Heat dissipation sheet

Abstract

Disclosed is a heat dissipation sheet, comprising a first side, a second side, a third side and a fourth side connected end to end in sequence, wherein the first side comprises a first sub-side connected to the second side, a second sub-side connected to the fourth side, and a third straight sub-side connected between the first sub-side and the second sub-side, and the length of a first orthographic projection of the first side on the third straight sub-side is greater than the length of a second orthographic projection of the third side on the third straight sub-side. The heat dissipation sheet in some embodiments of the present application can effectively reduce material costs while ensuring a heat dissipation effect.

Description

heat sink Technical Field

[0001] This application relates to the field of display technology, specifically to a heat sink, a method and apparatus for temperature assessment of a backlight module including a heat sink, a computing device, a computer-readable storage medium, and a computer program product. Background Technology

[0002] In recent years, with the increasing brightness specifications of display devices such as mobile phones, LCD display devices, such as LCD phones, require an increase in the number of LEDs and LED current used in the backlight module. However, the increase in the number of LEDs and current leads to an increase in the temperature of the backlight module (especially at the LED locations), thus affecting the user experience and the lifespan of the phone. On the other hand, due to the requirements and limitations of brightness specifications, the number of LEDs and (backlight) current, which are the main factors affecting the temperature of the backlight module, are often fixed and cannot be adjusted. Therefore, adding heat dissipation materials to the backlight module (e.g., attaching them to the back), as well as the selection of the type and design of the shape and size of the heat dissipation material, has become crucial to reducing the module temperature. Summary of the Invention

[0003] In view of this, this application provides a heat sink, a method and apparatus for temperature evaluation of a backlight module including a heat sink, a computing device, a computer-readable storage medium, and a computer program product, which are intended to alleviate or overcome some or all of the defects mentioned above, as well as other possible defects.

[0004] According to a first aspect of this application, a heat sink is provided, characterized in that it comprises: a first side, a second side, a third side and a fourth side connected end to end in sequence, wherein the first side includes a first sub-side connected to the second side, a second sub-side connected to the fourth side and a third straight sub-side connected between the first sub-side and the second sub-side, and the first orthographic projection length of the first side on the third straight sub-side is greater than the second orthographic projection length of the third side on the third straight sub-side.

[0005] In some embodiments of the heat sink according to this application, at least one of the first sub-side and the second sub-side is an arc-shaped side.

[0006] In some embodiments of the heat sink according to this application, a third straight edge is disposed along a first direction, and at least one of the first angle between the second edge and the second direction and the second angle between the fourth edge and the second direction is within a preset angle range, wherein the first direction is perpendicular to the second direction.

[0007] In some embodiments of the heat sink according to this application, the third side is parallel to the third straight side and the first included angle is equal to the second included angle.

[0008] In some embodiments of the heat sink according to this application, the distance between the third side and the third straight sub-side is within a first preset distance range.

[0009] In some embodiments of the present application, the heat sink further includes at least one clearance opening, wherein the minimum distance from a point on the edge of each clearance opening to the third straight side is within a second preset distance range.

[0010] In a heat sink according to some embodiments of the present application, each of the at least one clearance opening includes: a first edge, a second edge, a third edge and a fourth edge connected end to end in sequence, wherein the first edge and the third edge are parallel to each other and arranged along a first direction, wherein for each clearance opening, the superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge on the first edge is less than the distance between the first edge and the third edge.

[0011] In some embodiments of the heat sink according to this application, at least one clearance opening includes at least one rectangular clearance opening.

[0012] In a heat sink according to some embodiments of the present application, at least one clearance opening includes at least one isosceles trapezoidal clearance opening and / or at least one right trapezoidal clearance opening, wherein in the at least one isosceles trapezoidal or right trapezoidal clearance opening, the first edge is closer to the first side of the heat sink than the third edge, and the length of the third edge is greater than the length of the first edge.

[0013] In a heat sink according to some embodiments of the present application, at least one clearance opening includes a first clearance opening and a second clearance opening arranged side by side and adjacent to each other along a first direction, wherein the shortest distance in the first direction between the fourth edge of the first clearance opening near the second clearance opening and the third edge of the second clearance opening near the first clearance opening is greater than the maximum value among the first distance between the first edge and the second edge in the first clearance opening, the second distance between the first edge and the second edge in the second clearance opening, the first superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge in the first clearance opening on the first edge, and the second superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge in the second clearance opening on the first edge.

[0014] According to a second aspect of this application, a backlight module is provided, comprising: a backlight body; and a heat sink according to some embodiments of this application, which is attached to the back surface of the backlight body, wherein a first side of the heat sink is adjacent to the bottom edge of the back surface of the backlight body and conforms to its outline.

[0015] In a backlight module according to some embodiments of this application, the distance between the first side of the heat sink and the bottom edge of the backlight body is within a third preset distance range.

[0016] According to a third aspect of this application, a method for temperature evaluation of a backlight module according to some embodiments of this application is provided, comprising: obtaining a sample dataset through experimental detection, wherein each sample dataset includes a temperature influence factor sample and a corresponding temperature label of the backlight module, the temperature influence factor sample including a sample value of the number of backlight sources, a sample value of the backlight current, and a sample value of the heat sink length of the backlight module, wherein the heat sink length refers to the length of the heat sink in a second direction; obtaining a temperature evaluation model for the backlight module based on the sample dataset using at least one of interpolation and fitting methods; obtaining a set of temperature influence factors to be processed, which includes the number of backlight sources, the backlight current value, and the heat sink length; and evaluating the temperature of the backlight module corresponding to the set of temperature influence factors to be processed using the temperature evaluation model.

[0017] According to a fourth aspect of this application, a temperature evaluation apparatus for a backlight module according to some embodiments of this application is provided, comprising: a sample acquisition module configured to acquire a sample dataset through experimental detection, wherein each sample dataset includes a temperature influence factor sample and a corresponding temperature label of the backlight module, the temperature influence factor sample including a sample value of the number of backlight sources, a sample value of the backlight current, and a sample value of the heat sink length, wherein the heat sink length refers to the length of the heat sink in a second direction; a model acquisition module configured to obtain a temperature evaluation model for the backlight module based on the sample dataset using at least one of interpolation and fitting methods; a factor acquisition module configured to acquire a set of temperature influence factors to be processed, including the number of backlight sources, the backlight current value, and the heat sink length; and a temperature evaluation module configured to evaluate the temperature of the backlight module corresponding to the set of temperature influence factors to be processed using the temperature evaluation model.

[0018] According to a fifth aspect of this application, a computing device is provided, comprising: a memory and a processor, wherein the memory stores a computer program that, when executed by the processor, causes the processor to perform a method according to some embodiments of this application.

[0019] According to a sixth aspect of this application, a computer-readable storage medium is provided that stores computer-readable instructions thereon, which, when executed, implement methods according to some embodiments of this application.

[0020] According to a seventh aspect of this application, a computer program product is provided, comprising a computer program that, when executed by a processor, implements the steps of a method according to some embodiments of this application.

[0021] In some embodiments of the heat sink according to this application, a closed quadrilateral shape heat sink is formed by connecting four sides end to end. The first side includes three sub-sides to adapt to various different external contours (e.g., rounded corners) of the bottom of the backlight module (for arranging the backlight source), thereby achieving close contact near the heat source (i.e., the backlight source) of the backlight module and improving the heat dissipation effect. On the other hand, in the quadrilateral heat sink according to this application, the orthographic projection length of the third side, which is arranged opposite to the first side, on the third straight sub-side is less than the orthographic projection length of the first side adjacent to the bottom of the backlight source. That is, the heat sink is designed as a trapezoidal shape that is narrow at the top and wide at the bottom. Compared with the conventional rectangular heat sink, the corner portion away from the first side (i.e. away from the heat source at the bottom of the backlight module) (the area of ​​the backlight module it covers is far from the heat source, and the corresponding heat dissipation effect is not obvious) is cut off to effectively save the material cost of the heat sink while ensuring the heat dissipation effect.

