Laminated structure, electronic device, and preparation method for laminated structure

Abstract

Provided in the embodiments of the present application are a laminated structure, an electronic device, and a preparation method for a laminated structure. The laminated structure may be an optical laminate, and the laminated structure, for example, is disposed on a light-emitting side of a display module. The laminated structure comprises an anti-fingerprint layer, anti-reflection layers, a first adhesive layer, a hard coat layer and a base film, which are laminated from top to bottom, wherein the hard coat layer is disposed on the upper surface of the base film. The first adhesive layer, for example, is made of a bondable material, and the bondable material forms chemical bonds with the hard coat layer, such that a relatively strong bonding force is formed between the first adhesive layer and the hard coat layer, thereby improving the wear resistance of the laminated structure. The first adhesive layer has a relatively small thickness, such that a higher proportion of atoms in the first adhesive layer undergo a cross-linking reaction with the hard coat layer and bond therewith; thus, the bonding force between the first adhesive layer and the hard coat layer can be further improved. Moreover, the surface of the side of the hard coat layer away from the base film is smooth, such that the wear resistance is higher.

Description

Stacked structure, electronic device and preparation method of stacked structure

[0001] The present application claims priority from the Chinese patent application No. 202411093697.1 filed on August 08, 2024, and entitled "Stacked structure, electronic device and preparation method of stacked structure", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of display, and in particular to a stacked structure, an electronic device and a preparation method of the stacked structure. BACKGROUND

[0003] With the continuous development of display technology, foldable display terminals are gradually becoming a development trend of future mobile electronic products. In the unfolded state, the foldable display terminal can obtain a larger display area and improve the viewing effect. In the folded state, the foldable display terminal can obtain a smaller volume and is convenient for users to carry.

[0004] The current foldable screen phone protection film includes a base film, a hardening layer, an anti-reflection layer and a fingerprint resistant layer arranged in layers. The hardening layer has high hardness and good wear resistance. The anti-reflection layer can be prepared by coating method (wet method), and has poor wear resistance. During use, the friction of the user on the protection film can cause scratches or peeling of the anti-reflection layer, resulting in surface color difference and poor user experience. SUMMARY

[0005] Embodiments of the present application provide a stacked structure, an electronic device and a preparation method of the stacked structure, which solve the problems of poor wear resistance and reliability of the protection film.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the embodiments of the present application is as follows:

[0007] In a first aspect, the present application provides a laminated structure, which is arranged on a display module. The laminated structure comprises: a fingerprint-proof layer, a reflection-reducing layer, a first connecting layer, a hardening layer, and a base film arranged in layers. The hardening layer is arranged on the upper surface of the base film. The surface roughness of the side of the hardening layer facing away from the base film is 5-100 nm. The thickness of the first connecting layer is in the range of 1-20 atomic layers. The first connecting layer is made of bondable material. The bondable material forms a chemical bond with the hardening layer. Thus, the laminated structure connects the hardening layer and the reflection-reducing layer through the first connecting layer. The first connecting layer is made of bondable material, so that a chemical bond is formed between the first connecting layer and the hardening layer, resulting in strong bonding force. The film layer is not easy to fall off, and the wear resistance of the laminated structure is improved. The thickness of the first connecting layer is thin, and the wear resistance is better. The surface roughness of the hardening layer is low, so that the surface of the reflection-reducing layer prepared on the hardening layer is also smooth, further improving the wear resistance of the reflection-reducing layer.

[0008] In an optional implementation, the first connecting layer comprises silicon atoms, and the thickness of the first connecting layer is in the range of 1-5 atomic layers of silicon. Thus, the thickness of the hardening layer is thinner, which can further enhance the atomic bonding force between the first connecting layer and the hardening layer, and can further improve the wear resistance of the laminated structure.

[0009] In an optional implementation, the chemical bond formed between the hardening layer and the bondable material comprises a covalent bond. Thus, the bonding force between the hardening layer and the first connecting layer is strong, so that the film layer is not easy to fall off, and the wear resistance of the laminated structure is further improved.

[0010] In an optional implementation, the first connecting layer is formed on the hardening layer by chemical vapor deposition or physical vapor deposition, forming the chemical bond. Thus, the forming method is more likely to form a chemical bond between the first connecting layer and the hardening layer.

[0011] In an optional implementation, the material of the first connecting layer includes: silicon Si, titanium Ti, nickel Ni, chromium Cr, silicon oxide SiOx, titanium oxide TiOx, nickel oxide NiOx, and chromium oxide CrOx, where x is less than or equal to 2, and the material of the hardening layer includes at least one of an acrylic resin and an epoxy resin. The silicon oxide SiOx with x less than or equal to 2 can be referred to as oxygen-deficient silicon oxide, which can form a silicon-oxygen (Si-O) covalent bond with oxygen atoms in the hardening layer. When the first connecting layer includes silicon atoms, the silicon atoms in the first connecting layer form a silicon-oxygen (Si-O) covalent bond with the oxygen atoms in the hardening layer. When the first connecting layer includes titanium atoms, the titanium atoms in the first connecting layer form a titanium-oxygen (Ti-O) covalent bond with the oxygen atoms in the hardening layer. When the first connecting layer includes a nickel-chromium alloy, the nickel atoms in the first connecting layer form a nickel-oxygen (Ni-O) covalent bond with the oxygen atoms in the hardening layer, and / or the chromium atoms in the first connecting layer form a chromium-oxygen (Cr-O) covalent bond with the oxygen atoms in the hardening layer. In this way, the first connecting layer of various materials can form a covalent bond with the hardening layer, improving the wear resistance of the laminated structure.

[0012] In an optional implementation, the first connecting layer includes Si atoms, and the hardening layer includes oxygen atoms, and a silicon Si-oxygen O covalent bond is formed between the hardening layer and the first connecting layer. In this way, the silicon-oxygen covalent bond has stronger force, which can further enhance the atomic bonding force between the first connecting layer and the hardening layer, and can further improve the wear resistance of the laminated structure.

[0013] In an optional implementation, the hardening layer includes: a first hardening layer and a second hardening layer stacked, the first hardening layer is connected to the lower surface of the first connecting layer, and the second hardening layer is doped with reinforcing particles. In this way, the first hardening layer can be pure resin without particle addition, which is conducive to reducing the surface roughness, enhancing the connection stability with the first connecting layer, and improving the wear resistance of the laminated structure. The second hardening layer can use particle reinforced resin to improve the rigidity of the whole hardening layer and enhance the support effect. In this way, the hardening layer adopts a double-layer structure, which can balance the wear resistance and support performance.

[0014] In an optional implementation, the material of the reinforcing particles includes: silicon oxide SiO2, zirconium oxide ZrO2, aluminum oxide Al2O3, titanium oxide TiO2, and silicon nitride SiN. In this way, by doping reinforcing particles in the second hardening layer, the rigidity of the hardening layer can be enhanced, and the bending performance of the laminated structure can be improved.

[0015] In an optional implementation, the anti-reflection layer includes: a first low-refractive layer and a first high-refractive layer stacked, and the first high-refractive layer is arranged on the upper surface of the first connecting layer. In this way, by arranging the anti-reflection layer, the readability of the display module in strong light can be improved.

