Foldable electronic device comprising impedance circuit and switch circuit

Abstract

This foldable electronic device comprises: a foldable housing including a first housing part, a second housing part, and a third housing part; and a flexible display. The first housing part comprises: a bracket; a plate disposed between the bracket and the rear surface of the first housing part; a printed circuit board disposed on the bracket; an impedance circuit disposed on the printed circuit board; and a switch circuit disposed on the printed circuit board. The switch circuit is configured to electrically connect the plate and the impedance circuit on the basis of the state of the foldable electronic device.

Description

Foldable electronic device including impedance circuit and switch circuit

[0001] The present disclosure relates to a foldable electronic device including an impedance circuit and a switch circuit.

[0002] A foldable electronic device may include housing parts that are rotatably coupled and a flexible display. Depending on the rotation of the housing parts, a portion of the flexible display may bend. When the electronic device is fully folded, the housing parts of the electronic device may overlap each other. The foldable electronic device may include brackets configured to function as a ground for the foldable electronic device. For example, a first housing part may include a bracket corresponding to the ground of the foldable electronic device. The brackets may include a metal material, and each bracket may be an electrically conductive structure. Therefore, when the brackets face each other, parasitic components (e.g., parasitic capacitance) may be formed between the brackets. These parasitic components may deteriorate the performance of an electronic device including an antenna.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] A foldable electronic device is described. The foldable electronic device may include a foldable housing including a first housing part, a second housing part configured to rotate relative to the first housing part, and a third housing part configured to rotate relative to the second housing part. A multi-folded state of the foldable electronic device may have a front side of the second housing part facing the front side of the first housing part and a front side of the third housing part facing the rear side of the first housing part. The foldable electronic device may include a flexible display including a first part defining a portion of the front side of the first housing part, a second part defining a portion of the front side of the second housing part, and a third part defining a portion of the front side of the third housing part. The first housing part may include a bracket corresponding to the ground of the first housing part, a plate disposed between the bracket of the first housing part and the rear surface of the first housing part, a printed circuit board disposed on the bracket, an impedance circuit disposed on the printed circuit board, and a switch circuit disposed on the printed circuit board. The switch circuit may be configured to electrically connect the impedance circuit and the plate based on a state of the foldable electronic device.

[0005] A foldable electronic device is described. The foldable electronic device may include a foldable housing comprising a first housing part, a second housing part configured to rotate relative to the first housing part, and a third housing part configured to rotate relative to the second housing part. A multi-folded state of the foldable electronic device may have a rear surface of the first housing part facing a rear surface of the second housing part and a front surface of the third housing part facing a front surface of the second housing part. The foldable electronic device may include a flexible display comprising a first portion defining a portion of the front surface of the first housing part, a second portion defining a portion of the front surface of the second housing part, and a third portion defining a portion of the front surface of the third housing part. The first housing part may include a bracket corresponding to a ground of the first housing part, a plate disposed between the bracket and the rear surface of the first housing part, a printed circuit board disposed on the bracket, a contact disposed on the printed circuit board and configured to electrically connect the printed circuit board and the plate, an impedance circuit disposed on the printed circuit board, and a switch circuit disposed on the printed circuit board. The switch circuit may be configured to electrically disconnect the impedance circuit from the plate electrically connected to the printed circuit board through the contact when the foldable electronic device is in an unfolded state. The switch circuit may be configured to electrically connect the impedance circuit to the plate electrically connected to the printed circuit board through the contact when the foldable electronic device is in the multi-folded state.

[0006] The subject matter of the present disclosure may best be understood by reference to the accompanying drawings, in which:

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] FIG. 2a illustrates an example of a first state of an electronic device.

[0009] FIG. 2b illustrates an example of a second state of an electronic device.

[0010] FIG. 2c illustrates an example of a third state of an electronic device.

[0011] FIG. 3a is a plan view of an electronic device with the flexible display removed.

[0012] FIG. 3b is a rear view of an electronic device with the rear cover and display removed.

[0013] Figure 4 illustrates a multi-folded state of a foldable electronic device.

[0014] FIG. 5 shows the efficiency according to the frequency of the antenna of a foldable electronic device according to one embodiment.

[0015] FIG. 6 is a block diagram showing the components of a foldable electronic device according to one embodiment.

