Charging module and charging pile

Abstract

Embodiments of the present application relate to the technical field of electronic devices, and in particular to a charging module and a charging pile. The present application aims to solve the problem of the impact of excessive temperatures of circuit boards on the normal use of the circuit boards. The embodiments of the present application provide a charging module, comprising a circuit board and an electronic device. The electronic device is provided on one side of the circuit board. The charging module further comprises a cooling structure, and the cooling structure is provided on the side of the electronic device facing away from the circuit board. The charging module further comprises a first metal strip and a second metal strip, and the first metal strip is electrically connected to the electronic device and the circuit board. One end of the second metal strip is connected to the first metal strip or to the circuit board, and the other end of the second metal strip is in thermal contact with the cooling structure, so that heat of the circuit board or the electronic device is transferred to the second metal strip, and then the second metal strip transfers the heat to the cooling structure, to lower the temperature of the circuit board, thereby ensuring the normal use of the circuit board.

Description

A charging module and a charging pile

[0001] This application claims priority to Chinese patent application filed on August 26, 2024, with application number 202422081074.4 and entitled "A Charging Module and Charging Pile", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, specifically to a charging module and a charging pile. Background Technology

[0003] A charging module consists of electronic components and a circuit board. The electronic components are mounted on the circuit board and electrically connected to it. Due to the high power of the charging module, a cooling structure is typically included to cool it. However, the electronic components are small and do not directly contact the cooling structure, resulting in ineffective cooling and potentially causing the circuit board to overheat, thus affecting its normal operation.

[0004] Utility Model Content

[0005] This application provides a charging module and a charging pile, which can reduce the temperature of the circuit board and ensure the normal use of the circuit board.

[0006] In a first aspect, embodiments of this application provide a charging module, including a circuit board and electronic components. The electronic components are disposed on one side of the circuit board. The charging module further includes a cooling structure disposed on the side of the electronic components facing away from the circuit board. The charging module also includes a first metal strip and a second metal strip, the first metal strip being electrically connected to the electronic components and the circuit board. One end of the second metal strip is connected to the first metal strip or to the circuit board, the other end of the second metal strip is in thermal contact with the cooling structure, and the second metal strip is electrically isolated from the cooling structure.

[0007] One end of the second metal strip is connected to the first metal strip or to the circuit board, while the other end is in thermal contact with the cooling structure. This allows heat from the circuit board or electronic components to be transferred to the second metal strip, which then transfers the heat to the cooling structure, thus lowering the circuit board's temperature and ensuring its normal operation. Simultaneously, the second metal strip and the cooling structure are electrically isolated, preventing the cooling structure from becoming electrified and thus avoiding electric shock.

[0008] In some embodiments that may include the above embodiments, the charging module further includes a third metal strip, which is spaced apart from the second metal strip. One end of the third metal strip is connected to the first metal strip, and the other end of the third metal strip is in thermal contact with the cooling structure, while the third metal strip is electrically isolated from the cooling structure.

[0009] The third and second metal strips can transfer heat from electronic components or circuit boards to the cooling structure, enhancing heat transfer efficiency and further improving the heat dissipation capacity of the electronic components and circuit boards. The third metal strip is electrically isolated from the cooling structure, preventing it from transferring current to the cooling structure, thus preventing the cooling structure from becoming electrified and avoiding electric shock.

[0010] In some embodiments that may include the above embodiments, the second metal strip extends in a direction perpendicular to the circuit board, and the portion of the second metal strip near the cooling structure bends in a direction parallel to the surface of the cooling structure.

[0011] The portion of the second metal strip near the cooling structure extends in a direction parallel to the surface of the cooling structure. This increases the contact area between the second metal strip and the cooling structure, improves the thermal conductivity of the second metal strip, thereby accelerating the cooling rate of electronic devices and circuit boards, further enhancing their heat dissipation capacity, and ensuring their normal operation.

[0012] In some embodiments that may include the above embodiments, a second metal strip surrounds the outer periphery of the electronic device. The second metal strip includes a first metal strip, a second metal strip, and a third metal strip, which are connected sequentially. The first and third metal strips extend in a direction perpendicular to the plane of the circuit board, while the second metal strip extends in a direction parallel to the surface of the cooling structure, and the second metal strip is in thermally conductive contact with the cooling structure.

