Electronic device including conductive layer

Abstract

A wearable electronic device according to an embodiment may comprise: a housing configured to be wearable on the head of a user; a support plate provided inside the housing; a depth sensor which is disposed on the support plate and transmits and receives signals; an electronic component disposed on the support plate; and a first conductive layer which is disposed between the electronic component and the support plate and electrically connects the electronic component to the support plate.

Description

Electronic devices comprising a conductive layer

[0001] The present embodiments disclose an electronic device including a conductive layer.

[0002] A variety of wearable electronic devices, such as virtual reality (VR) devices, augmented reality (AR) devices, and / or mixed reality (MR) devices, are becoming commercially available. Wearable electronic devices can be configured to fit on a user's head. For example, wearable electronic devices can take the form of glasses or goggles.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment, a wearable electronic device may include a housing configured to be worn on a user's head, a support plate provided inside the housing, a depth sensor disposed on the support plate and transmitting and receiving signals, an electronic component disposed on the support plate, and a first conductive layer disposed between the electronic component and the support plate and electrically connecting the electronic component to the support plate.

[0005] A wearable electronic device according to one embodiment may include a depth sensor for transmitting and receiving signals, a support plate for supporting the depth sensor, an electronic component disposed on a surface of both sides of the support plate where the depth sensor is disposed, and a first conductive layer disposed between the electronic component and the support plate and electrically connecting the electronic component to the support plate.

[0006] According to one embodiment, a wearable electronic device includes a depth sensor for transmitting and receiving signals, a support plate for supporting the depth sensor, an electronic component disposed on a surface of both sides of the support plate on which the depth sensor is disposed, a first conductive layer disposed between the electronic component and the support plate and electrically connecting the electronic component to the support plate, a printed circuit board (PCB) disposed on an opposite side of the electronic component with respect to the support plate, a shield can disposed on the PCB, and a second conductive layer electrically connecting the support plate to the shield can, wherein the first conductive layer or the second conductive layer may be a conductive double-sided tape.

[0007] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2A is a drawing showing the front side of a wearable electronic device according to one embodiment.

[0010] FIG. 2b is a drawing showing the back of a wearable electronic device according to one embodiment.

[0011] FIG. 3 is a plan view schematically illustrating the interior of a wearable electronic device according to one embodiment.

[0012] FIG. 4 is a plan view schematically illustrating the support plate, depth sensor, and electronic components included in area A illustrated in FIG. 3.

[0013] Figure 5 is a graph showing signal strength versus frequency in an electronic device that does not include a first conductive layer.

[0014] FIG. 6 is a graph showing signal strength versus frequency in an electronic device according to one embodiment.

[0015] FIG. 7 is a schematic plan view of a PCB, a support plate, a depth sensor, and electronic components according to one embodiment.

[0016] Figure 8 is a graph showing signal strength versus frequency in an electronic device that does not include a second conductive layer.

[0017] FIG. 9 is a graph showing signal strength versus frequency in an electronic device according to one embodiment.

[0018] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0019] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0034] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0038] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] FIGS. 2A and 2B are diagrams illustrating the front and back of a wearable electronic device (200) according to one embodiment, and FIG. 3 is a plan view schematically illustrating the interior of a wearable electronic device according to one embodiment. When a user wears the wearable electronic device (200), the appearance that the user's eyes see may be as shown in FIG. 2B.

[0042] Referring to FIG. 2A, according to various embodiments, the electronic device (101) of FIG. 1 may include a wearable electronic device (200) that provides a service that provides an extended reality (XR) experience to a user. For example, XR or XR service may be defined as a service that collectively refers to virtual reality (VR), augmented reality (AR), and / or mixed reality (MR).

[0043] In one embodiment, the wearable electronic device (200) may have a form factor for being worn on a user's head. The wearable electronic device (200) may refer to a head-mounted device or a head-mounted display worn on the user's head, but may also be configured in the form of at least one of glasses, goggles, a helmet, or a hat. The wearable electronic device (200) may include an OST (optical see-through) type configured to allow external light to reach the user's eyes through glasses when worn, or a VST (video see-through) type configured to allow light emitted from a display to reach the user's eyes when worn, but block external light so that external light does not reach the user's eyes.

