Plasma automatic control line for PCB production

Abstract

Disclosed in the present invention is a plasma automatic control line for PCB production, comprising a loading production line, a PCB loading device, a carrier loading device, an automatic board frame and PCB transfer device, a double-station plasma cleaning and etching machine, a carrier unloading and buffering device, a PCB unloading device and an unloading production line. The PCB loading device vertically transfers PCBs supplied by the loading production line; the carrier loading device successively and vertically inserts the multiple supplied PCBs into board clamping frames of an empty carrier; the automatic board frame and PCB transfer device transfers to a Plasma station the carrier loaded with the multiple PCBs to undergo plasma cleaning and, after the cleaning, transfers same to an unloading and buffering station of the carrier unloading and buffering device, and transfers the unloaded empty carrier to a loading station. The present invention implements automatic plasma cleaning of PCBs during whole processes, eliminates desmear sections of electroless copper plating lines, simplifies production processes and procedures, effectively reduces production costs, and improves production efficiency.

Description

A plasma automatic control line for PCB production

TECHNICAL FIELD

[0001] The present application relates to PCB processing technology, and in particular to a plasma automatic control line for PCB production.

BACKGROUND

[0002] PCB circuit board is the most important component in the electronic industry, with the rapid development of electronic industry, HDI (High Density Interconnection) board, IC packaging substrate, rigid-flex board, embedded component board, photoelectric combination board, special substrate printed board, etc. represent the current development direction of printed circuit board (PCB). The development trend of electronic products requires printed circuit board to develop towards miniaturization, lightweight, high speed, high frequency and multifunctional direction.

[0003] Plasma technology is first applied to the semiconductor industry, and its application in PCB manufacturing process is relatively late. Plasma cleaning refers to the directional movement of highly activated plasma under the action of electric field, and the gas-solid chemical reaction of hole wall drilling dirt, and the generated gas products and part of the unreacted particles are discharged by the exhaust pump. With the development of PCB manufacturing process, the plasma equipment is also constantly improving, and the uniformity of plasma is a key parameter. If the PCB hole cleaning process is not uniform, the drilling dirt will be left, which will hinder the electrical connection of metallization. The new plasma equipment improves the uniformity performance, and can achieve good process quality repeatability in the same vacuum chamber and different batches. For different media and various drilling dirt generated by different lasers, how to realize efficient cleaning in blind hole is one of the research hotspots in the industry.

[0004] In the prior art, the general process flow of a PCB board includes: cutting -- drilling -- copper plating -- pattern transfer -- pattern plating -- etching -- solder resist -- character -- surface treatment -- profile milling -- final inspection -- packaging and delivery. Among them, the hole metallization process of the PCB board is a key link in production, which directly affects the electrical connection performance of electronic products. And the effect of drill cleaning directly affects the quality of the plating layer in the hole, and then determines the pass rate of the product. There are many methods for drill cleaning at present, which can be divided into wet and dry methods; wet treatment includes concentrated sulfuric acid, concentrated chromic acid, potassium permanganate and PI (polyimide) adjustment treatment, etc. The copper plating process is a key process in the wet process, and if the process parameters are not controlled well, many functional problems such as hole wall cavitation will occur. Among them, copper plating is the abbreviation of electroless plating copper. Before electroless plating copper, the drill holes on the multilayer PCB board are desmear treated to effectively ensure the subsequent copper plating process. However, with the development of technology, the existing multilayer PCB circuit board structure seeks high aspect ratio and smaller hole diameter, and the traditional desmear cleaning method (i.e. wet treatment) for drilling and holes is greatly limited, especially because the PCB board to be cleaned has different specifications, the PCB board is not easy to fix during the cleaning process, and the operation of sequentially and separately cleaning is very tedious and the cleaning efficiency is low.

[0005] Dry treatment is to remove drill dirt in the hole wall under vacuum environment through plasma, and to use plasma desmear, surface roughening / cleaning and activation of PCB plasma cleaning and etching equipment to physically impact and chemically react the surface of the PCB board, so that the surface material to be cleaned on the PCB board becomes particles and gaseous substances and is released, and then vacuum is extracted to achieve the purpose of surface treatment. Moreover, in the prior art, the materials of flexible printed circuit boards and rigid-flex boards swell in the wet treatment liquid, causing delamination of the multilayer board and environmental pollution and other problems, and the plasma treatment method is preferred when processing flexible multilayer boards and rigid-flex boards. Using plasma drill cleaning does not require the use of the entire wet process line, reducing the cost of chemical treatment and reducing water usage.

[0006] Therefore, how to effectively combine the PCB plasma cleaning and etching equipment with the existing PTH production line in the PCB board processing process, simplify or eliminate the desmear cleaning method in the existing electroless copper plating, effectively utilize the low operating cost of plasma cleaning (PLASMA), no drug and wastewater discharge in the production process, energy saving and environmental protection, and reduce production cost, change the existing PTH production line using manual up and down board process, further optimize production efficiency, is the technical problem that needs to be solved urgently in the current PCB PTH processing.

[0007] SUMMARY

[0008] The application provides a Plasma automatic control line for PCB production, which realizes processing of a large number of PCBs in the same batch through automatic control, and effectively improves production efficiency and reduces material transfer.

[0009] The application adopts the technical scheme that solves the technical problems:

[0010] A Plasma automatic control line for PCB production is used for automatic plasma cleaning of PCBs, and comprises:

[0011] A feeding production line is used for automatic feeding and conveying of PCBs to be processed.

