Method for manufacturing through-type electrode using metal nanowires and apparatus therefor

Abstract

A method for manufacturing a through-type electrode using metal nanowires according to one embodiment comprises the steps of: preparing a glass substrate having one or more through-holes; manufacturing a conductive curing ink capable of printing a pattern capable of conducting electrical signals by mixing nano-sized conductive metal wires with an oxide aqueous solution, a polymer binder, and a reducing agent; filling the through-holes of the glass substrate with the conductive curing ink by using a pressure method; manufacturing a molded product by putting the glass substrate, in which the through-holes are filled with the conductive curing ink, into a curing furnace and sintering same; and manufacturing a through-type electrode in which metal nanowires are filled in the through-holes by polishing and planarizing the molded glass substrate.

Description

Method for manufacturing a penetrating electrode using metal nanowires and device therefor

[0001] The present disclosure relates to a method for manufacturing a through-hole electrode using metal nanowires and a device therefor. Specifically, the present disclosure relates to a method for manufacturing a through-hole electrode using metal nanowires and a device therefor, which can minimize voids by cushioning the metal nanowires in through-holes of a glass substrate using pressure.

[0002] As electronic products become increasingly miniaturized and multifunctional, semiconductor devices are also becoming more highly integrated and multifunctional. This demand has led to the emergence of multi-chip packages (MCPs), which package multiple chips into a single semiconductor device.

[0003] Multi-chip package semiconductors can be divided into single-layer multi-chip package semiconductors and multi-layer multi-chip package semiconductors.

[0004] Single-layer multi-chip package semiconductors are packaged by arranging multiple chips side by side. Multi-layer multi-chip package semiconductors, also known as stacked semiconductor devices, are packaged by stacking multiple chips.

[0005] Stacked semiconductor devices have a three-dimensional structure because they are composed of multiple stacked chips. Conventional stacked semiconductor devices are manufactured to input and output various signals by wire bonding the input / output terminals on multiple stacked chips, or by wire bonding the input / output terminals of each chip and the external connection terminals of the stacked semiconductor device.

[0006] However, the use of wire bonding has raised concerns about performance degradation and increased component size due to increased inductance. In particular, increased noise degrades frequency characteristics and slows data transmission speeds.

[0007] To address these shortcomings, WSP (Wafer-level processed Stack Package) technology was developed. WSP utilizes a laser at the wafer level to form via holes that vertically penetrate each of the stacked chips, and fills the via holes with through-silicon vias (TSVs), thereby directly connecting the circuits of each of the stacked chips.

[0008] Therefore, stacked semiconductors utilizing WSP technology directly connect each stacked chip, eliminating the need for wires and enhancing semiconductor performance. Furthermore, the gap between chips can be reduced, dramatically reducing the thickness of stacked semiconductor devices. Furthermore, the device's mounting area can be reduced.

[0009] The matters described as background technology above are only intended to enhance understanding of the background of the present disclosure, and should not be taken as an acknowledgment that they correspond to prior art already known to those skilled in the art.

[0010] Prior art literature related to the present disclosure includes Korean Patent No. 10-1468680 (November 27, 2014).

[0011] The problem to be solved by the present disclosure is to provide a method for manufacturing a penetrating electrode using metal nanowires according to embodiments and a device therefor.

[0012] The problems to be solved by the present disclosure are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0013] A method for manufacturing a through-hole electrode using metal nanowires according to one embodiment of the present disclosure may include the steps of: preparing a glass substrate having one or more through-holes; preparing a conductive curable ink capable of printing a pattern capable of conducting an electrical signal by mixing nano-sized conductive metal wires with an oxide aqueous solution, a polymer binder, and a reducing agent; filling the through-holes of the glass substrate with the conductive curable ink using a pressure method; inserting the glass substrate, which is inserted into the through-holes filled with the conductive curable ink, into a curing furnace and sintering it to manufacture a molded article; and polishing and flattening the molded glass substrate to manufacture a through-hole electrode in which metal nanowires are filled in the through-holes.

[0014] The step of filling the conductive curing ink may include: a step of immersing the glass substrate in the conductive curing ink using a substrate fixing unit of a receiving space of a chamber; a step of lowering a pressure control unit from the upper part of the chamber to the lower part so as to surround a side surface of the glass substrate; a step of upwardly transporting the conductive curing ink in an upper direction of the glass substrate in a lower pressure suction manner; a step of blocking a path of the conductive curing ink by covering a lower surface of the glass substrate with a mold plate or a film when the conductive curing ink is filled in the through hole; a step of raising the pressure control unit to the upper part of the chamber; and a step of blocking a path of the conductive curing ink by covering an upper surface of the glass substrate, in which the conductive curing ink is filled in the through hole, with the mold plate or the film.

[0015] The step of upwardly transporting the conductive curing ink may include a step of upwardly transporting the conductive curing ink so that the conductive curing ink has an upward height equal to the thickness of the glass substrate on the upper surface of the glass substrate based on the thickness of the glass substrate.

[0016] The step of filling the conductive curing ink may include: a step of arranging the glass substrate using a substrate fixing unit of a receiving space of a chamber; a step of lowering a pressure regulating unit from the upper part of the chamber to the lower part so as to surround a side surface of the glass substrate; a step of downwardly transporting the conductive curing ink injected through an ink injection unit provided on one side of the pressure regulating unit in an upper pressurizing manner toward the lower part of the glass substrate; a step of blocking a path of the conductive curing ink by covering a lower surface of the glass substrate with a mold plate or a film when the conductive curing ink is filled in the through hole; a step of raising the pressure regulating unit to the upper part of the chamber; and a step of blocking a path of the conductive curing ink by covering an upper surface of the glass substrate, where the conductive curing ink is filled in the through hole, with the mold plate or the film.

[0017] The step of downwardly transporting the conductive curing ink may include a step of downwardly transporting the conductive curing ink so that the thickness of the glass substrate is equal to the height of the downward transport on the upper surface of the glass substrate based on the thickness of the glass substrate.

[0018] The step of downwardly transporting the conductive curing ink may include a step of downwardly transporting the conductive curing ink from an upper surface to a lower surface within the pressure control unit.

