Substrate processing system and substrate processing device

Abstract

Provided is a technology with which it is possible to improve power efficiency in a substrate processing system. A substrate processing system includes: a bending member configured to be bent by means of pressure fluctuation; and a power generation element that is attached to the bending member and configured to generate power through the bending of the bending member.

Description

Substrate processing system and substrate processing apparatus

[0001] SUMMARY Exemplary embodiments of the present disclosure relate to substrate processing systems and substrate processing apparatus.

[0002] Japanese Patent Application Laid-Open No. 2003-129999 discloses a technique for providing a substrate processing system with a vacuum transfer module and a plurality of substrate processing modules.

[0003] JP 2010-153777 A

[0004] The substrate processing system described above consumes a large amount of power.

[0005] The present disclosure provides techniques that can improve power efficiency in substrate processing systems.

[0006] A substrate processing system according to one exemplary embodiment of the present disclosure includes a flexible member configured to bend due to pressure fluctuations, and a power generating element attached to the flexible member and configured to generate power by the bending of the flexible member.

[0007] According to one exemplary embodiment of the present disclosure, a technique can be provided that can improve power efficiency in a substrate processing system.

[0008] FIG. 1 is a diagram for explaining a configuration example of a substrate processing system; FIG. 2 is a diagram for explaining a configuration example of a power generation system; FIG. 3 is a diagram for explaining a configuration example of a load lock module; FIG. 4 is a diagram for explaining a configuration example of a vacuum transfer module; FIG. 5 is a diagram for explaining a configuration example of a vacuum transfer module; FIG. 6 is a diagram for explaining a configuration example of a plasma processing module; and FIG. 7 is a diagram for explaining a configuration example of a stocker module.

[0009] Hereinafter, each embodiment of the present disclosure will be described.

[0010] In one exemplary embodiment, a substrate processing system is provided that includes a flexible member configured to bend due to pressure fluctuations, and a power generation element attached to the flexible member and configured to generate power due to the bending of the flexible member.

[0011] In one exemplary embodiment, a substrate processing system includes a chamber, the chamber including a flexure member.

[0012] In one exemplary embodiment, the chamber has a wall, the wall including a flexible member.

[0013] In one exemplary embodiment, the chamber has at least one of an exhaust or an intake, the exhaust or intake including a flexible member.

[0014] In one exemplary embodiment, the flexible member has an outer surface disposed facing the outside of the chamber, and the power generating element is attached to the outer surface of the flexible member.

[0015] In one exemplary embodiment, the chamber comprises a substrate processing chamber.

[0016] In one exemplary embodiment, the substrate processing chamber is a plasma processing chamber that defines a plasma processing space.

[0017] In one exemplary embodiment, the chamber includes a substrate transfer chamber.

[0018] In one exemplary embodiment, the flexible member is configured to be more flexible than the surrounding member.

[0019] In one exemplary embodiment, the flexible member is configured to be thinner than the surrounding member, thereby making it more flexible than the surrounding member.

[0020] In one exemplary embodiment, the flexible member is constructed of a material that is more flexible than the surrounding member.

[0021] In one exemplary embodiment, the substrate processing system includes a first transfer module having a first internal pressure, a second transfer module having a second internal pressure greater than the first internal pressure, a process module connected to the first transfer module, a load lock module interposed between the first transfer module and the second transfer module, and a gate valve disposed between the first transfer module and the process module, and the flexible member and the power generation element are disposed in at least one selected from the group consisting of the first transfer module, the load lock module, the process module, and the gate valve.

[0022] In one exemplary embodiment, the first transfer module is a vacuum transfer module and the second transfer module is an atmospheric transfer module.

[0023] In one exemplary embodiment, the substrate processing system includes a storage module configured to store the consumable parts, and the flexure member and the power generation element are disposed in the storage module.

[0024] In one exemplary embodiment, the substrate processing system further comprises a battery configured to store the power generated by the power generating element.

[0025] In one exemplary embodiment, there is provided a substrate processing apparatus comprising: a substrate processing chamber configured to define a processing space; a substrate support disposed within the substrate processing chamber; a gas supply configured to supply gas to the processing space; an exhaust configured to exhaust gas from the processing space; a flexible member disposed in the substrate processing chamber and configured to bend due to pressure fluctuations; and a power generation element attached to the flexible member and configured to generate power by bending of the flexible member.

[0026] In one exemplary embodiment, the flexure member is positioned below the substrate on the substrate support in the substrate processing chamber.

[0027] In one exemplary embodiment, the flexible member is disposed in the exhaust.

[0028] In one exemplary embodiment, the gas supply is configured to supply a process gas to the process space, and the substrate processing apparatus further includes a plasma generation unit configured to generate a plasma from the process gas.

[0029] In one exemplary embodiment, the substrate processing apparatus further includes a battery configured to store the power generated by the power generating element.

[0030] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are designated by the same reference numerals, and redundant explanations will be omitted. Unless otherwise specified, the positional relationships, such as up, down, left, and right, will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0031] <Configuration Example of Substrate Processing System> A substrate processing system PS according to one embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram for explaining a configuration example of the substrate processing system PS.

