Cooling structure, electronic device and heat sink

Abstract

Disclosed in the present application are a cooling structure, an electronic device and a heat sink. The cooling structure comprises: a cage, comprising: a housing; a first slot, which is provided in the housing, wherein a top plate of the first slot has a first hollowed-out structure; and a second slot, which is stacked with the first slot and provided in the housing, wherein a top plate of the second slot has a second hollowed-out structure. The cooling structure further comprises: a first heat sink, comprising: a first heat-conducting end, which enters the first slot by means of the first hollowed-out structure and is configured to come into thermal contact with a first device to be cooled in the first slot; a second heat-conducting end, which enters the second slot by means of the second hollowed-out structure and is configured to come into thermal contact with a second device to be cooled in the second slot; and a first heat-conducting member, which connects the first heat-conducting end and the second heat-conducting end.

Description

Heat dissipation structures, electronic devices and heat sinks

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411219522.0, filed on September 2, 2024, entitled "A Heat Dissipation Structure, Electronic Device and Heat Radiator", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of communication technology, and in particular to a heat dissipation structure, electronic device and heat sink. Background Technology

[0004] With the rapid development of the communications industry and the large-scale construction of data centers, the demand for optical communication equipment is constantly expanding and upgrading. Furthermore, optical communication equipment is gradually developing towards higher speeds, longer distances, and greater integration. As the processing power of optical communication equipment increases, more optical modules are needed to communicate with external devices. Summary of the Invention

[0005] In a first aspect, embodiments of this application provide a heat dissipation structure, comprising: a cage, including: a shell; a first slot disposed in the shell, wherein the top plate of the first slot has a first hollow structure; and a second slot stacked with the first slot, disposed in the shell, wherein the top plate of the second slot has a second hollow structure; and a first heat sink, comprising: a first heat-conducting end, entering the first slot through the first hollow structure for thermal contact with a first device to be cooled in the first slot; a second heat-conducting end, entering the second slot through the second hollow structure for thermal contact with a second device to be cooled in the second slot; and a first heat-conducting element connecting the first heat-conducting end and the second heat-conducting end.

[0006] In the above embodiment, the first heat sink connects the first heat sink in the upper optical cage and the second heat sink in the lower optical cage, thereby enabling the lower optical cage and the upper optical cage to share a heat dissipation structure, making full use of the internal space of the double optical cage and saving the space occupied by the heat dissipation structure.

[0007] In one embodiment, the cage can specifically be an optical cage in an optical communication device, and the device to be cooled can be an optical module. The cage includes two parallel housings and a partition, which divides the housings into three spaces from top to bottom: a first slot, a heat dissipation cavity, and a second slot. The first heat-conducting end of the heat sink extends from the first perforated structure into the first slot and fits against the first device to be cooled, dissipating its heat. The second heat-conducting end extends from the second perforated structure into the second slot and fits against the second device to be cooled, dissipating its heat, thus reducing the accumulation of heat in the slot. Furthermore, the optical cage has a heat dissipation cavity, and the heat sink makes full use of the internal space of the optical cage, resulting in a smaller space occupied by the heat dissipation structure.

[0008] In one embodiment, the cage further includes a heat dissipation cavity disposed between the first slot and the second slot.

[0009] In one embodiment, the cage includes a sidewall, and the heat dissipation cavity is provided with a clearance slot, which is used to avoid the first heat-conducting element and the second heat-conducting end.

[0010] In one embodiment, the clearance slot has an opening, the opening being configured as follows:

[0011] The cross-section of the first slot and the second slot is C-shaped in the plane formed by their stacking direction and the insertion direction of the first slot; or

[0012] The cross-section of the first slot and the second slot is O-shaped on the plane formed by the stacking direction of the first slot and the insertion direction of the first slot.

[0013] In one embodiment, the heat dissipation structure further includes a cold plate connected to the side of the first end opposite to the first elastic heat conductor.

[0014] In one embodiment, the first elastic thermal conductor is a thermal pad or a metal spring.

[0015] In one embodiment, the first heat-conducting element includes a first end, a second end, and a connecting segment, wherein the first end and the first heat-conducting end are in thermal contact, the second end and the second heat-conducting end are in thermal contact, and the connecting segment connects the first end and the second end.

[0016] In one embodiment, the first heat-conducting element is U-shaped.

[0017] In one embodiment, the first heat-conducting element is at least partially located on the outside of the cage.

[0018] In one embodiment, the first heat-conducting end includes a first heat-spreading block, which is connected to the side of the first end facing the first hollow structure, and the first heat-spreading block passes through the first hollow structure and is in thermal contact with the first device to be cooled.

[0019] In one embodiment, the first heat-conducting end further includes a first elastic heat conductor, which is disposed between the first end and the first heat-spreading block.

[0020] In one embodiment, the first elastic thermal conductor is a thermal pad or a metal spring.

[0021] In one embodiment, the heat dissipation structure further includes a first elastic element connected to the first heat spreader and the cage. The first elastic element is used to drive the first heat spreader closer to the first heat spreader when the first heat-dissipating device is inserted into the first slot.

[0022] In one embodiment, the first heat sink is used to connect to the cold plate; the first heat-conducting end further includes a second elastic heat conductor, which is located between the first end and the cold plate.

