Power converter

Abstract

Provided in the embodiments of the present application is a power converter, relating to the technical field of heat dissipation devices, and is used for ameliorating the problem of low heat dissipation efficiency of a radiator. The power converter comprises at least one radiator having a multi-layer flow channel, and a power component. The radiator comprises a cover body, a jet plate, and a bottom plate, which are stacked. The power component is arranged on a side of the bottom plate facing away from the cover body. The cover body is internally provided with a first liquid distribution cavity. A second liquid distribution cavity is formed between the jet plate and the cover body. A heat dissipation cavity is formed between the bottom plate and the jet plate. A side of the cover body close to the jet plate has a liquid distribution hole, and the first liquid distribution cavity communicates with the second liquid distribution cavity by means of the liquid distribution hole. A portion of the jet plate located inside of the second liquid distribution cavity is provided with a plurality of jet holes. The second liquid distribution cavity communicates with the heat dissipation cavity by means of the jet holes. The orthogonal projection of the liquid distribution hole on the surface of the jet plate facing away from the bottom plate falls outside of the jet holes. The power converter is used for improving heat dissipation efficiency.

Description

A power converter

[0001] The present application claims priority to the Chinese Patent Application No. 202410969997.5, filed on July 18, 2024, and entitled "A power converter", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat dissipation devices, in particular to a power converter. BACKGROUND

[0003] In order to reduce global carbon emissions, new energy vehicles powered by electric motors have developed rapidly in recent years. The vehicle-mounted power converter is the core device for direct current to alternating current conversion of electric vehicles. The chip power consumption of the power device of the vehicle-mounted power converter evolves rapidly, and the chip heat flux density of the future power device can reach 1000W / cm 2 . Therefore, the heat dissipation performance of the heat dissipation structure is required to be higher and higher.

[0004] The heat sink currently used by the power converter has low heat dissipation efficiency under the conditions of limited chip heat dissipation space and high heat flux density chips. SUMMARY

[0005] The purpose of the present application is to provide a power converter for improving heat dissipation efficiency.

[0006] The present application provides a power converter with a multi-layer flow channel heat dissipation structure, comprising at least one multi-layer flow channel heat sink and a power device. The heat sink comprises a cover, a jet plate and a bottom plate arranged in layers. The power device is arranged on the side of the bottom plate away from the cover. The cover has a first distribution cavity. The second distribution cavity is formed between the jet plate and the cover. The heat dissipation cavity is formed between the bottom plate and the jet plate. The side of the cover close to the jet plate is provided with a distribution hole, and the first distribution cavity is communicated with the second distribution cavity through the distribution hole. The part of the jet plate located in the second distribution cavity is provided with a plurality of jet holes. The second distribution cavity is communicated with the heat dissipation cavity through the jet holes. The vertical projection of the distribution hole on the surface of the jet plate away from the bottom plate falls outside the jet hole.

[0007] In some related technologies, the heat sink mainly uses horizontal flow of cooling medium for heat exchange, that is, the flow direction of the cooling medium is parallel to the surface of the heat sink substrate. This form of heat exchange can achieve a relatively high local convective heat transfer coefficient, but under the conditions of limited power device chip heat dissipation space and high heat flux density chips, the heat source is concentrated, the water temperature rises quickly, and the overall heat dissipation efficiency is low.

[0008] In the present application, the heat generated by the power device during operation can be transferred to the bottom plate. By injecting the cooling medium into the first distribution cavity of the cover, the cooling medium flows into the second distribution cavity through the distribution hole. Then, through the multiple jet flow holes opened on the jet flow plate, multiple impact jets enter the heat dissipation cavity and impact the bottom plate, carrying away the heat on the bottom plate, thereby dissipating heat from the bottom plate and the power device. The first distribution cavity, the second distribution cavity, and the heat dissipation cavity are respectively the upper, middle, and lower three layers of cavities, and the above-mentioned three layers of cavities are sequentially stacked to form a multi-layer flow channel heat dissipation structure, realizing vertical jet flow of the cooling medium to impact the heat source area of the bottom plate for heat dissipation. Compared with horizontal flow heat exchange of the cooling medium, the cooling medium needs to absorb heat along the entire heat dissipation cavity. As the cooling medium flows, the temperature of the cooling medium gradually rises, resulting in poor uniformity of the areas where the cooling medium flows first and the areas where the cooling medium flows later. The way of multiple cooling medium vertical jet flow impacting the heat source area of the bottom plate, the cooling medium fluid directly impacts the heat source area of the power device that needs to be cooled, carrying away the heat. Thus, it can quickly dissipate heat from the area with high heat flux density, and the uniformity of different areas is good. Especially under the condition of high heat flux density of the element to be cooled and limited heat dissipation space, it can effectively reduce the thermal resistance, improve the uniformity of the power device, and improve the heat dissipation efficiency.

[0009] Moreover, the vertical projection of the distribution hole on the surface of the jet flow plate away from the bottom plate falls outside the jet flow hole. That is, after the cooling medium in the first distribution cavity flows to the second distribution cavity first towards the jet flow plate, it flows in the jet flow hole only after flowing in the direction parallel to the jet flow plate. Thus, it can improve the uniformity of the cooling medium distributed to the multiple jet flow holes. The cooling medium first passes through the first distribution cavity and flows to different areas of the second distribution cavity through the distribution hole, and then further divides into multiple impact jets into the heat dissipation cavity through the multiple jet flow holes communicating with the second distribution cavity. Through two times of distribution, the single flow is small, the pressure drop is low when flowing, the power loss of the cooling medium when flowing is reduced, and the pump work required for pumping the cooling medium is reduced. In addition, after the cooling medium jets into the heat dissipation cavity through the jet flow hole, compared with some micro-manifold channels, the flow space of the cooling medium in the heat dissipation cavity is large, and it is not easy to be blocked.

[0010] In an alternative embodiment, the number of jet flow holes is greater than the number of distribution holes. Then, after being distributed through a smaller number of distribution holes, it can be distributed to more flow through a larger number of jet flow holes. Thus, the single flow is small, the pressure drop is low when flowing, and the power loss of the cooling medium when flowing is reduced.

[0011] In an alternative embodiment, the distribution hole is a strip-shaped hole. The length and cross-section of the strip-shaped hole are large, which can ensure that the liquid in the first distribution cavity can flow smoothly into the second distribution cavity, and can flow to different areas of the second distribution cavity, improve the distribution effect, and further improve the uniformity of the cooling medium distributed to the multiple jet flow holes.

[0012] In an alternative embodiment, a plurality of distribution holes are formed in the cover. The plurality of distribution holes allow the cooling medium to flow to different areas of the second distribution chamber, further improving the uniformity of the cooling medium distributed to the plurality of jet holes.

[0013] In an alternative embodiment, the cover has an inlet opening and an outlet opening. The inlet opening is in communication with the first distribution chamber. The cover also has a first flow collection chamber. The first flow collection chamber is isolated from the first distribution chamber. The first flow collection chamber is in communication with the outlet opening. The second flow collection chamber is formed between the jet plate and the cover. The second flow collection chamber is isolated from the second distribution chamber. The portion of the jet plate located in the second flow collection chamber has a return hole. The heat dissipation chamber is in communication with the second flow collection chamber through the return hole. The cover has a liquid collection hole near the jet plate. The second flow collection chamber is in communication with the first flow collection chamber through the liquid collection hole.

[0014] The cooling medium can flow into the first distribution chamber through the inlet opening. The cooling medium can also flow out of the first flow collection chamber through the outlet opening. The heat sink exchanges the cooling medium with the outside. The inlet opening and the outlet opening are both formed in the cover, which can facilitate the connection of the pipeline of the cooling system and the heat sink. In addition, the cooling medium can be injected into the first distribution chamber through the inlet opening on the cover, flow to the second distribution chamber through the distribution hole, and then enter the heat dissipation chamber through the jet hole for heat exchange. The cooling medium after absorbing heat can flow back to the second flow collection chamber through the return hole. Then, the cooling medium can flow into the first flow collection chamber through the liquid collection hole, and finally flow out of the heat sink through the outlet opening, thereby completing heat dissipation. The first distribution chamber, the second distribution chamber, and the heat dissipation chamber are vertically arranged in three layers, which realize the heat exchange and circulation of the cooling medium in the heat sink. In turn, it can reduce the size of the heat sink in the direction parallel to the bottom plate.

[0015] In an alternative embodiment, the heat sink further includes a first partition. The first partition is arranged between the cover and the jet plate. The first partition is connected to the cover and the jet plate, respectively. The first partition isolates the second distribution chamber and the second flow collection chamber from each other. This avoids the direct exchange of cooling medium in the second distribution chamber and the second flow collection chamber, which affects the heat dissipation effect.

[0016] In an alternative embodiment, the heat sink further includes a second partition. The second partition is located in the cover. The second partition isolates the first distribution chamber and the first flow collection chamber from each other. This avoids the direct exchange of cooling medium in the first distribution chamber and the first flow collection chamber.

