Conveying and processing apparatus

Abstract

The present invention relates to a conveying and processing apparatus, comprising a rack, a conveying device, a processing device, and a transporting device, wherein the rack is provided with a lower-layer region and an upper-layer region; the conveying device is arranged in the lower-layer region and used for conveying silicon wafers in a first carrier and a second carrier to each other; the processing device is arranged in the upper-layer region and comprises furnace bodies and a first conveying unit, the furnace bodies are horizontally arranged, and a plurality of furnace bodies are provided; the transporting device is arranged between the lower-layer region and the upper-layer region, is movable between the lower-layer region and the upper-layer region, and is used for transporting, between the conveying device and the first conveying unit, the first carrier loaded with a silicon wafer. The conveying and processing apparatus of the present invention is designed to be of an integrated structure, so as to greatly simplify the path of the first carrier from a loading and unloading station to each furnace body, and the structure of each part. Therefore, the structure is simple, the apparatus is compact, the occupied space is small, the precision of taking and placing the silicon wafers is high, the degree of automation is high, and the stability is high; the manufacturing, installation and maintenance are more convenient; the costs of the whole apparatus are lower.

Description

Conveying and processing apparatus TECHNICAL FIELD

[0001] The present application belongs to the technical field of solar cell processing, and particularly relates to a conveying and processing apparatus. BACKGROUND

[0002] In the process of manufacturing solar cells, various process treatments such as PECVD, LPCVD, etc. are performed on silicon wafers. Before these processes are performed, the silicon wafers from the previous process are first taken out of the first carrier and loaded into the second carrier. After the silicon wafers are loaded, the second carrier is sent into the reaction chamber of the process equipment for reaction. After the process is completed, the second carrier is sent out of the process equipment. After the second carrier cools down, the silicon wafers are taken out of the second carrier and reloaded into the first carrier for the next process. Currently, independent loading and unloading automation equipment + process equipment are usually combined.

[0003] A patent with publication number CN114203611A discloses an automatic loading and unloading system for a vertical furnace and a vertical furnace body. Although the automatic loading and unloading system for silicon wafers has high precision, high automation degree, and high stability, and can realize automatic and stable and reliable entry and exit of the quartz boat into the furnace body, the automatic loading and unloading system and the furnace body are arranged in front of and behind each other, the process route is relatively long, and the structure is still not compact and occupies a large space.

[0004] A patent with publication number CN115425113A discloses a battery preparation integrated system and a battery preparation integrated method. The diffusion and annealing processes are integrated by a conveying device, thereby reducing equipment investment. However, the conveying device and the process equipment are actually arranged in front of and behind each other, and are not integrated with each other. The same problems of non-compact structure and large space occupation exist.

[0005] Therefore, the current loading and unloading automation equipment and process machines are independent of each other, have complex structures, and have large equipment sizes. SUMMARY

[0006] The purpose of the present application is to provide a conveying and processing apparatus for conveying and processing silicon wafers. Of course, the silicon wafers can be replaced by wafers made of other materials, and the structure of the conveying and processing apparatus itself is not affected.

[0007] To achieve the above purpose, a technical solution adopted by the present application is as follows:

[0008] A conveying and processing apparatus comprises:

[0009] A rack is provided with a lower layer area and an upper layer area. One end of the lower layer area forms an inlet and outlet.

[0010] The conveying device is arranged in the lower area, and is used for transferring the silicon wafers in the first carrier and the second carrier.

[0011] The processing device is arranged in the upper area, and comprises a furnace body and a first conveying unit, the furnace body is horizontally arranged and provided with a plurality of furnace bodies, and the first conveying unit is used for conveying the first carrier loaded with the silicon wafers into or out of the furnace body.

[0012] The conveying device is arranged between the lower area and the upper area, and can move between the lower area and the upper area, and is used for conveying the first carrier loaded with the silicon wafers between the conveying device and the first conveying unit.

[0013] Preferably, the conveying device comprises a second conveying unit, a second conveying unit and a loading and unloading unit, the second conveying unit, the second conveying unit and the loading and unloading unit are sequentially arranged from one end to the other end of the lower area, the second conveying unit is used for conveying the second carrier loaded with the silicon wafers between the second conveying unit and the loading and unloading unit, and the loading and unloading unit is used for transferring the silicon wafers in the first carrier and the second carrier.

