Electronic device comprising printed circuit board

Abstract

This electronic device may comprise: a printed circuit board (PCB) assembly having a plurality of layers and comprising an array antenna comprising a plurality of subarrays; and at least one RF processing circuit connected to the PCB assembly. The plurality of subarrays may each comprise: a first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals according to first feed signals from the at least one RF processing circuit; a second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals according to second feed signals from the at least one RF processing circuit; and a plurality of coupling patches disposed on a second layer positioned higher than the first layer among the plurality of layers.

Description

Electronic devices including printed circuit boards

[0001] The descriptions below relate to electronic devices that include printed circuit boards.

[0002] Products equipped with multiple antennas are being developed to enhance communication performance. It is expected that devices with even greater numbers of antennas will be used. As the number of antennas in electronic devices increases, the number of components (e.g., radio frequency integrated circuits (RFICs)) required will inevitably increase.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, a substrate including a plurality of layers is provided. The substrate may include: a first conductive pattern disposed on a first layer among the plurality of layers and connected to a first port; a second conductive pattern disposed on the first layer among the plurality of layers and connected to a second port; a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer; and a ground layer disposed below the first layer among the plurality of layers. The coupling patches may be arranged on the second layer in a designated direction. At least a portion of the first conductive pattern may be formed on the first layer to supply a first signal from the first port along the designated direction. At least a portion of the second conductive pattern may be formed on the first layer to supply a second signal from the second port along the designated direction.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a processor including a processing circuit; a plurality of radio frequency (RF) processing circuits connected to the processor; and a substrate functioning as an array antenna including a plurality of sub-arrays. Each sub-array of the plurality of sub-arrays may include a first conductive pattern disposed on a first layer among the plurality of layers and connected to a first port; a second conductive pattern disposed on the first layer among the plurality of layers and connected to a second port; a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer; and a ground layer disposed below the first layer among the plurality of layers. The coupling patches may be arranged on the second layer in a designated direction. At least a portion of the first conductive pattern may be formed on the first layer to feed a first signal from the first port along the designated direction. At least a portion of the second conductive pattern may be formed on the first layer to supply a second signal from the second port along the designated direction.

[0006] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a printed circuit board (PCB) assembly comprising an array antenna having a plurality of layers and including a plurality of sub-arrays; and at least one RF processing circuit connected to the PCB assembly. Each of the plurality of sub-arrays may include a first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals in response to first feed signals from the at least one RF processing circuit; a second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals in response to second feed signals from the at least one RF processing circuit; and a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer. The coupling patches may be arranged along a linear direction on the second layer, and each of the coupling patches may be configured to radiate signals in response to coupling using the first signals and the second signals. The plurality of layers may include a ground layer disposed below the first layer. In each of the above sub-arrays, the first conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer. In each of the above sub-arrays, the second conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer.

[0007] In embodiments of the present disclosure, a printed circuit board (PCB) assembly having a plurality of layers is provided. The PCB assembly may include a plurality of sub-arrays. Each of the plurality of sub-arrays may include a first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals in response to first feed signals from the at least one RF processing circuit; a second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals in response to second feed signals from the at least one RF processing circuit; and a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer. The coupling patches may be arranged along a linear direction on the second layer, and each of the coupling patches may be configured to radiate signals in response to coupling using the first signals and the second signals. The plurality of layers may include a ground layer disposed below the first layer. In each of the above sub-arrays, the first conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer. In each of the above sub-arrays, the second conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer.

[0008] Figure 1a illustrates a wireless communication system.

[0009] Figure 1b shows an example of components of an electronic device.

[0010] Figures 2a and 2b are drawings for explaining a subarray.

[0011] Figure 3 shows an example of a unit cell of an antenna array.

[0012] Figure 4a shows an example of an antenna array including unit cells.

[0013] Figures 4b and 4c show examples of the performance of the antenna array.

[0014] Figure 4d is a drawing for explaining the principle of the antenna array.

[0015] Figures 5a and 5b show examples of conductive patterns of an antenna array.

[0016] Figure 5c shows examples of operation modes using challenging patterns.

[0017] Figure 5d shows an example of the performance of the antenna array.

[0018] Figure 5e shows an example of the performance of the antenna array according to each operating mode.

[0019] Figure 6a shows examples of conductive patterns of a two-dimensional antenna array.

[0020] Figures 6b and 6c show examples of the performance of a two-dimensional antenna array.

[0021] Figure 7a shows examples of conductive patterns of a two-dimensional antenna array.

[0022] Figure 7b shows an example of the performance of a two-dimensional antenna array.

[0023] Figure 8 shows an example of a two-dimensional antenna array including RF absorbers.

[0024] Figure 9 shows an example of a unit cell comprising conductive patterns that are fed in different directions.

[0025] Figure 10 shows examples of the challenging portions of the subarray.

[0026] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0027] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0028] Terms referring to parts of electronic devices used in the following description (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), printed board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to antennas (e.g., antenna radiator, radiator, conductive part, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating part, antenna structure, antenna structure), terms referring to the location of components (e.g., part, location, area, point), terms referring to the shape of components (e.g., structure, structure, support, contact, or protrusion), terms referring to connections between structures (e.g., connecting part, contact part, supporting part, connecting member, contact member, supporting member, contact, contact structure, conductive member, or assembly), terms referring to open structures (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line), Feeding lines, data lines, RF signal lines, antenna lines, RF paths, RF modules, RF circuits, splitters, dividers, couplers, or combiners are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', or '... body' used below may mean at least one shape structure or a unit that processes a function.

[0029] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0030] Although the present disclosure describes various embodiments using terms used in some communication standards (e.g., 3rd Generation Partnership Project (3GPP), European Telecommunications Standards Institute (ETSI), extensible radio access network (xRAN), open-radio access network (O-RAN), etc.), these are merely examples for explanation. The various embodiments of the present disclosure can be easily modified and applied to other communication systems.

[0031] Figure 1a illustrates a wireless communication system. The wireless communication environment of Figure 1a exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), and a third terminal (120-3)) as part of nodes utilizing a wireless channel.

[0032] Referring to Figure 1a, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance at which it can transmit a signal. The base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5th generation node', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit), 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU), remote radio head (RRH), 'electronic device', 'communication device' or other terms having an equivalent technical meaning. The base station (110) may transmit a downlink signal or receive an uplink signal.

[0033] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without the involvement of the user. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as a 'user equipment (UE)', a 'mobile station', a 'subscriber station', a 'customer premises equipment (CPE)', a 'remote terminal', a 'wireless terminal', an 'electronic device', a 'communication device', a 'vehicle terminal', a 'user device', or other terms having an equivalent technical meaning thereto.

[0034] Beamforming technology is being used as one of the technologies to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reception area of ​​radio waves or increase the directivity of reception sensitivity for a specific direction. Therefore, in order to form a beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, the base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0035] A key technology for improving the data capacity of 5G / 6G communications is beamforming, which utilizes antenna arrays connected to multiple RF paths. To achieve higher data capacity, either the number of RF paths or the power per RF path must increase. Increasing RF paths increases the size of the product, and due to space constraints for installing actual base station equipment, further expansion is currently not feasible. To increase antenna gain through higher output without increasing the number of RF paths, a divider (or splitter) can be used to connect multiple antenna elements in the RF paths. Here, the antenna elements corresponding to the RF paths can be referred to as subarrays. As a non-limiting example, subarray technology can be used to increase signal radiation gain. An antenna array may include multiple subarrays. The antennas of the antenna array may be divided into the multiple subarrays. The signal may be radiated through each antenna of the subarrays.

[0036] In Fig. 1A, the base station (110) of Fig. 1A is described as an example to explain an electronic device including an antenna, but the embodiments of the present disclosure are not limited thereto. As an electronic device according to the embodiments of the present disclosure, in addition to the base station (110), a wireless device performing a function equivalent to a base station, a wireless device connected to the base station (e.g., TRP), a terminal (120) of Fig. 1A, or any other communication device used for communication may be of course possible. Hereinafter, in the present disclosure, an antenna array composed of sub-arrays is described as an example as a structure of a plurality of antennas for communication in a MIMO (Multiple Input Multiple Output) environment, but as a non-limiting example, it is of course possible to easily change it for beamforming.

[0037] Figure 1b illustrates examples of components of an electronic device. For example, the electronic device may be the base station (110) of Figure 1a or a component of the base station (110). For example, unlike the illustration, the electronic device may also be a terminal (120).

[0038] Referring to FIG. 1B, an exemplary functional configuration of an electronic device (160) is illustrated. The electronic device (160) may include an antenna unit (111), a filter unit (112), an RF (radio frequency) processing unit (113), and a processor (114).

[0039] The antenna unit (111) may include a plurality of antennas. The antenna may perform functions for transmitting and receiving signals through a wireless channel. The antenna may include a radiator formed of a conductor (e.g., a metal structure) or a conductive pattern formed on a substrate (e.g., a PCB). The antenna may radiate an upconverted signal on a wireless channel or acquire a signal radiated by another device. Each antenna may be referred to as an antenna element, an antenna component, an antenna radiator, a radiating portion, a radiator, and / or equivalent technical terms. The antenna unit (111) may include an antenna array in which a plurality of antenna elements form an array. The antenna unit (111) may be electrically connected to the filter unit (112) through RF signal lines. For example, a plurality of antenna elements of the antenna unit (111) may be coupled to a substrate (e.g., a PCB). A plurality of antenna elements may be implemented within the substrate. The substrate may include RF signal lines connecting each antenna element and RF filters of the filter unit (112). The RF signal lines may be referred to as a feeding network. The substrate may be referred to as a board, a wireless unit substrate, a wireless unit board, an antenna substrate, an antenna board, a radiation substrate, a radiation board, an RF board, an RF substrate, and / or equivalent technical terms.

[0040] The filter unit (112) can perform filtering to transmit a signal of a desired frequency. The filter unit (112) can include a plurality of RF filters. The RF filter can perform a function of selectively passing a frequency by forming a resonance. The filter unit (112) can include at least one of a band pass filter, a low pass filter, a high pass filter, or a band reject filter. The filter unit (112) can include RF circuits for obtaining a signal of a frequency band for transmission or a frequency band for reception. Each RF filter of the filter unit (112) can be electrically connected to the antennas of the antenna unit (111) and the RF processing circuit of the RF processing unit (113).