[0044] In one embodiment, the wearable electronic device (200) may be worn on the user's head and may provide the user with an image related to an extended reality (XR) service. For example, the wearable electronic device (200) may provide XR content (hereinafter referred to as an XR content image) that outputs at least one virtual object to be superimposed on a display area or an area determined to be the user's field of view (FoV). According to one embodiment, the XR content may refer to an image or image related to a real space acquired through a camera (e.g., a camera for taking pictures) or an image or image in which at least one virtual object is superimposed on a virtual space. According to one embodiment, the wearable electronic device (200) may provide XR content based on a function being performed by the wearable electronic device (200) and / or a function being performed by one or more external electronic devices (e.g., the electronic devices 102, 104, or 108 of FIG. 1).

[0045] In one embodiment, the wearable electronic device (200) is at least partially controlled by an external electronic device (e.g., electronic devices (102 or 104) of FIG. 1), and may perform at least one function under the control of the external electronic device, but may also perform at least one function independently.

[0046] Referring to FIGS. 2A and 2B , a wearable electronic device (200) may include a housing (210) in which at least some of the components of FIG. 1 are arranged. The housing (210) may be configured to be wearable on a user's head. For example, the housing (210) may include a strap (219) and / or a wearing member for being fixed on a body part of the user. For example, the user may wear the wearable electronic device (200) on the head so as to face the first direction (①) of the wearable electronic device (200).

[0047] Referring to FIG. 2B, a fourth function camera (e.g., a face recognition camera) (225, 226, 227) and / or a display assembly (300) may be disposed in a first direction (①) of the housing (210) facing the user's face. Referring to FIG. 2A, a first function camera (e.g., a recognition camera) (215), a second function camera (e.g., a shooting camera) (211, 212), a depth sensor (217), and / or a touch sensor (213) may be disposed in a second direction (②) of the housing (210) opposite to the first direction (①). Although not illustrated in the drawing, the housing (210) may include a memory (e.g., a memory (130) of FIG. 1) and a processor (e.g., a processor (120) of FIG. 1), and may further include other components illustrated in FIG. 1.

[0048] In one embodiment, the display assembly (300) may be positioned in the first direction (①) of the wearable electronic device (200). For example, the display assembly (300) may be positioned toward the user's face. The display assembly (300) may include a display panel (310) and a lens assembly (320).

[0049] In one embodiment, the display assembly (300) may include a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), a light emitting diode (LED) on silicon (LEDoS), an organic light emitting diode (OLED), an organic light emitting diode (LED) on silicon (OLEDoS), or a micro light emitting diode (micro LED).

[0050] In one embodiment, when the display assembly (300) is formed of one of a liquid crystal display (LCD), a digital mirror display, or a silicon liquid crystal display (LCD), the wearable electronic device (200) may include a light source that irradiates light (e.g., visible light) to a screen output area of ​​the display assembly (300). In one embodiment, when the display assembly (300) can generate light (e.g., visible light) on its own, for example, when the wearable electronic device (200) is formed of one of an organic light-emitting diode (OLED) or a micro LED, the wearable electronic device (200) may provide a user with good quality XR content images even without including a separate light source. For example, if the display assembly (300) is implemented with an organic light-emitting diode (OLED) or a micro LED, a light source is unnecessary, and thus the wearable electronic device (200) may be lightweight.

[0051] In one embodiment, the display assembly (300) may include a first display assembly (300a) and / or a second display assembly (300b). According to one embodiment, the first display assembly (300a) may be arranged to face the user's left eye in the fourth direction (④), and the second display assembly (300b) may be arranged to face the user's right eye in the third direction (③).

[0052] In one embodiment, the display assembly (300) may include a lens assembly (320) including a transparent waveguide. The lens assembly (320) may serve to adjust the focus so that a screen (e.g., an XR content image) output from the display panel (310) can be viewed by the user's eyes. For example, light (e.g., visible light) emitted from the display panel (310) may pass through the lens assembly (320) and be transmitted to the user through a waveguide formed within the lens assembly (320). The lens assembly (320) may include at least one of a Fresnel lens, a pancake lens, a convex lens, or a multi-channel lens.

[0053] In one embodiment, the first function cameras (e.g., recognition cameras) (215) can acquire images while the wearable electronic device (200) is worn by the user. The first function cameras (215) can be used for the purpose of detecting user movements or recognizing user gestures. For example, the first function cameras (215) can be used for at least one of hand detection, hand tracking, recognition of user gestures (e.g., hand movements), and / or space recognition. For example, the first function cameras (215) mainly use GS (global shutter) cameras, which have superior performance compared to RS (rolling shutter) cameras, to detect and track fine movements of hand movements and fingers, and can be configured as a stereo camera including two or more GS cameras for head tracking and space recognition. The first function cameras (215) can be used for 3DoF (degrees of freedom), 6DoF head tracking, location (spatial, environmental) recognition, and / or movement recognition. The first function camera (215) can perform simultaneous localization and mapping (SLAM) function to recognize information (e.g., location and / or direction) related to the surrounding space through spatial recognition for 6DoF and depth shooting. In one embodiment, the second function cameras (211, 212) can also be used for hand detection and tracking, and recognition of user gestures.

