Spreading element for pushing a circuit carrier away from an abutment, and computing unit

Abstract

The invention relates to a spreading element (100) for pushing a circuit carrier away from an abutment, the spreading element (100) having a frame element (110), at least one holding element (120) and at least one spring element (130), the at least one holding element (120) protruding laterally from the frame element as a soldering or screw lug, the frame element (110) having a contact surface (115) for the circuit carrier (210, 410), the at least one holding element (120) being designed to hold the spreading element (100) on the circuit carrier or the abutment, and the at least one spring element (130) being designed to exert a force on the abutment perpendicularly to the contact surface (115), so that the contact surface (115) bears against the circuit carrier (210) and the abutment (250) is pushed away from the circuit carrier (210).

Description

[0001] R.413133

[0002] - 1 -

[0003] Description

[0004] Spreading element for pushing a circuit carrier away from a support and computing unit

[0005] The present invention relates to a spreading element for pushing away a circuit carrier from a support and to a computing unit with such a spreading element.

[0006] Background of the invention

[0007] In computing units that contain electrical (including electronic) components with high power dissipation, it can be important to dissipate heat from these components. For this purpose, a cooling element or heat sink can be provided, for example, a fluid-cooled heat sink through which a cooling fluid such as oil, water, or air flows. It is also important that the gap or distance between the components to be cooled and the cooling element is as small as possible to transfer heat to the heat sink as efficiently as possible. For example, a layer of a thermal interface material (TIM) with the lowest possible thermal resistance or the highest possible thermal conductivity can be placed in this gap.Such electrical components can be designed, for example, as semiconductor switching elements, such as transistors like FETs, MOSFETs, IGBTs, etc., which are often used in the (motor) vehicle sector. A corresponding processing unit could, for example, be a control unit of a (motor) vehicle.

[0008] Disclosure of invention R.413133

[0009] - 2 -

[0010] According to the invention, a spreading element for pushing away a support from a circuit carrier and a computing unit with such a spreading element, comprising the features of the independent claims, are proposed. Advantageous embodiments are the subject of the dependent claims and the following description.

[0011] The invention presents a spreading element for pushing away a circuit carrier, in particular a printed circuit board (PCB), from a support, such as a housing component. The spreading element comprises a frame element, at least one retaining element, and at least one spring element. The frame element, in particular, means that it encloses or frames a free area within its interior.

[0012] The at least one retaining element projects laterally from the frame element as a soldered or screwed tab, which can include outward and inward projection (i.e., into the framed area), and is designed to hold the spreading element to the circuit carrier or the abutment. In the context of this invention, a screwed tab is understood to be a tab with an eyelet that can accommodate a screw, but also a rivet, bolt, pin, etc.

[0013] The frame element has a contact surface for the circuit carrier, and the at least one spring element is configured to exert a force perpendicular to the contact surface on the abutment, such that the contact surface rests against the circuit carrier and the abutment is pushed away from the circuit carrier. For example, the at least one spring element can extend directly from the contact surface. For example, the at least one spring element can project from the contact surface and extend towards the abutment.

[0014] The frame element can, in particular, lie flat and evenly against the circuit carrier across its entire contact surface, or conform closely to the circuit carrier. This even contact allows for R.413133

[0015] - 3 - uniform force is applied and the abutment can be pushed away from the circuit carrier uniformly.

[0016] The invention thus proposes a structurally simple component that can be arranged in a simple and space-saving manner within a computing unit to effectively press a circuit carrier in a desired direction, particularly towards a cooling element. In particular, components within the computing unit can be pressed against each other in this way, e.g., to reduce or minimize a gap between components within the computing unit. The spreading element is particularly advantageous for compensating for component tolerances within the computing unit.

[0017] The spreading element is specifically designed to be arranged in a computing unit comprising the abutment, the circuit carrier, an electrical component on the circuit carrier, and a cooling element on the electrical component. The spreading element is designed to be positioned on the side of the circuit carrier facing away from the electrical component.

