Display panel and display apparatus

Abstract

A display panel and a display apparatus are provided. The display panel comprises a substrate, a first isolation structure, and a plurality of light-emitting components. The first isolation structure is located on a side of the substrate, the first isolation structure being provided with a plurality of first openings, and the first isolation structure being light-transmissive. Each of the light-emitting components is at least partially positioned in one of the first openings. The display panel is configured for displaying an image.

Description

Display panel and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel and a display device. BACKGROUND

[0002] With the continuous development of display technology, display devices have gradually spread in people's lives. Among them, the organic light-emitting diode (OLED) display panel has been widely used in display devices such as mobile phones, televisions, and notebook computers due to its self-luminous, low power consumption, wide viewing angle, fast response speed, high contrast ratio, and other advantages.

[0003] SUMMARY

[0004] In one aspect, a display panel is provided. The display panel includes a substrate, a first isolation structure, and a plurality of light emitting devices. The first isolation structure is located on one side of the substrate, the first isolation structure is provided with a plurality of first openings, and the first isolation structure is light-transmissive. Each of the light emitting devices is at least partially located in one of the first openings.

[0005] In some embodiments, the first isolation structure includes a first sub-layer, a second sub-layer, and a third sub-layer which are sequentially stacked in a direction away from the substrate, an edge of the third sub-layer extends towards a direction close to the light emitting device adjacent to the second sub-layer compared with the second sub-layer. The light emitting device includes a first electrode, a light emitting part, and a second electrode which are sequentially stacked in a direction away from the substrate. The first sub-layer includes a conductive material, and the second electrodes of two adjacent light emitting devices are electrically connected through the first sub-layer.

[0006] In some embodiments, an edge of the first sub-layer extends towards a direction close to the light emitting device adjacent to the second sub-layer compared with the second sub-layer. An edge of the light emitting part and the second sub-layer have a gap therebetween, and an edge of the second electrode extends into the gap and contacts a surface of the first sub-layer away from the substrate.

[0007] In some embodiments, the second sub-layer and the third sub-layer each include an inorganic material, and the material of the second sub-layer and the material of the third sub-layer are different.

[0008] In some embodiments, the display panel further includes a second isolation structure and a plurality of photodetectors. The second isolation structure is located between the plurality of light emitting devices and the substrate, and the second isolation structure is provided with a plurality of second openings. Each of the photodetectors is located in one of the second openings. In an orthogonal projection onto the substrate, the photodetector and the first isolation structure at least partially overlap.

[0009] In some embodiments, in the orthographic projection onto the substrate, the second opening is located within the range of the first isolation structure.

[0010] In some embodiments, in the orthographic projection onto the substrate, the second isolation structure and the light emitting device at least partially overlap.

[0011] In some embodiments, the display panel further comprises at least one insulating layer. The at least one insulating layer is located between the plurality of photodetectors and the first isolation structure. The insulating layer can be light-transmissive.

[0012] In some embodiments, the at least one insulating layer comprises an inorganic insulating layer and a planar layer which are sequentially stacked in a direction away from the substrate.

[0013] In some embodiments, the light emitting device comprises a first electrode, a light emitting part and a second electrode which are sequentially stacked in a direction away from the substrate. The display panel further comprises a first stacked structure. The first stacked structure is located on a side of the first isolation structure away from the substrate. The first stacked structure comprises a first subpart and a second subpart which are sequentially stacked in a direction away from the substrate, the material of the first subpart is the same as that of the light emitting part, and the material of the second subpart is the same as that of the second electrode. In the orthographic projection onto the substrate, two first stacked structures are arranged between two adjacent light emitting devices, and the two first stacked structures have a spacing in a first direction, the first direction being parallel to the line connecting the centers of the two adjacent light emitting devices.

[0014] In some embodiments, the light emitting device comprises a first electrode, a light emitting part and a second electrode which are sequentially stacked in a direction away from the substrate. The display panel further comprises a first stacked structure. The first stacked structure is located on a side of the first isolation structure away from the substrate. The first stacked structure comprises a first subpart and a second subpart which are sequentially stacked in a direction away from the substrate, the material of the first subpart is the same as that of the light emitting part, and the material of the second subpart is the same as that of the second electrode. In the orthographic projection onto the substrate, two first stacked structures are arranged between two adjacent light emitting devices, and in the two first stacked structures, one first stacked structure covers at least part of the area of the other first stacked structure.

[0015] In some embodiments, the photodetector comprises a third electrode, a photoelectric conversion film layer and a fourth electrode which are sequentially stacked in a direction away from the substrate. The fourth electrodes in adjacent photodetectors are connected to each other to form a fourth electrode layer, and the fourth electrode layer covers the photoelectric conversion film layer and the second isolation structure.

[0016] In another aspect, a display panel is provided. The display panel includes a substrate, a first isolation structure, a plurality of light emitting devices, and a plurality of photodetectors. The first isolation structure is located on one side of the substrate, the first isolation structure is provided with a plurality of first openings and a plurality of second openings, and the first isolation structure is light blocking. Each of the light emitting devices is at least partially located in one of the first openings. Each of the photodetectors is at least partially located in one of the second openings.

[0017] In some embodiments, the photodetector includes a third electrode, a photoelectric conversion film layer, and a fourth electrode, which are sequentially stacked in a direction away from the substrate. The light emitting device includes a first electrode, a light emitting part, and a second electrode, which are sequentially stacked in the direction away from the substrate. In adjacent ones of the light emitting device and the photodetector, the second electrode of the light emitting device and the fourth electrode of the photodetector are electrically connected through the first isolation structure.

[0018] In some embodiments, the first isolation structure includes a first sub-layer and a second sub-layer, which are sequentially stacked in a direction away from the substrate, and an edge of the second sub-layer extends toward a direction close to the light emitting device adjacent to the first sub-layer compared to the first sub-layer. The first sub-layer includes a conductive material, and in adjacent ones of the light emitting device and the photodetector, the second electrode of the light emitting device and the fourth electrode of the photodetector are electrically connected through the first sub-layer.

[0019] In some embodiments, the first isolation structure includes a first sub-layer and a second sub-layer, which are sequentially stacked in a direction away from the substrate. The first sub-layer and the second sub-layer each include a metal material, and the material of the first sub-layer and the material of the second sub-layer are different.

[0020] In some embodiments, the light emitting device includes a first electrode, a light emitting part, and a second electrode, which are sequentially stacked in a direction away from the substrate. The photodetector includes a third electrode, a photoelectric conversion film layer, and a fourth electrode, which are sequentially stacked in the direction away from the substrate.

[0021] The display panel further comprises a first stack structure and a second stack structure. The first stack structure is located on a side of the first isolation structure away from the substrate. The first stack structure comprises a first sub-part and a second sub-part which are sequentially stacked in a direction away from the substrate, a material of the first sub-part is the same as a material of the light emitting part, and a material of the second sub-part is the same as a material of the second electrode. The second stack structure is located on a side of the first isolation structure away from the substrate. The second stack structure comprises a third sub-part and a fourth sub-part which are sequentially stacked in a direction away from the substrate, a material of the third sub-part is the same as a material of the photoelectric conversion film layer, and a material of the fourth sub-part is the same as a material of the fourth electrode.

[0022] In a projection onto the substrate, two first stack structures are arranged between two adjacent light emitting devices, and the two first stack structures have a spacing in a first direction, the first direction being parallel to a line connecting centers of the two adjacent light emitting devices. And / or, in a projection onto the substrate, two second stack structures are arranged between two adjacent photoelectric detectors, and the two second stack structures have a spacing in the first direction. And / or, in a projection onto the substrate, a first stack structure and a second stack structure are arranged between an adjacent photoelectric detector and a light emitting device, and the first stack structure and the second stack structure have a spacing in the first direction.

[0023] In some embodiments, the light emitting device comprises a first electrode, a light emitting part and a second electrode which are sequentially stacked in a direction away from the substrate. The photoelectric detector comprises a third electrode, a photoelectric conversion film layer and a fourth electrode which are sequentially stacked in a direction away from the substrate.

[0024] The display panel further comprises a first stack structure and a second stack structure. The first stack structure is located on a side of the first isolation structure away from the substrate. The first stack structure comprises a first sub-part and a second sub-part which are sequentially stacked in a direction away from the substrate, a material of the first sub-part is the same as a material of the light emitting part, and a material of the second sub-part is the same as a material of the second electrode. The second stack structure is located on a side of the first isolation structure away from the substrate. The second stack structure comprises a third sub-part and a fourth sub-part which are sequentially stacked in a direction away from the substrate, a material of the third sub-part is the same as a material of the photoelectric conversion film layer, and a material of the fourth sub-part is the same as a material of the fourth electrode.

[0025] In a projection onto the substrate, two of the first stack structures are arranged between two adjacent light emitting devices, and in the two first stack structures, one of the first stack structures covers at least part of the area of the other first stack structure. And / or, in a projection onto the substrate, two of the second stack structures are arranged between two adjacent photodetectors, and in the two second stack structures, one of the second stack structures covers at least part of the area of the other second stack structure. And / or, in a projection onto the substrate, one of the first stack structure and one of the second stack structure are arranged between an adjacent photodetector and an adjacent light emitting device, and one of the first stack structure and one of the second stack structure covers at least part of the area of the other.

[0026] In some embodiments, the display panel further comprises a black matrix layer. The black matrix layer is provided with a plurality of third openings, each of the third openings being in communication with one of the first openings. A projection of the black matrix layer onto the substrate at least partially overlaps with a projection of the first isolation structure onto the substrate, and the black matrix layer and the first isolation structure have a spacing in a direction perpendicular to the substrate.

[0027] In another aspect, a display device is provided. The display device comprises the display panel and a cover plate. The cover plate is located at the light exit side of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described in the following description are only some drawings of the embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual timing of signals, etc. of the products involved in the embodiments of the present disclosure.

[0029] FIG. 1 is a plan view of a display device according to some embodiments;

[0030] FIG. 2A is a cross-sectional view of a partial region of a display device according to some embodiments;

[0031] FIG. 2B is another cross-sectional view of a partial region of a display device according to some embodiments;

[0032] FIG. 2C is still another cross-sectional view of a partial region of a display device according to some embodiments;

[0033] FIG. 3 is a plan view of a display panel according to some embodiments;

[0034] FIG. 4A is a diagram of a film layer structure of a light emitting device according to some embodiments;

[0035] FIG. 4B is a diagram of another film layer structure of a light emitting device according to some embodiments;

[0036] FIG. 4C is a diagram of yet another film layer structure of a light emitting device according to some embodiments;

[0037] FIG. 4D is a diagram of still another film layer structure of a light emitting device according to some embodiments;

[0038] FIG. 5 is a cross-sectional view of a partial region of a substrate and a pixel defining layer according to some embodiments;

[0039] FIG. 6 is a cross-sectional view of a partial region of a first isolation structure within a display panel according to some embodiments;

[0040] FIG. 7A is yet another cross-sectional view of a partial region of a display device according to some embodiments;

[0041] FIG. 7B is yet another cross-sectional view of a partial region of a display device according to some embodiments;

[0042] FIG. 8A is yet another cross-sectional view of a partial region of a display device according to some embodiments;

[0043] FIG. 8B is yet another cross-sectional view of a partial region of a display device according to some embodiments;

[0044] FIG. 9 is still another cross-sectional view of a partial region of a display device according to some embodiments;

[0045] FIG. 10 is a diagram of a structure corresponding to step S1 in a method of manufacturing a display panel according to some embodiments;

[0046] FIG. 11 is a diagram of a structure corresponding to step S2 in a method of manufacturing a display panel according to some embodiments;

[0047] FIG. 12 is a diagram of a structure corresponding to step S3 in a method of manufacturing a display panel according to some embodiments;

[0048] FIG. 13A is a cross-sectional view of a partial region of a display panel according to some embodiments;

[0049] FIG. 13B is another cross-sectional view of a partial region of a display panel according to some embodiments;

[0050] FIG. 14 is another diagram of a structure corresponding to step S1 in a method of manufacturing a display panel according to some embodiments;

[0051] FIG. 15 is another diagram of a structure corresponding to step S2 in a method of manufacturing a display panel according to some embodiments;

[0052] FIG. 16 is another structural diagram corresponding to step S3 in the preparation method of the display panel according to some embodiments;

[0053] FIG. 17 is a structural diagram corresponding to step S4 in the preparation method of the display panel according to some embodiments;

[0054] FIG. 18 is a structural diagram corresponding to step S5 in the preparation method of the display panel according to some embodiments;

[0055] FIG. 19 is a structural diagram corresponding to step S6 in the preparation method of the display panel according to some embodiments;

[0056] FIG. 20 is a structural diagram corresponding to step S7 in the preparation method of the display panel according to some embodiments;

[0057] FIG. 21 is a structural diagram corresponding to step S8 in the preparation method of the display panel according to some embodiments;

[0058] FIG. 22 is a structural diagram corresponding to step S9 in the preparation method of the display panel according to some embodiments;

[0059] FIG. 23 is a structural diagram corresponding to step S10 in the preparation method of the display panel according to some embodiments. DETAILED DESCRIPTION

[0060] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0061] Unless the context clearly requires otherwise, throughout the description and the claims, the term "comprise," and variations thereof (e.g., "comprises" and "comprising"), will be construed to be inclusive in a manner consistent with the term's plain meaning, namely, "including but not limited to." In describing the description, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example" or "some examples," and the like, mean that a particular feature, structure, material, or characteristic is included in at least one embodiment or example of the disclosure, but that it can not be included in other embodiments or examples. The illustrative appearance of the foregoing terms in various places in the description are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0062] Hereinafter, the terms "first", "second", etc. are used only for the purpose of description and should not be construed as indicating or implying relative importance or implying the number of the technical features indicated. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0063] In describing some embodiments, "coupled" and "connected," and variations thereof, can be used. The term "connected" should be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components have direct physical contact or electrical contact. The term "coupled" or "communicatively coupled" can also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0064] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C", and includes the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0065] "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.

