Laser marking device, and substrate processing system and substrate processing method using same

Abstract

A laser marking device is disclosed. The laser marking device according to one embodiment of the present invention may comprise: a laser head having a laser irradiation unit capable of irradiating a laser; and a substrate moving module capable of moving the position of a substrate so that one side surface of the substrate faces the laser irradiation unit.

Description

Laser marking device and substrate processing system and substrate processing method using the same

[0001] The present invention relates to a substrate processing technology, and more specifically, to a laser marking device and a substrate processing system and substrate processing method using the same.

[0002]

[0003] Substrates undergo a variety of processes, including depositing thin films or etching these deposited films to form circuit patterns. While these processes are being performed, the substrate's manufacturing history needs to be managed, including tracking the substrate's movement during the process.

[0004] Korean Patent Registration No. 10-1355430 (publication date: January 20, 2014) discloses a method for managing the history of a printed circuit board by inserting a two-dimensional barcode into a second area of ​​the printed circuit board where no components are mounted. However, when a circuit pattern layer or the like is formed on the printed circuit board to form a laminate, the two-dimensional barcode on the second area is also covered by the circuit pattern layer, making it difficult to search the two-dimensional barcode information in the subsequent lamination process, resulting in difficulties in managing the board history.

[0005]

[0006] The technical problem to be solved by the present invention relates to a laser marking device capable of individually identifying each substrate unit and confirming the substrate history during the manufacturing process even when a film is formed on the upper and lower surfaces of the substrate during the manufacturing process, and a substrate processing system and substrate processing method using the same.

[0007]

[0008] To solve the above technical problem, the present invention provides a laser marking device.

[0009] A laser marking device according to one embodiment of the present invention may include a laser head having a laser irradiation unit capable of irradiating a laser; and a substrate movement module capable of positionally moving the substrate so that one side of the substrate faces the laser irradiation unit.

[0010] According to one embodiment, the substrate moving module may include a picker capable of absorbing one surface of the substrate; and a lifting mechanism extended from an end of the picker and capable of positionally moving the substrate in a first direction.

[0011] According to one embodiment, the substrate moving module may further include a rotation mechanism provided between the picker and the lifting / lowering mechanism, the rotation mechanism being capable of rotating the substrate about the first direction as a rotation axis so that the other side of the substrate faces the laser irradiation unit.

[0012] According to one embodiment, the pickers are arranged in pairs with a gap in a second direction orthogonal to the first direction, and the laser irradiation unit may have a length that can face each of one side of the substrate arranged side by side in the second direction.

[0013] According to one embodiment, the substrate further includes a housing having an entrance and exit that can be taken out and taken out, a UV-blocking housing, and a camera disposed inside the housing, wherein the laser may be a laser having an ultraviolet wavelength range.

[0014] To solve the above technical problem, the present invention provides a substrate processing system.

[0015] A substrate processing system according to one embodiment of the present invention comprises: a conveyor capable of moving a loaded substrate in one direction; a laser marking device capable of marking substrate information on the substrate removed from the conveyor; and a transport robot that picks up the substrate returned to the conveyor and transports it to a post-processing facility, wherein the laser marking device may be the laser marking device according to any one of claims 1 to 4.

[0016] To solve the above technical problem, the present invention provides a substrate processing method.

[0017] A substrate processing method according to one embodiment of the present invention may include a substrate loading step of loading an input substrate onto a conveyor; a first transport step of stopping the operation of the conveyor so that the transported substrate is positioned at a first position; a substrate information marking step of marking substrate information on the substrate separated from the conveyor; and a second transport step of returning the substrate marked with the substrate information to the conveyor and restarting the conveyor.

[0018] According to one embodiment, the substrate information marking step includes: a first moving step of moving the substrate located at the first position from a first direction to a second position; a first laser irradiation step of irradiating a laser to a first side of the substrate at the second position; a rotation step of rotating the substrate about the first direction as a rotation axis; and

[0019] It may include a second laser irradiation step of irradiating a laser to the second side of the substrate.