[0023] In one embodiment, the second elastic thermal conductor is a thermal pad.

[0024] In one embodiment, the second heat-conducting end includes a second heat-spreading block, which is connected to the side of the second end facing the second hollow structure, and the second heat-spreading block passes through the second hollow structure and makes thermal contact with the second device to be cooled.

[0025] In one embodiment, the cage further includes a heat dissipation cavity disposed between the first slot and the second slot, and the heat dissipation structure further includes a second elastic member disposed between the bottom plate of the first slot and the second end. The second elastic member is used to drive the second heat-conducting end closer to the second heat-dissipating device when inserted into the second slot during the second heat dissipation period.

[0026] In one embodiment, the cage includes an upper shell and a lower shell, with the first slot located in the upper shell and the second slot located in the lower shell.

[0027] In one embodiment, the upper housing and the lower housing are detachably connected.

[0028] In one embodiment, the upper housing includes a first housing and a second housing, the first housing and the lower housing are fixedly connected, the second housing is detachably connected to the first housing and the lower housing, and the second housing is located at the end of the upper housing away from the insertion port of the first slot.

[0029] In one embodiment, the second housing is pivotally connected to the first housing.

[0030] In one embodiment, the cage further includes: at least one third slot arranged along the width direction of the cage with the first slot, disposed in the housing, wherein the top plate of the at least one third slot has a third hollow structure; at least one fourth slot arranged along the width direction of the cage with the second slot, disposed in the housing, wherein the top plate of the second slot has a second hollow structure, and the at least one fourth slot and the at least one third slot are stacked together along the stacking direction; and a second heat sink, including: a third heat-conducting end, entering the third slot through the third hollow structure, for thermal contact with a third heat-dissipating device in the third slot; a fourth heat-conducting end, entering the fourth slot through the fourth hollow structure, for thermal contact with a fourth heat-dissipating device in the fourth slot; and a second heat-conducting element, connecting the third heat-conducting end and the fourth heat-conducting end; wherein the orthographic projection of the first heat-conducting element on the plane formed by the width direction and the stacking direction and the orthographic projection of the second heat-conducting element on the plane formed by the width direction and the stacking direction do not overlap at least partially.

[0031] In one embodiment, the orthographic projection of the first heat-conducting element onto the plane formed by the width direction and the stacking direction and the orthographic projection of the second heat-conducting element onto the plane formed by the width direction and the stacking direction do not overlap at all.

[0032] Secondly, embodiments of this application also provide an electronic device, which includes at least one of the above-described heat dissipation structures.

[0033] Thirdly, embodiments of this application also provide a heat sink, comprising:

[0034] A heat-conducting component, which is U-shaped, includes a first end and a second end. The first end has a first planar portion and a second planar portion that are opposite to each other. The first planar portion faces the second end. The second end has a third planar portion that is opposite to the first end.

[0035] A first heat spreader block is connected to the first planar portion;

[0036] The second heat exchanger is connected to the third planar portion;

[0037] A cold plate, the cold plate being connected to the second planar portion;

[0038] Along the arrangement direction of the first end and the second end, the first heat exchange block and the second heat exchange block are spaced apart by a preset distance.

[0039] In one embodiment, the heat sink further includes a first elastic heat conductor disposed between the first heat spreader and the first planar portion.

[0040] In one embodiment, the heat sink further includes a second elastic heat conductor disposed between the second planar portion and the cold plate.

[0041] This application embodiment also provides a radiator applied to a cage, wherein...

[0042] The cage includes:

[0043] case;

[0044] A first slot is disposed within the housing, wherein the top plate of the first slot has a first hollow structure; and

[0045] A second slot, stacked on top of the first slot, is disposed within the housing, wherein the top plate of the second slot has a second hollow structure comprising:

[0046] The heat sink includes:

[0047] The first heat-conducting end enters the first slot through the first hollow structure and is used to make thermal contact with the first heat-dissipating device in the first slot.

[0048] The second heat-conducting end enters the second slot through the second hollow structure, for thermal contact with the second heat-dissipating device in the second slot; and

[0049] The first heat-conducting component connects the first heat-conducting end and the second heat-conducting end. Attached Figure Description

[0050] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings introduced below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 is a schematic diagram of the heat dissipation structure provided in an embodiment of this application.

[0052] Figure 2 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application.

[0053] Figure 3 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application.

[0054] Figure 4 is a schematic diagram of the structure of the first elastic element provided in an embodiment of this application.

[0055] Figure 5 is a schematic diagram of the assembly of the first elastic element, the first heat-spreading block, and the cage provided in an embodiment of this application.

[0056] Figure 6 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application.

[0057] Figure 7 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application.

[0058] Figure 8 is a side view of the heat dissipation structure provided in an embodiment of this application.

[0059] Figure 9 is a side view of a heat dissipation structure provided in another embodiment of this application.

[0060] Figure 10 is an exploded view of the cage provided in an embodiment of this application.

[0061] Figure 11 is a schematic diagram of the cage in the open state according to another embodiment of this application.

[0062] Figure 12 is a front view of the heat dissipation structure provided in an embodiment of this application.