[0018] The electrical component is expediently electrically connected to the circuit carrier and can, for example, be designed as an SMD (surface-mounted device). The electrical component can, in particular, be designed as an integrated circuit or power semiconductor. It is understood that several such electrical components can also be arranged on the circuit carrier. The electrical component can generate high power dissipation during operation of the processing unit, so a cooling element is provided to cool the electrical component. The cooling element can, for example, be a fluid-cooled heat sink through which a cooling fluid is passed, e.g., oil, water, air, etc. Furthermore, a layer of thermally conductive material or a thermal interface material (thermal interface material) can be placed between the electrical component and the heat sink."Thermal interface material" (TIM) should be provided, wherein this material can have the lowest possible thermal resistance or the highest possible thermal conductivity. R.413133.

[0019] - 4 -

[0020] The spreading element is particularly useful for reducing or minimizing the gap between the electrical component and the cooling element. The force exerted by the at least one spring element, supported at the abutment, effectively presses the circuit carrier and the electrical component mounted on it (or the assembly of these elements) towards the cooling element. In this way, the gap between the electrical component and the heat sink can be reduced.

[0021] The invention thus proposes a structurally simple component that can be arranged in the computing unit in a simple and space-saving manner and effectively reduces or minimizes the gap between the electrical component and the cooling element. The spreading element can compensate for component tolerances in the computing unit, e.g., tolerances of the circuit carrier, the electrical component, the abutment, a housing, etc. The at least one spring element advantageously ensures that the spreading element can conform evenly to the circuit carrier via the contact surface of the frame element and that the circuit carrier, together with the electrical component mounted on it, is pressed evenly against the cooling element or the TIM layer. The cooling of the electrical component by means of the heat sink can thus be improved.The spreading element allows a computing unit to be provided that has a very small TIM gap for very good heat dissipation of electrical components, without having to integrate an additional process step into a production line.

[0022] In particular, the spreading element can be designed to selectively influence the distance or gap between the electrical component and the cooling element. The spreading element can be specifically designed and, in particular, explicitly adapted to the specific conditions within the respective computing unit, so that the gap can be selectively influenced and specifically set to the smallest possible, especially minimal, value. In particular, the material and / or dimensions of the at least one spring element, especially its length and / or R.413133

[0023] - 5 -

[0024] The thickness can be specified to precisely control the force and thus the distance between the electrical component and the cooling element. Particularly useful is the ability to adjust the exerted force to specific requirements or dimensions within the processing unit by varying the material thickness and / or the length of individual spring elements, thereby influencing the gap as desired. Specifically, the material and / or dimensions of each spring element can be individually specified to precisely control the force exerted by that element and to influence the distance as effectively and uniformly as possible. Furthermore, the number of spring elements and / or their respective positions on the spreading element can be specified to precisely control the force of each individual spring element.

[0025] In one embodiment, the spreading element has at least four retaining elements, which are arranged on the frame element, in particular at uniform intervals from one another. Specifically, the retaining elements can thus be regularly and uniformly distributed on the frame element and generate a uniformly distributed fastening force to hold the spreading element to the circuit carrier or the abutment. Advantageously, the frame element can thus bear evenly against the circuit carrier over its contact surface.

[0026] In one embodiment, the frame element is designed as a polygon with multiple corners in a top view, and the spreading element has a retaining element at each corner, which is arranged particularly at the corners or on edges of the frame element that connect the corners. The retaining elements are thus provided regularly along the polygonal shape of the frame element. A uniformly distributed fastening force can be generated to hold the spreading element to the circuit carrier or the abutment, and the shape can be adapted to that of common electrical components.

[0027] In one embodiment, the frame element has a rectangular shape in a top view, in particular a square shape. Such an embodiment R.413133

[0028] - 6 - The rectangular shape can be adapted, in particular, to the shape of common electrical components mounted on the circuit board. In particular, the dimensions of this rectangular shape, especially its length and width, can be adapted to the corresponding dimensions of the component.

[0029] In one embodiment, the spreading element is designed as a stamped and bent part. For example, the stamped and bent part can be made from a sheet of metal, such as spring steel. Such stamped and bent parts can be manufactured particularly cost-effectively and with minimal effort. Mass production of such stamped and bent parts is also easily possible.

[0030] In one embodiment, the frame element is stiffened. For example, the stiffness of the frame element can have a predetermined value, particularly a predetermined minimum value. For instance, the material and / or the shape and / or the dimensions of the frame element can be specified such that the stiffness achieves the predetermined value. The frame element is thus, in particular, a rigid, non-deformable, or at least not easily deformable, element that exhibits little or no springiness. In particular, such a rigid frame element can create a stable contact surface for the circuit carrier, and the force generated by the spring elements can be transmitted as evenly as possible to the circuit carrier, especially to press the circuit carrier, together with the electrical component, as evenly as possible towards the cooling element.The frame element can have at least one stiffening element for reinforcement, for example a separate element provided on the frame element or a special structure in the frame element, e.g. a special deformation.