[0017] In an alternative embodiment, the first partition rib comprises a plurality of concave-convex structures along the width direction of the heat sink. The plurality of concave-convex structures separate the second distribution chamber into a plurality of sub-distribution chambers arranged in intervals. The plurality of concave-convex structures also separate the second flow collection chamber into a plurality of sub-flow collection chambers arranged in intervals. The sub-distribution chambers and the sub-flow collection chambers are arranged alternately along the length direction of the heat sink. The portion of the jet plate located in each sub-distribution chamber is provided with at least one jet hole. The portion of the jet plate located in each sub-flow collection chamber is provided with at least one backflow hole.

[0018] The cooling medium enters the second distribution chamber through the distribution hole, and then is distributed into different sub-distribution chambers, and then flows into different areas of the heat dissipation chamber through the jet holes provided on the portion of the jet plate located in the different sub-distribution chambers, and exchanges heat. Then the cooling medium flows out of the heat dissipation chamber through the backflow holes connected to the sub-distribution chambers, improving the flowability of the cooling medium and further improving the heat dissipation efficiency of the heat dissipation chamber.

[0019] In an alternative embodiment, the distribution hole is a plurality of distribution holes arranged along the side wall of the first distribution chamber. The flow collection hole is a plurality of flow collection holes arranged along the side wall of the first flow collection chamber. After the cooling medium is distributed through the plurality of distribution holes in the first distribution chamber, a plurality of parallel flows are formed, and after further distribution in different second distribution chambers, the cooling medium is jetted into the heat dissipation chamber, thereby being able to dissipate heat for a plurality of power devices arranged at different positions on one side of the bottom plate. After heat exchange, the cooling medium is preliminarily collected by backflowing to different second flow collection chambers, and then further collected by flowing to the first flow collection chamber through different flow collection holes. The cooling medium is distributed twice in the heat sink, and then collected twice, thereby being able to ensure that the single flow of the cooling medium changes smoothly, and the pressure drop is low when flowing. The power loss of the cooling medium when flowing is reduced, thereby reducing the pump work required for pumping the cooling medium.

[0020] In an alternative embodiment, the power converter comprises a plurality of power devices. A plurality of first cavities are formed between the jet plate and the cover. The projection of each first cavity on the bottom plate covers at least one power device. Each first cavity is divided into a second distribution chamber and a second flow collection chamber by a first partition rib. Each second distribution chamber is connected to the first distribution chamber through at least one distribution hole. Each second flow collection chamber is connected to the first flow collection chamber through at least one flow collection hole. The distribution hole distributes the cooling medium into different second distribution chambers to form a plurality of parallel flows. The parallel flows of the cooling medium are jetted to the portion of the bottom plate connected to different power devices, thereby uniformly dissipating heat for different power devices.

[0021] In an alternative embodiment, the heat sink further comprises a flow resistance tooth. The flow resistance tooth is located in the second distribution cavity. The flow resistance tooth is connected to the jet plate and protrudes in the direction of the cover plate. When the cooling medium flows into the second distribution cavity through the distribution hole, the flow resistance tooth can slow down the flow of the cooling medium, so that the cooling medium can flow into different sub-distribution cavities more uniformly. In addition, the flow resistance tooth can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into the jet hole better.

[0022] In an alternative embodiment, the flow resistance tooth is a plurality of flow resistance teeth. The flow resistance teeth and the jet holes are alternately and spacedly arranged in the width direction of the heat sink. The alternately and spacedly arranged flow resistance teeth and jet holes can slow down the flow rate of the cooling medium, so that the cooling liquid can flow into each jet hole better. By flowing into different areas of the heat sink through different jet holes, uniform heat dissipation of the power device is further achieved, and the temperature uniformity of the power device is improved.

[0023] In an alternative embodiment, the heat sink further comprises a first flow guide strip. The first flow guide strip is arranged in the first distribution cavity. The extension direction of the first flow guide strip is the direction in which the liquid inlet opening faces at least one distribution hole. The first flow guide strip is used to quickly guide the cooling medium entering the first distribution cavity through the liquid inlet opening to the distribution hole. Thus, the flow rate of the cooling medium in the heat sink is improved, which helps to further improve the heat dissipation efficiency. When there are a plurality of distribution holes, the first flow guide strip can also ensure that the cooling medium is evenly distributed to different distribution holes.

[0024] In an alternative embodiment, the heat sink further comprises a second flow guide strip. The second flow guide strip is arranged in the first flow collection cavity. The extension direction of the second flow guide strip is the direction in which at least one flow collection hole faces the liquid inlet opening. The second flow guide strip is used to quickly guide the cooling medium flowing into the first distribution cavity through the flow collection hole to the liquid outlet opening. This allows the cooling medium to quickly flow out through the liquid outlet opening, improving the circulation rate and further improving the heat dissipation efficiency.

[0025] In an alternative embodiment, the cover body comprises a partition plate and a cover plate. The second distribution cavity and the second flow collection cavity are formed between the partition plate and the jet plate. The cover plate is located on the side of the partition plate away from the jet plate. The first distribution cavity and the first flow collection cavity are formed between the cover plate and the partition plate. The liquid inlet opening and the liquid outlet opening are both provided on the cover plate. The cover plate is located on the side of the partition plate away from the jet plate, and the liquid inlet opening and the liquid outlet opening are both located on the cover plate, i.e. the liquid inlet opening and the liquid outlet opening are located on the same side of the heat sink, which facilitates the connection of the heat sink and the pipeline of the cooling system, thereby reducing the installation difficulty of the heat sink.

[0026] In an alternative embodiment, the heat sink further comprises an inlet flow channel and an outlet flow channel. The inlet flow channel and the outlet flow channel are arranged on the side of the cover plate away from the jet plate. The inlet flow channel is in communication with the inlet opening. The outlet flow channel is in communication with the outlet opening. The end of the inlet flow channel away from the inlet opening and the end of the outlet flow channel away from the outlet opening are away from the cover plate. This facilitates the connection of the heat sink with external pipelines, thereby reducing the installation difficulty of the heat sink.

[0027] In an alternative embodiment, the at least one heat sink comprises a first heat sink and a second heat sink. The first heat sink comprises a first jet plate and a first bottom plate. The second heat sink comprises a second jet plate and a second bottom plate. The first heat sink and the second heat sink share a cover. The first bottom plate, the first jet plate, the cover, the second jet plate, and the second bottom plate are sequentially stacked in a first direction. Part of the power devices are arranged on the side of the first bottom plate away from the cover, and another part of the power devices are arranged on the side of the second bottom plate away from the cover. Along the first direction, the two side bottom walls of the cover are provided with a distribution hole and a collection hole. The side wall of the cover is provided with an inlet opening and an outlet opening. The inlet opening is in communication with the first distribution cavity, and the outlet opening is in communication with the first collection cavity.

[0028] After the cooling medium flows into the first distribution cavity through the inlet opening, it is distributed into the first heat sink and the second heat sink through different distribution holes on the upper and lower sides. Part of the cooling medium enters the second distribution cavity between the first jet plate and the cover, and flows into the heat dissipation cavity between the first jet plate and the first bottom plate through the jet holes on the first jet plate, thereby dissipating heat from the power devices arranged on the first bottom plate. Another part of the cooling medium enters the second distribution cavity between the second jet plate and the cover, and flows into the heat dissipation cavity between the second jet plate and the second bottom plate through the jet holes on the second jet plate, thereby dissipating heat from the power devices arranged on the second bottom plate. This realizes the simultaneous heat dissipation of multiple power devices on the upper and lower sides by the heat sink.

[0029] In an alternative embodiment, the at least one heat sink comprises a first heat sink and a second heat sink. The first heat sink and the second heat sink are arranged on opposite sides of the power devices, respectively. The bottom plate of the first heat sink and the bottom plate of the second heat sink are connected with the power devices, respectively. At this time, the power devices can be cooled from both sides, further improving the heat dissipation effect of the power devices.

[0030] In an alternative embodiment, the heat sink further comprises an inlet flow channel and an outlet flow channel. The inlet flow channel is arranged on the first side of the cover in a direction parallel to the bottom plate, and the inlet opening is arranged on the first side of the cover. The inlet flow channel is in communication with the inlet opening. The outlet flow channel is arranged on the second side of the cover in a direction parallel to the bottom plate, and the outlet opening is arranged on the second side of the cover. The outlet flow channel is in communication with the outlet opening. The port of the inlet flow channel away from the inlet opening and the port of the outlet flow channel away from the outlet opening are oriented in the same direction. The inlet opening is in communication with the external pipeline through the inlet flow channel, the outlet opening is in communication with the external pipeline through the outlet flow channel, and the ports of the inlet flow channel and the outlet flow channel are oriented in the same direction. This facilitates the connection of the heat sink with the external pipeline, thereby reducing the installation difficulty of the heat sink. The first heat sink and the second heat sink share one inlet flow channel and one outlet flow channel. This facilitates the supply and recovery of cooling medium for the first heat sink and the second heat sink.

[0031] In an alternative embodiment, the heat sink further comprises a flow resistance wall. The flow resistance wall is located in the heat dissipation cavity and connected with the bottom plate. The flow resistance wall divides the heat dissipation cavity into a plurality of heat dissipation sub-cavities. Each heat dissipation sub-cavity is in communication with at least one jet flow hole and at least one backflow hole. The flow resistance wall can absorb the heat transferred by the bottom plate, and when the cooling medium flows and impacts on the flow resistance wall, the cooling medium can exchange heat with the flow resistance wall, thereby improving the heat dissipation effect. After the cooling medium flows into the heat dissipation sub-cavity through the jet flow hole, the flow resistance wall can prevent the cooling medium flows in different heat dissipation sub-cavities from colliding with each other, so as to reduce the flow speed of the cooling medium and avoid affecting the heat dissipation efficiency.