[0012] A PCB feeding device vertically transfers the PCBs horizontally fed by the feeding production line to the next station one by one.

[0013] A carrier feeding device vertically inserts the multiple PCBs fed by the PCB feeding device into the clamping frame of the empty carrier one by one.

[0014] A board frame and PCB automatic transfer device transfers the carrier loaded with the multiple PCBs to the Plasma station for plasma cleaning, and transfers the PCBs and the carrier to the unloading station after cleaning, and transfers the double-station empty carrier to the unloading station to the unloading station of the carrier feeding device.

[0015] A double-station plasma cleaning and etching machine automatically feeds the multiple PCBs of the same batch transferred by the board frame and PCB automatic transfer device to one cavity or two cavities for simultaneous cleaning and deslagging, and automatically unloads the PCBs after cleaning and deslagging.

[0016] A carrier unloading and buffering device is provided with double stations, and pre-stores the PCBs on the clamping frame after cleaning and deslagging according to the processing progress, or vertically extracts the PCBs on the clamping frame and transfers them to the unloading station one by one.

[0017] A PCB unloading device vertically feeds the PCBs on the carrier unloading and buffering device to the next station one by one after turning them by 90°.

[0018] An unloading production line horizontally receives the cleaned PCBs vertically transferred by the PCB unloading device, and automatically unloads and outputs the PCBs.

[0019] Preferably, the PCB feeding device is provided with a double-station feeding port, and a hoisting horizontal transfer mechanism is arranged between the PCB feeding device and the feeding production line to adapt to the feeding direction of the PCBs horizontally placed on the feeding production line and the vertical direction of the hoisting.

[0020] Preferably, the PCB feeding device comprises a feeding support frame, a PCB positioning table, a multi-joint PCB feeding manipulator and two PCB carrier collecting boxes. The PCB positioning table is installed on the upper side of the feeding support frame, a visual camera for acquiring PCB position information is installed on the feeding support frame above the PCB positioning table, the multi-joint PCB feeding manipulator is fixedly installed on the middle part of the feeding support frame, and two PCB carrier collecting boxes are separately installed on the feeding support frame on both sides of the multi-joint PCB feeding manipulator. A vacuum suction gripper frame for vacuum suction is installed at the end of the multi-joint PCB feeding manipulator to suction and grasp each PCB to be processed conveyed by the feeding production line. The multi-joint PCB feeding manipulator deflects the PCB to be processed to a vertical state one by one through the vacuum suction gripper frame and feeds the PCB to the clamping station of the carrier feeding device. Meanwhile, the multi-joint PCB feeding manipulator places the empty PCB carriers supporting the PCBs on the feeding production line in the two PCB carrier collecting boxes through the vacuum suction gripper frame.

[0021] Preferably, the carrier feeding device comprises a mounting frame, two groups of parallel and double-station plug-in and pull-out clamping mechanisms, a double-station parallel clamping plate frame and a plate frame positioning seat for plug-in of the PCBs. The plate frame positioning seat is provided with a plurality of slide rails for supporting the clamping plate frame and front and rear sliding guiding input or output and a locking assembly for positioning and locking the clamping plate frame.

[0022] The two groups of plug-in and pull-out clamping mechanisms are installed on the top side of the mounting frame and feed and horizontally transfer to the vertical state PCBs transferred by the PCB feeding device and respectively plug in each station of the clamping plate frame after moving backward.

[0023] Each group of plug-in and pull-out clamping mechanisms comprises a plate moving drive motor, a linear slide assembly, an up-down lifting plug-in and pull-out assembly and a plurality of clamping assemblies. The plurality of clamping assemblies are uniformly installed at the bottom end of the up-down lifting plug-in and pull-out assembly. Each clamping assembly comprises a clamping cylinder and a gripper clamped to the end of the PCB by the clamping cylinder. The up-down lifting plug-in and pull-out assembly is installed on the crossbeam sliding left and right on the linear slide assembly. The plate moving drive motor drives the crossbeam and the up-down lifting plug-in and pull-out assembly to slide left and right along the slide rails on both sides of the linear slide assembly through a gear belt.

[0024] The up-and-down lifting and plugging assembly comprises a lifting motor and a worm and gear linear lifting frame, the lifting motor is installed on a cross beam of the linear sliding table assembly, a plurality of groups of the clip opening assemblies are uniformly installed at the bottom end of the worm and gear linear lifting frame, and the lifting motor drives the worm on the worm and gear linear lifting frame to rotate and drive the plurality of groups of clip opening assemblies to synchronously clamp the PCB board to be lowered and plugged into each limiting groove of the clamping plate frame.

[0025] Preferably, the plate frame and PCB board automatic transfer device comprises a linear guide rail mechanism and a plate frame transfer mechanism, the plate frame transfer mechanism is slidingly installed on the linear guide rail mechanism and is positioned and stopped at the carrier loading and unloading stations of the carrier loading device, the carrier loading and unloading stations of each cavity of the double-station plasma cleaning and etching machine and the carrier loading and unloading stations of the PCB board unloading device respectively.

[0026] The linear guide rail mechanism comprises a rail frame, two first linear guide rails separately arranged at the front and rear edges of the rail frame and a rail rack located in the middle of the rail frame, and the rail rack is arranged in parallel with the first linear guide rails at intervals.