[0031] According to one embodiment, the frame element for stiffening has at least one recess, notch, or groove and / or at least one raised area or bulge. For example, recesses can be provided in the contact surface, where depth or height, number R.413133

[0032] - 7 - and / or the position of the individual depressions can be specified in order to influence the stiffness in a targeted manner.

[0033] According to one embodiment, the frame element, for stiffening purposes, comprises at least one tab element extending from the contact surface. Such a tab element can, in particular, extend in the direction of the abutment. Specifically, the tab elements can be provided as side walls of the frame element. For example, tab elements can extend from one or more sides of the contact surface, such as from opposite sides or from all sides. In particular, the individual tab elements can each be inclined at a predetermined angle to the contact surface of the frame element, especially at right angles or at least substantially at right angles to the contact surface. Furthermore, recesses and / or raised areas can also be provided in one or more of the tab elements.

[0034] According to one embodiment, the at least one spring element is arranged on the at least one tab element. For example, one or more spring elements can be arranged on each of these tab elements. For example, all spring elements can be arranged on one tab element. However, it is also conceivable that one or more of the spring elements are arranged directly on the contact surface and extend directly from the contact surface. In this case, for example, at least at those positions on the contact surface from which a spring element extends, no tab element can be provided. The tab elements can then be provided at other positions on the contact surface from which no spring element extends.

[0035] In one embodiment, at least one spring element is axially or perpendicularly (relative to the main extension plane of the frame element, to which all directional references refer in the following, unless otherwise specified) away from the frame element. The individual spring elements can extend from the frame element in the axial direction or at least R.413133

[0036] - 8 - extend partially in the axial direction towards the abutment. In particular, the spring elements can easily contact the abutment. In particular, good spring action can thus be achieved. For example, the spring elements can each extend axially from one of the tab elements or directly from the contact surface.

[0037] In one embodiment, at least one of the at least one retaining element is designed as a solder lug. This solder lug is designed to hold the spreading element to the circuit carrier. The spreading element can be attached to the circuit carrier by means of a solder connection using this solder lug(s). The spreading element can then advantageously push the circuit carrier away from the abutment. For example, the spreading element can be mounted together with the electrical component during an assembly process and soldered to the circuit carrier. For example, the individual solder lugs can each have a curved section, e.g., a meandering section. In particular, this curved section is provided between a solder joint where the solder lug is soldered to the circuit carrier and the transition of the solder lug to the frame element.This curved section can, in particular, reduce forces acting on the solder joint, especially forces that can occur due to a temperature difference between the connection of the solder joint and the spreading element.

[0038] In one embodiment, at least one of the at least one retaining element is designed as a screw lug. This screw lug is designed to hold the spreading element to the abutment and is elastically displaceable relative to the frame element. The spreading element can thus be attached to the abutment, but still be elastically displaceable relative to it, so that the spreading element can continue to bear against the circuit carrier with its contact surface and push the circuit carrier away from the abutment.

[0039] In one embodiment, the screw lug is designed to fix the spreading element axially and radially or laterally relative to the abutment. The screw lug can thus be firmly connected to the abutment, e.g., by R.413133.

[0040] - 9 - a screw or a rivet. Alternatively, the screw flag can be designed to fasten or guide the spreading element only laterally relative to the abutment, e.g. by means of an abutment pin in the eyelet of the screw flag.

[0041] In one embodiment, the computing unit further comprises a housing component that forms the abutment. The circuit carrier is arranged between this housing component and the circuit carrier. The spring elements can bear against this housing component and press the circuit carrier, together with the electrical component mounted on it, evenly against the cooling element or the TIM layer. The housing component can be designed, for example, as a housing base, intermediate housing base, housing frame, or housing cover. Furthermore, the housing component can be configured to be connected to another housing component or a counterpart, e.g., by means of screw connections.