[0032] The substrate processing system PS includes a vacuum transfer module TM, process modules PM1 to PM6, stocker modules SM1 and SM2, load lock modules LL1 and LL2, an atmospheric transfer module LM, load ports LP1 to LP4, an aligner AN, and the like.

[0033] The vacuum transfer module TM has a substantially polygonal shape in a plan view. Process modules PM1 to PM6 and stocker modules SM1 and SM2 are connected to multiple side surfaces of the vacuum transfer module TM. Load lock modules LL1 and LL2 are connected to some side surfaces of the vacuum transfer module TM. The vacuum transfer module TM has a vacuum chamber with a vacuum atmosphere, and a vacuum transfer robot TR1 is disposed inside the vacuum chamber.

[0034] The vacuum transfer robot TR1 is configured to be able to rotate, extend, and elevate. The vacuum transfer robot TR1 can transport objects such as substrates based on operational instructions output by a control unit CU (described later). For example, the vacuum transfer robot TR1 can place and hold the object on an end effector EE1 located at its tip, and transport the object between the load lock modules LL1 and LL2, the process modules PM1 to PM6, and the stocker modules SM1 and SM2. The end effector is also referred to as a pick, fork, or transfer arm. The end effector EE1 of the vacuum transfer robot TR1 may have a U-shaped, bifurcated shape and be configured to transport the object placed thereon.

[0035] The objects to be transferred include, for example, substrates and consumable parts (replacement parts). The substrates may be, for example, semiconductor wafers, dummy wafers, sensor wafers, etc. The consumable parts may be components that are replaceably mounted in the process modules PM1 to PM6 and are consumed by various processes such as plasma processing performed in the process modules PM1 to PM6. The consumable parts may include, for example, components that constitute a ring assembly disposed around a substrate support in the plasma processing module and components that constitute a showerhead that supplies processing gas into the plasma processing chamber.

[0036] The process modules PM1 to PM6 are modules for processing substrates. At least one of the process modules PM1 to PM6 may be a plasma processing module for plasma processing of substrates. At least one of the process modules PM1 to PM6 may be a module for post-processing of substrates. The vacuum transfer module TM and each of the process modules PM1 to PM6 are separated by a gate valve GV1 that can be opened and closed.

[0037] The stocker modules SM1 and SM2 are modules for storing consumable parts. In one embodiment, the stocker modules SM1 and SM2 have vacuum chambers with a vacuum atmosphere. The vacuum transfer module TM and each stocker module SM1 and SM2 are separated by gate valves GV2 that can be opened and closed.

[0038] The load lock modules LL1 and LL2 are disposed between the vacuum transfer module TM and the atmospheric transfer module LM. Each load lock module LL1 and LL2 has an internal pressure variable chamber that can be switched between vacuum and atmospheric pressure. When transferring a substrate from the atmospheric transfer module LM to the vacuum transfer module TM, the load lock modules LL1 and LL2 can set the interior to atmospheric pressure, receive the substrate from the atmospheric transfer robot TR3 of the atmospheric transfer module LM, and then vacuum the interior to transfer the substrate to the vacuum transfer robot TR1 of the vacuum transfer module TM. When transferring a substrate from the vacuum transfer module TM to the atmospheric transfer module LM, the load lock modules LL1 and LL2 can set the interior to vacuum, receive the substrate from the vacuum transfer robot TR1 of the vacuum transfer module TM, and then vacuum the interior to transfer the substrate to the atmospheric transfer robot TR3 of the atmospheric transfer module LM. Each load lock module LL1 and LL2 and the vacuum transfer module TM are separated by a gate valve GV3 that can be opened or closed. The load lock modules LL1 and LL2 are separated from the atmospheric transfer module LM by gate valves GV4 that can be opened and closed.

[0039] The atmospheric transfer module LM is disposed opposite the vacuum transfer module TM, with the load lock modules LL1 and LL2 sandwiched between them. The atmospheric transfer module LM may be, for example, an Equipment Front End Module (EFEM). The atmospheric transfer module LM is rectangular, includes a Fan Filter Unit (FFU), and has an atmospheric chamber with atmospheric air inside. Two load lock modules LL1 and LL2 are connected to one longitudinal side of the atmospheric transfer module LM. Load ports LP1 to LP4 are connected to the other longitudinal side of the atmospheric transfer module LM. An aligner AN is connected to one lateral side of the atmospheric transfer module LM. Note that the connection position of the aligner AN relative to the atmospheric transfer module LM is not limited to this and can be selected arbitrarily. An atmospheric transfer robot TR3 for transporting substrates is disposed within the atmospheric transfer module LM.

[0040] The atmospheric transfer robot TR3 is configured to be movable along the longitudinal direction of the atmospheric transfer module LM, and is also configured to be freely rotatable, extendable, and elevating. The atmospheric transfer robot TR3 can transport substrates based on operation instructions output by a control unit CU, which will be described later. For example, the atmospheric transfer robot TR3 can place and hold a substrate on an end effector EE3 located at its tip, and transport the substrate between the load ports LP1 to LP4, the load lock modules LL1 and LL2, and the aligner AN.