[0019] The step of filling the conductive curing ink may include: a step of immersing the glass substrate in the conductive curing ink using a substrate fixing unit of a receiving space of a chamber; a step of lowering a pressure regulating unit from the upper part of the chamber to the lower part so as to surround a side surface of the glass substrate; a step of rotating the conductive curing ink in one direction by a magnetic force of a magnet unit arranged in a non-receiving space of the chamber; a step of upwardly transporting the conductive curing ink in an upper direction of the glass substrate in a lower pressure suction manner; a step of blocking a path of the conductive curing ink by covering a lower surface of the glass substrate with a mold plate or a film when the conductive curing ink is filled in the through hole; a step of raising the pressure regulating unit to the upper part of the chamber; and a step of blocking a path of the conductive curing ink by covering an upper surface of the glass substrate, in which the conductive curing ink is filled in the through hole, with the mold plate or the film.

[0020] Before the step of filling the conductive curing ink into the through hole, if there is at least one glass substrate, a step of forming a wax layer having pores through which the conductive curing ink can penetrate between a plurality of glass substrates may be included.

[0021] The step of preparing the glass substrate may include a step of forming at least one microhole in the glass substrate through laser irradiation; and a step of wet etching the glass substrate in which the microhole is formed to form the through hole penetrating the glass substrate.

[0022] The conductive metal wire may be made of one or more of silver (Ag), copper (Cu), tin (Sn), tin-bismuth (Sn-Bi), indium (In), bismuth (Bi), nickel (Ni), and carbon allotropes (C).

[0023] According to one embodiment of the present disclosure, a device for manufacturing a through-type electrode using a metal nanowire comprises a chamber including a main body for forming a through-type electrode using pressure control in a receiving space provided therein, wherein the main body comprises: a substrate fixing unit for fixing a glass substrate having at least one through hole protruding inwardly from an inner surface of the main body so as to be spaced apart from a bottom surface of the main body by a predetermined interval; and a pressure control unit disposed on an upper portion of the main body for vertically raising and lowering in response to the glass substrate to upwardly absorb and downwardly pressurize conductive curing ink filled in the through holes.

[0024] The above main body part may further include a rotating part that is arranged on the bottom surface of the main body part and enables the conductive curing ink to rotate or flow in one direction.

[0025] The chamber may further include a magnet portion located on the bottom surface of a non-receiving space located below the receiving space, and rotating in one direction by a rotation axis and generating a magnetic force in an upward direction.

[0026] The technical solutions of the present disclosure are not limited to the technical solutions mentioned above, and other technical solutions not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0027] According to the embodiments, a through-hole electrode with minimized voids can be easily manufactured by applying pressure to a glass substrate with pre-processed through-holes to buffer metal nanowires.

[0028] According to embodiments, by uniformly filling metal nanowires into through-holes using pressure and magnetic force on a glass substrate having through-holes processed in advance, defects caused by voids inside the through-holes can be minimized, thereby further improving the quality of the through-type electrode.

[0029] According to embodiments, by simultaneously buffering metal nanowires in through-holes of multiple glass substrates to manufacture a through-hole electrode, the process can be simplified and economical effects can be achieved.

[0030] The effects of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0031] FIG. 1 is a conceptual diagram illustrating a process for manufacturing a penetrating electrode using a lower suction method according to one embodiment of the present disclosure.

[0032] FIG. 2 is a drawing for explaining a method for manufacturing a through-type electrode using a lower suction method according to one embodiment of the present disclosure.

[0033] FIG. 3 is a drawing for explaining a penetrating electrode manufacturing device using a lower suction method according to one embodiment of the present disclosure.

[0034] FIG. 4 is a drawing for explaining a method of filling a through hole with conductive curing ink using a lower suction method according to one embodiment of the present disclosure.

[0035] FIG. 5 is a conceptual diagram illustrating a process for manufacturing a through-type electrode using multiple glass substrates according to another embodiment of the present disclosure.

[0036] FIG. 6 is a conceptual diagram illustrating a process for manufacturing a through-type electrode using an upper pressurization method according to another embodiment of the present disclosure.

[0037] FIG. 7 is a drawing for explaining a penetrating electrode manufacturing device using an upper pressurization method according to another embodiment of the present disclosure.

[0038] FIG. 8 is a drawing for explaining a method of filling a conductive curing ink into a through hole using an upper pressurization method according to another embodiment of the present disclosure.

[0039] FIG. 9 is a drawing for explaining a penetrating electrode manufacturing device using magnetic force according to another embodiment of the present disclosure.

[0040] FIG. 10 is a drawing for explaining a method of filling a through hole with a conductive curing ink using magnetic force according to another embodiment of the present disclosure.

[0041] The present disclosure may be modified in various ways and encompasses numerous embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present disclosure to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present disclosure. Throughout the description of each drawing, similar reference numerals have been used to designate similar components.

[0042] Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. The terms are used solely to distinguish one component from another. For example, without departing from the scope of the present disclosure, a first component could be referred to as a second component, and similarly, a second component could also be referred to as a first component. The term "and / or" includes any combination of multiple related listed items or any one of multiple related listed items.

[0043] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0044] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present disclosure. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0045] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0046] Below, the configuration and operation of a penetrating electrode manufacturing device according to embodiments are specifically described.

[0047] First, the through-type electrode manufactured by the method for manufacturing a through-type electrode using metal nanowires according to the present embodiment can be generally used for wafer-level packaging technology required for high-density, high-reliability packaging in semiconductor processes or electronic component manufacturing processes. For this purpose, the through-type electrode can be composed of a glass substrate having a through-hole and metal nanowires inserted into the through-hole.

[0048] Hereinafter, with reference to FIGS. 1 to 4, a method and device for manufacturing a through-type electrode using a bottom adsorption method according to one embodiment of the present disclosure will be described.

[0049] Fig. 1 is a conceptual diagram illustrating a process for manufacturing a through-hole electrode using a bottom suction method. Fig. 2 is a diagram illustrating a method for manufacturing a through-hole electrode using a bottom suction method. Fig. 3 is a diagram illustrating a device for manufacturing a through-hole electrode using a bottom suction method. And Fig. 4 is a diagram illustrating a method for filling a through-hole with a conductive curing ink using a bottom suction method according to an embodiment of the present disclosure.

