High-heat-dissipation copper substrate and manufacturing method therefor

Abstract

Disclosed in the present invention are a high-heat-dissipation copper substrate and a manufacturing method therefor, which copper substrate is used for improving the heat dissipation capability of a chip. The method comprises: acquiring a circuit pattern to be etched on a copper substrate; sequentially laminating and pressing a first copper foil and a prepreg on the etched copper substrate, so as to form a first layer-adding circuit board; performing first blind hole punching, copper electroplating, pattern etching and groove milling treatments on the first layer-adding circuit board, so as to form a second layer-adding circuit board; attaching an adhesive tape underneath the second layer-adding circuit board, and attaching a component onto the surface of the adhesive tape; sequentially laminating and pressing a second copper foil and a high-heat-conductivity material above the second layer-adding circuit board, such that the component is fixed in the second layer-adding circuit board, removing the adhesive tape, and sequentially laminating and pressing a copper foil and a high-heat-conductivity material underneath the second layer-adding circuit board, so as to form a third layer-adding circuit board; and performing second blind hole punching, copper electroplating and pattern etching treatments on the third layer-adding circuit board to obtain a high-heat-dissipation copper substrate.

Description

A high heat dissipation copper substrate and its manufacturing method

[0001] This application is based on and claims priority to Chinese invention patent application No. 202411226832.5, filed on September 2, 2024, entitled "A High Heat Dissipation Copper Substrate and a Method for Manufacturing the Same". Technical Field

[0002] This invention relates to the field of printed circuit board manufacturing technology, and in particular to a high heat dissipation copper substrate and its manufacturing method. Background Technology

[0003] Copper substrates are the most expensive type of metal substrates. Their thermal conductivity is many times better than that of aluminum and iron substrates. They are suitable for high-frequency circuits, areas with large temperature variations, heat dissipation of precision communication equipment, and the building decoration industry. Common types include immersion gold copper substrates, silver-plated copper substrates, tin-plated copper substrates, and anti-oxidation copper substrates.

[0004] With the increasing demand for high-frequency and high-speed electronic products, the current-carrying capacity of embedded packaging technology is constantly improving, and the heat dissipation requirements of the working chips are also increasing. However, due to the high power and current of these electronic products, a significant amount of heat is generated, which cannot be effectively dissipated during operation. Therefore, improving the heat dissipation capacity of chips to meet the needs of high-power, high-current electronic products is a pressing technical challenge that the industry needs to address. Summary of the Invention

[0005] Therefore, it is necessary to provide a high-heat-dissipation copper substrate and its manufacturing method to address the above-mentioned technical problems, which can improve the heat dissipation capacity of the chip and thus meet the needs of high-power, high-current electronic products.

[0006] In a first aspect, a method for manufacturing a high-heat-dissipation copper substrate is provided, comprising:

[0007] Obtain the circuit pattern that needs to be etched on the copper substrate;

[0008] The first copper foil and the prepreg are stacked in sequence and then pressed onto the etched copper substrate to form the first add-on circuit board.

[0009] A laser drilling machine is used to drill the first blind hole in the first add-on circuit board, and the first add-on circuit board is subjected to copper plating, pattern etching and milling to form the second add-on circuit board.

[0010] Apply tape to the underside of the second add-on circuit board and attach the components to the surface of the tape;

[0011] The second copper foil and the high thermal conductivity material are stacked and pressed on top of the second augmentation circuit board to fix the components in the second augmentation circuit board. The tape is removed, and the copper foil and the high thermal conductivity material are stacked and pressed on the bottom of the second augmentation circuit board to form the third augmentation circuit board.

[0012] A laser drilling machine is used to drill a second blind via on the third add-on circuit board, and the third add-on circuit board is electroplated with copper and patterned and etched to obtain a high heat dissipation copper substrate.

[0013] Optionally, before sequentially stacking and pressing the first copper foil and the prepreg onto the etched copper substrate, the process includes:

[0014] The surface of the etched copper substrate is subjected to a browning treatment.

[0015] Optionally, the second add-on circuit board includes multiple cavities, each containing components.