[0013] The second metal strip increases the contact area between the second metal strip and the cooling structure, improving the thermal conductivity of the second metal strip, thereby accelerating the cooling rate of electronic devices and circuit boards and further improving their heat dissipation capacity.

[0014] Meanwhile, the first, second, and third metal strips are connected sequentially, which improves the stability of the second metal strip and prevents it from tipping over. The second metal strip surrounds the outer perimeter of the second electronic device, saving space on the circuit board and improving its space utilization.

[0015] In some embodiments that may include the above embodiments, the width of the first metal strip is greater than the width of the second metal strip and the width of the third metal strip along the extension direction perpendicular to the first metal strip and perpendicular to the direction from the first metal strip to the third metal strip.

[0016] The second and third metal strips are narrower, which can reduce the volume of the second metal strip while ensuring its stability, thereby reducing material usage and lowering costs.

[0017] In some embodiments that may include the above embodiments, the cooling structure is provided with a receiving cavity containing potting compound, and the second metal strip extends into the potting compound.

[0018] The second metal strip extends into the potting compound. Heat from the second electronic component and circuit board can be transferred through the second metal strip to the potting compound, and then from the potting compound to the cooling structure. The potting compound further increases the contact area between the second metal strip and the cooling structure, accelerating the heat transfer rate and thus improving the heat dissipation capacity of the electronic component and circuit board, ensuring their normal operation.

[0019] In some embodiments that may include the above embodiments, a thermally conductive material is provided between the end of the second metal strip near the cooling structure and the cooling structure.

[0020] Heat from electronic devices and circuit boards can be transferred to the heat-conducting material via the second metal strip, and then from the heat-conducting material to the cooling structure. The heat-conducting material can increase the contact area between the second metal strip and the cooling structure, accelerating the heat transfer rate, thereby improving the heat dissipation capacity of electronic devices and circuit boards and ensuring their normal operation.

[0021] In some embodiments that may include the above embodiments, an insulating material is also provided between the end of the second metal strip near the cooling structure and the cooling structure.

[0022] The insulating material has good insulation properties, effectively preventing current from being conducted from the second metal strip to the cooling structure. The insulating material can withstand a certain voltage, ensuring its insulation performance is not compromised and guaranteeing the safe operation of the charging module.

[0023] Secondly, this application provides a charging pile, including the aforementioned charging module and charging gun, wherein the charging gun is used to output the current output by the charging module to an electric vehicle.

[0024] The charging pile provided in this application includes the charging module in any of the above embodiments, so both can solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0025] Figure 1 is a schematic diagram of the charging module in the related technology;

[0026] Figure 2 is a schematic diagram of the structure of the charging pile provided in an embodiment of this application;

[0027] Figure 3 is a schematic diagram of the structure of the charging pile provided in the embodiment of this application;

[0028] Figure 4 is a schematic diagram of the structure of the charging module provided in an embodiment of this application;

[0029] Figure 5 is a cross-sectional view AA of Figure 4;

[0030] Figure 6 is a schematic diagram of the structure of the first metal strip and the second metal strip provided in an embodiment of this application;

[0031] Figure 7 is a schematic diagram of the structure of the first metal strip and the second metal strip provided in the embodiment of this application;

[0032] Figure 8 is a schematic diagram of the structure of the first metal strip and the second metal strip provided in the embodiment of this application;

[0033] Figure 9 is a BB cross-sectional view of Figure 8;

[0034] Figure 10 is a schematic diagram of the structure of the first metal strip and the second metal strip provided in the embodiment of this application;

[0035] Figure 11 is a schematic diagram of the structure of the second metal strip and the third metal strip provided in an embodiment of this application;

[0036] Figure 12 is a schematic diagram of the structure of the second metal strip and the third metal strip provided in the embodiment of this application;

[0037] Figure 13 is a second structural schematic diagram of the charging module provided in an embodiment of this application;

[0038] Figure 14 is a schematic diagram of the structure of the charging module provided in the embodiment of this application.

