Radio frequency introduction assembly, boat support device, and semiconductor processing apparatus

Abstract

The present disclosure relates to the technical field of semiconductor processing, and provides a radio frequency introduction assembly, a boat support device, and a semiconductor processing apparatus. The radio frequency introduction assembly is used for introducing radio frequency power into a wafer boat. The radio frequency introduction assembly comprises an electrode ring sleeve and a first introduction assembly. The electrode ring sleeve is used for being sleeved on a support member, the support member is used for supporting the wafer boat, and the electrode ring sleeve is electrically connected to a first end of the first introduction assembly. In the solution, the electrode ring sleeve can be sleeved on the support member and move relative to the support member, so that the radio frequency introduction assembly is telescopically arranged in a reaction chamber. Thus, the radio frequency introduction assembly can be introduced into the reaction chamber from the tail end of the reaction chamber. When performing maintenance or replacement on the radio frequency introduction assembly, there is no need to cool down the reaction chamber, pause an automated apparatus, and have maintenance personnel enter the interior of a machine to perform a chamber-opening procedure, so that the maintenance and replacement operation of the radio frequency introduction assembly can be simplified, the maintenance and replacement time can be shortened, and the safety of maintenance operations is improved.

Description

Radio frequency introduction assembly, carrier boat support device and semiconductor process equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing, and particularly relates to a radio frequency introduction assembly, a carrier boat support device and a semiconductor process equipment. BACKGROUND

[0002] In the technical field of semiconductor processing, such as in the technical field of crystalline silicon solar cell manufacturing, a surface passivation and anti-reflection process can increase light absorption and reduce carrier recombination, thereby improving the photoelectric conversion efficiency of a solar cell. Currently, a semiconductor process equipment, such as a PECVD (Plasma Enhanced Chemical Vapor Deposition) device, is generally used in the industry to prepare a SiNx passivation and anti-reflection film. The PECVD device places a wafer (for example, a silicon wafer) between carrier boats composed of positive and negative electrode plates, introduces a reaction gas, and increases a radio frequency voltage between the positive and negative electrode plates to generate plasma by glow discharge, so as to finally generate a layer of SiNx thin film on the surface of the wafer.

[0003] The radio frequency introduction assembly of the existing semiconductor process equipment is introduced from the furnace port of the reaction chamber. However, since the furnace port is the inlet and outlet of the wafer carrier boat, an automatic equipment carries the wafer carrier boat in and out of the reaction chamber through the furnace port. When the radio frequency introduction assembly needs to be maintained, the automatic equipment needs to be paused, the reaction chamber needs to be cooled, and then a maintenance personnel enters the inside of the machine to perform an opening operation. In this way, the normal operation of other PECVD devices is affected, the maintenance and replacement time is increased, the production capacity is reduced, and the safety of maintenance is low.

[0004] Therefore, the existing semiconductor process equipment has the shortcomings of difficult maintenance and replacement of the radio frequency introduction assembly, long maintenance and replacement time, and low safety. SUMMARY

[0005] The embodiments of the present application aim to provide a radio frequency introduction assembly, a carrier boat support device and a semiconductor process equipment, which can solve the problems of difficult maintenance and replacement of the radio frequency introduction assembly of the semiconductor process equipment, long maintenance and replacement time, and low safety in the related art.

[0006] In a first aspect, the embodiments of the present application provide a radio frequency introduction assembly for introducing radio frequency power to a wafer carrier boat, the radio frequency introduction assembly comprising an electrode ring sleeve and a first introduction assembly, the electrode ring sleeve being configured to be sleeved on a support, the support being configured to support the wafer carrier boat, and the electrode ring sleeve being electrically connected to a first end of the first introduction assembly.

[0007] In a second aspect, the embodiments of the present application further provide a carrier boat support device, comprising a support member for supporting a carrier boat and the above-mentioned RF lead-in assembly, wherein the electrode ring sleeve of the RF lead-in assembly is sleeved on the support member and is movable relative to the support member.

[0008] In a third aspect, the embodiments of the present application further provide a semiconductor process equipment, comprising a reaction chamber and at least two above-mentioned carrier boat support devices, wherein the support members of the carrier boat support devices are arranged in the reaction chamber, and the RF lead-in assemblies of the carrier boat support devices are arranged in the reaction chamber in a pullable manner.

[0009] In the embodiments of the present application, since the electrode ring sleeve has a ring structure, the electrode ring sleeve can be sleeved on the support member in the reaction chamber and is movable relative to the support member, so that the RF lead-in assembly can be arranged in the reaction chamber in a pullable manner. In this way, the RF lead-in assembly can be introduced into the reaction chamber from the tail end of the reaction chamber, i.e. the RF lead-in assembly can be introduced into the reaction chamber from the end of the reaction chamber away from the furnace port. When the RF lead-in assembly needs to be maintained and replaced, the RF lead-in assembly only needs to be pulled out from the tail end of the reaction chamber, without the need to cool the reaction chamber, pause the automatic equipment, and enter the inside of the machine to perform the opening operation, so that the maintenance and replacement operation of the RF lead-in assembly can be simplified, the maintenance and replacement time of the RF lead-in assembly can be effectively shortened, and the safety of the maintenance operation can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a perspective view of a semiconductor process equipment according to an embodiment of the present application;

[0011] FIG. 2 is another perspective view of the semiconductor process equipment according to an embodiment of the present application;

[0012] FIG. 3 is a connection relationship diagram of a support member, a first furnace door and an RF lead-in assembly according to an embodiment of the present application;

[0013] FIG. 4 is a connection relationship diagram of an electrode ring sleeve and a first lead-in assembly according to an embodiment of the present application;

[0014] FIG. 5 is an enlarged view of part A in FIG. 4;

[0015] FIG. 6 is a sectional view of the first lead-in assembly according to an embodiment of the present application;

[0016] FIG. 7 is an enlarged view of part B in FIG. 6;

[0017] FIG. 8 is an enlarged view of part C in FIG. 6;

[0018] FIG. 9 is another connection relationship diagram of the electrode ring sleeve and the first lead-in assembly according to an embodiment of the present application (the first insulating inner sleeve and the insulating outer sleeve are hidden);

[0019] Fig. 10 is a connection relationship diagram of the support and the first introduction assembly disclosed by the embodiment of the application;

[0020] Fig. 11 is a connection relationship diagram of the introduction assembly support assembly and the first introduction assembly disclosed by the embodiment of the application;

[0021] Fig. 12 is a position relationship diagram of the limiting ring and the reaction chamber disclosed by the embodiment of the application;

[0022] Fig. 13 is a sectional view of the second introduction assembly disclosed by the embodiment of the application;

[0023] Fig. 14 is a perspective view of the second introduction assembly disclosed by the embodiment of the application;

[0024] Fig. 15 is a connection relationship diagram of the limiting assembly and the second flange disclosed by the embodiment of the application;

[0025] Fig. 16 is an exploded view of part D in Fig. 15;

[0026] Fig. 17 is a maintenance disassembly diagram of the radio frequency introduction assembly disclosed by the embodiment of the application;

[0027] Fig. 18 is a sectional view of the radio frequency introduction assembly disclosed by the embodiment of the application (hidden electrode ring sleeve and electrode introduction rod);

[0028] Fig. 19 is an enlarged view of part E in Fig. 18.