[0016] In an optional implementation, the material of the first high-refractive layer includes at least one of zirconium oxide ZrO2, niobium oxide Nb2O5, tantalum pentoxide Ta2O5, aluminum oxide Al2O3, titanium oxide TiO2, silicon nitride Si3N4, silicon oxynitride SiON, and titanium nitride TiN; and the material of the first low-refractive layer includes silicon oxide SiO2. In this way, a chemical bond can be formed between the high-refractive layer and the first connecting layer, and the connection stability of the high-refractive layer and the first connecting layer is enhanced.

[0017] In an optional implementation, the thickness of the first high-refractive layer ranges from 5 nm to 150 nm, and the thickness of the first low-refractive layer ranges from 10 nm to 200 nm. In this way, the thicknesses of the high-refractive layer and the low-refractive layer are low, and the bending performance of the stack structure can be improved.

[0018] In an optional implementation, the first low-refractive layer is doped with at least one of titanium Ti, zirconium Zr, copper Cu, and aluminum Al; and the first high-refractive layer is doped with at least one of yttrium oxide Y2O3, aluminum oxide Al2O3, cerium oxide CeO2, calcium oxide CaO, and magnesium oxide MgO. In this way, by doping the low-refractive layer with metal materials, the hardness of the low-refractive layer can be increased, and the wear resistance of the stack structure is improved; and by doping the high-refractive layer with toughening materials, the toughness of the high-refractive layer can be increased, and the bending performance of the stack structure is improved. In this way, the wear resistance and the bending performance of the stack structure can be taken into account.

[0019] In an optional implementation, the stack structure further includes a second connecting layer, the first high-refractive layer is connected to the first low-refractive layer through the second connecting layer, the thickness of the second connecting layer ranges from 1 atomic layer to 20 atomic layers, the second connecting layer is made of bondable material, and the bondable material forms a chemical bond with the first high-refractive layer. In this way, by arranging the second connecting layer between the high-refractive layer and the low-refractive layer, a chemical bond is formed between the second connecting layer and the first high-refractive layer, a strong binding force is generated, the film layer is less likely to fall off, and the wear resistance of the stack structure is further improved.

[0020] In an optional implementation, the anti-reflective layer includes N layers of high-refractive layers and N layers of low-refractive layers, and the N layers of high-refractive layers and the N layers of low-refractive layers are arranged in an interval, where N is an integer greater than or equal to 2. In this way, the anti-reflective layer can be a multi-layer structure, and the anti-reflective performance is improved.

[0021] According to a second aspect of the embodiments of the present application, an electronic device is provided, including a display module and the stack structure as described above, and the stack structure is arranged on the light-emitting side of the display module. In this way, the stack structure is arranged on the display module, and the wear resistance is more optimal.

[0022] In a third aspect, the application provides a method for manufacturing a laminated structure, comprising: forming a hardening layer on a base film; performing surface treatment on a side of the hardening layer facing away from the base film to generate broken bonds on the side of the hardening layer facing away from the base film; forming a connecting layer on the hardening layer, the first connecting layer having a thickness ranging from 1 to 20 atomic layers, the first connecting layer being made of bondable material, the first connecting layer having a thickness ranging from 1 to 20 atomic layers, the first connecting layer being made of bondable material, the bondable material forming chemical bonds with the broken bonds of the hardening layer; forming an anti-reflection layer on the connecting layer; and forming an anti-fingerprint layer on the anti-reflection layer. In this way, chemical bonds can be formed between the connecting layer and the hardening layer, resulting in strong bonding force, so that the film layer is not easy to fall off, and the wear resistance of the laminated structure is improved. Moreover, the connecting layer is thin and the surface of the hardening layer is smooth, and the wear resistance is further improved.

[0023] In an alternative implementation, the hardening layer comprises oxygen atoms, and the connecting layer comprises silicon atoms. The silicon atoms of the connecting layer form silicon-oxygen covalent bonds with the oxygen atoms of the hardening layer. In this way, the silicon-oxygen covalent bonds have stronger force, which can further enhance the atomic bonding force between the connecting layer and the hardening layer, and further improve the wear resistance of the laminated structure.

[0024] The application provides a laminated structure, an electronic device, and a method for manufacturing a laminated structure. The laminated structure can be an optical laminated structure, which is arranged, for example, on the light-emitting side of a display module. The laminated structure comprises, from top to bottom, an anti-fingerprint layer, an anti-reflection layer, a connecting layer, a hardening layer, and a base film. The hardening layer is arranged on the upper surface of the base film. The connecting layer is made of, for example, bondable material, which forms chemical bonds with the hardening layer. In this way, when the connecting layer is formed on the surface of the hardening layer, strong chemical bonds can be formed between the connecting layer and the hardening layer, resulting in strong bonding force between the connecting layer and the hardening layer, and improving the wear resistance of the laminated structure. The connecting layer is thin, for example, having a thickness ranging from 1 to 20 atomic layers. A higher proportion of atoms in the connecting layer can form cross-linking reactions with the hardening layer, which can further improve the bonding force between the connecting layer and the hardening layer. The surface roughness of the side of the hardening layer facing away from the base film is, for example, 5-100 nm. The surface of the anti-reflection layer prepared thereon is also smooth, which further improves the wear resistance of the anti-reflection layer.

[0025] In some embodiments, a connecting layer is arranged between the high-refractive layer and the low-refractive layer, which can further improve the wear resistance of the laminated structure.

[0026] In some embodiments, the hardening layer can have a single-layer resin structure. In other embodiments, the hardening layer can have a double-layer structure: the hardening layer close to the connecting layer is made of pure resin, and the hardening layer away from the connecting layer is made of particle-reinforced resin, which can improve the overall stiffness of the hardening layer and enhance the support effect.

[0027] This application embodiment can perform bending reliability tests and wear resistance tests on laminated structures with different structures, measuring the bending performance and wear resistance of the laminated structures with different structures. It can be concluded that the laminated structure formed by the dry process has better wear resistance and bending performance. When zirconium oxide is used as the high refractive layer material, its modulus is moderate, which can take into account both the wear resistance and bending performance of the laminated structure.