[0016] Optionally, before sequentially stacking the copper foil and the high thermal conductivity material and then laminating them under the second add-on circuit board, the method further includes:

[0017] Remove the PET film from the surface of the high thermal conductivity material and roughen the surface of the high thermal conductivity material.

[0018] Optionally, the thickness of the copper substrate is 2 to 5 mm.

[0019] Optionally, the prepreg is made of BT resin, ABF, polyimide, epoxy resin or bismaleimide-triazine resin.

[0020] Optionally, the thermal conductivity of the prepreg is 1.0-8.0 W / mK.

[0021] Optionally, the copper substrate includes an upper surface and / or a lower surface of the substrate.

[0022] Optionally, the roughness of both the first copper foil and the second copper foil is less than 3 μm.

[0023] In a second aspect, a high heat dissipation copper substrate is prepared by the following steps;

[0024] Obtain the circuit pattern that needs to be etched on the copper substrate;

[0025] The first copper foil and the prepreg are stacked in sequence and then pressed onto the etched copper substrate to form the first add-on circuit board.

[0026] A laser drilling machine is used to drill the first blind hole in the first add-on circuit board, and the first add-on circuit board is subjected to copper plating, pattern etching and milling to form the second add-on circuit board.

[0027] Apply tape to the underside of the second add-on circuit board and attach the components to the surface of the tape;

[0028] The second copper foil and the high thermal conductivity material are stacked and pressed on top of the second augmentation circuit board to fix the components in the second augmentation circuit board. The tape is removed, and the copper foil and the high thermal conductivity material are stacked and pressed on the bottom of the second augmentation circuit board to form the third augmentation circuit board.

[0029] A laser drilling machine is used to drill a second blind via on the third add-on circuit board, and the third add-on circuit board is electroplated with copper and patterned and etched to obtain a high heat dissipation copper substrate.

[0030] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0031] The surface of the etched copper substrate is subjected to a browning treatment.

[0032] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0033] The second add-in circuit board includes multiple cavities, each containing components.

[0034] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0035] Remove the PET film from the surface of the high thermal conductivity material and roughen the surface of the high thermal conductivity material.

[0036] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0037] The thickness of the copper substrate is 2 to 5 mm.

[0038] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0039] The prepreg is made of BT resin, ABF, polyimide, epoxy resin or bismaleimide-triazine resin.

[0040] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0041] The thermal conductivity of the prepreg is 1.0-8.0 W / mK.

[0042] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0043] The copper substrate includes an upper surface and / or a lower surface of the substrate.

[0044] Optionally, the high heat dissipation copper substrate is prepared through the following steps:

[0045] The roughness of both the first copper foil and the second copper foil is less than 3 μm.

[0046] In any of the above-mentioned solutions, the copper substrate is fabricated by etching and laminating it in two stages, and the components are encased in a high thermal conductivity material to achieve rapid heat dissipation from the chip, thereby improving the chip's heat dissipation capacity and meeting the needs of high-power, high-current electronic products.

[0047] Details of one or more embodiments of this application are set forth in the following drawings and description, and other features and advantages of this application will become apparent from the specification, drawings and claims. Attached Figure Description

[0048] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 is a schematic flowchart of a method for manufacturing a high heat dissipation copper substrate according to an embodiment of the present invention;

[0050] Figure 2 is another schematic flowchart of a method for manufacturing a high heat dissipation copper substrate provided in one embodiment of the present invention. Detailed Implementation

[0051] To make the technical problems solved by the present invention, the technical solutions and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0052] It should be understood that the embodiments described below represent essential information to enable those skilled in the art to implement the embodiments and to illustrate the best mode of implementation. Upon reading the following description in conjunction with the accompanying drawings, those skilled in the art will understand the concepts of this disclosure and recognize the applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims.

[0053] It should also be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0054] It should also be understood that when a component is referred to as "connected" or "coupled" to another component, it can be directly connected or coupled to the other component, or there may be intermediate components. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intermediate components.