[0063] Figure 13 is a top view showing the installation position relationship of multiple heat sinks provided in an embodiment of this application.

[0064] Figure 14 is a top view showing the installation position relationship of multiple heat sinks according to another embodiment of this application.

[0065] Figure 15 is a schematic diagram of the structure of the heat sink provided in an embodiment of this application.

[0066] Figure 16 is a schematic diagram of the structure of a heat sink provided in another embodiment of this application.

[0067] Figure 17 is a schematic diagram of the structure of a heat sink provided in another embodiment of this application.

[0068] Reference numerals: 100-Cage; 200-Radiator; 101-First slot; 102-Second slot; 103-Heat dissipation cavity; 1011-First hollow structure; 1021-Second hollow structure; 201-First heat-conducting end; 202-Second heat-conducting end; 001-First device to be cooled; 002-Second device to be cooled; 203-Heat-conducting component; 2031-First end; 2032-Second end; 2011-First heat-spreading block; 2021-Second heat-spreading block; 2033-First planar portion; 204-Cold plate; 2034-Second planar portion; 2012-First elastic heat conductor; 1-First elastic component; 11-Feet; 12-Connecting part; 121-Bending section; 2041-Interface material layer; 2013-Second... Elastic heat conductor; 2035 - Third plane portion; 2036 - Connecting section; 104 - Side wall; 1041 - Avoidance slot; 2 - Second elastic element; 1001 - Upper shell; 1002 - Lower shell; 10110 - Top plate of the first slot; 1012 - Bottom plate of the first slot; 1013 - First side plate; 1014 - Second side plate; 10210 - Top plate of the second slot; 1022 - Bottom plate of the second slot; 1023 - Third side plate; 1024 - Fourth side plate; 10011 - First shell; 10012 - Second shell; X - First direction; Y - Second direction; 20301 - First heat conductor; 20302 - Second heat conductor; 20303 - Third heat conductor; 20304 - Fourth heat conductor Detailed Implementation

[0069] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0070] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0071] When using the terms "comprising," "having," and "including" as described in this application, another component may be added unless explicitly qualifying terms such as "only," "consisting of," etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having only one quantity.

[0072] In this application, unless otherwise defined in the context, if an element is referred to as being "fixed to," "set on," or "mounted to" another element, it may be directly "fixed to," "set on," or "mounted to" the other element, or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element, or there may be an intermediate element present. If present, the directional terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for the purpose of describing the directional relationship between elements and are not intended to impose any particular limitation.

[0073] As mentioned earlier, in related technologies, when implementing high-density port layouts for optical communication equipment, layered optical cages can accommodate more optical modules. However, due to the high density of optical modules and their high power consumption, heat is easily accumulated and difficult to dissipate, which can affect the performance of the optical modules.

[0074] This application provides a heat dissipation structure, a heat sink, and an electronic device. To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, in conjunction with the accompanying drawings, illustrates the embodiments. First, the application scenario is introduced: In optical communication equipment, the optical module is one of the main heat sources. The heat dissipation of the optical module mainly relies on a heat sink positioned above it. The fins of this heat sink exchange heat with the air via convection, thereby dissipating the heat inside the optical module. However, this air convection requires a large space. With the iterative design of optical modules, their power consumption has increased rapidly, significantly increasing the requirements for the fin area and airflow of the heat sink. This, in turn, leads to a series of problems such as increased fan power consumption and noise. Due to the high port density of the device, the heat dissipation space inside the device is limited, especially in double-layer optical cage applications, where the heat dissipation space of the lower optical module within the optical cage is even more restricted, and the heat dissipation conditions are more stringent.

[0075] This application provides a heat dissipation structure, an electronic device, and a heat sink, which improves the heat dissipation efficiency of the electronic device, and the heat dissipation structure occupies less space, making the electronic device structure compact.

[0076] Figure 1 is a schematic diagram of a heat dissipation structure provided by an embodiment of this application. As shown in Figure 1, the embodiment of this application provides a heat dissipation structure, which includes a cage 100 and a radiator 200. The cage 100 has slots 101 and 102, and the device to be dissipated can be plugged into and detachably connected to the slots 101 and 102.

[0077] Specifically, the cage 100 has a first slot 101 and a second slot 102 stacked together. A heat dissipation cavity 103 may be provided between the first slot 101 and the second slot 102. The top plate of the first slot 101 has a first hollow structure 1011, and the top plate of the second slot 102 has a second hollow structure 1021. The aforementioned heat sink 200 has a first heat-conducting end 201 and a second heat-conducting end 202. The first heat-conducting end 201 passes through the first hollow structure 1011 and is used to make thermal contact with the first heat-dissipating device 001 in the first slot 101 to conduct heat away from the first heat-dissipating device 001. The second heat-conducting end 202 is located in the heat dissipation cavity 103 and passes through the second hollow structure 1021 to make thermal contact with the second heat-dissipating device 002 in the second slot 102 to conduct heat away from the second heat-dissipating device 002.

