Evaporation unit assembly, heat dissipation apparatus comprisiing same, and electronic device assembly comprising heat dissipation apparatus

Abstract

An evaporation unit assembly, a heat dissipation apparatus comprising same, and an electronic device assembly comprising the heat dissipation device, according to the present invention, are advantageous in that a tubular elastic member provided on the outer circumferential surface of an evaporation unit transferring heat from one surface to the other surface thereof generates an elastic force due to the heat from the evaporation unit so as to move the evaporation unit in the direction of the one surface of the evaporation unit with the elastic force, and thus the evaporation unit is brought into contact with a heating unit of an electronic device due to the elastic force, thereby improving thermal conductivity.

Description

Evaporator assembly and heat dissipation device including the same and electronic device assembly including the heat dissipation device

[0001] The present invention relates to an evaporation assembly and a heat dissipation apparatus including the same, and an electronic device assembly including the heat dissipation apparatus, and more particularly, to an evaporation assembly that comes into contact with a heat generating unit of an electronic device, a heat dissipation apparatus including the same, and an electronic device assembly including the heat dissipation apparatus.

[0002]

[0003] The recent rapid development of Internet and artificial intelligence (AI) technologies has led to data centers processing massive amounts of data and performing complex algorithmic calculations. Consequently, the massive power consumption and heat generation of servers installed in data centers are becoming increasingly serious issues, and the demand for efficient heat dissipation in data centers is growing.

[0004] Typically, electronic devices such as servers include a housing that forms an external shape and a printed circuit board provided inside the housing, and various electronic components such as a GPU and CPU are mounted on the printed circuit board.

[0005] Inside the housing of the electronic device, a heat dissipation device is installed around the electronic component to dissipate heat generated during operation of the electronic component. Typically, air cooling type heat dissipation devices and liquid cooling type heat dissipation devices are known.

[0006] The above air-cooling type heat dissipation device is a heat dissipation device that installs a heat sink and a heat pipe around the electronic component, increases the contact area with air by using a plurality of heat dissipation fins formed on the heat sink, and circulates a refrigerant inside the heat pipe to dissipate heat generated from the electronic component.

[0007] The above liquid cooling type heat dissipation device is a heat dissipation device that installs a water circulation pipe around the electronic component and circulates cold water inside the water circulation pipe to dissipate heat generated from the electronic component.

[0008] Meanwhile, in electronic devices such as servers equipped with many electronic components that generate heat, both the air cooling type heat dissipation device and the liquid cooling type heat dissipation device are installed for rapid heat dissipation.

[0009] For example, Chinese Patent Publication No. CN 115623730 A (January 17, 2023) (hereinafter referred to as “prior art”) discloses a “temperature equalizing plate with built-in water cooling plate for heat dissipation.”

[0010] The above-described prior art comprises a temperature balance plate having a water-cooling plate built in, which is formed by including a water-cooling plate and a phase change chamber, and a water-cooling plate for heat dissipation that is installed inside the phase change chamber, wherein the phase change chamber is a sealed chamber manufactured according to the principle of a heat pipe, wherein the surface wall of the phase change chamber is an evaporation stage, and the surface wall of the water-cooling plate is a condensation stage. Fine heat dissipation sawtooth is processed inside the water-cooling plate to maximize the internal water-cooling heat exchange area, thereby improving heat dissipation efficiency. The joint of the water-cooling plate is integrally processed and molded with a metal material and installed by penetrating the phase change chamber, so that all welding of the water-cooling plate is sealed inside the phase change chamber.

[0011] However, since the conventional technology requires installing a heat dissipation device for each individual electronic component of an electronic device, the number of heat dissipation devices increases, and the structure of the heat pipe is complex due to the heat pipe of each of the plurality of heat dissipation devices, and there is a problem that the contents may leak due to the structure of the complex heat pipe, making it difficult to apply to a data center where a huge number of servers are in operation.

[0012]

[0013] The technical problem of the present invention is to provide an evaporator assembly having improved thermal conductivity by having an evaporator in elastic contact with a heat-generating portion of an electronic device, a heat dissipation device including the evaporator assembly, and an electronic device assembly including the heat dissipation device.

[0014] The technical problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0015]

[0016] To achieve the above-described task, an evaporator assembly according to the present invention comprises an evaporator and a tubular elastic member. The evaporator transfers heat from one surface to the other. The tubular elastic member is installed on the outer circumferential surface of the evaporator. The tubular elastic member generates elastic force due to the heat of the evaporator, thereby moving the evaporator in the direction of the one surface by the elastic force.

[0017] The above evaporator may have one surface formed as a plane, and a plurality of heat dissipation ribs may be formed protruding on the other surface.

[0018] The above evaporator may be formed in a cylindrical shape with an opening on the surface, and the plurality of heat dissipation ribs may be arranged inside the opening.

[0019] The outer surface of the above evaporator may be formed as a sloped surface whose outer diameter becomes smaller as it goes from one surface to the other surface.

[0020] An insertion groove into which one side of the tubular elastic member is inserted may be formed on the outer surface of the above evaporation section.

