Housing component of electronic device and manufacturing method therefor

Abstract

A housing component of an electronic device according to an embodiment disclosed herein comprises: a first housing part which includes a first metal material having a plurality of first pores, has a first surface oriented in a first direction, and includes a plurality of recesses recessed from the first surface in a second direction opposite to the first direction; and second housing parts which include a second metal material having a plurality of second pores, and are accommodated in the plurality of recesses. A first porosity of the first metal material due to the plurality of first pores is less than a second porosity of the second metal material due to the plurality of second pores.

Description

Housing components of electronic devices and methods for manufacturing the same

[0001] Various embodiments disclosed in this document relate to housing components of electronic devices, for example, to housing components and methods for manufacturing the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] In the process of machining or forming a pattern, etc., of a housing component (or plate) that forms the exterior of an electronic device, irregular steps on the surface cause unevenness and recesses, which result in additional processes due to the removal of an oxide layer and contamination of the machining area during surface treatment, and it is difficult to achieve the desired pattern effect.

[0005] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] In one embodiment of the present disclosure, a housing component of an electronic device comprises: a first housing portion including a first metal material having a plurality of first pores, the first housing portion including a first surface facing a first direction and a plurality of recesses sunken in a second direction opposite to the first direction from the first surface; and a second housing portion including a second metal material having a plurality of second pores and accommodated in the plurality of recesses, wherein a first porosity of the first metal material for the plurality of first pores is smaller than a second porosity of the second metal material for the plurality of second pores.

[0007] A method for manufacturing a housing component of an electronic device according to one embodiment of the present disclosure may include an operation of forming an engraved portion in a direction opposite to a first direction on a first metal member including a first surface facing a first direction; an operation of forming a second metal member on the engraved portion of the first metal member and the first surface; and an operation of etching the second metal member to a position corresponding to the first surface.

[0008] The above-described aspects or other aspects, configurations and / or advantages of various embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is an enlarged view of area A of the rear plate surface of the electronic device illustrated in FIG. 3 according to one embodiment of the present disclosure.

[0015] FIG. 7 is an enlarged view of cross-section A-A' of area A shown in FIG. 6 according to one embodiment of the present disclosure.

[0016] FIG. 8a is an enlarged view of area S1 illustrated in FIG. 7 according to one embodiment of the present disclosure.

[0017] FIG. 8b is a conceptual diagram illustrating an enlarged view of area S2 illustrated in FIG. 8a according to one embodiment of the present disclosure.

[0018] FIG. 9 is an enlarged view of cross-section A-A' shown in FIG. 6 according to one embodiment of the present disclosure.

[0019] FIG. 10 is a drawing showing an enlarged cross-section of a housing component according to one embodiment of the present disclosure.

[0020] FIG. 11a is a cross-sectional view of a recess formed on the surface of a housing component according to an embodiment of the present invention, which is an enlarged view of area S3 of FIG. 10.

[0021] FIG. 11b is a cross-sectional view of a recess formed on the surface of a housing component according to an embodiment of the present invention, which is an enlarged view of area S3 of FIG. 10.

[0022] FIG. 11c is a cross-sectional view of a recess formed on the surface of a housing component according to an embodiment of the present invention, which is an enlarged view of area S3 of FIG. 10.

[0023] FIG. 11d is a cross-sectional view of a recess formed on the surface of a housing component according to an embodiment of the present invention, which is an enlarged view of area S3 of FIG. 10.

[0024] FIG. 12 is a cross-sectional view of a housing component having a plurality of recesses on its surface according to one embodiment of the present disclosure.

[0025] FIG. 13 is a drawing showing a first recessed portion and a second recessed portion on a surface of a housing component according to one embodiment of the present disclosure.

[0026] FIG. 14 is an enlarged view of the surface of a housing component according to one embodiment of the present disclosure.

[0027] FIG. 15 is an enlarged view of cross-section A-A' shown in FIG. 6 according to one embodiment of the present disclosure.

[0028] FIG. 16 is an enlarged view of the surface of a housing component according to one embodiment of the present disclosure.

[0029] FIG. 17 is a conceptual diagram illustrating FIG. 16 according to one embodiment of the present disclosure.

[0030] FIG. 18 is a drawing of a method for manufacturing a housing component according to one embodiment of the present disclosure.

[0031] FIG. 19 is a drawing illustrating a method for manufacturing a housing component according to one embodiment of the present disclosure.

[0032] FIG. 20 is a drawing showing the content of a metal material included in a housing component according to one embodiment of the present disclosure.

[0033] FIG. 21a is a drawing analyzing the material of the first housing portion of the housing component according to one embodiment of the present disclosure.

[0034] FIG. 21b is a drawing analyzing the material of the second housing portion of the housing component according to one embodiment of the present disclosure.

[0035] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0036] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.

[0037] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0038] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0039] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0040] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0041] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0042] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0045] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0046] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0047] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0048] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0050] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0051] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0052] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0054] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0055] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0056] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0057] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0058] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0059] An electronic device (101) according to an embodiment disclosed in this document may take various forms. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device (101) according to an embodiment of this document is not limited to the aforementioned devices.

[0060] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0061] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0062] One embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0063] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0064] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0065] In the detailed description below, the longitudinal direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the longitudinal direction, the width direction, and / or the height direction (or thickness direction) may indicate the longitudinal direction, the width direction, and / or the height direction (or thickness direction) of the electronic device.

[0066] In one embodiment, the fact that a component is oriented in a "certain direction" may be understood to include not only that the component is oriented in a "direction identical to the certain direction" but also that the component is oriented in a "direction parallel to the certain direction." It should be noted that when a component is said to overlap (or be stacked) with another component in the following description, the description of the arrangement relationship in the height direction described above may be applied.

[0067] In describing a direction, if 'yin / yang (- / +)' is not indicated, it can be interpreted to include both the + direction and the - direction unless otherwise defined. For example, 'Z-axis direction' can be interpreted to include both the +Z direction and the -Z direction. Similarly, 'X-axis direction' can be interpreted to include both the +X direction and the -X direction, and 'Y-axis direction' can be interpreted to include both the +Y direction and the -Y direction. However, in the XYZ spatial coordinate system illustrated in the drawing, if 'yin / yang (- / +)' is not indicated for an axis, the axis can be interpreted to point in the + direction unless otherwise specified. In describing a direction, pointing toward any one of the three axes of the orthogonal coordinate system can include pointing in a direction parallel to the axis.

[0068] Hereinafter, in the description of the electronic device (e.g., 101 of FIG. 2) described below, the 'first direction' may mean the -Z-axis direction or a direction parallel to the -Z-axis. The 'second direction' may mean the +Z-axis direction or a direction parallel to the +Z-axis direction. The 'third direction' may mean the X-axis or Y-axis direction or a direction parallel thereto. The 'third direction' may mean a direction perpendicular to the 'first direction' or the 'second direction'. It should be noted that the above description is based on the rectangular coordinate system described in the drawings for the sake of brevity of description, and the description of such directions or components does not limit the various embodiments of the present disclosure.

[0069] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0070] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0071] The embodiments of FIGS. 2 to 3 can be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 15.

[0072] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0073] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0074] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0075] The display (220) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the connecting portion of the display (220) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer shape of the display (220) and the outer shape of the front plate (202) may be formed to be substantially identical in order to expand the area over which the display (220) is visually exposed.

[0076] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0077] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0078] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0079] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0080] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0081] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0082] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0083] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0084] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0085] The embodiments of FIGS. 4 and 5 can be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 18.

[0086] Referring to FIGS. 4 and 5 , the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2 ) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1 ), a display (330) (e.g., the display module (160) of FIG. 1 , the display (220) of FIG. 2 ), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2 ). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above the battery (350) and a second circuit board (340b) positioned below, and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0087] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0088] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0089] The first support member (311) may be referred to as a “support member.” The housing (301) may include the support member (311). The support member (311) may face the front plate (320). The support member (311) may face the rear plate (380). The support member (311) may be made of reinforced plastic or metal.

[0090] The support member (311) may include a support body (3111). The support body (3111) may have a flat shape. The support body (3111) may provide a space in which a battery (350) or a printed circuit board (340a, 340b) is placed.

[0091] The support member (311) may include an end portion (3112). The end portion (3112) may be integral with the support body (3111). The end portion (3112) may be formed along the perimeter of the support body (3111). The end portion (3112) may extend along the perimeter of the side structure (310). The end portion (3112) may be integral with the side structure (310).

[0092] The front plate (320) may be referred to as a “cover” or a “front cover.” The rear plate (380) may be referred to as a “cover” or a “rear cover.” The cover (380) may face the support member (311).

[0093] The cover (380) may include a cover body (381). The cover body (381) may be flat. The cover body (381) may face the support body (3111).

[0094] The cover (380) may include a cover edge (382). The cover edge (382) may be integral with the cover body (381). The cover edge (382) may extend along the direction in which the end portion (3112) of the support member (311) extends. The cover edge (382) may face the end portion (3112) of the support member (311). The cover edge (382) may be coupled with the end portion (3112) of the support member (311). The cover edge (382) may be referred to as a “joint portion.”

[0095] In one embodiment, the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). In one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including a structure that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). The housing (301) may include the side structure (310), the first support member (311), the front plate (320), and the rear plate (380). In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first surface (210A) of FIG. 1) and the rear plate (380) (e.g., the second surface (210B) of FIG. 2), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0096] The memory may include, for example, volatile memory or non-volatile memory.

[0097] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0098] The second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be placed to surround the additional printed circuit board together with another part of the first support member (311). A speaker module or interface arranged on an additional printed circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 309) of FIG. 1.

[0099] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0100] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0101] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a location adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0102] The plate of the electronic device described in the present disclosure is not limited to the electronic device described with reference to FIGS. 2 to 5, and can be applied to all of the plates of rollable electronic devices, plates of foldable electronic devices, and housing structures (or components) of wearable electronic devices.

[0103] FIG. 6 is an enlarged view of an area A of a rear plate surface of a housing component constituting an electronic device illustrated in FIG. 3 according to an embodiment of the present disclosure. FIG. 7 is an enlarged view of a cross-section A-A' of an area A illustrated in FIG. 6 according to an embodiment of the present disclosure. FIG. 8A is an enlarged view of an area S1 illustrated in FIG. 7 according to an embodiment of the present disclosure. FIG. 8B is an enlarged conceptual view of an area S2 illustrated in FIG. 8A according to an embodiment of the present disclosure.