[0027] The plate frame transfer mechanism comprises a moving frame and a first driving motor, the moving frame is slidingly installed on the first linear guide rail, and the first driving motor is installed on the moving frame and is provided with a gear engaged with the rail rack at the driving end, and the first driving motor drives the moving frame to slide linearly along the first linear guide rail in the transverse direction.

[0028] The moving frame is further provided with a second linear guide rail and a second motor, the second linear guide rail is provided with a positioning frame, the positioning frame is provided with a butt joint linear sliding rail, and the second motor drives the positioning frame to slide along the second linear guide rail to drive the butt joint linear sliding rail to butt joint with the loading station or the unloading station.

[0029] The positioning frame is further fixedly connected with a third linear guide rail and a third motor, the third linear guide rail is provided with a plate frame locking mechanism for locking the clamping plate frame, the third motor drives the plate frame locking mechanism connected through a ring gear belt to slide along the third linear guide rail in the positive direction, the pneumatic gripper of the plate frame locking mechanism approaches and locks the clamping plate frame, and the clamping plate frame is pulled to the positioning frame along the butt joint linear sliding rail through reverse sliding of the third motor; conversely, the idle clamping plate frame on the moving frame is sent to the carrier loading device.

[0030] Preferably, the plate and frame locking mechanism comprises a base, a guide seat and a push-pull cylinder are arranged on the base, the guide seat is provided with a F-shaped buckle member capable of sliding relative to each other, the movable end of the push-pull cylinder is connected with a driving plate member capable of linearly transversely moving along a sliding groove, and the end of the F-shaped buckle member is matched with an obliquely arranged driving sliding groove on the driving plate member through a pin shaft; the push-pull cylinder drives the F-shaped buckle member to slide forward and backward through the driving plate member, and controls the F-shaped buckle head at the front end of the F-shaped buckle member to lock or release the locking of the clamping plate frame through the obliquely arranged driving sliding groove.

[0031] Preferably, the carrier blanking and buffering device comprises a base frame, two groups of extraction and clamping mechanisms arranged in parallel and in double stations, and a plate frame feeding seat for buffering and directly feeding the clamping plate frame, wherein the plate frame feeding seat is provided with a plurality of sliding rails for supporting the clamping plate frame and guiding the forward and backward sliding input or output, and a locking assembly for positioning and locking the clamping plate frame.

[0032] The two groups of extraction and clamping mechanisms are installed on the top side of the base frame and are used to support the vertically arranged PCB board to which the clamping plate frame is transferred, and are used to extract the PCB board from each station of the clamping plate frame and then transversely move to the PCB board blanking device after clamping.

[0033] Each group of the extraction and clamping mechanisms comprises a plate moving driving motor, a linear sliding table assembly, an up-down lifting and plugging assembly, and a plurality of clamping assemblies, and the plurality of clamping assemblies are uniformly installed at the bottom end of the up-down lifting and plugging assembly, each clamping assembly comprises a clamping cylinder and a clamping hand driven to open and close by the clamping cylinder to clamp the end of the PCB board, the up-down lifting and plugging assembly is installed on a cross beam that slides left and right on the linear sliding table assembly, and the plate moving driving motor drives the cross beam and the up-down lifting and plugging assembly to slide left and right along the sliding rails on both sides of the linear sliding table assembly through a gear belt.

[0034] The up-down lifting and plugging assembly comprises a lifting motor and a worm gear linear lifting frame, the lifting motor is installed on the cross beam on the linear sliding table assembly, and a plurality of clamping assemblies are uniformly installed at the bottom end of the worm gear linear lifting frame, the lifting motor drives the worm gear on the worm gear linear lifting frame to rotate, and a plurality of clamping assemblies are driven by the lifting frame at the lower end to synchronously clamp the PCB board in each limiting groove of the clamping plate frame and move upward for extraction.

[0035] Preferably, the PCB board unloading device includes an unloading support frame, a PCB board positioning stage, a multi-joint unloading robot, an unloading slide rail carrying line, and two carrying board collection boxes. The PCB board positioning stage is installed on the top side of the support frame. A vision camera for acquiring PCB board position information is installed on the unloading support frame above the PCB board positioning stage. The multi-joint unloading robot is fixedly installed in the middle of the top side of the unloading support frame. The multi-joint unloading robot on the upper side of the unloading slide rail carrying line is installed in the middle of the unloading support frame to receive the PCB board when it is deflected 90° to a horizontal position by the multi-joint unloading robot. The two carrier plate collection boxes are respectively installed on the unloading support frame on both sides of the unloading slide rail carrier plate line. The end of the multi-joint unloading robot is equipped with a vacuum adsorption gripper for vacuum adsorption to grasp the PCB boards transferred from the carrier unloading and buffer device. The multi-joint unloading robot uses the vacuum adsorption gripper to deflect the cleaned PCB boards one by one from the vertical state to the horizontal state, and send them to the unloading slide rail carrier plate line and directly exported by the unloading production line. At the same time, the multi-joint unloading robot uses the vacuum adsorption gripper to adsorb and grasp the empty carrier plates supporting the PCB boards on the clamping frame and place them in the carrier plate collection boxes on both sides.

[0036] Preferably, the PCB board unloading device is further provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

[0037] Preferably, the PCB board loading device is further provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

[0038] The beneficial effects of the above technical solution are:

[0039] Compared to existing PCB manufacturing processes, which require manual handling of incoming boards from the previous process at the plasma cleaning stage, manual insertion of boards into racks during plasma cleaning, manual pushing of racks into the plasma cleaning stage, manual pulling out of racks during plasma cleaning, manual unloading of boards during plasma cleaning, manual trolley handling, and manual placement of boards during chemical copper plating (PTH) of PCBs.