[0021] A heat dissipation device according to the present invention comprises a heat dissipation housing, a heat exchanger, an evaporator, and a tubular elastic member. A phase-change refrigerant is accommodated inside the heat dissipation housing. The heat exchanger has a plurality of heat exchange tubes. The phase-change refrigerant comes into contact with the outer surfaces of the plurality of heat exchange tubes. A liquid refrigerant flows inside the plurality of heat exchange tubes, and the plurality of heat exchange tubes condense the phase-change refrigerant. The evaporator is disposed on one surface of the heat dissipation housing. The evaporator comes into contact with a heat-generating unit of an electronic device, transferring heat from one surface of the heat-generating unit to the other surface to evaporate the phase-change refrigerant. The tubular elastic member is installed on the outer peripheral surface of the evaporator. The tubular elastic member generates an elastic force due to the heat of the evaporator. The tubular elastic member moves the evaporator toward the one surface of the evaporator by the elastic force, and brings the one surface of the evaporator into close contact with the heat-generating unit by the elastic force.

[0022] An evaporator installation rib may be formed protrudingly on one surface of the above heat dissipation container. An evaporator installation hole into which the outer circumference of the evaporator is inserted may be formed within the evaporator installation rib.

[0023] The outer surface of the above evaporator may be formed as a first inclined surface whose outer diameter decreases from the first surface to the other surface. The inner surface of the evaporator installation hole may be formed as a second inclined surface corresponding to the first inclined surface.

[0024] A first insertion groove may be formed on the outer surface of the evaporator, into which one side of the tubular elastic member is inserted. A second insertion groove may be formed on the inner surface of the evaporator installation hole, into which the other side of the tubular elastic member is inserted.

[0025] A sealing member may be installed at the lower end of the above evaporator. A sealing flange that comes into contact with the lower surface of the evaporator installation rib may be formed on the sealing member.

[0026] A gasket may be installed at the lower end of the above evaporation unit installation rib. The gasket may be in contact with the electronic device to seal the evaporation unit.

[0027] A fastening boss may be formed on the second inclined surface. The fastening boss may be fastened to the first surface of the heat dissipation housing and the electronic device using a bolt or screw.

[0028] A refrigerant receiving groove for receiving the phase-change refrigerant may be formed on the inner surface of the one surface of the heat dissipation container. The evaporator may be installed in the refrigerant receiving groove and protrude outward from the one surface of the heat dissipation container.

[0029] The plurality of heat exchange tubes may have flat surfaces facing each other. The plurality of heat exchange tubes may be arranged diagonally.

[0030] The above plurality of heat exchange tubes may be formed as rectangular tubes. Heat dissipation protrusions may be formed on the outer and inner surfaces of the long sides of the above plurality of heat exchange tubes.

[0031] An electronic device assembly according to the present invention comprises an electronic device and a heat dissipation device. The electronic device has a heat generating unit mounted on a printed circuit board provided therein and exposed to the outside. The heat dissipation device is attached to an outer surface of the electronic device. The heat dissipation device comprises a heat dissipation housing, a heat exchanger, an evaporator, and a tubular elastic member. A phase-change refrigerant is accommodated inside the heat dissipation housing. The heat exchanger has a plurality of heat exchange tubes. The phase-change refrigerant comes into contact with the outside of the plurality of heat exchange tubes. A liquid refrigerant flows inside the plurality of heat exchange tubes, and the plurality of heat exchange tubes condense the phase-change refrigerant. The evaporation unit is disposed on one surface of the heat dissipation housing. The evaporation unit comes into contact with the heat generating unit of the electronic device, transferring heat from one surface of the heat generating unit to the other surface to evaporate the phase-change refrigerant. The tubular elastic member is installed on the outer surface of the evaporator. The tubular elastic member generates elastic force due to the heat from the evaporator. The above tubular elastic member moves the evaporator toward the one side of the evaporator with the elastic force, and brings the one side of the evaporator into close contact with the heating part with the elastic force.

[0032] Specific details of other embodiments are included in the detailed description and drawings.

[0033]

[0034] The evaporator assembly according to the present invention, the heat dissipation device including the same, and the electronic device assembly including the heat dissipation device have the effect of improving thermal conductivity by having the evaporator contact the heat-generating device of the electronic device by the elastic force of the tubular elastic member.

[0035] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0036]

[0037] Figure 1 is a perspective view showing a state in which a heat dissipation device according to an embodiment of the present invention is installed in an electronic device;

[0038] Figure 2 is a bottom perspective view of Figure 1 viewed from the rear.