[0032] In an alternative embodiment, the heat sink further comprises a heat dissipation fin. The heat dissipation fin is located in the heat dissipation cavity. The heat dissipation fin is connected with the bottom plate. The heat dissipation fin can increase the contact area with the cooling medium, slow down the flow speed of the cooling medium, thereby achieving sufficient heat exchange and improving the heat dissipation effect. The vertical projection of the jet flow hole on the bottom plate does not overlap with the vertical projection of the heat dissipation fin on the bottom plate. The cooling medium flowing into the heat dissipation cavity from the jet flow hole can directly impact on the bottom plate, and then flow to the surrounding heat dissipation fin structure, thereby ensuring that the cooling medium can fully contact with the bottom plate and the heat dissipation fin, and improving the heat dissipation effect.

[0033] In an alternative embodiment, the opening of the jet flow hole towards the bottom plate is cross-shaped. When the cooling medium flows into the heat dissipation cavity through the cross-shaped opening, it is beneficial for the cooling medium to diffuse outwardly in a direction parallel to the surface of the bottom plate, thereby taking away the heat on the bottom plate and improving the heat dissipation efficiency.

[0034] In an alternative embodiment, the heat sink further comprises an inlet flow channel and an outlet flow channel. The inlet flow channel is in communication with the inlet opening. The outlet flow channel is in communication with the outlet opening. The port of the inlet flow channel and the port of the outlet flow channel are both away from the heat sink along the stacking direction of the heat sink and the power device. The power converter further comprises a capacitor. The capacitor, the port of the inlet flow channel and the port of the outlet flow channel are located on the same side of the heat sink along the stacking direction of the heat sink and the power device. The size of the capacitor and the port of the inlet flow channel and the port of the outlet flow channel partially overlap. The width of the power converter can be reduced. After the cooling medium pipeline is connected with the port of the inlet flow channel and the port of the outlet flow channel, the size of the cooling medium pipeline and the capacitor partially overlap. The width of the power converter is further reduced, which is conducive to the miniaturization of the power converter. BRIEF DESCRIPTION OF DRAWINGS

[0035] Fig. 1 is a structural schematic diagram of a vehicle according to an embodiment of the present application;

[0036] Fig. 2A is a structural schematic diagram of a power converter according to an embodiment of the present application;

[0037] Fig. 2B is a structural schematic diagram of another power converter according to an embodiment of the present application;

[0038] Fig. 3 is an exploded view of a heat sink shown in Fig. 2A;

[0039] Fig. 4 is a sectional view of the heat sink shown in Fig. 3 along the direction O1-O2 after being combined;

[0040] Fig. 5A is a sectional view of the heat sink shown in Fig. 3 along the direction P1-P2 after being combined;

[0041] Fig. 5B is an enlarged view of A in Fig. 5A;

[0042] Fig. 6 is a sectional view of a power converter according to an embodiment of the present application;

[0043] Fig. 7 is a structural schematic diagram of a cover according to an embodiment of the present application;

[0044] Fig. 8 is a structural schematic diagram of another cover according to an embodiment of the present application;

[0045] Fig. 9 is an exploded view of another heat sink shown in Fig. 2A;

[0046] Fig. 10 is a structural schematic diagram of a jet plate according to an embodiment of the present application;

[0047] Fig. 11 is an exploded view of a cover and a jet plate of a heat sink according to an embodiment of the present application;

[0048] Fig. 12 is a structural schematic diagram of another cover according to an embodiment of the present application;

[0049] Fig. 13 is a front view of a heat sink according to an embodiment of the present application;

[0050] Fig. 14 is a partial cross-sectional view of a heat sink according to an embodiment of the present application;

[0051] Fig. 15A is a cross-sectional view of another power converter according to an embodiment of the present application;

[0052] Fig. 15B is a structural schematic view of another power converter according to an embodiment of the present application;

[0053] Fig. 16 is a cross-sectional view of the power converter shown in Fig. 15A along the direction of Q1-Q2;

[0054] Fig. 17A is a cross-sectional view of another power converter according to an embodiment of the present application;

[0055] Fig. 17B is a structural schematic view of another power converter according to an embodiment of the present application;

[0056] Fig. 18 is a partial exploded view of a jet plate and a bottom plate of a heat sink according to an embodiment of the present application;

[0057] Fig. 19 is a partial exploded view of a jet plate and a bottom plate of another heat sink according to an embodiment of the present application;

[0058] Fig. 20 is a partial schematic view of another jet plate according to an embodiment of the present application;

[0059] Fig. 21 is a partial schematic view of another jet plate according to an embodiment of the present application.

[0060] 100-vehicle; 01-battery; 02-power converter; 03-motor; 04-wheel; 10-power device; 11-power chip; 20-radiator; 40-capacitor; 50-liquid inlet pipe; 60-liquid outlet pipe; 21-cover; 211- partition; 211A-first partition; 211B-second partition; 212-cover plate; 213-second partition rib; 214-first partition plate; 2101-first distribution cavity; 2102-distribution hole; 2103-liquid inlet opening; 2104-liquid outlet opening; 2105-first flow cavity; 2106-flow hole; 2100-second cavity; 22-jet plate; 2201-jet hole; 2202-backflow hole; 22A-first jet plate; 22B-second jet plate; 23-bottom plate; 23A-first bottom plate; 23B-second bottom plate; 24-first partition rib; 241-convex-concave structure; 34-resistance tooth; 25-first resistance tooth; 26-second resistance tooth; 27-first flow guide strip; 28-second flow guide strip; 29-liquid inlet flow channel; 30-liquid outlet flow channel; 31-second partition plate; 32-resistance wall; 33-radiation tooth; 201-second distribution cavity; 2011-sub-distribution cavity; 202-radiation cavity; 2021-radiation sub-cavity; 203-second flow cavity; 2031-sub-flow cavity; 200-first cavity; 2001-first side wall; 2002-second side wall. DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0062] Hereinafter, the terms "first", "second", "third", "fourth" and the like are only used for description convenience and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified and limited, the meaning of "a plurality of" is two or more.

[0063] In the present application, unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed mechanical connection, or detachable mechanical connection, or integral; or "connection" can be direct connection, or indirect connection through intermediate medium.

[0064] The words "exemplary," "for example," etc., as may be used in the application, are intended to mean serving as an example, instance, or illustration. Any implementation described as "exemplary," "for example," etc., is not necessarily to be construed as preferred or advantageous over other implementations. The described

[0065] In the drawings of the embodiments of the present application, components are represented by straight lines with arrows, parts are represented by straight lines only, and hollow structures such as cavities and holes are represented by curved lines.

[0066] As shown in FIG. 1, the vehicle 100 can include a battery 01, a power converter 02, a motor 03, and a wheel 04. The power converter 02 receives direct current output by the battery 01 and outputs alternating current to the motor 03. The motor 03 receives power supply from the power converter 02 and drives the wheel 04. The battery 01 can be a power battery.

[0067] Exemplarily, the vehicle 100 can include an electric vehicle or a hybrid vehicle. The embodiments of the present application are not limited in this regard.

[0068] As shown in FIG. 2A, the power converter 02 can include power devices 10. Each power device 10 includes one or more power chips 11. The power chips 11 constitute a bridge arm circuit of a direct-to-alternate current conversion circuit. For example, the power device 10 can be a power module.

[0069] Exemplarily, the power chip 11 can include at least one of an Insulate-Gate Bipolar Transistor (IGBT), a Gallium Nitride (GaN) power transistor, and a Silicon Carbide (SiC) power transistor.

[0070] Exemplarily, as shown in FIG. 2A, the power converter 02 can include three power devices 10, and each power device 10 includes two power chips 11. The two power chips 11 in each power device 10 constitute a bridge arm circuit, and the three power devices 10 combine to constitute a three-phase inverter circuit. The three-phase inverter circuit is used to convert direct current output by the battery 01 into three-phase alternating current.

[0071] Of course, in other embodiments of the present application, the number of power devices 10 can also be other numbers. As shown in FIG. 2B, the power converter 02 can include four power devices 10. The embodiments of the present application are not limited in this regard.

[0072] As shown in FIG. 2A, the power converter 02 further comprises a capacitor 40. The capacitor 40 is electrically connected with the power chip 11, and is used for voltage stabilization and filtering, energy storage and release, power factor improvement, and protection of the inverter when the current power changes.

[0073] During the operation of the power device 10, the power chip 11 generates heat. If the heat cannot be dissipated in time, the power device 10 is prone to be damaged due to over-temperature. In order to dissipate the heat of the power device 10, as shown in FIG. 2A, the power converter 02 can further comprise a heat sink 20. The heat sink 20 is used for dissipating the heat of the power device 10. The power converter 02 can further comprise an inlet pipe 50 and an outlet pipe 60. The inlet pipe 50 is used for transmitting the cooling medium into the heat sink 20, and the outlet pipe 60 is used for transmitting the cooling medium in the heat sink 20 out of the heat sink 20. Along the stacking direction of the heat sink 20 and the power device 10, the capacitor 40, the inlet pipe 50, and the outlet pipe 60 are all arranged on the same side of the heat sink 20. At this time, along the direction on the XY plane, the sizes of the capacitor 40, the inlet pipe 50, and the outlet pipe 60 overlap. In this way, the width and the length of the power converter 02 can be reduced, and the miniaturization of the power converter 02 is facilitated.

