Optical module

Abstract

An optical module (200), comprising a circuit board (300), an optical transmitting component (400), an optical receiving component (500), first flexible printed circuits (301a, 301b), second flexible printed circuits (302a, 302b) and third flexible printed circuits (303a, 303b). The optical receiving component (500) is arranged below the optical transmitting component (400), and the optical receiving component (500) supports and is connected to the optical transmitting component (400). The optical transmitting component (400) comprises a laser assembly (450), a backlight detection assembly (490) and an electrical connector (430), wherein the backlight detection assembly (490) is arranged on the electrical connector (430) so as to fully utilize the electrical connector (430) to implement optical power detection of the laser assembly (450). A first driver (320) is provided on the top surface of the circuit board (300), a first pad group (304) is provided on one side of the first driver (320), and a second pad group (305) is provided on the other side of the first driver (320). The electrical connector (430) comprises a first connection surface (431) and a second connection surface (432) arranged at one end, and a third connection surface (433) and a fourth connection surface (434) arranged at the other end. The laser assembly (450) is wire-bonded to the first connection surface (431) and then electrically connected to the first pad group (304) by means of the third connection surface (433) and the first flexible printed circuits (301a, 301b) in sequence. The backlight detection assembly (490) is wire-bonded to the second connection surface (432) and then electrically connected to the second pad group (305) by means of the fourth connection surface (434) and the second flexible printed circuits (302a, 302b) in sequence.

Description

optical module

[0001] This application claims priority to Chinese Patent Application No. 202411205432.6, filed August 29, 2024; priority to Chinese Patent Application No. 202411205339.5, filed August 29, 2024; and priority to Chinese Patent Application No. 202411205294.1, filed August 29, 2024; the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0003] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0004] Summary of the Invention

[0005] This disclosure provides an optical module, including:

[0006] Circuit board;

[0007] A light-emitting component is located at one end of the circuit board and is electrically connected to the circuit board.

[0008] An optical receiving component is disposed below the optical emitting component, and the optical receiving component is supported and connected to the optical emitting component;

[0009] The light emitting component includes:

[0010] The first housing has a first through hole at one end and an opening at the other end;

[0011] A laser component, located within the first housing, is configured to generate an optical signal;

[0012] The first upper cover closes and connects to the first housing.

[0013] An electrical connector is embedded in the opening; one end of the electrical connector extends into the inner cavity of the first housing, and the other end of the electrical connector is located outside the first housing; one end of the electrical connector is wired to the laser assembly, and the other end of the electrical connector has a third connection surface and a fourth connection surface, with the third connection surface located above the fourth connection surface;

[0014] The optical receiving component includes:

[0015] The second shell has a fourth through hole at one end and a notch at the other end;

[0016] The second upper cover includes a cover plate body and a side plate, the top of the side plate being connected to the cover plate body; the second upper cover is closed and connected to the second housing, the cover plate body being connected to the top of the second housing, and the side plate being located within the notch; a light receiving component is disposed within the cavity formed by the second housing and the second upper cover, and the second upper cover supports the light emitting component;

[0017] A first flexible circuit board is welded to the third connecting surface at one end and to the circuit board at the other end.

[0018] The second flexible circuit board has one end welded to the fourth connecting surface and the other end welded to the circuit board.

[0019] A third flexible circuit board extends into the second housing at one end and is fixedly connected to the second housing. The third flexible circuit board is electrically connected to the optical receiving component. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0022] Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0023] Figure 3 is a schematic diagram of the structure of an optical module according to some embodiments of the present disclosure;

[0024] Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 5A is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0026] Figure 5B is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0027] Figure 6A is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure;

[0028] Figure 6B is an exploded view of a light emitting component provided according to some embodiments of the present disclosure;

[0029] Figure 6C is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure;

[0030] Figure 6D is a partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0031] Figure 6E is a partial schematic diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0032] Figure 6F is a schematic diagram of the structure of an electrical connector provided according to some embodiments of the present disclosure;

[0033] Figure 6G is a partially enlarged view of an electrical connector provided according to some embodiments of the present disclosure;

[0034] Figure 6H is a cross-sectional schematic diagram of an electrical connector provided according to some embodiments of the present disclosure;

[0035] Figure 7 is a usage diagram of a TEC according to some embodiments of the present disclosure;

[0036] Figure 8 is a schematic diagram of another optical emitting component provided according to some embodiments of the present disclosure;

[0037] Figure 9A is a schematic diagram of the structure of an optical receiving component provided according to some embodiments of the present disclosure;

[0038] Figure 9B is an exploded view of an optical receiving component provided according to some embodiments of the present disclosure;

[0039] Figure 9C is a schematic diagram of a second housing provided according to some embodiments of the present disclosure;

[0040] Figure 9D is a usage diagram of a second housing provided according to some embodiments of the present disclosure;

[0041] Figure 9E is a cross-sectional view of an optical receiving component provided according to some embodiments of the present disclosure;

[0042] Figure 9F is a schematic diagram of a second top cover provided according to some embodiments of the present disclosure;

[0043] Figure 10A is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0044] Figure 10B is a partial schematic diagram of another optical module provided according to some embodiments of the present disclosure;

[0045] Figure 10C is a schematic diagram of a circuit board according to some embodiments of the present disclosure;

[0046] Figure 10D is a schematic diagram of the structure of a second flexible circuit board according to some embodiments of the present disclosure;

[0047] Figure 11A is a schematic diagram of a fiber optic support structure according to some embodiments of the present disclosure;

[0048] Figure 11B is a schematic diagram of a fiber optic support structure according to some embodiments of the present disclosure;

[0049] Figure 11C is a schematic diagram of the assembly of a fiber optic cable support and a circuit board according to some embodiments of the present disclosure;

[0050] Figure 12A is a schematic diagram of a second fiber optic support according to some embodiments of the present disclosure;

[0051] Figure 12B is a schematic diagram of a second fiber optic support according to some embodiments of the present disclosure;

[0052] Figure 13 is a partial structural schematic diagram of a lower housing provided according to some embodiments of the present disclosure;

[0053] Figure 14A is an assembly diagram of a second fiber optic support according to some embodiments of the present disclosure;

[0054] Figure 14B is a cross-sectional view of a second fiber optic tray in use according to some embodiments of the present disclosure. Detailed Implementation

[0055] The following description, in conjunction with the accompanying drawings, provides a clear and detailed account of some embodiments of this disclosure. However, the described embodiments are merely some, and not all, of the embodiments described herein. All other embodiments obtained by those skilled in the art based on the embodiments provided herein are within the scope of protection of this disclosure.

[0056] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0057] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.

[0058] An optical module enables the conversion between optical and electrical signals between information processing and transmission devices. For example, at least one of the optical signal input or output ports of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ports is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts it into a first electrical signal and transmits it to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts it into a second optical signal and transmits it back to the optical fiber. Since multiple information processing devices can transmit information via electrical signals, at least one of the devices needs to be directly connected to the optical module, rather than all devices. Here, the information processing device directly connected to the optical module is referred to as the host computer of the optical module. Furthermore, the optical signal input or output port of the optical module can be referred to as an optical port, and the electrical signal input or output port can be referred to as an electrical port.

[0059] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0060] One end of optical fiber 101 extends toward the remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. The optical signal can undergo total internal reflection in optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to optical module 200, or to transmit the optical signal from optical module 200 to remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0061] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0062] The host computer 100 includes a generally rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 can establish a one-way or two-way electrical signal connection.

[0063] The host computer 100 also includes an external power interface that can connect to an electrical signal network. For example, this external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, thereby establishing an electrical signal connection between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. This second electrical signal from the host computer 100 is transmitted to the optical module 200, which converts the second electrical signal into a second optical signal and transmits it to the optical fiber 101. The second optical signal is then transmitted in the optical fiber 101 to the remote information processing device 1000. Alternatively, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101 and is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal and transmits it to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that an optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information itself does not change, but the encoding and decoding methods can change.

[0064] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0065] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures to increase the heat dissipation area.

[0066] The optical module 200 is inserted into the cage 106 of the host computer 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to the electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0067] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a shell, a circuit board 300, a light emitting component 400, and a light receiving component 500 disposed within the shell.

[0068] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing with two openings; the outer contour of the housing is generally square.

[0069] In some embodiments of this disclosure, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0070] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates 2012 are combined with the two lower side plates 2022 to realize that the upper housing 201 covers the lower housing 202.

[0071] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200 (right end of Figure 3), and opening 204 is also located at the end of the optical module 200 (left end of Figure 3). Alternatively, opening 203 is located at the end of the optical module 200, while opening 204 is located on the side of the optical module 200. Opening 203 is an electrical port, from which the gold fingers of the circuit board 300 extend and are inserted into the host computer (e.g., optical network terminal 100); opening 204 is an optical port, configured to connect to the optical fiber 101 so that the optical fiber 101 connects to the optical transmitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0072] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these devices. Furthermore, assembling the circuit board 300, light emitting component 400, and light receiving component 500 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components for these devices, which is beneficial for automated production.

[0073] In some embodiments, the upper housing 201 and the lower housing 202 can be selected as needed, and are generally made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0074] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing, the unlocking component 600 being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0075] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0076] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LIAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0077] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0078] The circuit board 300 also includes gold fingers formed on its end surface, each gold finger consisting of multiple independent pins. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector within the cage 106 via the gold fingers. The gold fingers can be located only on one side of the surface of the circuit board 300 (e.g., the upper surface shown in Figure 4), or on both the upper and lower surfaces of the circuit board 300, to accommodate applications requiring a large number of pins. The gold fingers are configured to establish an electrical connection with a host computer for power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0079] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0080] In some embodiments, the light emitting component 400 and the light receiving component 500 may be located at one end of the circuit board 300 and outside the circuit board 300. Of course, in the embodiments of this disclosure, the light emitting component 400 or the light receiving component 500 may be located on the circuit board 300.