[0029] Explanation of reference signs: 100-reaction chamber; 110-chamber body; 120-front furnace door; 130-first flange; 131-first connecting flange; 132-first cooling flange; 133-gas inlet flange; 140-rear furnace door; 150-second flange; 151-second connecting flange; 152-second cooling flange; 200-first supporting boat; 300-second supporting boat; 400-supporting member; 410-supporting rod; 420-third insulation sleeve; 430-supporting seat; 500-plug-in electrode assembly; 510-electrode rod; 600-radio frequency introduction assembly; 610-electrode ring sleeve; 611-first connecting part; 612-flat surface; 613-notch; 620-first introduction assembly; 621-electrode introduction rod; 622-electrode introduction cable; 623-electrode introduction plug; 6231-connecting groove; 624-first insulation inner sleeve; 625-second insulation inner sleeve; 626-insulation outer sleeve; 627-second connecting part; 628-third connecting part; 629-locking member; 630-second introduction assembly; 631-rear introduction electrode rod; 6311-watchband contact finger; 632-coaxial cable seat; 6321-cable insertion port; 633-electrode blind plate; 634-connecting sleeve; 635-electrode introduction fixing seat; 636-rear fixing seat; 637-first clamp; 638-first insulation sleeve; 639-second insulation sleeve; 640-first sealing member; 641-second sealing member; 642-third sealing member; 650-electrode reflection plate; 660-reflection plate spacer sleeve; 661-connecting screw; 670-second clamp; 680-fourth sealing member; 700-introduction assembly supporting assembly; 710-limiting ring; 720-supporting part; 800-limiting assembly; 810-fixing plate; 811-U-shaped groove; 820-limiting block; 821-arc-shaped block; 822-clamping groove; 823-connecting protrusion; 830-fixing block; 840-first screw; 850-second screw. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0031] The terms "first", "second", "third", "fourth" and the like in the description and in the claims of the present application are used for distinguishing between similar objects talking about the ordinal number and thus do not imply or create a sequentially or chronologically order. It is to be understood that the data used in these examples are for illustrative purposes only and that the embodiments of this application are capable of being practiced with other data. Also, the terms "first", "second", "third", "fourth" etc. as used in "first" and "second" object, do not order or rank the objects, but rather distinguish between two separate objects found in a group. For example, a first object and a second object, can be one or more than one object, respectively. Further, the term "and / or" as used in the specification and in the claims, means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects.

[0032] The radio frequency introduction assembly, the carrier boat support device and the semiconductor process equipment provided by the embodiments of the present application will be described in detail below in combination with the drawings and specific embodiments and application scenarios.

[0033] Referring to FIGS. 1-19, the radio frequency introduction assembly 600 provided by the embodiments of the present application can be used to introduce radio frequency power to a wafer carrier boat. The radio frequency introduction assembly 600 can include an electrode ring sleeve 610 and a first introduction assembly 620. As shown in FIG. 3, the electrode ring sleeve 610 can be used to be sleeved on a support 400, the support 400 can be used to support a wafer carrier boat, and the electrode ring sleeve 610 can be electrically connected with a first end of the first introduction assembly 620. Here, the first introduction assembly 620 can be electrically connected with a radio frequency power source. Specifically, a second end of the first introduction assembly 620 can be electrically connected with the radio frequency power source.

[0034] The electrode ring sleeve 610 is used to be electrically connected with the wafer carrier boat, so as to be able to introduce radio frequency power to the wafer carrier boat. It should be noted that the electrode ring sleeve 610 can be electrically connected with boat pins of the wafer carrier boat, so as to be able to introduce radio frequency power to the wafer carrier boat.

[0035] Since the electrode ring sleeve 610 has a ring structure, the electrode ring sleeve 610 can be sleeved on the support 400 in the reaction chamber 100 and can move relative to the support 400, so that the radio frequency introduction assembly 600 can be pullably arranged in the reaction chamber 100. In this way, the radio frequency introduction assembly 600 can be introduced into the reaction chamber 100 from the tail end of the reaction chamber 100, that is, the radio frequency introduction assembly 600 can be introduced into the reaction chamber 100 from the end of the reaction chamber 100 away from the furnace port. When the radio frequency introduction assembly 600 is maintained and replaced, the radio frequency introduction assembly 600 only needs to be pulled out from the tail end of the reaction chamber 100, without the need to cool the reaction chamber 100, pause the automatic equipment, and enter the machine inside for cavity opening operation by the maintenance personnel, so that the maintenance and replacement operation of the radio frequency introduction assembly 600 can be simplified, the maintenance and replacement time of the radio frequency introduction assembly 600 can be effectively shortened, and the safety of the maintenance operation can be improved.

[0036] In some embodiments, as shown in FIG. 5, the electrode ring sleeve 610 can be provided with a notch 613, which can be used for the support 400 to enter and exit the electrode ring sleeve 610. In this way, the electrode ring sleeve 610 can be conveniently detached from the support 400.

[0037] Specifically, in the process of pulling out the radio frequency introduction assembly 600, the operator can rotate the electrode ring sleeve 610 so that the notch 613 is rotated to a position opposite to the support seat 430 (used for connecting the support 400 and the second flange 150) described below. At this time, the notch 613 can avoid the support seat 430, so as to sleeve the electrode ring sleeve 610 on the support 400 or detach the electrode ring sleeve 610 from the support 400. Of course, in the process of pulling out the radio frequency introduction assembly 600, since the connecting sleeve 634 is separated from the electrode introduction fixed seat 635 as described below, the support 400 can be seen through the inner hole of the connecting sleeve 634 at this time, and the operator can manually sleeve the electrode ring sleeve 610 on the support 400 or directly detach the electrode ring sleeve 610 from the support 400. Here, the notch 613 can be used for the support 400 to enter and exit the electrode ring sleeve 610.