[0039] Figure 3 is an exploded perspective view of Figure 1;

[0040] Figure 4 is a perspective view of the bottom of Figure 3 and an enlarged view of a portion thereof;

[0041] Figure 5 is a cross-sectional view of Figure 1 and an enlarged view of a portion thereof;

[0042] FIG. 6 is an exploded perspective view showing a heat dissipation device according to an embodiment of the present invention illustrated in FIG. 3;

[0043] Fig. 7 is a drawing showing the lower cover plate shown in Fig. 6;

[0044] Fig. 8 is a bottom perspective view showing the evaporator shown in Fig. 7;

[0045] Figure 9 is a top perspective view of Figure 8;

[0046] Fig. 10 is an exploded perspective view of Fig. 9;

[0047] Fig. 11 is a perspective view showing the gasket illustrated in Fig. 5;

[0048] Fig. 12 is a drawing showing the heat exchanger shown in Fig. 6;

[0049] Figure 13 is a drawing showing the state in which the inlet cover is removed in Figure 12 and an enlarged view of a portion thereof.

[0050] Fig. 14 is a drawing showing the heat exchanger tube illustrated in Fig. 13 and an enlarged view of a portion thereof.

[0051]

[0052] <Explanation of symbols>

[0053] 9: Heat sink 100: Electronic device

[0054] 110: Heating unit 200: Heat dissipation housing

[0055] 212: Evaporator installation rib 213, 313: Insertion groove

[0056] 216: Evaporator installation hole 217, 317: Inclined surface

[0057] 310: Evaporator 315: Heat dissipation rib

[0058] 340: Gasket 350: Tubular elastic member

[0059] 360: Sealing member 400: Heat exchanger

[0060] 410: Heat exchanger tube

[0061]

[0062] Hereinafter, an evaporator assembly according to an embodiment of the present invention, a heat dissipation device including the same, and an electronic device assembly including the heat dissipation device will be described with reference to drawings.

[0063] However, the present invention can be modified in various ways and has various embodiments, and specific embodiments are illustrated in the drawings and described in detail.

[0064] However, this is not intended to limit the present invention to a specific embodiment, and it should be understood that all modifications, equivalents, and alternatives included within the spirit and technical scope of the present invention are included. Similar reference numerals have been used to refer to similar components throughout the description of each drawing.

[0065] When a component is referred to as being "connected" or "coupled" to another component, it should be understood that it may be directly connected or coupled to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "directly coupled" to another component, it should be understood that there are no other components intervening.

[0066] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0067] Hereinafter, the same reference numerals are used for identical components in the drawings, and duplicate descriptions of identical components are omitted.

[0068] FIG. 1 is a perspective view showing a state in which a heat dissipation device according to an embodiment of the present invention is installed in an electronic device, FIG. 2 is a bottom perspective view of FIG. 1 as viewed from the rear, FIG. 3 is an exploded perspective view of FIG. 1, FIG. 4 is a bottom perspective view of FIG. 3 and an enlarged view of a portion thereof, FIG. 5 is a cross-sectional view of FIG. 1 and an enlarged view of a portion thereof, and FIG. 6 is an exploded perspective view showing a heat dissipation device according to an embodiment of the present invention illustrated in FIG. 3.

[0069] Referring to FIGS. 1 to 6, a heat dissipation device (9) according to an embodiment of the present invention can be coupled to an outer surface of an electronic device (100). The heat dissipation device (9) can be coupled to an outer surface of the electronic device (100) to form an electronic device assembly. That is, the electronic device assembly can include a heat dissipation device (9) and an electronic device (100). Here, the electronic device (100) can include a server, a communication device, a lighting device, etc., and preferably, can include all electronic devices (100) having an electronic component, which is a heat generating unit (110), therein.

[0070] That is, the electronic device (100) may have a printed circuit board (PCB) provided within the housing, and a heating unit (110) may be mounted on the printed circuit board. A hole may be formed in a portion corresponding to the heating unit in the housing of the electronic device (100), so that the heating unit (110) may be exposed to the outside of the housing of the electronic device (100) through the hole. The heating unit (110) may include a CPU, a GPU, etc., but is not limited thereto and may include all electronic components that generate heat.

[0071] Since the heat generating unit (110) and the heat dissipation device (9) are not placed inside the electronic device (100) but are placed outside the electronic device (100), the degree of design freedom for the internal design of the electronic device (100) can be greatly increased. For example, if the electronic device (100) is a server, the heat generating unit (110) such as a CPU or GPU is placed outside the housing of the electronic device (100) and exposed, so that the inside of the housing of the electronic device (100) can be freely designed with a circuit that can satisfy the performance of the electronic device (100), and the heat dissipation function of the electronic device (100) can be solved by the heat dissipation device (9) placed outside the electronic device (100).

[0072] Specifically, the heat dissipation device (9) according to the embodiment of the present invention may include a heat dissipation body (200) and a heat exchanger (400).

[0073] A phase-change refrigerant can be accommodated inside the heat-radiating body (200). The heat-radiating body (200) can have a sealed space inside that can accommodate the phase-change refrigerant. The heat-radiating body (200) can be formed in a roughly rectangular shape, and can be modified into various shapes.

[0074] The heat dissipation body (200) is formed as a separate body from the heat exchanger (400), so that the heat exchanger (400) can be accommodated in the internal space of the heat generating body (200).