[0020]

[0021] According to an embodiment of the present invention, by marking substrate information on one side of the substrate with a laser head, there is an advantage in that individual tracking and management of the movement path for each substrate is possible in the entire process of the substrate processing system.

[0022] According to one embodiment of the present invention, there is an advantage in that the history of the substrate can be managed even after a film is formed on the substrate by not marking substrate information on the upper or lower surface of the plate-shaped substrate.

[0023] According to another embodiment of the present invention, by irradiating a laser to mark substrate information on the side of the substrate, the substrate information is not lost even under high temperature and high pressure conditions, and there is an advantage of increasing the utilization of the side of the substrate, which is an idle area on a thin and light substrate.

[0024] According to another embodiment of the present invention, a substrate can be moved from and returned to a conveyor by a substrate movement module, and substrate information can be marked on both sides of the substrate, thereby simplifying process equipment, simplifying the movement line, increasing space utilization, and further reducing costs.

[0025]

[0026] FIG. 1 is a perspective view schematically showing a substrate processing system according to one embodiment of the present invention.

[0027] FIG. 2 is a front view schematically showing a substrate processing system according to one embodiment of the present invention.

[0028] FIG. 3(a) is a drawing schematically showing an operation of marking substrate information on a substrate using a laser marking device according to one embodiment of the present invention, FIG. 3(b) is a drawing showing a substrate on which substrate information is marked by first laser irradiation according to one embodiment of the present invention, and FIG. 3(c) is a drawing showing a substrate on which substrate information is marked by second laser irradiation according to one embodiment of the present invention.

[0029] FIGS. 4(a) to 4(f) are drawings schematically showing a substrate processing method according to one embodiment of the present invention.

[0030] Figure 5 is a flowchart showing a substrate processing method according to one embodiment of the present invention.

[0031] FIG. 6 is a flowchart showing in more detail a substrate information marking step according to one embodiment of the present invention.

[0032]

[0033] 1: Substrate processing system

[0034] 10: Conveyor

[0035] 20: Laser marking device

[0036] 100: Laser head 110: Laser irradiation unit

[0037] 200: Substrate moving module 210: Picker

[0038] 220: Elevating mechanism 230: Rotating mechanism

[0039] 300: Housing 310: Entry / Exit

[0040] 400: Camera

[0041] 30: Transport robot

[0042] S: Board ID: Board information

[0043]

[0044] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed content is thorough and complete and to sufficiently convey the spirit of the present invention to those skilled in the art.

[0045] In this specification, when a component is referred to as being on another component, it means that it can be formed directly on the other component, or a third component may be interposed between them. In addition, in the drawings, shapes and sizes are exaggerated for the purpose of effectively explaining the technical contents.

[0046] Additionally, although terms such as first, second, and third have been used to describe various components in various embodiments of this specification, these components should not be limited by these terms. These terms are merely used to distinguish one component from another. Thus, what is referred to as a first component in one embodiment may be referred to as a second component in another embodiment. Each embodiment described and illustrated herein also includes its complementary embodiments. Furthermore, the term "and / or" has been used herein to mean including at least one of the components listed before and after.

[0047] In the specification, singular expressions include plural expressions unless the context clearly dictates otherwise. In addition, terms such as "comprise" or "have" are intended to specify the presence of a feature, number, step, component, or combination thereof described in the specification, and should not be construed as excluding the presence or addition of one or more other features, numbers, steps, components, or combinations thereof. In addition, the term "connection" is used in the present specification to mean both indirectly connecting multiple components and directly connecting them.

[0048] In addition, when describing the present invention below, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

[0049]

[0050] For convenience of explanation, the first direction refers to the Z-axis of the orthogonal coordinate system, the second direction refers to the Y-axis of the orthogonal coordinate system, and the third direction refers to the X-axis of the orthogonal coordinate system. In this case, the first, second, and third directions are orthogonal to each other.