[0078] In the above embodiments, the cage 100 can specifically be an optical cage in an optical communication device, and the device to be cooled can be an optical module. The cage 100 includes a shell and two parallel partitions. The partitions divide the shell into three spaces, from top to bottom: a first slot 101, a heat dissipation cavity 103, and a second slot 102. The first heat-conducting end 201 of the heat sink 200 extends from the first hollow structure 1011 into the first slot 101 and is in contact with the first device to be cooled 001, dissipating its heat. The second heat-conducting end 202 extends from the second hollow structure 1021 into the second slot 102 and is in contact with the second device to be cooled 002, dissipating its heat, thus reducing the accumulation of heat in the slots of the devices to be cooled 001 and 002. Furthermore, the cage 100 is provided with a heat dissipation cavity 103, and the heat sink 200 makes full use of the internal space of the cage 100, allowing the optical modules in the lower cage of the double-layer optical cage to share the top heat dissipation device of the upper cage, thereby reducing the space occupied by the heat dissipation structure.

[0079] In the embodiment shown in Figure 1, the heat sink 200 includes a heat-conducting element 203. This heat-conducting element 203 can be U-shaped, including a first end 2031 and a second end 2032. The first end 2031 is located outside the cage 100 and opposite to the first perforated structure 1011. The second end 2032 is located in the heat dissipation cavity 103 and opposite to the second perforated structure 1021. The heat-conducting element 203 is used to thermally connect the first heat-conducting end 201 and the second heat-conducting end 202, thereby dissipating heat from the two devices 001 and 002. The U-shaped heat-conducting element 203 allows the heat sink 200 to fully utilize the upper and lower spaces of the cage 100, making the heat sink 200 structure compact.

[0080] In the embodiment of FIG1, the first heat-conducting end 201 may include a first heat-spreading block 2011. The first heat-spreading block 2011 is connected to the side of the first end 2031 facing the first hollow structure 1011, and the first heat-spreading block 2011 passes through the first hollow structure 1011 and is in thermal contact with the first heat-dissipating device 001.

[0081] In the embodiment shown in Figure 1, the outer surface of the heat-conducting element 203 includes a first planar portion 2033. The aforementioned first heat-spreading block 2011 is connected to the first planar portion 2033, making the first heat-spreading block 2011 and the heat-conducting element 203 fit more tightly, thereby improving heat transfer efficiency.

[0082] In some embodiments, the heat-conducting element 203 may be a flat tube.

[0083] In the embodiment shown in Figure 1, the heat sink 200 is further configured to be connected to a cold plate 204. The cold plate 204 is connected to the side of the first end 2031 opposite to the first heat spreader 2011. The outer surface of the aforementioned heat-conducting component 203 also includes a second planar portion 2034. This second planar portion 2034 and the aforementioned first planar portion 2033 are respectively located on opposite sides of the first end 2031. The cold plate 204 is connected to the second planar portion 2034, making the cold plate 204 and the heat-conducting component 203 fit more tightly, thus improving heat transfer efficiency. Compared to air cooling, liquid cooling has higher heat dissipation efficiency.

[0084] Figure 2 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application. As shown in Figure 2, based on the embodiment shown in Figure 1, the first heat-conducting end 201 further includes a first elastic heat conductor 2012, which is connected between the first end 2031 and the first heat-spreading block 2011.

[0085] The aforementioned first elastic heat conductor 2012 is elastic, specifically it can be a thermal pad or a metal spring. When the first heat-dissipating device 001 is inserted into the first slot 101, the first elastic heat conductor 2012 can maintain the contact pressure between the first heat-spreading block 2011 and the first heat-dissipating device 001, so that the first heat-spreading block 2011 and the first heat-dissipating device 001 are in close contact, thereby improving the heat transfer efficiency, and can also ensure the heat conduction capacity between the first heat-spreading block 2011 and the heat-conducting component 203.

[0086] Figure 3 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application, Figure 4 is a schematic diagram of the structure of the first elastic member 1 provided in an embodiment of this application, and Figure 5 is an assembly schematic diagram of the first elastic member 1, the first heat dissipation block 2011, and the cage 100 provided in an embodiment of this application.

[0087] As shown in Figure 3, based on the embodiment shown in Figure 2, the above-mentioned heat dissipation structure may further include a first elastic element 1, which is connected to the first heat spreader 2011 and the cage 100. The first elastic element 1 is used to allow the first heat spreader 2011 to approach the first heat dissipation device 001, thereby making the first heat spreader 2011 and the first heat dissipation device 001 fit tightly together.

[0088] Specifically, the first elastic element 1 can be a frame structure, and has two oppositely arranged legs 11 and a connecting part 12. The legs 11 are connected to both sides of the cage 100, and the two ends of the connecting part 12 are respectively connected to the two legs 11.

[0089] As shown in Figures 4 and 5, the connecting portion 12 of the first elastic member 1 has a bent section 121 that protrudes towards the first heat spreader 2011. The top of the first heat spreader 2011 contacts the bent section 121. When the first heat-dissipating device 001 is not inserted into the first slot 101, the first elastic member 1 is in an energy-released state. When the first heat-dissipating device 001 is inserted into the first slot 101, the first heat-dissipating device 001 pushes the first heat spreader 2011 upward, and the bent section 121 is pressed upward by the first heat spreader 2011, thereby causing the first elastic member 1 to undergo slight deformation and enter an energy-storing state. The restoring force of the bent section 121 tending to return to its natural state presses the first heat spreader 2011 downward, thereby ensuring that the first heat spreader 2011 is always in contact with the first heat-dissipating device 001, guaranteeing a tight connection between the first heat spreader 2011 and the first heat-dissipating device 001, and further improving heat transfer efficiency.