[0014] Further preferably, the loading and unloading unit comprises a first loading and unloading unit, a second loading and unloading unit and a transfer module, the first loading and unloading unit is used for inserting or ejecting the silicon wafers into the first carrier, the second loading and unloading unit is used for inserting or ejecting the silicon wafers into the second carrier, and the transfer module is used for transferring the silicon wafers between the first loading and unloading unit and the second loading and unloading unit.

[0015] More preferably, the second loading and unloading unit comprises a second conveying module, a second ejector module and a second alignment module, the second conveying module has a first working position and a second working position, the second conveying unit conveys the second carrier loaded with the silicon wafers between the second conveying unit and the first working position of the second conveying module, the second ejector module and the second alignment module are arranged at the second working position of the second conveying module, the second ejector module is used for inserting or ejecting the silicon wafers into the second carrier, and the second alignment module is used for aligning the silicon wafers on the second ejector module.

[0016] Further preferably, the first loading and unloading unit comprises a first conveying module, a first top tooth module and a first aligning module, the first conveying module has a first working position and a second working position, the first top tooth module and the first aligning module are arranged at the end of the first working position of the first conveying module, the first top tooth module is used for inserting or ejecting a silicon wafer into or out of the first carrier, the first aligning module is used for aligning the silicon wafer on the first top tooth module, and the conveying device is used for conveying the first carrier loaded with the silicon wafer between the second working position of the first conveying module and the first conveying unit.

[0017] Further preferably, two first loading and unloading units are arranged, and two second loading and unloading units are arranged, and the two first loading and unloading units are respectively arranged on the two sides of the two second loading and unloading units. Arranging two groups of the first loading and unloading units and the second loading and unloading units can perform the loading and unloading of the silicon wafers requiring process treatment by one group and the loading and unloading of the silicon wafers completing process treatment by the other group, so as to improve the efficiency of loading and unloading.

[0018] Further preferably, the conveying device further comprises a buffer unit, the buffer unit comprises a plurality of buffer modules, and the conveying device is used for conveying the first carrier loaded with the silicon wafer between the loading and unloading unit, the buffer unit and the first conveying unit.

[0019] Preferably, the first conveying unit and the furnace body are sequentially arranged from the other end to the one end of the upper layer area.

[0020] Preferably, the processing device further comprises a gas source and a tail gas treatment unit, the gas source and the tail gas treatment unit are connected with the furnace body, and are used for providing reaction gas and tail gas treatment for the furnace body, and the first conveying unit, the furnace body, the gas source and the tail gas treatment unit are sequentially arranged from the other end to the one end of the upper layer area.

[0021] Preferably, the number of the first conveying units is consistent with the number of the furnace bodies, and each furnace body is correspondingly provided with the first conveying unit, and the first conveying unit corresponds to the furnace body one by one.

[0022] Preferably, the plurality of furnace bodies are arranged in multiple rows in the left-right direction of the upper layer area and are arranged in multiple columns in the up-down direction of the upper layer area.

[0023] Preferably, the furnace bodies are arranged in 2-4 rows; and / or the furnace bodies are arranged in 2-5 columns, for example, the furnace bodies are arranged in 2 rows and 3 columns in each row, and there are 6 furnace bodies in total.

[0024] Preferably, the conveying device comprises a pair of first guide rods, a pair of second guide rod units, a first conveying unit and a driving unit, the pair of first guide rods extend in the vertical direction, one second guide rod unit is connected to each of the first guide rods, the second guide rod units are movable up and down on the pair of first guide rods, the first conveying unit is movably connected between the pair of second guide rod units and is movable horizontally between the pair of second guide rod units, and the driving unit is used to drive the pair of second guide rod units and the first conveying unit to move.

[0025] Further preferably, the second guide rod unit comprises a second fixed guide rod and a second telescopic guide rod, the second fixed guide rod is movably connected to the first guide rod, the second telescopic guide rod is movably connected to the second fixed guide rod, the first conveying unit is movably connected to the pair of second telescopic guide rods, the second telescopic guide rod is movable on the second fixed guide rod, and the first conveying unit is movable on the second telescopic guide rod, so that the movement range of the first conveying unit is larger.

[0026] Further preferably, the second guide rod unit is perpendicular to the first guide rod, that is, the extension direction of the second fixed guide rod and the second telescopic guide rod is perpendicular to the extension direction of the first guide rod.

