Method and apparatus for manufacturing through-type electrode

Abstract

A method for manufacturing a through-type electrode according to embodiments may comprise the steps of: preparing a glass substrate having one or more through-holes; inserting metal pins into the through-holes of the glass substrate by using a vibration scheme; manufacturing a molded product by placing the glass substrate, which has the metal pins inserted into the through-holes, into a molding furnace and molding same; and manufacturing a through-type electrode by planarizing the molded glass substrate.

Description

Method for manufacturing a penetrating electrode and device therefor

[0001] The present disclosure relates to a method for manufacturing a through-hole electrode and a device therefor. Specifically, the present disclosure relates to a method for manufacturing a through-hole electrode and a device therefor, which inserts a metal pin into a through-hole of a glass substrate using vibration and then manufactures a through-hole electrode through thermoforming.

[0002] Various electronic devices, such as surface acoustic wave filters, crystal oscillators, and LEDs, feature package substrates with through-holes. Furthermore, the semiconductor TSV process for implementing 3D semiconductors also features microscopic through-holes, and within these through-holes, a metal layer is formed to connect the electrodes formed on the upper and lower portions of the package substrate.

[0003] Forming through-holes is essential for forming the through-electrodes required for packaging circuit boards. Various techniques are used to form through-holes, including punching, conventional wet etching, laser processing, and reactive ion etching. These techniques present various challenges, including technological limitations, processability, and material constraints.

[0004] Furthermore, as holes become increasingly finer, hole processing methods and hole-filling technologies for making them conductive have also changed. For example, the semiconductor TSV process involves forming a semi-through hole in silicon, sputtering to form a metal film inside the hole, and then growing an electroplated film from the bottom of the hole. Typically, the top and bottom surfaces are then polished to create a conductive through-hole electrode.

[0005] However, since silicon is a semiconductor, an insulating film is essential, and a diffusion barrier must also be formed. Furthermore, since the hole-processing method is reactive chemical etching, expensive equipment is required.

[0006] In this respect, circuit boards using glass, an insulator, are becoming widely used.

[0007] The matters described as background technology above are only intended to enhance understanding of the background of the present disclosure, and should not be taken as an acknowledgment that they correspond to prior art already known to those skilled in the art.

[0008] Prior art literature related to the present disclosure includes Korean Patent No. 10-1468680 (November 27, 2014).

[0009] The problem to be solved by the present disclosure is to provide a method for manufacturing a penetrating electrode and a device thereof according to embodiments.

[0010] The problems to be solved by the present disclosure are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0011] A method for manufacturing a through-type electrode according to one embodiment of the present disclosure may include the steps of: preparing a glass substrate having one or more through-holes; inserting a metal pin into the through-hole of the glass substrate using a vibration method; molding the glass substrate with the metal pin inserted into the through-hole into a molding furnace to manufacture a molded article; and flattening the molded glass substrate to manufacture a through-type electrode.

[0012] The step of inserting a metal pin into the above through hole may include the step of: placing the glass substrate having one or more through holes on the upper surface of the plate; the step of arranging the metal pins in a number greater than the number of through holes on the upper surface of the glass substrate; the step of generating a vibration frequency so that a high frequency is transmitted to the glass substrate; and the step of inserting the metal pin into the through hole in the depth direction of the through hole in response to the magnitude of the vibration frequency.

[0013] The step of inserting a metal pin into the above through hole may include a step of controlling a vibration frequency so that the movement of the metal pin in the forward and backward direction on the upper surface of the glass substrate is controlled in accordance with the diameter and depth of the through hole and the diameter and length of the metal pin.

[0014] The step of inserting a metal pin into the through hole may include a step of sucking air toward the lower surface of the glass substrate so that the metal pin is inserted into the through hole from the upper surface of the glass substrate toward the lower surface.

[0015] The step of inserting a metal pin into the through hole may include a step of generating a magnetic field in the direction of the lower surface of the glass substrate so that the metal pin is inserted into the through hole from the upper surface of the glass substrate to the lower surface.

[0016] The step of manufacturing the above-mentioned molded article includes a step of thermoforming the glass substrate at a high temperature so that the inner surface of the through hole and the outer surface of the metal pin are in contact with each other, and the thermoforming step can be performed by maintaining the thermoforming in a molding furnace at 500°C to 700°C for 2 to 5 hours.

[0017] The step of manufacturing the above molded product may further include a step of arranging mold plates formed to surround the entire upper and lower surfaces of the glass substrate so that the metal pin inserted into the through hole does not come off in one direction of the glass substrate.

[0018] The step of preparing the glass substrate may include a step of forming one or more micro-holes in the glass substrate through laser irradiation; and a step of wet-etching the glass substrate in which the micro-holes are formed to form the through-holes penetrating the glass substrate.