[0066] As used herein, the term "if' is, optionally, interpreted as meaning "when" or "while" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [stated condition or event] is detected" is, optionally, interpreted as meaning "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0067] Use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude additional devices or steps not specifically recited.

[0068] Additionally, use of "based on" means open and inclusive, as the process, step, calculation, or other action based on a stated condition or value can actually be based on additional conditions or values beyond those stated.

[0069] As used herein, "about," "approximately," or "circa" includes the recited value and the mean within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art considering the measurement in question and the error in measuring the particular quantity (i.e., the limitations of the measurement system).

[0070] As used herein, "parallel," "perpendicular," "equal" includes the recited condition and conditions that approximate the recited condition, the approximation being within an acceptable range of deviation, as determined by one of ordinary skill in the art considering the measurement in question and the error in measuring the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and near parallel, where near parallel can be, for example, within 5° of deviation; "perpendicular" includes absolute perpendicular and near perpendicular, where near perpendicular can also be, for example, within 5° of deviation. "Equal" includes absolute equality and near equality, where near equality can be, for example, within 5% of the difference between the two of which equality is being approximated.

[0071] It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0072] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are schematic illustrations of idealized embodiments. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have rounded or curved features. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the precise shape of a region that would be formed by a given manufacturing technique. The purpose of such illustrations is to more effectively convey specified information from drawing to viewer.

[0073] It is noted that, for example, F1 / F appearing in the drawings of the present disclosure means that the component is both F1 and F, and other similar designations appearing in the drawings also follow the above description.

[0074] As shown in FIG. 1, some embodiments of the present disclosure provide a display device 100.

[0075] Exemplarily, the display device 100 can be any device that displays images whether in motion (e.g., video) or stationary (e.g., still images), and whether textual or pictorial. More specifically, it is contemplated that the embodiments can be implemented in or in association with a variety of electronic devices, such as (but not limited to) mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers / navigators, cameras, MP4 players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, camera view displays (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projections, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry), etc. In FIG. 1, the display device 100 is schematically shown as a mobile phone.

[0076] Exemplarily, the display device 100 can be an electroluminescent display device or a photoluminescent display device. In the case that the display device 100 is an electroluminescent display device, the electroluminescent display device can be an Organic Light-Emitting Diode (OLED) display device or a Quantum Dot Light Emitting Diodes (QLED) display device. In the case that the display device 100 is a photoluminescent display device, the photoluminescent display device can be a Quantum Dot photoluminescent display device.

[0077] The following describes some embodiments of the present disclosure by taking the display device 100 as an example of an organic light-emitting diode (OLED) display device, but the embodiments of the present disclosure include but are not limited to this, and any other display device can also be considered as long as the same technical idea is applied.

[0078] In some embodiments, as shown in FIGS. 2A, 2B and 2C, each of FIGS. 2A, 2B and 2C is a cross-sectional view of a partial area of the display device 100 according to some embodiments. The display device 100 includes a display panel 10 and a cover plate 20. The cover plate 20 is arranged on the light-emitting side of the display panel 10. The cover plate 20 can separate the display panel 10 from the external environment and provide protection for the display panel 10.

[0079] Exemplarily, the cover plate 20 can be a single-layer cover plate or a multi-layer cover plate 20 bonded together by adhesive material.

[0080] Exemplarily, the cover plate 20 can be a silicate glass cover plate. For example, the cover plate 20 can be a curved glass cover plate or an ultra-thin glass cover plate.

[0081] The cover plate 20 can also be a flexible polymer film cover plate. For example, the cover plate 20 can be a transparent polyimide cover plate, a PET cover plate, a polyurethane cover plate, etc.

[0082] The cover plate 20 can also be a combination cover plate of multiple flexible polymer films or a combination cover plate of a flexible polymer film and a silicate glass.

[0083] In some embodiments, the display device 100 can further include a circuit board (not shown in the figure). The circuit board is electrically connected to the display panel 10 and is configured to drive the display panel 10 to display images.

[0084] Exemplarily, the circuit board includes but is not limited to a printed circuit board (PCB) and a flexible printed circuit board (FPC).

[0085] In some embodiments, the display device 100 can further include an under-screen camera, an under-screen fingerprint identification sensor, etc., so that the display device 100 can implement multiple different functions such as photographing, video recording, fingerprint identification, face recognition, etc. The present disclosure does not make any limitation in this regard, and adaptive design can be made according to actual needs.

[0086] The display panel 10 is described in detail as follows.

[0087] In some embodiments, as shown in FIG. 3, FIG. 3 is a plan view of the display panel 10 according to some embodiments. The display panel 10 can have a rectangular structure.

[0088] It should be noted that the "rectangular structure" means that the shape of the boundary of the display panel 10 is generally rectangular, but is not limited to a standard rectangle. That is, the "rectangle" herein not only includes the shape of a standard rectangle, but also includes shapes similar to a rectangle considering the process conditions. For example, as shown in FIG. 3, the long side and the short side of the rectangle are curved at each intersection (i.e., the corner G), that is, the corner G is smooth, so that the shape of the boundary of the display panel 10 in the plan view is a rounded rectangle.

[0089] In other embodiments, the display panel 10 can have a circular structure, or other shapes with corners.

[0090] Hereinafter, some embodiments of the present disclosure will be illustratively described taking the display panel 10 as a rectangular structure, but the embodiments of the present disclosure include but are not limited to this, and the shape of the display panel 10 can also consider any other shape.

[0091] In some embodiments, as shown in FIG. 3, the display panel 10 has a display area AA for displaying an image, and a peripheral area AN located at least one side of the display area AA.

[0092] For example, the peripheral area AN can be located at one side of the display area AA.

[0093] Alternatively, the peripheral area AN can be located at opposite sides of the display area AA.

[0094] Alternatively, as shown in FIG. 3, the peripheral area AN can surround the display area AA.

[0095] It should be noted that the specific arrangement of the peripheral area AN is related to the specific design of the display panel 10, and can be designed according to actual needs, which is only illustratively described herein and does not limit the present disclosure.

[0096] For example, the peripheral area AN of the display panel 10 can be provided with a gate drive circuit (for example, Gate driver On Array, GOA) and a control signal line (for example, a clock signal line, a power voltage signal line, etc.). However, the functions of the peripheral area AN of the display panel 10 include but are not limited to this.

[0097] In some embodiments, as shown in FIG. 3, the display area AA of the display panel 10 is provided with a plurality of light emitting devices F, and the light emitting device F is the smallest light emitting unit in the display area AA.

[0098] Exemplarily, the plurality of light emitting devices F in the display area AA of the display panel 10 can emit light rays of the same color, and the display panel 10 can further include a color film layer arranged on the light emitting side of the plurality of light emitting devices F. For example, the plurality of light emitting devices F in the display area AA of the display panel 10 can each emit white light, red light, green light, or blue light, and in this case, the color light emitted by the light emitting device F remains the same color light after passing through the color film layer or is converted into other color light, so that the display panel 10 can realize multi-color light emission when the plurality of light emitting devices F emit light of the same color.

[0099] Alternatively, please continue to refer to FIGS. 2A, 2B, and 2C, and in combination with FIG. 3, the plurality of light emitting devices F in the display area AA of the display panel 10 can emit light rays of different colors. For example, the plurality of light emitting devices F in the display area AA of the display panel 10 can include first color light emitting devices F1 emitting first color light rays, second color light emitting devices F2 emitting second color light rays, and third color light emitting devices F3 emitting third color light rays, so as to realize multi-color light emission of the display panel 10.

[0100] Among them, the first color light emitting device F1 can be a red light emitting device, emitting red light rays. The second color light emitting device F2 can be a green light emitting device, emitting green light rays. The third color light emitting device F3 can be a blue light emitting device, emitting blue light rays.

[0101] Alternatively, the first color light emitting device F1 can also be a green light emitting device or a blue light emitting device. The second color light emitting device F2 can also be a red light emitting device or a blue light emitting device. The third color light emitting device F3 can also be a red light emitting device or a green light emitting device.

[0102] Hereinafter, some embodiments of the present disclosure will be illustratively described taking the plurality of light emitting devices F in the display area AA of the display panel 10 emitting light rays of different colors as an example.

[0103] In some embodiments, please continue to refer to FIGS. 2A, 2B, and 2C, the light emitting device F in the display panel 10 includes a first electrode 41, a light emitting part 43, and a second electrode 42 arranged in sequence. The first electrode 41 and the second electrode 42 can provide carriers such as electrons and holes to the light emitting part 43, so that the light emitting part 43 emits light.

[0104] Exemplarily, one of the first electrode 41 and the second electrode 42 can serve as an anode of the light emitting device F (for example, the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3), and the other can serve as a cathode of the light emitting device F (for example, the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3).

[0105] For example, the first electrode 41 can serve as an anode of the light emitting device F (e.g., the first color light emitting device Fl, the second color light emitting device F2, and the third color light emitting device F3), and the second electrode 42 can serve as a cathode of the light emitting device F (e.g., the first color light emitting device Fl, the second color light emitting device F2, and the third color light emitting device F3).

[0106] In the case where the first electrode 41 serves as an anode of the light emitting device F (e.g., the first color light emitting device Fl, the second color light emitting device F2, and the third color light emitting device F3) and the second electrode 42 serves as a cathode of the light emitting device F (e.g., the first color light emitting device Fl, the second color light emitting device F2, and the third color light emitting device F3), when a voltage is applied between the first electrode 41 and the second electrode 42, holes injected from the first electrode 41 can be transported to the light emitting portion 43 of the light emitting device F, and electrons injected from the second electrode 42 can also be transported to the light emitting portion 43 of the light emitting device F, and the electrons and the holes as carriers recombine in the light emitting portion 43 of the light emitting device F to generate excitons, and the light is emitted when the excitons transit from an excited state to a ground state, thereby causing the light emitting portion 43 to emit light.

[0107] For example, the material for forming the first electrode 41 can include any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo).

[0108] The material for forming the first electrode 41 can also include an alloy material of the above-described metal materials. For example, the material for forming the first electrode 41 can include an aluminum-neodymium alloy (AlNd) or a molybdenum-niobium alloy (MoNb), etc.

[0109] For example, the first electrode 41 can be a single layer structure.

[0110] Alternatively, the first electrode 41 can also be a multi-layer composite structure. For example, the first electrode 41 can be a Ti / Al / Ti structure, etc. For another example, the first electrode 41 can be a stack structure formed of a metal material and a transparent conductive material, such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0111] For example, the material for forming the second electrode 42 can include any one or more of magnesium (Mg), silver (Ag), aluminum (Al), etc.

[0112] The material for forming the second electrode 42 can also include an alloy of any one or more of magnesium (Mg), silver (Ag), aluminum (Al), etc.

[0113] The material for forming the second electrode 42 can also include a transparent conductive material. For example, the material for forming the second electrode 42 can include Indium Zinc Oxide (IZO).

[0114] In some embodiments, as shown in FIGS. 4A, 4B, 4C and 4D, each of FIGS. 4A, 4B, 4C and 4D is a diagram of a film layer structure of a light emitting device F according to some embodiments. The light emitting part 43 within the light emitting device F includes a light emitting layer 43a.

[0115] For example, please continue to refer to FIGS. 4A and 4C, the display panel 10 can be an Organic Light-Emitting Diode (OLED) display panel. In the case that the display panel 10 is an Organic Light-Emitting Diode (OLED) display panel, the light emitting layer 43a can include an organic light emitting layer (EML). For example, the organic light emitting layer (EML) can include a light emitting layer host material and a light emitting layer guest material, which can be a fluorescent dopant or a phosphorescent dopant.

[0116] Alternatively, please continue to refer to FIGS. 4B and 4D, the display panel 10 can also be a Quantum Dot Light Emitting Diodes (QLED) display panel. In the case that the display panel 10 is a Quantum Dot Light Emitting Diodes (QLED) display panel, the light emitting layer 43a can include a quantum dot layer (QDL). For example, the quantum dot layer (QDL) can have quantum dot particles, which can be connected to each other by surface modification groups.

[0117] For example, please continue to refer to FIGS. 4A and 4B, the light emitting part 43 within the light emitting device F can include a single-layer light emitting layer 43a.

[0118] Alternatively, please continue to refer to FIGS. 4C and 4D, the light emitting part 43 within the light emitting device F can include a multi-layer light emitting layer 43a.

[0119] For example, please continue to refer to FIGS. 4C and 4D, the light emitting part 43 within the light emitting device F can include a two-layer light emitting layer 43a.

[0120] In the case that the light emitting part 43 in the light emitting device F includes two light emitting layers 43a, the light emitting part 43 in the light emitting device F can further include a charge generation layer (CGL) between the two adjacent light emitting layers 43a. The charge generation layer (CGL) can be configured to generate, transport and inject carriers. The charge generation layer (CGL) can connect the two adjacent light emitting layers 43a in series to realize a Tandem EL design.

[0121] On the one hand, due to the increase in the number of light emitting layers 43a and the charge generation layer (CGL) can reduce the driving voltage and generate new carriers, the light emitting efficiency of the light emitting part 43 can be doubled. On the other hand, at the same brightness, the current density of the display panel 10 with the Tandem EL design is reduced compared with the display panel 10 with the single-layer light emitting design, which is beneficial to prolong the service life of the display panel 10.

[0122] In some embodiments, please refer to FIG. 4A, FIG. 4B, FIG. 4C and FIG. 4D, the light emitting part 43 of the light emitting device F can further include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron block layer (EBL), a hole block layer (HBL), an electron transport layer (ETL) and an electron injection layer (EIL).

[0123] The film layer structure of the display panel 10 is described in detail as follows.

