Heat dissipation apparatus and electronic device

Abstract

Provided in the present application are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus comprises a heat-conducting member, a first heat dissipation assembly and a second heat dissipation assembly, wherein both the first heat dissipation assembly and the second heat dissipation assembly are connected to the heat-conducting member, and heat transfer can be achieved between the heat-conducting member and each of the first heat dissipation assembly and second heat dissipation assembly, the first heat dissipation assembly and the second heat dissipation assembly being used for generating airflow; in the direction of arrangement of the first heat dissipation assembly and the second heat dissipation assembly, there is an overlap area between the projection of the first heat dissipation assembly on the heat-conducting member and the projection of the second heat dissipation assembly on the heat-conducting member. The heat dissipation apparatus in the present application has good heat dissipation effects, and has a rationally arranged structure, occupying less space. The heat dissipation apparatus applied to an electronic device has good heat dissipation effects on a heat source of the electronic device, and occupies less internal space of the electronic device.

Description

Heat dissipation device and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411098874.5, filed on August 9, 2024, and entitled "Heat dissipation device and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. BACKGROUND

[0003] With the continuous improvement of the performance of electronic devices, the operating power consumption and heat generation of electronic devices have also been significantly improved. Therefore, in order to ensure the working performance and safety of electronic devices, a heat dissipation device needs to be arranged inside the electronic device to dissipate heat from the electronic device.

[0004] However, the structure of the heat dissipation device of the current electronic device is not reasonable, which results in that the heat dissipation device occupies too much space inside the electronic device, which is not conducive to the miniaturization of the electronic device. SUMMARY

[0005] The present application provides a heat dissipation device and an electronic device. The structure of the heat dissipation device is reasonable and occupies less space. The heat dissipation device is applied to the electronic device, has a better heat dissipation effect on the heat source of the electronic device, and is conducive to the miniaturization of the electronic device.

[0006] In a first aspect, the present application provides a heat dissipation device. The heat dissipation device includes a heat conduction member, a first heat dissipation assembly, and a second heat dissipation assembly. The first heat dissipation assembly and the second heat dissipation assembly are connected with the heat conduction member, and the heat conduction member can achieve heat transfer with the first heat dissipation assembly and the second heat dissipation assembly. The first heat dissipation assembly and the second heat dissipation assembly are used to generate airflow. In the arrangement direction of the first heat dissipation assembly and the second heat dissipation assembly, the projection of the first heat dissipation assembly on the heat conduction member and the projection of the second heat dissipation assembly on the heat conduction member have an overlapping area.

[0007] In the present application, the heat of the heat conduction member can be transferred to the first heat dissipation assembly and the second heat dissipation assembly, that is, the first heat dissipation assembly and the second heat dissipation assembly can dissipate heat from the heat conduction member. Moreover, the first heat dissipation assembly and the second heat dissipation assembly are used to generate airflow to dissipate heat from the heat conduction member. Compared with the natural heat dissipation scheme, the heat dissipation device in the present application has a higher heat dissipation efficiency.

[0008] In addition, in the embodiment of the present application, the first heat dissipation assembly and the second heat dissipation assembly can be stacked, for example, can be stacked in the Z-axis direction. In this way, in the Z-axis direction, the total projection area of the first heat dissipation assembly and the second heat dissipation assembly on the heat conduction member is small. Compared with the scheme in which the first heat dissipation assembly and the second heat dissipation assembly are arranged on the same plane, the first heat dissipation assembly and the second heat dissipation assembly in the embodiment occupy less space in the direction perpendicular to the stacking direction, which is beneficial to reduce the size of the heat dissipation device in the direction perpendicular to the stacking direction of the first heat dissipation assembly and the second heat dissipation assembly, that is, beneficial to reduce the size of the heat dissipation device in the X-Y plane. It can be understood that the heat dissipation device of the embodiment of the present application can reduce the total projection area of the first heat dissipation assembly and the second heat dissipation assembly on the heat conduction member while improving the heat dissipation efficiency of the heat dissipation device.

[0009] In some embodiments, the first heat dissipation assembly includes a first heat dissipation body and a first air source, the first heat dissipation body includes a first top plate, a first bottom plate, a first connecting frame and a first frame body, the first top plate and the first bottom plate are oppositely arranged, the first connecting frame is connected between the first top plate and the first bottom plate, and the first top plate, the first bottom plate and the first connecting frame collectively enclose a first air outlet space; the first frame body is protruded on the side of the first top plate away from the first bottom plate, and the first frame body and the first top plate collectively enclose a first air inlet space, the first air inlet space and the first air outlet space are oppositely arranged; the first top plate includes a plurality of first through holes, each first through hole penetrates the first top plate and communicates the first air inlet space and the first air outlet space; the first bottom plate has a first heat dissipation surface and a first heat conduction surface oppositely arranged, the first heat dissipation surface is located in the first air outlet space, and the first heat conduction surface is connected to the heat conduction member; the first air source is arranged in the first air inlet space, and the first air source is used to generate air flow.

[0010] It can be understood that in the present embodiment, the first heat conduction surface of the first bottom plate can be used to be attached to the heat source, so that the heat of the heat source can be conducted to the first bottom plate. By arranging the structure of the first heat dissipation assembly, the air flow generated by the first air source can flow from the first air inlet space through the first through hole into the first air outlet space and blow to the first heat dissipation surface of the first bottom plate, and the air flow can carry away the heat on the first bottom plate, thereby dissipating heat from the first bottom plate and the heat source.

[0011] In some embodiments, the second heat dissipation assembly comprises a second heat dissipation body and a second air source, the second heat dissipation body comprises a second top plate, a second bottom plate, a second connecting frame and a second frame body, the second top plate and the second bottom plate are oppositely arranged, the second connecting frame is connected between the second top plate and the second bottom plate, and the second top plate, the second bottom plate and the second connecting frame jointly enclose a second air outlet space; the second frame body is protruded from a side of the second top plate away from the second bottom plate, the second frame body and the second top plate jointly enclose a second air inlet space, and the second air inlet space and the second air outlet space are oppositely arranged; the second top plate comprises a plurality of second through holes, each of which penetrates through the second top plate and communicates the second air inlet space and the second air outlet space; the second bottom plate has a second heat dissipation surface and a second heat conduction surface oppositely arranged, the second heat dissipation surface is located in the second air outlet space, and the second heat conduction surface is connected with the heat conduction member; and the second air source is arranged in the second air inlet space and used for generating air flow.

[0012] It can be understood that, in the present embodiment, the second heat conduction surface of the second bottom plate can be used to be attached with the heat source, so that the heat of the heat source can be conducted to the second bottom plate. By arranging the structure of the second heat dissipation assembly, the air flow generated by the second air source can flow from the second air inlet space to the second air outlet space through the second through holes and blow to the second heat dissipation surface of the second bottom plate, and the air flow can carry away the heat on the second bottom plate, so that the second bottom plate and the heat source can be cooled.

[0013] In some embodiments, the first heat dissipation assembly further comprises a first air inlet, which is arranged in the first frame body and communicates the first air inlet space with the outside of the first heat dissipation assembly. In this way, the air outside the first heat dissipation assembly can enter the first air inlet space through the first air inlet, so that the first heat dissipation assembly can be cooled by air.

[0014] In some embodiments, the first heat dissipation assembly further comprises a first air outlet, which is arranged in the first connecting frame and communicates the first air outlet space with the outside of the first heat dissipation assembly.

[0015] It can be understood that the gas in the first air outlet space has a large amount of heat after cooling the first bottom plate, and if the gas cannot be dissipated, it will affect the cooling rate of the first heat dissipation assembly. The present embodiment arranges the first air outlet, so that the air with heat in the first air outlet space can flow out of the first air outlet space through the first air outlet, thereby facilitating the improvement of the cooling rate of the first heat dissipation assembly.

[0016] In some embodiments, the second heat dissipation assembly further comprises a second air inlet, which is arranged in the second frame body and communicates the second air inlet space with the outside of the second heat dissipation assembly. In this way, the air outside the second heat dissipation assembly can enter the second air inlet space through the second air inlet, so that the second heat dissipation assembly can be cooled by air.

[0017] In some embodiments, the second heat dissipation assembly further comprises a second air outlet, the second air outlet is located in the second connecting frame, and the second air outlet is in communication with the second air outlet space and the outside of the second heat dissipation assembly.

[0018] It can be understood that the gas in the second air outlet space has a large amount of heat after dissipating heat to the first bottom plate, and if the gas cannot be dissipated, the heat dissipation rate of the second heat dissipation assembly will be affected. The second air outlet is arranged in the present embodiment, so that the hot air in the second air outlet space can flow out of the second air outlet space through the second air outlet, thereby facilitating the improvement of the heat dissipation rate of the second heat dissipation assembly.

[0019] In some embodiments, the first air inlet penetrates the first frame body along a first direction, and the first air outlet penetrates the first connecting frame along a second direction, and the first direction is different from the second direction.

[0020] It can be understood that the gas flows out of the first air outlet after flowing through the first bottom plate, and at this time the gas flow has a large amount of heat. In some embodiments of the present application, the first air inlet can penetrate the first frame body along a first direction, and the first air outlet can penetrate the first connecting frame along a second direction. Wherein, the first direction is different from the second direction. For example, the first air inlet can penetrate the first frame body along the Z-axis direction, and the first air outlet can penetrate the first connecting frame along the X-axis direction, so that the air flowing out of the first air outlet can be away from the first air inlet, so that the hot air flowing out of the first air outlet will not be reabsorbed into the first air inlet, affecting the heat dissipation effect of the heat dissipation device.

[0021] In some embodiments, the second air inlet penetrates the second frame body along a first direction, and the second air outlet penetrates the second connecting frame along a second direction, and the first direction is different from the second direction.

[0022] It can be understood that the gas flows out of the second air outlet after flowing through the second bottom plate, and at this time the gas flow has a large amount of heat. In some embodiments of the present application, the second air inlet can penetrate the second frame body along a first direction, and the second air outlet can penetrate the second connecting frame along a second direction. Wherein, the first direction is different from the second direction. For example, the second air inlet can penetrate the second frame body along the Z-axis direction, and the second air outlet can penetrate the second connecting frame along the X-axis direction, so that the air flowing out of the second air outlet can be away from the second air inlet, so that the hot air flowing out of the second air outlet will not be reabsorbed into the second air inlet, affecting the heat dissipation effect of the heat dissipation device.

[0023] In some embodiments, the first through hole has a hole diameter less than or equal to 1mm.

[0024] In the embodiment, the first through hole is provided with a small aperture, and the flow area of the gas flowing through the first through hole is reduced and the flow rate is increased, so that the gas forms an air jet with a high flow rate after passing through the first through hole. The jet blowing to the first bottom plate can quickly take away the heat on the first bottom plate, and thus the jet formed after the gas flowing through the first through hole can quickly dissipate heat from the heat conduction member, so that the heat dissipation efficiency of the heat dissipation device is high.

[0025] In addition, since the heat dissipation amount of the heat dissipation device is positively correlated with the convective heat transfer coefficient and the heat dissipation area, under the premise of a certain heat dissipation amount, increasing the convective heat transfer coefficient can reduce the heat dissipation area of the heat dissipation device. The embodiment of the present application provides the first through hole with a small aperture, so that the flow rate of the gas flowing through the first through hole is increased, which is beneficial to increase the convective heat transfer coefficient, so that the heat dissipation area of the heat dissipation device can be reduced under the condition of the same heat dissipation amount, which is beneficial to reduce the volume of the heat dissipation device.

[0026] In some embodiments, the second through hole has an aperture less than or equal to 1 mm.

[0027] In the embodiment, the second through hole is provided with a small aperture, and the flow area of the gas flowing through the second through hole is reduced and the flow rate is increased, so that the gas forms an air jet with a high flow rate after passing through the second through hole. The jet blowing to the second bottom plate can quickly take away the heat on the second bottom plate, and thus the jet formed after the gas flowing through the second through hole can quickly dissipate heat from the heat conduction member, so that the heat dissipation efficiency of the heat dissipation device is high.

[0028] In addition, the second through hole is provided with a small aperture, so that the flow rate of the gas flowing through the second through hole is increased, which is beneficial to increase the convective heat transfer coefficient, so that the heat dissipation area of the heat dissipation device can be reduced under the condition of the same heat dissipation amount, which is beneficial to reduce the volume of the heat dissipation device.

[0029] In some embodiments, the heat conduction member has a thermal conductivity greater than or equal to 0.21 W / m·K. In this way, the heat conduction member has a fast heat conduction rate, so that the heat dissipation efficiency of the heat dissipation device can be improved to achieve rapid cooling of the heat source of the electronic device. For example, the material of the heat conduction member can be graphite, and can also be a high-thermal-conductivity metal such as copper, silver, aluminum, etc.

[0030] In some embodiments, the first bottom plate and / or the second bottom plate has a thermal conductivity greater than or equal to 0.21 W / m·K. In this way, the first bottom plate has a fast heat conduction rate, so that the heat dissipation efficiency of the heat dissipation device can be improved to achieve rapid cooling of the heat source of the electronic device. For example, the material of the first bottom plate can be graphite, and can also be a high-thermal-conductivity metal such as copper, silver, aluminum, etc.

[0031] In some embodiments, the first air source is a diaphragm fixed to the first frame and arranged opposite to the first top plate. In this embodiment, the diaphragm can generate high-frequency periodic vibration to suck air from the first air inlet into the first air inlet space and drive the air flow to the first top plate. The structure of the first air source is relatively simple, and the efficiency of generating air flow is relatively high.

[0032] In some embodiments, the second air source is a diaphragm fixed to the second frame and arranged opposite to the second top plate. In this embodiment, the diaphragm can generate high-frequency periodic vibration to suck air from the second air inlet into the second air inlet space and drive the air flow to the second top plate. The structure of the second air source is relatively simple, and the efficiency of generating air flow is relatively high.

[0033] In some embodiments, the heat-conducting member includes a first portion, a second portion, and a third portion, the first portion and the third portion are arranged opposite and spaced apart, and the second portion is connected between the first portion and the third portion; the first heat dissipation component is fixed to the first portion, and the second heat dissipation component is fixed to the third portion.

[0034] In some embodiments, the heat-conducting member includes a first portion, a second portion, and a third portion, the first portion and the third portion are arranged opposite and spaced apart, and the second portion is connected between the first portion and the third portion; the first heat dissipation component and the second heat dissipation component are both fixed to the first portion.

[0035] In some embodiments, the heat-conducting member includes a first portion, a second portion, and a third portion, the first portion and the third portion are arranged opposite and spaced apart, and the second portion is connected between the first portion and the third portion; the first heat dissipation component is fixed to the second portion, and the second heat dissipation component is fixed to the third portion.

[0036] It can be understood that in the embodiments of the present application, at least one of the first portion, the second portion, and the third portion of the heat-conducting member can be used to be attached to the heat source, so that the heat of the heat source can be conducted to the heat-conducting member. At least one of the first portion, the second portion, and the third portion of the heat-conducting member can be used to fix the first heat dissipation component and the second heat dissipation component, so that the first heat dissipation component and the second heat dissipation component can dissipate heat from the heat-conducting member, thereby achieving cooling of the heat source.

[0037] In some embodiments, the first portion, the second portion, and the third portion collectively enclose an installation space; the first heat dissipation component is located on a side of the first portion away from the installation space, and the second heat dissipation component is located in the installation space.

[0038] In the embodiment, the second heat dissipation component can be located in the mounting space of the heat conduction member. That is, the second heat dissipation component can be located at the inner side of the first part, the second part and the third part. The first part, the second part and the third part can surround the second heat dissipation component and play a role of protecting the second heat dissipation component.

[0039] In some embodiments, the first part, the second part and the third part collectively enclose the mounting space; the first heat dissipation component is located at the side of the first part away from the mounting space, and the second heat dissipation component is located at the side of the third part away from the mounting space.

[0040] In some embodiments, the first part, the second part and the third part collectively enclose the mounting space; the first heat dissipation component and the second heat dissipation component are both located in the mounting space.

[0041] In some embodiments, the first part, the second part and the third part collectively enclose the mounting space; the first heat dissipation component is located at the side of the second part away from the mounting space, and the second heat dissipation component is located in the mounting space.

[0042] In some embodiments, the first part, the second part and the third part collectively enclose the mounting space; the first heat dissipation component is located at the side of the second part away from the mounting space, and the second heat dissipation component is located at the side of the third part away from the mounting space.

[0043] It can be understood that in the embodiments of the present application, the relative position relationship between the first heat dissipation component and the second heat dissipation component of the heat conduction member can be set according to requirements, and the application range of the heat dissipation device is wide.

[0044] In some embodiments, the heat conduction member includes a first part and a second part, the first part is connected to the second part, and the first part and the second part are arranged at an included angle; the first heat dissipation component is fixed to the first part, and the second heat dissipation component is fixed to the second part.

[0045] It can be understood that in the embodiments of the present application, at least one of the first part and the second part of the heat conduction member can be used to be attached to the heat source, so that the heat of the heat source can be conducted to the heat conduction member. At least one of the first part and the second part of the heat conduction member can be used to fix the first heat dissipation component and the second heat dissipation component, so that the first heat dissipation component and the second heat dissipation component can dissipate heat of the heat conduction member, thereby realizing cooling of the heat source.

[0046] In some embodiments, the heat conduction member includes a first part and a second part, the first part is connected to the second part, and the first part and the second part are arranged at an included angle; the first heat dissipation component and the second heat dissipation component are respectively fixed to the first part.

[0047] In some embodiments, the first portion has a first surface and a second surface arranged oppositely, and the second portion has a third surface and a fourth surface arranged oppositely; the first heat dissipation component is fixed to the first surface, and the second heat dissipation component is fixed to the second surface.

[0048] In some embodiments, the first portion has a first surface and a second surface arranged oppositely, and the second portion has a third surface and a fourth surface arranged oppositely; the first heat dissipation component is fixed to the first surface, and the second heat dissipation component is fixed to the third surface.

[0049] In some embodiments, the first portion has a first surface and a second surface arranged oppositely, and the second portion has a third surface and a fourth surface arranged oppositely; the first heat dissipation component is fixed to the first surface, and the second heat dissipation component is fixed to the fourth surface.

[0050] In some embodiments, the first portion has a first surface and a second surface arranged oppositely, and the second portion has a third surface and a fourth surface arranged oppositely; the first heat dissipation component is fixed to the second surface, and the second heat dissipation component is fixed to the third surface.

[0051] In some embodiments, the first portion has a first surface and a second surface arranged oppositely, and the second portion has a third surface and a fourth surface arranged oppositely; the first heat dissipation component is fixed to the second surface, and the second heat dissipation component is fixed to the fourth surface.

[0052] It can be understood that, in the embodiments of the present application, the relative position relationship between the first heat dissipation component and the second heat dissipation component of the heat conduction member can be set according to requirements, and the heat dissipation device has a wide range of applications.

[0053] In some embodiments, the heat conduction member is in a plate shape, and the heat conduction member includes a first surface and a second surface arranged oppositely, the first heat dissipation component is fixed to the first surface of the heat conduction member, and the second heat dissipation component is fixed to the second surface of the heat conduction member. In this way, the structure of the heat conduction member is relatively simple, and the heat conduction member occupies less space inside the electronic device.

[0054] In some embodiments, the heat dissipation device further includes a housing, the housing has a bottom wall and a peripheral side wall, the peripheral side wall of the housing is connected to the peripheral edge of the bottom wall of the housing, and the bottom wall of the housing and the peripheral side wall of the housing together enclose an internal space of the housing; the heat conduction member, the first heat dissipation component, and the second heat dissipation component are all located in the internal space of the housing, and the first heat dissipation component is located on the side of the second heat dissipation component away from the bottom wall of the housing.

[0055] In the embodiment, the shell is arranged to protect the heat-conducting member, the first heat-dissipating assembly and the second heat-dissipating assembly, and the heat-conducting member, the first heat-dissipating assembly and the second heat-dissipating assembly are assembled to the shell first, and then the shell is used for subsequent assembly, so that the heat-dissipating device has better integrity and is convenient for subsequent assembly.

[0056] In some embodiments, the shell further comprises a partition plate connected to the bottom wall and the peripheral side wall of the shell and separating the internal space of the shell into a first space and a second space; the partition plate is provided with a communication hole communicating the first space and the second space; the first heat-dissipating assembly and the second heat-dissipating assembly are located in the first space, and the first air outlet and the second air outlet communicate with the second space through the communication hole.

[0057] It can be understood that, in the embodiment, the first air inlet of the first heat-dissipating assembly and the second air inlet of the second heat-dissipating assembly can communicate with the first space, and the first air outlet of the first heat-dissipating assembly and the second air outlet of the second heat-dissipating assembly can communicate with the second space. At this time, the gas outside the heat-dissipating device enters the first space, then enters the interior of the first heat-dissipating assembly through the first air inlet, flows through the first heat-dissipating assembly and then enters the second space from the first air outlet. In this way, on the one hand, the gas in the first space can flow through the first heat-dissipating assembly and the second heat-dissipating assembly to dissipate heat from the first bottom plate of the first heat-dissipating assembly and the second bottom plate of the second heat-dissipating assembly, so that the heat-dissipating device has better heat-dissipating efficiency; on the other hand, the gas with high temperature in the second space can be prevented from flowing back to the first space, so as to reduce the heat-dissipating efficiency.

[0058] In some embodiments, the shell further comprises a partition plate connected to the bottom wall and the peripheral side wall of the shell and separating the internal space of the shell into a first space and a second space; a part of the first heat-dissipating assembly is located in the first space and a part is located on the partition plate to make the first air outlet communicate with the second space; a part of the second heat-dissipating assembly is located in the first space and a part is located on the partition plate to make the second air outlet communicate with the second space.

[0059] It can be understood that in the embodiment, the first air inlet of the first heat dissipation assembly and the second air inlet of the second heat dissipation assembly can be in communication with the first space, and the first air outlet of the first heat dissipation assembly and the second air outlet of the second heat dissipation assembly can be in communication with the second space. At this time, the gas outside the heat dissipation device can enter the first space, then enter the inside of the first heat dissipation assembly through the first air inlet, and then enter the second space from the first air outlet after flowing through the first heat dissipation assembly. In this way, on the one hand, the gas in the first space can flow through the first heat dissipation assembly and the second heat dissipation assembly to dissipate heat from the first bottom plate of the first heat dissipation assembly and the second bottom plate of the second heat dissipation assembly, so that the heat dissipation device can have better heat dissipation efficiency; on the other hand, the gas with high temperature in the second space can be prevented from flowing back to the first space, thereby reducing the heat dissipation efficiency.

[0060] In some embodiments, the heat dissipation device further comprises a cover plate, the cover plate is fixed to the top of the shell, a part of the cover plate covers the first space to form a first chamber, and a part of the cover plate covers the second space to form a second chamber; the cover plate has a fourth opening and a fifth opening arranged at intervals, the fourth opening communicates with the first chamber, and the fifth opening communicates with the second chamber.

[0061] In the embodiment, the heat dissipation device has high integrity and high degree of modularity, which facilitates subsequent assembly of the heat dissipation device. In addition, in the embodiment, the gas outside the heat dissipation device can enter the first chamber from the fourth opening; then the gas in the first chamber can enter the inside of the first heat dissipation assembly from the first air inlet of the first heat dissipation assembly, flow through the inside of the first heat dissipation assembly, and then enter the second chamber from the first air outlet; at the same time, the gas in the first chamber can also enter the inside of the second heat dissipation assembly from the second air inlet of the second heat dissipation assembly, flow through the inside of the second heat dissipation assembly, and then enter the second chamber from the second air outlet, thereby taking away the heat on the second heat dissipation assembly; finally, the gas in the second chamber can flow to the outside of the heat dissipation device from the fifth opening.

[0062] In some embodiments, the cover plate comprises a top wall, a bottom wall, and a peripheral side wall connected between the top wall and the bottom wall, the top wall and the bottom wall are oppositely arranged, the top wall is located above the first space and the second space, and the bottom wall is fixedly connected to the shell; the peripheral side wall comprises oppositely arranged first and third side walls, the fourth opening is arranged on the first side wall, and the fifth opening is arranged on the third side wall.

[0063] It can be understood that, since the gas flowing out of the fifth opening carries a large amount of heat and has a high temperature, if the gas with high temperature is reabsorbed into the fourth opening, the heat dissipation efficiency of the heat dissipation device will be affected. Therefore, in the present embodiment, by arranging the fourth opening and the fifth opening on the first side wall and the third side wall respectively, the gas flowing out of the fifth opening can be away from the fourth opening, so that the gas with heat flowing out of the fifth opening will not be reabsorbed into the heat dissipation device, affecting the heat dissipation effect of the heat dissipation device.

[0064] In some embodiments, the heat dissipation device further comprises a housing, the housing having a bottom wall and a peripheral side wall, the peripheral side wall of the housing being connected to the peripheral edge of the bottom wall of the housing, the bottom wall of the housing and the peripheral side wall of the housing together enclosing an internal space of the housing; the heat conduction member, the first heat dissipation assembly and the second heat dissipation assembly are all located in the internal space of the housing, and the first heat dissipation surface and the second heat dissipation surface are both directed towards the peripheral side wall of the housing.

[0065] In the present embodiment, by arranging the housing, on the one hand, the housing can protect the heat conduction member, the first heat dissipation assembly and the second heat dissipation assembly; on the other hand, the heat conduction member, the first heat dissipation assembly and the second heat dissipation assembly can be assembled to the housing first, and then the subsequent assembly is carried out through the housing, so that the overall performance of the heat dissipation device is better, and the subsequent assembly of the heat dissipation device is facilitated.

[0066] In some embodiments, the first gas outlet and the second gas outlet are arranged away from the bottom wall of the housing. In this way, the high-temperature gas flowing out of the first gas outlet and the second gas outlet is not easy to flow back to the internal space of the housing, and the heat dissipation rate of the heat conduction is reduced.

[0067] In some embodiments, the heat dissipation device further comprises a cover plate, the cover plate being fixed to the top of the housing, the cover plate covering the internal space of the housing to form an air inlet chamber; the cover plate has a fourth opening and a fifth opening arranged at intervals, the fourth opening of the cover plate and the fifth opening of the cover plate both communicating with the air inlet chamber; the first gas outlet communicates with the outside of the heat dissipation device through the fifth opening, and the second gas outlet communicates with the outside of the heat dissipation device through the fifth opening.