[0074] With the fast evolution of the power consumption of the power device 10 chip for vehicles, the heat flux density of the power device 10 chip is also higher and higher. Therefore, the heat dissipation performance of the heat dissipation structure is required to be higher and higher. The heat sink 20 currently used by the power device 10 mainly adopts horizontal flow of the cooling medium for heat exchange, that is, the flow direction of the cooling medium is parallel to the substrate surface of the heat sink 20. This heat exchange form can achieve a relatively high local convective heat transfer coefficient. However, under the conditions of limited chip heat dissipation space and high heat flux density chip, the water temperature rises fast due to the relatively concentrated heat source, and the comprehensive heat dissipation efficiency is relatively low.

[0075] In order to solve the above problems, as shown in FIG. 3 (an exploded view of the heat sink 20 in FIG. 2A), the power converter 02 provided by the embodiment of the present application can further comprise a multi-layer flow channel heat sink 20. The heat sink 20 can comprise a cover 21, a jet plate 22, and a bottom plate 23 which are stacked. The power device 10 is arranged on the side of the bottom plate 23 away from the cover 21. The bottom plate 23 can be attached to the power device 10 (as shown in FIG. 2A). Alternatively, the bottom plate 23 can be the substrate of the power device 10, and the power chip 11 is arranged on the side of the bottom plate 23 away from the jet plate 22. The heat generated by the power device 10 can be transmitted to the bottom plate 23. The cover 21 and the jet plate 22 are both located on the side of the bottom plate 23 away from the power device 10.

[0076] For the convenience of description, an XYZ coordinate system is established in FIG. 3, wherein the XY plane can be parallel to the bottom plate 23. In the case where the bottom plate 23 of the heat sink 20 has a rectangular profile shape, the direction in which the X axis lies can be consistent with the direction in which the short side of the profile shape of the bottom plate 23 lies, and the direction in which the Y axis lies can be consistent with the direction in which the long side of the profile shape of the bottom plate 23 lies. The Z axis is perpendicular to the above-mentioned XY plane, and the Z axis can be the stacking direction of the cover 21, the jet plate 22 and the bottom plate 23, i.e., the thickness direction of the heat sink 20.

[0077] The cover 21 can have a first distribution cavity 2101 therein. The second distribution cavity 201 can be formed between the jet plate 22 and the cover 21. The heat dissipation cavity 202 can be formed between the bottom plate 23 and the jet plate 22. The cover 21 can further have a distribution hole 2102 formed therein, and the first distribution cavity 2101 communicates with the second distribution cavity 201 through the distribution hole 2102. The portion of the jet plate 22 located in the second distribution cavity 201 can have a plurality of jet holes 2201 formed therein. The second distribution cavity 201 communicates with the heat dissipation cavity 202 through the jet holes 2201.

[0078] By injecting the cooling medium into the first distribution cavity 2101 of the cover 21, the cooling medium flows into the second distribution cavity 201 through the distribution hole 2102. Then, the cooling medium is divided into a plurality of impact jets through the plurality of jet holes 2201 formed in the jet plate 22, and enters the heat dissipation cavity 202, and impacts the bottom plate 23 to take away the heat transferred by the power device 10 to the floor. In turn, the power device 10 is cooled. As shown in FIG. 4 (a cross-sectional view of the heat sink combination shown in FIG. 3 in the O1-O2 direction), the first distribution cavity 2101, the second distribution cavity 201 and the heat dissipation cavity 202 are respectively the upper, middle and lower three layers, and the above-mentioned three layers are sequentially stacked along the Z axis perpendicular to the bottom plate, and the heat sink 20 formed thereby is a multi-layer flow channel heat dissipation structure. The cooling medium is vertically jetted to impact the bottom plate 23 to cool the power device 10 (as shown in FIG. 2A) disposed on the other side of the bottom plate 23. Compared with the horizontal flow of the cooling medium, the cooling medium absorbs heat along the whole heat dissipation cavity 202, and the temperature of the cooling medium gradually increases as the cooling medium flows, resulting in poor uniformity of the areas to which the cooling medium flows first and the areas to which the cooling medium flows later. The way of vertically jetting a plurality of cooling media to impact the heat source area, the cooling medium fluid directly impacts the heat source area to be cooled, and carries away the heat. In turn, it can quickly cool the area with high heat flux density, and the uniformity of different areas is good. Especially under the condition of high heat flux density of the element to be cooled and limited heat dissipation space, the thermal resistance can be effectively reduced, the uniformity of the element to be cooled (such as the power chip 11 shown in FIG. 2A) can be improved, and the heat dissipation efficiency can be improved. In addition, after the cooling medium is jetted into the heat dissipation cavity 202 through the jet hole 2201, compared with some micro-manifold channels, the flow space of the cooling medium in the heat dissipation cavity 202 is larger, and it is not easy to be blocked.

[0079] As shown in FIG. 5A (a cross-sectional view of the heat sink combination along the direction of rear edge P1-P2 shown in FIG. 3), the vertical projection of the distribution hole 2102 on the surface of the jet plate 22 away from the bottom plate 23 falls into the jet hole 2201. The cooling medium in the first distribution cavity 2101 first flows to the second distribution cavity 201 towards the jet plate 22, and then flows into the jet hole 2201 as shown by the arrow in FIG. 5A. The cooling medium first flows in a direction parallel to the jet plate 22, and then flows into the jet hole 2201. In this way, the uniformity of the cooling medium distributed to the plurality of jet holes 2201 can be improved. The cooling medium is first distributed to different areas of the second distribution cavity 201 through the first distribution cavity 2101, and then further distributed into a plurality of impinging jets into the heat dissipation cavity 202 through the plurality of jet holes 2201 in communication with the second distribution cavity 201. The number of jet holes 2201 is greater than the number of distribution holes 2102. The cooling medium is first distributed through the distribution hole 2102, and then distributed through a larger number of jet holes 2201 to obtain a larger flow rate. Through the two distribution processes, the flow rate of the cooling medium is small, the pressure drop during flow is low, the power loss during flow of the cooling medium is reduced, and the pump power required for pumping the cooling medium is reduced.

[0080] In order to increase the flow rate of the cooling medium flowing out of the jet hole 2201, as shown in FIG. 5B (an enlarged view of position A in FIG. 5A), the opening area of the jet hole 2201 towards the bottom plate 23 is smaller than the opening area of the jet hole 2201 away from the bottom plate 23. For example, when the jet hole 2201 is a circular hole, the diameter of the jet hole 2201 towards the bottom plate 23 is smaller than the diameter of the jet hole 2201 away from the bottom plate 23. When the cooling medium flows into the heat dissipation cavity 202 through the jet hole 2201, the opening area of the jet hole 2201 towards the bottom plate 23 is smaller, and thus the flow rate of the cooling medium entering the heat dissipation cavity 202 can be increased to improve the heat exchange efficiency.

[0081] Of course, in other embodiments of the present application, the opening area of the jet hole 2201 towards the bottom plate 23 can also be equal to the opening area of the jet hole 2201 away from the bottom plate 23. For example, the jet hole 2201 is a cylindrical hole with a certain diameter, or the jet hole 2201 is a prismatic hole, etc. The present application does not make specific limitations.

[0082] As shown in FIG. 6, the power device 10 described above can include a plurality of power chips 11. The projection of each power chip 11 on the jet plate 22 covers at least a part of a jet hole 2201. At this time, after the heat generated by the power chip 11 during operation is diffused onto the bottom plate 23, the cooling medium flowing out of the jet hole 2201 can impact on the position where the heat is more concentrated, and thus the position where the heat is concentrated can be well cooled. The heat dissipation efficiency of the heat sink 20 is improved.

[0083] To further improve the uniformity of the distribution of the cooling medium, as shown in FIG. 7, the distribution hole 2102 can be a strip-shaped hole. For example, the strip-shaped hole can extend along the Y-axis direction, so that the size of the strip-shaped hole along the Y-axis direction is greater than the size along the X-axis direction. In the case of a fixed size along the X-axis direction, compared with a round hole, the length of the strip-shaped hole along the Y-axis direction is greater, and the opening of the strip-shaped hole is also larger. In turn, it can ensure that the liquid in the first distribution cavity 2101 can flow smoothly into the second distribution cavity 201 (as shown in FIG. 3) and can flow to different areas of the second distribution cavity 201, improving the distribution effect and further improving the uniformity of the cooling medium distributed to the plurality of jet holes 2201.

[0084] The above embodiments, as shown in FIG. 7, are exemplified by taking the distribution hole 2102 as a strip-shaped hole. In other embodiments of the present application, the distribution hole 2102 can also be round, snake-shaped, cross-shaped, etc. The present application does not make specific limitations.