[0055] It should also be understood that the terms “upper,” “lower,” “left,” “right,” “front,” “back,” “bottom,” “middle,” “center,” “top,” etc., may be used herein to describe various elements, indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are used only for the convenience of describing the invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, these elements should not be limited by these terms.

[0056] These terms are used only to distinguish one element from another. For example, a first element may be referred to as the “upper” element, and similarly, a second element may be referred to as the “upper” element depending on the relative orientation of these elements, without departing from the scope of this disclosure.

[0057] To be further understood, the terms “comprising,” “including,” “including,” and / or “include” as used herein specify the presence of the said feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0058] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that the terms used herein should be interpreted as having the same meaning as they mean in the context of this specification and related art, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0059] The first aspect of this application provides a method for manufacturing a high heat dissipation copper substrate, as shown in Figure 1, including the following steps:

[0060] S101: Obtain the circuit pattern to be etched on the copper substrate.

[0061] S102: The first copper foil and the prepreg are stacked in sequence and then pressed onto the etched copper substrate to form the first add-on circuit board.

[0062] In this embodiment, the copper substrate is a substrate material with excellent conductivity, commonly used in the manufacture of printed circuit boards (PCBs). The thickness of the copper substrate 100 is 2–5 mm. A layer of photoresist is coated on the copper substrate. After exposure and development processes, the designed circuit pattern is transferred onto the photoresist. Subsequently, an etching process removes the unwanted copper layer, retaining the designed circuit pattern. After etching, the circuit pattern is clearly visible on the copper substrate, which can be used to mount electronic components and connect various elements to form a circuit board. Pattern etching is a process for manufacturing microcircuits. This application ensures that the pattern will not fall off the copper substrate by exposing it to a pattern and etching it. The circuit pattern to be etched is input into the machine, and the copper substrate is etched according to the input circuit pattern. The circuit pattern to be etched is a pre-tested circuit pattern, which may include multiple circuit patterns; this embodiment does not limit this.

[0063] As an optional embodiment, the first copper foil and the prepreg are sequentially stacked and then pressed onto the etched copper substrate, including:

[0064] The surface of the etched copper substrate is subjected to a browning treatment.

[0065] In this embodiment, the etched copper substrate is cleaned to ensure a clean and impurity-free surface. Then, a browning solution, typically containing ferric chloride, is prepared. The copper substrate is immersed in the browning solution, with the immersion time controlled according to specific circumstances, usually between a few minutes and half an hour. It should be noted that the browning speed is based on the thickness of the underlying copper layer. After browning is complete, the copper substrate is removed and rinsed thoroughly with clean water to ensure the removal of any residual browning solution. A prepreg with a thermal conductivity of 1.0-8.0 W / mK is used. The first copper foil and the prepreg are cut to match the size of the etched copper substrate. The first copper foil is placed over the etched copper substrate, ensuring alignment with the circuit pattern. The prepreg is then placed on top of the first copper foil, and the entire laminated structure is placed in a laminator. Appropriate temperature and pressure are set for lamination to increase the heat dissipation of the copper substrate. The prepreg is made of BT resin, ABF, polyimide, epoxy resin, or bismaleimide-triazine resin, with a thickness of 25 μm to 50 μm. The first copper foil has a thickness of 35 μm. Typically, the lamination temperature is between 120-180 degrees Celsius, and the lamination time depends on the specific circumstances. After lamination, the laminated copper substrate is removed and allowed to cool before proceeding to the next processing or production step. Through the above steps, the etched copper substrate undergoes browning treatment and is then laminated with the first copper foil and prepreg, thereby achieving the purpose of adding layers and obtaining the first added-layer circuit board, so as to continue the subsequent circuit board manufacturing process.