[0028] In some embodiments, by filling the high-refractive-index layer with toughening fillers, the toughness of the antireflective coating is enhanced, further improving the bending resistance of the laminated structure. Attached Figure Description

[0029] Figure 1 is a schematic diagram of the disassembly structure of an electronic device provided in an embodiment of this application;

[0030] Figure 2A is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0031] Figure 2B is a schematic diagram of another electronic device provided in an embodiment of this application;

[0032] Figure 3 is a schematic diagram of a stacked structure;

[0033] Figure 4 is a flowchart of a method for forming an antireflection layer by coating process according to an embodiment of this application;

[0034] Figure 5 is a schematic diagram of a stacked structure provided in an embodiment of this application;

[0035] Figure 6 is a flowchart of a method for forming an antireflection layer by magnetron sputtering coating process according to an embodiment of this application;

[0036] Figure 7 is a schematic diagram of another stacked structure provided in an embodiment of this application;

[0037] Figure 8 is a schematic diagram of a stacked structure provided in an embodiment of this application;

[0038] Figure 9 is a schematic diagram of a stacked structure provided in another embodiment of this application;

[0039] Figure 10 is a schematic diagram of a stacked structure provided in another embodiment of this application;

[0040] Figure 11 is a schematic diagram of a stacked structure provided in another embodiment of this application;

[0041] Figure 12 is a schematic diagram of a stacked structure provided in another embodiment of this application;

[0042] Figure 13 is a schematic diagram of a stacked structure provided in another embodiment of this application. DETAILED DESCRIPTION

[0043] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0044] Hereinafter, the terms "first", "second", and the like are used only for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0045] In addition, in the present application, the orientation terms such as "upper", "lower", and the like are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0046] The embodiments of the present application provide an electronic device. The electronic device can be a tablet computer, a mobile phone, an electronic reader, a remote controller, a personal computer (PC), a notebook computer, a personal digital assistant (PDA), a vehicle-mounted device, a network television, a wearable device, a television, and the like, which are products with a display interface, and a smart watch, a smart bracelet, and the like, which are smart display wearable products. The embodiments of the present application do not specially limit the form of the above-mentioned electronic device. The following embodiments are exemplarily described by taking the electronic device as a mobile phone for convenience.

[0047] As shown in FIG. 1, the electronic device 1 includes a display module 13, a middle frame 11, and a shell (or referred to as a back shell) 12. The middle frame 11 is located between the display module 13 and the shell 12.

[0048] The display module 13 is used to display an image.

[0049] The display module 13, the middle frame 11, and the shell 12 can be respectively arranged at different layers in the thickness direction of the electronic device. These layers can be parallel to each other, and the plane where each layer is located can be referred to as an X-Y plane, and the direction perpendicular to the X-Y plane can be referred to as a Z direction. For example, the display module 13, the middle frame 11, and the shell 12 can be distributed in layers in the Z direction.

[0050] The display module 13 can be electrically connected to the PCB arranged on the middle frame 11 through a flexible printed circuit (FPC) passing through the middle frame 11 as shown in FIG. 1. Thus, the PCB can transmit display data to the display module 13 to control the display module 13 to display images.

[0051] The middle frame 11 is located between the display module 13 and the shell 12, and a surface of the middle frame 11 away from the display module 13 is used to mount internal components such as a battery, a printed circuit board (PCB), a camera, an antenna, and the like. After the shell 12 is covered with the middle frame 11, the above-mentioned internal components are located between the shell 12 and the middle frame 11.

[0052] The shell 12 and the middle frame 11 are connected to form a receiving cavity for accommodating electronic devices such as the above-mentioned PCB, camera, and battery. Thus, the invasion of water vapor and dust from the outside into the receiving cavity can be prevented, and the performance of the above-mentioned electronic devices can be affected.

[0053] Embodiments of the present application do not limit the structure of the mobile phone. In some embodiments of the present application, as shown in FIG. 2A and FIG. 2B, the mobile phone can be a folding screen mobile phone, and the display module 13 of the folding screen is foldable.

[0054] Embodiments of the present application do not limit the type of folding screen mobile phone. In some embodiments, as shown in FIG. 2A, the folding screen mobile phone adopts an outer folding design, and the display module 13 is located on the outer side of the device when the folding screen mobile phone is in a folded state.

[0055] In other embodiments, as shown in FIG. 2B, the folding screen mobile phone adopts an inner folding design, and the display module 13 is located on the inner side of the device when the folding screen mobile phone is in a folded state.

[0056] The display module 13 can be an active matrix organic light emitting diode (AMOLED) display screen.

[0057] The AMOLED display screen is a self-luminous display screen, and does not need to be provided with a back light module (BLM). Therefore, when the substrate of the AMOLED display screen is made of a flexible resin material such as polyimid (PI) or polyethylene terephthalate (PET), the AMOLED display screen can have a foldable characteristic.

[0058] In some embodiments, in order to improve the reading experience of the screen in sunlight or strong light, an anti-reflection (AR) film can also be arranged on the light-out surface of the display module 13.

[0059] As shown in FIG. 3, in some embodiments, the light-out surface of the display module 13 is provided with a laminated structure 10, which can be an optical laminate, for example, including an anti-reflection layer, which can improve the readability of the display module in strong light.

[0060] In some embodiments, the laminated structure 10 includes a substrate, a hardening layer, a high-refractive layer, a low-refractive layer, and an anti-fingerprint layer arranged in layers.

[0061] In some embodiments, the anti-reflection layer includes two low-refractive layers and two high-refractive layers arranged alternately. The high-refractive material includes niobium pentoxide, zirconium oxide, and other metal oxides, and the low-refractive material includes silicon oxide and other materials.

[0062] In some embodiments, the anti-reflection layer can be formed by a coating process (also known as "wet AR film").

[0063] In some embodiments, the coating process refers to a coating method such as slot coating or micro-recess coating, in which a resin material containing high-refractive and low-refractive particles is coated on the surface of the substrate to form a high-refractive material film layer and a low-refractive material film layer, respectively. The high-refractive material film layer contains metal oxide nanoparticles such as aluminum oxide, zirconium oxide, and tin oxide, and the low-refractive layer contains hollow silica nanoparticles. FIG. 4 is a flowchart of a method for forming an anti-reflection layer by a coating process according to an embodiment of the present application. As shown in FIG. 4, the method includes:

[0064] S1. Surface treatment of the substrate.

[0065] In some embodiments, the surface of the substrate can be treated.

[0066] S2. Coating of the hardening layer.

[0067] In some embodiments, the hardening layer can be coated on the surface of the substrate.

[0068] S3. Coating of the high-refractive layer.

[0069] In some embodiments, the high-refractive layer can be coated on the surface of the hardening layer and cured.

[0070] S4. Coating of the low-refractive layer.

[0071] The low-refractive layer can be formed on the surface of the high-refractive layer after curing and then cured.

[0072] However, the anti-reflective layer formed by the wet process has poor wear resistance, and the user's friction on the protective film during use can cause the anti-reflective layer to be scratched or peeled off, resulting in surface color difference and poor user experience.

[0073] Therefore, the film layer provided in the embodiments of the present application can effectively improve the wear resistance and reliability of the anti-reflective layer.

[0074] The present application does not limit the position of the film layer in the display module. In some embodiments, the film layer can be arranged on the light-emitting side of the display module. The film layer can be a laminated structure including a plurality of laminated layers.

[0075] FIG. 5 is a structural schematic diagram of a laminated structure provided in the embodiments of the present application.

[0076] As shown in FIG. 5, the laminated structure 10 includes, from top to bottom (along the -z direction shown in FIG. 5), a fingerprint-resistant layer 101, an anti-reflective layer 100, a connecting layer 1001, a hardening layer 104, and a base film 105. The hardening layer 104 is arranged on the upper surface of the base film 105.

[0077] The surface roughness of the hardening layer 104 on the side away from the base film is 5-100 nm. In this way, the surface of the hardening layer 104 is smoother, so that the surface of the anti-reflective layer prepared thereon is also smooth, improving the wear resistance of the anti-reflective layer.