[0081] In some embodiments, the optical module 200 may include a first optical transmission component for connecting an external optical fiber and an optical emitting component 400 to transmit the optical signal generated by the optical emitting component 400 to the external optical fiber. The first optical transmission component includes a first optical fiber adapter, a first optical fiber, and a second optical fiber adapter. One end of the first optical fiber is connected to the first optical fiber adapter, and the other end of the first optical fiber is connected to the second optical fiber adapter. The first optical fiber adapter is fixed to the optical port of the optical module 200, and the second optical fiber adapter is used to connect to the optical emitting component 400.

[0082] In some embodiments, the optical module 200 may include a second optical transmission component for connecting an external optical fiber and an optical receiving component 500 to transmit optical signals input from the external optical fiber to the optical receiving component 500. The second optical transmission component includes a third optical fiber adapter, a second optical fiber, and a fourth optical fiber adapter. One end of the second optical fiber is connected to the third optical fiber adapter, and the other end of the second optical fiber is connected to the fourth optical fiber adapter. The third optical fiber adapter is fixed to the optical port of the optical module 200, and the fourth optical fiber adapter is used to connect to the optical receiving component 500.

[0083] In some embodiments, the lengths of the first optical fiber and the second optical fiber are greater than the length of the optical module 200, such as the lengths of the first optical fiber and the second optical fiber being 2-3 times the length of the optical module 200, to facilitate the assembly of the optical emitting component 400, the optical receiving component 500, etc.

[0084] In some embodiments, the optical module 200 may include a fiber optic cable support 700 located within a housing. Exemplarily, the fiber optic cable support 700 is connected to a circuit board 300, with the circuit board 300 supporting the connection of the fiber optic cable support 700. Alternatively, in this embodiment, the fiber optic cable support 700 may also be fixedly connected to the lower housing 202 and located near the optical port of the optical module. The fiber optic cable support 700 is used to coil the first optical fiber and / or the second optical fiber to straighten them, thus preventing damage to the first and second optical fibers during optical module assembly and avoiding excessive bending of the first and second optical fibers, ensuring the transmission quality of the optical signal.

[0085] In some embodiments, the optical module 200 may include a first fiber optic cable support 700a and a second fiber optic cable support 700b. The first fiber optic cable support 700a is located between the end of the optical emitting component 400 and the electrical port of the optical module, and the second fiber optic cable support 700b is located between the front end of the optical emitting component 400 and the optical port of the optical module. For example, a circuit board 300 supports and connects to the first fiber optic cable support 700a, and a base plate 2021 supports and connects to the second fiber optic cable support 700b. The first fiber optic cable support 700a and the second fiber optic cable support 700b cooperate to coil the first optical fiber and / or the second optical fiber to facilitate more orderly arrangement of the first and second optical fibers.

[0086] Figure 5A is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure, and Figure 5B is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure. In some embodiments, the optical module 200 may include a first light emitting component 400a and a second light emitting component 400b, which are located on the side of the same end of the circuit board 300 and outside the circuit board 300. The first light emitting component 400a and the second light emitting component 400b may be electrically connected to the circuit board 300 via flexible circuit boards. For example, the first light emitting component 400a and the second light emitting component 400b are electrically connected to the top surface of the circuit board 300 via a flexible circuit board.

[0087] In some embodiments, the first light emitting component 400a and the second light emitting component 400b may be arranged side by side along the width direction of the optical module 200.

[0088] In some embodiments, the optical module 200 may include a first optical receiving component 500a and a second optical receiving component 500b. The first optical receiving component 500a and the second optical receiving component 500b may be electrically connected to the circuit board 300 via flexible circuit boards. For example, the first optical receiving component 500a and the second optical receiving component 500b are electrically connected to the bottom surface of the circuit board 300 via flexible circuit boards.

[0089] In some embodiments, the first optical receiving component 500a and the second optical receiving component 500b may be arranged side by side along the width direction of the optical module 200.

[0090] In some embodiments, a first light emitting component 400a is located on a first light receiving component 500a, and a second light emitting component 400b is located on a second light receiving component 500b, such that the first light emitting component 400a and the first light receiving component 500a are stacked vertically, and the second light emitting component 400b and the second light receiving component 500b are also stacked vertically. The light emitting component 400 and the light receiving component 500 have different heights, and stacking them vertically facilitates full utilization of the space inside the housing.

[0091] In some embodiments, the optical module 200 may include a first flexible circuit board 301a and a second flexible circuit board 302a, one end of the first flexible circuit board 301a and one end of the second flexible circuit board 302a are respectively connected to the first light emitting component 400a, and the other end of the first flexible circuit board 301a and the other end of the second flexible circuit board 302a are respectively connected to the circuit board 300.

[0092] In some embodiments, the optical module 200 may include a first flexible circuit board 301b and a second flexible circuit board 302b, one end of the first flexible circuit board 301b and one end of the second flexible circuit board 302b are respectively connected to the second light emitting component 400b, and the other end of the first flexible circuit board 301b and the other end of the second flexible circuit board 302b are respectively connected to the circuit board 300.

[0093] In some embodiments, a first driver 320 and a second driver 330 may be disposed on the top surface of the circuit board 300, with the first driver 320 close to the first light emitting component 400a and the second driver 330 close to the second light emitting component 400b. Of course, in this embodiment of the present disclosure, the first driver 320 and the second driver 330 may be packaged into a single driver, which is close to the first light emitting component 400a and the second light emitting component 400b.

[0094] In some embodiments, the first driver 320 and the second driver 330 may be connected to the upper housing 201 via thermal pads or thermal adhesives, so as to transfer heat from the first driver 320 and the second driver 330 to the upper housing 201.

[0095] In some embodiments, a first flexible circuit board 301a is used to transmit high-frequency signals. One end of the first flexible circuit board 301a extends to the side of a first driver 320, and the other end extends to the side of a second driver 330. The first driver 320 is electrically connected to a first light emitting component 400a via the first flexible circuit board 301a to transmit high-frequency signals to the first light emitting component 400a. The second driver 330 is electrically connected to a second light emitting component 400b via the first flexible circuit board 301b to transmit high-frequency signals to the second light emitting component 400b.

[0096] In some embodiments, the optical module 200 may include a third flexible circuit board 303a and a third flexible circuit board 303b. One end of the third flexible circuit board 303a is electrically connected to the first optical receiving component 500a, one end of the third flexible circuit board 303b is electrically connected to the second optical receiving component 500b, and the other ends of the third flexible circuit board 303a and the other ends of the third flexible circuit board 303b are respectively connected to the circuit board 300.

[0097] In some embodiments, a first CDR 340 and a second CDR 350 may be disposed on the bottom surface of the circuit board 300, with the first CDR 340 close to the first light receiving component 500a and the second CDR 350 close to the second light receiving component 500b. Alternatively, in this embodiment, the first CDR 340 and the second CDR 350 may be packaged into a single CDR, which is located close to both the first and second light receiving components 500a and 500b. The first CDR 340 and the second CDR 350 may integrate a limiting amplification function. Furthermore, in this embodiment, a first LIA and a second LIA may also be disposed on the circuit board 300, with the first LIA close to the first light receiving component 500a and the second LIA close to the second light receiving component 500b.

[0098] In some embodiments, the first optical receiving component 500a is electrically connected to the first CDR 340 via the third flexible circuit board 303a, so that the high-frequency signal output by the first optical receiving component 500a is transmitted to the first CDR 340 via the third flexible circuit board 303a; the second optical receiving component 500b is electrically connected to the second CDR 350 via the third flexible circuit board 303b, so that the high-frequency signal output by the second optical receiving component 500b is transmitted to the second CDR 350 via the third flexible circuit board 303b.

[0099] In some embodiments, gold fingers 310 are respectively provided on the top and bottom surfaces of the circuit board 300.

[0100] In some embodiments, an MCU 360 may be disposed on the bottom surface of the circuit board 300, and the MCU 360 is located on the side of the gold finger 310. Exemplarily, the MCU 360 is not located in the projection area of ​​the first driver 320 and the second driver 330 in the direction of the bottom surface of the circuit board 300.

[0101] Figure 6A is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 6A shows the structure of a light emitting component 400. The structures of the first light emitting component 400a and the second light emitting component 400b can be referred to the structure of the light emitting component 400. As shown in Figure 6A, the light emitting component 400 includes a first housing 410 and a first upper cover 420, which covers and connects to the first housing 410. One end of the first upper cover 420 is connected to a first optical transmission component 800a, and the other end of the first housing 410 is provided with an electrical connector 430. Exemplarily, the other end of the first housing 410 is provided with an opening, and the electrical connector 430 is embedded in the opening. In some embodiments, the first upper cover 420 is sealed to the first housing 410.

[0102] In some embodiments, the light emitting component 400 further includes a connecting component 440, one end of which is connected to the first light transmission component 800a, and the other end of which is connected to the first housing 410. The light signal output from the first housing 410 passes through the connecting component 440 and is transmitted to the first light transmission component 800a.

[0103] In some embodiments, the first optical transmission component 800a includes a first optical fiber adapter 810, a first optical fiber 820, and a second optical fiber adapter 830. One end of the first optical fiber 820 is connected to the first optical fiber adapter 810, and the other end of the first optical fiber 820 is connected to the second optical fiber adapter 830. The light input end of the second optical fiber adapter 830 is connected to the connection component 440.

