Magnetic read-write apparatus, and magnetic head and manufacturing method therefor

Abstract

The embodiments of the present application relate to the technical field of magnetic read-write. Disclosed are a magnetic read-write apparatus, and a magnetic head and a manufacturing method therefor, which mitigate the problem of the overall performance of the magnetic head being limited due to a low magnetic permeability of an existing magnetic yoke. The magnetic head comprises a coil and a magnetic yoke, and the magnetic yoke comprises a soft magnetic sheet and a magnetic head body. The magnetic permeability of the soft magnetic sheet is higher than 3000. Moreover, the soft magnetic sheet is bonded or adhered to the magnetic head body. The soft magnetic sheet with a high magnetic permeability is used as at least a part of the magnetic yoke or a part of a magnetic shielding layer, thereby improving the magnetic permeability or magnetic shielding capability of the magnetic yoke, and improving the overall performance of the magnetic head. Moreover, the magnetic head does not have the problem whereby metal lines in the magnetic head are seriously diffused to fail due to integral annealing after the entire soft magnetic material layer is connected to other film layers or components in the magnetic head.

Description

Magnetic read-write device, magnetic head and manufacturing method thereof

[0001] The present application claims priority to the Chinese patent application No. 202411113869.7, filed on August 13, 2024, and entitled "Magnetic read-write device, magnetic head and manufacturing method thereof", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of magnetic read-write, and in particular to a magnetic read-write device, a magnetic head and a manufacturing method thereof. BACKGROUND

[0003] In recent years, magnetic recording media have been widely used in electronic data backup devices. The magnetic recording media can be magnetic tapes, magnetic disks or magnetic cards, etc. The magnetic recording media tape needs a special magnetic read-write device to perform read-write operation to realize the recording and reading of electronic data. Taking a magnetic tape as an example, the device for reading and writing the magnetic tape can be a magnetic tape player.

[0004] Among them, the magnetic head is one of the key components that affect the performance of the magnetic read-write device. At present, the magnetic yoke in some magnetic heads includes a soft magnetic material layer, which is manufactured by semiconductor processes such as physical vapor deposition or electroplating. However, the magnetic permeability of the manufactured soft magnetic material layer is 10 2 orders of magnitude, which cannot meet the requirement of high magnetic permeability and limits the overall performance of the magnetic head. SUMMARY

[0005] The present application provides a magnetic read-write device, a magnetic head and a manufacturing method thereof, which solves the problem that the low magnetic permeability of the existing magnetic yoke limits the overall performance of the magnetic head.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] In a first aspect, embodiments of the present application provide a magnetic head, which can be used as a servo write head, a servo read head, a data write head, or a data read head. The magnetic head includes a magnetic head body and a soft magnetic sheet. The magnetic head body can include all components of the magnetic head except the soft magnetic sheet, such as a soft magnetic structure, a coil, a write gap, a separation film layer, and the like. The soft magnetic sheet has a magnetic permeability greater than 3000, and is bonded or adhered to the magnetic head body. Therefore, the soft magnetic sheet with high magnetic permeability in the magnetic head can replace at least part of the soft magnetic material in the original magnetic yoke (or magnetic shielding layer), and the soft magnetic sheet can improve the magnetic permeability of the magnetic yoke (shielding effect of the magnetic field shielding layer), so that the overall performance of the magnetic head is stronger. The soft magnetic sheet can replace at least part of the thickness (or part of the area) of the soft magnetic material layer formed by physical vapor deposition or electroplating and the like semiconductor process. Before being bonded or adhered to other film layers in the magnetic head, the soft magnetic sheet of the present example has been pretreated (such as pre-annealing) to improve the magnetic permeability (or magnetic shielding ability). Therefore, the magnetic head of the present example does not have the problem of serious diffusion of metal lines in the magnetic head caused by the whole annealing after connecting the soft magnetic material layer to other film layers or components in the magnetic head.

[0008] Based on this, in some embodiments of the present application, the soft magnetic sheet is a soft magnetic foil that is pretreated by an annealing process and has a magnetic permeability greater than 3000. In addition, the soft magnetic sheet can specifically use a nickel-iron (NiFe) mixed material. The soft magnetic sheet after pre-annealing treatment has low internal stress and is not prone to warping after being connected to the film layers in the magnetic head body.

[0009] It should be noted that the soft magnetic sheet and the magnetic head body can be bonded at room temperature, or can be bonded at high temperature (high temperature refers to a bonding temperature range of 300-400°C). Alternatively, the soft magnetic sheet can be adhered to the magnetic head body by using adhesive, and the connection operation is simple. The soft magnetic sheet after pre-annealing treatment has low internal stress and is not prone to warping after being connected to the film layers in the magnetic head body.

[0010] In addition, in some embodiments, the surface of the soft magnetic sheet can be a polished surface, such as a surface roughness of the soft magnetic sheet being less than 10 nm. Specifically, one or both surfaces of the soft magnetic sheet can be subjected to chemical polishing or physical and mechanical polishing treatment, so that the surface roughness of one surface or both surfaces of the soft magnetic sheet is less than 10 nm. Based on this, in one embodiment, the surface roughness of one surface or both surfaces of the soft magnetic sheet is less than 3 nm.

[0011] In addition, in order to bond the soft magnetic sheet with the film layer of different material in the head body, the head further comprises a seed layer arranged between the head body and the soft magnetic sheet in some embodiments of the present application. The soft magnetic sheet is bonded with the head body through the seed layer. Even if the film layer of the head body bonded with the soft magnetic sheet is made of non-metallic material, the soft magnetic sheet can be bonded with the film layer of the head body through the seed layer.

[0012] Therefore, the head can be applied to various magnetic read-write devices. For different magnetic read-write devices, different structures of the head are required. Correspondingly, the structure of the head body is also different.

[0013] In some embodiments, the head body comprises a soft magnetic structure, one side surface of the soft magnetic structure is connected with one side surface of the soft magnetic sheet by bonding or adhesion. The soft magnetic structure and the soft magnetic sheet are combined as a magnetic yoke of the head, so that the application range of the head is wider.

[0014] For the head of centimeter or millimeter semi-thin film structure, the soft magnetic structure is a soft magnetic material block bonded or adhered with the soft magnetic sheet. Therefore, the head of the embodiments of the present application can be a head of centimeter or millimeter semi-thin film structure, which can be used as a servo write head or a servo read head.

[0015] For the head of chip level, the soft magnetic structure is a soft magnetic material layer which can be bonded with the soft magnetic sheet. Therefore, the head of the embodiments of the present application can be a head of which all structures except the soft magnetic sheet are thin film structures, which can also be used as a servo write head or a servo read head.

[0016] In addition, in some other embodiments of the present application, the head body comprises an isolation layer and a soft magnetic structure, the soft magnetic structure can be diffractionally arranged on the side wall of the isolation layer in the circumferential direction. The soft magnetic sheet is bonded with the upper surface of the soft magnetic structure and the upper surface of the isolation layer. The soft magnetic structure can be a soft magnetic material layer. The head can be used as a data write head. Based on this, the soft magnetic structure can also cover the lower surface of the isolation layer or the upper surface of the soft magnetic sheet, which is not limited in the present application.

[0017] The head of the present application can adopt other structures in addition to the above structure when used as a data writing head. In some embodiments, the head body comprises a substrate, an isolation layer and a soft magnetic structure. The substrate can serve as a support structure. The isolation layer, the soft magnetic structure and the soft magnetic sheet are all arranged on the substrate. The soft magnetic sheet is bonded to the upper surface of the substrate. The isolation layer is arranged on the upper surface of the soft magnetic sheet. The soft magnetic structure can be a soft magnetic material layer. The soft magnetic structure can be circumferentially arranged outside the side wall of the isolation layer. In addition to the soft magnetic sheet between the lower surface of the isolation layer and the substrate, the soft magnetic structure can also be included, which is not limited in the present application. The upper surface of the isolation layer can be bonded to another soft magnetic sheet, or a soft magnetic structure can be arranged, or a laminated combination of soft magnetic structure and soft magnetic sheet can be arranged.

[0018] In other embodiments, the head body comprises an isolation layer and a soft magnetic structure. The soft magnetic structure can be a soft magnetic material layer. The soft magnetic structure can be circumferentially arranged outside the side wall of the isolation layer. In addition, the soft magnetic structure can be laminated above the isolation layer, or laminated below the isolation layer, or laminated above and below the isolation layer. The soft magnetic sheet can be bonded to the upper surface of part of the soft magnetic structure above or below the isolation layer. That is, either the upper surface of the isolation layer or the lower surface of the isolation layer can be laminated with a soft magnetic sheet and part of the soft magnetic structure below the soft magnetic sheet.

[0019] In addition, in some other embodiments of the present application, the head body comprises a magnetic transducer, a first spacer layer and a second spacer layer. The first spacer layer is laminated on the upper surface of the magnetic transducer. The second spacer layer is laminated on the lower surface of the magnetic transducer. The above-mentioned soft magnetic sheet is two, one soft magnetic sheet is bonded to the upper surface of the first spacer layer, and the other soft magnetic sheet is laminated on the lower surface of the second spacer layer. That is, the above-mentioned structure of the head can be used as a data reading head.

[0020] In addition, as a data reading head, the head body of the head of the present application can also adopt other structures. In some embodiments, the above-mentioned head body comprises a magnetic transducer, a first spacer layer, a second spacer layer and a soft magnetic structure. The first spacer layer is laminated on the upper surface of the magnetic transducer. The second spacer layer is laminated on the lower surface of the magnetic transducer. The soft magnetic sheet is bonded to the upper surface of the first spacer layer. The soft magnetic structure can be a soft magnetic material layer. The soft magnetic structure can be laminated on the lower surface of the second spacer layer. In addition, the soft magnetic structure can also be laminated on the upper surface of the soft magnetic sheet, which is not limited in the present application. In addition, other soft magnetic sheets can also be laminated below the second spacer layer, which is also not limited in the present application.

[0021] In some other embodiments, the head body includes a substrate, a magnetic transducer, a first spacer layer, a second spacer layer, and a soft magnetic structure. The substrate can serve as a support structure. The magnetic transducer, the first spacer layer, the second spacer layer, and the soft magnetic structure are disposed on the substrate. The soft magnetic sheet is bonded to an upper surface of the substrate. The first spacer layer is disposed on an upper surface of the magnetic transducer. The second spacer layer is disposed between an upper surface of the soft magnetic sheet and a lower surface of the magnetic transducer. The soft magnetic structure can be a soft magnetic material layer. The soft magnetic structure can be disposed on the first spacer layer, or disposed between the first spacer layer and the soft magnetic sheet. An additional soft magnetic sheet can be disposed on the first spacer layer, which is not limited in the present application.

[0022] In some other embodiments, the head body includes a magnetic transducer, a first spacer layer, a second spacer layer, and a soft magnetic structure. The first spacer layer is disposed on an upper surface of the magnetic transducer. The second spacer layer is disposed on a lower surface of the magnetic transducer. The soft magnetic structure can be a soft magnetic material layer. The soft magnetic structure can be disposed on the first spacer layer, or disposed under the first spacer layer, or disposed on and under the first spacer layer. A soft magnetic sheet is bonded to an upper surface of a portion of the soft magnetic structure that is disposed on or under the first spacer layer, which is not limited in the present application. That is, at least one of the first spacer layer and the first spacer layer under is disposed with the soft magnetic structure and a soft magnetic sheet that is bonded to an upper surface of the soft magnetic structure.

[0023] In a second aspect, the embodiments of the present application further include a method for manufacturing a magnetic head. The method includes the following steps: obtaining a soft magnetic sheet with a magnetic permeability greater than 3000; and bonding or adhering the soft magnetic sheet to a head body. Thus, the magnetic head described in the above embodiments can be obtained.

