Vapor chamber and electronic device

Abstract

The present invention relates to the field of electronic devices. Provided are a vapor chamber and an electronic device, which are configured to integrate functions of a circuit board into a first cover plate of the vapor chamber. The vapor chamber has a heat dissipation effect and a signal transmission effect, and is conducive to realizing thinning and lightening of the electronic device. The vapor chamber comprises the first cover plate and a second cover plate, wherein the first cover plate comprises at least one base material layer and at least one conductive material layer that are arranged in a stacked manner, with a signal transmission line provided within the at least one conductive material layer; the second cover plate is hermetically connected to at least part of the first cover plate to form a sealed cavity; and a cooling working medium is provided in the sealed cavity.

Description

Heat plate and electronic device

[0001] The present application claims priority from the Chinese patent application No. 202411005715.6 filed on July 24, 2024, and entitled "Heat plate and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the field of electronic devices, in particular to a heat plate and an electronic device. BACKGROUND

[0003] With the development of technology and the continuous improvement of living standards, people's demand for the thinness of electronic devices is also increasing. Thinness not only reduces the use cost of electronic devices, but also improves their aesthetic and comfort.

[0004] The heat plate in the electronic device can dissipate heat from the electronic components in the electronic device, and the circuit board in the electronic device can connect signals of different electronic components in the electronic device. The heat plate and the circuit board are usually stacked, which results in a large total size of the heat plate and the circuit board in the thickness direction, which is not conducive to the thinness of the electronic device. SUMMARY

[0005] Embodiments of the present application provide a heat plate and an electronic device, which integrate the signal transmission function of the circuit board in the first cover plate of the heat plate, so that the heat plate has heat dissipation and signal transmission effects, which is conducive to the thinness of the electronic device.

[0006] In a first aspect, a heat plate is provided. The heat plate includes a first cover plate and a second cover plate. The first cover plate includes at least one base material layer and at least one conductive material layer stacked together, and the at least one conductive material layer is provided with a signal transmission line (for example, the signal transmission line is used to transmit electrical signals, and the signal transmission line can be a patterned copper foil). The second cover plate is sealingly connected to at least part of the first cover plate to form a sealed cavity, and the sealed cavity is provided with a cooling working medium for heat dissipation.

[0007] The sealed connection of the second cover plate and the first cover plate forms a sealed cavity, and the cooling working medium in the sealed cavity can achieve heat dissipation, so that the vapor chamber has good heat dissipation effect; the first cover plate includes a base material layer and a conductive material layer which are stacked, and the conductive material layer is provided with a signal transmission circuit, so that the vapor chamber has good signal transmission effect; in this way, the vapor chamber can not only achieve heat dissipation for the electronic device in contact with the vapor chamber, but also achieve signal transmission through the signal transmission circuit in the first cover plate. Compared with the conventional way of stacking the vapor chamber and the circuit board, the embodiment of the present application integrates the function of the circuit board in the first cover plate of the vapor chamber, and realizes the function of the signal transmission circuit in the circuit board by sharing the conductive material layer in the first cover plate, so that the vapor chamber provided by the embodiment of the present application is applied to the electronic device, and is conducive to realizing the thinness of the electronic device. In addition, in the process of signal transmission through the signal transmission circuit, heat will be generated in the first cover plate, and at least part of the first cover plate is directly in contact with the cooling working medium, so that the heat in the first cover plate can be quickly and effectively dissipated.

[0008] In a possible implementation, the first cover plate is arranged on one side of the second cover plate, and the first cover plate and the second cover plate are sealingly connected to form a sealed cavity.

[0009] The first cover plate and the second cover plate are sealingly connected to form a sealed cavity, so that the signal transmission circuit in the conductive material layer of the first cover plate is directly opposite to the sealed cavity. In the process of signal transmission through the signal transmission circuit, the cooling working medium flowing through the sealed cavity can directly and effectively exchange heat with the signal transmission circuit, which is conducive to the timely dissipation of heat generated by the signal transmission circuit in the first cover plate.

[0010] In a possible implementation, the first cover plate includes a sealing area and an extension area; the sealing area and the second cover plate are sealingly connected to form a sealed cavity, and at least part of the extension area is provided with a signal transmission circuit, and the first cover plate is separated from the sealing connection with the second cover plate at the position where the sealing area and the extension area meet. That is, the first cover plate is connected only in the sealing area and the second cover plate, the sealing area of the first cover plate is mainly used to achieve heat dissipation effect, and the extension area of the first cover plate is mainly used to achieve signal transmission effect.

[0011] Therefore, on the one hand, from the heat dissipation perspective, the sealing area of the first cover plate and the second cover plate are sealingly connected to form a sealed cavity, and the cooling working medium in the sealed cavity can achieve a heat dissipation effect; from the signal transmission perspective, the signal transmission line is arranged in the extension area of the first cover plate, and the signal transmission line in the extension area can achieve a signal transmission effect, that is, the first cover plate can be used to achieve both the heat dissipation effect and the signal transmission effect; on the other hand, in the process of signal transmission in the extension area of the first cover plate, heat is generated in the signal transmission line in the extension area, and the heat in the extension area of the first cover plate is transmitted to the sealing area of the first cover plate through the conductive material layer, so that the extension area and the sealing area of the first cover plate can both dissipate heat, which is equivalent to expanding the heat dissipation area, and the larger heat dissipation area is conducive to improving the heat dissipation effect of the vapor chamber.

[0012] In a possible implementation, at least part of the sealing area is provided with the signal transmission line. That is, the sealing area and the extension area of the first cover plate can both be provided with the signal transmission line.

[0013] Therefore, on the one hand, the sealing area and the extension area of the first cover plate can both be provided with the signal transmission line, which can significantly increase the amount of wiring on the first cover plate, and under the condition that the amount of wiring is constant, the area where the signal transmission line can be arranged is increased, so that the impedance of the signal transmission line can be reduced by arranging a larger line width, or the signal interference between the signal transmission lines can be reduced by arranging a larger line spacing, which is conducive to improving the signal transmission effect; on the other hand, the sealing area of the first cover plate is in direct contact with the cooling working medium in the sealed cavity, and the cooling working medium can quickly dissipate the heat generated by the signal transmission line in the sealing area, which can further improve the heat dissipation effect of the vapor chamber.

[0014] In a possible implementation, the signal transmission line in the extension area is in communication with the signal transmission line in the sealing area. Therefore, the signal transmission line in the sealing area can share the signal power of the signal transmission line in the extension area, so as to avoid damage to the signal transmission line caused by transmission of a large-power signal in the signal transmission line in the extension area.

[0015] In a possible implementation, the signal power in the signal transmission line in the sealing area is greater than the signal power in the signal transmission line in the extension area. That is, the signal transmission line that generates more heat is arranged in the sealing area that is easier to dissipate heat, for example, the signal transmission line connected with the battery for charging and discharging can be arranged in the sealing area, so that when the battery is charged or discharged by a large current, the heat generated by the large current on the signal transmission line can be directly exchanged with the cooling working medium in the sealing area and dissipated in time, thereby avoiding damage to the electronic device or electronic component.

[0016] Therefore, assuming that the amount of wiring in the sealing area and the extending area is the same, according to Joule's law, the heat generated by the signal transmission line in the sealing area is obviously higher than that in the extending area, the sealing area of the first cover plate and the cooling working medium in the sealing cavity are in direct contact, and the signal transmission line with higher heat generation is arranged in the sealing area which is easier to dissipate heat, which is more conducive to dissipating heat in the first cover plate, and then the signal with greater signal power can be transmitted through the signal transmission line of the first cover plate.

[0017] In a possible implementation, the at least one substrate layer includes a first substrate layer, the at least one conductive material layer includes a first conductive material layer, and the second cover plate, the first conductive material layer and the first substrate layer are sequentially stacked.

[0018] Therefore, the second cover plate can protect one side of the signal transmission line in the first conductive material layer, and the first substrate layer can protect the other side of the signal transmission line in the first conductive material layer, so that oxidation and corrosion of the first conductive material layer can be effectively avoided, and damage to the signal transmission line in the first conductive material layer can be avoided.

[0019] In a possible implementation, the at least one substrate layer includes a first substrate layer, the at least one conductive material layer includes a first conductive material layer, and the second cover plate, the first substrate layer and the first conductive material layer are sequentially stacked; the first conductive material layer is provided with a first cover film away from one side of the first substrate layer, and the first cover film covers the signal transmission line in the first conductive material layer.