[0038] In other embodiments, the electrode ring sleeve 610 can not be provided with the notch 613, that is, the electrode ring sleeve 610 can have a closed ring structure.

[0039] In some embodiments, as shown in FIG. 6, the outer wall of the electrode ring 610 can be provided with a first connecting part 611, the first connecting part 611 can be provided with a through hole, the first end of the first lead-in assembly 620 can be provided with a second connecting part 627, the second connecting part 627 can be located in the through hole, the cross-sectional area of the through hole can gradually decrease in the direction towards the first end of the first lead-in assembly 620, the cross-sectional area of the second connecting part 627 gradually decreases, and the second connecting part 627 can be in close contact with the hole wall of the through hole. In this way, the connection of the first connecting part 611 and the second connecting part 627 can be facilitated to achieve the connection of the electrode ring 610 and the first lead-in assembly 620, and the contact area of the first connecting part 611 and the second connecting part 627 can be increased, thereby avoiding abnormal discharge phenomenon caused by poor contact to cause high frequency of radio frequency.

[0040] In some embodiments, the through hole can be a conical hole, and the second connecting part 627 can be a conical column structure, of course, they can also be other shapes of structures.

[0041] In other embodiments, the cross-sectional area of the first connecting part 611 and the second connecting part 627 can remain unchanged in the direction towards the first end of the first lead-in assembly 620.

[0042] In some embodiments, the end of the second connecting part 627 away from the first lead-in assembly 620 can be provided with a third connecting part 628, and the cross-sectional area of the third connecting part 628 can be smaller than the minimum cross-sectional area of the through hole. During the installation of the first connecting part 611, the first connecting part 611 can be sleeved on the second connecting part 627 through the third connecting part 628. Since the cross-sectional area of the third connecting part 628 is smaller than the minimum cross-sectional area of the through hole, the third connecting part 628 is not easy to interfere with the thinnest part of the first connecting part 611, so the first connecting part 611 can be more easily sleeved on the second connecting part 627 through the third connecting part 628. The third connecting part 628 can be connected with a locking piece 629, and the locking piece 629 can be used to lock the first connecting part 611 and the second connecting part 627, so as to improve the connection strength of the electrode ring 610 and the first lead-in assembly 620.

[0043] Here, the locking piece 629 can be a fixed nut, and the third connecting part 628 can be provided with a thread matched with the fixed nut.

[0044] Of course, the end of the second connecting part 627 away from the first lead-in assembly 620 can not be provided with the third connecting part 628, and the electrode ring 610 is connected with the second connecting part 627 only through the first connecting part 611.

[0045] In some embodiments, the outer wall of the electrode ring 610 can be provided with a flat surface 612, which can be used to fit the boat pins of the wafer boat. In this way, the contact area between the electrode ring 610 and the boat pins of the wafer boat can be increased. Of course, the outer wall of the electrode ring 610 can also not be provided with a flat surface 612, for example, the outer wall of the electrode ring 610 is a curved surface that contacts the boat pins of the wafer boat.

[0046] In some embodiments, an active gap is left between the electrode ring 610 and the support 400, so that the electrode ring 610 has a certain amount of activity in the circumferential direction, and when connected with the boat pins of the wafer boat, the electrode ring 610 can be self-leveling under the action of the gravity of the wafer boat, thereby ensuring that the flat surface 612 can fit the boat pins of the wafer boat.

[0047] In some embodiments, as shown in FIG. 6, the first introduction assembly 620 can include an electrode introduction rod 621, an electrode introduction cable 622, and an electrode introduction plug 623. The first end of the electrode introduction rod 621 can be electrically connected with the electrode ring 610, the first end of the electrode introduction cable 622 can be electrically connected with the second end of the electrode introduction rod 621, the first end of the electrode introduction plug 623 can be electrically connected with the second end of the electrode introduction cable 622, and the second end of the electrode introduction plug 623 can be used to be electrically connected with the RF power source. Here, the electrode introduction cable 622 can be a flexible cable, so that the first introduction assembly 620 can adapt to the rotation of the electrode ring 610, so that the wafer boat and the electrode ring 610 can be in good contact, and the phenomenon of abnormal RF discharge caused by poor contact can be eliminated, thereby improving the stability of the process, improving the product yield and production capacity, and reducing the stress of the RF introduction assembly 600, thereby prolonging the service life of the RF introduction assembly 600.

[0048] In other embodiments, the electrode introduction cable 622 can be a rigid structure.

[0049] In some embodiments, the second end of the electrode introduction rod 621 and the first end of the electrode introduction plug 623 can be provided with threaded holes, and the two ends of the electrode introduction cable 622 can be provided with external threads. The two ends of the electrode introduction cable 622 can be inserted into the threaded holes of the electrode introduction rod 621 and the electrode introduction plug 623 respectively and threadedly connected with the threaded holes. In this way, the stability of the connection between the electrode introduction cable 622 and the electrode introduction rod 621 and the electrode introduction plug 623 can be improved, and at the same time, the maintenance of the first introduction assembly 620 can be facilitated.

[0050] In some embodiments, as shown in FIG. 8, the first introduction assembly 620 can further include a first insulating inner sleeve 624, a second insulating inner sleeve 625, and an insulating outer sleeve 626. The first insulating inner sleeve 624 can be sleeved outside the electrode introduction rod 621 and a portion of the electrode introduction cable 622, and the second insulating inner sleeve 625 can be sleeved outside a portion of the electrode introduction plug 623 and another portion of the electrode introduction cable 622, so as to ensure the electrical insulation of the structure of the first introduction assembly 620. The insulating outer sleeve 626 can be sleeved outside the first insulating inner sleeve 624 and the second insulating inner sleeve 625, and the insulating outer sleeve 626 can shield the gap between the first insulating inner sleeve 624 and the second insulating inner sleeve 625, so as to ensure that the joint of the first insulating inner sleeve 624 and the second insulating inner sleeve 625 is not exposed after at least one of the electrode introduction rod 621, the electrode introduction cable 622, the electrode introduction plug 623, the first insulating inner sleeve 624, and the second insulating inner sleeve 625 is expanded by heat, thereby improving the electrical insulation of the first introduction assembly 620 to ensure the integrity of the electrical insulation.

[0051] Of course, the first introduction assembly 620 can only include the first insulating inner sleeve 624 and the second insulating inner sleeve 625, and not include the insulating outer sleeve 626.

[0052] In some embodiments, the insulating outer sleeve 626 can include a plurality of insulating sleeves which are sequentially abutted along the length direction of the first introduction assembly 620, and at least one of the plurality of insulating sleeves can shield the joint of the first insulating inner sleeve 624 and the second insulating inner sleeve 625.