[0041] The RF processing unit (113) may include a plurality of RF processing circuits. The RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through the antenna. The RF processing circuit may include a plurality of paths corresponding to antennas. At least one RF processing circuit may be referred to as an RF chain or an RF processing chain. The RF chain may include a plurality of RF components. The RF components may include amplifiers, mixers, oscillators, DACs, ADCs, etc. For example, the RF processing unit (113) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal to an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Also, for example, the RF processing unit (113) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts a digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of a receiving path. The receiving path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (113) may be implemented on a PCB. The electronic device (160) may include a structure in which an antenna unit (111) - a filter unit (112) - an RF processing unit (113) are stacked in that order.The RF components of the antennas and RF processing unit (113) can be implemented on a PCB, and filters can be repeatedly connected between the PCBs to form multiple layers. For example, the RF processing unit (113) can include a communication chip (e.g., RFIC).

[0042] The processor (114) can control the overall operations of the electronic device (160). The processor (114) may be referred to as a control unit, a controller, or a control unit. The processor (114) may include various modules for performing communication. The processor (114) may include at least one processor, such as a modem. The processor (114) may include modules for digital signal processing. For example, the processor (114) may include a modem. When transmitting data, the processor (114) generates complex symbols by encoding and modulating a transmission bit stream. In addition, for example, when receiving data, the processor (114) restores a reception bit stream by demodulating and decoding a baseband signal. The processor (114) may perform functions of a protocol stack required by a communication standard.

[0043] In FIG. 1B, functional components of an electronic device (160) are described as a communication device including a plurality of antennas. However, the example illustrated in FIG. 1B is merely an exemplary configuration for utilizing the antenna unit (111) described below, and embodiments of the present disclosure are not limited to the components of the electronic device illustrated in FIG. 1B. For example, even if some of the components of the electronic device are omitted or the connection relationship of the components is different, if it is a device (e.g., a communication device, a communication module) including antennas of the structure described below, it can be understood as an embodiment of the present disclosure.

[0044] Figures 2a and 2b are diagrams illustrating subarrays. A key technology for improving data capacity is beamforming, which utilizes an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. Increasing the number of RF paths increases the size of the product, and due to space constraints for installing actual base station equipment, further expansion is currently not possible. To increase antenna gain through higher output without increasing the number of RF paths, multiple antenna elements can be connected to a single RF path. Here, the antenna elements corresponding to a single RF path can be referred to as a subarray. As a non-limiting example, subarray technology can be used to increase signal radiation gain. In the present disclosure, an antenna array (or array antenna) may include multiple subarrays. The antennas of the antenna array may be divided into the multiple subarrays. The signal may be radiated through each of the antennas of the subarray.

[0045] Referring to FIG. 2A, the electronic device (160) may include an RFIC (213) and a first sub-array (241). The RFIC (213) may include a plurality of RF chains. For the RFIC (213), reference may be made to the description of the RF processing unit (113) of FIG. 1B. The first sub-array (241) may include a plurality of antenna elements. For example, the first sub-array (241) may include four antenna elements. For example, the first sub-array (241) may include a first antenna element (241a), a second antenna element (241b), a third antenna element (241c), and a fourth antenna element (241d). The first sub-array (241) may be configured to radiate signals of multiple polarizations. For example, the first sub-array (241) may be configured to radiate a signal of a first polarization. The first sub-array (241) may be configured to radiate a signal of a second polarization. The first polarization and the second polarization may be substantially perpendicular. For example, the first polarization may provide a +45 degree polarization and the second polarization may provide a -45 degree polarization. In another example, the first polarization may provide a vertical polarization and the second polarization may provide a horizontal polarization. The electronic device (160) may include a plurality of RF paths to provide the plurality of polarizations. For example, the electronic device (160) may include a first RF path (231) and a second RF path (232). The first RF path (231) may be used to transmit a first signal to each antenna element of the first sub-array (241). The second RF path (232) may be configured to transmit a second signal to each antenna element of the first sub-array (241).

[0046] Referring to FIG. 2B, the electronic device (160) may include an antenna array and an RFIC (213). The antenna array may include a plurality of sub-arrays. For example, the plurality of sub-arrays may include a first sub-array (241) and a second sub-array (242). For the RFIC (213), reference may be made to the description of the RF processing unit (113) of FIG. 1B. For the first sub-array (241), reference may be made to the description of the first sub-array (241) of FIG. 2A. The second sub-array (242) may include a plurality of antenna elements. For example, the second sub-array (242) may include four antenna elements. For example, the second sub-array (242) may include a first antenna element (242a), a second antenna element (242b), a third antenna element (242c), and a fourth antenna element (242d). The second sub-array (242) may be configured to radiate signals of multiple polarizations. For example, the second sub-array (242) may be configured to radiate signals of a first polarization. The second sub-array (242) may be configured to radiate signals of a second polarization. The first polarization and the second polarization may be substantially perpendicular. For example, the first polarization may provide a +45 degree polarization and the second polarization may provide a -45 degree polarization. In another example, the first polarization may provide a vertical polarization and the second polarization may provide a horizontal polarization. The electronic device (160) may include a plurality of RF paths to provide the multiple polarizations. For example, the electronic device (160) may include a third RF path (233) and a fourth RF path (234). The third RF path (233) may be used to transmit a third signal to each antenna element of the second sub-array (242). The fourth RF path (234) may be configured to transmit a fourth signal to each antenna element of the second sub-array (242).Within an antenna array, sets of antenna elements corresponding to different RF paths may correspond to different sub-arrays. For example, the first sub-array (241) and the second sub-array (242) may be distinguished by sub-array unit, as they obtain signals through different RF paths.

[0047] Although FIGS. 2A and 2B illustrate the subarray as being connected to each branch of an RF path and an antenna element, the embodiments of the present disclosure are not limited thereto. In other words, the embodiments of the present disclosure are not limited to the actual physical wiring from an RF path being connected to individual antenna radiators. The connection represents an electromagnetic connection for signal transmission on the subarray, and may be understood to include a direct connection via a feed line and / or an indirect connection via coupling.

[0048] Although a single RFIC is illustrated as an example in FIGS. 2A and 2B, embodiments of the present disclosure are not limited thereto. For example, a layout structure in which the first sub-array (241) and the second sub-array (242) are connected to different RFICs in FIG. 2B can also be understood as an embodiment of the present disclosure.

[0049] FIG. 3 illustrates an example of a unit cell of an antenna array. The antenna array may include a plurality of antennas (each antenna may be referred to as an antenna element). In one embodiment, the antenna array may include a plurality of subarrays, and each subarray may include a plurality of antenna elements. FIG. 3 illustrates the structure of a unit cell corresponding to one antenna element.

[0050] Referring to FIG. 3, an antenna array according to embodiments of the present disclosure may be implemented in a substrate (300). The substrate (300) may include a plurality of layers. For example, the substrate (300) may include a first layer (311), a second layer (312), and a third layer (313). The plurality of layers may be stacked in one direction (e.g., the (+) z-axis direction). The substrate (300) may include conductive patterns formed on the first layer (311). For example, the conductive patterns may include a first conductive pattern (321) and a second conductive pattern (322). The first conductive pattern (321) may be formed on a first surface (e.g., a surface facing the (+) z-axis direction) of the first layer (311). The second conductive pattern (322) may be formed on a first surface (e.g., a surface facing the (+) z-axis direction) of the first layer (311). According to one embodiment, a plurality of layers of the substrate (300) may be formed of a dielectric. The substrate (300) may include a dielectric substrate (e.g., a low temperature co-fired ceramic (LTCC) substrate). The first layer (311), the second layer (312), and the third layer (313) may be ceramic layers.

[0051] The first conductive pattern (321) may be electrically connected to the first port (301). The first port (301) may represent a terminal to which a first signal output through the RF processing unit (113) and the filter unit (112) is applied. The first signal may be applied to the first conductive pattern (321). The second conductive pattern (322) may be electrically connected to the second port (302). The second port (302) may represent a terminal to which a second signal output through the RF processing unit (113) and the filter unit (112) is applied. The second signal may be applied to the second conductive pattern (322). Hereinafter, in the present disclosure, the term “port” is used to describe a feeding portion of an RF signal applied to a conductive pattern; however, other than “port,” “terminal,” “end,” “input,” “node,” and / or equivalent technical / structural terms may be used. The first conductive pattern (321) may be configured to feed a first signal. The first conductive pattern (321) may be understood as a feed line of the first signal. The second conductive pattern (322) may be configured to feed a second signal. The second conductive pattern (322) may be understood as a feed line of the second signal. At least a portion of the first conductive pattern (321) may be formed to feed the first signal along a designated direction (e.g., the (+) y-axis direction). At least a portion of the second conductive pattern (322) may be formed to feed the second signal along a designated direction (e.g., the (+) y-axis direction). In one embodiment, the designated direction may be a direction in which unit cells are arranged. In other words, the designated direction may be a direction in which antenna elements are arranged in a sub-array.

[0052] An antenna array according to embodiments of the present disclosure may be configured as a non-resonant antenna, and may be configured to radiate a signal through the principle of a traveling wave of a leaky wave. The traveling wave may be a wave different from a standing wave that occurs when one end is fixed. For example, when a first signal is applied to a first conductive pattern (321), the first signal may flow on the first conductive pattern (321). A leaky wave may be generated due to the traveling wave of the first signal on the first conductive pattern (321). When a second signal is applied to a second conductive pattern (322), the second signal may flow on the second conductive pattern (322). A leaky wave may be generated due to the traveling wave of the second signal on the second conductive pattern (322). Based on the above leaky waves, a radiation pattern can be formed on a plane (e.g., an xy plane). For example, the (+) z-axis direction can correspond to a boresight direction. An antenna implemented within the substrate (300) can be referred to as a leaky wave antenna (LWA).

[0053] The substrate (300) may include a coupling patch (330). The coupling patch (330) may be used to increase radiation gain. The coupling patch (330) may be used as an antenna radiator. The coupling patch (330) may be referred to as, in addition to a coupling patch, an antenna radiator, a radiating patch, a patch radiator, a conductive portion, a conductive patch, a coil, a conductive member, a radiating member, a radiating material, a radiating component, an antenna structure, an antenna structure, and / or equivalent technical terms. The coupling patch (330) may be coupled with a first signal radiated from a first conductive pattern (321) and / or a second signal radiated from a second conductive pattern (322). Through the coupling, the coupling patch (330) may provide a radiation pattern together with the first conductive pattern (321) and the second conductive pattern (322). In other words, the first conductive pattern (321) and the second conductive pattern (322) can share a coupling patch (330). As a non-limiting example, the coupling patch (330) can be used not only to increase radiation gain in a frequency band where signal gain is insufficient, but also for impedance matching.

[0054] The substrate (300) may include a ground layer (350). The ground layer (350) may be disposed below the plurality of layers (e.g., at a low height relative to the z-axis). The ground layer (350) may include a metal layer. For example, a second surface (e.g., a surface facing the (-) z-axis direction) opposite to a first surface (e.g., a surface facing the (+) z-axis direction) of the first layer (311) on which the first conductive pattern (321) and the second conductive pattern (322) are formed may be bonded to the metal layer.