[0022] These and other advantages of this application will become clear from the embodiments described below, and will be illustrated with reference to the embodiments described below. Attached Figure Description

[0023] Embodiments of this application will now be described in more detail with reference to the accompanying drawings, wherein:

[0024] Figure 1 schematically shows a partial front view and a rear view of a backlight module according to related technologies;

[0025] Figure 2 schematically shows a measured thermal image of a backlight module according to the relevant technology;

[0026] Figure 3 schematically illustrates the structure of a heat sink according to some embodiments of this application;

[0027] Figure 4 schematically illustrates the cutting process of a heat sink according to some embodiments of this application;

[0028] Figure 5A schematically shows a front view of the back of a backlight module according to some embodiments of this application;

[0029] Figure 5B schematically shows a partial detail view of a backlight module according to some embodiments of the present application shown in Figure 5A;

[0030] Figure 6 schematically illustrates the structure of a heat sink according to some embodiments of this application;

[0031] Figure 7 schematically illustrates the structure of a heat sink according to some embodiments of this application;

[0032] Figure 8 schematically illustrates the heat dissipation path of a backlight module including a heat sink according to some embodiments of the present application;

[0033] Figure 9 schematically illustrates the structure of a heat sink according to some embodiments of this application;

[0034] Figure 10 schematically illustrates a flowchart of a temperature evaluation method for a backlight module according to some embodiments of this application;

[0035] Figure 11 schematically illustrates, in three-dimensional coordinate form, the range of values ​​and combination of various temperature influence factors in a temperature evaluation method for a backlight module according to some embodiments of this application;

[0036] Figure 12 shows an exemplary structural block diagram of a temperature evaluation method for a backlight module according to some embodiments of this application;

[0037] Figure 13 schematically illustrates an example block diagram of a computing device according to some embodiments of this application. Detailed Implementation

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0039] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0040] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0041] It should be understood that although the terms "first," "second," etc., may be used herein to describe various devices, features, or portions, these devices, features, or portions should not be limited by these terms. These terms are used only to distinguish one (or group of) devices, features, or portions from another (or another group of) devices, features, or portions. It should also be understood that, unless otherwise specified, "a plurality" as used in this disclosure may refer to two or more. It should also be understood that the terms "connection," "coupling," or similar terms as used in this disclosure may refer to direct connections or direct couplings, or to indirect connections or indirect couplings achieved via one or more intermediate means, components, etc. In some embodiments, "connection," "coupling," "joining," or similar terms may refer to fixed connections or detachable connections. For example, in a description relating to one element or device being connected to another element or device, it may mean that one element or device is fixedly connected to another element or device, or it may mean that one element or device is detachably connected to another element or device. In this article, a detachable connection means that component A and component B are connected together by a detachable and / or removable connection method such as bonding, snap-fitting, riveting, threaded connection, interference fit, etc., and the connection between component A and component B can be removed by means such as heating, pulling, pressing, impact, vibration, etc. without damaging and / or destroying component A and component B, so as to facilitate replacement and recycling of components.

[0042] Figure 1 schematically shows a partial front view and a rear view of a backlight module according to the relevant technology.

[0043] As shown in Figure 1, in the front view (a) of the backlight module, multiple backlight sources 110 (e.g., light-emitting diodes LED 1, LED 2, ..., LED 15, LED 16) are provided at the bottom of the backlight module 100, which are the main heat sources of the backlight module. As shown in Figure 1, in the rear view (b) of the backlight module, heat sinks 120 are attached to the back of the backlight module 100 along the bottom and side borders. The heat sinks 120 are roughly rectangular (with rounded corners at the connection between the bottom edge and the two sides, consistent with the outer contour of the bottom border of the backlight module 100), and the width W is roughly equal to the overall width of the backlight module 100, while the height H is much smaller than the overall height of the backlight module (i.e., the heat sink is only attached to the area adjacent to the bottom heat source (LED backlight) (i.e., the area with higher temperature) to save material costs).

[0044] Figure 2 shows a measured thermal image of the backlight module according to the related technology. As shown in Figure 2, in the area near the bottom of the backlight module 100, heat transfer and temperature distribution radiate outward from the backlight source 110 (i.e., the LED heat source). That is, the temperature is highest at the location of the backlight source 110 (i.e., the bottom) of the entire backlight module 100, and the temperature gradually decreases with increasing distance from the backlight source 110. Therefore, in the area on the back of the backlight module 100 covered by the rectangular heat sink 120 as shown in Figure 1, away from the corners or areas of the backlight source 110 or the LED heat source 110, such as the area covered by the shaded portions 121 and 122 of the heat sink 120 in the back view (b) of Figure 1, the temperature is not high. Thus, after experimental testing, it was found that the heat dissipation effect of the corner positions of the heat sink 120 that are far away from the heat source 110 (such as the shaded parts 121 and 122 in Figure 1) is poor and has little impact on the module temperature. Therefore, the corner parts 121 and 122 that are far away from the heat source of the conventional rectangular heat sink 120 can be cut to form a new trapezoidal heat sink, thereby reducing material costs while ensuring heat dissipation effect.

[0045] Figure 3 schematically illustrates the structure of a heat sink according to some embodiments of the present application. As shown in Figure 3, the heat sink 300 according to the present application may include: a first side 310, a second side 320, a third side 330, and a fourth side 340 connected end to end in sequence, wherein the first side 310 includes a first sub-side 311 connected to the second side, a second sub-side 312 connected to the fourth side 340, and a third straight sub-side 313 connecting the first sub-side 311 and the second sub-side 312, and the first orthographic projection length L1 of the first side 310 on the third straight sub-side 313 is greater than the second orthographic projection length L2 of the third side 330 on the third straight sub-side 313. It should be noted that the heat sink 300 can be attached or bonded to the back side of a backlight body for an LCD display device, wherein the first side 310 is adjacent to the bottom edge of the backlight body.

[0046] Since the material of the heat sink attached to the back of the backlight module or display module is one of the important factors affecting the module temperature, it is necessary to carefully select a heat dissipation material with better heat dissipation performance to make the heat sink. After practical testing and verification of various heat dissipation materials, graphite sheets are heat dissipation materials with high thermal conductivity. Therefore, the heat sink according to this application can be made of graphite sheets or may include graphite sheets.

[0047] In some embodiments of the heat sink according to this application, a closed quadrilateral shape heat sink is formed by connecting four sides end to end. The first side includes three sub-sides to adapt to various different external contours (e.g., rounded corners) of the bottom of the backlight module (for arranging the backlight source), thereby achieving close contact near the heat source (i.e., the backlight source) of the backlight module and improving the heat dissipation effect. On the other hand, in the quadrilateral heat sink according to this application, the projection length L2 of the third side opposite to the first side on the third straight sub-side is smaller than the projection length L1 of the first side adjacent to the bottom of the backlight source. That is, the heat sink is designed as a trapezoidal shape that is narrow at the top and wide at the bottom. Compared with the conventional rectangular heat sink, the corner portion away from the first side (i.e. away from the heat source at the bottom of the backlight module) (the area of ​​the backlight module it covers is far from the heat source, so the temperature is not too high and the corresponding heat dissipation effect is not obvious) is cut off to effectively save the material cost of the heat sink while ensuring the heat dissipation effect.