[0016] FIG. 7 illustrates the interior of a first housing part according to one embodiment.

[0017] FIG. 8 is an exploded perspective view of the first housing part of FIG. 7.

[0018] FIG. 9 is a flowchart showing the operation of a switch circuit of a foldable electronic device according to one embodiment.

[0019] FIG. 10 illustrates the upper part of a first housing part of a foldable electronic device according to one embodiment.

[0020] FIG. 11 is an exploded view of the fourth bracket of FIG. 10.

[0021] FIG. 12 is a plan view of the fourth bracket of FIG. 10.

[0022] FIG. 13 is a cross-sectional view of a foldable electronic device according to one embodiment taken along line AA' of FIG. 10.

[0023] Figures 14 and 15 illustrate the plate.

[0024] FIG. 16 illustrates the lower portion of a first housing part of a foldable electronic device according to one embodiment.

[0025] FIG. 17 is a graph showing the efficiency of an antenna of a foldable electronic device according to a frequency according to one embodiment.

[0026] FIG. 18 illustrates a foldable electronic device according to one embodiment.

[0027] FIG. 19 is a cross-sectional view of a foldable electronic device according to one embodiment, taken along line BB' of FIG. 18.

[0028] FIG. 20a illustrates an example of a first state of an electronic device.

[0029] FIG. 20b illustrates an example of a second state of an electronic device.

[0030] FIG. 20c illustrates an example of a third state of an electronic device.

[0031] Figure 21 illustrates the interior of a first housing part according to one embodiment.

[0032] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0033] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0035] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0048] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2a illustrates an example of a first state of an electronic device. FIG. 2b illustrates an example of a second state of an electronic device. FIG. 2c illustrates an example of a third state of an electronic device.

[0056] Referring to FIGS. 2A, 2B, and 2C, a foldable electronic device (200) may include a foldable housing (201), a flexible display (240), a first hinge assembly (250), a second hinge assembly (260), and a display (270). The foldable housing (201) may include a first housing part (210), a second housing part (220), and a third housing part (230).

[0057] In one embodiment, the first housing part (210) can be rotatably coupled to the second housing part (220) by the first hinge assembly (250). The second housing part (220) and the first housing part (210) can be rotated relative to the first hinge assembly (250). While the first housing part (210) is rotated relative to the first hinge assembly (250), the second housing part (220) can be rotated relative to the first hinge assembly (250). For example, when the second housing part (220) and the first housing part (210) are rotated relative to the first hinge assembly (250), the angular displacement of the second housing part (220) can be substantially equal to the angular displacement of the first housing part (210).

[0058] According to one embodiment, the third housing part (230) can be rotatably coupled to the second housing part (220) by a second hinge assembly (260). The second housing part (220) and the third housing part (230) can be rotated relative to the second hinge assembly (260). While the second housing part (220) is rotated relative to the second hinge assembly (260), the third housing part (230) can be rotated relative to the second hinge assembly (260). For example, when the second housing part (220) and the third housing part (230) are rotated relative to the second hinge assembly (260), the angular displacement (or angular change) of the second housing part (220) can be substantially equal to the angular displacement of the third housing part (230).

[0059] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) can change the state of the electronic device. The first hinge assembly (250) and the second hinge assembly (260) can provide (or enable) a first state (200a) of the foldable electronic device (200) (or a first state (200a) of the foldable housing (201)). The first state (200a) of the foldable electronic device (200) (or the first state (200a) of the foldable housing (201)) can be referred to as an unfolded state of the foldable electronic device (200) (or the foldable housing (201)). Within the first state (200a), the front surface of the first housing part (210), the front surface of the second housing part (220), and the front surface of the third housing part (230) can define the front surface of the foldable electronic device (200). Within the first state (200a), the front surface of the first housing part (210), the front surface of the second housing part (220), and the front surface of the third housing part (230) can face the same direction. Within the first state (200a), the foldable electronic device (200) can provide a large display area of ​​the flexible display (240) to the user.