[0053] In some embodiments, the radio frequency introduction assembly 600 can further include a second introduction assembly 630. The second introduction assembly 630 can include a fixing assembly and a rear introduction electrode rod 631 which can be arranged on the fixing assembly. The fixing assembly can be used to connect with the reaction chamber 100 of the semiconductor process equipment. The second end of the first introduction assembly 620 can be electrically connected with the first end of the rear introduction electrode rod 631. Specifically, the second end of the electrode introduction plug 623 can be electrically connected with the first end of the rear introduction electrode rod 631. The second end of the rear introduction assembly can be used to be electrically connected with the radio frequency power source. Here, the radio frequency introduction assembly 600 can be connected with the reaction chamber 100 through the fixing assembly, so as to avoid the radio frequency introduction assembly 600 from being in poor contact with the wafer carrying boat due to shaking and the like.

[0054] In other embodiments, the radio frequency introduction assembly 600 can not include the second introduction assembly 630. The electrode introduction plug 623 of the first introduction assembly 620 can be directly connected with the radio frequency power source.

[0055] In some embodiments, the second end of the first introduction assembly 620 is inserted with the first end of the rear introduction electrode rod 631, and a watch strap contact finger 6311 can be arranged between the first introduction assembly 620 and the rear introduction electrode rod 631. Specifically, the second end of the electrode introduction plug 623 is inserted with the first end of the rear introduction electrode rod 631, and the watch strap contact finger 6311 is arranged between the electrode introduction plug 623 and the rear introduction electrode rod 631. In this way, the contact area of the first introduction assembly 620 and the rear introduction electrode rod 631 can be increased, so that the radio frequency connection is more stable. Of course, the watch strap contact finger 6311 can not be arranged between the first introduction assembly 620 and the rear introduction electrode rod 631.

[0056] In the present embodiment, the first end of the rear introduction electrode rod 631 can be provided with a socket, and the second end of the electrode introduction plug 623 can be inserted into the socket.

[0057] In some embodiments, as shown in FIG. 13, the fixing assembly can include an electrode blind plate 633 and an electrode introduction fixing seat 635. The electrode blind plate 633 can be used to connect with the reaction chamber 100, and the side of the electrode blind plate 633 away from the inner cavity of the reaction chamber 100 can be provided with a connecting sleeve 634, which can be sleeved outside the first part of the rear introduction electrode rod 631. The electrode introduction fixing seat 635 can be sleeved outside the second part of the rear introduction electrode rod 631, and the connecting sleeve 634 can be detachably connected with the end of the electrode introduction fixing seat 635 close to the reaction chamber 100. When disassembling the radio frequency introduction assembly 600, the electrode introduction fixing seat 635 and the connecting sleeve 634 can be separated, and the electrode ring sleeve 610 and the first introduction assembly 620 can be pulled out from the reaction chamber 100 through the electrode introduction fixing seat 635. In this way, the electrode blind plate 633 does not need to be disassembled, and the disassembly and assembly are convenient, thereby facilitating the replacement or maintenance of the radio frequency introduction assembly 600.

[0058] In other embodiments, the connecting sleeve 634 and the electrode introduction fixing seat 635 are non-detachably connected.

[0059] In some embodiments, as shown in FIG. 13, the connecting sleeve 634 and the electrode introduction fixing seat 635 can be connected through a first clamp 637. Specifically, the first clamp 637 can be sleeved outside at least part of the connecting sleeve 634 and at least part of the electrode introduction fixing seat 635. When disassembling the radio frequency introduction assembly 600, the first clamp 637 can be loosened, so that the electrode introduction fixing seat 635 and the connecting sleeve 634 can be separated.

[0060] In the present embodiment, the electrode blind plate 633 can be arranged at the maintenance hole of the rear furnace door 140 of the reaction chamber 100, and the electrode blind plate 633 can be connected with the hole wall of the maintenance hole through a second clamp 670. Here, the second clamp 670 can be a chain clamp, so as to facilitate the quick assembly and disassembly of the electrode blind plate 633.

[0061] In order to ensure the air tightness of the reaction chamber 100, a fourth sealing member 680 is arranged between the electrode blind plate 633 and the hole wall of the maintenance hole.

[0062] In some embodiments, a first sealing member 640 can be arranged between the connecting sleeve 634 and the electrode introduction fixing seat 635. In this way, the sealing between the connecting sleeve 634 and the electrode introduction fixing seat 635 can be improved, so as to avoid the leakage of the reaction gas in the reaction chamber 100 through the gap between the connecting sleeve 634 and the electrode introduction fixing seat 635.

[0063] Of course, the first sealing member 640 can not be arranged between the connecting sleeve 634 and the electrode introduction fixing seat 635.

[0064] In some embodiments, as shown in FIG. 13, the second introduction assembly 630 can further include a first insulation sleeve 638 and a second insulation sleeve 639, both of which can be located in the fixing assembly. The first insulation sleeve 638 can be sleeved on a part of the rear introduction electrode rod 631, the second insulation sleeve 639 can be sleeved on another part of the rear introduction electrode rod 631, and the first insulation sleeve 638 and the second insulation sleeve 639 are opposite to each other. In this way, the rear introduction electrode rod 631 can be prevented from forming an electrical contact with the fixing assembly, and the fixing assembly can be made of metal, which is beneficial to improve the strength of the fixing assembly.

[0065] In other embodiments, the second introduction assembly 630 can not include the first insulation sleeve 638 and the second insulation sleeve 639, and the fixing assembly can be made of an insulating material.

[0066] In some embodiments, an annular protrusion can be arranged on the end of the first insulation sleeve 638 close to the second insulation sleeve 639, the annular protrusion can protrude in the radial direction of the first insulation sleeve 638, and a second sealing member 641 can be arranged between the side of the annular protrusion close to the reaction chamber 100 and the electrode introduction fixing seat 635. In this way, the sealing of the fixing assembly can be further improved. Of course, the end of the first insulation sleeve 638 close to the second insulation sleeve 639 can not be provided with the annular protrusion and the second sealing member 641.

[0067] In some embodiments, the fixing assembly can further include a rear fixing seat 636 and a coaxial cable seat 632, the coaxial cable seat 632 is arranged on the rear fixing seat 636, and the coaxial cable seat 632 is provided with a cable socket 6321 which can protrude from the rear fixing seat 636 towards the electrode blind plate 633, and the cable socket 6321 can be used for inserting a connecting cable connected with the radio frequency power supply. The rear fixing seat 636 can be located on the side of the electrode introduction fixing seat 635 away from the electrode blind plate 633, and the rear fixing seat 636 can be connected with the electrode introduction fixing seat 635 by screws. Here, the second end of the rear introduction electrode rod 631 can be connected with the coaxial cable seat 632.