[0040] Dual-station plasma cleaning and etching machine

[0041] The application improves the processing technology, and through the PCB plate feeding device, carrier feeding device, plate frame and PCB plate automatic transfer device, carrier unloading and buffering device and PCB plate unloading device, the automatic PCB plate processing equipment realizes the automatic feeding and discharging of the plate, cleaning conveying line through the carrier feeding and discharging station, carrier and plate body transfer station and clamping plate frame exchange station, realizes the full automation of the plasma cleaning process, the PCB plate processing can completely cancel the desmear section of the plated through hole (PTH) line, simplifies the production process and flow, effectively reduces the PCB plate material transfer, greatly reduces the equipment cost of traditional desmear (Desmear) and plated through hole (PTH) line, realizes zero discharge of desmear wastewater and zero consumption of water before chemical copper deposition, reduces environmental pollution, effectively reduces production cost and improves production efficiency.

[0042] The traditional PCB plate processing is simplified to plasma cleaning (Plasma), desmear (Desmear) and plated through hole (PTH) process, realizing zero discharge of desmear wastewater and zero consumption of water before plated through hole (PTH) process, canceling the consumption of various chemicals and gases in the desmear (Desmear) process, effectively reducing labor and production cost, and realizing automatic optimization of the production line.

DRAWINGS

[0043] Fig. 1 is a schematic diagram of the front view structure of the application;

[0044] Fig. 2 is a schematic diagram of the left side view structure of the application;

[0045] Fig. 3 is a schematic diagram of the right side view structure of the application;

[0046] Fig. 4 is a schematic diagram of the front view structure of the application after removing the plasma cleaning equipment;

[0047] Fig. 5 is a schematic diagram of the side view structure of the application after removing the plasma cleaning equipment and part of the shell;

[0048] Fig. 6 is a schematic diagram of the front view structure of the application after removing the plasma cleaning equipment and part of the shell;

[0049] Fig. 7 is a schematic diagram of the left side view structure of the application after removing the plasma cleaning equipment and part of the shell;

[0050] Fig. 8 is a schematic diagram of the explosion structure of the application after removing the plasma cleaning equipment and part of the shell;

[0051] Fig. 9 is a schematic diagram of part of the explosion structure of the plate frame and PCB plate automatic transfer device of the application;

[0052] Figure 10 is a three-dimensional enlarged structural diagram of the PCB board loading device of the present invention after removing the outer shell and part of the frame;

[0053] Figure 11 is a three-dimensional enlarged structural diagram of the carrier loading device after removing the outer shell and part of the frame in this invention;

[0054] Figure 12 is a three-dimensional enlarged structural schematic diagram of the plate and frame transfer mechanism in this invention;

[0055] Figure 13 is a three-dimensional enlarged structural schematic diagram of the plate and frame locking mechanism in this invention;

[0056] Figure 14 is a three-dimensional enlarged structural diagram of the carrier unloading and buffer device after removing the outer shell and part of the frame in this invention.

[0057] Figure 15 is a three-dimensional enlarged structural diagram of the PCB board unloading device after removing the outer shell in this invention.

Detailed Implementation Methods

[0058] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. The terms "comprising" and similar terms used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0059] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0060] The application discloses a plasma automatic control line for PCB production, which is used for automatic plasma cleaning and etching of PCBs and comprises a feeding production line 1, a PCB feeding device 2, a carrier feeding device 3, a board frame and PCB automatic transfer device 4, a double-station plasma cleaning and etching machine 5, a carrier unloading and buffering device 6, a PCB unloading device 7 and an unloading production line 8.

[0061] As shown in FIGS. 1-3, the PCB feeding device 2 is provided with double-station feeding ports, and a hoisting transverse moving mechanism 9 is further arranged between the PCB feeding device 2 and the feeding production line 1 and is adapted to enter from two different feeding channels along the longitudinal direction after hoisting the PCBs horizontally placed on the feeding production line 1 in the opposite feeding direction, so that the PCBs on the feeding production line 1 are respectively input from the two feeding ports of the PCB feeding device 2 through the hoisting transverse moving mechanism 9, and the feeding efficiency is effectively improved.

[0062] As shown in FIGS. 4-8 and 10, the PCB feeding device 2 includes a feeding support frame 20, a PCB positioning table (not shown), a multi-joint PCB feeding robot 21, and two PCB carrier collecting boxes 22. The PCB positioning table is installed on the upper side of the feeding support frame 20. A vision camera 23 for obtaining PCB position information is installed on the feeding support frame 20 above the PCB positioning table. The multi-joint PCB feeding robot 21 is fixedly installed on the middle part of the feeding support frame 20. The two PCB carrier collecting boxes 22 are separately installed on the feeding support frame 20 on both sides of the multi-joint PCB feeding robot 21. The multi-joint PCB feeding robot 21 is provided with a vacuum suction gripper frame at the end thereof for vacuum suction of each PCB to be processed conveyed from the feeding production line 1. The multi-joint PCB feeding robot 21 feeds the PCB to be processed to the clamping station of the carrier feeding device 3 in a vertical state one by one through the vacuum suction gripper frame. Meanwhile, the multi-joint PCB feeding robot 21 places the empty PCB carriers supporting the PCBs on the feeding production line 1 in the two PCB carrier collecting boxes 22 respectively through the vacuum suction gripper frame. Furthermore, a manual feeding port 24 for manual feeding of unqualified or defective products and PCBs to be processed is arranged on the PCB feeding device 2, so as to realize switching of multiple working modes and effectively improve the production efficiency.