[0075] However, in the present embodiment, the heat dissipation housing (200) may share the lower cover plate (210), the first side cover (230), and the second side cover (240) with the heat exchanger (400). That is, the heat dissipation housing (200) may include, in addition to the lower cover plate (210), the first side cover (230), and the second side cover (240), an upper cover plate (220) that is coupled to the upper surfaces of the first side cover (230) and the second side cover (240) of the heat exchanger (400) to cover the opened upper side of the heat exchanger (400). Here, the lower cover plate (210), the first side cover (230), and the second side cover (240) may be formed integrally by die-casting. In addition, the lower cover plate (210) can form one side of the heat dissipation body (200) facing the electronic device (100), and the upper cover plate (220) can form the other side of the heat dissipation body (200).

[0076] The above-mentioned phase-change refrigerant may be a refrigerant composed of an organic compound, which is a low-temperature phase-change material used in air conditioners, refrigerators, etc., and may preferably be a refrigerant composed of HFC (Hydro Fluoro Carbon), R22, R410A, R290, R134a, R32 (CH2F2), and mixtures thereof. That is, the above-mentioned phase-change refrigerant may be a refrigerant having a boiling point lower than that of water.

[0077] The heat exchanger (400) may have a plurality of heat exchange tubes (410). The plurality of heat exchange tubes (410) are arranged within the heat dissipation housing (200), and the phase change refrigerant may come into contact with the outer surfaces of the plurality of heat exchange tubes (410). The liquid refrigerant may flow within the plurality of heat exchange tubes (410), and the plurality of heat exchange tubes (410) may condense the phase change refrigerant.

[0078] Here, the liquid refrigerant may be water. That is, the liquid refrigerant may be formed of water having a higher boiling point than the phase change refrigerant.

[0079] The plurality of heat exchange tubes (410) may be formed of SUS (Steel Use Stainless), a material including stainless steel. When the material of the plurality of heat exchange tubes (410) is formed of SUS, the liquid refrigerant circulating inside the plurality of heat exchange tubes (410) may be formed of water. Here, the water may include any one of natural water, distilled water, pure water, and ultrapure water. When the liquid refrigerant is formed of water in this way, the price is very low and there are advantages in that no environmental problems occur even when the refrigerant leaks.

[0080] An electronic device (100) may include a rectangular housing forming an external shape and a heating unit (110) mounted on a printed circuit board provided within the housing. The heating unit (110) may be exposed to the outside of the housing through a hole formed in the upper surface of the housing, which is a surface facing the heat dissipation device (9).

[0081] The heating unit (110) may be composed of a plurality of heating units (110). In the present embodiment, the plurality of heating units (110) may be arranged in two rows and four columns, resulting in a total of eight heating units (110). Eight holes may be formed on the upper surface of the housing of the electronic device (100) through which eight heating units (110) are each exposed.

[0082] An evaporator (310) may be arranged on the lower surface, which is one surface facing the electronic device (100), of the heat dissipation housing (200). The evaporator (310) may be in contact with the heating unit (110) of the electronic device (100) to receive heat from the heating unit (110), and may evaporate the phase-change refrigerant provided therein by the heat received from the heating unit (110). That is, the evaporator (310) may transfer the heat of the heating unit (110) from one surface to the other surface to evaporate the phase-change refrigerant. The evaporator (310) may include a copper material, which is a material with good thermal conductivity.

[0083] The evaporator (310) may be formed in a position and number corresponding to the heating unit (110). That is, the evaporator (310) may be composed of a plurality of evaporator units (310). In the present embodiment, the plurality of evaporator units (310) may be arranged in two rows and four columns, resulting in a total of eight evaporator units (310).

[0084] FIG. 7 is a drawing showing the lower cover plate shown in FIG. 6, FIG. 8 is a bottom perspective view showing the evaporator shown in FIG. 7, FIG. 9 is a top perspective view of FIG. 8, FIG. 10 is an exploded perspective view of FIG. 9, and FIG. 11 is a perspective view showing the gasket shown in FIG. 5.

[0085] Referring to FIGS. 5 to 11, a refrigerant receiving groove (215) for receiving the phase-change refrigerant may be formed on the inner surface of the lower side, which is the one side of the heat dissipation housing (200). The evaporator (310) may be installed in the refrigerant receiving groove (215) and may be arranged to protrude outward from the lower side, which is the one side of the heat dissipation housing (200). In the present embodiment, the refrigerant receiving groove (215) is formed in the central portion of the lower cover plate (210) forming the lower side of the heat dissipation housing (200), but this is because the evaporator (310) is installed in the central portion of the lower cover plate (210). That is, even if the refrigerant receiving groove (215) is not in the central portion of the lower cover plate (210), it is preferable that it be formed in the portion of the lower cover plate (210) where the evaporator (310) is installed.

[0086] As described above, since a refrigerant receiving groove (215) is formed in the portion of the heat dissipation body (200) where the evaporation unit (310) is installed, the refrigerant for phase change that has undergone a phase change and has been condensed inside the heat dissipation body (200) can be collected in the refrigerant receiving groove (215), and the thermal conductivity of heat transferred from the heating unit (110) of the electronic device (100) to the evaporation unit (310) can be made equal.