[0068] Further, in some embodiments, a second insulation sleeve 639 can be arranged in the rear fixing seat 636, and one end of the rear fixing seat 636 close to the electrode blind plate 633 can be provided with a fixing groove, the annular protrusion described above can be embedded in the fixing groove, and a third sealing member 642 can be arranged between the annular protrusion and the groove bottom of the fixing groove, and the third sealing member 642 can be sleeved outside the second insulation sleeve 639, so that the sealing effect of the fixing assembly can be further improved. The rear fixing seat 636 and the electrode introduction fixing seat 635 are connected by screws, and the pre-tightening force of the screws can make the rear fixing seat 636 and the electrode introduction fixing seat 635 press the third sealing member 642, and make the electrode introduction fixing seat 635 form a sealed area with the first insulation sleeve 638 and the rear fixing seat 636 and the second insulation sleeve 639, so as to ensure the air tightness of the reaction chamber 100.

[0069] In some embodiments, as shown in FIG. 13 and FIG. 14, the radio frequency introduction assembly 600 can further include an electrode reflection plate 650, the electrode reflection plate 650 can be used to be placed in the reaction chamber 100, and the electrode reflection plate 650 can be connected with the fixing assembly, and the reflection surface of the electrode reflection plate 650 can be arranged away from the fixing assembly. In this way, the electrode reflection plate 650 can prevent the heat inside the reaction chamber 100 from being dissipated in the direction of the fixing assembly, thereby avoiding the sealing member inside the fixing assembly from being in a high temperature environment, so as to protect the sealing member inside the fixing assembly, thereby being conducive to improving the air tightness of the reaction chamber 100.

[0070] In other embodiments, one side of the electrode reflection plate 650 close to the fixing assembly and the side away from the fixing assembly can both be reflection surfaces, and the electrode reflection plate 650 can be arranged close to the rear furnace door 140 of the reaction chamber 100. Alternatively, the radio frequency introduction assembly 600 can not include the electrode reflection plate 650.

[0071] In some embodiments, the radio frequency introduction assembly 600 can include a plurality of electrode reflection plates 650, so as to improve the protection effect on the seal inside the fixed assembly. The electrode reflection plates 650 can be arranged in parallel and connected to the electrode blind plate 633 through a reflection plate spacer 660. Specifically, the reflection plate spacer 660 includes a spacer connecting portion and a reflection plate connecting portion coaxially connected to the spacer connecting portion. The spacer connecting portion is connected to the electrode blind plate 633. The diameter of the reflection plate connecting portion is smaller than that of the spacer connecting portion. The electrode reflection plates 650 are each provided with a connecting hole through which the reflection plate connecting portion can pass. The hole diameter of the connecting hole is smaller than the diameter of the spacer connecting portion. The reflection plate connecting portion is connected to a connecting screw 661. The diameter of the head of the connecting screw 661 is larger than the hole diameter of the connecting hole. In this way, the connecting screw 661 and the spacer connecting portion can limit the electrode reflection plates 650, so that the electrode reflection plates 650 can be installed on the reflection plate spacer 660.

[0072] In some embodiments, as shown in FIGS. 15 and 16, the radio frequency introduction assembly 600 can further include a limiting assembly 800. The limiting assembly 800 can include a limiting block 820 and a fixed plate 810. The fixed plate 810 can be used to connect with the reaction chamber 100 of the semiconductor process equipment. The limiting block 820 can be connected with the first introduction assembly 620 and fixed relative to the first introduction assembly 620 in the length direction of the first introduction assembly 620. The limiting block 820 and the fixed plate 810 can be limited and matched in the length direction of the first introduction assembly 620. In this way, the position of the electrode ring sleeve 610 can be accurately positioned through the limiting and matching of the limiting block 820 and the fixed plate 810. The radio frequency introduction assembly 600 can be axially limited, so as to ensure the consistency of the installation position of the radio frequency introduction assembly 600, thereby eliminating the abnormal discharge and dust pollution of the wafer caused by the inconsistent installation position of the radio frequency introduction assembly 600.

[0073] In other embodiments, the radio frequency introduction assembly 600 can not include the limiting assembly 800.

[0074] In some embodiments, the fixing plate 810 can be provided with a U-shaped slot 811, the limiting block 820 can be used to extend into the U-shaped slot 811 through the opening of the U-shaped slot 811, and the limiting block 820 can be provided with a clamping slot 822, and part of the fixing plate 810 can be inserted into the clamping slot 822. In this way, when the radio frequency lead-in assembly 600 is installed, the limiting block 820 can extend into the U-shaped slot 811 through the opening of the U-shaped slot 811 until the part of the fixing plate 810 is inserted into the clamping slot 822, at which time the position of the radio frequency lead-in assembly 600 is limited by the fixing plate 810; when the radio frequency lead-in assembly 600 is disassembled, the limiting block 820 is forced to separate the fixing plate 810 from the clamping slot 822, and then the limiting block 820 is removed from the U-shaped slot 811 through the opening of the U-shaped slot 811. As can be seen, when the radio frequency lead-in assembly 600 is disassembled, the operator can directly manually operate to move the limiting block 820 in a direction substantially perpendicular to the length direction of the first lead-in assembly 620, and the operation is relatively simple, so it is convenient to disassemble the radio frequency lead-in assembly 600.

[0075] Of course, the fixing plate 810 can not be provided with the U-shaped slot 811, and the limiting block 820 can not be provided with the clamping slot 822, and the fixing plate 810 and the limiting block 820 can be connected by a fixing member.

[0076] In some embodiments, one of the first lead-in assembly 620 and the limiting block 820 can be provided with a connecting slot 6231, and the other can be provided with a connecting protrusion 823, and the connecting protrusion 823 can be embedded in the connecting slot 6231 to relatively fix the first lead-in assembly 620 and the limiting block 820 in the length direction of the first lead-in assembly 620. In this way, the first lead-in assembly 620 and the limiting block 820 do not need to be connected by a fixing nail or the like fixing member, which is conducive to simplifying the structure of the radio frequency lead-in assembly 600.

[0077] In other embodiments, the first lead-in assembly 620 and the limiting block 820 can be connected by a fixing nail.

[0078] In some embodiments, the limiting block 820 can include at least two arc-shaped blocks 821, each arc-shaped block 821 can be connected to form a ring structure, and the ring structure can be sleeved outside the first lead-in assembly 620. In this way, it is convenient to disassemble. Of course, the limiting block 820 can also be a one-piece structure, specifically, the limiting block 820 can be an integral ring structure.