[0020] Therefore, the first substrate layer can protect one side of the signal transmission line in the first conductive material layer, and the first cover film can protect the other side of the signal transmission line in the first conductive material layer, so that oxidation and corrosion of the first conductive material layer can be effectively avoided, and damage to the signal transmission line in the first conductive material layer can be avoided.

[0021] In a possible implementation, a shielding layer is arranged on the side of the first cover film away from the signal transmission line, so that interference of signals transmitted in other electronic devices in the electronic device on the signals in the signal transmission line can be avoided.

[0022] In a possible implementation, the at least one substrate layer includes a first substrate layer, the at least one conductive material layer includes a first conductive material layer and a second conductive material layer, and the second cover plate, the first conductive material layer, the first substrate layer and the second conductive material layer are sequentially stacked; the second conductive material layer is provided with a first cover film away from one side of the first substrate layer, and the first cover film covers the signal transmission line in the second conductive material layer. That is, the first substrate layer can protect one side of the first conductive material layer and one side of the second conductive material layer.

[0023] Then, the first substrate layer can protect one side of the signal transmission line in the first conductive material layer, and the second cover plate can protect the other side of the signal transmission line in the first conductive material layer; the first substrate layer can protect one side of the signal transmission line in the second conductive material layer, and the first cover film can protect the other side of the signal transmission line in the second conductive material layer, and the first conductive material layer and the second conductive material layer are not easy to be oxidized and corroded, and the signal transmission line in the first conductive material layer and the second conductive material layer is not easy to be damaged.

[0024] In a possible implementation, the first cover plate has an opening groove facing away from the second cover plate, and the first cover film for protecting the signal transmission line is arranged in the groove.

[0025] Then, the first cover film is arranged in the groove formed by the first cover plate, and the first cover film can protect the signal transmission line in the conductive material layer of the first cover plate, avoid damage to the signal transmission line, and reduce the size of the vapor chamber in the thickness direction, which is conducive to the thinning of the electronic device.

[0026] In a possible implementation, the at least one substrate layer includes a first substrate layer, and the at least one conductive material layer includes a first conductive material layer, and the first conductive material layer is provided with a first cover film on a side away from the first substrate layer, and the first cover film covers the signal transmission line in the first conductive material layer.

[0027] Then, the first substrate layer can protect one side of the signal transmission line in the first conductive material layer, and the first cover film can protect the other side of the signal transmission line in the first conductive material layer, so as to effectively avoid oxidation and corrosion of the first conductive material layer and damage to the signal transmission line in the first conductive material layer.

[0028] In a possible implementation, the at least one substrate layer includes a first substrate layer, and the at least one conductive material layer includes a first conductive material layer and a second conductive material layer, and the first conductive material layer, the first substrate layer and the second conductive material layer are arranged in sequence; the first conductive material layer is provided with a first cover film on a side away from the first substrate layer, and the second conductive material layer is provided with a second cover film on a side away from the first substrate layer. That is, the first substrate layer can protect one side of the first conductive material layer and one side of the second conductive material layer.

[0029] Therefore, the first substrate layer can protect one side of the signal transmission line in the first conductive material layer, the first cover film can protect the other side of the signal transmission line in the first conductive material layer, the first substrate layer can protect one side of the signal transmission line in the second conductive material layer, and the second cover film can protect the other side of the signal transmission line in the second conductive material layer. The first conductive material layer and the second conductive material layer are not prone to oxidation and corrosion, and the signal transmission line in the first conductive material layer and the second conductive material layer is not prone to damage.

[0030] In a possible implementation, the substrate layer includes an organic polymer material. That is, the substrate layer has high flexibility.

[0031] Therefore, the substrate layer has excellent softness, high temperature resistance, insulation and other advantages, so that the first cover plate has high flexibility, can meet the design requirements of smaller size and higher density installation, and also helps to reduce the assembly process and enhance the reliability.

[0032] In a possible implementation, the extension area is provided with a bending-resistant layer on at least one side close to the sealing area.

[0033] In actual design requirements, the extension area may need to be bent or wound, and the like. The bending strength of the extension area close to the sealing area is required to be high. By providing the bending-resistant layer on at least one side of the extension area close to the sealing area, the bending strength of the extension area close to the sealing area can be improved, which is conducive to meeting the complex extension area setting scheme in actual design.

[0034] In a possible implementation, the material of the bending-resistant layer includes at least one of stainless steel, Teflon and Mylar. Therefore, the bending strength of the extension area close to the sealing area can be improved.

[0035] In a possible implementation, the sealed cavity includes alternating gas phase flow channels and liquid phase flow channels.

[0036] Therefore, the cooling working medium in the liquid phase can flow in the liquid phase flow channel (such as a capillary structure), and the cooling working medium in the gas phase can flow in the gas phase flow channel. The vapor chamber no longer needs to be provided with a liquid passage (such as a capillary structure) parallel to the thickness direction, which can further reduce the size of the vapor chamber in the vertical direction, and is conducive to the thinning of the electronic device.

[0037] In a second aspect, an electronic device is provided. The electronic device includes a middle frame and the vapor chamber of any possible implementation of the first aspect.

[0038] In a possible implementation, the electronic device further includes a display screen, and at least part of the vapor chamber is arranged between the middle frame and the display screen.

[0039] In a possible implementation, the middle frame is provided with a battery, and at least part of the vapor chamber is arranged on a side of the battery away from the middle frame.

[0040] The technical effects brought by any possible implementation of the second aspect can refer to the technical effects brought by different embodiments of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0042] FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application;

[0043] FIG. 2 is a schematic diagram of the position relationship between a vapor chamber and a circuit board according to an embodiment of the present application;

[0044] FIG. 3 is a schematic diagram of some vapor chambers according to an embodiment of the present application;

[0045] FIG. 4 is a schematic diagram of some other vapor chambers according to an embodiment of the present application;

[0046] FIG. 5 is a schematic diagram of some other vapor chambers according to an embodiment of the present application;

[0047] FIG. 6 is a schematic diagram of some other vapor chambers according to an embodiment of the present application;

[0048] FIG. 7 is a schematic diagram of some vapor chambers according to an embodiment of the present application, in which the first cover plate is provided with a groove;

[0049] FIG. 8 is a schematic diagram of some other vapor chambers according to an embodiment of the present application, in which the first cover plate is provided with a groove;

[0050] FIG. 9 is a schematic diagram of some other vapor chambers according to an embodiment of the present application, in which the first cover plate is provided with a groove;

[0051] FIG. 10 is a schematic diagram of some other vapor chambers according to an embodiment of the present application, in which the first cover plate is provided with a groove;

[0052] FIG. 11 is a schematic diagram of an electronic device including the vapor chamber shown in FIG. 10;

[0053] FIG. 12 is a schematic diagram of a cross section of the electronic device shown in FIG. 11 along the direction C1-C2 in some cases;

[0054] FIG. 13 is a schematic diagram of some other vapor chambers according to an embodiment of the present application;

[0055] FIG. 14 is a schematic view of a signal transmission line provided in the conductive material layer of the extended region according to an embodiment of the present application;

[0056] FIG. 15 is a schematic view of another heat plate according to an embodiment of the present application;

[0057] FIG. 16 is a schematic view of another heat plate according to an embodiment of the present application;

[0058] FIG. 17 is a schematic view of another heat plate according to an embodiment of the present application;

[0059] FIG. 18 is a schematic view of a signal transmission line provided in the conductive material layer of the extended region and the sealing region according to an embodiment of the present application;

[0060] FIG. 19 is a schematic view of another heat plate according to an embodiment of the present application;

[0061] FIG. 20 is a schematic view of another heat plate according to an embodiment of the present application;

[0062] FIG. 21 is a schematic view of another heat plate according to an embodiment of the present application;

[0063] FIG. 22 is a schematic view of another heat plate according to an embodiment of the present application;

[0064] FIG. 23 is a schematic view of another heat plate according to an embodiment of the present application;

[0065] FIG. 24 is a schematic view of an electronic device including the heat plate shown in FIG. 23 according to an embodiment of the present application;

[0066] FIG. 25 is a schematic view of a cross section of the electronic device shown in FIG. 24 along the direction C3-C4 in some cases according to an embodiment of the present application;

[0067] FIG. 26 is a schematic view of some electronic devices according to an embodiment of the present application.