[0060] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) can provide a second state (200b) of the foldable electronic device (200). The second state (200b) of the foldable electronic device (200) can be referred to as a state in which the foldable electronic device (200) is partially folded and partially unfolded (or a single folded state or a half folded state). For example, within the second state (200b), the front surface of the second housing part (220) and the front surface of the third housing part (230) can face the same direction, and the front surface of the first housing part (210) and the front surface of the second housing part (220) can face opposite directions. For example, within the second state (200b), the first housing part (210) and the second housing part (220) can be folded, and the second housing part (220) and the third housing part (230) can be unfolded. Within the second state (200b), the foldable electronic device (200) can provide visual information through a portion of the flexible display (240) (e.g., the third display area (240c)).

[0061] A foldable electronic device (200) according to one embodiment can change from a first state (200a) to a third state (200c) through a second state (200b). The foldable electronic device (200) can change from a first state (200a) that is an unfolded state to a second state (200b) that is a partially unfolded state. For example, the foldable electronic device (200) can change from a first state (200a) in which a first housing part (210), a second housing part (220), and a third housing part (230) face the same direction, to a second state (200b) in which a front side of the first housing part (210) faces a front side of the second housing part (220). The foldable electronic device (200) can change from a second state (200b) that is a partially unfolded state to a third state (200c) that is a folded state. For example, when changing from the second state (200b) to the third state (200c), the folded first housing part (210) and the second housing part (220) may be placed on the third housing part (230). The third state (200c) may be referred to as a multi-folded state.

[0062] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) can provide a third state (200c) of the foldable electronic device (200) (or a third state (200c) of the foldable housing (201)). The third state (200c) of the foldable electronic device (200) (or the third state (200c) of the foldable housing (201)) can be described as a folded state (or a multi-folded state) of the foldable electronic device (200) (or the foldable housing (201)). Within the third state (200c), the front surface of the first housing part (210) and the front surface of the second housing part (220) can face opposite directions, and the front surface of the second housing part (220) and the front surface of the third housing part (230) can face opposite directions. Within the third state (200c), the front of the first housing part (210) and the front of the third housing part (230) may face the same direction. For example, within the third state (200c), the front of the second housing part (220) may face the front of the first housing part (210), and the front of the third housing part (230) may face the rear of the first housing part (210). Within the third state (200c), the rear of the second housing part (220) may be exposed to the outside. The display (270) may be disposed on the rear of the second housing part (220). Within the third state (200c), the rear of the third housing part (230) may be exposed to the outside. The camera (275) may be disposed on the rear of the third housing part (230). Within the third state (200c), the foldable electronic device (200) can be folded to improve portability and provide visual information through a display (270) disposed on the rear of the second housing part (220).

[0063] A foldable electronic device (200) according to one embodiment may further include a key button (239). The key button (239) may be exposed from a structure (e.g., an opening) formed on the side of the third housing part (230) and may partially protrude outside the foldable electronic device (200). The key button (239) may provide physical input to a processing circuit inside the foldable electronic device (200) by pressure transmitted from the outside. The key button (239) may not be included in the foldable electronic device (200) and may be implemented in another form, such as a soft key displayed on a flexible display (240) or a display (270).

[0064] According to one embodiment, the key button (239) may be positioned on the side of the third housing part (230) so as to be exposed to the outside in the third state (200c). As the key button (239) is positioned on the side of the third housing part (230), it may be positioned in the direction in which the side of the third housing part (230) faces. Even if the foldable electronic device (200) is changed to the first state (200a) by a user looking at the display (270) in the third state (200c), the position of the key button (239) positioned on the side of the third housing part (230) may not be moved. For example, referring to FIG. 2a, in the first state (200a), when the flexible display (240) is viewed from above, the key button (239) may be positioned on the right side. Referring to FIG. 2c, in the third state (200c), when viewing the display (270) from above, the key button (239) can be positioned on the right.

[0065] According to one embodiment, the flexible display (240) can at least partially define the exterior appearance of the foldable electronic device (200). The flexible display (240) can be partially disposed within the foldable housing (201). The flexible display (240) can define the front surface of the foldable electronic device (200). The flexible display (240) can include a first portion (241), a second portion (242), a third portion (243), a first bendable portion (244), and a second bendable portion (245). The first portion (241) of the flexible display (240) can be disposed on the front surface of the first housing part (210). The second portion (242) of the flexible display (240) can be disposed on the front surface of the second housing part (220). The third part (243) of the flexible display (240) may be disposed on the front side of the third housing part (230). The first bendable part (244) of the flexible display (240) may be disposed between the first part (241) and the third part (243) of the flexible display (240). For example, the first bendable part (244) of the flexible display (240) may be disposed on the first hinge assembly (250) connecting the first housing part (210) and the second housing part (220). The second bendable part (245) of the flexible display (240) may be disposed between the second part (242) and the third part (243) of the flexible display (240). For example, the second bendable portion (245) of the flexible display (240) may be placed on a second hinge assembly (260) connecting the second housing part (220) and the third housing part (230).