[0050] Referring to Fig. 1, a through-type electrode can be manufactured by etching a glass substrate (10) to form a through hole (12), filling a conductive curing ink into the pre-formed through hole (12) using a lower suction method, curing using a mold plate for forming in a curing furnace, cooling the molded product, and then polishing and flattening the molded product so that a metal nanowire is filled into the through hole (12).

[0051] At this time, the mold plate for forming placed on the upper and lower parts of the glass substrate (10) to prevent the conductive curing ink from escaping from the inside of the through hole (12) may be formed in a plate shape having a predetermined thickness, but may also be formed of a heat-resistant film material.

[0052] More specifically, referring to FIG. 2, a glass substrate (10) can be prepared (S10).

[0053] At this time, the glass substrate (10) may be a substrate made of photosensitive glass that is basically transparent in a glassy state, but at least part of which crystallizes and becomes opaque depending on the exposure and heat treatment processes. That is, the glass substrate (10) may include photosensitive glass in a glassy state or a crystallized state. According to an embodiment, the glass substrate (10) may have one or more through holes (12).

[0054] Next, a laser can be irradiated onto the glass substrate (10) to form microholes (S20).

[0055] Specifically, after placing a photomask on a glass substrate (10), ultraviolet rays can be irradiated to form microholes. For example, the glass substrate (10) can be exposed to ultraviolet rays for 5 minutes (10 mW × 300 seconds) using a photomask in which an area corresponding to an area where a through hole (12) is to be formed in the glass substrate (10) is opened. In an embodiment, when exposing the glass substrate (10) using an ultraviolet laser, a separate photomask may not be used.

[0056] Next, the glass substrate (10) in which micro-holes are formed by exposure can be heat-treated. At this time, the heat treatment varies depending on the glass, but can typically be heat-treated at a temperature of 500°C to 600°C for 1.5 hours. When heat-treated, crystals grow in the exposed glass area, i.e., in the micro-holes, thereby forming a crystallized layer.

[0057] Next, a heat-treated glass substrate (10) can be wet-etched to form a through hole (12) (S30).

[0058] In this embodiment, the diameter of the through hole (12) may be 1 mm to 1 μm, but is not limited thereto. In addition, the depth of the through hole (12) may correspond to the thickness of the glass substrate (10).

[0059] Specifically, by etching at least one of one side and the other side of the glass substrate (10) using a hydrofluoric acid (HF) solution having a high etching selectivity for the crystallized portion (i.e., the crystallized layer) and the non-crystallized portion of the glass substrate (10), a through hole (12) can be formed in the glass substrate (100). For example, since the crystallized region has a much faster etching speed than the non-crystallized region, when the glass substrate (10) is wet-etched in the hydrofluoric acid solution, the crystallized region can be quickly removed to form the through hole (12). In addition, since the through hole (12) can be formed at once and no separate insulation treatment is required, the time and cost required for packaging can be reduced.

[0060] In this embodiment, a case in which a through hole (12) penetrating the entire surface of a glass substrate (10) is formed by a hydrofluoric acid solution is described as an example, but this is only an example. Depending on the embodiment, the through hole (12) may have a shape of a groove formed inwardly on at least one of the surfaces of one side and the other side of the glass substrate (10). For example, the through hole (12) may be etched inwardly from at least one of the surfaces of the one side and the other side of the glass substrate (10) by 1 μm to 5 μm.

[0061] Next, a conductive curable ink capable of printing a pattern capable of transmitting an electrical signal can be manufactured by mixing nano-sized conductive metal wires with an oxide aqueous solution, a polymer binder, and a reducing agent (S40).

[0062] In this embodiment, the conductive metal wire may include one or more of silver (Ag), copper (Cu), tin (Sn), tin-bismuth (Sn-Bi), indium (In), bismuth (Bi), nickel (Ni), and carbon isotropes (C).

[0063] Specifically, the conductive curing ink can be manufactured by mixing a conductive metal wire, an aqueous oxide solution, a reducing agent, and a polymer binder, centrifuging the resulting mixture to remove a portion of the polymer binder, adding a polymer stabilizing agent to the resulting precipitate, and then adding a solvent.

[0064] Next, the conductive curing ink can be filled into the through hole (12) of the glass substrate (10) using a pressure method (S50).

[0065] Specifically, the conductive curing ink can be filled into the through hole (12) using a lower suction method so that a void is not formed in the through hole (12). For example, as illustrated in FIG. 3, the through-type electrode manufacturing device (1) can immerse a glass substrate (10) provided with a through hole (12) into the conductive curing ink in the receiving space (111) inside the main body (100) of the chamber through a separate transfer unit (not shown), and then fill the conductive curing ink into the through hole (12) using a lower suction method using a pressure control unit (120). At this time, the through-type electrode manufacturing device (1) can be placed in a separate space that is not affected by external environmental conditions, for example, inside a chamber equipped with equipment capable of controlling manufacturing conditions such as temperature, humidity, and pressure, but is not limited thereto.

[0066] More specifically, the penetrating electrode manufacturing device (1) may include a main body (100). The main body (100) has an internal receiving space (111). In the receiving space (111), a penetrating electrode may be formed using a lower suction method.

[0067] The main body (100) may include a substrate fixing part (110) and a pressure control part (120).

[0068] The substrate fixing portion (110) is positioned to protrude inwardly from the main body portion (100) and can fix and support the side end of the glass substrate (10).

[0069] Specifically, the substrate fixing member (110) can fix and support the side end of the glass substrate (10) so that the glass substrate (10) is spaced apart from the bottom surface of the main body (100) at a predetermined interval.

[0070] The pressure control unit (120) is positioned at the upper portion of the main body (100) within the receiving space (111) and can be raised and lowered in the vertical direction relative to the glass substrate (10) to apply downward pressure to the conductive curing ink filled in the through hole (12).