[0068] FIG. 26 is a schematic view of some electronic devices according to an embodiment of the present application. DETAILED DESCRIPTION

[0069] With reference to the drawings and the embodiments disclosed herein, it will be understood that the embodiments described are merely examples of the application and should not be taken as limiting.

[0070] In the embodiments of the present application, the word "for example", "for instance" and the like is used to indicate an example, an illustration or an illustration. Any embodiment or design solution described as "for example" or "for instance" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design solutions. Rather, the word "for example", "for instance" and the like is used to present the relevant concept in a specific manner, so as to facilitate understanding.

[0071] The embodiments of the present application provide an electronic device. The electronic device is, for example, a consumer electronic product, a home electronic product, a vehicle-mounted electronic product, a financial terminal product, a communication electronic product. The consumer electronic product is, for example, a mobile phone, a pad, a notebook computer, an electronic reader, a personal computer (PC), a personal digital assistant (PDA), a desktop display, a smart wearable product (for example, a smart watch, a smart bracelet), a virtual reality (VR) electronic device, an augmented reality (AR) electronic device, a drone, and the like. The home electronic product is, for example, a smart door lock, a television, a remote controller, a refrigerator, a charging household small appliance (for example, a soybean milk machine, a sweeping robot), and the like. The vehicle-mounted electronic product is, for example, a vehicle-mounted navigation instrument, a vehicle-mounted high-density digital video disc (DVD), and the like. The financial terminal product is, for example, an automated teller machine (ATM) machine, a self-service terminal, and the like. The embodiments of the present application do not specially limit the specific form of the electronic device.

[0072] Please refer to FIG. 1, which is a structural schematic diagram of an electronic device 10 provided by the embodiments of the present application. For the convenience of description, the width direction of the electronic device 10 is defined as the X direction; the length direction of the electronic device 10 is defined as the Y direction; and the thickness direction of the electronic device 10 is defined as the Z direction. It can be understood that the coordinate system of the electronic device 10 can be flexibly set according to specific actual needs.

[0073] For the convenience of description, the electronic device is taken as a mobile phone as an example for illustration. The electronic device 10 can be a foldable mobile phone or a straight mobile phone, and the present application does not limit this. As shown in FIG. 1, the electronic device 10 can include a display screen 11, a middle frame 12, and a back shell 13. The middle frame 12 is located between the display screen 11 and the back shell 13, and the display surface of the display screen 11 faces away from the middle frame 12.

[0074] The display screen 11 is used to display images, videos, etc. The display screen 11 can be a flexible display screen or a rigid display screen. For example, the display screen 11 can be any one of an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light emitting diode (QLED) display screen, and a liquid crystal display (LCD).

[0075] The middle frame 12 has the function of supporting the whole machine. For example, the middle frame 12 can be used to carry card slots and keys, etc. In addition, the middle frame 12 can also include a high-thermal-conductivity material (such as aluminum), so that the middle frame has a high heat conduction rate, and the middle frame 12 can be used to dissipate heat in the electronic device 10 to the outside of the electronic device 10.

[0076] The back shell 13 can protect the electronic devices in the electronic device 10, prevent water vapor and / or dust from affecting the normal work of the electronic devices, and at the same time ensure the appearance neatness of the electronic device. The middle frame 12 can be adhered to the back shell 13 by adhesive. The middle frame 12 can also be an integral structure with the back shell 13, that is, the middle frame 12 and the back shell 13 are an integral structure. In addition, the material of the back shell 13 is not limited in the present application. For example, the material of the back shell 13 can be a conductive material such as metal. For example, the material of the back shell 13 can be a non-conductive material such as glass or plastic. When the material of the back shell 13 is a conductive material, the back shell 13 can serve as a reference ground for the electronic devices or radio frequency devices in the electronic device 10.

[0077] The electronic device 10 can further include a battery compartment provided with a battery 14, as shown in FIG. 2, which can be arranged on the middle frame 12. The battery 14, as an energy storage tool of the electronic device 100, can be a lithium battery, a nickel-hydrogen battery, or a sodium-ion battery, etc.

[0078] The electronic device 10 can further include a circuit board 15, as shown in FIG. 2, which plays an important role in the electronic device 10. For example, the circuit board 15 can be used to realize the connection and communication between different electronic devices in the electronic device 10, various complex circuits can be designed on the circuit board 15, so that the electronic device 10 can realize various functions, etc. The circuit board 15 can include rigid printed circuit boards (PCB), flexible printed circuit (FPC), rigid-flex PCB, etc.

[0079] In addition, with the continuous development of the electronic device 10, higher requirements are put forward for the multifunctionalization and high performance of the electronic device 10. The working power consumption and heat generation of the electronic device 10 also increase sharply, and the heat dissipation problem seriously limits the development and design of the electronic device 10. The existing heat dissipation methods include graphite material heat dissipation and vapor chamber heat dissipation. The graphite material heat dissipation can include extending graphite or graphene to the battery compartment area to dissipate heat for the battery 14 and other electronic devices. However, due to the low thermal conductivity of the graphite material, the heat dissipation effect of the graphite material is poor. The equivalent thermal conductivity of the vapor chamber (VC) is much higher than that of the graphite material, so the vapor chamber heat dissipation is an important means of high-efficiency heat dissipation in the current industry.

[0080] In some embodiments, as shown in FIG. 2, the electronic device 10 includes a vapor chamber 16, which includes two cover plates arranged oppositely and connected to form a sealed cavity (for example, the two cover plates can be connected to form a sealed cavity by welding, and the welding method can use low-temperature welding processes such as brazing, cold welding, pressure welding, diffusion welding, ultrasonic welding, electromagnetic pulse welding, etc. No solder can be used during welding, or a solder layer can be added). A cooling working medium is arranged in the sealed cavity, and the phase change of the cooling working medium can achieve a heat dissipation effect. It can be seen that the size of the sealed cavity is crucial to the heat dissipation effect of the vapor chamber 16. When the electronic device 10 is working, the circuit board 15 generates a lot of heat, and the vapor chamber 16 can be attached to the circuit board 15 to achieve rapid heat dissipation of the circuit board 15.

[0081] In some embodiments, as shown in (1) of FIG. 2, the middle frame 12 is provided with a hollow region, and a part of the circuit board 15 passes through the hollow region and is attached to the display screen 11. For example, the middle frame 12 is provided with a through hole in the thickness direction (Z direction), and the circuit board 15 can pass through the through hole of the middle frame 12 to realize signal connection between the display screen 11 and the battery 14 in the battery compartment (for example, a mainboard is arranged between the display screen 11 and the battery 14 in the battery compartment, and the display screen 11 can realize signal connection with the battery 14 through the mainboard; for another example, the display screen 11 can be directly connected with the battery 14 to realize signal connection between the display screen 11 and the battery 14), and the vapor chamber 16 can be arranged between the circuit board 15 and the battery 14 (for example, the vapor chamber 16 can be attached to the circuit board 15 and the battery 14 by adhesive). In other words, the battery 14, the vapor chamber 16 and the circuit board 15 are sequentially stacked. In another embodiment, as shown in (2) of FIG. 2, the middle frame 12 is provided with a hollow region, and a part of the circuit board 15 passes through the hollow region and is attached to the display screen 11. The battery 14 is located between the vapor chamber 16 and the circuit board 15, and the heat generated by the circuit board 15 is transferred to the middle frame 12, and then the middle frame 12 (the middle frame usually has a high heat conduction rate) transfers the heat to the adjacent vapor chamber 16, and finally the heat is dissipated by the vapor chamber 16. In other words, the vapor chamber 16, the middle frame 12, the battery 14 and the circuit board 15 are sequentially stacked. In yet another embodiment, as shown in (3) of FIG. 2, the circuit board 15 can also signal connect the mainboard 18 above the battery 14 and the subboard 17 below the battery, in other words, the vapor chamber 16, the middle frame 12, the battery 14 and the circuit board 15 are sequentially stacked. In yet another embodiment, the vapor chamber 16 can be attached to the side of the display screen 11 away from the display surface, and the circuit board 15 can be arranged on the side of the vapor chamber 16 away from the display screen 11, in other words, the display screen 11, the vapor chamber 16 and the circuit board 15 are sequentially stacked. Of course, according to design requirements, other stacking modes of the circuit board 15 and the vapor chamber 16 can also be included, and the embodiments of the present application do not limit this.

