Thermal cycler

Abstract

The present invention relates to a thermal cycler having a thermal module of which the position is adjustable, the thermal cycler comprising: a thermal module for heating and cooling a reaction container; a first support structure to which the thermal module is mounted; a vertical guide part which guides the first support structure to be moved vertically; and a second support structure which supports the vertical guide part and accommodates the first support structure. Thus, a pressure between the reaction container and a heat lid can be uniformly distributed, thereby improving the lifespan of the heat lid and reducing misalignment between components. In addition, provided is the thermal cycler, in which the first support structure is configured such that the thermal module can be attachable / detachable, and the thermal module is attached / detached through one open side of the first support structure. Thus, in the aspect of maintenance, repair and replacement can be carried out easily, and specifications can be changed stably.

Description

Thermal Cycler

[0001] The present invention relates to a thermal cycler for nucleic acid reaction detection, and more particularly, to a thermal cycler having a detachable and vertically movable thermal module.

[0002] Polymerase chain reaction (PCR) is the most widely used nucleic acid amplification reaction, which involves repeated cycles of denaturation of double-stranded DNA, annealing of oligonucleotide primers to a DNA template, and extension of the primers by DNA polymerase (Mullis et al., U.S. Patent Nos. 4,683,195, 4,683,202, and 4,800,159; Saiki et al., (1985) Science 230, 1350-1354).

[0003] DNA denaturation occurs at approximately 95°C, while annealing and primer extension occur at temperatures lower than 95°C, typically between 55°C and 75°C. Therefore, the temperature of the reaction vessel or chamber containing the sample is repeatedly raised and lowered, thereby performing a nucleic acid amplification reaction of the sample.

[0004] Typically, a thermal block having multiple sample wells is used to perform nucleic acid amplification reactions on multiple samples. Reaction vessels containing samples are inserted into the multiple sample wells, and the heating and cooling of the thermal block are repeated to simultaneously perform nucleic acid amplification reactions on multiple samples. The reaction vessel may be in the form of a multi-well sample plate, and a heated lid heats the upper portion of the reaction vessel, thereby preventing evaporation or condensation of the sample.

[0005] Typically, the sample wells of a heat block are arranged in rows and columns on a plane, and the sample wells are formed into 16 wells of 4 X 4, 32 wells of 4 X 8, 64 wells of 8 X 8, 96 wells of 8 X 12, and even larger 364 wells of 16 X 24. A typical heat block, also called a heat block, is made of metal for rapid heat conduction.

[0006] Thermal cycling and analysis are performed on the samples contained in the reaction vessels as reaction vessels, such as 96-well sample plates, are loaded and seated in the heat block. The reaction vessels are positioned between the heat block and the heat lid.

[0007] The pressure of the heat lead on the reaction vessel can affect the ramp rate of the thermal module, and the uniform distribution of pressure is known to affect the efficiency of the system. More specifically, the pressure and its uniform distribution are important for uniformly controlling the temperature of all samples contained in the reaction vessel. However, conventional thermal cyclers were generally designed so that the heat lead was simply pressurized toward the reaction vessel through a support that supported the heat lead.

[0008] This heat lead configuration inevitably leads to poor pressure distribution uniformity. Furthermore, the heat lead is repeatedly pressurized to pressures that differ from those of the reaction vessel, resulting in reduced durability and a shortened lifespan. Ultimately, if the heat lead fails to adequately prevent evaporation or condensation of the sample within the reaction vessel, the target analyte detection results may become inaccurate.

[0009] Additionally, to detect target analytes within a sample, an optical module equipped with a light source and a detector may be positioned on the reaction vessel and used with a thermal cycler. The optical module typically includes a light source and a detector. The light source emits excitation light to the samples, and fluorescent substances contained in the samples excited by the excitation light emit fluorescence. The detector is configured to detect the emission light emitted from the fluorescent substances and analyze the amplification reaction.

[0010] In conventional devices such as this, if the holes formed in the heat lead and the wells of each reaction vessel are not aligned and misaligned with each other, the excitation light may not pass through the area where it should pass. Consequently, the excitation light cannot be irradiated to the samples, making detection of the emitted light difficult. Therefore, it is important that the wells of the optical module and the reaction vessel, and the holes formed in the heat lead that is in close contact with the reaction vessel, are aligned with each other.

[0011] However, misalignment between the holes formed in the heat lead and the sample wells of the reaction vessel may occur due to the torsional action of the heat lead as it pressurizes the reaction vessel unevenly. If the holes in the heat lead and the sample wells are misaligned, the excitation light irradiation and emission light detection may not be performed accurately, making it difficult to detect the target analyte in the sample.

[0012] Therefore, there is a need for a device that can pressurize the reaction vessel with a uniform pressure to ensure the durability of the heat lead and enable precise alignment between the heat lead and the reaction vessel without distortion.

[0013] Against the background described above, the present invention aims to provide a thermal cycler configured to pressurize a reaction vessel with a uniform pressure and to enable precise alignment between a heat lead and the reaction vessel without distortion.

[0014] However, the problem to be solved according to this embodiment is not limited to this.

[0015] In order to achieve the above object, one aspect of the present invention can provide a thermal cycler including a thermal module for heating and cooling a reaction vessel; a first support structure on which the thermal module is mounted; a vertical guide part for guiding the first support structure to move vertically; and a second support structure for supporting the vertical guide part and accommodating the first support structure.

[0016] Additionally, the first support structure may include a receiving space for receiving the thermal module.

[0017] Additionally, the first support structure may include a first vertical side forming the receiving space, a second vertical side, and a connecting portion connecting the first vertical side and the second vertical side.

[0018] Additionally, at least one of the vertical guide portions may be connected to at least one of the first vertical side and the second vertical side.

[0019] Additionally, the connecting portion includes a first connecting member connecting the inner side of the first vertical side and the second vertical side, and an actuator providing power to move the first support structure can be coupled to the first connecting member.

[0020] Additionally, the connecting portion may include a second connecting member connecting the first vertical side, the second vertical side, and the first connecting member.

[0021] Additionally, the vertical guide portion may include a linear motion rail and a linear motion block that is slidable relative to the linear motion rail.

[0022] In addition, the linear motion rail may be provided on both sides of each of the first vertical side and the second vertical side, and the linear motion block may be provided for each of the linear motion rails on the inner side of the second support structure.

[0023] In addition, it further includes an actuator used to move the first support structure, and as the actuator is operated manually or automatically, the first support structure can move up and down inside the second support structure.

[0024] Additionally, the actuator may be coupled to at least a portion of the first support structure and disposed in an area adjacent to a side of the thermal module, and at least one of the vertical guide portions may be disposed spaced apart from the actuator.

[0025] Additionally, it may further include a manual handle used to move the first support structure.

[0026] Additionally, the manual handle may be connected to an actuator coupled to at least a portion of the first support structure.

[0027] In addition, the heat lead may be provided on the second support structure to provide heat from the upper portion of the thermal module; and a sensor may be further provided at a vertical distance (d1) from the heat lead.

[0028] Additionally, the sensor may be provided on the upper inner side of the second support structure.

[0029] In addition, it further includes a control unit that receives a signal detected by the sensor, and when a predetermined signal is generated by the sensor while the thermal module moves, the movement of the thermal module can be controlled by the control unit.

[0030] In addition, when the thermal module moves upward and the predetermined signal is generated by the sensor, the thermal module is moved upward by a second distance (d2) by the control unit, and the second distance (d2) may be equal to or greater than the first distance (d1).

[0031] Additionally, the predetermined signal may be a signal generated when the uppermost part of the object mounted on the thermal module passes the sensor.

[0032] Additionally, each of the first vertical side and the second vertical side may be provided with a support member on which the thermal module is mounted.