[0068] In the embodiment, the heat dissipation device has high integrity and high degree of modularity, and is convenient for subsequent assembly of the heat dissipation device. In addition, in the embodiment, the gas outside the heat dissipation device can enter the air inlet chamber from the fourth opening and the sixth opening; then the gas in the air inlet chamber can enter the interior of the first heat dissipation assembly from the first air inlet of the first heat dissipation assembly, flow through the interior of the first heat dissipation assembly, and then flow to the outside of the heat dissipation device from the first air outlet and the fifth opening, and take away the heat on the first heat dissipation assembly; at the same time, the gas in the internal space of the shell can also enter the interior of the second heat dissipation assembly from the second air inlet of the second heat dissipation assembly, flow through the interior of the second heat dissipation assembly, and then flow to the outside of the heat dissipation device from the second air outlet and the fifth opening, and take away the heat on the second heat dissipation assembly.

[0069] In some embodiments, the cover plate comprises a top wall, a bottom wall and a circumferential side wall connected between the top wall and the bottom wall, the top wall and the bottom wall are oppositely arranged, the top wall covers the internal space of the shell, and the bottom wall is fixedly connected to the shell; the fourth opening is arranged on the circumferential side wall, and the fifth opening is arranged on the top wall.

[0070] It can be understood that, since the gas flowing out of the fifth opening has a large amount of heat and is at a high temperature, if the gas at a high temperature is reabsorbed into the fourth opening, the heat dissipation efficiency of the heat dissipation device will be affected. Therefore, in the embodiment, by arranging the fourth opening on the circumferential side wall and arranging the fifth opening on the top wall, the air flowing out of the fifth opening can be far away from the fourth opening, so that the gas with heat flowing out of the fifth opening will not be reabsorbed into the heat dissipation device, and the heat dissipation effect of the heat dissipation device will not be affected.

[0071] In some embodiments, the shell is provided with a third through hole, the third through hole communicates the internal space of the shell with the outside of the shell; and the heat conduction member is fixed in the third through hole and seals the third through hole. In this way, air, dust and the like cannot enter the internal space of the shell through the third through hole. At the same time, the gas in the first space cannot flow out of the internal space of the shell through the third through hole.

[0072] In some embodiments, the shell is provided with a third through hole, the third through hole communicates the internal space of the shell with the outside of the shell; and the heat conduction member is fixed in the third through hole and seals the third through hole. In this way, air, dust and the like cannot enter the internal space of the shell through the third through hole. At the same time, the gas in the first space cannot flow out of the internal space of the shell through the third through hole.

[0073] In a second aspect, the embodiments of the present application provide an electronic device. The electronic device comprises a device shell and the heat dissipation device described above, and the heat dissipation device is mounted on the device shell.

[0074] In some embodiments, the electronic device further comprises a heat source, and the heat source is attached to the heat-conducting member. In this way, heat from the heat source of the electronic device can be conducted to the heat-conducting member, so that the heat dissipation device can dissipate heat from the heat source of the electronic device.

[0075] In some embodiments, the first heat dissipation assembly and the heat source are located on opposite sides of the same part of the heat-conducting member, and in the arrangement direction of the first heat dissipation assembly and the heat source, the projection of the first heat dissipation assembly on the heat-conducting member and the projection of the heat source on the heat-conducting member have an overlapping area. In this way, the first heat dissipation assembly can be arranged closer to the heat source of the electronic device, so as to reduce the thermal resistance of heat transfer on the heat-conducting member, thereby reducing the loss of heat conduction efficiency of heat on the heat-conducting member, and facilitating the improvement of heat dissipation efficiency, so as to achieve rapid cooling of the heat source of the electronic device.

[0076] In some embodiments, the second heat dissipation assembly and the heat source are located on opposite sides of the same part of the heat-conducting member, and in the arrangement direction of the second heat dissipation assembly and the heat source, the projection of the second heat dissipation assembly on the heat-conducting member and the projection of the heat source on the heat-conducting member have an overlapping area. In this way, the second heat dissipation assembly can be arranged closer to the heat source of the electronic device, so as to reduce the thermal resistance of heat transfer on the heat-conducting member, thereby reducing the loss of heat conduction efficiency of heat on the heat-conducting member, and facilitating the improvement of heat dissipation efficiency, so as to achieve rapid cooling of the heat source of the electronic device.

[0077] In a third aspect, the embodiments of the present application provide an electronic device. The electronic device comprises a device shell and the heat dissipation device described above, and the shell of the heat dissipation device is mounted to the device shell; the device shell comprises a shell main body and a partition part, the shell main body has a through hole, the partition part of the device shell is connected to the inner wall of the through hole of the shell main body, and the partition part of the device shell separates the through hole of the shell main body into a first through hole and a second through hole arranged at intervals, and the first through hole and the second through hole communicate with the internal space of the shell; the peripheral side wall of the shell is connected to the shell main body and surrounds the first through hole and the second through hole, the partition plate of the shell is connected to the partition part of the device shell, and the bottom wall of the shell is located on the inner side of the device shell.

[0078] In some embodiments, the shell further comprises a partition plate, the partition plate connects the bottom wall of the shell and the peripheral side wall of the shell, and separates the internal space of the shell into a first space and a second space; the first through hole communicates with the first space, and the second through hole communicates with the second space.

[0079] In the present embodiment, the gas outside the electronic device can enter the first space through the first through hole, then flow through the heat dissipation device to the second space, and then flow to the outside of the electronic device through the second through hole. It can be understood that the gas flowing through the heat dissipation device can carry away the heat on the heat dissipation device, thereby dissipating heat from the heat dissipation device.

[0080] In some embodiments, the electronic device further comprises a cover fixed to the top of the device housing, a portion of the cover covering the first through-hole to form the first chamber, and a portion of the cover covering the second through-hole to form the second chamber; the cover has a first opening and a second opening spaced apart, the first opening communicating the first chamber with the outside of the electronic device, and the second opening communicating the second chamber with the outside of the electronic device.

[0081] In the present embodiment, air outside the electronic device can enter the first chamber from the first opening, then flow through the heat dissipation device to the second chamber, and finally the gas in the second chamber can flow to the outside of the electronic device through the second opening. It can be understood that the gas flowing through the heat dissipation device can take away the heat on the heat dissipation device, thereby dissipating heat from the heat dissipation device, and the gas with heat in the second chamber will not flow back to the first chamber, affecting the heat dissipation efficiency of the heat dissipation device.

[0082] In some embodiments, the cover comprises a top wall, a bottom wall, and a peripheral side wall connected between the top wall and the bottom wall, the top wall and the bottom wall are oppositely arranged, the top wall covers the first through-hole and the second through-hole, and the bottom wall is fixedly connected to the device housing; the peripheral side wall comprises a first side wall and a third side wall oppositely arranged, the first opening is arranged on the first side wall, and the second opening is arranged on the third side wall.

[0083] The gas flowing out of the second opening usually has a large amount of heat and a high temperature. If the gas with a high temperature is reabsorbed into the first opening, the heat dissipation efficiency of the heat dissipation device will be affected. Therefore, in the present embodiment, the first opening and the second opening are arranged on the oppositely arranged first side wall and third side wall respectively, so that the gas flowing out of the second opening can be away from the first opening, thereby the air with heat flowing out of the second opening will not be reabsorbed into the heat dissipation device, affecting the heat dissipation effect of the heat dissipation device.

[0084] In some embodiments, the cover comprises a cover body and a partition plate, the cover body has a groove, the partition plate of the cover is connected to the inner wall of the groove and separates the groove into a first sub-groove and a second sub-groove which are spaced apart; the cover body is connected to the housing body and surrounds the first through-hole and the second through-hole, the partition plate of the cover is connected to the separation portion of the device housing, the first sub-groove communicates the first through-hole with the first opening, and the second sub-groove communicates the second through-hole with the second opening.

[0085] In the present embodiment, the cover has the first sub-groove and the second sub-groove, so that the space enclosed by the cover and the device housing is large, which is conducive to the circulation of the gas in the inside of the electronic device, and is conducive to the rapid removal of heat by the gas, thereby improving the heat dissipation efficiency. In addition, the electronic device can utilize the space of the first sub-groove and the second sub-groove of the cover, thereby not needing to additionally provide a protruding structure on the device housing, which is conducive to reducing the size of the electronic device in the thickness direction.

[0086] In some embodiments, the electronic device has an internal space for installing internal components of the electronic device, the first space and the second space are both spaced apart from the internal space of the electronic device; the electronic device further comprises a heat source, the heat source is located in the internal space of the electronic device, and the heat source is attached to the heat-conducting member. In this way, the heat of the heat source of the electronic device can be conducted to the heat-conducting member, so that the heat dissipation device can dissipate heat for the heat source of the electronic device. Moreover, in the present embodiment, the first space and the second space can be separated from the internal space of the electronic device. In this way, the space collectively enclosed between the device housing of the electronic device, the cover member, and the shell of the heat dissipation device can be separated from the internal space of the electronic device. On the one hand, when air enters the first space through the first opening of the electronic device, the gas will not flow into the internal space of the electronic device, so that more gas can flow better to the heat dissipation device and carry away the heat on the heat dissipation device, thereby facilitating the enhancement of heat dissipation of the heat dissipation device and improving the heat dissipation rate. On the other hand, the internal space of the electronic device can be isolated from the outside world, so that dust, water vapor and the like from the outside world are less likely to enter the internal space of the electronic device and affect the internal components of the electronic device, thereby facilitating the guarantee of the reliability of the electronic device.

[0087] In a fourth aspect, an electronic device is provided. The electronic device comprises a device housing and the heat dissipation device as described above, and the shell of the heat dissipation device is mounted to the device housing; the device housing has a through hole, the through hole is in communication with the internal space of the shell; the peripheral sidewall of the shell is connected to the device housing and surrounds the through hole, and the bottom wall of the shell is located on the inner side of the device housing.

[0088] In the present embodiment, the gas outside the electronic device can enter the internal space of the shell through the hole, then flow through the heat dissipation device, and then flow to the outside of the electronic device from the first gas outlet and the second gas outlet of the heat dissipation device. It can be understood that the gas flowing through the heat dissipation device can carry away the heat on the heat dissipation device, thereby dissipating heat for the heat dissipation device.

[0089] In some embodiments, the electronic device further comprises a cover member, the cover member is fixed to the top of the device housing, and the cover member covers the through hole of the device housing to form an air inlet chamber; the cover member has a first opening and a second opening spaced apart, the first opening is in communication with the air inlet chamber and the outside of the electronic device, and the first gas outlet and the second gas outlet are in communication with the outside of the electronic device through the second opening.

[0090] In the embodiment, air outside the electronic device can enter the air inlet chamber from the first opening, then flow through the heat dissipation device, and then the gas can flow to the outside of the electronic device through the second opening. It can be understood that the gas flowing through the heat dissipation device can take away the heat on the heat dissipation device, thereby dissipating heat for the heat dissipation device, and the gas with heat flowing out of the second opening will not flow back to the air inlet chamber, affecting the heat dissipation efficiency of the heat dissipation device.

[0091] In some embodiments, the cover includes a top wall, a bottom wall and a peripheral side wall connected between the top wall and the bottom wall, the top wall and the bottom wall are oppositely arranged, the top wall covers the through hole, and the bottom wall is fixedly connected to the device shell; the first opening is arranged on the peripheral side wall, and the second opening is arranged on the top wall.

[0092] It can be understood that the gas flowing out of the second opening usually has a large amount of heat and a high temperature. If the gas with high temperature is reabsorbed into the first opening, the heat dissipation efficiency of the heat dissipation device will be affected. Therefore, in the embodiment, by arranging the first opening on the peripheral side wall of the cover and arranging the second opening on the top wall of the cover, the air flowing out of the second opening can be away from the first opening, so that the air with heat flowing out of the second opening will not be reabsorbed into the heat dissipation device, affecting the heat dissipation effect of the heat dissipation device.

[0093] In some embodiments, the cover is connected to the device shell and surrounds the through hole of the device shell; the cover has a groove; and the groove is in communication with the through hole of the device shell, the first opening and the second opening.

[0094] In the embodiment, the cover has a groove, so that the space surrounded by the cover and the device shell is large, which is beneficial to the circulation of the gas in the interior of the electronic device, and is conducive to the rapid heat removal of the gas and the improvement of the heat dissipation efficiency. In addition, the electronic device can utilize the space of the groove of the cover, so that it is not necessary to additionally arrange a protruding structure on the device shell, which is beneficial to reducing the size of the electronic device in the thickness direction.

[0095] In some embodiments, the electronic device has an internal space for installing internal components of the electronic device, the internal space of the housing is spaced apart from the internal space of the electronic device; the electronic device further comprises a heat source, the heat source is located in the internal space of the electronic device, and the heat source is attached to the heat-conducting member. In this way, the heat of the heat source of the electronic device can be conducted to the heat-conducting member, so that the heat dissipation device can dissipate heat for the heat source of the electronic device. Moreover, in the present embodiment, the internal space of the housing can be spaced apart from the internal space of the electronic device. In this way, the space jointly enclosed by the device shell of the electronic device, the cover member and the housing of the heat dissipation device can be spaced apart from the internal space of the electronic device. On the one hand, when the air enters the first space through the first opening of the electronic device, the gas will not flow into the internal space of the electronic device, so that more gas can flow to the heat dissipation device better, and take away the heat on the heat dissipation device, thereby facilitating the enhancement of the heat dissipation of the heat dissipation device and the improvement of the heat dissipation rate. On the other hand, the internal space of the electronic device can be isolated from the outside world, so that the dust, water vapor and the like in the outside world are not easy to enter the internal space of the electronic device, and are not easy to affect the internal components of the electronic device, thereby facilitating the guarantee of the reliability of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0096] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0097] FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application;

[0098] FIG. 2 is a partial structural exploded view of the electronic device shown in FIG. 1 in some embodiments;

[0099] FIG. 3 is a partial structural schematic diagram of the electronic device shown in FIG. 1 along A-A in some embodiments;

[0100] FIG. 4 is a structural schematic diagram of the heat dissipation device shown in FIG. 3 in some embodiments;

[0101] FIG. 5 is a partial structural exploded view of the heat dissipation device shown in FIG. 4 in some embodiments;

[0102] FIG. 6 is a partial structural exploded view of the first heat dissipation assembly shown in FIG. 5 in some embodiments;

[0103] FIG. 7 is a partial cross-sectional structural view of the first heat dissipation assembly shown in FIG. 5 along B-B in some embodiments;

[0104] FIG. 8 is a partial cross-sectional structural view of the first heat dissipation assembly shown in FIG. 5 along C-C in some embodiments;

[0105] Fig. 9 is a schematic diagram of a partial cross-sectional structure of the first top plate shown in Fig. 6 in some embodiments;

[0106] Fig. 10A is a schematic diagram of a partial cross-sectional structure of the second heat dissipation assembly shown in Fig. 5 along D1-D1 in some embodiments;

[0107] Fig. 10B is a schematic diagram of a partial cross-sectional structure of the second heat dissipation assembly shown in Fig. 5 along D2-D2 in some embodiments;

[0108] Fig. 11 is a schematic diagram of a partial structure of the heat dissipation device shown in Fig. 4 in some embodiments;

[0109] Fig. 12 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 11 along E1-E1 in some embodiments;

[0110] Fig. 13A is a schematic diagram of a structure of the housing shown in Fig. 5 in some embodiments;

[0111] Fig. 13B is a schematic diagram of a structure of the housing shown in Fig. 13A in another angle;

[0112] Fig. 14 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 along E1-E1 in some embodiments;

[0113] Fig. 15 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 along E2-E2 in some embodiments;

[0114] Fig. 16 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 in some other embodiments;

[0115] Fig. 17 is a schematic diagram of a partial structure of the heat dissipation device shown in Fig. 4 in some other embodiments;

[0116] Fig. 18 is an exploded view of a partial structure of the heat dissipation device shown in Fig. 4 in some other embodiments;

[0117] Fig. 19 is a schematic diagram of a partial structure of the heat dissipation device shown in Fig. 4 in some other embodiments;

[0118] Fig. 20 is a schematic diagram of a partial cross-sectional structure of a partial structure of the heat dissipation device shown in Fig. 19 along F-F in some embodiments;

[0119] Fig. 21 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 along E1-E1 in some other embodiments;

[0120] Fig. 22 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 along E2-E2 in some other embodiments;

[0121] Fig. 23 is a partial structural schematic view of the heat dissipating device shown in Fig. 4 in another embodiment;

[0122] Fig. 24 is a partial structural schematic view of the heat dissipating device shown in Fig. 1 in another embodiment;

[0123] Fig. 25 is a structural schematic view of the heat dissipating device shown in Fig. 24 from another angle;

[0124] Fig. 26 is a partial structural exploded view of the heat dissipating device shown in Fig. 24 in some embodiments;

[0125] Fig. 27 is a partial structural exploded view of the partial structure of the heat dissipating device shown in Fig. 26 in some embodiments;

[0126] Fig. 28 is a structural schematic view of the partial structure of the heat dissipating device shown in Fig. 26 from another angle;

[0127] Fig. 29 is a partial structural schematic view of the heat dissipating device shown in Fig. 24 in another embodiment;

[0128] Fig. 30A is a structural schematic view of the cover shown in Fig. 2 in some embodiments;

[0129] Fig. 30B is a structural schematic view of the cover shown in Fig. 30A from another angle;

[0130] Fig. 31 is a partial structural schematic view of the electronic device shown in Fig. 1 along G-G from another angle;

[0131] Fig. 32 is a partial cross-sectional structural schematic view of the electronic device shown in Fig. 1 along A-A in some embodiments;

[0132] Fig. 33 is a structural schematic view of the partial cross-sectional structure of the electronic device shown in Fig. 32 from another angle;

[0133] Fig. 34 is a structural schematic view of the electronic device shown in Fig. 1 in another embodiment;

[0134] Fig. 35 is a partial structural exploded view of the electronic device shown in Fig. 34 in some embodiments;

[0135] Fig. 36 is a structural schematic view of the cover shown in Fig. 35 from another angle;

[0136] Fig. 37 is a partial cross-sectional structural schematic view of the electronic device shown in Fig. 34 along H-H in some embodiments;

[0137] Fig. 38 is a partial structural schematic view of the heat dissipating device shown in Fig. 4 in another embodiment;

[0138] Fig. 39 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 in another embodiment;

[0139] Fig. 40 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device shown in Fig. 4 in another embodiment. DETAILED DESCRIPTION

[0140] The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0141] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms “mounting”, “connecting” should be understood in a broad sense, for example, “connecting” can be detachably connected, or can be non-detachably connected; can be directly connected, or indirectly connected through an intermediate medium. Among them, “fixedly connected” means connected to each other and the relative positional relationship after connection does not change.

[0142] The orientation terms mentioned in the embodiments of the present application, such as “upper”, “top”, “bottom”, “inner”, “outer”, “side” and the like, are only the direction of the accompanying drawings, therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, and are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the embodiments of the present application.

[0143] In the embodiments of the present application, the terms “first”, “second”, “third”, “fourth”, “fifth” are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by “first”, “second”, “third”, “fourth”, “fifth” can explicitly or implicitly include one or more of the features. The term “multiple” means at least two.

[0144] In the embodiments of the present application, “and / or” is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character “ / ” in this paper generally represents that the front and rear associated objects are in an “or” relationship.

[0145] Reference being made to "some embodiments" and the like in the present description means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in some embodiments", "in other embodiments", "in another embodiments" and the like in the present description are not necessarily all referring to the same embodiments, although the features, structures, or characteristics can be common in such embodiments. The terms "including", "containing", and the like are meant to be non-limiting and are understood to include "comprising but not limited to".

[0146] It is to be understood that the specific embodiments described herein are merely illustrative of the application and that other embodiments can incorporate any of the relevant features. In addition, for the purpose of convenience and brevity, the figures depict only the features of the application that are necessary to understand the application.

[0147] It is to be understood that the embodiments and features of the application described herein can be combined with each other, unless specifically stated otherwise.

[0148] The application will be described in greater detail with reference to the figures and embodiments.

[0149] Please refer to FIG. 1 to FIG. 3, FIG. 1 is a structural schematic diagram of an electronic device 100 according to an embodiment of the application, FIG. 2 is a partial structural exploded view of the electronic device 100 shown in FIG. 1 in some embodiments, and FIG. 3 is a partial structural schematic diagram of the electronic device 100 shown in FIG. 1 along A-A in some embodiments.

[0150] In the embodiments of the application, the electronic device 100 can be a mobile phone, a tablet personal computer, a notebook computer, a personal digital assistant (PDA), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, a VR helmet, or the like, or an optical modem (also known as an optical modem), a router, or the like Internet of things (IOT) product, or other forms of devices that need to dissipate heat from internal heat sources. The electronic device 100 of the embodiments shown in FIG. 1 to FIG. 3 is described by taking a mobile phone as an example.

[0151] In some embodiments, the electronic device 100 can include a device housing 10, a display screen 20, a heat dissipation device 30, a heat source 40, and a cover 13. For example, the heat dissipation device 30 is schematically shown by a larger solid line box in FIG. 3, and the heat source 40 is schematically shown by a smaller solid line box.

[0152] It can be understood that FIGS. 1-3 only schematically show some components included in the electronic device 100, and actual shapes, actual sizes, actual positions and actual structures of the components are not limited by FIGS. 1-3.

[0153] It can be understood that the electronic device 100 can have more or fewer components. For example, the electronic device 100 can have more components. The electronic device 100 can have fewer components. The electronic device 100 can also not include the display screen 20 and / or the cover 13.

[0154] In some embodiments, the display screen 20 is fixed to one side of the device housing 10 and cooperates with the device housing 10 to enclose an internal space 101 of the electronic device 100. The internal space 101 of the electronic device 100 can be used to mount internal components of the electronic device 100, such as a battery, a receiver, a microphone, a processor, and the like. In this embodiment, the display screen 20 can be used to display images, text, and the like. The display screen 20 can be a flat screen or a curved screen. The display screen 20 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a quantum dot light emitting diode (QLED) display screen, or the like.

[0155] For example, the device housing 10 can include a middle frame 121 and a back cover 122. The back cover 122 can be fixedly connected to the middle frame 121 by adhesive. The back cover 122 can also be an integrally formed structure with the middle frame 121, i.e., the back cover 122 and the middle frame 121 are an integral structure. The device housing 10 can be used to support the display screen 20. The display screen 20 can be located on a side of the middle frame 121 away from the back cover 122 and disposed opposite the back cover 122. At this time, the middle frame 121 is connected between the display screen 20 and the back cover 122. The display screen 20, the middle frame 121 and the back cover 122 cooperatively enclose the internal space 101 of the electronic device 100.

[0156] In some embodiments, the heat source 40 of the electronic device 100 can be located in the internal space 101 of the electronic device 100. It can be understood that the heat source 40 of the electronic device 100 is usually some device that generates a large amount of heat during operation and needs to be cooled urgently. In some examples, the heat source 40 of the electronic device 100 can be a power device inside the electronic device 100, for example, a processor, etc. When the electronic device 100 is running, the processor needs to process a large amount of data and generates more heat, so the demand for cooling is greater. In other examples, the heat source 40 of the electronic device 100 can also be a charging circuit of the electronic device 100. The charging circuit can be connected to the battery of the electronic device 100 and used to manage the charging action of the battery. For example, the charging circuit can be a circuit including an integrated circuit such as a charging chip or a power management chip. When the electronic device 100 is in a charging state, the charging circuit generates more heat and has a greater demand for cooling.

[0157] It can be understood that a large amount of heat generated by the heat source 40 of the electronic device 100 can affect the normal operation of the electronic device 100 and thus affect the reliability of the electronic device 100. Therefore, in the embodiments of the present application, the electronic device 100 can include the heat dissipation device 30, and the heat dissipation device 30 is used to dissipate heat of the heat source 40 of the electronic device 100, so as to ensure the reliability of the electronic device 100.

[0158] In some embodiments, the heat dissipation device 30 can be installed on the device housing 10. At least part of the heat dissipation device 30 can be located in the internal space of the electronic device 100 and attached to the heat source 40 of the electronic device 100. At this time, heat transfer can be achieved between the heat dissipation device 30 and the heat source 40 of the electronic device 100. For example, the heat of the heat source 40 of the electronic device 100 can be transferred to the heat dissipation device 30. In this way, the heat dissipation device 30 can dissipate heat of the heat source 40 of the electronic device 100.

[0159] For example, the device housing 10 can have a through hole 123, and the through hole 123 can communicate the internal space 101 of the electronic device 100 with the outside of the electronic device 100. In some examples, the through hole 123 can be provided on the back cover 122 and penetrate the back cover 122. In other examples, the through hole 123 can also be provided on the middle frame 121 and penetrate the middle frame 121. The present application does not strictly limit the position of the through hole 123.

[0160] Exemplarily, the heat dissipation device 30 can be exposed relative to the through hole 123. The heat dissipation device 30 can be in communication with the outside of the electronic device 100 through the through hole 123. The cover 13 can be fixed to the top of the device housing 10. It can be understood that the cover 13 can be fixed to the side of the rear cover 122 facing away from the display screen 20. The cover 13 can cover the through hole 123, that is, the cover 13 can cover the heat dissipation device 30. In some other embodiments, the electronic device 100 does not include the cover 13.

[0161] It can be understood that, for the convenience of description, the width direction of the electronic device 100 is defined as the X axis. The length direction of the electronic device 100 is the Y axis. The thickness direction of the electronic device 100 is the Z axis. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs.

[0162] Please refer to FIG. 4 and FIG. 5, FIG. 4 is a structural schematic diagram of the heat dissipation device 30 in some embodiments shown in FIG. 3, and FIG. 5 is a partial structural exploded view of the heat dissipation device 30 in some embodiments shown in FIG. 4.

[0163] In some embodiments, the heat dissipation device 30 can include a heat conduction member 31, a first heat dissipation component 32, a second heat dissipation component 33, and a shell 34. The heat conduction member 31 can be used to connect multiple components to achieve heat transfer between the multiple components. Exemplarily, the heat conduction member 31 can be a heat pipe, a vapor chamber (VC), etc. The first heat dissipation component 32 and the second heat dissipation component 33 can be used to generate airflow and dissipate heat conducted to the first heat dissipation component 32 and the second heat dissipation component 33, respectively, through the airflow.