[0082] As can be seen from the above, in the thickness direction, the vapor chamber 16 and the circuit board 15 are usually stacked, and the size of the sealed cavity will affect the heat dissipation effect of the vapor chamber 16, so the vapor chamber 16 needs to ensure a certain thickness size to make the vapor chamber 16 have a better heat dissipation effect. In this way, the total size of the vapor chamber 16 and the circuit board 15 in the thickness direction (Z direction) is too large, which is not conducive to the thinning of the electronic device.

[0083] Based on this, the embodiments of the present application provide a vapor chamber, which aims to solve at least one of the above technical problems.

[0084] In some embodiments, referring to FIG. 3 and FIG. 4, the heat plate comprises: a first cover plate 100, the first cover plate 100 comprises a substrate layer and a conductive material layer arranged in a stack (for example, referring to FIG. 3 and FIG. 4, the first cover plate 100 comprises a first substrate layer 110 and a first conductive material layer 120 arranged in a stack), a signal transmission line is arranged in the conductive material layer (for example, referring to FIG. 3 and FIG. 4, a signal transmission line is arranged in the first conductive material layer 120), the signal transmission line can be arranged in a partial region of the conductive material layer or in the entire region of the conductive material layer; a second cover plate 200, the second cover plate 200 and at least part of the first cover plate 100 are sealingly connected to form a sealed cavity (for example, referring to FIG. 3, the second cover plate 200 can be sealingly connected with the first cover plate 100 to form a sealed cavity; for another example, referring to FIG. 4, the second cover plate 200 can be sealingly connected with part of the first cover plate 100 to form a sealed cavity); a cooling working medium, the cooling working medium (for example, water) is arranged in the sealed cavity.

[0085] In the heat plate described above, the second cover plate 200 and at least part of the first cover plate 100 are sealingly connected to form a sealed cavity, and a cooling working medium for heat dissipation is arranged in the sealed cavity, the heat plate can realize heat dissipation for the electronic device in contact with the heat plate, so that the heat plate has good heat dissipation effect; the first cover plate 100 comprises a substrate layer (the substrate layer can provide support for the conductive material layer) and a conductive material layer arranged in a stack, and a signal transmission line is arranged in at least part of the conductive material layer, so that the signal transmission line in the first cover plate 100 can realize good signal transmission effect. As can be seen, the heat plate can realize good heat dissipation effect and good signal transmission effect. Compared with the stack arrangement mode of the heat plate and the circuit board in the conventional design (for example, the battery 14, the heat plate 16 and the circuit board 15 in (1) of FIG. 2 are arranged in a stack; the heat plate 16, the middle frame 12, the battery 14 and the circuit board 15 in (2) of FIG. 2 are arranged in a stack; the heat plate 16, the middle frame 12, the battery 14 and the circuit board 15 in (3) of FIG. 2 are arranged in a stack), the present scheme integrates the function of the circuit board into the first cover plate of the heat plate, and shares the conductive material layer in the first cover plate 100 to realize the function of the signal transmission line in the circuit board. Therefore, when the heat plate provided by the embodiments of the present application is applied to the electronic device 10, it is beneficial to realize the thinness of the electronic device 10. In addition, in the process of signal transmission through the signal transmission line, heat will be generated in the first cover plate 100, and the cooling working medium in the sealed cavity will directly contact at least part of the first cover plate, so that the first cover plate 100 can be rapidly and effectively cooled.

[0086] In the embodiments of the present application, the signal transmission line can be used for transmitting an electrical signal. In some possible implementation manners, the signal transmission line can be at least one of a wire, an optical cable and an optical fiber. In another possible implementation manner, the step of forming the signal transmission line on the conductive material layer (such as the first conductive material layer 120 in FIGS. 3 and 4) includes: performing an exposure process, a development process, an etching process and the like on the conductive material layer to obtain the signal transmission line.

[0087] In some embodiments, the substrate layer (for example, the first substrate layer 110 in FIGS. 3 and 4) includes an organic polymer material; the substrate layer has excellent softness, high-temperature resistance, insulation and the like, so that the first cover plate 100 has extremely high flexibility, can meet the design needs of smaller and higher density installation, and also helps to reduce the assembly process and enhance the reliability; the first cover plate 100 can greatly reduce the volume and weight of the electronic device 10, and meets the needs of the development of the electronic device 10 in the direction of high density, miniaturization and high reliability. In some possible implementation manners, the organic polymer material can include at least one of polyimide (PI), polypropylene (PP), poly tetra fluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS) and polyamide (PA).

[0088] In some embodiments, the material of the conductive material layer (such as the first conductive material layer 120 in FIGS. 3 and 4) in the first cover plate can be copper, so that, from the perspective of signal transmission, the conductive material layer has excellent electrical conductivity, the signal transmission line in the conductive material layer has good signal transmission effect, from the perspective of heat dissipation, the conductive material layer has good thermal conductivity, and the conductive material layer has relatively high mechanical strength, which can significantly improve the overall mechanical properties of the heat plate, thereby improving the reliability of the heat plate.

[0089] In some embodiments, the sealed cavity is a cavity provided with the capillary structure 300 and capable of injecting the working medium. The heat dissipation principle of the vapor chamber can include four main steps of conduction, evaporation, convection and condensation. When the heat generated by the heat generating device (such as a battery) enters the vapor chamber through heat conduction, the cooling working medium near the heat source position of the heat generating device in the vapor chamber absorbs heat and vaporizes rapidly, while taking away a large amount of heat. By using the heat dissipation of the steam, when the steam in the vapor chamber diffuses from the high temperature zone to the low temperature zone, the steam contacts the inner wall with lower temperature and rapidly condenses into liquid and releases heat energy; the working medium condensed into liquid returns to the heat source of the heat generating device through the capillary structure 300, thereby completing a heat conduction cycle and forming a two-way circulation system of working medium vapor-liquid two-phase coexistence. For example, the capillary structure 300 can include a capillary core. The capillary core can be a mesh structure with dense through holes, such as a copper mesh, a stainless steel mesh, a woven mesh of organic materials, etc. The copper mesh can be sintered from copper powder, or the copper mesh can be woven from copper wire. In other embodiments, a plurality of support columns 210 can be provided on the first cover plate 100 and / or the second cover plate 200. For example, in FIGS. 3 and 4, a plurality of support columns 210 are provided on the inner wall surface of the second cover plate 200 close to the first cover plate 100, which can prevent the vapor chamber from collapsing and form a channel for the flow of cooling medium between the support columns 210 and the first cover plate 100.

[0090] In the embodiments of the present application, the vapor chamber shown in FIGS. 3, 5-10 is defined as a stacked vapor chamber, and the vapor chamber shown in FIGS. 4, 13, 15-17, 19-23 is defined as a parallel vapor chamber. The stacked vapor chamber and the parallel vapor chamber are only for more convenient description, and do not limit the positional relationship of the components in the vapor chamber.

[0091] According to the different arrangement positions of the substrate layer (for example, the first substrate layer 110 in FIGS. 3 and 4) and the conductive material layer (the first conductive material layer 120 in FIGS. 3 and 5, and the first conductive material layer 120 and the second conductive material layer 140 in FIG. 6), the vapor chamber (stacked) in the embodiments of the present application can be thus divided into the vapor chamber shown in FIGS. 3, 5 and 6; FIGS. 3, 5 and 6 do not limit the position, thickness and number of the substrate layer and the conductive material layer in the vapor chamber (stacked), and can also include other arrangement positions of the substrate layer and the conductive material layer, such as a vapor chamber formed by a plurality of substrate layers and a plurality of conductive material layers. The analysis idea is similar, and will not be described here.

[0092] In some embodiments, referring to FIG. 3, the vapor chamber includes: a first cover plate 100 and a second cover plate 200, the first cover plate 100 includes a first substrate layer 110 and a first conductive material layer 120, the first substrate layer 110 is disposed on one side of the first conductive material layer 120, the second cover plate 200 is disposed on a side of the first conductive material layer 120 away from the first substrate layer 110, the first conductive material layer 120 is provided with a signal transmission line, and the second cover plate 200 and the first cover plate 100 are sealingly connected to form a sealed cavity; and a cooling working medium, which is disposed in the sealed cavity.

[0093] Since the first conductive material layer 120 is disposed between the first substrate layer 110 and the second cover plate 200, first, the first substrate layer 110 can support the first conductive material layer 120, effectively avoiding oxidation and corrosion of the first conductive material layer 120, and also reducing the probability of damage to the signal transmission line in the first conductive material layer 120 due to external influences, second, the second cover plate 200 is disposed on a side of the first conductive material layer 120 away from the first substrate layer 110, which can also effectively avoid oxidation and corrosion of the first conductive material layer 120 and damage to the signal transmission line in the first conductive material layer 120, so that the vapor chamber has a better signal transmission effect. That is, the vapor chamber shown in FIG. 4 can not be provided with a first cover film to protect the signal transmission line in the first conductive material layer 120.