[0033] Additionally, an elastic member formed of an elastic material may be provided between the thermal module and the support member.

[0034] Additionally, the elastic member may have a pad shape formed of a silicone rubber sponge material.

[0035] In order to achieve the above purpose, another aspect of the present invention is a thermal module for heating and cooling a reaction vessel;

[0036] A first support structure configured to allow the above thermal module to be detachably mounted;

[0037] The above thermal module provides a thermal cycler that is detachable through an open side of the first support structure.

[0038] Additionally, the open side is the upper side of the first support structure, and the thermal module can be removed through an opening in which at least a portion of the upper side is open.

[0039] In addition, the first support structure may be provided with a support member that supports the thermal module, and the thermal module may be provided with a fixing member that is aligned with and fixed to the support member.

[0040] Additionally, the thermal module can be mounted on the first support structure simply by the support member being mounted on the fixing member.

[0041] Additionally, the first support structure may include an opening for access to an external component connected to the thermal module.

[0042] Additionally, a pinhole may be formed in the support member, and the fixing member may be provided with an alignment pin at least partially inserted into the pinhole.

[0043] Additionally, an alignment pin may be formed on the support member, and a pinhole into which the alignment pin is inserted may be formed on the fixing portion.

[0044] In addition, the support member is provided at least one on each side of the first support structure, and the fixing part can be hung on each of the support members.

[0045] Additionally, the fixed portion may be a portion protruding outwardly from the thermal module.

[0046] Additionally, an elastic member may be further included between the support member and the fixed member.

[0047] Additionally, the elastic member is formed of an elastic material and may have a pad shape formed with a predetermined thickness.

[0048] Additionally, the elastic member may have a pad shape formed of a silicone rubber sponge material.

[0049] In addition, it may further include a fixing pin for fixing the support member, the fixing member, and the elastic member.

[0050] In addition, an alignment pin may be formed in the fixed portion or the support member, and a first hole into which the alignment pin is inserted and a second hole into which the fixed pin is inserted may be formed in the elastic member.

[0051] Additionally, a fixing hole may be formed in the support member into which the fixing pin is inserted and fixed.

[0052] Additionally, the first support structure may include a receiving space for receiving the thermal module, and the receiving space may include a first vertical side, a second vertical side, and a connecting portion connecting the first vertical side and the second vertical side.

[0053] Additionally, the first support structure may further include an actuator coupled to the connecting portion, and the first support structure may be moved as the actuator is manually or automatically operated.

[0054] In addition, the thermal module includes a sample holder for accommodating the reaction vessel, a thermoelectric element used to heat or cool the sample holder, and a cooling fan and a heat sink for cooling the sample holder, and the thermal module can be detached from the first support structure as a whole.

[0055] Additionally, handles may be provided on both upper sides of the thermal module.

[0056] Additionally, the first support structure may further include a second support structure that supports the movement of the first support structure.

[0057] Additionally, the first support structure and the second support structure can be slidably connected.

[0058] According to one embodiment of the present invention, by providing a thermal cycler including a first support structure for stably vertically moving a thermal module on which a reaction vessel is mounted, the pressure between the reaction vessel and the heat lead is more uniformly distributed, thereby improving the lifespan of the heat lead and misalignment between the components.

[0059] Additionally, since the position of the thermal module can be adjusted by the first support structure, the pressure between the reaction vessel and the heat lead can be controlled to be constant.

[0060] According to another embodiment of the present invention, the thermal module is detachable from the thermal cycler, so that it is easy to repair and replace in terms of maintenance, and specifications can be changed reliably.

[0061] In addition, by providing a thermal cycler including a first support structure that stably supports a thermal module on which a reaction vessel is mounted, the pressure between the reaction vessel and the heat lead is more evenly distributed, thereby improving the lifespan of the heat lead and misalignment between the components.

[0062] FIG. 1 is a conceptual diagram illustrating a thermal cycler according to one embodiment of the present invention.

[0063] FIG. 2 is a perspective view illustrating a thermal cycler according to one embodiment of the present invention.

[0064] Figure 3 is an exploded perspective view of Figure 2 shown together with the reaction vessel.

[0065] FIG. 4 is a plan view showing a first support structure and a portion of a vertical guide according to one embodiment of the present invention.

[0066] FIG. 5 is a perspective view showing a first support structure and a portion of a vertical guide according to one embodiment of the present invention.

[0067] Figure 6 is a perspective view showing a thermal module according to one embodiment of the present invention.

[0068] FIG. 7 is an exploded perspective view illustrating the connection between a thermal module and a first support structure according to one embodiment of the present invention.

[0069] FIG. 8 is a perspective view showing a thermal module and a first support structure combined according to one embodiment of the present invention.

[0070] FIG. 9 is a partially enlarged exploded perspective view illustrating the connection between a thermal module and a first support structure according to one embodiment of the present invention.

[0071] Figure 10 is a longitudinal cross-sectional view taken along line AA' of Figure 9.

[0072] FIG. 11 is a perspective view showing a second support structure with upper and lower parts separated and a portion of a vertical guide part according to one embodiment of the present invention.

[0073] Figure 12 is a conceptual diagram for explaining movement of a thermal module according to operation of a sensor according to one embodiment of the present invention.

[0074] Fig. 13 is a perspective view showing an actuator according to one embodiment of the present invention.

[0075] Fig. 14 is a perspective view of the actuator of Fig. 13 viewed from the opposite side.

[0076] Hereinafter, the present invention will be described in detail through examples and illustrative drawings. These examples are intended solely to illustrate the present invention more specifically. It will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples, as they reflect the gist of the invention.

[0077] Additionally, when assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing the present invention, if a detailed description of a related known configuration or function is deemed likely to obscure the gist of the present invention, the detailed description will be omitted.

[0078] Additionally, when describing components of the present invention, terms such as first, second, A, B, (a), (b), (i), (ii), etc. may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by the terms. When it is described that a component is "connected," "coupled," or "connected" to another component, it can be understood that the component may be directly connected or connected to the other component, but another component may be "connected," "coupled," or "connected" between each component.

[0079] As used herein, a "sample" may include biological samples (e.g., cells, tissues, and fluids from biological sources) and non-biological samples (e.g., food, water, and soil). The biological samples may be viruses, bacteria, tissues, cells, blood (e.g., whole blood, plasma, and serum), lymph, bone marrow fluid, saliva, sputum, swabs, aspirations, milk, urine, feces, eye fluid, semen, brain extracts, spinal fluid, synovial fluid, thymic fluid, bronchial lavage fluid, ascites, and amniotic fluid. Additionally, the sample may include natural and synthetic nucleic acid molecules isolated from biological sources. In one embodiment of the present invention, the sample may include additional substances such as water, deionized water, saline solution, pH buffer, acidic solution, and basic solution.

[0080] A target analyte refers to an analyte that is to be analyzed. Such analysis may, for example, involve obtaining information about the presence, content, concentration, sequence, activity, or properties of an analyte in a sample. Analytes may include various substances (e.g., biological substances and non-biological substances such as compounds). Specifically, the analyte may include biological substances such as nucleic acid molecules (e.g., DNA and RNA), proteins, peptides, carbohydrates, lipids, amino acids, biological compounds, hormones, antibodies, antigens, metabolites, and cells. According to one embodiment of the present invention, the analyte may be a nucleic acid molecule.

[0081] An optical signal generated from a sample may be an optical signal that is generated depending on, for example, the properties of a target analyte, such as activity, amount, or presence (or absence), specifically the presence (or absence). The size, change, etc. of the optical signal serve as an indicator that qualitatively or quantitatively indicates the properties of the target analyte, specifically the presence or absence. The target analyte may be, for example, a target nucleic acid sequence or a target nucleic acid molecule containing the same. Therefore, the thermal cycler of the present invention can be used in a target nucleic acid sequence detection device.