[0079] Specifically, each arc-shaped block 821 can be provided with a connecting protrusion 823, and the first lead-in assembly 620 is provided with a connecting slot 6231, here, the connecting slot 6231 can be provided on the second insulating inner sleeve 625 or the insulating outer sleeve 626 described above, and the connecting protrusion 823 on each arc-shaped block 821 can be embedded in the connecting slot 6231 to realize the relative fixation of the limiting block 820 and the first lead-in assembly 620.

[0080] Each of the arc-shaped blocks 821 can enter the U-shaped groove 811, and each of the arc-shaped blocks 821 can be provided with a clamping groove 822, and parts of the fixing plate 810 can be inserted into the clamping groove 822 of each of the arc-shaped blocks 821.

[0081] In some embodiments, the fixing plate 810 can be connected with the reaction chamber 100 through the fixing block 830, specifically, the fixing plate 810 can be connected with the support seat 430 through the fixing block 830, and the support seat 430 can be arranged on the second flange 150 of the reaction chamber 100 and used for supporting the support 400. Here, the fixing block 830 can be connected with the support seat 430 through the first screw 840, and the fixing plate 810 can be connected with the fixing block 830 through the second screw 850.

[0082] Based on the radio frequency introduction assembly 600 provided in the embodiments of the present application, the embodiments of the present application further provide a carrier boat support device, which can include the support 400 and the radio frequency introduction assembly 600 as described in any of the above embodiments. The support 400 can be used for supporting a wafer carrier boat, the electrode ring sleeve 610 of the radio frequency introduction assembly 600 can be sleeved on the support 400, and the electrode ring sleeve 610 can move relative to the support 400. In this way, the electrode ring sleeve 610 can freely move along the axial direction of the support 400 to be connected with or separated from the wafer carrier boat, so that the radio frequency introduction assembly 600 can be pullably arranged in the reaction chamber 100.

[0083] The beneficial effects achieved by the carrier boat support device provided in the embodiments of the present application are consistent with the beneficial effects achieved by the radio frequency introduction assembly 600 provided in the embodiments of the present application, and thus will not be described herein again.

[0084] In some embodiments, the carrier boat support device can further include an introduction assembly support assembly 700, which can include a limiting ring 710 and a support part 720. The limiting ring 710 can be connected with the support part 720, and the limiting ring 710 can be sleeved outside the support 400, and the limiting ring 710 is used for contacting with the cavity wall of the reaction chamber 100. The support part 720 can be located below the first introduction assembly 620 of the radio frequency introduction assembly 600 and used for supporting the first introduction assembly 620. In this way, the deformation of the first introduction assembly 620 due to its own weight can be prevented, and the phenomenon of abnormal radio frequency discharge due to the fragmentation of the first insulating inner sleeve 624, the second insulating inner sleeve 625 and the insulating outer sleeve 626 can be avoided.

[0085] In other embodiments, the carrier boat support device can not include the introduction assembly support assembly 700.

[0086] In some embodiments, the support 400 can include a support rod 410 and a third insulating sleeve 420 sleeved outside the support rod 410, which can be used to electrically insulate the wafer carrier boat from the support rod 410.

[0087] Here, the two ends of the support rod 410 can be connected to the front door 120 and the rear door 140 of the reaction chamber 100 through the support seats 430, respectively.

[0088] It should be noted that the first insulating inner sleeve 624, the second insulating inner sleeve 625, the insulating outer sleeve 626, the first insulating sleeve 638, the second insulating sleeve 639 and the third insulating sleeve 420 can all be made of ceramic sleeves.

[0089] Based on the carrier boat support device provided in the embodiments of the present application, the embodiments of the present application further provide a semiconductor process equipment, which can include a reaction chamber 100 and at least two carrier boat support devices. The support 400 of each carrier boat support device is arranged in the reaction chamber 100, and the support 400 of each carrier boat support device is used to support a wafer carrier boat. In this way, the stability of the wafer carrier boat can be improved. Moreover, the RF introduction assembly 600 of the carrier boat support device is pullably arranged in the reaction chamber 100. In this way, the RF introduction assembly 600 can be introduced into the reaction chamber 100 from the tail end of the reaction chamber 100, that is, the RF introduction assembly 600 can be introduced into the reaction chamber 100 from the end of the reaction chamber 100 away from the furnace port. When the RF introduction assembly 600 is maintained or replaced, the RF introduction assembly 600 only needs to be pulled out from the tail end of the reaction chamber 100, without the need to cool the reaction chamber 100, pause the automatic equipment, and have maintenance personnel enter the inside of the machine to perform the opening operation. Therefore, the maintenance and replacement operation of the RF introduction assembly 600 can be simplified, the maintenance and replacement time of the RF introduction assembly 600 can be effectively shortened, and the safety of the maintenance operation can be improved.

[0090] In the embodiments of the present application, as shown in FIGS. 1 and 2, the reaction chamber 100 can include a chamber body 110, a front door 120, a first flange 130, a gas inlet flange 133, a rear door 140 and a second flange 150. The front door 120 can be connected to the first end of the chamber body 110 through the first flange 130, the rear door 140 can be connected to the second end of the chamber body 110 through the second flange 150, and the gas inlet flange 133 can be arranged on the front door 120 and used to communicate the inner cavity of the reaction chamber 100 with a process gas pipeline. When the wafer carrier boat needs to enter or exit the reaction chamber 100 before or after the process, the front door 120 can be opened or closed.

[0091] Here, the chamber body 110 can be made of a quartz tube, the first end of the chamber body 110 can be sealed by a sealing ring from the first flange 130, the second end of the chamber body 110 can be sealed by a sealing ring from the second flange 150, and the chamber body 110, the front furnace door 120, the first flange 130, the gas inlet flange 133, the rear furnace door 140 and the second flange 150 can jointly form a sealed vacuum environment.

[0092] The first flange 130 can include a first connecting flange 131 and a first cooling flange 132, the first connecting flange 131 can be connected with the first end of the chamber body 110, the first cooling flange 132 can be connected with the first connecting flange 131, and the front furnace door 120 can be connected with the first cooling flange 132, the first cooling flange 132 can provide a cooling environment to reduce the surface temperature of the first flange 130, and in turn can reduce the temperature of the front furnace door 120 to avoid the temperature of the front furnace door 120 being too high.