[0051]

[0052] FIG. 1 is a perspective view schematically showing a substrate processing system (1) according to one embodiment of the present invention, FIG. 2 is a front view schematically showing a substrate processing system (1) according to one embodiment of the present invention, FIG. 3(a) is a drawing schematically showing an operation of marking substrate information (ID) on a substrate (S) with a laser marking device (20) according to one embodiment of the present invention, FIG. 3(b) is a drawing showing a substrate (S) on which substrate information (ID) is marked by first laser irradiation according to one embodiment of the present invention, FIG. 3(c) is a drawing showing a substrate (S) on which substrate information (ID) is marked by second laser irradiation according to one embodiment of the present invention, and FIGS. 4(a) to 4(f) are drawings schematically showing a substrate processing method according to one embodiment of the present invention.

[0053]

[0054] Hereinafter, the configuration and operational relationship of a substrate processing system (1) according to one embodiment of the present invention will be examined with reference to FIGS. 1 to 4(f).

[0055]

[0056] Referring to FIGS. 1 to 4(f), the substrate processing system (1) marks substrate information (ID) on the substrate (S) during the transport process, and then can be retransported to the post-processing facility (40), which is a subsequent processing facility. More specifically, the substrate processing system (1) marks substrate information (ID) on the substrate (S) during the process of transporting the substrate (S) introduced into the processing facility (not shown) to the conveyor (10), so that each substrate (S) can be individually tracked and managed throughout the entire process of the substrate processing system (1).

[0057]

[0058] The substrate processing system (1) may include a conveyor (10), a marking device (20), and a transfer robot (30).

[0059] The conveyor (10) can move the substrate (S) brought into the substrate processing system (1) in one direction. The conveyor (10) can individually transport the substrate (S) in units of individual sheets of substrate. The one direction may mean the third direction, i.e., the X-axis direction, but is not limited thereto.

[0060]

[0061] Referring to FIGS. 1 and 2, a laser marking device (20) can mark substrate information (ID) on a substrate (S) that has been removed from a conveyor (10). The laser marking device (20) can be positioned at the front end of a series of post-processing facilities (40) as the first equipment configuration of a substrate processing system (1).

[0062] The laser marking device (20) includes a laser head (100) and a substrate movement module (200), and may further include a housing (300), a camera (400), a substrate detection sensor (500), and a dust collector (600).

[0063]

[0064] Referring to FIGS. 1 to 4(f), the substrate (S) may be a thin film-shaped substrate. The substrate (S) may be a base material on which at least one film is formed according to the process of the post-processing equipment (40). After the process of the post-processing equipment (40), the substrate (S) may be a laminate in which at least two films are laminated. After the process of the post-processing equipment (40), the upper surface and / or lower surface of the substrate (S) may be difficult to identify with the naked eye due to the formed film.

[0065] The substrate information (ID) may be an identification code of the substrate (S). The substrate information (ID) may include the type, thickness, size, manufacturer history, manufacturing date, usage location, identification information with respect to other substrates (S), etc. of the substrate (S). According to one embodiment, the substrate information (ID) may include information that can individually track and manage good or defective substrates (S) in the event of a process defect in various processes including the post-processing equipment (40).

[0066] The substrate information (ID) may be provided on at least two sides of the substrate (S). At least one substrate information (ID) may be marked on the side on which the substrate information (ID) is provided.

[0067]

[0068] Referring to FIG. 2 and FIG. 4(c) and FIG. 4(e), the laser head (100) may include a laser irradiation unit (110).

[0069] The laser irradiation unit (110) may be positioned to irradiate a laser in a third direction. The laser irradiation unit (110) may irradiate a laser in the ultraviolet spectrum. More specifically, the laser irradiation unit (110) may irradiate ultraviolet rays in the wavelength range of 320 nm to 400 nm.

[0070] The laser irradiation unit (110) may have a length corresponding to the width of a pair of substrates (S). The laser irradiation unit (110) may have a length that can face each side of a pair of substrates (S) arranged side by side in the second direction. Since the laser irradiation unit (110) has a length corresponding to the width of a pair of substrates (S), the position of the laser head (100) is fixed, and substrate information can be marked on the substrates (S) in units of individual substrates (S) for a pair of substrates (S) moved to a position by the substrate movement module (200).

