disposed in the second housing (1220). In one embodiment, the flexible circuit board (12400) can be at least partially bent in response to a state change of the electronic device (1101), for example, a sliding motion of the second housing (1210) relative to the second housing (1220).

[0300] Referring to FIGS. 12F and 12G, a flexible circuit board (12400) according to an embodiment may be formed in a structure in which a plurality of layers are overlapped in a thickness direction (T) (e.g., Z-axis). In an embodiment, the flexible circuit board (12400) may include a plurality of substrate layers (12410) that are sequentially overlapped in the thickness direction (T), and a plurality of connecting layers (12420) that are disposed between the plurality of substrate layers (12410) and that bond at least a portion between adjacent substrate layers (12410). For example, the plurality of substrate layers (12410) may include a first substrate layer (12410a), a second substrate layer (12410b), and a third substrate layer (12410c). For example, the plurality of connection layers (12420) may include one or more first connection layers (12420a) positioned between a first substrate layer (12410a) and a second substrate layer (12410b), and a second connection layer (12420b) positioned between a second substrate layer (12410b) and a third substrate layer (12410c).

[0301] In one embodiment, a data line (12411-1) for transmitting a data signal, a power line (12411-2) for transmitting a power signal, and a ground line (12411-3) for grounding may be formed on the surface of each substrate layer (12410). In one embodiment, when the flexible circuit board (12400) is viewed in the thickness direction (e.g., Z-axis), the flexible circuit board (12400) may include a first circuit region (12510) in which the data line (12411-1) is positioned, a second circuit region (12520) in which the power line (12411-2) is positioned, and a third circuit region (12530a, 12530b) in which the ground line (12411-3) is positioned.

[0302] In one embodiment, the flexible circuit board (12400) may be divided into one or more connection areas (12540) in which at least one pair of substrate layers (12410) are mutually connected by a connection layer (12420) when viewed from the surface, and non-connection areas (12550) in which a plurality of substrate layers (12510) are not mutually connected. For example, it may be understood that the connection layer (12420) is arranged in a portion of the flexible circuit board (12400) corresponding to the connection area (12540). In one embodiment, the connection area (12540) may be formed in a portion that does not overlap with the first circuit area (12510) of the flexible circuit board (12400). For example, the connection layer (12420) may be omitted from the surface of each substrate layer (12410) in which the data line (12411-1) is formed. In one embodiment, the connection area (12540) may be formed in the second circuit area (12520) and / or the third circuit area (12530) of the flexible circuit board (12400). In the portion of the flexible circuit board (12400) corresponding to the non-connection area (12550), an empty space (G) may be formed between each of the substrate layers (12410).

[0303] In one embodiment, when the connection area (12540) of the flexible circuit board (12400) is formed in a non-overlapping portion with the first circuit area (12510), the phenomenon of the transmission performance of data signals through the data lines (12411-1) of each substrate layer (12410) of the flexible circuit board (12400) being deteriorated can be reduced or prevented. For example, when the respective substrate layers (12410) of the flexible circuit board (12400) are partially joined through the connection area (12540), the phenomenon of the gap between each substrate layer (12410) becoming excessively wide when the flexible circuit board (12400) is partially unfolded or folded according to a state change of the electronic device (1201), for example, an insertion and withdrawal operation of the first housing (1210) with respect to the second housing (1220), can be reduced or prevented.

[0304] In one embodiment, the arrangement structure of the connection area (12540) and the non-connection area (12550) formed on the flexible circuit board (12400) can be implemented through various embodiments of the flexible circuit board illustrated in FIGS. 4a to 4j, 5a to 5c, 6a to 6c, 7a to 7e, and 8a to 8e described above.

[0305] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0306] A wearable electronic device (101; 201; 301; 401; 801) according to one embodiment may include a frame (4100; 8100) in which at least one lens or at least one display is accommodated, a temple (4200; 8200) connected to each end of the frame (4100; 8100), and a flexible circuit board (4400; 5400A; 6400; 7400; 8400) (FPCB) at least a portion of which is disposed on the temple (4200; 8200) and extends along the longitudinal direction. In one embodiment, the flexible circuit board (4400; 5400A; 6400; 7400; 8400) may include a plurality of substrate layers (4410; 5410; 6410; 7410; 8410) having one or more circuit lines (4411) formed on a surface thereof and arranged to overlap along a thickness direction (T), and one or more connection layers (4420; 5420; 6420; 7420; 8420) arranged between the plurality of substrate layers (4410; 5410; 6410; 7410; 8410) and connecting surfaces of adjacent substrate layers (4410; 5410; 6410; 7410; 8410). In one embodiment, the flexible circuit board (4400; 5400A; 6400; 7400; 8400) includes a first circuit area (4510; 5510; 6510; 7510; 8510) in which data lines (4411-1; 5411-1; 6411-1; 7411-1; 8411-1) for transmitting data signals are formed when viewed in the thickness direction (T), and the connection layer (4420; 5420; 6420; 7420; 8420) can be arranged to be non-overlapping in the first circuit area.