[0093] The second flange 150 can include a second connecting flange 151 and a second cooling flange 152, the second connecting flange 151 can be connected with the second end of the chamber body 110, the second cooling flange 152 can be connected with the second connecting flange 151, and the rear furnace door 140 can be connected with the second cooling flange 152, the second cooling flange 152 can provide a cooling environment to reduce the surface temperature of the second flange 150, and in turn can reduce the temperature of the rear furnace door 140 to avoid the temperature of the rear furnace door 140 being too high.

[0094] The two ends of the support rod 410 described above can be connected with the first flange 130 and the second flange 150 through the support seat 430 respectively. The two support seats 430 can be connected with the inner wall of the first flange 130 and the inner wall of the second flange 150 respectively, and each support seat 430 can be in an arc-shaped structure to adapt to the shape of the first flange 130 and the second flange 150. Here, the side of the support seat 430 away from the first flange 130 or the second flange 150 is provided with a groove, and the support rod 410 can be embedded in the groove.

[0095] During the process, the wafer carrier boat is sent into the inner cavity of the reaction chamber 100 by the conveying device, the boat foot of the wafer carrier boat can be in contact with the electrode ring sleeve 610 of the radio frequency introduction assembly 600 to form an electrical connection, at this time the radio frequency introduction assembly 600 can provide radio frequency power for the wafer carrier boat.

[0096] It should be noted that the semiconductor process equipment can be a PECVD (Plasma-Enhanced Chemical Vapor Deposition) device.

[0097] In the embodiment, the semiconductor processing equipment can include two wafer carrying boats and two carrying boat support devices.

[0098] In an optional embodiment of the present application, as shown in FIG. 1, the semiconductor processing equipment can include a plug-in electrode assembly 500, at least one carrying boat support device, and at least two wafer carrying boats. The plug-in electrode assembly 500 and the RF introduction assembly 600 of each carrying boat support device are electrically connected with the RF power source. The plug-in electrode assembly 500 can be arranged at the middle position of the back door 140, and the plug-in electrode assembly 500 can be plugged into the electrode hole of the wafer carrying boat (i.e., the wafer carrying boat close to the back door 140) that enters the inner cavity of the reaction chamber 100 first, so as to provide RF power for the wafer carrying boat. The RF introduction assembly 600 of each carrying boat support device is used to provide RF power for other wafer carrying boats.

[0099] In some embodiments, the plug-in electrode assembly 500 can include an electrode rod 510. The first end of the electrode rod 510 can be plugged into the electrode hole of the wafer carrying boat, and the second end of the electrode rod 510 can be electrically connected with the RF power source.

[0100] In an embodiment, the semiconductor processing equipment can include two wafer carrying boats and one carrying boat support device. The carrying boat support device can include two support members 400 and two RF introduction assemblies 600. Here, the two wafer carrying boats can be a first carrying boat 200 and a second carrying boat 300, respectively. The two support members 400 are used to support the first carrying boat 200 and the second carrying boat 300. The plug-in electrode assembly 500 can be plugged into the electrode hole of the first carrying boat 200, and the RF introduction assembly 600 can be in contact with the boat foot of the second carrying boat 300.

[0101] It should be noted that, since the plug-in electrode assembly 500 needs to be introduced from the back door 140, the second carrying boat 300 is far away from the back door 140, and the first carrying boat 200 is between the second carrying boat 300 and the back door 140, so the plug-in electrode assembly 500 cannot be connected with the second carrying boat 300. Therefore, the RF power is provided for the second carrying boat 300 by the RF introduction assembly 600 in contact with the boat foot of the second carrying boat 300.

[0102] When the wafer carrying boats are loaded, the first carrying boat 200 and the second carrying boat 300 are slowly loaded into the inner cavity of the reaction chamber 100 in sequence. The first end of the electrode rod 510 of the plug-in electrode assembly 500 is inserted into the electrode hole of the first carrying boat 200, so that the first carrying boat 200 is fed with RF power. Then, the wafer carrying boats are slowly unloaded, so that the first carrying boat 200 and the second carrying boat 300 are both unloaded onto the support member 400, and the boat foot of the second carrying boat 300 is in contact with the electrode ring sleeve 610 of the RF introduction assembly 600, so that the second carrying boat 300 is fed with RF power.

[0103] In the maintenance of the radio frequency introduction assembly 600, the first clamp 637 described above is opened first, the electrode introduction fixing seat 635 and the electrode blind plate 633 are separated, and the rear electrode introduction rod 631 and the electrode introduction plug 623 are separated, then the first seal 640 between the connecting sleeve 634 and the electrode introduction fixing seat 635 is removed, the limiting block 820 is lifted out of the U-shaped groove 811 of the fixing plate 810, and finally the first introduction assembly 620 and the electrode ring sleeve 610 are pulled out as a whole along the length direction of the support 400, so that the disassembly of the radio frequency introduction assembly 600 is realized. In this way, without the need for cooling treatment and suspension of the automatic equipment, the maintenance and replacement operation of the radio frequency introduction assembly 600 can be simplified and the maintenance and replacement time of the radio frequency introduction assembly 600 can be effectively shortened, and the safety of the maintenance operation can be improved.

[0104] In another embodiment of the present application, the semiconductor process equipment can include at least two wafer carrying boats, each of which is introduced with radio frequency power through the radio frequency introduction assembly 600 in the embodiment of the present application. At this time, the semiconductor process equipment can include at least two carrying boat support devices, each of which can include two support 400 and two radio frequency introduction assemblies 600. The electrode ring sleeve 610 of each radio frequency introduction assembly 600 can be sleeved on each support 400 respectively, and the two radio frequency introduction assemblies 600 are respectively used for connecting with the positive and negative poles of the radio frequency power supply. Each wafer carrying boat can enter the inner cavity of the reaction chamber 100 in turn, and the support 400 of each carrying boat support device can support each wafer carrying boat respectively, and the radio frequency introduction assembly 600 of each carrying boat support device can introduce radio frequency power for each wafer carrying boat.

[0105] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are only illustrative but not limiting. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims, which are all within the protection of the present application.

Claims

1. A radio frequency (RF) introduction component for introducing RF power into a wafer carrier boat, characterized in that, The radio frequency introduction assembly comprises an electrode ring sleeve and a first introduction assembly, the electrode ring sleeve is used for sleeving on a support, the support is used for supporting the wafer carrying boat, and the electrode ring sleeve is electrically connected with a first end of the first introduction assembly.

2. The radio frequency drop assembly of claim 1, wherein, The electrode ring sleeve is provided with a notch for the support to enter and exit the electrode ring sleeve.