[0082] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that a person having ordinary skill in the art to which the present invention pertains can easily practice the present invention.

[0083] First, the main components of a thermal cycler (1) according to an embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 is a conceptual diagram for explaining a thermal cycler (1) according to an embodiment of the present invention. As illustrated in FIG. 1, a thermal cycler (1) according to an embodiment of the present invention includes a heated lid (20), a thermal module (100) disposed below the heated lid (20), and a support structure (200, 300) for supporting the thermal module (100).

[0084] The support structure (200, 300) may include a first support structure (200) on which at least a portion of the upper side is open, and a second support structure (300) that supports the first support structure (200) to move, and the thermal module (100) may be substantially mounted. At this time, the reaction vessel (10) may be mounted between the heat lid (20) and the thermal module (100), more specifically, between the heat lid (20) and the sample holder of the thermal module (100).

[0085] A thermal cycler (1) according to one embodiment of the present invention can perform a nucleic acid amplification reaction of a sample by performing thermal cycling while applying heat and cooling to a sample holder provided in a thermal module (100). The thermal module (100) according to one embodiment of the present invention may include components typically included in a conventional thermal cycler. For example, the thermal module (100) according to one embodiment of the present invention may include a sample holder, a thermoelectric element used to heat and / or cool the sample holder, a temperature sensor for measuring temperature, a cooling fan and a heat sink for efficient cooling of the sample holder, etc.

[0086] However, unlike conventional thermal cyclers, the thermal module (100) according to one embodiment of the present invention may be provided as an integrated module. Here, “integrated” means that individual parts or functions are integrated into one device or system. In other words, the “integrated module” means a device that is combined into one. More specifically, the thermal module (100) may be provided as an integrated module in which a sample holder, a thermoelectric element, a temperature sensor, a duct that provides an air flow passage therein, a cooling fan that can introduce and exhaust air into and out of the duct, a heat sink through which air passes, and a control circuit board that controls the thermal cycling of the thermoelectric element are combined.

[0087] The thermal module (100) provided as an integrated module is easy to repair and replace, and its specifications can be changed reliably. For example, the manufacturer prepares thermal modules (100) with various specifications, and if the customer wishes to change the specifications, the specification can be easily changed by replacing only the thermal module (100) in the thermal cycler. For example, the specifications of the sample holder may include 6 wells, 12 wells, 24 wells, 48 ​​wells, 96 wells, 192 wells, or 384 wells. In addition, if the sample holder is provided so that multiple reaction vessels can be placed, the specifications of the sample holder may include 96x1, 96x2, or 96x3.

[0088] Additionally, the thermal module (100) may be provided with a connection for electrical connection with other components(s). The connection allows the thermal module (100) to be detachably coupled to other components(s). For example, the connection between the connection and other components(s) may include a board-to-board connector, and may include pin-through holes or magnetic structures for alignment.

[0089] A sample holder is formed with a sample receiving portion that receives a sample. The sample holder is a component that directly receives a sample in the sample receiving portion or receives a reaction vessel (10) containing the sample. In this specification, the expression "the sample holder can receive a sample" may be used to comprehensively indicate cases where the sample holder directly receives a sample in the sample receiving portion or receives a reaction vessel (10) containing the sample.

[0090] The sample holder may include one or more recesses (wells or holes) for accommodating a reaction vessel (10). Here, the reaction vessel (10) may have a multi-well sample plate shape. The reaction vessel (10) is used to accommodate a sample to be analyzed, and in addition, includes various forms of containers, for example, a tube, a vial, a strip in which multiple single tubes are connected, a plate in which multiple tubes are connected, a microcard, a chip, a cuvette, or a cartridge.

[0091] In one embodiment of the present invention, the sample holder may be a heat block formed of a material having thermal conductivity, such as metal. When the heat block is in direct contact with the sample or with the reaction vessels, heat can be transferred from the heat block to the sample or the sample within the reaction vessel (10).

[0092] According to one embodiment of the present invention, the sample wells of the heat block are arranged in rows and columns on a plane, and the sample wells can be formed as 16 wells of 4 X 4, 32 wells of 4 X 8, 64 wells of 8 X 8, 96 wells of 8 X 12, or even larger, 364 wells of 16 X 24. A thermoelectric element that heats and / or cools the heat block may be, for example, a Peltier device. The temperature sensor can be used to monitor the temperature of the heat block and / or the reaction vessel (10) in real time, and based on this, stable temperature control is possible.

[0093] As a configuration for preventing evaporation or condensation of a sample when heat is transferred to the sample as the heat block is heated, the thermal cycler (1) includes a heat lid (20). The heat lid (20) according to one embodiment of the present invention can prevent evaporation or condensation of the sample within the reaction vessel (10) by pressurizing and heating the reaction vessel (10) containing the sample. The heat lid (20) may include configurations included in a heat lid typically used in a thermal cycler.

[0094] A typical heat lead includes a heating element that can provide heat by converting electrical energy into thermal energy, a thermally conductive material for effectively transferring heat, an insulating material for minimizing heat loss to the outside of the heat lead, a temperature sensor for monitoring the temperature to help maintain an appropriate temperature, a control device for temperature control, and a pressure mechanism configured to apply uniform pressure when pressurized to an object to be heated.

[0095] In addition, a thermal cycler (1) according to one embodiment of the present invention includes a first support structure (200) and a second support structure (300) configured to pressurize the object disposed between a thermal module (100) and a heat lead (20). The first support structure (200) is configured to allow the thermal module (100) to be detachably attached thereto, and at least a portion thereof can be directly or indirectly coupled to a portion of the thermal module (100). Here, the thermal module (100) may be provided as an integrated module as described above.

[0096] Accordingly, the thermal module (100) can be easily replaced from a maintenance perspective. In this case, the user can remove a component such as a fixing pin or screw that fixes the thermal module (100) and the first support structure (200), and simply disconnect the connection with external components connected to the thermal module (100) to detach the thermal module (100) from the first support structure (200) as a whole.

[0097] In particular, the first support structure (200) may include an opening for an operator to easily access the external components connected to the thermal module (100). For example, the first support structure (200) may include an opening that allows access to ports or connectors for each of the power, communication circuit board, temperature control circuit board, etc. connected to the thermal module (100) so that the connection can be disconnected. In one embodiment of the present invention, it is preferable that the components connected to the thermal module (100) are connected through ports or connectors and configured to be disconnectable. Accordingly, the thermal module (100) can be easily separated from the first support structure (200) and detached from the thermal cycler (1).

[0098] As the first support structure (200) moves, the thermal module (100) can move. That is, the first support structure (200) supports the thermal module (100) so that it can move in the vertical direction, i.e., the Z-axis direction, but the thermal module (100) can be separated from the first support structure (200) as needed.

[0099] The second support structure (300) accommodates and supports the first support structure (200), and can support the first support structure (200) so that it can be stably lifted. At this time, the heat lead (20) can be positioned above the second support structure (300). The second support structure (300) can be a frame that substantially includes the bottom portion of the thermal cycler (1) according to one embodiment of the present invention. The first support structure (200) can be vertically slidably coupled to the second support structure (300).

[0100] Accordingly, the first support structure (200) can be stably moved vertically relative to the second support structure (300) while supporting the thermal module (100). The first support structure (200) moves upward relative to the second support structure (300), so that the reaction vessel (10) can be positioned in close contact with the heat lead (20).

[0101] In another embodiment of the present invention, the direction of movement of the first support structure configured to be detachable from the thermal module (100) may not be vertical. That is, the second support structure may support the first support structure to move, and the first support structure may be slidably connected to the second support structure.