[0039] Explanation of reference numerals in the attached drawings: 1: Charging pile; 2: Power grid; 3: Charging gun; 4: Electric vehicle; 10: Charging module; 111: AC / DC conversion module; 112: DC / DC conversion module; 113: DC bus; 114: Power distribution module; 11: Circuit board; 20: Electronic components; 30: Cooling structure; 31: Cooling plate; 32: Cover plate; 33: Coolant; 34: Receptacle; 35: Connecting plate; 41: First metal strip; 42: Second metal strip; 421: First segment metal strip; 422: Second segment metal strip; 423: Third segment metal strip; 43: Third metal strip; 61: Potting compound; 62: Thermally conductive material; 63: Insulating material. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0042] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0043] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0044] It should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or an integral connection; they can also refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0045] Referring to Figure 1, in related technologies, the charging module 10 includes a circuit board 11, electronic components 20, and a cooling structure 30. The electronic components 20 are disposed on one side of the circuit board 11 and electrically connected to the circuit board 11. The cooling structure 30 is disposed on the side of the electronic components 20 away from the circuit board 11. Some electronic components 20 (e.g., Hall effect devices, resistors, capacitors, etc.) are small in size and further away from the cooling structure 30, and cannot directly contact the cooling structure 30 for thermal conduction. This results in poor cooling effect of the electronic components 20, causing the corresponding part of the circuit board 11 to have an excessively high temperature, affecting the normal use of the circuit board 11.

[0046] Referring to Figures 2 and 3, this embodiment of the application provides a charging pile 1, including a charging module 10 and a charging gun 3. The charging gun 3 is used to output the current output by the charging module 10 to an electric vehicle 4. The charging module 10 can receive AC power output from the power grid 2 and convert the AC power into stable DC power before supplying it to the electric vehicle 4.

[0047] For example, the charging module 10 may include multiple AC / DC conversion modules 111 and multiple DC / DC conversion modules 112. The input terminal of the AC / DC conversion module 111 is connected to the power grid 2, and the output terminal is connected to the DC bus 113. The input terminal of the DC / DC conversion module 112 is connected to the DC bus 113, and the output terminal is connected to the input terminal of the power distribution module 114. The output terminal of the power distribution module 114 is connected to the charging gun 3.

[0048] The AC / DC conversion module 111 receives AC power from the power grid 2, converts it into DC power, and outputs it to the DC bus 113. The DC / DC conversion module 112 obtains DC power from the DC bus 113, further converts it into DC power suitable for the electric vehicle 4, and outputs it to the power distribution module 114. The power distribution module 114 dynamically distributes the DC power output from the DC / DC conversion module 112 according to the actual charging power required by the electric vehicle 4, and transmits the distributed charging power to the electric vehicle 4 through the charging gun 3.

[0049] The charging pile 1 also includes a shell, a human-machine interface, a charging control unit, and a metering and billing unit, and is used for information interaction, energy transmission, and metering and billing with the electric vehicle 4.

[0050] Electric vehicle 4 is a vehicle that is powered by electricity. Electric vehicle 4 can include pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), hybrid electric vehicle (HEV), range-extended electric vehicle (REEV), and plug-in hybrid electric vehicle (PHEV), etc.

[0051] Referring to Figures 4 and 5, this embodiment of the application provides a charging module 10, including a circuit board 11 and electronic components 20. The charging module 10 includes the circuit board 11, the electronic components 20, and a cooling structure 30. The electronic components 20 are disposed on one side of the circuit board 11, and the cooling structure 30 is disposed on the side of the electronic components 20 facing away from the circuit board 11. This embodiment of the application does not limit the electronic components 20; for example, the electronic components 20 may include switching transistors, magnetic devices, Hall effect devices, capacitors, resistors, etc. Magnetic devices may include transformers for voltage conversion.

[0052] This application does not limit the cooling structure 30. In some embodiments, the cooling structure 30 may include a fan and a heat sink inside the charging module 10. The heat sink may be in contact with the electronic device 20, and the fan is used to drive airflow through the heat sink to cool it, thereby cooling the charging module 10.

[0053] In some embodiments, the cooling structure 30 includes a cooling plate 31 and a cover plate 32. The cooling plate 31 includes a long plate and two short plates forming a groove, within which coolant 33 can be disposed. The cover plate 32 covers the cooling plate 31 to seal the coolant 33. The cooling structure 30 also includes a refrigeration device communicating with the groove. The coolant 33 can circulate within the refrigeration device and the groove, and the refrigeration device can supply low-temperature coolant 33 to the groove to cool the charging module 10.