[0066] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) can provide a first state (200a) of the foldable electronic device (200). In the first state (200a), the first part (241) of the flexible display (240), the second part (242) of the flexible display (240), and the third part (243) of the flexible display (240) may face substantially the same direction. In the first state (200a), the first bendable part (244) and the second bendable part (245) may be positioned in substantially the same horizontal plane as the first part (241), the second part (242), and the third part (243).

[0067] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) may provide a second state (200b) of the foldable electronic device (200). In the second state (200b), the first part (241) of the flexible display (240) may face the second part (242) of the flexible display (240), and the third part (243) of the flexible display (240) may face the same direction as the second part (242) of the flexible display (240). For example, the second part (242) and the third part (243) may be positioned substantially on the same horizontal plane.

[0068] According to one embodiment, in a second state (200b), the first bendable portion (244) of the flexible display (240) is bent by the first hinge assembly (250), so that the first bendable portion (244) of the flexible display (240) can be folded such that the first portion (241) of the flexible display (240) and the second portion (242) of the flexible display (240) face in different directions.

[0069] According to one embodiment, in the second state (200b), the second bendable portion (245) of the flexible display (240) is maintained in an unfolded state by the second hinge assembly (260), so that the second bendable portion (245) of the flexible display (240) can unfold so that the second portion (242) of the flexible display (240) and the third portion (243) of the flexible display (240) face the same direction.

[0070] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) can provide a third state (200c) of the foldable electronic device (200). Within the third state (200c), the second part (242) of the flexible display (240) can face the first part (241) of the flexible display (240), and the third part (243) of the flexible display (240) can face the back of the first housing part (210).

[0071] According to one embodiment, within the third state (200c), the first bendable portion (244) of the flexible display (240) is bent by the first hinge assembly (250), so that the first bendable portion (244) of the flexible display (240) can be folded such that the first portion (241) of the flexible display (240) and the second portion (242) of the flexible display (240) face different directions.

[0072] According to one embodiment, in a third state (200c), the second bendable portion (245) of the flexible display (240) is bent by the second hinge assembly (260), so that the second bendable portion (245) of the flexible display (240) can be folded such that the second portion (242) of the flexible display (240) and the third portion (243) of the flexible display (240) face in different directions. The second bendable portion (245) may further include a first deformation portion (245a), a second deformation portion (245b), and a flat portion (245c). The first deformation portion (245a) may be positioned between the flat portion (245c) and the second portion (242), and the second deformation portion (245b) may be positioned between the flat portion (245c) and the third portion (243). The flat portion (245c) may be positioned between the first deformation portion (245a) and the second deformation portion (245b). The flat portion (245c) may be supported by a support plate (e.g., the support plate (364) of FIG. 3a) that is distinct from the hinge plates of the second hinge assembly (260) (e.g., the third hinge plate (362) and the fourth hinge plate (363) of FIG. 3a). Regardless of the state of the foldable electronic device (200), the flat portion (245c) may remain flat. The first deformation part (245a) and the second deformation part (245b) are unfolded in the first state (200a) and the second state (200b), and in the third state (200c), the first deformation part (245a) and the second deformation part (245b) can be bent so that the second part (242) and the third part (243) face different directions. In the third state (200c), the first housing part (210) can be positioned between the second housing part (220) and the third housing part (230). In the third state (200c), the second bendable part (245) of the flexible display (240) positioned on the second hinge assembly (260) can be partially facing the side (210c) of the first housing part (210).

[0073] According to one embodiment, the display area of ​​the flexible display (240) may include a first display area (240a), a second display area (240b), and a third display area (240c). The display area represents an area that can provide visual information from the flexible display (240). In the first state (200a), the entire display area of ​​the flexible display (240) may be visible from the front of the foldable housing (201). For example, in the first state (200a), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be visually exposed. The foldable electronic device (200) may provide a user with a large display area that includes the first display area (240a), the second display area (240b), and the third display area (240c).