[0102] For example, even if the first support structure is configured to move horizontally, the thermal module (100) can be detached as a whole through an open side of the first support structure. Preferably, even in this case, the open side of the first support structure is the upper side of the first support structure. However, in this case, a horizontal guide part (not shown) rather than a vertical guide part (400) may be coupled to the first support structure. Among other configurations, the arrangement of the actuator (500) may also vary.

[0103] When a problem occurs in some configuration of the thermal module (100) and inspection or replacement of parts is required, the thermal module (100) can be detached through openings (first opening and second opening) formed in each of the first and second support structures (200 and 300). That is, the first support structure (200) and the second support structure (300) include openings in which at least a portion of one side is open, and the thermal module (100) can be detached from the thermal cycler (10) through the openings.

[0104] In one embodiment of the present invention, when the first support structure (200) is configured to move vertically with respect to the second support structure (300), both the first opening and the second opening may be formed so that a portion of the upper side is open. In another embodiment of the present invention, when the first support structure is configured to move horizontally with respect to the second support structure, the first opening may be formed so that a portion of the upper side is open, while the second opening may be formed so that a portion of any one of the left and right sides, the front, and the rear is open.

[0105] A thermal cycler (1) according to one embodiment of the present invention may be combined with an optical module and included in a target nucleic acid sequence detection device. In such a target nucleic acid sequence detection device, the optical module may be used to detect a target analyte within a sample accommodated in a reaction vessel (10). At this time, since the thermal module (100) according to one embodiment of the present invention is moved upward by the first support structure (200), the reaction vessel (10) can be aligned with the optical module while being stably and uniformly pressurized between the heat lead (20) and the heat block.

[0106] A thermal cycler (1) according to an embodiment of the present invention will be further described with further reference to FIGS. 2 and 3. FIG. 2 is a perspective view illustrating a thermal cycler (1) according to an embodiment of the present invention. FIG. 3 is an exploded perspective view of FIG. 2 illustrated together with a reaction vessel (10). Although the heat lead (20) is omitted in FIGS. 2 and 3, as described with reference to FIG. 1, the reaction vessel (10) is preferably positioned so as to be seated on a heat block (110) and pressurized between the heat lead (20) and the heat block (110).

[0107] As illustrated in FIG. 2, a thermal cycler (1) according to one embodiment of the present invention may include a thermal module (100) having a heat block (110), a first support structure (200) on which the thermal module (100) is mounted, a vertical guide portion (400) that guides the first support structure (200) to move vertically, a second support structure (300) that supports the vertical guide portion (400) and accommodates the first support structure (200), and an actuator (500) that is used to move the first support structure (200). Here, the first support structure (200) and the second support structure (300) may be slidably connected through the vertical guide portion (400).

[0108] In addition, the first support structure (200) according to one embodiment of the present invention can be coupled with an actuator (500), and more specifically, the actuator (500) can be coupled to one side of the first support structure (200). By the actuator (500), the first support structure (200) can vertically move along the vertical guide portion (400) within the second support structure (300).

[0109] Here, the vertical guide unit (400) may be an LM guide (linear motion guide), and the actuator (500) may be a ball screw actuator. That is, the vertical guide unit (400) and the actuator (500) according to one embodiment of the present invention are preferably configured as a combination of an LM guide and a ball screw actuator, but are not limited thereto. In other words, any configuration that allows the thermal module (100) to slide precisely on the second support structure (300) is possible.

[0110] Referring to FIG. 3, the structure of a thermal cycler (1) according to one embodiment of the present invention will be described in more detail. As illustrated in FIG. 3, a reaction vessel (10) may be mounted on a heat block (110) of a thermal module (100), and the thermal module (100) may be mounted inside a first support structure (200). The first support structure (200) may include a receiving space for receiving the thermal module (100). As an example, the first support structure (200) may be a box-shaped structure capable of receiving the thermal module (100).

[0111] The second support structure (300) may include an upper portion (310) that can cover at least a portion of the first support structure (200) and a lower portion (320) that can surround at least a portion of the first support structure (200). That is, the second support structure (300) may be configured to be divided into an upper portion (310) and a lower portion (320) and configured to at least partially accommodate the first support structure (200).

[0112] A vertical guide member (400) that provides high-precision linear motion may be provided as a mechanism for guiding and supporting the linear motion of the first support structure (200) accommodated within the second support structure (300). The vertical guide member (400) according to one embodiment of the present invention may be a mechanism that includes a linear rail system. Preferably, the vertical guide member (400) may be a linear motion guide, and may include a linear motion rail (410) and a linear motion block (420) that is slidable with respect to the linear motion rail (410).

[0113] The linear motion rail (410) can be manufactured from a high-strength material and can be manufactured with a precisely machined surface so that it can move smoothly relative to the linear motion block (420). The linear motion block (420) can be manufactured in various sizes and can include ball bearings or roller bearings inside. Generally, the rail in a linear rail system functions to guide the movement of the block, but in a preferred embodiment of the present invention, the linear motion rail (410) can move relative to the linear motion block (420).

[0114] More specifically, as illustrated in FIG. 3, when the first support structure (200) is in a form that can maintain the linearity and parallelism of the rail, such as a box-shaped structure, the linear motion rail (410) may be coupled to the first support structure (200), and the linear motion block (420) may be coupled to the second support structure (300). Preferably, the linear motion rail (410) may be coupled to the outside of the first support structure (200), and the linear motion block (420) may be coupled to the inside of the second support structure (300). Accordingly, the first support structure (200) may be smoothly moved vertically with respect to the second support structure (300). At this time, one or more, preferably two linear motion blocks (420) may be provided for one linear motion rail (410).

[0115] In addition, in another embodiment, if the first support structure (200) is of a form that cannot maintain the linearity and parallelism of the rail, the linear motion rail (410) may be coupled to the second support structure (300), and the linear motion block (420) may be coupled to the first support structure (200). In this case, one or more, preferably two linear motion blocks (420) may be slidably coupled to one linear motion rail (410).

[0116] The actuator (500) can be coupled to one side of the first support structure (200) and at least a portion, preferably the lower portion (320), of the second support structure (300). The actuator (500) can be operated manually or automatically, and can be operated to lift the lower portion of the first support structure (200) from the lower portion (320) and move vertically along the vertical guide portion (400).

[0117] In addition, the actuator (500) may be arranged in an area adjacent to the side of the thermal module (100), and at least one vertical guide member (400) may be arranged spaced apart from the actuator (500). Preferably, even if the position of the force point of the actuator (500) does not correspond to the center of gravity of the thermal module (100), twisting due to an asymmetrical load can be prevented as the actuator (500) and at least one vertical guide member (400) are arranged spaced apart from each other.

[0118] Next, the features of the first support structure (200) of the present invention will be further described with further reference to FIGS. 4 and 5. FIG. 4 is a plan view showing a portion of the first support structure (200) and the vertical guide portion (400) according to one embodiment of the present invention. FIG. 5 is a perspective view showing a portion of the first support structure (200) and the vertical guide portion (400) according to one embodiment of the present invention.

[0119] A first support structure (200) according to one embodiment of the present invention may include a receiving space for receiving a thermal module (100). The first support structure (200) may include a first vertical side (210), a second vertical side (220) forming the receiving space, and a connecting portion (230) connecting the first vertical side (210) and the second vertical side (220).

[0120] Here, the first vertical side (210) and the second vertical side (220) are configured to be vertically arranged with respect to the upper and / or lower surfaces of the thermal module (100), and may be part of a kind of frame that surrounds the thermal module (100). That is, the first vertical side (210) and the second vertical side (220) may have a shape such as a wall, panel, pillar, etc. having a vertical surface, but are not limited thereto.