[0078] The connecting layer 1001 can be a first connecting layer, and the connecting layer 1001 is made of a bondable material that forms a chemical bond with the hardening layer 104. In this way, when the connecting layer 1001 is formed on the surface of the hardening layer 104, a strong chemical bond between the connecting layer 1001 and the hardening layer 104 can be formed, thereby forming a strong bonding force between the connecting layer 1001 and the hardening layer 104, further improving the wear resistance.

[0079] The chemical bond can be formed by bonding.

[0080] The thickness of the connecting layer 1001 ranges from 1 to 20 atomic layers. When the connecting layer 1001 includes silicon atoms, the thickness thereof ranges from 1 to 20 atomic layers of silicon, so that a higher proportion of atoms in the connecting layer 1001 are bonded by cross-linking reaction with the hardening layer 104, which can further improve the bonding force between the connecting layer 1001 and the hardening layer 104.

[0081] In some embodiments, the thickness of the connecting layer 1001 ranges from 1 to 5 atomic layers. When the connecting layer 1001 includes silicon atoms, the thickness thereof ranges from 1 to 5 atomic layers of silicon. The thickness of the connecting layer 1001 can be further reduced, the light transmittance of the connecting layer 1001 is improved, and the bonding force between the connecting layer 1001 and the hardening layer 104 is improved.

[0082] The embodiments of the present application do not limit the type of chemical bonds between the hardening layer 104 and the connecting layer 1001. The chemical bonds include ionic bonds, covalent bonds, and metal bonds. The ionic bonds can be formed by the transfer of electrons between atoms to form positive and negative ions by electrostatic interaction. The covalent bonds can be formed by sharing one or more pairs of electrons between atoms. The metal bonds are a modified covalent bond and can be formed by sharing some free-flowing electrons between multiple atoms. In some embodiments, the connecting layer 1001 is made of bondable material, and the hardening layer 104 is bonded to the bondable material by covalent bonds.

[0083] The laminated structure provided by the embodiments of the present application connects the hardening layer 104 and the antireflection layer through the connecting layer 1001, and the connecting layer 1001 is made of bondable material. The bondable material forms chemical bonds with the hardening layer 104, generates a strong bonding force, makes the film layer not easy to fall off, and improves the wear resistance of the laminated structure. In addition, the connecting layer 1001 is thin, the surface of the hardening layer 104 is smooth, and the wear resistance is better.

[0084] The embodiments of the present application do not limit the material of the base film 105. In some embodiments, the material of the base film 105 includes at least one of polyethylene terephthalate (PET), thermoplastic polyurethane elastomer rubber (TPU), and polyimide (PI).

[0085] The embodiments of the present application do not limit the material of the hardening layer 104 and the connecting layer 1001. In some embodiments, the hardening layer 104 includes oxygen atoms, and the connecting layer 1001 forms covalent bonds with the oxygen atoms of the hardening layer 104.

[0086] In some embodiments, the material of the connecting layer 1001 includes silicon (Si), titanium (Ti), nickel (Ni), chromium (Cr), silicon oxide (SiOx), titanium oxide (TiOx), nickel oxide (NiOx), and chromium oxide (CrOx), where x is less than or equal to 2.

[0087] When x is less than or equal to 2, the silicon oxide (SiOx) can be referred to as oxygen-deficient silicon oxide, which can form silicon-oxygen (Si-O) covalent bonds with the oxygen atoms of the hardening layer 104.

[0088] When the connecting layer 1001 includes silicon atoms, the silicon atoms of the connecting layer 1001 form silicon-oxygen (Si-O) covalent bonds with the oxygen atoms of the hardening layer 104.

[0089] When the connecting layer 1001 includes titanium atoms, titanium atoms of the connecting layer 1001 form titanium-oxygen (Ti-O) covalent bonds with oxygen atoms of the hardening layer 104.

[0090] When the connecting layer 1001 includes nickel-chromium alloy, nickel atoms of the connecting layer 1001 form nickel-oxygen (Ni-O) covalent bonds with oxygen atoms of the hardening layer 104, and / or, chromium atoms of the connecting layer 1001 form chromium-oxygen (Cr-O) covalent bonds with oxygen atoms of the hardening layer 104.

[0091] In the present application, when the connecting layer 1001 includes silicon atoms, the thickness of the connecting layer 1001 is, for example, less than 1 nm, so that the influence of the connecting layer 1001 on the transmittance can be reduced.

[0092] The present application does not limit the forming method of the stack structure, and in some embodiments, the stack structure can be deposited by a magnetron sputtering film forming process (also referred to as "dry AR film").

[0093] FIG. 6 is a flowchart of a method for forming the anti-reflection layer 100 by a magnetron sputtering film forming process according to an embodiment of the present application. As shown in FIG. 6, the method for preparing the anti-reflection layer 100 includes:

[0094] S11. Forming the hardening layer 104 on the base film 105.

[0095] Before forming the hardening layer 104 on the base film 105, the base film 105 can also be subjected to surface treatment.

[0096] Forming the hardening layer 104 on the base film 105 can be coating and forming the hardening layer 104 on the surface of the base film 105, and solidifying the hardening layer 104.

[0097] The magnetron sputtering film forming process refers to applying a direct current voltage between a film forming target material and a substrate under vacuum conditions, so that the voltage decomposes the gas into argon ions (Ar+) and electrons, so that the positively charged ions are accelerated and collide with the film forming target material, and the atoms of the film forming target material are sputtered by momentum transfer.

[0098] For example, the surface of the film forming target material can be gasified into gaseous atoms, molecules or partially ionized into ions and electrons by an electrode, and a magnetic field can be introduced on the surface of the film forming target material. Under the action of the electric field, the electrons collide with the argon atoms during the flight to the substrate, causing ionization to produce Ar+ and new electrons. The new electrons fly to the substrate, and Ar+ accelerates to the cathode film forming target material under the action of the electric field, and hits the surface of the film forming target material with high energy, causing the film forming target material to sputter. In the sputtered particles, neutral target atoms or molecules are deposited on the substrate to form a thin film.

[0099] S12. Surface treatment is performed on the side of the hardened layer 104 facing away from the base film.

[0100] In this embodiment, surface activation treatment can be performed on the side of the hardened layer 104 facing away from the base film after the hardened layer 104 is cured.

[0101] In this embodiment, surface activation treatment can be performed on the side of the hardened layer 104 facing away from the base film after the hardened layer 104 is cured.

[0102] S13. A connecting layer 1001 is formed on the hardened layer 104.

[0103] In this embodiment, surface activation treatment can be performed on the side of the hardened layer 104 facing away from the base film after the hardened layer 104 is cured.

[0104] In some embodiments, the material of the connecting layer 1001 includes silicon, silicon oxide SiOx, titanium Ti, and nickel-chromium alloy NiCr, where x is less than or equal to 2. The thickness of the connecting layer 1001 ranges from 1 to 20 atomic layers. When the connecting layer 1001 includes silicon atoms, the thickness ranges from 1 to 20 silicon atoms. The connecting layer is made of a bondable material that forms a chemical bond with the broken bonds of the hardened layer.

[0105] S14. A reflection-reducing layer is formed on the connecting layer 1001.