[0164] It can be understood that FIG. 4 and FIG. 5 only schematically show some components included in the heat dissipation device 30, and the actual shape, actual size, actual position, and actual structure of these components are not limited by FIG. 4 and FIG. 5.

[0165] It can be understood that the heat dissipation device 30 can have more or fewer components. For example, the heat dissipation device 30 can have more components. The heat dissipation device 30 can have fewer components. The heat dissipation device 30 can also not include the shell 34.

[0166] In some embodiments, the heat conduction member 31 can include a first portion 311, a second portion 312, and a third portion 313. The first portion 311 and the third portion 313 can be oppositely and spacedly arranged, and the second portion 312 can be connected between the first portion 311 and the third portion 313. At this time, the first portion 311, the second portion 312, and the third portion 313 can collectively enclose an installation space 310.

[0167] Exemplarily, the length extension direction of the first portion 311 and the length extension direction of the third portion 313 can be arranged in parallel. In other examples, the length extension direction of the first portion 311 and the length extension direction of the third portion 313 can also be arranged at an angle. Exemplarily, the length extension direction of the first portion 311 and / or the length extension direction of the third portion 313 can be perpendicular to the length extension direction of the second portion 312. In other examples, the length extension direction of the first portion 311 and / or the length extension direction of the third portion 313 can also be arranged at an angle with the length extension direction of the second portion 312.

[0168] In some embodiments, the thermal conductivity of the thermal conductive member 31 is greater than or equal to 0.21 W / m·K. In this way, the thermal conductive member 31 has a faster heat conduction rate, so as to improve the heat dissipation efficiency of the heat dissipation device 30, to achieve rapid cooling of the heat source of the electronic device 100. Exemplarily, the material of the thermal conductive member 31 can be graphite, and can also be a high-thermal-conductivity metal, such as copper, silver, aluminum, etc. It can be understood that the material of the thermal conductive member 31 can also be other materials with a thermal conductivity greater than or equal to 0.21 W / m·K, which is not strictly limited in the present application.

[0169] Please refer to FIGS. 6-8, FIG. 6 is a partial structure exploded view of the first heat dissipation assembly 32 shown in FIG. 5 in some embodiments, FIG. 7 is a partial cross-sectional structure view of the first heat dissipation assembly 32 shown in FIG. 5 along B-B in some embodiments, and FIG. 8 is a partial cross-sectional structure view of the first heat dissipation assembly 32 shown in FIG. 5 along C-C in some embodiments.

[0170] In some embodiments, the first heat dissipation assembly 32 can include a first heat dissipation body 32A and a first air source 32B. The first heat dissipation body 32A can include a first top plate 321, a first bottom plate 322, a first connecting frame 323, and a first frame body 324. Exemplarily, the first top plate 321, the first bottom plate 322, and the first connecting frame 323 are schematically distinguished by dashed lines in FIGS. 7 and 8. It can be understood that the first top plate 321, the first bottom plate 322, the first connecting frame 323, and the first frame body 324 can be an integrally formed structural member. The first top plate 321, the first bottom plate 322, the first connecting frame 323, and the first frame body 324 can also be separate structural members, that is, the first top plate 321, the first bottom plate 322, the first connecting frame 323, and the first frame body 324 are independent structural members and form an integral structural member through bonding, clamping, or the like. The present application does not make strict limitations in this regard.

[0171] Exemplarily, the first top plate 321 is opposite and spaced apart from the first bottom plate 322. The first connecting frame 323 is connected between the first top plate 321 and the first bottom plate 322. At this time, the first top plate 321, the first bottom plate 322 and the first connecting frame 323 can jointly enclose the first air outlet space 3231.

[0172] Exemplarily, the first connecting frame 323 can be substantially a quadrilateral frame. The first connecting frame 323 can have a first partition 3232. The first partition 3232 can separate the first air outlet space 3231 into a first sub-air outlet space 3231a and a second sub-air outlet space 3231b. The first sub-air outlet space 3231a is spaced apart from the second sub-air outlet space 3231b. In the embodiment, the first partition 3232 of the first bottom plate 322 is conducive to increasing the structural strength of the first bottom plate 322.

[0173] Exemplarily, the first frame 324 can be protruded from a side of the first top plate 321 away from the first bottom plate 322. The first frame 324 can be substantially a quadrilateral frame, and the first frame 324 and the first top plate 321 can jointly enclose a first air inlet space 3241. The first air inlet space 3241 is opposite to the first air outlet space 3231, that is, the first air inlet space 3241 and the first air outlet space 3231 are respectively located on two opposite sides of the first top plate 321.

[0174] In some embodiments, the first heat dissipation assembly 32 can be provided with a first air inlet 326 and a first air outlet 327. The first air inlet 326 can be located on the first frame 324. The first air inlet 326 can penetrate through a side of the first frame 324, so that the first air inlet 326 can communicate with the first air inlet space 3241. Exemplarily, the first heat dissipation assembly 32 can further include a first cover plate 320. The first cover plate 320 can be fixed to the first frame 324 and cover the first air inlet space 3241. Of course, in other embodiments, the first heat dissipation assembly 32 can not include the first cover plate 320, and at this time, the first air inlet 326 can be located on a side of the first top plate 321 away from the first bottom plate 322, and the first air source 32B can be fixed to an inner side of the first connecting frame 323 and opposite to a part of the first top plate 321.

[0175] The first air outlet 327 can be located on the first connecting frame 323. The first air outlet 327 can penetrate through a side of the first connecting frame 323, so that the first air outlet 327 can communicate with the first air outlet space 3231. Exemplarily, the number of the first air outlet 327 can be two, and the two first air outlets 327 respectively communicate with the first sub-air outlet space 3231a and the second sub-air outlet space 3231b.

[0176] In some embodiments, the first air source 32B can be disposed in the first air inlet space 3241. The first air source 32B is a device for generating air flow. The first air source 32B generates air flow that can blow towards the first top plate 321.

[0177] For example, the first air source 32B can be a diaphragm. The first air source 32B can be fixed to the inner side of the first frame 324 and disposed opposite to the first top plate 321. For example, the first air source 32B can be located on the side of the first cover plate 320 facing the first top plate 321 and spaced apart from the first top plate 321. The diaphragm can generate high-frequency periodic vibration to suck air from the first air inlet 326 into the first air inlet space 3241 and drive the air flow towards the first top plate 321. In this embodiment, the structure of the first air source 32B is relatively simple and the efficiency of generating air flow is relatively high.

[0178] In some examples, the first heat dissipation assembly 32 can further include a vibration driving element (not shown). The vibration driving element can be connected to the diaphragm by adhesion or the like and can drive the diaphragm to vibrate. The vibration driving element can be a piezoelectric element, such as a piezoelectric ceramic. The piezoelectric element can generate vibration excitation based on the piezoelectric effect. The diaphragm can also be driven by other means, such as electromagnetic driving, electrostatic driving, piston driving, etc. In other examples, the diaphragm itself can be made of piezoelectric ceramic. At this time, the diaphragm can itself vibrate at high frequency to push air flow after being powered.

[0179] In other embodiments, the first air source 32B can also be a fan or other device capable of generating air flow, which is not strictly limited in the present application.

[0180] Referring again to FIG. 7, in some embodiments, the first top plate 321 can have a first surface 3211 and a second surface 3212 disposed opposite to each other. The first top plate 321 can include a plurality of first through holes 3213. Each first through hole 3213 penetrates the first top plate 321, i.e., each first through hole 3213 penetrates the first surface 3211 of the first top plate 321 and the second surface 3212 of the first top plate 321. Each first through hole 3213 communicates the first air inlet space 3241 with the first air outlet space 3231.

[0181] Exemplarily, the first through hole 3213 can have a first end and a second end. The first end of the first through hole 3213 can penetrate the first face 3211 of the first top plate 321, and the second end of the first through hole 3213 can penetrate the second face 3212 of the first top plate 321. It can be understood that, since the first through hole 3213 penetrates the first top plate 321, the first end of the first through hole 3213 penetrating the first face 3211 of the first top plate 321 can be understood as that the first end of the first through hole 3213 extends to the first face 3211 of the first top plate 321, that is, the first end of the first through hole 3213 is located at the first face 3211 of the first top plate 321. Correspondingly, the second end of the first through hole 3213 penetrating the second face 3212 of the first top plate 321 can be understood as that the second end of the first through hole 3213 can extend to the second face 3212 of the first top plate 321, that is, the second end of the first through hole 3213 is located at the second face 3212 of the first top plate 321.

[0182] Exemplarily, the first face 3211 of the first top plate 321 can be arranged opposite to the first gas source 32B. At this time, the airflow generated by the first gas source 32B can flow from the first face 3211 of the first top plate 321 to the second face 3212 of the first top plate 321 through the plurality of first through holes 3213.

[0183] In some embodiments, the first bottom plate 322 can have a first heat dissipation face 3221 and a first heat conduction face 3222 arranged oppositely. The first heat dissipation face 3221 can be located in the first air outlet space 3231. The first heat dissipation face 3221 can be arranged opposite to the first through hole 3213 of the first top plate 321. At this time, the first end of the first through hole 3213 can be away from the first bottom plate 322, and the second end of the first through hole 3213 can be toward the first bottom plate 322. In this way, the airflow generated by the first gas source 32B blows toward the first top plate 321, and the airflow flows through the plurality of first through holes 3213 and flows to the first heat dissipation face 3221 of the first bottom plate 322, so that the airflow can take away the heat on the first bottom plate 322.

[0184] It can be understood that the gas in the first air outlet space 3231 has a large amount of heat after dissipating heat to the first bottom plate 322, and if the gas cannot be dissipated, the heat dissipation rate of the first heat dissipation assembly 32 will be affected. In the present embodiment, the first air outlet 327 is arranged, so that the hot air inside the first air outlet space 3231 can flow out of the first air outlet space 3231 through the first air outlet 327, thereby facilitating the improvement of the heat dissipation rate of the first heat dissipation assembly 32.

[0185] It can be understood that the gas flows out from the first air outlet 327 after flowing through the first bottom plate 322, and at this time, the gas flow carries a large amount of heat. In some embodiments of the present application, the first air inlet 326 can penetrate the first frame 324 in a first direction, and the first air outlet 327 can penetrate the first connecting frame 323 in a second direction. Wherein, the first direction is different from the second direction. For example, the first air inlet 326 can penetrate the first frame 324 in the Z-axis direction, and the first air outlet 327 can penetrate the first connecting frame 323 in the X-axis direction, so that the air flowing out of the first air outlet 327 can be away from the first air inlet 326, so that the air with heat flowing out of the first air outlet 327 will not be reabsorbed into the first air inlet 326, affecting the heat dissipation effect of the heat dissipation device 30.

[0186] In other embodiments, the first air inlet 326 can penetrate the first frame 324 on the side of the negative direction of the X-axis, and the first air outlet 327 can penetrate the first connecting frame 323 on the side of the positive direction of the X-axis, which can also make the air flowing out of the first air outlet 327 can be away from the first air inlet 326, so that the air with heat flowing out of the first air outlet 327 will not be reabsorbed into the first air inlet 326, affecting the heat dissipation effect of the heat dissipation device 30.

[0187] In some embodiments, the thermal conductivity of the first bottom plate 322 is greater than or equal to 0.21 W / m·K. In this way, the first bottom plate 322 has a faster heat conduction rate, so as to improve the heat dissipation efficiency of the heat dissipation device 30, so as to realize the rapid cooling of the heat source of the electronic equipment 100. Exemplarily, the material of the first bottom plate 322 can be graphite, and can also be a high-thermal-conductivity metal, such as copper, silver, aluminum, etc. It can be understood that the material of the first bottom plate 322 can also be other materials with a thermal conductivity greater than or equal to 0.21 W / m·K, which is not strictly limited in the present application.

[0188] In some embodiments, the aperture of each first through hole 3213 can be less than or equal to 1 mm. It can be understood that the apertures of the plurality of first through holes 3213 can be the same or different, which is not strictly limited in the present application.

[0189] In the present embodiment, by setting the small aperture of the first through hole 3213, the flow area decreases and the flow rate increases when the gas flow passes through the first through hole 3213, so that the gas flow forms a jet with a fast flow rate after passing through the first through hole 3213. The jet blowing to the first bottom plate 322 can quickly take away the heat on the first bottom plate 322, so that the jet formed by the gas flow after passing through the first through hole 3213 can quickly dissipate heat for the heat conduction member 31, so that the heat dissipation efficiency of the heat dissipation device 30 and the electronic equipment 100 is higher.

[0190] And, since the heat dissipation amount of the heat dissipation device is positively correlated with the convective heat transfer coefficient and the heat dissipation area, under the premise of a certain heat dissipation amount, improving the convective heat transfer coefficient can reduce the heat dissipation area of the heat dissipation device. The first through hole 3213 has a small hole diameter, so that the flow rate of the gas flowing through the first through hole 3213 increases, which is conducive to improving the convective heat transfer coefficient, so that the heat dissipation area of the heat dissipation device 30 can be reduced under the condition of the same heat dissipation amount, which is conducive to reducing the volume of the heat dissipation device 30, thereby facilitating the reduction of the occupied space of the heat dissipation device 30 in the electronic device 100.

[0191] Referring to FIG. 9, FIG. 9 is a schematic diagram of a partial cross-sectional structure of the first top plate 321 in another embodiment. For example, FIG. 9 mainly shows various structures of the first through hole 3213 of the first top plate 321. It can be understood that when the first through hole 3213 in the first top plate 321 is arranged, the size and shape of the first through hole 3213 can be various.

[0192] In some embodiments, as shown in (a) of FIG. 9, the first through hole 3213 can be a straight hole. That is, from the first end of the first through hole 3213 to the second end of the first through hole 3213, the cross section of the first through hole 3213 does not change. Alternatively, in another embodiment, as shown in (b) of FIG. 9, the first through hole 3213 can be a stepped hole. That is, from the first end of the first through hole 3213 to the second end of the first through hole 3213, the first through hole 3213 is divided into two sections with different cross sections. Among them, the cross section close to the first end of the first through hole 3213 can be larger, and the cross section close to the second end of the first through hole 3213 can be smaller. Alternatively, in another embodiment, as shown in (c) of FIG. 9, the first through hole 3213 can be a chamfered stepped hole. That is, from the first end of the first through hole 3213 to the second end of the first through hole 3213, the first through hole 3213 is divided into two sections with different cross sections. Among them, the cross section close to the first end of the first through hole 3213 can be larger, and the cross section close to the second end of the first through hole 3213 can be smaller. And, the transition between the two sections is achieved by chamfering. Alternatively, in another embodiment, as shown in (d) of FIG. 9, the first through hole 3213 can be a tapered hole. That is, from the first end of the first through hole 3213 to the second end of the first through hole 3213, the cross section of the first through hole 3213 linearly decreases. Alternatively, in another embodiment, as shown in (e) of FIG. 9, from the first end of the first through hole 3213 to the second end of the first through hole 3213, the cross section of the first through hole 3213 linearly decreases in the form of a gradient line.

[0193] It can be understood that in the example shown in FIG. 9, the cross-sectional area of the first end of the first through hole 3213 is greater than the cross-sectional area of the second end of the first through hole 3213, so that when air flows into the first through hole 3213 from the first end and is discharged from the second end, the flow speed of the air is significantly improved, thereby improving the heat dissipation performance of the first heat dissipation assembly 32.

[0194] Of course, in other embodiments, the cross section of the first through hole 3213 can also change in other ways from the first end of the first through hole 3213 to the second end of the first through hole 3213, which will not be repeated here. In addition, in the direction perpendicular to the extension direction of the first through hole 3213, the cross-sectional shape of the first through hole 3213 can be circular, oval, polygonal, or other irregular shapes. In actual application, the cross-sectional shape of the first through hole 3213 can be reasonably set according to actual needs, which will not be repeated here.

[0195] It can be understood that in the embodiments of the present application, the position layout of the first through hole 3213 can also be various. In some examples, a plurality of first through holes 3213 can be arranged equidistantly, and the diameter of each first through hole 3213 is substantially the same. Alternatively, in other examples, a plurality of first through holes 3213 can be arranged in a longitudinal and transverse staggered manner, and the diameter of each first through hole 3213 is substantially the same. Alternatively, in other examples, a plurality of first through holes 3213 can be arranged in a mixed manner. Among them, among the plurality of first through holes 3213, there can be two first through holes 3213 with different diameters.

[0196] It can be understood that the above examples are only exemplary descriptions of the arrangement of the first through hole 3213. In other examples, the diameter, number, and position arrangement of the first through hole 3213 can be reasonably selected and adjusted according to actual needs, and the present application does not make strict limitations thereto.

[0197] Please refer to FIG. 10A and FIG. 10B, FIG. 10A is a partial cross-sectional structure schematic diagram of the second heat dissipation assembly 33 shown in FIG. 5 along D1-D1 in some embodiments, and FIG. 10B is a partial cross-sectional structure schematic diagram of the second heat dissipation assembly 33 shown in FIG. 5 along D2-D2 in some embodiments.

[0198] In some embodiments, the second heat dissipation assembly 33 can include a second heat dissipation body 33A and a second air source 33B. The second heat dissipation body 33A can include a second top plate 331, a second bottom plate 332, a second connecting frame 333, and a second frame 334. In examples, the second top plate 331, the second bottom plate 332, and the second connecting frame 333 are schematically distinguished by dashed lines in FIGS. 10A and 10B. It can be understood that the second top plate 331, the second bottom plate 332, the second connecting frame 333, and the second frame 334 can be an integrally formed structural member. Alternatively, the second top plate 331, the second bottom plate 332, the second connecting frame 333, and the second frame 334 can be separate structural members that are bonded, clamped, or otherwise formed into an integral structural member. The present application does not strictly limit the same.

[0199] In examples, the second top plate 331 is opposite and spaced apart from the second bottom plate 332. The second connecting frame 333 is connected between the second top plate 331 and the second bottom plate 332. In this case, the second top plate 331, the second bottom plate 332, and the second connecting frame 333 can collectively enclose a second air outlet space 3331.

[0200] In examples, the second connecting frame 333 can be substantially a quadrilateral frame. The second connecting frame 333 can have a second partition 3332. The second partition 3332 of the second connecting frame 333 can divide the second air outlet space 3331 into a third sub-air outlet space 3331a and a fourth sub-air outlet space 3331b. The third sub-air outlet space 3331a and the fourth sub-air outlet space 3331b are spaced apart. In the present embodiment, the second partition 3332 of the second bottom plate 332 is beneficial to increase the structural strength of the second bottom plate 332.

[0201] In examples, the second frame 334 can be substantially a quadrilateral frame. The second frame 334 can be protruded from a side of the second top plate 331 away from the second bottom plate 332. The second frame 334 and the second top plate 331 can collectively enclose a second air inlet space 3341. The second air inlet space 3341 is opposite the second air outlet space 3331, i.e., the second air inlet space 3341 and the second air outlet space 3331 are located on opposite sides of the second top plate 331.

[0202] In some embodiments, the second heat dissipation assembly 33 can be provided with a second air inlet 336 and a second air outlet 337. The second air inlet 336 can be located on the second frame 334. The second air inlet 336 can penetrate through a side of the second frame 334, so that the second air inlet 336 can communicate with the second air inlet space 3341.

[0203] The second heat dissipation assembly 33 can further include a second cover plate 330. The second cover plate 330 can be fixed to the second frame 334 and cover the second air inlet space 3341. Of course, in other embodiments, the second heat dissipation assembly 33 can not include the second cover plate 330, and the second air inlet 336 can be located on the side of the second top plate 331 away from the second bottom plate 332, and the second air source 33B can be fixed to the inner side of the second connecting frame 333 and arranged opposite to part of the second top plate 331.

[0204] The second air outlet 337 can be located on the second connecting frame 333. The second air outlet 337 can penetrate through one side of the second connecting frame 333, so that the second air outlet 337 can communicate with the second air outlet space 3331. For example, the number of the second air outlet 337 can be two, and the two second air outlets 337 respectively communicate with the third sub-air outlet space 3331a and the fourth sub-air outlet space 3331b.

[0205] In some embodiments, the second air source 33B can be arranged in the second air inlet space 3341. The second air source 33B is a device for generating air flow. The air flow generated by the second air source 33B can blow towards the second top plate 331.

[0206] For example, the second air source 33B can be a diaphragm. The second air source 33B can be fixed to the inner side of the second frame 334 and arranged opposite to the second top plate 331. For example, the second air source 33B can be located on the side of the second cover plate 330 facing the second top plate 331 and arranged spaced apart from the second top plate 331. The diaphragm can generate high-frequency periodic vibration to suck air from the second air inlet 336 into the second air inlet space 3341 and drive the air flow towards the second top plate 331. At this time, the second air source 33B can be located on the side of the second air inlet 336 away from the second top plate 331. The second air source 33B can suck air from the second air inlet 336 by periodic vibration and drive the air flow towards the second top plate 331. In this embodiment, the structure of the second air source 33B is relatively simple, and the efficiency of generating air flow is relatively high.

[0207] In other embodiments, the second air source 33B can also be a fan or other device capable of generating air flow, which is not strictly limited in the present application.

[0208] Please refer to FIG. 10A again, in some embodiments, the second top plate 331 can have a first surface 3311 and a second surface 3312 arranged oppositely. The second top plate 331 can include a plurality of second through holes 3313. Each of the second through holes 3313 penetrates the first surface 3311 of the second top plate 331 and the second surface 3312 of the second top plate 331. Each of the second through holes 3313 communicates the second air inlet space 3341 with the second air outlet space 3331.

[0209] For example, the first surface 3311 of the second top plate 331 can be arranged opposite to the second air source 33B. In this case, the air flow generated by the second air source 33B can flow from the first surface 3311 of the second top plate 331 to the second surface 3312 of the second top plate 331 through the plurality of second through holes 3313.

[0210] In some embodiments, the second bottom plate 332 can have a second heat dissipation surface 3321 and a second heat conduction surface 3322 arranged oppositely. The second heat dissipation surface 3321 can be located in the second air outlet space 3331. The second heat dissipation surface 3321 can be arranged facing the second through holes 3313 of the second top plate 331. In this case, the first end of the second through holes 3313 can be away from the second bottom plate 332, and the second end of the second through holes 3313 can be toward the second bottom plate 332. In this way, the air flow generated by the second air source 33B blows toward the second top plate 331, and the air flow flows through the plurality of second through holes 3313 and flows toward the second heat dissipation surface 3321 of the second bottom plate 332, so that the air flow can carry away the heat on the second bottom plate 332.

[0211] It can be understood that the gas in the second air outlet space 3331 has a large amount of heat after dissipating the heat of the second bottom plate 332, and if the gas cannot be dissipated, it will affect the heat dissipation rate of the second heat dissipation assembly 33. In the present embodiment, by arranging the second air outlet 337, the air with heat inside the second air outlet space 3331 can flow out of the second air outlet space 3331 through the second air outlet 337, thereby facilitating to improve the heat dissipation rate of the second heat dissipation assembly 33.

[0212] It can be understood that the gas flows out from the second air outlet 337 after flowing through the second bottom plate 332, and at this time, the gas flow carries a large amount of heat. In some embodiments of the present application, the second air inlet 336 can penetrate the second frame body 334 in a first direction, and the second air outlet 337 can penetrate the second connecting frame 333 in a second direction. Wherein, the first direction is different from the second direction. For example, the second air inlet 336 can penetrate the second frame body 334 in the Z-axis direction, and the second air outlet 337 can penetrate the second connecting frame 333 in the X-axis direction, so that the air flowing out of the second air outlet 337 can be away from the second air inlet 336, so that the air with heat flowing out of the second air outlet 337 will not be reabsorbed into the second air inlet 336, affecting the heat dissipation effect of the heat dissipation device 30.

[0213] In other embodiments, the second air inlet 336 can penetrate the second frame body 334 on the side of the negative direction of the X-axis, and the second air outlet 337 can penetrate the second connecting frame 333 on the side of the positive direction of the X-axis, which can also make the air flowing out of the first air outlet 327 can be away from the first air inlet 326, so that the air with heat flowing out of the first air outlet 327 will not be reabsorbed into the first air inlet 326, affecting the heat dissipation effect of the heat dissipation device 30.

[0214] In some embodiments, the thermal conductivity of the second bottom plate 332 is greater than or equal to 0.21 W / m·K. In this way, the second bottom plate 332 has a faster heat conduction rate, so as to improve the heat dissipation efficiency of the heat dissipation device 30, so as to realize the rapid cooling of the heat source of the electronic equipment 100. Exemplarily, the material of the second bottom plate 332 can be graphite, and can also be a high-thermal-conductivity metal, such as copper, silver, aluminum, etc. It can be understood that the material of the second bottom plate 332 can also be other materials with a thermal conductivity greater than or equal to 0.21 W / m·K, which is not strictly limited in the present application.

[0215] In some embodiments, the aperture of each second through hole 3313 can be less than or equal to 1 mm. It can be understood that the apertures of the plurality of second through holes 3313 can be the same or different, which is not strictly limited in the present application.

[0216] In the present embodiment, by setting the small aperture of the second through hole 3313, the flow area decreases and the flow rate increases when the gas flow passes through the second through hole 3313, so that the gas flow forms an air jet with a fast flow rate after passing through the second through hole 3313. The jet blowing to the second bottom plate 332 can quickly take away the heat on the second bottom plate 332, so that the jet formed by the gas flow after passing through the second through hole 3313 can quickly dissipate heat from the heat conduction member 31, so that the heat dissipation device 30 and the electronic equipment 100 have high heat dissipation efficiency.

[0217] And, since the heat dissipation amount of the heat dissipation device is positively correlated with the convective heat transfer coefficient and the heat dissipation area, under the premise of a certain heat dissipation amount, increasing the convective heat transfer coefficient can reduce the heat dissipation area of the heat dissipation device. The second through hole 3313 has a small hole diameter in the embodiment, so that the flow rate of the gas flowing through the second through hole 3313 is increased, which is conducive to increasing the convective heat transfer coefficient, so that the heat dissipation area of the heat dissipation device 30 can be reduced under the condition of the same heat dissipation amount, which is conducive to reducing the volume of the heat dissipation device 30, thereby facilitating the reduction of the occupied space of the heat dissipation device 30 in the electronic device 100.