[0094] In some embodiments, referring to FIG. 5, the vapor chamber includes: a first cover plate 100 and a second cover plate 200, the first cover plate 100 includes a first substrate layer 110, a first conductive material layer 120, and a first cover film 130, the first substrate layer 110 is disposed on one side of the first conductive material layer 120, the second cover plate 200 is disposed on a side of the first substrate layer 110 away from the first conductive material layer 120, the first cover film 130 is disposed on a side of the first conductive material layer 120 away from the first substrate layer 110, the first conductive material layer 120 is provided with a signal transmission line, and the second cover plate 200 and the first cover plate 100 are sealingly connected to form a sealed cavity; and a cooling working medium, which is disposed in the sealed cavity. In some possible implementations, the first cover film 130 is bonded to a side of the first conductive material layer 120 away from the first substrate layer 110 through an adhesive layer.

[0095] If the coverlay 130 is not arranged on the side of the first conductive material layer 120 away from the first substrate layer 110, the side of the first conductive material layer 120 away from the first substrate layer 110 is directly in contact with air, which may cause the first conductive material layer 120 to be oxidized and corroded, and the signal transmission line in the first conductive material layer 120 may be damaged, resulting in a significant reduction in the signal transmission effect of the signal transmission line in the first conductive material layer 120. By arranging the first coverlay 130 on the side of the first conductive material layer 120 away from the first substrate layer 110, the oxidation and corrosion of the first conductive material layer 120 can be effectively avoided, and the damage to the signal transmission line in the first conductive material layer 120 can be avoided, so that the heat plate has a better signal transmission effect. That is, the heat plate shown in FIG. 5 needs to be provided with the first coverlay 130 to protect the signal transmission line in the first conductive material layer 120.

[0096] In some embodiments, the material of the first coverlay 130 includes at least one of polyester resin and polyurethane. The polyester resin has good transparency, insulation and mechanical strength, and can provide good insulation performance for the signal transmission line in the first conductive material layer 120. The polyurethane has good wear resistance, elasticity and waterproof performance, and can provide good waterproof performance and wear resistance for the signal transmission line in the first conductive material layer 120. For example, the material of the first coverlay 130 can be polyimide.

[0097] In some embodiments, referring to FIG. 6, the heat plate includes: a first cover plate 100 and a second cover plate 200, the first cover plate 100 includes a first conductive material layer 120, a first substrate layer 110, a second conductive material layer 140 and a first coverlay 130 which are sequentially stacked, the first substrate layer 110 is arranged between the first conductive material layer 120 and the second conductive material layer 140, the second cover plate 200 is arranged on the side of the first conductive material layer 120 away from the first substrate layer 110, the first coverlay 130 is arranged on the side of the second conductive material layer 140 away from the first substrate layer 110, the first conductive material layer 120 and / or the second conductive material layer 140 is provided with a signal transmission line, and the second cover plate 200 and the first cover plate 100 are sealingly connected to form a sealed cavity; and a cooling working medium arranged in the sealed cavity. At least part of the first conductive material layer 120 and / or at least part of the second conductive material layer 140 can be provided with a signal transmission line. In a possible implementation, if the second conductive material layer 140 is not provided with a signal transmission line, the first coverlay 130 can also not be arranged on the side of the second conductive material layer 140 away from the first substrate layer 110.

[0098] In this way, by arranging the first cover film 130 on the side of the second conductive material layer 140 away from the first base material layer 110, the oxidation and corrosion of the second conductive material layer 140 can be effectively avoided, and the signal transmission lines in the second conductive material layer 140 can be effectively protected from damage, so that the heat plate has better signal transmission effect. In addition, the second cover plate 200 is arranged on the side of the first conductive material layer 120 away from the first base material layer 110, which can also effectively avoid the oxidation and corrosion of the first conductive material layer 120, and the signal transmission lines in the first conductive material layer 120 can be effectively protected from damage.

[0099] In some embodiments, referring to FIGS. 7 and 8, the first cover plate 100 has a recess with an opening facing away from the second cover plate 200, and the first cover film 130 is arranged in the recess. At least part of the conductive area (the first conductive area 120a in FIG. 7 and the second conductive area 140a in FIG. 8) in the conductive material layer (the first conductive material layer 120 in FIG. 7 and the second conductive material layer 140 in FIG. 8) opposite the first cover film 130 can be provided with signal transmission lines. The conductive area can be provided with all or part of the signal transmission lines. The recess is described below with reference to FIGS. 7 and 8, which are only two examples and do not limit the position, size and number of the recess, and the material arranged in the recess.

[0100] For example, referring to FIG. 7, the heat plate includes a first cover plate 100 and a second cover plate 200. The first cover plate 100 includes a first base material layer 110, a first conductive material layer 120 and a first cover film 130. The first base material layer 110 is arranged on one side of the first conductive material layer 120, and the second cover plate 200 is arranged on the side of the first base material layer 110 away from the first conductive material layer 120. The first base material layer 110 and the first conductive material layer 120 in the first cover plate 100 each have a recess with an opening facing away from the second cover plate 200. The first cover film 130 can be arranged in the recess. At least part of the first conductive area 120a in the first conductive material layer 120 opposite the first cover film 130 can be provided with signal transmission lines. The second cover plate 200 and the first cover plate 100 are sealingly connected to form a sealed cavity, and a cooling working medium is arranged in the sealed cavity. The structure of the sealed cavity changes accordingly according to the structure of the recess in the first cover plate 100.

[0101] By arranging the recess with an opening facing away from the second cover plate 200 in the first cover plate 100 and arranging the first cover film 130 in the recess formed by the first cover plate 100, the first cover film 130 can protect the signal transmission lines in the first conductive area 120a and avoid damage to the signal transmission lines in the first conductive area 120a. In this way, the size of the heat plate in the thickness direction can be further reduced, which is conducive to the thinning of the electronic device 10.

[0102] For another example, referring to FIG. 8, the first base material layer 110, the first conductive material layer 120 and the second conductive material layer 140 in the first cover plate 100 each has a groove facing away from the second cover plate 200, the first cover film 130 can be arranged in the groove, and the first cover film 130 can be arranged with a signal transmission line facing at least part of the second conductive area 140a in the second conductive material layer 140, and at least part of the first conductive material layer 120 can be arranged with a signal transmission line.

[0103] The first cover film 130 is arranged in the groove formed by the first cover plate 100, the first cover film 130 can protect the signal transmission line of at least part of the second conductive area 140a in the second conductive material layer 140, so as to avoid damage to the signal transmission line in the second conductive area 140a, and the second cover plate 200 is arranged on the side of the first conductive material layer 120 away from the first base material layer 110, and the second cover plate 200 can protect the signal transmission line of at least part of the first conductive material layer 120, so as to further reduce the size of the vapor chamber in the thickness direction, and facilitate the thinning of the electronic device 10.

[0104] In some embodiments, referring to FIG. 9, the second cover plate 200 can include at least one sealing material layer 230 and at least one sealing base material layer 240 arranged in layers. In some possible implementation manners, the material of the sealing material layer 230 can be a metal material, and the metal material includes at least one of copper, copper alloy, titanium, titanium alloy, stainless steel, and stainless steel composite material, so that the second cover plate 200 has high mechanical strength, can significantly improve the overall mechanical properties of the vapor chamber, can effectively avoid the deformation of the vapor chamber under extrusion, and thus improve the reliability of the vapor chamber. In some possible implementation manners, the material of the sealing base material layer 240 includes a high-molecular organic material, and the material of the sealing base material layer 240 can be arranged as the first base material layer 110. When the vapor chamber of the embodiment of the present application is applied to an electronic device, the vapor chamber can be arranged on the side of the battery 14 in the electronic device 10 away from the middle frame 12, and the battery 14 can expand during use of the electronic device 10. The second cover plate 200 with too high rigidity can inhibit the expansion of the battery 14, thereby causing a battery safety risk. By arranging the sealing base material layer 240 in the second cover plate 200, the sealing base material layer 240 has a certain flexibility, which is conducive to reducing the foregoing battery safety risk. In another embodiment, the second cover plate 200 can only include the sealing material layer 230.