[0066] Specifically, this application utilizes baking to adjust the curing degree of the prepreg layer. The fluidity and rigidity of the prepreg material are closely related to its curing degree. Baking the material at a temperature higher than normal allows for adjustment of the curing degree by varying the baking temperature and time, thereby reducing fluidity and increasing rigidity. For example, controlling the curing degree of the prepreg layer to 60%–70% provides a certain rigidity and reduces internal stress, preparing it for subsequent processes. For instance, the prepreg can be made of ABF (Ajinomoto Build-up Film) material as an interlayer insulating material, allowing for the fabrication of precise circuits using a semi-additive process. The first copper foil is an anionic electrolytic material, a thin, continuous metal foil deposited on the circuit board substrate, serving as the conductor for the subsequent copper substrate. It readily adheres to the insulating layer, accepts the printed protective layer, and forms the circuit pattern after etching. Copper is generally used because it is a readily available and inexpensive raw material with good electrical conductivity and heat dissipation. Of course, other conductive materials such as aluminum and gold can also be used; there are no restrictions here. Prepreg is a dielectric material used for adding layers to copper substrates. Lamination is a process where prepreg is used to add layers after the inner layers of the copper substrate have been processed.

[0067] S103: A laser drilling machine is used to drill the first blind hole in the first augmented circuit board, and the first augmented circuit board is subjected to copper plating, pattern etching and milling to form the second augmented circuit board.

[0068] In this embodiment, a first blind hole is drilled into both copper foil surfaces of the first augmented circuit board using a laser. The bottom of the hole is the inner side of the metal base. The first blind hole can be metallized by a copper plating process. Then, a dry film or wet film is applied to the upper and lower surfaces of the sub-board. The plated hole pattern is formed on the copper foil surface of the sub-board by exposure and development. That is, a window is opened at the corresponding first blind hole, and the other parts are covered and protected by the dry film or wet film. Then, the first blind hole is filled by a hole-filling electroplating process. After the film is removed, the copper foil surface is polished flat by a grinding plate. Then, when making the inner layer circuit (negative film process), a dry film or wet film is applied to the upper and lower surfaces of the first augmented circuit board. The inner layer circuit pattern is formed on the copper foil surface by exposure and development. Then, the inner layer circuit is etched on the copper foil surface. Then, the inner layer circuit is inspected for defects such as open circuits, short circuits, circuit gaps, and pinholes. Defective products are scrapped, and defect-free products are sent to the next process. Finally, a cavity penetrating the upper and lower surfaces of the first augmented circuit board is formed by milling grooves in the inner layer circuit. Furthermore, the milling groove includes one or more of the following: steel die punching, mechanical milling, CO2 laser drilling, or UV cutting.

[0069] In fact, this application may not use milling, and may use other methods to create grooves; this application does not impose any particular restrictions.

[0070] In this embodiment, a laser drilling machine is used to process blind vias on the first add-on circuit board. The laser drilling machine can efficiently and accurately drill holes, suitable for processing micro- and complex holes. Copper is electroplated into the lead-tin alloy grooves formed in the blind vias and circuit areas to increase the conductivity of the circuit board, fill the holes and circuit structure, and improve the reliability and electrical performance of the circuit board. The electroplated circuit board is then patterned using chemical etching or dry etching methods. Unwanted copper layers are removed, leaving the designed circuit pattern. Finally, a milling machine or CNC milling machine is used to mill grooves on the edges or specific areas of the first add-on circuit board. Milling grooves can be used for grooving, removing excess material, positioning, and other purposes.

[0071] Through the above steps, the first add-on circuit board can be drilled, electroplated with copper, etched with patterns, and milled to form the second add-on circuit board, aiming to prepare a high-quality circuit board that meets the design requirements.

[0072] It should be noted that the cavity is a through-slot, which penetrates the upper and lower surfaces of the copper substrate, and the inner layer circuitry fills the through-slot and extends to the upper and lower surfaces of the copper substrate. If it is a blind slot, other methods can also be used to fabricate it. The size of the cavity in this application is determined according to the components to be embedded, and it can be designed to be slightly larger than the components to be embedded.

[0073] As an optional embodiment, the second add-on circuit board includes multiple cavities, each containing components.

[0074] Specifically, the second add-layer circuit board of this application includes multiple cavities, and the components contained in each cavity are different, so that the circuit board manufactured later can realize more functions.