[0054] Referring to Figures 4 and 6, the charging module 10 further includes a first metal strip 41 and a second metal strip 42. The first metal strip 41 is electrically connected to the electronic device 20 and the circuit board 11. It is understood that in embodiments where the electronic device 20 includes a Hall effect device, the first metal strip 41 may include a conductor penetrating the magnetic core; in embodiments where the electronic device 20 includes an inductor, the first metal strip 41 may include pins connected to the circuit board 11.

[0055] One end of the second metal strip 42 is connected to the first metal strip 41 or to the circuit board 11, and the other end of the second metal strip 42 is in thermal contact with the cooling structure 30. The second metal strip 42 can transfer the heat from the first metal strip 41 or the circuit board 11 to the cooling structure 30 to cool the electronic device 20 or the circuit board 11 and improve the heat dissipation capacity of the electronic device 20 or the circuit board 11.

[0056] The second metal strip 42 is electrically isolated from the cooling structure 30. It is understood that there is a certain distance L between the second metal strip 42 and the cooling structure 30. The second metal strip 42 is connected to the first metal strip 41 or the circuit board 11, which can easily cause the second metal strip 42 to become electrified. In embodiments where the surface of the cooling structure 30 uses a thermally conductive metal, if the distance between the second metal strip 42 and the cooling structure 30 is too close, the cooling structure 30 may become electrified, thereby electrifying the charging module 10 and causing electric shock. This application embodiment does not limit the distance L between the second metal strip 42 and the cooling structure 30; for example, the distance L can be greater than or equal to 3 mm.

[0057] The charging module 10 provided in this embodiment has a second metal strip 42, one end of which is connected to the first metal strip 41 or the circuit board 11, and the other end extending to the cooling structure 30. This allows heat from the circuit board 11 or electronic device 20 to be transferred to the second metal strip 42, and then the second metal strip 42 transfers the heat to the cooling structure 30, thereby reducing the temperature of the circuit board 11 and ensuring its normal operation. Simultaneously, the second metal strip 42 and the cooling structure 30 are electrically isolated, preventing the cooling structure 30 from becoming energized and thus preventing electric shock.

[0058] Referring again to Figure 4, in some embodiments, one end of the second metal strip 42 is connected to the first metal strip 41, and the other end of the second metal strip 42 is in thermal contact with the cooling structure 30. The heat of the electronic device 20 is transferred to the second metal strip 42 through the first metal strip 41, and then the second metal strip 42 transfers the heat to the cooling structure 30, which accelerates the heat dissipation rate of the electronic device 20. This achieves heat dissipation of the electronic device 20 by the cooling structure 30, thereby reducing the temperature of the circuit board 11 and ensuring the normal use of the circuit board 11.

[0059] In embodiments where the first metal strip 41 and the second metal strip 42 are connected, this application does not limit the connection method of the first metal strip 41 and the second metal strip 42. For example, the first metal strip 41 and the second metal strip 42 can be an integral structural component, or they can be welded together. Having the first metal strip 41 and the second metal strip 42 as an integral structural component simplifies the processing steps and reduces processing difficulty.

[0060] Referring again to Figure 6, in other embodiments, one end of the second metal strip 42 is connected to the circuit board 11, and the other end of the second metal strip 42 is in thermal contact with the cooling structure 30 (shown in Figure 5). The heat of the circuit board 11 is transferred to the cooling structure 30 through the second metal strip 42, thereby cooling the circuit board 11, accelerating the heat dissipation rate of the circuit board 11, reducing the temperature of the circuit board 11, and ensuring the normal use of the circuit board 11.

[0061] Meanwhile, the temperature of the circuit board 11 and the electronic device 20 will affect the temperature at the connection between the circuit board 11 and the first metal strip 41. If the temperature of the circuit board 11 and the electronic device 20 is too high, the temperature of the solder joint at the connection between the circuit board 11 and the first metal strip 41 will rise, causing the solder joint to melt, resulting in poor contact between the first metal strip 41 and the circuit board 11, thereby causing the circuit to break.