[0071] In this embodiment, the pressure control unit (120) is disclosed as a cylindrical shape that surrounds the upper surface and side surfaces of the glass substrate (10) in accordance with the shape of the glass substrate (10), but is not limited thereto and may be formed in various shapes that surround the upper surface and side surfaces of the glass substrate (10). At this time, the height of the pressure control unit (120) may have a predetermined height at which the conductive curing ink can flow to the upper surface of the glass substrate (10).

[0072] Specifically, when the glass substrate (10) is placed in a state where the receiving space (111) is filled with conductive curing ink, the pressure control unit (120) can be lowered vertically to cover the upper surface and side surfaces of the glass substrate (10), and then, after upwardly transporting the conductive curing ink in the upper direction of the glass substrate (10) in a downward suction manner, be raised vertically when the filling is completed.

[0073] For example, the pressure control unit (120) can control the pressure and / or speed to transport the conductive curing ink upward from the upper surface of the glass substrate (10) to a height (d12) equal to the thickness (d11) of the glass substrate (10) based on the thickness (d11) of the glass substrate (10). At this time, in order to transport the conductive curing ink upward to the height (d12), the conductive curing ink filled in the receiving space (111) can move to the inside of the pressure control unit (120) by the lower suction method and be filled into the through hole (12) more quickly.

[0074] According to an embodiment, the pressure control unit (120) can upwardly transport the conductive curing ink from the upper surface of the glass substrate (10) by a height (d13) from the bottom surface of the receiving space (111) to the lower surface of the glass substrate (10) based on the thickness (d11) of the glass substrate (10).

[0075] A device (1) for manufacturing a penetrating electrode using a metal nanowire of this structure can upwardly transfer the conductive curing ink to the upper surface of a glass substrate (10) in a downward suction manner by controlling the pressure and / or speed so that the conductive curing ink in the receiving space (111) fills the penetrating hole (12) without voids.

[0076] The operation of a penetrating electrode manufacturing device (1) having such a structure is as shown in Fig. 4.

[0077] Referring to FIG. 4, a device (1) for manufacturing a penetrating electrode using a metal nanowire can place a glass substrate (10) in a receiving space (111) of a main body (100) filled with conductive curing ink and immerse it in the conductive curing ink (S100). Specifically, a substrate fixing part (111) can fix and support the side of the glass substrate (10) so that the glass substrate (10) is spaced apart from the bottom of the main body (100) by a predetermined distance. Next, a pressure control part (120) can be placed on the upper part of the glass substrate (100) so as to surround the fixedly supported glass substrate (10) (S110). The pressure control part (120) placed on the upper part of the glass substrate (100) can be vertically lowered. Specifically, the pressure control part (120) can be vertically lowered so that the upper surface and side surfaces of the glass substrate (10) are covered.

[0078] Next, the conductive curing ink can be transferred to the upper part of the glass substrate (10) in a downward suction manner using pressure (S120). Specifically, the pressure control unit (120) can suction the conductive curing ink filled in the receiving space (111) upward from the bottom part of the receiving space (111) so that the conductive curing ink is filled in the through holes (12) of the glass substrate (10). For example, the pressure control unit (120) can suction the conductive curing ink upward from the bottom part of the receiving space (111) by adjusting the pressure and / or speed according to the thickness of the glass substrate (10) and the number of through holes (12). According to an embodiment, the pressure control unit (120) can suction the conductive curing ink upward from the bottom part of the receiving space (111) by adjusting the pressure and / or speed according to the thickness of the glass substrate (10), the number of through holes (12), and the amount of the conductive curing ink filled in the receiving space (111).

[0079] Next, when the conductive curing ink is filled in the through hole (12), the lower surface of the glass substrate (10) can be blocked with a mold plate (S130). Specifically, when the conductive curing ink is filled in the through hole (12) of the glass substrate (10) without a void, the lower surface of the glass substrate (10) can be blocked using the mold plate to prevent the conductive curing ink from escaping to the lower surface. At this time, the shape of the mold plate can be formed into a circle corresponding to the shape of the glass substrate (10), but is not limited thereto, and can be formed into a pair of various shapes that can wrap the entire upper and lower surfaces of the glass substrate (10).

[0080] Next, the pressure control unit (120) surrounding the upper surface and side surfaces of the glass substrate (10) can be vertically raised to expose the upper surface of the glass substrate (10) filled with conductive curing ink (S140). Specifically, when the conductive curing ink filled in the through hole (12) by the mold plate is blocked from leaking out to the lower surface of the glass substrate (10), the pressure control unit (120) can be vertically raised to expose the upper surface of the glass substrate (10) filled with conductive curing ink.

[0081] Next, the upper surface of the glass substrate (10) filled with exposed conductive curing ink can be blocked with a mold plate (S150). Specifically, when the conductive curing ink is filled in the through hole (12) of the glass substrate (10) without voids, the upper surface of the glass substrate (10) can be blocked using the mold plate to prevent the conductive curing ink from escaping to the upper surface.

[0082] Referring back to FIG. 2, a glass substrate (10) filled with conductive curing ink in a through-hole (12) according to an embodiment of the present disclosure can be cured in a furnace to produce a molded article (S60). Specifically, a glass substrate (10) having a mold plate (40) arranged to cover the entire upper and lower surfaces of the glass substrate (10) so that the conductive curing ink does not escape from the through-hole (12) to the upper and lower surfaces of the glass substrate (10) is placed in a curing furnace to perform a curing process and a degreasing process to produce a molded article. In other words, after thermally or photo-curing the glass substrate (10) at a high temperature so that the conductive curing ink can grow in the through-hole (12) and be filled with metal nanowires, a degreasing process can be performed to produce a molded article. That is, by performing a debinding process using a debinding oven after thermal curing or photocuring, only the metal nanowires can be buffered in the through-holes (12) of the glass substrate (10). In some embodiments, the debinding process can be omitted. Accordingly, a through-hole electrode using metal nanowires with improved quality and competitiveness in packaging various electronic devices can be manufactured.

[0083] Finally, the molded glass substrate (10) can be polished to produce a flattened through-hole electrode (S70). Specifically, the polishing process can be performed so that both sides of the glass substrate (10) are flattened. For example, both sides of the glass substrate (10) can be removed by polishing, such as a chemical mechanical polishing (CMP) process.