[0075] S104: Apply tape to the underside of the second add-on circuit board and attach the components to the surface of the tape.

[0076] In this embodiment, since the application mills away the areas where components need to be mounted by creating slots, the second add-on circuit board includes multiple through-slot cavities. These cavities penetrate the upper and lower surfaces of the copper substrate. Adhesive tape can be applied under the second add-on circuit board to ensure that the tape completely covers the lower surface of all cavities, allowing components to be attached to the tape surface. However, after application, the tape may not adhere tightly, leaving air bubbles on the adhesive side. Therefore, a fast-pressing method can be used to compact the tape. A vacuum fast-pressing machine can be used to increase the adhesion between the tape and the area under the second add-on circuit board. Optionally, a PI tape with an initial tack of 14-20 can be used, with a fast-pressing temperature of 170℃-180℃ and a fast-pressing time of 180-240 seconds. Components are then placed in all cavities using a pick-and-place machine, which is a high-precision pick-and-place machine.

[0077] It should be noted that the tape is a high-temperature tape, and it is applied below the second add-on circuit board, covering all the through-holes of the cavities on the lower surface of the copper substrate. Furthermore, the tape is composed of a 25µm thick polyimide layer and a 25µm thick acrylic adhesive layer bonded together. The high-temperature tape is used to cope with subsequent high-temperature processes such as heat treatment. If the subsequent process does not involve high temperatures, other ordinary tapes or similar materials can be used. The high-temperature tape in this application covers all the through-holes of the cavities on the lower surface of the copper substrate to prevent components from slipping out; other blocking components can also achieve a similar effect. The use of high-temperature tape to fix the component modules is a temporary fixation method, and the tape needs to be removed subsequently.

[0078] S105: The second copper foil and the high thermal conductivity material are stacked and pressed on top of the second augmentation circuit board to fix the components in the second augmentation circuit board. The tape is removed, and the copper foil and the high thermal conductivity material are stacked and pressed on the bottom of the second augmentation circuit board to form a third augmentation circuit board.

[0079] In this embodiment, the second copper foil and the high thermal conductivity material are cut into sheets matching the size of the second add-on circuit board. These sheets are then sequentially stacked on the prepared second add-on circuit board. Using a laminator with appropriate temperature and pressure parameters, the second copper foil and the high thermal conductivity material are laminated and pressed onto the second add-on circuit board. The second copper foil is also a cathodic electrolytic material, a thin, continuous metal foil deposited on the circuit board substrate to serve as a conductor in the PCB. A uniform and tight laminated structure is ensured to improve adhesion and thus secure the components. The area beneath the second add-on circuit board is treated to remove the adhesive tape. Since the tape adheres to the components, it needs to be removed for subsequent processing or treatment. Mechanical peeling or de-adhesive removal methods can be used. This embodiment does not limit the specific method of tape removal; for example, the tape can be removed by dissolving it with an organic solvent. It can also be removed by tearing. The second copper foil and high thermal conductivity material are then laminated together below the second add-on circuit board using a laminator to ensure a strong bond between the layers, forming the third add-on circuit board. Through these steps, the second copper foil and high thermal conductivity material are laminated and pressed onto the top of the second add-on circuit board, the adhesive tape is removed, and then the second copper foil and high thermal conductivity material are laminated and pressed onto the bottom of the second add-on circuit board to form the third add-on circuit board. These steps facilitate the construction of multilayer circuit boards and ensure strong adhesion between the layers. Furthermore, the use of high thermal conductivity material improves the chip's heat dissipation capacity, and the processing technology addresses quality issues encountered during the processing of high thermal conductivity material.

[0080] It should be noted that the processing technology of the high thermal conductivity material of the present invention is special. In order to improve the problem of poor uniformity and air bubbles caused by direct lamination of high thermal conductivity materials, the present invention combines vacuum lamination machine to process according to specific parameters, and then uses ordinary press to press together to connect copper foil with high thermal conductivity material, so as to achieve the purpose of adding layers.