[0042] The invention is particularly well-suited for use in the automotive sector. The computing units can be designed, in particular, as a control unit within a vehicle. Such a control unit can comprise a multitude of electrical components, for example, semiconductor switching elements such as transistors like FETs, MOSFETs, IGBTs, etc. The control unit can be used, in particular, for the safe operation and control of the vehicle, for example, in the context of engine control or driver assistance functions, etc.

[0043] Further advantages and embodiments of the invention will become apparent from the description and the accompanying drawing.

[0044] The invention is schematically illustrated in the drawing using exemplary embodiments and is described below with reference to the drawing.

[0045] Brief description of the drawings R.413133

[0046] - 10 -

[0047] Figure 1 schematically shows an embodiment of a spreading element according to the invention in various perspective views a) to d).

[0048] Figure 2 schematically shows an embodiment of a computing unit according to the invention, comprising an embodiment of a spreading element according to the invention, in a sectional view.

[0049] Figure 3 schematically shows an embodiment of a spreading element according to the invention in various perspective views a) to d).

[0050] Figure 4 schematically shows an embodiment of a computing unit according to the invention, comprising an embodiment of a spreading element according to the invention, in a sectional view.

[0051] Figure 5 schematically shows an embodiment of a spreading element according to the invention in different perspective views a) and b).

[0052] embodiment(s) of the invention

[0053] In the figures, identical reference symbols denote the same or equivalent elements.

[0054] Figures 1a to 1d schematically illustrate an embodiment of a spreading element according to the invention, designated by 100. The spreading element 100 is designed to push a circuit carrier away from a support and vice versa, and can be installed, in particular, in a computing unit between a printed circuit board 210 as a circuit carrier and a housing component such as a second housing element 250, e.g., a housing base, as a support.

[0055] Figure 1a shows a perspective top view of a first side of the spreading element 100, wherein the spreading element 100 is configured to face the printed circuit board 210 with this first side facing it. R.413133

[0056] - 11 -

[0057] Figure 1b shows a perspective top view of a second side of the spreading element 100, wherein the spreading element 100 is arranged to face the housing base 250 with this second side.

[0058] Figure 1c shows a perspective side view of part of the spreader element 100.

[0059] Figure 1d shows a side view of part of the spreading element 100 arranged between the circuit board 210 and the housing base 250.

[0060] In the example shown, the spreading element 100 comprises a frame element 110 and four retaining elements 120 connected to or arranged on the frame element 110. In a top view, the frame element 110 has a polygonal shape, for example, a rectangular shape, and a principal extension plane of the retaining element lies in an x / y plane containing radial or lateral directions. In Fig. 1a, a z-axis extends upwards, and in Fig. 1b, downwards, defining an axial or perpendicular direction, respectively. One of the four retaining elements 120 is provided at each corner of this rectangular frame element 110. The frame element 110 is designed to be positioned between the printed circuit board 210 and the housing base 250. The retaining elements 120 are each designed as solder lugs and are configured to be connected to the printed circuit board 210.The frame element 110 is designed such that a first side 115 facing the circuit board 210 can contact the circuit board 210 over its entire surface and uniformly. In particular, this first side 115 facing the circuit board 210 can lie uniformly against the circuit board 210 over its entire surface.

[0061] The retaining elements 120 are each designed as a flat, planar, undeformed or unbent element. Each of these flat elements 120 extends in the same plane as the first side 115 of the frame element 110. These flat retaining elements 120 are designed to be R.413133

[0062] - 12 - to be bonded to the circuit board, in particular by means of a soldered connection 215.

[0063] The frame element 110 is designed as a rigid, stiffened element. In particular, the stiffness of the frame element 110 has a predetermined value that prevents noticeable bending under forces acting in the regular installation state. For this purpose, the frame element 110 has a plurality of stiffening elements. For example, the frame element 110 has a plurality of recesses 140, notches, or grooves as such stiffening elements. Furthermore, the frame element 110 has a plurality of tab elements 150 as such stiffening elements. These tab elements 150 can be arranged at an edge region of the frame element 110 and extend perpendicular to the first side 115 of the frame element 110, as well as perpendicular to a surface of the circuit board 210 and the housing base 250.For example, the tab elements 150 can be provided as side walls of the frame element 110 and extend from the contact surface in the negative z-direction (downwards in Fig. 1a and upwards in Fig. 1b).