[0027] Further preferably, the first conveying unit comprises a connecting rod and a hook portion, the connecting rod is movably connected between the pair of second guide rod units, and the hook portion is connected to the connecting rod and used to hook the first carrier, the hook portion is provided in pairs, and a pair of hook portions hook the hanging ears at both ends of the first carrier.

[0028] More preferably, the hook portion is provided in multiple groups, so that multiple groups of first carriers can be conveyed on one connecting rod at the same time.

[0029] To achieve the above-mentioned purposes, another technical solution adopted by the present application is:

[0030] A conveying and processing device, characterized in that it comprises:

[0031] A rack, wherein the rack is provided with a lower area and an upper area, and one end of the lower area forms a feeding and discharging port;

[0032] A conveying device, wherein the conveying device is arranged in the lower area, and the conveying device comprises a second conveying unit, a second conveying unit, a loading and unloading unit and a buffer unit, and the second conveying unit, the second conveying unit, the loading and unloading unit and the buffer unit are arranged in sequence from one end to the other end of the lower area;

[0033] Processing device: the processing device is arranged in the upper layer area, the processing device includes furnace body, first conveying unit, gas source and tail gas treatment unit, the furnace body is arranged horizontally, and is provided with multiple, the first conveying unit, furnace body, gas source and tail gas treatment unit are sequentially distributed from the other end to the end of the upper layer area, multiple furnace bodies are distributed into multiple rows in the left-right direction of the upper layer area, and are distributed into multiple columns in the up-down direction of the upper layer area;

[0034] Conveying device: the conveying device is in the lower layer area, the upper layer area, the conveying device is movable between the lower layer area, the upper layer area, and the conveying device is used for conveying the first carrier loaded with the silicon wafer between the loading and unloading unit, the buffer unit and the first conveying unit.

[0035] The above technical scheme is preferably, the second conveying unit is located below the gas source and the tail gas treatment unit; the second conveying unit is located below the furnace body; the loading and unloading unit is at least partially located below the furnace body; and the buffer unit is located below the first conveying unit.

[0036] Compared with the prior art, the application has the following advantages due to the above technical scheme:

[0037] The conveying and process treatment of the application are designed as an integrated structure, which greatly simplifies the path and each part structure of the first carrier between the wafer loading and unloading station and the furnace body, has a compact structure, occupies a small space, has high precision in taking and placing silicon wafers, high automation degree, high stability, is more convenient to manufacture, install and maintain, and has lower cost of the whole machine. BRIEF DESCRIPTION OF DRAWINGS

[0038] Fig. 1 is a perspective view of the integrated machine of the application;

[0039] Fig. 2 is a front view of the integrated machine of the application;

[0040] Fig. 3 is a top view of the integrated machine of the application;

[0041] Fig. 4 is a side view of the integrated machine of the application;

[0042] Fig. 5 is a perspective view of the loading and unloading unit of the application;

[0043] Fig. 6 is a top view of the loading and unloading unit of the application;

[0044] Fig. 7 is a perspective view of the conveying device of the application;

[0045] Fig. 8 is a front view of the conveying device of the application.

[0046] In the above drawings:

[0047] 1, rack; 10, lower area; 100, inlet and outlet; 11, upper area;

[0048] 20, second conveying unit; 21, second conveying unit; 22, loading and unloading unit; 23, buffer module;

[0049] 2201, second conveying module; 2202, second top tooth module; 2203, second alignment module; 2211, first conveying module; 2212, first top tooth module; 2213, first alignment module; 222, transfer module;

[0050] 30, first conveying unit; 31, furnace body; 32, gas source and tail gas treatment unit;

[0051] 4, conveying device; 40, first guide rod; 41, second guide rod unit; 410, second fixed guide rod; 411, second telescopic guide rod; 42, first conveying unit; 420, connecting rod; 421, hook portion;

[0052] 5, first carrier. DETAILED DESCRIPTION

[0053] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0054] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0055] A conveying and processing device as shown in FIGS. 1-4 is used for conveying and processing silicon wafers. The conveying and processing device includes a rack 1, a conveying device, a processing device, and a conveying device 4. Each device will be described in detail below.

[0056] In this embodiment, the rack 1 is defined as the front end at the left side end of FIG. 2, and the right side end is defined as the rear end; the lower side of FIG. 3 is defined as the left side, and the upper side is defined as the right side.