[0121] As illustrated in FIG. 4, the first vertical side (210) and the second vertical side (220) according to one embodiment of the present invention may be arranged parallel to each other, and the connecting portion (230) may connect the two vertical sides (210, 220). Preferably, the connecting portion (230) serves to connect the two vertical sides (210, 220) so that they can stably move as a single body. In particular, the connecting portion (230) may include a member crossing the inner side of the two vertical sides (210, 220) and / or a member crossing the upper part thereof. By means of this connecting portion (230), the first vertical side (210) and the second vertical side (220) can form a stable structure without distortion.

[0122] Additionally, the first support structure (200) may include a bottom portion (250) that is arranged parallel to the lower surface of the thermal module (100) and is coupled to the lower portions of the first vertical side (210) and the second vertical side (220). Furthermore, the first support structure (200) may further include a front portion (260) that is perpendicular to the bottom portion (250) and is coupled to the ends of the first vertical side (210) and the second vertical side (220). That is, the first support structure (200) according to one embodiment of the present invention may include the first vertical side (210) and the second vertical side (220) on both sides, a connection portion (230) on the inner side and / or the upper side, the bottom portion (250) on the lower side, and the front portion (260) that connects the ends of the first vertical side (210) and the second vertical side (220).

[0123] The arrangement of the first vertical side (210), the second vertical side (220), and the connecting portion (230) may vary depending on the arrangement of the actuator (500). In particular, as illustrated in FIG. 4, the actuator (500), which is simply indicated by a box, may be coupled to a portion of the connecting portion (230), and the point where the actuator (500) is coupled to the connecting portion (230) may act as a force point (F).

[0124] At this time, one or more vertical guide parts (400) may be connected to at least one of the first vertical side (210) and the second vertical side (220). As the vertical guide parts (400) are appropriately positioned on the first support structure (200), an asymmetrical load due to a difference in distance between the position of the force point (F) and the center of gravity of the thermal module (100) and a rotational force that may be generated thereby can be offset.

[0125] More specifically, in one embodiment of the present invention, the linear motion rail (410) of the vertical guide portion (400) may be provided and arranged at each corner portion of the first support structure (200). As illustrated in FIG. 4, four linear motion rails (410a, 410b, 410c, 410d) may be provided and combined on both sides of each of the first vertical side (210) and the second vertical side (220). That is, linear motion rails (410a, 410b, 410c, 410d) may be provided on both sides of each of the first vertical side (210) and the second vertical side (220), and linear motion blocks (420) may be provided for each of the linear motion rails (410a, 410b, 410c, 410d) on the inner side of the second support structure (230). One or more linear motion blocks (420) may be provided for each linear motion rail (410a, 410b, 410c, 410d).

[0126] At this time, the connecting portion (230) may be coupled to the inside of the first vertical side (210) and the second vertical side (220) so that the force point (F) is positioned closer to the center of gravity of the thermal module (100) than at least two linear motion rails (410a, 410b). That is, the first vertical side (210) and the second vertical side (220) may each have a form that extends beyond the position where the actuator (500) is coupled to the connecting portion (230).

[0127] In another embodiment, depending on the shape of the thermal module (100), the first vertical side (210), the second vertical side (220), and the connection part (230) may be arranged differently and combined, or may be manufactured as an integral part. In another embodiment, the first vertical side (210) and the second vertical side (220) may be arranged perpendicular to the bottom part (250), but may not be parallel to each other. One or more vertical guide parts (400) may be provided, and may be arranged at each corner of the first support structure (200), but are not limited thereto.

[0128] In addition, the bottom part (250) of the first support structure (200) according to one embodiment of the present invention may be designed in consideration of the center of gravity of the thermal module (100) and the first support structure (200), the force point (F), the arrangement of the vertical guide part (400), etc., for an asymmetrical load and rotational force that may occur due to the gap between the thermal module (100) and the actuator (500). That is, the bottom part (250) may be designed so that when the thermal module (100) is mounted on the first support structure (200) and moved, the load is evenly distributed so that the module can move stably.

[0129] For example, as illustrated in FIG. 4, which is a plan view of the first support structure (200), the bottom portion (250) may include bottom members (251, 252) that spread out from a force point (F) position. More specifically, the bottom portion (250) may include a first bottom member (251) that passes through the center of the bottom portion (250), and a second bottom member (252) that spreads out in both directions in a diagonal direction from one side of the first bottom member (251) positioned adjacent to the force point.

[0130] In addition, the first support structure (200) is provided with a support member (240) that supports the thermal module (100), and a protruding portion of the thermal module (100) can be seated on the support member (240). Accordingly, the lower side of the thermal module (100) can be maintained in a state spaced apart from the bottom portion (250) of the first support structure (200), and the thermal module (100) can be seated in an accurate position only by aligning and fixing it with the support member (240).

[0131] According to one embodiment of the present invention, a support member (240) may be configured so that a thermal module (100) can be accurately positioned and mounted. A pin hole (241) may be formed in the support member (240), and a portion of the thermal module (100) may be provided with an alignment pin (131, see FIG. 7) that can be inserted therein. A portion of the thermal module (100) where the alignment pin (131) is formed may be a portion protruding from both upper sides of the thermal module (100). In addition, the support member (240) may be formed or coupled to each of the first vertical side (210) and the second vertical side (220).

[0132] In another embodiment, alignment pins may be formed on the support member, and pinholes into which the alignment pins are inserted may be formed on a portion of the thermal module (100). That is, the positional alignment of the thermal module (100) and the first support structure (200) may be achieved by these alignment pins and pinholes. In another embodiment, the positional alignment of the thermal module (100) and the first support structure (200) may be achieved by another method.

[0133] Next, an example of a connecting member (230) is further described with reference to FIG. 5. As illustrated in FIG. 5, the connecting member (230) includes a first connecting member (231) connecting the inner sides of the first vertical side (210) and the second vertical side (220), and an actuator (500) providing power to move the first support structure (200) may be coupled to the first connecting member (231). Here, the first connecting member (231) may have a vertical wall shape coupled to the inner sides of the first vertical side (210) and the second vertical side (220). In another embodiment, the first connecting member (231) may be in the shape of a plurality of rods, bars, or panels crossing between the first vertical side (210) and the second vertical side (220).

[0134] In addition, the connecting portion (230) according to one embodiment of the present invention may further include a second connecting member (232) connecting the first vertical side (210), the second vertical side (220), and the first connecting member (231). Here, the second connecting member (232) may be a member that covers the first vertical side (210), the second vertical side (220), and a portion of the upper side of the first connecting member (231).

[0135] More preferably, the second connecting member (232) may include a plate portion having a function of reinforcing a corner portion formed by connecting the first vertical side (210), the second vertical side (220), and the first connecting member (231). For example, the second connecting member (232) may have a function such as a gusset plate. Although illustrated in FIG. 5 as a single plate of a specific shape covering the upper side, the second connecting member (232) may be a plurality of members of different shapes that reinforce the corner portion at different locations.

[0136] A first support structure (200) according to one embodiment of the present invention may include a first vertical side (210), a second vertical side (220), a connecting portion (230), a support member (240), a bottom portion (250), and a front portion (260) as described above, and a thermal module (100) may be mounted in the receiving space formed thereby.

[0137] The structure of a thermal module (100') according to another embodiment of the present invention will be described with reference to FIG. 6. FIG. 6 is a perspective view showing a thermal module (100') according to another embodiment of the present invention. The thermal module (100') illustrated in FIG. 6 is different from the thermal module (100) illustrated in FIGS. 2 and 3 in that it further includes a handle (150), but all other components may be included in the same manner.