[0062] One end of the second metal strip 42 is connected to the first metal strip 41 or the circuit board 11, which can reduce the temperature of the solder joint at the connection between the first metal strip 41 and the circuit board 11, ensure the reliability of the solder joint, and avoid thermal fatigue failure of the solder joint.

[0063] Referring to Figure 7, in some implementations, the second metal strip 42 extends in a direction perpendicular to the circuit board 11, forming an "I" shape.

[0064] Referring again to Figure 5, in some implementations, the second metal strip 42 extends in a direction perpendicular to the circuit board 11. The portion of the second metal strip 42 near the cooling structure 30 is bent in an "L" shape, parallel to the surface of the cooling structure 30. This extension of the second metal strip 42 near the cooling structure 30 increases the contact area between the second metal strip 42 and the cooling structure 30, improving the thermal conductivity of the second metal strip 42. This, in turn, accelerates the cooling rate of the electronic device 20 and the circuit board 11, further enhancing their heat dissipation capacity and ensuring their normal operation.

[0065] Referring to Figures 8 and 9, in some implementations, the second metal strip 42 surrounds the outer periphery of the electronic device 20 in a "U" shape. The second metal strip 42 includes a first metal strip 421, a second metal strip 422, and a third metal strip 423, which are connected sequentially. The first metal strip 421 and the third metal strip 423 extend in a direction perpendicular to the plane of the circuit board 11, while the second metal strip 422 extends in a direction parallel to the surface of the cooling structure 30, and the second metal strip 422 makes thermal contact with the cooling structure 30.

[0066] The second metal strip 422 increases the contact area between the second metal strip 42 and the cooling structure 30, and improves the thermal conductivity of the second metal strip 42, thereby accelerating the cooling rate of the electronic device 20 and the circuit board 11, and further improving the heat dissipation capacity of the electronic device 20 and the circuit board 11.

[0067] Meanwhile, the first metal strip 421, the second metal strip 422, and the third metal strip 423 are connected in sequence in a "U" shape, which improves the stability of the second metal strip 42 and prevents it from tipping over. The second metal strip 42 surrounds the outer periphery of the electronic device 20, which saves space on the circuit board 11 and improves the space utilization of the circuit board 11.

[0068] In the above embodiment, along the extension direction perpendicular to the first metal strip 421 and perpendicular to the direction from the first metal strip 421 to the third metal strip 423, the widths d1 of the first metal strip 421, d2 of the second metal strip 422, and d3 of the third metal strip 423 are all equal. This ensures the thermal conductivity of the second metal strip 42 while facilitating its integral manufacturing, thus reducing the processing difficulty of the second metal strip 42.

[0069] Referring to Figure 10, in some implementations, along a direction perpendicular to the extension direction of the first metal strip 421 and perpendicular to the direction from the first metal strip 421 to the third metal strip 423, the width d1 of the first metal strip 421 is greater than the width d2 of the second metal strip 422 and the width d3 of the third metal strip 423. It is understood that having smaller widths d2 of the second metal strip 422 and d3 of the third metal strip 423 allows for a reduction in the volume of the second metal strip 42 while maintaining its stability, thereby reducing material usage and lowering costs.

[0070] In some embodiments, the width d2 of the second metal strip 422 and the width d3 of the third metal strip 423 are equal along the extension direction perpendicular to the first metal strip 421 and perpendicular to the direction from the first metal strip 421 to the third metal strip 423. This ensures the stability of the second metal strip 42 while facilitating its integral manufacturing, thus reducing the processing difficulty of the second metal strip 42.

[0071] Referring to Figures 11 and 12, in some implementations, the charging module 10 further includes a third metal strip 43, which is spaced apart from the second metal strip 42. One end of the third metal strip 43 is connected to the first metal strip 41 or the circuit board 11, and the other end of the third metal strip 43 is in thermal contact with the cooling structure 30 (as shown in Figure 9), and the third metal strip 43 is electrically isolated from the cooling structure 30.

[0072] Referring again to Figure 11, one end of the third metal strip 43 is connected to the first metal strip 41, and the other end of the third metal strip 43 is in thermal contact with the cooling structure 30 (as shown in Figure 9). The third metal strip 43 can transfer the heat of the electronic device 20 to the cooling structure 30.