[0106] In some embodiments, the reflection-reducing layer includes a high-refractive layer and a low-refractive layer arranged in a stack.

[0107] In some embodiments, the reflection-reducing layer includes a high-refractive layer and a low-refractive layer arranged in a stack.

[0108] In this embodiment, the connecting layer 1001, the high-refractive layer, and the low-refractive layer are formed by a magnetron sputtering process.

[0109] S15. A fingerprint-resistant layer is formed on the reflection-reducing layer.

[0110] In some embodiments, the fingerprint-resistant layer is formed on the surface of the low-refractive layer by an AF coating process. The fingerprint-resistant layer can be formed by coating, spraying, or evaporation. In some embodiments, the fingerprint-resistant layer is included in the low-refractive layer resin.

[0111] In the present application, the fingerprint-resistant layer is formed by an AF coating process, which can be formed by spraying or evaporation of AF liquid. The AF liquid contains fluorosilane, which is a hydrophobic and oleophobic polymer. The AF liquid forms a film layer on the glass surface (Si-O chemical bond forms a chemical link), and the existence of this invisible film layer cannot be identified by the naked eye, and does not affect the visual effect of the screen.

[0112] The AF liquid is a surface treatment agent that can be applied to the waterproof and oil-repellent surface treatment of the touch screen to reduce dust and fingerprints adhering to the surface. The AF liquid can be applied to various substrates, including touch screen glass panels (mobile phones, displays, etc.), glass products, plastics, metal products, etc. The AF liquid has excellent waterproof and stain-resistant effects and can effectively prevent surface scratches.

[0113] The present application does not limit the structure of the hardening layer 104. In some embodiments, the hardening layer 104 is a single-layer structure. The material of the hardening layer 104 includes at least one of acrylic resin and epoxy resin.

[0114] In other embodiments, as shown in FIG. 7, the hardening layer 104 includes a first hardening layer 1041 and a second hardening layer 1042 stacked together, the first hardening layer 1041 is connected to the connecting layer 1001, and the first hardening layer 1041 can be pure resin without particle addition, which is beneficial to reduce surface roughness, enhance the connection stability with the connecting layer 1001, and improve the wear resistance of the stacked structure. The second hardening layer 1042 can use particle reinforced resin, for example, the second hardening layer 1042 is added with silicon oxide SiO2, zirconium oxide ZrO2, aluminum oxide Al2O3, titanium oxide TiO2, and silicon nitride SiN, which improves the rigidity of the whole hardening layer 104 and enhances the support effect. The roughness of the first hardening layer 1041 is lower than that of the second hardening layer 1042.

[0115] The hardening layer 104 provided by the present application adopts a double-layer structure, which can balance the wear resistance and support performance.

[0116] The present application does not limit the structure of the hardening layer 104. In some embodiments, the hardening layer 104 is a single-layer structure. The material of the hardening layer 104 includes at least one of acrylic resin and epoxy resin.

[0117] The present application does not limit the material of the high-refractive layer 103 and the low-refractive layer 102. The material of the high-refractive layer 103 includes at least one of zirconium oxide ZrO2, niobium oxide Nb2O5, tantalum pentoxide Ta2O5, aluminum oxide Al2O3, titanium oxide TiO2, silicon nitride Si3N4, silicon oxynitride SiON, and titanium nitride TiN.

[0118] The material of the low-refractive layer 102 includes silicon oxide SiO2.

[0119] In some embodiments, at least one of titanium Ti, zirconium Zr, copper Cu, aluminum Al, or the like is doped in the low-refractive layer 102.

[0120] The anti-reflective layer provided in the embodiments can increase the hardness of the low-refractive layer by doping the metal material in the low-refractive layer.

[0121] The high-refractive layer 103 is doped with at least one of yttrium oxide Y2O3, aluminum oxide Al2O3, cerium oxide CeO2, calcium oxide CaO, and magnesium oxide MgO.

[0122] The anti-reflective layer provided in the embodiments can increase the toughness of the high-refractive layer by doping the toughening material in the high-refractive layer.

[0123] The embodiments of the present application do not limit the connection mode of the high-refractive layer 103 and the low-refractive layer 102. In some embodiments, the low-refractive layer 102 can be formed on the upper surface of the high-refractive layer 103 by a magnetron sputtering plating process.

[0124] In another embodiment, as shown in FIG. 11, the stack structure further includes a connection layer 1002, which can be a second connection layer. The connection layer 1002 is arranged between the low-refractive layer 102 and the high-refractive layer 103. The low-refractive layer 102 is connected to the high-refractive layer 103 through the connection layer 1002. The thickness of the connection layer 1002 ranges from 1 to 20 atomic layers. The connection layer 1002 is made of a bondable material, which forms a chemical bond with the high-refractive layer 103.

[0125] The material and structure of the bondable material can refer to the description of the bondable material above, which will not be repeated here.

[0126] The embodiments of the present application do not limit the number of layers of the anti-reflective layer. In some embodiments, the anti-reflective layer includes N layers of high-refractive layers and N layers of low-refractive layers. The N layers of high-refractive layers and the N layers of low-refractive layers are arranged alternately. N is an integer greater than or equal to 2.

[0127] In some embodiments, a connection layer 1001 can be arranged between adjacent high-refractive layers and low-refractive layers. The structure of the connection layer 1001 can refer to the description of the connection layer 1001 above.

[0128] In the present application, the bending performance and wear resistance of the stack structure are related to the forming process of the stack structure and the material and thickness of the stack.

[0129] The embodiment of the present application can perform bending reliability test and wear resistance test on the laminated structure with different structures, and measure the bending performance and wear resistance of the laminated structure with different structures.

[0130] In the bending test, the laminated structure is bent to obtain the single limit bending radius of the laminated structure. The smaller the single limit bending radius of the laminated structure is, the better the bending performance is.

[0131] In the wear resistance test, the surface of the laminated structure is rubbed by steel wool to obtain the number of times of steel wool rubbing resistance of the laminated structure. The more the number of times of steel wool rubbing resistance is, the better the wear resistance is.

[0132] In some embodiments, the laminated structure is formed by a wet coating process, the material of the high-refractive layer is ZrO2, there is no connecting layer, the hardening layer 104 adopts a single layer structure, the number of times of steel wool rubbing resistance is 1000-2000 times, and the single limit bending radius is 0.15 mm. The wear resistance is poor, and the bending performance is good.

[0133] In some embodiments, the laminated structure is formed by a dry coating process, the material of the high-refractive layer is ZrO2, the material of the connecting layer 1001 is Si, the thickness of the connecting layer 1001 ranges from 1-20 atomic layers, and the hardening layer 104 adopts a single layer resin structure. The number of times of steel wool rubbing resistance is greater than or equal to 5000 times, and the single limit bending radius is 0.25 mm. The laminated structure of the embodiment is formed by a dry process and is provided with a connecting layer 1001, and the wear resistance and the bending performance are both good, so that the wear resistance and the bending performance can be considered.