[0074] According to one embodiment, in the second state (200b), the display area of ​​the flexible display (240) may be partially visible from the front of the third housing part (230). For example, the third display area (240c) may be visually exposed, while the first display area (240a) and the second display area (240b) may not be visually exposed.

[0075] According to one embodiment, in the third state (200c), the display area of ​​the flexible display (240) may not be visible. For example, in the third state (200c), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may not be visually exposed.

[0076] As a non-limiting example, when the flexible display (240) is used to display a screen within a first state (200a) of the foldable electronic device (200), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be activated. As a non-limiting example, within a third state (200c), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) may be deactivated. As a non-limiting example, in the second state (200b) of the foldable electronic device (200), when the flexible display (240) is used to display a screen, the third display area (240c) may be activated, and the first display area (240a) and the second display area (240b) of the flexible display (240) may be deactivated.

[0077] As a non-limiting example, when the flexible display (240) is used to display a screen within a first state (200a) of the foldable electronic device (200), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) can display visual information. As a non-limiting example, within the third state (200c), the first display area (240a), the second display area (240b), and the third display area (240c) of the flexible display (240) can provide a black image. As a non-limiting example, when the flexible display (240) is used to display a screen in the second state (200b) of the foldable electronic device (200), the third display area (240c) may provide visual information, and the first display area (240a) and the second display area (240b) of the flexible display (240) may provide a black image.

[0078] Figure 3a is a plan view of an electronic device with the flexible display removed. Figure 3b is a rear view of the electronic device with the back cover and display removed.

[0079] Referring to FIGS. 3A and 3B , the foldable electronic device (200) may include a first hinge assembly (250) and a second hinge assembly (260). A first width (w1) of the first hinge assembly (250) may be narrower than a second width (w2) of the second hinge assembly (260). A difference between the first width (w1) of the first hinge assembly (250) and the second width (w2) of the second hinge assembly (260) may be equal to or greater than a thickness of the first housing part (210). For example, the second hinge assembly (260) may have a second width (w2) that is wider than the first width (w1) such that the first housing part (210) is disposed between the second housing part (220) and the third housing part (230) according to the third state (200c). The first hinge assembly (250) may be referred to as a narrow hinge structure in that it has a narrower width than the second hinge assembly (260). The second hinge assembly (260) may be referred to as a wide hinge structure in that it has a wider width than the first hinge assembly (250).

[0080] According to one embodiment, the first hinge assembly (250) may include a first set of gears (351), a first hinge plate (352), and a second hinge plate (353). The first hinge plate (352) may be coupled to a first bracket (211) of the first housing part (210). The second hinge plate (353) may be coupled to a second bracket (221) of the second housing part (220). The gears (g11, g12, g13, g14) included in the first set of gears (351) may be configured to rotate the first hinge plate (352) and the second hinge plate (353). For example, the gears (g11, g12, g13, g14) included in the first set of gears (351) can rotate the second hinge plate (353) (or the second housing part (220)) in conjunction with the rotation of the first hinge plate (352) (or the first housing part (210)). After the first hinge plate (352) (or the first housing part (210)) is rotated, the gears (g11, g12, g13, g14) included in the first set of gears (351) can be rotated in accordance with the rotation of the first hinge plate (352) (or the first housing part (210)). The second hinge plate (353) (or the second housing part (220)) can be rotated in conjunction with the rotation of the first hinge plate (352) according to the rotation of the gears included in the first set of gears (351). The gears (g11, g12, g13, g14) included in the first set of gears (351) can include a first gear (g11), a second gear (g12), a third gear (g13), and a fourth gear (g14). The first gear (g11) can be arranged adjacent to the first hinge plate (352), and the fourth gear (g14) can be arranged adjacent to the second hinge plate (353). The second gear (g12) and the third gear (g13) can be arranged between the first gear (g11) and the fourth gear (g14).The first gear (g11), the second gear (g12), the third gear (g13), and the fourth gear (g14) can be sequentially meshed. According to the rotation of the first gear (g11) in the first rotation direction (e.g., clockwise), the second gear (g12) meshed with the first gear (g11) can be rotated in the second rotation direction (e.g., counterclockwise) opposite to the first rotation direction. According to the rotation of the second gear (g12) in the second rotation direction, the third gear (g13) meshed with the second gear (g12) can be rotated in the first rotation direction. According to the rotation of the third gear (g13) in the first rotation direction, the fourth gear (g14) can be rotated in the second rotation direction. As the first gear (g11) and the fourth gear (g14) rotate in different directions, the first housing part (210) connected to the first hinge plate (352) and the second housing part (220) connected to the second hinge plate (353) can be folded or unfolded.