[0084] FIG. 5 is a conceptual diagram illustrating a process for manufacturing a through-type electrode using multiple glass substrates according to another embodiment of the present disclosure.

[0085] Referring to FIG. 5, when manufacturing a through-hole electrode using metal nanowires using a plurality of glass substrates (10), a wax layer having pores through which conductive curing ink can penetrate can be formed between the plurality of glass substrates (10).

[0086] Specifically, the wax layer may include a plurality of pores to prevent damage between the plurality of glass substrates (10) and to allow conductive curing ink to be filled into the through holes (12) of the plurality of glass substrates (10) through a pressure method.

[0087] At this time, the wax layer may be composed of a hydrocarbon mixture containing an insoluble alcohol fatty acid ester or a solid alkane, and the melting temperature may be 40°C to 80°C.

[0088] In some embodiments, after the curing process is completed, a process of removing the molten wax layer may be performed.

[0089] Next, with reference to FIGS. 6 to 8, a method and device for manufacturing a penetrating electrode using an upper pressurization method according to another embodiment of the present disclosure will be described.

[0090] Figure 6 is a conceptual diagram illustrating a process for manufacturing a through-hole electrode using a top-pressure method. Figure 7 is a diagram illustrating a device for manufacturing a through-hole electrode using a top-pressure method. Figure 8 is a diagram illustrating a method for filling a through-hole with conductive curing ink using a top-pressure method.

[0091] Referring to FIG. 6, a through-type electrode can be manufactured by etching a glass substrate (10) to form a through hole (12), filling a conductive curing ink into the pre-formed through hole (12) using an upper pressurization method, curing using a mold plate for forming in a curing furnace, and then cooling to manufacture a molded article, and then polishing and flattening the molded article so that a metal nanowire is filled into the through hole (12).

[0092] In an embodiment, when a through-type electrode is manufactured by a top-pressure method using a plurality of glass substrates (10), a wax layer having pores through which a conductive curing ink can penetrate can be formed between the plurality of glass substrates (10).

[0093] Specifically, the conductive curing ink can be filled into the through hole (12) using an upper pressure method so that a void is not formed in the through hole (12).

[0094] For example, as illustrated in FIG. 7, the through-type electrode manufacturing device (2) can place a glass substrate (10) equipped with a through hole (12) into a receiving space (111) inside the main body (100) of the chamber through a separate transfer unit (not shown), and then fill the through hole (12) with conductive curing ink that is injected from the top to the bottom through the ink injection unit (130) by using the pressure control unit (120) in an upper pressure manner. At this time, the through-type electrode manufacturing device (2) can be placed inside a chamber equipped with equipment capable of controlling manufacturing conditions such as temperature and humidity, pressure, etc., in a separate space that is not affected by external environmental conditions, but is not limited thereto.

[0095] More specifically, the penetrating electrode manufacturing device (2) may include a main body (100). The main body (100) has an internal receiving space (111). In the receiving space (111), a penetrating electrode may be formed using an upper pressurization method.

[0096] The main body (100) may include a substrate fixing part (110), a pressure control part (120), and an ink injection part (130).

[0097] The substrate fixing portion (110) is positioned to protrude inwardly from the main body portion (100) and can fix and support the side end of the glass substrate (10).

[0098] Specifically, the substrate fixing member (110) can fix and support the side end of the glass substrate (10) so that the glass substrate (10) is spaced apart from the bottom surface of the main body (100) at a predetermined interval.

[0099] The pressure control unit (120) is positioned at the upper portion of the main body (100) within the receiving space (111) and can be raised and lowered in the vertical direction relative to the glass substrate (10) to pressurize the conductive curing ink filled in the through hole (12).

[0100] In this embodiment, the pressure control unit (120) is disclosed as a cylindrical shape that surrounds the upper surface and side surfaces of the glass substrate (10) in accordance with the shape of the glass substrate (10), but is not limited thereto and may be formed in various shapes that surround the upper surface and side surfaces of the glass substrate (10). At this time, the height of the pressure control unit (120) may have a predetermined height at which the conductive curing ink can flow to the upper surface of the glass substrate (10).

[0101] Specifically, when the glass substrate (10) is placed in the receiving space (111), the pressure control unit (120) is lowered vertically to cover the upper surface and side surfaces of the glass substrate (10), and then the conductive curing ink is lowered downward in the downward direction of the glass substrate (10) in an upward pressure manner, and when the filling is completed, the pressure control unit (120) can be raised vertically.

[0102] For example, the pressure control unit (120) can control the pressure and / or speed to transport the conductive curing ink downward from the upper surface of the glass substrate (10) to a lowering height (d22) equal to the thickness (d21) of the glass substrate (10) based on the thickness (d21) of the glass substrate (10). At this time, the conductive curing ink injected from the upper portion of the pressure control unit (120) to transport the conductive curing ink downward to the lowering height (d22) can move from the upper portion of the pressure control unit (120) to the lower portion by the upper pressurization method, so that the through hole (12) can be filled more quickly.

[0103] According to an embodiment, the pressure control unit (120) can downwardly transport the conductive curing ink from the upper surface of the glass substrate (10) by a height (d23) from the bottom surface of the receiving space (111) to the lower surface of the glass substrate (10) based on the thickness (d21) of the glass substrate (10).

[0104] A device (1) for manufacturing a penetrating electrode using a metal nanowire of this structure can control the pressure speed so that the conductive curing ink in the receiving space (111) fills the penetrating hole (12) without voids, thereby upwardly transporting the conductive curing ink to the upper surface of the glass substrate (10) in a downward suction manner.

[0105] The operation of a penetrating electrode manufacturing device (2) according to one embodiment of the present disclosure having such a structure is as shown in FIG. 8.

[0106] Referring to Fig. 8, a device (2) for manufacturing a penetrating electrode using metal nanowires can place a glass substrate (10) in a receiving space (111) of a main body (100) (S200). Specifically, the substrate fixing portion (111) can fix and support the side of the glass substrate (10) so that the glass substrate (10) is spaced apart from the bottom of the main body (100) by a predetermined distance.

