Electronic component

Abstract

Provided is an electronic component in which heat dissipation performance from a bus bar is improved without providing a complicated structure. This electronic component 1 comprises: an electronic component body 10; and a bus bar 20 connected to the electronic component body 10 and having a metal plate 21 having a first principal surface 21a and a second principal surface 21b, and a heat radiation promotion part 22 rising from at least one of the principal surfaces 21a, 21b of the metal plate 21.

Description

Electronic Components

[0001] The present invention relates to electronic components.

[0002] Capacitors used for smoothing purposes in power conversion devices for electric vehicles often use film capacitors for reliability reasons. Because the dielectric is a polymer film, the dielectric has a low heat resistance temperature. This creates a problem because heat transfer from other components, such as power semiconductor elements, and heat generated by the film capacitor elements and bus bars within the capacitor can exceed the film capacitor's heat resistance temperature. Heat generated in the bus bars, which are the connection points between the power semiconductor elements and the power source, can be particularly problematic.

[0003] Patent Document 1 discloses a technology for enhancing the heat dissipation effect by forming heat dissipation holes in the flat, side, and top plates of a bus bar. The heat dissipation holes serve to dissipate heat emitted from surrounding electronic components and to promote cooling of the bus bar itself.

[0004] Japanese Patent Application Publication No. 10-290085

[0005] In Patent Document 1, a large, complex heat dissipation section must be provided separately on the bus bar to cool the electronic components, which may make it impossible to achieve both heat dissipation performance and miniaturization of the electronic component module including the electronic components and the bus bar, as well as simplification of the process and cost reduction. Furthermore, providing a heat dissipation section with such a large, three-dimensional structure on the bus bar may cause the heat dissipation section to vibrate significantly when the electronic component module is subjected to vibration, potentially damaging the joints between the bus bars.

[0006] The present invention has been made to solve the above problems, and has an object to provide an electronic component that has improved heat dissipation performance from a bus bar without providing a complex structure.

[0007] The electronic component of the present invention is an electronic component comprising: an electronic component body; a metal plate connected to the electronic component body and having a first main surface and a second main surface; and a bus bar having a heat dissipation promotion portion rising from at least one main surface of the metal plate.

[0008] According to the present invention, it is possible to provide an electronic component that has improved heat dissipation performance from a bus bar without providing a complex structure.

[0009] Fig. 1 is a perspective view schematically illustrating an example of an electronic component according to one embodiment of the present invention. Fig. 2 is a perspective view schematically illustrating only an electronic component body and bus bars extracted from the electronic component shown in Fig. 1. Fig. 3 is a schematic view showing an enlarged view of a portion of a metal plate of an electronic component according to a first embodiment of the present invention. Fig. 4 is a schematic view showing an enlarged view of a portion of a metal plate of an electronic component according to a second embodiment of the present invention. Fig. 5 is a schematic view showing an enlarged view of a portion of a metal plate of an electronic component according to a third embodiment of the present invention.

[0010] The electronic component of the present invention is described below. The electronic component of the present invention includes an electronic component body, a metal plate connected to the electronic component body and having a first main surface and a second main surface, and a bus bar having a heat dissipation promotion portion extending from at least one main surface of the metal plate. As long as the electronic component of the present invention has the above configuration, it may be modified as appropriate within the scope of the present invention.

[0011] In this specification, terms indicating the relationship between elements (e.g., "perpendicular," "parallel," "orthogonal," etc.) and terms indicating the shapes of elements are not expressions that only express a strict meaning, but also expressions that include a range of substantial equivalence, for example, a difference of about a few percent. In addition, the drawings shown below are schematic diagrams, and the dimensions, aspect ratio, etc. may differ from those of the actual product.

[0012] The following embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. Furthermore, a combination of multiple individual preferred configurations described below also constitutes the present invention. From the second embodiment onward, descriptions of matters common to the first embodiment will be omitted, and only differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0013] First Embodiment First, an electronic component according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view schematically illustrating an example of an electronic component according to an embodiment of the present invention. Fig. 2 is a perspective view schematically illustrating only an electronic component body and bus bars extracted from the electronic component shown in Fig. 1. The electronic component 1 shown in Figs. 1 and 2 includes an electronic component body 10 and a bus bar 20 connected to the electronic component body 10.