[0041] The load ports LP1 to LP4 are configured to accommodate multiple containers C. The containers C may accommodate multiple substrates (e.g., 25 substrates). The containers C may be, for example, front-opening unified pods (FOUPs).

[0042] The aligner AN may be a device that detects the position (orientation and center) of the substrate. The aligner AN may include a rotary support table, an optical sensor (neither of which are shown), etc. The control unit CU may correct the orientation of the substrate based on the detection result by the aligner AN. Based on the detection result by the aligner AN, the control unit CU may correct the position of the end effector EE3 of the atmospheric transfer robot TR3 when receiving the substrate from the aligner AN so that the center of the substrate is located at a predetermined position of the end effector EE3 of the atmospheric transfer robot TR3.

[0043] The substrate processing system PS is connected to the control unit CU via a communication interface. In one embodiment, part or all of the control unit CU may be included in the substrate processing system PS. The control unit CU may be, for example, a computer. The control unit CU includes a central processing unit (CPU), random access memory (RAM), read-only memory (ROM), an auxiliary storage device, etc. The CPU operates based on a program stored in the ROM or the auxiliary storage device, and can control each part of the substrate processing system PS.

[0044] <Configuration Example of Power Generation System> The substrate processing system PS has a power generation system GS. Fig. 2 is a diagram for explaining a configuration example of the power generation system GS. In one embodiment, as shown in Fig. 2, the power generation system GS includes a flexible member 300 configured to bend due to pressure fluctuations, a power generation element 301 configured to generate power by bending the flexible member 300, and a battery 302.

[0045] In one embodiment, the flexible member 300 has a plate shape. The flexible member 300 may have a material, shape, size, and thickness that provide high flexibility. The flexible member 300 may be made of resin. The flexible member 300 may have a thickness of 5 mm or more and 10 mm or less. The power generating element 301 may be a piezoelectric element. In one embodiment, the power generating element 301 has a first electrode 310, a piezoelectric body 311, and a second electrode 312. The first electrode 310, the piezoelectric body 311, and the second electrode 312 each have a plate shape and are stacked in this order. The first electrode 310 and the second electrode 312 are electrically connected to the battery 302 via wiring 313 and 314.

[0046] The power generating element 301 is attached to the flexible member 300. The first electrode 310 is attached to the flexible member 300, and they are in surface contact with each other. When the flexible member 300 is bent, pressure is applied to the piezoelectric body 311, generating electricity. The generated electricity is supplied to the battery 302 from the first electrode 310 and the second electrode 312 through wiring 313 and 314 and stored therein.

[0047] The power generation system GS is disposed at a portion of the substrate processing system PS where pressure fluctuations occur. The power generation system GS is disposed at one or more locations in the substrate processing system PS.

[0048] <Example of Arrangement of Power Generation System GS> In one embodiment, the power generation system GS is arranged in the load lock modules LL1 and LL2.

[0049] In one embodiment, as shown in FIG. 3, the load lock modules LL1 and LL2 have a chamber 400, a substrate support portion 401 arranged in the chamber 400, a lifting portion 402 that raises and lowers the substrate W on the substrate support portion 401, an exhaust portion 403, and an air supply portion 404.

[0050] The chamber 400 defines an internal pressure variable space switchable between vacuum and atmospheric pressure. The substrate support member 401 has a thick plate shape. The lifting unit 402 has lift pins that vertically penetrate the substrate support member 401 and move up and down. The exhaust unit 403 is configured to evacuate the atmosphere within the chamber 400 to create a vacuum within the chamber 400. The gas supply unit 404 is configured to supply gas into the chamber 400 to create atmospheric pressure within the chamber 400. A transfer port 400b is formed in a lateral wall (side wall) 400a of the chamber 400, through which a substrate is transferred to a vacuum transfer module TM. A transfer port 400c is formed in the other side wall 400a of the chamber 400, through which a substrate is transferred to an atmospheric transfer module LM. As shown in FIG. 1, the transfer port 400b and the transfer port 400c are arranged to face each other. The transfer port 400b is opened and closed by a gate valve GV3, and the transfer port 400c is opened and closed by a gate valve GV4.

[0051] In one embodiment, as shown in FIG. 2 , the flexible member 300 is disposed on a sidewall 400a of the chamber 400. The chamber 400 has a sidewall 400a that is thinner than the surrounding area, and the flexible member 300 is configured from the thinner sidewall 400a. The flexible member 300 has an outer surface that faces the outside of the chamber 400, and the power generating element 301 is attached to the outer surface of the flexible member 300. When a substrate is loaded into or unloaded from the load lock modules LL1 and LL2, the chamber 400 of the load lock modules LL1 and LL2 becomes vacuum or atmospheric pressure. At this time, the pressure inside the chamber 400 fluctuates, causing the flexible member 300 to bend, and power generation is performed by the power generating element 301. The flexible member 300 may be disposed on the ceiling wall (top) or bottom wall (bottom) of the chamber 400. The flexible members 300 may be positioned at multiple locations in the chamber 400 .