[0107] Next, the pressure control unit (120) can be lowered vertically to cover the fixedly supported glass substrate (10) (S210). Specifically, the pressure control unit (120) can be lowered vertically to cover the upper surface and side surfaces of the glass substrate (10).

[0108] Next, conductive curing ink can be injected toward the glass substrate (10) through the ink injection unit (130) (S220). Specifically, the ink injection unit (130) provided on one side of the pressure control unit (120) can inject conductive curing ink into the inside of the pressure control unit (120).

[0109] Next, the conductive curing ink can be transferred to the upper portion of the glass substrate (10) in a downward suction manner using pressure (S230). Specifically, the pressure control unit (120) can pressurize the conductive curing ink injected into the interior of the pressure control unit (120) downward from the upper surface of the pressure control unit (120) so that the conductive curing ink is filled in the through holes (12) of the glass substrate (10). For example, the pressure control unit (120) can adjust the pressure and / or speed in accordance with the thickness of the glass substrate (10) and the number of through holes (12) to suction the conductive curing ink upward to the bottom portion of the receiving space (111). According to an embodiment, the pressure control unit (120) can adjust the pressure and / or speed in accordance with the thickness of the glass substrate (10), the number of through holes (12), and the amount of the conductive curing ink filled in the receiving space (111) to suction the conductive curing ink upward to the bottom portion of the receiving space (111).

[0110] Next, when the conductive curing ink is filled in the through hole (12), the lower surface of the glass substrate (10) can be blocked with a mold plate (S240). Specifically, when the conductive curing ink is filled in the through hole (12) of the glass substrate (10) without a void, the mold plate can be used to block the lower surface of the glass substrate (10) to prevent the conductive curing ink from escaping to the lower surface. At this time, the shape of the mold plate can be formed into a circle corresponding to the shape of the glass substrate (10), but is not limited thereto, and can be formed into a pair of various shapes that can wrap the entire upper and lower surfaces of the glass substrate (10).

[0111] Next, the pressure control unit (120) covering the upper surface and side surfaces of the glass substrate (10) can be vertically raised to expose the upper surface of the glass substrate (10) filled with conductive curing ink (S250). Specifically, when the conductive curing ink filled in the through hole (12) by the mold plate is blocked from leaking out to the lower surface of the glass substrate (10), the pressure control unit (120) can be vertically raised to expose the upper surface of the glass substrate (10) filled with conductive curing ink.

[0112] Next, the upper surface of the glass substrate (10) filled with exposed conductive curing ink can be blocked with a mold plate (S260). Specifically, when the conductive curing ink is filled without voids in the through hole (12) of the glass substrate (10), the upper surface of the glass substrate (10) can be blocked using the mold plate to prevent the conductive curing ink from escaping to the upper surface.

[0113] Next, an electrode manufacturing device using magnetic force according to another embodiment of the present disclosure will be described with reference to FIGS. 9 and 10.

[0114] FIG. 9 is a drawing for explaining a device for manufacturing a penetrating electrode using magnetic force according to another embodiment of the present disclosure. FIG. 10 is a drawing for explaining a method for filling a penetrating hole with a conductive curing ink using magnetic force according to another embodiment of the present disclosure.

[0115] Referring to FIG. 9, a through-type electrode can be manufactured by etching a glass substrate (10) to form a through hole (12), then filling a conductive curing ink into the pre-formed through hole (12) using a lower suction method and magnetic force, curing using a mold plate for forming in a curing furnace, and then cooling to manufacture a molded article, and then polishing and flattening the molded article so that a metal nanowire is filled into the through hole (12).

[0116] Specifically, the conductive curing ink can be filled into the through hole (12) using a lower suction method and magnetic force so that a void is not formed in the through hole (12).

[0117] For example, the through-hole electrode manufacturing device (3) can immerse a glass substrate (10) equipped with a through-hole (12) into conductive curing ink in a receiving space (111) inside the main body (100) of the chamber through a separate transfer unit (not shown), and then, using a pressure control unit (120), more quickly fill the through-hole (12) with conductive curing ink by a vortex of conductive curing ink generated by a lower suction method and a magnetic force generated in the non-receiving space (112). At this time, the through-hole electrode manufacturing device (3) can be placed in a separate space that is not affected by external environmental conditions, for example, a chamber equipped with equipment capable of controlling manufacturing conditions such as temperature, humidity, and pressure, but is not limited thereto.

[0118] More specifically, the penetrating electrode manufacturing device (3) may include a main body (100). The main body (100) has an internal receiving space (111) and a non-receiving space (112) below the receiving space (111). In the receiving space (111), a penetrating electrode may be formed using a lower suction method. The conductive curing ink may flow by a magnetic force generated in the non-receiving space (112).

[0119] The main body (100) may include a receiving space (111) including a substrate fixing portion (110), a pressure control portion (120), and a rotating portion (140), and a non-receiving space (112) including a magnet portion (150).

[0120] The substrate fixing portion (110) is positioned to protrude inwardly from the receiving space (111) of the main body (100) and can fix and support the side end of the glass substrate (10).

[0121] Specifically, the substrate fixing member (110) can fix and support the side end of the glass substrate (10) so that the glass substrate (10) is spaced apart from the bottom surface of the main body (100) at a predetermined interval.

[0122] The pressure control unit (120) is positioned at the upper portion of the main body (100) within the receiving space (111) and can be raised and lowered in the vertical direction relative to the glass substrate (10) to apply downward pressure to the conductive curing ink filled in the through hole (12).

[0123] In this embodiment, the pressure control unit (120) is disclosed as a cylindrical shape that surrounds the upper surface and side surfaces of the glass substrate (10) in accordance with the shape of the glass substrate (10), but is not limited thereto and may be formed in various shapes that surround the upper surface and side surfaces of the glass substrate (10). At this time, the height of the pressure control unit (120) may have a predetermined height at which the conductive curing ink can flow to the upper surface of the glass substrate (10).

[0124] Specifically, when the glass substrate (10) is placed in a state where the receiving space (111) is filled with conductive curing ink, the pressure control unit (120) is lowered vertically to cover the upper surface and side surfaces of the glass substrate (10), and then, considering the flow speed of the conductive curing ink that rotates by the magnetic force generated in the non-receiving space (112), the pressure control unit (120) can be raised vertically in the upper direction of the glass substrate (10) by a lower suction method, and then, when the filling is completed, the pressure control unit (120) can be raised vertically.