[0218] It can be understood that the size, number, and position arrangement of the second through hole 3313 can refer to the related description of the first through hole 3213 above, which will not be repeated here. The size, number, and position arrangement of the second through hole 3313 can also be reasonably selected and adjusted according to actual needs, and the application does not make strict limitations on this.

[0219] It can be understood that the structure of the second heat dissipation component 33 and the structure of the first heat dissipation component 32 can be the same or similar structure, symmetric or partially symmetric structure, or different structure. In the embodiment, the structure of the second heat dissipation component 33 and the structure of the first heat dissipation component 32 are the same structure; the basic design of the component structure of the second heat dissipation component 33, the connection relationship design between the components, and the connection relationship design of the components and other structures outside the component can refer to the related schemes of the first heat dissipation component 32. At the same time, the second heat dissipation component 33 and the first heat dissipation component 32 are allowed to be slightly different in the detailed structure or position arrangement of the components. Details will not be repeated here.

[0220] Please refer to FIG. 11 and FIG. 12, FIG. 11 is a partial structure schematic diagram of the heat dissipation device 30 in some embodiments shown in FIG. 4, and FIG. 12 is a partial cross-sectional structure schematic diagram of the heat dissipation device 30 shown in FIG. 11 along E1-E1. For example, FIG. 11 shows the assembly structure schematic diagram between the heat conduction piece 31, the first heat dissipation component 32, and the second heat dissipation component 33 of the heat dissipation device 30. In FIG. 11 and FIG. 12, the first bottom plate 322 and the second bottom plate 332 are schematically divided by dashed lines.

[0221] In some embodiments, the first heat dissipation component 32 can be fixed to the first part 311 of the heat conduction piece 31. For example, the first heat conduction surface 3222 of the first bottom plate 322 can be fixed to the first part 311 of the heat conduction piece 31, so that the heat on the heat conduction piece 31 can be conducted to the first bottom plate 322. For example, the first heat conduction surface 3222 can be fixed to the heat conduction piece 31 by gluing or the like. At this time, the first heat dissipation surface 3221 of the first bottom plate 322 can be arranged away from the first part 311 of the heat conduction piece 31.

[0222] In some embodiments, the second heat dissipation component 33 can be fixed to the third portion 313 of the heat conducting member 31. For example, the second heat conducting surface 3322 of the second bottom plate 332 can be fixed to the third portion 313 of the heat conducting member 31, so that the heat on the heat conducting member 31 can be conducted to the second bottom plate 332. For example, the second heat conducting surface 3322 can be fixed to the heat conducting member 31 by means of gluing or the like. At this time, the second heat dissipation surface 3321 of the second bottom plate 332 can be arranged to face away from the third portion 313 of the heat conducting member 31.

[0223] For example, the first heat dissipation component 32 can be arranged on the side of the first portion 311 facing away from the mounting space 310, i.e. the first heat dissipation component 32 can be arranged on the side of the first portion 311 facing away from the third portion 313. The second heat dissipation component 33 can be arranged in the mounting space 310 of the heat conducting member 31, i.e. the second heat dissipation component 33 can be arranged on the side of the third portion 313 facing the first portion 311. In the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the first portion 311 of the heat conducting member 31 can be arranged between the first heat dissipation component 32 and the second heat dissipation component 33. Here, the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33 is the Z-axis direction.

[0224] For example, in the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the projection of the first heat dissipation component 32 on the heat conducting member 31 and the projection of the second heat dissipation component 33 on the heat conducting member 31 have an overlapping region, i.e. in the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the projection of the first heat dissipation component 32 and the projection of the second heat dissipation component 33 at least partially overlap. It can be understood that the projection of the first heat dissipation component 32 and the projection of the second heat dissipation component 33 can completely overlap or partially overlap.

[0225] In the present embodiment, the first heat dissipation component 32 can dissipate heat from the first portion 311 of the heat conducting member 31, and the second heat dissipation component 33 can dissipate heat from the third portion 313 of the heat conducting member 31, i.e. both the first heat dissipation component 32 and the second heat dissipation component 33 can dissipate heat from the heat conducting member 31. Moreover, the first heat dissipation component 32 and the second heat dissipation component 33 in the present embodiment are used to generate airflow, and the airflow is used to dissipate heat from the heat conducting member 31. Compared with the natural heat dissipation scheme, the heat dissipation efficiency of the heat dissipation device 30 in the present embodiment is higher.

[0226] In addition, the first heat dissipation component 32 and the second heat dissipation component 33 can be stacked, for example, in the Z-axis direction. In this way, in the Z-axis direction, the total projection area of the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conduction member 31 is small. Compared with the scheme in which the first heat dissipation component 32 and the second heat dissipation component 33 are arranged on the same plane (for example, a plane perpendicular to the Z-axis direction, that is, the X-Y plane), the first heat dissipation component 32 and the second heat dissipation component 33 in the embodiment have small space occupation in the direction perpendicular to the stacking direction, which is conducive to reducing the size of the heat dissipation device 30 in the direction perpendicular to the stacking direction of the first heat dissipation component 32 and the second heat dissipation component 33, that is, conducive to reducing the size of the heat dissipation device 30 in the X-Y plane. It can be understood that the heat dissipation device 30 in the embodiment of the present application can reduce the total projection area of the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conduction member 31 while improving the heat dissipation efficiency of the heat dissipation device 30.

[0227] In other embodiments, the first heat dissipation component 32 can also be fixed to the side of the first part 311 away from the third part 313, and the second heat dissipation component 33 can be fixed to the side of the third part 313 away from the first part 311. That is, the first heat dissipation component 32 can also be fixed to the side of the first part 311 away from the mounting space 310, and the second heat dissipation component 33 can be fixed to the side of the third part 313 away from the mounting space 310.

[0228] In other embodiments, the first heat dissipation component 32 can also be fixed to the side of the first part 311 facing the third part 313, and the second heat dissipation component 33 can be fixed to the side of the third part 313 facing the first part 311. That is, the first heat dissipation component 32 and the second heat dissipation component 33 can both be located in the mounting space 310 of the heat conduction member 31.

[0229] In other embodiments, the first heat dissipation component 32 can also be fixed to the side of the first part 311 facing the third part 313, that is, the first heat dissipation component 32 can be located in the mounting space 310 of the heat conduction member 31. The second heat dissipation component 33 can be fixed to the side of the third part 313 away from the first part 311.

[0230] In other embodiments, the first heat dissipation component 32 can be fixed to the second part 312 of the heat conduction member 31 and located in the mounting space 310. The second heat dissipation component 33 can be fixed to the side of the third part 313 facing the first part 311. At this time, the second heat dissipation component 33 can be located in the mounting space 310.

[0231] In other embodiments, the first heat dissipation component 32 can be fixed to the second part 312 of the heat conduction member 31 and located in the mounting space 310. The second heat dissipation component 33 can be fixed to the side of the third part 313 away from the first part 311.

[0232] In some other embodiments, the first heat dissipation component 32 can be fixed to the second portion 312 of the heat conducting member 31 on the side facing away from the mounting space 310. The second heat dissipation component 33 can be fixed to the third portion 313 on the side facing the first portion 311. In this case, the second heat dissipation component 33 can be located on the side of the third portion 313 facing away from the mounting space 310.

[0233] In some other embodiments, the first heat dissipation component 32 can be fixed to the second portion 312 of the heat conducting member 31 on the side facing away from the mounting space 310. The second heat dissipation component 33 can be fixed to the third portion 313 on the side facing away from the first portion 311. In this case, the second heat dissipation component 33 can be located on the side of the third portion 313 facing away from the mounting space 310.

[0234] It can be understood that the relative position relationship between the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conducting member 31 can be adjusted according to specific requirements. The heat dissipation device 30 has a wide range of applications.

[0235] Please refer to FIG. 13A and FIG. 13B. FIG. 13A is a structural schematic diagram of the shell 34 shown in FIG. 5 in some embodiments, and FIG. 13B is a structural schematic diagram of the shell 34 shown in FIG. 13A from another angle.

[0236] In some embodiments, the shell 34 can be a substantially quadrilateral housing. The shell 34 can have a bottom wall 341 and a peripheral side wall 342 connected to the periphery of the bottom wall 341. In this case, the bottom wall 341 and the peripheral side wall 342 of the shell 34 can jointly enclose an internal space of the shell 34. The bottom wall 341 of the shell 34 can have a third through hole 3411. The third through hole 3411 can communicate the internal space of the shell 34 and the outside.

[0237] For example, the shell 34 can further have a partition plate 343. The partition plate 343 can be connected to the bottom wall 341 and the peripheral side wall 342, and separate the internal space of the shell 34 into a first space 301 and a second space 302. That is, the partition plate 343 can be located between the first space 301 and the second space 302. Both the first space 301 and the second space 302 can communicate the outside of the heat dissipation device 30. Among them, the first space 301 further communicates the third through hole 3411 of the bottom wall 341.

[0238] For example, the partition plate 343 can be provided with a communication hole 3431. The communication hole 3431 penetrates the partition plate 343 and communicates the first space 301 and the second space 302.

[0239] The housing 34 can further include a first connecting member 344. The first connecting member 344 can be connected to the inner wall of the communication hole 3431 and divide the communication hole 3431 into a first sub-communication hole 3431a and a second sub-communication hole 3431b. The first sub-communication hole 3431a and the second sub-communication hole 3431b can be arranged in parallel.

[0240] The first sub-communication hole 3431a and the second sub-communication hole 3431b can be arranged in parallel to the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, i.e., the first sub-communication hole 3431a and the second sub-communication hole 3431b can also be arranged along the Z-axis direction. The second sub-communication hole 3431b can be in communication with the third communication hole 3411 of the housing 34.

[0241] It can be understood that in the embodiment, the bottom wall 341, the peripheral side wall 342 and the partition plate 343 of the housing 34 can be an integrally formed structure. In other embodiments, the bottom wall 341, the peripheral side wall 342 and the partition plate 343 of the housing 34 can also be formed into an integral whole by bonding, clamping or the like. The application does not strictly limit the structure of the housing 34.

[0242] It can be understood that in other embodiments of the application, the structure of the housing 34 can also be different from that of the housing 34 shown in FIGS. 13A and 13B, and the application does not strictly limit the structure of the housing 34.

[0243] Please refer to FIGS. 14 and 15. FIG. 14 is a partial cross-sectional structure schematic view of the heat dissipation device 30 along E1-E1 in some embodiments shown in FIG. 4, and FIG. 15 is a partial cross-sectional structure schematic view of the heat dissipation device 30 along E2-E2 in some embodiments shown in FIG. 4. FIGS. 14 and 15 show the assembly structure schematic view between the heat conduction member 31, the first heat dissipation component 32, the second heat dissipation component 33 and the housing 34. In FIG. 14, the first top plate 321, the first bottom plate 322 and the first connecting frame 323 are schematically distinguished by dashed lines. In FIG. 14, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 are schematically distinguished by dashed lines.

[0244] In some embodiments, the heat-conducting member 31, the first heat-dissipating component 32 and the second heat-dissipating component 33 can all be located in the inner space of the shell 34. In this way, on the one hand, the shell 34 can protect the heat-conducting member 31, the first heat-dissipating component 32 and the second heat-dissipating component 33; on the other hand, the heat-conducting member 31, the first heat-dissipating component 32 and the second heat-dissipating component 33 can be assembled to the shell 34 first, and then the shell 34 is used for subsequent assembly, so that the integrity of the heat-dissipating device 30 is better, and the subsequent assembly of the heat-dissipating device 30 is facilitated. For example, the first heat-dissipating component 32 can be located on the side of the second heat-dissipating component 33 away from the bottom wall 341 of the shell 34.

[0245] For example, the heat-conducting member 31 can be fixedly connected to the shell 34. The heat-conducting member 31 can be located at least partially in the first space 301 of the shell 34, and part of the heat-conducting member 31 can be exposed relative to the third through hole 3411. It can be understood that the part of the heat-conducting member 31 exposed relative to the third through hole 3411 can be used to be attached to the heat source of the electronic device 100, and the heat of the heat source of the electronic device 100 can be conducted to the heat-conducting member 31.

[0246] For example, the second part 312 and the third part 313 of the heat-conducting member 31 can be connected to the inner wall of the third through hole 3411. At this time, the third part 313 of the heat-conducting member 31 can be exposed relative to the third through hole 3411.

[0247] In some embodiments, the heat-conducting member 31 can seal the third through hole 3411 of the shell 34. For example, the second part 312 and the third part 313 of the heat-conducting member 31 can be sealingly connected to the inner wall of the third through hole 3411. In this way, air, dust and the like cannot enter the first space 301 through the third through hole 3411. At the same time, the gas in the first space 301 cannot flow out of the first space 301 through the third through hole 3411.

[0248] For example, part of the heat-conducting member 31 can be located in the first space 301. For example, the first part 311 of the heat-conducting member 31 can be located in the first space 301. The end of the first part 311 of the heat-conducting member 31 away from the second part 312 can be located in the first sub-communication hole 3431a of the shell 34 and connected to the inner wall of the first sub-communication hole 3431a.

[0249] In other embodiments, the heat-conducting member 31 can also be located entirely in the first space 301. At this time, the third part 313 of the heat-conducting member 31 can be exposed relative to the third through hole 3411.

[0250] In some embodiments, the first heat-dissipating component 32 is located at least partially in the first space 301 of the shell 34. It can be understood that the first heat-dissipating component 32 can be partially located in the first space 301. The first heat-dissipating component 32 can also be located entirely in the first space 301.

[0251] For example, a part of the first heat dissipation component 32 can be located in the first space 301 of the shell 34, and a part can be located in the partition plate 343 of the shell 34. At this time, the first air inlet 326 of the first heat dissipation component 32 can be located in the first space 301. The first air inlet 326 can be in communication with the first space 301. The first air outlet 327 of the first heat dissipation component 32 can be towards the second space 302 and in communication with the second space 302.

[0252] For example, the first part 311 of the heat conduction member 31, the part of the first top plate 321 of the first heat dissipation component 32, the part of the first bottom plate 322, and the part of the first connecting frame 323 can be located in the first sub-communication hole 3431a of the partition plate 343 and in sealing connection with the inner wall of the first sub-communication hole 3431a. It can be understood that the first part 311 of the heat conduction member 31 can be in sealing connection with the first connecting member 344 and the partition plate 343. The first top plate 321, the first bottom plate 322, and the first connecting frame 323 can be in sealing connection with the partition plate 343. In this way, the gap between the first part 311 of the heat conduction member 31, the first top plate 321, the first bottom plate 322, and the first connecting frame 323 and the inner wall of the first sub-communication hole 3431a can be sealed, so that on the one hand, the gas in the first space 301 can be prevented from flowing to the second space 302 through the above-mentioned gap without passing through the heat dissipation device 30, thereby reducing the heat dissipation efficiency; on the other hand, the gas with a higher temperature in the second space 302 can be prevented from flowing back to the first space 301 through the above-mentioned gap, thereby reducing the heat dissipation efficiency.

[0253] For example, the approximate flow direction of the gas in the process of heat dissipation of the heat dissipation device 30 is shown by the dashed arrow in FIG. 14. In this embodiment, the gas in the first space 301 can flow into the first air inlet space 3241 through the first air inlet 326, then the gas can flow to the first air outlet space 3231 through the first through hole 3213, and finally the gas can flow to the second space 302 through the second air outlet 337. It can be understood that when the gas flows through the first air outlet space 3231, the heat on the first bottom plate 322 can be dissipated.

[0254] In some embodiments, the second heat dissipation component 33 is at least partially located in the first space 301. It can be understood that the second heat dissipation component 33 can be partially located in the first space 301. The second heat dissipation component 33 can also be entirely located in the first space 301.

[0255] For example, a portion of the second heat dissipation component 33 can be located in the first space 301 of the shell 34, and a portion can be located in the partition plate 343 of the shell 34. At this time, the second air inlet 336 of the second heat dissipation component 33 can be located in the first space 301. The second air inlet 336 can be in communication with the first space 301. The second air outlet 337 of the second heat dissipation component 33 faces the second space 302 and is in communication with the second space 302.

[0256] For example, a portion of the second top plate 331, a portion of the second bottom plate 332, and a portion of the second connecting frame 333 of the second heat dissipation component 33 can be located in the second sub-communication hole 3431b of the partition plate 343 and be sealingly connected to the inner wall of the second sub-communication hole 3431b. It can be understood that the second top plate 331 can be sealingly connected to the first connecting piece 344 and the partition plate 343. The first bottom plate 322 and the first connecting frame 323 can be sealingly connected to the partition plate 343. In this way, the gap between the second top plate 331, the second bottom plate 332, and the second connecting frame 333 and the inner wall of the second sub-communication hole 3431b can be sealed, so that on the one hand, the gas in the first space 301 can be prevented from flowing to the second space 302 through the above-mentioned gap without passing through the heat dissipation device 30, thereby reducing the heat dissipation efficiency; on the other hand, the gas with a higher temperature in the second space 302 can be prevented from flowing back to the first space 301 through the above-mentioned gap, thereby reducing the heat dissipation efficiency.

[0257] For example, the approximate flow direction of the gas during the heat dissipation process of the heat dissipation device 30 is shown by the dashed arrows in FIG. 14. In this embodiment, the gas in the first space 301 can flow to the second air inlet space 3341 through the second air inlet 336, then flow to the second air outlet space 3331 through the second through hole 3313, and finally flow to the second space 302 through the second air outlet 337. It can be understood that when the gas flows through the second air outlet space 3331, the heat on the second bottom plate 332 can be dissipated.

[0258] In some embodiments, a portion of the second bottom plate 332 of the second heat dissipation component 33 can be located in the third through hole 3411 and connected to the inner wall of the third through hole 3411. For example, the second bottom plate 332 can be sealingly connected to the inner wall of the third through hole 3411. In this way, the second bottom plate 332 can separate the first space 301 and the third through hole 3411, so that dust, gas, and the like outside the shell 34 can be prevented from entering the internal space of the shell 34 from the third through hole 3411.

[0259] In some embodiments, the heat dissipation device 30 can further include a second connecting member 345. The second connecting member 345 can be connected between the first portion 311 of the heat conducting member 31 and the second connecting frame 333 of the second heat dissipation assembly 33, so as to improve the connection stability of the second heat dissipation assembly 33 and the heat conducting member 31. Moreover, by connecting the second heat dissipation assembly 33 and the heat conducting member 31 through the second connecting member 345, the integrity of the heat dissipation device 30 can be improved.

[0260] Referring to FIG. 16, FIG. 16 is a schematic diagram of a partial cross-sectional structure of the heat dissipation device 30 shown in FIG. 4 in some embodiments. It can be understood that the heat dissipation device 30 shown in FIG. 16 only shows a partial structure of the heat dissipation device 30. The heat dissipation device 30 shown in FIG. 16 can include most of the technical contents of the foregoing embodiments, and the following mainly describes the differences between the two, and the most of the same scheme contents of the two will not be described herein again.

[0261] The heat dissipation device 30 of the present embodiment has substantially the same structure as the heat dissipation device 30 shown in FIG. 14, except that:

[0262] In the present embodiment, the first heat dissipation assembly 32 and the second heat dissipation assembly 33 can be located in the first space 301 of the housing 34.

[0263] For example, the first portion 311 of the heat conducting member 31, the first top plate 321, the first bottom plate 322 and the first connecting frame 323 of the first heat dissipation assembly 32 can be sealingly connected to the partition plate 343 of the housing 34. The first gas outlet 327 of the first heat dissipation assembly 32 can be directed to the first sub-communication hole 3431a of the partition plate 343, and can be communicated with the second space 302 through the first sub-communication hole 3431a, so that the gas flowing out of the first gas outlet 327 can flow into the second space 302 through the first sub-communication hole 3431a. Moreover, the gases in the first space 301 and the second space 302 can be prevented from flowing into each other through the gap between the first portion 311 of the heat conducting member 31, the first top plate 321, the first bottom plate 322 and the first connecting frame 323 of the first heat dissipation assembly 32 and the partition plate 343, so as to avoid reducing the heat dissipation efficiency. In FIG. 16, the first top plate 321, the first bottom plate 322 and the first connecting frame 323 are schematically distinguished by dashed lines.

[0264] For example, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 of the second heat dissipation assembly 33 can be sealingly connected to the partition plate 343 of the shell 34. The second air outlet 337 of the second heat dissipation assembly 33 can be directed to the second sub-communication hole 3431b of the partition plate 343 and can be in communication with the second space 302 through the second sub-communication hole 3431b, so that the gas flowing out of the second air outlet 337 can flow into the second space 302 through the second sub-communication hole 3431b. In addition, the gas in the first space 301 and the second space 302 can be prevented from flowing into each other through the gap between the second top plate 331, the second bottom plate 332, the second connecting frame 333 and the partition plate 343. In FIG. 16, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 are schematically distinguished by dashed lines.

[0265] Referring to FIG. 17, FIG. 17 is a schematic diagram of part of the structure of the heat dissipation device 30 in another embodiment. It can be understood that the heat dissipation device 30 shown in FIG. 17 only shows part of the structure of the heat dissipation device 30. The heat dissipation device 30 shown in FIG. 17 can include most of the technical content of the previous embodiments, and the differences between the two will be mainly described below. Most of the scheme content of the two is not repeated here.

[0266] The structure of the heat dissipation device 30 of the present embodiment is substantially the same as that of the heat dissipation device 30 shown in FIG. 11, and the difference is that:

[0267] In the present embodiment, the number of the second heat dissipation assemblies 33 can be multiple. The multiple second heat dissipation assemblies 33 can be arranged on the same plane (a plane perpendicular to the Z-axis direction), for example, the arrangement direction of the multiple second heat dissipation assemblies 33 is the Y-axis direction. For example, the multiple second heat dissipation assemblies 33 can be arranged on a plane perpendicular to the arrangement direction of the first heat dissipation assembly 32 and the second heat dissipation assembly 33. In the arrangement direction of the first heat dissipation assembly 32 and the second heat dissipation assembly 33, the projection of the first heat dissipation assembly 32 on the heat conduction member 31 and the projection of each second heat dissipation assembly 33 on the heat conduction member 31 both have overlapping regions. The arrangement direction of the first heat dissipation assembly 32 and the second heat dissipation assembly 33 is the Z-axis direction.

[0268] In the present embodiment, the first heat dissipation assembly 32 and the second heat dissipation assembly 33 can both dissipate heat from the heat conduction member 31. In addition, the first heat dissipation assembly 32 and the second heat dissipation assembly 33 in the present embodiment are used to generate airflow to dissipate heat from the heat conduction member 31. Compared with the natural heat dissipation scheme, the heat dissipation efficiency of the heat dissipation device 30 in the present embodiment is higher.

[0269] In addition, the first heat dissipation component 32 and each second heat dissipation component 33 can be stacked, for example, in the Z-axis direction. In this way, in the Z-axis direction, the total projection area of the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conduction member 31 is small. Compared with a scheme in which the first heat dissipation component 32 and the second heat dissipation component 33 are arranged on the same plane (for example, a plane perpendicular to the Z-axis direction, that is, the X-Y plane), the first heat dissipation component 32 and the second heat dissipation component 33 in the embodiment have small space occupation in the direction perpendicular to the stacking direction, which is beneficial to reducing the size of the heat dissipation device 30 in the direction perpendicular to the stacking direction of the first heat dissipation component 32 and the second heat dissipation component 33, that is, beneficial to reducing the size of the heat dissipation device 30 in the X-Y plane. It can be understood that the heat dissipation device 30 in the embodiment can reduce the total projection area of the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conduction member 31 while improving the heat dissipation efficiency of the heat dissipation device 30.

[0270] As shown in FIG. 17, taking the number of second heat dissipation components 33 as two as an example for description. The arrangement direction of the two second heat dissipation components 33 can be perpendicular to the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33. In the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the projection of the first heat dissipation component 32 on the heat conduction member 31 has an overlapping area with the projection of one of the second heat dissipation components 33 on the heat conduction member 31, and the projection of the first heat dissipation component 32 on the heat conduction member 31 also has an overlapping area with the projection of the other second heat dissipation component 33 on the heat conduction member 31.

[0271] For example, in the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the projection of the first heat dissipation component 32 on the heat conduction member 31 can be greater than the projection of the second heat dissipation component 33 on the heat conduction member 31. It can be understood that the width dimension (the dimension in the Y-axis direction) of the first heat dissipation component 32 can be greater than the width dimension (the dimension in the Y-axis direction) of the second heat dissipation component 33. In this way, when the heat dissipation device 30 is installed on the electronic equipment 100, the number of second heat dissipation components 33 can be reduced or increased according to the structure and heat dissipation requirement of the electronic equipment 100. For example, when the internal components of the electronic equipment 100 are more and the internal space is smaller, the number of second heat dissipation components 33 can be reduced to avoid the internal components of the electronic equipment 100. When the internal space of the electronic equipment 100 is larger and the heat dissipation requirement is larger, the number of second heat dissipation components 33 can be increased to improve the heat dissipation rate.

[0272] Please refer to FIG. 18 and FIG. 19, FIG. 18 is a partial structural exploded view of the heat dissipation device 30 shown in FIG. 4 in some embodiments, and FIG. 19 is a partial structural schematic view of the heat dissipation device 30 shown in FIG. 4 in some embodiments. For example, FIG. 19 shows a schematic view of the assembly structure between the heat conducting member 31, the first heat dissipation component 32 and the second heat dissipation component 33.

[0273] It can be understood that FIG. 18 and FIG. 19 only schematically show some components included in the heat dissipation device 30, and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 18 and FIG. 19.

[0274] It can be understood that the heat dissipation device 30 can have more or less components. For example, the heat dissipation device 30 can have more components. The heat dissipation device 30 can have less components. The heat dissipation device 30 can also not include the shell 34.

[0275] The embodiments shown in FIG. 18 and FIG. 19 can include most of the technical contents of the previous embodiments, and the following mainly describes the differences between the two, and most of the scheme contents of the two are not described again.

[0276] The structure of the heat dissipation device 30 of the present embodiment is substantially the same as that of the heat dissipation device 30 shown in FIG. 5, and the difference is that:

[0277] In the present embodiment, the first heat dissipation component 32 and the second heat dissipation component 33 can be respectively fixed on the two sides of the first part 311 of the heat conducting member 31. For example, the second heat dissipation component 33 can be located in the mounting space 310 of the heat conducting member 31. That is, the second heat dissipation component 33 can be located inside the first part 311, the second part 312 and the third part 313. The first part 311, the second part 312 and the third part 313 can surround the second heat dissipation component 33, and play a role of protecting the second heat dissipation component 33.