[0085] As shown in FIG. 8, a plurality of distribution holes 2102 can be provided on the cover 21, which are in communication with the same second distribution cavity 201 (as shown in FIG. 3). The plurality of distribution holes 2102 will cause the cooling medium to flow to different areas of the second distribution cavity 201 (as shown in FIG. 3), further improving the uniformity of the cooling medium distributed to the plurality of jet holes 2201.

[0086] As shown in FIG. 9 (an exploded view of the heat sink 20 in FIG. 2A), the cover 21 can be provided with an inlet opening 2103 and an outlet opening 2104. The inlet opening 2103 is in communication with the first distribution cavity 2101. The cover 21 can also have a first flow cavity 2105. The first flow cavity 2105 is isolated from the first distribution cavity 2101. The first flow cavity 2105 is in communication with the outlet opening 2104. A second flow cavity 203 can also be formed between the jet plate 22 and the cover 21. The second flow cavity 203 is isolated from the second distribution cavity 201. The part of the jet plate 22 located in the second flow cavity 203 can also be provided with a backflow hole 2202. The heat dissipation cavity 202 is in communication with the second flow cavity 203 through the backflow hole 2202. The cover 21 can also be provided with a liquid collection hole 2106. The second flow cavity 203 is in communication with the first flow cavity 2105 through the liquid collection hole 2106.

[0087] As shown by the arrows in FIG. 9, the cooling medium can flow into the first distribution cavity 2101 through the liquid inlet opening 2103. The cooling medium can also flow out of the first distribution cavity 2101 through the liquid outlet opening 2104. The heat sink 20 exchanges heat with the cooling medium outside. The liquid inlet opening 2103 and the liquid outlet opening 2104 are both provided on the cover 21, which can facilitate the connection of the liquid inlet pipe 50 (as shown in FIG. 2A) and the liquid outlet pipe 60 (as shown in FIG. 2A) with the heat sink 20. In addition, the cooling medium can be injected into the first distribution cavity 2101 through the liquid inlet opening 2103 on the cover 21, flow to the second distribution cavity 201 through the distribution hole 2102, and then enter the heat dissipation cavity 202 through the jet hole 2201 for heat exchange. The cooling medium that absorbs heat can flow back to the second distribution cavity 201 through the backflow hole 2202, flow into the first distribution cavity 2101 through the distribution hole 2102, and then flow out of the heat sink 20 through the liquid outlet opening 2104, thereby completing heat dissipation. The first distribution cavity 2101, the second distribution cavity 201, and the heat dissipation cavity 202 are vertically arranged in three layers, which can realize the heat exchange and circulation of the cooling medium in the heat sink 20. In addition, the size of the heat sink 20 in the direction parallel to the bottom plate 23 can be reduced.

[0088] Alternatively, in other embodiments of the present application, the liquid outlet opening 2104 can also be provided on the side wall of the heat dissipation cavity 202. After the cooling medium flows from the jet hole 2201 to the heat dissipation cavity 202, it can be discharged from the heat dissipation cavity 202 through the liquid outlet opening 2104 on the side wall of the heat dissipation cavity 202.

[0089] As shown in FIG. 10, the jet plate 22 and the cover 21 (as shown in FIG. 9) can form a first cavity 200 therebetween. The heat sink 20 can further include a first partition 24. The first partition 24 is arranged in the first cavity 200 and located between the cover 21 and the jet plate 22. The first partition 24 is connected with the cover 21 and the jet plate 22, respectively. The first partition 24 divides the first cavity 200 into the second distribution cavity 201 and the second distribution cavity 203. The second distribution cavity 201 and the second distribution cavity 203 are separated, so that the cooling medium in the second distribution cavity 201 and the second distribution cavity 203 does not exchange directly, thereby avoiding affecting the heat dissipation effect.

[0090] Continuing to FIG. 10, the first partition 24 includes a plurality of protrusions and depressions 241 along the width direction (i.e., the X-axis direction) of the heat sink 20. The plurality of protrusions and depressions 241 separate the second distribution chamber 201 into a plurality of sub-distribution chambers 2011 arranged in an interval. The plurality of protrusions and depressions 241 also separate the second flow collection chamber 203 into a plurality of sub-flow collection chambers 2031 arranged in an interval. The sub-distribution chambers 2011 and the sub-flow collection chambers 2031 are arranged alternately along the length direction (i.e., the Y-axis direction) of the heat sink 20. The portion of the jet plate 22 located in each of the sub-distribution chambers 2011 is provided with at least one jet hole 2201. The portion of the jet plate 22 located in each of the sub-flow collection chambers 2031 is provided with at least one backflow hole 2202.

[0091] The cooling medium enters the second distribution chamber 201 through the distribution hole 2102, and then is distributed into different sub-distribution chambers 2011, and then flows into different areas of the heat dissipation chamber 202 through the jet holes 2201 of the portion of the jet plate 22 located in the different sub-distribution chambers 2011, and exchanges heat. Then the cooling medium flows out of the heat dissipation chamber 202 through the backflow holes 2202 of the sub-flow collection chambers 2031 adjacent to the sub-distribution chambers 2011, improving the flowability of the cooling medium, and further improving the heat dissipation efficiency of the heat dissipation chamber 202.

[0092] Exemplarily, continuing to FIG. 10, the first cavity 200 can have a first side wall 2001 and a second side wall 2002. The first partition 24 is located between the first side wall 2001 and the second side wall 2002. The first partition 24 separates the second distribution chamber 201 from the first side wall 2001. The first partition 24 separates the second flow collection chamber 203 from the second side wall 2002.

[0093] Exemplarily, the first partition 24 can be a zigzag line or a wavy line. The zigzag line or the wavy line of the first partition 24 can separate a plurality of sub-distribution chambers 2011 and a plurality of sub-flow collection chambers 2031, and make one side of one sub-distribution chamber 2011 be provided with one sub-flow collection chamber 2031.

[0094] In order to make the cooling medium flow into different jet holes 2201 uniformly, continuing to FIG. 10, the heat sink 20 can further include a flow resistance tooth 34. The flow resistance tooth 34 is located in the second distribution chamber 201. The flow resistance tooth 34 is connected with the jet plate 22 and protrudes in the direction of the jet plate 22 facing the cover 21 (as shown in FIG. 9). When the cooling medium flowing into the second distribution chamber 201 through the distribution hole 2102 (as shown in FIG. 9) flows, the flow resistance tooth 34 can resist the flow of the cooling medium, so that the cooling medium can flow into different sub-distribution chambers 2011 and into the jet holes 2201 uniformly.

[0095] Further, as shown in FIG. 10, the flow blocking teeth 34 can be multiple. The flow blocking teeth 34 and the jet holes 2201 are alternately arranged along the width direction (i.e. the X-axis direction) of the heat sink 20. The flow blocking teeth 34 and the jet holes 2201 are alternately arranged, which can slow down the flow rate of the cooling medium, and thus the cooling liquid can flow into each jet hole 2201 better. The cooling liquid flows into different areas of the heat dissipation cavity 202 (as shown in FIG. 9) through different jet holes 2201, which further realizes uniform heat dissipation of the power device 10 (as shown in FIG. 6) and improves the temperature uniformity of the power device 10.

[0096] For example, the flow blocking teeth 34 can include first flow blocking teeth 25 and second flow blocking teeth 26. The first flow blocking teeth 25 are located between the vertical projection of the distribution hole 2102 (as shown in FIG. 9) on the jet plate 22 and the sub-distribution cavity 2011. When the cooling medium flows into the sub-distribution cavity 2011 through the distribution hole 2102, the first flow blocking teeth 25 are in the flow path of the cooling medium, which can slow down the flow of the cooling medium. The second flow blocking teeth 26 are located between two jet holes 2201, which can slow down the flow of the cooling medium in the sub-distribution cavity 2011, and thus the cooling liquid can flow into different jet holes 2201 more uniformly.

[0097] As shown in FIG. 11, the distribution holes 2102 are multiple, and the multiple distribution holes 2102 are arranged along the side wall (i.e. the Y-axis direction) of the first distribution cavity 2101. The multiple collection holes 2106 are arranged along the side wall (i.e. the Y-axis direction) of the first collection cavity 2105. After the cooling medium is distributed through the multiple distribution holes 2102 in the first distribution cavity 2101, multiple flows in parallel are formed, and after further distribution in different second distribution cavities 201, the cooling medium is jetted into the heat dissipation cavity 202 (as shown in FIG. 9), which can dissipate heat from multiple heat sources. After heat exchange, the cooling medium is preliminarily collected by flowing back to different second collection cavities 203, and then further collected by flowing through different collection holes 2106 to the first collection cavity 2105. The cooling medium is distributed twice in the heat sink 20 and collected twice, which can ensure that the single flow of the cooling medium changes smoothly and the pressure drop is low when flowing. The power loss of the cooling medium when flowing is reduced, and thus the pump power required for pumping the cooling medium is reduced.

[0098] Continuing as shown in FIG. 11, a plurality of first cavities 200 can be formed between the cover 21 and the jet plate 22. Each first cavity 200 is divided into a second distribution cavity 201 and a second flow collection cavity 203 by the first partition 24. Each second distribution cavity 201 is in communication with the first distribution cavity 2101 through at least one distribution hole 2102. Each second flow collection cavity 203 is in communication with the first flow collection cavity 2105 through at least one flow collection hole 2106. The distribution holes 2102 distribute the cooling medium into different second distribution cavities 201, forming multiple parallel flows. The parallel flows of cooling medium are jetted to the portions of the bottom plate 23 (as shown in FIG. 6) connected to different power devices 10 (as shown in FIG. 6), respectively. In turn, the different power devices 10 are uniformly cooled.