[0064] The spreading element 100 further comprises at least one, here several, spring elements 130 arranged on the frame element 110. For example, these individual spring elements 130 can each be arranged on one of the tab elements 150. The spring elements 130 are configured to exert a force perpendicular (i.e., in the negative z-direction) to the contact surface 115 on the abutment or the housing base 250, so that the contact surface 115 rests against the circuit carrier or the printed circuit board 210 and so that the housing base 250 is pushed away from the printed circuit board 210. The individual spring elements 130 are configured to contact the housing base 250 and thereby exert a force on the printed circuit board 210. This exerted force is indicated in Fig. 1d by the arrows 135.

[0065] The spring elements 130 are furthermore specifically designed to exert the respective force 135 in such a way that the circuit board 210 together with an R.413133

[0066] - 13 - the electrical component arranged thereon is pressed in the direction of a cooling element, as explained below with reference to Figure 2.

[0067] Figure 2 schematically shows an embodiment of a computing unit 200 according to the invention, in which the spreading element 100 shown in Figures 1a to 1d is installed. The computing unit 200 is intended, for example, as a control unit for a (motor) vehicle.

[0068] This control unit 200, in addition to the circuit board 210, also includes an electrical or electronic component 220 arranged on and electrically connected to the circuit board 210, e.g., a semiconductor switching element, e.g., a MOSFET, or an integrated circuit (IC), etc. Since this MOSFET 220 can generate high power dissipation during operation, the control unit 200 also includes a cooling element 230, e.g., a fluid-cooled heat sink. Furthermore, the control unit 200 includes a housing with a first housing element 240, e.g., a housing cover, and a second housing element 250, e.g., the housing base.

[0069] The MOSFET 220 is located on the side of the circuit board 210 facing the housing cover 240. The cooling element 230 is located on the side of the MOSFET 220 facing away from the circuit board 210. The housing cover 240 is located on the side of the cooling element 230 facing away from the MOSFET 220. The housing base 250 is located on the side of the circuit board 210 facing away from the MOSFET 220.

[0070] The spreading element 100 is arranged between the circuit board 210 and the housing base 250, with the retaining elements 120 of the spreading element 100 each being connected to the circuit board 210 via a soldered connection 215. When the housing cover 240 and the housing base 250 are connected to each other, the individual spring elements 130 each contact the housing base 250 and thereby exert the force 135 such that the circuit board 210 and the MOSFET 220 mounted on it are pressed towards the cooling element 230. R.413133

[0071] - 14 -

[0072] The spring elements 130 are designed to exert the force 135 such that the distance or gap between the electrical component 220 and the cooling element 230 has a predetermined, preferably small, and in particular minimal, value. For example, the material and dimensions of the individual spring elements 130, in particular their length and thickness, can be specified such that the generated force 135 has a predetermined value and that the gap can thereby be reduced to the predetermined value. A layer 225 made of a thermally conductive material or a thermal interface material (TIM) can be provided in the gap. By reducing this distance, waste heat from the MOSFET 220 can be effectively transferred to the cooling element 230, and the MOSFET 220 can be effectively cooled.

[0073] The spreading element 100 compensates for component tolerances in the control unit 200 and minimizes or at least reduces the TIM gap. The force or spring elements 130 are supported against the housing base 250 and ensure that the spreading element 100, in particular the frame element 110, can lie flat against the circuit board 210 and that the circuit board 210, together with the MOSFET 220 mounted on it, can conform evenly to the cooling element 230 or to the TIM material 225.

[0074] It is also conceivable that the retaining elements of the spreading element can be connected not to the circuit board, but to the second housing element or housing base, as explained below with reference to Figures 3 and 4.

[0075] Figures 3a to 3d schematically depict an embodiment of the spreading element according to the invention, corresponding to Figures 1a to 1d, and are designated by 300. Figure 3a shows a perspective top view of a first side of this spreading element 300, wherein the spreading element 300 is configured to face a printed circuit board 410 with this first side facing the printed circuit board 410. Figure 3b shows a perspective top view of a second side of the spreading element 300, wherein the spreading element 300 is configured to face a printed circuit board 410 with this side facing the printed circuit board 410.

[0076] - 15 - the second side faces a second housing element 450, for example a housing base. Figure 3c shows a perspective side view of part of the spreading element 300. Figure 3d shows a side view of part of the spreading element 300 arranged between the ladder slat 410 and the housing base 450.