[0052] In one embodiment, the power generation system GS is located in a vacuum transfer module TM.

[0053] In one embodiment, as shown in FIG. 4, the vacuum transfer module TM has a vacuum transfer chamber 500, a vacuum transfer robot TR1 arranged in the vacuum transfer chamber 500, an exhaust section 501, and an air supply section 502.

[0054] In one embodiment, as shown in FIGS. 4 and 5 , the vacuum transfer chamber 500 has a substantially rectangular parallelepiped shape. The vacuum transfer chamber 500 defines a vacuum space therein that is regulated to a vacuum. A transfer port 510 is formed in a lateral wall (side wall) 500a of the vacuum transfer chamber 500, through which substrates are transferred to the process modules PM1 to PM6. The transfer port 510 is opened and closed by a gate valve GV1. A transfer port 511 is formed in another side wall 500a of the vacuum transfer chamber 500, through which consumable parts are transferred to the stocker modules SM1 and SM2. The transfer port 511 is opened and closed by a gate valve GV2. A transfer port 512 is formed in yet another side wall 500a of the vacuum transfer chamber 500, through which substrates are transferred to the load lock modules LL1 and LL2. The transfer port 512 is opened and closed by a gate valve GV3.

[0055] In one embodiment, the ceiling wall (top) 500b of the vacuum transfer chamber 500 has a plurality of windows 520 for visually observing the inside of the vacuum transfer chamber 500 from the outside. The windows 520 may be made of a material that is more flexible than the surrounding parts of the top 500b. The windows 520 may be made of a transparent resin. The surrounding parts may be made of metal. The windows 520 may be thinner than the surrounding parts of the top 500b.

[0056] The exhaust unit 501 is configured to exhaust the atmosphere inside the vacuum transfer chamber 500 to create a vacuum inside the chamber 500. The gas supply unit 502 is configured to supply an inert gas such as nitrogen gas into the chamber 500.

[0057] In one embodiment, the flexible member 300 is disposed on the ceiling 500b of the vacuum transfer chamber 500. A part of the window 520 of the ceiling 500b may be the flexible member 300. The power generating element 301 is attached to the upper surface of the flexible member 300. When the gate valves GV1, GV2, and GV3 are opened in the vacuum transfer module TM, the pressure inside the vacuum transfer chamber 500 fluctuates and is adjusted to a vacuum by the exhaust unit 501. The pressure fluctuations at this time cause the flexible member 300 to bend, and power is generated by the power generating element 301. The flexible member 300 may be disposed on the side wall 500a or bottom wall (bottom) of the vacuum transfer chamber 500. The flexible member 300 may be disposed at multiple locations in the vacuum transfer chamber 500.

[0058] In one embodiment, the power generation systems GS are arranged in the process modules PM1 to PM6. At least one of the process modules PM1 to PM6 may be a plasma processing module 700. The plasma processing module 700 is an example of a substrate processing apparatus.

[0059] 6 , the plasma processing module 700 includes a plasma processing chamber 800, a substrate support 801, a gas supply unit 802, a plasma generation unit 803, and an exhaust unit 804. The plasma processing chamber 800 is an example of a substrate processing chamber. The plasma processing chamber 800 defines a plasma processing space 800s therein. The substrate support 801 is disposed within the plasma processing chamber 800. In this embodiment, the substrate support 801 includes a base 810, an electrostatic chuck 811 for electrostatically attracting the substrate, and an edge ring 812 disposed around the periphery of the substrate on the electrostatic chuck 811.

[0060] The gas supply 802 is configured to supply a process gas into the plasma processing chamber 800 .

[0061] The plasma processing chamber 800 includes a showerhead 820 that introduces at least one process gas from a gas supply 802 into the plasma processing chamber 800 .

[0062] In one embodiment, the plasma generating unit 803 is configured to provide at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. In one embodiment, the lower electrode may comprise at least a portion of the substrate support 801, and the upper electrode may comprise at least a portion of the showerhead 820.

[0063] The exhaust unit 804 is configured to evacuate the atmosphere inside the plasma processing chamber 800, thereby creating a vacuum inside the plasma processing chamber 800. The exhaust unit 804 may have a gas outlet 800b provided in a lower wall (bottom) 800e of the plasma processing chamber 800.

[0064] In one embodiment, the flexible member 300 is disposed on a lateral wall (sidewall) 800a of the plasma processing chamber 800. The flexible member 300 may be disposed on the sidewall 800a near the gas exhaust port 800b at a position lower than the substrate W on the electrostatic chuck 811. The chamber 800 has a sidewall 800a that is thinner than the surrounding area, and the flexible member 300 may be formed from the thinner sidewall 800a. The power generating element 301 is attached to the outer surface of the flexible member 300. When a substrate is transferred into the plasma processing chamber 800 of the plasma processing module 700 or when the substrate is plasma processed, the pressure inside the plasma processing chamber 800 fluctuates. This pressure fluctuation causes the flexible member 300 to bend, and power is generated by the power generating element 301. The flexible member 300 may also be disposed on a ceiling wall (top) or a bottom 800e of the plasma processing chamber 800. The flexures 300 may be positioned at multiple locations in the plasma processing chamber 800 .