3. The radio frequency drop assembly of claim 1, wherein, A first connecting part is arranged on the outer wall of the electrode ring sleeve, the first connecting part is provided with a through hole, a second connecting part of the first introduction assembly is arranged in the through hole, the cross-sectional area of the through hole gradually decreases in the direction towards the first end of the first introduction assembly, the cross-sectional area of the second connecting part gradually decreases, and the second connecting part is fitted with the hole wall of the through hole.

4. The radio frequency drop assembly of claim 3, wherein, An end of the second connecting part away from the first introduction assembly is provided with a third connecting part, the cross-sectional area of the third connecting part is smaller than the minimum cross-sectional area of the through hole, the third connecting part is connected with a locking part, and the locking part is used for locking the first connecting part and the second connecting part.

5. The radio frequency drop assembly of claim 1, wherein, The outer wall of the electrode ring sleeve is provided with a flat surface for fitting with a boat foot of the wafer carrying boat.

6. The radio frequency drop assembly of claim 1, wherein, The first introduction assembly comprises: an electrode introduction rod, a first end of the electrode introduction rod is electrically connected with the electrode ring sleeve; an electrode introduction cable, a first end of the electrode introduction cable is electrically connected with a second end of the electrode introduction rod, and the electrode introduction cable is a flexible cable; an electrode introduction plug, a first end of the electrode introduction plug is electrically connected with a second end of the electrode introduction cable, and a second end of the electrode introduction plug is used for electrically connecting with a radio frequency power supply.

7. The radio frequency drop assembly of claim 6, wherein, The first introduction assembly further comprises: a first insulating inner sleeve, the first insulating inner sleeve is sleeved outside the electrode introduction rod and a part of the electrode introduction cable; a second insulating inner sleeve, the second insulating inner sleeve is sleeved outside a part of the electrode introduction plug and another part of the electrode introduction cable; an insulating outer sleeve, the insulating outer sleeve is sleeved outside the first insulating inner sleeve and the second insulating inner sleeve, and the insulating outer sleeve shields a gap between the first insulating inner sleeve and the second insulating inner sleeve.

8. The radio frequency drop assembly of claim 1, wherein, The radio frequency introduction assembly further comprises a second introduction assembly, the second introduction assembly comprises a fixing assembly and a rear introduction electrode rod arranged on the fixing assembly, the fixing assembly is used for connecting with a reaction chamber of a semiconductor process equipment, a second end of the first introduction assembly is electrically connected with a first end of the rear introduction electrode rod, and a second end of the rear introduction electrode rod is used for electrically connecting with a radio frequency power supply.

9. The radio frequency drop assembly of claim 8, wherein, The fixing assembly comprises an electrode blind plate and an electrode introduction fixing seat, the electrode blind plate is used for connecting with the reaction chamber, a connecting sleeve is arranged on a side of the electrode blind plate away from an inner cavity of the reaction chamber, the connecting sleeve is sleeved outside a first part of the rear introduction electrode rod, the electrode introduction fixing seat is sleeved outside a second part of the rear introduction electrode rod, and an end of the connecting sleeve and the electrode introduction fixing seat close to the reaction chamber is detachably connected.

10. The radio frequency drop assembly of claim 9, wherein, A first sealing part is arranged between the connecting sleeve and the electrode introduction fixing seat.

11. The radio frequency drop assembly of claim 9, wherein, The second introducing assembly further comprises a first insulation sleeve and a second insulation sleeve, both of which are located in the fixing assembly, the first insulation sleeve is sleeved on a part of the rear introducing electrode rod, the second insulation sleeve is sleeved on another part of the rear introducing electrode rod, and the first insulation sleeve and the second insulation sleeve are connected.

12. The radio frequency drop assembly of claim 11, wherein, An annular protrusion is arranged on one end of the first insulation sleeve close to the second insulation sleeve, the annular protrusion protrudes in the radial direction of the first insulation sleeve, and a second sealing element is arranged between the annular protrusion close to one side of the reaction chamber and the electrode introducing fixing seat.

13. The radio frequency drop assembly of claim 8, wherein, The second end of the first introducing assembly is inserted into the first end of the rear introducing electrode rod, and a watchband contact finger is arranged between the first introducing assembly and the rear introducing electrode rod.

14. The radio frequency drop assembly of claim 8, wherein, The radio frequency introducing assembly further comprises an electrode reflecting plate, the electrode reflecting plate is arranged in the reaction chamber, and the electrode reflecting plate is connected with the fixing assembly, and a reflecting surface of the electrode reflecting plate is arranged away from the fixing assembly.

15. The radio frequency drop assembly of claim 1, wherein, The radio frequency introducing assembly further comprises: A limiting assembly comprises a limiting block and a fixing plate, the fixing plate is arranged to be connected with the reaction chamber of the semiconductor process equipment, the limiting block is connected with the first introducing assembly, and both are fixed relative to each other in the length direction of the first introducing assembly, and the limiting block and the fixing plate are limitedly matched in the length direction of the first introducing assembly.

16. The radio frequency drop assembly of claim 15, wherein, The fixing plate is provided with a U-shaped groove, the limiting block is arranged to extend into the U-shaped groove through the opening of the U-shaped groove, and the limiting block is provided with a clamping groove, and part of the fixing plate is inserted into the clamping groove.

17. The radio frequency drop assembly of claim 15, wherein, One of the first introducing assembly and the limiting block is provided with a connecting groove, and the other is provided with a connecting protrusion, the connecting protrusion is embedded in the connecting groove, so that the first introducing assembly and the limiting block are fixed relative to each other in the length direction of the first introducing assembly.

18. The radio frequency drop assembly of claim 15, wherein, The limiting block comprises at least two arc-shaped blocks, each of which is connected to form an annular structure, and the annular structure is sleeved outside the first introducing assembly.

19. A carrier boat support apparatus, characterized by, The support member is arranged to support a carrier boat, and the electrode ring sleeve of the radio frequency introducing assembly is arranged on the support member and is movable relative to the support member.

20. The load boat support apparatus of claim 19, wherein, The carrier boat support device further comprises an introducing assembly support assembly, the introducing assembly support assembly comprises a limiting ring and a support part connected with each other, the limiting ring is sleeved outside the support member, and the limiting ring is arranged to be in contact with the cavity wall of the reaction chamber of the semiconductor process equipment, and the support part is arranged below the first introducing assembly of the radio frequency introducing assembly and is arranged to support the first introducing assembly.

21. A semiconductor process apparatus, characterized by, The reaction chamber and at least two carrier boat support devices according to claim 19 or 20 are provided, the support member of the carrier boat support device is arranged in the reaction chamber, and the radio frequency introducing assembly of the carrier boat support device is arranged to be pullable in the reaction chamber.

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