[0071] The laser head (100) can be fixedly positioned at a first height. The fixedly positioned laser head (100) can irradiate laser to at least two surfaces of the substrate (S).

[0072]

[0073] Referring to FIG. 2, the substrate movement module (200) can move the substrate (S) so that one side of the substrate (S) faces the laser irradiation unit (110). The substrate movement module (200) can move the substrate (S) to a first height. At the first height, the substrate (S) can face the laser irradiation unit (110).

[0074] The substrate moving module (200) includes a picker (210) and a lifting mechanism (220), and may further include a rotating mechanism (230).

[0075]

[0076] Referring to FIG. 2 and FIG. 4(b) and FIG. 4(e), the picker (210) can adsorb one surface of the substrate (S). The picker (210) can adsorb one area of ​​the substrate (S) at a vacuum pressure lower than atmospheric pressure. A plurality of pickers (210) can be provided spaced apart from each other to adsorb a single sheet of substrate (S). According to one embodiment, four pickers (210) can be spaced apart from each other to correspond to the size of the substrate (S) and adsorb the upper surface of the corner of the substrate (S), but are not limited thereto.

[0077] A bellows may be formed at the end joint of the picker (210). As the shape of the picker (210) flexibly changes when the picker (210) adsorbs or releases the substrate (S) due to a pressure difference, a gap between the substrates (S) can be provided, thereby providing a stable adsorption force for the substrate (S).

[0078] The pickers (210) may be arranged at intervals in the second direction so that a plurality of them may form a pair.

[0079] A pair of pickers (210) can move in synchronization with each other. A pair of substrates (S) are supported on a pair of pickers (210) at intervals in the second direction and can be moved simultaneously by a lifting mechanism (220) and / or a rotating mechanism (230).

[0080]

[0081] Referring to FIGS. 2 and 4(a) and 4(b), an elevation mechanism (220) may be provided to extend to an end of a picker (210). The elevation mechanism (220) may move a substrate (S) in a first direction. According to one embodiment, the elevation mechanism (220) may move the substrate (S) in a predetermined section in the first direction. One point of the section moved in position by the elevation mechanism (220) may be a first position (second height) on the conveyor (10), and another point of the section moved in position by the elevation mechanism (220) may be the first height. The elevation mechanism (220) may translate the substrate (S) in a section between the first height and the second height.

[0082] According to one embodiment, the lifting mechanism (220) may be, but is not limited to, a lifting / lowering cylinder.

[0083]

[0084] Referring to FIG. 2 and FIG. 4(d) and FIG. 4(f), a rotation mechanism (230) may be provided to extend to an end of a picker (210). The rotation mechanism (230) may be provided between the picker (210) and the elevation mechanism (220). The rotation mechanism (230) may rotate the substrate (S) about the first direction as the rotation axis so that the other side of the substrate (S) faces the laser irradiation unit (110).

[0085] The rotating mechanism (230) can rotate the substrate (S) with the first direction as the rotation axis. According to one embodiment, the laser irradiation unit (110) can face two of the four side surfaces of the plate-shaped substrate (S) by the rotating mechanism (230). Preferably, the rotating mechanism (230) can rotate a pair of substrates (S) simultaneously with the first direction as the rotation axis in 180-degree increments.

[0086] The rotating mechanism (230) can rotate the substrate (S) in units of 180 degrees with the first direction as the rotation axis. The rotating mechanism (230) can rotate the substrate (S) in units of 180 degrees with the first direction as the rotation axis for n times (n is a natural number). According to one embodiment, by rotating the substrate (S) in the first direction with the rotation axis by the rotating mechanism (230), the substrate (S) can be rotated 180 degrees based on the direction in which it was introduced into the conveyor (10) and then taken out of the conveyor (10). According to one embodiment, by rotating the substrate (S) in the first direction with the rotation axis twice by the rotating mechanism (230), the substrate (S) can be rotated so that the direction of the substrate (S) is positioned in the direction in which the substrate (S) faces when separated from the conveyor (10).

[0087] According to one embodiment, the rotating mechanism (230) may be, but is not limited to, a rotating cylinder.