[0065] At least one of the process modules PM1 to PM6 is not limited to the plasma processing module 700, and may be another substrate processing module for processing substrates. The substrate processing module may be equipped with a hot plate for heating the substrate. The substrate processing module may have the same functions as the plasma processing module 700. The vacuum transfer module TM and the atmospheric transfer module LM may be transfer modules having an internal pressure other than vacuum or atmospheric pressure. Furthermore, the transfer modules may be transfer modules having an atmosphere of a gas such as nitrogen.

[0066] In one embodiment, the power generation system GS is arranged in the storage modules SM1, SM2.

[0067] In one embodiment, as shown in FIG. 7, the stocker modules SM1 and SM2 each include a chamber 900, a container placement unit 901, a lifting unit 902 for lifting and lowering the container placement unit 901, an exhaust unit 903, and an air supply unit 904.

[0068] The chamber 900 defines a vacuum space therein that is regulated to a vacuum. A transfer port 900b is formed in a side wall 900a of the chamber 900, through which consumable parts K are transferred to the vacuum transfer module TM. The transfer port 900b is opened and closed by a gate valve GV2. A door 900c is formed in the other side wall 900a of the chamber 900, through which a container L is transferred in and out from the outside.

[0069] The container mounting unit 901 is disposed within the chamber 900. The container mounting unit 901 is configured to be able to mount a container L that stores consumable parts K. The container L is configured to be able to store multiple consumable parts K in multiple tiers vertically. The lifting unit 902 has a motor 910 disposed outside the chamber 900 and a ball screw 911 that extends vertically within the chamber 900. The container mounting unit 901 is attached to the ball screw 911. The container mounting unit 901 is configured to be raised and lowered along the ball screw 911 by the motor 910. The lifting unit 902 can raise and lower the container mounting unit 901 to adjust the height of each consumable part K in the container L to the height of the transport port 900b.

[0070] The exhaust unit 903 is configured to evacuate the atmosphere inside the chamber 900 to create a vacuum inside the chamber 900. The gas supply unit 904 is configured to supply an inert gas such as nitrogen gas into the chamber 900.

[0071] In one embodiment, the flexible member 300 is disposed on a sidewall 900a of the chamber 900. The chamber 900 has a sidewall 900a that is thinner than the surrounding area, and the flexible member 300 may be configured from the thinner sidewall 900a. The power generating element 301 is attached to the outer surface of the flexible member 300. When a container L is carried in or out of the chamber 900 of the storage modules SM1 and SM2, or when a consumable part K is transported to the vacuum transport module TM, the pressure inside the chamber 900 fluctuates. This pressure fluctuation causes the flexible member 300 to bend, and power is generated by the power generating element 301. The flexible member 300 may be disposed on the ceiling wall (top) or bottom wall (bottom) of the chamber 900. The flexible member 300 may be disposed at multiple locations in the chamber 900.

[0072] 2 may be disposed in a module of the substrate processing system PS. The battery 302 may be disposed in a space formed below the vacuum transfer module TM. One or more batteries 302 may be disposed in the substrate processing system PS.

[0073] 1 may supply power stored in the battery 302 to electrical devices of the substrate processing system PS. The electrical devices may be sensors, valves, pumps, motors, lamps, etc. used in the vacuum transfer module TM, the process modules PM1 to PM6, the load lock modules LL1 and LL2, the atmospheric transfer module LM, the stocker modules SM1 and SM2, etc.

[0074] <Example of Substrate Processing> An example of substrate processing performed in the substrate processing system PS shown in FIG. 1 will be described. In one embodiment, the substrate processing is executed by the control unit CU. Substrates accommodated in containers C of load ports LP1 to LP4 are transferred into the chambers 400 of the load lock modules LL1 and LL2 by the atmospheric transfer robot TR3 of the atmospheric transfer module LM. At this time, the chambers 400 of the load lock modules LL1 and LL2 are adjusted to atmospheric pressure. Next, the chambers 400 of the load lock modules LL1 and LL2 are adjusted to a vacuum. The pressure within the chambers 400 is adjusted by the exhaust unit 403 and the gas supply unit 404. Then, the substrates from the load lock modules LL1 and LL2 are transferred into the vacuum transfer chamber 500 of the vacuum transfer module TM by the vacuum transfer robot TR1 of the vacuum transfer module TM. The pressure within the vacuum transfer chamber 500 of the vacuum transfer module TM is adjusted to a vacuum. The pressure within the vacuum transfer chamber 500 is adjusted by the exhaust unit 501. Thereafter, the substrate is transferred by the vacuum transfer robot TR1 through the vacuum transfer chamber 500 to at least one of the process modules PM1 to PM6.

[0075] For example, the substrate is transferred to a plasma processing module 700, which is one of the process modules PM1 to PM6. In the plasma processing module 700 shown in FIG.