[0278] In the present embodiment, the partition plate 343 of the shell 34 can have a communication hole 3431. The communication hole 3431 can communicate the first space 301 and the second space 302. The communication hole 3431 can also communicate the third through hole 3411 of the shell 34.

[0279] Please refer to FIG. 20, which is a partial cross-sectional structural schematic view of the heat dissipation device 30 shown in FIG. 19 along F-F in some embodiments.

[0280] In some embodiments, the first heat conducting surface 3222 of the first bottom plate 322 of the first heat dissipation component 32 can be fixed on the first part 311, and the first heat dissipation surface 3221 can be arranged to face away from the first part 311. In FIG. 20, the first bottom plate 322 is schematically divided by a dashed line.

[0281] For example, the second heat-conducting surface 3322 of the second bottom plate 332 of the second heat-dissipation component 33 can be fixed to the side of the first part 311 facing away from the first heat-dissipation component 32, and the second heat-dissipation surface 3321 can be arranged to face away from the first part 311. For example, the first bottom plate 322 and the second bottom plate 332 are schematically distinguished by the dashed lines in FIG. 19 and FIG. 20. In FIG. 20, the second bottom plate 332 is schematically distinguished by the dashed line.

[0282] For example, the first top plate 321, the first bottom plate 322 and the first connecting frame 323 are schematically distinguished by the dashed lines in FIG. 21. In FIG. 21, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 are schematically distinguished by the dashed lines. In FIG. 22, the first bottom plate 322 and the second bottom plate 332 are schematically distinguished by the dashed lines.

[0283] For example, the heat-conducting member 31 can be fixedly connected to the shell 34. The heat-conducting member 31 can be at least partially located in the first space 301 of the shell 34, and part of the heat-conducting member 31 can be exposed relative to the third through hole 3411.

[0284] For example, part of the heat-conducting member 31 can be located in the first space 301. For example, the first part 311 of the heat-conducting member 31 can be located in the first space 301. The end of the first part 311 of the heat-conducting member 31 away from the second part 312 can be located in the communication hole 3431 of the shell 34 and connected to the inner wall of one of the communication holes 3431. In other embodiments, the heat-conducting member 31 can be entirely located in the first space 301. In this case, the third part 313 of the heat-conducting member 31 can be exposed relative to the third through hole 3411.

[0285] In some embodiments, the heat-conducting member 31 can seal the third through hole 3411 of the shell 34. For example, the second part 312 and the third part 313 of the heat-conducting member 31 can be sealingly connected to the inner wall of the third through hole 3411. In this way, dust, gas and the like outside the shell 34 can be prevented from entering the internal space of the shell 34 through the third through hole 3411. At the same time, the gas inside the shell 34 can also be prevented from flowing out through the third through hole 3411.

[0286] For example, the second part 312 and the third part 313 of the heat-conducting member 31 can be connected to the inner wall of the third through hole 3411, and the third part 313 of the heat-conducting member 31 can also be connected to the partition plate 343.

[0287] In some embodiments, the first heat dissipation component 32 is at least partially located in the first space 301 of the housing 34. It is to be understood that the first heat dissipation component 32 can be partially located in the first space 301. The first heat dissipation component 32 can also be entirely located in the first space 301. For example, a portion of the first connecting frame 323 and a portion of the first bottom plate 322 of the first heat dissipation component 32 can be located in the communication hole 3431 of the partition plate 343 and connected to the inner wall of the communication hole 3431. The first air outlet 327 of the first heat dissipation component 32 faces the second space 302 and is in communication with the second space 302, so that the second space 302 can be in communication with the second end of the first through hole 3213.

[0288] For example, the first space 301 can be in communication with the first air inlet space 3241 through the first air inlet 326 of the first heat dissipation component 32, so as to be in communication with the first end of the first through hole 3213. The second space 302 can be in communication with the first air outlet space 3231 through the first air outlet 327 of the first heat dissipation component 32, so as to be in communication with the second end of the first through hole 3213. In this embodiment, the gas in the first space 301 can flow into the first air inlet space 3241 through the first air inlet 326, then flow to the first air outlet space 3231 through the first through hole 3213, and finally flow into the second space 302 through the first air outlet 327.

[0289] In some embodiments, the second heat dissipation component 33 is at least partially located in the first space 301. It is to be understood that the second heat dissipation component 33 can be partially located in the first space 301. The second heat dissipation component 33 can also be entirely located in the first space 301. For example, a portion of the second connecting frame 333 and a portion of the second bottom plate 332 of the second heat dissipation component 33 can be located in the communication hole 3431 of the partition plate 343 and connected to the inner wall of the communication hole 3431. The second air outlet 337 of the second heat dissipation component 33 faces the second space 302 and is in communication with the second space 302, so that the second space 302 can be in communication with the second end of the second through hole 3313.

[0290] For example, the first space 301 can be in communication with the first air inlet space 3241 through the first air inlet 326 of the first heat dissipation component 32, so as to be in communication with the first end of the first through hole 3213. The second space 302 can be in communication with the first air outlet space 3231 through the first air outlet 327 of the first heat dissipation component 32, so as to be in communication with the second end of the first through hole 3213. In this embodiment, the gas in the first space 301 can flow into the first air inlet space 3241 through the first air inlet 326, then flow to the first air outlet space 3231 through the first through hole 3213, and finally flow into the second space 302 through the first air outlet 327.

[0291] In some embodiments, a portion of the first heat dissipation component 32 can be located in the first space 301 of the shell 34, and a portion can be located on the partition plate 343 of the shell 34, so that the first air outlet 327 of the first heat dissipation component 32 communicates with the second space 302 of the shell 34. A portion of the second heat dissipation component 33 can be located in the first space 301 of the shell 34, and a portion can be located on the partition plate 343 of the shell 34, so that the second air outlet 337 of the second heat dissipation component 33 communicates with the second space 302 of the shell 34.

[0292] For example, the first portion 311 of the heat conduction member 31, the first top plate 321, the first bottom plate 322, the first connecting frame 323, the second top plate 331, the second bottom plate 332, and the second connecting frame 333 can be sealingly connected to the inner wall of the through hole 3431 of the partition plate 343. In this way, the gap between the first portion 311 of the heat conduction member 31, the first top plate 321, the first bottom plate 322, the first connecting frame 323, the second top plate 331, the second bottom plate 332, and the second connecting frame 333 and the inner wall of the through hole 3431 can be sealed, so that the gas in the first space 301 and the second space 302 cannot flow through the above-mentioned gap, thereby avoiding the reduction of the heat dissipation efficiency.

[0293] In some embodiments, the heat dissipation device 30 can further include a second connecting member 345. The second connecting member 345 can be connected between the third portion 313 of the heat conduction member 31 and the second connecting frame 333 of the second heat dissipation component 33, thereby improving the connection stability of the second heat dissipation component 33 and the heat conduction member 31. Moreover, by connecting the second heat dissipation component 33 and the heat conduction member 31 through the second connecting member 345, the integrity of the heat dissipation device 30 can be improved.

[0294] In other embodiments, the heat conduction member 31 can not include the second portion 312 and the third portion 313. At this time, the heat conduction member 31 can be in a plate shape. The structure of the heat conduction member 31 is relatively simple, and the heat conduction member 31 occupies less space inside the electronic device 100. The heat conduction member 31 can include a first surface and a second surface arranged oppositely, the first heat dissipation component 32 can be fixed to the first surface of the heat conduction member 31, and the second heat dissipation component 33 can be fixed to the second surface of the heat conduction member 31. The heat conduction member 31 can extend to the outside of the shell 34, and be used to be attached to the heat source of the electronic device 100.

[0295] In other embodiments, the first heat dissipation component 32 and the second heat dissipation component 33 can be located in the first space 301 of the shell 34. At this time, the first air outlet 327 of the first heat dissipation component 32 and the second air outlet 337 of the second heat dissipation component 33 can communicate with the second space 302 of the shell 34 through the through hole 3431.

[0296] Please refer to Fig. 23, which is a schematic diagram of part of the heat dissipation device 30 shown in Fig. 4 in another embodiment. It can be understood that the heat dissipation device 30 shown in Fig. 23 only shows part of the structure of the heat dissipation device 30. The heat dissipation device 30 shown in Fig. 23 can include most of the technical content of the previous embodiment, and the following mainly describes the differences between the two, and most of the scheme content of the two is not repeated.

[0297] The structure of the heat dissipation device 30 of the present embodiment is substantially the same as that of the heat dissipation device 30 shown in Fig. 11, and the difference is that:

[0298] In the present embodiment, the heat conduction member 31 can include a first portion 311, a second portion 312, a third portion 313, and a fourth portion 314. The first portion 311, the third portion 313, and the fourth portion 314 are all connected to the second portion 312, and the first portion 311, the third portion 313, and the fourth portion 314 are all located on the same side of the second portion 312. The fourth portion 314 can be located between the first portion 311 and the third portion 313, and is arranged opposite and spaced apart from the first portion 311 and the third portion 313, respectively.

[0299] For example, the heat dissipation device 30 can further include a third heat dissipation component 35. The third heat dissipation component 35 is connected to the heat conduction member 31 and can achieve heat transfer with the heat conduction member 31. It can be understood that the structure of the third heat dissipation component 35 can be the same or similar structure, symmetric or partially symmetric structure, or different structure from that of the first heat dissipation component 32. In the present embodiment, the structure of the third heat dissipation component 35 is the same as that of the first heat dissipation component 32; the basic design of the component structure of the third heat dissipation component 35, the connection relationship design between the components, and the connection relationship design of the components and other structures outside the component, can be referred to the related scheme of the first heat dissipation component 32. At the same time, the third heat dissipation component 35 and the first heat dissipation component 32 are allowed to be slightly different in the detailed structure or position arrangement of the components. Details are not repeated here.

[0300] For example, in the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the projection of the first heat dissipation component 32 on the heat conduction member 31 and the projection of the third heat dissipation component 35 on the heat conduction member 31 have an overlapping area, and / or the projection of the second heat dissipation component 33 on the heat conduction member 31 and the projection of the third heat dissipation component 35 on the heat conduction member 31 have an overlapping area.

[0301] In the embodiment, the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 can all dissipate heat from the heat conduction member 31. In addition, the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 in the embodiment are used to generate airflow to dissipate heat from the heat conduction member 31. Compared with the natural heat dissipation scheme, the heat dissipation efficiency of the heat dissipation device 30 in the embodiment is higher.

[0302] In addition, the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 can be stacked, for example, can be stacked in the Z-axis direction. Compared with the scheme in which the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 are arranged on the same plane (for example, the plane perpendicular to the Z-axis direction, that is, the X-Y plane), in the Z-axis direction, the total projection area of the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 on the heat conduction member 31 is smaller. The first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 in the embodiment occupy less space in the direction perpendicular to the stacking direction, which is beneficial to reduce the size of the heat dissipation device 30 in the direction perpendicular to the stacking direction of the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35, that is, beneficial to reduce the size of the heat dissipation device 30 in the X-Y plane. It can be understood that the heat dissipation device 30 in the embodiment of the present application can reduce the total projection area of the first heat dissipation component 32, the second heat dissipation component 33 and the third heat dissipation component 35 on the heat conduction member 31 while improving the heat dissipation efficiency of the heat dissipation device 30.

[0303] For example, the first heat dissipation component 32 can be fixed to the first part 311 of the heat conduction member 31 and located on the side of the first part 311 away from the fourth part 314. The second heat dissipation component 33 can be fixed to the third part 313 of the heat conduction member 31 and located on the side of the third part 311 facing the fourth part 314. The third heat dissipation component 35 can be fixed to the fourth part 314 of the heat conduction member 31 and located on the side of the fourth part 314 facing the first part 311.

[0304] In other embodiments, the first heat dissipation component 32 can also be fixed to the side of the first part 311 of the heat conduction member 31 facing the fourth part 314. The second heat dissipation component 33 can also be fixed to the side of the third part 313 of the heat conduction member 31 facing the fourth part 314. The third heat dissipation component 35 can also be located on the side of the fourth part 314 of the heat conduction member 31 facing the first part 311.

[0305] In some other embodiments, the first heat dissipation component 32 can also be fixed on the side of the first portion 311 of the heat conducting member 31 opposite to the fourth portion 314. The second heat dissipation component 33 can also be fixed on the side of the third portion 313 of the heat conducting member 31 opposite to the fourth portion 314. The third heat dissipation component 35 can also be located on the side of the fourth portion 314 of the heat conducting member 31 facing the first portion 311.

[0306] In some other embodiments, the first heat dissipation component 32 can also be fixed on the side of the first portion 311 of the heat conducting member 31 opposite to the fourth portion 314. The second heat dissipation component 33 can also be fixed on the side of the first portion 311 of the heat conducting member 31 facing the fourth portion 314, i.e. the first heat dissipation component 32 and the second heat dissipation component 33 can be located on the opposite sides of the first portion 311. The third heat dissipation component 35 can also be located on the side of the first portion 311 of the heat conducting member 31 facing the fourth portion 314.

[0307] It can be understood that the relative position relationship between the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conducting member 31 can be adjusted according to specific requirements. The application range of the heat dissipation device 30 is wide.

[0308] It can be understood that in the above embodiments, the first heat dissipation component 32 and the second heat dissipation component 33 of the heat dissipation device 30 can be stacked in the Z-axis direction, so that the first heat dissipation component 32 and the second heat dissipation component 33 occupy less space in the direction perpendicular to the stacking direction, which is beneficial to reduce the size of the heat dissipation device 30 in the direction perpendicular to the stacking direction of the first heat dissipation component 32 and the second heat dissipation component 33, i.e. beneficial to reduce the size of the heat dissipation device 30 in the X-Y plane. The structure of the heat conducting member 31, as well as the number and position arrangement of the first heat dissipation component 32 and the second heat dissipation component 33 can be adjusted accordingly according to requirements. In the following, the structure of the heat dissipation device 30 in some other embodiments will be further introduced with reference to the relevant drawings.

[0309] Please refer to FIG. 24 to FIG. 26, FIG. 24 is a partial structure schematic diagram of the heat dissipation device 30 in some other embodiments shown in FIG. 1, FIG. 25 is a structure schematic diagram of the heat dissipation device 30 shown in FIG. 24 from another angle, and FIG. 26 is a partial structure exploded view of the heat dissipation device 30 in some embodiments shown in FIG. 24. The embodiment shown in FIG. 24 can include most of the technical contents of the previous embodiments, and the following mainly explains the differences between the two, and most of the scheme contents of the two are not repeated.

[0310] In some embodiments, the heat dissipation device 30 can include the heat conducting member 31, the first heat dissipation component 32, the second heat dissipation component 33, and the housing 34. The first heat dissipation component 32 and the second heat dissipation component 33 in the present embodiment have the same structure as those in the embodiment shown in FIG. 5. The structure of the first heat dissipation component 32 and the second heat dissipation component 33 in the present embodiment can be referred to the relevant description above, and will not be repeated here.

[0311] It can be understood that FIGS. 24-26 only schematically show some components included in the heat dissipation device 30, and the actual shape, actual size, actual position, and actual structure of these components are not limited by FIGS. 24-26.

[0312] It can be understood that the heat dissipation device 30 can have more or fewer components. For example, the heat dissipation device 30 can have more components. The heat dissipation device 30 can have fewer components. The heat dissipation device 30 can also not include the housing 34.

[0313] For example, the housing 34 can be a substantially quadrilateral shell. The housing 34 can have a bottom wall 341 and a peripheral side wall 342 connected to the periphery of the bottom wall 341. At this time, the bottom wall 341 and the peripheral side wall 342 of the housing 34 can jointly enclose an internal space of the housing 34. The bottom wall 341 of the housing 34 can have a third through hole 3411. The third through hole 3411 can communicate the internal space of the housing 34 with the outside of the housing 34.

[0314] For example, part of the heat conducting member 31 can be located in the internal space of the housing 34, part of the heat conducting member 31 can extend into the internal space of the housing 34 through the third through hole 3411 of the housing 34, and part of the heat conducting member 31 can be exposed relative to the housing 34.

[0315] For example, at least part of the first heat dissipation component 32 and the second heat dissipation component 33 are located in the internal space of the housing 34 and connected to the heat conducting member 31. Heat transfer can be achieved between the first heat dissipation component 32, the second heat dissipation component 33, and the heat conducting member 31.

[0316] For example, the first heat dissipation surface 3221 of the first heat dissipation component 32 and the second heat dissipation surface 3321 of the second heat dissipation component 33 can both face the peripheral side wall 342 of the housing 34. For example, the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33 can be parallel to the plane in which the bottom wall 341 of the housing 34 lies. For example, the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33 can be the X-axis direction.

[0317] Exemplarily, in the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33, the first heat dissipation component 32 can have an overlapping area with the projection of the heat conducting member 31 on the second heat dissipation component 33.

[0318] In the embodiment, the first heat dissipation component 32 and the second heat dissipation component 33 can both dissipate heat from the heat conducting member 31. In addition, the first heat dissipation component 32 and the second heat dissipation component 33 in the embodiment are used to generate air flow to dissipate heat from the heat conducting member 31, and the heat dissipation efficiency of the heat dissipation device 30 in the embodiment is higher than that of the natural heat dissipation scheme.

[0319] In addition, the first heat dissipation component 32 and the second heat dissipation component 33 can be stacked in the direction perpendicular to the Z axis, for example, can be stacked in the X axis direction. In this way, in the direction perpendicular to the Z axis, the total projection area of the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conducting member 31 is small. Compared with the scheme in which the first heat dissipation component 32 and the second heat dissipation component 33 are arranged on the same plane (for example, the Y-Z plane), the first heat dissipation component 32 and the second heat dissipation component 33 in the embodiment occupy less space in the stacking direction perpendicular to the Z axis, which is beneficial to reduce the size of the heat dissipation device 30 in the direction perpendicular to the stacking direction of the first heat dissipation component 32 and the second heat dissipation component 33, for example, beneficial to reduce the size of the heat dissipation device 30 in the Y-Z plane. It can be understood that the heat dissipation device 30 in the embodiment of the present application can reduce the total projection area of the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conducting member 31 while improving the heat dissipation efficiency of the heat dissipation device 30.

[0320] Exemplarily, the first air outlet 327 of the first heat dissipation component 32 can be arranged to face away from the bottom wall 341 of the shell 34. The second air outlet 337 of the second heat dissipation component 33 can be arranged to face away from the bottom wall 341 of the shell 34. In this way, the high-temperature gas flowing out of the first air outlet 327 and the second air outlet 337 is not easy to flow back to the internal space of the shell 34, and the heat dissipation rate of the heat conduction is reduced.

[0321] Please refer to FIG. 25, FIG. 27 and FIG. 28 together, FIG. 27 is a partial structure exploded view of the partial structure of the heat dissipation device 30 shown in FIG. 26 in some embodiments, and FIG. 28 is a structure schematic view of the partial structure of the heat dissipation device 30 shown in FIG. 26 from another angle. Exemplarily, FIG. 27 and FIG. 28 mainly show the partial structure exploded view of the heat conducting member 31, the first heat dissipation component 32 and the second heat dissipation component 33.

[0322] In some embodiments, the heat-conducting member 31 can include a first portion 315 and a second portion 316. The second portion 316 is connected to the first portion 315 and is arranged at an angle with respect to the first portion 315. That is, the second portion 316 can be bent with respect to the first portion 315. For example, the first portion 315 and the second portion 316 of the heat-conducting member 31 can be arranged perpendicular to each other.

[0323] For example, the first portion 315 of the heat-conducting member 31 can extend into the interior of the housing 34 through the third through hole 3411 of the housing 34. The second portion 316 of the heat-conducting member 31 can be located outside the housing 34.

[0324] For example, the second portion 316 of the heat-conducting member 31 can be exposed with respect to the housing 34. For example, the second portion 316 of the heat-conducting member 31 can be located outside the housing 34, and the first portion 315 of the heat-conducting member 31 can extend into the interior of the housing 34 through the third through hole 3411 of the housing 34. It can be understood that the second portion 316 of the heat-conducting member 31 can be used to conform to the heat source of the electronic device 100, and heat transfer can be achieved between the second portion 316 of the heat-conducting member 31 and the heat source of the electronic device 100.

[0325] In some embodiments, the first heat-dissipating component 32 and the second heat-dissipating component 33 can be fixed to two sides of the first portion 315 of the heat-conducting member 31. In this way, the first heat-dissipating component 32 and the second heat-dissipating component 33 can both be used to dissipate heat from the heat-conducting member 31, which is conducive to increasing the heat-dissipating area of the heat-conducting member 31 and thus improving the heat-dissipating efficiency.

[0326] For example, the first portion 315 of the heat-conducting member 31 can include a first surface 3151 and a second surface 3152 arranged in opposite directions. The second portion 316 of the heat-conducting member 31 can include a third surface 3161 and a fourth surface 3162 arranged in opposite directions.

[0327] For example, the first heat-dissipating component 32 can be fixed to the first surface 3151 of the first portion 315, for example, the first heat-conducting surface 3222 of the first heat-dissipating component 32 can be fixed to the first surface 3151 of the first portion 315. The second heat-dissipating component 33 can be fixed to the second surface 3152 of the first portion 315, for example, the second heat-conducting surface 3322 of the second heat-dissipating component 33 can be fixed to the second surface 3152 of the first portion 315.

[0328] In some other embodiments, the first heat dissipation component 32 can be fixed to the first surface 3151 of the first part 315, for example, the first heat conduction surface 3222 of the first heat dissipation component 32 can be fixed to the first surface 3151 of the first part 315. The second heat dissipation component 33 can be fixed to the third surface 3161 of the second part 316, for example, the second heat conduction surface 3322 of the second heat dissipation component 33 can be fixed to the third surface 3161 of the second part 316.

[0329] In some other embodiments, the first heat dissipation component 32 can be fixed to the first surface 3151 of the first part 315, for example, the first heat conduction surface 3222 of the first heat dissipation component 32 can be fixed to the first surface 3151 of the first part 315. The second heat dissipation component 33 can be fixed to the fourth surface 3162 of the second part 316, for example, the second heat conduction surface 3322 of the second heat dissipation component 33 can be fixed to the fourth surface 3162 of the second part 316.

[0330] In some other embodiments, the first heat dissipation component 32 can be fixed to the second surface 3152 of the first part 315, for example, the first heat conduction surface 3222 of the first heat dissipation component 32 can be fixed to the second surface 3152 of the first part 315. The second heat dissipation component 33 can be fixed to the third surface 3161 of the second part 316, for example, the second heat conduction surface 3322 of the second heat dissipation component 33 can be fixed to the third surface 3161 of the second part 316.

[0331] In some other embodiments, the first heat dissipation component 32 can be fixed to the second surface 3152 of the first part 315, for example, the first heat conduction surface 3222 of the first heat dissipation component 32 can be fixed to the second surface 3152 of the first part 315. The second heat dissipation component 33 can be fixed to the fourth surface 3162 of the second part 316, for example, the second heat conduction surface 3322 of the second heat dissipation component 33 can be fixed to the fourth surface 3162 of the second part 316.

[0332] It can be understood that the relative position relationship between the first heat dissipation component 32 and the second heat dissipation component 33 on the heat conduction member 31 can be adjusted according to specific requirements. The heat dissipation device 30 has a wide range of applications.

[0333] In some other embodiments, the heat conduction member 31 can also not include the second part 316. At this time, the heat conduction member 31 can be in a plate shape. The heat conduction member 31 has a relatively simple structure and occupies less space inside the electronic device 100. The heat conduction member 31 can include oppositely arranged first and second surfaces, the first heat dissipation component 32 can be fixed to the first surface of the heat conduction member 31, and the second heat dissipation component 33 can be fixed to the second surface of the heat conduction member 31. The heat conduction member 31 can extend to the outside of the shell 34 and be used to be attached to the heat source 40 of the electronic device 100.

[0334] Referring to FIG. 29, FIG. 29 is a schematic diagram of a partial structure of the heat dissipation device 30 shown in FIG. 24 in some embodiments. It can be understood that the heat dissipation device 30 shown in FIG. 29 only shows a partial structure of the heat dissipation device 30.

[0335] It can be understood that FIG. 29 only schematically shows some components included in the heat dissipation device 30, and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 29.

[0336] It can be understood that the heat dissipation device 30 can have more or less components. For example, the heat dissipation device 30 can have more or less components.

[0337] The structure of the heat dissipation device 30 of the present embodiment is substantially the same as that of the heat dissipation device 30 shown in FIG. 14, and most of the same schemes are not repeated. The difference is that:

[0338] In the present embodiment, the heat conduction member 31 can include a first portion 315, a second portion 316 and a third portion 317. The first portion 315 and the third portion 317 are both connected to the second portion 316 and are located on the same side of the second portion 316. The second portion 316 of the heat conduction member 31 can be used to be attached to the heat source of the electronic device 100.

[0339] For example, the first portion 315 and the third portion 317 of the heat conduction member 31 can be oppositely and spacedly arranged. In some examples, the length extension direction of the first portion 315 can be parallel to the length extension direction of the third portion 317. In other examples, the length extension direction of the first portion 315 and the length extension direction of the third portion 317 can also be arranged at an angle.

[0340] For example, the heat dissipation device 30 further includes a third heat dissipation assembly 36 and a fourth heat dissipation assembly 37. The third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can be fixed to the opposite sides of the heat conduction member 31. In the present embodiment, the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can both be used to dissipate heat from the third portion 317 of the heat conduction member 31, thereby improving the heat dissipation efficiency of the heat dissipation device 30.

[0341] It can be understood that the structures of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can be the same or similar structure, symmetrical or partially symmetrical structure, or different structure from the structure of the first heat dissipation assembly 32. In the embodiment, the structures of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 are the same structure as the first heat dissipation assembly 32. The basic design of the component structure, the connection relationship design between the components, and the connection relationship design of the components and other structures outside the assembly of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can refer to the related solutions of the first heat dissipation assembly 32. At the same time, the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can be slightly different from the first heat dissipation assembly 32 in the detailed structure or position arrangement of the components. Details are not repeated here.