[0055] Although a substrate (300) including three layers is illustrated in FIG. 3, embodiments of the present disclosure are not limited thereto. The substrate (300) may include more than three layers. In addition, although a structure in which a ground layer is disposed at the bottom of the substrate (300) is illustrated in FIG. 3, embodiments of the present disclosure are not limited thereto. The ground layer may be positioned at an intermediate point between the layers of the substrate (300). If a structure is formed in which a ground layer (e.g., a ground layer (350)), conductive patterns (e.g., a first conductive pattern (321), a second conductive pattern (322)), and a coupling patch (e.g., a coupling patch (330)) are sequentially stacked within the substrate (300), it can be understood as an embodiment of the present disclosure.

[0056] FIG. 4A illustrates an example of an antenna array including unit cells. The antenna array may include a plurality of antennas (each antenna may be referred to as an antenna element). In one embodiment, the antenna array may include a plurality of subarrays, each subarray including a plurality of antenna elements. Each of the antenna elements may correspond to a unit cell of FIG. 3. The same reference numerals may be used to indicate the same description.

[0057] Referring to FIG. 4A, an antenna array according to embodiments of the present disclosure may be implemented within a substrate (300). The substrate (300) may include an antenna array. The antenna array may include antennas (or antenna elements) having a 1x4 arrangement. The antenna array may include sub-arrays in that RF signals from the same source are provided to each unit cell. The unit cells illustrated in FIG. 3 may be repeatedly arranged along a designated direction (e.g., the (+) y-axis). For example, four unit cells may be arranged along the designated direction. The substrate (300) may include a first unit cell (401), a second unit cell (402), a third unit cell (403), and a fourth unit cell (404). Here, the arrangement of the unit cells does not indicate that independently manufactured unit cells are each combined, but rather indicates that logically distinct units are arranged within the substrate (300). For example, layers of the substrate (300) can be arranged through the unit cells.

[0058] The substrate (300) may include a plurality of layers (e.g., ceramic layers of an LTCC substrate). For example, the substrate (300) may include a first layer (311), a second layer (312), and a third layer (313). The plurality of layers may be stacked in one direction (e.g., the (+) z-axis direction). The substrate (300) may include conductive patterns formed on the first layer (311). For example, each conductive pattern may be a microstrip line disposed within the substrate (300). For example, the conductive patterns may include a first conductive pattern (321) and a second conductive pattern (322). The first conductive pattern (321) may be formed on a first surface (e.g., a surface facing the (+) z-axis direction) of the first layer (311). The second conductive pattern (322) may be formed on a first surface (e.g., a surface facing the (+) z-axis direction) of the first layer (311). For each of the first conductive pattern (321) and the second conductive pattern (322), the descriptions of FIG. 3 may be referred to. The first conductive pattern (321) may be electrically connected to the first port (301). The first conductive pattern (321) may be configured to supply a first signal of the first port (301). The second conductive pattern (322) may be electrically connected to the second port (302). The second conductive pattern (322) may be configured to supply a second signal of the second port (302). At least a portion of the first conductive pattern (321) may be formed to supply the first signal along a specified direction (e.g., the (+) y-axis direction). At least a portion of the second conductive pattern (322) may be formed to supply the second signal along a designated direction (e.g., the (+) y-axis direction). In one embodiment, the designated direction may be a direction in which unit cells (e.g., the first unit cell (401), the second unit cell (402), the third unit cell (403), and the fourth unit cell (404)) are arranged.As shown in FIG. 4a, in terms of the antenna elements being implemented within the unit cells of the repeating grid of the substrate (300), the substrate (300) may be referred to as a GAPCB (grid array PCB).

[0059] The substrate (300) may include a plurality of coupling patches. For example, the coupling patches may include a first coupling patch (431), a second coupling patch (432), a third coupling patch (433), and a fourth coupling patch (434). The coupling patches may be arranged on a third layer (313) of the substrate (300). As the unit cells are arranged in a designated direction (e.g., the y-axis direction), coupling patches (e.g., the coupling patches (330)) may also be arranged for each unit cell. For example, on the third layer (313), the first coupling patch (431) of the first unit cell (401), the second coupling patch (432) of the second unit cell (402), the third coupling patch (433) of the third unit cell (403), and the fourth coupling patch (434) of the fourth unit cell (404) may be arranged along the designated direction. As a non-limiting example, the coupling patches may be arranged such that there is a uniform spacing between two adjacent coupling patches. For each coupling patch, reference may be made to the description of coupling patch (330) in FIG. 3.

[0060] The structure that repeats for each unit cell can also be applied to a conductive pattern (e.g., a first conductive pattern (321), a second conductive pattern (322)). The conductive pattern can have a periodic structure. The conductive pattern can include a conductive portion that repeats for each unit cell. For example, as illustrated in FIG. 4A, the conductive portion can include a feed line that is formed by partially bending. The conductive portion can have various shapes, and examples of the various shapes are specifically described through FIG. 10. According to one embodiment, the first conductive pattern (321) and the second conductive pattern (322) can be symmetrical with respect to the specified direction. For example, the conductive portion of the first conductive pattern (321) that repeats for each unit cell and the conductive portion of the second conductive pattern (322) can be symmetrical with respect to each other with respect to the specified direction.

[0061] The antenna array of the substrate (300) may be configured to support dual polarization. For example, the antenna array (or sub-array) may be configured to radiate a signal of a first polarization. The antenna array (or sub-array) may be configured to radiate a signal of a second polarization. The first polarization and the second polarization may be substantially perpendicular. For example, the first polarization may provide a +45 degree polarization and the second polarization may provide a -45 degree polarization. As another example, the first polarization may provide a vertical polarization and the second polarization may provide a horizontal polarization.

[0062] A first signal flowing on a first conductive pattern (321) can cause a first leakage wave. A second signal flowing on a second conductive pattern (322) can cause a second leakage wave. The traveling wave of the first leakage wave and the traveling wave of the second leakage wave can be combined to form a radiation pattern. To control the radiation characteristics (e.g., aiming direction, polarization, phase) of the radiation pattern formed by the combination of the leakage waves, multiple modes can be used. For example, the antenna array of the substrate (300) can generate a radiation pattern according to the first mode. The phase of the first signal supplied through the first port (301) for the first mode and the phase of the second signal supplied through the second port (302) can be the same. For example, the antenna array of the substrate (300) can generate a radiation pattern according to the second mode. The phase of the first signal supplied through the first port (301) for the second mode may be different from the phase of the second signal supplied through the second port (302). The phase difference between the phase of the first signal and the phase of the second signal may be substantially 180 degrees. The first mode may be referred to as even-mode, first polarization mode, vertical polarization mode, first operating mode, fundamental mode, EH0 mode, and / or equivalent technical terms therefor. The second mode may be referred to as odd-mode, second polarization mode, horizontal polarization mode, second operating mode, higher-order mode, EH1 mode, and / or equivalent technical terms therefor. As a non-limiting example, the first signal and the second signal may be referred to as signals in a differential mode in that different signals are applied.

[0063] Although a substrate (300) including three layers is illustrated in FIG. 4A, embodiments of the present disclosure are not limited thereto. The substrate (300) may include more than three layers. In addition, although a structure in which a ground layer is disposed at the bottom of the substrate (300) is illustrated in FIG. 4A, embodiments of the present disclosure are not limited thereto. The ground layer may be positioned at an intermediate point between the layers of the substrate (300). If a structure is formed in which a ground layer (e.g., a ground layer (350)), conductive patterns (e.g., a first conductive pattern (321), a second conductive pattern (322)), and coupling patches (e.g., a first coupling patch (431), a second coupling patch (432), a third coupling patch (433), and a fourth coupling patch (434)) are sequentially stacked within the substrate (300), it can be understood as an embodiment of the present disclosure.

[0064] Figures 4b and 4c illustrate examples of the performance of an antenna array. The antenna array illustrates the performance of an antenna array implemented on the substrate (300) of Figure 4a.

[0065] Referring to FIG. 4B, a graph (470) represents peak realized gain by frequency. The horizontal axis of the graph (470) represents frequency (unit: GHz (gigahertz)), and the vertical axis of the graph (470) represents peak realized gain (unit: dB (decibel)). A first line (471) represents peak realized gain by frequency when signals of the first mode are fed to the substrate (300) of FIG. 4A. A second line (472) represents peak realized gain by frequency when signals of the second mode are fed to the substrate (300) of FIG. 4A. Comparing the first line (471) and the second line (472), it can be confirmed that the peak realized gain of signals of the first polarization (e.g., vertical polarization) is measured high in a specific frequency range, and the peak realized gain of signals of the second polarization (e.g., horizontal polarization) is measured high in another frequency range. Accordingly, an electronic device (e.g., electronic device (160)) including a substrate (300) may be configured to select a polarization advantageous to a frequency band for performing communication and output signals corresponding to the selected polarization. For example, when transmitting a signal in a frequency band of about 20 GHz, the electronic device (160) may operate in a first mode for generating a first polarization.

[0066] Referring to Fig. 4c, the graph (480) shows the S-parameters (e.g., reflection coefficient, S) by frequency. 11) is shown. The horizontal axis of the graph (480) represents frequency (unit: GHz), and the vertical axis of the graph (480) represents S-parameter (unit: dB). The graph (480) shows the radiation performance according to the presence or absence of coupling patches (e.g., the first coupling patch (431), the second coupling patch (432), the third coupling patch (433), and the fourth coupling patch (434)). The first line (481) shows the reflection coefficient by frequency when there is no coupling patch (e.g., the first coupling patch (431), the second coupling patch (432), the third coupling patch (433), and the fourth coupling patch (434)) in the antenna array of the substrate (300) of FIG. 4A. The second line (482) shows the reflection coefficient by frequency in the antenna array of the substrate (300) of FIG. 4A. Comparing the first line (481) and the second line (482), a frequency range having a reflection coefficient lower than the pass gain (e.g., -10 dB) can be identified. This frequency range can be understood as a frequency band in which communication is possible through the antenna array of the substrate (300).

[0067] FIG. 4D is a diagram for explaining the principle of the antenna array. The antenna array may correspond to not only the 1x4 antenna array of the substrate (300) illustrated in FIG. 4A, but also a two-dimensional antenna array described later. Referring to FIG. 4D, a graph (490) represents a phase constant by frequency. The horizontal axis of the graph (490) represents a frequency (unit: GHz), and the vertical axis of the graph (490) may represent a phase parameter (Y) (unit: meter) that is inversely proportional to the phase constant. It can be understood that the larger the phase parameter, the smaller the phase constant, and the smaller the phase parameter, the larger the phase constant. The first line (491) represents a phase parameter according to the structure of conductive patterns (e.g., the first conductive pattern (321), the second conductive pattern (322)) implemented in the substrate (300). The second line (492) represents a phase parameter for radio waves on a wireless channel (e.g., in the air). The third line (493) represents the phase parameter for attenuation.