[0019] The method may further include a step of arranging a guide portion for guiding the metal pin so that the metal pin does not come off from the upper surface of the glass substrate, such that the guide portion protrudes from the upper surface of the glass substrate in correspondence with the end of the glass substrate.

[0020] A step of removing residual metal pins that are disposed on the lower surface of the glass substrate and are not inserted into the through hole; and a step of collecting the residual metal pins using a net disposed on the lower surface of the glass substrate, wherein the net may be formed of a mesh mesh with a spacing smaller than the size of the metal pins to prevent the residual metal pins from coming off.

[0021] The above metal pin may be made of a metal or alloy containing one or more of tin, lead, silver, copper, gold, zinc, tungsten, nickel, and aluminum.

[0022] According to one embodiment of the present disclosure, a device for manufacturing a through-type electrode comprises a main body having an accommodation space therein and forming a through-type electrode using a vibration method in the accommodation space, wherein the main body comprises: a plate on which a glass substrate having one or more through holes is placed; a high-frequency vibration generating unit disposed at one side of the accommodation space to generate a vibration frequency so that a high frequency is transmitted to the glass substrate; an air suction unit disposed between the glass substrate and the plate to suck air in the direction of a lower surface of the glass substrate so that a metal pin is inserted into the through hole from an upper surface of the glass substrate toward a lower surface; a magnetic body disposed between the glass substrate and the air suction unit to generate a magnetic field in the direction of a lower surface of the glass substrate so that the metal pin is inserted into the through hole from an upper surface of the glass substrate toward a lower surface; a guide unit disposed to protrude from an end of the glass substrate and to guide the metal pin so that it does not come off from the upper surface of the glass substrate; And it may include a net disposed between the glass substrate and the magnetic body to collect residual metal pins that are not inserted into the through hole.

[0023] The technical solutions of the present disclosure are not limited to the technical solutions mentioned above, and other technical solutions not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0024] According to the embodiments, a through-hole electrode can be easily manufactured by inserting a metal pin into a glass substrate with a pre-processed through hole using a vibration method and then thermoforming.

[0025] According to embodiments, by inserting a metal pin into a glass substrate with a pre-processed through hole using a vibration method, defects including voids can be minimized.

[0026] According to an embodiment, a highly conductive through-hole electrode can be manufactured by thermoforming a glass substrate and a metal pin inserted into a through-hole of the glass substrate.

[0027] The effects of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0028] FIG. 1 is a conceptual diagram illustrating a process for manufacturing a through-type electrode according to one embodiment of the present disclosure.

[0029] FIG. 2 is a drawing for explaining a method for manufacturing a through-type electrode according to one embodiment of the present disclosure.

[0030] FIG. 3 is a drawing for explaining a penetrating electrode manufacturing device according to one embodiment of the present disclosure.

[0031] FIG. 4 is a drawing for explaining a device for manufacturing a penetrating electrode having a magnetic body according to another embodiment of the present disclosure.

[0032] FIG. 5 is a drawing for explaining a through-type electrode manufacturing device having a guide portion according to another embodiment of the present disclosure.

[0033] FIG. 6 is a drawing for explaining a through-type electrode manufacturing device having an air intake according to another embodiment of the present disclosure.

[0034] FIG. 7 is a drawing for explaining a method for manufacturing a through-hole electrode according to another embodiment of the present disclosure.

[0035] The present disclosure may be modified in various ways and encompasses numerous embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present disclosure to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present disclosure. Throughout the description of each drawing, similar reference numerals have been used to designate similar components.

[0036] Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. The terms are used solely to distinguish one component from another. For example, without departing from the scope of the present disclosure, a first component could be referred to as a second component, and similarly, a second component could also be referred to as a first component. The term "and / or" includes any combination of multiple related listed items or any one of multiple related listed items.

[0037] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0038] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present disclosure. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0039] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0040] Below, the configuration and operation of a penetrating electrode manufacturing device according to embodiments are specifically described.

[0041] First, the through-type electrode manufactured by the through-type electrode manufacturing method according to the present embodiment can be generally used for wafer-level packaging technology required for high-density, high-reliability packaging in semiconductor processes or electronic component manufacturing processes. For this purpose, the through-type electrode can be composed of a glass substrate having a through-hole and a metal pin inserted into the through-hole.

[0042] Hereinafter, with reference to FIGS. 1 to 3, a process and device for manufacturing a penetrating electrode according to one embodiment of the present disclosure will be described.

[0043] FIG. 1 is a conceptual diagram illustrating a process for manufacturing a through-type electrode according to one embodiment of the present disclosure. FIG. 2 is a diagram illustrating a method for manufacturing a through-type electrode according to one embodiment of the present disclosure. FIG. 3 is a diagram illustrating a device for manufacturing a through-type electrode according to one embodiment of the present disclosure.