[0048] Figure 3 illustrates the first and second directions, which are distinct from each other. Optionally, the first direction is horizontal, and the second direction is vertical, and they are perpendicular to each other. As shown in Figure 3, in some embodiments, the third straight side 313 can be parallel to the first direction, and at least one of the first angle θ1 between the second side 320 and the second direction and the second angle θ2 between the fourth side 340 and the second direction is within a preset angle range. By limiting the angles between the sides (second and fourth sides) and the vertical direction (second direction), the length difference between the orthographic projections of the upper bottom edge (third side) and the lower bottom edge (first side) of the heat sink can be appropriately limited, thereby limiting the cutting range of the upper corners of the heat sink relative to the rectangular plate, so as to balance the heat dissipation effect and material cost, that is, to save material cost to the greatest extent without significantly affecting the heat dissipation effect. On the one hand, the degrees of θ1 and θ2 cannot be too large, otherwise the heat dissipation effect will be affected; on the other hand, they cannot be too small, otherwise the cost savings will not be significant. Therefore, the angles θ1 and θ2 between the sides of the trapezoidal heat sink according to this application and the vertical direction should be limited to a reasonable range, that is, within a preset angle range. The preset angle range can be determined through experimental testing.

[0049] Table 1—Example data on heat sink shapes and corresponding heat dissipation effects according to some embodiments of this application

[0050] As shown in Table 1, Item represents the shape data of the heat sink 300, where X represents the width of the heat sink 300 (the length of the heat sink in the first direction, i.e., the orthographic projection length L1 of the first side 310 onto the third straight side 313), Y represents the height of the heat sink 300 (the length of the heat sink 300 in the second direction, e.g., the superimposed orthographic projection length of each side of the heat sink in the second direction), and θ represents the angle between the two sides 320 and 340 of the heat sink 300 and the vertical direction (i.e., θ1 = θ2 = θ). As shown in Table 1, three temperature measurements were performed on the backlight module with the corresponding heat sink 300 attached for different values ​​of θ. Thus, for each different value of θ, three sets of measured temperature data #1, #2, and #3 were obtained, along with the average value AVG of these three sets of data. The unit of the temperature data is ℃ (degrees Celsius). As shown in Table 1, in the shape data of heat sink 300, X = 68mm, Y = 50mm, and θ takes 0 degrees, 5 degrees, 7.5 degrees, 10 degrees, 12.5 degrees, 15 degrees, 20 degrees and 30 degrees, a total of 8 degrees. Each group of data (#1, #2, #3 and AVG) in Table 1 includes two temperature data points, "front" and "back", which represent the measured temperatures of the front and back of the backlight module, respectively.

[0051] As can be seen from the specific temperature data of each group of backlight modules shown in Table 1 (especially the AVG (average temperature) group data), after multiple experimental tests, when the angles θ1 and θ2 between the side and the vertical direction of the (rounded corner) trapezoidal heat sink 300 of this application are within the range of 0-10 degrees (e.g., 0 degrees, 5 degrees, 7.5 degrees, 10 degrees), the temperature change of the backlight module attached to the heat sink 300 is not significant. However, when the degree of θ exceeds 10 degrees (12.5 degrees, 15 degrees, 20 degrees, and 30 degrees), the temperature of the front and back of the corresponding backlight module increases significantly (e.g., compared with heat sinks below 10 degrees, the front and back temperatures of the backlight module are approximately 0.4-0.8 degrees higher). Therefore, based on the above measured data, at least one of the first angle θ1 between the second side 320 and the second direction and the second angle θ2 between the fourth side 340 and the second direction can be set to a preset angle range of (0... 0 10 0 Alternatively, it can be set to (1) 0 10 0 ] or (2 0 10 0 ] or (5 0 10 0 This preset angle range ensures that the heatsink's heat dissipation effect and performance for the backlight module are not affected, while significantly saving on the material cost of the heatsink.

[0052] In the first side 310 of the heat sink 300 according to some embodiments of this application, at least one of the first sub-side 311 connecting the second side 320 and the third straight sub-side 313 and the second sub-side 312 connecting the fourth side 340 and the third straight sub-side 313 can be an arc-shaped side. As shown in FIG3, both the first sub-side 311 and the second sub-side 312 are arc-shaped sides. In the heat sink according to this application, the arc-shaped side (i.e., the first sub-side 311 and the second sub-side 310) at the connection between the first side 310 (i.e., the bottom edge adjacent to the bottom of the backlight module) and the side edge (i.e., the second side 320 and the fourth side 340) can be designed to adapt to the rounded corner contour features of the display module or the bottom bezel of the backlight module of a display device such as a mobile phone. This facilitates a close fit between the bottom corner of the heat sink and the area where the heat source (i.e., the backlight) of the backlight module is located, significantly improving the heat dissipation effect.

[0053] In the heat sink 300 according to some embodiments of this application, as shown in FIG3, the third side 330 can be parallel to the third straight side 313 and the first included angle θ1 is equal to the second included angle θ2. That is, as shown in FIG3, when the third side 330 is a straight side parallel to the first direction (i.e., parallel to the third straight side 313), the shape of the heat sink 300 is a relatively regular (rounded) trapezoidal shape. Further, the first included angle θ1 being equal to the second included angle θ2 means that the two sides 320 and 340 have the same inclination, and the shape of the heat sink 300 is a more regular (rounded) isosceles trapezoid. Here, depending on the normal orientation of the backlight module where the heat sink is located and its corresponding display device such as a mobile phone, the first direction can be a horizontal direction (e.g., the bottom direction of the mobile phone), and the second direction can be a vertical direction (e.g., the side direction of the mobile phone). The standard or regular (isosceles) trapezoidal shape of the heat sink 300 facilitates assembly line production or cutting.

[0054] Figure 4 schematically illustrates the cutting process of a heat sink according to some embodiments of this application. As shown in Figure 4, the cutting process of the heat sink 300 can be achieved by alternating layout, and practice has shown that such alternating layout cutting process can reduce material costs by approximately 6%.

[0055] In the heat sink 300 according to some embodiments of this application, the distance between the mutually parallel third side 330 and the third straight sub-side 313 can be within a first preset distance range. As shown in FIG3, when the third side 330 is parallel to the third straight sub-side 313, the distance between them is exactly equal to the height H of the heat sink 300 (the length of the heat sink in the second direction, i.e., the height of the trapezoidal heat sink 300). As shown in FIG3, the height H of the heat sink = H1 + H2, where H1 is the orthographic projection length of the heat sink side (i.e., the second side 320 and the fourth side 340) in the second direction, and H2 is the orthographic projection length of the first sub-side 311 and the second sub-side 312 in the second direction. In order to save the material cost of the heat sink as much as possible while ensuring that the heat dissipation effect of the backlight module targeted by the heat sink is not significantly affected (i.e., to achieve a balance between heat dissipation effect and material cost), the first preset distance range of the heat sink height H (i.e., the distance between the third side 330 and the third straight sub-side 313) can be determined through repeated experiments and tests. H2 is the rounded corner projection adapted to the backlight module, and therefore can be determined by the outline of the backlight module; while H1 can be determined through experimental testing, for example, within the range of 5.0-8.5mm. On the other hand, the width W of the heat sink 300 can be limited by the width of the backlight module.

[0056] Figure 5A schematically shows a front view of the back of a backlight module according to some embodiments of this application. As shown in Figure 5A, the backlight module 500 includes a backlight body 510 and a heat sink 520 attached to the back of the backlight body 510. As shown in Figure 5A, the backlight body 510 includes a plurality of backlights 511 (e.g., LEDs) arranged linearly at the bottom of the backlight body. The heat sink 520 is formed by first to fourth sides 521, 522, 523, and 524 connected end to end in sequence, wherein the first side 521 is adjacent to the bottom edge of the backlight body 510 and conforms to its outline. Among the first side 521, the first arc-shaped sub-side 521a and the second sub-side 521b located at the corners conform to the bottom rounded corner outline of the backlight body 510, and the third straight sub-side 521c is adjacent to the bottom edge of the backlight body 510. In the backlight module 500, the heat sink 520 is attached to the bottom back of the backlight body 510 to ensure that it is close to the bottom backlight (such as the LED heat source) 511, which is conducive to heat conduction and improves the heat dissipation effect.