[0104] The components described with reference to FIGS. 6 to 8A and 8B may be substantially the same as the components described with reference to FIGS. 1 to 5. The components described with reference to FIGS. 6 to 8A and 8B may be substantially the same as the components described with reference to FIGS. 9 to 21B. The embodiments of FIGS. 6 to 8A and 8B may be combined with the embodiments of FIGS. 9 to 21B. Components not described below may be substantially the same as the components described with reference to FIGS. 1 to 6 and 9 to 21B.

[0105] According to one embodiment, an electronic device (e.g., 101 of FIG. 2) may include a housing component (401). The housing component (401) may include at least one of a front plate facing a first direction (e.g., a front plate (202) illustrated in FIG. 4), a rear plate facing a second direction (e.g., a rear plate (380) illustrated in FIG. 4), or a side structure facing a third direction (e.g., a side structure (310) illustrated in FIG. 4). The plate (420) described with reference to FIGS. 6 to 8B is not limited to the rear plate of the electronic device (e.g., the rear plate (380) illustrated in FIG. 4), but may be applied to a side structure (e.g., a side structure (310) illustrated in FIG. 4) or other plate structures surrounding the housing. The housing component (401) may be substantially the same as a component forming the housing of the electronic device or an exterior of the electronic device. The configurations of the housing component (401) described in the present disclosure may be the same as those of the electronic device (101). The configurations of the housing component (401) described in this disclosure can be used as a configuration of an electronic device (101).

[0106] In one embodiment, the housing component (401) may include a first housing portion (420) and a second housing portion (430). The first housing portion (420) and the second housing portion (430) may be joined to form one housing component (401). The second housing portion (430) may be disposed in a plurality of recesses (422) of the first housing portion (420) to form the housing component. The second housing portion (430) may be disposed in a molten state in the first housing portion (420) and may form one housing component (401) upon hardening. The first housing portion (420) and the second housing portion (430) may be joined to be positioned on the same plane. In one embodiment, the first housing portion (420) may include a protrusion, and the second housing portion may be disposed to surround the protrusion. For example, the first housing part (420) may protrude and the second housing part (430) may surround it, and the second housing part (430) may be joined to surround the protrusion of the first housing part (420) to form one housing component. According to one embodiment, the first housing part (420) may include a first surface (421) facing a first direction (-Z-axis direction). The first surface (421) may extend in a third direction (X-axis) or a Y-axis direction different from the third direction. The first surface (421) of the first housing part (420) may form an outer surface of a back plate (e.g., a back plate (380) illustrated in FIG. 4) or a side structure (e.g., a side structure (310) illustrated in FIG. 4) of the electronic device. The first housing part (420) may include a first-first housing part (420-1) and a first-second housing part (420-2). The first-first housing portion (420-1) and the first-second housing portion (420-2) may include an empty space. The volume of the empty space of the first-first housing portion (420-1) may be smaller than the volume of the empty space of the first-second housing portion (420-2).For example, the empty space formed in the 1-1 housing portion (420-1) may be expanded into the empty space formed in the 1-2 housing portion (420-2) to form a recess.

[0107] According to one embodiment, the first housing portion (420) may include a recess (422). The recess (422) may be recessed from a first surface (421) of the first housing portion (420). The recess (422) may be formed by being recessed from the first surface (421) in a second direction (+Z direction). The recess (422) may include a second surface (423) spaced apart from the first surface (421) in the second direction (+Z direction) by a first distance (L1). The recess (422) may be formed by extending along the first surface (421). The recess (422) may include a plurality of recesses. The recess (422) may include an extension surface (4223) extending from the first surface in the second direction (+Z direction). The first housing portion (420) may include a corner (or edge) (424) connecting the first face (421) and the extension face (4223). The first housing portion (420) may include a corner (or edge) (424) connecting the first face (421) and the recess (422). The first housing portion (420) may include a corner (or edge) (424) located on one side of the recess (422) and included in the first face (421). The recess (422) may include an extension face (4224) extending in a third direction perpendicular to the second direction from the extension face (4223) or in a direction away from the interior space of the recess. The extension surface (4224) may be positioned at a predetermined distance from the extension surface (4223) and may include a connecting portion (42241) extending perpendicularly to the second direction (+Z direction) from the extension surface (4223). The extension surface (4224) may extend a predetermined distance away from the inner space of the recess or in a third direction perpendicular to the second direction and may be bent in the second direction (+Z direction) to be connected to the second surface (423).For example, the recess (422) may have a smaller internal space of a portion of the recess formed in the first-first housing portion (e.g., 420-1 of FIG. 8A) than the internal space of another portion of the recess formed in the first-second housing portion (e.g., 420-2 of FIG. 8A). The recess (422) may have at least one side open and extend along the first surface (421). For example, the recess (422) may extend along the first surface (421) such that the first housing portion (420) is disposed on both sides centered around the recess (422). The recess (422) described in the present disclosure may extend to form a valley. The recess (422) may extend such that the first surface (421) of the first housing portion (420) forms a peak. The corner (or edge) (424) described in the present disclosure may be a connecting portion that extends from the first surface (421) and connects to an extension surface (4223) surrounding the recess (422), a starting portion where the first surface (421) is sunken, a portion where the recess (422) and the first surface (421) are connected, or may be named or mean substantially the same as these.

[0108] In one embodiment, the recess (422) may include a first portion (4221) that is recessed from the first face (421). At least a portion of the recess (422) may include the first portion (4221). The first portion (4221) may be referred to as a portion of the recess (422) that is close to the first face (421). The first portion (4221) may be disposed in the first-first housing portion (420-1). The first portion (4221) may include an extension surface (4223) extending from the first face (421) in a second direction (+Z direction). The first housing portion (420) may include a corner (or edge) (424) connecting the extension surface (4223) of the first portion (4221) and the first face (421). The first portion (4221) may extend parallel to the second direction (+Z direction) away from the first surface (421). The first portion (4221) may include extension surfaces (4223) extending from the first surface (421) and spaced apart from each other.

[0109] In one embodiment, the recess (422) may include a second portion (4222) extending from the first portion (4221). At least a portion of the recess (422) may include the second portion (4222). The second portion (4222) may be referred to as another portion of the recess (422) that is closer to the second surface (423). The second portion (4222) may be disposed in the first-second housing portion (420-2). The second portion (4222) may extend from the first portion (4221) in a direction away from the internal space of the recess (422) or in a third direction perpendicular to the second direction, and may be formed to extend in the second direction (+Z-axis direction). The second portion (4222) may be referred to as an extension, an extension area, or an anchor portion. The second portion (4222) may include an extension surface (4224) extending away from the recess interior space from the extension surface (4223) or in a third direction perpendicular to the second direction. The second portion (4222) may include extension surfaces (4224) extending from the extension surface (4223) and spaced apart from each other. The second portion (4222) may include a second surface (423). One side of the second portion (4222) in the second direction (+Z direction) may be closed by the second surface (423). The extension surface (4224) of the second portion (4222) may extend to a certain extent in the direction away from the recess interior space or in a third direction perpendicular to the second direction and may be bent in the second direction (+Z direction) to be connected to the second surface (423).

[0110] The extension surface (4223) described in the present disclosure may be named a first extension surface (4223), a first-first extension surface (4223), and a first-second extension surface (4223). The extension surface (4224) described in the present disclosure may be named a second extension surface (4224), a second-first extension surface (4224), and a second-second extension surface (4224).

[0111] According to one embodiment, the recess (422) may have a space of a portion of the recess (422) that is farther from the first surface (421) than another portion of the recess (422) that is closer to the first surface (421) due to the first portion (4221) and the second portion (4222). According to one embodiment, the width of a portion of the first portion (4221) formed in the 1-1 housing portion (420-1) (e.g., D1 shown in FIG. 10A) may be smaller than the width of a portion of the second portion (4222) formed in the 1-2 housing portion (420-2) (e.g., D2 shown in FIG. 10A). The recess (422) according to one embodiment may include various shapes. For example, the recess (422) may have a cross-section that is T-shaped, L-shaped, circular, oval, triangular, irregular, and / or a combination thereof.

[0112] According to one embodiment, the recess (422) of the first housing portion (420) may be referred to as a plurality of recesses (422). In the present disclosure, the recess (422) may mean a plurality of recesses or each of the plurality of recesses (422).

[0113] In one embodiment, the second housing portion (430) can be disposed in the first housing portion (420). The second housing portion (430) can be joined to the first housing portion (420). The second housing portion (430) can be disposed in the recess (422) of the first housing portion (420). The second housing portion (430) can fill the recess (422) of the first housing portion (420). The second housing portion (430) can fill the first portion (4221) of the recess (422). The second housing portion (430) can extend from the portion disposed in the first portion (4221) to fill the second portion (4222) of the recess (422). The second housing portion (430) can extend from a portion disposed in the second portion (4222) to fill the first portion (4221) of the recess (422). The second housing portion (430) can be aligned along the first surface (421) while filling the recess (422) of the first housing portion (420). For example, a plurality of recesses can be arranged along the first surface (421) of the first housing portion (420), and the second housing portion (430) can be aligned along the first surface (421) while filling the plurality of recesses (422). The second housing portion (430) can be in contact with the second surface (423) of the recess (422). The second housing portion (430) can be in contact with the extension surface (4223). The second housing portion (430) can be in contact with the expansion surface (4224). The second housing portion (430) may extend in a first direction (-Z direction). The second housing portion (430) may include a third face (431) forming an end of the second housing portion extending in the first direction (-Z direction). The third face (431) of the second housing portion (430) may face the first direction (-Z direction). The third face (431) of the second housing portion (430) may be positioned corresponding to the first face (421) of the first housing portion (420). The third face (431) of the second housing portion (430) may be aligned with the first face (421).The second housing portion (430) may be formed such that a third surface (431) of the second housing portion is aligned with the first surface (421) to form a surface (411) of the plate. For example, the second housing portion (430) may be filled in the recess (422) of the first housing portion (420), and the filled second housing portion (430) may be positioned on the same plane as the first surface (421) of the first housing portion (420). The third surface (431) of the second housing portion may be positioned on the first surface (421), so that the housing component (401) may include a constant surface. For example, the third surface (431) of the second housing portion (430) may be positioned at the same height without a distance apart from the first surface (421) or a height difference to form a constant surface. In the present disclosure, a constant surface may include a third surface (431) and a first surface (421) being positioned at the same height, or a first surface (421) and a third surface (431) being formed at substantially the same position. The constant surface may prevent an oxide layer (e.g., 440 shown in FIG. 10) formed on a housing component (401) from being removed. A second housing portion (430) may fill a recess (422) of a first housing portion (420), thereby preventing damage to the oxide layer caused by a corner (or edge) of the recess (422) (e.g., 424 shown in FIG. 10A). The second housing portion (430) may include a second-first housing portion (430-1) and a second-second housing portion (430-2). The second-first housing portion (430-1) may be disposed close to the first surface (421). The second-first housing portion (430-1) may be placed in the first portion (4221). The second-second housing portion (430-2) may be placed close to the second surface (423). The second-second housing portion (430-2) may be placed in the second portion (4222).The third surface (431) may be defined as a flattened surface where the second housing portion fills the recess of the first housing portion or as an end surface where the second housing portion extends in the second direction.