[0125] For example, the pressure control unit (120) can control the pressure and / or speed to transport the conductive curing ink upward to the elevation height (d32) by considering the flow speed of the conductive curing ink based on the thickness (d31) of the glass substrate (10). At this time, in order to transport the conductive curing ink upward to the elevation height (d12), the conductive curing ink filled in the receiving space (111) rotates in one direction to generate a vortex, thereby moving into the inside of the pressure control unit (120) by the lower suction method and can be filled into the through hole (12) more quickly.

[0126] The rotating part (140) is arranged on the bottom surface of the receiving space (111) so that the conductive curing ink can be rotated or flowed in one direction.

[0127] In this embodiment, a plurality of rotating parts (140) are disclosed, but this is not limited to this, and the number of rotating parts (140) may be different depending on the number of glass substrates (10), the amount of conductive curing ink, the strength of the magnetic force, or the strength of the pressure.

[0128] The rotating part (140) can rotate or flow the conductive curing ink filled in the receiving space (111) in one direction by the magnetic force generated from the magnet part (150). That is, by rotating or flowing the conductive curing ink, the conductive curing ink filled in the receiving space (111) can move into the inside of the pressure control part (120) by the lower suction method and be filled into the through hole (12) more quickly.

[0129] The magnet part (150) is located on the bottom surface of the non-receiving space (112), and can rotate in one direction by the rotation axis and generate a magnetic force in the upward direction. At this time, the magnet part (150) may be formed of a permanent magnet or a neodymium magnet, but is not limited thereto.

[0130] A device (3) for manufacturing a penetrating electrode using a metal nanowire of this structure can increase the speed of movement of the conductive curing ink filled in the receiving space (111) by controlling the pressure speed and magnetic force so that the conductive curing ink in the receiving space (111) fills the through hole (12) without voids, thereby allowing the conductive curing ink to be upwardly transported to the upper surface of the glass substrate (10) in a downward suction manner.

[0131] The operation of the penetrating electrode manufacturing device (3) having this structure is as shown in Fig. 10.

[0132] Referring to Fig. 10, a device (3) for manufacturing a penetrating electrode using metal nanowires can place a glass substrate (10) in a receiving space (111) of a main body (100) filled with conductive curing ink and immerse it in the conductive curing ink (S300). Specifically, the substrate fixing portion (111) can fix and support the side of the glass substrate (10) so that the glass substrate (10) is spaced apart from the bottom of the main body (100) by a predetermined distance.

[0133] Next, the pressure control unit (120) can be lowered vertically to cover the fixedly supported glass substrate (10) (S310). Specifically, the pressure control unit (120) can be lowered vertically to cover the upper surface and side surfaces of the glass substrate (10).

[0134] Next, the rotating part (140) can rotate in one direction by the magnetic force generated from the magnet part (150) to rotate the conductive curing ink (S320). Specifically, the rotating part (140) generates a vortex in the conductive curing ink filled in the receiving space (111) that includes vibration due to the magnetic force in response to the magnetic force generated from the magnet part (150), thereby allowing the conductive curing ink to rotate or flow in one direction.

[0135] Next, the conductive curing ink can be transferred to the upper portion of the glass substrate (10) by using pressure in a downward suction manner (S330). Specifically, the pressure control unit (120) can suction the conductive curing ink filled in the receiving space (111) upward from the bottom portion of the receiving space (111) so that the conductive curing ink is filled in the through holes (12) of the glass substrate (10). For example, the pressure control unit (120) can suction the conductive curing ink upward from the bottom portion of the receiving space (111) by adjusting the pressure and / or speed in response to the thickness of the glass substrate (10), the number of through holes (12), and the strength of the magnetic force. According to an embodiment, the pressure control unit (120) can control the pressure and / or speed in response to the thickness of the glass substrate (10), the number of through holes (12), and the amount of conductive curing ink filled in the receiving space (111) to suck the conductive curing ink upward to the bottom of the receiving space (111).

[0136] Next, when the conductive curing ink is filled in the through hole (12), the lower surface of the glass substrate (10) can be blocked with a mold plate (S340). Specifically, when the conductive curing ink is filled in the through hole (12) of the glass substrate (10) without a void, the mold plate can be used to block the lower surface of the glass substrate (10) to prevent the conductive curing ink from escaping to the lower surface. At this time, the shape of the mold plate can be formed into a circle corresponding to the shape of the glass substrate (10), but is not limited thereto, and can be formed into a pair of various shapes that can wrap the entire upper and lower surfaces of the glass substrate (10).

[0137] Next, the pressure control unit (120) surrounding the upper surface and side surfaces of the glass substrate (10) can be vertically raised to expose the upper surface of the glass substrate (10) filled with conductive curing ink (S350). Specifically, when the conductive curing ink filled in the through hole (12) by the mold plate is blocked from leaking out to the lower surface of the glass substrate (10), the pressure control unit (120) can be vertically raised to expose the upper surface of the glass substrate (10) filled with conductive curing ink.

[0138] Next, the upper surface of the glass substrate (10) filled with exposed conductive curing ink can be blocked with a mold plate (S360). Specifically, when the conductive curing ink is filled in the through hole (12) of the glass substrate (10) without voids, the upper surface of the glass substrate (10) can be blocked using the mold plate to prevent the conductive curing ink from escaping to the upper surface.

[0139] The embodiments of the present disclosure disclosed in this specification and drawings are intended only to provide specific examples to facilitate easy explanation of the technical content of the present disclosure and to aid understanding of the present disclosure, and are not intended to limit the scope of the present disclosure. It will be apparent to those skilled in the art to which the present disclosure pertains that other modifications based on the technical concepts of the present disclosure are possible in addition to the embodiments disclosed herein.

[0140] Although the above has been described with reference to preferred embodiments of the present disclosure, it will be understood by those skilled in the art that various modifications and changes can be made to the present disclosure without departing from the spirit and scope of the present disclosure as set forth in the claims below.