[0087] The refrigerant receiving groove (215) may include a first refrigerant receiving groove (215A) and a second refrigerant receiving groove (215B). The first refrigerant receiving groove (215A) and the second refrigerant receiving groove (215B) may be arranged to be spaced apart from each other in the longitudinal direction of the lower cover plate (210) at the center of the lower cover plate (210). Among the plurality of evaporators (310) arranged in two rows and four columns, four evaporators (310) arranged in the first row may be installed in the first refrigerant receiving groove (215A) and may be arranged to protrude downwardly from the lower cover plate (210). In addition, among the plurality of evaporators (310) arranged in the second row may be installed in the second refrigerant receiving groove (215B) and may be arranged to protrude downwardly from the lower cover plate (210).

[0088] An evaporator assembly according to an embodiment of the present invention may include an evaporator (310) that transfers heat from one surface, i.e., a lower surface, to the other surface, i.e., an upper surface, a tubular elastic member (350) installed on the outer surface of the evaporator (310), and a sealing member (360).

[0089] The tubular elastic member (350) may be formed of a rubber material having elasticity. The tubular elastic member (350) may be installed on the outer surface of the evaporator (310) and may function to seal the internal space of the heat dissipation housing (200). In addition, the internal air of the tubular elastic member (350) may expand due to the heat of the evaporator (310). That is, the heat transferred from the heating unit (110) of the electronic device (100) to the evaporation unit (310) can be transferred to the tubular elastic member (350), and accordingly, the internal air of the tubular elastic member (350) expands due to the heat, and the tubular elastic member (350) generates elastic force to become taut, so that the evaporation unit (310) can be pushed out by a predetermined pressure due to the elastic force, and the evaporation unit (310) can come into contact with the heating unit (110) of the electronic device (100) by the predetermined pressure pushed out by the tubular elastic member (350).

[0090] In other words, the tubular elastic member (350) generates elastic force by the heat of the evaporator (310), moves the evaporator (310) in a downward direction, which is one side of the evaporator (310), by the elastic force, and can bring the lower surface, which is one side of the evaporator (310), into close contact with the heating unit (110) of the electronic device (100) by the elastic force. Accordingly, the heat conductivity transferred from the heating unit (110) of the electronic device (100) to the evaporator (310) can be improved.

[0091] The evaporator (310) may have a lower surface that is in contact with the heating element (110) of the electronic device (100) formed as a flat surface. In addition, a plurality of heat dissipation ribs (315) may be formed to protrude on the upper surface, which is the other surface of the evaporator (310).

[0092] However, in the present embodiment, the evaporator (310) may be formed in a cylindrical shape with an open upper surface, which is the other surface. That is, the evaporator (310) may be formed in a cylindrical shape with an open upper surface. A plurality of heat dissipation ribs (315) may be arranged inside the opening of the evaporator (310). The refrigerant that has been condensed through heat exchange with the heat exchange tube (410) of the heat exchanger (400) within the heat dissipation housing (200) may be introduced into the opening formed on the upper surface, which is the other surface, of the evaporator (310) and may be evaporated through heat exchange with the plurality of heat dissipation ribs (315).

[0093] A plurality of heat dissipation ribs (315) may be formed in various shapes to increase the contact area with the phase change refrigerant provided inside the heat dissipation housing (200). The plurality of heat dissipation ribs (315) may be formed in an arc shape and arranged radially. The plurality of heat dissipation ribs (315) may be formed such that their circumferential lengths become longer from the center of the evaporator (310) toward the radially outer side of the evaporator (310).

[0094] The outer surface of the evaporator (310) may be formed as an inclined surface (hereinafter referred to as a first inclined surface (317)) whose outer diameter becomes smaller as it goes from one surface to the other surface.

[0095] An insertion groove (hereinafter referred to as a first insertion groove (313)) into which one side of a tubular elastic member (350) is inserted may be formed on the outer surface of the evaporator (310).

[0096] An evaporator installation hole (216) may be formed in the lower cover plate (210) forming the lower side of the heat dissipation body (200). Specifically, an evaporator installation rib (212) may be formed protrudingly in the lower side of the heat dissipation body (200), and an evaporator installation hole (216) may be formed so as to be open vertically within the evaporator installation rib (212). The outer circumferential surface of the evaporator (310) may be inserted into the evaporator installation hole (216).

[0097] The inner surface of the evaporator installation hole (216) can be formed as a second inclined surface (217) corresponding to the first inclined surface (317) formed on the outer surface of the evaporator (310).

[0098] A second insertion groove (213) into which the other side of the tubular elastic member (350) is inserted can be formed on the inner surface of the evaporation unit installation hole (216).

[0099] The sealing member (360) may be formed in a shape that supports the lower edge of the evaporator (310) and surrounds the outer peripheral surface of the lower portion of the evaporator (310). In addition, a sealing flange that comes into contact with the lower surface of the evaporator installation rib (212) may be formed on the outer peripheral surface of the sealing member (360). The sealing flange may seal the lower portion between the outer peripheral surface of the evaporator (310) and the inner peripheral surface of the evaporator installation rib (212).