[0105] In some embodiments, referring to FIG. 9 again, a third cover film 220 is arranged on the side of the second cover plate 200 away from the first cover plate 100. The first conductive material layer 120 needs to transmit signals, and thus the material of the first conductive material layer 120 is usually a material with good conductivity (for example, the material of the first conductive material layer 120 can be copper), and the second cover plate 200 can include at least one sealing material layer 230 and at least one sealing substrate layer 240 arranged in layers, the sealing material layer 230 usually adopts a metal material (for example, the metal material includes at least one of copper, copper alloy, titanium, and titanium alloy), and in the process of using the vapor chamber, the first conductive material layer 120 can be in contact with the sealing material layer 230, which can cause the second cover plate 200 to be electrified. By arranging the third cover film 220 on the side of the second cover plate 200 away from the first cover plate 100, the influence of the electrification of the second cover plate 200 on the remaining electronic devices in the electronic device 10 can be effectively avoided.

[0106] In some embodiments, referring to FIG. 9 again, a shielding layer 150 can be arranged on the side of the first cover film 130 away from the second conductive material layer 140. The material of the shielding layer 150 can include an electromagnetic shielding material (English abbreviation: EMI); the shielding layer 150 can effectively protect the signal transmission circuit in the second conductive material layer 140 from external (strong electromagnetic area or susceptible area) interference.

[0107] In some embodiments, referring to FIG. 10, the sealed cavity includes alternating gas-phase flow channels and liquid-phase flow channels 400, the cooling working medium in the liquid phase can flow in the liquid-phase flow channels 400, and the cooling working medium in the gas phase can flow in the gas-phase flow channels. In this way, the vapor chamber no longer needs to be provided with a capillary structure 300 parallel to the thickness direction, but uses the liquid-phase flow channels 400 in the thickness direction to realize the flow of the liquid-phase cooling working medium, which can further reduce the size of the vapor chamber in the vertical direction, and is conducive to the thinning of the electronic device 10. In a possible implementation manner, the liquid-phase flow channels 400 can be capillary structures. For example, the capillary structure can include a capillary wick. The capillary wick can be a mesh structure with dense through-holes, such as a copper mesh, a stainless steel mesh, a woven mesh of an organic material, etc. The copper mesh can be sintered from copper powder, or the copper mesh can be woven from copper wire.

[0108] When the vapor chamber provided by the embodiments of the present application is applied to the electronic device 10, the heat generating device (for example, a battery) can be in contact with the first cover plate 100 or the second cover plate 200 in the vapor chamber, and the heat in the heat generating device can be transmitted to the vapor chamber through the first cover plate 100 or the second cover plate 200 to achieve heat dissipation of the heat generating device; the conductive device (for example, a battery) can be electrically connected with the signal transmission circuit in the first cover plate 100 of the vapor chamber, and the first cover plate 100 can realize signal transmission between the conductive device (for example, a battery) and other electronic devices (for example, a display screen).

[0109] FIG. 11 and FIG. 12 show schematic diagrams of some cases of applying the vapor chamber shown in FIG. 10 to the electronic device 10. Specifically, FIG. 11 is a schematic diagram of an electronic device including the vapor chamber shown in FIG. 10; FIG. 12 is a schematic diagram of a cross section of the electronic device shown in FIG. 11 in some cases along the direction of C1-C2; FIG. 11 and FIG. 12 are merely examples and do not limit the setting position of the vapor chamber, which can be freely selected according to design requirements. Here, only the vapor chamber shown in FIG. 10 is taken as an example, and the vapor chambers shown in FIG. 3, FIG. 5 to FIG. 9 can also be applied to the electronic device 10, which can be set by referring to FIG. 11 and FIG. 12, and will not be described here. In addition, according to design requirements, the size of the battery 14 and the vapor chamber can be freely adjusted, and the position of the battery 14 and the vapor chamber in the middle frame can also be freely adjusted. FIG. 11 and FIG. 12 do not limit the size of the battery 14 and the vapor chamber, and the position of the battery 14 and the vapor chamber in the middle frame 12.

[0110] In some embodiments, referring to FIG. 11 and FIG. 12, the battery 14 is arranged on the middle frame 12, and the vapor chamber is arranged on the side of the battery 14 away from the middle frame 12. On the one hand, the signal transmission circuit in the first cover plate 100 of the vapor chamber can be electrically connected with the battery 14, so that the vapor chamber can realize signal transmission between the battery 14 and other electronic devices. On the other hand, the first cover plate 100 of the vapor chamber is in contact with the battery 14, so that the heat generated by the battery 14 during operation can be transferred to the first cover plate 100, and the vapor chamber can realize heat dissipation of the battery 14. In a possible implementation, the first cover plate 100 of the vapor chamber is electrically connected with the battery 14, and a hollow area is arranged on the middle frame, and part of the vapor chamber passes through the hollow area and is connected with the display screen, so that signal (such as power supply current) transmission between the battery 14 and the display screen can be realized. In another possible implementation, the first cover plate 100 of the vapor chamber is electrically connected with the mainboard in the electronic device, and the first cover plate 100 of the vapor chamber is also electrically connected with the subboard in the electronic device, so that signal transmission between the mainboard and the subboard can be realized through the vapor chamber.

[0111] In some embodiments, referring to FIG. 12, the battery 14 and the vapor chamber can be attached by the adhesive 1000. Of course, the battery 14 and the vapor chamber can also be directly in contact or attached by other means.

[0112] In some embodiments, referring to FIG. 13, FIG. 15, and FIG. 16, the heat plate includes a first cover plate 100 and a second cover plate 200, the first cover plate 100 includes, along the thickness direction (Z direction), a substrate layer (such as the first substrate layer 110 in FIG. 13, FIG. 15, and FIG. 16), a conductive material layer (such as the first conductive material layer 120 in FIG. 13 and FIG. 15, or the first conductive material layer 120 and the second conductive material layer 140 in FIG. 16), and a cover film (such as the first cover film 130 in FIG. 13 and FIG. 15, or the first cover film 130 and the second cover film 160 in FIG. 16) stacked together, the first cover plate 100 includes a sealing area and an extension area along the width direction (X direction), the first cover plate 100 is sealedly connected with the second cover plate 200 at the position where the sealing area and the extension area meet, that is, the first cover plate 100 is connected with the second cover plate 200 only in the sealing area; the sealing area of the first cover plate 100 is sealedly connected with the second cover plate 200 to form a sealed cavity, and the conductive material layer (such as the first conductive material layer 120 in FIG. 13 and FIG. 15, or the first conductive material layer 120 and the second conductive material layer 140 in FIG. 16) of at least part of the extension area is provided with a signal transmission line.

[0113] According to different arrangement positions of the substrate layer (such as the first substrate layer 110 in FIG. 13, FIG. 15, and FIG. 16) and the conductive material layer (such as the first conductive material layer 120 in FIG. 13 and FIG. 15, or the first conductive material layer 120 and the second conductive material layer 140 in FIG. 16), the heat plate (arranged side by side) in the embodiments of the present application can be thus classified into the heat plates shown in FIG. 13, FIG. 15, and FIG. 16, and FIG. 13, FIG. 15, and FIG. 16 do not limit the positions, thicknesses, and numbers of the substrate layer and the conductive material layer, and can also include substrate layers and conductive material layers in other arrangement positions, such as a heat plate formed by multiple substrate layers and multiple conductive material layers, and the analysis idea is similar, which will not be described here.

[0114] For example, referring to FIG. 13 and FIG. 14, in the extension area, the first cover film 130 is arranged on the side of the first conductive material layer 120 away from the first substrate layer 110, and the first conductive material layer 120 of at least part of the extension area is provided with a signal transmission line; in the sealing area, the second cover plate 200 is arranged on the side of the first substrate layer 110 away from the first conductive material layer 120, and the first substrate layer 110 in the sealing area is sealedly connected with the second cover plate 200 to form a sealed cavity.