[0063] As shown in FIGS. 4-8 and 11, the carrier feeding device 3 includes a mounting frame 30, two sets of parallel and double-station plug-in and pull-out clamping mechanisms 31, double-station parallel clamping plate frames 32 for plug-in of PCBs, and plate frame positioning seats 33. The plate frame positioning seats 33 are provided with a plurality of slide rails 330 for supporting the clamping plate frames 32 and forward and backward sliding guiding input or output, and locking assemblies 331 for positioning and locking the clamping plate frames 32. The two sets of plug-in and pull-out clamping mechanisms 31 are installed on the top side of the mounting frame and are fed to move horizontally, so as to clamp the PCBs in the vertical state transferred from the PCB feeding device 2 and move backward to be respectively inserted into each station of the clamping plate frames 32.

[0064] As shown in FIG. 11, each set of plug-in and pull-out clamping mechanism 31 includes a plate moving drive motor 310, a linear slide assembly 311, an up-and-down lifting plug-in and pull-out assembly 312, and a plurality of sets of clamping assembly 313, which are evenly installed at the bottom end of the up-and-down lifting plug-in and pull-out assembly 312. Each set of clamping assembly 313 includes a clamping cylinder 3130 and a clamping hand 3131 driven to open and close by the clamping cylinder 3130 to clamp the end of the PCB board. The up-and-down lifting plug-in and pull-out assembly 312 is installed on a cross beam 314 that slides left and right on the linear slide assembly 311. The plate moving drive motor 310 drives the cross beam 314 and the up-and-down lifting plug-in and pull-out assembly 312 to slide left and right along the slide rails on both sides of the linear slide assembly 311 through a gear belt. The up-and-down lifting plug-in and pull-out assembly 312 includes a lifting motor 3120 and a worm gear linear lifting frame 3121. The lifting motor 3120 is installed on the cross beam 314 of the linear slide assembly 311. A plurality of sets of clamping assembly 313 are evenly installed at the bottom end of the worm gear linear lifting frame 3121. The lifting motor 3120 drives the worm gear linear lifting frame 3121 to rotate and drives the plurality of sets of clamping assembly 313 to synchronously clamp the PCB board and move it down to be inserted into each limiting groove of the clamping plate frame 32.

[0065] As shown in FIGS. 4-8 and 12, the plate frame and PCB board automatic transfer device 4 includes a linear guide rail mechanism 40 and a plate frame transfer mechanism 41. The plate frame transfer mechanism 41 is slidingly installed on the linear guide rail mechanism 40 and is positioned and stopped at the carrier loading and unloading station of the carrier loading device 3, the carrier loading and unloading station of each cavity of the double-station plasma cleaning and etching machine 5, and the carrier loading and unloading station of the PCB board unloading device 7, respectively. The linear guide rail mechanism 40 includes a rail frame 400, two first linear guide rails 401 arranged on the front and rear edges of the rail frame 400, and a rail rack 402 arranged in the middle of the rail frame 400. The rail rack 402 is parallel and spaced apart from the first linear guide rails 401. The plate frame transfer mechanism 41 includes a moving frame 410 and a first drive motor 411. The moving frame 410 is slidingly installed on the first linear guide rails 401. The first drive motor 411 is installed on the moving frame 410 and has a gear on the driving end that engages with the rail rack 402. The first drive motor 411 drives the moving frame 410 to slide linearly along the first linear guide rails 401. The moving frame 410 is further provided with a second linear guide rail 412 and a second motor 413. The second linear guide rail 412 is provided with a positioning frame 414. The positioning frame 4120 is provided with a butt joint linear slide rail 4140. The second motor 413 drives the positioning frame 414 to slide along the second linear guide rail 412 to drive the butt joint linear slide rail 4140 to butt joint with the loading station or the unloading station.

[0066] As shown in FIG. 12, the third linear guide rail 415 and the third motor 416 are also fixed on the alignment frame 414. The third linear guide rail 415 is provided with a plate frame locking mechanism 417 for locking the clamping plate frame 32. The third motor 416 drives the plate frame locking mechanism 417 through a ring gear belt to slide along the third linear guide rail 415 in the positive direction. The pneumatic gripper of the plate frame locking mechanism 417 approaches and locks the clamping plate frame 32. The third motor 416 is reversed to slide and pull the clamping plate frame 32 along the butt linear slide rail 4140 to the alignment frame 414. Conversely, the empty clamping plate frame 32 on the moving frame 410 is sent to the carrier feeding device 3.

[0067] As shown in FIG. 13, the plate frame locking mechanism 417 includes a base 4170. The base 4170 is provided with a guide seat 4171 and a push-pull cylinder 4172. The guide seat 4171 is provided with a F-shaped buckle 4173 that can slide relatively. The movable end of the push-pull cylinder 4172 is connected with a driving plate 4174 that linearly moves along the sliding groove of the guide seat 4171. The end of the F-shaped buckle 4173 is connected with the obliquely arranged driving sliding groove 41740 of the driving plate 4174 through a pin shaft. The push-pull cylinder 4172 drives the F-shaped buckle 4173 to slide forward and backward through the driving plate 4174, and controls the F-shaped buckle head at the front end of the F-shaped buckle 4173 to lock or release the clamping plate frame 32 through the obliquely arranged driving sliding groove 41740.