[0138] As illustrated in Fig. 6, the thermal module (100') may have a substantially hexahedral shape. A heat block (110) may be provided on the upper side of the thermal module (100'), and a fan (120) may be provided on the side. In addition, an outwardly protruding fixing member (130) may be formed on the upper side of the thermal module (100'), and an elastic member (140) may be provided on the lower side of the fixing member (130).

[0139] According to one embodiment of the present invention, a handle (150) may be provided on both upper sides of a thermal module (100'). The thermal module (100') is configured to be detachable from the first support structure (200), and the user can more easily take out the thermal module (100') from the first support structure (200) by means of the handle (150).

[0140] For example, in the case where some parts of the thermal module (100') need to be replaced for maintenance reasons, the user can easily separate the thermal module (100') from the first support structure (200) by removing a configuration such as a fixing pin or screw that fixes the thermal module (100') and the first support structure (200), and then lifting the handle (150). In addition, the handle (150) may be detachably coupled to the thermal module (100') to facilitate repair of the thermal module (100') or replacement of some parts. For example, the handle (150) may be screw-coupled to the thermal module (100'). More specifically, the handle (150) may be fixed on a fixing portion (130) that protrudes outwardly of the thermal module (100').

[0141] The coupling structure of the thermal module (100') and the first support structure (200) will be described in more detail with reference to FIGS. 7 to 10. FIG. 7 is an exploded perspective view illustrating the coupling between the thermal module (100') and the first support structure (200) according to one embodiment of the present invention. FIG. 8 is a perspective view illustrating the coupled state of the thermal module (100') and the first support structure (200) according to one embodiment of the present invention. FIG. 9 is a partially enlarged view of the exploded perspective view illustrating the coupling between the thermal module (100') and the first support structure (200) according to one embodiment of the present invention. FIG. 10 is a longitudinal cross-sectional view taken along line AA' of FIG. 9.

[0142] As illustrated in FIG. 7, a handle frame portion (211) may be formed on the first support structure (200) to secure a free space around the handle (150) of the thermal module (100'). The handle frame portion (211) may be a frame that surrounds at least a portion of the handle (150). Accordingly, the free space around the handle (150) allows a user to easily grip the handle (150) and easily separate the thermal module (100') from the first support structure (200).

[0143] The fixing member (130) is provided with an alignment pin (131) protruding downward, and can be inserted into a pin hole (241, see FIG. 9) formed in a support member (240) of the first support structure (200). The alignment pin (131) can be made of various materials, and is particularly formed so that the thermal module (100') can be accurately positioned with respect to the first support structure (200). That is, as the alignment pin (131) is accurately inserted into the pin hole (241), the thermal module (100') can be accurately aligned and mounted with respect to the first support structure (200). In addition, a fixing pin (132) can be inserted and passed through the fixing member (130) and fixed into a fixing hole (242, see FIG. 9) formed in the support member (240). A thermal module (100') accurately positioned by a fixed pin (132) can be stably fixed to the first support structure (200).

[0144] Referring to FIG. 8, a thermal module (100') is illustrated in an accurately positioned and mounted manner relative to a first support structure (200). As illustrated in FIG. 8, when handles (150) are provided on both sides of the thermal module (100'), a first handle frame portion (211) and a second handle frame portion (221) may be formed on each of the first vertical side (210) and the second vertical side (220). The handle (150) is formed to be used when lifting the thermal module (100') upward, and one or more handles may be provided on the thermal module (100'). In another embodiment, one or more handles (150) may be provided on the thermal modules (100, 100') in a different arrangement, and accordingly, the positions and numbers of the handle frame portions (211, 221) formed may also vary.

[0145] The following describes the coupling relationship between the fixing member (130), the elastic member (140), and the support member (240) in more detail with reference to FIGS. 9 and 10. At least one fixing member (130) may be provided on a side of the thermal module (100), and each fixing member (130) may be provided with an alignment pin (131, see FIG. 10) and a fixing pin (132). The fixing member (130) may be a protruding part of the thermal module (100), and the thermal module (100) may be secured to the first support structure (200) simply by the support member (240) being secured to the fixing member (130). The elastic member (140) may be provided between the thermal module (100) and the support member (240).

[0146] The elastic member (140) may have a pad shape with a predetermined thickness and may be formed of an elastic material, such as a silicone rubber sponge material. In one embodiment of the present invention, the elastic member (140) may be formed of a silicone rubber sponge. The silicone rubber sponge can maintain its physical properties even in environments with large temperature changes, has little deformation even after long-term use, is highly durable, and has high mechanical strength. In addition, it can withstand repeated compression and expansion.

[0147] By providing such an elastic member (140) between the fixing member (130) of the thermal module (100) and the support member (240) of the first support structure (200), when the thermal module (100) moves and the reaction vessel (10) is brought into close contact with the heat lid (20), the pressure between the reaction vessel (10) and the heat lid (20) can be distributed more evenly.

[0148] At this time, since the fixed part (130) has a shape that spans the support member (240), the lower side of the thermal module (100) can be maintained in a state spaced apart from the bottom part (250) of the first support structure (200). That is, in a state where the thermal module (100) is lifted from the bottom part (250), the thermal module (100) can be stably leveled on the support member (240) by the elastic member (140). Through the leveling effect of the elastic member (140), the pressure on the reaction vessel (10) can be evenly distributed, shock that may occur due to movement of the thermal module (100) can be absorbed, and vibration can also be reduced.

[0149] A support member (240) may be provided on each of the first vertical side (210) and the second vertical side (220) of the first support structure (200). The support member (240) is coupled to the first support structure (200) and includes an upper surface that substantially supports the thermal module (100), and may include a fine pin hole (241) and a fixing hole (242) extending downward from the upper surface.

[0150] As illustrated in FIG. 10, the alignment pin (131) may be formed to extend substantially as a part of the fixing member (130). At this time, a first through-hole (141), which is a hole through which the alignment pin (131) may pass, may be formed in the elastic member (140). The alignment pin (131) may pass through the first through-hole (141) of the elastic member (140) and be received in the pinhole (241) of the support member (240). That is, the thermal module (100) may be accurately aligned to the first support structure (200) by the alignment pin (131).

[0151] The fixed pin (132) can be inserted after the alignment pin (131) is secured. The fixed pin (132) may be a component such as a screw that is inserted into a hole formed in the fixed portion (130) and used. A second through-hole (142), which is a hole through which the fixed pin (132) can pass, may be formed in the elastic member (140). That is, the fixed pin (132) can be inserted into the fixed portion (130), pass through the second through-hole (142) of the elastic member (140), and be inserted and fixed into the fixed hole (242) of the support member (240). The fixed pin (132) may be a screw that is tightened into the fixed hole (242) within a predetermined torque range.

[0152] The second support structure (300) will now be described with further reference to FIG. 11. FIG. 11 is a perspective view showing a second support structure (300) with an upper portion (310) and a lower portion (310) separated according to one embodiment of the present invention, and a portion of a vertical guide portion (400). The second support structure (300) may be a structure that surrounds the first support structure (200). The second support structure (300) may include an upper portion (310) and a lower portion (320) that are separable from each other.

[0153] The upper portion (310) of the second support structure (300) according to one embodiment of the present invention may include a frame portion (311) that serves to support a heat lead (not shown) so that it can be provided on the thermal module (100). The frame portion (311) may cover a portion of the first support structure (200) and the upper portion of the actuator (500).

[0154] It is preferable that the inner circumference of the frame (311) covering a portion of the first support structure (200) be larger than the outer circumference of the thermal module (100). Accordingly, the thermal module (100) can pass through the inner space covered by the frame (311). That is, when a user separates the thermal module (100) from the first support structure (200), the thermal module (100) can pass through the frame (311) and be separated from the thermal cycler (1).