[0090] Referring again to Figure 3, to further improve the heat transfer efficiency between the cold plate 204 and the heat-conducting component 203, an interface material layer 2041 may be provided between the cold plate 204 and the first end 2031. Specifically, the interface material layer 2041 may be a silicone grease layer.

[0091] Referring again to Figure 3, the second heat-conducting end 202 further includes a second heat-spreading block 2021. The second heat-spreading block 2021 is connected to the side of the second end 2032 of the heat-conducting component 203 facing the second hollow structure 1021, and the second heat-spreading block 2021 passes through the second hollow structure 1021 and is in thermal contact with the second heat-dissipating device 002 so that the heat of the second heat-dissipating device 002 can be dissipated.

[0092] Figure 6 is a schematic diagram of a heat dissipation structure provided in another embodiment of this application. As shown in Figure 6, the difference from the embodiment shown in Figure 3 is that, alternatively or additionally, the first heat-conducting end 201 includes a second elastic heat-conducting body 2013. The second elastic heat-conducting body 2013 is located between the first end 2031 and the cold plate 204. The second elastic heat-conducting body 2013 can be a thermal pad, used to reduce the thermal resistance between the heat-conducting element 203 and the cold plate 204, and improve the heat transfer efficiency.

[0093] As shown in Figure 7, the difference from the embodiment shown in Figure 6 is that the above-mentioned heat dissipation structure additionally includes a second elastic member 2, which is installed on the side of the bottom plate (partition) of the first slot 101 facing the second hollow structure. The bottom plate of the first slot 101 and the top plate (partition) of the second slot 102 are arranged opposite to each other. The second end 2032 of the heat-conducting member 203 is located between the second elastic member 2 and the second heat-spreading block 2021, and the second elastic member 2 is used to drive the second heat-conducting end 202 closer to the second heat-dissipating device 002.

[0094] In one specific embodiment, the second elastic element 2 can be a sheet, a spring, or an elastic thermal pad.

[0095] The second end 2032 of the heat-conducting element 203 can have the same or different structures as the first end 2031. Both the second end 2032 and the first end 2031 of the heat-conducting element 203 can have two planar portions that are opposite to each other. Specifically, the heat-conducting element 203 includes a third planar portion 2035, located on the side of the second end 2032 facing the second hollow structure 1021. The second heat-spreading block 2021 is mounted on the third planar portion 2035 to increase the contact area and thus improve heat transfer efficiency.

[0096] In one embodiment, the heat-conducting element 203 may be a heat pipe. The heat pipe has an inner cavity with a capillary structure and is filled with a heat-conducting medium.

[0097] In some of the above embodiments, the first heat-conducting end 201 and the second heat-conducting end 202 of the heat sink 200 are connected by a heat-conducting component 203, and the two heat-conducting ends share a cold plate 204 for heat dissipation, thus reducing the volume of the heat sink 200. The first heat-spreading block 2011 and the second heat-spreading block 2021 can both be made of metal and can have the same size. The first heat-spreading block 2011 and the second heat-spreading block 2021 are elongated strips, with their length extending along the insertion direction of the device to be cooled, thereby increasing the contact area between the first heat-spreading block 2011 and the second heat-spreading block 2021 and the device to be cooled.

[0098] Figure 8 is a side view of a heat dissipation structure provided in an embodiment of this application. As shown in Figure 8, the heat-conducting component 203 further includes a connecting section 2036, the two ends of which are respectively connected to a first end 2031 and a second end 2032. In one embodiment, the connecting section 2036 is located on the outer side of the cage 100. The cage 100 includes a side wall 104, which is parallel to the insertion direction of the device to be cooled. A clearance slot 1041 is provided at the corresponding position of the side wall 104 and the heat dissipation cavity 103. The opening of the clearance slot 1041 extends toward the rear end of the cage 100. The clearance slot 1041 is used to avoid the heat-conducting component 203, so that the heat-conducting component 203 can pass through the side wall 104 of the cage 100 and extend to the outside of the cage 100. And when the radiator 200 is installed, the second heat-spreading block 2021 of the second heat-conducting end 202 can pass through the clearance slot 1041 and be installed inside the cage.

[0099] Figure 9 is a side view of a heat dissipation structure provided in another embodiment of this application. As shown in Figure 9, in one embodiment, the aforementioned clearance slot 1041 can also be an O-hole, the length direction of which extends along the insertion direction of the first heat dissipation device 001. This is to avoid the problem of misalignment caused by assembly tolerances preventing the heat sink 200 from being properly assembled with the cage 100.