[0057] The rack 1 is the frame of the whole all-in-one machine, the conveying device, the processing device and the conveying device of the all-in-one machine are arranged in the frame 1, and the reduction of the overall size of the equipment also means the reduction of the size of the rack 1. The rack 1 is provided with a lower area 10 and an upper area 11, one end of the lower area 10 forms a feeding and discharging port 100, that is, the whole rack 1 is divided into upper and lower two layers, and the left side of the lower layer of the rack 1 is the feeding and discharging port 100.

[0058] The conveying device is arranged in the lower area 10, that is, the conveying device is located in the lower layer of the rack 1, and the conveying device is mainly used for transferring the silicon wafers in the first carrier (quartz boat) and the second carrier (flower basket) to each other. Specifically:

[0059] The conveying device includes a second conveying unit 20, a second conveying unit 21 and a loading and unloading unit 22, which are arranged in sequence from one end to the other end of the lower area 10, that is, from the front end to the rear end of the lower layer of the rack 1.

[0060] The second conveying unit 20 is used for conveying the second carrier loaded with silicon wafers between the feeding and discharging port 100 and the second conveying unit 21, and the second conveying unit 20 adopts but is not limited to, such as guide rail conveying. The second carrier loaded with silicon wafers that need to be processed is placed at one end (front end) of the second conveying unit 20 through the feeding and discharging port 100, and the second conveying unit 20 conveys it to the other end (rear end); similarly, the second carrier loaded with silicon wafers that have completed the process is placed at the other end (rear end) of the second conveying unit 20, and the second conveying unit 20 conveys it to the feeding and discharging port 100 at one end (front end).

[0061] The second conveying unit 21 is used for conveying the second carrier loaded with silicon wafers between the second conveying unit 20 and the loading and unloading unit 22, and the second conveying unit 21 adopts but is not limited to, such as conveying robot, such as the first carrier clamping and carrying device with the publication number CN210635369U. The second conveying unit 21 conveys the second carrier loaded with silicon wafers that need to be processed from the other end of the second conveying unit 20 to the loading and unloading unit 22; similarly, the second conveying unit 21 conveys the second carrier loaded with silicon wafers that have completed the process from the loading and unloading unit 22 to the other end of the second conveying unit 20.

[0062] As shown in FIGS. 5 and 6, the loading and unloading unit 22 is used for transferring the silicon wafers in the first carrier and the second carrier to each other. In this embodiment: the loading and unloading unit 22 includes a first loading and unloading unit, a second loading and unloading unit and a transfer module 222. In the order of conveying front and back:

[0063] The second loading and unloading unit is used for inserting or ejecting the silicon wafer into or out of the second carrier. The second loading and unloading unit comprises a second conveying module 2201, a second ejector module 2202, and a second alignment module 2203.

[0064] The second conveying module 2201 can adopt, but is not limited to, a guide rail conveying device, and a second carrier seat can be arranged on the guide rail for placing the second carrier. In the embodiment, the second conveying module 2201 has a first working position 2201a and a second working position 2201b. The second conveying unit 21 conveys the second carrier loaded with the silicon wafer between the second conveying unit 20 and the first working position 2201a of the second conveying module 2201. The second ejector module 2202 and the second alignment module 2203 are arranged at the second working position 2201b of the second conveying module 2201. The second ejector module 2202 is used for inserting or ejecting the silicon wafer into or out of the second carrier. The second ejector module 2202 can adopt, but is not limited to, a silicon wafer ejector device disclosed in CN214848570U. The second alignment module 2203 is used for aligning the silicon wafer on the second ejector module 2202. The second alignment module 2203 can adopt, but is not limited to, an alignment structure in a silicon wafer compatible loading and unloading mechanism disclosed in CN217322400U. Therefore, the second ejector module 2202 is arranged below the second working position 2201b of the second conveying module 2201, and the second alignment module 2203 is arranged above the second working position 2201b of the second conveying module 2201. The second carrier loaded with the silicon wafer requiring process treatment is conveyed from the first working position 2201a of the second conveying module 2201 to the second working position 2201b of the second conveying module 2201. The second ejector module 2202 ejects the silicon wafer in the second carrier first, and then the second alignment module 2203 aligns the silicon wafer on the second ejector module 2202, so as to facilitate the transfer module 222 to transfer the silicon wafer to the first loading and unloading unit. Similarly, the transfer module 222 transfers the silicon wafer after process treatment to the second working position 2201b of the second conveying module 2201 and places it on the second ejector module 2202 ejected from the second carrier. The second alignment module 2203 aligns the silicon wafer on the second ejector module 2202 first, and then the second ejector module 2202 is lowered, and the silicon wafer is reinserted into the second carrier. The second carrier is conveyed to the first working position 2201a of the second conveying module 2201 again and waits for the second conveying unit 21 to convey it.