[0100] A gasket (340) may be installed at the bottom of the evaporation unit installation rib (212). The gasket (340) may be in contact with the electronic device (100) to seal the evaporation unit (310). That is, the gasket (340) may be installed at the bottom edge of the evaporation unit installation rib (212) to be in contact with the outer surface of the housing of the electronic device (100) to block the inner space between the electronic device (100) and the heat dissipation housing (200) from external air.

[0101] The evaporator installation rib (212) and gasket (340) may be formed in an approximately square ring shape. A ring-shaped coupling groove may be formed on the upper surface of the gasket (340), and a ring-shaped coupling protrusion may be formed on the lower surface of the evaporator installation rib (212) to be inserted into and coupled to the ring-shaped coupling groove. By inserting the ring-shaped coupling protrusion into the ring-shaped coupling groove, the gasket (340) may be installed on the lower edge of the evaporator installation rib (212).

[0102] Accordingly, since the evaporator (310) is blocked from the outside air by the gasket (340), the heat generated in the heating unit (110) of the electronic device (100) can be easily transferred to the evaporator (310), and through this, the evaporator (310) can evaporate the phase-change refrigerant within the heat-radiating body (200) using the heat of the heating unit (110).

[0103] A fastening boss (325) may be formed on the lower surface of the lower cover plate (210) forming the lower side, which is the one side of the heat dissipation body (200). The evaporation unit installation rib (212) may be formed in an approximately rectangular shape, and the fastening bosses (325) may be formed to protrude downward, one by one, on the lower surface of the four corners of the second inclined surface (217) formed on the inner side of the evaporation unit installation rib (212), so that a total of four fastening bosses (325) may be formed.

[0104] The fastening boss (325) may be fastened to the lower side of the heat dissipation housing (200) and the printed circuit board provided inside the housing of the electronic device (100) via a bolt or a screw. For example, the bolt or the screw may be fastened to the printed circuit board by sequentially passing through the lower side of the heat dissipation housing (200) and the fastening boss (325). Alternatively, the bolt or the screw may be fastened to the lower side of the heat dissipation housing (200) by sequentially passing through the printed circuit board and the fastening boss (325).

[0105] Alternatively, the fastening boss (325) may be fastened to the lower side of the one side of the heat dissipation housing (200) and the upper side of the housing of the electronic device (100) via a bolt or a screw. For example, the bolt or the screw may be fastened to the upper side of the housing of the electronic device (100) by passing through the lower side of the heat dissipation housing (200) and the fastening boss (325) in sequence. Alternatively, the bolt or the screw may be fastened to the lower side of the heat dissipation housing (200) by passing through the upper side of the housing of the electronic device (100) and the fastening boss (325) in sequence.

[0106] Fig. 12 is a drawing showing the heat exchanger shown in Fig. 6, Fig. 13 is a drawing showing the state in which the inlet cover is removed in Fig. 12 and an enlarged view of a part thereof, and Fig. 14 is a drawing showing the heat exchanger tube shown in Fig. 13 and an enlarged view of a part thereof.

[0107] Referring to FIGS. 12 to 14, the heat exchanger (400) may include a plurality of heat exchange tubes (410), an inlet tube (420), and an outlet tube (430).

[0108] A liquid refrigerant may flow inside a plurality of heat exchange tubes (410). The liquid refrigerant flowing inside the plurality of heat exchange tubes (410) may exchange heat with the phase-change refrigerant inside the heat dissipation body (200) to condense the phase-change refrigerant.

[0109] The plurality of heat exchange tubes (410) may include a plurality of first heat exchange tubes (410A) that are arranged diagonally but spaced apart from each other from the longitudinal center of the heat exchanger (400) to one side, and a plurality of second heat exchange tubes (410B) that are arranged diagonally but spaced apart from each other from the longitudinal center of the heat exchanger (400) to the other side, and are arranged diagonally in the opposite direction to the plurality of first heat exchange tubes (410A).

[0110] An inlet pipe (440) into which the liquid refrigerant is introduced may be arranged in the inlet pipe (420).

[0111] The outlet pipe (430) may be positioned opposite to the inlet pipe (420). The outlet pipe (430) may be formed to have the same shape and size as the inlet pipe (420). The outlet pipe (430) may be connected to the inlet pipe (420) through a plurality of heat exchange pipes (410). An outlet pipe (450) through which the liquid refrigerant flows out may be positioned in the outlet pipe (430).

[0112] The above liquid refrigerant may flow into the inside of the inlet tube (420) through the inlet pipe (440), then flow into the inside of the outlet tube (430) through a plurality of heat exchange tubes (410) inside the inlet tube (420), and then flow into the liquid refrigerant cooling device (not shown) through the outlet tube (450) inside the outlet tube (430).

[0113] The inlet tube (420) may include an inlet tube cover (421) and an inlet tube body (422). The inlet tube body (422) may have an outer surface opposite to the surface facing the outlet tube (430) formed as an open surface, and the inlet tube cover (421) may cover the open surface of the inlet tube body (422). The inlet tube body (422) may have a plurality of insertion holes (423) formed into which one end of a plurality of heat exchange tubes (410) are each inserted.