[0124] In some embodiments, please refer to FIG. 2A, FIG. 2B and FIG. 2C, the display panel 10 can include a substrate 1. The plurality of light emitting devices F in the display area AA of the display panel 10 can be located on one side of the substrate 1.

[0125] Exemplarily, the material of the substrate 1 can include an inorganic material. For example, the material of the substrate 1 can include a glass material such as soda lime glass, quartz glass, sapphire glass, etc.

[0126] Alternatively, the material of the substrate 1 can also include an organic material. For example, the material of the substrate 1 can include one or more of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0127] Alternatively, the material of the substrate 1 can also include both an organic material and an inorganic material.

[0128] In some embodiments, please refer to FIGS. 2A, 2B, and 2C, and FIG. 5, which is a cross-sectional view of a partial region of the substrate 1 and the pixel defining layer 2, according to some embodiments. The display panel 10 can further include a pixel defining layer 2. The pixel defining layer 2 is located on one side of the substrate 1. The pixel defining layer 2 is provided with a plurality of fourth openings K4. At least part of each light emitting device F (e.g., a first color light emitting device Fl, a second color light emitting device F2, or a third color light emitting device F3) in the display panel 10 is located within one fourth opening K4.

[0129] For example, please refer to FIGS. 2A, 2B, and 2C, and FIG. 5, the first electrode 41 of the light emitting device F in the display panel 10 can be located within the fourth opening K4, which exposes at least part of the first electrode 41 of the light emitting device F in the display panel 10.

[0130] For example, please refer to FIGS. 2A, 2B, and 2C, the pixel defining layer 2 can cover the edge of the first electrode 41 of the light emitting device F, and the fourth opening K4 exposes part of the inner region of the first electrode 41 of the light emitting device F.

[0131] By exposing at least part of the first electrode 41 of the light emitting device F in the display panel 10 with the fourth opening K4, the pixel defining layer 2 can effectively define the actual effective region of the first electrode 41 (i.e., the region where the first electrode 41 is directly electrically connected to the light emitting part 43 of the light emitting device F), and further define the light emitting region and the light emitting area of the light emitting device F.

[0132] For example, the material of the pixel defining layer 2 can include an organic insulating material. For example, the material of the pixel defining layer 2 can include polyimide, acrylic, or polyethylene terephthalate, etc.

[0133] For example, other film layer structures can be provided between the substrate 1 and the pixel defining layer 2.

[0134] For example, a driving layer (not shown in the figure) for driving the light emitting device F to emit light can be provided between the substrate 1 and the pixel defining layer 2. The driving layer can include an active layer (Active) formed on the substrate 1 using a patterning process, a gate insulating layer (GI) formed on the active layer (Active) by deposition or the like, a gate (Gate) of a thin film transistor (TFT) formed on the gate insulating layer (GI) using a patterning process, an interlayer dielectric layer (ILD) formed on the gate (Gate) by deposition or the like, a source-drain metal layer forming a source (Source) and a drain (Drain) of the thin film transistor (TFT), and a planarization layer (PLN) covering the source-drain metal layer and the exposed interlayer dielectric layer (ILD).

[0135] The material of the active layer (Active) can include polysilicon and metal oxide, etc., the material of the gate insulating layer (GI) can include inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride, etc., and the material of the interlayer dielectric layer (ILD) can include inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride, etc. The material of the gate (Gate) can include metals or alloy materials such as aluminum, titanium, cobalt, etc. The material of the planarization layer (PLN) can include organic materials, and can also include inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride, etc. The planarization layer (PLN) has a planarization effect, which is conducive to improving the quality of subsequent material deposition, reducing the surface difference of other film layers formed subsequently, and the planarization layer (PLN) can block water and oxygen from entering the light emitting device F.

[0136] In some embodiments, please refer to FIG. 2A, FIG. 2B and FIG. 2C, the display panel 10 can further include a first isolation structure 31. The first isolation structure 31 is located on one side of the substrate 1. The first isolation structure 31 is provided with a plurality of first openings K1. Each light emitting device F (for example, a first color light emitting device F1, a second color light emitting device F2, or a third color light emitting device F3) in the display panel 10 is at least partially located in one first opening K1.

[0137] In the case where the first isolation structure 31 is provided in the display panel 10 and the first isolation structure 31 is provided with a plurality of first openings K1, when forming the light emitting device F (for example, the first color light emitting device F1, the second color light emitting device F2, or the third color light emitting device F3) in the display panel 10, the light emitting device F can be formed in the display panel 10 by a maskless lithography process, so that each light emitting device F is at least partially located in one first opening K1.

[0138] In one aspect, when the light emitting device F is formed by the maskless photolithography process, the light emitting device F can be formed more finely in the display panel 10 without depending on the precision limitation of the physical mask, and thus the precision of the display panel 10 can be improved.

[0139] In addition, since the maskless photolithography process does not depend on the physical mask, when a large-size display panel 10 is prepared, the problems of sagging, deformation or wear of the physical mask can be avoided, and thus the large-size display panel 10 can be prepared, and the yield of the large-size display panel 10 can be improved.

[0140] On the other hand, when the light emitting device F is formed by the maskless photolithography process, the light emitting part 43 of the two adjacent light emitting devices F is disconnected at the first isolation structure 31, and thus the crosstalk between the two adjacent light emitting devices F is weakened, and thus the display effect of the display panel 10 can be improved.

[0141] For example, please continue to refer to FIGS. 2A, 2B and 2C, when the display panel 10 includes the pixel defining layer 2, the first isolation structure 31 can be located away from the substrate 1 on the side of the pixel defining layer 2. That is, the pixel defining layer 2 is closer to the substrate 1 than the first isolation structure 31.

[0142] The fourth opening K4 in the pixel defining layer 2 can be in communication with the first opening K1 in the first isolation structure 31, and a part of the light emitting device F in the display panel 10 can be disposed in the fourth opening K4 in the pixel defining layer 2, and another part of the light emitting device F can be disposed in the first opening K1 in the first isolation structure 31.

[0143] For example, please continue to refer to FIGS. 2A, 2B and 2C, the first electrode 41, the light emitting part 43 and the second electrode 42 of the light emitting device F in the display panel 10 can be sequentially stacked in the direction away from the substrate 1. That is, the first electrode 41 of the light emitting device F is closer to the substrate 1 than the second electrode 42 of the light emitting device F.

[0144] When the first electrode 41, the light emitting part 43 and the second electrode 42 of the light emitting device F in the display panel 10 are sequentially stacked in the direction away from the substrate 1, the first electrode 41 of the light emitting device F, and a part of the light emitting part 43 and the second electrode 42 of the light emitting device F can be disposed in the fourth opening K4 in the pixel defining layer 2, and another part of the light emitting part 43 and the second electrode 42 of the light emitting device F can be disposed in the first opening K1 in the first isolation structure 31.

[0145] In some embodiments, as shown in FIG. 6, FIG. 6 is a cross-sectional view of a partial region of the first isolation structure 31 in the display panel 10 according to some embodiments. The first isolation structure 31 in the display panel 10 can be transparent.

[0146] Please continue to refer to FIG. 6, by making the first isolation structure 31 in the display panel 10 light-transmissive, the first isolation structure 31 can avoid blocking the large viewing angle light (for example, light g1) emitted by the light emitting device F, so that the large viewing angle light (for example, light g1) emitted by the light emitting device F can be emitted through the first isolation structure 31, which is beneficial to improve the display effect of the display panel 10 in the side view state and improve the visual experience of the display panel 10.

[0147] In some embodiments, please continue to refer to FIG. 6, in the case that the first isolation structure 31 in the display panel 10 is light-transmissive, the first isolation structure 31 can include a first sub-layer 311, a second sub-layer 312 and a third sub-layer 313 which are sequentially stacked in a direction away from the substrate 1.

[0148] The edge of the third sub-layer 313 of the first isolation structure 31 protrudes in a direction closer to the light emitting device F adjacent to the second sub-layer 312 than the second sub-layer 312. That is, in the orthographic projection toward the substrate 1, the second sub-layer 312 falls within the boundary range of the third sub-layer 313, and there is a spacing between the boundary of the second sub-layer 312 and the boundary of the third sub-layer 313.

[0149] By making the edge of the third sub-layer 313 of the first isolation structure 31 protrude in a direction closer to the light emitting device F adjacent to the second sub-layer 312 than the second sub-layer 312, when the light emitting device F in the display panel 10 is formed by a maskless lithography process, the light emitting part 43 of the two adjacent light emitting devices F can be disconnected at the first isolation structure 31, thereby weakening the crosstalk between the two adjacent light emitting devices F, which is beneficial to improve the display effect of the display panel 10.

[0150] Exemplarily, please continue to refer to FIG. 6, the first sub-layer 311 of the first isolation structure 31 can include a conductive material.

[0151] In the case that the light emitting device F in the display panel 10 is formed by a maskless lithography process, the second electrode 42 of the two adjacent light emitting devices F can also be disconnected at the first isolation structure 31. By making the first sub-layer 311 of the first isolation structure 31 include a conductive material, the second electrodes 42 of the two adjacent light emitting devices F in the display panel 10 can be electrically connected through the first sub-layer 311 of the first isolation structure 31, which facilitates the transmission of the second electrode (for example, cathode) signal between the two adjacent light emitting devices F.

[0152] Specifically, please continue to refer to FIG. 6, the edge of the first sub-layer 311 of the first isolation structure 31 protrudes towards the direction close to the light emitting device F adjacent to the second sub-layer 312. That is, in the orthographic projection towards the substrate 1, the second sub-layer 312 falls within the boundary range of the first sub-layer 311, and there is a spacing between the boundary of the second sub-layer 312 and the boundary of the first sub-layer 311. There is a gap J between the edge of the light emitting part 43 of the light emitting device F and the second sub-layer 312, and the edge of the second electrode 42 of the light emitting device F extends into the gap J and contacts the surface 311a of the first sub-layer 311 away from the substrate 1 to realize the electrical connection between the second electrode 42 of the light emitting device F and the first sub-layer 311 of the first isolation structure 31, so that the second electrodes 42 of two adjacent light emitting devices F in the display panel 10 can be electrically connected through the first sub-layer 311 of the first isolation structure 31.

[0153] For example, the first sub-layer 311 of the first isolation structure 31 can include a transparent conductive oxide (TCO).

[0154] By making the first sub-layer 311 of the first isolation structure 31 include a transparent conductive oxide (TCO), the first isolation structure 31 can be made light-transmitting, which can avoid the first isolation structure 31 from blocking the large viewing angle light (e.g., light g1) emitted by the light emitting device F, so that the large viewing angle light (e.g., light g1) emitted by the light emitting device F can be emitted through the first isolation structure 31, which is conducive to improving the display effect of the display panel 10 in the side view state and improving the visual experience of the display panel 10.

[0155] For example, the second sub-layer 312 and the third sub-layer 313 of the first isolation structure 31 can include inorganic materials such as silicon nitride and silicon dioxide.

[0156] The light-transmitting performance of inorganic materials is good, and by making the second sub-layer 312 and the third sub-layer 313 of the first isolation structure 31 include inorganic materials, the first isolation structure 31 can be made light-transmitting, which can avoid the first isolation structure 31 from blocking the large viewing angle light (e.g., light g1) emitted by the light emitting device F, so that the large viewing angle light (e.g., light g1) emitted by the light emitting device F can be emitted through the first isolation structure 31, which is conducive to improving the display effect of the display panel 10 in the side view state and improving the visual experience of the display panel 10.

[0157] Please continue to refer to FIG. 6, the material of the second sub-layer 312 of the first isolation structure 31 is different from the material of the third sub-layer 313. For example, the material of the second sub-layer 312 of the first isolation structure 31 can include silicon nitride or the like, and the material of the third sub-layer 313 of the first isolation structure 31 can include silicon dioxide or the like.

[0158] In some embodiments, please continue to refer to FIG. 2A, FIG. 2B and FIG. 2C, the display panel 10 can further include a first laminated structure 51. The first laminated structure 51 is located on the side of the first isolation structure 31 away from the substrate 1.

[0159] The first laminated structure 51 includes a first sub-part 511 and a second sub-part 512 which are sequentially stacked in the direction away from the substrate 1. The material of the first sub-part 511 of the first laminated structure 51 is the same as the material of the light-emitting part 43 of the light-emitting device F, and the material of the second sub-part 512 of the first laminated structure 51 is the same as the material of the second electrode 42 of the light-emitting device F.

[0160] In the case that the material of the first sub-part 511 of the first laminated structure 51 is the same as the material of the light-emitting part 43 of the light-emitting device F, and the material of the second sub-part 512 of the first laminated structure 51 is the same as the material of the second electrode 42 of the light-emitting device F, the first sub-part 511 of the first laminated structure 51 can be formed in the same process as the light-emitting part 43 of the light-emitting device F, and the second sub-part 512 of the first laminated structure 51 can be formed in the same process as the second electrode 42 of the light-emitting device F. That is, the first laminated structure 51 and the light-emitting device F can be formed in the same process.

[0161] Exemplarily, please continue to refer to FIG. 2A, FIG. 2B and FIG. 2C, in the orthographic projection onto the substrate 1, two first laminated structures 51 can be arranged between two adjacent light-emitting devices F in the display panel 10.

[0162] Please continue to refer to FIG. 2A and FIG. 2B, the two first laminated structures 51 between the two adjacent light-emitting devices F can have a spacing d1 in the first direction X, and the first direction X is parallel to the line connecting the centers of the two adjacent light-emitting devices F. That is, in the orthographic projection onto the substrate 1, the two first laminated structures 51 between the two adjacent light-emitting devices F in the display panel 10 do not overlap.

[0163] Alternatively, please continue to refer to FIG. 2C, in the two first laminated structures 51 between the two adjacent light-emitting devices F, one first laminated structure 51 covers at least part of the area of the other first laminated structure 51. That is, in the orthographic projection onto the substrate 1, the two first laminated structures 51 between the two adjacent light-emitting devices F in the display panel 10 have an overlapping area M1.