[0081] As an optional embodiment, before sequentially stacking the copper foil and the high thermal conductivity material and then pressing them onto the underside of the second add-on circuit board, the method further includes:

[0082] Remove the PET film from the surface of the high thermal conductivity material and roughen the surface of the high thermal conductivity material.

[0083] In this embodiment, during the lamination process using high thermal conductivity materials, a vacuum lamination and curing process is first performed using a material of a specific thickness (calculated based on the required amount of adhesive). At this stage, copper foil is not required. After the device is fixed, the adhesive tape is removed, along with the PET film on the surface of the high thermal conductivity material. Plasma equipment is needed to roughen the surface of the high thermal conductivity material, enhancing the bonding strength between different layers and simultaneously cleaning the device surface. Alternatively, high thermal conductivity materials of a specific thickness (calculated and selected according to customer requirements) can be used on both sides simultaneously, followed by vacuum lamination and curing. In this case, the PET film on the surface of the high thermal conductivity material must be removed before adding copper foil, serving as an additional layer. Furthermore, roughening increases the surface roughness of the circuitry, enhancing the bonding strength between the inner circuitry and the high thermal conductivity material.

[0084] S106: A laser drilling machine is used to drill a second blind hole in the third add-on circuit board, and the third add-on circuit board is electroplated with copper and patterned and etched to obtain a high heat dissipation copper substrate.

[0085] In this embodiment, a laser drilling machine is used to drill second blind holes into the inner circuit surface on both outer copper foil surfaces of the third add-on circuit board. The second blind holes are then metallized by copper plating and full-board electroplating. The second blind holes are filled by a hole-filling electroplating process. After the film is removed, the outer copper foil surface is ground flat by a grinding plate. Furthermore, during the fabrication of the inner layer circuitry (negative film process), dry or wet films are applied to the upper and lower surfaces of the third add-on circuit board. The outer layer circuitry pattern is then formed on the outer copper foil surface through exposure and development. Subsequently, the outer layer circuitry is etched onto the outer copper foil surface. Defects such as open circuits, short circuits, gaps, and pinholes in the outer layer circuitry are then inspected. Defective products are scrapped, while defect-free products proceed to the next process. In the above process, corresponding second and first blind vias are used to connect the inner and outer layer circuitry and the copper substrate, ensuring that both the inner and outer circuitry at this location are ultra-high thermal conductivity circuitry. Alternatively, the second blind via can be used directly to connect the inner and outer layer circuitry without connecting to the copper substrate, ensuring that both the inner and outer circuitry at this location are high thermal conductivity circuitry. This achieves the coexistence of ultra-high thermal conductivity circuitry and high thermal conductivity circuitry on the copper substrate.

[0086] In this embodiment, a laser drilling machine is used to process blind vias on the third add-on circuit board. The laser drilling machine can efficiently and precisely drill holes, suitable for processing micro- and complex holes. Copper is electroplated into the lead-tin alloy grooves formed in the blind vias and circuit areas to increase the conductivity of the circuit board, fill the holes and circuit structure, and improve the reliability and electrical performance of the circuit board. The electroplated circuit board is then patterned using chemical etching or dry etching methods. Unwanted copper layers are removed, leaving the designed circuit pattern. Through these steps, the third add-on circuit board can be drilled, electroplated with copper, and patterned etched, ultimately forming a high-heat-dissipation copper substrate, aiming to produce a high-quality circuit board that meets design requirements.

[0087] In one embodiment, the copper substrate includes an upper surface and / or a lower surface. That is, as an example, as shown in FIG2, laser drilling, copper electroplating, pattern etching, and lamination can be performed simultaneously on the upper and lower surfaces of the copper substrate, while this embodiment can be performed on both sides, resulting in higher manufacturing efficiency for the high heat dissipation copper substrate.

[0088] In one embodiment, the roughness of both the first copper foil and the second copper foil is less than 3 μm. As an example, when the roughness of both the first copper foil and the second copper foil is less than 3 μm, it can prevent the copper teeth from being too large and forming a short circuit through the prepreg when the first copper line and the second copper line are pressed onto or pressed into the prepreg or high thermal conductivity material in subsequent steps.