[0065] The first loading and unloading unit is used for inserting or ejecting the silicon wafer into or out of the first carrier. The first loading and unloading unit comprises a first conveying module 2211, a first ejector module 2212, and a first alignment module 2213.

[0066] The first conveying module 2211 adopts, but is not limited to, a guide rail conveying, and a first carrier seat can be arranged on the guide rail for placing the first carrier. In the embodiment, the first conveying module 2211 has a first working position 2211a and a second working position 2211b, the transfer module 222 transfers the silicon wafer between the second working position 2201b of the second conveying module 2201 and the first working position 2211a of the first conveying module 2211; the first ejector pin module 2212 and the first alignment module 2213 are arranged at the end of the first working position 2211a (in front of the first end of the second working position 2211b) of the first conveying module 2211, the first ejector pin module 2212 is used for inserting or ejecting the silicon wafer into or out of the first carrier, and the first ejector pin module 2212 can adopt, but is not limited to, the ejector pin assembly in the universal quartz boat jig with the publication number CN214848524U; the first alignment module 2213 is used for aligning the silicon wafer on the first ejector pin module 2212, and the first alignment module 2213 can adopt, but is not limited to, the alignment structure in the silicon wafer compatible loading and unloading mechanism with the publication number CN217322400U. Assuming that the first ejector pin module 2212 cannot insert or eject all the silicon wafers in the second carrier into or out of the first carrier at one time, the first ejector pin module 2212 can first load and unload the first carrier at the end of the first working position 2211a of the first conveying module 2211, and gradually load and unload the first carrier being conveyed as the second carrier is conveyed from the first working position 2211a of the first conveying module 2211 to the second working position 2211b of the first conveying module 2211. The silicon wafer to be processed is transferred from the second ejector pin module 2202 to the first working position 2211a of the first conveying module 2211 and placed on the first ejector pin module 2212 ejected from the first carrier, the first alignment module 2213 first aligns the silicon wafer on the first ejector pin module 2212, the first ejector pin module 2212 is lowered, the silicon wafer is inserted into the first carrier, and the first carrier is conveyed to the second working position 2211b of the first conveying module 2211 and waits for the conveying device 4 to convey; similarly, the conveying device 4 conveys the first carrier loaded with the silicon wafer after the process is completed to the second working position 2211b of the first conveying module 2211 and to the first working position 2211a of the first conveying module 2211, the first ejector pin module 2212 first ejects the silicon wafer in the first carrier, and the first alignment module 2213 aligns the silicon wafer on the first ejector pin module 2212, so as to facilitate the transfer module 222 to transfer the silicon wafer to the second loading and unloading unit.

[0067] The transfer module 222 is used for transferring the silicon wafer between the first loading and unloading unit and the second loading and unloading unit, specifically, transferring the silicon wafer between the second top tooth module 2202 and the first top tooth module 2212, and the transfer module 222 adopts a rotating mechanism for changing the attitude of the silicon wafer and a carrying system as disclosed in CN220474598U, but is not limited to the same.

[0068] In one preferred embodiment of the present embodiment, two first loading and unloading units are provided, two second loading and unloading units are also provided, and the two first loading and unloading units are respectively located on the two sides of the two second loading and unloading units. One group can be used for loading and unloading the silicon wafer requiring process treatment, and the other group can be used for loading and unloading the silicon wafer completing process treatment; the transfer module 222 is provided with only one group and is located between the first loading and unloading unit and the second loading and unloading unit.

[0069] In one preferred embodiment of the present embodiment, the conveying device further comprises a buffer unit, which is used for storing the first carrier requiring process treatment and loaded with the silicon wafer, or the first carrier completing process treatment and loaded with the silicon wafer. The buffer unit comprises a plurality of buffer modules 23, and in the illustration, the buffer module 23 is provided with 6, and the 6 buffer modules 23 are distributed in 2 rows and 3 columns in each row, and the second working position 2211b of the first conveying module 2211 extends between the two rows of buffer modules 23.