[0114] In one embodiment, the housing part (401) can decorate the exterior of the electronic device. The recess (422) of the first housing part (420) and the second housing part (430) filling the recess (422) can decorate the exterior of the housing part (401). The recess (422) of the first housing part (420) and the second housing part (430) filling the recess (422) can form a pattern of the housing part (401). The recess (422) of the first housing part (420) and the second housing part (430) filling the recess (422) can form a logo on the surface of the housing part (401).

[0115] According to one embodiment, the second housing part (430) may be formed by filling the first housing part (420) and the housing component (401), or the second housing part (430) may be double-joined to the first housing part (420) by injection molding. The second housing part (430) may be laminated to the recess (422) of the first housing part (420) and joined to the internal space of the recess (422). For example, the second housing part (430) including the second metal material may be laminated to the recess (422) of the first housing part (420) by 3D printing.

[0116] Referring to FIG. 8B, the first housing portion (420) may include a first metal material. The second housing portion (430) may include a second metal material. The first housing portion (420) and the second housing portion (430) may each include a void (or empty space) in the first metal material and the second metal material. The first metal material and the second metal material may include a plurality of voids. The first metal material may form a void (425) in the first housing portion (420). The first metal material may include the first void (425). The second metal material may form a void (435) in the second housing portion (430). The second metal material may include the second void (435). The first porosity may be smaller than the second porosity. The first porosity may refer to a volume ratio occupied by a plurality of first pores (425) per volume area of ​​the first housing portion (e.g., B2 as shown in FIG. 8b). The first porosity may refer to the number or area of ​​the first pores (425) included per unit area of ​​the first housing portion (e.g., B2 as shown in FIG. 8b). The first porosity may refer to a ratio of a specific gravity of the first housing portion (420) per unit volume (e.g., B2 as shown in FIG. 8b) to a specific gravity of the first pores (425). The second porosity may refer to a volume ratio occupied by the second pores (435) per unit volume of the second housing portion (e.g., B1 as shown in FIG. 8b). The second porosity may refer to the number or area of ​​the second pores (435) included per unit area of ​​the second housing portion (e.g., B1 as shown in FIG. 8b). The second porosity may refer to the ratio of the specific gravity of the second housing portion (430) per unit volume (e.g., B1 as shown in FIG. 8b) to the specific gravity of the second pores (435). The first density, which refers to the mass per unit volume of the first housing portion (420), may be greater than the second density, which refers to the mass per unit volume of the second housing portion (430).The first density, which means the mass per unit volume of the first metal material, may be greater than the second density, which means the mass per unit volume of the second metal material. For example, the volume or number of the first pores (425) of the first housing part (420) may be formed to be less than the volume or number of the second housing part (430), so that the density of the first housing part (420) may be higher. Alternatively, the second housing part (430) may be combined with the first housing part (420) in a molten state, so that the second porosity may be greater than the first porosity. The surface roughness may be different due to the difference in porosity between the first housing part (420) and the second housing part (430). The surface roughness may be different due to the difference in density between the first housing part (420) and the second housing part (430).

[0117] The housing component described in the present disclosure (e.g., 401 in FIG. 6) may mean a plate of an electronic device (e.g., 380 in FIG. 4) or a structure forming the exterior of the electronic device. The first housing portion (e.g., 420 in FIG. 6) may mean or be named a first plate portion, a first housing portion including a first metal material, or a part of a structure forming the exterior of the electronic device. The second housing portion (e.g., 430 in FIG. 6) may mean or be named a second plate portion, a second housing portion including a second metal material, or a part of a structure forming the exterior of the electronic device.

[0118] FIG. 9 is an enlarged view of cross-section A-A' shown in FIG. 6 according to one embodiment of the present disclosure.

[0119] The components described with reference to FIG. 9 may be substantially the same as the components described with reference to FIGS. 1 to 8B. The components described with reference to FIG. 9 may be substantially the same as the components described with reference to FIGS. 10 to 21B. The embodiment of FIG. 9 may be combined with the embodiments of FIGS. 10 to 21B. Components not described below may be substantially the same as the components described with reference to FIGS. 1 to 8B and 10 to 19.

[0120] According to one embodiment, a housing component (e.g., 401 of FIG. 6) may include an oxide layer (440). The oxide layer (440) may be disposed on one side of a plate (420). The oxide layer (440) may be disposed on a plate surface (411). The oxide layer may be disposed on a first housing portion (420). The oxide layer (440) may be disposed on a second housing portion (430). The oxide layer (440) may extend along a first side (421) of the first housing portion (420). The oxide layer (440) may extend along a third side (431) of the second housing portion (430). The oxide layer (440) may be disposed on the first housing portion (420) and the second housing portion (430) and may extend in a first direction (-Z direction). The oxide layer (440) can be formed with a constant thickness (T1). The oxide layer (440) can include an oxide surface (4401). The oxide layer (440) can be disposed on a housing component (e.g., 401 of FIG. 6) to form an oxide surface (4401) of the housing component (e.g., 401 of FIG. 6). The oxide layer (440) can protect the plate surface (411). The oxide layer (440) can increase the effect of a pattern formed on the surface of the housing component (e.g., 401 of FIG. 6). The oxide surface (4401) of the oxide layer (440) can increase the gloss or color effect of the housing component (e.g., 401 of FIG. 6).

[0121] According to one embodiment, the oxide layer (440) may include a first oxide portion (441) and a second oxide portion (442). The first oxide portion (441) may be disposed in the first housing portion (420). The first oxide portion (441) may be disposed on a first surface (421) of the first housing portion (420). The first oxide portion (441) may be disposed on the first surface (421) and may extend in a first direction (-Z direction). The second oxide portion (442) may be disposed in the second housing portion (430). The second oxide portion (442) may be disposed in the second housing portion (430) filling the recess (422). The second oxidized portion (442) can be disposed on a third face (431) of the second housing portion (430) aligned with the first face (421) of the first housing portion (420). The second oxidized portion (442) can be disposed on the third face (431) and extend in the first direction (-Z direction). The second oxidized portion (442) can be formed by extending from the first oxidized portion (441). The first oxidized portion (441) disposed on the first face (421) of the first housing portion (420) and the second oxidized portion (442) disposed on the third face (431) of the second housing portion (430) can be formed along the first face (421) and the third face (431) aligned with the first face (421). The first oxidized portion (441) and the second oxidized portion (442) may be formed with the same thickness (T1). The first oxidized portion (441) and the second oxidized portion (442) may have different characteristics. For example, when forming an oxide layer, the first oxidized portion (441) and the second oxidized portion (442) may have the same thickness (T1), but may have different growth rates and shapes. The first oxidized portion (441) and the second oxidized portion (442) may decorate the exterior of the housing component (e.g., 401 of FIG. 6) differently. For example, the color or gloss of the housing component (e.g., 401 of FIG. 6) may appear different due to the different characteristics of the first oxidized portion (441) and the second oxidized portion (442).The oxide layer (440) can increase the decorative effect of the pattern formed by the first housing portion (420) and the second housing portion (430).

[0122] FIG. 10 is a cross-sectional view showing an enlarged photograph of a section in which a second housing portion is filled in a recess of a first housing portion of a housing component according to one embodiment of the present disclosure. FIG. 11a is a cross-sectional view of a recess formed in a plate surface of a housing component according to one embodiment, which is an enlarged view of area S3 of FIG. 10. FIG. 11b is a cross-sectional view of a recess formed in a plate surface of a housing component according to one embodiment, which is an enlarged view of area S3 of FIG. 10. FIG. 11c is a cross-sectional view of a recess formed in a plate surface of a housing component according to one embodiment, which is an enlarged view of area S3 of FIG. 10. FIG. 11d is a cross-sectional view of a recess formed in a plate surface of a housing component according to one embodiment, which is an enlarged view of area S3 of FIG.

[0123] The components described with reference to FIGS. 10 and 11A to 11D may be substantially the same as the components described with reference to FIGS. 1 to 9. The components described with reference to FIGS. 10 and 11A to 11D may be substantially the same as the components described with reference to FIGS. 12 to 21B. The embodiments of FIGS. 10 and 11A to 11D may be combined with the embodiments of FIGS. 12 to 21B. Components not described below may be substantially the same as the components described with reference to FIGS. 1 to 9 and 12 to 21B.