[0057] As shown in Figure 5A, the height H (length in the second direction) of the heat sink 520 is obtained by the following formula (1): H=H1+H2 (1)

[0058] Where H1 represents the superimposed orthographic projection length of the side edges (i.e., the second edge 522 and the fourth edge 524) of the heat sink 520 in the second direction, and H2 represents the orthographic projection length of the (arc-shaped) first sub-edge 521a and / or second sub-edge 521b of the bottom edge (i.e., the first edge 521) in the second direction.

[0059] Generally, since the arc-shaped first sub-side 311 and the second sub-side are adapted to the rounded corner outline of the backlight module, H2 can be determined by the outline of the backlight module (especially the outline of the bottom rounded corner); while H1 can be determined by experimental testing. For example, through actual temperature measurement, H1 can be in the range of 5.0-8.5mm.

[0060] Figure 5B shows a partial detail of the corner of the backlight module shown in Figure 5A. As shown in Figure 5B, in the corner 530 of the backlight module 500 shown in Figure 5A, the second arc-shaped sub-edge 521b of the heat sink 520 is basically consistent with the outline of the rounded (arc-shaped) edge 512 of the backlight body 510. To meet the requirements and margin of the bonding process, a certain gap d can be set between the first edge 521 and the bottom edge of the backlight body 520. The design of the gap d between the bottom edge 521 of the heat sink and the bottom edge 512 of the backlight module can avoid errors caused by assembly errors. The gap d can be within a preset distance range (e.g., a third), for example, a minimum of 0.5mm and a maximum of 1mm.

[0061] In some embodiments, the width W of the heat sink 520 can be defined by the width W0 of the backlight module 500 or the backlight body 510. As shown in Figures 5A and 5B, the width W (length in the first direction) of the heat sink 520 can be obtained by the following formula (2): W = W0 - 2 * d (2)

[0062] Where W0 represents the width of the backlight body 510 or the backlight module 500, and d represents the gap between the bottom edge of the heat sink (i.e., the first edge 521) and the bottom edge of the backlight body 510.

[0063] Figures 6 and 7 schematically illustrate the structure of a heat sink according to some embodiments of this application.

[0064] In some application scenarios of backlight modules or display modules used in display devices, one or more specific positions or small areas need to be pre-defined on the back of the module where heat sinks are attached, for setting or attaching other components. Therefore, the corresponding heat sinks need to be designed with cutouts for such positions, that is, openings are set at the corresponding positions of the heat sinks to avoid occupying specific positions.

[0065] As shown in Figures 6 and 7, according to some embodiments of this application, the heat sink 600, 700 formed by the first side (bottom edge) 610, 710, the second side (left side) 620, 720, the third side (top edge) 630, 730 and the fourth side (right side) 640, 740 may include at least one clearance opening, such as the first clearance opening 650, 750 and the second clearance opening 660, 760; the first side 610, 710 includes the first sub-side 611, 711, the second sub-side 612, 712 and the third straight sub-side 613, 713; the minimum distance 'a' from a point on the edge of each clearance opening 650, 750, 660, 760 to the third straight sub-side 613, 713 is within a second preset distance range.

[0066] As shown in Figures 6 and 7, for heat sinks 600 and 700 that include cutout designs (i.e., recessed openings 650, 660, 750, and 760 on the back of the backlight module used for attaching other components), the cutout positions should be as far away as possible from the bottom backlight source (i.e., the heat source) of the backlight module to avoid adverse effects on heat transfer and dissipation caused by heat sink openings near the heat source. The specific position can be determined experimentally. For example, the distance 'a' from the lowest point on the edge of the recessed openings 650, 660, 750, and 760 to the bottom edge (i.e., the third straight sub-edge 613 and 713) can be determined experimentally within a second preset distance range. Referring to Table 2, the second preset distance range of 'a' can be set to 5-15 mm, i.e., a minimum of 5 mm, a maximum of 15 mm, and typically 10 mm, because experiments show that the temperature increase decreases at 5 mm and the temperature tends to stabilize at 10 mm.

[0067] In some embodiments, the shape and size of the recessed openings 650, 660, 750, and 760 of the heat sinks 600 and 700 can be determined according to the specific application scenario of the backlight module (e.g., the size and shape of the components). As shown in Figure 6, each recessed opening in the heat sink 600, such as the second recessed opening 660, may include: a first edge 661, a second edge 662, a third edge 663, and a fourth edge 664 connected end to end in sequence, wherein the first edge 661 and the third edge 663 are parallel to a first direction. In other words, the first recessed opening 650 and the second recessed opening 660 can be rectangular, trapezoidal, or parallelogram-shaped. Optionally, the recessed openings of the heat sink 600 can also be circular, other polygonal shapes, etc.

[0068] As shown in Figure 6, at least one clearance opening 650 includes at least one rectangular clearance opening 650, and the second edge 662 and the fourth edge 664 of each rectangular clearance opening 660 are parallel to the second direction. As shown in Figure 6, the width (i.e., the length along the first direction) of each rectangular clearance opening 650, 660 is x, and the height (i.e., the length along the second direction) is y, where x>y, that is, the lateral length of the rectangular opening is greater than the longitudinal length.

[0069] As shown in Figure 7, each recessed opening in the heat sink 700, such as the second recessed opening 760, may include: a first edge 761, a second edge 762, a third edge 763, and a fourth edge 764 connected end to end in sequence. The first edge 761 and the third edge 763 are parallel to the first direction. For each recessed opening (e.g., the second recessed opening 760), the superimposed orthographic projection length of the first edge 761, the second edge 762, the third edge 763, and the fourth edge 764 on the first edge 761 is less than the distance between the first edge 761 and the third edge 763. Here, the "superimposed orthographic projection length" refers to the length of the superimposed orthographic projections of the various edges of the recessed opening on the first edge (bottom edge) (where the overlapping parts of different projections are not counted repeatedly), used to characterize the overall width of the recessed opening, i.e., its length in the first direction; while the "distance between the first edge and the third edge" represents the height of the recessed opening, i.e., its length in the second direction. The degree of difference between the overall horizontal width and the overall vertical height of the clearance opening can be determined according to the specific application scenario. For example, according to actual measurements, the superimposed orthographic projection length (i.e., the overall width) can be less than half of the distance between the first edge and the third edge (i.e., the overall height) (e.g., the width is 7 and the height is 15).

[0070] Based on the heat dissipation principle in backlight modules, since the backlight source (i.e., the heat source) is located at the bottom, its main heat conduction path is from bottom to top (i.e., along the second direction). Therefore, the lateral width (the first direction perpendicular to the second direction) of the heat sink's recessed opening becomes the main obstacle to this heat conduction path. Based on this principle, the shape of the heat sink's recessed opening should be designed to have the smallest possible lateral width (the vertical height can be appropriately extended to maintain the opening area), thus ensuring a smoother heat conduction path for the backlight module and improving heat dissipation. See Figure 8 for a detailed explanation.

[0071] As shown in FIG. 7, at least one clearance opening 750, 760 includes at least one rectangular clearance opening 750, 760. The second edge 762 and the fourth edge 764 of each rectangular clearance opening 760 are parallel to the second direction. Generally, clearance openings with regular shapes (such as rectangles) are relatively easy to fabricate. As shown in FIG. 7, for the rectangular clearance openings 750, 760, the superposition orthographic projection length of each edge (i.e., the overall width of the opening) is exactly the width of the rectangle (i.e., the length along the first direction) which is x, and the distance between the first edge and the third edge (i.e., the overall height of the opening) is exactly the height of the rectangle (i.e., the length along the second direction) which is y, where x < y, that is, the lateral length (i.e., width) of the rectangular opening is less than the longitudinal length (i.e., height). Thus, compared with the shapes of the horizontally placed clearance openings 650 and 660 of the heat sink 600 in FIG. 6, the vertically placed clearance openings 750 and 760 shown in FIG. 7 are more conducive to the heat conduction and evacuation of the heat source, and thus have a better heat dissipation effect. Specific heat dissipation effect data can be seen in Table 2.