[0104] Figure 6B is an exploded view of a light emitting component according to some embodiments of the present disclosure, and Figure 6C is a cross-sectional view of a light emitting component according to some embodiments of the present disclosure. As shown in Figures 6B and 6C, a first through hole is provided at one end of the first housing 410, the first through hole communicating with the inner cavity of the first housing 410, and the first through hole is used to output light signals.

[0105] In some embodiments, a light window is provided within the first through hole. The light window is sealingly connected to the first through hole. Exemplarily, the light window may be tilted within the first through hole. The tilt angle of the light window is 6-10°.

[0106] In some embodiments, the connection assembly 440 includes a lens holder 441 and a connecting sleeve 442. One end of the connecting sleeve 442 is connected to the second fiber optic adapter 830, and the other end of the connecting sleeve 442 is connected to one end of the lens holder 441, the other end of which is connected to the first housing 410.

[0107] In some embodiments, a converging lens 443 is provided inside the lens holder 441. The converging lens 443 is used to converge the optical signal output from the first housing 410, so that the optical signal is converged and transmitted to the second fiber optic adapter 830, thereby improving the coupling efficiency of the optical signal to the second fiber optic adapter 830.

[0108] In some embodiments, a second through hole is formed within the lens holder 441, the second through hole communicating with the first through hole, and a converging lens 443 is embedded within the second through hole. For example, the central axis of the second through hole is parallel to the central axis of the first through hole, and the optical axis of the converging lens 443 is parallel to the central axis of the second through hole.

[0109] In some embodiments, a third through hole is formed within the connecting sleeve 442, and the third through hole communicates with the second through hole. For example, the optical axis of the third through hole is parallel to the central axis of the second through hole.

[0110] In some embodiments, the light input end of the second fiber optic adapter 830 is embedded in the third through hole. The second fiber optic adapter 830 is provided with an isolator 840, which is located on the output optical path of the converging lens 443. The isolator 840 is used to prevent the reflected light signal from being transmitted back to the direction of the converging lens 443.

[0111] In some embodiments, a laser component 450 is disposed within the first housing 410, the laser component 450 being used to generate optical signals. For example, the laser component 450 may include one or more laser chips, and multiple laser chips can generate multiple optical signals. For instance, the laser component 450 may include four laser chips, enabling the laser component 450 to generate four optical signals.

[0112] In some embodiments, a thermoelectric cooler (TEC) 460 may be disposed within the first housing 410. The bottom of the TEC 460 is connected to the base plate of the first housing 410, and the top of the TEC 460 supports and connects to the laser assembly 450. For example, a first base 461 is disposed on the top of the TEC 460, and the laser assembly 450 is disposed on the first base 461.

[0113] In some embodiments, a collimating lens group 470 may be disposed within the first housing 410. The collimating lens group 470 is located in the output optical path of the laser assembly 450 and is used to collimate the optical signal generated by the laser assembly 450. Exemplarily, the collimating lens group 470 may include one or more collimating lenses. For example, the collimating lens group 470 may include four collimating lenses, which are correspondingly disposed in the output optical paths of four laser chips. The collimating lens group 470 may be disposed on the first base 461.

[0114] In some embodiments, a wavelength division multiplexing (WDM) component 480 may be disposed within the first housing 410, and the WDM component 480 is disposed in the output optical path of the laser component 450. The WDM component 480 is used to WDM multiplex multiple optical signals generated by the laser component 450, so as to WDM multiplex multiple optical signals into a single optical signal. The optical signal output by the WDM component 480 is transmitted to the first via.

[0115] In some embodiments, a second base 481 may be provided inside the first housing 410, with the top of the second base 481 supporting and connecting the wavelength division multiplexing (WDM) assembly 480. The bottom of the second base 481 may be fixedly connected to the base plate of the first housing 410. During the coupling assembly of the WDM assembly 480, the WDM assembly 480 may be first assembled onto the second base 481, so that the second base 481 carries and drives the WDM assembly 480 to move. Once the position of the WDM assembly 480 is accurately located, the second base 481 and the first housing 410 are fixedly connected.

[0116] Figure 6D is a partial schematic diagram of a light emitting component according to some embodiments of the present disclosure, and Figure 6E is a partial schematic diagram of a light emitting component according to some embodiments of the present disclosure. As shown in Figures 6C-6E, in some embodiments, an opening is provided on the side wall of the other end of the first housing 410, extending to the bottom plate of the first housing 410, so that the bottom plate of the first housing 410 fixes and supports the bottom of the electrical connector 430. The top of the opening is connected to the top of the electrical connector 430, one end of the electrical connector 430 is located inside the first housing 410, and the other end of the electrical connector 430 is located outside the first housing 410. One end of the electrical connector 430 is used for electrical connection to the laser component 450, etc., and the other end of the electrical connector 430 is used for electrical connection to the flexible circuit board. The use of the electrical connector 430 in the light emitting component 400 facilitates the hermetic sealing of the light emitting component 400, enabling the light emitting component 400 to be suitable for the industrial temperature range of -40 to 85°C.

[0117] In some embodiments, a backlight detection component 490 may be disposed within the first housing 410. The backlight detection component 490 is located on the backlight side of the laser component 450 and is used to receive the backlight from the laser component 450 to detect the intensity of the light signal generated by the laser component 450. The backlight detection component 490 may be disposed on the electrical connector 430 for fixation; alternatively, the backlight detection component 490 may be connected to the first housing 410 for fixation.

[0118] In some embodiments, one end of the electrical connector 430 has a first connection surface 431, on which a plurality of pads are formed. The laser assembly 450 can be wire-connected to the pads on the first connection surface 431. The first connection surface 431 can fixably support the backlight detection assembly 490.

[0119] In some embodiments, the backlight detection assembly 490 includes a backlight substrate 491 and a backlight detector 492. The backlight detector 492 is disposed on the backlight substrate 491, which is connected to a first connection surface 431. The backlight detector 492 is correspondingly disposed on the backlight side of the laser in the laser assembly 450 to receive the backlight of the corresponding laser.

[0120] In some embodiments, the backlight detection assembly 490 may include a plurality of backlight substrates 491, and a plurality of backlight detectors 492 are disposed on the backlight substrates 491. For example, the backlight detection assembly 490 includes a first backlight substrate and a second backlight substrate, with two backlight detectors 492 disposed on the first backlight substrate and two backlight detectors 492 disposed on the second backlight substrate. This facilitates the overall assembly of the backlight detection assembly 490 and ensures the coupling efficiency of the backlight detection assembly 490 in receiving the laser backlight from the laser assembly 450.

[0121] In some embodiments, one end of the electrical connector 430 may have a second connection surface 432, which is located above the side of the first connection surface 431, and a plurality of pads are formed on the second connection surface 432. The backlight detection assembly 490 is wire-connected to the pads on the second connection surface 432.

[0122] In some embodiments, the other end of the electrical connector 430 may have a third connection surface 433, on which a plurality of pads are formed, and the third connection surface 433 is soldered to the first flexible circuit board 301. For example, the third connection surface 433 and the first connection surface 431 may be located on the same layer as the electrical connector 430, so that the electrical connection between the pads on the third connection surface 433 and the pads on the first connection surface 431 does not pass through vias, thereby reducing the loss of high-frequency signals caused by vias.

[0123] Figure 6F is a schematic diagram of an electrical connector according to some embodiments of the present disclosure. As shown in Figure 6F, in some embodiments, the other end of the electrical connector 430 may have a fourth connecting surface 434, which is located below the third connecting surface 433. A plurality of pads are formed on the fourth connecting surface 434, and the fourth connecting surface 434 is connected to the second flexible circuit board 302. Exemplarily, the electrical connection between the pads on the fourth connecting surface 434 and the pads on the second connecting surface 432 is via a via.

[0124] Figure 6G is a partially enlarged view of an electrical connector according to some embodiments of the present disclosure, illustrating the internal structure of the electrical connector. As shown in Figure 6G, in some embodiments, a first routing surface 435 is formed inside the electrical connector 430. The first routing surface 435 extends from a first connecting surface 431 to a third connecting surface 433 to connect the first connecting surface 431 and the third connecting surface 433. Circuit traces are formed on the first routing surface 435 for connecting pads on the first connecting surface 431 and pads on the third connecting surface 433.

[0125] In some embodiments, a first high-frequency trace group 4351 and a second high-frequency trace group 4352 are formed on the first trace surface 435. One end of the first high-frequency trace group 4351 is connected to a high-frequency pad on the first trace surface 435, and the other end of the first high-frequency trace group 4351 is connected to a high-frequency pad on the third connection surface 433. One end of the second high-frequency trace group 4352 is connected to a high-frequency pad on the first trace surface 435, and the other end of the second high-frequency trace group 4352 is connected to a high-frequency pad on the third connection surface 433.

[0126] In some embodiments, a via 436 is formed within the electrical connector 430, and the via 436 penetrates the first trace surface 435. For example, a via 436 is provided on the side of a first high-frequency trace group 4351, a via 436 is provided on the side of a second high-frequency trace group 4352, and a via 436 is provided between the first high-frequency trace group 4351 and the second high-frequency trace group 4352.

[0127] Figure 6H is a cross-sectional schematic diagram of an electrical connector according to some embodiments of the present disclosure, showing a circuit trace from a second connection surface to a fourth connection surface. As shown in Figure 6H, a second trace surface 437 and a third trace surface 438 are formed inside the electrical connector 430. The second trace surface 437 is located on the outer extension direction of the second connection surface 432, and the third trace surface 438 is located on the outer extension direction of the fourth connection surface 434. Circuit traces are formed on the second trace surface 437 and the third trace surface 438, respectively. The top of the via 436 extends to the second trace surface 437, connecting the top of the via 436 to the circuit board trace on the second trace surface 437; the bottom of the via 436 extends to the third trace surface 438, connecting the bottom of the via 436 to the circuit board trace on the third trace surface 438, thereby achieving electrical connection between the pads on the second connection surface 432 and the pads on the fourth connection surface 434.