[0155] Additionally, the upper portion (310) covering the upper side of the actuator (500) may include a detachable window (313). A manual handle (510, see FIG. 13) of the actuator (500) may be positioned below the window (313). When a user needs to manually operate the actuator (500), the manual handle (510) of the actuator (500) can be easily accessed through the window (313) formed in the upper portion (310). The manual handle (510) may be configured to be rotated so that the actuator (500) is operated, thereby allowing manual adjustment of the height of the thermal module (100).

[0156] In one embodiment of the present invention, the manual handle (510) may be coupled to a ball screw type actuator (500), but in another embodiment, the manual handle may be configured to be connected to a lifting device that vertically moves the first support structure (200) in another manner. For example, the manual handle may be a lever, dial, button, or the like coupled to a lifting device composed of a chain, belt, pulley, gear, or the like.

[0157] In addition, a sensor (312) may be provided on the inner side of the upper portion (310) of the second support structure (300). The sensor (312) according to one embodiment of the present invention may be a height detection sensor that uses a beam to detect the height or position of an object placed on the reaction vessel (10) or the thermal module (100). In particular, the sensor (312) may be a transmission-type sensor, and may include a light-emitting element that emits infrared rays or laser, and a light-receiving element on the opposite side that detects light emitted from the light-emitting element. When an object such as the reaction vessel (10) blocks the path of light emitted from the light-emitting element, the light-receiving element detects this and generates a signal, so that the sensor can operate.

[0158] A thermal cycler (1) according to one embodiment of the present invention may further include a control unit (not shown) that receives a signal detected by a sensor (312) as described above. When a predetermined signal is generated by the sensor (132) while the thermal module (100) moves, the movement of the thermal module (100) may be controlled by the control unit. The first support structure (200) on which the thermal module (100) is mounted may be moved vertically with respect to the lower portion (320) of the second support structure (300).

[0159] According to one embodiment of the present invention, the lower part (320) of the second support structure (300) is combined with the upper part (310) to form a frame of the thermal cycler (1). The lower part (320) of the second support structure (300) may include a first lower side (321) and a second lower side (322) facing the first lower side (321). In addition, the first lower side (321) and the second lower side (322) may be a plane on which they are erected, and may include a lower bottom portion (323).

[0160] A vertical guide member (400) may be coupled to the inner surface of each of the first lower side (321) and the second lower side (322). Preferably, as described above, the linear motion rail (410) may be coupled to the outer surface of the first support structure (200), and the linear motion block (420) may be coupled to the inner surface of the second support structure (300). Accordingly, the first support structure (200) may be smoothly moved vertically with respect to the second support structure (300). At this time, one or more, preferably two linear motion blocks (420) may be provided for one linear motion rail (410).

[0161] Next, the operation of the sensor (312) will be described with further reference to FIG. 12. FIG. 12 is a conceptual diagram for explaining the movement of the thermal module (100) according to the operation of the sensor (312, 312'). As illustrated in FIG. 12, the heat lead (20) may be provided on the second support structure (300) to provide heat from the upper portion of the thermal module (100). At this time, the sensor (312, 312') may be arranged at a vertical distance equal to a first distance (d1) from the heat lead (20). The sensor (312, 312') may include a light-emitting element and a light-receiving element arranged opposite thereto.

[0162] Such sensors (312, 312') may be provided on the upper portion (310) of the second support structure (300), but are not limited thereto, and are preferably arranged so that the reaction vessel (10) can pass through the path of light while the distance from the heat lead (20) is fixed at a constant level. The vertical distance equivalent to the first distance (d1) is a distance perpendicular to the path of light passing between the sensors (312, 312'). That is, in one example, the vertical distance equivalent to the first distance (d1) is a distance perpendicular to the path of light passing between the light-emitting element and the light-receiving element.

[0163] When a predetermined signal is generated by the sensor (312, 312') while the thermal module (100) moves upward, the control unit can cause the thermal module (100) to move upward by a second distance (d2). The second distance (d2) may be equal to or greater than the first distance (d1). The predetermined signal may be a signal generated when an object mounted on the thermal module (100), for example, the top of the reaction vessel (10), passes the sensor (312, 312'). That is, when a predetermined signal is generated while the thermal module (100) on which the reaction vessel (10) is mounted moves upward, the top of the reaction vessel (10) can reach the heat lead (20) and be pressurized to a certain pressure.

[0164] Next, the actuator (500) will be described with further reference to FIGS. 13 and 14. FIG. 13 is a perspective view showing an actuator (500) according to one embodiment of the present invention. FIG. 14 is a perspective view of the actuator (500) of FIG. 13 viewed from the opposite side. The actuator (500) can be operated manually or automatically, and the first support structure (200) can move up and down within the second support structure (300) by the actuator (500).

[0165] In one embodiment of the present invention, a manual handle (510) may be used to move the first support structure (200). As described above, the manual handle (510) may be used when a user needs to manually operate the actuator (500). For example, the manual handle (510) may include a disc, lever, dial, gear, pinion, or the like coupled to a lifting device comprised of a ball screw, chain, belt, pulley, rack, or the like.

[0166] Preferably, in one embodiment of the present invention, the actuator (500) may be a ball screw type actuator coupled with a motor (550). At this time, the linear member (520) may be a ball screw arranged parallel to the vertical guide member (400), and the moving member (530) may be a ball nut that can move around the linear member (520), and the moving member (530) may be fixed to at least a part of the connecting member (230). Here, the manual handle (510) is coupled to the linear member (520) and formed so as to be able to rotate the linear member (520). For example, the manual handle (510) may be a disk-shaped member in which a grippable gap is formed, as illustrated in FIG. 13.

[0167] That is, the linear member (520) is a member that converts rotational motion into linear motion with a screw-shaped shaft, and is coupled to a manual handle (510), so that the linear member (520) can be rotated by turning the manual handle (510). The rotation of the linear member (520) can raise or lower the movable member (530), which is a ball nut. The movable member (530) can have a ball bearing and a curved (spiral) groove formed therein so that it can rotate with respect to the linear member (520).

[0168] Additionally, one side of the movable member (530) may be fixed to the connecting portion (230) of the first support structure (200), more specifically, the first connecting member (231). In practice, since the movable member (530) is fixed to a portion of the first support structure (200), the first support structure (200) may be vertically moved together with the movable member (530). Accordingly, as the linear member (520) rotates, the first support structure (200) supporting the thermal module (100) may be raised or lowered together with the movable member (530).

[0169] Since the screw pitch of the ball screw mechanism of the actuator (500) according to one embodiment of the present invention is small, the height of the first support structure (200) can be precisely adjusted even with a small rotation of the manual handle (510). When the first support structure (200) reaches the height desired by the user, the manual handle (510) can be stopped and fixed.

[0170] The linear member (520) and the movable member (530) can both be stably coupled and operated by the actuator housing (540). The actuator housing (540) can be vertically erected and fixed to the lower bottom portion (323) of the second support structure (300). The actuator housing (540) can be a member that protects the linear member (520) and the movable member (530) while preventing the movable member (530) from being separated from the linear member (520).

[0171] By fixing the arrangement of the linear member (520) and the movable member (530) by the actuator housing (540), the first support structure (200) can smoothly move vertically together with the movable member (530) by providing rotational force to the movable member (530). Here, the rotational force can be provided by the user directly rotating the manual handle (510) or by operating a motor (550) coupled to the movable member (530) or the linear member (520).

[0172] In one embodiment of the present invention, the motor (550) may be coupled to a linear member (520) which is a ball screw, and may provide rotational force to a movable member (530) which is a ball nut by rotating the linear member (520). The motor (550) may be a stepping motor or a servo motor, and as the motor (550) is operated, the linear member (520) rotates, thereby causing the movable member (530) to move the first support structure (200) up and down. The motor (550) may be connected to the linear member (520) through a coupling (560), and the rotational force of the motor (550) may be efficiently transmitted by the coupling (560).