[0076] The plasma processing includes an etching process in which plasma is used to etch a film on the substrate W. First, the substrate W is carried into the plasma processing chamber 800 by the vacuum transfer robot TR1, placed on the substrate support part 801 by a lifter, and held by suction on the substrate support part 801.

[0077] Next, plasma is generated in the plasma processing space 800s by the plasma generating unit 803. At this time, a processing gas is supplied to the plasma processing space 800s by the gas supply unit 802 via the shower head 820. The processing gas supplied at this time includes a gas that generates activated species necessary for etching the substrate W. The exhaust unit 804 evacuates the atmosphere in the plasma processing space 800s, and the inside of the plasma processing chamber 800 is depressurized to a vacuum. Then, an RF signal is supplied from the plasma generating unit 803 to the upper electrode and / or the lower electrode, and plasma is generated from the processing gas in the plasma processing space 800s. In this manner, the substrate W is etched.

[0078] When plasma processing is completed, the substrate is unloaded from the plasma processing chamber 800 of the plasma processing module 700 by the vacuum transfer robot TR1 of the vacuum transfer module TM shown in FIG. The substrate is transferred by the vacuum transfer robot TR1 through the vacuum transfer chamber 500 of the vacuum transfer module TM to the load lock modules LL1 and LL2. Alternatively, the substrate is transferred by the vacuum transfer robot TR1 through the vacuum transfer chamber 500 of the vacuum transfer module TM to one of the other process modules PM1 to PM6, where it is processed and then transferred to the load lock modules LL1 and LL2. At this time, the chambers 400 of the load lock modules LL1 and LL2 are regulated to a vacuum. Next, the chambers 400 of the load lock modules LL1 and LL2 are regulated to atmospheric pressure. The substrate is then transferred by the atmospheric transfer robot TR3 of the atmospheric transfer module LM from the load lock modules LL1 and LL2 through the atmospheric transfer module LM to the container C of the load ports LP1 to LP4.

[0079] When replacing a consumable part in the substrate processing system PS, for example, the consumable part in the plasma processing module 700 is removed from the plasma processing chamber 800 by the vacuum transfer robot TR1 of the vacuum transfer module TM. The consumable part may be an edge ring 812. The vacuum transfer robot TR1 transfers the consumable part through the vacuum transfer chamber 500 of the vacuum transfer module TM into the chamber 900 of the stocker modules SM1 and SM2. As shown in FIG. 7 , the consumable part is stored in a container L on the container mounting unit 901 in the chamber 900. At this time, the pressure inside the chamber 900 of the stocker modules SM1 and SM2 is regulated to a vacuum. The pressure inside the chamber 900 is regulated by an exhaust unit 903.

[0080] Then, the vacuum transfer robot TR1 of the vacuum transfer module TM removes new consumable parts from the container L on the container mounting portion 901 from the chamber 900. The vacuum transfer robot TR1 shown in FIG. 1 transfers the consumable parts through the vacuum transfer chamber 500 of the vacuum transfer module TM into the plasma processing chamber 800 of the plasma processing module 700 and installs them in a predetermined position. Note that the consumable parts are not limited to parts of the process modules PM1 to PM6, and may be other parts of the substrate processing system PS.

[0081] According to this exemplary embodiment, the substrate processing system PS includes a flexible member 300 configured to bend due to pressure fluctuations, and a power generating element 301 configured to generate power by the bending of the flexible member 300. This allows power generation using pressure fluctuations occurring in the substrate processing system PS, thereby improving the power efficiency of the substrate processing system PS.

[0082] In this exemplary embodiment, the walls of the chambers 400, 500, 800, and 900 of the substrate processing system PS include the flexible member 300, so that the flexible member 300 can bend by effectively capturing vibrations and deformations of the chamber, pressure fluctuations inside the chamber, etc. Therefore, power generation by the power generating element 301 can be performed effectively.

[0083] In this exemplary embodiment, the flexible member 300 has an outer surface that is positioned to face the outside of the chamber 400, and the power generating element 301 is attached to the outer surface of the flexible member 300, making it easy to attach and wire the power generating element 301.

[0084] In this exemplary embodiment, the chambers 400, 500, 800, and 900 include at least one of an exhaust section and an air supply section, which makes it easier for pressure fluctuations to occur within the chamber, making it easier for the flexible member 300 to bend, and allowing the power generation element 301 to generate power effectively.

[0085] In this exemplary embodiment, the flexible member 300 is configured to be more flexible than the surrounding members, so that the flexible member 300 is more flexible and the power generating element 301 can generate power more effectively.

[0086] In this exemplary embodiment, the flexible members 300 and the power generating elements 301 are arranged in the load lock modules LL1 and LL2, the vacuum transfer module TM, the process modules PM1 to PM6, and the stocker modules SM1 and SM2.

[0087] In the load lock modules LL1 and LL2, the pressure switches between vacuum and atmospheric pressure every time a substrate is transferred, resulting in large pressure fluctuations. By arranging the flexible member 300 and the power generating element 301 in the load lock modules LL1 and LL2, the power generating element 301 can generate power more effectively.