[0128] Figure 7 is a usage diagram of a TEC according to some embodiments of the present disclosure. As shown in Figure 7, a first pad 462 and a second pad 463 are formed on a first base 461, and the first pad 462 and the second pad 463 are located on the side of the laser assembly 450. A thermistor 464 is mounted on the first pad 462, and the thermistor 464 is wire-connected to the second pad 463. The first pad 462 and the second pad 463 are respectively wire-connected to an electrical connector 430, such as the first pad 462 and the second pad 463 being wire-connected to pads on a first connecting surface 431.

[0129] In some embodiments, the TEC460 includes a first electrode 4601 and a second electrode 4602, which are located on one side of the first base 461. The first electrode 4601 and the second electrode 4602 are respectively wire-connected to pads on the first connection surface 431.

[0130] In some embodiments, the first pad 462 and the second pad 463 are located at the top edge of the other side of the first base 461, facilitating sufficient space for the lasers in the laser assembly 450. Of course, in this embodiment, the first pad 462 and the second pad 463 may be located between two adjacent lasers in the laser assembly 450.

[0131] Figure 8 is a schematic diagram of another light-emitting component provided according to some embodiments of the present disclosure. As shown in Figure 8, in some embodiments, the first flexible circuit board 301 has a first extension plate 3011, which is used to extend the first flexible circuit board 301; the second flexible circuit board 302 has a second extension plate 3021, which is used to extend the second flexible circuit board 302. The first extension plate 3011 and the second extension plate 3021 are used to facilitate the connection between the light-emitting component 400 and the detection equipment, etc. After the light-emitting component 400 is tested, the first extension plate 3011 and the second extension plate 3021 are cut off.

[0132] Figure 9A is a schematic diagram of a light receiving component according to some embodiments of the present disclosure, and Figure 9B is an exploded schematic diagram of a light receiving component according to some embodiments of the present disclosure. Figures 9A and 9B show the structure of a light receiving component 500. The structures of the first light receiving component 500a and the second light receiving component 500b can be referenced to the structure of the light receiving component 500. As shown in Figures 9A and 9B, the light receiving component 500 includes a second housing 510 and a second upper cover 520, which covers and connects to the second housing 510. The cavity formed by the second housing 510 and the second upper cover 520 is used to accommodate lenses, light receiving components, and other devices used for transmitting and receiving light signals.

[0133] In some embodiments, the second optical transmission component 800b includes a third optical fiber adapter 850, a second optical fiber 860, and a fourth optical fiber adapter 870. One end of the second optical fiber 860 is connected to the third optical fiber adapter 850, and the other end of the second optical fiber 860 is connected to one end of the fourth optical fiber adapter 870. The other end of the fourth optical fiber adapter 870 is connected to the second housing 510.

[0134] In some embodiments, one end of the third flexible circuit board 303 extends into the second housing 510. Of course, in this embodiment, an electrical connector may be provided on the second housing 510, and the third flexible circuit board 303 is soldered to the electrical connector.

[0135] Figure 9C is a structural schematic diagram of a second housing according to some embodiments of the present disclosure, Figure 9D is a usage diagram of a second housing according to some embodiments of the present disclosure, and Figure 9E is a cross-sectional view of an optical receiving component according to some embodiments of the present disclosure. As shown in Figures 9C-9E, a fourth through hole 511 is formed at one end of the second housing 510, and the fourth through hole 511 communicates with the inner cavity of the second housing 510. The other end of the fourth optical fiber adapter 870 is embedded in and connected to the fourth through hole 511.

[0136] In some embodiments, the light-emitting end face of the fourth fiber optic adapter 870 extends into the second housing 510. Exemplarily, the light-emitting end face of the fourth fiber optic adapter 870 is an inclined surface, meaning that the light-emitting end face is not perpendicular to the optical axis of the fourth fiber optic adapter 870. The inclined light-emitting end face effectively prevents the light signal incident from the light-emitting end face from propagating along the optical axis of the fourth fiber optic adapter 870, reducing crosstalk between the incident light signal and the light signal input through the second optical transmission component 800b. Exemplarily, the inclination angle of the light-emitting end face is 4°-10°, such as 4°-7°.

[0137] In some embodiments, a notch 512 is formed at the other end of the second housing 510, that is, the notch 512 and the aforementioned fourth through hole 511 are disposed opposite to each other, and the notch 512 extends from the top of the second housing 510 to the bottom plate of the second housing 510. One end of the third flexible circuit board 303 passes through the notch 512, and the notch 512 facilitates the placement of one end of the third flexible circuit board 303 inside the second housing 510.

[0138] In some embodiments, a first stepped surface 514 may be formed on the bottom plate of the second housing 510, and the first stepped surface 514 supports and connects to the bottom surface of one end of the third flexible circuit board 303. For example, a reinforcing piece 3031 is provided on the bottom surface of one end of the third flexible circuit board 303. The top surface of the reinforcing piece 3031 is connected to the bottom surface of the third flexible circuit board 303, and the bottom surface of the reinforcing piece 3031 is connected to the first stepped surface 514. The reinforcing piece 3031 is used to reinforce the third flexible circuit board 303 to increase the strength of the third flexible circuit board 303, thereby facilitating the fixing of the third flexible circuit board 303. The reinforcing piece 3031 may be a steel reinforcing piece, etc.

[0139] In some embodiments, a first limiting platform 518 and a second limiting platform 519 may be formed on the first stepped surface 514, and the first limiting platform 518 and the second limiting platform 519 limit the connection of the third flexible circuit board 303. For example, the first limiting platform 518 is located at the edge of one side of the first stepped surface 514, and the second limiting platform 519 is located at the edge of the other side of the first stepped surface 514. The first limiting platform 518 and the second limiting platform 519 are connected to the sidewall of the second housing 510.

[0140] In some embodiments, a second stepped surface 515 may be formed on the bottom plate of the second housing 510, and the second stepped surface 515 supports and connects to the light receiving component 530. The light receiving component 530 is used to receive optical signals and convert them into photocurrent. Exemplarily, the light receiving component 530 may include one or more photodetectors, and multiple photodetectors can receive multiple beams of optical signals. The light receiving component 530 may include four photodetectors, so that the light receiving component 530 can receive four beams of optical signals.

[0141] In some embodiments, the second step surface 515 is positioned lower than the first step surface 514 to form a recess at the second step surface 515. A third base 540 is disposed on the second step surface 515, the bottom of the third base 540 being connected to the first step surface 514, and the top of the third base 540 supporting and connecting to the light receiving assembly 530. The third base 540 may be a base made of materials such as ceramic or tungsten copper.

[0142] In some embodiments, a transimpedance amplifier 550 is further disposed on the top of the third base 540, and the transimpedance amplifier 550 is located between the optical receiving assembly 530 and the end of the third flexible circuit board 303. The optical receiving assembly 530 is wire-connected to the transimpedance amplifier 550, and the transimpedance amplifier 550 is wire-connected to the third flexible circuit board 303. The edge of the third flexible circuit board 303 may be located on the side of the transimpedance amplifier 550, which facilitates control over the length between the transimpedance amplifier 550 and the third flexible circuit board 303 used for transmitting high-frequency signals.

[0143] In some embodiments, a copper plating layer is formed on the top surface of the third base 540, the transimpedance amplifier 550 is mounted on the surface of the third base 540, and the ground pad on the transimpedance amplifier 550 can be wired to the copper plating on the surface of the third base 540. The copper plating on the surface of the third base 540 is wired to the ground on the third flexible circuit board 303.

[0144] In some embodiments, a matching resistor or matching capacitor may be provided on the third base 540, and the matching resistor or matching capacitor is wired to the transimpedance amplifier 550.

[0145] In some embodiments, a third stepped surface 516 may be formed on the bottom plate of the second housing 510, and a wavelength demultiplexing component 560 is disposed on the third stepped surface 516. The light inlet of the wavelength demultiplexing component 560 is located on the side of the fourth through hole 511. The wavelength demultiplexing component 560 receives the optical signal output by the fourth fiber optic adapter 870 to split a single optical signal including multiple wavelengths into multiple beams and transmit them in the direction of the optical receiving component 530. For example, the optical signal output by the fourth fiber optic adapter 870 includes four wavelengths, and the wavelength demultiplexing component 560 can split the single optical signal into four beams of optical signals for output, with each beam of optical signal representing one wavelength.

[0146] In some embodiments, the optical receiving component 500 may include an optical deflection component 570, which is located on the output optical path from the wavelet demultiplexing component 560 to the optical receiving component 530. The optical axis of the output optical signal of the wavelet demultiplexing component 560 is parallel to the third step surface 516, while the receiving optical axis of the photodetector in the optical receiving component 530 is perpendicular to the third step surface 516. The optical deflection component 570 can change the propagation direction of the output optical signal of the wavelet demultiplexing component 560 to facilitate the reception of the optical signal by the photodetector in the optical receiving component 530.

[0147] In some embodiments, the optical deflection assembly 570 includes a deflection prism 571 and a converging lens array 572. The converging lens array 572 is located in the output optical path of the wave demultiplexing assembly 560. The incident light side of the deflection prism 571 is connected to the deflection prism 571, and the reflecting surface of the deflection prism 571 is located above the optical receiving assembly 530. The optical signal output from the wave demultiplexing assembly 560 is transmitted to the converging lens array 572, converged by the converging lens array 572, transmitted to the deflection prism 571, and then reflected by the reflecting surface of the deflection prism 571 to the optical receiving assembly 530.