[0054] In one embodiment, the second function camera (e.g., a camera for shooting) (211, 212) can obtain an image related to the surrounding environment of the wearable electronic device (200). The second function camera (211, 212) can be used to shoot the outside and generate an image or video corresponding to the outside and transmit it to a processor (e.g., the processor (120) of FIG. 1). The processor (120) can display the image provided from the second function camera (211, 212) on the display assembly (300). The second function camera (211, 212) may also be referred to as an HR (high resolution) or PV (photo video) camera and may include a high-resolution camera. For example, the second function camera (211, 212) may include a color camera equipped with functions for obtaining high-quality images, such as an auto focus (AF) function and an optical image stabilizer (OIS), but is not limited thereto, and the second function camera (211, 212) may also include a GS camera or an RS camera.

[0055] In one embodiment, a third function camera (e.g., a gaze tracking camera) may be positioned in the display assembly (300) (or inside the housing (210)) so that the camera lens faces the user's eyes when the user wears the wearable electronic device (200). The third function camera may be used for detecting and tracking (ET) pupils and / or recognizing the user's iris. The processor (120) may track the movements of the user's left and right eyes in the images received from the third function camera to determine the gaze direction. The processor (120) may track the position of the pupil in the images so that the center of the XR content image displayed in the screen display area is positioned according to the direction in which the pupil is gazing. As an example, the third function camera may be a GS camera to detect the pupil and track the movement of the pupil. The third function camera can be installed for the left eye and the right eye, and cameras with the same performance and specifications can be used.

[0056] In one embodiment, the fourth functional camera (e.g., a face recognition camera) (225, 226, 227) may be used to detect and track (FT) the user's facial expression when the user wears the wearable electronic device (200). For example, the fourth functional camera (225, 226, 227) may be used to recognize the user's face, or to recognize and / or track the user's two eyes.

[0057] In one embodiment, a depth sensor (or depth camera) (217) may be used to determine the distance to an object (e.g., an object) such as time of flight (ToF). ToF may include direct time of flight (dToF) and indirect time of flight (iToF). ToF is a technology that measures the distance to an object using a signal (e.g., near-infrared, ultrasound, or laser). After a transmitter transmits a signal, a receiver measures the signal, and the distance to the object can be determined based on the time of flight of the signal. For example, the depth sensor (217) may be configured to transmit a signal and receive a signal reflected from a subject. Instead of or in addition to the depth sensor (217), a first function camera (215) may determine the distance to an object.

[0058] In one embodiment, the touch sensor (213) may be arranged in the second direction (②) of the housing (210). The touch sensor (213) may be implemented as a single type or a left / right separated type depending on the shape of the housing (210), but is not limited thereto. For example, when the touch sensor (213) is implemented as a left / right separated type as illustrated in FIG. 2A, when the user wears the wearable electronic device (200), the first touch sensor (213a) may be arranged at the user's left eye position, such as in the fourth direction (④), and the second touch sensor (213b) may be arranged at the user's right eye position, such as in the third direction (③).

[0059] In one embodiment, the touch sensor (213) can recognize a touch input in at least one of, for example, a capacitive, pressure-sensitive, infrared, or ultrasonic manner. For example, the capacitive touch sensor (213) can recognize a physical touch (or contact) input or a hovering input (or proximity) of an external object. According to some embodiments, the wearable electronic device (200) can also utilize a proximity sensor (not shown) to recognize proximity of an external object.

[0060] In one embodiment, the touch sensor (213) has a two-dimensional surface and can transmit touch data (e.g., touch coordinates) of an external object (e.g., a user's finger) that comes into contact with the touch sensor (213) to a processor (e.g., the processor (120) of FIG. 1). The touch sensor (213) can detect a hovering input for an external object (e.g., a user's finger) that approaches within a first distance from the touch sensor (213), or a touch input that touches the touch sensor (213).