[0014] As shown in FIG. 1, the electronic component body 10 is sealed with a sealing resin (not shown) and housed in an exterior case 40 .

[0015] Bus bar 20 includes metal plate 21 that is not sealed with sealing resin and has first and second main surfaces 21a and 21b that protrude outside exterior case 40, and heat dissipation promotion portions 22 that rise from first main surface 21a of metal plate 21. Note that in the electronic component according to the first embodiment of the present invention, the heat dissipation promotion portions may rise from the second main surface of the metal plate, or may rise from both the first and second main surfaces.

[0016] The metal plate 21 functions as an external terminal for electrically connecting the electronic component body 10 to other components (not shown), such as a power semiconductor or a battery. Conventional known components can be used as the power semiconductor, battery, or other components. The electronic component of the present invention may also include other components, such as a power semiconductor or a battery, as constituent elements.

[0017] When the metal plate 21 is connected to a power semiconductor or a battery, the bus bar 20 functions as a member that supplies power to the electronic component body 10 .

[0018] When the metal plate 21 functions as an external terminal, a current flows through the metal plate 21, which causes heat to be generated in the metal plate 21. When the electronic component body 10 generates heat, the heat is transferred from the electronic component body 10 to the metal plate 21.

[0019] In electronic component 1, heat dissipation promotion portion 22 is formed, which increases the overall surface area of ​​metal plate 21. As a result, heat from metal plate 21 is quickly dissipated to the outside. Therefore, electronic component 1 can be said to be an electronic component with improved heat dissipation performance from the bus bar without requiring a complex structure. In other words, in electronic component 1, heat from other components is dissipated by heat dissipation promotion portion 22, making it less likely to be transferred to electronic component body 10, and heat from electronic component body 10 is dissipated by heat dissipation promotion portion 22, thereby suppressing a temperature rise in electronic component body 10. As a result, heat dissipation performance from bus bar 20 is improved, and it is possible to prevent electronic component body 10 from being used above its heat resistance temperature.

[0020] In the electronic component 1, the electronic component body 10 may be any type of component connected by the bus bar 20, but may be, for example, a capacitor. When the electronic component body 10 is a capacitor, the capacitor is preferably a film capacitor. Because film capacitors contain a polymer film as a dielectric, they have a relatively low heat resistance temperature and require enhanced heat dissipation. As described above, the electronic component 1 has improved heat dissipation performance from the bus bar 20, preventing the film capacitor from being used above its heat resistance temperature. The film capacitor may be a conventionally known product, or may include a film capacitor having a low heat resistance polymer film as a dielectric. For example, the polymer film used as the dielectric may be made of a material such as polypropylene or a thermoplastic polymer primarily composed of polypropylene.

[0021] When the electronic component body 10 is a capacitor, the electronic component 1 can be suitably used for smoothing purposes in power conversion devices for electric vehicles and the like.

[0022] The electronic component body 10 may be a component other than a capacitor, such as a power semiconductor, a battery, a reactor, or a current sensor.

[0023] In the electronic component 1, the material constituting the bus bar 20 (metal plate 21) is not particularly limited, but may be copper, aluminum, etc. These metals have high conductivity and are therefore suitable as materials for the bus bar 20.

[0024] In the electronic component 1, through holes may be formed in the bus bars 20. When through holes are formed in the bus bars 20, air can pass through the through holes, improving heat dissipation performance.

[0025] In the electronic component 1, the metal plate 21 may be composed of one metal layer or two or more metal layers. The total thickness of the metal plate 21 is preferably 0.4 mm or more and 1.5 mm or less, and more preferably 0.4 mm or more and 1.2 mm or less. If the total thickness of the metal plate is less than 0.4 mm, the strength of the metal plate will be reduced, and current will not easily flow, making the metal plate more likely to generate heat. If the total thickness of the metal plate exceeds 1.5 mm, it will be difficult to miniaturize the electronic component.

[0026] Furthermore, when the metal plate 21 is made up of two or more metal layers, the thickness of each metal layer is preferably 0.4 mm or more and 0.8 mm or less, and more preferably 0.4 mm or more and 0.6 mm or less.