[0077] Like the spreading element 100 shown in Figures 1a to 1d, the spreading element 300 shown in Figures 3a to 3d has a rectangular frame element 310 with stiffening elements in the form of recesses 340 and tab elements 350, with spring elements 330 being provided on individual tab elements 350 to exert a force 335 on the circuit board 410. The frame element 310 is designed such that a first side 315 facing the circuit board 410 can make full and uniform contact with the circuit board 410. The spreading element 300 also has a plurality of retaining elements 320, with one retaining element 320 being provided at each corner of the rectangular frame element 310. A principal extent plane of the contact surface 315 lies, for example, in an x' / y' plane in which radial or lateral directions lie. A z'-axis perpendicular to this x' / y'-plane defines an axial or perpendicular direction.

[0078] In contrast to the retaining elements 120 of the spreading element 100 shown in Figures 1a to 1d, these retaining elements 320 of the spreading element 300 are not flat, straight elements, but rather bendable or already bent elements. These retaining elements 320 are each designed to be bent away from the circuit board 410 or towards the housing base 450 and connected to the housing base 450. For this purpose, the retaining elements 320 each have an opening 325. Through this opening 325, the individual retaining elements can be connected to the housing base by means of a friction-fit and / or positive-locking fastening element, e.g., by a rivet 455. In particular, the retaining elements 320 are designed as screw tabs.

[0079] Figure 4 schematically shows an embodiment of a computing unit 200 according to the invention, for example a control unit, in which a [unit] shown in Figures 3a to R.413133

[0080] - 16 -

[0081] The spreading element 100 shown in Figure 3d is installed. Corresponding to the control unit 200 from Figure 2, the control unit 400 shown in Figure 4 also has the circuit board 410, an electrical component 420 arranged on the circuit board 410, e.g. a MOSFET, a cooling element 430, e.g. a fluid-cooled heat sink, a TIM layer 425, a first housing element 440, e.g. a housing cover, and the second housing element or the housing base 450.

[0082] The spreading element 300 is arranged between the circuit board 410 and the housing base 450, with each of the retaining elements 320 of the spreading element 300 being connected to the housing base 455 by a rivet 455. When the housing cover 440 and the housing base 450 are connected to each other, the individual force or spring elements 330 each contact the housing base 450 and thereby exert the force 335 such that the circuit board 410 and the MOSFET 420 are pressed towards the cooling element 430 in order to reduce the gap between the MOSFET 420 and the cooling element 430 to the specified value.

[0083] Figures 5a and 5b schematically depict an embodiment of the spreading element according to the invention, including solder lugs, corresponding to Figures 1a and 1b. Figure 5a shows a perspective top view of a first side of this spreading element 500, wherein the spreading element 500 is configured to face a corresponding printed circuit board with this first side. Figure 5b shows a perspective top view of a second side of the spreading element 500, wherein the spreading element 500 is configured to face a corresponding abutment with this second side.

[0084] The spreading element 500 has a rectangular frame element 510. A principal extent plane of a contact surface 515 of this frame element 510 facing the respective printed circuit board lies in an x" / y" plane, which defines radial or lateral directions. A z" axis perpendicular to the x" / y" plane defines an axial or perpendicular direction. R.413133

[0085] - 17 -

[0086] Like the spreading element 100 shown in Figures 1a to 1d, the spreading element 500 has a retaining element designed as a solder lug 520 at each corner of the rectangular frame element 510. The solder lugs 520 are each designed to be metallurgically connected to the corresponding printed circuit board by means of a solder joint. In contrast to the solder lugs 120 of the spreading element 100 in Figures 1a to 1d, the solder lugs 520 of the spreading element 500 are not flat, but each has a convex, curved section 525. This section 525 reduces forces that can arise from the solder joint.

[0087] The spreading element 500 further comprises a plurality of spring elements 530 arranged on the frame element 510 to exert a force perpendicular to the contact surface 515 on the corresponding abutment. In contrast to the spreading elements 100 and 300, the spreading element 500 does not have spring elements 530 on all sides of the frame element 510, but only on opposite sides. On these sides, spring elements 530 extend directly from the contact surface 515 in the axial direction. The spring elements 530 extend alternately in opposite directions, here alternating in the x" and - ' directions, and project significantly beyond the frame element 510.