[0164] It should be noted that, since the first direction X is parallel to the line connecting the centers of two adjacent light emitting devices F, the first direction X is related to the arrangement of the light emitting devices F in the display panel 10, and the first direction X corresponding to different adjacent light emitting devices F in the display panel 10 can be different.

[0165] In some embodiments, please refer to FIGS. 2A, 2B and 2C, the display panel 10 can further include a packaging structure 6. The packaging structure 6 is located on the side of the plurality of light emitting devices F away from the substrate 1. That is, the packaging structure 6 is farther away from the substrate 1 than the light emitting devices F.

[0166] Please refer to FIGS. 2A, 2B and 2C, the packaging structure 6 can include a first inorganic packaging layer 61, an organic packaging layer 63 and a second inorganic packaging layer 62 which are sequentially stacked in the direction away from the substrate 1. That is, the first inorganic packaging layer 61 is closer to the light emitting devices F than the second inorganic packaging layer 62.

[0167] The packaging structure 6 is used to package the light emitting devices F (for example, the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3), and plays a role of protecting the light emitting devices F from corrosion caused by external water and oxygen.

[0168] The materials of the first inorganic packaging layer 61 and the second inorganic packaging layer 62 are inorganic materials, which can be used to block water and oxygen. The material of the organic packaging layer 63 is an organic material, which can play a role of flat interface, defect covering and stress release.

[0169] Exemplarily, the materials of the first inorganic packaging layer 61 and the second inorganic packaging layer 62 can include SiON, SiNx or SiOy, etc.

[0170] The material of the organic packaging layer 63 can include organic ink, etc.

[0171] Exemplarily, the processes such as Plasma Enhanced Chemical Vapor Deposition (PECVD), magnetic control sputtering (SUPTTER) or atomic layer deposition (ALD) can be used to form the first inorganic packaging layer 61 and the second inorganic packaging layer 62.

[0172] The process such as inkjet printing (IJP) can be used to form the organic packaging layer 63.

[0173] Exemplarily, please refer to FIGS. 2A, 2B and 2C, the first inorganic packaging layer 61 in the packaging structure 6 at least includes a first packaging sub-layer 611.

[0174] For example, please continue to refer to FIG. 2A and FIG. 2C, the first inorganic encapsulation layer 61 in the encapsulation structure 6 includes a first encapsulation sub-layer 611.

[0175] For another example, please continue to refer to FIG. 2B, the first inorganic encapsulation layer 61 in the encapsulation structure 6 includes the first encapsulation sub-layer 611 and a second encapsulation sub-layer 612.

[0176] Please continue to refer to FIG. 2A, FIG. 2B and FIG. 2C, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61 covers the light emitting device F and the first stacked structure 51 in the display panel 10, and is continuous in the area between the adjacent light emitting device F and the first stacked structure 51.

[0177] It can be understood that, please continue to refer to FIG. 2A and FIG. 2B, in the case that the two first stacked structures 51 between the adjacent two light emitting devices F in the display panel 10 have a pitch d1 in the first direction (i.e. the direction parallel to the line connecting the centers of the adjacent two light emitting devices F) X, the first encapsulation sub-layer 611 is not arranged at the pitch d1 of the two first stacked structures 51 between the adjacent two light emitting devices F. That is, the first encapsulation sub-layer 611 covering the two first stacked structures 51 between the adjacent two light emitting devices F is discontinuous in the first direction (i.e. the direction parallel to the line connecting the centers of the adjacent two light emitting devices F) X.

[0178] Please continue to refer to FIG. 2C, in the case that one of the two first stacked structures 51 between the adjacent two light emitting devices F in the display panel 10 covers at least part of the other first stacked structure 51, since the two first stacked structures 51 between the adjacent two light emitting devices F do not have a pitch in the first direction (i.e. the direction parallel to the line connecting the centers of the adjacent two light emitting devices F) X, the first encapsulation sub-layer 611 covering the two first stacked structures 51 between the adjacent two light emitting devices F is continuous in the first direction (i.e. the direction parallel to the line connecting the centers of the adjacent two light emitting devices F) X.

[0179] Please continue to refer to FIG. 2B, the second encapsulation sub-layer 612 in the first inorganic encapsulation layer 61 covers the first encapsulation sub-layer 611.

[0180] The two first stack structures 51 between the two adjacent light emitting devices F in the display panel 10 have a spacing d1 in the first direction (i.e., the direction parallel to the line connecting the centers of the two adjacent light emitting devices F) X, and no first encapsulation sub-layer 611 is arranged at the spacing d1 of the two first stack structures 51 between the two adjacent light emitting devices F, i.e., in the case that the first encapsulation sub-layer 611 covering the two first stack structures 51 between the two adjacent light emitting devices F also has a spacing d1 in the first direction (i.e., the direction parallel to the line connecting the centers of the two adjacent light emitting devices F) X, the second encapsulation sub-layer 612 can also be arranged at the spacing d1 of the two first encapsulation sub-layers 611, i.e., the second encapsulation sub-layer 612 is continuous in the area between the two first encapsulation sub-layers 611.

[0181] By including the first encapsulation sub-layer 611 and the second encapsulation sub-layer 612 in the first inorganic encapsulation layer 61 in the encapsulation structure 6, the ability of the first inorganic encapsulation layer 61 in the encapsulation structure 6 to block water and oxygen can be improved, which is conducive to enhancing the protection of the light emitting device F in the display panel 10 and avoiding corrosion caused by external water and oxygen.

[0182] In some embodiments, please continue to refer to FIGS. 2A, 2B and 2C, the display panel 10 can further include a touch layer 7. The touch layer 7 can be located on the side of the encapsulation structure 6 away from the substrate 1.

[0183] Exemplarily, the touch layer 7 in the display panel 10 can be formed by a flexible multi-layer on cell (FMLOC) process.

[0184] In some embodiments, please continue to refer to FIGS. 2A, 2B and 2C, the display panel 10 can further include a plurality of light filtering color resist S. The light filtering color resist S is located on the side of the light emitting device F away from the substrate 1, and in the second direction (i.e., the thickness direction of the display device 100) Z, each light filtering color resist S is arranged corresponding to one light emitting device F.

[0185] The light filtering color resist S can be used to form a color filter on encapsulation (COE) structure, which is conducive to improving the display effect of the display panel 10.

[0186] Exemplarily, please continue to refer to FIGS. 2A, 2B and 2C, the plurality of light filtering color resistances S in the display panel 10 can include first color light filtering color resistances S1, second color light filtering color resistances S2 and third color light filtering color resistances S3. The first color light filtering color resistances S1 can normally pass the first color light and absorb the second color light and the third color light, the second color light filtering color resistances S2 can normally pass the second color light and absorb the first color light and the third color light, and the third color light filtering color resistances S3 can normally pass the third color light and absorb the first color light and the second color light.

[0187] In the case that the plurality of light emitting devices F in the display area AA of the display panel 10 include first color light emitting devices F1 emitting the first color light, second color light emitting devices F2 emitting the second color light and third color light emitting devices F3 emitting the third color light, the first color light filtering color resistances S1 can be arranged corresponding to the first color light emitting devices F1, the second color light filtering color resistances S2 can be arranged corresponding to the second color light emitting devices F2, and the third color light filtering color resistances S3 can be arranged corresponding to the third color light emitting devices F3.

[0188] Exemplarily, please continue to refer to FIGS. 2A, 2B and 2C, in the case that the display panel 10 includes the touch layer 7, the light filtering color resistances S can be located on the side of the touch layer 7 away from the substrate 1. That is, the touch layer 7 can be arranged between the light filtering color resistances S and the light emitting devices F.

[0189] At present, fingerprint recognition has become one of the important ways for identity authentication of the display device 100 (for example, a mobile phone). The fingerprint recognition assembly can be attached to the display panel 10 in the display device 100, so that the display device 100 (for example, a mobile phone) has the function of fingerprint recognition. However, directly attaching the fingerprint recognition assembly to the display panel 10 in the display device 100 can easily cause the overall thickness of the display device 100 to be large, which is not conducive to the thinning of the display device 100.

[0190] Based on this, in some embodiments, as shown in FIGS. 7A, 7B, 8A and 8B, which are cross-sectional views of a partial area of the display device 100 according to some embodiments, the difference between FIGS. 7A and 7B is that the two first stacked structures 51 between the two adjacent light emitting devices F have a spacing in the first direction (i.e., the direction parallel to the line connecting the centers of the two adjacent light emitting devices F) X in FIG. 7A, and in the two first stacked structures 51 between the two adjacent light emitting devices F, one first stacked structure 51 at least covers part of the area of the other first stacked structure 51 in FIG. 7B. The difference between FIGS. 8A and 8B is that the two first stacked structures 51 between the two adjacent light emitting devices F have a spacing in the first direction (i.e., the direction parallel to the line connecting the centers of the two adjacent light emitting devices F) X in FIG. 8A, and in the two first stacked structures 51 between the two adjacent light emitting devices F, one first stacked structure 51 at least covers part of the area of the other first stacked structure 51 in FIG. 8B.

[0191] The display panel 10 in the display device 100 can also include a plurality of photodetectors 8. The photodetector 8 can identify various biometric information (e.g., fingerprints, palm prints or footprints) based on the principle of light refraction and reflection. Please continue to refer to FIGS. 7A, 7B, 8A and 8B, taking the identification of fingerprints by the photodetector 8 based on the principle of light refraction and reflection as an example, when a user's finger touches the surface of the display panel 10 including a plurality of photodetectors 8, the light (e.g., light g2 or light g3) emitted from the light emitting device F in the display panel 10 is radiated onto the valley lines and ridge lines of the user's finger, and part of the light (e.g., light g2 or light g3) is reflected after passing through the valley lines and ridge lines of the user's finger, and then enters the photodetector 8 in the display panel 10, so as to realize the identification of the user's finger fingerprint, so that the display panel 10, and the display device 100 including the display panel 10 have the function of fingerprint identification.

[0192] Exemplarily, please continue to refer to FIGS. 7A, 7B, 8A and 8B, the photodetector 8 in the display panel 10 can include an organic photo diode (OPD).

[0193] Exemplarily, please continue to refer to FIGS. 7A, 7B, 8A and 8B, the photodetector 8 in the display panel 10 can include a third electrode 81, a photoelectric conversion film layer 83 and a fourth electrode 82 which are sequentially stacked in the direction away from the substrate 1. That is, the third electrode 81 of the photodetector 8 is closer to the substrate 1 than the fourth electrode 82.

[0194] For example, the material used to form the third electrode 81 may include a metallic material. For instance, the material used to form the third electrode 81 may include any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo).

[0195] The material used to form the third electrode 81 may also include alloys of the aforementioned metallic materials. For example, the material used to form the third electrode 81 may include aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), etc.

[0196] For example, the third electrode 81 may be a single-layer structure.

[0197] Alternatively, the third electrode 81 can also be a multilayer composite structure. For example, the third electrode 81 can be a Ti / Al / Ti structure, etc. Another example is that the third electrode 81 can be a stacked structure formed of metallic materials and transparent conductive materials, such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0198] For example, the material used to form the fourth electrode 82 may include any one or more of magnesium (Mg), silver (Ag), aluminum (Al), etc.

[0199] The material used to form the fourth electrode 82 may also include alloys made of any one or more of magnesium (Mg), silver (Ag), aluminum (Al), etc.

[0200] The material used to form the fourth electrode 82 may also include a transparent conductive material. For example, the material used to form the fourth electrode 82 may include indium tin oxide (ITO), indium zinc oxide (IZO), etc.

[0201] For example, the material used to form the photoelectric conversion film layer 83 may include an organic active material.

[0202] The materials used to form the photoelectric conversion film layer 83 may also include hole transport layer (HTL) materials and electron transport layer (ETL) materials.

[0203] The following provides a detailed description of the specific arrangement of the photodetector 8 within the display panel 10.

[0204] In some embodiments, please refer to FIG. 7A and FIG. 7B, the display panel 10 can further include a second isolation structure 32. The second isolation structure 32 is located between the plurality of light emitting devices F and the substrate 1 in the display panel 10. That is, the second isolation structure 32 is closer to the substrate 1 than the light emitting devices F.

[0205] The second isolation structure 32 is provided with a plurality of second openings K2, and each photodetector 8 is located in one second opening K2.

[0206] By providing the second isolation structure 32 in the display panel 10, and the second isolation structure 32 is provided with a plurality of second openings K2, and each photodetector 8 in the display panel 10 is arranged in one second opening K2, the photodetector 8 can be integrated in the display panel 10, which is conducive to improving the integration of the display panel 10, and further makes the display device 100 including the display panel 10 have the function of fingerprint recognition while having a smaller thickness, which is conducive to realizing the thinness of the display device 100.

[0207] Please refer to FIG. 7A and FIG. 7B, in the case that the first isolation structure 31 in the display panel 10 is light-transmissive, in the orthographic projection onto the substrate 1, the photodetector 8 and the first isolation structure 31 at least partially overlap, and there is an overlapping region M2.

[0208] Since the first isolation structure 31 in the display panel 10 is light-transmissive, in the orthographic projection onto the substrate 1, by making the photodetector 8 and the first isolation structure 31 at least partially overlap, the light emitted by the light emitting device F in the display panel 10 (for example, light g2) can be incident on the photodetector 8 in the display panel 10 through the first isolation structure 31 after being reflected by the user's finger fingerprint, so as to realize the recognition of the user's finger fingerprint.

[0209] For example, please refer to FIG. 7A and FIG. 7B, in the orthographic projection onto the substrate 1, the range of the first isolation structure 31 is W1, and the range of the second opening K2 in the second isolation structure 32 is W2.

[0210] In the case that the first isolation structure 31 in the display panel 10 is light-transmissive, in the orthographic projection onto the substrate 1, the second opening K2 in the second isolation structure 32 is located in the range W1 of the first isolation structure 31.