[0148] In some embodiments, a fourth stepped surface 517 may be formed on the bottom plate of the second housing 510. The fourth stepped surface 517 is located between the third stepped surface 516 and the second stepped surface 515, and the position of the fourth stepped surface 517 is higher than that of the second stepped surface 515. The fourth stepped surface 517 supports the bottom of the converging lens array 572, and the converging lens array 572 is located at the edge of the fourth stepped surface 517, so that the deflection prism 571 is suspended above the light receiving assembly 530.

[0149] In some embodiments, a collimating lens 580 may be disposed on the third step surface 516, and the collimating lens 580 is located between the wavelet demultiplexing component 560 and the fourth through-hole 511. The collimating lens 580 collimates the optical signal output by the fourth fiber optic adapter 870 in order to ensure the coupling efficiency of the optical signal to the wavelet demultiplexing component 560.

[0150] Figure 9F is a schematic diagram of a second top cover according to some embodiments of the present disclosure. As shown in Figures 9E and 9F, the second top cover 520 may include a cover body 521 and a side plate 522. The side plate 522 is located at the end of the cover body 521, and the top of the side plate 522 is connected to the cover body 521. The bottom of the cover body 521 is connected to the top of the second housing 510, and the side plate 522 is located within a notch 512. The bottom of the side plate 522 may be connected to a third flexible circuit board 303. The second top cover 520, in conjunction with the second housing 510 in the above embodiments, can effectively reduce the thickness of the light receiving component 500, such as reducing the thickness of the light receiving component 500 from 5.5 mm to 2.9 mm, which facilitates the stacking of the light receiving component 500 and the light emitting component 400 within the housing.

[0151] In some embodiments, the second top cover 520 may include a pressure plate 523 connected to the bottom of the side plate 522. For example, the end of the pressure plate 523 is connected to the side plate 522, and the bottom surface of the pressure plate 523 contacts the top surface of the third flexible circuit board 303 to strengthen the fixation of the third flexible circuit board 303.

[0152] In some embodiments, a clearance portion 5211 is formed on the cover plate body 521. The clearance portion 5211 is formed by a partial recess of the cover plate body 521 toward the bottom surface of the cover plate body 521. The clearance portion 5211 is used to avoid the connecting assembly 440 so that the light emitting component 400 and the light receiving component 500 can be stacked vertically.

[0153] Figure 10A is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure, and Figure 10B is a partial schematic diagram of another optical module provided according to some embodiments of the present disclosure. In some embodiments, a first optical receiving component 500a is stacked opposite to a first optical emitting component 400a, and a second optical receiving component 500b is stacked opposite to a second optical emitting component 400b, such that the bottom plates of the first housings of the first optical emitting component 400a and the second optical emitting component 400b face the cover plate 2011, and the bottom plates of the second housings of the second optical receiving component 500b and the second optical receiving component 500b face the bottom plate 2021. Exemplarily, the second upper cover 520a of the first optical receiving component 500a supports and connects to the first upper cover 420a of the first optical emitting component 400a. This facilitates the transfer of heat from the first light emitting component 400a and the second light emitting component 400b to the upper housing 201, and facilitates the transfer of heat from the first light receiving component 500a and the second light receiving component 500b to the lower housing 202, thereby reducing thermal crosstalk between the first light receiving component 500a and the first light emitting component 400a, and reducing crosstalk between the second light receiving component 500b and the second light emitting component 400b.

[0154] Figure 10C is a schematic diagram of a circuit board structure according to some embodiments of the present disclosure. As shown in Figure 10C, a first pad group 304 and a second pad group 305 may be disposed on the circuit board 300. The first pad group 304 is located on one side of the first driver 320 and between the first light emitting component 400a and the first driver 320. The second pad group 305 is located on the other side of the first driver 320 and is close to the gold finger 310.

[0155] In some embodiments, the first flexible circuit board 301a is electrically connected to the first pad group 304, and the second flexible circuit board 302a is electrically connected to the second pad group 305. This facilitates reducing the transmission distance of the high-frequency signal output by the first driver 320 to the first optical emitting component 400a, thereby ensuring the transmission quality of the high-frequency signal.

[0156] In some embodiments, a third pad group 306 and a fourth pad group 307 may be provided on the circuit board 300. The third pad group 306 is located on one side of the second driver 330 and between the second light emitting component 400b and the second driver 330. The fourth pad group 307 is located on the other side of the second driver 330 and is close to the gold finger 310.

[0157] In some embodiments, the first flexible circuit board 301b is electrically connected to the third pad group 306, and the second flexible circuit board 302a is electrically connected to the fourth pad group 307. This facilitates reducing the transmission distance of the high-frequency signal output by the second driver 330 to the second optical emitting component 400b, thereby ensuring the transmission quality of the high-frequency signal.

[0158] In some embodiments, a gap exists between the first driver 320 and the second driver 330, and the middle portion of the second flexible circuit board 302a extends through this gap. Alternatively, in this embodiment, the middle portion of the second flexible circuit board 302a may extend through the gap between the first driver 320 and the lower side plate 2022.

[0159] In some embodiments, there is a gap between the second driver 330 and the lower side plate 2022, through which the second flexible circuit board 302a passes. Of course, in this embodiment, the middle portion of the second flexible circuit board 302a may also pass through the gap between the first driver 320 and the second driver 330.

[0160] Figure 10D is a schematic diagram of a second flexible circuit board according to some embodiments of the present disclosure. As shown in Figure 10D, the second flexible circuit board 302 may include a first connecting portion 3022, on which a plurality of pads are formed for soldering and connecting an electrical connector 430. Exemplarily, the central axis of the first connecting portion 3022 extends along the length direction of the circuit board 300.

[0161] In some embodiments, the second flexible circuit board 302 may include a second connection portion 3026, on which a plurality of pads are formed for soldering a second pad group 305 or a fourth pad group 307 through the pads.

[0162] In some embodiments, the central axis of the second connection portion 3026 extends along the width direction of the circuit board 300. This facilitates the use of space on the circuit board 300.

[0163] In some embodiments, the second flexible circuit board 302 may include a first transition portion 3023, with one end of the first transition portion 3023 having a relatively large width and the other end having a relatively small width. One end of the first transition portion 3023 is connected to the first connecting portion 3022, and the first transition portion 3023 is used to gradually reduce the width of the second flexible circuit board 302. Exemplarily, the central axis of the first transition portion 3023 extends along the length direction of the circuit board 300.

[0164] In some embodiments, the second flexible circuit board 302 may include a first extension 3025. One end of the first extension 3025 is connected to the first transition portion 3023, and the other end of the first extension 3025 is connected to the side of the second connecting portion 3026. The first extension 3025 is used to connect the first transition portion 3023 to the second connecting portion 3026. Exemplarily, the central axis of the first extension 3025 extends along the length direction of the circuit board 300.

[0165] In some embodiments, the first extension 3025 has a relatively long length to facilitate the placement of the second flexible circuit board 302 within the cavity; for example, the first extension 3025 may extend from one side of the first driver 320 to the other side of the first driver 320. For instance, the first extension 3025 may extend through the gap between the first driver 320 and the second driver 330, or through the gap between the second driver 330 and the lower side plate 2022, etc.

[0166] In some embodiments, the second flexible circuit board 302 may include a second transition portion 3024. One end of the second transition portion 3024 is connected to one end of the first transition portion 3023, and the other end of the second transition portion 3024 is connected to one end of the first extension portion 3025. The central axis of the second transition portion 3024 forms an angle with the length direction of the circuit board 300, causing the second transition portion 3024 to be inclined relative to the length direction of the circuit board 300, which facilitates the extension of the second flexible circuit board 302 to the gap between the first driver 320 and the second driver 330, etc.

[0167] Figure 11A is a schematic diagram of a first fiber optic cable support according to some embodiments of the present disclosure, Figure 11B is a schematic diagram of a first fiber optic cable support according to some embodiments of the present disclosure, and Figure 11C is an assembly diagram of a first fiber optic cable support and a circuit board according to some embodiments of the present disclosure. As shown in Figures 11A-11C, the first fiber optic cable support 700a includes a fiber optic cable body 710, a first baffle 720, and a second baffle 730. The side of the end of the first baffle 720 is connected to the bottom of the fiber optic cable body 710 through a first connecting plate 740, so that the side of the first baffle 720 and the side of the fiber optic cable body 710 form a first winding cavity 741; the first connecting plate 740 can support the first optical fiber, etc., and the first baffle 720 and the fiber optic cable body 710 can block the first optical fiber, etc., so as to limit the first optical fiber, etc., within the first fiber optic cable cavity 741. The side of the end of the second baffle 730 is connected to the bottom of the fiber coil body 710 through the second connecting plate 750, so that the side of the second baffle 730 and the side of the fiber coil body 710 form a second fiber coil cavity 751; the second connecting plate 750 can support the first optical fiber, etc., and the second baffle 730 and the fiber coil body 710 can block the first optical fiber, etc., so as to limit the first optical fiber, etc., within the second fiber coil cavity 751.

[0168] The fiber optic coil body 710 is located above the circuit board 300 and has a preset distance from the top surface of the circuit board 300 to avoid interference between the fiber optic coil body 710 and the components on the top surface of the circuit board 300. The first connecting plate 740 and the second connecting plate 750 are respectively located above the side of the circuit board 300 to reduce the impact of the first connecting plate 740 and the second connecting plate 750 on the top surface layout of the circuit board 300.