[0070] The processing device is arranged in the upper layer area 11, that is, the processing device is located on the upper layer of the rack 1, and the processing device is mainly used for process treatment of the silicon wafer, such as PECVD, LPCVD, etc. Specifically:

[0071] The processing device comprises a first conveying unit 30, a furnace body 31, and a gas source and tail gas treatment unit 32, and the first conveying unit 30, the furnace body 31, and the gas source and tail gas treatment unit 32 are sequentially distributed from the other end to the end of the upper layer area 11, that is, from the rear end to the front end of the upper layer of the rack 1.

[0072] The first conveying unit 30 is used for sending or removing the first carrier loaded with the silicon wafer into or out of the furnace body 31; the furnace body 31 is used for process treatment of the silicon wafer, and the first conveying unit 30 adopts a corresponding structure of a boat pushing device as disclosed in CN219319006U, but is not limited to the same; wherein the furnace body 31 is horizontally arranged, or said transversely arranged, and is provided with a plurality of. The number of the first conveying unit 30 is consistent with the number of the furnace body 31, and each furnace body 31 is correspondingly provided with the first conveying unit 30, such as a plurality of furnace bodies 31 distributed in multiple rows in the left-right direction of the upper layer area 11 and in multiple columns in the up-down direction of the upper layer area 11. The furnace body 31 can be generally distributed in 2-4 rows and 2-5 columns, and in the illustration, the furnace body 31 is provided with 6, and the 6 furnace bodies 31 are distributed in 2 rows and 3 columns in each row.

[0073] The gas source and tail gas treatment unit 32 is connected with the furnace body 31, and is used for providing reaction gas for the furnace body 31 and treating tail gas, and each furnace body 31 is correspondingly provided with the gas source and tail gas treatment unit 32.

[0074] The conveying device 4 is movably arranged between the lower layer area 10 and the upper layer area 11, and is used for conveying the first carrier loaded with the silicon wafer between the conveying device and the first conveying unit, and further used for conveying the first carrier loaded with the silicon wafer between the loading and unloading unit, the buffer unit and the first conveying unit 30.

[0075] As shown in FIG. 7 and FIG. 8, the conveying device 4 comprises a pair of first guide rods 40, a pair of second guide rod units 41, a first conveying unit 42 and a driving unit (not shown in the figure). Specifically:

[0076] The pair of first guide rods 40 are arranged on the rack 1 and extend in the vertical direction, and are distributed in front of and behind each other. The pair of second guide rod units 41 are respectively connected to the pair of first guide rods 40, that is, one second guide rod unit 41 is connected to one first guide rod 40, and the second guide rod unit 41 is perpendicular to the first guide rod 40, that is, the second guide rod unit 41 extends in the left-right direction, and the second guide rod unit 41 is movable on the pair of first guide rods 40. The first conveying unit 42 is connected between and movable between the pair of second guide rod units 41. The driving unit is used to drive the pair of second guide rod units 41 and the first conveying unit 42 to move. In this way, the second guide rod unit 41 moves up and down on the first guide rod 40, driving the first conveying unit 42 to move up and down, and at the same time, the first conveying unit 42 moves left and right between the pair of second guide rod units 41, thereby realizing conveying in the up, down, left and right directions.

[0077] In a preferred embodiment of the present embodiment, the second guide rod unit 41 comprises a second fixed guide rod 410 and a second telescopic guide rod 411, the second fixed guide rod 410 is movably connected to the first guide rod 40 in the up-down direction, the second telescopic guide rod 411 is movably connected to the second fixed guide rod 410 in the left-right direction, and the first conveying unit 42 is movably connected to the pair of second telescopic guide rods 411. Since the second telescopic guide rod 411 is movable on the second fixed guide rod 410 and can move left or right relative to the second fixed guide rod 410, and at the same time, the first conveying unit 42 can move left or right on the second telescopic guide rod 411, the moving range of the first conveying unit 42 in the left-right direction is larger, and the conveying at various positions is satisfied.

[0078] In another preferred embodiment of the present embodiment: the first conveying unit 42 comprises a connecting rod 420 movably connected between the second telescopic guide rods 411 of the pair of second guide rod units 41, and a hook portion 421 connected to the connecting rod 420 for hooking the first carriers, the hook portion 421 is usually provided in pairs, and a pair of hook portions 421 hook the ears at both ends of the first carrier. The hook portion 421 is provided in multiple groups, so that multiple groups of first carriers can be conveyed on one connecting rod 420 at the same time. In the illustration, the hook portion 421 is provided in two groups, and two groups of first carriers can be conveyed at the same time.