[0081] According to one embodiment, the second hinge assembly (260) may include a second set of gears (361), a third hinge plate (362), a fourth hinge plate (363), and a support plate (364). The third hinge plate (362) may be coupled to a second bracket (221) of the second housing part (220). The fourth hinge plate (363) may be coupled to a third bracket (231) of the third housing part (230). The gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) may be configured to rotate the third hinge plate (362) and the fourth hinge plate (363). For example, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) can rotate the fourth hinge plate (363) (or the third housing part (230)) in conjunction with the rotation of the third hinge plate (362) (or the second housing part (220)). After the third hinge plate (362) (or the second housing part (220)) is rotated, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) can be rotated in accordance with the rotation of the third hinge plate (362) (or the second housing part (220)). The fourth hinge plate (363) (or the third housing part (230)) can be rotated in conjunction with the rotation of the third hinge plate (362) according to the rotation of the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361).

[0082] According to one embodiment, the gears (g21, g22, g23, g24, g25, g26) included in the second set of gears (361) may include a first gear (g21), a second gear (g22), a third gear (g23), a fourth gear (g24), a fifth gear (g25), and a sixth gear (g26). The first gear (g21) may be arranged adjacent to the third hinge plate (362), and the sixth gear (g26) may be arranged adjacent to the fourth hinge plate (363). The second gear (g22), the third gear (g23), the fourth gear (g24), and the fifth gear (g25) may be arranged between the first gear (g21) and the sixth gear (g26). The first gear (g21), second gear (g22), third gear (g23), fourth gear (g24), fifth gear (g25), and sixth gear (g26) can be engaged sequentially. Depending on the first rotational direction (e.g., clockwise) of the first gear (g21), the second gear (g22) engaged with the first gear (g21) can be rotated in a second rotational direction (e.g., counterclockwise) opposite to the first rotational direction. Depending on the second rotational direction of the second gear (g22), the third gear (g23) engaged with the second gear (g22) can be rotated in the first rotational direction. Depending on the first rotational direction of the third gear (g23), the fourth gear (g24) can be rotated in the second rotational direction. As the fourth gear (g24) rotates in the second rotation direction, the fifth gear (g25) meshed with the fourth gear (g24) can rotate in the first rotation direction. As the fifth gear (g25) rotates in the first rotation direction, the sixth gear (g26) meshed with the fifth gear (g25) can rotate in the second rotation direction. As the first gear (g21) and the sixth gear (g26) rotate in different directions, the second housing part (220) connected to the third hinge plate (362) and the third housing part (230) connected to the fourth hinge plate (363) can be folded or unfolded.

[0083] According to one embodiment, the first hinge assembly (250) and the second hinge assembly (260) may further include a spiral structure. The spiral structure may include a spiral groove formed in each hinge plate or a rotating member connected to the hinge plate, and a moving member sliding along the spiral groove. The hinge plates connected to the hinge assembly may be configured to rotate at substantially the same angular displacement through the spiral structure.

[0084] A foldable electronic device (200) according to one embodiment may include a first printed circuit board (371), a second printed circuit board (372), and a third printed circuit board (373).

[0085] According to one embodiment, a first printed circuit board (371) may be disposed on a first bracket (211) of a first housing part (210). Hardware components within the first housing part (210) may be disposed on the first printed circuit board (371). A second printed circuit board (372) may be disposed on a second bracket (221) of a second housing part (220). A third printed circuit board (373) may be disposed on a third bracket (231) of a third housing part (230). Hardware components within the third housing part (230) may be disposed on the third printed circuit board (373).

[0086] According to one embodiment, a hardware component disposed on a first printed circuit board (371) may support or operate independently of a hardware component disposed on a second printed circuit board (372) and / or a hardware component disposed on a third printed circuit board (373).