[0027] Next, the heat dissipation promotion portion 22 in the electronic component 1 will be described in detail. Fig. 3 is a schematic diagram showing an enlarged view of a portion of the metal plate of the electronic component according to the first embodiment of the present invention. In the electronic component 1, the heat dissipation promotion portion 22 has a structure in which a cut is made in a portion of the metal plate 21 and the portion connected to the metal plate 21 is bent and raised, and the portion that was part of the metal plate 21 becomes a through-hole 23.

[0028] Such heat dissipation promotion portion 22 can be easily produced by making cuts in metal plate 21 using a laser cutter, punching, or the like, and bending the cuts toward first main surface 21 a. When through holes 23 are formed in metal plate 21, air can pass through through holes 23, improving heat dissipation performance.

[0029] In this way, when the heat dissipation promotion portions 22 and the through holes 23 are formed by cutting a portion of the metal plate 21, the aperture ratio of the metal plate 21 is preferably 5% or more and 20% or less. If the aperture ratio is less than 5%, the size or number of the heat dissipation promotion portions will be small, making it difficult to obtain sufficient heat dissipation performance. If the aperture ratio is more than 20%, the current flow path will be small, making the electrical resistance of the metal plate likely to be high.

[0030] In the electronic component 1, the shape of the heat dissipation promotion portion 22 in a plan view is not particularly limited, and may be a triangle, a rectangle, a semicircle, a U-shaped outline, or the like, and if the shape is a triangle or a rectangle, the corners may be rounded. If the shape of the heat dissipation promotion portion 22 in a plan view is a triangle, it is preferably an isosceles triangle or an equilateral triangle. If the shape of the heat dissipation promotion portion 22 in a plan view is a rectangle, it is preferably a square or a rectangle.

[0031] In the electronic component 1, the arrangement of the metal plate 21 is not particularly limited, but it is preferable that the heat dissipation promotion portions 22 be arranged in a regular pattern when viewed from above on the metal plate 21. For example, when viewed from above on the metal plate 21, the heat dissipation promotion portions 22 may be arranged in a staggered pattern or a grid pattern on the metal plate 21. When the heat dissipation promotion portions 22 are arranged in this manner, heat can be dissipated uniformly. In particular, when the heat dissipation promotion portions 22 are arranged in a staggered pattern on the metal plate 21, the distance between adjacent heat dissipation promotion portions 22 can be easily increased, thereby improving the heat dissipation effect.

[0032] In the electronic component 1, the heat dissipation promotion portions 22 may be formed perpendicular to the metal plate 21 or at an angle, but it is preferable that each heat dissipation promotion portion 22 is formed at the same angle to the metal plate 21.

[0033] In the electronic component 1, the materials for the sealing resin and the exterior case 40 are not particularly limited, and conventionally known materials can be used.

[0034] Second Embodiment Next, an electronic component according to a second embodiment of the present invention will be described. The electronic component according to the second embodiment of the present invention differs from the electronic component according to the first embodiment of the present invention in that the electronic component is formed by overlapping a first metal plate on the first main surface side and a second metal plate on the second main surface side, the heat dissipation promotion portion is a first heat dissipation promotion portion formed by making a cut in part of the first metal plate and bending the part connected to the first metal plate toward the first main surface, and the part that was part of the first metal plate is a bottomed hole with the second metal plate as the bottom surface.

[0035] The metal plate of the electronic component according to the second embodiment of the present invention will be described in detail below with reference to the drawings. Fig. 4 is a schematic diagram showing an enlarged view of a portion of the metal plate of the electronic component according to the second embodiment of the present invention.

[0036] The metal plate 121 shown in FIG. 4 is formed by stacking a first metal plate 131a on the first main surface 121a side and a second metal plate 131b on the second main surface 121b side.

[0037] Furthermore, a heat dissipation promotion portion 122 is formed on the metal plate 121. The heat dissipation promotion portion 122 is a first heat dissipation promotion portion 132a formed by cutting a portion of the first metal plate 131a and bending the portion connected to the first metal plate 131a toward the first main surface 121a.

[0038] A portion that was part of the first metal plate 131a becomes a bottomed hole 133a with the second metal plate 131b as the bottom surface.