[0044] Referring to FIG. 1, a through-type electrode (70) can be manufactured by etching a glass substrate (10) to form a through hole (12), inserting a metal pin (20) into the pre-formed through hole (12) using a vibration method, thermally forming the through hole using a forming mold plate (40) in a forming furnace, cooling the formed product, and then polishing the surface of the formed product to make it flat.

[0045] More specifically, referring to FIG. 2, a glass substrate (10) can be prepared (S10).

[0046] At this time, the glass substrate (10) may be a substrate made of photosensitive glass that is basically transparent in a glassy state, but at least part of which crystallizes and becomes opaque depending on the exposure and heat treatment processes. That is, the glass substrate (10) may include photosensitive glass in a glassy state or a crystallized state. According to an embodiment, the glass substrate (10) may have one or more through holes (12).

[0047] Next, a laser can be irradiated onto the glass substrate (10) to form microholes (S20).

[0048] Specifically, after placing a photomask on a glass substrate (10), ultraviolet rays can be irradiated to form microholes. For example, the glass substrate (10) can be exposed to ultraviolet rays for 5 minutes (10 mW × 300 seconds) using a photomask in which an area corresponding to an area where a through hole (12) is to be formed in the glass substrate (10) is opened. In an embodiment, when exposing the glass substrate (10) using an ultraviolet laser, a separate photomask may not be used.

[0049] Next, the glass substrate (10) that has been exposed to light and has formed micro-holes can be heat-treated. The heat treatment varies depending on the glass, but is typically performed at a temperature of 500°C to 600°C for 1.5 hours. Heat treatment can cause crystals to grow in the exposed glass area, i.e., in the micro-holes, thereby forming a crystallized layer.

[0050] Next, a heat-treated glass substrate (10) can be wet-etched to form a through hole (12) (S30).

[0051] In this embodiment, the diameter of the through hole (12) may be 1 mm to 1 μm, but is not limited thereto. In addition, the depth of the through hole (12) may correspond to the thickness of the glass substrate (10).

[0052] Specifically, by etching at least one of one side and the other side of the glass substrate (10) using a hydrofluoric acid (HF) solution having a high etching selectivity for the crystallized portion (i.e., the crystallized layer) and the non-crystallized portion of the glass substrate (10), a through hole (12) can be formed in the glass substrate (100). For example, since the crystallized region has a much faster etching speed than the non-crystallized region, when the glass substrate (10) is wet-etched in the hydrofluoric acid solution, the crystallized region can be quickly removed to form the through hole (12). In addition, since the through hole (12) can be formed at once and no separate insulation treatment is required, the time and cost required for packaging can be reduced.

[0053] In this embodiment, a case in which a through hole (12) penetrating the entire surface of a glass substrate (10) is formed by a hydrofluoric acid solution is described as an example, but this is only an example. Depending on the embodiment, the through hole (12) may have a shape of a groove formed inwardly on at least one of the surfaces of one side and the other side of the glass substrate (10). For example, the through hole (12) may be etched inwardly from 1 μm to 5 μm from at least one of the surfaces of the one side and the other side of the glass substrate (10).

[0054] Next, a metal pin (20) can be inserted into a through hole (12) of a glass substrate (10) using a vibration method (S40).

[0055] In this embodiment, the metal pin (20) may be made of a metal or alloy containing one or more of tin, lead, silver, copper, gold, zinc, tungsten, nickel, and aluminum, which have high electrical conductivity.

[0056] Specifically, a metal pin (20) corresponding to the shape of the through hole (12) can be inserted into the through hole (12) by vibration. For example, as illustrated in FIG. 3, the through-type electrode manufacturing device (1) can place a glass substrate (10) having a through hole (12) on a plate (100) through a separate transfer unit (not shown), then place the metal pin (20) on the upper surface of the glass substrate (10), and then insert the metal pin (20) into the through hole (12) using the vibration frequency generated from the high-frequency vibration generating unit (30). At this time, the through-type electrode manufacturing device (1) can be placed in a separate space that is not affected by external environmental conditions, for example, a chamber equipped with equipment capable of controlling manufacturing conditions such as temperature, humidity, and pressure, but is not limited thereto.

[0057] More specifically, the penetrating electrode manufacturing device (1) may include a main body. The main body has an internal receiving space. In the receiving space, a penetrating electrode (70) may be formed using a vibration method.

[0058] The main body may include a plate (100), a net (110), and a high-frequency vibration generating unit (30).

[0059] In this embodiment, the net (110) and the high-frequency vibration generating unit (30) are shown as being spaced apart at a predetermined interval around the plate (100), but this is not limited thereto.

[0060] The plate (100) is a flat surface, and a glass substrate (10) having a through hole (12) provided on the upper surface can be placed by a transfer unit.