[0099] The above embodiment, as shown in FIG. 11, is exemplified by taking the number of first cavities 200 as three. The three first cavities 200 correspond to three power devices 10 (as shown in FIG. 6), respectively. The cooling medium in the second distribution cavity 201 of each first cavity 200 is jetted to impact the position where the bottom plate 23 and one power device 10 are attached, through the jetting hole 2201 in communication with the second distribution cavity 201, in turn cooling one power device 10. In other embodiments of the present application, the number of first cavities 200 and power devices 10 can also be other numbers. The present application is not specifically limited.

[0100] In addition, the above embodiment, as shown in FIG. 11, is exemplified by taking three distribution holes 2102 and three flow collection holes 2106 opened on the cover 21. Each second distribution cavity 201 is in communication with the first distribution cavity 2101 through one distribution hole 2102. Each second flow collection cavity 203 is in communication with the first flow collection cavity 2105 through one flow collection hole 2106. In other embodiments of the present application, the number of distribution holes 2102 and flow collection holes 2106 can also be other numbers. The present application is not specifically limited.

[0101] As shown in FIG. 12, the heat sink 20 can further include a first flow guide 27. The first flow guide 27 is arranged in the first distribution cavity 2101. The extension direction of the first flow guide 27 is the direction (for example, direction M in the figure) in which the liquid inlet opening 2103 faces at least one distribution hole 2102. The first flow guide 27 is used to quickly guide the cooling medium entering the first distribution cavity 2101 from the liquid inlet opening 2103 to the distribution hole 2102. Thus, the flow rate of the cooling medium in the heat sink 20 is improved, which helps to further improve the cooling efficiency. When the distribution holes 2102 are multiple, the first flow guide 27 can also ensure that the cooling medium is uniformly distributed into different distribution holes 2102.

[0102] Continuing to FIG. 12, the heat sink 20 can further include a second flow guide 28. The second flow guide 28 is disposed in the first flow collection cavity 2105. The second flow guide 28 extends in a direction (e.g., direction N in the figure) toward the liquid inlet opening 2103 from at least one liquid collection hole 2106. The second flow guide 28 is configured to quickly guide the cooling medium flowing into the first liquid distribution cavity 2101 from the liquid collection hole 2106 to the liquid outlet opening 2104. This allows the cooling medium to quickly flow out through the liquid outlet opening 2104, thereby increasing the circulation rate and further improving the heat dissipation efficiency.

[0103] In addition, continuing to FIG. 12, the heat sink 20 further includes a second partition 213 disposed in the cover 21. The second partition 213 separates the first liquid distribution cavity 2101 and the first flow collection cavity 2105 from each other. This prevents the cooling medium in the first liquid distribution cavity 2101 and the first flow collection cavity 2105 from directly exchanging.

[0104] Further, continuing to FIG. 12, the cover 21 can include a partition plate 211 and a cover plate 212. The partition plate 211 and the jet plate 22 (shown in FIG. 11) form a second liquid distribution cavity 201 (shown in FIG. 11) and a second flow collection cavity 203 (shown in FIG. 11) therebetween. The cover plate 212 is disposed on a side of the partition plate 211 opposite the jet plate 22. The liquid inlet opening 2103 and the liquid outlet opening 2104 are both formed in the cover 21. The cover plate 212 and the partition plate 211 form the first liquid distribution cavity 2101 and the first flow collection cavity 2105 therebetween. The cover plate 212 is disposed on a side of the partition plate 211 opposite the jet plate 22, and the liquid inlet opening 2103 and the liquid outlet opening 2104 are both formed in the cover plate 212. That is, the liquid inlet opening 2103 and the liquid outlet opening 2104 are both formed on the same side of the heat sink 20, which facilitates connecting the heat sink 20 to the liquid inlet pipe 50 (shown in FIG. 2A) and the liquid outlet pipe 60 (shown in FIG. 2A) both of which are disposed on the same side of the heat sink 20, thereby reducing the difficulty of installing the heat sink 20.

[0105] For example, the cover plate 212 and the partition plate 211 form a second cavity 2100 therebetween. The second partition 213 is disposed in the second cavity 2100. The second partition 213 separates the second cavity 2100 into the first liquid distribution cavity 2101 and the first flow collection cavity 2105. The second partition 213 separates the second liquid distribution cavity 201 and the second flow collection cavity 203 from each other, thereby preventing the cooling medium in the second liquid distribution cavity 201 and the second flow collection cavity 203 from directly exchanging.

[0106] Further, as shown in FIG. 12, the axis of the liquid inlet opening 2103 and the axis of the liquid outlet opening 2104 can both be perpendicular to the partition plate 211. When the pipes of the cooling system (the liquid inlet pipe 50 and the liquid outlet pipe 60 shown in FIG. 2A) are connected to the heat sink 20, the liquid inlet pipe 50 and the liquid outlet pipe 60 are both directed towards the partition plate 211, further improving the convenience of mounting the heat sink 20 with the liquid inlet pipe 50 and the liquid outlet pipe 60.

[0107] As shown in FIG. 12, the length direction of the second partition rib 213 is inclined relative to the length direction of the second cavity 2100. That is, in the direction (for example, direction M in the figure) from the liquid inlet opening 2103 towards the liquid outlet hole 2102, the width of the first liquid distribution cavity 2101 gradually decreases. This further ensures that when the cooling medium flows to the liquid outlet hole 2102 away from the liquid inlet opening 2103, the flow rate of the cooling medium can still be close to that of the cooling medium flowing through the liquid outlet hole 2102 close to the liquid inlet opening 2103. This ensures that the flow rates in the plurality of liquid outlet holes 2102 remain balanced, thereby improving the uniformity of heat dissipation for the power device 10.

[0108] On this basis, as shown in FIG. 13, the heat sink 20 further comprises a liquid inlet flow channel 29 and a liquid outlet flow channel 30. The liquid inlet flow channel 29 is in communication with the liquid inlet opening 2103 (shown in FIG. 12). The liquid outlet flow channel 30 is in communication with the liquid outlet opening 2104 (shown in FIG. 12). In the stacking direction (i.e., Z-axis direction) of the heat sink 20 and the power device 10 (shown in FIG. 2A), the port of the liquid inlet flow channel 29 and the port of the liquid outlet flow channel 30 both face away from the heat sink 20. In the X-axis direction, the size of the capacitor 40 (shown in FIG. 2A), the liquid inlet flow channel 29 and the liquid outlet flow channel 30 overlap. This further reduces the width dimension of the power converter 02. In addition, the structure in which the port of the liquid inlet flow channel 29 and the port of the liquid outlet flow channel 30 both face away from the heat sink 20 can also facilitate connection with the cooling medium pipes (the liquid inlet pipe 50 and the liquid outlet pipe 60 shown in FIG. 2A). As shown in FIG. 2A, the liquid inlet pipe 50 is in communication with the liquid inlet opening 2103 through the liquid inlet flow channel 29. The liquid outlet pipe 60 is in communication with the liquid outlet opening 2104 through the liquid outlet flow channel 30. This achieves that the liquid inlet pipe 50 and the liquid outlet pipe 60 are both located on the same side of the capacitor 40, thereby reducing the width dimension of the power converter 02.

[0109] As shown in FIG. 14, the cover 21 can further include a first surrounding plate 214. The first surrounding plate 214 is fixedly arranged at the side of the partition plate 211 or the cover plate 212, and the first surrounding plate 214, the partition plate 211 and the cover plate 212 jointly enclose a second cavity 2100. The second partition rib 213 is further connected with the first surrounding plate 214. Exemplarily, the first surrounding plate 214 can be an integral structure with the partition plate 211. Alternatively, the first surrounding plate 214 can be an integral structure with the cover plate 212. Alternatively, the first surrounding plate 214, the partition plate 211 and the cover plate 212 can be fixed by welding or by screws (not shown in the figure). The embodiments of the present application are not limited specifically.

[0110] Continuing as shown in FIG. 14, the heat sink 20 can further include a second surrounding plate 31. The second surrounding plate 31 is fixedly arranged at the side of the partition plate 211 or the jet plate 22, and the second surrounding plate 31, the partition plate 211 and the jet plate 22 jointly enclose a first cavity 200. The first partition rib 24 is further connected with the second surrounding plate 31. Exemplarily, the second surrounding plate 31 can be an integral structure with the jet plate 22. Alternatively, the second surrounding plate 31 can be an integral structure with the partition plate 211. Alternatively, the second surrounding plate 31, the jet plate 22 and the partition plate 211 can be an integral structure and be manufactured by laser printing. Alternatively, the second surrounding plate 31, the partition plate 211 and the jet plate 22 can be fixed by welding or by screws (not shown in the figure). The embodiments of the present application are not limited specifically.

[0111] Further, continuing as shown in FIG. 14, in the direction of the jet plate 22 pointing to the bottom plate 23, the second surrounding plate 31 protrudes from the jet plate 22. The part of the second surrounding plate 31 protruding from the jet plate 22 jointly encloses a heat dissipation cavity 202 with the jet plate 22 and the bottom plate 23.