[0039] If a cut is made in a portion of the first metal plate 131a and the cut portion is bent, current will not flow through that portion. In other words, if the first heat dissipation promotion portion 132a is formed, the current flow path in the first metal plate 131a becomes smaller, making it difficult for current to flow through the first metal plate 131a. In other words, the electrical resistance value is likely to be high. However, the second metal plate 131b does not have a heat dissipation promotion portion or a cut formed therein. Therefore, current can flow sufficiently through the second metal plate 131b. Therefore, it can be said that the metal plate 121 as a whole has improved heat dissipation properties and a sufficiently low resistance value.

[0040] Such a metal plate 121 can be produced, for example, by the following method.

[0041] First, a first metal plate and a second metal plate without cuts are prepared.

[0042] Next, a cut is made in a portion of the first metal plate using a laser cutter, punching, or the like. The cut portion is then bent to one side, thereby forming a first heat dissipation promotion portion. Furthermore, a through hole is formed in the location where the first heat dissipation promotion portion was previously located.

[0043] The first metal plate and the second metal plate are then overlapped so that the main surface of the first metal plate on the side where the first heat dissipation promotion portion is not formed is in contact with the main surface of the second metal plate, thereby turning the portion that was a part of the first metal plate (i.e., the through hole portion) into a bottomed hole with the second metal plate as the bottom surface.

[0044] When the first metal plate and the second metal plate are overlapped, the first metal plate and the second metal plate may be joined by welding, brazing, ultrasonic bonding, or the like.

[0045] By this method, the metal plate 121 can be produced.

[0046] Third Embodiment Next, an electronic component according to a third embodiment of the present invention will be described. The electronic component according to the third embodiment of the present invention differs from the electronic component according to the first embodiment of the present invention in that the electronic component according to the third embodiment of the present invention is formed by overlapping a first metal plate on a first main surface side and a second metal plate on a second main surface side, and the heat dissipation promotion portion includes a first heat dissipation promotion portion formed by cutting a portion of the first metal plate and bending the portion connected to the first metal plate toward the first main surface, and a second heat dissipation promotion portion formed by cutting a portion of the second metal plate and bending the portion connected to the second metal plate toward the second main surface.

[0047] The metal plate of the electronic component according to the third embodiment of the present invention will be described in detail below with reference to the drawings. Fig. 5 is a schematic diagram showing an enlarged view of a portion of the metal plate of the electronic component according to the third embodiment of the present invention.

[0048] The metal plate 221 shown in FIG. 5 is formed by stacking a first metal plate 231a on the first main surface 221a side and a second metal plate 231b on the second main surface 221b side.

[0049] Further, a heat dissipation promotion portion 222 is formed on the metal plate 221. The heat dissipation promotion portion 222 includes a first heat dissipation promotion portion 232a formed by cutting a portion of the first metal plate 231a and bending and raising the portion connected to the first metal plate 231a toward the first main surface 221a, and a second heat dissipation promotion portion 232b formed by cutting a portion of the second metal plate 231b and bending and raising the portion connected to the second metal plate 231b toward the second main surface 221b.

[0050] The metal plate 221 has heat dissipation promotion portions 222 (i.e., first heat dissipation promotion portions 232a and second heat dissipation promotion portions 232b) formed on both the first main surface 221a side and the second main surface 221b side. Therefore, the metal plate 221 has a large amount of heat dissipation from both main surfaces (221a, 221b). This further improves heat dissipation.

[0051] Such a metal plate 221 can be produced, for example, by the following method.

[0052] First, a first metal plate and a second metal plate without cuts are prepared.

[0053] Next, a cut is made in a portion of the first metal plate using a laser cutter, punching, or the like. The cut portion is then bent to one side, thereby forming a first heat dissipation promotion portion. Furthermore, a through hole is formed in the location where the first heat dissipation promotion portion was previously located.

[0054] Similarly, a cut is made in a portion of the second metal plate using a laser cutter, punching, or the like. The cut portion is then bent to one side. This forms a second heat dissipation promotion portion. A through hole is also formed in the location of the second heat dissipation promotion portion.

[0055] Thereafter, the first metal plate and the second metal plate are overlapped so that the main surface of the first metal plate on which the first heat dissipation promotion portion is not formed and the main surface of the second metal plate on which the second heat dissipation promotion portion is not formed are in contact with each other. In this way, the metal plate 221 can be produced.