[0061] The net (110) can be arranged between the glass substrate (10) and the plate (100) to collect the remaining metal pins (20) that were not inserted into the through hole (12). That is, the lower surface of the net (110) can be arranged to be aligned with the plate (100), and the upper surface of the net (110) can be arranged to be aligned with the glass substrate (10). The net (110) can be formed to be equal to or larger than the width of the glass substrate (10), or equal to or smaller than the width of the plate (100). In other words, the net (110) can prevent the remaining metal pins (20) from coming off.

[0062] A high-frequency vibration generating unit (30) is placed on one side of the receiving space and can generate a vibration frequency so that high-frequency is transmitted to the glass substrate (10).

[0063] Specifically, the high-frequency vibration generating unit (30) generates a vibration frequency corresponding to the diameter and depth of the through-hole (12), the diameter and length of the metal pin (20), the number of through-holes (12), and the number (weight) of the metal pins (20), thereby controlling the insertion direction and insertion speed of the metal pin (20) inserted from the upper surface of the glass substrate (10) into the inner surface of the through-hole (12). For example, the high-frequency vibration generating unit (30) can control the vibration frequency so that the metal pin (20) moves in the front-back direction so that the metal pin (20) is uniformly arranged on the upper surface of the glass substrate (10).

[0064] In a device (1) for manufacturing a penetrating electrode having a structure like this, when a glass substrate (10) having a penetrating hole (12) provided on the upper surface of the net (110) is transported while the plate (100) and the net (110) are sequentially arranged, a metal pin (20) is arranged on the upper surface of the glass substrate (10), and then vibration is generated using a high-frequency vibration generating unit (30) so that the metal pin (20) can be inserted into the penetrating hole (12). That is, the through-hole electrode manufacturing device (1) can adjust the vibration frequency in response to the diameter and depth of the through-hole (12), the diameter and length of the metal pin (20), the number of through-holes (12), and the number (weight) of the metal pins (20) so that the metal pins (20) are evenly distributed on the upper surface of the glass substrate (10), thereby enabling the metal pins (20) to be inserted into all the through-holes (12) of the glass substrate (10).

[0065] In other words, by inserting a metal pin (20) into a through hole (12) in the longitudinal direction using a vibration method in a glass substrate (10) in which a through hole (12) has been processed in advance, the pretreatment and plating processes are omitted, simplifying the process and minimizing defects including voids.

[0066] In some embodiments, the presence or absence of a metal pin (20) inserted into a through hole (12) can be determined using a photographing device separately provided inside or outside the chamber, and then the vibration frequency can be generated to control the vibration speed and vibration time. For example, the presence or absence of a void can be determined using a vision camera provided inside or outside the chamber, and the vibration speed and vibration time can be controlled. At this time, it is preferable that the number of metal pins (20) arranged on the upper surface of the glass substrate (10) is greater than the number of through holes (12).

[0067] FIG. 4 is a drawing for explaining a device for manufacturing a penetrating electrode having a magnetic body according to another embodiment of the present disclosure.

[0068] Referring to FIG. 4, the through-type electrode manufacturing device (2) may further include a magnetic body (120) disposed between the plate (100) and the net (110) compared to the through-type electrode manufacturing device (1) illustrated in FIG. 3. Except for the magnetic body (120) illustrated in FIG. 4, the through-type electrode manufacturing device (2) illustrated in FIG. 4 may have the same characteristics as the through-type electrode manufacturing device (1) illustrated in FIG. 3.

[0069] In the following FIG. 4, detailed descriptions of the overlapping contents described in FIG. 3 are omitted, and differences are mainly described. Accordingly, among the components of the through-type electrode manufacturing device (2) illustrated in FIG. 4, components that perform the same functions as the components of the through-type electrode manufacturing device (1) illustrated in FIG. 3 are given the same reference numerals as in FIG. 3, and detailed descriptions thereof are omitted.

[0070] The magnetic body (120) may be placed between the upper surface of the plate (100) and the lower surface of the net (110). At this time, although the magnetic body (120) is disclosed as being placed at a predetermined interval between the upper surface of the plate (100) and the lower surface of the net (110), it is not limited thereto.

[0071] Specifically, the magnetic body (120) generates a magnetic field corresponding to the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), the number of through holes (12), and the number (weight) of the metal pins (20) so that the metal pins (20) arranged on the upper surface of the glass substrate (10) can be easily inserted into the through hole (12), thereby controlling the insertion direction and insertion speed of the metal pins (20) from the upper surface of the glass substrate (10) to the through hole (12). For example, the magnetic body (120) can control the magnetic field in the direction of the lower surface of the glass substrate (10) so that the metal pins (20) move from the upper surface of the glass substrate (10) toward the lower surface and are inserted into the through hole (12).