[0134] In some embodiments, the laminated structure is formed by a dry coating process, the material of the high-refractive layer is ZrO2, the material of the connecting layer 1001 is Si, the thickness of the connecting layer 1001 ranges from 1-20 atomic layers, and the hardening layer 104 includes: a first hardening layer 1041 and a second hardening layer 1042 stacked. The first hardening layer 1041 can be pure resin without particle addition, and the second hardening layer 1042 can adopt particle reinforced resin, for example, SiO2 is added in the second hardening layer 1042. The number of times of steel wool rubbing resistance is greater than or equal to 6000 times, and the single limit bending radius is 0.25 mm. The laminated structure provided in the embodiment adopts a double layer structure of a pure resin layer and a particle reinforced resin layer for the hardening layer 104, which can further improve the wear resistance of the laminated structure.

[0135] In some embodiments, the laminated structure is formed by a dry plating process, the material of the high-refractive layer is Nb2O5, the material of the connecting layer 1001 is Si, the thickness of the connecting layer 1001 is in the range of 1-20 atomic layers, the hardening layer 104 is a single-layer resin structure, the number of abrasion-resistant steel wool is 2000-3000 times, and the limit bending radius of the single body is 0.5 mm. The laminated structure provided in this embodiment has Nb2O5 as the material of the high-refractive layer, and the abrasion resistance and bending performance are both decreased compared with ZrO2 as the material of the high-refractive layer. When the high-refractive layer is ZrO2, the modulus is moderate, and the material with too low modulus has poor abrasion resistance, and the material with too high modulus has poor bending performance.

[0136] In some embodiments, the laminated structure is formed by a dry plating process, the material of the high-refractive layer is ZrO2, the connecting layer 1001 is not provided, the hardening layer 104 is a single-layer resin structure, the number of abrasion-resistant steel wool is 1000 times, and the limit bending radius of the single body is 1.5 mm. The laminated structure of this embodiment does not provide the connecting layer 1001, and the abrasion resistance and bending performance are poorer than the laminated structure with the connecting layer 1001.

[0137] In some embodiments, the laminated structure is formed by a dry plating process, the material of the high-refractive layer is ZrO2, the material of the connecting layer 1001 is Si, and the thickness of the connecting layer 1001 is greater than 20 atomic layers, the hardening layer 104 is a single-layer resin structure, the number of abrasion-resistant steel wool is about 3000 times, and the limit bending radius of the single body is 0.4 mm. The laminated structure provided in this embodiment has a thicker connecting layer 1001, and the abrasion resistance and bending performance are decreased.

[0138] In the above embodiments, the correlation between the bending performance and abrasion resistance of the laminated structure and the forming process of the laminated structure, the thickness of the connecting layer 1001, and the material of the high-refractive layer can be obtained.

[0139] The structure that may affect the bending performance and abrasion resistance of the laminated structure is described below in combination with embodiments.

[0140] FIG. 8 is a structural schematic diagram of a laminated structure provided in an embodiment of the present application. As shown in FIG. 8, the laminated structure includes, from top to bottom, a fingerprint-resistant layer 101, an anti-reflection layer 100, a connecting layer 1001, a hardening layer 104, and a base film 105; the hardening layer 104 is arranged on the base film 105, the connecting layer 1001 is formed on the hardening layer 104, the anti-reflection layer 100 is formed on the connecting layer 1001, and the fingerprint-resistant layer 101 is formed on the anti-reflection layer 100.

[0141] The connecting layer 1001 is formed on the hardening layer 104 by magnetron sputtering, and the thickness of the connecting layer 1001 ranges from 1 to 20 atomic layers, for example, the thickness of the connecting layer 1001 ranges from 1 to 5 atomic layers of Si.

[0142] The anti-reflective layer 100 includes a high-refractive layer 103 and a low-refractive layer 102 which are stacked, the high-refractive layer 103 is formed on the connecting layer 1001, and the low-refractive layer 102 is formed on the high-refractive layer 103.

[0143] The material of the high-refractive layer 103 is ZrO2, and the thickness of the high-refractive layer 103 ranges from 5 to 150 nm. The material of the low-refractive layer 102 is SiO2, and the thickness of the low-refractive layer 102 ranges from 10 to 200 nm. The hardening layer 104 can be a hard coating (HC) layer.

[0144] The high-refractive layer 103 and the low-refractive layer 102 can be formed by magnetron sputtering.

[0145] The stack structure is tested for wear resistance and bending performance. After the stack structure is rubbed by steel wool for more than 5000 times, the coating (anti-reflective layer) has no obvious scratches, the limit radius R of the single bending resistance of the stack structure is less than or equal to 0.25 mm, and the coating has no cracks.

[0146] The stack structure provided in the embodiment has good wear resistance and bending resistance.

[0147] FIG. 9 is a structural schematic diagram of a stack structure provided in another embodiment of the application. As shown in FIG. 9, the stack structure includes, from top to bottom, a fingerprint-resistant layer 101, an anti-reflective layer 100, a connecting layer 1001, a hardening layer 104, and a base film 105; the hardening layer 104 is arranged on the base film 105, the connecting layer 1001 is formed on the hardening layer 104, the anti-reflective layer 100 is formed on the connecting layer 1001, and the fingerprint-resistant layer 101 is formed on the anti-reflective layer 100.

[0148] The connecting layer 1001 is formed on the hardening layer 104 by magnetron sputtering, and the thickness of the connecting layer 1001 is less than 1 nm, for example, the thickness of the connecting layer 1001 ranges from 1 to 5 atomic layers of Si.

[0149] The anti-reflective layer 100 includes N high-refractive layers and N low-refractive layers which are stacked and arranged alternately, and the low-refractive layer 102 is formed on the high-refractive layer 103. N is a positive integer greater than or equal to 2.

[0150] The material of the high-refractive layer is ZrO2, and the thickness of the high-refractive layer ranges from 5 to 150 nm. The material of the low-refractive layer is SiO2, and the thickness of the low-refractive layer 102 ranges from 10 to 200 nm.

[0151] The high-refractive layer and the low-refractive layer can be formed by magnetron sputtering.

[0152] The stack structure is tested for wear resistance and bending performance. After the stack structure is rubbed by steel wool for more than 5000 times, the coating (anti-reflection layer) has no obvious scratches, the limit radius R of the stack structure for single bending resistance is less than or equal to 0.25 mm, and the coating has no cracks, and the reflectivity.

[0153] The stack structure provided in the embodiment has an increased number of layers of the anti-reflection layer, and has unchanged wear resistance and bending performance, and better anti-reflection effect.

[0154] FIG. 10 is a structural schematic diagram of a stack structure provided in another embodiment of the present application. As shown in FIG. 10, the stack structure includes, from top to bottom, a fingerprint-resistant layer 101, an anti-reflection layer 100, a connecting layer 1001, a hardening layer 104, and a base film 105. The hardening layer 104 is arranged on the base film 105, the connecting layer 1001 is formed on the hardening layer 104, the anti-reflection layer 100 is formed on the connecting layer 1001, and the fingerprint-resistant layer 101 is formed on the anti-reflection layer 100.

[0155] The connecting layer 1001 is formed on the hardening layer 104 by magnetron sputtering. The thickness of the connecting layer 1001 is less than 1 nm. For example, the thickness of the connecting layer 1001 ranges from 1 to 5 atomic layers of Si.