[0088] Furthermore, the spreading element 500 has tab elements 550 for stiffening. For example, tab elements 550 are provided at least on those opposite sides of the contact surface 515 where no spring elements 530 are arranged. In the example shown, the frame element 510 does not have any recesses for stiffening; however, such recesses can be provided if necessary.

Claims

R.413133 - 18 - Claims 1. Spreading element (100, 300, 500) for pushing away a circuit carrier (210, 410) from an abutment (250, 450), wherein the spreading element (100, 300, 500) has a frame element (110, 310, 510), at least one retaining element (120, 320, 520) and at least one spring element (130, 330, 530), wherein the at least one retaining element (120, 320, 520) projects laterally from the frame element (110, 310, 510) as a solder or screw tab, wherein the frame element (110, 310, 510) has a contact surface (115, 315, 515) for the circuit carrier (210, 410), wherein the at least one retaining element (120, 320, 520) is configured to hold the spreading element (100, 300, 500) on the circuit carrier (210, 410) or the abutment (250, 450), wherein the at least one spring element (130, 330, 530) is configured to exert a force perpendicular to the contact surface (115, 315, 515) on the abutment (250, 450), so that the contact surface (115, 315, 515) on the circuit carrier (210,410) is in contact with the circuit carrier (210, 410) and the abutment (250, 450) is pushed away from the circuit carrier (210, 410).

2. Spreading element (100, 300, 500) according to claim 1, wherein the spreading element (100, 300, 500) has at least four retaining elements (120, 320, 520) which are arranged, in particular, at uniform intervals from one another on the frame element (110, 310, 510).

3. Spreading element (100, 300) according to claim 1 or 2, wherein the frame element (110, 310, 510) is designed in a top view as a polygon with multiple corners and wherein the spreading element (100, 300, 500) has a retaining element (120, 320, 520) at each corner of the frame element (110, 310, 510). R.413133 - 19 - 4. Spreading element (100, 300, 500) according to claim 3, wherein the frame element (110, 310, 510) has a rectangular shape or at least a substantially rectangular shape in a top view.

5. Spreading element (100, 300, 500) according to one of the preceding claims, wherein the spreading element (100, 300, 500) is designed as a stamped and bent part.

6. Spreading element (100, 300, 500) according to one of the preceding claims, wherein the frame element (110, 310, 510) is stiffened.

7. Spreading element (100, 300, 500) according to claim 6, wherein the frame element (110, 310, 510) has one or more of the following stiffening elements for stiffening: at least one recess (140, 340) and / or at least one raised section and / or at least one tab element (150, 350, 550) extending from the contact surface (115, 315, 515).

8. Spreading element (100, 300) according to claim 7, wherein the at least one spring element (130, 330) is arranged on the at least one tab element (150, 350).

9. Spreading element (100, 300, 500) according to one of the preceding claims, wherein the at least one spring element (130, 330, 530) projects axially from the frame element (110, 310, 510).

10. Spreading element (100, 500) according to one of the preceding claims, wherein at least one of the at least one retaining element (120, 520) is designed as a solder lug, wherein this solder lug is designed to hold the spreading element (100, 500) on the circuit carrier (210). R.413133 - 20 - 11. Spreading element (300) according to one of the preceding claims, wherein at least one of the at least one retaining element (320) is designed as a screw flag, wherein this screw flag is designed to hold the spreading element (300) on the abutment (450) and is elastically displaceable relative to the frame element (310).

12. Spreading element (300) according to claim 11, wherein the screw flag is configured to be attached axially and laterally to the abutment (450) or to be guided laterally on the abutment (450).

13. Computing unit (200, 400), in particular of a vehicle, wherein the computing unit (200, 400) comprises a spreading element (100, 300, 500) according to one of the preceding claims, the circuit carrier (210, 410), an electrical component (220, 420) on the circuit carrier (210, 410), a cooling element (230, 430) on the electrical component (220, 420) and the abutment (250, 450), wherein the spreading element (100, 300, 500) is arranged on a side of the circuit carrier (210, 410) facing away from the electrical component (220, 420).

14. Computing unit (200, 400) according to claim 13, which further comprises a housing component (250, 450) which forms the abutment, wherein the circuit carrier (210, 410) is arranged between the housing component (250, 450) and the circuit carrier (210, 410).

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