[0072] In this embodiment, the magnetic body (120) has a shape corresponding to the circular shape of the glass substrate (10) and is a single number, but this is not limited thereto. According to another embodiment, a plurality of magnetic bodies (120) having various shapes may be arranged corresponding to the shape of the glass substrate (10).

[0073] According to an embodiment, the magnetic body (120) may be arranged to be rotatable in one direction. The magnetic body (120) may be formed of a permanent magnet or a neodymium magnet, but is not limited thereto.

[0074] According to an embodiment, the magnetic body (120) can generate a magnetic field corresponding to the vibration frequency generated from the high-frequency vibration generating unit (30) to control the insertion direction and insertion speed of the metal pin (20) in the upper surface of the glass substrate (10). According to an embodiment, the magnetic body (120) can generate a magnetic field corresponding to the vibration frequency generated from the high-frequency vibration generating unit (30), the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), the number of through holes (12), and the number (weight) of the metal pins (20), to control the insertion direction and insertion speed of the metal pin (20) inserted into the inner surface of the through hole (12) in the upper surface of the glass substrate (10).

[0075] A device (2) for manufacturing a penetrating electrode having a structure like this can be configured such that when a glass substrate (10) having a penetrating hole (12) provided on the upper surface of the net (110) is transported while the plate (100) and the net (110) are sequentially arranged, a metal pin (20) is arranged on the upper surface of the glass substrate (10), and then vibration and a magnetic field are generated using a high-frequency vibration generating unit (30) and a magnetic body (120) so that the metal pin (20) can be inserted into the penetrating hole (12). That is, the through-hole electrode manufacturing device (2) adjusts the size of the magnetic field in response to the diameter and depth of the through-hole (12), the diameter and length of the metal pin (20), the number of through-holes (12), the number (weight) of the metal pins (20), and the vibration frequency, thereby allowing the metal pins (20) to be inserted accurately and quickly from the upper surface to the lower surface of the glass substrate (10), thereby enabling the metal pins (20) to be inserted into all the through-holes (12) of the glass substrate (10).

[0076] In this way, by using vibration and a magnetic field to insert a metal pin (20) into a through hole (12) in the depth direction (length direction) of the through hole (12) in a glass substrate (10) in which a through hole (12) has been processed in advance, the pretreatment and plating processes are omitted, simplifying the process and minimizing defects including voids.

[0077] FIG. 5 is a drawing for explaining a through-type electrode manufacturing device having a guide portion according to another embodiment of the present disclosure.

[0078] Referring to FIG. 5, the through-type electrode manufacturing device (3) may further include a guide portion (130) compared to the through-type electrode manufacturing device (2) illustrated in FIG. 4. Except for the guide portion (130) illustrated in FIG. 5, it may have the same characteristics as the through-type electrode manufacturing device (2) illustrated in FIG. 4.

[0079] In the following FIG. 5, detailed descriptions of the overlapping contents described in FIG. 4 are omitted, and differences are mainly described. Accordingly, among the components of the through-type electrode manufacturing device (3) illustrated in FIG. 5, components that perform the same function as the components of the through-type electrode manufacturing device (2) illustrated in FIG. 4 are given the same reference numerals as in FIG. 4, and detailed descriptions thereof are omitted.

[0080] The guide portion (130) may be positioned to protrude a predetermined length from the upper surface of the glass substrate (10) in correspondence with the end of the glass substrate (10). At this time, the protruding height of the guide portion (130) may vary depending on the process. Specifically, the protruding height of the guide portion (130) may vary depending on the number of metal pins (20) and the number of through holes (12) arranged on the upper surface of the glass substrate (10) in each process.

[0081] This guide part (130) can prevent the metal pin (20) arranged on the upper surface of the glass substrate (10) from being separated to the outside of the glass substrate (10). For example, the guide part (130) can guide the metal pin (20) to move from the upper surface of the glass substrate (10) toward the lower surface and be inserted into the through hole (12) without being separated to the outside of the glass substrate (10) by the vibration of the high-frequency vibration generating part (30) and the magnetic field of the magnetic body (120).

[0082] In this embodiment, the guide portion (130) is formed as a single circular flat line surrounding the outer surface of the glass substrate (10) corresponding to the end of each glass substrate (10), but is not limited thereto. According to another embodiment, the guide part (130) may be formed as a mesh net with a gap smaller than the size of the metal pin (20). In a through-type electrode manufacturing device (3) having such a structure, when a glass substrate (10) having a through hole (12) provided on the upper surface of the net (110) is transported while the plate (100) and the net (110) are sequentially arranged, the metal pin (20) is arranged on the upper surface of the glass substrate (10), and then a high-frequency vibration generating part (30) and a magnetic body (120) are used to generate vibration and a magnetic field to prevent the metal pin (20) from being detached from the glass substrate (10), thereby guiding the movement path of the metal pin (20) so that the metal pin (20) can be inserted into the through hole (12) in the depth direction (length direction) of the through hole (12). That is, the through-hole electrode manufacturing device (3) can prevent the metal pin (20) from coming off and can allow the metal pin (20) to be inserted accurately and quickly from the upper surface to the lower surface of the glass substrate (10), thereby allowing the metal pin (20) to be inserted into all the through-holes (12) of the glass substrate (10). FIG. 6 is a drawing for explaining a through-hole electrode manufacturing device having an air intake unit according to another embodiment of the present disclosure.