[0100] Figure 10 is an exploded view of the cage provided in an embodiment of this application. As shown in Figure 10, to facilitate the assembly of the radiator 200 and the cage 100, the cage 100 can be designed as a splicing structure. In one embodiment, the cage 100 includes an upper shell 1001 and a lower shell 1002, with a first slot 101 located in the upper shell 1001 and a second slot 102 located in the lower shell 1002. The upper shell 1001 and the lower shell 1002 are detachably connected. The cage 100 adopts a split structure. During assembly, the upper shell 1001 and the lower shell 1002 are separated. After the first heat-conducting end 201 of the radiator 200 is connected to the first hollow structure 1011, the assembled upper shell 1001 and the radiator 200 are joined together as a whole with the lower shell 1002, so that the second heat-conducting end 202 is inserted into the second hollow structure 1021 and contacts the second heat-dissipating device 002.

[0101] In one embodiment, the upper housing 1001 includes a top plate 10110 of a first slot, a bottom plate (partition) 1012 of the first slot 101, and a first side plate 1013 and a second side plate 1014 disposed opposite to each other. The top plate (partition) 10110 and the bottom plate 1012 of the first slot 101 are connected between the first side plate 1013 and the second side plate 1014. The bottom plate 1012 of the first slot 101 also serves as the top plate of the heat dissipation cavity 103. The lower housing 1002 includes a top plate 10210 of a second slot, a bottom plate 1022 of the second slot 102, and a third side plate 1023 and a fourth side plate 1024 disposed opposite to each other. The top plate 10210 of the second slot 102 also serves as the bottom plate of the heat dissipation cavity 103. The first side plate 1013 and the second side plate 1014 extend into the lower housing 1002. The first side plate 1013 can be connected to the third side plate 1023 via a snap-fit, and the second side plate 1014 can be connected to the fourth side plate 1024 via a snap-fit. After the upper shell 1001 and the lower shell 1002 are assembled, the bottom plate 1022 of the first slot 101, the top plate 10210 of the second slot 102, the first side plate 1013, and the second side plate 1014 enclose a heat dissipation cavity 103. The aforementioned clearance slot 1041 can be located on the first side plate 1013 or the second side plate 1014, or both the first side plate 1013 and the second side plate 1014 can be provided with clearance slots 1041. The protrusion direction of the heat-conducting component 203 can be selected according to actual assembly needs.

[0102] Figure 11 is a schematic diagram of the cage in an open state according to another embodiment of this application. As shown in Figure 11, the tail of the cage 100 is provided with a detachable structure to facilitate the assembly of the radiator 200 with the cage 100. Specifically, one end of the cage 100 is open and the other end is closed. The opening refers to the insertion port of the first slot 101 and the second slot 102, and the end away from the insertion port is the closed tail end. The cage 100 includes an upper shell 1001 and a lower shell 1002. The first slot 101 and the heat dissipation cavity 103 can be located in the upper shell 1001, and the second slot 102 is located in the lower shell 1002. The upper shell 1001 includes a first shell 10011 near the insertion port and a second shell 10012 near the tail end. When the second housing 10012 is opened, the cage 100 is L-shaped and the tail end of the cage 100 is open. The second heat-conducting end 202 of the radiator 200 can be inserted into the heat dissipation cavity 103 from the open tail end. After the radiator 200 is installed, the second housing 10012 is installed to the tail end of the cage 100 so that it is connected to the first housing 10011 and the lower housing 1002.

[0103] The connection between the second housing 10012 and the first housing 10011 can be a snap-fit ​​connection or a pivot connection; this application does not impose any specific restrictions.

[0104] Figure 12 is a front view of a heat dissipation structure provided in an embodiment of this application. Figure 13 is a top view of the installation positions of multiple heat sinks provided in an embodiment of this application. Referring to Figures 12 and 13, the cage 100 includes multiple first slots 101 arranged along a first direction (width direction) X and multiple second slots 102 arranged along the first direction X. The first slots 101 and second slots 102 correspond one-to-one along a second direction (stack direction) Y. The first direction X, the second direction Y, and the insertion direction Z of the first heat-dissipating device 001 are perpendicular to each other. The heat dissipation structure includes multiple heat sinks 200, with one heat sink 200 installed in each pair of corresponding first slots 101 and second slots 102. The orthographic projections of the heat-conducting element 203 of each heat sink 200 onto the plane formed by the first direction X and the stack direction Z do not overlap.

[0105] As shown in Figure 13, the cage 100 has a 2x4 port configuration, meaning it has eight slots: four first slots 101 on the upper layer and four second slots 102 on the lower layer. The heat dissipation structure includes four heat sinks 200, i.e., four heat-conducting elements 203. These four heat-conducting elements 203 are designated as first heat-conducting element 20301, second heat-conducting element 20302, third heat-conducting element 20303, and fourth heat-conducting element 20304. Each pair of first slots 101 and second slots 102 constitutes a mounting position. Thus, along the first direction X, the cage 100 includes four sequentially arranged mounting positions. The first heat-conducting element 20301 is mounted in the first mounting position, the second heat-conducting element 20302 is mounted in the second mounting position, the third heat-conducting element 20303 is mounted in the third mounting position, and the fourth heat-conducting element 20304 is mounted in the fourth mounting position. The first heat-conducting element 20301 and the second heat-conducting element 20302 are located on the left side of the cage 100, while the third heat-conducting element 20303 and the fourth heat-conducting element 20304 are located on the right side of the cage 100. The first heat-conducting element 20301 and the fourth heat-conducting element 20304 have the same dimensions, and the second heat-conducting element 20302 and the third heat-conducting element 20303 have the same dimensions. The heat-conducting elements 203 on the left and right sides of the cage 100 are staggered. This arrangement ensures that adjacent heat-dissipating structures do not interfere with each other when multiple heat-dissipating structures are installed in the equipment, reduces space occupation, and makes the overall structure of the equipment compact.