[0024] In some embodiments of the present application, the soft magnetic sheet with a magnetic permeability greater than 3000 is obtained by annealing the soft magnetic sheet. The internal stress of the soft magnetic sheet after the pre-annealing process is relatively low, and the soft magnetic sheet is less likely to warp after being connected to other film layers in the magnetic head.

[0025] In addition, in some embodiments of the present application, after the soft magnetic sheet is annealed to obtain a soft magnetic sheet with a magnetic permeability greater than 3000, the soft magnetic sheet with a magnetic permeability greater than 3000 is obtained by polishing the surface of the soft magnetic sheet to obtain a soft magnetic sheet with a magnetic permeability greater than 3000 and a surface roughness less than 10 nm. For example, the surface of the soft magnetic sheet can be polished by chemical polishing or physical and mechanical polishing. Thus, the bonding strength of the soft magnetic sheet and the head body can be improved, and / or the wear of the magnetic tape when the soft magnetic sheet contacts the magnetic tape can be reduced.

[0026] In some embodiments, the bonding or adhering the soft magnetic sheet to the head body includes forming a seed layer on the head body. The soft magnetic sheet is bonded to the head body through the seed layer. Therefore, the soft magnetic sheet can be bonded to the non-metallic film layer in the head body.

[0027] In some embodiments, the head body includes a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body includes bonding or adhering one side surface of the soft magnetic sheet to one side surface of the soft magnetic structure. The method can be used to manufacture a semi-thin film structure head, such as a servo write head and a servo read head, with a size of centimeter or millimeter.

[0028] In some other embodiments, the head body includes an isolation layer and a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body includes forming the soft magnetic structure and the isolation layer, and bonding the soft magnetic sheet to the upper surface of the soft magnetic structure and the upper surface of the isolation layer. The soft magnetic structure is at least circumferentially arranged outside the side wall of the isolation layer. The method can be used to manufacture a data write head with a structure.

[0029] In some other embodiments, the head body includes a substrate, an isolation layer and a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body includes obtaining the substrate, bonding the soft magnetic sheet to the upper surface of the substrate, and forming the isolation layer and the soft magnetic structure on the upper surface of the soft magnetic sheet. The soft magnetic structure is at least circumferentially arranged outside the side wall of the isolation layer. The method can be used to manufacture a data write head with another structure.

[0030] In some other embodiments, the head body includes an isolation layer and a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body includes forming the soft magnetic structure and the isolation layer, and bonding the soft magnetic sheet to the upper surface of the soft magnetic structure. The soft magnetic structure is at least circumferentially arranged outside the side wall of the isolation layer, and is arranged above or below the isolation layer. The method can be used to manufacture a data write head with another structure.

[0031] In order to manufacture a data read head, in some embodiments, the head body includes a magnetic transducer, a first spacer layer and a second spacer layer. The head includes two soft magnetic sheets with a magnetic permeability greater than 3000. In the method of obtaining the soft magnetic sheet with a magnetic permeability greater than 3000, two soft magnetic sheets with a magnetic permeability greater than 3000 are obtained. The bonding or adhering the soft magnetic sheet to the head body includes sequentially forming the second spacer layer, the magnetic transducer and the first spacer layer on the upper surface of one soft magnetic sheet, and bonding the other soft magnetic sheet to the upper surface of the first spacer layer. The method can be used to manufacture a data read head with a structure.

[0032] In some other embodiments of the present application, the head body comprises a magnetic transducer, a first spacer layer, a second spacer layer and a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the magnetic transducer, the first spacer layer, the second spacer layer and the soft magnetic structure, and bonding the soft magnetic sheet to the upper surface of the first spacer layer. The first spacer layer is stacked on the upper surface of the magnetic transducer, the second spacer layer is stacked on the lower surface of the magnetic transducer, and the soft magnetic structure is stacked on at least the lower surface of the second spacer layer. The method can be used to manufacture another structure of data reading head.

[0033] In some other embodiments of the present application, the head body comprises a substrate, a magnetic transducer, a first spacer layer, a second spacer layer and a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body specifically comprises: obtaining the substrate, bonding the soft magnetic sheet to the upper surface of the substrate, forming the second spacer layer, the magnetic transducer, the first spacer layer and the soft magnetic structure on the upper surface of the soft magnetic sheet, wherein the first spacer layer is stacked on the upper surface of the magnetic transducer, and the second spacer layer is stacked on the lower surface of the magnetic transducer. The soft magnetic structure is stacked on at least the upper surface of the first spacer layer. The method can be used to manufacture another structure of data reading head.

[0034] In some other embodiments of the present application, the head body comprises a magnetic transducer, a first spacer layer, a second spacer layer and a soft magnetic structure. The bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the magnetic transducer, the first spacer layer, the second spacer layer and the soft magnetic structure, and bonding the soft magnetic sheet to the upper surface of the soft magnetic structure. The first spacer layer is stacked on the upper surface of the magnetic transducer, and the second spacer layer is stacked on the lower surface of the magnetic transducer. The soft magnetic structure is stacked on at least one of the upper surface of the first spacer layer and the lower surface of the second spacer layer. The method can be used to manufacture another structure of data reading head.

[0035] In a third aspect, the embodiments of the present application further provide a magnetic reading and writing device, which comprises a shell and the magnetic head described in the above embodiments. The magnetic head is mounted on the shell. Since the magnetic head in the magnetic reading and writing device of the embodiments of the present application has the same structure as the magnetic head described in the above embodiments, both can solve the same technical problems and obtain the same technical effects, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments of the present application will be described below.

[0037] FIG. 1 is a schematic diagram of the three-dimensional structure of the magnetic tape machine of the embodiments of the present application;

[0038] FIG. 2 is a schematic diagram of the structure of the internal parts of the magnetic tape machine of the embodiments of the present application;

[0039] Fig. 3 is a sectional view of a magnetic head according to an embodiment of the present application;

[0040] Figs. 4(a) and (b) are sectional views of a magnetic head according to the embodiment of the present application, showing the steps of a manufacturing method therefor;

[0041] Fig. 5 is a sectional view of a first magnetic head according to Example 1, having a soft magnetic material block and a seed layer;

[0042] Fig. 6 is a sectional view of a second magnetic head according to Example 1, having a soft magnetic material block;

[0043] Fig. 7 is a sectional view of a third magnetic head according to Example 1, having a write gap;

[0044] Fig. 8 is a perspective view of the third magnetic head according to Example 1, having a soft magnetic material layer;

[0045] Fig. 9 is a sectional view of the third magnetic head according to Example 1, having a soft magnetic material layer and a seed layer;

[0046] Figs. 10(a), (b), (c), (d), and (e) are sectional views of a first magnetic head according to Example 2, showing the steps of a manufacturing method therefor;

[0047] Figs. 11(a), (b), (c), and (d) are sectional views of a third magnetic head according to Example 2, showing the steps of a manufacturing method therefor;

[0048] Fig. 12 is a sectional view of a first magnetic head according to Example 3;

[0049] Fig. 13 is a sectional view of a second magnetic head according to Example 3;

[0050] Fig. 14 is a sectional view of a third magnetic head according to Example 3;

[0051] Fig. 15 is a sectional view of a fourth magnetic head according to Example 3;

[0052] Figs. 16(a), (b), (c), and (d) are sectional views of a magnetic head according to Example 4, showing the steps of a manufacturing method therefor;

[0053] Figs. 17(a), (b), (c), (d), and (e) are sectional views of a magnetic head according to Example 5, showing the steps of a manufacturing method therefor;

[0054] Figs. 18(a), (b), (c), and (d) are sectional views of a magnetic head according to Example 6, showing the steps of a manufacturing method therefor;

[0055] Fig. 19 is a sectional view of a first magnetic head according to Example 7;

[0056] Fig. 20 is a sectional view of a second magnetic head according to Example 7;

[0057] Fig. 21 is a cross-sectional schematic view of a third magnetic head in Example 7;

[0058] Fig. 22 is a cross-sectional schematic view of a fourth magnetic head in Example 7;

[0059] Fig. 23 is a cross-sectional schematic view of a fifth magnetic head in Example 7;

[0060] Figs. 24(a), (b), (c) are schematic structural views of respective steps in a manufacturing method of a magnetic head in Example 8;

[0061] Figs. 25(a), (b) are schematic structural views of respective steps of S503 in the manufacturing method of the magnetic head in Example 8;

[0062] Figs. 26(a), (b), (c) are schematic structural views of respective steps in a manufacturing method of a magnetic head in Example 9;

[0063] Figs. 27(a), (b) are schematic structural views of respective steps in a manufacturing method of a magnetic head in Example 10;

[0064] Figs. 28(a), (b) are schematic structural views of respective steps in a manufacturing method of a magnetic head in Example 11.

[0065] Reference signs: 1000 - tape drive; 100 - housing; 101 - accommodating cavity; 200 - magnetic head; 1 / 1a / 1b - soft magnetic sheet; 11a - first surface; 11b - second surface; 2 - soft magnetic structure; 2a - soft magnetic material block; 2b - soft magnetic material layer; 3 - seed layer; 4 - substrate; 10a - coil; 20a - magnetic yoke; 201 - winding slot; 2011 - non-magnetic material; 30a - isolation layer; 40a - write gap; 10b - magnetic transducer; 20b - first spacer layer; S1 - metal material layer; S2 - insulating material layer; 30b - second spacer layer; 40b - first magnetic field shielding layer; 50b - second magnetic field shielding layer; 60b - bias layer; 70b - insulating layer; 400 - unwinding wheel; 500 - guide wheel; 600 - winding wheel. DETAILED DESCRIPTION

[0066] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0067] Hereinafter, the terms "first", "second", and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0068] In addition, in the present application, the orientation terms such as "upper", "lower", "left", "right", "horizontal" and "vertical" are defined relative to the orientation in which the components in the drawings are shown, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation in which the components in the drawings are placed.

[0069] In the present application, unless otherwise explicitly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can refer to mechanical connection, physical connection. It can be fixed connection, or detachable connection, or integral; it can be directly connected, or indirectly connected through an intermediate medium. It can also be understood as physical contact and electrical conduction of components, or as a form of connection between different components in the circuit structure through the entity circuit of PCB copper foil or wire that can transmit electrical signals.

[0070] The present application provides a magnetic read-write device, which can include a magnetic tape drive, a magnetic tape recorder, a magnetic tape player, a disk drive, etc. with the function of reading data from a magnetic recording medium and / or writing data into a magnetic recording medium. The specific form of the magnetic read-write device in the embodiments of the present application is not specially limited. For the convenience of description, the electronic device is mainly taken as a tape machine as shown in FIG. 1 for example.

[0071] Referring to FIGS. 1 and 2, the tape machine 1000 of the embodiments of the present application includes a housing 100 and a magnetic head 200, and the housing 100 is formed with a receiving cavity 101 for placing a magnetic tape. The magnetic head 200 is installed in the housing 100 and can read or write the magnetic tape placed in the receiving cavity 101. The tape machine can also include other components, such as the tape machine 1000 in FIG. 2 also shows a pay-off reel 400, a plurality of guide wheels 500 and a take-up reel 600 (the arrow in FIG. 2 shows the rotation direction of the pay-off reel 400 and the take-up reel 600), and the functions of these components are known technologies, which will not be described in detail here.

[0072] Among them, the magnetic head 200 is one of the key parts of the tape machine 1000, which affects the overall performance of the tape machine 1000. However, in some magnetic heads, the yoke is an integral soft magnetic material layer formed by physical vapor deposition or electroplating semiconductor process. However, the magnetic permeability of the soft magnetic material layer is 102 level, which cannot meet the requirement of high magnetic permeability, limiting the overall performance of the magnetic head 200.