[0056] When the first metal plate and the second metal plate are overlapped, the first metal plate and the second metal plate may be joined by welding, brazing, ultrasonic bonding, or the like.

[0057] When the first metal plate and the second metal plate are stacked, the through holes formed in the first metal plate and the through holes formed in the second metal plate may or may not be in communication with each other.

[0058] When the through holes are made to communicate with each other, a through hole is formed that penetrates from the first main surface to the second main surface of the metal plate.

[0059] If the through holes are made non-communicating, the portion that was part of the first metal plate becomes a bottomed hole with the second metal plate as its bottom surface, and the portion that was part of the second metal plate becomes a bottomed hole with the first metal plate as its bottom surface.

[0060] (Other Embodiments) In the electronic components according to the first to third embodiments, the heat dissipation promotion portion is formed by making a cut in a portion of the metal plate. However, in the electronic component of the present invention, the heat dissipation promotion portion may be formed by connecting a separate fin-shaped member to at least one main surface of the metal plate by welding, brazing, or the like. In this case, the heat dissipation promotion portion may be made of the same material as the bus bar (metal plate), or may be made of a different material. Furthermore, the heat dissipation promotion portion may be formed on the main surface of the metal plate by casting. When the heat dissipation promotion portion is formed in this manner, no cut is made in a portion of the metal plate, and therefore no through-hole is formed. Therefore, the current flow path is larger than when a through-hole is formed in the metal plate. Therefore, the electrical resistance value of the metal plate is less likely to increase.

[0061] In the electronic component of the present invention, when multiple metal plates are formed on the bus bar, some metal plates may be prone to temperature rise and others may be resistant to temperature rise depending on their positions. The metal plates arranged in positions where the temperature is prone to rise (usually the center) may have more heat dissipation promotion portions formed thereon than the metal plates arranged in positions where the temperature is resistant to rise.

[0062] In the electronic component according to the second embodiment, the metal plate is composed of a first metal plate and a second metal plate, but in the electronic component of the present invention, another metal plate may be stacked on the second main surface side of the second metal plate.

[0063] In the electronic component according to the third embodiment, the metal plate is composed of a first metal plate and a second metal plate, but in the electronic component of the present invention, another metal plate may be stacked between the first metal plate and the second metal plate.

[0064] The present specification describes the following:

[0065] The present disclosure (1) is an electronic component including an electronic component body, a metal plate connected to the electronic component body and having a first main surface and a second main surface, and a bus bar having a heat dissipation promotion portion rising from at least one main surface of the metal plate.

[0066] The present disclosure (2) is the electronic component according to the present disclosure (1), wherein the bus bar has a through hole.

[0067] The present disclosure (3) is an electronic component according to the present disclosure (2), in which the heat dissipation promotion portion has a structure in which a cut is made in a part of the metal plate and the part connected to the metal plate is bent and raised, and the part that was part of the metal plate is a through hole.

[0068] The present disclosure (4) is an electronic component according to the present disclosure (1), wherein the metal plate is formed by stacking a first metal plate on a first main surface side and a second metal plate on a second main surface side, the heat dissipation promotion portion is a first heat dissipation promotion portion formed by making a cut in a part of the first metal plate and bending the part connected to the first metal plate toward the first main surface side and raising it, and the part that was part of the first metal plate is a bottomed hole with the second metal plate as a bottom surface.

[0069] The present disclosure (5) is an electronic component according to the present disclosure (1), wherein the metal plate is formed by stacking a first metal plate on a first main surface side and a second metal plate on a second main surface side, and the heat dissipation promotion portion includes a first heat dissipation promotion portion formed by making a cut in a part of the first metal plate and bending the part connected to the first metal plate toward the first main surface side to raise it up, and a second heat dissipation promotion portion formed by making a cut in a part of the second metal plate and bending the part connected to the second metal plate toward the second main surface side to raise it up.

[0070] The present disclosure (6) is the electronic component according to any one of the present disclosures (1) to (5), in which, in a plan view, the heat dissipation promotion portions are arranged in a staggered pattern on the metal plate.

[0071] The present disclosure (7) is the electronic component according to any one of the present disclosures (1) to (5), wherein, in a plan view, the heat dissipation promotion portion is arranged in a grid pattern on the metal plate.

[0072] The present disclosure (8) is the electronic component according to any one of the present disclosures (1) to (7), in which the electronic component body is a film capacitor.