[0072] As shown in FIG. 6, in the heat sink 600 according to some embodiments of the present application, it includes a first clearance opening 650 and a second clearance opening 660 arranged side by side along the first direction. The shortest distance in the first direction between the fourth edge 654 of the first clearance opening 650 close to the second clearance opening 66 is greater than the first distance between the first edge 651 and the third edge 652 of the first clearance opening 650, the second distance between the first edge 661 and the third edge 663 of the second clearance opening 660, the first superposition orthographic projection length of the first edge 651, the second edge 652, the third edge 653 and the fourth edge 654 of the first clearance opening 650 on the first edge 651, and the maximum value among the second superposition orthographic projection lengths of the first edge 661, the second edge 662, the third edge 663 and the fourth edge 664 of the second clearance opening 660 on the first edge 661. The adjacent clearance openings 750 and 760 in the heat sink 700 of FIG. 7 can have the same properties as the clearance openings 650 and 660 of the heat sink 600 in FIG. 6, which will not be elaborated here. Based on the heat conduction principle of the backlight module heat sink, the distance between two adjacent clearance openings in the heat sink should be set as large as possible to facilitate the smooth passage of heat. For example, it can be set to be greater than the overall lateral width and the overall longitudinal height of the two clearance openings. In this way, the adjacent clearance opening spacing is relatively wide, which is conducive to heat conduction; otherwise, if the adjacent opening spacing is too small and the two openings are close to being connected, it may block heat conduction and is not conducive to heat dissipation.

[0073] Table 2 - Example data of the heat sink morphology and corresponding heat dissipation effect according to some embodiments of the present application

[0074] As shown in Table 2, Item represents the shape-related data of the recessed openings 650, 660, 750, and 760 of the heat sinks 600 and 700. X represents the width of the recessed opening (length in the first direction, e.g., the horizontal width of a rectangular opening), Y represents the height of the recessed opening (length in the second direction, e.g., the vertical height of a rectangular opening), a represents the minimum distance from a point on the edge of the recessed opening to the bottom edge of the heat sink (i.e., the third straight side), and b represents the shortest distance between two adjacent recessed openings in the first direction. As shown in Table 2, for each set of recessed opening data (i.e., different combinations of X, Y, a, and b values ​​(unit: mm), five temperature measurements were performed on the backlight module with the corresponding heat sink shape. This resulted in five sets of measured temperature data (#1, #2, #3, #4, and #5) and the average value (AVG) of these five sets of data for each set of heat sink recessed opening shape data. The unit of the temperature data is ℃ (degrees Celsius). As shown in Table 2, in the data of the heat sink's recessed opening shape, (X, Y) takes (0,0), (15,7), and (7,15) respectively; while a only takes one data point, 20; and b takes three data points, 5, 10, and 15. Each group of temperature data (#1, #2, #3, and AVG) in Table 2 includes two temperature data points, "Front Side" and "Back Side," representing the measured temperatures of the front and back sides of the backlight module, respectively. From the specific temperature data of each group of backlight modules shown in Table 2 (especially the AVG (average temperature) group data), it can be seen that after multiple experimental tests, the first row of data indicates that when X = Y = 0 (i.e., the heat sink has no recessed opening), the backlight module temperature is lower than the other rows. This means that the hollow design has a certain impact on heat dissipation; therefore, unless absolutely necessary, the hollow design of the heat sink should be minimized. Secondly, as can be seen from the data in rows 2-4, when X=15 and Y=7 (i.e., the horizontal width is greater than the vertical height), as the value of b changes from 5 to 10, the overall module temperature decreases by about 0.2-0.5 degrees Celsius, indicating that the farther the distance between the recess opening and the bottom edge of the heat sink, the better the heat dissipation effect. However, when b changes from 10 to 15, the module temperature does not change significantly (it may decrease or increase). Therefore, when the distance between the recess opening and the bottom edge (third straight edge) of the heat sink becomes large enough (e.g., 10mm-15mm), it has almost no effect on the heat dissipation effect. Furthermore, comparing the data in rows 2-4 with the data in row 5, it can be seen that compared with the horizontally placed recessed opening (e.g., X=15, Y=7), when the horizontal width X of the recessed opening is less than the vertical height Y (i.e., X=7, Y=15), the temperature of the backlight module is generally lower, especially the front temperature is significantly lower. This indicates that the shape of the recessed opening has a significant impact on the heat dissipation effect. Specifically, the width of the recessed opening in the first direction (horizontal) parallel to the bottom edge of the backlight module (i.e., the position where the LED backlight is installed) should be less than the height in the second direction in order to improve the heat dissipation effect.

[0075] Figure 8 schematically illustrates the heat dissipation path of a backlight module including a heat sink according to some embodiments of the present application.

[0076] As shown in Figure 8(a) on the left, the backlight module 800a includes a backlight body 810 and a heat sink 820 attached to the bottom of the back of the backlight body. The heat sink 820 includes two recessed openings 821 and 822 with a lateral width greater than its longitudinal height. Based on the heat dissipation characteristics of the heat sink (e.g., a graphite sheet) and its heat conduction efficiency in the horizontal and vertical directions, and since the backlight (i.e., the heat source) is located at the bottom of the backlight module, the main heat conduction path is from bottom to top (i.e., along the second direction). Thus, the lateral width (the first direction perpendicular to the second direction) of the recessed openings of the heat sink becomes the main obstacle to the heat conduction path. Therefore, as shown in Figure 8(a), the rectangular recessed openings 821 and 822, with a lateral width greater than their longitudinal height (i.e., the length in the first direction greater than the length in the second direction), become obstacles in the heat conduction path of the heat sink 820 in the backlight module 800a, blocking the heat dissipation path over a large area. Therefore, the larger the dimension in the first direction (horizontal) (i.e., the lateral width), the smaller the heat dissipation path and the worse the heat dissipation effect.

[0077] As shown in Figure 8(b) on the right, the backlight module 800b includes a backlight body 830 and a heat sink 840 attached to the bottom of the back of the backlight body. The heat sink 840 includes two recessed openings 841 and 842 with a lateral width smaller than the longitudinal height. In comparison, as shown in Figure 8(b), based on the heat dissipation characteristics of the heat sink (e.g., graphite sheet) and the heat conduction efficiency in the horizontal and vertical directions, compared with the heat sink 820 shown in Figure 8(a), the rectangular recessed openings 841 and 842 with a lateral width smaller than the longitudinal height (i.e., the length in the first direction is smaller than the length in the second direction) significantly reduce the obstruction of heat conduction from bottom to top in the heat sink 840 in the backlight module 800a, which is more conducive to the smooth flow of heat transfer path. Therefore, the smaller the first direction (horizontal) dimension (i.e., lateral width), the less obstruction to the heat dissipation path and the better the heat dissipation effect. Therefore, based on the heat conduction principle of the heat sink shown in Figure 9, while keeping the cutout area unchanged, the direction of the cutout (i.e., the clearance opening) can be optimized. For example, the clearance opening can be designed as a rectangular hole placed vertically (the length of the first direction is less than the length of the second direction) as shown in Figure 7, thereby reducing the obstruction of the heat conduction path (the vertical propagation path from bottom to top) and improving the heat conduction capacity and heat dissipation effect.

[0078] Figure 9 schematically illustrates the structure of a heat sink according to some embodiments of this application.