[0068] As shown in FIG. 4 to FIG. 8, FIG. 14, the carrier blanking and buffering device 6 is similar in structure to the carrier feeding device 3, except that one is used for blanking the clamping plate frame 32, and one is used for feeding and buffering the clamping plate frame 32, that is, the carrier blanking and buffering device 6 is additionally provided with a work station for buffering the clamping plate frame 32 to be processed; the carrier blanking and buffering device 6 comprises a base frame 60, two sets of extraction and clamping mechanisms 61 arranged side by side and in double-station mode, and a plate frame feeding seat 62 for buffering and directly feeding the clamping plate frame 32; the plate frame feeding seat 62 is provided with a plurality of slide rails 63 for supporting the clamping plate frame 32 and slidingly guiding the input or output of the clamping plate frame 32, and a locking assembly 64 for positioning and locking the clamping plate frame 32; the two sets of extraction and clamping mechanisms 61 are installed on the top side of the base frame 60 and are used for feeding and transversely moving the vertical PCB board to be clamped to the clamping plate frame 32, and after clamping, extracting from each station of the clamping plate frame 32 and transversely moving to the PCB board blanking device 7; each set of extraction and clamping mechanism 61 is similar in structure to the plug-in and clamping mechanism 31 used for feeding in FIG. 11, and will not be described in detail here; each set of extraction and clamping mechanism 61 comprises a plate moving drive motor, a linear slide assembly, an up-down lifting and plugging assembly 610, and a plurality of clamping assemblies; the plurality of clamping assemblies are evenly installed at the bottom end of the up-down lifting and plugging assembly; each clamping assembly comprises a clamping cylinder and a clamping hand driven by the clamping cylinder to clamp the end of the PCB board; the plate moving drive motor drives the crossbeam and the up-down lifting and plugging assembly to slide left and right along the slide rails on both sides of the linear slide assembly through a gear belt.

[0069] As shown in FIG. 14, each up-down lifting and plugging assembly 610 is similar in structure to the up-down lifting and plugging assembly 312 used for feeding in FIG. 11, and will not be described in detail here; the up-down lifting and plugging assembly 610 comprises a lifting motor and a worm gear linear lifting frame; the lifting motor is installed on the crossbeam of the linear slide assembly; a plurality of clamping assemblies are evenly installed at the bottom end of the worm gear linear lifting frame; the lifting motor drives the worm to rotate on the worm gear linear lifting frame, and drives the plurality of clamping assemblies through the lifting frame at the lower end to synchronously clamp the PCB board in each limiting groove of the clamping plate frame 32 and lift up for extraction.

[0070] As shown in FIGS. 4-8 and 15, the PCB unloading device 7 includes an unloading support frame 70, a PCB positioning table (not shown), a multi-joint PCB unloading robot 71, an unloading slide rail carrier line 72, and two carrier collection boxes 73. The PCB positioning table is installed on the top side of the support frame. A visual camera (not shown) for obtaining PCB position information is installed on the unloading support frame 70 above the PCB positioning table. The multi-joint PCB unloading robot 71 is fixedly installed on the top side of the middle part of the unloading support frame 70. The unloading slide rail carrier line 72 corresponding to the multi-joint PCB unloading robot 71 on the upper side is installed on the top side of the middle part of the unloading support frame 70 and is used to receive the PCBs deflected by 90° to a horizontal state by the multi-joint PCB unloading robot 71. The two carrier collection boxes 73 are separately installed on the unloading support frame 70 on both sides of the unloading slide rail carrier line 72. The end of the multi-joint PCB unloading robot 71 is provided with a vacuum suction gripper frame for unloading and buffering the PCBs transferred by the vacuum suction gripper frame of the unloading and buffering device 6. The multi-joint PCB unloading robot 71 deflects the cleaned PCBs one by one from a vertical state to a horizontal state by the vacuum suction gripper frame, feeds them to the unloading slide rail carrier line 72, and directly guides them out of the unloading production line 8. At the same time, the multi-joint PCB unloading robot 71 absorbs and grabs the empty carriers on the clamping plate frame 32 carrying the PCBs and places them in the carrier collection boxes 73 on both sides, respectively. Furthermore, the PCB unloading device 7 is also provided with a manual feeding port 74 for manual feeding of unqualified or defective products and PCBs to be processed. The corresponding carrier collection box 22 on the lower side is provided with a return slide rail carrier line 75 for feeding of unqualified or defective products and PCBs to be processed.

[0071] In this embodiment, the plasma cleaning and etching equipment adopts two working cavities, which can effectively ensure synchronous processing of multiple PCBs in the same batch, prevent material mixing, and improve material conveying efficiency. In addition, the plate frame and PCB automatic transfer device effectively cooperate with the carrier feeding device, the carrier unloading and buffering device, effectively control the feeding and transfer of the clamping plate frame, and effectively ensure the smooth transfer of the PCBs. The full-automatic plasma cleaning of the PCBs can completely cancel the Desmear section of the PTH line, simplify the production process and flow, effectively reduce the PCB material transfer, greatly reduce the equipment cost of the traditional Desmear and PTH line, realize zero discharge and zero water consumption of Desmear wastewater before chemical copper deposition, reduce environmental pollution, and effectively reduce production cost and improve production efficiency.