[0061] In one embodiment, the touch sensor (213) may provide two-dimensional information about the point of contact as “touch data” to the processor (120) when an external object touches the touch sensor (213). The touch data may be described as a “touch mode.” The touch sensor (213) may provide hovering data about the time or location of hovering around the touch sensor (213) to the processor (120) when an external object is located within a first distance from the touch sensor (213) (or in proximity, hovering above the touch sensor). The hovering data may be described as a “hovering mode / proximity mode.”

[0062] In one embodiment, the wearable electronic device (200) may obtain hovering data using at least one of a touch sensor (213), a proximity sensor (not shown), or / and a depth sensor (217) to generate information about a distance, location, or time point between the touch sensor (213) and an external object.

[0063] In one embodiment, the interior of the housing (210) may include components of FIG. 1, for example, a processor (e.g., processor (120) of FIG. 1) and memory (e.g., memory (130) of FIG. 1).

[0064] In one embodiment, the memory (130) may store various instructions that may be performed by the processor (120). The instructions may include arithmetic and logical operations, data movement, or control commands such as input / output that may be recognized by the processor (120). The memory (130) may include volatile memory (e.g., volatile memory (132) of FIG. 1) and non-volatile memory (e.g., non-volatile memory (134) of FIG. 1), and may temporarily or permanently store various data.

[0065] In one embodiment, the processor (120) may be operatively, functionally, and / or electrically connected to each component of the wearable electronic device (200) and may be configured to perform calculations or data processing related to control and / or communication of each component. Operations performed by the processor (120) may be stored in the memory (130) and, when executed, may be executed by instructions that cause the processor (120) to operate. For example, the processor (120) may be configured to control at least a portion of the operation of the wearable electronic device (200).

[0066] Hereinafter, the computational and data processing functions that the processor (120) can implement on the wearable electronic device (200) are not limited, but a series of operations related to the XR content service function will be described. The operations of the processor (120) described below can be performed by executing instructions stored in the memory (130).

[0067] In one embodiment, the processor (120) may generate a virtual object based on virtual information based on image information. The processor (120) may output a virtual object related to an XR service together with background space information through the display assembly (300). For example, the processor (120) may capture an image related to a real space corresponding to the field of view of a user wearing the wearable electronic device (200) through the second function camera (211, 212) to obtain image information or generate a virtual space for a virtual environment. For example, the processor (120) may control the display assembly (300) to display XR content (hereinafter referred to as an XR content screen) in which at least one virtual object is output to be overlapped in an area determined to be a display area or a field of view (FoV) of the user.

[0068] Meanwhile, in FIG. 3, it should be noted that other components are schematically illustrated to explain the position where the depth sensor (217) is positioned inside the housing (210). For example, in FIG. 3, the first function camera (215) is simply illustrated as being positioned on each side of the depth sensor (217), but any component (e.g., a microphone) included in the wearable electronic device (200) may be positioned instead of the first function camera (215) or additionally positioned next to the first function camera (215).

[0069] FIG. 4 is a plan view schematically illustrating a support plate, a depth sensor, and electronic components included in area A illustrated in FIG. 3, FIG. 5 is a graph showing signal strength versus frequency in an electronic device that does not include a first conductive layer, and FIG. 6 is a graph showing signal strength versus frequency in an electronic device according to one embodiment.

[0070] Referring to FIGS. 4 to 6, a wearable electronic device (200) according to an embodiment can calculate a distance to an object through a depth sensor (217). The depth sensor (217) can transmit and receive signals. For example, the depth sensor (217) can transmit a signal modulated at a specific frequency and receive a signal reflected from an object. The depth sensor (217) can calculate a distance to an object by using a phase change between the transmitted signal and the received signal. The depth sensor (217) can be connected to a support plate (220).

[0071] In one embodiment, the support plate (220) may be disposed in a housing (e.g., the housing (210) of FIG. 2A). For example, the support plate (220) may be provided inside the housing. The support plate (220) may support a depth sensor (217) and an electronic component (230). The depth sensor (217) may be connected to a surface of the support plate (220) that faces forward (e.g., in the +x direction). For example, the depth sensor (217) may be connected to the support plate (220) via an adhesive layer (218). The adhesive layer (218) may be, for example, a conductive double-sided tape.

[0072] In one embodiment, an electronic component (230) may be disposed on the same surface as the surface of the support plate (220) on which the depth sensor (217) is disposed. The electronic component (230) may be any configuration that transmits an electrical signal or receives an electrical signal to perform a predetermined function. The electronic component (230) may be formed of a conductive material or include at least one conductive material. A first conductive layer (240) may be disposed between the electronic component (230) and the support plate (220).