[0083] Referring to FIG. 6, the through-type electrode manufacturing device (4) may further include an air suction unit (140) disposed between the plate (100) and the magnetic body (12) compared to the through-type electrode manufacturing device (3) illustrated in FIG. 5. Except for the air suction unit (140) illustrated in FIG. 6, it may have the same characteristics as the through-type electrode manufacturing device (3) illustrated in FIG. 5.

[0084] In the following FIG. 6, detailed descriptions of the overlapping contents described in FIG. 5 are omitted, and differences are mainly described. Accordingly, among the components of the through-type electrode manufacturing device (4) illustrated in FIG. 6, components that perform the same function as the components of the through-type electrode manufacturing device (3) illustrated in FIG. 5 are given the same reference numerals as in FIG. 5, and detailed descriptions thereof are omitted.

[0085] The air intake (140) may be placed between the plate (100) and the magnetic body (120). At this time, although the air intake (140) is disclosed as being placed at a predetermined interval between the upper surface of the plate (100) and the lower surface of the magnetic body (120), it is not limited thereto.

[0086] Specifically, the air suction unit (140) can control the insertion direction and insertion speed of the metal pin (20) on the upper surface of the glass substrate (10) according to the amount of air suction generated in response to the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), the number of through holes (12), and the number (weight) of the metal pins (20) so that the metal pin (20) arranged on the upper surface of the glass substrate (10) can be easily inserted into the through hole (12). For example, the air suction unit (140) can control the amount of air suction in the direction of the lower surface of the glass substrate (10) so that the metal pin (20) is inserted into the through hole (12) from the upper surface of the glass substrate (10) toward the lower surface.

[0087] In this embodiment, the case where the air intake unit (140) is arranged between the upper surface of the plate (100) and the lower surface of the magnetic body (120) is exemplified, but is not limited thereto. According to another embodiment, the air intake unit (140) may be arranged on the upper surface of the glass substrate (10) to discharge air from the upper surface to the lower surface of the glass substrate (10).

[0088] According to an embodiment, the air suction unit (140) can control the insertion direction and insertion speed of the metal pin (20) on the upper surface of the glass substrate (10) according to the amount of air suctioned in response to the vibration frequency generated from the high-frequency vibration generating unit (30).

[0089] According to an embodiment, the air suction unit (140) can control the insertion direction and insertion speed of the metal pin (20) on the upper surface of the glass substrate (10) according to the amount of air suctioned in response to the magnetic field generated from the magnetic body (120).

[0090] According to an embodiment, the air suction unit (140) generates an amount of air suction corresponding to the vibration frequency generated from the high-frequency vibration generating unit (30), the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), the number of through holes (12), the number (weight) of the metal pins (20), and the vibration and magnetic field, thereby controlling the insertion direction and insertion speed of the metal pin (20) on the upper surface of the glass substrate (10).

[0091] A device (4) for manufacturing a penetrating electrode having a structure like this can be configured such that when a glass substrate (10) having a penetrating hole (12) provided on the upper surface of the net (110) is transported while the plate (100) and the net (110) are sequentially arranged, a metal pin (20) is arranged on the upper surface of the glass substrate (10), and then vibration, a magnetic field, and air suction are generated using a high-frequency vibration generating unit (30) and a magnetic body (120) so that the metal pin (20) can be inserted into the penetrating hole (12). That is, the through-hole electrode manufacturing device (4) controls the air intake amount in response to the diameter and depth of the through-hole (12), the diameter and length of the metal pin (20), the number of through-holes (12), the number (weight) of the metal pins (20), the vibration frequency, and the magnetic field, thereby allowing the metal pin (20) to be inserted accurately and quickly from the upper surface to the lower surface of the glass substrate (10), thereby allowing the metal pin (20) to be inserted into all the through-holes (12) of the glass substrate (10).

[0092] In this way, by inserting a metal pin (20) into a through hole (12) in the longitudinal direction using a vibration method, a magnetic field, and air suction force in a glass substrate (10) in which a through hole (12) has been processed in advance, the pretreatment and plating processes are omitted, simplifying the process and minimizing defects including voids.