[0089] As shown in Figure 2, this application embodiment provides a method for manufacturing a high heat dissipation copper substrate. The method involves obtaining the circuit pattern to be etched on the copper substrate, sequentially stacking a first copper foil and a prepreg on the etched copper substrate to form a first add-on circuit board. A laser drilling machine is used to drill a first blind via on the first add-on circuit board. The first add-on circuit board is then subjected to copper plating, pattern etching, and milling to form a second add-on circuit board. Adhesive tape is applied to the underside of the second add-on circuit board, and components are attached to the surface of the tape. A second copper foil and a high thermal conductivity material are sequentially stacked and pressed onto the top of the second add-on circuit board to fix the components within it. The tape is removed, and the copper foil and the high thermal conductivity material are sequentially stacked and pressed onto the bottom of the second add-on circuit board to form a third add-on circuit board. A laser drilling machine is used to drill a second blind via on the third add-on circuit board, and the third add-on circuit board is then subjected to copper plating and pattern etching to obtain a high heat dissipation copper substrate. This application processes and uses a copper substrate to increase the copper area, improve the current carrying area, and enhance the current carrying capacity. At the same time, it provides excellent heat dissipation. The copper substrate is fabricated by etching and laminating it in two stages. The high thermal conductivity material is then used to laminate and encapsulate the components, enabling the rapid dissipation of heat generated by the chip and improving the chip's heat dissipation capacity. This meets the needs of high-power, high-current electronic products.

[0090] In this embodiment of the application, a high heat dissipation copper substrate is also provided, which is prepared by the following steps;

[0091] Obtain the circuit pattern that needs to be etched on the copper substrate;

[0092] The first copper foil and the prepreg are stacked in sequence and then pressed onto the etched copper substrate to form the first add-on circuit board.

[0093] A laser drilling machine is used to drill the first blind hole in the first add-on circuit board, and the first add-on circuit board is subjected to copper plating, pattern etching and milling to form the second add-on circuit board.

[0094] Apply tape to the underside of the second add-on circuit board and attach the components to the surface of the tape;

[0095] The second copper foil and the high thermal conductivity material are stacked and pressed on top of the second augmentation circuit board to fix the components in the second augmentation circuit board. The tape is removed, and the copper foil and the high thermal conductivity material are stacked and pressed on the bottom of the second augmentation circuit board to form the third augmentation circuit board.

[0096] A laser drilling machine is used to drill a second blind via on the third add-on circuit board, and the third add-on circuit board is electroplated with copper and patterned and etched to obtain a high heat dissipation copper substrate.

[0097] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0098] The surface of the etched copper substrate is subjected to a browning treatment.

[0099] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0100] The second add-in circuit board includes multiple cavities, each containing components.

[0101] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0102] Remove the PET film from the surface of the high thermal conductivity material and roughen the surface of the high thermal conductivity material.

[0103] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0104] The thickness of the copper substrate is 2 to 5 mm.

[0105] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0106] The prepreg is made of BT resin, ABF, polyimide, epoxy resin or bismaleimide-triazine resin.

[0107] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0108] The thermal conductivity of the prepreg is 1.0-8.0 W / mK.

[0109] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0110] The copper substrate includes an upper surface and / or a lower surface of the substrate.

[0111] In one embodiment, the high heat dissipation copper substrate is prepared through the following steps:

[0112] The roughness of both the first copper foil and the second copper foil is less than 3 μm.

[0113] It should be noted that this high-heat-dissipation copper substrate can be used in electronic components or modules requiring good heat dissipation performance, such as high-power LED lamps, power converters, power modules, semiconductor heat sinks, and other equipment. The implementation method of this embodiment is the same as that of the embodiment on the manufacturing method of the high-heat-dissipation copper substrate, and will not be repeated here.

[0114] It is worth noting that the high heat dissipation copper substrate prepared by the manufacturing method of the high heat dissipation copper substrate provided in the embodiments of this application has good thermal conductivity and electrical properties, which can effectively solve the heat dissipation problem of high power devices, improve the heat dissipation capacity of chips, and ensure the normal operation of equipment.