[0073] In one embodiment, the first conductive layer (240) can electrically connect the electronic component (230) to the support plate (220). For example, the first conductive layer (240) can be a conductive double-sided tape. From this structure, the support plate (220) functions as a ground, and the current (C1) can flow from the electronic component (230) to the support plate (220). Radiated emission noise generated by coupling a harmonic frequency of a frequency included in a signal transmitted from the depth sensor (217) to the electronic component (230) can be reduced.

[0074] In one embodiment, the graph illustrated in FIG. 5 is a graph showing signal intensity versus frequency for a wearable electronic device including a ToF sensor, which is a depth sensor (217), a flexible printed circuit board (FPCB), which is an electronic component (230), and a non-conductive layer connecting the electronic component (230) to a support plate (220). Referring to the graph illustrated in FIG. 5, it can be confirmed that radiated emission noise of approximately 51.0 dB is generated at a frequency near 400 MHz.

[0075] In one embodiment, the graph illustrated in FIG. 6 is a graph showing signal intensity versus frequency for a wearable electronic device (200) including a ToF sensor, which is a depth sensor (217), an FPCB, which is an electronic component (230), and a first conductive layer (240) that connects the electronic component (230) to a support plate (220). Referring to the graph illustrated in FIG. 6, it can be confirmed that a radiated emission noise of approximately 44.5 dB, which is reduced by 6.5 dB from 51.0 dB, is generated at a frequency near 400 MHz.

[0076] Meanwhile, in the graphs illustrated in FIGS. 5 and 6, the specific values ​​of frequency and radiated emission noise are merely examples for explanation, and it should be noted that radiated emission noise having different magnitudes may be reduced at different frequencies. For example, if the distance between the depth sensor (217) and the object, the thickness of the electronic component (230), and / or the type of the depth sensor (217) change, radiated emission noise may occur near a frequency other than 400 MHz.

[0077] In one embodiment, the electronic component (230) may be composed of an FPCB. In one embodiment, a cover layer (231) may be exposed on a first side of both sides of the electronic component (230), and an FCCL layer (232) may be exposed on a second side of both sides of the electronic component (230).

[0078] In one embodiment, the cover layer (231) may be the uppermost layer among a plurality of layers constituting the electronic component (230). Here, the upper direction is the +x direction. The cover layer (231) may reduce the infiltration of foreign substances such as moisture and dust from the outside of the electronic component (230) and protect the electronic component (230) from physical impact. The cover layer (231) may be formed of, for example, a polyimide material.

[0079] In one embodiment, the FCCL layer (232) may be disposed between the cover layer (231) and the first conductive layer (240). The FCCL layer (232) may include a circuit pattern. A copper layer formed on the FCCL layer (232) may transmit an electrical signal. In one embodiment, a separate layer may not be disposed on the surface of the FCCL layer (232) facing the first conductive layer (240). The FCCL layer (232) may be the layer disposed at the lowest side among a plurality of layers constituting the electronic component (230). From this structure, the FCCL layer (232) may contact the first conductive layer (240) and be directly connected to the first conductive layer (240). The FCCL layer (232) may be electrically connected to the support plate (220) through the first conductive layer (240).

[0080] FIG. 7 is a schematic plan view of a PCB, a support plate, a depth sensor, and electronic components according to one embodiment, FIG. 8 is a graph showing signal strength versus frequency in an electronic device that does not include a second conductive layer, and FIG. 9 is a graph showing signal strength versus frequency in an electronic device according to one embodiment.

[0081] Referring to FIGS. 7 to 9, a wearable electronic device (e.g., the wearable electronic device (200) of FIG. 2A) according to an embodiment can calculate a distance to an object through a depth sensor (417) (e.g., the depth sensor (217) of FIG. 4). An electronic component (430) (e.g., the electronic component (230) of FIG. 4) is electrically connected to a support plate (420) (e.g., the support plate (220) of FIG. 4) through a first conductive layer (440) (e.g., the first conductive layer (240) of FIG. 4), and radiated noise generated from the electronic component (430) can be reduced.

[0082] In one embodiment, the electronic component (430) may be composed of an FPCB. In one embodiment, the electronic component (430) may include a cover layer (431) (e.g., the cover layer (231) of FIG. 4) and a FCCL layer (432) (e.g., the FCCL layer (232) of FIG. 4). The FCCL layer (432) may be directly connected to the first conductive layer (440).

[0083] In one embodiment, the wearable electronic device may further include a printed circuit board (PCB) (450), a shield can (460), a support body (470), and a second conductive layer (480).