[0106] Figure 14 is a top view showing the installation position relationship of multiple heat sinks according to another embodiment of this application. As shown in Figure 14, the first heat-conducting element 20301, the second heat-conducting element 20302, the third heat-conducting element 20303, and the fourth heat-conducting element 20304 can all be located on the same side of the cage 100, and the dimensions of the first heat-conducting element 20301, the second heat-conducting element 20302, the third heat-conducting element 20303, and the fourth heat-conducting element 20304 increase sequentially. For example, the heat-conducting elements can all be arranged around the left side of the cage 100, or the heat-conducting elements 203 can all be arranged around the right side of the cage 100. The arrangement can be made according to specific requirements, and this application does not impose specific limitations.

[0107] It is worth noting that the cage 100 described above can also be a 2x2 port or a 2x6 port. The arrangement of the heat-conducting components 203 is not limited to the arrangement shown in the above embodiments.

[0108] Embodiments of this application also provide an electronic device including at least one of the above-described heat dissipation structures, wherein the at least one heat dissipation structure is arranged sequentially along a first direction. The heat-conducting elements 203 of the heat sinks 200 in each heat dissipation structure are staggered, and the heat-conducting elements 203 of adjacent heat dissipation structures do not interfere with each other, making full use of the internal space of the device and resulting in a compact device structure. Simultaneously, the heat dissipation structure can conduct heat away from the 200 heat sinks located in the lower cage 100, reducing heat accumulation and achieving good heat conduction.

[0109] Figure 15 is a schematic diagram of the structure of a heat sink provided in an embodiment of this application. As shown in Figure 15, an embodiment of this application also provides a heat sink 200, which includes: a heat-conducting component 203, a first heat-spreading block 2011, a second heat-spreading block 2021, and a cold plate 204. The heat-conducting component 203 is U-shaped, including a first end 2031 and a second end 2032. The first end 2031 has a first planar portion 2033 and a second planar portion 2034 that are opposite to each other. The first planar portion 2033 faces the second end 2032, and the second end 2032 has a third planar portion 2035 that is opposite to the first end 2031. The first heat-spreading block 2011 is connected to the first planar portion 2033, the second heat-spreading block 2021 is connected to the third planar portion 2035, and the cold plate 204 is connected to the second planar portion 2034. Along the arrangement direction of the first end 2031 and the second end 2032, the first heat-spreading block 2011 and the second heat-spreading block 2021 are spaced apart by a preset distance. The heat sink 200 of this application has two heat-conducting ends, which can simultaneously dissipate heat for two devices to be cooled. The two heat-conducting ends share one heat dissipation end (cold plate 204), which has a compact structure, occupies less space, and is suitable for heat dissipation of devices arranged in high density.

[0110] Figure 16 is a schematic diagram of another heat sink provided in an embodiment of this application. As shown in Figure 16, in one embodiment, the heat sink further includes a first elastic heat conductor 2012, which is disposed between the first heat spreader 2011 and the first planar portion 2033. When the first heat spreader 2011 contacts the device to be cooled, the first elastic heat conductor 2012 can maintain contact pressure between the first heat spreader 2011 and the device to be cooled, thereby improving heat transfer efficiency.

[0111] Figure 17 is a schematic diagram of another heat sink provided in an embodiment of this application. As shown in Figure 17, in one embodiment, the heat sink 200 further includes a second elastic heat conductor 2013, which is disposed between the second planar portion 2034 and the cold plate 204. The second elastic heat conductor 2013 can reduce the thermal resistance between the cold plate 204 and the heat conductor 203, thereby improving the heat transfer efficiency.

[0112] The first elastic heat conductor 2012 is a heat-conducting pad or a metal sheet, and the second elastic heat conductor 2013 can be a heat-conducting pad.

[0113] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A heat dissipation structure, comprising: The cage includes: case; A first slot is disposed within the housing, wherein the top plate of the first slot has a first hollow structure; and A second slot, stacked on top of the first slot, is disposed within the housing, wherein the top plate of the second slot has a second hollow structure; and The first radiator includes: The first heat-conducting end enters the first slot through the first hollow structure and is used to make thermal contact with the first heat-dissipating device in the first slot. The second heat-conducting end enters the second slot through the second hollow structure, for thermal contact with the second heat-dissipating device in the second slot; and The first heat-conducting component connects the first heat-conducting end and the second heat-conducting end.

2. The heat dissipation structure according to claim 1, wherein, The cage also includes a heat dissipation cavity disposed between the first slot and the second slot.

3. The heat dissipation structure according to claim 2, wherein, The cage includes side walls, and the heat dissipation cavity is provided with a clearance slot, which is used to avoid the first heat-conducting element and the second heat-conducting end.