[0088]

[0089] Referring to FIGS. 2, 4(c), and 4(e), the housing (300) can block ultraviolet rays. The housing (300) can shield the laser marking space from the outside so that the laser irradiated from the laser irradiation unit does not leak out. An ultraviolet blocking agent can be applied to the inner wall of the housing (300).

[0090] A loading / unloading port (310) may be formed in the housing (300). The loading / unloading port (310) may be formed on one side of the housing (300). Through the loading / unloading port (310), a substrate (S) on a conveyor (10) may be loaded / unloaded into the housing (300). The loading / unloading port (310) is opened toward the conveyor (10), so that even if a laser is irradiated by the laser head (100), the laser may not be exposed to an external worker.

[0091]

[0092] Referring to FIG. 2 and FIG. 4(c) and FIG. 4(e), the camera (400) can be placed inside the housing (300). The camera (400) can provide image information inside the housing (300) shielded from the outside to the outside.

[0093] The camera (400) may include a lighting unit (not shown). The lighting unit (not shown) may create a bright atmosphere within the housing (300) to enhance the accuracy of the image information of the camera (400). The lighting unit (not shown) may not interfere with the laser irradiation of the laser head (100).

[0094]

[0095] Referring to FIG. 2 and FIG. 4(c) and FIG. 4(e), the substrate detection sensor (500) can detect whether the substrate (S) is positioned at a first height. The substrate detection sensor (500) can detect whether the substrate (S) moved by the substrate movement module (200) is positioned at the first position.

[0096]

[0097] Referring to FIG. 2 and FIG. 4(c) and FIG. 4(e), the dust collector (600) can capture and remove substances such as dust and gas generated in the internal space of the housing (300). The dust collector (600) can improve the air quality within the housing (300). According to one embodiment, the dust collector (600) can include an intake port, a filtering system, and an exhaust port.

[0098]

[0099] Referring to FIGS. 1 and 2, the transport robot (30) can pick up the substrate (S) returned from the laser marking device (20) to the conveyor (10) and transport it to the post-processing equipment (40).

[0100]

[0101] FIG. 4(a) to FIG. 4(f) are drawings schematically showing a substrate processing method according to one embodiment of the present invention, FIG. 5 is a flowchart showing a substrate processing method according to one embodiment of the present invention, and FIG. 6 is a flowchart showing a substrate information marking step according to one embodiment of the present invention in more detail.

[0102]

[0103] Hereinafter, a substrate processing method using a substrate processing system according to one embodiment of the present invention will be described in detail in a time series manner.

[0104]

[0105] Referring to FIGS. 4(a) to 4(f) and FIGS. 5 and 6, the substrate processing method may include a substrate loading step (S10), a first transfer step (S20), a substrate information marking step (S30), and a second transfer step (S40).

[0106]

[0107] Referring to Fig. 5, in the substrate loading step (S10), the loaded substrate can be loaded onto a conveyor.

[0108]

[0109] Referring to FIGS. 4(a) and 4(b) and FIG. 5, in the first transport step (S20), the operation of the conveyor can be stopped so that the transported substrate is positioned at a first position. The first position may be a position facing the laser marking device on a conveyor having a length in the third direction.

[0110]

[0111] Referring to FIGS. 4(c) to 4(e) and FIGS. 5 and 6, in the substrate information marking step (S30), substrate information can be marked on a substrate separated from a conveyor.

[0112] According to one embodiment, the substrate information marking step (S30) includes a first movement step (S210), a first laser irradiation step (S220), a rotation step (S230), a second laser irradiation step (S240), and may further include a re-rotation step and a second movement step.

[0113] According to one embodiment, the substrate information marking step (S30) includes a first movement step (S210), a first laser irradiation step (S220), a rotation step (S230), a second laser irradiation step (S240), and may further include a second movement step.

[0114]

[0115] Referring to FIG. 4(b) and FIG. 6, in the first movement step (S210), the substrate positioned at the first position can be moved to the second position in the first direction.

[0116] The second position may be a position facing the laser irradiation unit in the first direction. The second position may mean a position equal to the first height in the first direction.