[0211] For example, in the orthographic projection onto the substrate 1, the range W2 of the second opening K2 in the second isolation structure 32 can coincide with the range W1 of the first isolation structure 31.

[0212] For another example, please refer to FIG. 7A and FIG. 7B, in the orthographic projection onto the substrate 1, the range W2 of the second opening K2 in the second isolation structure 32 and the range W1 of the first isolation structure 31 can have a spacing.

[0213] Please continue to refer to FIG. 7A and FIG. 7B, since each photodetector 8 in the display panel 10 is located in a second opening K2, in the case that the first isolation structure 31 in the display panel 10 is light-transmissive, by making the second opening K2 in the second isolation structure 32 in the orthographic projection to the substrate 1 be located in the range W1 of the first isolation structure 31, the overlapping area of the photodetector 8 and the first isolation structure 31 in the orthographic projection to the substrate 1 can be increased, so that most of the light emitted by the light emitting device F in the display panel 10 after being reflected by the user's finger fingerprint can pass through the first isolation structure 31 and be incident to the photodetector 8 in the display panel 10, which is conducive to improving the light quantity incident to the photodetector 8 in the display panel 10, and further the sensitivity of the photodetector 8 can be improved.

[0214] Exemplarily, please continue to refer to FIG. 7A and FIG. 7B, in the orthographic projection to the substrate 1, the second isolation structure 32 in the display panel 10 and the light emitting device F can at least partially overlap, and there is an overlapping region M3.

[0215] For example, please continue to refer to FIG. 7A and FIG. 7B, in the orthographic projection to the substrate 1, the second isolation structure 32 in the display panel 10 and the light emitting device F can partially overlap.

[0216] For another example, in the orthographic projection to the substrate 1, the second isolation structure 32 in the display panel 10 and the light emitting device F can completely overlap. That is, in the orthographic projection to the substrate 1, the second isolation structure 32 in the display panel 10 and the light emitting device F can coincide.

[0217] Exemplarily, please continue to refer to FIG. 7A and FIG. 7B, in the case that the second isolation structure 32 in the display panel 10 is located between the plurality of light emitting devices F and the substrate 1 in the display panel 10, and each photodetector 8 is located in a second opening K2 of the second isolation structure 32, the fourth electrodes 82 in adjacent photodetectors 8 can be connected to each other to form a fourth electrode layer 82a. The fourth electrode layer 82a covers the photoelectric conversion film layer 83 in the photodetector 8 and the second isolation structure 32.

[0218] In some embodiments, please continue to refer to FIG. 7A and FIG. 7B, in the case that the second isolation structure 32 in the display panel 10 is located between the plurality of light emitting devices F and the substrate 1, and each photodetector 8 is located in a second opening K2 of the second isolation structure 32, the display panel 10 can further include at least one insulating layer 9. The at least one insulating layer 9 is located between the plurality of photodetectors 8 and the first isolation structure 31 in the display panel 10. The insulating layer 9 can be light-transmissive.

[0219] By making the insulating layer 9 between the plurality of photodetectors 8 and the first isolation structure 31 in the display panel 10 light-transmissive, light rays (for example, light ray g2) emitted by the light emitting device F in the display panel 10 can be reflected by a user's finger fingerprint, and then sequentially pass through the first isolation structure 31 and at least one insulating layer 9 to be incident on the photodetector 8 in the display panel 10, so as to realize identification of the user's finger fingerprint.

[0220] Exemplarily, the at least one insulating layer 9 between the plurality of photodetectors 8 and the first isolation structure 31 in the display panel 10 can include an inorganic insulating layer 91 and a planar layer 92 which are sequentially stacked in a direction away from the substrate 1. The planar layer 92 has a planarization effect, which is conducive to improving the quality of subsequent material deposition, reducing the surface difference of other film layers formed subsequently, and the planar layer 92 can also block water and oxygen from entering the light emitting device F.

[0221] The material of the inorganic insulating layer 91 can include an inorganic material. For example, the material of the inorganic insulating layer 91 can include silicon oxide, silicon nitride, silicon oxynitride, etc.

[0222] The material of the planar layer 92 can include an organic material, or can include an inorganic material.

[0223] In some embodiments, please continue to refer to FIGS. 8A and 8B, the first isolation structure 31 in the display panel 10 is provided with a plurality of first openings K1 and a plurality of second openings K2. Each light emitting device F in the display panel 10 is at least partially located in one first opening K1, and each photodetector 8 in the display panel 10 is at least partially located in one second opening K2.

[0224] By providing the first isolation structure 31 in the display panel 10 with a plurality of second openings K2, and at least partially disposing each photodetector 8 in the display panel 10 in one second opening K2, the photodetector 8 can be integrated in the display panel 10, which is conducive to improving the integration of the display panel 10, and thus the display device 100 including the display panel 10 has a smaller thickness while having a fingerprint identification function, which is conducive to realizing the thinness of the display device 100.

[0225] In the case where the first isolation structure 31 is provided in the display panel 10 and the first isolation structure 31 is provided with a plurality of first openings K1 and a plurality of second openings K2, when forming the light emitting device F (for example, the first color light emitting device F1, the second color light emitting device F2, or the third color light emitting device F3) and the photodetector 8 in the display panel 10, the light emitting device F and the photodetector 8 can be formed in the display panel 10 by a maskless lithography process, so that each light emitting device F is at least partially located in one first opening K1, and each photodetector 8 is at least partially located in one second opening K2.

[0226] In one aspect, when the light emitting device F and the photodetector 8 are formed by the maskless lithography process, the precision limitation of the physical mask can be avoided, which is beneficial to form more fine light emitting devices F and photodetectors 8 in the display panel 10, and further beneficial to improve the precision of the display panel 10.

[0227] In addition, since the maskless lithography process does not depend on the physical mask, when a large-size display panel 10 is prepared, the problems of sagging, deformation or wear of the physical mask can be avoided, which is beneficial to prepare a large-size display panel 10, and further beneficial to improve the yield of the large-size display panel 10.

[0228] On the other hand, when the light emitting device F and the photodetector 8 are formed by the maskless lithography process, the light emitting part 43 of the two adjacent light emitting devices F, the photoelectric conversion film layer 83 of the two adjacent photodetectors 8, and the light emitting part 43 of the light emitting device F and the photoelectric conversion film layer 83 of the photodetector 8 in the adjacent light emitting device F and photodetector 8 are all disconnected at the first isolation structure 31, which reduces the crosstalk between the two adjacent light emitting devices F, the two adjacent photodetectors 8, and the adjacent light emitting device F and photodetector 8, and is beneficial to improve the display effect of the display panel 10.

[0229] Exemplarily, as shown in FIG. 9, FIG. 9 is a cross-sectional view of a partial region of the display device 100 according to some embodiments. The first isolation structure 31 in the display panel 10 is provided with a plurality of first openings K1 and second openings K2, and each light emitting device F is at least partially located in one first opening K1, and each photodetector 8 is at least partially located in one second opening K2, the first isolation structure 31 can include a first sub-layer 314 and a second sub-layer 315 which are sequentially stacked in a direction away from the substrate 1. The edge of the second sub-layer 315 extends towards the direction close to the light emitting device F adjacent to the first sub-layer 314 compared with the first sub-layer 314. That is, in the orthographic projection towards the substrate 1, the first sub-layer 314 falls within the boundary range of the second sub-layer 315, and there is a spacing between the boundary of the first sub-layer 314 and the boundary of the second sub-layer 315.

[0230] By making the edge of the second sub-layer 315 of the first isolation structure 31 protrude towards the direction close to the light emitting device F adjacent to the first sub-layer 314, when the light emitting device F and the photodetector 8 in the display panel 10 are formed by the maskless photolithography process, the light emitting part 43 of the two adjacent light emitting devices F, the photoelectric conversion film layer 83 of the two adjacent photodetectors 8, and the light emitting part 43 of the light emitting device F and the photoelectric conversion film layer 83 of the photodetector 8 in the adjacent light emitting device F and photodetector 8 are all disconnected at the first isolation structure 31, thereby weakening the crosstalk between the two adjacent light emitting devices F, the two adjacent photodetectors 8, and the light emitting device F and the photodetector 8, and helping to improve the display effect of the display panel 10.

[0231] For example, please continue to refer to FIG. 9, when the light emitting device F and the photodetector 8 in the display panel 10 are formed by the maskless photolithography process, and the photodetector 8 in the display panel 10 includes the third electrode 81, the photoelectric conversion film layer 83 and the fourth electrode 82 which are sequentially stacked in the direction away from the substrate 1, and the light emitting device F in the display panel 10 includes the first electrode 41, the light emitting part 43 and the second electrode 42 which are sequentially stacked in the direction away from the substrate 1, in the adjacent light emitting device F and photodetector 8, the second electrode 42 of the light emitting device F and the fourth electrode 82 of the photodetector 8 can also be disconnected at the first isolation structure 31, and the second electrode 42 of the light emitting device F and the fourth electrode 82 of the photodetector 8 in the adjacent light emitting device F and photodetector 8 can be electrically connected through the first isolation structure 31.

[0232] For example, please continue to refer to FIG. 9, when the first isolation structure 31 includes the first sub-layer 314 and the second sub-layer 315 which are sequentially stacked in the direction away from the substrate 1, the first sub-layer 314 of the first isolation structure 31 can include a conductive material, and the second electrode 42 of the light emitting device F and the fourth electrode 82 of the photodetector 8 in the adjacent light emitting device F and photodetector 8 can be electrically connected through the first sub-layer 314 of the first isolation structure 31.

[0233] Similarly, the second electrode 42 of the two adjacent light emitting devices F, and the fourth electrode 82 of the two adjacent photodetectors 8 can also be electrically connected through the first isolation structure 31 (for example, the first sub-layer 314 of the first isolation structure 31), which will not be described here.

[0234] In some embodiments, please refer to FIG. 9, the first isolation structure 31 in the display panel 10 is provided with a plurality of first openings K1 and second openings K2, and each light emitting device F is at least partially located in one first opening K1, and each photodetector 8 is at least partially located in one second opening K2, in this case, the first isolation structure 31 in the display panel 10 can block light.

[0235] By making the first isolation structure 31 capable of blocking light, stray light (for example, stray light Z1) incident on the second opening K2 through the first isolation structure 31 can be blocked, so that it is more difficult for stray light (for example, stray light Z1) in the display panel 10 to be incident on the second opening K2 through the first isolation structure 31, thereby reducing the interference of stray light on the photodetector 8 in the second opening K2, which is conducive to improving the fingerprint acquisition contrast of the photodetector 8, and further conducive to improving the fingerprint recognition effect of the display panel 10.

[0236] For example, please refer to FIG. 9, the first sub-layer 314 and the second sub-layer 315 of the first isolation structure 31 each include a metal material. For example, the materials of the first sub-layer 314 and the second sub-layer 315 of the first isolation structure 31 can include aluminum (Al), titanium (Ti), and the like.

[0237] The light-blocking performance of a metal material is good, and by making the first sub-layer 314 and the second sub-layer 315 of the first isolation structure 31 each include a metal material, it is conducive to improving the light-blocking effect of the first isolation structure 31, so that stray light (for example, stray light Z1) incident on the second opening K2 through the first isolation structure 31 can be blocked, and further reducing the interference of stray light on the photodetector 8 in the second opening K2.

[0238] For example, please refer to FIG. 9, the materials of the first sub-layer 314 and the second sub-layer 315 of the first isolation structure 31 are different. For example, the material of the first sub-layer 314 of the first isolation structure 31 can include aluminum (Al), and the material of the second sub-layer 315 can include titanium (Ti).

[0239] By making the materials of the first sub-layer 314 and the second sub-layer 315 of the first isolation structure 31 different, when the first isolation structure 31 is formed by an etching process, the etching rates of an initial film layer used to form the first sub-layer 314 and an initial film layer used to form the second sub-layer 315 are different, and further making the edge of the second sub-layer 315 in the finally formed first isolation structure 31 extend towards the direction close to the light emitting device F adjacent to the first sub-layer 314 compared with the first sub-layer 314.

[0240] In some embodiments, please refer to FIG. 8A and FIG. 8B, the first isolation structure 31 in the display panel 10 is provided with a plurality of first openings K1 and second openings K2, and each light emitting device F is at least partially located in one first opening K1, and each photodetector 8 is at least partially located in one second opening K2, the display panel 10 can further include a second stack structure 52. The second stack structure 52 is located on the side of the first isolation structure 31 away from the substrate 1.

[0241] The second stack structure 52 includes a third sub-portion 521 and a fourth sub-portion 522 which are sequentially stacked in the direction away from the substrate 1. The material of the third sub-portion 521 of the second stack structure 52 can be the same as the material of the photoelectric conversion film layer 83 of the photodetector 8, and the material of the fourth sub-portion 522 of the second stack structure 52 can be the same as the material of the fourth electrode 82 of the photodetector 8.

[0242] In the case that the material of the third sub-portion 521 of the second stack structure 52 is the same as the material of the photoelectric conversion film layer 83 of the photodetector 8, and the material of the fourth sub-portion 522 of the second stack structure 52 is the same as the material of the fourth electrode 82 of the photodetector 8, the third sub-portion 521 of the second stack structure 52 can be formed in the same process as the photoelectric conversion film layer 83 of the photodetector 8, and the fourth sub-portion 522 of the second stack structure 52 can be formed in the same process as the fourth electrode 82 of the photodetector 8.

[0243] Exemplarily, please refer to FIG. 8A and FIG. 8B, in the orthographic projection onto the substrate 1, a first stack structure 51 and a second stack structure 52 can be arranged between adjacent photodetectors 8 and light emitting devices F in the display panel 10.