[0115] In this way, first, from the heat dissipation point of view, the sealing area of the first cover plate 100 and the sealing connection of the second cover plate 200 form a sealed cavity, and the cooling working medium is arranged in the sealed cavity, so that the heat dissipation effect of the vapor chamber can be realized. From the signal transmission point of view, the first conductive material layer 120 of at least part of the extension area of the first cover plate 100 is provided with a signal transmission circuit, so that the signal transmission effect of the vapor chamber can be realized. In this way, compared with the stacking arrangement mode of the vapor chamber and the circuit board in the conventional design (for example, the battery 14, the vapor chamber 16, and the circuit board 15 in (1) of FIG. 2 are sequentially stacked; the vapor chamber 16, the middle frame 12, the battery 14, and the circuit board 15 in (2) of FIG. 2 are sequentially stacked; the vapor chamber 16, the middle frame 12, the battery 14, and the circuit board 15 in (3) of FIG. 2 are sequentially stacked), the signal transmission function of the circuit board is integrated into the extension area of the first cover plate, which is conducive to realizing the thinness of the electronic device 10; second, in the working process of the electronic device 10, referring to FIG. 14, the first conductive material layer 120 of the extension area is provided with a signal transmission circuit, and the signal transmission circuit of the first conductive material layer 120 of the extension area generates heat. The heat of the first conductive material layer 120 of the extension area is transferred to the first conductive material layer 120 of the sealing area. In this way, the extension area and the sealing area of the first cover plate 100 can be cooled, which is equivalent to expanding the cooling area. The larger cooling area can greatly improve the heat dissipation effect of the vapor chamber; in addition, the sealing area of the first cover plate 100 is in direct contact with the cooling working medium, which is further conducive to improving the heat dissipation effect of the vapor chamber.

[0116] For another example, referring to FIG. 15, in the extension area, the first cover film 130 is arranged on the side of the first conductive material layer 120 away from the first base material layer 110, and the first conductive material layer 120 of at least part of the extension area is provided with a signal transmission circuit; in the sealing area, the second cover plate 200 is arranged on the side of the first conductive material layer 120 away from the first base material layer 110, and the first base material layer 110 and the second cover plate 200 in the sealing area are sealingly connected to form a sealed cavity. The explanation of FIG. 15 is similar to that of FIG. 13, which will not be repeated here.

[0117] For example, referring to FIG. 16, in the extension area, the first substrate layer 110 is arranged between the first conductive material layer 120 and the second conductive material layer 140, the first cover film 130 is arranged on the side of the first conductive material layer 120 away from the first substrate layer 110, the second cover film 160 is arranged on the side of the second conductive material layer 140 away from the first substrate layer 110, the first conductive material layer 120 of at least part of the extension area is provided with a signal transmission line, and the second conductive material layer 140 of at least part of the extension area is provided with a signal transmission line; in the sealing area, the first substrate layer 110 is arranged between the first conductive material layer 120 and the second conductive material layer 140, the second cover plate 200 is arranged on the side of the first conductive material layer 120 away from the first substrate layer 110, and the first conductive material layer 120 and the second cover plate 200 in the sealing area are sealingly connected to form a sealed cavity. The explanation of FIG. 16 is similar to that of FIG. 13, and will not be repeated here.

[0118] In some embodiments, referring to FIG. 17, in the extension area, the first cover film 130 is arranged on the side of the first conductive material layer 120 away from the first substrate layer 110, and the first conductive material layer 120 of at least part of the extension area is provided with a signal transmission line; in the sealing area, the second cover plate 200 is arranged on the side of the first conductive material layer 120 away from the first cover film 130, and the first conductive material layer 120 of at least part of the extension area is provided with a signal transmission line; and the first conductive material layer 120 and the second cover plate 200 in the sealing area are sealingly connected to form a sealed cavity.

[0119] In this way, first, the extension area on the first cover plate can be provided with a signal transmission line, and the sealing area on the first cover plate can also be provided with a signal transmission line, and the amount of wiring of the signal transmission line on the first cover plate 100 (including the extension area and the sealing area) can be greatly increased; in the case of a certain amount of wiring, the area where the signal transmission line can be arranged is increased, which is beneficial to improve the signal transmission effect (for example, when the signal transmission line is a metal line for electrical signal transmission, the impedance of the signal transmission line can be reduced by arranging a larger line width, or the signal interference between the signal transmission lines can be reduced by arranging a larger line spacing, thereby improving the electrical signal transmission effect); second, the signal transmission line is arranged on the first conductive material layer 120 in the sealing area, the first conductive material layer 120 in the sealing area is in direct contact with the cooling working medium in the sealed cavity, and the cooling working medium can quickly and effectively cool the first conductive material layer 120 in the sealing area, which can further effectively improve the heat dissipation effect of the vapor chamber.

[0120] In some embodiments, referring to FIG. 18, the signal transmission line in the extension area can be in communication with the signal transmission line in the sealed area (e.g., the second signal transmission line in FIG. 18). Then, the signal power of the signal transmission line in the extension area can be shared by the signal transmission line in the sealed area, so as to avoid damage to the signal transmission line when a large signal power is transmitted in the signal transmission line in the extension area.

[0121] Further, referring again to FIG. 18, the signal power in the signal transmission line in the sealed area is greater than the signal power in the signal transmission line in the extension area. That is, the signal transmission line that generates more heat is arranged in the sealed area that is easier to dissipate heat.

[0122] Taking the signal transmission line as an electrical signal transmission line as an example, assuming that the amount of wiring in the sealed area and the extension area is the same, and the current flowing through the electrical signal transmission line in the sealed area (e.g., the second signal transmission line in FIG. 18) is greater than the current flowing through the electrical signal transmission line in the extension area (e.g., the first signal transmission line in FIG. 18), according to Joule's law, the heat generated in the sealed area is higher than that in the extension area, but the first cover plate 100 in the sealed area is in direct contact with the cooling working medium, and the signal transmission line that generates more heat is arranged in the sealed area that is easier to dissipate heat, which is more conducive to dissipating heat in the first cover plate 100, and then the signal transmission line in the first cover plate 100 can transmit a signal with greater signal power. For example, the signal transmission line connected with the battery for charging and discharging can be arranged in the sealed area, so that when the battery is charged and discharged by a large current, the heat generated by the large current on the signal transmission line can be directly exchanged with the cooling working medium in the sealed area, which can optimize the overall heat consumption of the electronic device in the charging and discharging state, avoid damage to the electronic device or electronic component, and also be conducive to improving the charging and discharging speed of the electronic device.

[0123] In some embodiments, referring to FIG. 19, in the extension area, the first substrate layer 110 is disposed between the first conductive material layer 120 and the second conductive material layer 140, the first cover film 130 is disposed on the side of the first conductive material layer 120 away from the first substrate layer 110, the second cover film 160 is disposed on the side of the second conductive material layer 140 away from the first substrate layer 110, and the first conductive material layer 120 and the second conductive material layer 140 of at least part of the extension area are provided with signal transmission lines; in the sealing area, the first substrate layer 110 is disposed between the first conductive material layer 120 and the second conductive material layer 140, the second cover plate 200 is disposed on the side of the first conductive material layer 120 away from the first substrate layer 110, the second cover film 160 is disposed on the side of the first conductive material layer 120 away from the first substrate layer 110, and the first conductive material layer 120 and the second conductive material layer 140 of at least part of the sealing area are provided with signal transmission lines; the first conductive material layer 120 and the second cover plate 200 of the sealing area are sealingly connected to form a sealed cavity. The explanation of FIG. 19 is similar to that of FIG. 17, and will not be repeated here.

[0124] In some embodiments, referring to FIGS. 20 and 21, the extension area is provided with a bending-resistant layer 500 on at least one side close to the sealing area. For example, the extension area is provided with a bending-resistant layer 500 on one side close to the sealing area, and for another example, the extension area is provided with a bending-resistant layer 500 on both sides close to the sealing area. For example, the material of the bending-resistant layer 500 includes at least one of stainless steel, Teflon, and Mylar.

[0125] According to design requirements, the extension area may need to be bent or wound, etc. Such operations have higher requirements for the bending-resistant strength of the position of the extension area close to the sealing area. By providing the bending-resistant layer 500 on at least one side of the extension area close to the sealing area, the bending-resistant strength of the position of the extension area close to the sealing area can be improved, which is conducive to meeting the complex extension area setting scheme in actual design.

[0126] In some embodiments, referring to FIG. 22, a third cover film 220 is disposed on the side of the second cover plate 200 away from the first cover plate 100. In this way, the influence of the electrification of the second cover plate 200 on the remaining electronic devices in the electronic device 10 can be effectively avoided. In some embodiments, referring to FIG. 22 again, the second cover plate 200 can include at least one sealing material layer 230 and at least one sealing substrate layer 240 which are stacked. The sealing material layer 230 can be made of a metal material (for example, the metal material includes at least one of copper, copper alloy, titanium, and titanium alloy). The material of the sealing substrate layer 240 includes a high-molecular organic material, and the material of the sealing substrate layer 240 can be set by referring to the first substrate layer 110. In this way, the sealing substrate layer 240 has a certain flexibility, which is conducive to reducing the risk of battery safety caused by too high strength of the sealing material layer 230.