[0073] (Temperature Simulation of Film Capacitor) A film capacitor and a battery were connected by a bus bar, and the difference in temperature of the film capacitor when a heat dissipation promotion portion was formed on the metal plate constituting the bus bar and when no heat dissipation promotion portion was formed was analyzed using simulation software. The simulation model and conditions were as follows:

[0074] (Simulation Model) An electronic component with the shape shown in Figure 2 was used as a simulation model. In the simulation model, four film capacitors were connected by two copper bus bars. Three metal plates were formed on the bus bars, and the tip of each metal plate was connected to a power semiconductor. The metal plates had a plate-like shape with dimensions of length x width x thickness = 38.2 mm x 14.4 mm x 1.0 mm.

[0075] In the simulation model in which the heat dissipation promotion portion is formed on the metal plate, the shape of the heat dissipation promotion portion was as follows: Shape: A shape in which a cut is made in part of the metal plate and the cut portion is bent toward the first main surface side (a shape in which a through hole is formed in the metal plate) Shape in plan view: Rectangular Size: Length x Width = 1.5 mm x 7.5 mm Opening ratio = 12% Arrangement position: Staggered

[0076] (Simulation conditions) <Software used> Femtet® (Murata Software) <Thermal analysis conditions> Heat generation conditions AC current: 160 Arms, 10 kHz Boundary conditions (external boundary conditions): 85°C, natural convection boundary conditions (fixed temperature at the tip of the metal plate): 150°C Transient analysis elapsed time: 0 to 100 seconds, initial temperature setting: 85°C Uniform heat measurement location: center of film capacitor

[0077] As a result of the simulation, after 100 seconds had elapsed, the temperature of the film capacitor was 2°C lower when a heat dissipation promotion portion was formed on the metal plate than when a heat dissipation promotion portion was not formed on the metal plate.

[0078] From the above results, it was found that the electronic component of the present invention has improved heat dissipation performance from the bus bar without providing a complex structure.

[0079] 1 Electronic component 10 Electronic component main body 20 Bus bar 21, 121, 221 Metal plate 21a, 121a, 221a First main surface 21b, 121b, 221b Second main surface 22, 122, 222 Heat dissipation promotion part 23 Through hole 40 Exterior case 131a, 231a First metal plate 131b, 231b Second metal plate 132a, 232a First heat dissipation promotion part 133a Bottomed hole 232b Second heat dissipation promotion part

Claims

1. An electronic component comprising: an electronic component body; a metal plate connected to the electronic component body and having a first main surface and a second main surface; and a bus bar having a heat dissipation promotion portion extending from at least one of the main surfaces of the metal plate.

2. The electronic component according to claim 1, wherein the bus bar has a through hole.

3. The electronic component according to claim 2, wherein the heat dissipation promoting portion has a structure in which a cut is made in a part of the metal plate and the part connected to the metal plate is bent and raised, and the part that was part of the metal plate is now a through hole.

4. An electronic component as described in claim 1, wherein the metal plate is formed by overlapping a first metal plate on the first main surface side and a second metal plate on the second main surface side, and the heat dissipation promotion portion is a first heat dissipation promotion portion formed by cutting a cut in part of the first metal plate and bending the part connected to the first metal plate towards the first main surface, and the part that was part of the first metal plate is a bottomed hole with the second metal plate as the bottom surface.

5. An electronic component as described in claim 1, wherein the metal plate is formed by overlapping a first metal plate on the first main surface side and a second metal plate on the second main surface side, and the heat dissipation promotion portion comprises a first heat dissipation promotion portion formed by cutting a slit in part of the first metal plate and bending and raising the part connected to the first metal plate towards the first main surface side, and a second heat dissipation promotion portion formed by cutting a slit in part of the second metal plate and bending and raising the part connected to the second metal plate towards the second main surface side.

6. An electronic component according to any one of claims 1 to 5, wherein the heat dissipation promoting portions are arranged in a staggered pattern on the metal plate in a plan view.

7. An electronic component according to any one of claims 1 to 5, wherein the heat dissipation promoting portions are arranged in a grid pattern on the metal plate in a plan view.

8. The electronic component according to any one of claims 1 to 7, wherein the electronic component body is a film capacitor.

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