[0117]

[0118] Referring to FIG. 4(c) and FIG. 6, in the first laser irradiation step (S220), a laser can be irradiated to the first side of the substrate at the second position. In the first laser irradiation step (S220), as illustrated in FIG. 3(b), a laser can be irradiated to the first side of the substrate to mark substrate information.

[0119]

[0120] Referring to FIG. 4(d) and FIG. 6, in the rotation step (S230), the substrate can be rotated with the first direction as the rotation axis. In the rotation step (S230), the first side on which the substrate information facing the laser irradiation unit is marked can be rotated 180 degrees so that the second side, which is opposite to the first side, faces the laser irradiation unit.

[0121]

[0122] Referring to FIG. 4(e) and FIG. 6, in the second laser irradiation step (S240), a laser may be irradiated to the second side of the substrate. The second side may be the opposite side facing the first side of the substrate. In the second laser irradiation step (S240), a laser may be irradiated to the second side of the substrate to mark substrate information.

[0123]

[0124] Referring to FIG. 4(f), in the re-rotation step, the substrate may be re-rotated with the first direction as the rotation axis. According to one embodiment, in the re-rotation step, the substrate may be re-rotated with the first direction as the rotation axis so that the substrate is positioned in the positive direction for transporting the substrate with substrate information marked thereon to a post-processing facility. According to one embodiment, the re-rotation step may not be included.

[0125]

[0126] In the second movement step, the substrate positioned at the second position can be moved to the first position in the first direction.

[0127]

[0128] Referring to FIG. 5, in the second transport step (S40), the substrate on which the substrate information is marked can be returned to the conveyor, and the conveyor can be re-operated.

[0129]

[0130] While the present invention has been described in detail using preferred embodiments, the scope of the present invention is not limited to the specific embodiments and should be construed in accordance with the appended claims. Furthermore, those skilled in the art will appreciate that numerous modifications and variations are possible without departing from the scope of the present invention.

Claims

1. A laser head having a laser irradiation unit capable of irradiating a laser; and A laser marking device comprising a substrate moving module capable of moving the substrate so that one side of the substrate faces the laser irradiation unit.

2. In paragraph 1, The above substrate moving module, A picker capable of absorbing one surface of the substrate; and A laser marking device comprising an elevating mechanism provided at an end of the picker and capable of moving the substrate in a first direction.

3. In paragraph 2, The above substrate moving module, A laser marking device further comprising a rotation mechanism provided between the picker and the lifting / lowering mechanism, the rotation mechanism being capable of rotating the substrate about the first direction as a rotation axis so that the other side of the substrate faces the laser irradiation unit.

4. In paragraph 2, The above pickers are arranged in pairs with intervals in a second direction orthogonal to the first direction, A laser marking device, wherein the laser irradiation unit has a length that can be opposed to each of one side of the substrate arranged in parallel in the second direction.

5. In paragraph 1, A housing having an entrance and exit that allows the substrate to be taken out and a UV-blocking housing; and Further comprising a camera disposed inside the housing, The above laser is a laser marking device having an ultraviolet wavelength range.

6. A conveyor capable of moving the imported substrate in one direction; and A laser marking device capable of marking substrate information on the substrate detached from the conveyor; Including a transport robot that picks up the substrate returned to the conveyor and transports it to a post-processing facility, A substrate processing system, wherein the laser marking device is a laser marking device according to any one of claims 1 to 4.

7. Substrate loading step for loading the loaded substrate onto the conveyor; A first transport step of stopping the operation of the conveyor so that the transported substrate is positioned at a first position; A substrate information marking step for marking substrate information on the substrate separated from the conveyor; and A substrate processing method comprising a second transport step of returning the substrate on which the substrate information is marked to the conveyor and re-operating the conveyor.

8. In paragraph 7, The above substrate information marking step is, A first moving step of moving the substrate located at the first position to a second position in the first direction; A first laser irradiation step of irradiating a laser to a first side of the substrate on the second position; A rotation step of rotating the substrate around the first direction as a rotation axis; and A substrate processing method, comprising a second laser irradiation step of irradiating a laser to a second side of the substrate.

Images