[0114] The outlet tube (430) may be formed with the same structure as the inlet tube (420). That is, the outlet tube (430) may include an outlet tube cover having a shape corresponding to the inlet tube cover (421) and an outlet tube body having a shape corresponding to the inlet tube body (422). The outlet tube body may have an outer surface opposite to the surface facing the inlet tube (420) formed as an opening surface, and the outlet tube cover may cover the opening surface of the outlet tube body. Similarly to the fact that the inlet tube body (422) is formed with a plurality of insertion holes (423) into which one end of a plurality of heat exchange tubes (410) are each inserted, the outlet tube body may be formed with insertion holes into which the other end of a plurality of heat exchange tubes (410) are inserted.

[0115] The longitudinal direction of the plurality of heat exchange tubes (410) may be orthogonal to the longitudinal direction of the inlet tube (440) and the longitudinal direction of the outlet tube (450). The inlet of the inlet tube (440) and the outlet of the outlet tube (450) may be positioned in the same direction.

[0116] The plurality of heat exchange tubes (410) may be formed as rectangular tubes. The cross-sectional shape of the plurality of heat exchange tubes (410) may be formed as a rectangle in which the long sides are straight and the short sides are also straight. However, the corner portion where the long sides and the short sides meet may be formed as a round shape that is convex outward. Here, the long sides may be portions that form mutually opposing flat portions, and the short sides may also be portions that form mutually opposing flat portions. That is, the plurality of heat exchange tubes (410) may have mutually opposing flat portions.

[0117] In this way, when a plurality of heat exchange tubes (410) are formed in a rectangular shape, the time for the refrigerant condensed on the outer surface of the plurality of heat exchange tubes (410) to fall into the heat dissipation body (200) can be shortened compared to when they are formed in a circular shape.

[0118] In addition, the plurality of heat exchange tubes (410) may be arranged diagonally rather than vertically. When the plurality of heat exchange tubes (410) are arranged diagonally, the flow of the phase-change refrigerant within the heat dissipation housing (200) can move more smoothly between the plurality of heat exchange tubes (410) compared to when the plurality of heat exchange tubes (410) are arranged vertically.

[0119] That is, when a plurality of heat exchange tubes (410) formed in a rectangular shape are arranged vertically, the refrigerant condensed in the heat exchange tube (410) arranged at the upper side falls and stays on the upper surface of the heat exchange tube (410) arranged at the lower side, but when a plurality of heat exchange tubes (410) formed in a rectangular shape are arranged diagonally, the refrigerant condensed in the heat exchange tube (410) arranged at the upper side falls on the upper surface of the heat exchange tube (410) arranged at the lower side and falls in a diagonal direction, so that the flow of the refrigerant can be made smooth.

[0120] Meanwhile, a plurality of heat dissipation grooves (413) may be formed on the outer surface of each of the plurality of heat exchange tubes (410) and spaced apart from each other in the longitudinal direction of each of the plurality of heat exchange tubes (410). The plurality of heat dissipation grooves (413) may extend in a direction perpendicular to the longitudinal direction of each of the plurality of heat exchange tubes (410). A heat dissipation protrusion (414) may be formed between the plurality of heat dissipation grooves (413). The heat dissipation protrusions (414) may be formed one by one between the plurality of heat dissipation grooves (413). The heat dissipation protrusions (414) may be formed in a shape corresponding to the plurality of heat dissipation grooves (413). The plurality of heat dissipation grooves (413) are formed on the outer surface of the long sides of each of the plurality of heat exchange tubes (410) so that the contact area with the phase change refrigerant can be secured to the maximum extent.

[0121] In addition, a plurality of heat dissipation protrusions (415) may be formed on the inner surface of each of the plurality of heat exchange tubes (410) and arranged to be spaced apart from each other in the vertical direction. The plurality of heat exchange protrusions (415) may extend in the longitudinal direction of each of the plurality of heat exchange tubes (410). The plurality of heat dissipation protrusions (415) may be formed from one longitudinal end of each of the plurality of heat exchange tubes (410) to the other longitudinal end. The plurality of heat dissipation protrusions (415) may be formed on the inner surface of the long side of each of the plurality of heat exchange tubes (410) so that the contact area with the liquid refrigerant may be secured to the maximum extent.

[0122]

[0123] Meanwhile, in order to flow the liquid refrigerant through the inlet pipe (440) and the outlet pipe (450), a power source such as a pump (not shown) is required. According to an embodiment of the present invention, when the electronic device (100) is a server installed in a data center, the additional energy input excluding the energy for operating the pump (not shown) can be significantly reduced, thereby providing an advantage in lowering the power usage effectiveness (PUE) of the data center.

[0124]

[0125] As described above, the evaporator assembly according to the embodiment of the present invention, the heat dissipation device including the same, and the electronic device assembly including the heat dissipation device can improve the thermal conductivity by having the evaporator (310) contact the heat generating device (110) of the electronic device (100) by the elastic force of the tubular elastic member (350).