[0112] Of course, in other embodiments of the present application, the edge region of the bottom plate 23 can also protrude towards the jet plate 22, and the jet plate 22 is connected with the protruding part. Further, the heat dissipation cavity 202 is formed between the bottom plate 23 and the jet plate 22.

[0113] As shown in FIG. 15A, the at least one heat sink 20 includes a first heat sink 20A and a second heat sink 20B. The first heat sink 20A includes a first jet plate 22A and a first bottom plate 23A. The second heat sink 20B includes a second jet plate 22B and a second bottom plate 23B. The first heat sink 20A shares the cover 21 with the second heat sink 20B. The bottom plate 23 can include the first bottom plate 23A and the second bottom plate 23B. The jet plate 22 can include the first jet plate 22A and the second jet plate 22B. The first bottom plate 23A, the first jet plate 22A, the cover 21, the second jet plate 22B, and the second bottom plate 23B are sequentially stacked along the first direction Z. Part of the power devices 10 are arranged on the side of the first bottom plate 23A away from the cover 21, and another part of the power devices 10 are arranged on the side of the second bottom plate 23B away from the cover 21. As shown in FIG. 16 (a cross-sectional view along the direction of Q1-Q2 in FIG. 15A), on both sides of the cover 21 along the first direction Z, a distribution hole 2102 and a collection hole 2106 can be formed. As shown in FIG. 15A, a liquid inlet opening 2103 and a liquid outlet opening 2104 can be formed on the side wall of the cover 21. The liquid inlet opening 2103 is in communication with the first distribution cavity 2101, and the liquid outlet opening 2104 is in communication with the first collection cavity 2105.

[0114] After the cooling medium flows into the first distribution cavity 2101 through the liquid inlet opening 2103, it is distributed into the first heat sink 20A and the second heat sink 20B through different distribution holes 2102 on the upper and lower sides (as shown in FIG. 16). Part of the cooling medium enters the second distribution cavity 201 between the first jet plate 22A and the cover 21, and flows into the heat dissipation cavity 202 between the first jet plate 22A and the first bottom plate 23A through the jet holes 2201 on the first jet plate 22A, and then cools the power devices 10 on the first bottom plate 23A. The cooling medium that has completed heat exchange flows back into the second collection cavity 203 between the first jet plate 22A and the cover 21 through the backflow holes 2202 on the first jet plate 22A, flows to the first collection cavity 2105 through the collection hole 2106 (as shown in FIG. 16) on the cover 21, and finally flows out through the collection hole 2106. Another part of the cooling medium enters the second distribution cavity 201 between the second jet plate 22B and the cover 21, and flows into the heat dissipation cavity 202 between the second jet plate 22B and the second bottom plate 23B through the jet holes 2201 on the second jet plate 22B, and then cools the power devices 10 on the second bottom plate 23B. Similarly, the cooling medium that has completed heat exchange flows back into the second collection cavity 203 between the second jet plate 22B and the cover 21 through the backflow holes 2202 on the second jet plate 22B, the second collection cavity 203 between the second jet plate 22B and the cover 21, the collection hole 2106, the first collection cavity 2105, and finally flows out through the collection hole 2106. In this way, the heat sink 20 can simultaneously cool multiple power devices 10 on the upper and lower sides.

[0115] Continuing as shown in FIG. 15A, the cover 21 can include a first partition 211 A and a second partition 211B. The first partition 211 A is located between the first jet plate 22A and the second partition 211B. The cooling medium can enter the second distribution cavity 201 between the first jet plate 22A and the first partition 211 A through the distribution hole 2102 (as shown in FIG. 16) on the first partition 211 A. The cooling medium can also enter the second distribution cavity 201 between the second jet plate 22B and the second partition 211B through the distribution hole 2102 (as shown in FIG. 16) on the second partition 211B.

[0116] On this basis, continuing as shown in FIG. 15A, the heat sink 20 can also include a liquid inlet channel 29 and a liquid outlet channel 30. In the direction parallel to the first bottom plate 23A, the liquid inlet channel 29 is arranged on the first side c of the cover 21, and the liquid inlet opening 2103 is opened on the first side c of the cover 21. The liquid inlet channel 29 communicates with the liquid inlet opening 2103. In the direction parallel to the first bottom plate 23A, the liquid outlet channel 30 is arranged on the second side d of the cover 21, and the liquid outlet opening 2104 is opened on the second side d of the cover 21. The liquid outlet channel 30 communicates with the liquid outlet opening 2104. The first heat sink 20A and the second heat sink 20B share the cover 21, the liquid inlet channel 29, and the liquid outlet channel 30. Further facilitating the supply and recovery of cooling medium for the first heat sink 20A and the second heat sink 20B.

[0117] As shown in FIG. 15B, the liquid inlet pipe 50 communicates with the liquid inlet opening 2103 (as shown in FIG. 15A) through the liquid inlet channel 29. The liquid outlet pipe 60 communicates with the liquid outlet opening 2104 (as shown in FIG. 15A) through the liquid outlet channel 30. And continuing as shown in FIG. 15A, the port a of the liquid inlet channel 29 away from the liquid inlet opening 2103 and the port b of the liquid outlet channel 30 away from the liquid outlet opening 2104 are oriented in the same direction. In the X-axis direction, the size of the capacitor 40 (as shown in FIG. 2A), the port a part of the liquid inlet channel 29, and the port b part of the liquid outlet channel 30 overlap. Further, the width dimension of the power converter 02 can be reduced. In addition, the ports of the liquid inlet channel 29 and the liquid outlet channel 30 are both away from the structure of the heat sink 20, which can facilitate the connection with the cooling medium pipeline (such as the liquid inlet pipe 50 and the liquid outlet pipe 60 shown in FIG. 15B). Reducing the assembly difficulty of the power converter 02.

[0118] As shown in FIG. 15B, in the Z-axis direction, the liquid inlet pipe 50, the liquid outlet pipe 60, and the capacitor 40 (as shown in FIG. 2A) are all located on the same side of the heat sink 20. Beneficial to the width dimension along the X-axis direction and the length dimension along the Y-axis direction of the power converter 02. Beneficial to the miniaturization of the power converter 02.

[0119] As shown in FIG. 17A, the at least one heat sink 20 includes a first heat sink 20A and a second heat sink 20B. The first heat sink 20A and the second heat sink 20B are respectively arranged on opposite sides of the power device 10. The first heat sink 20A includes a first cover 21A, a first jet plate 22A, and a first bottom plate 23A. The second heat sink 20B includes a second cover 21B, a second jet plate 22B, and a second bottom plate 23B. The first bottom plate 23A and the second bottom plate 23B are respectively connected with the power device 10. At this time, the power device 10 can be double-sidedly cooled, and the cooling effect of the power device 10 is further improved.

[0120] On this basis, as shown in FIG. 17A, the heat sink 20 can further include an inlet flow channel 29 and an outlet flow channel 30. The inlet flow channel 29 and the outlet flow channel 30 are arranged on both sides of the second cover 21B along a direction parallel to the first bottom plate 23A. The inlet opening 2103 of the first cover 21A and the second cover 21B can be communicated with the inlet pipe 50 (as shown in FIG. 2A) through the same inlet flow channel 29. The outlet opening 2104 of the first cover 21A and the second cover 21B can be communicated with the outlet pipe 60 (as shown in FIG. 2A) through the same outlet flow channel 30. That is, the first heat sink 20A and the second heat sink 20B share the inlet flow channel 29 and the outlet flow channel 30. Further, the supply and recovery of the cooling medium to the first heat sink 20A and the second heat sink 20B are facilitated. The ports of the inlet flow channel 29 and the outlet flow channel 30 are oriented in the same direction. In the X-axis direction, the size of the capacitor 40 (as shown in FIG. 2A), the port a of the inlet flow channel 29, and the port b of the outlet flow channel 30 overlap. Further, the width dimension of the power converter 02 can be reduced. In addition, the ports of the inlet flow channel 29 and the outlet flow channel 30 are both away from the structure of the heat sink 20, which can facilitate the connection with the cooling medium pipeline (the inlet pipe 50 and the outlet pipe 60 as shown in FIG. 2A). The assembly difficulty of the power converter 02 is reduced.

[0121] In addition, as shown in FIG. 17B, along the Z-axis direction, the inlet pipe 50, the outlet pipe 60, and the capacitor 40 are all located on the same side of the heat sink 20. The width dimension along the X-axis direction and the length dimension along the Y-axis direction of the power converter 02 are facilitated. The miniaturization of the power converter 02 is facilitated.

[0122] As shown in FIG. 18, the heat sink 20 can further include a flow resistance wall 32. The flow resistance wall 32 is located in the heat dissipation cavity 202 and connected with the bottom plate 23. The flow resistance wall 32 divides the heat dissipation cavity 202 into a plurality of heat dissipation sub-cavities 2021. Each heat dissipation sub-cavity 2021 is in communication with at least one jet hole 2201 and at least one backflow hole 2202. The flow resistance wall 32 can absorb the heat transferred by the bottom plate 23, and exchange heat with the flow resistance wall 32 when the cooling medium flows against the flow resistance wall 32, thereby improving the heat dissipation effect. After the cooling medium flows into the heat dissipation sub-cavity 2021 through the jet hole 2201, the flow resistance wall 32 can prevent the cooling medium in different heat dissipation sub-cavities 2021 from colliding with each other, so as to reduce the flow rate of the cooling medium and avoid affecting the heat dissipation efficiency.