[0156] The anti-reflection layer 100 includes a high-refractive layer 103 and a low-refractive layer 102 arranged in layers. The high-refractive layer 103 is formed on the connecting layer 1001, and the low-refractive layer 102 is formed on the high-refractive layer 103.

[0157] In the embodiment, the material of the high-refractive layer 103 is ZrO2, and the high-refractive layer 103 further contains at least one of Y2O3, Al2O3, CeO2, and CaO. The thickness of the high-refractive layer 103 ranges from 5 to 150 nm. The material of the low-refractive layer 102 is SiO2, and the low-refractive layer 102 contains at least one of Ti, Zr, Cu, and Al. The thickness of the low-refractive layer 102 ranges from 10 to 200 nm.

[0158] The high-refractive layer 103 and the low-refractive layer 102 can be formed by magnetron sputtering.

[0159] The abrasion resistance and bending performance test is conducted on the laminated structure. After the laminated structure is rubbed by steel wool for more than or equal to 5000 times, the coating (antireflection layer) has no obvious scratches, the limit radius R of the monomer bending resistance of the laminated structure is less than or equal to 0.2 mm, and the coating has no cracks.

[0160] The laminated structure provided in the embodiment has good abrasion resistance and bending resistance. The toughness of the antireflection coating is enhanced by filling the toughening filler in the high-refractive layer, and the bending resistance of the laminated structure is further improved.

[0161] FIG. 11 is a structural schematic diagram of a laminated structure provided in another embodiment of the application. As shown in FIG. 11, the laminated structure includes, from top to bottom, a fingerprint-resistant layer 101, a low-refractive layer 102, a connecting layer 1002, a high-refractive layer 103, a connecting layer 1001, a hardening layer 104, and a base film 105. The hardening layer 104 is arranged on the base film 105, the connecting layer 1001 is formed on the hardening layer 104, the antireflection layer 100 is formed on the connecting layer 1001, and the fingerprint-resistant layer 101 is formed on the antireflection layer 100.

[0162] The connecting layer 1001 is formed on the hardening layer 104 by magnetron sputtering. The thickness of the connecting layer 1001 is less than 1 nm. For example, the thickness of the connecting layer 1001 ranges from 1 to 5 atomic layers of Si.

[0163] The material of the high-refractive layer 103 is ZrO2, and the thickness of the high-refractive layer 103 ranges from 5 to 150 nm. The material of the low-refractive layer 102 is SiO2, and the thickness of the low-refractive layer 102 ranges from 10 to 200 nm.

[0164] The high-refractive layer 103 and the low-refractive layer 102 can be formed by magnetron sputtering.

[0165] The abrasion resistance and bending performance test is conducted on the laminated structure. After the laminated structure is rubbed by steel wool for more than or equal to 6000 times, the coating (antireflection layer) has no obvious scratches, the limit radius R of the monomer bending resistance of the laminated structure is less than or equal to 0.2 mm, and the coating has no cracks.

[0166] The laminated structure provided in the embodiment, with reference to the laminated structure shown in FIG. 8, has the connecting layer 1002 added, so that the bonding force between the coatings is enhanced, and the abrasion resistance and bending resistance are further improved.

[0167] Figure 12 is a structural schematic diagram of a laminated structure according to another embodiment of the present application. As shown in Figure 12, the laminated structure comprises, from top to bottom, a fingerprint-proof layer 101, an anti-reflection layer 100, a connecting layer 1001, a hardening layer 104, and a base film 105; the hardening layer 104 is disposed on the base film 105, the connecting layer 1001 is formed on the hardening layer 104, the anti-reflection layer 100 is formed on the connecting layer 1001, and the fingerprint-proof layer 101 is formed on the anti-reflection layer 100.

[0168] The connecting layer 1001 is formed on the hardening layer 104 by magnetron sputtering, and the thickness of the connecting layer 1001 is less than 1 nm, for example, the thickness of the connecting layer 1001 ranges from 1 to 5 atomic layers of Si.

[0169] The anti-reflection layer 100 comprises a high-refractive layer 103 and a low-refractive layer 102 stacked together, the high-refractive layer 103 is formed on the connecting layer 1001, and the low-refractive layer 102 is formed on the high-refractive layer 103.

[0170] The material of the high-refractive layer 103 comprises at least one of Ta2O5, Si3N4, TiO2, Al2O3, and TiN, and the thickness of the high-refractive layer 103 ranges from 5 to 150 nm. The material of the low-refractive layer 102 is SiO2, and the thickness of the low-refractive layer 102 ranges from 10 to 200 nm.

[0171] The high-refractive layer 103 and the low-refractive layer 102 can be formed by magnetron sputtering.

[0172] The laminated structure is tested for wear resistance and bending performance. When the laminated structure is rubbed by steel wool for more than 3000 times, the coating (anti-reflection layer) has no obvious scratches, the limit radius R of the single-body bending resistance of the laminated structure is less than or equal to 0.3 mm, and the coating has no cracks.

[0173] The laminated structure provided in the embodiment has different material of the high-refractive layer from that shown in Figure 8, and the wear resistance and bending performance are decreased. When the high-refractive layer is ZrO2, the modulus is moderate, the material with too low modulus has poor wear resistance, and the material with too high modulus has poor bending performance.

[0174] Figure 13 is a structural schematic diagram of a laminated structure according to another embodiment of the present application. As shown in Figure 13, the laminated structure comprises, from top to bottom, a fingerprint-proof layer 101, an anti-reflection layer 100, a connecting layer 1001, a hardening layer 104, and a base film 105; the hardening layer 104 is disposed on the base film 105, the connecting layer 1001 is formed on the hardening layer 104, the anti-reflection layer 100 is formed on the connecting layer 1001, and the fingerprint-proof layer 101 is formed on the anti-reflection layer 100.

[0175] The connecting layer 1001 is formed on the hardening layer 104 by magnetron sputtering, and the material of the connecting layer 1001 includes at least one of SiOx (X≤2), Ti, and NiCr, and the thickness of the connecting layer 1001 is less than 1 nm.

[0176] The anti-reflective layer 100 includes a high-refractive layer 103 and a low-refractive layer 102 which are stacked, the high-refractive layer 103 is formed on the connecting layer 1001, and the low-refractive layer 102 is formed on the high-refractive layer 103.

[0177] The material of the high-refractive layer 103 includes at least one of Ta2O5, Si3N4, TiO2, Al2O3, and TiN, and the thickness of the high-refractive layer 103 ranges from 5 nm to 150 nm. The material of the low-refractive layer 102 is SiO2, and the thickness of the low-refractive layer 102 ranges from 10 nm to 200 nm.

[0178] The high-refractive layer 103 and the low-refractive layer 102 can be formed by magnetron sputtering.

[0179] The stack structure is tested for wear resistance and bending performance. After the stack structure is rubbed by steel wool for more than 3000 times, the coating (anti-reflective layer) has no obvious scratches, the limit radius R of the single bending resistance of the stack structure is less than or equal to 0.3 mm, and the coating has no cracks.