[0087] According to one embodiment, the hardware components disposed on the second printed circuit board (372) may support or operate independently of the hardware components disposed on the first printed circuit board (371) or the third printed circuit board (373). The hardware components disposed on the second printed circuit board (372) may include a speaker, a front camera, and / or a display driving circuit.

[0088] According to one embodiment, the hardware components disposed on the third printed circuit board (373) may include at least one processor including a processing circuit (e.g., an application processor (AP), a communication processor (CP)), a memory including one or more storage media, a communication circuit, and a rear camera (275). The rear camera (275) may be exposed through a structure (e.g., an opening) on ​​the rear of the third housing part (230).

[0089] According to one embodiment, a foldable electronic device (200) may further include a sub-printed circuit board (375) and flexible printed circuit boards (380, 390). The sub-printed circuit board (375) may be disposed on at least some of the first housing part (210), the second housing part (220), and the third housing part (230). The flexible printed circuit boards (380, 390) may include a first flexible printed circuit board (380) and a second flexible printed circuit board (390). The first flexible printed circuit board (380) may electrically connect the printed circuit boards disposed on each of the housing parts (210, 220, 230). The second flexible printed circuit board (390) may connect the sub-printed circuit board (375) to a printed circuit board within the housing part in which the sub-printed circuit board (375) is disposed.

[0090] Components within the foldable electronic device (200) may be connected to at least one processor within the third printed circuit board (373) via flexible printed circuit boards (380, 390). For example, a signal received from an antenna disposed in the third housing part (230) may be transmitted to the third printed circuit board (373) on which at least one processor (e.g., an AP or CP) is disposed via a signal path (a) provided by the first flexible printed circuit board (380). A driving circuit for the flexible display (240) disposed within the first housing part (210) may be connected to the third printed circuit board (373) on which at least one processor (e.g., an AP) is disposed via a signal path (b) provided by the sub-printed circuit board (375) and the first flexible printed circuit board (380). A driving circuit for a display (270) connected to a sub-printed circuit board (375) disposed on a second housing part (230) can be electrically connected to a third printed circuit board (373) on which at least one processor (e.g., AP) is disposed via a signal path (c) provided by the sub-printed circuit board (375) and the first flexible printed circuit board (380) and the second flexible printed circuit board (390).

[0091] A foldable electronic device (200) according to one embodiment may further include batteries. Each of the batteries may be attached to brackets (211, 221, 231) included in housing parts (210, 220, 230). The brackets (211, 221, 231) may support rechargeable batteries.

[0092] The arrangement of hardware components is exemplary, and differently from the above, the rear camera (275) and the second printed circuit board (372) may be arranged in the third housing part (230), and the third printed circuit board (373) may be arranged in the second housing part (220).

[0093] Although the first housing part (210) and the third housing part (230) are shown as rotating in opposite directions with respect to the second housing part (220), this is not limited thereto. For example, during the change from the first state (200a) to the third state (200c), the first housing part (210) may rotate counterclockwise with respect to the second housing part (220), and the third housing part (230) may rotate counterclockwise with respect to the second housing part (220). As the first housing part (210) and the third housing part (230) rotate in the same direction, a portion of the display area of ​​the flexible display (240) within the second state may be visually exposed.

[0094] The foldable electronic device (200) described below may be referred to as the foldable electronic device (200) described with reference to FIGS. 2A to 3B. In the descriptions below, the same reference numerals are assigned to the same components as those described above, and redundant descriptions may be omitted.

[0095] Fig. 4 illustrates a multi-folded state of a foldable electronic device. Fig. 5 illustrates the efficiency of an antenna of a foldable electronic device according to an embodiment of the present invention as a function of frequency.

[0096] Referring to FIG. 4, the foldable electronic device (200) may be in a multi-folded state (e.g., the third state (200c) of FIG. 2c). As illustrated in FIG. 4, in the multi-folded state of the foldable electronic device (200), the first housing part (210) may be positioned between the second housing part (220) and the third housing part (230).

[0097] According to one embodiment, the multi-folded state of the foldable housing (201) may have a front side (402) of the second housing part (220) facing the front side (401) of the first housing part (210) and a front side (403) of the third housing part (230) facing the rear side (404) of the first housing part (210). For example, within the multi-folded state of the foldable electronic device (200), the front side (401) of the first housing part (210) and the front side (402) of the second housing part (220) may face each other, and the rear side (404) of the first housing part (210) and the front side (403) of the third housing part (230) may face each other.