[0068] Each of the first conductive pattern (321) and the second conductive pattern (322) can cause a traveling wave. The traveling wave is a leakage wave, and must travel faster than a radio wave in the air to be radiated onto a wireless channel. If the phase parameter of the radiated signal is lower than the phase parameter of the radio wave in the air, it can be understood that the speed at which the signal is output from the radiator (e.g., coupling patch, conductive portion) to the outside is faster than the speed at which the signal is introduced from the outside to the radiator. In other words, the radiated signal is faster, so that the leakage wave can be radiated onto a wireless channel. Therefore, in order for a radiation pattern to be formed in the antenna array of the substrate (300), the value of the first line (491) with respect to the y-axis must be lower than a value lower than that of the second line (492). For example, signals can be radiated in the first frequency range (498a) and the second frequency range (498b), respectively. For example, the antenna array can form a radiation pattern in the aiming direction at a first frequency (499a) in a first frequency range (498a). For example, the antenna array can form a radiation pattern in the aiming direction at a second frequency (499b) in a second frequency range (498b). Since a traveling wave has periodicity, a plurality of frequency bands (e.g., a frequency band of about 16 GHz and a frequency band of about 32 GHz) can be supported through the shape of the same antenna array. For example, the plurality of frequency bands can include a Ku (K-under) band (e.g., about 12 GHz or more and less than 18 GHz) and / or a Ka (K-above) band (e.g., about 26.5 GHz or more and less than 40 GHz).

[0069] Figures 5a and 5b illustrate examples of conductive patterns of an antenna array (e.g., a first conductive pattern (321), a second conductive pattern (322)). Like reference numerals may be used to indicate like descriptions.

[0070] Referring to FIG. 5A, an antenna array according to embodiments of the present disclosure may be implemented within a substrate (300). The substrate (300) may include an antenna array. The antenna array may include antennas (or antenna elements) having a 1x3 arrangement. The antenna array may include sub-arrays in that RF signals from the same source are provided to each unit cell. The unit cells illustrated in FIG. 3 may be repeatedly arranged along a designated direction (e.g., the (+) y-axis). For example, three unit cells may be arranged along the designated direction. The substrate (300) may include a first unit cell (501), a second unit cell (502), and a third unit cell (503). Here, the arrangement of the unit cells does not indicate that independently manufactured unit cells are each combined, but rather indicates that logically distinct units are arranged within the substrate (300). For example, layers of the substrate (300) may be arranged via the unit cells. The substrate (300) may include a plurality of layers. For example, the substrate (300) may include a first layer (311), a second layer (312), and a third layer (313). The plurality of layers may be stacked in one direction (e.g., the (+) z-axis direction). For each of the first conductive pattern (321) and the second conductive pattern (322), reference may be made to the descriptions of FIGS. 3, 4A, 4B, 4C, and 4D.

[0071] Referring to FIG. 5B, the first conductive pattern (321) may be a feed line for the first signal. The feed line may have a shape that is repeated for each unit cell (e.g., the first unit cell (501), the second unit cell (502), and the third unit cell (503)). A first end of the feed line may be connected to a first port (541), and a second end of the feed line may be connected to a third port (543). In order to generate a traveling wave, different from a standing wave, through the feed line, one end of the feed line may be connected to a separate element. For example, an RF signal (e.g., the first signal) may be fed to the first conductive pattern (321) through the first port (541), and an element having a load impedance corresponding to the characteristic impedance of the line may be connected to the third port (543). For example, an RF signal (e.g., a first signal) may be fed to a first conductive pattern (321) through a first port (541), and an RF absorber may be disposed at a third port (543). A second conductive pattern (322) may be a feed line for the second signal. The feed line may have a shape that is repeated for each unit cell (e.g., the first unit cell (501), the second unit cell (502), and the third unit cell (503)). A first end of the feed line may be connected to a second port (542), and a second end of the feed line may be connected to a fourth port (544). In order to generate a traveling wave through the feed line, one end of the feed line may be connected to a separate element. For example, an RF signal (e.g., a first signal) may be supplied to the second conductive pattern (322) through the second port (542), and a component having a load impedance corresponding to the characteristic impedance of the line may be connected to the fourth port (544). For example, an RF signal (e.g., a second signal) may be supplied to the second conductive pattern (322) through the second port (542), and an RF absorber may be disposed at the fourth port (544).

[0072] FIG. 5c shows examples of operation modes (e.g., first operation mode, second operation mode) using conductive patterns (e.g., first conductive pattern (321), second conductive pattern (322)).

[0073] Referring to FIG. 5c, example (551) represents an electric field and current density according to a first signal of a first conductive pattern (321) and a second signal of a second conductive pattern (322) in a first mode. In the first mode, the first signal of the first conductive pattern (321) and the second signal of the second conductive pattern (322) may be in phase. The first signal may form an electric field and / or a magnetic field while flowing on the first conductive pattern (321). For example, an electric field may be formed in a direction from the first conductive pattern (321) toward the ground layer (350). The second signal may form an electric field and / or a magnetic field while flowing on the second conductive pattern (322). For example, an electric field may be formed in a direction from the second conductive pattern (322) toward the ground layer (350). As signals having the same phase in the first mode flow along a designated direction, a current density in the designated direction (e.g., (+) y-axis direction) can be formed in each conductive portion (a portion corresponding to a repeating shape in a unit cell) of the first conductive pattern (321). Since a radiation pattern in the designated direction is formed due to the propagation of leakage waves of the first signal and the second signal, a vertical polarization can be formed.

[0074] Example (552) shows an electric field and current density according to a first signal of a first conductive pattern (321) and a second signal of a second conductive pattern (322) in a second mode. In the second mode, the first signal of the first conductive pattern (321) and the second signal of the second conductive pattern (322) may have opposite phases. That is, the difference between the phases of the first signal and the second signal may be about 180 degrees. The first signal may form an electric field and / or a magnetic field while flowing on the first conductive pattern (321). For example, when viewed in a propagating direction (e.g., (+) y-axis direction), an electric field may be formed in a direction toward the ground layer (350) at one end of the first conductive pattern (321), and an electric field may be formed in a direction coming from the ground layer (350) at the other end of the first conductive pattern (321). The second signal may flow on the second conductive pattern (322) to form an electric field and / or a magnetic field. For example, when viewed in the propagating direction (e.g., the (+) y-axis direction), an electric field may be formed at one end of the second conductive pattern (322) in a direction toward the ground layer (350), and an electric field may be formed at the other end of the second conductive pattern (322) in a direction coming from the ground layer (350). As signals having phases in opposite directions flow in the second mode and a magnetic field is formed perpendicular to the designated direction, a current density may be formed in a direction perpendicular to the propagating direction of the propagating wave (e.g., the (+) y-axis direction) (e.g., the (-) x-axis direction). Due to the magnetic field in the same direction, a horizontal polarization may be formed.

[0075] Fig. 5d shows an example of the performance of an antenna array. The antenna array may correspond to the antenna array of the substrate (300) of Fig. 5a.

[0076] Referring to FIG. 5d, the graph (570) shows the frequency-dependent S-parameters (e.g., reflection coefficient, S) of the antenna array. 11 ) is shown. The horizontal axis of the graph (570) represents frequency (unit: GHz), and the vertical axis of the graph (570) represents S-parameter (unit: dB). In the graph (570), a frequency range having a reflection coefficient lower than a threshold value (e.g., about -10 dB) may include a supportable frequency band. For example, the antenna array of the substrate (300) may support a frequency range of about 7 GHz to less than 23 GHz, a frequency range of about 26 GHz to less than 28 GHz, and / or a frequency range of about 38 GHz to more than 38 GHz.

[0077] Fig. 5e shows an example of the performance of the antenna array according to each operating mode. Graph (590) shows the peak realized gain by frequency. The horizontal axis of graph (590) represents the frequency (unit: GHz (gigahertz)), and the vertical axis of graph (590) represents the peak realized gain (unit: dB). A first line (591) shows the peak realized gain by frequency when signals of a first mode (e.g., signals of the same phase for providing a first polarization (vertical polarization)) are fed to the substrate (300) of Fig. 5a. A second line (592) shows the peak realized gain by frequency when signals of a second mode (e.g., signals of the opposite phase for providing a second polarization (horizontal polarization)) are fed to the substrate (300) of Fig. 4a. Comparing the first line (591) and the second line (592), it can be confirmed that the peak realized gain of signals of the first polarization (e.g., vertical polarization) is measured high in a specific frequency range, and the peak realized gain of signals of the second polarization (e.g., horizontal polarization) is measured high in another frequency range. Accordingly, an electronic device (e.g., electronic device (160)) including a substrate (300) can be configured to select a polarization that is advantageous to a frequency band for performing communication and output signals corresponding to the selected polarization. For example, when a signal is to be transmitted in a frequency band of about 20 GHz, the electronic device (160) can operate in a second mode for generating a second polarization (horizontal polarization). For example, when a signal is to be transmitted in a frequency band of about 100 GHz, the electronic device (160) can operate in a first mode for generating a first polarization (vertical polarization).

[0078] FIG. 6A illustrates examples of conductive patterns of a two-dimensional antenna array. The antenna array may include a plurality of antennas (each antenna may be referred to as an antenna element). In one embodiment, the antenna array may include a plurality of sub-arrays, each sub-array including a plurality of antenna elements. Each of the antenna elements may correspond to a unit cell of FIG. 3. The same reference numerals may be used to indicate the same description.