[0073] Therefore, the magnetic head 200 with improved structure is proposed in the embodiments of the present application to improve the overall performance of the magnetic head 200. Referring to FIG. 3, the magnetic head 200 of the embodiments of the present application includes a soft magnetic sheet 1 and a magnetic head body 200S.

[0074] The soft magnetic sheet 1 has a magnetic permeability greater than 3000. In an example, the soft magnetic foil is pre-processed by an annealing process to obtain the soft magnetic sheet 1 having a magnetic permeability greater than 3000. In addition, the soft magnetic foil can specifically be made of a nickel-iron (NiFe) mixed material. In the nickel-iron (NiFe) mixed material, the mass ratio of nickel to iron can be 45:55 or 80:20, which is not limited in the present application.

[0075] The soft magnetic sheet 1 and the head body 200S are connected by bonding or adhesion. The soft magnetic sheet 1 can be used as at least part of a magnetic yoke or a partial shielding film layer in the head 200. The head body 200S can include all components in the head 200 except the soft magnetic sheet 1, such as a remaining magnetic yoke (or a remaining shielding film layer), a coil, a write gap, an isolation film layer, and the like.

[0076] Therefore, the soft magnetic sheet 1 with high magnetic permeability in the head 200 of the present example can replace at least part of the soft magnetic material of the magnetic yoke (or the shielding film layer) in the head 200. The soft magnetic sheet 1 can improve the magnetic permeability of the magnetic yoke 20a (or the magnetic shielding capability of the shielding film layer), so that the overall performance of the head 200 is stronger. In addition, the soft magnetic sheet 1 can replace at least part of the thickness (or part of the area) of the soft magnetic material layer formed by a semiconductor process such as physical vapor deposition or electroplating. Before being bonded or adhered to other film layers in the head 200, the soft magnetic sheet 1 of the present example has been pre-processed (such as pre-annealing) to improve the magnetic permeability (or the magnetic shielding capability). Therefore, the head 200 of the present example does not have the problem that the soft magnetic material layer is connected to other film layers or components in the head 200 and then the whole is annealed, which causes the metal lines in the head 200 to be severely diffused and fail.

[0077] Based on the structure of the head 200, the surface of the soft magnetic sheet 1 of the present embodiment can be a polished surface, such as a surface roughness of the soft magnetic sheet 1 being less than 10 nm. Specifically, one or both surfaces of the soft magnetic sheet 1 are chemically polished or physically and mechanically polished to have a surface roughness of less than 10 nm.

[0078] It can be understood that the surface roughness of the side surface of the soft magnetic sheet 1 bonded to the head body 200S is less than 10 nm, which can improve the bonding strength of the soft magnetic sheet 1 and the head body 200S. The side surface of the soft magnetic sheet 1 away from the head body 200S can be used to contact the magnetic tape. The surface roughness of this surface is less than 10 nm, which can reduce the wear of the magnetic tape when the soft magnetic sheet 1 contacts the magnetic tape.

[0079] In some embodiments of the present application, the surface roughness of the side surface of the soft magnetic sheet 1 bonded with the head body 200S is less than 3 nm, and the bonding strength between the soft magnetic sheet 1 and the head body 200S is strong. The surface roughness of the side surface of the soft magnetic sheet 1 away from the head body 200S is also less than 3 nm, which can reduce the wear of the magnetic tape when the soft magnetic sheet 1 contacts the magnetic tape.

[0080] In addition, considering that the material (such as a non-magnetic material or a non-metallic material) of the film layer bonded with the soft magnetic sheet 1 on the head body 200S cannot be directly bonded with the soft magnetic sheet 1, in some embodiments of the present example, the head 200 further includes a seed layer 3 as shown in FIG. 3, and the soft magnetic sheet 1 can be bonded with the film layer of different materials on the head body 200S through the seed layer 3. The seed layer 3 can be formed on the surface of the head body 200S by a sputtering process. The material of the seed layer 3 can be the same as that of the soft magnetic sheet 1, such as a nickel-iron (NiFe) mixture, or other metal materials, which are not limited in the present application.

[0081] Based on the structure of the head 200, the head 200 can be manufactured by the following manufacturing method. In some embodiments of the present application, the manufacturing method of the head 200 includes the following steps:

[0082] S1000: obtaining a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0083] In some embodiments, the S101 can be specifically: annealing the soft magnetic sheet 1 to obtain a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0084] In some embodiments, after the soft magnetic sheet 1 is annealed, the S1000 further includes: polishing the surface of the soft magnetic sheet 1 to obtain a soft magnetic sheet 1 with a magnetic permeability greater than 3000 and a surface roughness less than 10 nm. For example, one side surface or both side surfaces of the soft magnetic sheet 1 can be polished by chemical polishing or physical and mechanical polishing to obtain a soft magnetic sheet 1 with a magnetic permeability greater than 3000 and a surface roughness less than 10 nm.

[0085] S2000: bonding or adhering the soft magnetic sheet 1 with the head body 200S.

[0086] In some embodiments, the soft magnetic sheet 1 can be directly bonded with the head body 200S. The bonding method can be room temperature bonding or high temperature bonding. In the present application, the high temperature bonding refers to a bonding temperature range of 300-400°C. Alternatively, the soft magnetic sheet 1 and the head body 200S can be adhered by using an adhesive.

[0087] Based on the above method, the material that can be used for the film layer bonded with the soft magnetic sheet 1 on the head body 200S is a non-magnetic material or a non-metal material. Therefore, in some embodiments of the present application, as shown in FIG. 4, the above S2000 specifically includes:

[0088] S2001: forming a seed layer 3 on the head body 200S.

[0089] In some embodiments, as shown in (a) of FIG. 4, the seed layer 3 is formed on the head body 200S by a sputtering process.

[0090] S2002: the soft magnetic sheet 1 is bonded with the head body 200S through the seed layer 3.

[0091] In some embodiments, as shown in (b) of FIG. 4, the soft magnetic sheet 1 is bonded with the head body 200S through the seed layer 3, so as to bond the soft magnetic sheet 1 with the non-magnetic material film layer or the non-metal film layer on the head body 200S.

[0092] Based on the structure and manufacturing method of the head 200, the head 200 of the embodiments of the present application can be used as a servo write head, a servo read head, a data write head, or a data read head. The head 200 of the embodiments of the present application and the manufacturing method thereof will be further described in combination with specific embodiments as follows.

[0093] Example 1

[0094] The present example is a head 200. Referring to FIG. 5, the head 200 in the present example includes a coil 10a and a magnetic yoke 20a, and the coil 10a can be wound on the magnetic yoke 20a. The coil 10a can be a metal wire made of a metal material such as copper or gold. The magnetic yoke 20a includes a soft magnetic sheet 1 and a soft magnetic structure 2. The coil 10a can be wound on the soft magnetic sheet 1, or can be wound on the soft magnetic structure 2, or can be wound on both the soft magnetic sheet 1 and the soft magnetic structure 2. The present application does not limit this. The coil 10a shown in FIG. 5 can be wound on the soft magnetic structure 2.

[0095] The soft magnetic sheet in the present example is the soft magnetic sheet described in the above embodiments, i.e., the magnetic permeability of the soft magnetic sheet 1 is greater than 3000, and can also be obtained by pre-treatment through an annealing process.

[0096] In addition, the above soft magnetic sheet 1 can be bonded with the soft magnetic structure 2, and can be bonded in a normal temperature bonding mode or in a high temperature bonding mode. Alternatively, the soft magnetic sheet 1 can be bonded with the soft magnetic structure 2 in a glue bonding mode, and the connection operation is simple.

[0097] The magnetic head 200 of the present example adopts a soft magnetic sheet 1 with high magnetic permeability as part of the soft magnetic material of the magnetic yoke 20a, which can increase the magnetic permeability of the magnetic yoke 20a, so that the overall performance of the magnetic head 200 is stronger. Moreover, compared with the magnetic yoke 20a formed by combining a soft magnetic material layer and a soft magnetic structure by semiconductor processes such as physical vapor deposition or electroplating, the soft magnetic sheet 1 of the present example has been pretreated (e.g., pre-annealed) to increase the magnetic permeability before being bonded or adhered to the soft magnetic structure 2 in the magnetic head body 200S. Therefore, the magnetic head 200 of the present example does not have the problem of the entire soft magnetic material layer being bonded to the soft magnetic structure 2 in the magnetic head body 200S and then being annealed as a whole, which can cause the metal lines in the magnetic head 200 to diffuse severely and fail. Moreover, the soft magnetic sheet 1 after the pre-annealing treatment has low internal stress and is less likely to warp after being connected to the soft magnetic structure 2.

[0098] Moreover, referring to FIG. 5, the thickness D of the soft magnetic sheet 1 is in the range of 1 μm to 20 μm to ensure that the overall magnetic permeability of the magnetic yoke 20a is high. In some embodiments of the present example, the thickness D of the soft magnetic sheet 1 is specifically in the range of 2 μm to 5 μm.

[0099] In addition, in the present example, the side surface of the soft magnetic sheet 1 bonded to the soft magnetic structure 2 is referred to as the first surface 11a, and the side surface of the soft magnetic sheet 1 away from the soft magnetic structure 2 is referred to as the second surface 11b. The second surface 11b can be used to contact the magnetic tape. Both the first surface 11a of the soft magnetic sheet 1 and the second surface 11b of the soft magnetic sheet 1 can be polished surfaces, such as the surface roughness of the first surface 11a and the surface roughness of the second surface 11b, which can be less than 10 nm. In some embodiments, the surface roughness of the first surface 11a is less than 3 nm, and the bonding strength of the soft magnetic sheet 1 to the soft magnetic structure 2 is strong. The surface roughness of the second surface 11b is also less than 3 nm, so that the soft magnetic sheet 1 has less wear on the magnetic tape when it contacts the magnetic tape.

[0100] Based on the structure of the magnetic head 200 described above, in some embodiments of the present example, as shown in FIGS. 5 and 6, the soft magnetic structure 2 is a soft magnetic material block 2a. Therefore, the magnetic head 200 of the present example can be a centimeter or millimeter level semi-thin film structure magnetic head 200, which can be used as a servo write head or a servo read head. In the two magnetic heads 200 shown in FIGS. 5 and 6, some of the structures such as the coil 10a are slightly different.

[0101] Moreover, the soft magnetic sheet 1 can be bonded to the soft magnetic material block 2a or adhered to the soft magnetic material block 2a. It should be noted that the soft magnetic material block 2a described above can be a soft magnetic material such as ferrite, silicon steel, nickel-iron (NiFe) mixture, etc., which is not limited in the present application.

[0102] As shown in FIG. 6, the soft magnetic material block 2a can be provided with a winding slot 201, and the coil 10a can pass through the winding slot 201 and be arranged on the soft magnetic material block 2a. According to the position of the winding slot 201, if the soft magnetic sheet 1 needs to be bonded or bonded to the surface of the soft magnetic material block 2a provided with the winding slot 201, the winding slot 201 can be filled with a non-magnetic material 2011 such as glass or ceramic. At this time, the soft magnetic sheet 1 is bonded to the surface of the soft magnetic material block 2a provided with the winding slot 201 and the surface of the non-magnetic material 2011 at the slot opening to support the soft magnetic sheet 1, which is not limited in the present application.