[0141] The method for manufacturing a penetrating electrode using the metal nanowires described above and the device thereof can be applied to the field of electrode manufacturing.

Claims

1. A method for manufacturing a penetrating electrode using metal nanowires, A step of preparing a glass substrate having one or more through holes; A step of manufacturing a conductive curable ink capable of printing a pattern capable of conducting electrical signals by mixing nano-sized conductive metal wires with an oxide aqueous solution, a polymer binder, and a reducing agent; A step of filling conductive curing ink into the through hole of the glass substrate using a pressure method; A step of manufacturing a molded product by inserting the glass substrate inserted into the through hole filled with the conductive curing ink into a curing furnace and sintering it; and A step of polishing and flattening the molded glass substrate to manufacture a through-hole electrode in which metal nanowires are filled in the through-hole, A method for manufacturing a penetrating electrode using metal nanowires.

2. In paragraph 1, The step of filling the above conductive curing ink is: A step of immersing the glass substrate in the conductive curing ink using a substrate fixing portion of the receiving space of the chamber; A step of lowering the pressure control unit from the top to the bottom of the chamber so as to surround the side of the glass substrate; A step of upwardly transporting the conductive curing ink in the upper direction of the glass substrate by a lower suction method; When the conductive curing ink is filled in the through hole, a step of blocking the path of the conductive curing ink by blocking the lower surface of the glass substrate with a mold plate; a step of raising the pressure control unit to the upper part of the chamber; and A step of blocking the path of the conductive curing ink by covering the upper surface of the glass substrate in which the conductive curing ink is buffered in the through hole with the mold plate, A method for manufacturing a penetrating electrode using metal nanowires.

3. In paragraph 2, The step of upwardly transporting the above conductive curing ink is: A step of upwardly transporting the conductive curing ink so that the conductive curing ink has a height equal to the thickness of the glass substrate on the upper surface of the glass substrate based on the thickness of the glass substrate, A method for manufacturing a penetrating electrode using metal nanowires.

4. In paragraph 1, The step of filling the above conductive curing ink is: A step of placing the glass substrate using a substrate fixing part of the receiving space of the chamber; A step of lowering the pressure control unit from the top to the bottom of the chamber so as to surround the side of the glass substrate; A step of transporting the conductive curing ink introduced through an ink introduction portion provided on one side of the pressure control portion in an upper pressure manner downwardly toward the lower side of the glass substrate; When the conductive curing ink is filled in the through hole, a step of blocking the path of the conductive curing ink by blocking the lower surface of the glass substrate with a mold plate; a step of raising the pressure control unit to the upper part of the chamber; and A step of blocking the path of the conductive curing ink by covering the upper surface of the glass substrate in which the conductive curing ink is buffered in the through hole with the mold plate, A method for manufacturing a penetrating electrode using metal nanowires.

5. In paragraph 4, The step of lowering the conductive curing ink is as follows: A step of downwardly transporting the conductive curing ink so that the thickness of the glass substrate is lowered from the upper surface of the glass substrate by the thickness of the glass substrate, A method for manufacturing a penetrating electrode using metal nanowires.

6. In paragraph 4, The step of lowering the conductive curing ink is as follows: A step of transporting the conductive curing ink downward from the upper surface to the lower surface within the pressure control unit, A method for manufacturing a penetrating electrode using metal nanowires.

7. In paragraph 1, The step of filling the above conductive curing ink is: A step of immersing the glass substrate in the conductive curing ink using the substrate fixing portion of the chamber's receiving space; A step of lowering the pressure control unit from the top to the bottom of the chamber so as to surround the side of the glass substrate; A step in which the conductive curing ink is rotated in one direction by the magnetic force of the magnet part arranged in the non-receiving space of the chamber; A step of upwardly transporting the conductive curing ink in the upper direction of the glass substrate by a lower suction method; When the conductive curing ink is filled in the through hole, a step of blocking the path of the conductive curing ink by blocking the lower surface of the glass substrate with a mold plate; a step of raising the pressure control unit to the upper part of the chamber; and A step of blocking the path of the conductive curing ink by covering the upper surface of the glass substrate in which the conductive curing ink is buffered in the through hole with the mold plate, A method for manufacturing a penetrating electrode using metal nanowires.

8. In paragraph 1, Before the step of filling the conductive curing ink into the above through hole, In the case where there is at least one glass substrate, the step of forming a wax layer having pores through which the conductive curing ink can penetrate between the plurality of glass substrates is further included. Method for manufacturing a penetrating electrode using metal nanowires.

9. In paragraph 1, The steps for preparing the above glass substrate are: A step of forming at least one microhole in the glass substrate through laser irradiation; and A step of wet etching the glass substrate on which the micro-hole is formed to form the through hole penetrating the glass substrate, Method for manufacturing a penetrating electrode using metal nanowires.

10. In paragraph 1, The conductive metal wire is made of one or more of silver (Ag), copper (Cu), tin (Sn), tin-bismuth (Sn-Bi), indium (In), bismuth (Bi), nickel (Ni), and carbon isotropes (C). Method for manufacturing a penetrating electrode using metal nanowires.

11. In a device for manufacturing a penetrating electrode using metal nanowires, A chamber including a main body that forms a penetrating electrode by using pressure control in a gradient receiving space inside, The above main body part, A substrate fixing unit that fixes a glass substrate having at least one through hole and protruding inwardly from the inner surface of the main body portion so as to be spaced apart from the bottom surface of the main body portion at a predetermined interval; A pressure control unit is disposed on the upper part of the main body and is vertically raised and lowered in response to the glass substrate to apply upward and downward pressure to the conductive curing ink filled in the through hole. A device for manufacturing a penetrating electrode using metal nanowires.

12. In paragraph 11, The above main body part, Further comprising a rotating part arranged on the bottom surface of the main body to enable the conductive curing ink to rotate or flow in one direction. A device for manufacturing a penetrating electrode using metal nanowires.

13. In paragraph 12, The above chamber, Further comprising a magnet part located on the bottom surface of the non-receiving space located at the bottom of the receiving space, which rotates in one direction by the rotation axis and generates a magnetic force in the upward direction. A device for manufacturing a penetrating electrode using metal nanowires.

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