[0244] Please refer to FIG. 8A, the first stack structure 51 and the second stack structure 52 between adjacent photodetectors 8 and light emitting devices F have a spacing d2 in the first direction (i.e. the direction parallel to the line connecting the centers of the two adjacent light emitting devices F) X. That is, in the orthographic projection onto the substrate 1, the first stack structure 51 and the second stack structure 52 between adjacent photodetectors 8 and light emitting devices F in the display panel 10 do not overlap.

[0245] Alternatively, please refer to FIG. 8B, one of the first stack structure 51 and the second stack structure 52 between adjacent photodetectors 8 and light emitting devices F covers at least part of the other. That is, in the orthographic projection onto the substrate 1, the first stack structure 51 and the second stack structure 52 between adjacent photodetectors 8 and light emitting devices F in the display panel 10 have an overlapping area M3.

[0246] For example, please continue to refer to FIG. 8B, in a first stack structure 51 and a second stack structure 52 located between adjacent photodetectors 8 and light emitting devices F, the first stack structure 51 can cover at least part of the area of the second stack structure 52.

[0247] For another example, please continue to refer to FIG. 8B, in a first stack structure 51 and a second stack structure 52 located between adjacent photodetectors 8 and light emitting devices F, the second stack structure 52 can cover at least part of the area of the first stack structure 51.

[0248] Likewise, in the orthographic projection onto the substrate 1, two second stack structures 52 can be arranged between two adjacent photodetectors 8 in the display panel 10.

[0249] The two second stack structures 52 between the two adjacent photodetectors 8 can have a spacing in the first direction X, which is parallel to the line connecting the centers of the two adjacent photodetectors 8. That is, in the orthographic projection onto the substrate 1, the two second stack structures 52 between the two adjacent photodetectors 8 in the display panel 10 do not overlap.

[0250] Alternatively, in the two second stack structures 52 located between the two adjacent photodetectors 8, one second stack structure 52 covers at least part of the area of the other second stack structure 52. That is, in the orthographic projection onto the substrate 1, the two second stack structures 52 between the two adjacent photodetectors 8 in the display panel 10 have an overlapping area.

[0251] In some embodiments, please continue to refer to FIG. 9, in the case where the first isolation structure 31 in the display panel 10 is provided with a plurality of first openings K1 and second openings K2, and each light emitting device F is at least partially located in a first opening K1, and each photodetector 8 is at least partially located in a second opening K2, the display panel 10 can further include a black matrix layer H. The black matrix layer H is provided with a plurality of third openings K3, and each third opening K3 penetrates a first opening K1.

[0252] The orthographic projection of the black matrix layer H on the substrate 1 at least partially overlaps the orthographic projection of the first isolation structure 31 on the substrate, and there is an overlapping area M4, and the black matrix layer H and the first isolation structure 31 have a spacing d3 in the direction perpendicular to the substrate 1.

[0253] By arranging the black matrix layer H in the display panel 10, the stray light (for example, stray light Z2) in the display panel 10 can be blocked from being emitted out of the display panel 10, so that it is difficult for the stray light (for example, stray light Z2) in the display panel 10 to be emitted out of the display panel 10 via the black matrix layer H, which is conducive to improving the display effect of the display panel 10.

[0254] The preparation method of the display panel 10 is described in detail as follows.

[0255] In some embodiments, the preparation method of the display panel 10 includes steps S1-S3.

[0256] S1: As shown in FIG. 10, which is a structural diagram corresponding to step S1 in the preparation method of the display panel 10 according to some embodiments, a first isolation structure 31 is formed on one side of the substrate 1. A plurality of target sub-openings Km (i.e., first openings K1 of the light emitting devices Fa corresponding to the target colors) corresponding to light emitting devices Fa of target colors (e.g., first color light emitting devices F1, second color light emitting devices F2, or third color light emitting devices F3) are formed in the first isolation structure 31.

[0257] S2: As shown in FIG. 11, which is a structural diagram corresponding to step S2 in the preparation method of the display panel 10 according to some embodiments, a light emitting device film layer Faa of target colors and a first inorganic thin film 611a are sequentially formed on the substrate 1 having the plurality of target sub-openings Km (i.e., first openings K1 of the light emitting devices Fa corresponding to the target colors).

[0258] S3: As shown in FIG. 12, which is a structural diagram corresponding to step S3 in the preparation method of the display panel 10 according to some embodiments, portions of the light emitting device film layer Faa of target colors and the first inorganic thin film 611a covering regions other than the regions of the light emitting devices Fa of target colors (e.g., first color light emitting devices F1, second color light emitting devices F2, or third color light emitting devices F3) are removed, and the light emitting device film layer Faa of target colors and the first inorganic thin film 611a in the regions of the light emitting devices Fa of target colors (e.g., first color light emitting devices F1, second color light emitting devices F2, or third color light emitting devices F3) are retained, to respectively form the light emitting devices Fa of target colors (e.g., first color light emitting devices F1, second color light emitting devices F2, or third color light emitting devices F3) located in the target sub-openings Km (i.e., first openings K1 of the light emitting devices Fa corresponding to the target colors), the first laminated structure 51 located on the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the light emitting devices Fa of target colors (e.g., first color light emitting devices F1, second color light emitting devices F2, or third color light emitting devices F3) and the first laminated structure 51, and continuously located between adjacent light emitting devices Fa of target colors (e.g., first color light emitting devices F1, second color light emitting devices F2, or third color light emitting devices F3) and the first laminated structure 51.

[0259] Exemplarily, please continue to refer to FIG. 11 and FIG. 12, when removing the part of the light-emitting device film layer Faa and the first inorganic film 611a covering the area other than the area of the light-emitting device Fa of the target color in the light-emitting device film layer Faa and the first inorganic film 611a, the part of the light-emitting device film layer Faa and the first inorganic film 611a covering the area other than the area of the light-emitting device Fa of the target color can be removed by a photoetching process through the steps of coating photoresist, exposure, development and etching, and the light-emitting device film layer Faa and the first inorganic film 611a in the area of the light-emitting device Fa of the target color are reserved to form the light-emitting device Fa of the target color located in the target sub-opening Km (i.e. the first opening K1 corresponding to the light-emitting device Fa of the target color), the first laminated structure 51 located on the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the light-emitting device Fa of the target color and the first laminated structure 51, and continuous in the area between adjacent light-emitting device Fa of the target color and the first laminated structure 51.

[0260] Exemplarily, in the case that the light-emitting device Fa of the target color described above can be the first color light-emitting device F1, the second color light-emitting device F2 or the third color light-emitting device F3, the light-emitting device Fa of the target color can be the first color light-emitting device F1, the second color light-emitting device F2 and the third color light-emitting device F3 in turn, i.e. when preparing the display panel 10, the first color light-emitting device F1, the first laminated structure 51 adjacent to the first color light-emitting device F1, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the first color light-emitting device F1 and the first laminated structure 51, and continuous in the area between adjacent first color light-emitting device F1 and the first laminated structure 51 can be formed first, then the second color light-emitting device F2, the first laminated structure 51 adjacent to the second color light-emitting device F2, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the second color light-emitting device F2 and the first laminated structure 51, and continuous in the area between adjacent second color light-emitting device F2 and the first laminated structure 51 are formed, and finally the third color light-emitting device F3, the first laminated structure 51 adjacent to the third color light-emitting device F3, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the third color light-emitting device F3 and the first laminated structure 51, and continuous in the area between adjacent third color light-emitting device F3 and the first laminated structure 51 are formed, to obtain the display panel 10 with the first color light-emitting device F1, the second color light-emitting device F2 and the third color light-emitting device F3 simultaneously as shown in FIG. 13A or FIG. 13B.

[0261] Alternatively, the light-emitting device Fa of the target color can be the second color light-emitting device F2, the first color light-emitting device Fl and the third color light-emitting device F3 in sequence, that is, in the preparation of the display panel 10, the second color light-emitting device F2, the first stack structure 51 adjacent to the second color light-emitting device F2, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the second color light-emitting device F2 and the first stack structure 51 and continuous in the region between the adjacent second color light-emitting device F2 and the first stack structure 51 can be formed first, then the first color light-emitting device Fl, the first stack structure 51 adjacent to the first color light-emitting device Fl, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the first color light-emitting device Fl and the first stack structure 51 and continuous in the region between the adjacent first color light-emitting device Fl and the first stack structure 51 are formed, and finally the third color light-emitting device F3, the first stack structure 51 adjacent to the third color light-emitting device F3, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the third color light-emitting device F3 and the first stack structure 51 and continuous in the region between the adjacent third color light-emitting device F3 and the first stack structure 51 are formed, so as to obtain the display panel 10 with the first color light-emitting device Fl, the second color light-emitting device F2 and the third color light-emitting device F3 at the same time as shown in FIG. 13A or FIG. 13B.

[0262] Alternatively, the light emitting device Fa of the target color can be the third color light emitting device F3, the second color light emitting device F2, and the first color light emitting device Fl in sequence, that is, in the preparation of the display panel 10, the third color light emitting device F3, the first stack structure 51 adjacent to the third color light emitting device F3, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the third color light emitting device F3 and the first stack structure 51 and continuous in the region between the adjacent third color light emitting device F3 and the first stack structure 51 can be formed first, then the second color light emitting device F2, the first stack structure 51 adjacent to the second color light emitting device F2, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the second color light emitting device F2 and the first stack structure 51 and continuous in the region between the adjacent second color light emitting device F2 and the first stack structure 51 are formed, and finally the first color light emitting device Fl, the first stack structure 51 adjacent to the first color light emitting device Fl, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the first color light emitting device Fl and the first stack structure 51 and continuous in the region between the adjacent first color light emitting device Fl and the first stack structure 51 are formed, so as to obtain the display panel 10 having the first color light emitting device Fl, the second color light emitting device F2, and the third color light emitting device F3 at the same time as shown in FIG. 13A or FIG. 13B.

[0263] It should be noted that both FIG. 13A and FIG. 13B are sectional views of a partial region of the display panel 10 according to some embodiments. The difference between the display panel 10 shown in FIG. 13A and the display panel 10 shown in FIG. 13B is that in the display panel 10 shown in FIG. 13A, the two first stack structures 51 between the two adjacent light emitting devices F have a spacing dl in the first direction X, which is parallel to the line connecting the centers of the two adjacent light emitting devices F. That is, in the orthographic projection onto the substrate 1, the two first stack structures 51 between the two adjacent light emitting devices F in the display panel 10 do not overlap. In the display panel 10 shown in FIG. 13B, one of the two first stack structures 51 between the two adjacent light emitting devices F covers at least part of the region of the other first stack structure 51. That is, in the orthographic projection onto the substrate 1, the two first stack structures 51 between the two adjacent light emitting devices F in the display panel 10 have an overlapping region Ml.

[0264] It can be understood that, when the display panel 10 is prepared by using the preparation method of the display panel 10 shown in FIGS. 10-12, the first opening K1 corresponding to the first color light emitting device F1, the first opening K1 corresponding to the second color light emitting device F2, and the first opening K1 corresponding to the third color light emitting device F3 in the first isolation structure 31 are not formed synchronously.

[0265] For example, taking the case of first forming the first color light emitting device F1, the first stack structure 51 adjacent to the first color light emitting device F1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the first color light emitting device F1 and the first stack structure 51, and continuous in the region between the adjacent first color light emitting device F1 and the first stack structure 51, then forming the second color light emitting device F2, the first stack structure 51 adjacent to the second color light emitting device F2, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the second color light emitting device F2 and the first stack structure 51, and continuous in the region between the adjacent second color light emitting device F2 and the first stack structure 51, and finally forming the third color light emitting device F3, the first stack structure 51 adjacent to the third color light emitting device F3, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the third color light emitting device F3 and the first stack structure 51, and continuous in the region between the adjacent third color light emitting device F3 and the first stack structure 51, the first opening K1 corresponding to the first color light emitting device F1 in the first isolation structure 31 can be formed before the first color light emitting device F1, the first stack structure 51 adjacent to the first color light emitting device F1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the first color light emitting device F1 and the first stack structure 51, and continuous in the region between the adjacent first color light emitting device F1 and the first stack structure 51 are formed.

[0266] The first opening K1 in the first isolation structure 31 corresponding to the second color light emitting device F2 can be formed after the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the first color light emitting device F1 and the first color light emitting device F1 adjacent first layer structure 51, and covering the first color light emitting device F1 and the first layer structure 51, and the region between the adjacent first color light emitting device F1 and the first layer structure 51, and before the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the second color light emitting device F2 and the second color light emitting device F2 adjacent first layer structure 51, and covering the second color light emitting device F2 and the first layer structure 51, and the region between the adjacent second color light emitting device F2 and the first layer structure 51.

[0267] The first opening K1 in the first isolation structure 31 corresponding to the third color light emitting device F3 can be formed after the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the second color light emitting device F2 and the second color light emitting device F2 adjacent first layer structure 51, and covering the second color light emitting device F2 and the first layer structure 51, and the region between the adjacent second color light emitting device F2 and the first layer structure 51, and before the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the third color light emitting device F3 and the third color light emitting device F3 adjacent first layer structure 51, and covering the third color light emitting device F3 and the first layer structure 51, and the region between the adjacent third color light emitting device F3 and the first layer structure 51.

[0268] Exemplarily, please continue to refer to FIG. 11 and FIG. 12, in the case that the first layer structure 51 comprises a first sub-portion 511 and a second sub-portion 512 sequentially stacked in the direction away from the substrate 1, since the light emitting device Fa of the target color (for example, the first color light emitting device F1, the second color light emitting device F2 or the third color light emitting device F3) located in the target sub-opening Km (i.e. the first opening K1 corresponding to the light emitting device Fa of the target color) and the first layer structure 51 located on the side of the first isolation structure 31 away from the substrate 1 are formed in the same process, therefore, the material of the first sub-portion 511 of the first layer structure 51 can be the same as the material of the light emitting part 43 of the light emitting device Fa of the target color (for example, the first color light emitting device F1, the second color light emitting device F2 or the third color light emitting device F3), and the material of the second sub-portion 512 of the first layer structure 51 can be the same as the material of the second electrode 42 of the light emitting device Fa of the target color (for example, the first color light emitting device F1, the second color light emitting device F2 or the third color light emitting device F3).