[0073] Referring again to Figure 12, one end of the third metal strip 43 is connected to the circuit board 11, and the other end of the third metal strip 43 is in thermal contact with the cooling structure 30 (as shown in Figure 9). The third metal strip 43 can transfer heat from the circuit board 11 to the cooling structure 30.

[0074] The third metal strip 43 and the second metal strip 42 can transfer heat from the electronic device 20 or the circuit board 11 to the cooling structure 30, enhancing the heat transfer rate and further improving the heat dissipation capacity of the electronic device 20 and the circuit board 11. The third metal strip 43 is electrically isolated from the cooling structure 30, which can prevent the third metal strip 43 from transferring current to the cooling structure 30, thereby preventing the cooling structure 30 and the charging module 10 from becoming energized and preventing electric shock.

[0075] The position of the third metal strip 43 is not limited in this embodiment. For example, the third metal strip 43 and the second metal strip 42 can be disposed on opposite sides of the first metal strip 41; the third metal strip 43 and the second metal strip 42 can also be disposed on the same side of the first metal strip 41.

[0076] The embodiments of this application do not limit the shape of the second metal strip 42 and the third metal strip 43. For example, the second metal strip 42 and the third metal strip 43 may have the same shape, such as both being "L"-shaped; the second metal strip 42 and the third metal strip 43 may also have different shapes, such as the second metal strip 42 being "L"-shaped and the third metal strip 43 being "U"-shaped.

[0077] In some embodiments, the second metal strip 42 can be connected to the first metal strip 41 and the third metal strip 43 can be connected to the circuit board 11, so that the heat on the electronic device 20 and the circuit board 11 can be transferred to the cooling structure 30 through the second metal strip 42 and the third metal strip 43 respectively, which can simultaneously reduce the temperature of the electronic device 20 and the circuit board 11 and ensure the normal use of the electronic device 20 and the circuit board 11.

[0078] In other embodiments, the second metal strip 42 and the third metal strip 43 may both be connected to the first metal strip 41.

[0079] In other embodiments, the second metal strip 42 and the third metal strip 43 may both be connected to the circuit board 11.

[0080] In some embodiments, the third metal strip 43 and the second metal strip 42 may include multiple strips. It is understood that the more third metal strips 43 and the more second metal strips 42 there are, the faster the heat transfer rate and the greater the heat dissipation capacity of the electronic device 20 and the circuit board 11. However, at the same time, the more space the second metal strips 42 and the third metal strips 43 occupy, which may increase the size of the charging module 10. The corresponding number of third metal strips 43 and second metal strips 42 can be set according to actual heat dissipation requirements.

[0081] This application embodiment does not limit the width L1 of the second metal strip 42 and the width L2 of the third metal strip 43. It is understood that the larger L1 and L2 are, the faster the heat transfer rate and the greater the heat dissipation capacity of the electronic device 20 and the circuit board 11. However, at the same time, the more space the second metal strip 42 and the third metal strip 43 occupy, the larger the volume of the charging module 10 may be. The width of the third metal strip 43 and the second metal strip 42 can be set according to the actual heat dissipation requirements.

[0082] Referring again to Figure 9, in some implementations, the cooling structure 30 is provided with a receiving cavity 34, which contains potting compound 61, and a second metal strip 42 extends into the potting compound 61. For example, the material of the potting compound 61 may include silicone rubber. With the second metal strip 42 extending into the potting compound 61, heat from the electronic device 20 and the circuit board 11 can be transferred to the potting compound 61 via the second metal strip 42, and then the potting compound 61 transfers the heat to the cooling structure 30.

[0083] The potting compound 61 can further increase the contact area between the second metal strip 42 and the cooling structure 30, accelerate the heat transfer rate, thereby improving the heat dissipation capacity of the electronic device 20 and the circuit board 11, and ensuring the normal use of the electronic device 20 and the circuit board 11.

[0084] In some embodiments, a connecting plate 35 is provided on the side of the cooling structure 30 facing the electronic device 20, and the connecting plate 35 forms an accommodating cavity 34. This application embodiment does not limit the connection method between the connecting plate 35 and the cooling structure 30. For example, the connecting plate 35 and the cooling structure 30 can be an integral structural component; the connecting plate 35 and the cooling structure 30 can also be connected by welding.