[0079] In some embodiments, as shown in Figures 9(a) and (b), the backlight modules 900a and 900b according to this application respectively include backlight bodies 910a and 910b and heat sinks 920a and 920b. The heat sinks 920a and 920b may each include at least one isosceles trapezoidal recess 921 and / or at least one right-angled trapezoidal recess 922. In the isosceles trapezoidal recess 921 or the right-angled trapezoidal recess 922, the first edge (lower edge) is closer to the first side (i.e., the lower base) of the heat sink 900a and 900b than the third edge (upper edge), and the length of the third edge is greater than the length of the first edge. In the hollow (i.e., recess) design of the trapezoidal heat sink, the shape of the opening can be designed as an isosceles trapezoid and / or a right-angled trapezoid as shown in Figures 9(a) and (b), and the upper base (third edge) of the trapezoid is greater than the lower base (third edge) (i.e., a trapezoid with a larger upper base and a smaller lower base, also known as an inverted trapezoid). In this way, because the bottom edge of the inverted trapezoidal opening in the heat sink is smaller near the bottom of the backlight body (i.e., the heat source), it reduces the obstruction of heat conduction at the bottom (more), which is more conducive to heat conduction and improves the heat dissipation effect. Although the top edge is larger, it is farther away from the bottom heat source, so less heat needs to be conducted or dissipated, and therefore has a smaller impact on the heat dissipation effect. Under the same area and height (length), the inverted trapezoid may have less heat obstruction than a rectangular or normal trapezoidal (i.e., smaller at the top and larger at the bottom) opening. On the other hand, the isosceles trapezoidal or right trapezoidal openings are easier to manufacture due to their relatively regular shape.

[0080] In some embodiments, as shown in FIG9(c), the backlight module 900c according to this application includes a backlight body 910c and a heat sink 920c, and the heat sink 920c may include at least one parallelogram-shaped recessed opening 923. In some embodiments, as shown in FIG9(d), the backlight module 900d according to this application includes a backlight body 910d and a heat sink 920d, and the heat sink 920d may include at least one isosceles trapezoidal recessed opening 923, wherein the length of the third edge is less than the length of the first edge. As described above, compared with the isosceles trapezoidal recessed opening 923 shown in FIG9(d), which is smaller at the bottom and larger at the top, the isosceles trapezoidal recessed opening 923 shown in FIG9(a) may increase the obstruction of heat conduction at the bottom (more) because the bottom base of this inverted trapezoidal opening near the bottom of the backlight body (i.e., the heat source) is smaller, which is not conducive to heat conduction and improves the heat dissipation effect.

[0081] In Figures 9(a)-(d), among the various shapes (parallelogram-shaped clearance opening 923, isosceles trapezoidal clearance openings 921, 924, and right trapezoidal clearance opening 922), the overall width (i.e., the length of the superimposed orthographic projection of each edge of the opening onto the bottom edge) x is less than the overall height (i.e., the distance between the top and bottom edges) y. Specifically, the superimposed orthographic projection length of the first edge (bottom edge), second edge (left side), third edge (top edge), and fourth edge (right side) of each clearance opening onto the first edge is less than the distance between the first and third edges. Therefore, this heat sink shape, with a lateral (first direction) width less than its longitudinal (second direction) height, significantly reduces the obstruction of the heat conduction path (primarily the vertical propagation from bottom to top), thus significantly improving heat conduction capacity and heat dissipation effect.

[0082] In Figures 9(a)-(d), the shortest distance *b* between two adjacent recessed openings—that is, the shortest distance *b* between the right edge of the left opening and the left edge of the right opening in the first direction—is greater than the overall lateral width *x* and overall longitudinal height *y* of each of these two recessed openings. In other words, the distance between two adjacent recessed openings in the heat sink should be set as large as possible to facilitate the smooth passage of heat; for example, it can be set to be greater than the overall lateral width and overall longitudinal height of the two recessed openings. This wider spacing between adjacent recessed openings is beneficial for heat conduction.

[0083] Figure 10 schematically illustrates a flowchart of a temperature evaluation method for a backlight module according to some embodiments of this application.

[0084] In related technologies, display modules or backlight modules with heat sinks often lack temperature assessments before project initiation. This results in some products exhibiting display defects during trial production due to excessively high temperatures. Therefore, there is an urgent need for an effective solution to assess module temperature to ensure smooth mass production. This application provides a method for assessing backlight module temperature. It obtains experimental data on the quantitative relationship between key factors influencing temperature (e.g., backlight current, number of LEDs, heat sink dimensions, etc.) and module temperature. Specifically, it assesses the temperature changes caused by different currents, different numbers of LEDs, and different sizes of heat sinks (e.g., graphite sheets) to effectively evaluate the temperature of new module projects (i.e., the module temperature corresponding to new backlight currents, number of LEDs, heat sink dimensions, etc.).

[0085] As shown in Figure 10, in some embodiments, a temperature evaluation method for a backlight module according to some embodiments of this application may include the following steps:

[0086] S1010, obtain a sample dataset through experimental testing, wherein each sample dataset includes a temperature influence factor sample and a corresponding temperature label of the backlight module. The temperature influence factor sample includes the sample value of the number of backlights of the backlight module, the sample value of the backlight current, and the sample value of the heat sink length, wherein the heat sink length refers to the length of the heat sink in the second direction.

[0087] S1020, using at least one of interpolation and fitting methods, a temperature evaluation model for the backlight module is obtained based on the sample dataset.

[0088] S1030, obtain the set of temperature influence factors to be processed, which includes the number of backlights, the backlight current value, and the length of the heat sink;

[0089] S1040, Using the temperature assessment model, assess the temperature of the backlight module corresponding to the set of temperature influence factors to be processed.

[0090] As described in S1010, the first step is to obtain a sample dataset, which consists of temperature influence factor samples used to calculate the temperature evaluation model or function of the backlight module, as well as the measured temperature labels of the corresponding backlight modules. Through experimental testing, the main factors affecting the temperature of the backlight module (i.e., temperature influence factors) can include three aspects: LED current, number of LEDs, and size of the heat sink (or graphite sheet) (e.g., vertical height).

[0091] Figure 11 schematically illustrates, in three-dimensional coordinates, the range and combination of various temperature influence factors in a temperature assessment method for a backlight module according to some embodiments of this application. As shown in Figure 11, in some embodiments, the LED current range of currently commercially available backlight modules is 20–24 mA, the number of LEDs is typically 16ea, 18ea, or 20ea, and the longitudinal height or length of the graphite sheet is 0–50 mm. Subsequently, specific measurement conditions are performed in three dimensions: in the current dimension, the module temperature increases from 20 to 24 mA; in the LED number dimension, the module temperature increases from 16 to 20ea; and in the graphite sheet dimension, the module temperature decreases from 0 to 50 mm. As shown in Figure 5, temperature influence factors can be combined in different ways to form multiple (e.g., 90) sets for input sample data, such as (20mA, 16ea, 0mm)...(24mA, 20ea, 50mm), etc. Subsequently, the temperature data (i.e., temperature labels) corresponding to each set of sample data can be obtained through actual measurement, thus obtaining a sample dataset (i.e., 90 sets of sample data, each set of sample data including three influence factor input data and corresponding measured temperature data).

[0092] As shown in S1020, after obtaining the sample dataset, multiple sets (i.e., 90 sets) of input samples in the sample dataset, plus measured temperature labels, can be used to calculate the temperature evaluation model or function of the backlight module corresponding to these datasets through numerical methods such as interpolation and / or fitting. This model serves as a fixed model for directly obtaining the corresponding backlight module temperature based on the input number of LEDs, heat sink length, and LED current value.

[0093] Thus, after obtaining the temperature evaluation model, as described in S1030 and S1040, the temperature of the backlight module corresponding to the set of temperature influence factors to be processed (including the number of backlights, the backlight current value, and the length of the heat sink) can be calculated or evaluated by obtaining the set of temperature influence factors to be processed and inputting it into the temperature evaluation model.