[0126] In addition, the heat dissipation device (9) according to the embodiment of the present invention can be provided as a body and installed on the outside of the electronic device (100), and can simultaneously dissipate heat generated from a plurality of electronic components of the electronic device (100).

[0127]

[0128] Those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential characteristics thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims that follow rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

[0129]

[0130] The present invention provides an evaporator assembly having improved thermal conductivity by elastically contacting an evaporator with a heat-generating portion of an electronic device, a heat dissipation device including the same, and an electronic device assembly including the heat dissipation device.

Claims

1. An evaporator that transfers heat from one side to the other; and An evaporator assembly comprising a tubular elastic member installed on the outer surface of the evaporator and generating elastic force by the heat of the evaporator to move the evaporator in the one-sided direction by the elastic force.

2. In claim 1, The above evaporator assembly is an evaporator assembly in which one surface is formed as a plane and a plurality of heat dissipation ribs are protrudingly formed on the other surface.

3. In claim 2, The above evaporation part is formed in a cylinder shape with the other surface open, An evaporator assembly in which the plurality of heat dissipation ribs are arranged inside the opening.

4. In claim 1, An evaporator assembly in which the outer surface of the above evaporator is formed as a sloped surface whose outer diameter becomes smaller as it goes from one surface to the other surface.

5. In claim 1, An evaporator assembly in which an insertion groove is formed on the outer surface of the evaporator into which one side of the tubular elastic member is inserted.

6. A heat-insulating container containing a refrigerant for phase change; and A heat exchanger having a plurality of heat exchange tubes in which the phase change refrigerant is in contact with the outer surface and the liquid refrigerant flows inside to condense the phase change refrigerant; An evaporator arranged on one side of the heat dissipation housing and in contact with a heating part of an electronic device to transfer heat from one side of the heating part to the other side to evaporate the refrigerant for phase change; and A heat dissipation device comprising a tubular elastic member installed on the outer surface of the evaporator, which generates elastic force by the heat of the evaporator, moves the evaporator in the direction of the one side of the evaporator with the elastic force, and brings the one side of the evaporator into close contact with the heat generating part with the elastic force.

7. In claim 6, An evaporation installation rib is formed protrudingly on one side of the above heat dissipation container, A heat dissipation device in which an evaporation unit installation hole is formed within the above evaporation unit installation rib into which the outer surface of the evaporation unit is inserted.

8. In claim 7, The outer surface of the above evaporator is formed as a first inclined surface whose outer diameter becomes smaller as it goes from the one surface to the other surface, A heat dissipation device in which the inner surface of the above evaporation unit installation hole is formed as a second inclined surface corresponding to the first inclined surface.

9. In claim 7, A first insertion groove is formed on the outer surface of the above evaporator into which one side of the above tubular elastic member is inserted, A heat dissipation device in which a second insertion groove is formed on the inner surface of the above evaporation unit installation hole into which the other side of the above tubular elastic member is inserted.

10. In claim 7, A heat dissipation device further comprising a sealing member installed at the lower end of the evaporator and having a sealing flange formed in contact with the lower surface of the evaporator installation rib.

11. In claim 7, A heat dissipation device further comprising a gasket installed at the lower end of the evaporation unit installation rib and in contact with the electronic device to seal the evaporation unit.

12. In claim 8, A heat dissipation device in which a fastening boss is formed on the second inclined surface to be fastened to the first surface of the heat dissipation body and the electronic device via a bolt or screw.

13. In claim 6, A refrigerant receiving groove for receiving the phase change refrigerant is formed on the inner surface of the one side of the above heat dissipation container, A heat dissipation device in which the above evaporator is installed in the refrigerant receiving groove and protrudes outward from the one side of the heat dissipation container.

14. In claim 6, A heat dissipation device in which the above plurality of heat exchange tubes have flat surfaces facing each other and are arranged diagonally.

15. In claim 14, The above plurality of heat exchange tubes are formed into rectangular tubes, A heat dissipation device in which heat dissipation projections are formed on the outer and inner surfaces of the long sides of the plurality of heat exchange tubes.

16. Electronic devices with a heating element mounted on a printed circuit board provided internally and exposed to the outside; and A heat dissipation device coupled to the outer surface of the electronic device; The above heat dissipation device, A heat-insulating body containing a phase-change refrigerant therein; and A heat exchanger having a plurality of heat exchange tubes in which the phase change refrigerant is in contact with the outer surface and the liquid refrigerant flows inside to condense the phase change refrigerant; An evaporator disposed on one side of the heat-radiating body, in contact with the heating unit, and transferring heat from the heating unit from one side to the other side to evaporate the phase-change refrigerant; and An electronic device assembly comprising a tubular elastic member installed on the outer surface of the evaporator, generating elastic force by the heat of the evaporator, moving the evaporator in the direction of the one side of the evaporator with the elastic force, and bringing the one side of the evaporator into close contact with the heating part with the elastic force.

Images