[0342] For example, the length extension direction of the third heat dissipation assembly 36 can be parallel to the length extension direction of the first heat dissipation assembly 32. The length extension direction of the fourth heat dissipation assembly 37 can be parallel to the length extension direction of the first heat dissipation assembly 32. In the arrangement direction of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37, the projection of the third heat dissipation assembly 36 on the heat conduction member 31 and the projection of the fourth heat dissipation assembly 37 on the heat conduction member 31 have an overlapping area. The arrangement direction of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can be the X-axis direction.

[0343] In the embodiment, the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can dissipate heat from the heat conduction member 31. In addition, the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 in the embodiment are used to generate airflow to dissipate heat from the heat conduction member 31. Compared with the natural heat dissipation scheme, the heat dissipation efficiency of the heat dissipation device 30 in the embodiment is higher.

[0344] In addition, the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 can be stacked in the direction perpendicular to the Z-axis, for example, can be stacked in the X-axis direction. In this way, in the direction perpendicular to the Z-axis, the total projection area of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 on the heat conduction member 31 is smaller. Compared with the scheme in which the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 are arranged on the same plane (for example, the Y-Z plane), the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 in the embodiment occupy less space in the direction perpendicular to the stacking direction, which is beneficial to reduce the size of the heat dissipation device 30 in the direction perpendicular to the stacking direction of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37, for example, beneficial to reduce the size of the heat dissipation device 30 in the Y-Z plane. It can be understood that the heat dissipation device 30 of the embodiment can reduce the total projection area of the third heat dissipation assembly 36 and the fourth heat dissipation assembly 37 on the heat conduction member 31 while improving the heat dissipation efficiency of the heat dissipation device 30.

[0345] In some other embodiments, the heat dissipation device 30 can also not include the fourth heat dissipation component 37, or can include a fifth heat dissipation component, a sixth heat dissipation component, and so on. It can be understood that the structure of the heat conduction member 31 of the heat dissipation device 30, the number of heat dissipation components, and the arrangement manner of the heat dissipation components can be adjusted according to the heat dissipation requirement of the electronic device 100.

[0346] The above describes various embodiments of the heat dissipation device 30 in combination with the related drawings, and the following will continue to describe the electronic device 100 including the above heat dissipation device 30 in combination with the related drawings.

[0347] Please refer to FIG. 30A and FIG. 30B, FIG. 30A is a structural schematic diagram of the cover 13 shown in FIG. 2 in some embodiments, and FIG. 30B is a structural schematic diagram of the cover 13 shown in FIG. 30A from another angle.

[0348] In some embodiments, the cover 13 can be substantially a quadrilateral shell. The cover 13 can include a top wall 131 and a bottom wall 132 arranged oppositely, and can also include a circumferential side wall 133 connected between the top wall 131 and the bottom wall 132. For example, the circumferential side wall 133 of the cover 13 can include a first side wall 133a, a second side wall 133b, a third side wall 133c, and a fourth side wall 133d connected in sequence. Among them, the first side wall 133a and the third side wall 133c are arranged oppositely, and the second side wall 133b and the fourth side wall 133d are arranged oppositely. It can be understood that the top wall 131, the bottom wall 132, and the circumferential side wall 133 of the cover 13 jointly constitute a cover main body 130 of the cover 13.

[0349] For example, the cover main body 130 can have a groove 134. The opening of the groove 134 can be located at the bottom wall 132 of the cover 13. That is, the groove 134 can be formed by the bottom wall 132 of the cover 13 being recessed towards the top wall 131 of the cover 13.

[0350] For example, the cover 13 can also have a partition plate 135. The partition plate 135 can be connected to the inner wall of the groove 134 and separate the groove 134 into a first sub-groove 134a and a second sub-groove 134b. It can be understood that the first sub-groove 134a and the second sub-groove 134b are spaced apart, and the partition plate 135 can be located between the first sub-groove 134a and the second sub-groove 134b.

[0351] For example, the arrangement direction of the first groove 134 and the second groove 134 can be perpendicular to the Z-axis direction. For example, the first groove 134 and the second groove 134 can be arranged along the X-axis direction, or the first groove 134 and the second groove 134 can be arranged along the Y-axis direction.

[0352] In some embodiments, the cover 13 can have a first opening 136 and a second opening 137 arranged at intervals. The first opening 136 can pass through the peripheral sidewall 133 of the cover 13 and communicate with the first sub-groove 134a. The second opening 137 can pass through the peripheral sidewall 133 of the cover 13 and respectively communicate with the second sub-groove 134b. The first opening 136 and the second opening 137 can also pass through the bottom wall 132 of the cover 13, that is, the first opening 136 can communicate with the opening of the first sub-groove 134a, and the second opening 137 can communicate with the opening of the second sub-groove 134b.

[0353] For example, the first opening 136 can be arranged on the first sidewall 133a, and the second opening 137 can be arranged on the third sidewall 133c. In other examples, the first opening 136 can be arranged on the first sidewall 133a, and the second opening 137 can be arranged on the second sidewall 133b; or, the first opening 136 can be arranged on the second sidewall 133b, and the second opening 137 can be arranged on the third sidewall 133c.

[0354] In other embodiments, one of the first opening 136 and the second opening 137 can be arranged on the top wall of the cover 13, and the other can be arranged on the peripheral sidewall 133 of the cover 13. The present application does not make strict limitations on this.

[0355] For example, the first opening 136 and the second opening 137 can both be long strip-shaped openings. In other embodiments, the first opening 136 and the second opening 137 can also be circular or other shapes. The number of the first opening 136 and the second opening 137 can be one or more, respectively. It can be understood that the shape and number of the first opening 136 and the second opening 137 can be arranged according to the specific structure needs of the electronic device 100, and the present application does not make strict limitations on the shape and number of the first opening 136 and the second opening 137.

[0356] It can be understood that in other embodiments, the electronic device 100 can also not include the cover 13. At this time, the device shell 10 can be provided with the first opening 136 and the second opening 137. For example, the middle frame 121 of the device shell 10 can be provided with the first opening 136 and the second opening 137. The present application does not make strict limitations on the arrangement position of the first opening 136 and the second opening 137.

[0357] Please refer to FIG. 31 and FIG. 32, FIG. 31 is a partial structural schematic view of the electronic device 100 shown in FIG. 1 along G-G at another angle, and FIG. 32 is a partial cross-sectional structural schematic view of the electronic device 100 shown in FIG. 1 along A-A in some embodiments. For example, FIG. 31 shows a partial structural schematic view of the device housing 10, the cover 13, and the display screen 20 of the electronic device 100. The electronic device 100 shown in FIG. 32 includes the heat dissipation device 30 shown in FIG. 14.

[0358] In some embodiments, the device housing 10 can include the housing body 12 and the partition 11. It can be understood that the housing body 12 can include the middle frame 121 and the back cover 122. The housing body 12 can have a through hole 123, and the partition 11 can be connected to the inner wall of the through hole 123 of the housing body 12 and separate the through hole 123 of the housing body 12 into a first through hole 1231 and a second through hole 1232. It can be understood that the first through hole 1231 and the second through hole 1232 are arranged at intervals, and the partition 11 can be located between the first through hole 1231 and the second through hole 1232. The first through hole 1231 and the second through hole 1232 are both in communication with the internal space 101 of the electronic device 100.

[0359] For example, the first through hole 1231 and the second through hole 1232 can both be arranged on the back cover 122. In other embodiments, the first through hole 1231 and / or the second through hole 1232 can also be arranged on the middle frame 121 of the device housing 10, which is not strictly limited in the present application.

[0360] In some embodiments, the cover 13 can be fixed to the top of the device housing 10. It can be understood that the cover 13 can be fixed to the side of the device housing 10 facing away from the display screen 20. The cover 13 can cover the first through hole 1231 and the second through hole 1232 of the device housing 10.

[0361] For example, the cover body 130 of the cover 13 can be connected to the housing body 12 of the device housing 10. For example, the cover 13 can be fixed to the back cover 122 of the device housing 10 by adhesion, clamping, or the like. Among them, the bottom wall 132 and the peripheral side wall 133 of the cover 13 can be fixed to the side of the back cover 122 of the device housing 10 facing away from the display screen 20. The peripheral side wall 133 (including the first side wall 133a to the fourth side wall 133d) of the cover 13 can surround the first through hole 1231 and the second through hole 1232 of the device housing 10. The top wall 131 of the cover 13 can cover the first through hole 1231 and the second through hole 1232 of the device housing 10.

[0362] For example, the partition 135 of the cover 13 can be connected to the partition 11 of the device housing 10. At this time, the recess 134 of the cover 13 can face the internal space 101 of the electronic device 100. The first sub-recess 134a of the cover 13 can be in communication with the first through hole 1231 of the device housing 10, so that the first opening 136 can be in communication with the internal space 101 of the electronic device 100 through the first through hole 1231. The second sub-recess 134b of the cover 13 can be in communication with the second through hole 1232 of the device housing 10, so that the second opening 137 can be in communication with the internal space 101 of the electronic device 100 through the second through hole 1232. In this way, air outside the electronic device 100 can enter the internal space of the electronic device 100 from the first opening 136 and then flow out from the second opening 137.

[0363] In some embodiments, the electronic device 100 can further include a camera module (not shown). The camera module is mounted on the device housing 10. The camera module can be used for taking photos and videos. For example, the camera module can be fixed on the inner side of the device housing 10, and the camera module can extend to the outer surface of the cover 13.

[0364] It can be understood that in the present embodiment, the heat dissipation device 30 can be integrated with the camera module in the mobile phone. The heat dissipation device 30 and the camera module can be disposed together in the space on the inner side of the cover 13, so that the heat dissipation device 30 and the camera module can fully utilize the space on the inner side of the electronic device 100, thereby reducing the size of the electronic device 100, which is conducive to realizing the miniaturization of the electronic device 100.

[0365] Please refer to FIG. 32 and FIG. 33, FIG. 33 is a structure schematic diagram of the partial cross-section structure of the electronic device 100 shown in FIG. 32 from another angle.

[0366] In some embodiments, the heat dissipation device 30 can be fixed on the device housing 10. For example, the shell 34 of the heat dissipation device 30 can be fixed on the inner side of the device housing 10, that is, the shell 34 can be located on the side of the back cover 122 facing the display screen 20. At this time, the bottom wall 341 and the peripheral side wall 342 of the shell 34 can be located on the inner side of the back cover 122.

[0367] For example, the peripheral wall 342 of the housing 34 can be connected to the rear cover 122, and the peripheral wall 342 of the housing 34 can surround the first through hole 1231 and the second through hole 1232. The partition plate 343 of the housing 34 can be connected to the partition portion 11 of the device housing 10. At this time, the first space 301 of the heat dissipation device 30 can be communicated with the first through hole 1231, and the second space 302 can be communicated with the second through hole 1232. It can be understood that the gas outside the electronic device 100 can enter the first space 301 of the heat dissipation device 30 through the first through hole 1231, and then flow to the second space 302 through the second through hole 1232.

[0368] In some embodiments, a part of the cover 13 can cover the first space 301 of the housing 34 to form a first chamber. It can be understood that the first sub-groove 134a of the cover 13 can be communicated with the first through hole 1231. At this time, the first sub-groove 134a, the first through hole 1231 and the first space 301 can jointly constitute the first chamber, and the first chamber can be communicated with the first opening 136. In this way, the air outside the electronic device 100 can enter the first space 301 of the heat dissipation device 30 from the first opening 136, and then flow into the first air inlet space 3241 of the first heat dissipation assembly 32 through the first air inlet 326, and flow into the second air inlet space 3341 of the second heat dissipation assembly 33 through the second air inlet 336.

[0369] For example, a part of the cover 13 can cover the second space 302 of the housing 34 to form a second chamber. It can be understood that the second sub-groove 134b of the cover 13 can be communicated with the second through hole 1232. At this time, the second sub-groove 134b, the second through hole 1232 and the second space 302 can jointly constitute the second chamber, and the second chamber can be communicated with the second opening 137. In this way, the gas in the second space 302 of the heat dissipation device 30 can flow to the outside of the electronic device 100 through the second opening 137.

[0370] It can be understood that in the present embodiment, the first sub-groove 134a of the cover 13 is part of the first chamber, and the second sub-groove 134b of the cover 13 is part of the second chamber, that is, the electronic device 100 can form the first chamber and the second chamber by using the structure of the cover 13 itself, so that it is not necessary to additionally provide a protruding structure on the device housing 10 to form the first chamber and the second chamber, which is conducive to reducing the size of the electronic device 100 in the Z-axis direction.

[0371] For example, the first heat dissipation component 32 and the second heat dissipation component 33 can be arranged along the thickness direction (i.e., the Z-axis direction) of the electronic device 100, i.e., the first heat dissipation component 32 and the second heat dissipation component 33 can be stacked in the thickness direction (i.e., the Z-axis direction) of the electronic device 100. Compared with the case that the first heat dissipation component 32 and the second heat dissipation component 33 are arranged on the same plane (e.g., a plane perpendicular to the Z-axis direction, i.e., the X-Y plane), the first heat dissipation component 32 and the second heat dissipation component 33 in the embodiment have a smaller space occupation in the direction perpendicular to the Z-axis direction, which is conducive to reducing the size of the electronic device 100 in the direction perpendicular to the Z-axis direction, i.e., the size of the electronic device 100 in the X-Y plane. It can be understood that, compared with the case that the first heat dissipation component 32 and the second heat dissipation component 33 are arranged on the same plane (a plane perpendicular to the thickness direction), the heat dissipation device 30 in the embodiment is more suitable for the electronic device 100 with a smaller size in the direction perpendicular to the thickness direction. Moreover, the first heat dissipation component 32 and the second heat dissipation component 33 can both dissipate heat of the heat conduction member 31, which is conducive to improving the heat dissipation efficiency of the heat dissipation device 30.

[0372] In some embodiments, the third part 313 of the heat conduction member 31 can be exposed to the internal space 101 of the electronic device 100 and be attached to the heat source 40 of the electronic device 100, so that the heat of the heat source 40 of the electronic device 100 can be conducted to the heat conduction member 31, and then the heat conducted to the heat conduction member 31 can be conducted to the first heat dissipation component 32 and the second heat dissipation component 33. The first heat dissipation component 32 and the second heat dissipation component 33 can dissipate the heat conducted to the first heat dissipation component 32 and the second heat dissipation component 33, so as to achieve heat dissipation of the heat conduction member 31 and the heat source of the electronic device 100; and the first heat dissipation component 32 and the second heat dissipation component 33 can both dissipate heat of the heat conduction member 31 and the heat source 40, which is conducive to improving the heat dissipation efficiency of the heat dissipation device 30, so as to achieve rapid cooling of the heat source 40 of the electronic device 100.

[0373] It can be understood that, in the embodiment, at least one of the first part 311, the second part 312 and the third part 313 of the heat conduction member 31 can be used to attach to the heat source 40 of the electronic device 100, so that the heat of the heat source 40 of the electronic device 100 can be conducted to the heat conduction member 31. At least one of the first part 311, the second part 312 and the third part 313 of the heat conduction member 31 can be used to fix the first heat dissipation component 32 and the second heat dissipation component 33, so that the first heat dissipation component 32 and the second heat dissipation component 33 can dissipate heat of the heat conduction member 31, thereby achieving cooling of the heat source 40 of the electronic device 100.

[0374] In some embodiments, the second heat dissipation component 33 and the heat source 40 of the electronic device 100 can be located on opposite sides of the same part of the heat conducting member 31 respectively. For example, the heat source 40 of the electronic device 100 can be attached to the third part 313 of the heat conducting member 31, and located on the side of the third part 313 opposite to the first part 311. At this time, the heat source 40 of the electronic device 100 and the second heat dissipation component 33 can be located on opposite sides of the third part 313 of the heat conducting member 31 respectively.

[0375] In the present embodiment, the third part 313 of the heat conducting member 31 is attached to the heat source 40 of the electronic device 100, so that the heat of the heat source 40 of the electronic device 100 can be sequentially transferred to the third part 313, the second part 312 and the first part 311 of the heat conducting member 31, and the thermal resistance of the third part 313, the second part 312 and the first part 311 increases in turn. Since the greater the thermal resistance, the more difficult the heat transfer, and the less conducive to rapid heat dissipation. Therefore, in the present embodiment, the second heat dissipation component 33 is fixed to the third part 313 of the heat conducting member 31, so that the second heat dissipation component 33 can quickly dissipate heat from the third part 313 of the heat conducting member 31, so that the thermal resistance is small during heat transfer on the heat conducting member 31. In this way, the loss of heat conduction efficiency of the heat on the heat conducting member 31 can be reduced, and the heat dissipation efficiency can be improved to achieve rapid cooling of the heat source 40 of the electronic device 100.

[0376] For example, in the arrangement direction of the second heat dissipation component 33 and the heat source 40 of the electronic device 100, the projection of the second heat dissipation component 33 on the heat conducting member 31 and the projection of the heat source 40 on the heat conducting member 31 can have an overlapping area. For example, in the Z-axis direction, the projection of the second heat dissipation component 33 on the heat conducting member 31 and the projection of the heat source 40 on the heat conducting member 31 can have an overlapping area. In this way, the second heat dissipation component 33 can be arranged closer to the heat source 40 of the electronic device 100 to reduce the thermal resistance of heat transfer on the heat conducting member 31, so that the loss of heat conduction efficiency of the heat on the heat conducting member 31 can be reduced, and the heat dissipation efficiency can be improved to achieve rapid cooling of the heat source 40 of the electronic device 100.

[0377] It can be understood that in some other embodiments, the first heat dissipation component 32 and the heat source 40 of the electronic device 100 can also be located on opposite sides of the same part of the heat conducting member 31. In the arrangement direction of the first heat dissipation component 32 and the heat source 40, the projection of the first heat dissipation component 32 on the heat conducting member 31 and the projection of the heat source 40 on the heat conducting member 31 have an overlapping area.

[0378] For example, the approximate flow direction of the gas in the process of dissipating heat from the heat source 40 of the electronic device 100 by the heat dissipation device 30 is shown by the dashed arrows in FIG. 32. As shown in FIG. 32, the gas outside the electronic device 100 can enter the first sub-groove 134a from the first opening 136 of the cover 13, enter the first space 301 of the heat dissipation device 30 through the first through hole 1231, then flow through the first heat dissipation assembly and the second heat dissipation assembly, and flow to the second space 302 of the heat dissipation device 30, enter the second sub-groove 134b through the second through hole 1232, and finally flow to the outside of the electronic device 100 through the second opening 137. It can be understood that the air outside the electronic device 100 can enter the first chamber from the first opening 136, dissipate heat from the heat dissipation device 30, then flow to the second chamber, and finally the gas in the second chamber can flow to the outside of the electronic device 100 through the second opening 137, and the gas with heat in the second chamber will not flow back to the first chamber, affecting the heat dissipation efficiency of the heat dissipation device.

[0379] In the embodiment of the present application, the heat of the heat source 40 of the electronic device 100 can be conducted to the first heat dissipation assembly 32 and the second heat dissipation assembly 33 of the heat dissipation device 30, the first heat dissipation assembly 32 and the second heat dissipation assembly 33 can generate airflow, and the heat source 40 of the electronic device 100 is cooled by the airflow, thereby avoiding the heat of the heat source 40 of the electronic device 100 being conducted to the device housing 10 of the electronic device 100, causing the temperature of the device housing 10 of the electronic device 100 to rise, thereby facilitating the improvement of the user's experience.

[0380] It can be understood that in the embodiment of the present application, the gas flowing through the heat dissipation device 30 can carry away heat, thereby cooling the heat source 40 of the electronic device 100. Therefore, the airflow entering the second space 302 from the first gas outlet 327 carries a large amount of heat, so that the temperature of the gas flowing out of the second opening 137 from the second space 302 is usually higher than the temperature of the gas entering the first opening 136. If the gas with high temperature is reabsorbed into the first opening 136, the heat dissipation efficiency of the heat dissipation device 30 will be affected. In the embodiment of the present application, the first opening 136 and the second opening 137 are respectively arranged on the first side wall 133a and the third side wall 133c which are oppositely arranged, so that the gas flowing out of the second opening 137 can be far away from the first opening 136, thereby the gas with heat flowing out of the second opening 137 will not be reabsorbed into the heat dissipation device 30, affecting the heat dissipation effect of the heat dissipation device 30.

[0381] In addition, in the present embodiment, the cover 13 has the first sub-groove 134a and the second sub-groove 134b, so that the space enclosed by the cover 13 and the device housing 10 is large, facilitating the circulation of the gas inside the electronic device 100, and facilitating the rapid removal of heat by the gas, thereby improving the heat dissipation efficiency.

[0382] In some embodiments, the first space 301 and the second space 302 of the heat dissipation device 30 can be spaced apart from the internal space 101 of the electronic device 100. That is, the first space 301 and the second space 302 can be separated from the internal space 101 of the electronic device 100. In this way, the space jointly enclosed by the device housing 10, the cover 13 of the electronic device 100 and the shell 34 of the heat dissipation device 30 can be separated from the internal space 101 of the electronic device 100. On the one hand, when air enters the first space 301 through the first opening 136 of the electronic device 100, the gas will not flow into the internal space 101 of the electronic device 100, so that more gas can flow better to the heat dissipation device 30 and carry away the heat on the heat dissipation device 30, thereby facilitating the enhancement of heat dissipation of the heat dissipation device 30 and improving the heat dissipation rate. On the other hand, the internal space 101 of the electronic device 100 can be isolated from the outside world, so that dust, water vapor and the like from the outside world are less likely to enter the internal space 101 of the electronic device 100 and affect the internal components of the electronic device 100, thereby facilitating the guarantee of the reliability of the electronic device 100.

[0383] In other embodiments, the heat dissipation device 30 can also be fixed to the middle frame 121 of the device housing 10 and located between the rear cover 122 and the display screen 20. The application does not strictly limit the fixed position of the heat dissipation device 30.

[0384] In other embodiments, the heat dissipation device 30 can also not include the shell 34. At this time, the device housing 10 can include the shell 34, that is, the shell 34 can belong to the device housing 10 and be a part of the device housing 10.

[0385] It can be understood that the structure of the heat dissipation device 30 shown in FIG. 18 is similar to that of the heat dissipation device 30 shown in FIG. 5, and the assembly manner of the heat dissipation device 30 shown in FIG. 18 in the electronic device 100 is similar to that of the heat dissipation device 30 shown in FIGS. 32 and 33 in the electronic device 100. For the assembly manner of the heat dissipation device 30 in the electronic device 100 shown in FIGS. 32 and 33, which will not be repeated here.

[0386] Please refer to FIGS. 34 and 35, FIG. 34 is a structural schematic diagram of the electronic device 100 in other embodiments shown in FIG. 1, and FIG. 35 is a partial structural exploded view of the electronic device 100 in some embodiments shown in FIG. 34. For example, the electronic device 100 shown in FIGS. 34 and 35 includes the heat dissipation device 30 shown in FIG. 24. The embodiment shown in FIG. 34 can include most of the technical content of the previous embodiments, and the differences between the two will be mainly described below. Most of the same scheme contents of the two will not be repeated here.

[0387] In the present embodiment, the electronic device 100 can include a device housing 10, a display screen 20, a heat dissipation device 30, and a cover 13.

[0388] It can be understood that FIG. 34 and FIG. 35 only schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual structure of the components are not limited by FIG. 34 and FIG. 35.

[0389] It can be understood that the electronic device 100 can have more or fewer components. For example, the electronic device 100 can have more components. The electronic device 100 can have fewer components. The electronic device 100 can also not include the display screen 20 and / or the cover 13.

[0390] For example, the device housing 10 can include a middle frame 121 and a back cover 122. The middle frame 121 can be fixed between the back cover 122 and the display screen 20. The cover 13 can be fixed to the top of the device housing 10. It can be understood that the cover 13 can be fixed to the side of the back cover 122 away from the display screen 20.

[0391] For example, the back cover 122 of the device housing 10 can have a through hole 123. The through hole 123 of the device housing 10 can communicate the internal space 101 of the electronic device 100 with the outside of the electronic device 100. For example, the cover 13 can cover the through hole 123 of the device housing 10. In other examples, the through hole 123 of the device housing 10 can also be located in the middle frame 121 of the device housing 10, and the present application does not make strict limitations.

[0392] Please refer to FIG. 35 and FIG. 36, FIG. 36 is a structural schematic view of the cover 13 shown in FIG. 35 from another angle.

[0393] In some embodiments, the cover 13 can generally be a quadrilateral housing. The cover 13 can include a top wall 131 and a bottom wall 132 arranged oppositely, and can also include a peripheral side wall 133 connected between the top wall 131 and the bottom wall 132. For example, the peripheral side wall 133 of the cover 13 can include a first side wall 133a, a second side wall 133b, a third side wall 133c, and a fourth side wall 133d connected in sequence. Among them, the first side wall 133a and the third side wall 133c are arranged oppositely, and the second side wall 133b and the fourth side wall 133d are arranged oppositely. It can be understood that the top wall 131, the bottom wall 132, and the peripheral side wall 133 of the cover 13 jointly constitute a cover main body 130 of the cover 13.

[0394] For example, the cover body 130 can have a recess 134. The opening of the recess 134 can be located at the bottom wall 132 of the cover 13. That is, the recess 134 can be formed by the bottom wall 132 of the cover 13 being recessed towards the top wall 131 of the cover 13.

[0395] In some embodiments, the cover 13 can have a first opening 136 and a second opening 137 arranged at intervals. The first opening 136 can pass through the peripheral side wall 133 of the cover 13 and communicate with the recess 134 of the cover 13. The second opening 137 can pass through the top wall 131 of the cover 13 and communicate with the recess 134 of the cover 13. For example, the second opening 137 can also pass through the bottom wall 132 of the cover 13, that is, the second opening 137 can communicate with the opening of the recess 134.

[0396] In some embodiments, the second opening 137 can be arranged at the top wall 131 of the cover 13. The first opening 136 can be arranged at at least one of the first side wall 133a to the fourth side wall 133d of the cover 13, for example, the first opening 136 can be arranged at the first side wall 133a of the cover 13. In another example, the first opening 136 can also be arranged at the second side wall 133b or the third side wall 133c of the cover 13, which is not strictly limited in the present application.

[0397] For example, the cover 13 of the electronic device 100 can also have a third opening 138. The third opening 138 is arranged at intervals from the first opening 136 and the second opening 137. The third opening 138 can pass through the peripheral side wall 133 of the cover 13 and communicate with the recess 134 of the cover 13. For example, the third opening 138 can be arranged at the third side wall 133c of the cover 13. The third opening 138 can also pass through the bottom wall 132 of the cover 13, that is, the third opening 138 can communicate with the opening of the recess 134.