[0079] Referring to FIG. 6A, an antenna array according to embodiments of the present disclosure may be implemented in a substrate (300). The substrate (300) may include an antenna array. The antenna array may include antennas (or antenna elements) having a 4x3 arrangement. According to one embodiment, the antenna array may include four sub-arrays. For example, the antenna array may include a first sub-array, a second sub-array, a third sub-array, and a fourth sub-array. As an example, the first sub-array may have a 1x3 configuration. The first sub-array may include a first unit cell (601a), a second unit cell (602a), and a third unit cell (603a). For the first sub-array, a first conductive pattern (621a) and a second conductive pattern (622a) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate). For the first conductive pattern (621a), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (622a), reference may be made to the description of the second conductive pattern (322). As an example, the second sub-array may have a 1x3 shape. The second sub-array may include a first unit cell (601b), a second unit cell (602b), and a third unit cell (603b). For the second sub-array, a first conductive pattern (621b) and a second conductive pattern (622b) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate). For the first conductive pattern (621b), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (622b), reference may be made to the description of the second conductive pattern (322). As an example, the third sub-array may have a 1x3 shape. The third sub-array may include a first unit cell (601c), a second unit cell (602c), and a third unit cell (603c).For the third sub-array, a first conductive pattern (621c) and a second conductive pattern (622c) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate). For the first conductive pattern (621c), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (622c), reference may be made to the description of the second conductive pattern (322). As an example, the fourth sub-array may have a 1x3 shape. The fourth sub-array may include a first unit cell (601d), a second unit cell (602d), and a third unit cell (603d). For the fourth sub-array, a first conductive pattern (621d) and a second conductive pattern (622d) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate). For the first conductive pattern (621d), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (622d), reference may be made to the description of the second conductive pattern (322). Conductive patterns corresponding to multiple sub-arrays may be formed on different regions on the same layer of the substrate (300). In other words, sub-arrays may be arranged on different regions in a layer (e.g., an xy plane) of the same height (e.g., a distance in the (+) z-axis direction in the xy plane). The above sub-arrays may be arranged in a direction perpendicular to the direction in which the antenna elements of each sub-array are arranged (e.g., the (-) x-axis direction). As shown in Fig. 6a, in terms of implementing the antenna elements within the unit cells of the repeating grid of the substrate (300), the substrate (300) may be referred to as a GAPCB.

[0080] The antenna array of the substrate (300) may include four sub-arrays. Accordingly, each sub-array of the substrate (300) may form a radiation pattern. The antenna array of the substrate (300) may form four independent radiation patterns. To form the radiation patterns, a first signal and a second signal may be supplied to the conductive patterns of each sub-array. For example, for the first sub-array, the first conductive pattern (621a) and the second conductive pattern (622a) may be respectively connected to the first port and the second port for signal supply. For example, for the second sub-array, the first conductive pattern (621b) and the second conductive pattern (622b) may be respectively connected to the third port and the fourth port for signal supply. For example, for the third sub-array, the first conductive pattern (621c) and the second conductive pattern (622c) may be respectively connected to the fifth port and the sixth port for signal supply. For example, for the fourth sub-array, the first conductive pattern (621d) and the second conductive pattern (622d) may be respectively connected to the seventh port and the eighth port for signal supply. Each port is connected to an independent RF path, and a signal may be applied to the corresponding port from an RF processing circuit (e.g., an RF processing unit (113)) through the RF path. The first signal and the second signal may be determined according to an operation mode (e.g., a first mode, a second mode). For example, when the operation mode is the first mode, the phases of the first signal and the second signal may be the same. For example, if the operation mode is the second mode, the difference between the phase of the first signal and the phase of the second signal may be about 180 degrees.

[0081] Figures 6b and 6c illustrate examples of the performance of a two-dimensional antenna array. The antenna array illustrates the performance of an antenna array implemented on the substrate (300) of Figure 6a.

[0082] Referring to FIG. 6b, the graph (670) shows the frequency-dependent S-parameters (e.g., reflection coefficient, S) of the antenna array. 11 ) is shown. The horizontal axis of the graph (670) represents frequency (unit: GHz), and the vertical axis of the graph (670) represents S-parameter (unit: dB). The lines of the graph (670) may correspond to the ports of the antenna array of FIG. 6A, respectively. The ports may include a first port (e.g., a port connected to a first conductive pattern (621a) of a first sub-array), a second port (e.g., a port connected to a second conductive pattern (621b) of the first sub-array), a third port (e.g., a port connected to a first conductive pattern (622a) of a second sub-array), a fourth port (e.g., a port connected to a second conductive pattern (622b) of the second sub-array), a fifth port (e.g., a port connected to a first conductive pattern (623a) of a third sub-array), a sixth port (e.g., a port connected to a second conductive pattern (623b) of the third sub-array), a seventh port (e.g., a port connected to a first conductive pattern (624a) of a fourth sub-array), and an eighth port (e.g., a port connected to a second conductive pattern (624b) of the fourth sub-array). Frequency ranges having a reflection coefficient lower than a threshold value (e.g., approximately -10 dB) in the graph (670) may include supportable frequency bands. For example, the antenna array of the substrate (300) may support a frequency range of approximately 5 GHz to less than 24 GHz, a frequency range of approximately 27 GHz to less than 29 GHz, and / or a frequency range of approximately 35 GHz to greater than 35 GHz.

[0083] Referring to FIG. 6C, a graph (690) represents peak realized gain by frequency. The horizontal axis of the graph (690) represents frequency (unit: GHz), and the vertical axis of the graph (690) represents peak realized gain (unit: dB). A first line (691) represents peak realized gain by frequency when signals of the first mode are fed to the substrate (300) of FIG. 6A. A second line (692) represents peak realized gain by frequency when signals of the second mode are fed to the substrate (300) of FIG. 6A. Comparing the first line (691) and the second line (692), it can be confirmed that the peak realized gain of signals of the first polarization (e.g., vertical polarization) is measured high in a specific frequency range, and the peak realized gain of signals of the second polarization (e.g., horizontal polarization) is measured high in another frequency range. Accordingly, an electronic device (e.g., electronic device (160)) including a substrate (300) may be configured to select a polarization advantageous to a frequency band for performing communication and output signals corresponding to the selected polarization. For example, when a signal is to be transmitted in a frequency band of about 7 GHz, the electronic device (160) may operate in a first mode for generating a first polarization. For example, when a signal is to be transmitted in a frequency band of about 24 GHz, the electronic device (160) may operate in a second mode for generating a second polarization.

[0084] FIG. 7A illustrates examples of conductive patterns of a two-dimensional antenna array. The antenna array may include a plurality of antennas (each antenna may be referred to as an antenna element). In one embodiment, the antenna array may include a plurality of sub-arrays, each sub-array including a plurality of antenna elements. Each of the antenna elements may correspond to a unit cell of FIG. 3. The same reference numerals may be used to indicate the same description.

[0085] Referring to FIG. 7A, an antenna array according to embodiments of the present disclosure may be implemented in a substrate (300). The substrate (300) may include an antenna array. The antenna array may include antennas (or antenna elements) having a 4x4 arrangement. According to one embodiment, the antenna array may include four sub-arrays. For example, the antenna array may include a first sub-array, a second sub-array, a third sub-array, and a fourth sub-array. As an example, the first sub-array may have a 1x4 configuration. The first sub-array may include a first unit cell (701a), a second unit cell (702a), a third unit cell (703a), and a fourth unit cell (704a). For the first sub-array, a first conductive pattern (721a) and a second conductive pattern (722a) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate). Each of the first conductive pattern (721a) and the second conductive pattern (722a) may be formed across the first unit cell (701a), the second unit cell (702a), the third unit cell (703a), and the fourth unit cell (704a) on the first layer (311). For the first conductive pattern (721a), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (722a), reference may be made to the description of the second conductive pattern (322). As an example, the second sub-array may have a 1x4 shape. The second sub-array may include a first unit cell (701b), a second unit cell (702b), a third unit cell (703b), and a fourth unit cell (704b). For the second sub-array, a first conductive pattern (721b) and a second conductive pattern (722b) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate).Each of the first conductive pattern (721b) and the second conductive pattern (722b) may be formed across the first unit cell (701b), the second unit cell (702b), the third unit cell (703b), and the fourth unit cell (704b) on the first layer (311). For the first conductive pattern (721b), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (722b), reference may be made to the description of the second conductive pattern (322). For example, the third sub-array may have a 1x4 shape. The third sub-array may include the first unit cell (701c), the second unit cell (702c), the third unit cell (703c), and the fourth unit cell (704c). For the third sub-array, a first conductive pattern (721c) and a second conductive pattern (722c) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate). Each of the first conductive pattern (721c) and the second conductive pattern (722c) may be formed across the first unit cell (701c), the second unit cell (702c), the third unit cell (703c), and the fourth unit cell (704c) on the first layer (311). For the first conductive pattern (721c), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (722c), reference may be made to the description of the second conductive pattern (322). As an example, the fourth sub-array may have a 1x4 shape. The fourth sub-array may include a first unit cell (701d), a second unit cell (702d), a third unit cell (703d), and a fourth unit cell (704d). For the fourth sub-array, a first conductive pattern (721d) and a second conductive pattern (722d) may be formed on a first layer (311) of a substrate (300) (e.g., a ceramic layer of an LTCC substrate).Each of the first conductive pattern (721d) and the second conductive pattern (722d) may be formed across the first unit cell (701d), the second unit cell (702d), the third unit cell (703d), and the fourth unit cell (704d) on the first layer (311). For the first conductive pattern (721d), reference may be made to the description of the first conductive pattern (321). For the second conductive pattern (722d), reference may be made to the description of the second conductive pattern (322). Conductive patterns corresponding to a plurality of sub-arrays may be formed on different regions on the same layer of the substrate (300). In other words, the sub-arrays may be arranged on different regions in a layer (e.g., in the xy plane) of the same height (e.g., the distance in the (+) z-axis direction in the xy plane). The above sub-arrays may be arranged in a direction perpendicular to the direction in which the antenna elements of each sub-array are arranged (e.g., the (-) x-axis direction). As shown in Fig. 7a, in terms of implementing the antenna elements within the unit cells of the repeating grid of the substrate (300), the substrate (300) may be referred to as a GAPCB.

[0086] The antenna array of the substrate (300) may include four sub-arrays. Accordingly, each sub-array of the substrate (300) may form a radiation pattern. The antenna array of the substrate (300) may form four independent radiation patterns. To form the radiation patterns, a first signal and a second signal may be supplied to the conductive patterns of each sub-array. For example, for the first sub-array, the first conductive pattern (721a) and the second conductive pattern (722a) may be connected to the first port and the second port for signal supply, respectively. For example, for the second sub-array, the first conductive pattern (721b) and the second conductive pattern (722b) may be connected to the third port and the fourth port for signal supply, respectively. For example, for the third sub-array, the first conductive pattern (721c) and the second conductive pattern (722c) may be respectively connected to the fifth port and the sixth port for signal supply. For example, for the fourth sub-array, the first conductive pattern (721d) and the second conductive pattern (722d) may be respectively connected to the seventh port and the eighth port for signal supply. Each port is connected to an independent RF path, and a signal may be applied to the corresponding port from an RF processing circuit (e.g., an RF processing unit (113)) through the RF path. The first signal and the second signal may be determined according to an operation mode (e.g., a first mode, a second mode). For example, when the operation mode is the first mode, the phases of the first signal and the second signal may be the same. For example, if the operation mode is the second mode, the difference between the phase of the first signal and the phase of the second signal may be about 180 degrees.