[0124] According to one embodiment, the first housing portion (520) may include a recess (522). The recess (522) may be formed by being recessed from a first surface (521) of the first housing portion (520). The recess (522) may be formed by being recessed in a second direction (+Z direction). The recess (522) may include a second surface (523) spaced apart from the first surface (521) in the second direction (+Z direction) by a first distance (e.g., L1 as shown in FIG. 8A). The recess (522) may include an extension surface (5223) extending from the first surface (521) in the second direction (+Z direction). The recess (522) may include the extension surfaces (5223) spaced apart from each other by a predetermined distance (e.g., D1 as shown in FIG. 11A). The recess (e.g., 522a of FIG. 11a) may include a first extension surface (e.g., 5223a of FIG. 11a) spaced apart from each other by a predetermined distance (e.g., D1 of FIG. 11a). The first extension surface (e.g., 5223a of FIG. 11a) may include a first-first extension surface (e.g., 52231a of FIG. 11a) and a first-second extension surface (e.g., 52232a of FIG. 11a). The recess (522) may include an extension surface (5224) extending in a third direction that is perpendicular to the second direction (+Z direction) from the extension surface (5223) and away from the recess interior space or perpendicular to the second direction. The recess (522) may include an extension surface (5224) formed to expand the recess interior space. The recess (522) may include extended surfaces (5224) spaced apart from each other by a predetermined distance (e.g., D2 as shown in FIG. 11a). The extended surfaces (5224) may extend a predetermined distance away from the inner space of the recess or in a third direction perpendicular to the second direction, and may be bent in the second direction (+Z direction) to be connected to the second surface (523). The recess (522a) may include a second extended surface (5224a) spaced apart from each other by a predetermined distance (D1). The second extended surface (5224a) may include a second-first extended surface (52241a) and a second-second extended surface (52242a).The extension surface (e.g., 5224a in FIG. 11a) may be named a second extension surface, a second-first extension surface, a second-second extension surface, or substantially the same as these. The separation distance of the extension surface (5223) (e.g., D1 illustrated in FIG. 11a) may be smaller than the separation distance of the extension surface (5224) (e.g., D2 illustrated in FIG. 11a). The separation distance of the extension surface (5223) or the extension surface (5224) (e.g., D1 or D2 illustrated in FIG. 11a) may be named as the width of the recess. The width of the internal space of the recess (522) may increase as it moves away from the first surface (521) in the second direction (+Z direction). The recess (522) may include a first recess portion (522-1) disposed in the first-first housing portion (520-1) and a second recess portion (522-2) extending from the first recess portion (522-1) and disposed in the first-second housing portion (520-2). The recess (522) may have a width (D1) of a recess portion closer to the first surface (521) smaller than a width (D2) of a recess portion closer to the second surface (523).

[0125] In one embodiment, the recess (522) may include a first portion (5221) that is recessed in the first surface (521). The first portion (5221) may include an extension surface (5223) extending from the first surface (521) in a second direction (+Z direction). The first portion (5221) may include extension surfaces (5223) that are spaced apart from each other by a predetermined distance (D1). The first portion (5221) may be open on at least one side.

[0126] According to one embodiment, the recess (522) may include a second portion (5222). The recess (522) may include an extension surface (5224) that is perpendicular to the second direction (+Z direction) from the extension surface (5223) and extends in a direction opposite to the internal space of the recess. The recess (5222) may include the extension surfaces (5224) that are spaced apart from each other by a predetermined distance (D2). The extension surfaces (5224) may extend a predetermined distance in a direction away from the internal space of the recess or in a third direction perpendicular to the second direction, and may be bent in the second direction (+Z direction) to be connected to the second surface (523). The second portion (5222) may be formed by extending from the first portion (5221). The internal space of the second portion (5222) may be larger than the internal space of the first portion (5221).

[0127] Hereinafter, the first part (5221) not described may be referenced with respect to the first part (e.g., 4221 illustrated in FIG. 8a) described with reference to FIGS. 6 to 9. Hereinafter, the second part (5222) not described may be referenced with respect to the second part (e.g., 4222 illustrated in FIG. 8a) described with reference to FIGS. 6 to 9.

[0128] According to one embodiment, the recess (522) of the first housing portion (520) may include various shapes. For example, the cross-sectional shape of the recess (522) may include at least one of a T-shape, an L-shape, a circular or oval shape, or a triangular shape.

[0129] Referring to FIG. 11a, a plate recess (522a) of a housing component (e.g., 401 of FIG. 6) according to one embodiment may extend in a second direction (+Z direction) perpendicular to the direction and away from the inner space of the recess or in a third direction perpendicular to the second direction. The recess (522a) may include an extension surface (5223a) extending in the second direction from the first surface (521a). The extension surface (5223a) may be referred to as a first extension surface (5223a). The extension surface (5223a) may include a first-first extension surface (52231a) extending from the first surface (521) located on one side of the recess and a first-second extension surface (52232a) extending in the second direction (+Z direction) from the first surface (521) located on the other side of the recess. The recess (522a) may include an extension surface (5224a) that extends in a direction perpendicular to the second direction (+Z direction) from the extension surface (5223a) and away from the recess interior space or in a third direction perpendicular to the second direction and spaced apart from each other by a predetermined width (D2). For example, the extension surface (5224a) may include an extension surface (5224a) that extends to both sides of the recess (522a). The extension surface (5224a) may be referred to as a second extension surface. The extension surface (5224a) may include a first-first extension surface (52241a) that extends in a direction away from the recess interior space from the first-first extension surface (52231a) or in a third direction perpendicular to the second direction, and a first-second extension surface (52242a) that extends in a third direction away from the recess interior space or perpendicular to the second direction from the first-second extension surface (52232a). The first-first extension surface (52241a) may be named the second-first extension surface. The first-second extension surface (52242a) may be named the second-second extension surface.The extended surface (e.g., 52241a in FIG. 11a) may be positioned at a predetermined distance from the extended surface (e.g., 52231a in FIG. 11a) and may include a connecting portion (e.g., 52243a in FIG. 11a) that extends perpendicularly in a second direction (+Z direction) from the extended surface (e.g., 52231a in FIG. 11a) and is connected to the extended surface (e.g., 52241a in FIG. 11a). The recess (522) may have a cross-section formed in an inverted T shape. The recess (522a) may include a first portion (5221a) that is recessed from the first surface (521a). The first portion (5221a) may extend in the second direction (+Z direction). The first portion (5221a) may include an extension surface (5223a) extending in a second direction (+Z direction) from the first surface (521a). The first portion (5221a) may include extension surfaces (5223a) spaced apart from each other by a predetermined width (D1). The recess (522a) may include a second portion (5222a) extending from the first portion (5221a-). The second portion (5222a) may be perpendicular to the second direction with the first portion (5221a) as the center, and may extend in both directions in a direction away from the internal space of the recess (522a) or in a third direction perpendicular to the second direction. The second portion (5222a) may include an extension surface (5224a) that is perpendicular to the second direction (+Z direction) from the extension surface (5223a) of the first portion (5221a) and extends in a direction away from the internal space of the recess (522a) or in a third direction perpendicular to the second direction. The second portion (5222a) may include extension surfaces (5224a) that are spaced apart from each other by a predetermined width (D2) and extend perpendicular to the second direction (+Z direction) and in a direction away from the internal space of the recess, respectively, from the extension surfaces (5223a) that are spaced apart from each other. For example, the second portion (5222a) may have extension surfaces (5224a) that are each extended by a predetermined distance from the first portion (5221a) and may be spaced apart from each other to form the second portion (5222a).

[0130] Referring to FIG. 11b, the recess (522b) may include a first surface (521b) and a second surface (523b) spaced apart from the first surface (521b) by a first distance (e.g., L1 illustrated in FIG. 8a) in a second direction (+Z direction). The recess (522b) may include a first extension surface (52231b) extending from the first surface (521b) in the second direction (+Z direction) on one side. The recess (522b) may include an extension surface (5224b) extending perpendicular to the second direction (+Z direction) from the first extension surface (52231b) and in a direction opposite to the inner space of the recess. The recess (522b) may include a first-second extension surface (52232b) extending from the first surface (521b) on the other side in a second direction (+Z direction) and connected to the second surface (523b). The first-second extension surface (52232b) may extend in a direction parallel to the second direction (+Z direction). The first-second extension surface (52232b) may be perpendicular to the first surface (521b). The recess (522b) may extend only to one side within the recess. For example, one side of the recess (522b) may include a first-first extension surface (52231b) extending from the first surface (521b) in the second direction (+Z direction) and connected to the second surface (523b), and the other side may include a first-second extension surface (52232b) and an extension surface (5224b) extending from the first-second extension surface (52232b). The extension surface (5224b) may include a connecting portion (52241b) spaced apart from the first-second extension surface (52232b) by a predetermined distance and extending in a direction perpendicular to the second direction (+Z direction) from the first-second extension surface (52232b). The recess (522b) may include a first portion (5221b) recessed from the first surface (521b). The first portion (5221b) may include an extension surface (5223b) extending in a second direction (+Z direction) from the first surface (521b). The first portion (5221b) may include extension surfaces (5223b) spaced apart by a predetermined width (e.g., D1 in FIG. 11a).The recess (522b) may include a second portion (5222b) extended from the first portion (5221b). The second portion (5222b) may include a first extension surface (52231b) extending in a second direction (+Z direction) and connected to a second surface (523b). The second portion (5222b) may include an extension surface (5224b) extending in a third direction that is perpendicular to the second direction (+Z direction) from the first-second extension surface (52232b) and away from the internal space of the recess (522b) or perpendicular to the second direction. The second portion (5222b) may have the first extension surface (52231b) of the first portion (5221b) extending on one side, and the other side may include the extension surface (5224b). The recess (522b) may be formed in an L-shaped cross-section. The first extension surface (5223b) described with reference to FIG. 11b may be substantially the same as the extension surface (e.g., 4223 illustrated in FIG. 8a) described with reference to FIGS. 6 to 10.

[0131] Referring to FIG. 11c, the recess (522c) may include an extension surface formed as a curved surface. The recess (522c) may include a first surface (521c). The recess (522c) may include an extension surface (5223c) extending in a second direction (+Z direction) from the first surface (521c). The recess (522c) may include an extension surface (5224c) extending in a third direction that is perpendicular to the second direction (+Z direction) from the extension surface (5223c) and away from the internal space of the recess (522c) or perpendicular to the second direction. The extension surface (5224c) may be formed as a convex curved surface in the opposite direction to the internal space of the recess (522c). The recess (522c) may extend from the extension surface (5224c) and include a second surface (523c) that is convex in the second direction (+Z direction). The extension surface (5224c) that extends from the extension surface (5223c) may be formed as a convex curved surface on both sides of the recess (522c) opposite to the inner space of the recess, and the second surface (523c) that extends from the extension surface (5224c) may be formed as a convex curved surface in the second direction (+Z direction). The recess (522c) may include a first portion (5221c) that is recessed from the first surface (521c). The first portion (5221c) may include an extension surface (5223c) that extends from the first surface (521c) in the second direction (+Z direction). The first portion (5221c) may include extended surfaces (5223c) spaced apart from each other by a predetermined width (e.g., D1 in FIG. 11A). The recess (522c) may include a second portion (5222c). The second portion (5222c) may include an extended surface (5224c) that extends in a second direction (+Z direction) perpendicular to the extended surface (5223c) and away from the internal space of the recess or in a third direction perpendicular to the second direction. The second portion (5222c) may include an extended surface (5224c) that is formed convexly perpendicular to the second direction (+Z direction).For example, the recess (522c) may be formed into a shape in which the extended surface (5224c) and the second surface (523c) are curved, and the cross-section includes a circular or elliptical shape.