[0398] For example, the first opening 136, the second opening 137 and the third opening 138 can each be an elongated opening. In other embodiments, the first opening 136, the second opening 137 and the third opening 138 can also be circular or other shapes. The number of the first opening 136, the second opening 137 and the third opening 138 can each be one or more. It can be understood that the shape and number of the first opening 136, the second opening 137 and the third opening 138 can be arranged according to the specific structure of the electronic device 100. The shape and number of the first opening 136, the second opening 137 and the third opening 138 are not strictly limited in the present application.

[0399] Please refer to FIG. 37, which is a partial cross-sectional structure schematic diagram of the electronic device 100 along H-H in some embodiments of FIG. 34.

[0400] In some embodiments, the housing 34 of the heat dissipation device 30 can be fixed to the device housing 10 of the electronic device 100. For example, the housing 34 can be fixed to the inner side of the back cover 122, i.e., the housing 34 can be fixed to the side of the back cover 122 facing the display screen 20.

[0401] For example, the second part 316 of the heat conduction member 31 can be located in the internal space 101 of the electronic device 100 and abut the heat source 40 of the electronic device 100. In this way, the heat of the heat source 40 of the electronic device 100 can be conducted to the heat conduction member 31, so that the heat dissipation of the heat source 40 of the electronic device 100 can be achieved.

[0402] It can be understood that, in the embodiments of the present application, at least one of the first part 315 and the second part 316 of the heat conduction member 31 can be used to abut the heat source 40 of the electronic device 100, so that the heat of the heat source 40 of the electronic device 100 can be conducted to the heat conduction member 31. At least one of the first part 315 and the second part 316 of the heat conduction member 31 can be used to fix the first heat dissipation component 32 and the second heat dissipation component 33, so that the first heat dissipation component 32 and the second heat dissipation component 33 can dissipate heat from the heat conduction member 31, thereby achieving the cooling of the heat source 40 of the electronic device 100.

[0403] For example, the arrangement direction of the first heat dissipation component 32 and the second heat dissipation component 33 can be perpendicular to the Z-axis direction. At this time, the first heat dissipation component 32 and the second heat dissipation component 33 can be vertically arranged (i.e., the thickness direction of the first heat dissipation component 32 and the thickness direction of the second heat dissipation component 33 can be perpendicular to the Z-axis direction). In this way, the first heat dissipation component 32 and the second heat dissipation component 33 occupy less space in the direction perpendicular to the Z-axis direction, which is conducive to reducing the size of the electronic device 100 in the direction perpendicular to the thickness direction. It can be understood that the heat dissipation device 30 of the embodiments of the present application is suitable for electronic devices 100 with small size in the direction perpendicular to the thickness direction. Moreover, the first heat dissipation component 32 and the second heat dissipation component 33 can dissipate heat from the heat conduction member 31, which is conducive to improving the heat dissipation efficiency of the heat dissipation device 30.

[0404] It can be understood that in the embodiment, the second part 316 of the heat conduction member 31 is attached to the heat source 40 of the electronic device 100. In some embodiments, the first heat dissipation assembly 32 or the second heat dissipation assembly 33 can also be fixed to the side of the second part 316 away from the heat source 40, that is, the first heat dissipation assembly 32 or the second heat dissipation assembly 33 can be fixed to the two sides of the second part 316 away from the heat source 40, so that the first heat dissipation assembly 32 or the second heat dissipation assembly 33 can quickly dissipate heat from the second part 316 of the heat conduction member 31, thereby reducing the thermal resistance during heat transfer on the heat conduction member 31. In this way, the heat conduction efficiency loss of the heat on the heat conduction member 31 can be reduced, which is beneficial to improve the heat dissipation efficiency, so as to achieve rapid cooling of the heat source 40 of the electronic device 100.

[0405] In some embodiments, the cover 13 can cover the through hole 123 of the device shell 10 to form an air inlet chamber. It can be understood that the groove 134 of the cover 13 can be in communication with the through hole 123. At this time, the groove 134 of the cover 13, the through hole 123 of the device shell 10 and the internal space of the shell 34 can jointly constitute an air inlet chamber, and the air inlet chamber can be in communication with the first opening 136, the second opening 137 and the third opening 138. In the embodiment, the cover 13 has the groove 134, so that the space enclosed by the cover 13 and the device shell 10 is large, which is beneficial to the circulation of gas in the electronic device 100 and improves the heat dissipation efficiency. In addition, the groove 134 of the cover 13 is part of the air inlet chamber, that is, the electronic device 100 can form the air inlet chamber by using the structure of the cover 13 itself, so that it is not necessary to additionally provide a protruding structure on the device shell 10 to form the air inlet chamber, which is beneficial to reduce the size of the electronic device 100 in the Z-axis direction.

[0406] For example, the first air outlet 327 of the first heat dissipation assembly 32 is directed to the second opening 137 of the cover 13 and is in communication with the second opening 137. At this time, the first air outlet 327 can be in communication with the outside of the electronic device 100 through the second opening 137. The second air outlet 337 of the second heat dissipation assembly 33 is directed to the second opening 137 of the cover 13 and is in communication with the second opening 137. At this time, the second air outlet 337 can be in communication with the outside of the electronic device 100 through the second opening 137.

[0407] For example, the first portion 315, the first top plate 321, the first bottom plate 322, the first connecting frame 323, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 of the heat conduction member 31 are in sealing connection with the groove bottom wall of the groove 134 of the cover 13. In this way, the gaps between the first portion 315, the first top plate 321, the first bottom plate 322, the first connecting frame 323, the second top plate 331, the second bottom plate 332, the second connecting frame 333 of the heat conduction member 31 and the groove bottom wall of the groove 134 of the cover 13 are sealed, so that the gas in the internal space of the shell 34 cannot flow to the second opening 137 through the gaps and flow out of the internal space of the shell 34, thereby avoiding the reduction of the heat dissipation efficiency.

[0408] In some embodiments, the first portion 315, the first top plate 321, the first bottom plate 322, the first connecting frame 323, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 of the heat conduction member 31 can be located in the third through hole 3411 and in sealing connection with the inner wall of the third through hole 3411. That is, the first portion 315, the first top plate 321, the first bottom plate 322, the first connecting frame 323, the second top plate 331, the second bottom plate 332 and the second connecting frame 333 of the heat conduction member 31 can collectively seal the third through hole 3411.

[0409] At this time, the internal space of the shell 34 of the heat dissipation device 30 is spaced apart from the internal space 101 of the electronic device 100. That is, the internal space of the shell 34 can be separated from the internal space 101 of the electronic device 100. In this way, the space collectively enclosed by the cover 13 of the electronic device 100, the rear cover 122 of the device shell 10 and the shell 34 of the heat dissipation device 30 can be separated from the internal space 101 of the electronic device 100. On the one hand, the gas in the internal space of the shell 34 cannot flow into the internal space 101 of the electronic device 100, so that more gas can flow to the heat dissipation device 30 and carry away the heat on the heat dissipation device 30, thereby facilitating the enhancement of the heat dissipation of the heat dissipation device 30 and the improvement of the heat dissipation rate. On the other hand, the internal space 101 of the electronic device 100 can be isolated from the outside, so that the outside dust, water vapor and the like cannot easily enter the internal space 101 of the electronic device 100 and cannot easily affect the internal components of the electronic device 100, thereby facilitating the guarantee of the reliability of the electronic device 100.

[0410] In other embodiments, the first portion 315, the first heat dissipation assembly 32 and the second heat dissipation assembly 33 of the heat conduction member 31 can be located in the internal space of the shell 34. At least part of the second portion 316 of the heat conduction member 31 can be located in the third through hole 3411 and in sealing connection with the inner wall of the third through hole 3411. That is, the second portion 316 of the heat conduction member 31 can seal the third through hole 3411.

[0411] For example, the approximate flow direction of the gas in the process of dissipating heat from the heat source 40 of the electronic device 100 by the heat dissipation device 30 is shown by the dashed arrows in FIG. 37. As shown in FIG. 37, the gas outside the electronic device 100 can enter the internal space of the shell 34 of the heat dissipation device 30 from the first opening 136 and the third opening 138 of the cover 13 through the via hole 123 of the device housing 10, and then flow to the first heat dissipation assembly 32 and the second heat dissipation assembly 33 of the heat dissipation device 30. The gas flows through the first heat dissipation assembly 32 and flows out from the first gas outlet 327 of the first heat dissipation assembly 32, and the gas flows through the second heat dissipation assembly 33 and flows out from the second gas outlet 337 of the second heat dissipation assembly 33. Finally, the gas flows to the outside of the electronic device 100 through the second opening 137. It can be understood that the air outside the electronic device 100 can enter the air inlet chamber from the first opening 136, and then flow through the heat dissipation device 30 and dissipate heat from the heat dissipation device 30. Then, the gas can flow to the outside of the electronic device 100 through the second opening 137. The gas with heat flowing out from the second opening 137 will not flow back to the air inlet chamber, which affects the heat dissipation efficiency of the heat dissipation device 30.

[0412] In the embodiments of the present application, the heat of the heat source 40 of the electronic device 100 can be conducted to the first heat dissipation assembly 32 and the second heat dissipation assembly 33 of the heat dissipation device 30. The first heat dissipation assembly 32 and the second heat dissipation assembly 33 can generate air flow and dissipate heat from the heat source 40 of the electronic device 100 through the air flow. Thus, the heat of the heat source 40 of the electronic device 100 can be avoided from being conducted to the device housing 10 of the electronic device 100, which causes the temperature of the device housing 10 of the electronic device 100 to rise. Therefore, the use experience of the user can be improved.

[0413] It can be understood that in the embodiments of the present application, the air flow flowing out from the second gas outlet 337 has a large amount of heat. The temperature of the gas flowing out from the second gas outlet 337 is generally higher than the temperature of the gas entering the first opening 136 and the third opening 138. If the gas with high temperature is reabsorbed into the first opening 136 and the third opening 138, the heat dissipation efficiency of the heat dissipation device 30 will be affected. In the present application, the second opening 137 is arranged on the top wall 131 of the cover 13, the first opening 136 is arranged on the first side wall 133a of the cover 13, and the third opening 138 is arranged on the third side wall 133c of the cover 13. Thus, the gas flowing out from the second opening 137 can be far away from the first opening 136 and the third opening 138. Therefore, the gas with heat flowing out from the second opening 137 will not be reabsorbed into the heat dissipation device 30, which affects the heat dissipation effect of the heat dissipation device 30.

[0414] In some other embodiments, the heat dissipation device 30 can also not include the shell 34. In this case, the device shell 10 of the electronic device 100 can include the shell 34, i.e., the shell 34 can belong to the device shell 10 as a part of the device shell 10.

[0415] In some other embodiments, the heat dissipation device 30 can further include a third heat dissipation component (not shown in the figure). The third heat dissipation component can have the same structure as the first heat dissipation component 32 and the second heat dissipation component 33, or can not include part of the structure of the first heat dissipation component 32 and / or the second heat dissipation component 33. The third heat dissipation component can be fixed to the second part 316 of the heat conduction member 31.

[0416] It can be understood that the heat dissipation device 30 can make corresponding adjustments to the arrangement of the first heat dissipation component 32 and the second heat dissipation component 33 according to the structure of the electronic device 100 to adapt to different shapes of the electronic device 100. For example, the arrangement direction of the first heat dissipation component 32 can be parallel to the Z-axis direction, and the arrangement direction of the second heat dissipation component 33 can be perpendicular to the Z-axis direction, i.e., the second heat dissipation component 33 can be arranged on the X-Y plane. In this case, the first heat dissipation component 32 and the second heat dissipation component 33 of the heat dissipation device 30 can form a heat dissipation scheme combined with "laying" and "standing".

[0417] Please refer to FIG. 38, which is a schematic diagram of part of the structure of the heat dissipation device 30 in some other embodiments shown in FIG. 4. The embodiment shown in FIG. 38 can include most of the technical content of the previous embodiments, and the following mainly describes the differences between the two, and most of the scheme content of the two that is the same will not be repeated here. It can be understood that FIG. 38 is a schematic diagram of part of the cross-sectional structure of the heat dissipation device 30 in some embodiments, and FIG. 38 only schematically shows some components included in the heat dissipation device 30, and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 38.

[0418] In the present embodiment, the heat dissipation device 30 can include the first heat dissipation component 32 and the second heat dissipation component 33. The structure of the second heat dissipation component 33 is similar to that of the second heat dissipation component 33 of the embodiment shown in FIG. 5. The structure of the second heat dissipation component 33 of the present embodiment can refer to the related description in the foregoing, which will not be repeated here.

[0419] The first heat dissipation assembly 32 in this embodiment has substantially the same structure as the first heat dissipation assembly 32 in the embodiment shown in FIG. 5, except that the first heat dissipation assembly 32 in this embodiment further includes a cover plate 328. The cover plate 328 can cover the first frame 324 and be located on the side of the first air source (not shown) away from the first top plate 321. In this embodiment, the cover plate 328 can cover the first air inlet space 3241 and the first air source, so as to block external dust and moisture from entering the interior of the first heat dissipation assembly 32 and affecting the reliability of the heat dissipation device 30. Meanwhile, the cover plate 328 can also be used to protect the first air source, the first top plate 321, and other structures.

[0420] In some embodiments, the first heat dissipation assembly 32 can be connected to the second heat dissipation assembly 33, and heat transfer can be achieved between the first heat dissipation assembly 32 and the second heat dissipation assembly 33. It can be understood that the first heat dissipation body 32A of the first heat dissipation assembly 32 and the second heat dissipation body 33A of the second heat dissipation assembly 33 are both made of heat-conductive materials. In this way, the heat of the heat source of the electronic device 100 can be conducted to the first heat dissipation assembly 32 through the second heat dissipation assembly 33, or conducted to the second heat dissipation assembly 33 through the first heat dissipation assembly 32. It can be understood that when the temperature of the first heat dissipation assembly 32 is greater than the temperature of the second heat dissipation assembly 33, the heat of the first heat dissipation assembly 32 can be conducted to the second heat dissipation assembly 33; when the temperature of the first heat dissipation assembly 32 is less than the temperature of the second heat dissipation assembly 33, the heat of the second heat dissipation assembly 33 can be conducted to the first heat dissipation assembly 32.

[0421] In some embodiments, the thermal conductivity coefficients of the first heat dissipation body 32A of the first heat dissipation assembly 32 and the second heat dissipation body 33A of the second heat dissipation assembly 33 can both be greater than or equal to 0.21 W / m·K. At this time, the first heat dissipation body 32A and the second heat dissipation body 33A both have a relatively fast heat conduction rate. The first heat dissipation body 32A and / or the second heat dissipation body 33A can be used to be in contact with the heat source of the electronic device 100, and the heat of the heat source of the electronic device 100 can be quickly conducted to the first heat dissipation body 32A and the second heat dissipation body 33A. For example, the materials of the first heat dissipation body 32A and the second heat dissipation body 33A can be graphite, and can also be high-thermal-conductivity metals such as copper, silver, aluminum, etc. It can be understood that the materials of the first heat dissipation body 32A and the second heat dissipation body 33A can also be other materials with a thermal conductivity coefficient greater than or equal to 0.21 W / m·K, which are not strictly limited in the present application.

[0422] In some embodiments, the first bottom plate 322 of the first heat dissipation component 32 can be arranged opposite and spaced apart from the second top plate 331 of the second heat dissipation component 33. The first bottom plate 322 of the first heat dissipation component 32 can be connected with the second frame 334 of the second heat dissipation component 33. Heat transfer can be achieved between the second frame 334 of the second heat dissipation component 33 and the first bottom plate 322 of the first heat dissipation component 32. In the present embodiment, when the heat dissipation device 30 is installed on the electronic device 100, the first heat dissipation component 32 and the second heat dissipation component 33 can be arranged along the thickness direction of the electronic device 100. In this way, the first heat dissipation component 32 and the second heat dissipation component 33 occupy less space in the direction perpendicular to the thickness direction of the electronic device 100, which is conducive to reducing the size of the electronic device 100 in the direction perpendicular to the thickness direction, i.e., in the X-Y plane. It can be understood that the heat dissipation device 30 of the present embodiment is more suitable for electronic devices 100 with small size in the direction perpendicular to the thickness direction.

[0423] For example, the approximate flow direction of the gas flowing through the heat dissipation device 30 is shown by dashed arrows in FIG. 38. As shown in FIG. 38, air can enter the first air inlet space 3241 of the first heat dissipation component 32 from the first air inlet 326 of the first heat dissipation component 32, then flow to the first bottom plate 322 through the first through hole 3213 to dissipate heat from the first bottom plate 322, and finally the gas with heat can flow out of the heat dissipation device 30 from the first air outlet 327. Similarly, air can enter the second air inlet space 3341 of the second heat dissipation component 33 from the second air inlet 336 of the second heat dissipation component 33, then flow to the second bottom plate 332 through the second through hole 3313 to dissipate heat from the second bottom plate 332, and finally the gas with heat can flow out of the heat dissipation device 30 from the second air outlet 337.

[0424] In some embodiments, the second bottom plate 332 of the second heat dissipation component 33 can be attached to the heat source of the electronic device 100, and heat transfer can be achieved between the second bottom plate 332 and the heat source of the electronic device 100. The heat of the heat source of the electronic device 100 can be conducted to the second bottom plate 332 of the second heat dissipation component 33, the second connecting frame 333, the second top plate 331, the second frame 334, and the first bottom plate 322 of the first heat dissipation component 32 in sequence, so that the second heat dissipation component 33 can dissipate the heat conducted to the second bottom plate 332, and the first heat dissipation component 32 can dissipate the heat conducted to the first bottom plate 322.

[0425] In some embodiments, the cover plate 328 of the first heat dissipation component 32 can be attached to the heat source of the electronic device 100, and heat transfer can be achieved between the cover plate 328 and the heat source of the electronic device 100. The heat of the heat source of the electronic device 100 can be conducted to the cover plate 328 of the first heat dissipation component 32, the first frame 324, the first top plate 321, the first connecting frame 323, and the first bottom plate 322 in sequence, and then to the second frame 334, the second top plate 331, the second connecting frame 333, and the second bottom plate 332 of the second heat dissipation component 33 in sequence. In this way, the first heat dissipation component 32 can dissipate the heat conducted to the first bottom plate 322, and the second heat dissipation component 33 can dissipate the heat conducted to the second bottom plate 332.

[0426] It can be understood that in the present embodiment, the first heat dissipation component 32 and the second heat dissipation component 33 of the heat dissipation device 30 can be attached to the heat source of the electronic device 100, and heat transfer can be achieved between the first heat dissipation component 32 and the second heat dissipation component 33 and the heat source of the electronic device 100. Therefore, the heat dissipation device 30 can achieve heat transfer with multiple heat sources of the electronic device 100, so as to dissipate heat of the multiple heat sources of the electronic device 100.

[0427] Please refer to FIG. 39, which is a schematic diagram of a partial cross-sectional structure of the heat dissipation device 30 in another embodiment. It can be understood that the heat dissipation device 30 shown in FIG. 39 only shows part of the structure of the heat dissipation device 30. The heat dissipation device 30 shown in FIG. 39 can include most of the technical content of the previous embodiments. Hereinafter, the differences between the two will be mainly described, and most of the scheme content of the two will not be described again.

[0428] In some embodiments, the heat dissipation device 30 can include the heat conduction member 31, the first heat dissipation component 32, the second heat dissipation component 33, the housing 34, and the cover plate 38. The structure and arrangement of the heat conduction member 31, the first heat dissipation component 32, the second heat dissipation component 33, and the housing 34 can refer to the structure and arrangement of the heat conduction member 31, the first heat dissipation component 32, the second heat dissipation component 33, and the housing 34 in any of the previous embodiments, which will not be described again here.

[0429] It can be understood that FIG. 39 only schematically shows some components included in the heat dissipation device 30, and the actual shape, actual size, actual position, and actual structure of these components are not limited by FIG. 39.

[0430] It can be understood that the heat dissipation device 30 can have more or fewer components. For example, the heat dissipation device 30 can have more components. The heat dissipation device 30 can have fewer components. The heat dissipation device 30 can also not include the housing 34 and the cover plate 38.

[0431] In some embodiments, the cover plate 38 can be fixed to the top of the housing 34. It can be understood that the cover 13 can be fixed to the side of the housing 34 away from the bottom wall 341. A portion of the cover plate 38 can cover the first space 301 of the housing 34 to form the first chamber. A portion of the cover plate 38 can cover the second space 302 of the housing 34 to form the second chamber. In the present embodiment, the structure of the cover plate 38 is similar to that of the cover 13 shown in FIGS. 30A and 30B. The structure of the cover plate 38 can be understood with reference to the relevant description of the structure of the cover 13 shown in FIGS. 30A and 30B.

[0432] For example, the cover plate 38 can include a cover body 381 and a partition 382. The cover body 381 can have a groove 3811, and the partition 382 can connect the inner wall of the groove 3811 of the cover body 381 and divide the groove 3811 into the first sub-groove 3811a and the second sub-groove 3811b arranged at intervals.

[0433] For example, the cover body 381 can be fixed to the peripheral side wall 342 of the housing 34 and surround the first space 301 and the second space 302 of the housing 34. The partition 382 of the cover plate 38 can be fixed to the partition plate 343 of the housing 34. At this time, the first sub-groove 3811a can be in communication with the first space 301, and the first sub-groove 3811a and the first space 301 together constitute the first chamber. The second sub-groove 3811b can be in communication with the second space 302, and the second sub-groove 3811b and the second space 302 together constitute the second chamber.

[0434] For example, the cover plate 38 can include a top wall 3812 and a bottom wall 3813 arranged in opposite directions, and further include a peripheral side wall 3814 connected between the top wall 3812 and the bottom wall 3813. For example, the peripheral side wall 3814 of the cover plate 38 can include the first side wall 3814a, the second side wall (not shown), the third side wall 3814c, and the fourth side wall 3814d connected in sequence. Among them, the first side wall 3814a is arranged opposite to the third side wall 3814c, and the second side wall (not shown) is arranged opposite to the fourth side wall 3814d. It can be understood that the top wall 3812, the bottom wall 3813, and the peripheral side wall 3814 of the cover plate 38 together constitute the cover body 381 of the cover plate 38. Among them, the top wall 3812 can cover the first space 301 and the second space 302 of the housing 34, and the bottom wall 3813 can be fixedly connected to the housing 34.

[0435] For example, the cover plate 38 can have the fourth opening 383 and the fifth opening 384 arranged at intervals. The fourth opening 383 can penetrate the peripheral side wall 3814 of the cover plate 38 and communicate with the first chamber. The fifth opening 384 can penetrate the peripheral side wall 3814 of the cover plate 38 and communicate with the second chamber.

[0436] For example, the approximate flow direction of the gas flowing through the heat dissipation device 30 is shown by the dashed arrows in FIG. 39. As shown in FIG. 39, in this embodiment, the gas outside the heat dissipation device 30 can enter the first chamber from the fourth opening 383; then the gas in the first chamber can enter the interior of the first heat dissipation component 32 from the first gas inlet 326 of the first heat dissipation component 32, flow through the interior of the first heat dissipation component 32, and then enter the second chamber from the first gas outlet 327; meanwhile, the gas in the first chamber can also enter the interior of the second heat dissipation component 33 from the second gas inlet 336 of the second heat dissipation component 33, flow through the interior of the second heat dissipation component 33, and then enter the second chamber from the second gas outlet 337, and take away the heat on the second heat dissipation component 33; finally, the gas in the second chamber can flow to the outside of the heat dissipation device 30 from the fifth opening 384.

[0437] It can be understood that when the heat dissipation device 30 dissipates heat, the gas flowing through the first heat dissipation component 32 and the second heat dissipation component 33 can take away the heat of the first heat dissipation component 32 and the second heat dissipation component 33. Therefore, the temperature of the gas flowing into the second chamber is higher than that of the gas in the first chamber, that is, the temperature of the gas flowing out of the fifth opening 384 to the outside of the heat dissipation device 30 is higher than that of the gas in the first chamber.

[0438] In some examples, the fourth opening 383 can be arranged on the first side wall 3814a, and the fifth opening 384 can be arranged on the third side wall 3814c. It can be understood that since the gas flowing out of the fifth opening 384 carries a large amount of heat and has a high temperature, if the gas with a high temperature is reabsorbed into the fourth opening 383, it will affect the heat dissipation efficiency of the heat dissipation device 30. In this embodiment, by arranging the fourth opening 383 and the fifth opening 384 on the first side wall 3814a and the third side wall 3814c arranged opposite to each other, the gas flowing out of the fifth opening 384 can be away from the fourth opening 383, so that the gas carrying heat flowing out of the fifth opening 384 will not be reabsorbed into the heat dissipation device 30, affecting the heat dissipation effect of the heat dissipation device 30. In other examples, the first opening 136 can be arranged on the first side wall 133a, and the second opening 137 can be arranged on the second side wall 133b; or, the first opening 136 can be arranged on the second side wall 133b, and the second opening 137 can be arranged on the third side wall 133c. The present application does not make strict limitations in this regard.

[0439] In this embodiment, the heat dissipation device 30 has high integrity and high degree of modularity. When the heat dissipation device 30 is applied to an electronic device, the heat dissipation device 30 can be simply assembled on the electronic device 100.

[0440] Referring to Fig. 40, Fig. 40 is a schematic diagram showing a partial cross-sectional structure of the heat dissipation device 30 shown in Fig. 4 in some embodiments. It is to be understood that the heat dissipation device 30 shown in Fig. 40 only shows a partial structure of the heat dissipation device 30. The heat dissipation device 30 shown in Fig. 40 can include most of the technical contents of the previous embodiments, and the following mainly describes the differences between the two, and most of the scheme contents of the two are not described again.

[0441] In some embodiments, the heat dissipation device 30 can include the heat conduction member 31, the first heat dissipation assembly 32, the second heat dissipation assembly 33, the shell 34, and the cover plate 38. The structure and arrangement of the heat conduction member 31, the first heat dissipation assembly 32, the second heat dissipation assembly 33, and the shell 34 can refer to the structure and arrangement of the heat conduction member 31, the first heat dissipation assembly 32, the second heat dissipation assembly 33, and the shell 34 of any of the previous embodiments, which will not be described again here.