[0087] The substrate (300) may include a plurality of coupling patches. As the unit cells in the sub-array are arranged in a designated direction (e.g., the y-axis direction), a coupling patch (e.g., the coupling patch (330)) may also be arranged for each unit cell. For example, on the third layer (313), a first coupling patch (731a) of a first unit cell (701a) for a first sub-array, a second coupling patch (732a) of a second unit cell (702a), a third coupling patch (733a) of a third unit cell (703a), and a fourth coupling patch (734a) of a fourth unit cell (704a) may be arranged along a designated direction (e.g., the (+) y-axis direction). On the third layer (313), the first coupling patch (731b) of the first unit cell (701b) for the second sub-array, the second coupling patch (732b) of the second unit cell (702b), the third coupling patch (733b) of the third unit cell (703b), and the fourth coupling patch (734b) of the fourth unit cell (704b) can be arranged along a designated direction (e.g., the (+) y-axis direction). On the third layer (313), the first coupling patch (731c) of the first unit cell (701c) for the third sub-array, the second coupling patch (732c) of the second unit cell (702c), the third coupling patch (733c) of the third unit cell (703c), and the fourth coupling patch (734c) of the fourth unit cell (704c) can be arranged along a designated direction (e.g., the (+) y-axis direction). On the third layer (313), the first coupling patch (731d) of the first unit cell (701d) for the fourth sub-array, the second coupling patch (732d) of the second unit cell (702d), the third coupling patch (733d) of the third unit cell (703d), and the fourth coupling patch (734d) of the fourth unit cell (704d) can be arranged along a specified direction (e.g., the (+) y-axis direction).

[0088] Figure 7b shows an example of the performance of a two-dimensional antenna array.

[0089] Referring to FIG. 7B, a graph (770) represents peak realized gain by frequency. The horizontal axis of the graph (770) represents frequency (unit: GHz), and the vertical axis of the graph (770) represents peak realized gain (unit: dB). A first line (771) represents peak realized gain by frequency when signals of the first mode are fed to the substrate (300) of FIG. 7A. A second line (772) represents peak realized gain by frequency when signals of the second mode are fed to the substrate (300) of FIG. 7A. Comparing the first line (771) and the second line (772), it can be confirmed that the peak realized gain of signals of the first polarization (e.g., vertical polarization) is measured high in a specific frequency range, and the peak realized gain of signals of the second polarization (e.g., horizontal polarization) is measured high in another frequency range. Accordingly, an electronic device (e.g., electronic device (160)) including a substrate (300) may be configured to select a polarization advantageous to a frequency band for performing communication and output signals corresponding to the selected polarization. For example, when transmitting a signal in a frequency band of about 23 GHz, the electronic device (160) may operate in a first mode for generating a first polarization.

[0090] FIG. 8 illustrates an example of a two-dimensional antenna array including RF absorbers. The two-dimensional antenna array may correspond to the antenna array implemented on the substrate (300) of FIG. 7A. The same reference numerals may be used to indicate the same description.

[0091] Referring to FIG. 8, the antenna array of the substrate (300) may include the first sub-array, the second sub-array, the third sub-array, and the fourth sub-array of FIG. 7a. According to one embodiment, the conductive patterns of the sub-arrays may be connected to RF absorbers to generate a traveling wave through each conductive pattern of each sub-array within a limited space (e.g., antenna in package (AiP)). For example, the first conductive pattern (721a) and the second conductive pattern (722a) of the first sub-array may be connected to the first RF absorber (899a). For example, the first conductive pattern (721b) and the second conductive pattern (722b) of the second sub-array may be connected to the second RF absorber (899b). For example, the first conductive pattern (721c) and the second conductive pattern (722c) of the third sub-array may be connected to the third RF absorber (899c). For example, the first conductive pattern (721d) and the second conductive pattern (722d) of the fourth sub-array may be connected to the fourth RF absorber (899d).

[0092] The first conductive pattern (721a) of the first sub-array may include a first end connected to the first port based on the specified direction (e.g., (+) y-axis) and a second end connected to the first RF absorber (899a). The second conductive pattern (722a) of the first sub-array may include a first end connected to the second port based on the specified direction (e.g., (+) y-axis) and a second end connected to the first RF absorber (899a). The first conductive pattern (721b) of the second sub-array may include a first end connected to the third port based on the specified direction (e.g., (+) y-axis) and a second end connected to the second RF absorber (899b). The second conductive pattern (722b) of the first sub-array may include a first end connected to the fourth port based on the specified direction (e.g., (+) y-axis) and a second end connected to the second RF absorber (899b). The first conductive pattern (721c) of the third sub-array may include a first end connected to the fifth port based on the specified direction (e.g., (+) y-axis) and a second end connected to the third RF absorber (899c). The second conductive pattern (722c) of the first sub-array may include a first end connected to the sixth port based on the specified direction (e.g., (+) y-axis) and a second end connected to the third RF absorber (899c). The first conductive pattern (721d) of the fourth sub-array may include a first end connected to the seventh port in the specified direction (e.g., (+) y-axis) and a second end connected to the fourth RF absorber (899d). The second conductive pattern (722d) of the first sub-array may include a first end connected to the eighth port in the specified direction (e.g., (+) y-axis) and a second end connected to the fourth RF absorber (899d).

[0093] Although FIG. 8 illustrates an example in which one RF absorber is connected to each sub-array, embodiments of the present disclosure are not limited thereto. In one embodiment, an independent RF absorber may be connected to each conductive pattern.

[0094] FIG. 9 illustrates an example of a unit cell including conductive patterns that are fed in different directions (e.g., a first conductive pattern (321), a second conductive pattern (322)). Like reference numerals may be used to indicate like descriptions. Although FIGS. 3 through 8 illustrate two conductive patterns configured to feed a signal in a designated direction to the unit cell, embodiments of the present disclosure are not limited thereto. For dual polarizations, additional conductive patterns may be formed within the substrate (300) to feed a signal in a direction substantially perpendicular to the designated direction.

[0095] Referring to FIG. 9, the substrate (300) may include a plurality of layers. For example, the substrate (300) may include a first layer (311), a second layer (312), and a third layer (313). For the substrate (300), the descriptions of FIG. 3 may be referred to. The substrate (300) may include conductive patterns formed on the first layer (311). For example, the conductive patterns may include a first conductive pattern (321) and a second conductive pattern (322). The first conductive pattern (321) may be formed on a first side (e.g., a side facing the (+) z-axis direction) of the first layer (311). The second conductive pattern (322) may be formed on a first side (e.g., a side facing the (+) z-axis direction) of the first layer (311). The substrate (300) may include a coupling patch (330). A coupling patch (330) may be used to increase radiation gain. The coupling patch (330) may be used as an antenna radiator. The substrate (300) may include a ground layer (350). The ground layer (350) may be positioned below the plurality of layers (e.g., at a low height relative to the z-axis). The ground layer (350) may include a metal layer.

[0096] In one embodiment, the substrate (300) may include a third conductive pattern (911) and a fourth conductive pattern (912). The third conductive pattern (911) and the fourth conductive pattern (912) may be disposed on a third layer (313). A radiating patch (330) may be disposed between the third conductive pattern (911) and the fourth conductive pattern (912) on the third layer (313). A third signal may be applied to the third conductive pattern (911). A fourth signal may be applied to the fourth conductive pattern (912). Depending on the difference in phase of the third signal and the phase of the fourth signal, the third conductive pattern (911) and the fourth conductive pattern (912) may support multiple polarizations. For example, when the difference between the phase of the third signal and the phase of the fourth signal is about 0 degrees, the third conductive pattern (911) and the fourth conductive pattern (912) can generate a radiation pattern of a first polarization. When the difference between the phase of the third signal and the phase of the fourth signal is about 180 degrees, the third conductive pattern (911) and the fourth conductive pattern (912) can generate a radiation pattern of a second polarization. The second polarization can be substantially perpendicular to the first polarization.

[0097] In one embodiment, the polarizations provided through the third conductive pattern (911) and the fourth conductive pattern (912) may be different from the polarizations provided through the first conductive pattern (321) and the second conductive pattern (322). That is, the substrate (300) may provide four different polarizations. In another embodiment, the polarizations provided through the third conductive pattern (911) and the fourth conductive pattern (912) may be the same as the polarizations provided through the first conductive pattern (321) and the second conductive pattern (322). The third conductive pattern (911) and the fourth conductive pattern (912) may be used to complement the first conductive pattern (321) and the second conductive pattern (322), respectively. As a non-limiting example, signals of a specific polarization may be output through the third conductive pattern (911) and the fourth conductive pattern (912), and signals of a polarization perpendicular to the specific polarization may be output through the first conductive pattern (321) and the second conductive pattern (322), thereby forming a circular polarization.

[0098] Although FIGS. 3 to 9 illustrate a structure in which a coupling patch (e.g., coupling patch (330)) is formed on the third layer (313), embodiments of the present disclosure are not limited thereto. According to one embodiment, the coupling patch (e.g., coupling patch (330)) may be disposed on the second layer (312). According to another embodiment, the coupling patch (e.g., coupling patch (330)) may be disposed on a layer that is at least two layers further down than the first layer (311).

[0099] Fig. 10 illustrates examples of conductive portions of a sub-array. The conductive portion refers to a portion of a conductive pattern (e.g., a first conductive pattern (321), a second conductive pattern (322)) formed across the unit cells of the sub-array that is repeated for each unit cell. The length of the conductive portion may affect the total length of a path along which a signal flows in the conductive pattern. For example, as the total length of the path increases, a frequency range having a high phase constant may decrease. In order to design frequency bands to be supported through the substrate (300), the shape of the conductive portion may be determined. In Figs. 3 to 9, examples are shown in which the conductive portions of the conductive patterns of the unit cells have a curved shape (e.g., a 'half-hat shape') corresponding to a portion of a hexagonal shape. However, if a portion of the feed line of the conductive portion has a curved shape facing in a direction different from the direction of wave propagation, it may be understood as an embodiment of the present disclosure. Below, various shapes of challenging parts are illustrated through Fig. 10.

[0100] Referring to FIG. 10, in a first example (1001), the conductive portions of the conductive patterns of the unit cell may have a curved shape (e.g., each conductive portion has a 'square hat shape') to correspond to a portion of a rectangular shape (e.g., a square). In a second example (1002), the conductive portions of the conductive patterns of the unit cell may have a curved shape (e.g., each conductive portion has a 'semicircular hat shape') to correspond to a portion of a circle. In a third example (1003), the conductive portions of the conductive patterns of the unit cell may have a curved shape (e.g., each conductive portion has a 'triangular hat shape') to correspond to a portion of a rhombus shape. In a fourth example (1004), the conductive portions of the conductive patterns of the unit cell may have a curved shape to correspond to a portion of an 'X' shape. In the fifth example (1005), the conductive portions of the conductive patterns of the unit cell may have a shape that is closer to the center of the unit cell and farther away from the unit cell as they are located in one direction (e.g., the y-axis direction). In the sixth example (1006), the conductive portions of each conductive pattern may have a straight shape.