[0132] Referring to FIG. 11d, the recess (522d) may include an extension surface (5223d) extending in a second direction (+Z direction) from the first surface (521d). The recess (522d) may include an extension surface (5224d) extending perpendicular to the second direction (+Z direction) from the extension surface (5223d) and in a direction opposite to the internal space of the recess (522d). The extension surface (5224d) may extend from the extension surface (5223d) with a constant slope. The recess (522d) may include extension surfaces (5224d) extending from each of the extension surfaces (5223d) spaced apart from each other. The recess (522d) may include a first portion (5221d) recessed from the first surface (521d). The first portion (5221d) may include an extension surface (5223d) extending in a second direction (+Z direction) from the first surface (521d). The first portion (5221d) may include extension surfaces (5223d) spaced apart from each other by a predetermined width (e.g., D1 in FIG. 11A). The recess (522d) may include a second portion (5222d). The second portion (5222d) may include an extension surface (5224d) extending in a third direction that is perpendicular to the second direction (+Z direction) from the extension surface (5223d) and away from the inner space of the recess or perpendicular to the second direction. The second portion (5222d) may include an extension surface (5224d) extending perpendicular to the second direction (+Z direction) with a predetermined slope. The second portion (5222d) may have a triangular cross-section. The recess (522d) may be expanded such that each of the expansion surfaces (5224d) has an increasing width spaced apart from each other. For example, the cross-section of the recess (522d) may be formed into a shape including a triangle. The configurations of the first portion (e.g., 5221a of FIG. 11a) described with reference to FIGS. 11a to 11d may be substantially the same as the first portion (e.g., 4221 illustrated in FIG. 8a) described with reference to FIGS. 6 to 10.The configurations of the second part (e.g., 5222a in FIG. 11a) described in FIGS. 11a to 11d may be the same as the second part (e.g., 4222 illustrated in FIG. 8a) described with reference to FIGS. 6 to 10.

[0133] The recess (e.g., 522 in FIG. 10) described with reference to FIGS. 10 and 11a to 11d can be filled with a second housing portion (e.g., 430 in FIG. 8a) to enhance bonding strength with the second housing portion. For example, the second housing portion (e.g., 430 in FIG. 8a) can be filled in an expanded space formed by an expanded surface of the recess (e.g., 5224 in FIG. 10), thereby increasing the physical bonding strength due to the anchor effect.

[0134] Hereinafter, the components of the recess (e.g., 522 illustrated in FIG. 10) described with reference to FIGS. 10 and 11a to 11d may be substantially the same as the components of the recess (e.g., 422 illustrated in FIG. 8a) described with reference to FIGS. 6 to 9. The components of the recess (e.g., 522 illustrated in FIG. 10) not described below may be substantially the same as the components of the recess (e.g., 422 illustrated in FIG. 8a) described with reference to FIGS. 6 to 9.

[0135] FIG. 12 is a cross-sectional view showing a plurality of recesses included in a plate surface of a housing component according to one embodiment of the present disclosure. The components described with reference to FIG. 12 may be substantially the same as the components described with reference to FIGS. 1 to 11D. The components described with reference to FIG. 12 may be substantially the same as the components described with reference to FIGS. 13 to 21B. The embodiment of FIG. 12 may be combined with the embodiments of FIGS. 13 to 21B. Hereinafter, configurations not described may be substantially the same as the components described with reference to FIGS. 1 to 11B and 13 to 21B.

[0136] According to one embodiment, a housing component (e.g., 401 of FIG. 6) may include a first housing portion (620) including a plurality of recesses (622) and a second housing portion (e.g., 430 of FIG. 8A) filling the plurality of recesses (622). The first housing portion (620) may include a plurality of recesses (622) that are recessed in a second direction (+Z direction) from a first surface (621). The plurality of recesses (622) may be arranged along the first surface (621). The plurality of recesses (622) may be arranged in the +X direction. The plurality of recesses (622) may be formed to be spaced apart from each other by a second distance (L2). The plurality of recesses (622) may include an extension surface (6223) that extends in the second direction (+Z direction) from the first surface (621). Each of the plurality of recesses (622) may include a second surface (623) spaced apart from the first surface (621) in a second direction (+Z direction) by a predetermined distance (e.g., the first distance (L1) illustrated in FIG. 8A). Each of the plurality of recesses (622) may include a first portion (6221) recessed from the first surface (621). The first portion (6221) may include an extension surface (6223) extending from the first surface (621) in a second direction (+Z direction). The first portion (6221) may include a second surface (623) spaced apart from the first surface (621) in a second direction (+Z direction) by a predetermined distance (e.g., the first distance (L1) illustrated in FIG. 8A). Each of the plurality of recesses (622) may include an extension surface (6224) extending in a third direction perpendicular to the second direction (+Z direction) from the extension surface (6223) and away from the internal space of each recess (622) or perpendicular to the second direction. Each of the plurality of recesses (622) may include a second portion (6222) extending in a second direction (+Z direction) perpendicular to the second direction from the first portion (6221).The second portion (6222) may include an extension surface (6224) extending in a third direction perpendicular to the second direction (+Z direction) from the extension surface (6223) and away from the interior space of each recess (622) or perpendicular to the second direction. The first housing portion (620) may include a pattern composed of a plurality of recesses (622). Each recess (622) not described below may refer to the recesses of FIGS. 6 to 11D (e.g., 422 of FIG. 8A). Configurations not described below may be substantially the same as those described with reference to FIGS. 1 to 11D.

[0137] Fig. 13 is a drawing showing a first recessed portion and a second recessed portion on a plate surface of a housing component according to one embodiment of the present disclosure. Fig. 14 is an enlarged drawing of a plate surface of a housing component (e.g., 401 of Fig. 6) according to one embodiment of the present disclosure.

[0138] The components described with reference to FIGS. 13 and 14 may be substantially the same as the components described with reference to FIGS. 1 to 12. The components described with reference to FIGS. 13 and 14 may be substantially the same as the components described with reference to FIGS. 15 to 21B. The embodiments of FIGS. 13 and 14 may be combined with the embodiments of FIGS. 15 to 21B. Hereinafter, components not described may be substantially the same as the components described with reference to FIGS. 1 to 12 and 15 to 21B.

[0139] Referring to FIG. 13, a housing component (e.g., 410 of FIG. 8A) (710) may include a first housing portion (720) having a recess (722) formed therein. The first housing portion (720) may include a first recess portion (722a) including a recess (722) extending in a third direction (+Y direction). Referring to region C1 illustrated in FIG. 13, the first recess portion (722a) may be recessed from a first surface (721) of the first housing portion (720) in the third direction (+Y direction) and may be continuous. The first recess portion (722b) may include a third surface (723a). The first housing portion (720) may include a plurality of discontinuous first surfaces (721) along the first recess portion (722a). The first recessed portion (722a) may include a plurality of first recessed portions (722a) along the X-axis direction. The plurality of first recessed portions (722a) may be spaced apart from each other by a predetermined distance (e.g., L2 illustrated in FIG. 12). The first housing portion (720) may include a second recessed portion (722b) including a recess extending in a direction intersecting the third direction of the recess (722). Referring to region C2 illustrated in FIG. 13, the second recessed portion (722b) may be recessed from the first surface (721) of the first housing portion (720) in a direction (X-axis direction) intersecting the third direction (Y-axis direction). The second recessed portion (722b) may include a third surface (723b). The first housing portion (720) may include a plurality of discontinuous first surfaces (721) along the second recess portion (722b). The second recess portion (722b) may include a plurality of second recess portions (722b) along the Y-axis direction. The plurality of second recess portions (722b) may be spaced apart from each other by a predetermined distance (e.g., L2 as shown in FIG. 12). The first recess portion (722a) and the second recess portion (722b) may intersect each other to form a predetermined pattern.The first recess portion (722a) and the second recess portion (722b) may use the recesses described with reference to FIGS. 6 to 14 (e.g., 422 in FIG. 8a).

[0140] The first recess portion (722a) may refer to a recess (722a) formed from the first surface (721) along the Y-axis direction. For example, the first recess portion (722a) may be formed by being recessed from the first surface (721) of the first housing portion and extending in the Y-axis direction. The second recess portion (722b) may refer to a recess (722b) formed from the first surface (721) along the X-axis direction. For example, the second recess portion (722b) may be formed by being recessed from the first surface (721) of the first housing portion and extending in the X-axis direction.

[0141] Referring to FIG. 14, a second housing portion (730) can be filled in the first recess portion (722a) and the second recess portion (722b). The second housing portion (730) can be filled by extending along the first recess portion (722a). The second housing portion (730) can be filled by extending along the second recess portion (722b). The third surface (731) of the second housing portion (730) filled in the first recess portion (722a) and the second recess portion (722b) can be aligned with the first surface (721) of the first housing portion. The third surface of the second housing portion can be positioned to correspond to the first surface (721). Referring to area S4 of FIG. 14, when the housing component (710) is viewed from above, the second housing portion (730) can be filled into the recess (722) and contact the corner (or edge) (724) of the recess. The second housing portion (730) can form a pattern along the first recess portion (722a) and the second recess portion (722b) of the first housing portion (720).