[0123] In order to further improve the heat dissipation effect of the heat sink 20, as shown in FIG. 19, the heat sink 20 can further include a heat dissipation tooth 33. The heat dissipation tooth 33 is located in the heat dissipation cavity 202. The heat dissipation tooth 33 is connected with the bottom plate 23. The heat dissipation tooth 33 can increase the contact area with the cooling medium, slow down the flow rate of the cooling medium, thereby realizing sufficient heat exchange and improving the heat dissipation effect. The vertical projection of the jet hole 2201 on the bottom plate 23 does not overlap with the vertical projection of the heat dissipation tooth 33 on the bottom plate 23. The cooling medium flowing into the heat dissipation cavity 202 from the jet hole 2201 can directly impact on the bottom plate 23, and then flow to the surrounding heat dissipation tooth 33 structure, thereby ensuring that the cooling medium can fully contact with the bottom plate 23 and the heat dissipation tooth 33, and improving the heat dissipation effect.

[0124] As shown in FIG. 20, the opening of the jet hole 2201 towards the bottom plate 23 can be cross-shaped. When the cooling medium flows into the heat dissipation cavity 202 through the cross-shaped opening, it is beneficial for the cooling medium to diffuse outwardly in a direction parallel to the surface of the bottom plate 23, thereby taking away the heat on the bottom plate 23 and improving the heat dissipation efficiency.

[0125] As shown in FIG. 20, a plurality of second flow resistance teeth 26 are arranged on the circumferential side of the cross-shaped jet hole 2201, so that more cooling medium can flow into the jet hole 2201.

[0126] Of course, in the embodiment of the present application, the jet hole 2201 can also be a circular hole as shown in FIG. 21. Alternatively, the jet hole 2201 can also be a square hole, an elliptical hole, etc., which is not limited in the present application.

[0127] Similarly, in the embodiment of the present application, the backflow hole 2202 can be a circular hole as shown in FIG. 20. Alternatively, the backflow hole 2202 can also be a strip-shaped hole as shown in FIG. 21. Alternatively, the backflow hole 2202 can also be a square hole, an elliptical hole, etc., which is not limited in the present application.

[0128] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed by the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A power converter having a multi-layered flow channel heat sink structure, characterized by, A heat sink comprising at least one multilayer flow channel, the heat sink comprising a cover, a jet plate and a bottom plate arranged in layers, and a power device arranged on a side of the bottom plate away from the cover; The cover has a first distribution cavity; a second distribution cavity is formed between the jet plate and the cover, and a heat dissipation cavity is formed between the bottom plate and the jet plate; A distribution hole is formed on a side of the cover close to the jet plate, and the first distribution cavity communicates with the second distribution cavity through the distribution hole; A plurality of jet holes are formed on a portion of the jet plate located in the second distribution cavity, and the second distribution cavity communicates with the heat dissipation cavity through the jet holes; the vertical projection of the distribution hole on the surface of the jet plate away from the bottom plate falls outside the jet holes.

2. The power converter of claim 1, wherein, The number of the jet holes is greater than the number of the distribution holes.

3. A power converter as claimed in claim 1 or 2, characterised in that, An inlet opening and an outlet opening are formed on the cover, the inlet opening communicates with the first distribution cavity; the cover also has a first confluence cavity, which is isolated from the first distribution cavity, and the first confluence cavity communicates with the outlet opening; A second confluence cavity is also formed between the jet plate and the cover, which is isolated from the second distribution cavity, and a backflow hole is also formed on a portion of the jet plate located in the second confluence cavity, and the heat dissipation cavity communicates with the second confluence cavity through the backflow hole; A confluence hole is formed on a side of the cover close to the jet plate, and the second confluence cavity communicates with the first confluence cavity through the confluence hole.

4. The power converter of claim 3, wherein, The heat sink also comprises a first partition rib, which is arranged between the cover and the jet plate and connected with the cover and the jet plate respectively, and the first partition rib isolates the second distribution cavity and the second confluence cavity from each other; The heat sink also comprises a second partition rib, which is located in the cover and isolates the first distribution cavity and the first confluence cavity from each other.

5. The power converter of claim 4, wherein, The first partition rib comprises a plurality of concave-convex structures along the width direction of the heat sink, the plurality of concave-convex structures separate the second distribution cavity into a plurality of sub-distribution cavities arranged at intervals and separate the second confluence cavity into a plurality of sub-confluence cavities arranged at intervals, and the sub-distribution cavities and the sub-confluence cavities are arranged alternately along the length direction of the heat sink; At least one jet hole is formed on a portion of the jet plate located in each of the sub-distribution cavities, and at least one backflow hole is formed on a portion of the jet plate located in each of the sub-confluence cavities.

6. A power converter according to any of claims 3-5, characterized in that, The distribution hole is a plurality of distribution holes, and the plurality of distribution holes are arranged along the side wall of the first distribution cavity; the confluence hole is a plurality of confluence holes, and the plurality of confluence holes are arranged along the side wall of the first confluence cavity.

7. A power converter according to any of claims 3-6, characterized in that, The heat sink also comprises a flow resistance tooth, which is located in the second distribution cavity, connected with the jet plate and protrudes in the direction of the jet plate facing the cover.

8. A power converter as claimed in any of claims 3 to 7, characterised in that, The heat sink also comprises a first flow guide strip, which is arranged in the first distribution cavity, and the extension direction of the first flow guide strip is the direction of the inlet opening towards at least one distribution hole.

9. A power converter according to any of claims 3-8, characterized in that The cover comprises a partition plate and a cover plate, the second distribution cavity and the second flow cavity are formed between the partition plate and the jet plate, the cover plate is located on the side of the partition plate away from the jet plate, and the first distribution cavity and the first flow cavity are formed between the cover plate and the partition plate. The liquid inlet opening and the liquid outlet opening are both arranged on the cover plate.

10. A power converter as claimed in any of claims 3 to 9, characterised in that, The at least one heat sink comprises a first heat sink and a second heat sink, the first heat sink comprises a first jet plate and a first bottom plate, the second heat sink comprises a second jet plate and a second bottom plate, and the first heat sink and the second heat sink share the cover. The first bottom plate, the first jet plate, the cover, the second jet plate and the second bottom plate are sequentially stacked in a first direction, part of the power devices are arranged on the side of the first bottom plate away from the cover, and the other part of the power devices are arranged on the side of the second bottom plate away from the cover. In the first direction, the distribution hole and the flow hole are arranged on both sides of the cover, the liquid inlet opening and the liquid outlet opening are arranged on the side wall of the cover, the liquid inlet opening is communicated with the first distribution cavity, and the liquid outlet opening is communicated with the first flow cavity.

11. A power converter as claimed in any of claims 3 to 9, characterised in that, The at least one heat sink comprises a first heat sink and a second heat sink, the first heat sink and the second heat sink are arranged on opposite sides of the power device respectively, and the bottom plate of the first heat sink and the bottom plate of the second heat sink are connected with the power device respectively.

12. The power converter of claim 10 or 11, wherein, The heat sink further comprises: The liquid inlet flow channel is arranged on the first side of the cover in a direction parallel to the bottom plate, the liquid inlet opening is arranged on the first side of the cover, and the liquid inlet flow channel is communicated with the liquid inlet opening; The liquid outlet flow channel is arranged on the second side of the cover in a direction parallel to the bottom plate, the liquid outlet opening is arranged on the second side of the cover, and the liquid outlet flow channel is communicated with the liquid outlet opening; The port of the liquid inlet flow channel away from the liquid inlet opening and the port of the liquid outlet flow channel away from the liquid outlet opening are in the same direction, and the first heat sink and the second heat sink share the liquid inlet flow channel and the liquid outlet flow channel.

13. The power converter of any of claims 3-12, wherein, The heat sink further comprises a flow resistance wall, the flow resistance wall is located in the heat dissipation cavity and connected with the bottom plate, and the flow resistance wall divides the heat dissipation cavity into a plurality of heat dissipation sub-cavities, each heat dissipation sub-cavity is communicated with at least one jet hole and at least one backflow hole.

14. The power converter of any of claims 1-13, wherein, The heat sink further comprises a heat dissipation tooth, the heat dissipation tooth is located in the heat dissipation cavity and connected with the bottom plate; The vertical projection of the jet hole on the bottom plate and the vertical projection of the heat dissipation tooth on the bottom plate do not overlap.

15. The power converter of any of claims 3-14, wherein, The heat sink further comprises a liquid inlet flow channel and a liquid outlet flow channel, the liquid inlet flow channel is communicated with the liquid inlet opening, the liquid outlet flow channel is communicated with the liquid outlet opening, and the ports of the liquid inlet flow channel and the liquid outlet flow channel are both away from the heat sink in the stacking direction of the heat sink and the power device. The power converter further comprises a capacitor, along the stacking direction of the heat sink and the power device, the capacitor, the inlet liquid flow channel port and the outlet liquid flow channel port are located on the same side of the heat sink.

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