[0094] In some embodiments, since the LED current is a non-integer value (e.g., 20.5mA) and the graphite sheet length is a non-ten value (e.g., 36mm) in the actual product design process, it is necessary to refine the LED current and graphite sheet length settings. For example, setting the LED current to 0.1mA as the minimum unit and the graphite sheet length to 1mm as the minimum unit can meet the actual product design requirements, while the number of LEDs can be set to 16ea, 18ea, or 20ea.

[0095] The temperature assessment method for backlight modules according to some embodiments of this application can accurately assess the module temperature during the early project assessment stage, avoiding temperature assessment errors or large inaccuracies caused by relying solely on existing project designs or experience-based predictions. This allows for accurate assessment of the backlight module temperature during trial production using the temperature assessment method according to this application before the module project is initiated. Based on the assessed (e.g., potentially too high) temperature, the values ​​of various influencing factors (e.g., LED current, number of LEDs, or heatsink length) can be appropriately adjusted to ensure normal temperature operation. This prevents individual products from exhibiting display defects due to excessively high temperatures during trial production, and avoids uneven display caused by material wrinkling due to excessively high temperatures during reliability testing.

[0096] Figure 12 is an exemplary structural block diagram of a temperature evaluation device 1200 for a backlight module according to some embodiments of the present application. As shown in Figure 12, the temperature evaluation device 1200 for a backlight module may include a sample acquisition module 1210, a model acquisition module 1220, a factor acquisition module 1230, and a temperature evaluation module 1240.

[0097] The sample acquisition module 1210 can be configured to acquire a sample dataset through experimental detection, wherein each sample data includes a temperature influence factor sample and a corresponding temperature label of the backlight module. The temperature influence factor sample includes a sample value of the number of backlight sources, a sample value of the backlight current, and a sample value of the heat sink length of the backlight module, wherein the heat sink length refers to the length of the heat sink in the second direction.

[0098] The model acquisition module 1220 can be configured to obtain a temperature evaluation model for the backlight module based on the sample dataset using at least one of interpolation and fitting methods.

[0099] The factor acquisition module 1230 can be configured to acquire a set of temperature influence factors to be processed, including the number of backlights, the backlight current value, and the length of the heat sink.

[0100] The temperature assessment module 1240 can be configured to use the temperature assessment model to assess the temperature of the backlight module corresponding to the set of temperature influence factors to be processed.

[0101] It should be noted that the various modules described above can be implemented in software, hardware, or a combination of both. Multiple different modules can be implemented within the same software or hardware architecture, or a single module can be implemented by multiple different software or hardware architectures.

[0102] Figure 13 schematically illustrates an example block diagram of a computing device 1300 according to some embodiments of this application. The computing device 1300 may represent a device for implementing the various apparatuses or modules described herein and / or performing the various methods described herein. The computing device 1300 may be, for example, a server, desktop computer, laptop computer, tablet, smartphone, smartwatch, wearable device, or any other suitable computing device or computing system, which may include various levels of devices ranging from full-resource devices with abundant storage and processing resources to low-resource devices with limited storage and / or processing resources. In some embodiments, the temperature evaluation apparatus 1200 for a backlight module described above with respect to Figure 12 may be implemented in one or more computing devices 1300.

[0103] As shown in Figure 13, the example computing device 1300 includes a processing system 1301 communicatively coupled to each other, one or more computer-readable media 1302, and one or more I / O interfaces 1303. Although not shown, the computing device 1300 may also include a system bus or other data and command transfer system that couples the various components to each other. The system bus may include any or a combination of different bus architectures, such as a memory bus or memory controller, a peripheral bus, a universal serial bus, and / or a processor or local bus utilizing any of the various bus architectures. Alternatively, it may also include control and data lines.

[0104] Processing system 1301 represents the functionality of performing one or more operations using hardware. Therefore, processing system 1301 is illustrated as including hardware elements 1304 that can be configured as processors, function blocks, etc. This may include other logic devices implemented in hardware as application-specific integrated circuits (ASICs) or formed using one or more semiconductors. Hardware element 1304 is not limited by the materials in which it is formed or the processing mechanism employed therein. For example, a processor may consist of semiconductors and / or transistors (e.g., integrated circuits (ICs)). In such a context, processor-executable instructions may be electronically executable instructions.

[0105] Computer-readable medium 1302 is illustrated as including memory / storage device 1205. Memory / storage device 1305 represents a memory / storage device associated with one or more computer-readable media. Memory / storage device 1205 may include volatile media (such as random access memory (RAM)) and / or non-volatile media (such as read-only memory (ROM), flash memory, optical disk, magnetic disk, etc.). Memory / storage device 1305 may include fixed media (e.g., RAM, ROM, fixed hard disk drive, etc.) and removable media (e.g., flash memory, removable hard disk drive, optical disk, etc.). Exemplarily, memory / storage device 1305 may be used to store various types of data mentioned in the above embodiments. Computer-readable medium 1302 may be configured in various other ways as further described below.

[0106] One or more I / O (input / output) interfaces 1303 represent the functionality that allows a user to type commands and information into the computing device 1300 and also allows information to be displayed to the user and / or sent to other components or devices using various input / output devices. Examples of input devices include keyboards, cursor control devices (e.g., mice), microphones (e.g., for voice input), scanners, touch functionality (e.g., capacitive or other sensors configured to detect physical touch), cameras (e.g., capable of detecting non-touch-related movements as gestures using visible or invisible wavelengths (such as infrared frequencies), network interface cards (NICs), receivers, and so on. Examples of output devices include display devices, speakers, printers, haptic-responsive devices, network interface cards (NICs), transmitters, and so on.

[0107] The computing device 1300 also includes a temperature evaluation strategy 1306. The temperature evaluation strategy 1306 can be stored as computing program instructions in the memory / storage device 1305, or it can be hardware or firmware. The temperature evaluation strategy 1306, together with the processing system 1301 and the like, can implement all the functions of the various modules of the temperature evaluation device 1200 for the backlight module described in FIG. 12.

[0108] This document describes various technologies in the general context of software, hardware, components, or program modules. Generally, these modules include routines, programs, objects, elements, components, data structures, etc., that perform specific tasks or implement specific abstract data types. The terms "module," "function," etc., as used herein generally refer to software, firmware, hardware, or a combination thereof. The technologies described herein are platform-independent, meaning that these technologies can be implemented on a variety of computing platforms with various processors.

[0109] Implementations of the described modules and technologies may be stored on or transmitted across some form of computer-readable medium. The computer-readable medium may include a variety of media accessible by the computing device 1300. By way of example and not limitation, the computer-readable medium may include "computer-readable storage media" and "computer-readable signal media".

[0110] In contrast to simple signal transmission, carrier waves, or signals themselves, a "computer-readable storage medium" refers to a medium and / or device capable of persistently storing information, and / or a tangible storage device. Therefore, a computer-readable storage medium refers to a non-signal-bearing medium. Computer-readable storage media include hardware such as volatile and non-volatile, removable and non-removable media and / or storage devices implemented using methods or techniques suitable for storing information (such as computer-readable instructions, data structures, program modules, logic elements / circuits, or other data). Examples of computer-readable storage media may include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, DVD or other optical storage devices, hard disks, magnetic tape cassettes, magnetic tapes, disk storage devices or other magnetic storage devices, or other storage devices, tangible media, or articles of art suitable for storing desired information and accessible by a computer.

[0111] "Computer-readable signal medium" refers to a signal-bearing medium configured to transmit instructions, such as via a network, to computing device 1300. A signal medium typically embodies computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave, data signal, or other transmission mechanism. A signal medium also includes any information transmission medium. By way of example and not limitation, a signal medium includes wired media such as wired networks or direct connections, and wireless media such as acoustic, RF, infrared, and other wireless media.