[0084] In one embodiment, the PCB (450) may be provided inside a housing (e.g., housing (210) of FIG. 2A). The PCB (450) may be disposed, for example, on the lower side of a support plate (420). The PCB (450) may face the support plate (420).

[0085] In one embodiment, the shield can (460) may be placed on one surface (e.g., in the x-axis direction) of the PCB (450). The shield can (460) may cover, for example, at least a portion of an electronic component, such as an application processor (AP) or memory, formed on the PCB (450). The shield can (460) may reduce electromagnetic interference applied to the AP or memory and increase the accuracy of signal transmission. The shield can (460) may reduce damage to the AP or memory due to physical impact.

[0086] In one embodiment, the support body (470) may be disposed on the PCB (450) and may support the support plate (420). For example, the support body (470) may be disposed on the same side (e.g., in the x-axis direction) as the side of the PCB (450) on which the shield can (460) is disposed. In one embodiment, the support body (470) is formed of a non-conductive material, and electrical interference applied to the PCB (450) by the support body (470) may be reduced.

[0087] In one embodiment, the shield can (460) can be electrically connected to the support plate (420) through the second conductive layer (480). The second conductive layer (480) can be formed of, for example, the same material as the first conductive layer (440). For example, the second conductive layer (480) can be a conductive double-sided tape. From this structure, the FCCL layer (432) can be electrically connected to the shield can (460). The shield can (460) functions as a ground, and current (C2) can flow from the electronic component (430) through the first conductive layer (440), the support plate (420), and the second conductive layer (480) to the shield can (460). Radiation noise generated by coupling a harmonic frequency of a frequency included in a signal transmitted from a depth sensor (417) to an electronic component (430) can be reduced.

[0088] In one embodiment, the graph illustrated in FIG. 8 is a graph showing signal intensity versus frequency for a wearable electronic device including a ToF sensor, which is a depth sensor (417), an FPCB, which is an electronic component (430), a first conductive layer (440) connecting the electronic component (430) to a support plate (220), and no second conductive layer (480). Referring to the graph illustrated in FIG. 8, it can be confirmed that radiated emission noise of approximately 34.5 dB is generated at a frequency near 800 MHz.

[0089] In one embodiment, the graph illustrated in FIG. 9 is a graph showing signal intensity versus frequency for a wearable electronic device including a ToF sensor, which is a depth sensor (417), an FPCB, which is an electronic component (430), a first conductive layer (440), and a second conductive layer (480). Referring to the graph illustrated in FIG. 9, it can be confirmed that a radiated emission noise of about 31.5 dB, which is reduced by 3.5 dB from 35 dB, is generated at a frequency near 800 MHz. At this time, compared to a wearable electronic device that connects the electronic component (430) to the support plate (420) using a non-conductive layer without including a PCB (450), a support body (470), and a second conductive layer (480), it can be understood that the radiated emission noise is reduced by about 10 dB.

[0090] Meanwhile, in the graphs shown in FIGS. 8 and 9, the specific values ​​of frequency and radiated emission noise are only examples for explanation, and it is to be noted that radiated emission noise having different magnitudes at different frequencies can be reduced.

[0091] In one embodiment, one end of the second conductive layer (480) may be connected to the shield can (460), and the other end may be connected to the support plate (420). The shape of the second conductive layer (480) for electrically connecting the shield can (460) to the support plate (420) may vary. In one embodiment, the second conductive layer (480) may include a first connection part (481) connected to the shield can (460), and a second connection part (482) extending from the first connection part (481) and connected to the support plate (420).

[0092] In one embodiment, the first connecting part (481) may protrude from the support plate (420) based on the longitudinal direction of the support plate (420), as illustrated in FIG. 7. Here, the longitudinal direction of the support plate (420) is a direction parallel to the y-axis. The first connecting part (481) may be positioned on the opposite side of the PCB (450) based on the shield can (460). The lower surface of the first connecting part (481) may cover the upper surface of the shield can (460), and the upper surface of the first connecting part (481) may be exposed to the outside.

[0093] Meanwhile, unlike as illustrated in FIG. 7, it is to be noted that the first connection part (481) may be disposed between the shield can (460) and the support plate (420), and the upper surface of the first connection part (481) may be covered by the support plate (420). In this case, the support plate (420) is connected not only to the second connection part (482) of the second conductive layer (480) but also to the first connection part (481), and the connection strength of the support plate (420) to the PCB (450) may be increased. Since the support plate (420) covers the upper surface of the first connection part (481), the amount of foreign substances contacting the first connection part (481) may be reduced, and electrical interference between other electronic components disposed inside the housing and the first connection part (481) may be reduced.