[0180] The stack structure provided in this embodiment has a different material of the connecting layer 1001 from that shown in FIG. 8, and the wear resistance and bending resistance are decreased.

[0181] The stack structure, the electronic device, and the preparation method of the stack structure are provided. The stack structure can be an optical stack, which is arranged on the light-emitting side of a display module, for example. The stack structure includes, from top to bottom, a fingerprint-resistant layer, an anti-reflective layer, a connecting layer, a hardening layer, and a base film which are stacked. The hardening layer is arranged on the upper surface of the base film. The connecting layer is made of a bondable material, which forms a chemical bond with the hardening layer. Thus, when the connecting layer is formed on the surface of the hardening layer, a strong chemical bond is formed between the connecting layer and the hardening layer, thereby improving the wear resistance of the stack structure. The thickness of the connecting layer is small, for example, 1-20 atomic layers, so that a higher proportion of atoms in the connecting layer are bonded by cross-linking reaction with the hardening layer, which can further improve the bonding force between the connecting layer and the hardening layer. The surface of the hardening layer away from the base film is smoother, for example, the surface roughness is 5-100 nm, which further improves the wear resistance of the hardening layer.

[0182] In some embodiments, a connecting layer is arranged between the high-refractive layer and the low-refractive layer, which can further improve the wear resistance of the laminated structure.

[0183] In some embodiments, the hardening layer can adopt a single-layer resin structure. In other embodiments, the hardening layer can adopt a double-layer structure: the hardening layer close to the connecting layer adopts pure resin, and the hardening layer away from the connecting layer adopts particle-reinforced resin, which can improve the rigidity of the hardening layer as a whole and enhance the supporting effect.

[0184] The embodiments of the present application can perform the bending reliability test and the wear resistance test on laminated structures of different structures, measure the bending performance and wear resistance of laminated structures of different structures, and can conclude that the wear resistance and bending performance of the laminated structure formed by the dry process are both better. When the high-refractive layer material is zirconia, the modulus is moderate, and the wear resistance and bending performance of the laminated structure can be considered.

[0185] In some embodiments, by filling the toughening filler in the high-refractive layer, the toughness of the anti-reflective coating is enhanced, and the bending resistance of the laminated structure is further improved.

[0186] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A stacked structure, characterized by, The laminated structure is arranged on a display module, and the laminated structure comprises: a fingerprint-proof layer, a reflection-reducing layer, a first connecting layer, a hardening layer and a base film which are arranged in layers. The hardening layer is arranged on the base film, a surface roughness of a side of the hardening layer facing away from the base film is 5-100 nm, a thickness of the first connecting layer ranges from 1 to 20 atomic layers, the first connecting layer is made of bondable material, and the bondable material forms a chemical bond with the hardening layer.

2. The laminate structure of claim 1, wherein The chemical bond formed between the hardening layer and the bondable material comprises a covalent bond.

3. The laminate structure of claim 2, wherein, The bondable material comprises silicon atoms, the hardening layer comprises oxygen atoms, and the covalent bond formed between the hardening layer and the bondable material comprises a silicon-oxygen covalent bond.

4. The laminate structure according to any one of claims 1 to 3, characterized in that The first connecting layer comprises silicon atoms, and a thickness of the first connecting layer ranges from 1 to 5 silicon atom layers.

5. The laminate structure according to any one of claims 1 to 4, characterized in that The first connecting layer is formed on the hardening layer by chemical vapor deposition or physical vapor deposition to form the chemical bond.

6. The laminate structure according to any one of claims 1 to 5, characterized in that The material of the first connecting layer comprises silicon Si, titanium Ti, nickel Ni, chromium Cr, silicon oxide SiOx, titanium oxide TiOx, nickel oxide NiOx and chromium oxide CrOx, wherein x is less than or equal to 2, and the material of the hardening layer comprises at least one of acrylic resin and epoxy resin.

7. The laminate structure according to any one of claims 1 to 6, characterized in that The hardening layer comprises a first hardening layer and a second hardening layer arranged in layers, the first hardening layer is connected to the first connecting layer, and the second hardening layer is doped with reinforcing particles.

8. The stacked structure of claim 7, wherein The reinforcing particles comprise silicon oxide SiO2, zirconium oxide ZrO2, aluminum oxide Al2O3, titanium oxide TiO2 and silicon nitride SiN.

9. The laminate structure according to any one of claims 1 to 6, characterized in that The reflection-reducing layer comprises a first low-refraction layer and a first high-refraction layer arranged in layers, and the first high-refraction layer is connected to the first connecting layer.

10. The stacked structure of claim 9, wherein The material of the first high-refraction layer comprises at least one of zirconium oxide ZrO2, niobium oxide Nb2O5, tantalum pentoxide Ta2O5, aluminum oxide Al2O3, titanium oxide TiO2, silicon nitride Si3N4, silicon oxynitride SiON and titanium nitride TiN, and the material of the first low-refraction layer comprises silicon oxide SiO2.

11. The stack structure according to claim 9 or 10, characterized in that A thickness of the first high-refraction layer ranges from 5 to 150 nm, and a thickness of the first low-refraction layer ranges from 10 to 200 nm.

12. The laminate structure according to any of claims 9-11, characterized in that The first low-refraction layer is doped with at least one of titanium Ti, zirconium Zr, copper Cu and aluminum Al, and the first high-refraction layer is doped with at least one of yttrium oxide Y2O3, aluminum oxide Al2O3, cerium oxide CeO2, calcium oxide CaO and magnesium oxide MgO.

13. The laminate structure according to any of claims 9 to 12, characterized in that The laminated structure further comprises a second connecting layer, the first high-refraction layer is connected to the first low-refraction layer through the second connecting layer, a thickness of the second connecting layer ranges from 1 to 20 atomic layers, the second connecting layer is made of bondable material, and the bondable material forms a chemical bond with the first high-refraction layer.

14. The laminate structure according to any one of claims 1 to 13, characterized in that The reflection-reducing layer comprises N layers of high-refraction layers and N layers of low-refraction layers, and the N layers of high-refraction layers and the N layers of low-refraction layers are arranged at intervals, wherein N is an integer greater than or equal to 2.

15. An electronic device, comprising: A display module comprising the laminated structure as claimed in any one of claims 1-14, the laminated structure being disposed at an out-coupling side of the display module.

16. A method of manufacturing a stacked structure, characterized by, The display module comprises: forming a hardening layer on a base film; subjecting a side of the hardening layer facing away from the base film to a surface treatment so that a broken bond is generated on the side of the hardening layer facing away from the base film; forming a first connecting layer on the hardening layer, the first connecting layer having a thickness in the range of 1-20 atomic layers, the first connecting layer being made of a bondable material, the first connecting layer having a thickness in the range of 1-20 atomic layers, the first connecting layer being made of a bondable material, the bondable material forming a chemical bond with the broken bond of the hardening layer; forming an anti-reflection layer on the first connecting layer; forming a fingerprint-resistant layer on the anti-reflection layer.

17. The method of claim 16, wherein, The bondable material comprises silicon atoms, the material of the hardening layer comprises oxygen atoms, and the covalent bond formed between the hardening layer and the bondable material comprises a silicon-oxygen covalent bond.

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