[0088] The vacuum transfer module TM is regulated to a vacuum. In the vacuum transfer module TM, the pressure frequently fluctuates when substrates are transferred to the process modules PM1 to PM6 or the load lock modules LL1 and LL2, or when consumable parts are transferred to the stocker modules SM1 and SM2. By arranging the flexible member 300 and the power generating element 301 in the vacuum transfer module TM, the power generating element 301 can generate electricity effectively.

[0089] In the process modules PM1 to PM6, the pressure is adjusted to a predetermined level when a substrate is processed. The pressure also fluctuates when the substrate is transported to the vacuum transport module TM. In particular, in the plasma processing module 700, the pressure is reduced to a vacuum during plasma processing, resulting in large pressure fluctuations. By arranging the flexible member 300 and the power generating element 301 in the process modules PM1 to PM6, the power generating element 301 can generate electricity more effectively.

[0090] In the storage modules SM1 and SM2, the atmosphere is controlled to prevent contaminants from entering, and the pressure fluctuates frequently. By disposing the flexible member 300 and the power generating element 301 in the storage modules SM1 and SM2, the power generating element 301 can generate electricity effectively.

[0091] In this exemplary embodiment, the substrate processing system PS includes a battery 302, so that the generated power can be stored and utilized.

[0092] In this exemplary embodiment, in the plasma processing module 700, the flexible member 300 is positioned at a position lower than the substrate on the substrate support 801 in the plasma processing chamber 800, thereby preventing particles from being generated due to bending of the flexible member 300 and contaminating the substrate.

[0093] In the above-described embodiments, the flexible member 300 and the power generating element 301 may be disposed in other parts of the PS of the substrate processing system. The flexible member 300 and the power generating element 301 may be disposed in a part of the PS of the substrate processing system where the air pressure fluctuations are large, such as a wall or window separating a vacuum from atmospheric pressure. For example, the flexible member 300 and the power generating element 301 may be disposed in the gate valve GV1. The flexible member 300 and the power generating element 301 may be disposed in any of the gate valves GV2, GV3, and GV4.

[0094] Embodiments of the present disclosure further include the following aspects.

[0095] (Supplementary Note 1) A substrate processing system comprising: a flexible member configured to bend due to pressure fluctuation; and a power generating element attached to the flexible member and configured to generate power by bending of the flexible member.

[0096] (Supplementary Note 2) The substrate processing system according to Supplementary Note 1, wherein the substrate processing system includes a chamber, and the chamber includes the flexible member.

[0097] (Supplementary Note 3) The substrate processing system according to Supplementary Note 2, wherein the chamber has a wall portion, and the wall portion includes the flexible member.

[0098] (Supplementary Note 4) The substrate processing system according to Supplementary Note 2 or 3, wherein the chamber has at least one of an exhaust section or an air supply section, and the exhaust section or the air supply section includes the flexible member.

[0099] (Supplementary Note 5) The substrate processing system according to any one of Supplementary Notes 2 to 4, wherein the flexible member has an outer surface that faces outside the chamber, and the power generating element is attached to the outer surface of the flexible member.

[0100] (Supplementary Note 6) The substrate processing system according to any one of Supplementary Notes 2 to 5, wherein the chamber includes a substrate processing chamber.

[0101] (Supplementary Note 7) The substrate processing system according to Supplementary Note 6, wherein the substrate processing chamber is a plasma processing chamber that defines a plasma processing space.

[0102] (Supplementary Note 8) The substrate processing system according to any one of Supplementary Notes 2 to 7, wherein the chamber includes a substrate transfer chamber.

[0103] (Supplementary Note 9) The substrate processing system according to any one of Supplementary Notes 1 to 8, wherein the flexible member is configured to be more flexible than surrounding members.

[0104] (Supplementary Note 10) The substrate processing system according to Supplementary Note 9, wherein the flexible member is configured to be thinner than the peripheral member, thereby being more flexible than the peripheral member.

[0105] (Supplementary Note 11) The substrate processing system according to Supplementary Note 9, wherein the flexible member is made of a material that is more flexible than the peripheral member.

[0106] (Supplementary Note 12) The substrate processing system according to any one of Supplementary Notes 1 to 11, comprising: a first transfer module having a first internal pressure; a second transfer module having a second internal pressure greater than the first internal pressure; a process module connected to the first transfer module; a load lock module interposed between the first transfer module and the second transfer module; and a gate valve disposed between the first transfer module and the process module, wherein the flexible member and the power generating element are disposed in at least one selected from the group consisting of the first transfer module, the load lock module, the process module, and the gate valve.

[0107] (Supplementary Note 13) The substrate processing system according to Supplementary Note 12, wherein the first transfer module is a vacuum transfer module, and the second transfer module is an atmospheric transfer module.

[0108] (Supplementary Note 14) The substrate processing system according to any one of Supplementary Notes 1 to 13, wherein the substrate processing system includes a storage module configured to store consumable parts, and the flexible member and the power generating element are disposed in the storage module.