[0169] In some embodiments, the fiber coil body 710 may include a fiber coil side plate 711, the bottom of which is connected to a first connecting plate 740 and a second connecting plate 750. The fiber coil side plate 711 can guide the coiling and bending of the first and second optical fibers. For example, the fiber coil side plate 711 is an arc-shaped plate, which facilitates control of the bending degree of the first and second optical fibers and effectively reduces excessive bending of the first and second optical fibers.

[0170] In some embodiments, the fiber coil body 710 may include a reinforcing plate 712 located inside the fiber coil side plate 711 to increase the strength of the fiber coil body 710. The side of the reinforcing plate 712 is connected to the top of the inner side of the fiber coil side plate 711, and the thickness of the reinforcing plate 712 is less than the height of the fiber coil side plate 711, which helps to reduce the overall weight of the fiber coil body 710.

[0171] In some embodiments, the first baffle 720 may extend along the length of the circuit board 300, with one end of the first baffle 720 away from the gold finger 310 and the other end of the first baffle 720 close to the gold finger. The side of the other end of the first baffle 720 may be connected to the first connecting plate 740.

[0172] In some embodiments, a first limiting plate 721 may be formed on the inner side of one end of the first baffle 720, and the first limiting plate 721 may be suspended above the circuit board 300. The first limiting plate 721 is used to assist in limiting the first optical fiber, etc., and to help reduce the first optical fiber, etc. from detaching from the first fiber optic cable support 700a.

[0173] In some embodiments, a first support post 722 may be formed below one end of the first baffle 720. The bottom of the first support post 722 is connected to the top surface of the circuit board 300, so that the circuit board 300 is supported and connected to the first fiber optic bracket 700a through the first support post 722.

[0174] In some embodiments, a second support post 723 may be formed below the other end of the first baffle 720. The bottom of the second support post 723 is connected to the top surface of the circuit board 300, so that the circuit board 300 is supported and connected to the first fiber optic bracket 700a through the second support post 723.

[0175] In some embodiments, a first hook 724 may be formed below the first baffle 720, and the first hook 724 engages with the side of the circuit board 300. For example, a first fixing opening 3001 is formed on the side of the circuit board 300, and the first hook 724 engages within the first fixing opening 3001. The first hook 724 may be located between the first support post 722 and the second support post 723.

[0176] In some embodiments, the second baffle 730 may extend along the length of the circuit board 300, with one end of the second baffle 730 away from the gold finger 310 and the other end of the second baffle 730 close to the gold finger. The side of the other end of the second baffle 730 may be connected to the second connecting plate 750.

[0177] In some embodiments, a second limiting plate 731 is formed on the inner side of one end of the second baffle 730, and the second limiting plate 731 can be suspended above the circuit board 300. For example, the second limiting plate 731 can be disposed opposite to the first limiting plate 721. The second limiting plate 731 is used to assist in limiting the first optical fiber, etc., and to help reduce the first optical fiber, etc. from detaching from the first fiber optic cable support 700a.

[0178] In some embodiments, a third support post 732 may be formed below one end of the second baffle 730. The bottom of the third support post 732 is connected to the top surface of the circuit board 300, so that the circuit board 300 is supported and connected to the first fiber optic bracket 700a through the third support post 732.

[0179] In some embodiments, a fourth support post 733 may be formed below the other end of the second baffle 730. The bottom of the fourth support post 733 is connected to the top surface of the circuit board 300, so that the circuit board 300 is supported and connected to the first fiber optic bracket 700a through the fourth support post 733.

[0180] In some embodiments, a second hook 734 may be formed below the second baffle 730, and the second hook 734 engages with the side of the circuit board 300. For example, a second fixing opening 3002 is formed on the side of the circuit board 300, and the second hook 734 engages within the second fixing opening 3002. The second hook 734 may be located between the third support post 732 and the fourth support post 733.

[0181] In some embodiments, the first fiber optic cable support 700a may include a fiber bundle 713, which is located on the side of the fiber optic cable side plate 711 and connected to the top of the fiber optic cable side plate 711. The fiber bundle 713 is used to bind the first optical fiber or the like to the side of the fiber optic cable side plate 711.

[0182] In some embodiments, the first fiber optic cable support 700a may include a plurality of fiber bundlers 713 disposed on the side of the fiber optic cable side plate 711, and the plurality of fiber bundlers 713 located between the other end of the first baffle 720 and the other end of the second baffle 730. For example, two fiber bundlers 713 are disposed on the side of the fiber optic cable side plate 711.

[0183] In some embodiments, the first support post 722, the second support post 723, and the first hook 724 are connected to the edge of one side of the circuit board 300, and the third support post 732, the fourth support post 733, and the second hook 734 are connected to the edge of the other side of the circuit board 300. The first baffle 720 extends along the upper edge of one side of the circuit board 300, and the second baffle 730 extends along the upper edge of the other side of the circuit board 300, so that the first baffle 720 is close to and extends along the lower side plate of one side of the lower housing 202, and the second baffle 730 is close to and extends along the lower side plate of the other side of the lower housing 202, which helps to reduce the impact of assembling the first fiber optic cable support 700a in the housing on the utilization rate of its internal space.

[0184] Figure 12A is a schematic diagram of a second fiber optic cable support according to some embodiments of the present disclosure, and Figure 12B is a schematic diagram of a second fiber optic cable support according to some embodiments of the present disclosure. As shown in Figures 12A and 12B, the second fiber optic cable support 700b may include a third connecting plate 760, a fourth connecting plate 770, and a bridging plate 780. One end of the bridging plate 780 is connected to the third connecting plate 760, and the other end of the bridging plate 780 is connected to the fourth connecting plate 770. The third connecting plate 760 and the fourth connecting plate 770 are used to limit the first optical fiber, the second optical fiber, etc.

[0185] In some embodiments, a third limiting plate 761 is formed on the top of one end of the third connecting plate 760, and the third limiting plate 761 extends in the direction of the fourth connecting plate 770. The third limiting plate 761 is used to limit the first optical fiber, etc., in the height direction of the optical module. For example, the extension direction of the third limiting plate 761 is perpendicular or approximately perpendicular to the length direction of the optical module. The other end of the third connecting plate 760 is connected to one end of the bridging plate 780.

[0186] In some embodiments, a fourth limiting plate 771 is formed on the top of one end of the fourth connecting plate 770, and the fourth limiting plate 771 extends in the direction of the third connecting plate 760. The fourth limiting plate 771 is used to limit the first optical fiber, etc., in the height direction of the optical module. Exemplarily, the extending direction of the fourth limiting plate 771 is perpendicular or approximately perpendicular to the length direction of the optical module. The other end of the fourth limiting plate 771 is connected to one end of the bridging plate 780.

[0187] In some embodiments, the bridging plate 780 includes a bridging body 781, a first bridging portion 782, and a second bridging portion 783. One end of the first bridging portion 782 is connected to the other end of the third connecting plate 760, and the other end of the first bridging portion 782 is connected to one end of the bridging body 781. One end of the second bridging portion 783 is connected to the other end of the fourth connecting plate 770, and the other end of the second bridging portion 783 is connected to the other end of the bridging body 781.

[0188] In some embodiments, one end of the first bridging portion 782 is connected to the top of the inner side of the other end of the third connecting plate 760, so that the outer side of the first bridging portion 782 and the outer side of the other end of the third connecting plate 760 have space for the first optical fiber or the like to pass through.

[0189] In some embodiments, one end of the second bridging portion 783 is connected to the top of the inner side of the other end of the fourth connecting plate 770, and the outer side of the second bridging portion 783 and the outer side of the other end of the second bridging portion 783 have spaces for the first optical fiber to pass through.

[0190] In some embodiments, the bridging body 781 has a first clearance hole 7811 and a second clearance hole 7812. The first clearance hole 7811 is used to avoid the first light emitting component 400a, and the second clearance hole 7812 is used to avoid the second light emitting component 400b. The connecting bracket of the first light emitting component 400a spans across the first clearance hole 7811, and the connecting bracket of the second light emitting component 400b spans across the second clearance hole 7812. The side of the bridging body 781 can limit the first light emitting component 400a and the second light emitting component 400b.

[0191] In some embodiments, the second fiber optic cable support 700b may include a fixing plate 790, which is connected to a bridging plate 780. The fixing plate 790 is used to connect the second fiber optic cable support 700b to the lower housing 202. For example, one end of the fixing plate 790 has a fixing hole 791 for connecting to the lower housing 202 through the fixing hole 791; the other end of the fixing plate 790 is connected to the bridging body 781.

[0192] In some embodiments, the other end of the fixing plate 790 is connected to the lower part of the bridging body 781, and the connection between the fixing plate 790 and the bridging body 781 is located between the first clearance hole 7811 and the second clearance hole 7812.

[0193] In some embodiments, a reinforcing plate 792 is formed at the other end of the fixing plate 790, and the reinforcing plate 792 reinforces the connection between the fixing plate 790 and the bridging body 781.

[0194] Figure 13 is a partial structural schematic diagram of a lower housing according to some embodiments of the present disclosure. As shown in Figure 13, a first fixing seat 2023 may be formed on the base plate 2021, and the first fixing seat 2023 protrudes from the top surface of the base plate 2021. The first fixing seat 2023 is used to support the connecting fixing plate 790. In some embodiments, a fixing post 2024 is formed on the top of the first fixing seat 2023, and the fixing post 2024 is connected to the fixing hole 791.

[0195] In some embodiments, a second fixing seat 2025 may be formed on the base plate 2021, the second fixing seat 2025 protruding from the top surface of the base plate 2021. The sidewall of the second fixing seat 2025 is used to limit the connection between the light emitting component 400 and the light receiving component 500.