[0079] As shown in FIG. 2: looking at the entire conveying device, the processing device, and the conveying device 4, the second conveying unit 20 is located below the gas source and the tail gas processing unit 32; the second conveying unit 21 is located below the furnace body 31; the loading and unloading units are basically located below the furnace body 31, but the second working position 2211b of the first conveying module extends to the lower side of the first conveying unit 30, at the same time, the buffer unit is also located below the first conveying unit 30, that is: the second working position 2211b of the first conveying module, the buffer unit, and the first conveying unit 30 are distributed vertically, which is more convenient for the conveying device 4 to convey between the three.

[0080] Comparative examples and examples:

[0081] Taking a automatic conveying machine and a process processing machine (6 furnaces vertically distributed) in series as an example, wherein: the automatic conveying machine has a length of 10.5 meters, a width of 3 meters, and a height of 2.2 meters; the process processing machine has a length of 15 meters, a width of 2.2 meters, and a height of 4.5 meters, and after being connected in series, the entire machine occupies a land area of 25.5 meters in length, 3 meters in width, and 4.5 meters in height.

[0082] Taking the conveying and processing equipment (6 furnaces, 2 rows, 3 columns) of the present embodiment as an example, under the same conditions, the entire machine occupies a land area of 12 meters in length, 3 meters in width, and 4.5 meters in height.

[0083] Obviously, under the condition that the width and height remain basically unchanged, the length of the entire machine can be shortened by nearly half, greatly reducing the size of the equipment.

[0084] The above examples are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made in accordance with the spirit and essence of the present application shall be covered within the protection scope of the present application.

[0085]

Claims

1. A conveying and processing apparatus, characterized by: The utility model relates to a silicon wafer processing system, including: Rack: the rack is provided with lower area, upper area, one end of lower area forms access and exit material mouth; Conveying device: the conveying device is arranged in lower area, and the conveying device is used at least for mutual transfer of the silicon wafer in first carrier, second carrier; Processing device: the processing device is arranged in upper area, and the processing device includes furnace body, first conveying unit, the furnace body is horizontally arranged, and is provided with multiple, and the first conveying unit is used to send or remove the first carrier loaded with silicon wafer into or out of the furnace body; Conveying device: the conveying device is between lower area, upper area, and the conveying device can move between lower area, upper area, and the conveying device is used at least for mutual conveying of the first carrier loaded with silicon wafer between conveying device, first conveying unit.

2. The conveying and processing apparatus of claim 1, wherein: The conveying device includes second conveying unit, second conveying unit, loading and unloading unit, and the second conveying unit, second conveying unit, loading and unloading unit are sequentially distributed from one end to the other end of lower area, and the second conveying unit is used for conveying the second carrier loaded with silicon wafer between second conveying unit, loading and unloading unit;The loading and unloading unit is used for mutual transfer of the silicon wafer in first carrier, second carrier.

3. The conveying and processing apparatus of claim 2, wherein: The loading and unloading unit includes first loading and unloading unit, second loading and unloading unit, transfer module, the first loading and unloading unit is used for inserting or ejecting the silicon wafer into or out of first carrier;The second loading and unloading unit is used for inserting or ejecting the silicon wafer into or out of second carrier;The transfer module is used for transferring the silicon wafer between the first loading and unloading unit, second loading and unloading unit.

4. The delivery and treatment device of claim 3, wherein: The second loading and unloading unit includes second conveying module, second ejector module, second alignment module, the second conveying module has first working position, second working position, and the second conveying unit is used for conveying the second carrier loaded with silicon wafer between second conveying unit, the first working position of second conveying module, and the second ejector module, second alignment module are arranged in the second working position of second conveying module, and the second ejector module is used for inserting or ejecting the silicon wafer into or out of second carrier, and the second alignment module is used for aligning the silicon wafer on the second ejector module.

5. The delivery and treatment device of claim 3, wherein: The first loading and unloading unit includes first conveying module, first ejector module, first alignment module, and the first conveying module has first working position, second working position, and the first ejector module, first alignment module are arranged in the end of first working position of first conveying module, and the first ejector module is used for inserting or ejecting the silicon wafer into or out of first carrier, and the first alignment module is used for aligning the silicon wafer on the first ejector module, and the conveying device is used for mutual conveying of the first carrier loaded with silicon wafer between the second working position of first conveying module, first conveying unit.