[0103] It should be noted that in some embodiments, the non-magnetic material 2011 used in the winding slot 201 cannot be directly bonded to the soft magnetic sheet 1, so in some embodiments of the present example, the magnetic head 200 further comprises a seed layer 3 as shown in FIG. 5, and the soft magnetic sheet 1 can be bonded to the surface of the soft magnetic material block 2a provided with the winding slot 201 and the surface of the non-magnetic material 2011 at the slot opening through the seed layer 3. The seed layer 3 can be formed on the surface of the non-magnetic material 2011 at the slot opening and the surface of the soft magnetic material block 2a provided with the winding slot 201 by a sputtering process. The material of the seed layer 3 can be the same as that of the soft magnetic sheet 1, such as a nickel-iron (NiFe) mixture, or other metal materials, which are not limited in the present application.

[0104] In addition, if the magnetic head 200 with the soft magnetic material block 2a of the present example is a servo write magnetic head, the yoke 20a is further formed with a write gap 40a as shown in FIG. 7 to realize the write function of the magnetic head 200. The write gap 40a of the magnetic head 200 is a key parameter in the design of the magnetic head, which can directly affect the servo signal write accuracy of the magnetic head 200. The design of the write gap 40a of the magnetic head 200 involves many aspects, including the thickness and shape of the write gap 40a, which together affect the density and signal to interference plus noise ratio (SNR) of the servo signal recording. In the magnetic head 200 of the present example, the width B of the write gap 40a is in the range of 0.3 μm-3 μm to ensure the write accuracy. In addition, the write gap 40a can be filled with a non-magnetic material.

[0105] In some embodiments of the present example, the write gap 40a can be formed on the soft magnetic sheet 1 by ion beam etching (in combination with semiconductor film layer manufacturing process). In addition, the width B of the write gap 40a is in the range of 0.7 μm-1.5 μm to make the write accuracy of the magnetic head 200 higher.

[0106] Therefore, for the magnetic head 200 with the soft magnetic material block 2a, the magnetic head body 200S can include the soft magnetic material block 2a, the coil 10a, the winding slot 201, the non-magnetic material 2011 in the winding slot 201, the write gap 40a, and the like in the magnetic head 200 except the soft magnetic sheet 1. In addition, the magnetic head body 200S can further include other film layer structures, such as other non-magnetic film layers formed on the side surface of the soft magnetic sheet 1 away from the soft magnetic material block 2a, which are not limited in the present application.

[0107] The above is the description of the soft magnetic structure 2 as the soft magnetic material block 2a in the present example. Referring to FIGS. 8 and 9, the soft magnetic structure 2 in the present example can also be a soft magnetic material layer 2b, which is deposited by sputtering, evaporation, electroplating, or the like, and prepared by photolithography, etching, or the like. Therefore, the magnetic head 200 of the present example can be a magnetic head 200 with all the components except the soft magnetic sheet 1 in a thin film structure, which can also be used as a servo write head or a servo read head. In addition, the soft magnetic sheet 1 can be bonded with the soft magnetic material layer 2b. It should be noted that the soft magnetic material layer 2b can also be a nickel-iron NiFe mixed material (for example, the mass fraction ratio of nickel to iron in the nickel-iron NiFe mixed material can be 45:55, or 80:20), which is not limited in the present application.

[0108] As shown in FIG. 9, the soft magnetic material layer 2b can be provided with (e.g., prepared by photolithography, etching, or the like) the winding slot 201 in the present example. The coil 10a can be deposited by sputtering, evaporation, electroplating, or the like, and prepared by photolithography, etching, or the like, and passes through the winding slot 201 and is wound on the soft magnetic material layer 2b.

[0109] In addition, according to the position of the winding slot 201, if the soft magnetic sheet 1 needs to be bonded with the surface of the soft magnetic material layer 2b provided with the winding slot 201, as shown in FIG. 9, the non-magnetic material 2011 can be filled in the winding slot 201 to support the soft magnetic sheet 1, which is not limited in the present application. For example, the non-magnetic material 2011 is aluminum oxide Al2O3, silicon dioxide SiO2, silicon nitride SiN, or a high polymer material, or the like. The aluminum oxide Al2O3, the silicon dioxide SiO2, and the silicon nitride SiN can be filled in the winding slot 201 by sputtering, evaporation, chemical vapor deposition, or the like. The high polymer material can be filled in the winding slot 201 by uniform coating process or curing process.

[0110] It should be noted that in some embodiments, the non-magnetic material 2011 used in the winding slot 201 cannot be directly bonded with the soft magnetic sheet 1, so in some embodiments of the present example, the magnetic head 200 further comprises a seed layer 3 as shown in FIG. 9, and the soft magnetic sheet 1 can be bonded with the surface of the non-magnetic material 2011 at the slot opening, and the surface of the soft magnetic material layer 2b provided with the winding slot 201 through the seed layer 3. The seed layer 3 can be formed on the surface of the non-magnetic material 2011 in the winding slot 201 and the surface of the soft magnetic material layer 2b provided with the winding slot 201 by a sputtering process. The material of the seed layer 3 can be the same as that of the soft magnetic sheet 1, such as a nickel-iron (NiFe) mixture, or other metal materials, which are not limited in the present application.

[0111] Similarly, if the magnetic head 200 with the soft magnetic material layer 2b of the present example is a servo write magnetic head, a write gap 40a is also formed on the magnetic yoke 20a to realize the servo signal writing function of the magnetic head 200. The width B of the write gap 40a can be the same as that of the above-mentioned embodiments, which will not be described here. In addition, the write gap 40a can also be filled with non-magnetic material.

[0112] Therefore, for the magnetic head 200 with the soft magnetic material layer 2b described above, the magnetic head body 200S can include the soft magnetic material layer 2b, the coil 10a, the winding slot 201, the non-magnetic material 2011 in the winding slot 201, the write gap 40a, etc. in the magnetic head 200 described above except the soft magnetic sheet 1. In addition, the magnetic head 200 of the present example can also include other film layer structures, such as other non-magnetic film layers formed on the side surface of the soft magnetic sheet 1 away from the soft magnetic material layer 2b, which are not limited in the present application.

[0113] Example 2

[0114] The present example is a manufacturing method of the magnetic head 200 in example 1. The manufacturing method comprises:

[0115] S101: obtaining a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0116] In some embodiments, S101 can be performed by the same process steps as S1000 described above, which will not be repeated here.

[0117] S102: bonding or adhering one side surface of the soft magnetic sheet 1 with one side surface of the soft magnetic structure 2.

[0118] For the embodiment in which the soft magnetic structure 2 is a soft magnetic material block 2a, in some embodiments of the present example, S102 can specifically comprise:

[0119] S1021a: obtaining a soft magnetic material block 2a, and forming a winding slot 201 on the soft magnetic material block 2a.

[0120] In some embodiments, as shown in (a) of FIG. 10, winding slots 201 can be formed on soft magnetic material block 2a by machining.

[0121] S1022a: winding coil 10a on soft magnetic material block 2a through winding slots 201.

[0122] In some embodiments, as shown in (b) of FIG. 10, metal wires can be wound on soft magnetic material block 2a through winding slots 201 to form coil 10a.

[0123] S1023a: filling non-magnetic material 2011 in winding slots 201.

[0124] In some embodiments, as shown in (c) of FIG. 10, non-magnetic material 2011 can be filled in part of winding slots 201, so that the surface of non-magnetic material 2011 can be flush with the surface of part of the slot opening of winding slots 201. If the surface of soft magnetic material block 2a where winding slots 201 are located is not the bonding surface of soft magnetic sheet 1, this step can be omitted.

[0125] S1024a: bonding or adhering soft magnetic sheet 1 to soft magnetic material block 2a.

[0126] If the surface of soft magnetic material block 2a where winding slots 201 are located is not the bonding surface of soft magnetic sheet 1, S1024a can be performed before S1022a. Soft magnetic sheet 1 can be directly bonded to soft magnetic material block 2a. The bonding method can be room temperature bonding or high temperature bonding. Alternatively, soft magnetic sheet 1 and soft magnetic material block 2a can be adhered by using an adhesive.

[0127] If the surface of soft magnetic material block 2a where winding slots 201 are located is the bonding surface of soft magnetic sheet 1, S1024a can specifically include:

[0128] S10241a: forming seed layer 3 on the surface of winding slots 201 and the surface of non-magnetic material 2011 on soft magnetic material block 2a.

[0129] In some embodiments, as shown in (d) of FIG. 10, seed layer 3 can be formed on the surface of winding slots 201 and the surface of non-magnetic material 2011 on soft magnetic material block 2a by sputtering process. Seed layer 3 can be a metal layer or a nickel-iron material layer to bond with soft magnetic sheet 1.

[0130] S10242a: bonding soft magnetic sheet 1 to the surface of winding slots 201 and the surface of non-magnetic material 2011 on soft magnetic material block 2a through seed layer 3.

[0131] In some embodiments, as shown in (e) of FIG. 10, the soft magnetic sheet 1 can be bonded to the surface of the soft magnetic material block 2a on which the winding slot 201 is formed and the surface of the non-magnetic material 2011 through the seed layer 3.

[0132] However, for the embodiment in which the soft magnetic structure 2 is the soft magnetic material layer 2b, in some implementations of the present example, S102 can specifically include:

[0133] S1021b: forming the soft magnetic material layer 2b and the coil 10a.

[0134] In some embodiments, as shown in (a) of FIG. 11, the soft magnetic material layer 2b and the coil 10a can be formed through semiconductor processes, including but not limited to patterning processes such as photolithography, etching, etc., and deposition processes such as sputtering, evaporation, electroplating, etc.

[0135] In addition, when forming the coil 10a, the winding slot 201 can be formed on the soft magnetic material layer 2b through semiconductor processes such as chemical etching, etching, etc. Part of the coil 10a is located in the winding slot 201. The position of the winding slot 201 will affect the process flow. If the surface on which the winding slot 201 is located is not the bonding surface of the soft magnetic sheet 1 or the supporting surface of other film layers, it is not necessary to fill materials in the winding slot 201. If the surface on which the winding slot 201 is located is the bonding surface of the soft magnetic sheet 1 or the supporting surface of other film layers, it is necessary to fill the non-magnetic material 2011 in the winding slot 201, so that the surface of the non-magnetic material 2011 can be flush with the surface on which at least part of the slot of the winding slot 201 is located, to support the soft magnetic sheet 1.

[0136] S1022b: bonding the soft magnetic sheet 1 to the soft magnetic material layer 2b.

[0137] In this case, if the surface on which the winding slot 201 is located on the soft magnetic material layer 2b is not the bonding surface of the soft magnetic sheet 1, the soft magnetic sheet 1 can be directly bonded to the soft magnetic material layer 2b.

[0138] For the embodiment in which the surface on which the winding slot 201 is located on the soft magnetic material layer 2b is the bonding surface of the soft magnetic sheet 1, S1022b can specifically include:

[0139] S10221b: forming the seed layer 3 on the surface of the winding slot 201 and the surface of the non-magnetic material 2011 on the soft magnetic material layer 2b.

[0140] In some embodiments, as shown in (b) of FIG. 11, the seed layer 3 is formed on the surface of the winding slot 201 and the surface of the non-magnetic material 2011 on the soft magnetic material layer 2b. The seed layer 3 can be a metal layer or a nickel-iron material layer, to facilitate bonding with the soft magnetic sheet 1.

[0141] S10222b: Bond the soft magnetic sheet 1 to the surface of the soft magnetic material layer 2b on which the winding slot 201 is formed and the surface of the non-magnetic material 2011 through the seed layer 3.

[0142] In some embodiments, as shown in (c) of FIG. 11, the soft magnetic sheet 1 can be bonded to the surface of the soft magnetic material layer 2b on which the winding slot 201 is formed and the surface of the non-magnetic material 2011 through the seed layer 3.