[0196] In some embodiments, a positioning seat 2026 is formed on the inner wall of the lower side plate 2022. The positioning seat 2026 is used to assist in positioning the light receiving component 500 so as to facilitate positioning during the assembly of the light receiving component 500.

[0197] Figure 14A is an assembly schematic of a second fiber optic cable holder according to some embodiments of the present disclosure, and Figure 14B is a cross-sectional view of a second fiber optic cable holder in use according to some embodiments of the present disclosure. As shown in Figures 14A and 14B, the fixing post 2024 is embedded in the fixing hole 791, and the top of the first fixing seat 2023 supports one end of the fixing plate 790; the other end is supported by the first optical receiving component 500a, etc. When the upper housing 201 is closed and connected to the lower housing 202, the cover plate 2011 of the upper housing 201 presses against the top of the bridging body 781, fixing the second fiber optic cable holder 700b in the cavity.

[0198] In some embodiments, the outer side of the third connecting plate 760 is close to the lower side plate 2022 on the side of the upper housing 201, and the outer side of the first bridging portion 782 is spaced from the lower side plate 2022. The first optical fiber or the like passes through the space to cooperate with the third limiting plate 761 to coil the first optical fiber or the like.

[0199] In some embodiments, the outer side of the fourth connecting plate 770 is close to the lower side plate 2022 on the other side of the upper housing 201, and the outer side of the second bridging portion 783 is spaced from the lower side plate 2022. The first optical fiber or the like passes through the space to cooperate with the fourth limiting plate 771 to coil around the first optical fiber or the like.

[0200] In some embodiments, the second fixing base 2025 is located on the side of the first light emitting component 400a and the first light receiving component 500a, etc. The sidewall of the second fixing base 2025 abuts against the first light emitting component 400a and the first light receiving component 500a, etc., to limit the first light emitting component 400a and the first light receiving component 500a, etc., in the length direction of the optical module. The second fixing base 2025 cooperates with the second fiber optic bracket 700b to fix the first light emitting component 400a and the first light receiving component 500a, etc., in the length direction of the optical module, which facilitates more securely fixing the first light emitting component 400a and the first light receiving component 500a, etc., in the cavity.

[0201] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, comprising: Circuit board; A light-emitting component is located at one end of the circuit board and is electrically connected to the circuit board. An optical receiving component is disposed below the optical emitting component, and the optical receiving component is supported and connected to the optical emitting component; The light emitting component includes: The first housing has a first through hole at one end and an opening at the other end; A laser component, located within the first housing, is configured to generate an optical signal; The first upper cover covers and connects to the first housing. An electrical connector is embedded in the opening; one end of the electrical connector extends into the inner cavity of the first housing, and the other end of the electrical connector is located outside the first housing; one end of the electrical connector is wired to the laser assembly, and the other end of the electrical connector has a third connection surface and a fourth connection surface, with the third connection surface located above the fourth connection surface; The optical receiving component includes: The second shell has a fourth through hole at one end and a notch at the other end; The second upper cover includes a cover plate body and a side plate, the top of the side plate being connected to the cover plate body; the second upper cover is closed and connected to the second housing, the cover plate body being connected to the top of the second housing, and the side plate being located within the notch; a light receiving component is disposed within the cavity formed by the second housing and the second upper cover, and the second upper cover supports the light emitting component; A first flexible circuit board is welded to the third connecting surface at one end and to the circuit board at the other end. The second flexible circuit board has one end welded to the fourth connecting surface and the other end welded to the circuit board. A third flexible circuit board extends into the second housing at one end and is fixedly connected to the second housing. The third flexible circuit board is electrically connected to the optical receiving component.

2. The optical module according to claim 1, wherein, A first driver is provided on the top surface of the circuit board, and gold fingers are provided on the surface of the end of the circuit board. A first pad group is provided on one side of the first driver, and a second pad group is provided on the other side of the first driver. The second pad group is close to the gold fingers. The first driver is electrically connected to the first pad group; One end of the electrical connector has a first connecting surface and a second connecting surface, with the second connecting surface located above the first connecting surface; the first connecting surface and the third connecting surface are located on the same layer of the electrical connector. The first connecting surface is located on the backlight side of the laser component, and the first connecting surface is wire-connected to the laser component; The light emitting component further includes a backlight detection component, which is disposed on the first connecting surface and is wire-connected to the second connecting surface; The other end of the first flexible circuit board is soldered to the first pad group; the laser component is electrically connected to the first driver in sequence through the first connecting surface, the third connecting surface and the first flexible circuit board; The other end of the second flexible circuit board is soldered to the second pad group; the backlight detection component is electrically connected to the second pad group in sequence through the second connecting surface, the fourth connecting surface and the second flexible circuit board.

3. The optical module according to claim 2, wherein, The optical module also includes: The second transmission component includes a third fiber optic adapter, a second fiber optic cable, and a fourth fiber optic adapter connected in sequence. The third fiber optic adapter is located at the optical port of the optical module, and the fourth fiber optic adapter is embedded in the fourth through-hole.

4. The optical module according to claim 2, wherein, The light emitting component also includes: A connecting assembly includes a lens holder and a connecting sleeve, wherein a second through hole is formed in the lens holder; one end of the lens holder is connected to the connecting sleeve, and the other end of the lens holder is connected to the first housing; the second through hole communicates with the first through hole; a converging lens is disposed in the second through hole. The optical module also includes: The first transmission component includes a first fiber optic adapter, a first fiber optic cable, and a second fiber optic adapter connected in sequence. The first fiber optic adapter is located at the optical port of the optical module, and the second fiber optic adapter is connected to the connecting sleeve.

5. The optical module according to claim 4, wherein, A third through hole is formed on the connecting sleeve, and the third through hole, the second through hole and the first through hole are connected in sequence. The light input end of the second fiber optic adapter is embedded in the third through hole, and the converging lens converges the optical signal to the second fiber optic adapter.

6. The optical module according to claim 2, wherein, The light emitting component includes a TEC, which is located on the side of the electrical connector; The top of the TEC is provided with a first base, which supports and connects the laser component; On the side of the laser assembly, a first pad and a second pad are formed on the first base, and a thermistor is mounted on the first pad. The thermistor is wired to the second pad, and the first pad and the second pad are wired to the electrical connector.

7. The optical module according to claim 2, wherein, The electrical connector has a first wiring surface formed inside, which extends from the first connection surface to the third connection surface; A high-frequency trace group is formed on the first trace surface. One end of the high-frequency trace group is connected to the high-frequency pad on the first connection surface, and the other end of the high-frequency trace group is connected to the high-frequency pad on the third connection surface. The electrical connector has a via formed inside, which passes through the side of the high-frequency trace group and electrically connects the pads on the second connection surface and the pads on the fourth connection surface.

8. The optical module according to claim 7, wherein, The electrical connector has a second routing surface and a third routing surface inside; the second routing surface is coplanar with the second connection surface, and the third routing surface is coplanar with the fourth connection surface. The second routing surface and the third routing surface are respectively formed with circuit traces; the top of the via is connected to the circuit trace on the second routing surface, and the bottom of the via is connected to the circuit trace on the third routing surface, so as to electrically connect the pads on the second connection surface and the pads on the fourth connection surface through the via.

9. The optical module according to claim 2, wherein, The second flexible circuit board includes a first connecting portion, a first transition portion, a second transition portion, a first extension portion, and a second connecting portion connected in sequence, and the side of the end of the first extension portion is connected to the side of the second connecting portion; The first connecting portion has a solder pad for welding the fourth connecting surface, and the second connecting portion has a solder pad for welding the second solder pad group. The width of one end of the first transition portion is greater than the width of the other end of the first transition portion, the extension direction of the second transition portion is inclined relative to the extension direction of the first transition portion, and the first extension portion is located on the side of the first driver.

10. The optical module according to claim 4, wherein, The first transmission component further includes an isolator located at the optical input end of the second optical fiber adapter; A third through hole is formed on the connecting sleeve, the third through hole is connected to the second through hole, and the light input end of the second optical fiber adapter is embedded in the third through hole; A light window is provided inside the first through hole, and the light window is sealed to the first through hole. The light window is not perpendicular to the central axis of the first through hole. The backlight detection assembly includes a backlight substrate and multiple backlight detectors; The backlight detector is disposed on the top surface of the backlight substrate, and the bottom surface of the backlight substrate is connected to the first connecting surface.

11. The optical module according to claim 3, wherein, The bottom of the second upper cover is connected to the top surface of the third flexible circuit board; The second top cover also includes a pressure plate, the end of which is connected to the bottom of the side plate, and the bottom surface of which is connected to the circuit board; A reinforcing plate is provided at the bottom of one end of the third flexible circuit board. The top surface of the reinforcing plate is connected to the bottom surface of the third flexible circuit board, and the bottom surface of the reinforcing plate is connected to the bottom plate of the second housing.

12. The optical module according to claim 4, wherein, The optical module further includes a first fiber optic cable support, which is connected to the circuit board; wherein the first fiber optic cable support includes a fiber optic cable body, a first baffle, and a second baffle. The side of the end of the first baffle is connected to the bottom of the fiber coil body through the first connecting plate, and the first baffle, the first connecting plate and the side of the fiber coil body form a first winding cavity; The side of the end of the second baffle is connected to the bottom of the fiber coil body through the second connecting plate. The second baffle, the second connecting plate and the side of the fiber coil body form a second coiling cavity; the first optical fiber passes through the first coiling cavity and the second coiling cavity.