6. The delivery and treatment device of claim 3, wherein: The first loading and unloading units are two; the second loading and unloading units are two, and the two first loading and unloading units are respectively located on the two sides of the two second loading and unloading units.

7. The delivery and treatment device of claim 2, wherein: The conveying device further comprises a buffer unit, the buffer unit comprises a plurality of buffer modules, and the conveying device is used for conveying the first carriers loaded with the silicon wafers among the loading and unloading units, the buffer unit and the first conveying unit.

8. The transport and treatment apparatus of claim 1, wherein: The first conveying units and the furnace bodies are sequentially distributed from the other end to the one end of the upper layer area.

9. The conveying and processing apparatus of claim 1 or 8, wherein: The processing device further comprises a gas source and a tail gas processing unit, the gas source and the tail gas processing unit are connected with the furnace bodies, and are used for providing reaction gas for the furnace bodies and processing tail gas, and the first conveying units, the furnace bodies, the gas source and the tail gas processing unit are sequentially distributed from the other end to the one end of the upper layer area.

10. The transport and treatment apparatus of claim 1, wherein: The number of the first conveying units is consistent with the number of the furnace bodies, and each furnace body is provided with the first conveying unit correspondingly.

11. The conveying and processing apparatus of claim 1 or 10, wherein: The plurality of furnace bodies are distributed into multiple rows in the left-right direction of the upper layer area and into multiple columns in the up-down direction of the upper layer area.

12. The delivery and treatment device of claim 11, wherein: The furnace bodies are distributed into 2-4 rows; and / or the furnace bodies are distributed into 2-5 columns.

13. The transport and treatment apparatus of claim 1, wherein: The conveying device comprises a pair of first guide rods, a pair of second guide rod units, a first conveying unit and a driving unit, the first guide rods extend in the vertical direction, the second guide rod units are respectively connected to the first guide rods, the second guide rod units are movable up and down on the first guide rods, the first conveying unit is movably connected between the second guide rod units and is movable horizontally between the second guide rod units, and the driving unit is used to drive the second guide rod units and the first conveying unit to move.

14. The delivery and handling apparatus of claim 13, wherein: The second guide rod units comprise second fixed guide rods and second telescopic guide rods, the second fixed guide rods are movably connected to the first guide rods, the second telescopic guide rods are movably connected to the second fixed guide rods, and the first conveying unit is movably connected to the second telescopic guide rods.

15. The conveying and processing apparatus of claim 13 or 14, characterized in that: The second guide rod units are perpendicular to the first guide rods.

16. The delivery and treatment device of claim 13, wherein: The first conveying unit comprises a connecting rod and a hook portion, the connecting rod is movably connected between the second guide rod units, and the hook portion is connected to the connecting rod and used to hook the second carriers.

17. The delivery and treatment device of claim 16, wherein: The hook portions are arranged in pairs, and a pair of the hook portions hook the hanging ears at the two ends of the first carrier.

18. A conveying and processing apparatus characterized by: The rack is provided with a lower layer area and an upper layer area, one end of the lower layer area forms an inlet and outlet, and a conveying device is arranged in the lower layer area. The conveying device comprises a second conveying unit, a second conveying unit, a loading and unloading unit and a buffer unit, and the second conveying unit, the second conveying unit, the loading and unloading unit and the buffer unit are sequentially distributed from one end to the other end of the lower layer area. ​ The processing device is arranged in the upper area, and comprises a furnace body, a first conveying unit, a gas source and a tail gas treatment unit. The furnace body is horizontally arranged and provided with multiple furnace bodies. The first conveying unit, the furnace body, the gas source and the tail gas treatment unit are sequentially arranged from the other end to the end of the upper area. The multiple furnace bodies are arranged in multiple rows in the left-right direction of the upper area and in multiple columns in the up-down direction of the upper area. The conveying device is arranged in the lower area and the upper area, and is movable between the lower area and the upper area. The conveying device is used for conveying the first carrier loaded with the silicon wafer between the loading and unloading unit, the buffer unit and the first conveying unit.

19. The delivery and treatment device of claim 18, wherein: The second conveying unit is located below the gas source and the tail gas treatment unit. The second conveying unit is located below the furnace body. The loading and unloading unit is at least partially located below the furnace body. The buffer unit is located below the first conveying unit.

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