[0269] In some embodiments, the method for manufacturing the display panel 10 comprises steps S1-S3.

[0270] S1: As shown in FIG. 14, FIG. 14 is a structure diagram corresponding to step S1 in the method for manufacturing the display panel 10 according to some embodiments. The first isolation structure 31 is formed on one side of the substrate 1. The plurality of first openings K1 are formed in the first isolation structure 31.

[0271] S2: As shown in FIG. 15, FIG. 15 is a structure diagram corresponding to step S2 in the method for manufacturing the display panel 10 according to some embodiments. The light-emitting device film layer Faa of the target color and the first inorganic thin film 611a are sequentially formed on the substrate 1 with the plurality of first openings K1.

[0272] S3: As shown in FIG. 16, FIG. 16 is a structure diagram corresponding to step S3 in the method for manufacturing the display panel 10 according to some embodiments. The portions of the light-emitting device film layer Faa of the target color and the first inorganic thin film 611a covering the areas other than the area of the light-emitting device Fa (e.g., the first color light-emitting device F1, the second color light-emitting device F2, or the third color light-emitting device F3) of the target color are removed, and the light-emitting device film layer Faa of the target color and the first inorganic thin film 611a in the area of the light-emitting device Fa (e.g., the first color light-emitting device F1, the second color light-emitting device F2, or the third color light-emitting device F3) of the target color are reserved to form the light-emitting device Fa (e.g., the first color light-emitting device F1, the second color light-emitting device F2, or the third color light-emitting device F3) of the target color located in the first opening K1, the first laminated structure 51 located on the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the light-emitting device Fa (e.g., the first color light-emitting device F1, the second color light-emitting device F2, or the third color light-emitting device F3) of the target color and the first laminated structure 51, and continuously between the adjacent light-emitting device Fa (e.g., the first color light-emitting device F1, the second color light-emitting device F2, or the third color light-emitting device F3) of the target color and the first laminated structure 51.

[0273] Exemplarily, please continue to refer to FIG. 15 and FIG. 16, when removing the part of the light-emitting device film layer Faa and the first inorganic film 611a covering the area other than the area of the light-emitting device Fa of the target color in the light-emitting device film layer Faa and the first inorganic film 611a, the part of the light-emitting device film layer Faa and the first inorganic film 611a covering the area other than the area of the light-emitting device Fa of the target color can be removed by a photoetching process through the steps of coating photoresist, exposure, development and etching, and the light-emitting device film layer Faa and the first inorganic film 611a in the area of the light-emitting device Fa of the target color are reserved to form the light-emitting device Fa of the target color located in the first opening K1, the first laminated structure 51 located on the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the light-emitting device Fa of the target color and the first laminated structure 51, and continuous in the area between the adjacent light-emitting device Fa of the target color and the first laminated structure 51.

[0274] Exemplarily, in the case that the light-emitting device Fa of the target color can be the first color light-emitting device F1, the second color light-emitting device F2 or the third color light-emitting device F3, the light-emitting device Fa of the target color can be the first color light-emitting device F1, the second color light-emitting device F2 and the third color light-emitting device F3 in turn, that is, when preparing the display panel 10, the first color light-emitting device F1, the first laminated structure 51 adjacent to the first color light-emitting device F1, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the first color light-emitting device F1 and the first laminated structure 51, and continuous in the area between the adjacent first color light-emitting device F1 and the first laminated structure 51 can be formed first, then the second color light-emitting device F2, the first laminated structure 51 adjacent to the second color light-emitting device F2, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the second color light-emitting device F2 and the first laminated structure 51, and continuous in the area between the adjacent second color light-emitting device F2 and the first laminated structure 51 are formed, and finally the third color light-emitting device F3, the first laminated structure 51 adjacent to the third color light-emitting device F3, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the third color light-emitting device F3 and the first laminated structure 51, and continuous in the area between the adjacent third color light-emitting device F3 and the first laminated structure 51 are formed, to obtain the display panel 10 with the first color light-emitting device F1, the second color light-emitting device F2 and the third color light-emitting device F3 simultaneously as shown in FIG. 13A or FIG. 13B.

[0275] Alternatively, the light-emitting device Fa of the target color can be the second color light-emitting device F2, the first color light-emitting device Fl and the third color light-emitting device F3 in sequence, that is, in the preparation of the display panel 10, the second color light-emitting device F2, the first stack structure 51 adjacent to the second color light-emitting device F2, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the second color light-emitting device F2 and the first stack structure 51 and continuous in the region between the adjacent second color light-emitting device F2 and the first stack structure 51 can be formed first, then the first color light-emitting device Fl, the first stack structure 51 adjacent to the first color light-emitting device Fl, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the first color light-emitting device Fl and the first stack structure 51 and continuous in the region between the adjacent first color light-emitting device Fl and the first stack structure 51 are formed, and finally the third color light-emitting device F3, the first stack structure 51 adjacent to the third color light-emitting device F3, and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the third color light-emitting device F3 and the first stack structure 51 and continuous in the region between the adjacent third color light-emitting device F3 and the first stack structure 51 are formed, so as to obtain the display panel 10 with the first color light-emitting device Fl, the second color light-emitting device F2 and the third color light-emitting device F3 at the same time as shown in FIG. 13A or FIG. 13B.

[0276] Alternatively, the light-emitting device Fa of the target color can be the third color light-emitting device F3, the second color light-emitting device F2 and the first color light-emitting device Fl in sequence, that is, in the preparation of the display panel 10, the third color light-emitting device F3, the first stack structure 51 adjacent to the third color light-emitting device F3 and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the third color light-emitting device F3 and the first stack structure 51 and continuous in the region between the adjacent third color light-emitting device F3 and the first stack structure 51 can be formed first, then the second color light-emitting device F2, the first stack structure 51 adjacent to the second color light-emitting device F2 and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the second color light-emitting device F2 and the first stack structure 51 and continuous in the region between the adjacent second color light-emitting device F2 and the first stack structure 51 are formed, and finally the first color light-emitting device Fl, the first stack structure 51 adjacent to the first color light-emitting device Fl and the first inorganic encapsulating layer 61 (specifically, the first encapsulating sub-layer 611 in the first inorganic encapsulating layer 61) covering the first color light-emitting device Fl and the first stack structure 51 and continuous in the region between the adjacent first color light-emitting device Fl and the first stack structure 51 are formed, so as to obtain the display panel 10 with the first color light-emitting device Fl, the second color light-emitting device F2 and the third color light-emitting device F3 at the same time as shown in FIG. 13A or FIG. 13B.

[0277] It can be understood that in the preparation of the display panel 10 using the preparation method of the display panel 10 shown in FIGS. 14-16, the first openings K1 corresponding to the first color light-emitting device Fl, the second color light-emitting device F2 and the third color light-emitting device F3 in the first isolation structure 31 are formed synchronously. That is, the first openings K1 corresponding to the first color light-emitting device Fl, the second color light-emitting device F2 and the third color light-emitting device F3 in the first isolation structure 31 are formed at the same time.

[0278] In the case of the first color light emitting device F1, the first color light emitting device F1 adjacent first stack structure 51, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the first color light emitting device F1 and the first stack structure 51, and being continuous in the region between the adjacent first color light emitting device F1 and the first stack structure 51, the first opening K1 corresponding to the first color light emitting device F1 in the first isolation structure 31 can be formed before the first color light emitting device F1, the first color light emitting device F1 adjacent first stack structure 51, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the first color light emitting device F1 and the first stack structure 51, and being continuous in the region between the adjacent first color light emitting device F1 and the first stack structure 51 are formed.

[0279] In the case where the display panel 10 includes the photodetector 8, the method of manufacturing the display panel 10 further includes forming the photodetector 8.

[0280] The following describes in detail the specific steps of forming the photodetector 8 in the display panel 10 in the case where the first isolation structure 31 in the display panel 10 is provided with a plurality of first openings K1 and a plurality of second openings K2, and each light emitting device F in the display panel 10 is at least partially located in a first opening K1, and each photodetector 8 in the display panel 10 is at least partially located in a second opening K2.

[0281] In some embodiments, in the case where the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3 in the display panel 10 are manufactured using the method of manufacturing the display panel 10 shown in FIGS. 10-12, the step S4-S6 is included when the photodetector 8 is formed in the display panel 10.

[0282] S4: As shown in FIG. 17, FIG. 17 is a structural diagram corresponding to step S4 in the preparation method of the display panel 10 according to some embodiments. The first isolation structure 31 is formed on one side of the substrate 1. The plurality of second openings K2 are formed in the first isolation structure 31.

[0283] S2: As shown in FIG. 18, FIG. 18 is a structural diagram corresponding to step S5 in the preparation method of the display panel 10 according to some embodiments. The photoelectric detector film layer 8a and the first inorganic film 611a are sequentially formed on the substrate 1 with the plurality of second openings K2.

[0284] S3: As shown in FIG. 19, FIG. 19 is a structural diagram corresponding to step S6 in the preparation method of the display panel 10 according to some embodiments. The photoelectric detector film layer 8a and the first inorganic film 611a covering the regions other than the photoelectric detector 8 region are removed, and the photoelectric detector film layer 8a and the first inorganic film 611a in the photoelectric detector 8 region are reserved to form the photoelectric detector 8 located in the second opening K2, the second stacked structure 52 located on the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the photoelectric detector 8 and the second stacked structure 52 and continuous in the regions between adjacent photoelectric detectors 8 and second stacked structures 52, respectively.

[0285] It should be noted that the preparation method of the display panel 10 shown in FIGS. 17-19 is only schematically described by taking the photoelectric detector 8 in the display panel 10 as an example formed before the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3 in the display panel 10, but the order of forming the photoelectric detector 8, the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3 in the display panel 10 in the preparation method of the display panel 10 of the present disclosure includes but is not limited to this.

[0286] For example, the photoelectric detector 8 in the display panel 10 can be formed after the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3 in the display panel 10 are formed.

[0287] For another example, the photodetector 8 in the display panel 10 can be formed among the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3 formed in the display panel 10. That is, the photodetector 8 in the display panel 10 can be formed between the first color light emitting device F1 formed in the display panel 10 and the second color light emitting device F2. Alternatively, the photodetector 8 in the display panel 10 can be formed between the first color light emitting device F1 formed in the display panel 10 and the third color light emitting device F3. For another alternative, the photodetector 8 in the display panel 10 can be formed between the third color light emitting device F3 formed in the display panel 10 and the second color light emitting device F2.

[0288] It can be understood that, when the display panel 10 is prepared by using the preparation method of the display panel 10 shown in FIGS. 10-12 and FIGS. 17-19, the first opening K1 corresponding to the first color light emitting device F1, the first opening K1 corresponding to the second color light emitting device F2 and the first opening K1 corresponding to the third color light emitting device F3 in the first isolation structure 31, and the second opening K2 corresponding to the photodetector 8 are not formed synchronously.

[0289] For example, the second opening K2 corresponding to the photodetector 8 in the first isolation structure 31 can be formed before the photodetector 8, the second stack structure 52 adjacent to the photodetector 8, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the photodetector 8 and the second stack structure 52, and continuous in the region between the adjacent photodetector 8 and the second stack structure 52 are formed, and then the first color light emitting device F1, the first stack structure 51 adjacent to the first color light emitting device F1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the first color light emitting device F1 and the first stack structure 51, and continuous in the region between the adjacent first color light emitting device F1 and the first stack structure 51 are formed.

[0290] The first opening K1 corresponding to the first color light emitting device F1 in the first isolation structure 31 can be formed after the photodetector 8, the second stack structure 52 adjacent to the photodetector 8, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the photodetector 8 and the second stack structure 52, and continuous in the region between the adjacent photodetector 8 and the second stack structure 52 are formed, and before the first color light emitting device F1, the first stack structure 51 adjacent to the first color light emitting device F1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the first color light emitting device F1 and the first stack structure 51, and continuous in the region between the adjacent first color light emitting device F1 and the first stack structure 51 are formed.

[0291] The first opening K1 in the first isolation structure 31 corresponding to the second color light emitting device F2 can be formed after the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the first color light emitting device F1 and the first stack structure 51 adjacent to the first color light emitting device F1 and covering the first color light emitting device F1 and the first stack structure 51 and the region between the adjacent first color light emitting device F1 and the first stack structure 51, and before the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the second color light emitting device F2 and the first stack structure 51 adjacent to the second color light emitting device F2 and covering the second color light emitting device F2 and the first stack structure 51 and the region between the adjacent second color light emitting device F2 and the first stack structure 51.

[0292] The first opening K1 in the first isolation structure 31 corresponding to the third color light emitting device F3 can be formed after the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the second color light emitting device F2 and the first stack structure 51 adjacent to the second color light emitting device F2 and covering the second color light emitting device F2 and the first stack structure 51 and the region between the adjacent second color light emitting device F2 and the first stack structure 51, and before the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) formed on the third color light emitting device F3 and the first stack structure 51 adjacent to the third color light emitting device F3 and covering the third color light emitting device F3 and the first stack structure 51 and the region between the adjacent third color light emitting device F3 and the first stack structure 51.

[0293] Exemplarily, please continue to refer to FIG. 18 and FIG. 19, in the case that the first stack structure 51 comprises the third sub-portion 521 and the fourth sub-portion 522 arranged in sequence in the direction away from the substrate 1, since the photodetector 8 located in the second opening K2 and the second stack structure 52 located on the side of the first isolation structure 31 away from the substrate 1 are formed in the same process, the material of the third sub-portion 521 of the second stack structure 52 can be the same as that of the photoelectric conversion film layer 83 of the photodetector 8, and the material of the fourth sub-portion 522 of the second stack structure 52 can be the same as that of the fourth electrode 82 of the photodetector 8.