[0307] In one embodiment, the flexible circuit board (4400; 5400; 6400; 7400; 8400) may further include a second circuit area (4520; 5520; 6520; 7520; 8520) that does not overlap with the first circuit area (4510; 5510; 6510; 7510; 8510) and in which power lines (4411-2; 5411-2; 6411-2; 7411-2; 8411-1) for transmitting power signals are formed. When the above flexible circuit board (4400;;5400;6400;7400;8400) is viewed in the thickness direction (T), the connection layer (4420;5420;6420;7420;8420) can overlap the second circuit area (4520;5520;6520;7520;8520).

[0308] In one embodiment, the connection layer (7420) may be arranged to overlap the entire second circuit region (7520).

[0309] In one embodiment, the flexible circuit board (4400; 5400A; 6400; 7400; 8400) may further include a third circuit region (4530; 5530; 6530; 7530; 8530) in which a ground line (4411-3; 5411-3; 6411-3; 7411-3; 8411-3) is formed. When the flexible circuit board (4400; 5400A; 6400; 7400; 8400) is viewed in the thickness direction (T), the connection layer (4420; 5420; 6420; 7420; 8420) may overlap the third circuit region (4530; 5530; 6530; 7530; 8530).

[0310] In one embodiment, each of the plurality of substrate layers (8410) may include one or more protruding portions (8412) that protrude outwardly in a width direction perpendicular to the length direction. When the flexible circuit board (8400) is viewed in the thickness direction (T), the connection layer (8420) may overlap the one or more protruding portions (8412).

[0311] In one embodiment, the one or more protruding portions (8412) may include one or more guide holes (8412a) formed through the thickness direction (T).

[0312] In one embodiment, the flexible circuit board (8400D) may include one or more via holes (8412b) formed on the at least one protruding portion (8412) and connected to ground.

[0313] In one embodiment, the flexible circuit board (4400; 5400A; 5400B) may include one or more bending portions (4430; 5430) that are at least partially bent in the thickness direction (T). The connecting layer (5420) may be arranged so as not to overlap the bending portions (5430).

[0314] In one embodiment, the flexible circuit board (4400; 5400A; 6400; 7400; 8400) may include one or more connection areas (4540; 5540; 6540; 7540; 8540) in which the connection layers (4420; 5420; 6420; 7420; 8420) are positioned when viewed in the thickness direction (T). The connection areas (5540) may be arranged adjacent to the bending portion (5430).

[0315] In one embodiment, in the flexible circuit board (5400A; 5400B), a connection area (5540) may be positioned at each of the longitudinal ends of the bending portion (5430).

[0316] In one embodiment, the flexible circuit board (5400C) may include one or more bending portions (5430) that are at least partially bent in the thickness direction (T). The connecting region (5540) may include a first connecting region (5540A) and / or a second connecting region (5540B) in which the connecting layer (5420) is disposed to not overlap the bending portion (5430), and a third connecting region (5540C) in which the connecting layer (5420) is disposed to overlap the bending portion. The third connecting region (5540C) may have a thinner thickness than the first connecting region (5510A) and / or the second connecting region (5510B).

[0317] In one embodiment, at least one pair of connecting layers (5420a, 5420b) disposed between different substrate layers (5410) in at least one connecting region (5540) disposed adjacent to the bending portion (5430) may have different areas.

[0318] In one embodiment, based on the cross-section of the flexible circuit board (4400; 5400; 6400; 7400; 8400), the connection layers (4420; 5420; 6420; 7420; 8420) may be respectively arranged at both ends in the width direction of the flexible circuit board (4400; 5400; 6400; 7400; 8400).