[0112] As previously described, hardware element 1304 and computer-readable medium 1302 represent instructions, modules, programmable device logic, and / or fixed device logic implemented in hardware, which in some embodiments can be used to implement at least some aspects of the techniques described herein. Hardware elements may include components of integrated circuits or systems-on-a-chip, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other implementations or other hardware devices in silicon. In this context, hardware elements can serve as processing devices for executing program tasks defined by instructions, modules, and / or logic embodied by the hardware element, and as hardware devices for storing instructions for execution, such as the previously described computer-readable storage medium.

[0113] The foregoing combinations can also be used to implement the various techniques and modules described herein. Therefore, software, hardware, or program modules and other program modules can be implemented as one or more instructions and / or logic embodied on some form of computer-readable storage medium and / or by one or more hardware elements 1304. Computing device 1300 can be configured to implement specific instructions and / or functions corresponding to the software and / or hardware modules. Thus, modules can be implemented at least partially in hardware as modules executable as software by computing device 1300, for example, by using the computer-readable storage medium and / or hardware elements 1304 of a processing system. Instructions and / or functions can be executed / operated by, for example, one or more computing devices 1300 and / or processing system 1301 to implement the techniques, modules, and examples described herein.

[0114] The techniques described herein can be supported by these various configurations of computing device 1300, and are not limited to specific examples of the techniques described herein.

[0115] In particular, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as computer programs. For example, embodiments of this application provide a computer program product including a computer program carried on a computer-readable medium, the computer program containing program code for performing at least one step in the method embodiments of this application.

[0116] In some embodiments of this application, one or more computer-readable storage media are provided, on which computer-readable instructions are stored. When executed, these computer-readable instructions implement a temperature evaluation method for a backlight module according to some embodiments of this application. The various steps of the temperature evaluation method for a backlight module according to some embodiments of this application can be programmed into computer-readable instructions, thereby stored in the computer-readable storage medium. When such a computer-readable storage medium is read or accessed by a computing device or computer, the computer-readable instructions therein are executed by a processor on the computing device or computer to implement the method described according to some embodiments of this application.

[0117] In the description of this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0118] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing custom logic functions or processes, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed (including substantially simultaneously or in reverse order depending on the functions involved), as will be understood by those skilled in the art to which embodiments of this application pertain.

[0119] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0120] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, it can be implemented using any of the following techniques known in the art, or a combination thereof: discrete logic circuits having logic gates for implementing logical functions on data signals; application-specific integrated circuits (ASICs) having suitable combinational logic gates; programmable gate arrays (FPGAs); field-programmable gate arrays (FPGAs); etc.

[0121] Those skilled in the art will understand that all or part of the steps of the methods described in the above embodiments can be implemented by hardware associated with program instructions. The program can be stored in a computer-readable storage medium, and when executed, the program includes performing one or a combination of the steps of the method embodiments.

[0122] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

Claims

1. A heat sink, characterized by, Comprises: a first edge, a second edge, a third edge and a fourth edge connected in sequence end to end, wherein the first edge comprises a first sub-edge connected to the second edge, a second sub-edge connected to the fourth edge, and a third straight sub-edge connected between the first sub-edge and the second sub-edge, and a first orthogonal projection length of the first edge on the third straight sub-edge is greater than a second orthogonal projection length of the third edge on the third straight sub-edge.

2. The fin of claim 1, wherein At least one of the first sub-edge and the second sub-edge is an arc-shaped edge.

3. The finned heat sink of claim 1 or 2, wherein, The third straight sub-edge is arranged along a first direction, and at least one of a first included angle between the second edge and a second direction and a second included angle between the fourth edge and the second direction is in a preset angle interval, wherein the first direction is perpendicular to the second direction.

4. The fin of claim 3 wherein, The third edge is parallel to the third straight sub-edge, and the first included angle is equal to the second included angle.

5. The fin of claim 4 wherein, A distance between the third edge and the third straight sub-edge is in a first preset distance interval.

6. The fin of claim 1 wherein, The heat sink further comprises at least one avoidance opening, and a minimum distance from a point on an edge of each avoidance opening to the third straight sub-edge is in a second preset distance interval.

7. The fin of claim 6 wherein, Each of the at least one avoidance opening comprises: a first edge, a second edge, a third edge and a fourth edge connected in sequence end to end, wherein the first edge and the third edge are parallel to each other and arranged along the first direction, wherein for each avoidance opening, an overlapping orthogonal projection length of the first edge, the second edge, the third edge and the fourth edge on the first edge is less than a distance between the first edge and the third edge.

8. The fin of claim 7 wherein, The at least one avoidance opening comprises at least one rectangular avoidance opening.

9. The fin of claim 7 wherein, The at least one avoidance opening comprises at least one isosceles trapezoidal avoidance opening and / or at least one right trapezoidal avoidance opening, wherein in the at least one isosceles trapezoidal or right trapezoidal avoidance opening, the first edge is closer to the first edge of the heat sink than the third edge, and a length of the third edge is greater than a length of the first edge.

10. The fin of claim 7 wherein, The at least one avoidance opening comprises a first avoidance opening and a second avoidance opening arranged side by side and adjacent along the first direction, wherein a shortest distance in the first direction between a fourth edge of the first avoidance opening close to the second avoidance opening and a third edge of the second avoidance opening close to the first avoidance opening is greater than a maximum value of a first distance between the first edge and the second edge in the first avoidance opening, a second distance between the first edge and the second edge in the second avoidance opening, a first overlapping orthogonal projection length of the first edge, the second edge, the third edge and the fourth edge on the first edge in the first avoidance opening, and a second overlapping orthogonal projection length of the first edge, the second edge, the third edge and the fourth edge on the first edge in the second avoidance opening.

11. A backlight module, comprising: a backlight source body; and the heat sink according to any one of claims 1-10, which is attached on a back surface of the backlight source body, wherein a first edge of the heat sink is adjacent to a bottom edge of the back surface of the backlight source body and conforms to an outline thereof.

12. The backlight module of claim 1, wherein, A distance between the first edge of the heat sink and the bottom edge of the back surface of the backlight source body is in a third preset distance interval.

13. A method for temperature evaluation of a backlight module according to claim 11, characterized in that, Comprises: obtaining a sample data set by experiment detection, wherein each sample data comprises a temperature influencing factor sample and a corresponding temperature label of the backlight module, the temperature influencing factor sample comprises a backlight source number sample value, a backlight source current sample value and a heat sink length sample value of the backlight module, wherein the heat sink length refers to a length of the heat sink in the second direction; obtaining a temperature evaluation model for the backlight module based on the sample data set by using at least one of an interpolation method and a fitting method; obtaining a set of temperature influencing factors to be processed, which comprises a backlight source number, a backlight source current value and a heat sink length; evaluating a temperature of the backlight module corresponding to the set of temperature influencing factors to be processed by using the temperature evaluation model.

14. A temperature evaluation device for a backlight module according to claim 11, characterized in that, comprise: a sample obtaining module configured to obtain a sample data set by experiment detection, wherein each sample data comprises a temperature influencing factor sample and a corresponding temperature label of the backlight module, the temperature influencing factor sample comprises a backlight source number sample value, a backlight source current sample value and a heat sink length sample value of the backlight module, wherein the heat sink length refers to a length of the heat sink in the second direction; a model obtaining module configured to obtain a temperature evaluation model for the backlight module based on the sample data set by using at least one of an interpolation method and a fitting method; a factor obtaining module configured to obtain a set of temperature influencing factors to be processed, which comprises a backlight source number, a backlight source current value and a heat sink length; and a temperature evaluating module configured to evaluate a temperature of the backlight module corresponding to the set of temperature influencing factors to be processed by using the temperature evaluation model.

15. A computing device comprising: a memory and a processor, wherein a computer program is stored in the memory, and the computer program, when executed by the processor, causes the processor to perform the method of claim 13.

16. A computer readable storage medium having stored thereon computer readable instructions which, when executed, implement the method of claim 13.

17. A computer program product comprising a computer program which, when executed by a processor, implements the steps of the method according to claim 13. ​

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