[0115] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for manufacturing a high heat dissipation copper substrate, comprising: Obtain the circuit pattern that needs to be etched on the copper substrate; The first copper foil and the prepreg are stacked in sequence and then pressed onto the etched copper substrate to form the first add-on circuit board. A laser drilling machine is used to drill the first blind hole in the first add-on circuit board, and the first add-on circuit board is subjected to copper plating, pattern etching and milling to form the second add-on circuit board. Apply tape to the underside of the second add-on circuit board and attach the components to the surface of the tape; The second copper foil and the high thermal conductivity material are stacked and pressed on top of the second augmentation circuit board to fix the components in the second augmentation circuit board. The tape is removed, and the copper foil and the high thermal conductivity material are stacked and pressed on the bottom of the second augmentation circuit board to form the third augmentation circuit board. A laser drilling machine is used to drill a second blind via on the third add-on circuit board, and the third add-on circuit board is electroplated with copper and patterned and etched to obtain a high heat dissipation copper substrate.

2. The method for manufacturing a high-heat-dissipation copper substrate according to claim 1, wherein before sequentially stacking and pressing the first copper foil and the prepreg onto the etched copper substrate, the method comprises: The surface of the etched copper substrate is subjected to a browning treatment.

3. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein the second added-layer circuit board includes a plurality of cavities, each of which contains components.

4. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein before sequentially stacking the copper foil and the high thermal conductivity material and then pressing them onto the underside of the second add-on circuit board, the method further includes: Remove the PET film from the surface of the high thermal conductivity material and roughen the surface of the high thermal conductivity material.

5. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein the thickness of the copper substrate is 2-5 mm.

6. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein the prepreg is made of BT resin, ABF, polyimide, epoxy resin or bismaleimide-triazine resin.

7. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein the thermal conductivity of the prepreg is 1.0-8.0 W / mK.

8. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein the copper substrate includes an upper surface and / or a lower surface of the substrate.

9. The method for manufacturing a high heat dissipation copper substrate according to claim 1, wherein the roughness of both the first copper foil and the second copper foil is less than 3 μm.

10. A high heat dissipation copper substrate, wherein the high heat dissipation copper substrate is prepared by the following steps: Obtain the circuit pattern that needs to be etched on the copper substrate; The first copper foil and the prepreg are stacked in sequence and then pressed onto the etched copper substrate to form the first add-on circuit board. A laser drilling machine is used to drill the first blind hole in the first add-on circuit board, and the first add-on circuit board is subjected to copper plating, pattern etching and milling to form the second add-on circuit board. Apply tape to the underside of the second add-on circuit board and attach the components to the surface of the tape; The second copper foil and the high thermal conductivity material are stacked and pressed on top of the second augmentation circuit board to fix the components in the second augmentation circuit board. The tape is removed, and the copper foil and the high thermal conductivity material are stacked and pressed on the bottom of the second augmentation circuit board to form the third augmentation circuit board. A laser drilling machine is used to drill a second blind via on the third add-on circuit board, and the third add-on circuit board is electroplated with copper and patterned and etched to obtain a high heat dissipation copper substrate.

11. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The surface of the etched copper substrate is subjected to a browning treatment.

12. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The second add-in circuit board includes multiple cavities, each containing components.

13. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: Remove the PET film from the surface of the high thermal conductivity material and roughen the surface of the high thermal conductivity material.

14. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The thickness of the copper substrate is 2 to 5 mm.

15. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The prepreg is made of BT resin, ABF, polyimide, epoxy resin or bismaleimide-triazine resin.

16. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The thermal conductivity of the prepreg is 1.0-8.0 W / mK.

17. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The copper substrate includes an upper surface and / or a lower surface of the substrate.

18. The high heat dissipation copper substrate as described in claim 10, wherein the high heat dissipation copper substrate is specifically prepared by the following steps: The roughness of both the first copper foil and the second copper foil is less than 3 μm.

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