[0143] In addition, after the above S102, the manufacturing method of the magnetic head 200 of the present example can further include:

[0144] S103: Forming the write gap 40a on the soft magnetic sheet 1.

[0145] As shown in (d) of FIG. 11, the write gap 40a can be formed on the soft magnetic sheet 1 through semiconductor processes such as photolithography, etching, stripping, etc. The write gap 40a can also be filled with non-magnetic material through deposition processes, etc.

[0146] Example 3

[0147] The present example is a magnetic head 200, which can be used as a data write head. Referring to FIG. 12, the magnetic head 200 of the present example includes a coil 10a, a magnetic yoke 20a and an isolation layer 30a. The coil 10a can be a metal wire made of metal materials such as copper, gold, etc. The coil 10a is arranged in the isolation layer 30a and around the magnetic yoke 20a. The isolation layer 30a can be made of non-magnetic and non-conductive materials such as aluminum oxide, silicon oxide, silicon nitride or high polymer materials, etc. The magnetic yoke 20a includes a soft magnetic sheet 1 and a soft magnetic structure 2. The number of the soft magnetic sheet 1 can be one, two or more, which is not limited in the present application. The soft magnetic structure 2 can be a soft magnetic material layer 2b. The number of the soft magnetic material layer 2b in the soft magnetic structure 2 can be one, two or more, which is not limited in the present application. The soft magnetic material layer 2b in the soft magnetic structure 2 is at least in the same layer as the isolation layer 30a and around the side wall of the isolation layer 30a.

[0148] In addition, the soft magnetic sheet 1 can be bonded to the film layer located in the lower layer thereof. The physical parameters (such as permeability, thickness, surface roughness, etc.), processing technology, materials and connection methods of the soft magnetic sheet 1 of the present example can be the same as those of the soft magnetic sheet of Example 1, which will not be repeated here. The manufacturing process and materials of the soft magnetic material layer 2b are also the same as those of the soft magnetic material layer 2b of Example 1, which will not be repeated here.

[0149] Therefore, the magnetic head 200 of the present example employs the soft magnetic sheet 1 having high magnetic permeability as at least a part of the soft magnetic material of the magnetic yoke 20a, and the same technical effects as those of Example 1 can be obtained, and thus detailed description thereof will not be given herein.

[0150] Note that the magnetic head 200 of the present example can further include a substrate 4 as a support structure as shown in FIG. 12. The coil 10a, the magnetic yoke 20a, and the insulating layer 30a are provided on the substrate 4.

[0151] The film layer under the soft magnetic sheet 1 in the present example can be various. In some embodiments of the present example, the film layer under the soft magnetic sheet 1 can include the insulating layer 30a and a soft magnetic material layer 2b which is diffused on the side wall of the insulating layer 30a. Based on this, the magnetic yoke 20a includes at least one soft magnetic material layer 2b which is provided in the same layer as the insulating layer 30a and is circumferentially diffused on the outside of the side wall of the insulating layer 30a, and at least one soft magnetic sheet 1 which is bonded to the upper surface of the soft magnetic material layer 2b and the upper surface of the insulating layer 30a. It is to be understood that more soft magnetic material layers 2b and / or soft magnetic sheets 1 can be provided on the soft magnetic sheet 1, and the present application is not limited thereto. The lower surface of the soft magnetic material layer 2b and the lower surface of the insulating layer 30a can be the soft magnetic sheet 1, the soft magnetic material layer 2b, or a stacked structure of the soft magnetic sheet 1 and the soft magnetic material layer 2b, and the present application is not limited thereto.

[0152] Note that the upper surface and the lower surface mentioned in the present application are determined in the vertical direction (Z-axis direction) shown in the drawings, and the upper surface and the lower surface in the present application change accordingly if the orientation of the magnetic head 200 changes.

[0153] As shown in FIG. 12, the magnetic yoke 20a includes one soft magnetic material layer 2b which is provided in the same layer as the insulating layer 30a and is circumferentially diffused on the outside of the side wall of the insulating layer 30a, and two soft magnetic sheets 1a and 1b in some embodiments of the present example. The soft magnetic sheet 1b is connected to the lower surface of the soft magnetic material layer 2b and the lower surface of the insulating layer 30a (the soft magnetic material layer 2b and the insulating layer 30a can be formed on the soft magnetic sheet 1a by a growth process). The soft magnetic sheet 1a is bonded to the upper surface of the soft magnetic material layer 2b and the upper surface of the insulating layer 30a.

[0154] Note that the material of the insulating layer 30a cannot be directly bonded to the soft magnetic sheet 1 in some embodiments. Therefore, the magnetic head 200 of the present example further includes a seed layer 3 as shown in FIG. 12 in some embodiments of the present example, and the soft magnetic sheet 1 can be bonded to the upper surface of the soft magnetic material layer 2b and the upper surface of the insulating layer 30a via the seed layer 3. The seed layer 3 can be formed by the same process and from the same material as the seed layer of Example 1, and thus detailed description thereof will not be given herein.

[0155] In some other embodiments of the present example, the film layer under the soft magnetic sheet 1 is the substrate 4. Based on this, the magnetic yoke 20a comprises at least one layer of soft magnetic material 2b and at least one soft magnetic sheet 1. The layer of soft magnetic material 2b is arranged in the same layer as the isolation layer 30a and circumferentially around the sidewall of the isolation layer 30a. The soft magnetic sheet 1 is bonded to the upper surface of the substrate 4. It can be understood that more layers of soft magnetic material 2b and / or soft magnetic sheets 1 can be arranged between the upper surface of the soft magnetic sheet 1 and the lower surface of the isolation layer 30a, which is not limited in the present application. The upper surface of the layer of soft magnetic material 2b and the upper surface of the isolation layer 30a can be the soft magnetic sheet 1, the layer of soft magnetic material 2b, or the stacked structure of the soft magnetic sheet 1 and the layer of soft magnetic material 2b, which is not limited in the present application.

[0156] For example, as shown in FIG. 13, the magnetic yoke 20a comprises a layer of soft magnetic material 2b and two soft magnetic sheets 1a and 1b. The layer of soft magnetic material 2b is arranged in the same layer as the isolation layer 30a and circumferentially around the sidewall of the isolation layer 30a. The soft magnetic sheet 1b is bonded to the substrate 4 and arranged on the lower surface of the layer of soft magnetic material 2b and the lower surface of the isolation layer 30a. The soft magnetic sheet 1a is arranged on the upper surface of the layer of soft magnetic material 2b and the upper surface of the isolation layer 30a through the seed layer 3.

[0157] For example, as shown in FIG. 14, the magnetic yoke 20a comprises a first part of the layer of soft magnetic material 2b, a second part of the layer of soft magnetic material 2b, and a soft magnetic sheet 1. The first part of the layer of soft magnetic material 2b is arranged in the same layer as the isolation layer 30a and circumferentially around the sidewall of the isolation layer 30a. The second part of the layer of soft magnetic material 2b is arranged on the upper surface of the layer of soft magnetic material 2b and the upper surface of the isolation layer 30a. The soft magnetic sheet 1 is bonded to the upper surface of the substrate 4 and arranged on the lower surface of the layer of soft magnetic material 2b and the lower surface of the isolation layer 30a.

[0158] In some other embodiments of the present example, the film layer under the soft magnetic sheet 1 is the layer of soft magnetic material 2b. Based on this, the magnetic yoke 20a comprises at least one layer of soft magnetic material 2b and at least one soft magnetic sheet 1. The layer of soft magnetic material 2b comprises a first part and a second part. The first part of the layer of soft magnetic material 2b is arranged in the same layer as the isolation layer 30a and circumferentially around the sidewall of the isolation layer 30a. The second part of the layer of soft magnetic material 2b is arranged on the upper surface of the isolation layer 30a and the upper surface of the layer of soft magnetic material 2b arranged in the same layer as the isolation layer 30a; and / or, another layer or multiple layers of soft magnetic material 2b are arranged on the upper surface of the isolation layer 30a and the upper surface of the layer of soft magnetic material 2b arranged in the same layer as the isolation layer 30a. The soft magnetic sheet 1 is bonded to the upper surface of the layer of soft magnetic material 2b under itself, and the soft magnetic sheet 1 can be arranged above the isolation layer 30a or below the isolation layer 30a, which is not limited in the present application.

[0159] In some embodiments, as shown in Fig. 15, the above-mentioned magnetic yoke 20a comprises a first portion of soft magnetic material layer 2b, a second portion of soft magnetic material layer 2b, a third portion of soft magnetic material layer 2b, and two soft magnetic sheets 1a and 1b. The first portion of soft magnetic material layer 2b is arranged in the same layer as the isolation layer 30a and around the side wall of the isolation layer 30a. The second portion of soft magnetic material layer 2b is arranged on the upper surface of the isolation layer 30a, and the third portion of soft magnetic material layer 2b is arranged on the lower surface of the isolation layer 30a. The soft magnetic sheet 1b is arranged on the lower surface of one layer of soft magnetic material layer 2b on the lower surface of the isolation layer 30a, and the soft magnetic sheet 1a is bonded to the upper surface of the second portion of soft magnetic material layer 2b.

[0160] In summary, the combination of the soft magnetic sheet 1 and the soft magnetic material layer 2b in the present example can have various forms, and the above-mentioned figures only show several specific embodiments. The soft magnetic sheet 1 and the soft magnetic material layer 2b in the magnetic yoke 20a of the present example can also have other combination forms, which will not be described one by one here.

[0161] In addition, if the magnetic head 200 of the present example is a data writing head, a write gap 40a as shown in Fig. 15 can also be formed on the magnetic yoke 20a to realize the data writing function of the magnetic head 200. In the magnetic head 200 of the present example, the width range of the above-mentioned write gap 40a can be the same as that of the write gap 40a in the above-mentioned example 1, which will not be described in detail here. In some embodiments of the present example, as shown in Fig. 15, the write gap 40a can be formed on the side surface of the soft magnetic material layer 2b in the same layer as the isolation layer 30a.

[0162] Therefore, for the magnetic head 200 of the present example, the magnetic head body 200S comprises the soft magnetic material layer 2b, the isolation layer 30a, the coil 10a, the write gap 40a (and the substrate 4), and the like in the above-mentioned magnetic head 200 except for the soft magnetic sheet 1. In addition, the magnetic head 200 of the present example can also comprise other film layer structures, which are not limited by the present application.

[0163] Example 4

[0164] The present example is a manufacturing method of the magnetic head 200 of some embodiments in example 3. Some steps in the manufacturing method are the same as or similar to some steps in the manufacturing method of the magnetic head of example 2. Therefore, only the steps that are the same as or similar to those of example 2 will be briefly described in the following steps. The manufacturing method of the present example comprises:

[0165] S201: obtaining a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0166] Wherein, the S201 can be the same as the S101 in the above-mentioned example 2, which will not be described here.

[0167] S202: Form the soft magnetic structure 2 and the isolation layer 30a, and bond the soft magnetic sheet 1 to the upper surface of the soft magnetic structure 2 and the upper surface of the isolation layer 30a. The soft magnetic structure 2 is at least circumferentially arranged outside the side wall of the isolation layer 30a.

[0168] The soft magnetic structure 2 can be a soft magnetic material layer 2b, which is at least circumferentially arranged outside the side wall of the isolation layer 30a. In some embodiments, in S201, two soft magnetic sheets 1a and 1b with magnetic permeability greater than 3000 are obtained. The soft magnetic structure 2 is a soft magnetic material layer 2b. For the above embodiments, referring to FIG. 16, S202 can include:

[0169] S2021: Form the isolation layer 30a, the soft magnetic material layer 2b and the coil 10a on one soft magnetic sheet 1b. The coil 10a is arranged in the isolation layer 30a and outside the soft magnetic material layer 2b.