[0127] In some embodiments, referring to FIG. 23, the sealed cavity includes alternating gas phase flow channels and liquid phase flow channels, the cooling medium in liquid phase can flow in the liquid phase flow channels, and the cooling medium in gas phase can flow in the gas phase flow channels. In one possible implementation, the liquid phase flow channels can be liquid phase flow channels 400 perpendicular to the thickness direction. For example, the liquid phase flow channels 400 can include capillary wicks. In some embodiments, referring to FIG. 23, a shielding layer 150 can be disposed on the side of the first cover film 130 away from the first conductive material layer 120. In other embodiments, a shielding layer 150 can also be disposed on the side of the second cover film 160 away from the second conductive material layer 140. The shielding layer 150 can effectively protect the signal transmission lines in the first conductive material layer 120 or the second conductive material layer 140 from external (strong electromagnetic or susceptible to interference) interference.

[0128] FIGS. 24 and 25 show some cases of applying the heat spreading plate shown in FIG. 23 to the electronic device 10. Specifically, FIG. 24 is a schematic view of an electronic device including the heat spreading plate shown in FIG. 23; FIG. 25 is a schematic view of the cross section of the electronic device shown in FIG. 24 in the C3-C4 direction in some cases; FIGS. 24 and 25 are merely examples and do not limit the position of the heat spreading plate, which can be freely selected according to design requirements. In addition, the heat spreading plate shown in FIG. 23 is only used as an example here, and the heat spreading plates shown in FIGS. 4, 13, 15-17, 19-22 can also be applied to the electronic device 10. The heat spreading plates can be arranged as shown in FIGS. 24 and 25, and details are not described here.

[0129] In some embodiments, referring to FIGS. 24 and 25, the battery 14 is disposed on the middle frame 12, and the heat spreading plate is disposed on the side of the battery 14 away from the middle frame. On the one hand, the first cover plate 100 in the heat spreading plate is electrically connected to the battery 14, and the heat spreading plate can realize signal transmission between the battery 14 and other electronic devices. On the other hand, the first cover plate 100 or the second cover plate 200 in the heat spreading plate is in contact with the battery 14, and the heat generated by the battery 14 during operation can be transferred to the first cover plate 100 or the second cover plate 200, and the heat spreading plate can realize heat dissipation of the battery 14.

[0130] In a possible implementation, the first cover plate 100 or the second cover plate 200 in the vapor chamber is electrically connected with the battery 14, the middle frame is provided with a hollow area, and part of the vapor chamber passes through the hollow area to be connected with the display screen, so that signal transmission between the battery 14 and the display screen can be realized. In another possible implementation, referring to FIG. 26, the first cover plate 100 in the vapor chamber is electrically connected with the main board 18 in the electronic device, and the first cover plate 100 in the vapor chamber can also be electrically connected with the auxiliary board 17 in the electronic device, so that signal transmission between the main board and the auxiliary board can be realized through the vapor chamber. FIG. 26 is only a specific example and does not limit the positions of the main board and the auxiliary board. For example, the battery 14 and the vapor chamber can be attached through the back adhesive 1000. Of course, the battery 14 and the vapor chamber can also be directly contacted or attached through other manners.

[0131] Although the present application is described in conjunction with specific features and embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications and variations as can come within the scope of the present application. Obviously, many modifications and variations of the present application are possible in light of its teachings. It is intended that the scope of the application encompass these and all other modifications and equivalents. Therefore, the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the application should, therefore, be determined not with reference to the above description, but instead with reference to the appended claims, along with their full scope of equivalents.

Claims

1. A vapor chamber, characterized by, The application relates to a cooling device comprising: a first cover plate (100) comprising at least one substrate layer and at least one electrically conductive material layer, the at least one electrically conductive material layer being provided with a signal transmission line; a second cover plate (200) sealingly connected to at least part of the first cover plate (100) to form a sealed cavity; a cooling medium arranged in the sealed cavity.

2. The vapor chamber of claim 1, wherein The first cover plate (100) is arranged on one side of the second cover plate (200), and the first cover plate (100) and the second cover plate (200) are sealingly connected to form the sealed cavity.

3. The vapor chamber of claim 1, wherein The first cover plate (100) comprises a sealing area and an extension area; the sealing area and the second cover plate (200) are sealingly connected to form a sealed cavity, and the extension area is provided with the signal transmission line; the first cover plate (100) is separated from the sealing connection of the second cover plate (200) at the position where the sealing area and the extension area meet.

4. The vapor chamber of claim 3, wherein The sealing area is provided with the signal transmission line.

5. The vapor chamber of claim 4, wherein The signal transmission line of the extension area is in communication with the signal transmission line of the sealing area.

6. The vapor chamber of claim 4 or 5, wherein The signal power in the signal transmission line of the sealing area is greater than the signal power in the signal transmission line of the extension area.

7. The vapor chamber of claim 2, wherein The at least one substrate layer comprises a first substrate layer (110), and the at least one electrically conductive material layer comprises a first electrically conductive material layer (120); the second cover plate (200), the first electrically conductive material layer (120) and the first substrate layer (110) are sequentially laminated.

8. The vapor chamber of claim 2, wherein, The at least one substrate layer comprises a first substrate layer (110), and the at least one electrically conductive material layer comprises a first electrically conductive material layer (120); the second cover plate (200), the first substrate layer (110) and the first electrically conductive material layer (120) are sequentially laminated. The first electrically conductive material layer (120) is provided with a first cover film (130) on the side away from the first substrate layer (110), and the first cover film (130) covers the signal transmission line in the first electrically conductive material layer (120).

9. The vapor chamber of claim 2, wherein, The at least one substrate layer comprises a first substrate layer (110), and the at least one electrically conductive material layer comprises a first electrically conductive material layer (120) and a second electrically conductive material layer (140); the second cover plate (200), the first electrically conductive material layer (120), the first substrate layer (110) and the second electrically conductive material layer (140) are sequentially laminated. The second electrically conductive material layer (140) is provided with a first cover film (130) on the side away from the first substrate layer (110), and the first cover film (130) covers the signal transmission line in the second electrically conductive material layer (140).

10. The vapor chamber of claim 8 or 9, wherein The first cover plate (100) has a groove with an opening facing away from the second cover plate (200), and the first cover film (130) is arranged in the groove.

11. The vapor chamber of any of claims 3-6, wherein, The at least one substrate layer comprises a first substrate layer (110), the at least one conductive material layer comprises a first conductive material layer (120), the first conductive material layer (120) is provided with a first cover film (130) away from one side of the first substrate layer (110), and the first cover film (130) covers the signal transmission line in the first conductive material layer (120).

12. The vapor chamber of any of claims 3-6, wherein, The first cover plate (100) comprises a first substrate layer (110), the at least one substrate layer comprises a first substrate layer (110), the at least one conductive material layer comprises a first conductive material layer (120) and a second conductive material layer (140), and the first conductive material layer (120), the first substrate layer (110) and the second conductive material layer (140) are sequentially stacked. The first conductive material layer (120) is provided with a first cover film (130) away from one side of the first substrate layer (110), and the second conductive material layer (140) is provided with a second cover film (160) away from one side of the first substrate layer (110).

13. The vapor chamber of any of claims 1-12, wherein, The at least one substrate layer comprises an organic polymer material.

14. The vapor chamber of any of claims 3-6, wherein, The anti-bending layer (500) is arranged on at least one side of the sealing area close to the extension area.

15. The vapor chamber of claim 14, wherein, The material of the anti-bending layer (500) comprises at least one of stainless steel, Teflon and Mylar.

16. The vapor chamber of any of claims 1-15, wherein, The sealing cavity comprises alternatingly arranged gas phase flow channels and liquid phase flow channels (400).

17. An electronic device, comprising: The electronic device further comprises a display screen (11); at least part of the vapor chamber is arranged between the middle frame (12) and the display screen (11).

18. The electronic device of claim 17, wherein, The middle frame (12) is provided with a battery (14), and at least part of the vapor chamber is arranged on a side of the battery (14) away from the middle frame (12).

19. The electronic device of claim 17, wherein, ​

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