4. The heat dissipation structure according to claim 3, wherein, The clearance slot has an opening, and the opening is configured as follows: The cross-section of the first slot and the second slot is C-shaped in the plane formed by their stacking direction and the insertion direction of the first slot; or The cross-section of the first slot and the second slot is O-shaped on the plane formed by the stacking direction of the first slot and the insertion direction of the first slot.

5. The heat dissipation structure according to any one of claims 1 to 4, wherein, The first heat-conducting component includes a first end, a second end, and a connecting section. The first end and the first heat-conducting end are in thermal contact, the second end and the second heat-conducting end are in thermal contact, and the connecting section connects the first end and the second end. Preferably, the first heat-conducting component is U-shaped.

6. The heat dissipation structure according to any one of claims 1 to 5, wherein, The first heat-conducting element is located at least partially outside the cage.

7. The heat dissipation structure according to claim 5 or 6, wherein, The first heat-conducting end includes a first heat-spreading block, which is connected to the side of the first end facing the first hollow structure. The first heat-spreading block passes through the first hollow structure and is in thermal contact with the first device to be cooled.

8. The heat dissipation structure according to claim 7, wherein, The first heat-conducting end also includes a first elastic heat-conducting body, which is disposed between the first end and the first heat-spreading block.

9. The heat dissipation structure according to claim 8, wherein, The first elastic heat conductor is a heat-conducting pad or a metal spring.

10. The heat dissipation structure according to any one of claims 7 to 9, wherein, The heat dissipation structure further includes a first elastic element, which is connected to the first heat spreader and the cage. The first elastic element is used to drive the first heat spreader to approach the first heat spreader when the first heat-dissipating device is inserted into the first slot.

11. The heat dissipation structure according to any one of claims 5 to 10, wherein, The first heat sink is used to connect to the cold plate; the first heat-conducting end also includes a second elastic heat conductor, which is located between the first end and the cold plate.

12. The heat dissipation structure according to claim 11, wherein, The second elastic thermal conductor is a thermal pad.

13. The heat dissipation structure according to any one of claims 5 to 12, wherein, The second heat-conducting end includes a second heat-spreading block, which is connected to the side of the second end facing the second hollow structure. The second heat-spreading block passes through the second hollow structure and is in thermal contact with the second device to be cooled.

14. The heat dissipation structure according to claim 13, wherein, The cage also includes a heat dissipation cavity disposed between the first slot and the second slot. The heat dissipation structure also includes a second elastic member disposed between the bottom plate of the first slot and the second end. The second elastic member is used to drive the second heat-conducting end to approach the second heat-dissipating device when it is inserted into the second slot during the second heat dissipation period.

15. The heat dissipation structure according to any one of claims 1 to 14, wherein, The cage includes an upper shell and a lower shell, with the first slot located in the upper shell and the second slot located in the lower shell. Optionally, the upper shell and the lower shell are detachably connected.

16. The heat dissipation structure according to claim 15, wherein, The upper housing includes a first housing and a second housing. The first housing and the lower housing are fixedly connected. The second housing is detachably connected to the first housing and the lower housing. The second housing is located at the end of the upper housing away from the insertion port of the first slot. Optionally, the second housing is pivotally connected to the first housing.

17. The heat dissipation structure according to any one of claims 1 to 16, wherein, The cage also includes: At least one third slot is arranged in the housing along the width direction of the cage and is provided in the housing, wherein the top plate of the at least one third slot has a third hollow structure; At least one fourth slot, arranged along the width direction of the cage and aligned with the second slot, is disposed in the housing, wherein the top plate of the second slot has a second perforated structure, and the at least one fourth slot is stacked with the at least one third slot along the stacking direction; and The second radiator includes: The third heat-conducting end enters the third slot through the third hollow structure and is used to make thermal contact with the third heat-dissipating device in the third slot; The fourth heat-conducting end enters the fourth slot through the fourth hollow structure, for thermal contact with the fourth heat-dissipating device in the fourth slot; and The second heat-conducting component connects the third heat-conducting end and the fourth heat-conducting end; Wherein, the orthographic projection of the first heat-conducting element on the plane formed by the width direction and the stacking direction and the orthographic projection of the second heat-conducting element on the plane formed by the width direction and the stacking direction do not overlap at least partially.

18. The heat dissipation structure as described in claim 17, wherein, The orthographic projection of the first heat-conducting element onto the plane formed by the width direction and the stacking direction and the orthographic projection of the second heat-conducting element onto the plane formed by the width direction and the stacking direction do not overlap at all.

19. An electronic device comprising at least one heat dissipation structure as described in any one of claims 1 to 18.

20. A radiator applied to a cage, wherein, The cage includes: case; A first slot is disposed within the housing, wherein the top plate of the first slot has a first hollow structure; and A second slot, stacked on top of the first slot, is disposed within the housing, wherein the top plate of the second slot has a second hollow structure comprising: The heat sink includes: The first heat-conducting end enters the first slot through the first hollow structure and is used to make thermal contact with the first heat-dissipating device in the first slot. The second heat-conducting end enters the second slot through the second hollow structure, for thermal contact with the second heat-dissipating device in the second slot; and The first heat-conducting component connects the first heat-conducting end and the second heat-conducting end.

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