[0173] Additionally, the actuator (500) according to one embodiment of the present invention may include a block (570) that supports both ends of the linear member (520) and maintains the alignment of the linear member (520). As illustrated in FIG. 13, the block (570) may include a first block (571) and a second block (572) that are positioned with the movable member (530) interposed therebetween. Since the first and second blocks (571 and 572) are provided above and below the movable member (530), the movable member (530) can be reliably prevented from coming off.

[0174] In addition, as illustrated in FIG. 14, the actuator (500) according to an embodiment of the present invention may further include a guide groove (580) formed in the actuator housing (540). A moving member (530) is inserted into the guide groove (580), and the moving member (530) may be fixed to the first support structure (200) through the guide groove (580). Accordingly, when the motor (550) or the manual handle (510) is operated, the moving member (530) may vertically move along the guide groove (580) together with the first support structure (200).

[0175] The above description is merely an example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential quality of the present invention.

[0176] Accordingly, the embodiments disclosed in the present invention are intended to illustrate, rather than limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical concepts within the scope equivalent thereto should be interpreted as being included within the scope of the present invention.

Claims

1. Thermal module for heating and cooling the reaction vessel; A first support structure on which the above thermal module is mounted; A vertical guide part that guides the first support structure to move vertically; and A thermal cycler comprising a second support structure supporting the vertical guide portion and accommodating the first support structure.

2. In paragraph 1, A thermal cycler, wherein the first support structure includes a receiving space for receiving the thermal module.

3. In paragraph 2, A thermal cycler, wherein the first support structure comprises a first vertical side forming the receiving space, a second vertical side, and a connecting portion connecting the first vertical side and the second vertical side.

4. In paragraph 3, A thermal cycler, wherein at least one of the vertical guide portions is connected to at least one of the first vertical side and the second vertical side.

5. In paragraph 3, The above connecting portion includes a first connecting member connecting the inner side of the first vertical side and the second vertical side, A thermal cycler, wherein an actuator providing power to move the first support structure is coupled to the first connecting member.

6. In paragraph 5, A thermal cycler, wherein the connecting member comprises a first vertical side, a second vertical side, and a second connecting member connecting the first connecting member.

7. In paragraph 3, A thermal cycler, wherein the vertical guide section includes a linear motion rail and a linear motion block that is slidable relative to the linear motion rail.

8. In paragraph 7, A thermal cycler, wherein the linear motion rails are provided on both sides of the first vertical side and the second vertical side, and the linear motion blocks are provided for each of the linear motion rails on the inner side of the second support structure.

9. In paragraph 1, Further comprising an actuator used to move the first support structure, A thermal cycler in which the first support structure moves up and down within the second support structure as the actuator is operated manually or automatically.

10. In paragraph 9, The actuator is coupled to at least a portion of the first support structure and is positioned in an area adjacent to a side of the thermal module, A thermal cycler, wherein at least one of the vertical guide members is disposed spaced apart from the actuator.

11. In paragraph 1, A thermal cycler further comprising a manual handle used to move the first support structure.

12. In paragraph 11, A thermal cycler, wherein the manual handle is connected to an actuator coupled to at least a portion of the first support structure.

13. In paragraph 1, A heat lead provided on the second support structure to provide heat from the upper portion of the thermal module; and A thermal cycler further comprising a sensor positioned vertically apart from the heat lead by a first distance (d1).

14. In paragraph 13, The above sensor is a thermal cycler provided on the upper inner side of the second support structure.

15. In paragraph 13, It further includes a control unit that receives a signal detected by the above sensor, When the above thermal module moves and a predetermined signal is generated by the above sensor, A thermal cycler in which the movement of the thermal module is controlled by the control unit.

16. In paragraph 15, When the above thermal module moves upward and the above predetermined signal is generated by the above sensor, By the above control unit, the thermal module moves upward by a second distance (d2), A thermal cycler wherein the second distance (d2) is equal to or greater than the first distance (d1).

17. In paragraph 15, The above predetermined signal is a thermal cycler that is a signal generated when the uppermost part of an object mounted on the thermal module passes the sensor.

18. In paragraph 3, A thermal cycler, wherein each of the first vertical side and the second vertical side is provided with a support member on which the thermal module is mounted.

19. In paragraph 18, A thermal cycler, wherein an elastic member formed of an elastic material is provided between the thermal module and the support member.

20. In paragraph 19, A thermal cycler in which the elastic member has a pad shape formed of a silicone rubber sponge material.

21. Thermal module for heating and cooling the reaction vessel; A first support structure configured to allow the above thermal module to be detachably mounted; A thermal cycler wherein the thermal module is detachable through an open side of the first support structure.

22. In paragraph 21, The above open side is the upper side of the first support structure, A thermal cycler in which the thermal module is removed through an opening in which at least a portion of the upper side is open.

23. In paragraph 21, The above first support structure is provided with a support member that supports the thermal module, A thermal cycler, wherein the above thermal module is provided with a fixing member that is aligned with and fixed to the support member.

24. In paragraph 23, A thermal cycler in which the thermal module is secured to the first support structure simply by the support member being secured to the fixing member.

25. In paragraph 21, A thermal cycler, wherein the first support structure includes an opening for access to an external component connected to the thermal module.

26. In paragraph 23, A thermal cycler, wherein a pinhole is formed in the support member, and the fixing member is provided with an alignment pin at least partially inserted into the pinhole.

27. In paragraph 23, A thermal cycler in which an alignment pin is formed on the support member and a pinhole into which the alignment pin is inserted is formed on the fixing member.

28. In paragraph 23, The above support member is provided at least one on both sides of the first support structure, A thermal cycler in which the fixing member is hung on each of the above supporting members.

29. In paragraph 28, The above fixed part is a thermal cycler that is a part protruding outwardly from the thermal module.

30. In paragraph 28, A thermal cycler further comprising an elastic member disposed between the support member and the fixed member.

31. In paragraph 30, A thermal cycler in which the elastic member is formed of an elastic material and has a pad shape formed with a predetermined thickness.

32. In paragraph 30, A thermal cycler in which the elastic member has a pad shape formed of a silicone rubber sponge material.

33. In paragraph 30, A thermal cycler further comprising a fixing pin for fixing the support member, the fixing member, and the elastic member.

34. In paragraph 33, An alignment pin is formed in the above fixed part or the above support member, A thermal cycler, wherein the elastic member has a first hole formed therein into which the alignment pin is inserted, and a second hole formed therein into which the fixing pin is inserted.

35. In paragraph 33, A thermal cycler in which a fixing hole is formed in the above support member into which the fixing pin is inserted and fixed.

36. In paragraph 21, The first support structure includes a receiving space for receiving the thermal module, A thermal cycler, wherein the receiving space includes a first vertical side, a second vertical side, and a connecting portion connecting the first vertical side and the second vertical side.

37. In paragraph 36, Further comprising an actuator coupled to the above connecting portion, A thermal cycler in which the first support structure moves as the actuator is operated manually or automatically.

38. In paragraph 21, The thermal module includes a sample holder for accommodating the reaction vessel, a thermoelectric element used to heat or cool the sample holder, and a cooling fan and a heat sink for cooling the sample holder. A thermal cycler wherein the thermal module is detachable as a whole from the first support structure.

39. In paragraph 21, A thermal cycler having handles on both sides of the upper portion of the thermal module.

40. In paragraph 21, A thermal cycler further comprising a second support structure that supports the first support structure to move.

41. In paragraph 40, A thermal cycler wherein the first support structure and the second support structure are slidably connected.

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