[0170] In some embodiments, as shown in (a) of FIG. 16, the isolation layer 30a, the soft magnetic material layer 2b and the coil 10a can be formed on one soft magnetic sheet 1b by using semiconductor processes. After the soft magnetic material layer 2b is formed, as shown in (b) of FIG. 16, a gap 40a can also be formed on the soft magnetic material layer 2b by semiconductor processes such as photolithography, etching, stripping, etc. The gap 40a can also be filled with a non-magnetic material by deposition processes.

[0171] S2022: Form a seed layer 3 on the upper surface of the isolation layer 30a and the upper surface of the soft magnetic material layer 2b.

[0172] In some embodiments, as shown in (c) of FIG. 16, the seed layer 3 can be formed on the surface of the isolation layer 30a and the surface of the soft magnetic material layer 2b by sputtering processes.

[0173] S2023: Bond another soft magnetic sheet 1a to the upper surface of the isolation layer 30a and the upper surface of the soft magnetic material layer 2b through the seed layer 3.

[0174] In some embodiments, as shown in (d) of FIG. 16, another soft magnetic sheet 1a can be bonded to the upper surface of the isolation layer 30a and the upper surface of the soft magnetic material layer 2b through the seed layer 3.

[0175] Example 5

[0176] This example is another method for manufacturing the magnetic head 200 of some embodiments of Example 3. Some steps in this manufacturing method are the same as or similar to some steps in the manufacturing method of Example 4. Therefore, only some steps that are the same as or similar to those of Example 4 are described briefly in the following steps. Referring to FIG. 17, the manufacturing method of this example includes:

[0177] S301: Obtain the substrate 4 and the soft magnetic sheet 1 with magnetic permeability greater than 3000.

[0178] Wherein, the obtaining of the substrate 4 and the soft magnetic sheet 1 with magnetic permeability greater than 3000 can be performed simultaneously. The specific steps of obtaining the soft magnetic sheet 1 with magnetic permeability greater than 3000 in this S301 can be the same as those in S201 of Example 4 described above, and will not be repeated here.

[0179] S302: Bond the soft magnetic sheet 1 to the upper surface of the substrate 4.

[0180] Wherein, as shown in (a) of FIG. 17, the soft magnetic sheet 1 is bonded to the upper surface of the substrate 4.

[0181] S303: Form the isolation layer 30a and the soft magnetic structure 2 on the upper surface of the soft magnetic sheet 1. Wherein, the soft magnetic structure 2 is at least circumferentially disposed outside the side wall of the isolation layer 30a.

[0182] Wherein, the soft magnetic structure 2 can be specifically a soft magnetic material layer 2b, and at least part of the soft magnetic material layer 2b is circumferentially disposed outside the side wall of the isolation layer 30a.

[0183] In some embodiments, in the above S301, two soft magnetic sheets 1a and 1b with magnetic permeability greater than 3000 are obtained. Wherein, the soft magnetic sheet 1b is bonded to the upper surface of the substrate 4. And the soft magnetic structure 2 is a soft magnetic material layer 2b. Therefore, referring to (b), (c), and (d) of FIG. 17, the specific steps of the above S303 can be the same as S2021, S2022, and S2023 of S202 of Example 4, and will not be described in detail here.

[0184] Example 6

[0185] This example is another method for manufacturing the magnetic head 200 of some embodiments of Example 3. Some steps in this manufacturing method are the same as or similar to some steps in the manufacturing method of the magnetic head of Example 4. Therefore, only the steps that are the same as or similar to those of Example 4 will be briefly described below. The manufacturing method of this example includes:

[0186] S401: Obtain the soft magnetic sheet 1 with magnetic permeability greater than 3000.

[0187] Wherein, this S401 can be the same as S201 of Example 4 described above, and will not be repeated here.

[0188] S402: Form the soft magnetic structure 2 and the isolation layer 30a, and bond the soft magnetic sheet 1 to the upper surface of the soft magnetic structure 2. Wherein, the soft magnetic structure 2 is at least circumferentially disposed outside the side wall of the isolation layer 30a, and is disposed on top of and below the isolation layer 30a in any one of them;

[0189] The soft magnetic structure 2 can include one or more layers of soft magnetic material layers 2b. One layer of soft magnetic material layers 2b is circumferentially disposed outside the sidewall of the isolation layer 30a, and the remaining soft magnetic material layers 2b are stacked above and below the isolation layer 30a. Alternatively, the soft magnetic sheet can be bonded to the wafer, and then the soft magnetic structure 2 and the isolation layer 30a are formed on the wafer. The present application does not limit this.

[0190] In some embodiments, in the above S401, a soft magnetic sheet 1 with a magnetic permeability greater than 3000 is obtained. The soft magnetic structure 2 includes three layers of soft magnetic material layers 2b. For the above embodiments, referring to FIG. 18, the above S402 can specifically include:

[0191] S4021: Forming a layer of soft magnetic material layers 2b.

[0192] In some embodiments, as shown in (a) of FIG. 18, the soft magnetic material layer 2b can be formed by using semiconductor processes such as deposition, lithography, etching, and stripping.

[0193] S4022: Bonding the soft magnetic sheet 1 to the upper surface of the soft magnetic material layer 2b.

[0194] As shown in (b) of FIG. 18, the soft magnetic sheet 1 is bonded to the upper surface of the soft magnetic material layer 2b. The bonding method can be room temperature bonding or high temperature bonding, which is not limited by the present application.

[0195] S4023: Forming the isolation layer 30a, the coil 10a, and another layer of soft magnetic material layers 2b on the soft magnetic sheet 1. The coil 10a is disposed in the isolation layer 30a and circumferentially disposed outside the soft magnetic material layer 2b. The soft magnetic material layer 2b includes a first part and a second part. The soft magnetic material layer 2b of the first part is circumferentially disposed outside the sidewall of the isolation layer 30a, and the soft magnetic material layer 2b of the second part is stacked on the upper surface of the isolation layer 30a.

[0196] In some embodiments, as shown in (c) and (d) of FIG. 18, the isolation layer 30a, the coil 10a, and another layer of soft magnetic material layers 2b can be formed on the soft magnetic sheet 1 by using semiconductor processes. When the soft magnetic material layer 2b is formed, the write gap 40a can also be formed on the sidewall of the soft magnetic material layer 2b by using semiconductor processes such as lithography, etching, and stripping.

[0197] Example 7

[0198] The magnetic head 200 in the example can be a servo read head or a data read head, and the application does not limit the magnetic head 200. Referring to FIG. 19, the magnetic head 200 in the example includes a magnetic transducer 10b, a first spacer layer 20b, a second spacer layer 30b, a first magnetic field shielding layer 40b, and a second magnetic field shielding layer 50b. The magnetic transducer 10b is formed of a plurality of film layers, such as a tunnel barrier layer, a free switching layer, a protective layer, a reference layer, and the like. The magnetic transducer 10b is used to convert a magnetic field signal read from a magnetic tape into an electrical signal. The first spacer layer 20b is laminated on an upper surface of the magnetic transducer 10b. The second spacer layer 30b is laminated on a lower surface of the magnetic transducer 10b. The first spacer layer 20b and the second spacer layer 30b can be made of an electrically conductive but magnetically non-conductive material, such as copper Cu, platinum Pt, iridium Ir, or gold Au. The first magnetic field shielding layer 40b is laminated on an upper surface of the first spacer layer 20b. The second magnetic field shielding layer 50b is laminated on a lower surface of the second spacer layer 30b.

[0199] In addition, at least one of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b includes or is the soft magnetic sheet 1. The soft magnetic sheet 1 can be bonded to a film layer located in a lower layer thereof. The soft magnetic sheet 1 in the example has the same physical parameters (such as magnetic permeability, thickness, surface roughness, and the like), processing technology, material, and connection mode as the soft magnetic sheet in Example 1, and thus the description is not repeated here.

[0200] Therefore, at least one of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b in the magnetic head 200 in the example includes or is the soft magnetic sheet 1 with high magnetic permeability, which can improve the shielding effect of the soft magnetic sheet 1 as part or the entire magnetic field shielding layer, thereby improving the overall performance of the magnetic head 200. Compared with the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b each being a soft magnetic material layer formed by a semiconductor process such as physical vapor deposition or electroplating, the magnetic head 200 in the example does not have the problem of serious diffusion of metal lines in the magnetic head 200 caused by the overall annealing treatment of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b each being a soft magnetic material layer after assembly with other components in the magnetic head 200. In addition, the soft magnetic sheet 1 after the pre-annealing treatment is less likely to have a warping problem after being connected to a lower film layer.

[0201] Based on the above structure, if the soft magnetic sheet 1 is only or contains one of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b, the remaining first magnetic field shielding layer 40b or the second magnetic field shielding layer 50b can also include the soft magnetic structure 2 shown in FIG. 20, which can be a soft magnetic material layer 2b. The manufacturing process and material of the soft magnetic material layer 2b can also be the same as those of the soft magnetic material layer 2b in Example 1, which will not be repeated here.

[0202] It should be noted that the magnetic head 200 in this example can also include a substrate 4 as shown in FIG. 20, which can serve as a support structure. The magnetic transducer 10b, the first spacing layer 20b, the second spacing layer 30b, the first magnetic field shielding layer 40b, and the second magnetic field shielding layer 50b are all disposed on the substrate 4.

[0203] It should be noted that the combination of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b can have many options, which are not limited by the present application. Considering that the film layer under the soft magnetic sheet 1 can have the following situations, the different combination embodiments of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b will be described in combination with the bonding of the soft magnetic sheet 1 with different film layers.

[0204] In some embodiments of the present example, as shown in FIG. 19, the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b are both soft magnetic sheets, and the two soft magnetic sheets are soft magnetic sheets 1a and 1b, respectively. The first magnetic field shielding layer 40b is bonded to the upper surface of the first spacing layer 20b, and the second magnetic field shielding layer 50b is connected to the lower surface of the second spacing layer 30b.

[0205] In some other embodiments of the present example, the first magnetic field shielding layer 40b can be a soft magnetic sheet 1 bonded to the upper surface of the first spacing layer 20b. Alternatively, the first magnetic field shielding layer 40b can be a soft magnetic material layer 2b connected to the upper surface of the first spacing layer 20b. Alternatively, the first magnetic field shielding layer 40b includes a soft magnetic sheet 1 and a soft magnetic material layer 2b stacked together, and the soft magnetic sheet 1 and the soft magnetic material layer 2b can be one or more, which is not limited in the present application. The soft magnetic sheet 1 or the soft magnetic material layer 2b in the first magnetic field shielding layer 40b is bonded or connected to the upper surface of the first spacing layer 20b. The second magnetic field shielding layer 50b can be a soft magnetic sheet 1 (in this case, the first magnetic field shielding layer 40b is not a soft magnetic sheet 1), and the soft magnetic sheet 1 is bonded to the upper surface of the substrate 4. The second magnetic field shielding layer 50b includes a soft magnetic sheet 1 and a soft magnetic material layer 2b stacked together, and the soft magnetic sheet 1 and the soft magnetic material layer 2b can be one or more, which is not limited in the present application. In addition, for the first magnetic field shielding layer 40b including a soft magnetic sheet 1 and a soft magnetic material layer 2b, one soft magnetic sheet 1 is located between the soft magnetic material layer 2b and the substrate 4 and is bonded to the substrate 4. One soft magnetic material layer 2b is located between the soft magnetic sheet 1 and the lower surface of the second spacing layer 30b and is connected to the lower surface of the second spacing layer 30b.