[0294] Exemplarily, please continue to refer to FIG. 18 and FIG. 19, when removing the portions of the photodetector film layer 8a and the first inorganic thin film 611a covering the regions other than the photodetector 8 region, the portions of the photodetector film layer 8a and the first inorganic thin film 611a covering the regions other than the photodetector 8 region can be removed by a photolithography process through steps of coating photoresist, exposure, development and etching, and the photodetector film layer 8a and the first inorganic thin film 611a in the photodetector 8 region are reserved to form the photodetector 8 located in the second opening K2, the second stack structure 52 located at the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the photodetector 8 and the second stack structure 52 and continuous in the regions between adjacent photodetectors 8 and second stack structures 52, respectively. In other embodiments, when the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3 in the display panel 10 are prepared by using the preparation method of the display panel 10 shown in FIG. 14 to FIG. 16, the step S7 to S9 are included when the photodetector 8 is formed in the display panel 10.

[0295] S7: As shown in FIG. 20, FIG. 20 is a structure diagram corresponding to step S7 in the preparation method of the display panel 10 according to some embodiments. The first isolation structure 31 is formed at one side of the substrate 1. The plurality of first openings K1 and the plurality of second openings K2 are formed in the first isolation structure 31.

[0296] S8: As shown in FIG. 21, FIG. 21 is a structure diagram corresponding to step S8 in the preparation method of the display panel 10 according to some embodiments. The photodetector film layer 8a and the first inorganic thin film 611a are sequentially formed on the substrate 1 formed with the plurality of second openings K2.

[0297] S9: As shown in FIG. 22, FIG. 22 is a structure diagram corresponding to step S9 in the preparation method of the display panel 10 according to some embodiments. The portions of the photodetector film layer 8a and the first inorganic thin film 611a covering the regions other than the photodetector 8 region are removed, and the photodetector film layer 8a and the first inorganic thin film 611a in the photodetector 8 region are reserved to form the photodetector 8 located in the second opening K2, the second stack structure 52 located at the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the photodetector 8 and the second stack structure 52 and continuous in the regions between adjacent photodetectors 8 and second stack structures 52, respectively.

[0298] It should be noted that the preparation method of the display panel 10 shown in FIGS. 20-22 is only illustratively described by taking the example that the photodetector 8 in the display panel 10 is formed before the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3 in the display panel 10 are formed, but the order of forming the photodetector 8, the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3 in the display panel 10 in the preparation method of the display panel 10 of the present disclosure includes but is not limited to this.

[0299] For example, the photodetector 8 in the display panel 10 can be formed after the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3 in the display panel 10 are formed.

[0300] For another example, the photodetector 8 in the display panel 10 can be formed among the first color light emitting device F1, the second color light emitting device F2 and the third color light emitting device F3 in the display panel 10. That is, the photodetector 8 in the display panel 10 can be formed between the formation of the first color light emitting device F1 and the formation of the second color light emitting device F2 in the display panel 10. Alternatively, the photodetector 8 in the display panel 10 can be formed between the formation of the first color light emitting device F1 and the formation of the third color light emitting device F3 in the display panel 10. Alternatively, the photodetector 8 in the display panel 10 can be formed between the formation of the third color light emitting device F3 and the formation of the second color light emitting device F2 in the display panel 10.

[0301] It can be understood that when the display panel 10 is prepared using the preparation method of the display panel 10 shown in FIGS. 14-16 and FIGS. 20-22, the first opening K1 corresponding to the first color light emitting device F1, the first opening K1 corresponding to the second color light emitting device F2 and the first opening K1 corresponding to the third color light emitting device F3 in the first isolation structure 31, and the second opening K2 corresponding to the photodetector 8 are formed synchronously.

[0302] Exemplarily, please continue to refer to FIG. 21 and FIG. 22, when removing the photoelectric detector film layer 8a and the part of the first inorganic film 611a covering the area other than the photoelectric detector 8 area, the photoelectric detector film layer 8a and the part of the first inorganic film 611a covering the area other than the photoelectric detector 8 area can be removed by a photoetching process through the steps of coating photoresist, exposure, development and etching, and the photoelectric detector film layer 8a and the first inorganic film 611a in the photoelectric detector 8 area are reserved to form the photoelectric detector 8 in the second opening K2, the second laminated structure 52 on the side of the first isolation structure 31 away from the substrate 1, and the first inorganic encapsulation layer 61 (specifically, the first encapsulation sub-layer 611 in the first inorganic encapsulation layer 61) covering the photoelectric detector 8 and the second laminated structure 52 and continuous in the area between adjacent photoelectric detectors 8 and second laminated structures 52, respectively.

[0303] The following describes in detail the specific steps of forming the photoelectric detector 8 in the display panel 10, where the second isolation structure 32 in the display panel 10 is provided with a plurality of second openings K2, and each photoelectric detector 8 is located in one second opening K2.

[0304] In some embodiments, as shown in FIG. 23, FIG. 23 is a structure diagram corresponding to step S10 in the preparation method of the display panel 10 according to some embodiments.

[0305] S10: After forming the second isolation structure 32 on one side of the substrate 1 and forming a plurality of second openings K2 in the second isolation structure 32, forming the photoelectric detector 8 in the second opening K2.

[0306] Exemplarily, when forming the photoelectric detector 8 in the second opening K2, the photoelectric detector 8 can be formed by evaporation in the second opening K2 through a fine metal mask (FMM) process.

[0307] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which shall be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel, comprising: a substrate; a first isolation structure located on one side of the substrate; the first isolation structure is provided with a plurality of first openings; the first isolation structure is light-transmissive; a plurality of light emitting devices, each of the light emitting devices is at least partially located in one of the first openings.

2. The display panel of claim 1, wherein, the first isolation structure comprises a first sub-layer, a second sub-layer and a third sub-layer which are sequentially stacked in a direction away from the substrate; an edge of the third sub-layer extends towards a direction close to the light emitting device adjacent to the second sub-layer compared with the second sub-layer; the light emitting device comprises a first electrode, a light emitting part and a second electrode which are sequentially stacked in a direction away from the substrate; the first sub-layer comprises a conductive material, the second electrodes of two adjacent light emitting devices are electrically connected through the first sub-layer.

3. The display panel of claim 2, wherein, an edge of the first sub-layer extends towards a direction close to the light emitting device adjacent to the second sub-layer compared with the second sub-layer; an edge of the light emitting part and the second sub-layer have a gap therebetween, an edge of the second electrode extends into the gap and contacts a surface of the first sub-layer away from the substrate.

4. The display panel of claim 2 or 3, wherein, the second sub-layer and the third sub-layer both comprise inorganic materials, and the material of the second sub-layer and the material of the third sub-layer are different. 5.The display panel according to any one of claims 1-4, further comprising: a second isolation structure located between the plurality of light emitting devices and the substrate; the second isolation structure is provided with a plurality of second openings; a plurality of photodetectors, each of the photodetectors is located in one of the second openings; in a projection onto the substrate, the photodetectors and the first isolation structure at least partially overlap.

6. The display panel of claim 5, wherein, in the projection onto the substrate, the second openings are located within a range of the first isolation structure.

7. The display panel of claim 5 or 6, wherein, in the projection onto the substrate, the second isolation structure and the light emitting devices at least partially overlap. 8.The display panel according to any one of claims 5-7, further comprising at least one insulating layer located between the plurality of photodetectors and the first isolation structure; the insulating layer is light-transmissive.

9. The display panel of claim 8, wherein, the at least one insulating layer comprises an inorganic insulating layer and a planar layer which are sequentially stacked in a direction away from the substrate.

10. The display panel according to any one of claims 1 to 9, wherein the light emitting device comprises a first electrode, a light emitting part and a second electrode which are sequentially stacked in a direction away from the substrate; the display panel further comprises a first laminated structure located on a side of the first isolation structure away from the substrate; the first laminated structure comprises a first sub-part and a second sub-part which are sequentially stacked in a direction away from the substrate, the material of the first sub-part is the same as the material of the light emitting part, and the material of the second sub-part is the same as the material of the second electrode; in the projection onto the substrate, two first laminated structures are arranged between two adjacent light emitting devices, and the two first laminated structures have a spacing in a first direction; the first direction is parallel to a line connecting centers of the two adjacent light emitting devices.

11. The display panel according to any one of claims 1 to 9, wherein the light emitting device comprises a first electrode, a light emitting part and a second electrode which are sequentially stacked in a direction away from the substrate; The display panel further comprises a first laminated structure located on a side of the first isolation structure away from the substrate; the first laminated structure comprises a first sub-part and a second sub-part sequentially stacked in a direction away from the substrate, the material of the first sub-part is the same as that of the light-emitting part, and the material of the second sub-part is the same as that of the second electrode; In the orthographic projection of the substrate, two first laminated structures are arranged between two adjacent light-emitting devices, and in the two first laminated structures, one first laminated structure covers at least part of the area of another first laminated structure.

12. The display panel according to any one of claims 1 to 11, wherein, The photoelectric detector comprises a third electrode, a photoelectric conversion film layer and a fourth electrode sequentially stacked in a direction away from the substrate; The fourth electrodes in adjacent photoelectric detectors are connected to each other to form a fourth electrode layer, and the fourth electrode layer covers the photoelectric conversion film layer and the second isolation structure.

13. A display panel, comprising: a substrate; a first isolation structure located on a side of the substrate; The first isolation structure is provided with a plurality of first openings and a plurality of second openings; The first isolation structure can block light; a plurality of light-emitting devices, each of which is at least partially located in one of the first openings; a plurality of photoelectric detectors, each of which is at least partially located in one of the second openings.

14. The display panel of claim 13, wherein, The photoelectric detector comprises a third electrode, a photoelectric conversion film layer and a fourth electrode sequentially stacked in a direction away from the substrate; The light-emitting device comprises a first electrode, a light-emitting part and a second electrode sequentially stacked in a direction away from the substrate; In adjacent light-emitting devices and photoelectric detectors, the second electrode of the light-emitting device and the fourth electrode of the photoelectric detector are electrically connected through the first isolation structure.

15. The display panel of claim 14, wherein, The first isolation structure comprises a first sub-layer and a second sub-layer sequentially stacked in a direction away from the substrate; the edge of the second sub-layer extends towards the direction close to the light-emitting device adjacent to the first sub-layer compared with the first sub-layer; The first sub-layer comprises a conductive material, and in adjacent light-emitting devices and photoelectric detectors, the second electrode of the light-emitting device and the fourth electrode of the photoelectric detector are electrically connected through the first sub-layer.

16. The display panel according to any one of claims 13 to 15, wherein, The first isolation structure comprises a first sub-layer and a second sub-layer sequentially stacked in a direction away from the substrate; The first sub-layer and the second sub-layer both comprise metal materials, and the materials of the first sub-layer and the second sub-layer are different.

17. The display panel according to any one of claims 13 to 16, wherein, The light-emitting device comprises a first electrode, a light-emitting part and a second electrode sequentially stacked in a direction away from the substrate; The photoelectric detector comprises a third electrode, a photoelectric conversion film layer and a fourth electrode sequentially stacked in a direction away from the substrate; The display panel further comprises: a first sub-layer and a second sub-layer are sequentially stacked in a direction away from the substrate, a material of the first sub-layer is the same as a material of the light-emitting part, and a material of the second sub-layer is the same as a material of the second electrode; a third sub-layer and a fourth sub-layer are sequentially stacked in a direction away from the substrate, a material of the third sub-layer is the same as a material of the photoelectric conversion film layer, and a material of the fourth sub-layer is the same as a material of the fourth electrode; in a projection onto the substrate, two first stacked structures are arranged between two adjacent light-emitting devices, and the two first stacked structures have a spacing in a first direction; and / or, in a projection onto the substrate, two second stacked structures are arranged between two adjacent photoelectric detectors, and the two second stacked structures have a spacing in the first direction; and / or, in a projection onto the substrate, one first stacked structure and one second stacked structure are arranged between the photoelectric detector and the light-emitting device, and the one first stacked structure and the one second stacked structure have a spacing in the first direction.

18. The display panel according to any one of claims 13 to 16, wherein, the light-emitting device comprises a first electrode, a light-emitting part, and a second electrode which are sequentially stacked in a direction away from the substrate; the photoelectric detector comprises a third electrode, a photoelectric conversion film layer, and a fourth electrode which are sequentially stacked in a direction away from the substrate; the display panel further comprises: a first sub-layer and a second sub-layer are sequentially stacked in a direction away from the substrate, a material of the first sub-layer is the same as a material of the light-emitting part, and a material of the second sub-layer is the same as a material of the second electrode; a third sub-layer and a fourth sub-layer are sequentially stacked in a direction away from the substrate, a material of the third sub-layer is the same as a material of the photoelectric conversion film layer, and a material of the fourth sub-layer is the same as a material of the fourth electrode; in a projection onto the substrate, two first stacked structures are arranged between two adjacent light-emitting devices, and in the two first stacked structures, one first stacked structure covers at least a partial region of another first stacked structure; and / or, in a projection onto the substrate, two second stacked structures are arranged between two adjacent photoelectric detectors, and in the two second stacked structures, one second stacked structure covers at least a partial region of another second stacked structure; And / or, in the orthographic projection onto the substrate, one of the first stack structure and the second stack structure is arranged between adjacent photodetectors and light emitting devices, and at least covers part of the area of the other.

19. The display panel of any one of claims 13-18, further comprising: a black matrix layer provided with a plurality of third openings, each of the third openings being in communication with one of the first openings; an orthographic projection of the black matrix layer onto the substrate at least partially overlaps with an orthographic projection of the first isolation structure onto the substrate, and the black matrix layer and the first isolation structure have a spacing in a direction perpendicular to the substrate.

20. A display device, comprising: the display panel of any one of claims 1-19; a cover plate located at the light exit side of the display panel.

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