[0101] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0102] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0103] In embodiments, a substrate (300) including a plurality of layers is provided. The substrate (300) may include a first conductive pattern (321) disposed on a first layer among the plurality of layers and connected to a first port; a second conductive pattern (322) disposed on the first layer among the plurality of layers and connected to a second port; a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer; and a ground layer (350) disposed below the first layer among the plurality of layers. The coupling patches may be arranged in a designated direction on the second layer. At least a portion of the first conductive pattern (321) may be formed to power a first signal from the first port along the designated direction on the first layer. At least a portion of the second conductive pattern (322) may be formed to power a second signal from the second port along the designated direction on the first layer.

[0104] For example, the first conductive pattern (321) may have a shape that is repeated along the specified direction as many times as the number of coupling patches. The second conductive pattern (322) may have a shape that is repeated along the specified direction as many times as the number of coupling patches.

[0105] For example, the plurality of coupling patches may be arranged at regular intervals along the designated direction on the second layer. The first conductive pattern (321) may include a first conductive portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. The second conductive pattern (322) may include a second conductive portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. The first conductive portion and the second conductive portion may be symmetrical with respect to the designated direction.

[0106] For example, the first conductive portion may include a first portion that is parallel to the designated direction and adjacent to a first side, a second portion that is parallel to the designated direction and adjacent to a second side opposite to the first side, and a third portion formed between the first portion and the second portion. The second conductive portion may include a first portion that is parallel to the designated direction and adjacent to the first side, a second portion that is parallel to the designated direction and adjacent to the second side, and a third portion formed between the first portion and the second portion. A distance between the first portion of the first conductive portion and the first portion of the second conductive portion may correspond to a distance between the second portion of the first conductive portion and the second portion of the second conductive portion. The third portion of the first conductive portion and the third portion of the second conductive portion may be symmetrical with respect to the designated direction.

[0107] For example, the first conductive pattern (321) and the second conductive pattern (322) may be configured to provide a signal of a first polarization based on the first signal and the second signal having the same phase. The first conductive pattern (321) and the second conductive pattern (322) may be configured to provide a signal of a second polarization based on the first signal and the second signal having a phase difference of 180 degrees. The first polarization and the second polarization may be perpendicular.

[0108] For example, the substrate (300) may be a low temperature co-fired ceramics (LTCC) substrate (300). The plurality of layers of the substrate (300) may include at least one layer disposed between the first layer and the second layer.

[0109] For example, each of the first layer and the second layer may be at least partially composed of a dielectric. The ground layer (350) may be at least partially composed of a metal.

[0110] For example, the first conductive pattern (321) may include a first end connected to the first port based on the specified direction and a second end connected to a first radio frequency (RF) absorber. The second conductive pattern (322) may include a first end connected to the second port based on the specified direction and a second end connected to a second RF absorber.

[0111] For example, the substrate (300) may include a third conductive pattern disposed on the first layer among the plurality of layers; and a fourth conductive pattern disposed on the first layer among the plurality of layers. At least a portion of the third conductive pattern may be formed to supply a third signal on the first layer along a direction substantially perpendicular to the designated direction. At least a portion of the fourth conductive pattern may be formed to supply a fourth signal on the first layer along a direction substantially perpendicular to the designated direction. For example, the substrate (300) may include a fourth conductive pattern disposed on the first layer among the plurality of layers and connected to the third port; a fourth conductive pattern disposed on the first layer among the plurality of layers and connected to the fourth port; and a second set of coupling patches disposed on the second layer among the plurality of layers. The second set of coupling patches may be arranged in the designated direction in a different region from the plurality of coupling patches on the second layer. At least a portion of the third conductive pattern may be formed on the first layer to supply a third signal from the third port along the designated direction. At least a portion of the fourth conductive pattern may be formed on the second layer to supply a fourth signal from the fourth port along the designated direction.

[0112] In embodiments, an electronic device (160) is provided. The electronic device (160) may include a processor including a processing circuit; a plurality of radio frequency (RF) processing circuits connected to the processor; and a substrate (300) functioning as an array antenna including a plurality of sub-arrays. Each sub-array of the plurality of sub-arrays may include a first conductive pattern (321) disposed on a first layer among the plurality of layers and connected to a first port; a second conductive pattern (322) disposed on the first layer among the plurality of layers and connected to a second port; a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer; and a ground layer (350) disposed below the first layer among the plurality of layers. The coupling patches may be arranged on the second layer in a designated direction. At least a portion of the first conductive pattern (321) may be formed on the first layer to feed a first signal from the first port along the designated direction. At least a portion of the second conductive pattern (322) may be formed on the first layer to supply a second signal from the second port along the specified direction.

[0113] For example, the first conductive pattern (321) may have a shape that is repeated along the specified direction as many times as the number of coupling patches. The second conductive pattern (322) may have a shape that is repeated along the specified direction as many times as the number of coupling patches.

[0114] For example, the plurality of coupling patches may be arranged at regular intervals along the designated direction on the second layer. The first conductive pattern (321) may include a first conductive portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. The second conductive pattern (322) may include a second conductive portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. The first conductive portion and the second conductive portion may be symmetrical with respect to the designated direction.

[0115] For example, the first conductive portion may include a first portion that is parallel to the designated direction and adjacent to a first side, a second portion that is parallel to the designated direction and adjacent to a second side opposite to the first side, and a third portion formed between the first portion and the second portion. The second conductive portion may include a first portion that is parallel to the designated direction and adjacent to the first side, a second portion that is parallel to the designated direction and adjacent to the second side, and a third portion formed between the first portion and the second portion. A distance between the first portion of the first conductive portion and the first portion of the second conductive portion may correspond to a distance between the second portion of the first conductive portion and the second portion of the second conductive portion. The third portion of the first conductive portion and the third portion of the second conductive portion may be symmetrical with respect to the designated direction.

[0116] For example, the first conductive pattern (321) and the second conductive pattern (322) may be configured to provide a signal of a first polarization based on the first signal and the second signal having the same phase. The first conductive pattern (321) and the second conductive pattern (322) may be configured to provide a signal of a second polarization based on the first signal and the second signal having a phase difference of 180 degrees. The first polarization and the second polarization may be perpendicular.

[0117] For example, the substrate (300) may be a low temperature co-fired ceramics (LTCC) substrate (300). The plurality of layers of the substrate (300) may include at least one layer disposed between the first layer and the second layer.

[0118] For example, each of the first layer and the second layer may be at least partially composed of a dielectric. The ground layer (350) may be at least partially composed of a metal.

[0119] For example, the first conductive pattern (321) may include a first end connected to the first port based on the specified direction and a second end connected to a first radio frequency (RF) absorber. The second conductive pattern (322) may include a first end connected to the second port based on the specified direction and a second end connected to a second RF absorber.

[0120] For example, the array antenna may be configured to radiate a signal of a first frequency band or a signal of a second frequency band through the first conductive pattern (321) and the second conductive pattern (322) of the same sub-arrays under the control of the processor. The first frequency band may include a Ku (K-under) band. The second frequency band may include a Ka (K-above) band.

[0121] For example, each sub-array of the plurality of sub-arrays may be arranged in a direction substantially perpendicular to the specified direction.

[0122] In embodiments, an electronic device is provided. The electronic device may include a printed circuit board (PCB) assembly comprising an array antenna having a plurality of layers and including a plurality of sub-arrays; and at least one RF processing circuit connected to the PCB assembly. Each of the plurality of sub-arrays may include a first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals in response to first feed signals from the at least one RF processing circuit; a second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals in response to second feed signals from the at least one RF processing circuit; and a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer. The coupling patches may be arranged along a linear direction on the second layer, and each of the coupling patches may be configured to radiate signals in response to coupling using the first signals and the second signals. The plurality of layers may include a ground layer disposed below the first layer. In each of the above sub-arrays, the first conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer. In each of the above sub-arrays, the second conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer.

[0123] For example, the plurality of coupling patches may be arranged at regular intervals along the linear direction on the second layer for each of the sub-arrays. In each of the sub-arrays, the first conductive line may include an angular portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. In each of the sub-arrays, the second conductive line may include an angular portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer.

[0124] For example, the first conductive line and the second conductive line may be symmetrical with respect to the linear axis. The first conductive line and the second conductive line may provide a first RF signal having a first polarization when the first signal and the second signal have the same phase. The first conductive line and the second conductive line may provide a second RF signal having a second polarization that is perpendicular to the first polarization when the phase difference between the first signal and the second signal is substantially 180 degrees.

[0125] For example, the first conductive portion may include a first portion formed along the linear direction and adjacent to a first side, a second portion formed along the linear direction and adjacent to a second side opposite to the first side, and the angled portion formed between the first portion and the second portion. The second conductive portion may include a first portion formed along the linear direction and adjacent to the first side, a second portion formed along the linear direction and adjacent to the second side, and the angled portion formed between the first portion and the second portion.

[0126] For example, each of the sub-arrays may include a plurality of antenna elements. Each of the antenna elements may include a corresponding portion of the first conductive line, a corresponding portion of the second conductive line, and a corresponding coupling patch among the coupling patches.

[0127] For example, the first conductive line may include a first end connected with a first RF port of the at least one RF processing circuit and a second end connected with a radio frequency (RF) absorber. The second conductive line may include a first end connected with a second RF port of the at least one RF processing circuit and a second end connected with the RF absorber. A direction from the first end of the first conductive line to the second end of the first conductive line may be parallel to the linear direction. A direction from the first end of the second conductive line to the second end of the second conductive line may be parallel to the linear direction.

[0128] For example, in each of the sub-arrays, the first conductive line may have a shape that is repeated according to the arrangement of the coupling patches as many times as the number of coupling patches. In each of the sub-arrays, the second conductive line may have a shape that is repeated according to the arrangement of the coupling patches as many times as the number of coupling patches.

[0129] For example, in each of the sub-arrays, the first conductive line may be formed entirely along the linear direction on the first layer, across the array of coupling patches, such that the first signals are provided to each of the coupling patches through coupling. In each of the sub-arrays, the second conductive line may be formed entirely along the linear direction on the first layer, such that the second signals are provided to each of the coupling patches through coupling.

[0130] For example, the first signals may include a first leakage wave propagating along the first conductive line and formed in response to the first feed signals on the first conductive line. The second signals may include a second leakage wave propagating along the second conductive line and formed in response to the second feed signals on the first conductive line.