13. The optical module according to claim 12, wherein, Below the first baffle, there are a first support column, a second support column, and a first hook, with the first hook located between the first support column and the second support column; A third support column, a fourth support column, and a second hook are formed below the second baffle, with the second hook located between the third support column and the fourth support column; A first fixing port is formed on one side of the circuit board, and a second fixing port is formed on the other side of the circuit board. The top surface of the circuit board is connected to the first support column, the second support column, the third support column and the fourth support column. The first hook engages with the first fixing port, and the second hook engages with the second fixing port.

14. The optical module according to claim 12, wherein, The fiber coil body includes a fiber coil side plate and a reinforcing plate. The fiber coil side plate is an arc plate. The bottom of the outer side of the fiber coil side plate is connected to the first connecting plate and the second connecting plate, and the top of the inner side of the fiber coil side plate is connected to the reinforcing plate. A first limiting plate is formed at the top of one end of the first baffle, and a second limiting plate is formed at the top of one end of the second baffle. The first limiting plate extends in the direction of the second baffle, and the second limiting plate extends in the direction of the first baffle. The first fiber optic cable support also includes a fiber bundler, which is connected to the top of the fiber optic cable side plate and is located between the other end of the first baffle and the other end of the second baffle.

15. The optical module according to claim 4, wherein, The optical module also includes a second fiber optic bracket, which includes a third connecting plate, a fourth connecting plate, a bridging plate, and a fixing plate. One end of the bridging plate is connected to the third connecting plate, the other end of the bridging plate is connected to the fourth connecting plate, and the fixing plate is connected to the bottom of the bridging plate. The third connecting plate and the fourth connecting plate limit the first optical fiber, and the side of the bridging plate abuts against the side of the first housing; The lower housing of the optical module has a first fixing seat and a second fixing seat. The first fixing seat supports and connects to the fixing plate, and the side wall of the second fixing seat abuts against the side of the electrical connector.

16. The optical module according to claim 15, wherein, The bridging plate includes a bridging body, a first bridging portion, and a second bridging portion; one end of the first bridging portion is connected to the top of the inner side of the third connecting plate, and the other end of the first bridging portion is connected to one end of the bridging body; one end of the second bridging portion is connected to the top of the inner side of the fourth connecting plate, and the other end of the second bridging portion is connected to the other end of the bridging body; the fixing plate is connected to the bridging body. A third limiting plate is formed on the top of one end of the third connecting plate, and a fourth limiting plate is formed on the fourth connecting plate. The third limiting plate, the first bridging portion, the fourth limiting plate, and the second bridging portion limit the first optical fiber. The side of the bridging plate abuts against the side of the first housing.

17. The optical module according to claim 16, wherein, The third connecting plate and the fourth connecting plate limit the second optical fiber, and the bottom of the bridging plate abuts against the cover plate body; a first fixing seat and a second fixing seat are formed on the lower housing of the optical module, the first fixing seat supports and connects the fixing plate, and the side wall of the second fixing seat abuts against the second housing.

18. The optical module according to claim 3, wherein, The bottom plate of the second housing has a first stepped surface and a second stepped surface; The first stepped surface is located at the edge of the notch, and the first stepped surface provides fixed support for the third flexible circuit board; A first limiting platform is formed on one side edge of the first stepped surface, and a second limiting platform is formed on the other side edge of the first stepped surface. The first limiting platform and the second limiting platform limit the connection of the third flexible circuit board. The second step surface is located on one side of the first step surface and is lower than the first step surface. A third base is provided on the second step surface, and the third base supports and connects the light receiving component.

19. The optical module according to claim 18, wherein, The bottom plate of the second housing has a third stepped surface and a fourth stepped surface; the third stepped surface is located on the side of the fourth through hole, and a wave demultiplexing component and a collimating lens are disposed on the third stepped surface, with the collimating lens located between the fourth through hole and the light inlet of the wave demultiplexing component; The fourth step surface is higher than the second step surface, and the fourth step surface supports and connects the optical deflection component; the optical deflection component includes a deflection prism and a converging lens array, the converging lens array is located in the output optical path of the wave decomposition and multiplexing component and is connected to the fourth step surface at its bottom; the light-emitting side of the deflection prism is connected to the converging lens array, and the light-emitting side of the deflection prism is located above the optical receiving component.

20. The optical module according to claim 3, wherein, The first optical receiving component further includes a third base, the bottom of which is connected to the bottom plate of the second housing, and the third base supports and connects the optical receiving component. A copper-clad layer is formed on the top surface of the third base, and a transimpedance amplifier is mounted on the copper-clad layer. The transimpedance amplifier is located at the edge of the third flexible circuit board, and the transimpedance amplifier is wire-connected to the third base and the third flexible circuit board.

21. The optical module according to claim 2, wherein, The cover plate body is provided with a clearance part, which avoids the light emitting component.

22. The optical module according to claim 1, wherein, The light emitting component includes a first light emitting component and a second light emitting component; the light receiving component includes a first light receiving component and a second light receiving component; The first light-emitting component is located at one end of the circuit board; The second light emitting component is located at one end of the circuit board and is located on the side of the first light emitting component; The first light receiving component is located below the first light emitting component and is supported and connected to the first light emitting component; The second light receiving component is located below the second light emitting component and is supported and connected to the second light emitting component.

23. An optical module, wherein, include: A circuit board has a first driver on its top surface and gold fingers on the surface of its ends. A first pad group is provided on one side of the first driver, and a second pad group is provided on the other side of the first driver. The second pad group is close to the gold fingers. The first driver is electrically connected to the first pad group; A light-emitting component is located at one end of the circuit board and is electrically connected to the circuit board. An optical receiving component is disposed below the optical emitting component, and the optical receiving component is supported and connected to the optical emitting component; The light emitting component includes: The first housing has a first through hole at one end and an opening at the other end; A laser component, located within the first housing, is configured to generate an optical signal; The first upper cover covers and connects to the first housing. An electrical connector is embedded in the opening; one end of the electrical connector extends into the inner cavity of the first housing, and the other end of the electrical connector is located outside the first housing; one end of the electrical connector has a first connecting surface and a second connecting surface, with the second connecting surface located above the first connecting surface; the other end of the electrical connector has a third connecting surface and a fourth connecting surface, with the third connecting surface located above the fourth connecting surface; the first connecting surface and the third connecting surface are located on the same layer as the electrical connector; the first connecting surface is located on the backlight side of the laser assembly, and the first connecting surface is wire-connected to the laser assembly; A backlight detection component is disposed on the first connecting surface, and the backlight detection component is connected to the second connecting surface by wire bonding; A first flexible circuit board is soldered to the third connection surface at one end and to the first pad group at the other end; the laser component is electrically connected to the first driver in sequence through the first connection surface, the third connection surface and the first flexible circuit board. The second flexible circuit board has one end welded to the fourth connecting surface and the other end welded to the second pad group; the backlight detection component is electrically connected to the second pad group in sequence through the second connecting surface, the fourth connecting surface and the second flexible circuit board.

24. The optical module according to claim 23, wherein, The light emitting component also includes: A connecting assembly includes a lens holder and a connecting sleeve, wherein a second through hole is formed in the lens holder; one end of the lens holder is connected to the connecting sleeve, and the other end of the lens holder is connected to the first housing; the second through hole communicates with the first through hole; a converging lens is disposed in the second through hole. The optical module also includes: The first transmission component includes a first fiber optic adapter, a first fiber optic cable, and a second fiber optic adapter connected in sequence. The first fiber optic adapter is located at the optical port of the optical module, and the second fiber optic adapter is connected to the connecting sleeve.

25. The optical module according to claim 23, wherein, The light emitting component includes a TEC, which is located on the side of the electrical connector; The top of the TEC is provided with a first base, which supports and connects the laser component; On the side of the laser assembly, a first pad and a second pad are formed on the first base. A thermistor is mounted on the first pad and wired to the second pad. The first pad and the second pad are wired to the electrical connector.

26. The optical module according to claim 23, wherein, The electrical connector has a first wiring surface formed inside, which extends from the first connection surface to the third connection surface; A high-frequency trace group is formed on the first trace surface. One end of the high-frequency trace group is connected to the high-frequency pad on the first connection surface, and the other end of the high-frequency trace group is connected to the high-frequency pad on the third connection surface. The electrical connector has a via formed inside, which passes through the side of the high-frequency trace group and electrically connects the pads on the second connection surface and the pads on the fourth connection surface.

27. The optical module according to claim 23, wherein, The second flexible circuit board includes a first connecting portion, a first transition portion, a second transition portion, a first extension portion, and a second connecting portion connected in sequence, and the side of the end of the first extension portion is connected to the side of the second connecting portion; The first connecting portion has a solder pad for welding the fourth connecting surface, and the second connecting portion has a solder pad for welding the second solder pad group. The width of one end of the first transition portion is greater than the width of the other end of the first transition portion, the extension direction of the second transition portion is inclined relative to the extension direction of the first transition portion, and the first extension portion is located on the side of the first driver.

28. The optical module according to claim 23, wherein, The optical receiving component includes: The second shell has a fourth through hole at one end and a notch at the other end; The second upper cover includes a cover plate body and a side plate, the top of which is connected to the cover plate body; the second upper cover is closed and connected to the second housing, the cover plate body is connected to the top of the second housing, and the side plate is located within the notch; An optical receiving component is disposed within the cavity formed by the second housing and the second upper cover; The optical module also includes: The second transmission component includes a third fiber optic adapter, a second fiber optic cable, and a fourth fiber optic adapter connected in sequence. The third fiber optic adapter is located at the optical port of the optical module, and the fourth fiber optic adapter is embedded in the fourth through-hole. A third flexible circuit board extends into and is fixedly connected to the second housing at one end; the bottom of the second upper cover is connected to the top surface of the third flexible circuit board, and the third flexible circuit board is electrically connected to the optical receiving component.

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