[0142] FIG. 15 is an enlarged view of section A-A' illustrated in FIG. 6 according to one embodiment of the present disclosure. The components described with reference to FIG. 15 may be substantially the same as the components described with reference to FIGS. 1 to 14. The components described with reference to FIG. 15 may be substantially the same as the components described with reference to FIGS. 16 to 21B. The embodiment of FIG. 15 may be combined with the embodiments of FIGS. 16 to 21B. Hereinafter, configurations not described may be substantially the same as the configurations described with reference to FIGS. 1 to 14.

[0143] A housing component (810) of an electronic device (e.g., 101 of FIG. 2) according to one embodiment may include a first housing portion (820) and a second housing portion (830). The first housing portion (820) may include a recess (822) recessed from a first surface (821). The recess (822) may include a first portion (8221) recessed from the first surface (821) and a second portion (8222) extending from the first portion (8221) in a second direction (+Z direction) and away from the space inside the recess (822) or in a third direction that is perpendicular to the second direction. The second housing portion (830) may be disposed in the recess (822). The second housing portion (830) may fill the recess (822). The second housing portion (830) can fill the second portion (8222). The second housing portion (830) can extend in a first direction (-Z direction) while filling the second portion (8222) to fill the first portion (8221). The second housing portion (830) can include a protrusion (832) that protrudes in the first direction (-Z direction) by a first separation distance (L3) from a portion that fills the recess (822). The protrusion (832) can include a protrusion surface (8321) that forms a convex curved surface in the first direction (-Z direction). The protrusion surface (8321) can contact a corner (or edge) (824) of the recess (822).

[0144] According to one embodiment, the recess (822) of the first housing portion (820) can include a plurality of recesses (822). The second housing portion (830) can be disposed in each of the plurality of recesses (822). The second housing portion (830) can fill the plurality of recesses (822).

[0145] In one embodiment, the housing component (810) may include an oxide layer (840). The oxide layer (840) may extend with a constant thickness along the first surface (821) and the protruding surface (8321). The oxide layer (840) may include a first oxidized portion (841) and a second oxidized portion (842). The first oxidized portion (841) may be disposed in the first housing component (820). The second oxidized portion (842) may be disposed in the second housing component (830). The oxide layer (840) may prevent damage at a corner (or edge) (824) of the recess (822) due to the curved surface of the protruding surface (8321) of the second housing component (830). For example, when the second housing portion (830) fills the recess (822) of the first housing portion (820) and is flush with the first surface (821), the oxide layer (840) can be prevented from being damaged at the corner (or edge) (824) even if it includes some protruding protrusions. The oxide layer (840) of FIG. 15 can utilize the oxide layer (440) described with reference to FIG. 9.

[0146] FIG. 16 is an enlarged view of a plate surface of a housing component according to an embodiment of the present disclosure. FIG. 17 is a conceptual diagram illustrating FIG. 16 according to an embodiment of the present disclosure. The configurations described with reference to FIGS. 16 and 17 may be substantially the same as the configurations described with reference to FIGS. 1 to 15. The configurations described with reference to FIGS. 16 and 17 may be substantially the same as the configurations described with reference to FIGS. 18 to 21B. The embodiments of FIGS. 16 and 17 may be combined with the embodiments of FIGS. 18 to 21B. Configurations not described herein may be substantially the same as the configurations of FIGS. 1 to 15.

[0147] In one embodiment, the housing component (910) may include a first housing portion (920) and a second housing portion (930). The first housing portion (920) may include a recess (922). The second housing portion (930) may fill the recess (922). The second housing portion (930) may fill the recess (922) and extend in a first direction (-Z direction). The extended second housing portion (930) may include a third face (931) aligned with the first face (921). The extended second housing portion (930) may include a protrusion (e.g., 832 as shown in FIG. 15) spaced apart from the first face (910) by a first distance (e.g., L3 as shown in FIG. 15). The protrusion (e.g., 832 as shown in FIG. 15) may include a protrusion surface (e.g., 8321 as shown in FIG. 15) that forms a convex surface in the first direction (-Z direction).

[0148] Referring to FIG. 16, the first housing portion (920) may include an edge (924) surrounding at least a portion of the recess (922). The first housing portion (920) may include an edge (924) connecting the first surface (921) and the recess (922). The second housing portion (930) may have a third surface (931) or a protruding surface (e.g., 8321 as shown in FIG. 15) that may contact the edge (924) of the recess (922) to engage the first housing portion (920). Referring to FIG. 16, the edge (924) may include a plurality of grooves (9241). The second housing portion (930) may include an engaging portion (933) that protrudes into the plurality of grooves (9241). A third surface (931) or protruding surface (e.g., 8321 as shown in FIG. 15) of the second housing portion (930) may include a plurality of grooves (9241) that protrude and include a coupling portion (933) that couples with the first housing portion (920). The second housing portion (920) may be coupled to the first housing portion (920) to form a coupling surface (9331). For example, the molten second housing portion (930) may fill the recess (922) of the first housing portion (920) and be molten-bonded to the edge (924).

[0149] Hereinafter, the configurations of the housing part (910) not described may be substantially the same as the housing part (e.g., 410 illustrated in FIG. 6) described with reference to FIGS. 1 to 15. The first housing part (920) and the second housing part (930) may use the first housing part (e.g., 420 illustrated in FIG. 8A) and the second housing part (e.g., 430 illustrated in FIG. 8A) described with reference to FIGS. 1 to 15.

[0150] FIG. 18 is a drawing regarding a method (1000) for manufacturing a housing component according to one embodiment of the present disclosure. FIG. 19 is a drawing illustrating a method for manufacturing a housing component according to one embodiment of the present disclosure. The components of the plate described with reference to FIGS. 18 and 19 may be substantially the same as the components described with reference to FIGS. 1 to 17. The components of the plate described with reference to FIGS. 18 and 19 may be substantially the same as the components described with reference to FIGS. 20 to 21B. The embodiments of FIGS. 18 and 19 may be combined with the embodiments of FIGS. 20 to 21B. Configurations not described below may be substantially the same as the configurations described with reference to FIGS. 1 to 17.

[0151] According to one embodiment, a method for manufacturing a housing component (1010) may include an operation (1001) of forming a concave portion (or recess) (1022). The operation (1001) of forming the concave portion (1022) may be an operation of forming the concave portion (1022) in a first metal member (1020). The concave portion (1022) may be an operation of recessing a first surface (1021) of the first metal member (1020). The first metal member (1020) may utilize the first housing portion (e.g., 420 illustrated in FIG. 8A) described with reference to FIGS. 6 to 17. The concave portion (1022) may utilize the recess (e.g., 422 illustrated in FIG. 8A) described with reference to FIGS. 6 to 17.

[0152] According to one embodiment, a method of manufacturing a housing component (1010) may include an operation (1002) of forming a second metal member (1030). The second metal member (1030) may fill a concave portion (1022) of a first metal member (1020). The second metal member (1030) may fill the concave portion (1022) of the first metal member (1020) and extend in a first direction (-Z direction). The second metal member (1030) may be applied in a molten state along the first surface (1021) and the recess (1022). At least a portion of the second metal member (1030) may be disposed on the first surface (1021). The second metal member (1030) may be disposed on the first metal member (1020). The second metal member (1030) may include a second metal member surface (1034). The second metal member (1030) may utilize the second housing portion of FIGS. 6 to 17 (e.g., 430 illustrated in FIG. 8A).

[0153] According to one embodiment, a method of manufacturing a housing component (1010) may include an operation (1003) of etching a second metal member (1030). The etched second metal member (1030) may include a protrusion (1032) that protrudes from a first surface (1021) by a predetermined distance (e.g., L3 as shown in FIG. 15). The method of manufacturing a housing component (1010) may include an operation (10031) of etching the second metal member (1030) so that it includes the protrusion (1032). The etching operation (10031) including the protrusion may be a step of the etching operation (1003). The method of manufacturing a housing component (1010) may include an operation (10032) of completely etching the second metal member. The completely etching operation (10032) may be a final step of the etching operation (1003). The etched second metal member (1030) may have a third surface (1031) aligned with the first surface (1021). The third surface (1031) may be positioned to correspond to the first surface (1021). For example, the second metal member (1030) may be etched so that the first surface (1021) of the first metal member (1020) and the third surface (1031) of the second metal member (1030) form a surface (1011) of the housing component (1010). The etched second metal member (1030) may be fused and bonded, such as the first housing portion (e.g., 920 illustrated in FIG. 16) and the second housing portion (e.g., 930 illustrated in FIG. 16), as described with reference to FIG. 16 when the housing component (1010) is viewed from above. When viewed from above, the recess (1022) of the first metal member and the second metal member (1030) filling the recess (1022) can form a pattern. The etched second metal member (1030) can refer to the second housing portion of FIGS. 6 to 17 (e.g., 430 illustrated in FIG. 9). The second metal member (1030) including the protrusion can refer to the second housing portion of FIGS. 6 to 17 (e.g., 930 illustrated in FIG. 16).

[0154] According to one embodiment, a method of manufacturing a housing component (1010) may include an operation (1004) of forming an oxide layer (1040) on the housing component (1010). The oxide layer (1040) may be disposed on a plate surface (1011). The oxide layer (1040) may extend along the plate surface (1011). The oxide layer (1040) may be disposed on a first metal member (1020) and a second metal member (1030). The oxide layer (1040) may be formed to a constant thickness. The oxide layer (1040) may include a first oxidized portion (1041) and a second oxidized portion (1042). The first oxidized portion (1041) may be disposed on the first metal member (1020). The first oxidized portion (1041) can be grown in a first direction (-Z direction) on the first surface (1021) of the first metal member (1020). The second oxidized portion (1042) can be disposed on the second metal member (1030). The second oxidized portion (1042) can be disposed on the third surface (1031) of the second metal member (1030) or the protruding surface (10321) of the protruding portion (1032). The second oxidized portion (1042) can be disposed on the third surface (1031) or the protruding surface (10321) and grow in the first direction (-Z direction). The first oxidized portion (1041) and the second oxidized portion (1042) can be connected to each other. The first oxidized portion (1041) and the second oxidized portion (1042) can form a surface (10401) of the oxide layer. The first oxidized portion (1041) and the second oxidized portion (1042) of the oxide layer (1040) may have different characteristics. For example, the thickness may be the same, but the growth rate and shape of the oxide layer may be different. The oxide layer (1040) may be formed through an anodizing process. The oxide layer (1040) may be formed through an anodizing process by immersing the housing component (1010) in a liquid containing an electrolyte. The recess (1022) may be filled and placed on the plate surface (1011) without being damaged by the etched second metal member (1030).The oxide layer (1040) can increase the effect of the pattern formed by the first metal member (1020) and the second metal member (1030) on the plate surface (1011). For example, the pattern effect of the appearance due to the pattern of the first metal member and the second metal member formed of different metal members can be increased by the oxide layer (1040). This can make the appearance stand out to the user.