[0319] In one embodiment, at least a portion of the flexible circuit board (4400) may be disposed at a location where the temple (4200) and the frame (4100) are connected. The connection layer (4420) may be disposed at at least a portion of the flexible circuit board (4400) disposed at a location where the temple (4200) and the frame (4100) are connected.

[0320] In one embodiment, the plurality of substrate layers (4410; 5410; 6410; 7410; 8410) may include a first substrate layer (4410a; 5410a; 6410a; 7410a; 8410a), a second substrate layer (4410b; 5410b; 6410b; 7410b; 8410b), and a third substrate layer (4410c; 5410c; 6410c; 7410c; 8410c) that are sequentially arranged along the thickness direction (T). The above connection layer (4420; 5420; 6420; 7420; 8420) comprises at least one first connection layer (4420a; 5420a; 6420a; 7420a; 8420a) disposed at least partially between the first substrate layer (4410a; 5410a; 6410a; 7410a; 8410a) and the second substrate layer (4410b; 5410b; 6410b; 7410b; 8410b), and at least one second connection layer disposed at least partially between the second substrate layer (4410b; 5410b; 6410b; 7410b; 8410b) and the third substrate layer (4410c; 5410c; 6410c; 7410c; 8410c). It may contain layers (4420b; 5420b; 6420b; 7420b; 8420b).

[0321] When viewed in the thickness direction, the first connection layer (4420a; 5420a; 6420a; 7420a; 8420a) and the second connection layer (4420b; 5420b; 6420b; 7420b; 8420b) can overlap at least partially.

[0322] A flexible circuit board (4400; 5400A; 6400; 7400; 8400; 9400; 10400; 11400; 12400) according to one embodiment has a circuit line (4411) formed on a surface, a plurality of substrate layers (4410; 5410; 6410; 7410; 8410; 9410; 10410; 11410; 12410) arranged to overlap in the thickness direction (T), and one or more connections connecting at least a portion between the plurality of substrate layers (4410; 5410; 6410; 7410; 8410; 9410; 10410; 11410; 12410). It can contain layers (4420;5420;6420;7420;8420;9420;10420;11420;12420). Each of the above substrate layers (4410; 5410; 6410; 7410; 8410; 9410; 10410; 11410; 12410) is a first circuit in which a data line (4411-1; 5411-1; 6411-1; 7411-1; 8411-1; 9411-1; 10411-1; 11411-1; 12411-1) for transmitting a data signal along the length direction of the flexible circuit board (4400; 5400A; 6400; 7400; 8400; 9400; 10400; 11400; 12400) is formed. It may include a second circuit region (4520; 5520; 6520; 7520; 8520; 9520; 10520; 11510; 12510), in which a power line (4411-2; 5411-2; 6411-2; 7411-2; 8411-2; 9411-2; 10411-2; 11411-2; 12411-2) for transmitting a power signal along the longitudinal direction of the flexible circuit board is formed. The above connection layers (4420; 5420; 6420; 7420; 8420; 9420; 10420; 11420; 12420) may be arranged so as not to overlap the first circuit region (4510; 5510; 6510; 7510; 8510; 9510; 10510; 11510; 12510).

[0323] In one embodiment, the connection layer (7420) may be arranged to overlap the entire surface of the substrate layer (7510) forming the second circuit region (7520).

[0324] In one embodiment, the flexible circuit board (4400; 5400A) may include a bending portion (4430; 5430) that is at least partially bent. The connecting layer (4420; 5420) may be disposed on the surface of a portion of the substrate layer (4410; 5410) that does not overlap the bending portion (4430; 5430) and is adjacent to the bending portion (4430; 5430).

[0325] In one embodiment, the flexible circuit board (8400) may include one or more protruding portions (8412) protruding in both width directions. In one embodiment, a guide hole (8412a) may be formed in the protruding portions (8412). A connecting layer (8420) may be arranged between portions of a plurality of substrate layers (8410) forming the protruding portions (8412a).

[0326] An electronic device (101; 201; 301; 401; 901; 1001; 1101; 1201) according to one embodiment may include a housing having a component element disposed therein, a flexible circuit board (4400; 5400A; 6400; 7400; 8400; 9400; 10400; 11400; 12400) disposed inside the housing, electrically connected to the component element, and at least partially bendable in a longitudinal direction.