[0442] It is to be understood that Fig. 40 only schematically shows some components included in the heat dissipation device 30, and the actual shape, actual size, actual position, and actual structure of these components are not limited by Fig. 40.

[0443] It is to be understood that the heat dissipation device 30 can have more or fewer components. For example, the heat dissipation device 30 can have more components. The heat dissipation device 30 can have fewer components. The heat dissipation device 30 can also not include the shell 34 and the cover plate 38.

[0444] In some embodiments, the cover plate 38 can be fixed to the top of the shell 34. It is to be understood that the cover member 13 can be fixed to the side of the shell 34 away from the bottom wall 341. The cover plate 38 can cover the internal space of the shell 34 to form an air inlet chamber. In this embodiment, the structure of the cover plate 38 is similar to that of the cover member 13 shown in Figs. 35 and 36. The structure of the cover plate 38 can refer to the related description of the structure of the cover member 13 shown in Figs. 35 and 36.

[0445] For example, the cover plate 38 can be fixed to the peripheral side wall 342 of the shell 34 and surround the internal space of the shell 34. For example, the cover plate 38 can have a groove 3811. The groove 3811 of the cover plate 38 can communicate with the internal space of the shell 34, and the groove 3811 and the internal space of the shell 34 together constitute an air inlet chamber.

[0446] Exemplarily, the cover plate 38 can comprise a top wall 3812 and a bottom wall 3813 arranged oppositely, and further comprise a peripheral side wall 3814 connected between the top wall 3812 and the bottom wall 3813. Exemplarily, the peripheral side wall 3814 of the cover plate 38 can comprise a first side wall 3814a, a second side wall (not shown), a third side wall 3814c and a fourth side wall 3814d connected in sequence. The first side wall 3814a is arranged oppositely to the third side wall 3814c, and the second side wall (not shown) is arranged oppositely to the fourth side wall 3814d. The top wall 3812 can cover the internal space of the shell 34, and the bottom wall 3813 can be fixedly connected to the shell 34.

[0447] Exemplarily, the cover plate 38 can have a fourth opening 383, a fifth opening 384 and a sixth opening 385 arranged at intervals. The fourth opening 383, the fifth opening 384 and the sixth opening 385 can all communicate with the internal space of the shell 34.

[0448] Exemplarily, the approximate flow direction of the gas flowing through the heat dissipation device 30 is shown by the dashed arrows in FIG. 40. As shown in FIG. 40, in the present embodiment, the gas outside the heat dissipation device 30 can enter the gas inlet chamber from the fourth opening 383 and the sixth opening 385; then the gas in the gas inlet chamber can enter the interior of the first heat dissipation component 32 from the first gas inlet 326 of the first heat dissipation component 32, flow through the interior of the first heat dissipation component 32, and then flow to the outside of the heat dissipation device 30 from the first gas outlet 327 and the fifth opening 384, thereby taking away the heat on the first heat dissipation component 32; at the same time, the gas in the internal space of the shell 34 can also enter the interior of the second heat dissipation component 33 from the second gas inlet 336 of the second heat dissipation component 33, flow through the interior of the second heat dissipation component 33, and then flow to the outside of the heat dissipation device 30 from the second gas outlet 337 and the fifth opening 384, thereby taking away the heat on the second heat dissipation component 33.

[0449] It can be understood that when the heat dissipation device 30 dissipates heat, the gas flowing through the first heat dissipation component 32 and the second heat dissipation component 33 can take away the heat of the first heat dissipation component 32 and the second heat dissipation component 33. Therefore, the temperature of the gas flowing to the outside of the heat dissipation device 30 from the fifth opening 384 is higher than the temperature of the gas in the gas inlet chamber of the heat dissipation device 30.

[0450] For example, the fourth opening 383 can be arranged on the first side wall 3814a, the fifth opening 384 can be arranged on the top wall 3812 of the cover plate 38, and the sixth opening 385 can be arranged on the third side wall 3814c of the cover plate 38. It can be understood that the gas flowing out of the fifth opening 384 has a large amount of heat and a high temperature. If the gas with a high temperature is reabsorbed into the fourth opening 383 and the sixth opening 385, the heat dissipation efficiency of the heat dissipation device 30 will be affected. In the embodiment, the fourth opening 383 is arranged on the first side wall 3814a, the sixth opening 385 is arranged on the third side wall 3814c, and the fifth opening 384 is arranged on the top wall 3812. In this way, the gas flowing out of the fifth opening 384 can be far away from the fourth opening 383 and the sixth opening 385. Therefore, the gas with heat flowing out of the fifth opening 384 will not be reabsorbed into the heat dissipation device 30, and the heat dissipation effect of the heat dissipation device 30 will not be affected. In other examples, the sixth opening 385 can also be arranged on the first side wall 3814a, the second side wall, or the fourth side wall 3814d. The present application does not make strict limitations in this regard.

[0451] In the embodiment, the heat dissipation device 30 has high integrity and high degree of modularity. When the heat dissipation device 30 is applied to the electronic device, the heat dissipation device 30 can be simply assembled on the electronic device 100.

[0452] In other embodiments, the cover plate 38 can also not include the sixth opening 385, and the present application does not make strict limitations in this regard.

[0453] It can be understood that the structure of the heat dissipation device 30 provided by the present application can be adjusted according to the internal space of the electronic device 100. For example, the heat dissipation device 30 can include more or fewer components; the structure of the heat conduction member 31 can also have other forms; and the first heat dissipation assembly 32 and the second heat dissipation assembly 33 can also have other arrangement modes.

[0454] It should be noted that all the above-mentioned drawings are exemplary illustrations of the present application, and do not represent the actual size of the product. The size ratio relationship between the components in the drawings also does not limit the actual product of the present application.

[0455] The above is only part of the embodiments of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipating device (30) characterized by, The heat conducting piece (31), the first heat dissipation assembly (32) and the second heat dissipation assembly (33), the first heat dissipation assembly (32) and the second heat dissipation assembly (33) are connected with the heat conducting piece (31), and heat transfer can be realized between the heat conducting piece (31), the first heat dissipation assembly (32) and the second heat dissipation assembly (33), the first heat dissipation assembly (32) and the second heat dissipation assembly (33) are used for generating air flow; In the arrangement direction of the first heat dissipation assembly (32) and the second heat dissipation assembly (33), the projection of the first heat dissipation assembly (32) on the heat conducting piece (31) and the projection of the second heat dissipation assembly (33) on the heat conducting piece (31) have an overlapping area.

2. The heat dissipating device (30) according to claim 1, characterized in that The first heat dissipation assembly (32) comprises a first heat dissipation main body (32A) and a first air source (32B), the first heat dissipation main body (32A) comprises a first top plate (321), a first bottom plate (322), a first connecting frame (323) and a first frame body (324), the first top plate (321) and the first bottom plate (322) are oppositely arranged, the first connecting frame (323) is connected between the first top plate (321) and the first bottom plate (322), and the first top plate (321), the first bottom plate (322) and the first connecting frame (323) jointly form a first air outlet space (3231); The first frame body (324) is arranged on the side of the first top plate (321) away from the first bottom plate (322), the first frame body (324) and the first top plate (321) jointly form a first air inlet space (3241), and the first air inlet space (3241) and the first air outlet space (3231) are oppositely arranged; The first top plate (321) comprises a plurality of first through holes (3213), each first through hole (3213) penetrates the first top plate (321) and communicates the first air inlet space (3241) and the first air outlet space (3231); The first bottom plate (322) has a first heat dissipation surface (3221) and a first heat conduction surface (3222) arranged oppositely, the first heat dissipation surface (3221) is located in the first air outlet space (3231), and the first heat conduction surface (3222) is connected with the heat conducting piece (31); The first air source (32B) is arranged in the first air inlet space (3241), and the first air source (32B) is used for generating air flow.

3. The heat dissipating device (30) according to claim 2, characterized in that The second heat dissipation assembly (33) comprises a second heat dissipation body (33A) and a second air source (33B), the second heat dissipation body (33A) comprises a second top plate (331), a second bottom plate (332), a second connecting frame (333) and a second frame body (334), the second top plate (331) is arranged opposite to the second bottom plate (332), the second connecting frame (333) is connected between the second top plate (331) and the second bottom plate (332), and the second top plate (331), the second bottom plate (332) and the second connecting frame (333) jointly form a second air outlet space (3331); The second frame body (334) is arranged on the side of the second top plate (331) away from the second bottom plate (332), the second frame body (334) and the second top plate (331) jointly form a second air inlet space (3341), and the second air inlet space (3341) is arranged opposite to the second air outlet space (3331); The second top plate (331) comprises a plurality of second through holes (3313), each second through hole (3313) penetrates the second top plate (331) and communicates the second air inlet space (3341) and the second air outlet space (3331); The second bottom plate (332) has a second heat dissipation surface (3321) and a second heat conduction surface (3322) arranged opposite to each other, the second heat dissipation surface (3321) is located in the second air outlet space (3331), and the second heat conduction surface (3322) is connected to the heat conduction member (31); The second air source (33B) is arranged in the second air inlet space (3341), and the second air source (33B) is used for generating air flow.

4. The heat dissipating device (30) according to claim 3, characterized in that The first heat dissipation assembly (32) further comprises a first air inlet (326), the first air inlet (326) is located in the first frame body (324), and the first air inlet (326) communicates the first air inlet space (3241) and the outside of the first heat dissipation assembly (32); And / or, the first heat dissipation assembly (32) further comprises a first air outlet (327), the first air outlet (327) is located in the first connecting frame (323), and the first air outlet (327) communicates the first air outlet space (3231) and the outside of the first heat dissipation assembly (32); And / or, the second heat dissipation assembly (33) further comprises a second air inlet (336), the second air inlet (336) is located in the second frame body (334), and the second air inlet (336) communicates the second air inlet space (3341) and the outside of the second heat dissipation assembly (33); And / or, the second heat dissipation assembly (33) further comprises a second air outlet (337), the second air outlet (337) is located in the second connecting frame (333), and the second air outlet (337) communicates the second air outlet space (3331) and the outside of the second heat dissipation assembly (33).

5. The heat dissipating device (30) according to claim 4, characterized in that The first air inlet (326) penetrates the first frame (324) in a first direction, and the first air outlet (327) penetrates the first connecting frame (323) in a second direction, wherein the first direction is different from the second direction. And / or, the second air inlet (336) penetrates the second frame (334) in a first direction, and the second air outlet (337) penetrates the second connecting frame (333) in a second direction, wherein the first direction is different from the second direction.

6. The heat dissipating device (30) according to claim 4 or 5, characterized in that The aperture of the first through hole (3213) and / or the second through hole (3313) is less than or equal to 1mm.

7. The heat dissipating device (30) according to any one of claims 4 to 6, characterized in that The thermal conductivity of the heat conduction member (31) is greater than or equal to 0.21W / m·K. The thermal conductivity of the first bottom plate (322) and / or the second bottom plate (332) is greater than or equal to 0.21W / m·K.

8. The heat dissipating device (30) according to any one of claims 4 to 7, characterized in that The first air source (32B) is a diaphragm, and the first air source (32B) is fixed to the first frame (324) and is arranged opposite to the first top plate (321). And / or, the second air source (33B) is a diaphragm, and the second air source (33B) is fixed to the second frame (334) and is arranged opposite to the second top plate (331).

9. The heat dissipating device (30) according to any one of claims 4 to 8, characterized in that The heat conduction member (31) comprises a first part (311), a second part (312), and a third part (313), the first part (311) and the third part (313) are arranged opposite and spaced apart, and the second part (312) is connected between the first part (311) and the third part (313). The first heat dissipation assembly (32) is fixed to the first part (311), and the second heat dissipation assembly (33) is fixed to the third part (313). Or, the first heat dissipation assembly (32) and the second heat dissipation assembly (33) are both fixed to the first part (311). Or, the first heat dissipation assembly (32) is fixed to the second part (312), and the second heat dissipation assembly (33) is fixed to the third part (313).

10. The heat dissipating device (30) according to claim 9, characterized in that The first part (311), the second part (312), and the third part (313) jointly enclose an installation space (310); The first heat dissipation assembly (32) is located on the side of the first part (311) away from the installation space (310), and the second heat dissipation assembly (33) is located in the installation space (310); Or, the first heat dissipation assembly (32) is located on the side of the first part (311) away from the installation space (310), and the second heat dissipation assembly (33) is located on the side of the third part (313) away from the installation space (310); Or, the first heat dissipation assembly (32) and the second heat dissipation assembly (33) are both located in the installation space (310); Or, the first heat dissipation assembly (32) is located on the side of the second part (312) away from the installation space (310), and the second heat dissipation assembly (33) is located in the installation space (310); Or, the first heat dissipation component (32) is located on the side of the second part (312) away from the mounting space (310), and the second heat dissipation component (33) is located on the side of the third part (313) away from the mounting space (310).

11. The heat dissipating device (30) according to any one of claims 4 to 8, characterized in that The heat conduction member (31) comprises a first part (315) and a second part (316), the first part (315) is connected to the second part (316), and the first part (315) and the second part (316) are arranged at an included angle; The first heat dissipation component (32) and the second heat dissipation component (33) are fixed on the first part (315) respectively. Or, the first heat dissipation component (32) is fixed on the first part (315), and the second heat dissipation component (33) is fixed on the second part (316).

12. The heat dissipating device (30) according to claim 11, characterized in that The first part (315) has a first surface (3151) and a second surface (3152) arranged away from each other, and the second part (316) has a third surface (3161) and a fourth surface (3162) arranged away from each other; The first heat dissipation component (32) is fixed on the first surface (3151), and the second heat dissipation component (33) is fixed on the second surface (3152); Or, the first heat dissipation component (32) is fixed on the first surface (3151), and the second heat dissipation component (33) is fixed on the third surface (3161); Or, the first heat dissipation component (32) is fixed on the first surface (3151), and the second heat dissipation component (33) is fixed on the fourth surface (3162); Or, the first heat dissipation component (32) is fixed on the second surface (3152), and the second heat dissipation component (33) is fixed on the third surface (3161); Or, the first heat dissipation component (32) is fixed on the second surface (3152), and the second heat dissipation component (33) is fixed on the fourth surface (3162).

13. The heat dissipating device (30) according to any one of claims 4 to 8, characterized in that The heat conduction member (31) is in a plate shape, the heat conduction member (31) comprises a first surface and a second surface arranged away from each other, the first heat dissipation component (32) is fixed on the first surface of the heat conduction member (31), and the second heat dissipation component (33) is fixed on the second surface of the heat conduction member (31).

14. The heat dissipating device (30) according to any one of claims 4 to 10, characterized in that The heat dissipation device (30) further comprises a shell (34), the shell (34) has a bottom wall (341) and a peripheral side wall (342), the peripheral side wall (342) of the shell (34) is connected to the peripheral edge of the bottom wall (341) of the shell (34), and the bottom wall (341) of the shell (34) and the peripheral side wall (342) of the shell (34) jointly define an internal space of the shell (34); The heat conduction member (31), the first heat dissipation component (32), and the second heat dissipation component (33) are located in the internal space of the shell (34), and the first heat dissipation component (32) is located on the side of the second heat dissipation component (33) away from the bottom wall (341) of the shell (34).

15. The heat dissipating device (30) according to claim 14, characterized in that The shell (34) further comprises a partition plate (343) connecting a bottom wall (341) of the shell (34) and a peripheral side wall (342) of the shell (34) and separating an inner space of the shell (34) into a first space (301) and a second space (302); The partition plate (343) is provided with a communication hole (3431) communicating the first space (301) and the second space (302); The first heat dissipation assembly (32) and the second heat dissipation assembly (33) are both located in the first space (301), and the first air outlet (327) and the second air outlet (337) both communicate with the second space (302) through the communication hole (3431).

16. The heat dissipating device (30) according to claim 14, characterized in that The shell (34) further comprises a partition plate (343) connecting a bottom wall (341) of the shell (34) and a peripheral side wall (342) of the shell (34) and separating an inner space of the shell (34) into a first space (301) and a second space (302); Part of the first heat dissipation assembly (32) is located in the first space (301) and part is located in the partition plate (343) so that the first air outlet (327) communicates with the second space (302); Part of the second heat dissipation assembly (33) is located in the first space (301) and part is located in the partition plate (343) so that the second air outlet (337) communicates with the second space (302).

17. The heat dissipating device (30) according to claim 15 or 16, characterized in that The heat dissipation device (30) further comprises a cover plate (38) fixed to a top of the shell (34), part of the cover plate (38) covers the first space (301) to form a first chamber, and part of the cover plate (38) covers the second space (302) to form a second chamber; The cover plate (38) has a fourth opening (383) and a fifth opening (384) arranged at intervals, the fourth opening (383) communicates the first chamber, and the fifth opening (384) communicates the second chamber.

18. The heat dissipating device (30) according to claim 17, characterized in that The cover plate (38) comprises a top wall (3812), a bottom wall (3813), and a peripheral side wall (3814) connected between the top wall (3812) and the bottom wall (3813), the top wall (3812) and the bottom wall (3813) are arranged back to back, the top wall (3812) covers the first space (301) and the second space (302), and the bottom wall (3813) is fixedly connected to the shell (34); The peripheral side wall (3814) comprises oppositely arranged first and third side walls (3814a, 3814c), the fourth opening (383) is arranged on the first side wall (3814a), and the fifth opening (384) is arranged on the third side wall (3814c).

19. The heat dissipating device (30) according to any one of claims 4 to 10, characterized in that The heat dissipation device (30) further comprises a shell (34), the shell (34) has a bottom wall (341) and a peripheral side wall (342), the peripheral side wall (342) of the shell (34) is connected to the peripheral edge of the bottom wall (341) of the shell (34), and the bottom wall (341) of the shell (34) and the peripheral side wall (342) of the shell (34) jointly define an internal space of the shell (34); The heat conduction member (31), the first heat dissipation assembly (32) and the second heat dissipation assembly (33) are located in the internal space of the shell (34), and the first heat dissipation surface (3221) and the second heat dissipation surface (3321) both face the peripheral side wall (342) of the shell (34).

20. The heat dissipating device (30) according to claim 19, characterized in that The first air outlet (327) and the second air outlet (337) are arranged away from the bottom wall (341) of the shell (34).

21. The heat dissipating device (30) according to claim 19 or 20, characterized in that The heat dissipation device (30) further comprises a cover plate (38), the cover plate (38) is fixed to the top of the shell (34), the cover plate (38) covers the internal space of the shell (34) to form an air inlet chamber; The cover plate (38) has a fourth opening (383) and a fifth opening (384) arranged at intervals, the fourth opening (383) of the cover plate (38) and the fifth opening (384) of the cover plate (38) both communicate with the air inlet chamber; The first air outlet (327) communicates with the outside of the heat dissipation device (30) through the fifth opening (384), and the second air outlet (337) communicates with the outside of the heat dissipation device (30) through the fifth opening (384).

22. The heat dissipating device (30) according to claim 21, characterized in that The cover plate (38) comprises a top wall (3812), a bottom wall (3813) and a peripheral side wall (3814) connected between the top wall (3812) and the bottom wall (3813), the top wall (3812) and the bottom wall (3813) are arranged away from each other, the top wall (3812) covers the internal space of the shell (34), and the bottom wall (3813) is fixedly connected to the shell (34); The fourth opening (383) is arranged on the peripheral side wall (3814), and the fifth opening (384) is arranged on the top wall (3812).

23. The heat dissipating device (30) according to any one of claims 14 to 22, characterized in that The shell (34) is provided with a third through hole (3411) which communicates the internal space of the shell (34) with the outside of the shell (34); The heat conduction member (31) is fixed in the third through hole (3411) and seals the third through hole (3411).

24. The heat dissipating device (30) according to any one of claims 19 to 22, characterized in that The shell (34) is provided with a third through hole (3411) which communicates the internal space of the shell (34) with the outside of the shell (34); The heat-conducting member (31) extends outside the shell (34) through the third through hole (3411), and the first top plate (321), the first bottom plate (322), the first connecting frame (323), the second top plate (331), the second bottom plate (332), and the second connecting frame (333) seal the third through hole (3411).

25. An electronic device (100), characterized by The device housing (10) and the heat dissipation device (30) of any one of claims 1 to 24 are installed on the device housing (10).

26. The electronic device (100) according to claim 25, characterized by The electronic device (100) further comprises a heat source (40) which is attached to the heat-conducting member (31).

27. The electronic device (100) according to claim 26, characterized by The first heat dissipation assembly (32) and the heat source (40) are located on opposite sides of the same part of the heat-conducting member (31), and in the arrangement direction of the first heat dissipation assembly (32) and the heat source (40), the projection of the first heat dissipation assembly (32) on the heat-conducting member (31) and the projection of the heat source (40) on the heat-conducting member (31) have an overlapping area. Or, the second heat dissipation assembly (33) and the heat source (40) are located on opposite sides of the same part of the heat-conducting member (31), and in the arrangement direction of the second heat dissipation assembly (33) and the heat source (40), the projection of the second heat dissipation assembly (33) on the heat-conducting member (31) and the projection of the heat source (40) on the heat-conducting member (31) have an overlapping area.

28. An electronic device (100), characterized by The device housing (10) and the heat dissipation device (30) of claim 14 are installed on the device housing (10); The device housing (10) comprises a housing main body (12) and a partition (11), the housing main body (12) has a through hole (123), the partition (11) of the device housing (10) is connected to the inner wall of the through hole (123) of the housing main body (12), and the partition (11) of the device housing (10) separates the through hole (123) of the housing main body (12) into a first through hole (1231) and a second through hole (1232) arranged at intervals, and the first through hole (1231) and the second through hole (1232) communicate with the internal space of the shell (34). The peripheral side wall (342) of the shell (34) is connected to the housing main body (12) and surrounds the first through hole (1231) and the second through hole (1232), the partition plate (135) of the shell (34) is connected to the partition (11) of the device housing (10), and the bottom wall (341) of the shell (34) is located on the inner side of the device housing (10).

29. The electronic device (100) according to claim 28, characterized by The shell (34) further comprises a partition plate (343) which connects the bottom wall (341) of the shell (34) and the peripheral side wall (342) of the shell (34) and separates the internal space of the shell (34) into a first space (301) and a second space (302); The first via hole (1231) communicates with the first space (301), and the second via hole (1232) communicates with the second space (302).

30. The electronic device (100) according to claim 29, characterized by The electronic device (100) further comprises a cover (13) fixed to the top of the device shell (10), a part of the cover (13) covering the first via hole (1231) to form a first chamber, and a part of the cover (13) covering the second via hole (1232) to form a second chamber. The cover (13) has a first opening (136) and a second opening (137) arranged at intervals, the first opening (136) communicating the first chamber with the outside of the electronic device (100), and the second opening (137) communicating the second chamber with the outside of the electronic device (100).

31. The electronic device (100) according to claim 30, characterized by The cover (13) comprises a top wall (131), a bottom wall (132), and a peripheral side wall (133) connected between the top wall (131) and the bottom wall (132), the top wall (131) and the bottom wall (132) being arranged back to back, the top wall (131) covering the first via hole (1231) and the second via hole (1232), and the bottom wall (132) being fixedly connected to the device shell (10). The peripheral side wall (133) comprises a first side wall (133a) and a third side wall (133c) arranged opposite to each other, the first opening (136) being arranged at the first side wall (133a), and the second opening (137) being arranged at the third side wall (133c).

32. The electronic device (100) according to claim 30 or 31, characterized by The cover (13) comprises a cover body (130) and a partition plate (135), the cover body (130) having a groove (134), the partition plate (135) of the cover (13) being connected to the inner wall of the groove (134) and separating the groove (134) into a first sub-groove (134a) and a second sub-groove (134b) arranged at intervals. The cover body (130) is connected to the shell body (12) and surrounds the first via hole (1231) and the second via hole (1232), the partition plate (135) of the cover (13) being connected to the separation portion (11) of the device shell (10), the first sub-groove (134a) communicating the first via hole (1231) with the first opening (136), and the second sub-groove (134b) communicating the second via hole (1232) with the second opening (137).

33. The electronic device (100) according to any one of claims 29 to 32, characterized by The electronic device (100) has an internal space (101) for installing internal components of the electronic device (100), and the first space (301) and the second space (302) are arranged at intervals with the internal space (101) of the electronic device (100). The electronic device (100) further comprises a heat source (40) located in the internal space (101) of the electronic device (100), and the heat source (40) is attached to the heat conduction member (31).

34. An electronic device (100), characterized by The device housing (10) has a through hole (123) communicating with the internal space of the shell (34); The peripheral side wall (342) of the shell (34) is connected to the device housing (10) and surrounds the through hole (123), and the bottom wall (341) of the shell (34) is located on the inner side of the device housing (10). The electronic device (100) further comprises a cover (13) fixed to the top of the device housing (10), which covers the through hole (123) of the device housing (10) to form an air inlet chamber; 35. The electronic device (100) according to claim 34, characterized by The cover (13) has a first opening (136) and a second opening (137) arranged at intervals, the first opening (136) communicates the air inlet chamber with the outside of the electronic device (100), and the first air outlet (327) and the second air outlet (337) communicate with the outside of the electronic device (100) through the second opening (137). The cover (13) comprises a top wall (131), a bottom wall (132) and a peripheral side wall (133) connected between the top wall (131) and the bottom wall (132), the top wall (131) and the bottom wall (132) are arranged back to back, the top wall (131) covers the, and the bottom wall (132) is fixedly connected to the device housing (10); 36. The electronic device (100) according to claim 35, characterized by The first opening (136) is provided on the peripheral side wall (133), and the second opening (137) is provided on the top wall (131). The cover (13) is connected to the device housing (10) and surrounds the through hole (123) of the device housing (10); 37. The electronic device (100) according to claim 35 or 36, characterized by The cover (13) has a groove (134); the groove (134) communicates the through hole (123) of the device housing (10), the first opening (136) and the second opening (137). The electronic device (100) has an internal space (101), and the internal space (101) of the electronic device (100) is used for installing internal devices of the electronic device (100), and the internal space of the shell (34) is arranged at intervals with the internal space (101) of the electronic device (100); 38. The electronic device (100) according to any one of claims 34 to 37, characterized by The electronic device (100) further comprises a heat source (40) located in the internal space (101) of the electronic device (100), and the heat source (40) is attached to the heat conduction member (31). ​

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