[0155] FIG. 20 is a drawing showing the content of a metal material included in a plate of a housing component according to one embodiment of the present disclosure. FIG. 21a is a drawing analyzing the material of a first housing portion of a plate of a housing component (e.g., 401 of FIG. 6) according to one embodiment of the present disclosure. FIG. 21b is a drawing analyzing the material of a second housing portion of a plate of a housing component (e.g., 401 of FIG. 6) according to one embodiment of the present disclosure.

[0156] According to one embodiment, the first housing portion (or first metal member) (1120) may include an aluminum alloy. The first housing portion (or first metal member) (1120) may include aluminum (Al). The first housing portion (or first metal member) (1120) may include zinc (Zn). The first housing portion (or first metal member) (1120) may include magnesium (Mg). According to one embodiment, the first metal member may be formed by controlling the content ratio (wt%) of aluminum (Al) and other materials. According to one embodiment, the first housing portion (or first metal member) (1120) may be manufactured with a content ratio (wt%) including 93.38 wt% of aluminum (Al), 2.58 wt% of zinc (Zn), and 1.79 wt% of magnesium (Mg). However, it is not limited to the content ratio (wt%) according to one embodiment, and the content ratio can be appropriately changed through normal design changes. For example, the content ratio (wt%) of aluminum (Al) can be reduced and the content ratios of zinc and magnesium can be increased.

[0157] According to one embodiment, the second housing portion (or second metal member) (1130) may include an aluminum alloy. The second housing portion (or second metal member) (1130) may include aluminum (Al). According to one embodiment, the second housing portion (or second metal member) (1130) may include 98.22 wt% of aluminum (Al). However, the present invention is not limited to one embodiment, and the aluminum (Al) content ratio (wt%) may be appropriately changed. For example, the aluminum (Al) content ratio (wt%) may be reduced and another alloy material may be added, or the carbon (C) or oxygen (O) content ratio (wt%) may be increased.

[0158] Referring to FIG. 21a, the first housing part (or first metal member) (1020) may include three peaks in the range of 1 keV to 2 keV as a result of spectrum analysis. The first housing part (or first metal member) (1020) may have the largest luminosity (lm) of aluminum (Al), and the luminosities (lm) of zinc (Zn) and magnesium (Mg) may be smaller. Referring to FIG. 21b, the second housing part (or second metal member) (1030) may include one peak in the range of 1 keV to 2 keV as a result of spectrum analysis. The luminosity (lm) of aluminum (Al) of the second housing part (or second metal member) (1030) may have a larger value than the luminosity (lm) of aluminum (Al) of the first housing part (or first metal member) (1020) described with reference to FIG. 21a. However, the components of the first housing part (or first metal member) (1020) and the second housing part (or second metal member) (1030) are not limited thereto and may be changed depending on the embodiment.

[0159] According to one embodiment, the exterior of the electronic device can be decorated by the difference in the composition of the first housing portion (or the first metal member) (1020) and the second housing portion (or the second metal member) (1030). The difference in the composition of the first housing portion (or the first metal member) (1020) and the second housing portion (or the second metal member) (1030) allows an oxide layer (e.g., 440 as shown in FIG. 9) disposed on a plate (e.g., 410 as shown in FIG. 8A) to have the same thickness while having different properties. The difference in the composition of the first housing portion (or the first metal member) (1020) and the second housing portion (or the second metal member) (1030) allows the first oxide portion (e.g., 441 as shown in FIG. 9) and the second oxide portion (e.g., 442 as shown in FIG. 9) to have different properties. For example, when a housing part (e.g., 410 of FIG. 8a) is immersed to form an oxide layer, the first oxidized portion and the second oxidized portion may grow differently depending on the corresponding first housing part (1020) and second housing part (1030), respectively. For example, the first oxidized portion (e.g., 441 shown in FIG. 9) corresponding to the first housing part (1020) and the second oxidized portion (e.g., 442 shown in FIG. 9) corresponding to the second housing part (1030) may grow at different growth rates, and may be formed to have substantially the same thickness as the destruction and creation of the oxide layer are repeated in the final stage. The first oxidized portion (e.g., 441 shown in FIG. 9) and the second oxidized portion (e.g., 442 shown in FIG. 9) may be formed integrally while having different characteristics. The first oxidized portion (e.g., 441 as shown in FIG. 9) and the second oxidized portion (e.g., 442 as shown in FIG. 9) may be formed to substantially the same thickness. In the present disclosure, substantially the same thickness means a height or step difference of 1 μm or less with respect to the thickness of the oxidized layer (e.g., 440 as shown in FIG. 9).The oxide layer described with reference to FIG. 21a in the present disclosure (e.g., 440 shown in FIG. 9) can be used for the oxide layers of FIGS. 1 to 20.

[0160] The content ratio described in this disclosure is described based on wt% based on mass, but is not limited thereto and can be described based on specific gravity, density (kg / m3), mole (mol) ratio (mol%), etc.

[0161] The plate of the housing component according to the embodiment of the present disclosure can decorate the exterior of the electronic device through different dual materials.

[0162] The recess of the plate of the housing component according to one embodiment of the present disclosure can be filled with another material to implement a flat plate surface.

[0163] According to one embodiment of the present disclosure, the plate of the housing component can enhance bonding strength with a material filling the recess according to the recess shape of the housing portion including the recess.

[0164] According to one embodiment of the present disclosure, a plate of a housing component can enhance bonding strength by melting a housing portion including a recess and a material filling the recess.

[0165] The plate of the housing component according to one embodiment of the present disclosure can form a uniform oxide layer on a flat plate surface.

[0166] The plate of the housing component according to one embodiment of the present disclosure can prevent damage such as delamination of the oxide layer due to unevenness (or edges) of the plate surface due to a flat surface.

[0167] According to one embodiment of the present disclosure, the plate of the housing component may have different oxide layers formed due to differences in the properties of the plate including the recess and the material filling the plate.

[0168] The plate of the housing component according to one embodiment of the present disclosure can improve the decorativeness of the appearance of an electronic device through differences in gloss, color, etc. due to different oxide layers.

[0169] The plate of the housing component according to one embodiment of the present disclosure can enhance the durability of the plate due to the uniform surface and oxide layer.

[0170] The plate of the housing component according to one embodiment of the present disclosure can partially implement different surface roughness on the plate surface through different alloy materials, thereby implementing different textures in the appearance.

[0171] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0172] According to one embodiment of the present disclosure, an electronic device may include a housing component (e.g., 401 of FIG. 6).

[0173] According to one embodiment of the present disclosure, a housing component (e.g., 401 of FIG. 6) of an electronic device may include a first housing portion comprising a first metal material having a plurality of first pores (e.g., 425 of FIG. 8b), a first housing portion (e.g., 420 of FIG. 9) including a first surface (e.g., 421 of FIG. 9) facing a first direction and a plurality of recesses (e.g., 422 of FIG. 12) sunk from the first surface in a second direction opposite to the first direction.

[0174] According to one embodiment of the present disclosure, a housing component of an electronic device (e.g., 401 of FIG. 6) may include a second metal material having a plurality of second pores (e.g., 435 of FIG. 8b) and may include a second housing portion (e.g., 430 of FIG. 9) accommodated in the plurality of recesses.

[0175] According to one embodiment of the present disclosure, a housing component of an electronic device (e.g., 401 of FIG. 6) may have a first porosity for the plurality of first pores of the first metal material that is smaller than a second porosity for the plurality of second pores of the second metal material.

[0176] According to one embodiment of the present disclosure, a second housing portion of a housing component of an electronic device (e.g., 401 of FIG. 6) may include a third surface (e.g., 431 of FIG. 9) disposed substantially on the same plane as a first surface of the first housing portion.

[0177] According to one embodiment of the present disclosure, the oxide layer of the housing component (e.g., 401 of FIG. 6) may be disposed on the first surface of the first housing portion and the third surface of the second housing portion (e.g., 431 of FIG. 9).

[0178] According to one embodiment of the present disclosure, an oxide layer of a housing component (e.g., 401 of FIG. 6) may extend along a third direction perpendicular to the first direction and the second direction over the first surface and the third surface with a substantially uniform thickness.

[0179] According to one embodiment of the present disclosure, the oxide layer of the housing component (e.g., 401 of FIG. 6) may include a first oxide portion (e.g., 441 of FIG. 9) disposed on the first surface of the first housing portion and a second oxide portion (e.g., 442 of FIG. 9) disposed on the third surface of the second housing portion and different from the first oxide portion.

[0180] According to one embodiment of the present disclosure, a first housing portion of a housing component (e.g., 401 of FIG. 6) may include a first edge (e.g., 424 of FIG. 8A) positioned on one side of each of the plurality of recesses.

[0181] According to one embodiment of the present disclosure, the first oxidized portion and the second oxidized portion of the housing component (e.g., 401 in FIG. 6) can be connected at a position corresponding to the first edge.

[0182] According to one embodiment of the present disclosure, the first density of the first metal material of the housing component (e.g., 401 of FIG. 6) may be greater than the second density of the second metal material.

[0183] According to one embodiment of the present disclosure, a plurality of recesses of a housing component (e.g., 401 of FIG. 6) may include a first portion (e.g., 4221 of FIG. 11a) including an extension surface (e.g., 4223 of FIG. 11a) extending from the first surface in the second direction, and a second portion (e.g., 4222 of FIG. 11a) including an extension surface (e.g., 4224 of FIG. 11a) extending from the extension surface in a third direction perpendicular to the second direction.

[0184] According to one embodiment of the present disclosure, the plurality of recesses of the housing component (e.g., 401 of FIG. 6) may have a second portion larger than the first portion.