[0327] In one embodiment, the flexible circuit board (4400; 5400A; 6400; 7400; 8400; 9400; 10400; 11400; 12400) is arranged to overlap in the thickness direction (T) and has a plurality of substrate layers (4410; 5410; 6410; 7410; 8410; 9410; 10410; 11410; 12410) having circuits formed on the surface, and is arranged at least in a portion between the plurality of substrate layers (4410; 5410; 6410; 7410; 8410; 9410; 10410; 11410; 12410), and is adjacent to each other. It may include one or more connecting layers (4420;5420;6420;7420;8420;9420;10420;11420;12420) connecting layers (4410;5410;6410;7410;8410;9410;10410;11410;12410). In one embodiment, the flexible circuit board (4400; 5400A; 6400; 7400; 8400; 9400; 10400; 11400; 12400) has a first circuit area (4510; 5510; 6510; 7510; 8510; 9510; 10510; 11510; 12510) in which data lines (4411-1; 5411-1; 6411-1; 7411-1; 8411-1; 9411-1; 10411-1; 11411-1; 12411-1) formed to transmit a data signal are located, and a power line (4411-1; 5411-1; 6411-1; 7411-1; 8411-1; 9411-1; 10411-1; 11411-1; 12411-1) formed to transmit a power signal is located. It may include a second circuit area (4520;5520;6520;7520;8520;9520;10520;11520;12520) where lines (4411-2;5411-2;6411-2;7411-2;8411-2;9411-2;10411-2;11411-2;12411-2) are located. The one or more connection layers (4420; 5420; 6420; 7420; 8420; 9420; 10420; 11420; 12420) may be arranged to not overlap the first circuit region (4510; 5510; 6510; 7510; 8510; 9510; 10510; 11510; 12510).

[0328] The effects to be achieved are not limited to those disclosed and described with reference to the various embodiments described above, and there are other effects not mentioned above, but it will be clearly understood by those skilled in the art that various changes in form and details are possible without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.