[0131] For example, the plurality of layers may include at least one layer between the first layer and the second layer. Each of the first layer and the second layer may be at least partially composed of a dielectric, and the ground layer may be composed of a metallic material. The PCB assembly may include a low temperature co-fired ceramics (LTCC) substrate.

[0132] In embodiments, a printed circuit board (PCB) assembly having a plurality of layers is provided. The PCB assembly may include a plurality of sub-arrays. Each of the plurality of sub-arrays may include a first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals in response to first feed signals from the at least one RF processing circuit; a second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals in response to second feed signals from the at least one RF processing circuit; and a plurality of coupling patches disposed on a second layer among the plurality of layers that is positioned above the first layer. The coupling patches may be arranged along a linear direction on the second layer, and each of the coupling patches may be configured to radiate signals in response to coupling using the first signals and the second signals. The plurality of layers may include a ground layer disposed below the first layer. In each of the above sub-arrays, the first conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer. In each of the above sub-arrays, the second conductive line may be formed along an arrangement of the coupling patches corresponding to the linear direction on the first layer.

[0133] For example, the plurality of coupling patches may be arranged at regular intervals along the linear direction on the second layer for each of the sub-arrays. In each of the sub-arrays, the first conductive line may include an angular portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. In each of the sub-arrays, the second conductive line may include an angular portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer.

[0134] For example, the first conductive line and the second conductive line may be symmetrical with respect to the linear axis. The first conductive line and the second conductive line may provide a first RF signal having a first polarization when the first signal and the second signal have the same phase. The first conductive line and the second conductive line may provide a second RF signal having a second polarization that is perpendicular to the first polarization when the phase difference between the first signal and the second signal is substantially 180 degrees.

[0135] For example, the first conductive portion may include a first portion formed along the linear direction and adjacent to a first side, a second portion formed along the linear direction and adjacent to a second side opposite to the first side, and the angled portion formed between the first portion and the second portion. The second conductive portion may include a first portion formed along the linear direction and adjacent to the first side, a second portion formed along the linear direction and adjacent to the second side, and the angled portion formed between the first portion and the second portion.

[0136] For example, each of the sub-arrays may include a plurality of antenna elements. Each of the antenna elements may include a corresponding portion of the first conductive line, a corresponding portion of the second conductive line, and a corresponding coupling patch among the coupling patches.

[0137] For example, the first conductive line may include a first end connected to a first RF port and a second end connected to a radio frequency (RF) absorber. The second conductive line may include a first end connected to a second RF port and a second end connected to the RF absorber. A direction from the first end of the first conductive line to the second end of the first conductive line may be parallel to the linear direction. A direction from the first end of the second conductive line to the second end of the second conductive line may be parallel to the linear direction.

[0138] For example, in each of the sub-arrays, the first conductive line may have a shape that is repeated according to the arrangement of the coupling patches as many times as the number of coupling patches. In each of the sub-arrays, the second conductive line may have a shape that is repeated according to the arrangement of the coupling patches as many times as the number of coupling patches.

[0139] For example, in each of the sub-arrays, the first conductive line may be formed entirely along the linear direction on the first layer, across the array of coupling patches, such that the first signals are provided to each of the coupling patches through coupling. In each of the sub-arrays, the second conductive line may be formed entirely along the linear direction on the first layer, such that the second signals are provided to each of the coupling patches through coupling.

[0140] For example, the first signals may include a first leakage wave propagating along the first conductive line and formed in response to the first feed signals on the first conductive line. The second signals may include a second leakage wave propagating along the second conductive line and formed in response to the second feed signals on the first conductive line.

[0141] For example, the plurality of layers may include at least one layer between the first layer and the second layer. Each of the first layer and the second layer may be at least partially composed of a dielectric, and the ground layer may be composed of a metallic material. The PCB assembly may include a low temperature co-fired ceramics (LTCC) substrate.

[0142] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0143] When implemented in software, a computer-readable storage medium (e.g., a non-transitory computer-readable storage medium) storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0144] These programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, magnetic cassettes, or may be stored in memories formed by a combination of some or all of these. In addition, each configuration memory may include multiple copies.

[0145] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network, such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device implementing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device implementing an embodiment of the present disclosure.

[0146] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed singularly or plurally, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in plural may be composed of singular elements, or components expressed in singular may be composed of plural elements.

[0147] According to embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0148] Meanwhile, although the detailed description of the present disclosure has described specific embodiments, it is obvious that various modifications are possible within the scope of the present disclosure.

Claims

1. In electronic devices, A printed circuit board (PCB) assembly comprising an array antenna having multiple layers and including multiple sub-arrays; and At least one RF processing circuit connected to the PCB assembly; Each of the above multiple sub-arrays: A first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals according to first feed signals from the at least one RF processing circuit; A second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals according to second feed signals from the at least one RF processing circuit; A plurality of coupling patches arranged in a second layer above the first layer among the plurality of layers, the coupling patches being arranged along a linear direction on the second layer, each of the coupling patches being configured to radiate signals according to coupling using the first signals and the second signals; The above plurality of layers include a ground layer positioned below the first layer, In each of the above sub-arrays, the first conductive line is formed along the arrangement of the coupling patches corresponding to the linear direction on the first layer, In each of the above sub-arrays, the second conductive line is formed along the arrangement of the coupling patches corresponding to the linear direction on the first layer. Electronic devices.

2. In claim 1, The above plurality of coupling patches are arranged at regular intervals along the linear direction on the second layer for each of the sub-arrays, In each of the above sub-arrays, the first conductive line includes an angular portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer, In each of the above sub-arrays, the second conductive line includes an angled portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. Electronic devices.

3. In claim 2, The first conductive line and the second conductive line are symmetrical with respect to the linear direction axis, The first conductive line and the second conductive line provide a first RF signal having a first polarization when the first signal and the second signal have the same phase, The first conductive line and the second conductive line provide a second RF signal having a second polarization that is perpendicular to the first polarization when the phase difference between the first signal and the second signal is substantially 180 degrees. Electronic devices.

4. In claim 2, The first conductive portion includes a first portion formed along the linear direction and adjacent to the first side, a second portion formed along the linear direction and adjacent to the second side opposite to the first side, and the angled portion formed between the first portion and the second portion, The second conductive portion includes a first portion formed along the linear direction and adjacent to the first side, a second portion formed along the linear direction and adjacent to the second side, and the angled portion formed between the first portion and the second portion. Electronic devices.

5. In claim 1, Each of the above sub-arrays includes a plurality of antenna elements, Each of the above antenna elements includes a corresponding portion of the first conductive line, a corresponding portion of the second conductive line, and a corresponding coupling patch among the coupling patches. Electronic devices.

6. In claim 1, The first conductive line includes a first end connected to a first RF port of the at least one RF processing circuit and a second end connected to a radio frequency (RF) absorber, The second conductive line includes a first end connected to a second RF port of the at least one RF processing circuit and a second end connected to the RF absorber, The direction from the first end of the first conductive line to the second end of the first conductive line is parallel to the linear direction, The direction from the first end of the second conductive line to the second end of the second conductive line is parallel to the linear direction. Electronic devices.

7. In claim 1, In each of the above sub-arrays, the first conductive line has a shape that is repeated according to the arrangement of the coupling patches as many times as the number of the coupling patches, In each of the above sub-arrays, the second conductive line has a shape that is repeated according to the arrangement of the coupling patches as many times as the number of the coupling patches. Electronic devices.

8. In claim 1, In each of the above sub-arrays, the first conductive line is formed entirely along the linear direction on the first layer across the array of the coupling patches so that the first signals are provided to each of the coupling patches through coupling, In each of the above sub-arrays, the second conductive line is formed entirely along the linear direction on the first layer across the array of the coupling patches, such that the second signals are provided to each of the coupling patches through coupling. Electronic devices.

9. In claim 8, The first signals propagate along the first conductive line and include a first leakage wave formed according to the first feed signals on the first conductive line, The second signals are propagated along the second conductive line and include a second leakage wave formed according to the second feed signals on the first conductive line. Electronic devices.

10. In claim 1, The plurality of layers include at least one layer between the first layer and the second layer, Each of the first layer and the second layer is at least partially composed of a dielectric, and the ground layer is composed of a metallic material, The above PCB assembly comprises a LTCC (low temperature co-fired ceramics) substrate, Electronic devices.

11. In a PCB (printed circuit board) assembly having multiple layers, the PCB assembly: comprising a plurality of sub-arrays, each of said plurality of sub-arrays: A first conductive line disposed on a first layer among the plurality of layers and configured to provide first signals according to first feed signals from the at least one RF processing circuit; A second conductive line disposed on the first layer among the plurality of layers and configured to provide second signals according to second feed signals from the at least one RF processing circuit; A plurality of coupling patches arranged in a second layer above the first layer among the plurality of layers, the coupling patches being arranged along a linear direction on the second layer, each of the coupling patches being configured to radiate signals according to coupling using the first signals and the second signals; The above plurality of layers include a ground layer positioned below the first layer, In each of the above sub-arrays, the first conductive line is formed along the arrangement of the coupling patches corresponding to the linear direction on the first layer, In each of the above sub-arrays, the second conductive line is formed along the arrangement of the coupling patches corresponding to the linear direction on the first layer. PCB assembly.

12. In claim 11, The above plurality of coupling patches are arranged at regular intervals along the linear direction on the second layer for each of the sub-arrays, In each of the above sub-arrays, the first conductive line includes an angular portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer, In each of the above sub-arrays, the second conductive line includes an angled portion repeatedly formed at a position corresponding to each coupling patch of the plurality of coupling patches on the first layer. PCB assembly.

13. In claim 12, The first conductive line and the second conductive line are symmetrical with respect to the linear direction axis, The first conductive line and the second conductive line provide a first RF signal having a first polarization when the first signal and the second signal have the same phase, The first conductive line and the second conductive line provide a second RF signal having a second polarization that is perpendicular to the first polarization when the phase difference between the first signal and the second signal is substantially 180 degrees. PCB assembly.

14. In claim 12, The first conductive portion includes a first portion formed along the linear direction and adjacent to the first side, a second portion formed along the linear direction and adjacent to the second side opposite to the first side, and the angled portion formed between the first portion and the second portion, The second conductive portion includes a first portion formed along the linear direction and adjacent to the first side, a second portion formed along the linear direction and adjacent to the second side, and the angled portion formed between the first portion and the second portion. PCB assembly.

15. In claim 11, Each of the above sub-arrays includes a plurality of antenna elements, Each of the above antenna elements includes a corresponding portion of the first conductive line, a corresponding portion of the second conductive line, and a corresponding coupling patch among the coupling patches. PCB assembly.

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