[0094] In one embodiment, the second connecting part (482) may be disposed between the support plate (420) and the support body (470), as illustrated in FIG. 7. From this structure, the second connecting part (482) may electrically connect the support plate (420) to the support body (470) while fixing the support plate (420) to the support body (470). As the second connecting part (482) is compressed by the support plate (420) and the support body (470), the connection strength between the support plate (420) and the support body (470) may be increased. Even without arranging an additional configuration in the limited internal space of the housing, the radiated noise generated from the electronic component (430) through the second conductive layer (480) may be reduced. Meanwhile, unlike as shown in FIG. 7, it is to be noted that the second connecting part (482) is connected to the side of the support plate (420), and an additional connecting layer for fixation may be arranged between the support plate (420) and the support body (470).

[0095] According to one embodiment, a wearable electronic device (200) may include a housing (210) configured to be worn on a user's head, a support plate (220; 420) provided inside the housing (210), a depth sensor (217; 417) disposed on the support plate (220; 420) and transmitting and receiving signals, an electronic component (230; 430) disposed on the support plate (220; 420), and a first conductive layer (240; 440) disposed between the electronic component (230; 430) and the support plate (220; 420) and electrically connecting the electronic component (230; 430) to the support plate (220; 420).

[0096] In one embodiment, the electronic component (230; 430) may include a cover layer (231; 431), and a flexible copper clad laminate (FCCL) layer (232; 432) disposed between the cover layer (231; 431) and the first conductive layer (240; 440).

[0097] In one embodiment, the cover layer (231; 431) may be exposed on a first side of both sides of the electronic component (230; 430), and the FCCL layer (232; 432) may be exposed on a second side of both sides of the electronic component (230; 430).

[0098] In one embodiment, the FCCL layer (232; 432) may be in contact with the first conductive layer (240; 440).

[0099] In one embodiment, the electronic component (230; 430) may be placed on the same surface as the surface of the support plate (220; 420) on which the depth sensor (217; 417) is placed.

[0100] In one embodiment, the housing (210) may further include a printed circuit board (PCB) (450) provided inside the housing (210), a shield can (460) placed on the PCB (450), and a second conductive layer (480) electrically connecting the support plate (420) to the shield can (460).

[0101] In one embodiment, the FCCL layer (432) may be electrically connected to the shield can (460).

[0102] In one embodiment, the first conductive layer (240; 440) or the second conductive layer (480) may be a conductive double-sided tape.

[0103] In one embodiment, the PCB (450) may further include a support body (470) that is disposed on the PCB (450) and supports the support plate (420).

[0104] In one embodiment, the support body (470) may be formed of a non-conductive material.

[0105] In one embodiment, the second conductive layer (480) may include a first connecting part (481) connected to the shield can (460), and a second connecting part (482) extending from the first connecting part (481) and connected to the support plate (420).

[0106] In one embodiment, the first connecting part (481) may protrude from the support plate (420) based on the longitudinal direction of the support plate (420).

[0107] In one embodiment, the first connecting part (481) may be placed on the opposite side of the PCB (450) with respect to the shield can (460).

[0108] In one embodiment, the second connecting part (482) may be positioned between the support plate (420) and the support body (470).

[0109] In one embodiment, the support body (470) may be placed on the same surface as the surface of the PCB (450) on which the shield can (460) is placed.

[0110] A wearable electronic device (200) according to one embodiment may include a depth sensor (217; 417) for transmitting and receiving signals, a support plate (220; 420) for supporting the depth sensor (217; 417), an electronic component (230; 430) disposed on one of both sides of the support plate (220; 420) on which the depth sensor (217; 417) is disposed, and a first conductive layer (240; 440) disposed between the electronic component (230; 430) and the support plate (220; 420) and electrically connecting the electronic component (230; 430) to the support plate (220; 420).

[0111] In one embodiment, the electronic component (230; 430) may include a cover layer (231; 431), and a flexible copper clad laminate (FCCL) layer (232; 432) disposed between the cover layer (231; 431) and the first conductive layer (240; 440).

[0112] In one embodiment, the cover layer (231; 431) may be exposed on a first side of both sides of the electronic component (230; 430), and the FCCL layer (232; 432) may be exposed on a second side of both sides of the electronic component (230; 430).