[0185] According to one embodiment of the present disclosure, the plurality of recesses of the housing component (e.g., 401 of FIG. 6) may include a first-first extension surface (e.g., 5223a of FIG. 11a) extending from the first surface located on one side of the plurality of recesses, and a first-second extension surface (e.g., 52232a of FIG. 11a) extending from the first surface located on the other side of the plurality of recesses, spaced apart from the first extension surface.

[0186] According to one embodiment of the present disclosure, the extended surface (e.g., 5224a of FIG. 11a) of the housing component (e.g., 401 of FIG. 6) may include a first-first extended surface (e.g., 52241a of FIG. 11a) extended from the first-first extended surface and a first-second extended surface (e.g., 52242a of FIG. 11a) extended from the first-second extended surface.

[0187] According to one embodiment of the present disclosure, the extended surface (e.g., 5224c in FIG. 11c) of the housing component (e.g., 401 in FIG. 6) may be formed to be convex in a third direction perpendicular to the second direction.

[0188] According to one embodiment of the present disclosure, the plurality of recesses (e.g., 622 of FIG. 12) of the housing component (e.g., 401 of FIG. 6) may be spaced apart from each other along the first surface.

[0189] According to one embodiment of the present disclosure, the second housing portion of the housing component (e.g., 410 of FIG. 6) can fill the plurality of recesses.

[0190] According to one embodiment of the present disclosure, the first housing portion of the housing component (e.g., 401 of FIG. 6) may include a first recessed portion (e.g., 722a of FIG. 13) extending along the first surface (e.g., 721 of FIG. 13) and a second recessed portion (e.g., 722b of FIG. 13) extending along the first surface in a direction intersecting the first recessed portion.

[0191] According to one embodiment of the present disclosure, the second housing portion of the housing component (e.g., 401 of FIG. 6) can extend along the first recess portion and the second recess portion to fill the recess.

[0192] According to one embodiment of the present disclosure, the second housing portion of the housing component (e.g., 401 of FIG. 6) may include a protrusion (e.g., 832 of FIG. 15) that protrudes from the first surface by a first distance (L2) in a direction away from the recess.

[0193] According to one embodiment of the present disclosure, the protrusion of the housing component (e.g., 401 of FIG. 6) may include a protrusion surface (e.g., 8321 of FIG. 15) facing away from the plurality of recesses.

[0194] According to one embodiment of the present disclosure, the oxide layer (e.g., 840 in FIG. 15) of the housing component (e.g., 401 in FIG. 6) may extend along the first housing portion along the first surface (e.g., 821 in FIG. 15) and the protruding surface (e.g., 8321 in FIG. 15).

[0195] According to one embodiment of the present disclosure, the first housing portion of the housing component (e.g., 401 of FIG. 6) may include a plurality of grooves (e.g., 9241 of FIG. 16) on an edge (e.g., 424 of FIG. 8a) surrounding at least a portion of the plurality of recesses, and the second housing portion may include a connecting portion (e.g., 933 of FIG. 16) protruding toward the grooves and contacting the first housing portion.

[0196] According to one embodiment of the present disclosure, the second housing portion (e.g., 1110 in FIG. 20) of the housing component (e.g., 401 in FIG. 6) includes a first metal material, and the first housing portion (e.g., 1120 in FIG. 20) may further include a second metal material and a third metal material that are different from the first metal material.

[0197] According to one embodiment of the present disclosure, the first housing portion of the housing component (e.g., 401 of FIG. 6) may have a first surface roughness, and the second housing portion may have a second surface roughness greater than the first surface roughness.

[0198] According to an embodiment of the present disclosure, a method for manufacturing a housing component (e.g., 1010 of FIG. 19) of an electronic device (e.g., 1000 of FIG. 18) may include an operation (e.g., 1001 of FIG. 18) of forming an engraved portion (e.g., 1022 of FIG. 18) in a direction opposite to the first direction on a first metal member (e.g., 1020 of FIG. 18) including a first surface facing a first direction.

[0199] According to an embodiment of the present disclosure, a method for manufacturing a housing component (e.g., 1010 of FIG. 19) of an electronic device (e.g., 1000 of FIG. 18) may include an operation (e.g., 1002 of FIG. 18) of forming a concave portion of the first metal member and a second metal member (e.g., 1020 of FIG. 18) on the first surface.

[0200] According to an embodiment of the present disclosure, a method for manufacturing a housing component (e.g., 1010 of FIG. 19) of an electronic device (e.g., 1000 of FIG. 18) may include an operation of etching the second metal member to a position corresponding to the first surface (e.g., 1003 of FIG. 18).

[0201] According to an embodiment of the present disclosure, a method for manufacturing a housing component (e.g., 1010 of FIG. 19) of an electronic device (e.g., 1000 of FIG. 18) may further include an operation of forming an oxide layer (1040) on the plate (e.g., 1004 of FIG. 18).

[0202] According to an embodiment of the present disclosure, a method for manufacturing a housing component (e.g., 1010 of FIG. 19) of an electronic device (e.g., 1000 of FIG. 18) may be formed such that the oxide layer (e.g., 1040 of FIG. 18) includes a first oxide portion (e.g., 1041 of FIG. 19) disposed on the first metal member and a second oxide portion (e.g., 1042 of FIG. 19) disposed on the second metal member.

[0203] According to an embodiment of the present disclosure, the operation of forming the engraved portion of the method for manufacturing a housing component (e.g., 1010 of 19) of an electronic device (e.g., 1000 of FIG. 18) may include an operation of forming the engraved portion so as to have a predetermined pattern on the first surface of the plate.

[0204] According to an embodiment of the present disclosure, the second metal member forming operation of the method for manufacturing a housing component (e.g., 1010 of FIG. 19) of an electronic device (e.g., 1000 of FIG. 18) may include an operation of filling the molten second metal member into the concave portion of the first metal member and hardening the same.

Claims

1. In the housing part (401) of the electronic device, A first housing portion comprising a first metal material having a plurality of first pores (425), the first housing portion comprising a first surface (421; 521; 621; 721; 821; 921) facing a first direction and a plurality of recesses (422; 522; 622; 722; 822; 922) sunken from the first surface in a second direction opposite to the first direction (420; 520; 620; 720; 820; 920); and A second metal material having a plurality of second pores (435) and a second housing portion (430; 530; 630; 730; 830; 930) accommodated in the plurality of recesses, A housing component in which the first porosity for the plurality of first pores of the first metal material is smaller than the second porosity for the plurality of second pores of the second metal material.

2. In paragraph 1, The second housing portion includes a third surface (431; 531; 631; 731) disposed substantially on the same plane as the first surface of the first housing portion, The above oxide layer is a housing part of an electronic device disposed on the first surface of the first housing part and the third surface (431) of the second housing part.

3. In paragraph 2, A housing component of an electronic device, wherein the oxide layer has a substantially uniform thickness and extends along a third direction perpendicular to the first direction and the second direction over the first surface and the third surface.

4. In paragraph 2 or paragraph 3, The above oxide layer includes a first oxide portion (441) disposed on the first surface of the first housing portion and a second oxide portion (442) disposed on the third surface of the second housing portion and different from the first oxide portion, The first housing portion includes a first edge (424) located on one side of each of the plurality of recesses, A housing component of an electronic device, wherein the first oxidized portion and the second oxidized portion are connected at a position corresponding to the first edge.

5. In any one of paragraphs 1 to 4, A housing component of an electronic device, wherein the first density of the first metal material is greater than the second density of the second metal material.

6. In any one of paragraphs 1 to 5, The above plurality of recesses are, A first portion (4221; 5221; 6221; 7221; 8221) including an extension surface (4223; 5223; 6223; 7223; 8223) extending in the second direction from the first surface; and A second portion (4222; 5222; 6222; 7222; 8222) including an extension surface (4224; 5224; 6224; 7224; 8224) extending in a third direction perpendicular to the second direction from the extension surface, The second part is a housing part of an electronic device larger than the first part.

7. In paragraph 6, The above extension surface (5223a) includes a first-first extension surface (52231a) extending from the first surface located on one side of the plurality of recesses and a first-second extension surface (52232a) extending from the first surface located on the other side of the plurality of recesses and spaced apart from the first extension surface, The above extension surface (5224a) is a housing component of an electronic device including a first-first extension surface (52241a) extended from the first extension surface and a first-second extension surface (52242a) extended from the first-second extension surface.

8. In paragraph 6 or 7, The above-mentioned expansion surface (5224c) is a housing component of an electronic device formed convexly in a third direction perpendicular to the second direction.

9. In any one of paragraphs 1 to 8, The above plurality of recesses (622) are spaced apart from each other along the first surface, The second housing portion is a housing component of an electronic device that fills the plurality of recesses.

10. In any one of paragraphs 1 to 9, The first housing portion includes a first recess portion (722a) extending along the first surface (721) and a second recess portion (722b) extending along the first surface in a direction intersecting the first recess portion, A housing component of an electronic device, wherein the second housing portion extends along the first recess portion and the second recess portion to fill the recess.

11. In any one of paragraphs 1 to 10, The second housing portion (830) includes a protrusion (832) protruding away from the plurality of recesses, The above protrusion includes a protrusion surface (8321) facing away from the plurality of recesses, The above oxide layer (840) is a housing part of an electronic device extending along the first surface (821) and the protruding surface (8321).

12. In any one of paragraphs 1 to 11, A housing component of an electronic device, wherein the second housing portion (1110) includes a first metal material, and the first housing portion (1120) further includes a second metal material and a third metal material different from the first metal material.

13. In any one of paragraphs 1 to 12, A housing component of an electronic device, wherein the first housing portion has a first surface roughness, and the second housing portion has a second surface roughness greater than the first surface roughness.

14. In a method (1000) for manufacturing a housing part (1010) of an electronic device, An operation (1001) of forming an engraved portion (1022) in a direction opposite to the first direction on a first metal member (1020) including a first surface facing the first direction; An operation (1002) of forming a second metal member (1020) on the engraved portion of the first metal member and the first surface; and A method for manufacturing a housing part of an electronic device, including an operation (1003) of etching the second metal member to a position corresponding to the first surface.

15. In paragraph 14, A method for manufacturing a housing component of an electronic device, further comprising an operation (1004) of forming an oxide layer (1040) on the plate.

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