[0085] Referring to Figure 13, in some implementations, a thermally conductive material 62 is disposed between the end of the second metal strip 42 near the cooling structure 30 and the cooling structure 30. Heat from the electronic device 20 and the circuit board 11 can be transferred through the second metal strip 42 to the thermally conductive material 62, and then from the thermally conductive material 62 to the cooling structure 30. The thermally conductive material 62 can increase the contact area between the second metal strip 42 and the cooling structure 30, accelerate the heat transfer rate, thereby improving the heat dissipation capacity of the electronic device 20 and the circuit board 11, and ensuring the normal operation of the electronic device 20 and the circuit board 11.

[0086] In some implementations, the thermally conductive material 62 includes at least one of a thermally conductive pad or a thermally conductive adhesive. This application does not limit the materials of the thermally conductive pad and the thermally conductive adhesive. For example, the material of the thermally conductive pad may include silicone and a metal oxide, with the metal oxide doped into the silicone to form the thermally conductive pad. The material of the thermally conductive adhesive may include silicone rubber and a thermally conductive filler, which may include alumina, boron nitride, silicon oxide, etc. The thermally conductive pad has high hardness, and the thermally conductive adhesive has good elasticity.

[0087] Referring to Figure 14, in some implementations, the second metal strip 42 is located near the end of the cooling structure 30, and an insulating material 63 is disposed between it and the cooling structure 30. Exemplarily, the insulating material 63 may include a thermally conductive insulating film, a ceramic sheet, etc. The material of the thermally conductive insulating film may include at least one of silicone rubber, glass fiber, and polyimide.

[0088] The insulating material 63 has good insulation properties, which can effectively prevent current from being conducted from the second metal strip 42 to the cooling structure 30. The insulating material 63 can withstand a certain voltage, ensuring that the insulation properties of the insulating material 63 are not damaged, and ensuring the safe operation of the charging module 10.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A charging module, characterized in that, include: Circuit board; Electronic devices, the electronic devices being disposed on one side of the circuit board; A cooling structure is disposed on the side of the electronic device away from the circuit board; A first metal strip and a second metal strip, wherein the first metal strip is electrically connected to the electronic device and the circuit board, one end of the second metal strip is connected to the first metal strip or to the circuit board, the other end of the second metal strip is in thermal contact with the cooling structure, and the second metal strip is electrically isolated from the cooling structure.

2. The charging module according to claim 1, characterized in that, The charging module further includes: a third metal strip, wherein the third metal strip and the second metal strip are spaced apart; One end of the third metal strip is connected to the first metal strip, the other end of the third metal strip is in thermal contact with the cooling structure, and the third metal strip is electrically isolated from the cooling structure.

3. The charging module according to claim 1, characterized in that, The second metal strip extends in a direction perpendicular to the circuit board, and the portion of the second metal strip near the cooling structure bends in a direction parallel to the surface of the cooling structure.

4. The charging module according to claim 1, characterized in that, The second metal strip surrounds the outer periphery of the electronic device; The second metal strip includes a first metal strip, a second metal strip, and a third metal strip, which are connected in sequence. The first and third metal strips extend in a direction perpendicular to the plane of the circuit board, and the second metal strip extends in a direction parallel to the surface of the cooling structure, and the second metal strip is in thermally conductive contact with the cooling structure.

5. The charging module according to claim 4, characterized in that, Along a direction perpendicular to the extension of the first metal strip and perpendicular to the direction from the first metal strip to the third metal strip, the width of the first metal strip is greater than the width of the second metal strip and the width of the third metal strip.

6. The charging module according to any one of claims 1-5, characterized in that, The cooling structure is provided with a receiving cavity containing potting compound, and the second metal strip extends into the potting compound.

7. The charging module according to any one of claims 1-5, characterized in that, The second metal strip is located near the end of the cooling structure, and a thermally conductive material is disposed between it and the cooling structure.

8. The charging module according to claim 7, characterized in that, The thermally conductive material includes at least one of thermally conductive pads or thermally conductive adhesives.

9. The charging module according to claim 8, characterized in that, An insulating material is also provided between the end of the second metal strip near the cooling structure and the cooling structure.

10. A charging pile, characterized in that, The charging pile includes a charging module and a charging gun as described in any one of claims 1-9, wherein the charging gun is used to output the current output by the charging module to the electric vehicle.

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