[0113] In one embodiment, the device may further include a printed circuit board (PCB) (450) disposed on the opposite side of the electronic component (430) with respect to the support plate (420), a shield can (460) disposed on the PCB (450), and a second conductive layer (480) electrically connecting the support plate (420) to the shield can (460).

[0114] According to one embodiment, a wearable electronic device (200) includes a depth sensor (417) for transmitting and receiving a signal, a support plate (420) for supporting the depth sensor (417), an electronic component (430) disposed on one side of the support plate (420) where the depth sensor (417) is disposed, a first conductive layer (440) disposed between the electronic component (430) and the support plate (420) and electrically connecting the electronic component (430) to the support plate (420), a printed circuit board (PCB) (450) disposed on the opposite side of the electronic component (430) with respect to the support plate (420), a shield can (460) disposed on the PCB (450), and a second conductive layer (480) electrically connecting the support plate (420) to the shield can (460), wherein the first conductive layer (240; 440) or the second conductive layer (480) may be a conductive double-sided tape.

[0115] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0116] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0117] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0118] One embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0119] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0120] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0121] And the embodiments of the present invention disclosed in this specification and drawings are merely specific examples presented to easily explain the technical contents according to the embodiments of the present invention and to help understand the embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. Therefore, the scope of the various embodiments of the present invention should be interpreted as including all changes or modified forms derived based on the technical idea of ​​the various embodiments of the present invention in addition to the embodiments disclosed herein.

Claims

1. In a wearable electronic device (200), A housing (210) configured to be worn on a user's head; A support plate (220; 420) provided inside the above housing (210); A depth sensor (217; 417) disposed on the above support plate (220; 420) and transmitting and receiving signals; Electronic components (230; 430) placed on the above support plate (220; 420); and A first conductive layer (240; 440) disposed between the electronic component (230; 430) and the support plate (220; 420) and electrically connecting the electronic component (230; 430) to the support plate (220; 420) A wearable electronic device comprising:

2. In paragraph 1, The above electronic components (230; 430) are cover layer (231; 431); and A wearable electronic device comprising a flexible copper clad laminate (FCCL) layer (232; 432) disposed between the cover layer (231; 431) and the first conductive layer (240; 440).

3. In paragraph 1 or 2, The cover layer (231; 431) is exposed on the first side of both sides of the electronic component (230; 430), A wearable electronic device, wherein the FCCL layer (232; 432) is exposed on the second side of the two sides of the electronic component (230; 430).

4. In any one of paragraphs 1 to 3, A wearable electronic device, wherein the FCCL layer (232; 432) is in contact with the first conductive layer (240; 440).

5. In any one of paragraphs 1 to 4, The above electronic components (230; 430) are A wearable electronic device, wherein the depth sensor (217; 417) is disposed on the same surface as the surface of the support plate (220; 420).

6. In paragraph 1 or paragraph 5, A PCB (printed circuit board) (450) provided inside the above housing (210); A shield can (460) placed on the above PCB (450); and A wearable electronic device further comprising a second conductive layer (480) electrically connecting the support plate (420) to the shield can (460).

7. In any one of paragraphs 1 to 6, A wearable electronic device in which the FCCL layer (432) is electrically connected to the shield can (460).

8. In any one of paragraphs 1 to 7, A wearable electronic device, wherein the first conductive layer (240; 440) or the second conductive layer (480) is a conductive double-sided tape.

9. In any one of paragraphs 1 to 8, A wearable electronic device further comprising a support body (470) disposed on the PCB (450) and supporting the support plate (420).

10. In any one of paragraphs 1 to 9, The above support body (470) is a wearable electronic device formed of a non-conductive material.

11. In any one of paragraphs 1 to 10, The above second conductive layer (480) is A first connecting part (481) connected to the above shield can (460); and A wearable electronic device comprising a second connecting part (482) extending from the first connecting part (481) and connected to the support plate (420).

12. In any one of paragraphs 1 to 11, A wearable electronic device in which the first connecting part (481) protrudes from the support plate (420) based on the longitudinal direction of the support plate (420).

13. In any one of paragraphs 1 to 12, A wearable electronic device in which the first connecting part (481) is placed on the opposite side of the PCB (450) with respect to the shield can (460).

14. In any one of paragraphs 1 to 13, The above second connecting part (482) is, A wearable electronic device disposed between the support plate (420) and the support body (470).

15. In any one of paragraphs 1 to 14, A wearable electronic device in which the support body (470) is placed on the same surface as the surface of the PCB (450) on which the shield can (460) is placed.

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