Claims

In a wearable electronic device (101; 201; 301; 401; 801), A frame (4100;8100) that accommodates at least one lens or at least one display; A temple (4200; 8200) connected to the end of the above frame (4100; 8100); and At least a portion of the flexible circuit board (4400; 5400A; 6400; 7400; 8400) (FPCB) is disposed on the temple (4200; 8200) and extends along the length direction, The above flexible circuit board (4400; 5400A; 6400; 7400; 8400) A plurality of substrate layers (4410; 5410; 6410; 7410; 8410) having one or more circuit lines (4411) formed on the surface and arranged to overlap along the thickness direction (T); and At least one connecting layer (4420; 5420; 6420; 7420; 8420) disposed between the plurality of substrate layers (4410; 5410; 6410; 7410; 8410) and connecting the surfaces of the adjacent substrate layers (4410; 5410; 6410; 7410; 8410), The above flexible circuit board (4400; 5400A; 6400; 7400; 8400) is A wearable electronic device comprising a first circuit region (4510; 5510; 6510; 7510; 8510) in which data lines (4411-1; 5411-1; 6411-1; 7411-1; 8411-1) for transmitting data signals are formed when viewed in the thickness direction (T), and wherein at least one connection layer (4420; 5420; 6420; 7420; 8420) is arranged non-overlappingly in the first circuit region. In the first paragraph, The above flexible circuit board (4400; 5400; 6400; 7400; 8400) It further includes a second circuit area (4520; 5520; 6520; 7520; 8520) which does not overlap with the first circuit area (4510; 5510; 6510; 7510; 8510) and in which a power line (4411-2; 5411-2; 6411-2; 7411-2; 8411-1) for transmitting a power signal is formed, A wearable electronic device, wherein when the flexible circuit board (4400;;5400;6400;7400;8400) is viewed in the thickness direction (T), the at least one connection layer (4420;5420;6420;7420;8420) overlaps the second circuit area (4520;5520;6520;7520;8520). In any one of paragraphs 1 and 2, At least one of the above connection layers (7420) A wearable electronic device arranged to overlap the entire second circuit area (7520). In any one of the first to third paragraphs, The above flexible circuit board (4400; 5400A; 6400; 7400; 8400) It further includes a third circuit area (4530;5530;6530;7530;8530) in which ground lines (4411-3;5411-3;6411-3;7411-3;8411-3) are formed, A wearable electronic device, wherein when the flexible circuit board (4400; 5400A; 6400; 7400; 8400) is viewed in the thickness direction (T), the at least one connection layer (4420; 5420; 6420; 7420; 8420) overlaps the third circuit area (4530; 5530; 6530; 7530; 8530). In any one of the first to fourth paragraphs, Each of the above multiple substrate layers (8410) It comprises one or more protruding portions (8412) protruding outward in a width direction perpendicular to the longitudinal direction, A wearable electronic device, wherein when the flexible circuit board (8400) is viewed in the thickness direction (T), the at least one connection layer (8420) overlaps the one or more protruding portions (8412). In any one of the first to fifth paragraphs, The above one or more protruding portions (8412) A wearable electronic device comprising one or more guide holes (8412a) formed penetrating along the thickness direction (T). In any one of the first to sixth paragraphs, The above flexible circuit board (8400D) A wearable electronic device comprising at least one via (8412b) formed on at least one protruding portion (8412) and connected to ground. In any one of the first to seventh paragraphs, The above flexible circuit board (4400; 5400A; 5400B) includes one or more bending portions (4430; 5430) that are at least partially bent in the thickness direction (T), A wearable electronic device, wherein at least one of the above connecting layers (5420) is arranged so as not to overlap at least one of the above bending portions (5430). In any one of claims 1 to 8, The above flexible circuit board (4400; 5400A; 6400; 7400; 8400) includes at least one connection area (4540; 5540; 6540; 7540; 8540) in which the connection layer (4420; 5420; 6420; 7420; 8420) is located when viewed in the thickness direction (T), A wearable electronic device, wherein at least one of the above connection areas (5540) is positioned adjacent to at least one of the above bending portions (5430). In any one of claims 1 to 9, In the above flexible circuit board (5400A; 5400B), A wearable electronic device, wherein at least one connection area (5540) is positioned at each of the longitudinal ends of the above-mentioned bending portion (5430). In any one of claims 1 to 10, The above flexible circuit board (5400C) includes at least one bending portion (5430) that is at least partially bent in the thickness direction (T), The above connection area (5540) includes a first connection area (5540A, 5540B) in which the at least one connection layer (5420) is arranged to not overlap the at least one bending portion (5430), and a second connection area (5540C) in which the connection layer (5420) is arranged to overlap the at least one bending portion. A wearable electronic device, wherein the second connection area (5540C) has a thinner thickness than the first connection area (5510A, 5510B). In any one of claims 1 to 11, A wearable electronic device, wherein at least one pair of connection layers (5420a, 5420b) disposed between different substrate layers (5410) in at least one connection area (5540) disposed adjacent to at least one bending portion (5430) have different areas. In any one of claims 1 to 12, Based on the cross-section of the above flexible circuit board (4400; 5400; 6400; 7400; 8400), A wearable electronic device, wherein at least one of the above connection layers (4420; 5420; 6420; 7420; 8420) is respectively disposed on both ends in the width direction of the flexible circuit board (4400; 5400; 6400; 7400; 8400). In any one of claims 1 to 13, At least a portion of the above flexible circuit board (4400) is placed at the portion where the temple (4200) and the frame (4100) are connected, A wearable electronic device, wherein at least one connecting layer (4420) is disposed on at least a portion of a flexible circuit board (4400) positioned at a location where the temple (4200) and frame (4100) are connected. In any one of claims 1 to 14, The above plurality of substrate layers (4410; 5410; 6410; 7410; 8410) include a first substrate layer (4410a; 5410a; 6410a; 7410a; 8410a), a second substrate layer (4410b; 5410b; 6410b; 7410b; 8410b), and a third substrate layer (4410c; 5410c; 6410c; 7410c; 8410c) sequentially arranged along the thickness direction (T), At least one of the above connection layers (4420; 5420; 6420; 7420; 8420) One or more first connection layers (4420a; 5420a; 6420a; 7420a; 8420a) disposed at least partially between the first substrate layer (4410a; 5410a; 6410a; 7410a; 8410a) and the second substrate layer (4410b; 5410b; 6410b; 7410b; 8410b); and comprising at least one second connection layer (4420b; 5420b; 6420b; 7420b; 8420b) disposed at least partially between the second substrate layer (4410b; 5410b; 6410b; 7410b; 8410b) and the third substrate layer (4410c; 5410c; 6410c; 7410c; 8410c); A wearable electronic device, wherein when viewed in the thickness direction, the first connection layer (4420a; 5420a; 6420a; 7420a; 8420a) and the second connection layer (4420b; 5420b; 6420b; 7420b; 8420b) overlap at least partially.

Images