[0206] For example, as shown in FIG. 20, the first magnetic field shielding layer 40b is a soft magnetic material layer 2b connected to the upper surface of the first spacing layer 20b. The second magnetic field shielding layer 50b is a soft magnetic sheet 1 which can be bonded to the upper surface of the substrate 4 and connected to the lower surface of the second spacing layer 30b.

[0207] In some other embodiments of the present example, the first magnetic field shielding layer 40b can be a soft magnetic sheet 1 bonded to the upper surface of the first spacing layer 20b. Alternatively, the first magnetic field shielding layer 40b can include a soft magnetic sheet 1 and a soft magnetic material layer 2b stacked together, which can be one or more, without limitation. In addition, for the first magnetic field shielding layer 40b including the soft magnetic sheet 1 and the soft magnetic material layer 2b, the soft magnetic sheet 1 is located between the soft magnetic material layer 2b and the upper surface of the first spacing layer 20b. Therefore, the soft magnetic sheet 1 in the first magnetic field shielding layer 40b can be bonded to the upper surface of the first spacing layer 20b, and the soft magnetic material layer 2b is stacked on the upper surface of the soft magnetic sheet 1. The second magnetic field shielding layer 50b can be a soft magnetic sheet 1 connected to the lower surface of the second spacing layer 30b. Alternatively, the second magnetic field shielding layer 50b can be a soft magnetic material layer 2b connected to the lower surface of the second spacing layer 30b. Alternatively, the second magnetic field shielding layer 50b includes a soft magnetic sheet 1 and a soft magnetic material layer 2b stacked together, which can be one or more, without limitation. The soft magnetic sheet 1 or the soft magnetic material layer 2b in the second magnetic field shielding layer 50b is connected to the lower surface of the second spacing layer 30b.

[0208] For example, the first magnetic field shielding layer 40b is a soft magnetic sheet 1 bonded to the upper surface of the first spacing layer 20b. The second magnetic field shielding layer 50b is a soft magnetic material layer 2b connected to the lower surface of the second spacing layer 30b.

[0209] For example, as shown in FIG. 21, the first magnetic field shielding layer 40b is a soft magnetic sheet 1 bonded to the upper surface of the first spacing layer 20b. The second magnetic field shielding layer 50b includes a soft magnetic sheet 1 and a soft magnetic material layer 2b stacked together, which is located between the soft magnetic sheet 1 and the lower surface of the second spacing layer 30b. In addition, the upper surface of the soft magnetic material layer 2b is connected to the lower surface of the second spacing layer 30b, and the lower surface of the soft magnetic material layer 2b is connected to the upper surface of the soft magnetic sheet 1. The soft magnetic sheet 1 is bonded to the upper surface of the soft magnetic material layer 2b, and the upper surface of the soft magnetic sheet 1 is connected to the lower surface of the second spacing layer 30b.

[0210] In addition, in some other embodiments of the present example, at least one of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b includes a soft magnetic material layer 2b and a soft magnetic sheet 1 stacked together. The number of soft magnetic sheets 1 and soft magnetic material layers 2b can be one or more, without limitation. A soft magnetic sheet 1 can be bonded to an adjacent soft magnetic material layer 2b below.

[0211] For example, as shown in FIG. 22, the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b each include a soft magnetic sheet 1 and a soft magnetic material layer 2b arranged in a stack. The lower surface of the soft magnetic sheet 1 in the first magnetic field shielding layer 40b is bonded to the upper surface of the soft magnetic material layer 2b in the first magnetic field shielding layer 40b, and the lower surface of the soft magnetic material layer 2b in the first magnetic field shielding layer 40b is connected to the upper surface of the first spacing layer 20b. The soft magnetic sheet 1 in the second magnetic field shielding layer 50b is bonded to the upper surface of the soft magnetic material layer 2b in the second magnetic field shielding layer 50b, and the lower surface of the soft magnetic sheet 1 in the second magnetic field shielding layer 50b is bonded to the upper surface of the soft magnetic material layer 2b in the second magnetic field shielding layer 50b. The upper surface of the soft magnetic sheet 1 in the second magnetic field shielding layer 50b is connected to the lower surface of the second spacing layer 30b.

[0212] The above is the description of the structure of the first magnetic field shielding layer 40b and the second magnetic field shielding layer 50b in the magnetic head 200. Depending on the application scenario of the magnetic head 200, the first spacing layer 20b and the second spacing layer 30b can be made of different materials.

[0213] If the magnetic head 200 is used in a hard disk drive to read data of the hard disk, the first spacing layer 20b and the second spacing layer 30b in the magnetic head 200 can be made of a metal material. Therefore, the soft magnetic sheet 1 can be directly bonded when bonded to the first spacing layer 20b or the second spacing layer 30b.

[0214] If the magnetic head 200 is used as a data reading magnetic head of the tape drive 1000 to read data of the tape, either of the first spacing layer 20b and the second spacing layer 30b in the magnetic head 200 can be made of a stack structure. As shown in FIG. 23, the stack structure includes a metal material layer S1 and an insulating material layer S2 arranged in a stack. The metal material layer S1 is located between the insulating material layer S2 and the magnetic transducer 10b.

[0215] Since some materials of the insulating material layer S2 can not allow the soft magnetic sheet 1 to be directly bonded to the upper surface of the insulating material layer S2 in the first spacing layer 20b, in some embodiments of the present application, the magnetic head 200 further includes a seed layer 3 as shown in FIG. 23, and the soft magnetic sheet 1 can be bonded to the upper surface of the insulating material layer S2 in the first spacing layer 20b through the seed layer 3. The material of the seed layer 3 can be the same as that of the soft magnetic sheet 1, such as a nickel-iron (NiFe) mixture, or other metal materials, which are not limited in the present application.

[0216] It should be noted that the magnetic head 200 in the present example includes a read gap and other film layer structures in addition to the above-mentioned components and film layer structure, such as a bias layer 60b, an insulating layer 70b (formed of a material that is neither electrically nor magnetically conductive, such as aluminum oxide), and the like as shown in FIG. 23, and the present application is not limited in this regard. The bias layer 60b is provided in the same layer as the magnetic transducer 10b and is disposed around the outer periphery of the magnetic transducer 10b. The bias layer 60b is used to zero the magnetic transducer 10b to ensure proper operation of the magnetic transducer 10b. The insulating layer 70b is disposed between the bias layer 60b and the magnetic transducer 10b, between the bias layer 60b and the first spacer layer 20b, and between the bias layer 60b and the second spacer layer 30b to separate the bias layer 60b from the magnetic transducer 10b, the first spacer layer 20b, and the second spacer layer 30b.

[0217] Therefore, for the magnetic head 200 of the present example described above, the magnetic head body 200S includes the magnetic transducer 10b, the first spacer layer 20b, the second spacer layer 30b (and the soft magnetic material layer 2b in the first magnetic field shield layer 40b and the second magnetic field shield layer 50b, the substrate 4, the bias layer 60b, the insulating layer 70b, and the like in the magnetic head 200 described above, excluding the soft magnetic sheet 1.

[0218] Example 8

[0219] The present example is a method for manufacturing the magnetic head 200 in some of the embodiments of Example 7. Some of the steps in the manufacturing method are the same as or similar to some of the steps in the manufacturing method of the magnetic head of Example 4. Therefore, only the steps that are the same as or similar to those of Example 4 in the following steps will be described briefly. The manufacturing method of the present example includes the following steps:

[0220] S501: Obtain a soft magnetic sheet 1 having a magnetic permeability greater than 3000.

[0221] The S501 can be the same as the S201 in the above-described Example 4, and will not be described again here.

[0222] S502: Form the second spacer layer 30b, the magnetic transducer 10b, and the first spacer layer 20b in that order on the upper surface of one soft magnetic sheet 1b.

[0223] In some embodiments, as shown in (a) and (b) of FIG. 24, the upper surface of one soft magnetic sheet 1b can be formed with the second spacer layer 30b, the magnetic transducer 10b, and the first spacer layer 20b in that order by using a semiconductor process. The soft magnetic sheet 1b is the second magnetic field shield layer 50b. Furthermore, the bias layer 60b and the insulating layer 70b can also be formed. The soft magnetic sheet 1b is the second magnetic field shield layer 50b.

[0224] S503: Bond another soft magnetic sheet 1a to the upper surface of the first spacer layer 20b.

[0225] In some embodiments, as shown in (a) of FIG. 24, a seed layer 3 is formed on the upper surface of the first spacer layer 20b.

[0226] If the first spacer layer 20b in the magnetic head 200 is made of a metal material layer S1 and an insulating material layer S2 which are stacked, and the metal material layer S1 is located between the insulating material layer S2 and the magnetic transducer 10b, referring to FIG. 25, the S503 specifically includes:

[0227] S5031: forming a seed layer 3 on the upper surface of the first spacer layer 20b.

[0228] In some embodiments, as shown in (a) of FIG. 25, a seed layer 3 is formed on the upper surface of the first spacer layer 20b.

[0229] S5032: bonding another soft magnetic sheet 1a to the upper surface of the first spacer layer 20b through the seed layer 3.

[0230] In some embodiments, as shown in (b) of FIG. 25, another soft magnetic sheet 1a can be bonded to the upper surface of the first spacer layer 20b through the seed layer 3.

[0231] Example 9

[0232] This example is another method for manufacturing the magnetic head 200 in some embodiments of Example 7. Some steps in this manufacturing method are the same as or similar to some steps in the manufacturing method of the magnetic head of Example 8. Therefore, only the steps which are the same as or similar to those of Example 8 are briefly described below. The manufacturing method of this example includes the following steps:

[0233] S601: obtaining a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0234] The S601 can be the same as the S501 in Example 8 above, and thus is not described here again.

[0235] S602: forming the magnetic transducer 10b, the first spacer layer 20b, the second spacer layer 30b and the soft magnetic structure 2, and bonding the soft magnetic sheet 1 to the upper surface of the first spacer layer 20b.

[0236] In some embodiments, the first spacer layer 20b is stacked on the upper surface of the magnetic transducer 10b, the second spacer layer 30b is stacked on the lower surface of the magnetic transducer 10b, and the soft magnetic structure 2 is stacked on at least the lower surface of the second spacer layer 30b. The magnetic transducer 10b, the first spacer layer 20b, the second spacer layer 30b and the soft magnetic structure 2 can be formed by a semiconductor process.

[0237] In some embodiments, the first magnetic field shielding layer 40b in the magnetic head 200 is the soft magnetic sheet 1, and the second magnetic field shielding layer 50b is the soft magnetic material layer 2b. Therefore, referring to FIG. 26, the above S602 specifically includes:

[0238] S6021: forming the soft magnetic material layer 2b.

[0239] In some embodiments, as shown in (a) of FIG. 26, the soft magnetic material layer 2b (i.e., the second magnetic field shielding layer 50b) can be formed by semiconductor processes such as sputtering, deposition, etc.

[0240] S6022: sequentially forming the second spacer layer 30b, the magnetic transducer 10b, and the first spacer layer 20b on the soft magnetic material layer 2b.

[0241] In some embodiments, as shown in (b) of FIG. 26, the second spacer layer 30b, the magnetic transducer 10b, and the first spacer layer 20b can be sequentially formed on the soft magnetic material layer 2b by semiconductor processes such as sputtering, deposition, photolithography, etching, stripping, etc. In addition, the bias layer 60b and the insulating layer 70b can also be formed.

[0242] S6023: bonding the soft magnetic sheet 1 with the upper surface of the first spacer layer 20b.