[0072] The above-described embodiments are only the preferred embodiments of the present application, and do not limit the scope of the present application. Any equivalent changes made in shape, structure, and principle according to the present application should be covered within the protection scope of the present application.

Claims

1. A Plasma automatic control line for PCB board production for the automatic plasma cleaning of PCB boards, characterized by, The application relates to a PCB plate feeding and discharging system. The application comprises: A feeding production line for automatically feeding and conveying the PCB plates to be processed; A PCB plate feeding device which vertically transfers the PCB plates horizontally fed by the feeding production line to the next work station one by one; A carrier feeding device which vertically inserts the multiple PCB plates fed by the PCB plate feeding device into the clamping frame of the empty carrier; A plate frame and PCB plate automatic transfer device which transfers the carrier loaded with the multiple PCB plates to the plasma etching station for plasma cleaning, and then transfers the cleaned PCB plates and the carrier to the discharging station, and then transfers the double-station empty carrier to the feeding station of the carrier feeding device; A double-station plasma etching machine which automatically feeds the multiple PCB plates transferred by the plate frame and PCB plate automatic transfer device into one cavity or two cavities for synchronous cleaning and deslagging, and then automatically discharges the cleaned PCB plates; A carrier discharging and buffering device which is provided with double stations, and which pre-stores the PCB plates on the clamping frame according to the processing progress, or vertically extracts the PCB plates on the clamping frame and then transfers the PCB plates to the discharging station one by one; A PCB plate discharging device which vertically feeds the PCB plates to the next work station one by one after the PCB plates are turned over by 90 degrees by the carrier discharging and buffering device; 2. The Plasma automatic control line for PCB production according to claim 1, characterized in that: A discharging production line which horizontally receives the cleaned PCB plates vertically fed by the PCB plate discharging device and then automatically discharges and outputs the cleaned PCB plates.

3. The Plasma automatic control line for PCB production according to claim 2, characterized in that: The PCB plate feeding device is provided with double-station feeding ports, and a hoisting transverse moving mechanism is arranged between the PCB plate feeding device and the feeding production line for hoisting the horizontally placed PCB plates on the feeding production line along the relative feeding direction and then moving the hoisted PCB plates along the longitudinal direction. The PCB plate feeding device comprises a feeding support frame, a PCB plate positioning table, a multi-joint plate feeding manipulator and two plate carrier collecting boxes, the PCB plate positioning table is installed on the upper side of the feeding support frame, a visual camera for acquiring the position information of the PCB plates is installed on the feeding support frame above the PCB plate positioning table, the multi-joint plate feeding manipulator is fixedly installed on the middle part of the feeding support frame, two plate carrier collecting boxes are separately installed on the feeding support frame on the two sides of the multi-joint plate feeding manipulator, a vacuum suction gripper frame for vacuum suction is installed at the tail end of the multi-joint plate feeding manipulator, the multi-joint plate feeding manipulator deflects the PCB plates to be processed one by one to the vertical state through the vacuum suction gripper frame and then feeds the PCB plates to the clamping station of the carrier feeding device, and the multi-joint plate feeding manipulator places the empty plate carriers carrying the PCB plates on the feeding production line into the two plate carrier collecting boxes through the vacuum suction gripper frame.

4. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The carrier feeding device comprises a mounting frame, two sets of parallel and double-station plug-in and pull-out clamping mechanisms, double-station parallel clamping plate frames and plate frame positioning seats, the plate frame positioning seats are provided with a plurality of slide rails for supporting the clamping plate frames and front and rear sliding guide input or output and locking assemblies for positioning and locking the clamping plate frames; The two sets of plug-in and pull-out clamping mechanisms are mounted on the top side of the mounting frame and are used for clamping the PCB boards in the vertical state transferred by the PCB board feeding device and respectively inserted into each station of the clamping plate frame after feeding and transverse movement; Each set of plug-in and pull-out clamping mechanisms comprises a plate moving drive motor, a linear slide assembly, an up-down lifting plug-in and pull-out assembly and a plurality of clamping assemblies, the plurality of clamping assemblies are uniformly mounted on the bottom end of the up-down lifting plug-in and pull-out assembly, each clamping assembly comprises a clamping cylinder and a clamping hand driven to open and close by the clamping cylinder to clamp the end of the PCB board, the up-down lifting plug-in and pull-out assembly is mounted on the cross beam of the linear slide assembly and slides left and right, the plate moving drive motor drives the cross beam and the up-down lifting plug-in and pull-out assembly to slide left and right along the slide rails on both sides of the linear slide assembly through a gear belt; The up-down lifting plug-in and pull-out assembly comprises a lifting motor and a worm gear linear lifting frame, the lifting motor is mounted on the cross beam of the linear slide assembly, a plurality of clamping assemblies are uniformly mounted on the bottom end of the worm gear linear lifting frame, the lifting motor drives the worm gear linear lifting frame to rotate and drives the plurality of clamping assemblies to synchronously clamp the PCB board to be inserted into each limiting groove of the clamping plate frame through the lifting frame at the lower end.

5. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The plate frame and PCB board automatic transfer device comprises a linear guide rail mechanism and a plate frame transfer mechanism, the plate frame transfer mechanism is slidingly mounted on the linear guide rail mechanism and is positioned and stopped at the carrier feeding and discharging stations of the carrier feeding device, the carrier feeding and discharging stations of each cavity of the double-station plasma cleaning and etching machine and the carrier feeding and discharging stations of the PCB board discharging device; The linear guide rail mechanism comprises a rail frame, two first linear guide rails separately arranged on the front and rear edges of the rail frame and a rail rack located in the middle of the rail frame, the rail rack is parallel and spaced apart from the first linear guide rails; The plate frame transfer mechanism comprises a moving frame and a first drive motor, the moving frame is slidingly mounted on the first linear guide rail, the first drive motor is mounted on the moving frame and is provided with a gear engaged with the rail rack at the driving end, the first drive motor drives the moving frame to slide horizontally and linearly along the first linear guide rail; The moving frame is further provided with a second linear guide rail and a second motor, the second linear guide rail is provided with a positioning frame, the positioning frame is provided with a butt joint linear slide rail, the second motor drives the positioning frame to slide along the second linear guide rail to drive the butt joint linear slide rail to butt joint with the feeding station or the discharging station. The third linear guide rail is provided with a plate frame locking mechanism for locking the clamping plate frame, and the third motor drives the plate frame locking mechanism to slide along the third linear guide rail in a positive direction through a ring gear belt drive connection. The plate frame locking mechanism is provided with a pneumatic gripper that approaches and locks the clamping plate frame, and the third motor is reversed to slide the clamping plate frame along the butt joint linear slide rail to the butt joint frame.

6. The Plasma automatic control line for PCB board production according to claim 5, characterized in that: The plate frame locking mechanism comprises a base provided with a guide seat and a push-pull cylinder, the guide seat is provided with a F-shaped buckle member capable of sliding relative to each other, the movable end of the push-pull cylinder is connected with a driving plate member linearly transversely moving along a sliding groove, and the F-shaped buckle member is connected with a driving sliding groove obliquely arranged on the driving plate member through a pin shaft.

7. The Plasma automatic control line for PCB production according to claim 1, characterized in that: The carrier unloading and buffering device comprises a base frame, two groups of extraction opening clamping mechanisms arranged in parallel and in double stations, and a plate frame feeding seat for buffering and directly feeding the clamping plate frame. The two groups of extraction opening clamping mechanisms are installed on the top side of the base frame and are used to support the vertically arranged PCB board transferred by the clamping plate frame, and are used to extract the PCB board from each station of the clamping plate frame and then transversely move to the PCB board unloading device after clamping. Each group of extraction opening clamping mechanisms comprises a plate moving driving motor, a linear sliding table assembly, an up-down lifting and plugging assembly, and a plurality of opening clamping assemblies, and the plurality of opening clamping assemblies are evenly installed at the bottom end of the up-down lifting and plugging assembly. Each opening clamping assembly comprises an opening clamping cylinder and a clamping hand driven by the opening clamping cylinder to clamp the end of the PCB board, the up-down lifting and plugging assembly is installed on the cross beam that slides left and right on the linear sliding table assembly, and the plate moving driving motor drives the cross beam and the up-down lifting and plugging assembly to slide left and right along the rails on both sides of the linear sliding table assembly through a gear belt. The up-down lifting and plugging assembly comprises a lifting motor and a worm gear linear lifting frame, the lifting motor is installed on the cross beam on the linear sliding table assembly, and a plurality of opening clamping assemblies are evenly installed at the bottom end of the worm gear linear lifting frame, the lifting motor drives the worm gear on the worm gear linear lifting frame to rotate, and the lifting frame at the lower end drives a plurality of opening clamping assemblies to synchronously clamp the PCB board in each limiting groove of the clamping plate frame and move upward for extraction.

8. The Plasma automatic control line for PCB board production according to claim 7, characterized in that: The PCB blanking device comprises a blanking support frame, a PCB positioning table, a multi-joint plate blanking manipulator, a blanking slide rail carrier plate line and two carrier plate collecting boxes, the PCB positioning table is installed on the top side of the support frame, a visual camera for acquiring PCB position information is installed on the blanking support frame above the PCB positioning table, the multi-joint plate blanking manipulator is fixedly installed on the top side of the middle part of the blanking support frame, the blanking slide rail carrier plate line corresponding to the multi-joint plate blanking manipulator on the upper side is installed on the middle part of the blanking support frame and is used for supporting the PCB plate deflected by 90° to be in a horizontal state, two carrier plate collecting boxes are separately installed on the blanking support frame on both sides of the blanking slide rail carrier plate line, a vacuum suction gripper frame for vacuum suction is installed at the end of the multi-joint plate blanking manipulator and is used for vacuum suction and gripping the PCB plate transferred by the carrier blanking and buffering device, the multi-joint plate blanking manipulator deflects the cleaned PCB plate from a vertical state to a horizontal state one by one through the vacuum suction gripper frame, sends the cleaned PCB plate to the blanking slide rail carrier plate line and directly leads out the cleaned PCB plate from the blanking production line, meanwhile, the multi-joint plate blanking manipulator absorbs and grips the empty carrier plate supporting and carrying the PCB plate on the clamping plate frame through the vacuum suction gripper frame and respectively places the empty carrier plate in the carrier plate collecting boxes on both sides.

9. The Plasma automatic control line for PCB board production according to claim 1, characterized in that: The PCB blanking device is further provided with a manual feeding port for manual feeding of unqualified or defective PCBs and PCBs to be processed.

10. The Plasma automatic control line for PCB board production according to claim 1, characterized in that: The PCB blanking device is further provided with a manual feeding port for manual feeding of unqualified or defective PCBs and PCBs to be processed. The PCB blanking device is further provided with a manual feeding port for manual feeding of unqualified or defective PCBs and PCBs to be processed.

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