[0109] (Supplementary Note 15) The substrate processing system according to any one of Supplementary Notes 1 to 14, further comprising a battery configured to store the power generated by the power generating element.

[0110] (Supplementary Note 16) A substrate processing apparatus comprising: a substrate processing chamber configured to define a processing space; a substrate support disposed within the substrate processing chamber; a gas supply unit configured to supply gas to the processing space; an exhaust unit configured to exhaust gas from the processing space; a flexible member disposed in the substrate processing chamber and configured to bend due to pressure fluctuations; and a power generation element attached to the flexible member and configured to generate power by bending of the flexible member.

[0111] (Supplementary Note 17) The substrate processing apparatus according to Supplementary Note 16, wherein the flexible member is positioned lower than the substrate on the substrate support in the substrate processing chamber.

[0112] (Supplementary Note 18) The substrate processing apparatus according to Supplementary Note 17, wherein the flexible member is disposed in the exhaust section.

[0113] (Supplementary Note 19) The substrate processing apparatus according to any one of Supplementary Notes 16 to 18, wherein the gas supply unit is configured to supply a processing gas to the processing space, and the substrate processing apparatus further includes a plasma generation unit configured to generate plasma from the processing gas.

[0114] (Supplementary Note 20) The substrate processing apparatus according to any one of Supplementary Notes 16 to 19, further comprising a battery configured to store the power generated by the power generating element.

[0115] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments.

[0116] PS...substrate processing system, TM...vacuum transfer module, LL1, LL2...load lock modules, PM1 to PM6...process modules, SM1, SM2...storage modules, GS...power generation system, 300...flexible member, 301...power generation element, 302...battery, 400...chamber, 500...vacuum transfer chamber, 700...plasma processing module, 800...plasma processing chamber, 900...chamber

Claims

1. A substrate processing system comprising: a flexible member configured to bend due to pressure fluctuation; and a power generation element attached to the flexible member and configured to generate power by the bending of the flexible member.

2. The substrate processing system of claim 1, wherein the substrate processing system includes a chamber, and the chamber includes the flexible member.

3. The substrate processing system of claim 2, wherein the chamber has a wall, and the wall includes the flexible member.

4. The substrate processing system according to claim 2, wherein the chamber has at least one of an exhaust section or an air supply section, and the exhaust section or the air supply section includes the flexible member.

5. The substrate processing system according to claim 2, wherein the flexible member has an outer surface that faces the outside of the chamber, and the power generating element is attached to the outer surface of the flexible member.

6. The substrate processing system of any one of claims 2 to 5, wherein the chamber comprises a substrate processing chamber.

7. The substrate processing system of claim 6, wherein the substrate processing chamber is a plasma processing chamber defining a plasma processing space.

8. The substrate processing system according to any one of claims 2 to 5, wherein the chamber includes a substrate transfer chamber.

9. The substrate processing system of claim 1, wherein the flexible member is configured to be more flexible than the surrounding member.

10. The substrate processing system of claim 9, wherein the flexible member is configured to be thinner than the peripheral member, thereby making the flexible member more flexible than the peripheral member.

11. The substrate processing system according to claim 9, wherein the flexible member is made of a material that is more flexible than the peripheral member.

12. The substrate processing system according to claim 1, comprising: a first transfer module having a first internal pressure; a second transfer module having a second internal pressure greater than the first internal pressure; a process module connected to the first transfer module; a load lock module interposed between the first transfer module and the second transfer module; and a gate valve disposed between the first transfer module and the process module, wherein the flexible member and the power generating element are disposed in at least one selected from the group consisting of the first transfer module, the load lock module, the process module, and the gate valve.

13. The substrate processing system of claim 12, wherein the first transfer module is a vacuum transfer module and the second transfer module is an atmospheric transfer module.

14. The substrate processing system according to claim 1, wherein the substrate processing system comprises a stocker module configured to store consumable parts, and the flexible member and the power generating element are disposed in the stocker module.

15. The substrate processing system according to claim 1, further comprising a battery configured to store the power generated by the power generating element.

16. A substrate processing apparatus comprising: a substrate processing chamber configured to define a processing space; a substrate support disposed within the substrate processing chamber; a gas supply unit configured to supply gas to the processing space; an exhaust unit configured to exhaust gas from the processing space; a flexible member disposed in the substrate processing chamber and configured to bend due to pressure fluctuations; and a power generation element attached to the flexible member and configured to generate power by bending of the flexible member.

17. The substrate processing apparatus of claim 16, wherein the flexible member is positioned lower than a substrate on the substrate support in the substrate processing chamber.

18. The substrate processing apparatus according to claim 17, wherein the flexible member is disposed in the exhaust section.

19. The substrate processing apparatus according to claim 16, wherein the gas supply unit is configured to supply a processing gas to the processing space, and the substrate processing apparatus further includes a plasma generation unit configured to generate plasma from the processing gas.

20. The substrate processing apparatus according to claim 16, further comprising a battery configured to store the power generated by the power generating element.

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