[0243] In some embodiments, as shown in (c) of FIG. 26, the soft magnetic sheet 1 is bonded with the upper surface of the first spacer layer 20b. Similarly, for different structures of the first spacer layer 20b in the magnetic head 200, such as a metal material layer S1 and an insulating material layer S2 made of metal material or stacked, the specific steps of S6023 are the same as those in S503 of Example 8, which will not be described in detail here.

[0244] Example 10

[0245] This example is another method for manufacturing the magnetic head 200 in some embodiments of Example 7. Some steps in this manufacturing method are the same as or similar to some steps in the manufacturing method of the magnetic head of Example 9. Therefore, only the steps that are the same as or similar to those in Example 9 will be briefly described in the following steps. Referring to FIG. 27, the manufacturing method of this example includes the following steps:

[0246] S701: obtaining a substrate 4 and a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0247] In some embodiments, the substrate 4 and the soft magnetic sheet 1 with a magnetic permeability greater than 3000 can be obtained at the same time. This S701 can be the same as S601 in Example 9 described above, which will not be described in detail here.

[0248] S702: bonding the soft magnetic sheet 1 with the upper surface of the substrate 4.

[0249] As shown in (a) of FIG. 27, the soft magnetic sheet 1 is bonded to the upper surface of the substrate 4.

[0250] S703: Forming the second spacer layer 30b, the magnetic transducer 10b, the first spacer layer 20b and the soft magnetic structure 2 on the upper surface of the soft magnetic sheet 1. The first spacer layer 20b is laminated on the upper surface of the magnetic transducer 10b, and the second spacer layer 30b is laminated on the lower surface of the magnetic transducer 10b. The soft magnetic structure 2 is laminated on at least one of the upper surface of the first spacer layer 20b and the lower surface of the second spacer layer 30b.

[0251] In some embodiments, the soft magnetic sheet 1 is the second magnetic field shielding layer 50b. The soft magnetic structure 2 is a soft magnetic material layer 2b, which can be the first magnetic field shielding layer 40b. As shown in (b) of FIG. 27, the S703 can be specifically forming the second spacer layer 30b, the magnetic transducer 10b, the first spacer layer 20b and the soft magnetic material layer 2b on the upper surface of the soft magnetic sheet 1 by semiconductor processes such as sputtering, deposition, lithography, etching, stripping, etc. The bias layer 60b and the insulating layer 70b can also be formed.

[0252] Example 11

[0253] This example is another method for manufacturing the magnetic head 200 in some embodiments of Example 7. Some steps in this manufacturing method are the same as or similar to some steps in the manufacturing method of the magnetic head of Example 9. Therefore, only the steps that are the same as or similar to those of Example 9 will be briefly described in the following steps. The manufacturing method of this example includes the following steps:

[0254] S801: Obtaining a soft magnetic sheet 1 with a magnetic permeability greater than 3000.

[0255] The S801 can be the same as the S601 in Example 9 described above, and will not be described again here.

[0256] S802: Forming the magnetic transducer 10b, the first spacer layer 20b, the second spacer layer 30b and the soft magnetic structure 2, and bonding the upper surface of the soft magnetic sheet 1 to the upper surface of the soft magnetic structure 2.

[0257] The first spacer layer 20b is laminated on the upper surface of the magnetic transducer 10b, and the second spacer layer 30b is laminated on the lower surface of the magnetic transducer 10b. The soft magnetic structure 2 is laminated on at least one of the upper surface of the first spacer layer 20b and the lower surface of the second spacer layer 30b. The magnetic transducer 10b, the first spacer layer 20b, the second spacer layer 30b and the soft magnetic structure 2 can be formed by semiconductor processes.

[0258] In some embodiments, the first magnetic field shielding layer 40b in the magnetic head 200 is a soft magnetic material layer 2b and a soft magnetic sheet 1 stacked together, and the second magnetic field shielding layer 50b is a soft magnetic material layer 2b. Therefore, referring to FIG. 28, the above S802 specifically includes:

[0259] S8021: sequentially forming a soft magnetic material layer 2b, a second spacer layer 30b, a magnetic transducer 10b, a first spacer layer 20b, and another soft magnetic material layer 2b.

[0260] In which, as shown in (a) of FIG. 28, a soft magnetic material layer 2b (i.e. the second magnetic field shielding layer 50b), a second spacer layer 30b, a magnetic transducer 10b, a first spacer layer 20b, and another soft magnetic material layer 2b (included in the first magnetic field shielding layer 40b) can be sequentially formed by semiconductor process. And, a bias layer 60b and an insulating layer 70b can also be formed.

[0261] S8022: bonding the soft magnetic sheet 1 with the upper surface of the other soft magnetic material layer 2b.

[0262] In which, as shown in (b) of FIG. 28, the soft magnetic sheet 1 is bonded with the upper surface of the other soft magnetic material layer 2b.

[0263] The above description is merely specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A magnetic head, characterized by, The application relates to a magnetic head, comprising: a soft magnetic sheet, the magnetic permeability of which is greater than 3000; a magnetic head body, which is connected to the soft magnetic sheet by bonding or adhesion.

2. The magnetic head of claim 1 wherein, The soft magnetic sheet is a soft magnetic foil which is pretreated by an annealing process and has a magnetic permeability greater than 3000.

3. The magnetic head according to claim 1 or 2, characterized by The surface roughness of the soft magnetic sheet is less than 10 nm.

4. The magnetic head according to any one of claims 1 to 3, characterized by The magnetic head further comprises: a seed layer arranged between the magnetic head body and the soft magnetic sheet, and the soft magnetic sheet is bonded to the magnetic head body through the seed layer.

5. The magnetic head according to any one of claims 1 to 4, wherein The magnetic head body comprises: a soft magnetic structure, one side surface of which is connected to one side surface of the soft magnetic sheet by bonding or adhesion.

6. The magnetic head according to any one of claims 1 to 4, wherein The magnetic head body comprises: an isolation layer; a soft magnetic structure, which is arranged at least along the circumference outside the side wall of the isolation layer; wherein the upper surface of the soft magnetic structure and the upper surface of the isolation layer are both bonded to the soft magnetic sheet.

7. The magnetic head according to any one of claims 1 to 4, wherein The magnetic head body comprises: an isolation layer; a soft magnetic structure, which is arranged at least along the circumference outside the side wall of the isolation layer and is arranged at least one of above and below the isolation layer; wherein the upper surface of the soft magnetic structure is bonded to the soft magnetic sheet.

8. The magnetic head according to any one of claims 1 to 4, wherein The magnetic head body comprises: a magnetic transducer; a first spacing layer, which is arranged above the upper surface of the magnetic transducer; a second spacing layer, which is arranged below the lower surface of the magnetic transducer; The soft magnetic sheet is two, one of which is bonded to the upper surface of the first spacing layer, and the other of which is arranged below the lower surface of the second spacing layer.

9. The magnetic head according to any one of claims 1 to 4, wherein The magnetic head body comprises: a magnetic transducer; a first spacing layer, which is arranged above the upper surface of the magnetic transducer; a second spacing layer, which is arranged below the lower surface of the magnetic transducer; a soft magnetic structure, which is arranged below the lower surface of the second spacing layer; wherein the upper surface of the first spacing layer is bonded to the soft magnetic sheet.

10. The magnetic head according to any one of claims 1 to 4, wherein The magnetic head body comprises: a magnetic transducer; a first spacing layer, which is arranged above the upper surface of the magnetic transducer; a second spacing layer, which is arranged below the lower surface of the magnetic transducer; a soft magnetic structure, which is arranged at least one of above the first spacing layer and below the second spacing layer; wherein the upper surface of the soft magnetic structure is bonded to the soft magnetic sheet.

11. A method of fabricating a magnetic head, comprising: The application further relates to a method for manufacturing a magnetic head, comprising the following steps: obtaining a soft magnetic sheet with a magnetic permeability greater than 3000; bonding or adhering the soft magnetic sheet to the magnetic head body.

12. The method of manufacturing a magnetic head as claimed in claim 11, wherein The step of obtaining a soft magnetic sheet with a magnetic permeability greater than 3000 comprises: annealing the soft magnetic sheet to obtain a soft magnetic sheet with a magnetic permeability greater than 3000.

13. The method of manufacturing a magnetic head as claimed in claim 12, wherein After the step of annealing the soft magnetic sheet to obtain a soft magnetic sheet with a magnetic permeability greater than 3000, the step of obtaining a soft magnetic sheet with a magnetic permeability greater than 3000 further comprises: polishing the surface of the soft magnetic sheet to obtain a soft magnetic sheet with a magnetic permeability greater than 3000 and a surface roughness less than 10 nm.

14. The method of manufacturing a magnetic head according to any one of claims 11 to 13, wherein The step of bonding or adhering the soft magnetic sheet to the magnetic head body comprises: forming a seed layer on the magnetic head body; The soft magnetic sheet is bonded or adhered to the head body through the seed layer.

15. The method of manufacturing a magnetic head according to any one of claims 11 to 14, wherein The head body comprises a soft magnetic structure, and the bonding or adhering the soft magnetic sheet to the head body specifically comprises: bonding or adhering one side surface of the soft magnetic sheet to one side surface of the soft magnetic structure.

16. The method of manufacturing a magnetic head according to any one of claims 11 to 14, wherein The head body comprises an isolation layer and a soft magnetic structure, and the bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the soft magnetic structure and the isolation layer; wherein the soft magnetic structure is at least circumferentially arranged outside the side wall of the isolation layer; and the soft magnetic sheet is bonded to the upper surface of the soft magnetic structure and the upper surface of the isolation layer.

17. The method of manufacturing a magnetic head according to any one of claims 11 to 14, wherein The head body comprises an isolation layer and a soft magnetic structure; and the bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the soft magnetic structure and the isolation layer; wherein the soft magnetic structure is at least circumferentially arranged outside the side wall of the isolation layer and is arranged in any one of above and below the isolation layer; and the soft magnetic sheet is bonded to the upper surface of the soft magnetic structure.

18. The method of manufacturing a magnetic head according to any one of claims 11 to 14, wherein The head body comprises a magnetic transducer, a first spacer layer and a second spacer layer; the head comprises two soft magnetic sheets with a magnetic permeability greater than 3000; and the bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the second spacer layer, the magnetic transducer and the first spacer layer on the upper surface of one of the soft magnetic sheets in sequence; bonding the other soft magnetic sheet to the upper surface of the first spacer layer.

19. The method of manufacturing a magnetic head according to any one of claims 11 to 14, wherein The head body comprises a magnetic transducer, a first spacer layer, a second spacer layer and a soft magnetic structure; and the bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the magnetic transducer, the first spacer layer, the second spacer layer and the soft magnetic structure; and bonding the soft magnetic sheet to the upper surface of the first spacer layer; wherein the first spacer layer is arranged in layers on the upper surface of the magnetic transducer, the second spacer layer is arranged in layers on the lower surface of the magnetic transducer, and the soft magnetic structure is arranged in layers on at least the lower surface of the second spacer layer.

20. The method of manufacturing a magnetic head according to any one of claims 11 to 14, wherein The head body comprises a magnetic transducer, a first spacer layer, a second spacer layer and a soft magnetic structure; and the bonding or adhering the soft magnetic sheet to the head body specifically comprises: forming the magnetic transducer, the first spacer layer, the second spacer layer and the soft magnetic structure; and bonding the soft magnetic sheet to the upper surface of the soft magnetic structure; wherein the first spacer layer is arranged in layers on the upper surface of the magnetic transducer, and the second spacer layer is arranged in layers on the lower surface of the magnetic transducer; and the soft magnetic structure is arranged in layers on at least one of above the first spacer layer and below the second spacer layer.

21. A magnetic read-write device, characterized in that, a housing; the head of any one of claims 1-10; the head is mounted on the housing.

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