[0093] Referring again to FIG. 2, a glass substrate (10) with a metal pin (20) inserted into a through hole (12) is placed into a molding furnace, and a molded product can be manufactured by thermoforming in the molding furnace (S50).

[0094] Specifically, a mold plate (see FIG. 1, 40) formed to surround the entire upper and lower surfaces of the glass substrate (10) so that the metal pin (20) does not come off in one direction of the glass substrate (10) is placed on the upper and lower surfaces of the glass substrate (10), respectively, and then a molding process is performed in a molding furnace to manufacture a molded product. At this time, the shape of the mold plate (40) may be formed to have a predetermined thickness in a circular shape corresponding to the shape of the glass substrate (10), but is not limited thereto. The shape of the mold plate (40) may be formed in various shapes that can surround the entire upper and lower surfaces of the glass substrate (10).

[0095] In other words, at step S50, the glass substrate (10) can be thermoformed at a high temperature so that the inner surface of the through hole (12) and the outer surface of the metal pin (20) are in contact with each other. That is, the metal pin (20) can be fixed to the through hole (12) so that it does not come off due to the expansion of the glass substrate (10).

[0096] For example, the molding process may be performed by raising the temperature of a glass substrate (10) having a metal pin (20) inserted into a through hole (12) to 500°C to 700°C depending on the metal component of the metal pin (20) in a vacuum, hydrogen, or inert gas atmosphere (Ar, N2) in a molding furnace capable of controlling the temperature increase rate, maintaining the temperature at the highest temperature for 2 to 5 hours, and then going through a cooling process to form the glass substrate (10). At this time, the temperature may be maintained at 500°C for 1 hour, and then increased by 5°C per minute to be maintained at 700°C for 3 hours, but is not limited thereto.

[0097] In this way, by keeping the heating temperature of a molded product composed solely of metal components and glass components low and setting the temperature holding time long in a vacuum, hydrogen, or inert gas atmosphere (Ar, N2), collapse or warping of the product due to temperature deviation can be prevented. Accordingly, by preventing deformation occurring during thermoforming, quality can be further improved, enabling the manufacture of a through-type electrode (70) that is competitive in packaging various electronic devices.

[0098] Finally, the molded glass substrate (10) can be polished to produce a flattened through-hole electrode (70) (S60).

[0099] Specifically, a polishing process can be performed so that both sides of the glass substrate (10) are flat. For example, both sides of the glass substrate (10) can be removed by polishing, for example, a chemical mechanical polishing (CMP) process.

[0100] FIG. 7 is a drawing for explaining a method for manufacturing a through-hole electrode according to another embodiment of the present disclosure.

[0101] First, a glass substrate (10) having a through hole (12) formed on the upper surface of a plate (100) is mounted (S100), and then a metal pin (20) can be placed on the upper surface of the glass substrate (10) (S110). Specifically, a plurality of metal pins (20) can be placed in proportion to the number of through holes (12).

[0102] Next, a metal pin (20) can be inserted into the through hole (12) using the vibration frequency, magnetic field, and air suction force.

[0103] Specifically, the vibration frequency is generated in response to the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), or the number of through holes (12), and the number (weight) of the metal pins (20), so that the movement of the metal pins on the upper surface of the glass substrate (10) is controlled in the forward and backward direction, thereby controlling the vibration speed and vibration time (S120).

[0104] Next, a magnetic field is generated in response to the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), or the number of through holes (12), and the number (weight) of the metal pins (20), thereby controlling the insertion direction and insertion speed of the metal pin (20) on the upper surface of the glass substrate (10) (S130).

[0105] Next, the insertion direction and insertion speed of the metal pin (20) on the upper surface of the glass substrate (10) can be controlled by generating an air suction force corresponding to the diameter and depth of the through hole (12), the diameter and length of the metal pin (20), the number of through holes (12), and the number (weight) of the metal pin (20) (S140).

[0106] Finally, when all the metal pins (20) are inserted into the through holes (12) of the glass substrate (10), the remaining metal pins (20) can be removed using a device that does not damage the glass substrate (10) (S150).

[0107] The embodiments of the present disclosure disclosed in this specification and drawings are intended only to provide specific examples to facilitate easy explanation of the technical content of the present disclosure and to aid understanding of the present disclosure, and are not intended to limit the scope of the present disclosure. It will be apparent to those skilled in the art to which the present disclosure pertains that other modifications based on the technical concepts of the present disclosure are possible in addition to the embodiments disclosed herein.

[0108] Although the above has been described with reference to preferred embodiments of the present disclosure, it will be understood by those skilled in the art that various modifications and changes can be made to the present disclosure without departing from the spirit and scope of the present disclosure as set forth in the claims below.

[0109] The method for manufacturing a penetrating electrode using the metal nanowires described above and the device thereof can be applied to the field of electrode manufacturing.

Claims

1. A method for manufacturing a penetrating electrode, A step of preparing a glass substrate having one or more through holes; A step of inserting a metal pin into the through hole of the glass substrate using a vibration method; A step of forming a molded product by inserting the glass substrate with the metal pin inserted into the through hole into a molding furnace; and Comprising a step of flattening the molded glass substrate to manufacture a through-hole electrode. A method for manufacturing a penetrating electrode.

2. In paragraph 1, The step of inserting a metal pin into the above through hole is: A step of mounting the glass substrate having one or more through holes on the upper surface of the plate; A step of arranging a number of metal pins greater than the number of through holes on the upper surface of the glass substrate; A step of generating a vibration frequency so that high frequency is transmitted to the glass substrate; and Including a step of inserting the metal pin into the through hole in the depth direction of the through hole corresponding to the magnitude of the vibration frequency. Method for manufacturing a penetrating electrode.

3. In paragraph 2, The step of inserting a metal pin into the above through hole is: A step of controlling the vibration frequency so that the movement of the metal pin in the forward and backward direction is controlled on the upper surface of the glass substrate in response to the diameter and depth of the through hole and the diameter and length of the metal pin, Method for manufacturing a penetrating electrode.

4. In paragraph 2, The step of inserting a metal pin into the above through hole is: Including a step of sucking air in the direction of the lower surface of the glass substrate so that the metal pin is inserted in the direction from the upper surface of the glass substrate to the lower surface of the glass substrate through the through hole. Method for manufacturing a penetrating electrode.

5. In paragraph 2, The step of inserting a metal pin into the above through hole is: A step of generating a magnetic field in the direction of the lower surface of the glass substrate so that the metal pin is inserted from the upper surface of the glass substrate toward the lower surface of the glass substrate into the through hole, Method for manufacturing a penetrating electrode.

6. In paragraph 1, The step of manufacturing the above molded product is: It includes a step of thermoforming the glass substrate at a high temperature so that the inner surface of the through hole and the outer surface of the metal pin are in contact with each other, The above thermoforming step is, Thermoforming by maintaining the temperature in a molding furnace at 500℃ to 700℃ for 2 to 5 hours, Method for manufacturing a penetrating electrode.

7. In paragraph 6, The step of manufacturing the above molded product is: Further comprising a step of arranging mold plates formed to surround the entire upper and lower surfaces of the glass substrate so that the metal pin inserted into the through hole does not come off in one direction of the glass substrate. Method for manufacturing a penetrating electrode.

8. In paragraph 1, The steps for preparing the above glass substrate are: A step of forming one or more micro-holes in the glass substrate through laser irradiation; and A step of wet etching the glass substrate on which the micro-hole is formed to form the through hole penetrating the glass substrate, Method for manufacturing a penetrating electrode.

9. In paragraph 1, The method further includes a step of arranging a guide portion for guiding the metal pin so that the metal pin does not come off from the upper surface of the glass substrate, so as to protrude from the upper surface of the glass substrate in correspondence with the end of the glass substrate. Method for manufacturing a penetrating electrode.

10. In paragraph 1, A step of removing the remaining metal pins that are placed on the lower surface of the glass substrate and are not inserted into the through hole; and Further comprising a step of collecting the remaining metal pins using a net arranged on the lower surface of the glass substrate, The above net is made of a mesh net with a spacing smaller than the size of the metal pin to prevent the remaining metal pin from coming off. Method for manufacturing a penetrating electrode.

11. In paragraph 1, The above metal pin is made of a metal or alloy containing one or more of tin, lead, silver, copper, gold, zinc, tungsten, nickel and aluminum. Method for manufacturing a penetrating electrode.

12. In a penetrating electrode manufacturing device, It includes a main body having an internal storage space and forming a penetrating electrode using a vibration method in the storage space, The above main body part, A plate on which a glass substrate having one or more through holes is arranged; A high-frequency vibration generating unit arranged on one side of the above-mentioned receiving space and generating a vibration frequency so that high-frequency waves are transmitted to the glass substrate; An air suction unit disposed between the glass substrate and the plate to suck air in the direction of the lower surface of the glass substrate so that a metal pin is inserted into the through hole from the upper surface of the glass substrate toward the lower surface; A magnetic material disposed between the glass substrate and the air intake portion and generating a magnetic field in the direction of the lower surface of the glass substrate so that the metal pin is inserted into the through hole from the upper surface of the glass substrate to the lower surface; A guide portion positioned to protrude from the upper surface of the glass substrate in correspondence with the end of the glass substrate and to guide the metal pin so that it does not come off from the upper surface of the glass substrate; and A net is disposed between the glass substrate and the magnetic body to collect residual metal pins that are not inserted into the through hole. Penetrating electrode manufacturing device.

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