[0098] According to one embodiment, the flexible display (240) may define at least a portion of the front surface of the foldable housing (201). As described above, the flexible display (240) may include a first portion (241), a second portion (242), and a third portion (243). For example, the first portion (241) of the flexible display (240) may define at least a portion of the front surface (401) of the first housing part (210). For example, the second portion (242) of the flexible display (240) may define at least a portion of the front surface (402) of the second housing part (220). For example, the third portion (243) of the flexible display (240) may define at least a portion of the front surface (403) of the third housing part (230). Within the multi-folded state of the foldable electronic device (200), the first part (241) of the flexible display (240) and the second part (242) of the flexible display (240) may face each other. The third part (243) of the flexible display (240) may face the rear surface (404) of the first housing part (210).

[0099] According to one embodiment, a foldable electronic device (200) may include brackets corresponding to the ground of the foldable electronic device (200). For example, a first housing part (210) may include a first bracket (e.g., a first bracket (211) of FIG. 3B) corresponding to the ground of the first housing part (210). For example, a second housing part (220) may include a second bracket (e.g., a second bracket (221) of FIG. 3B) corresponding to the ground of the second housing part (220). For example, a third housing part (230) may include a third bracket (e.g., a third bracket (231) of FIG. 3B) corresponding to the ground of the third housing part (230). The first bracket (211), the second bracket (221), and the third bracket (231) may include a metal material. The first bracket (211) may be arranged within the first housing part (210) and configured to function as a ground for the first housing part (210). The second bracket (221) may be arranged within the second housing part (220) and configured to function as a ground for the second housing part (220). The third bracket (231) may be arranged within the third housing part (230) and configured to function as a ground for the third housing part (230). Each of the above brackets may be referred to as a conductive bracket, a conductive plate, or a conductive support member.

[0100] As illustrated in FIG. 4, within the multi-folded state of the foldable electronic device (200), the first bracket (211), the second bracket (221), and the third bracket (231) may overlap each other. For example, within the multi-folded state of the foldable electronic device (200), the second bracket (221) within the second housing part (220) may face the first bracket (211) within the first housing part (210), and the third bracket (231) within the third housing part (230) may face the first bracket (211) within the first housing part (210).

[0101] Some of the first bracket (211), the second bracket (221), and the third bracket (231) may be conductive because they include a metal material. When the conductive materials face each other, a parasitic effect may occur. For example, parasitic capacitance formed between the conductive materials facing each other may cause distortion of radio frequency (RF) signals transmitted and / or received through the antenna of the foldable electronic device (200). For example, when parasitic components formed in the first bracket (211), the second bracket (221), and the third bracket (231) at least partially overlap with the frequency band of RF signals, it may cause deterioration of the communication performance of the foldable electronic device (200).

[0102] The graph (500) of FIG. 5 shows the efficiency of an antenna (e.g., the antenna module (197) of FIG. 1) of a foldable electronic device (e.g., the foldable electronic device (200) of FIG. 4) according to frequency. The x-axis of the graph (500) represents the frequency (unit: MHz (megahertz)), and the y-axis of the graph (500) represents the efficiency of the antenna (unit: dB (decibel)). The first graph (501) shows the efficiency of the antenna according to frequency when the foldable electronic device (200) is in an unfolded state (e.g., the first state (200a) of FIG. 2a). The second graph (502) shows the efficiency of the antenna according to frequency when the foldable electronic device (200) is in a multi-folded state.

[0103] Referring to the graph (500) of FIG. 5, parasitic components formed in the first bracket (e.g., the first bracket (211) of FIG. 4), the second bracket (e.g., the second bracket (221) of FIG. 4), and the third bracket (e.g., the third bracket (231) of FIG. 4) can affect RF signals within the low band. Comparing the first graph (501) and the second graph (502), the second graph (502) exhibits significantly lower efficiency than the first graph (501) at frequencies around 700 MHz and around 900 MHz. When the foldable electronic device (200) is in a multi-folded state, parasitic components formed in the first bracket (211), the second bracket (221), and the third bracket (231) facing each other may affect an RF signal having a frequency of about 700 MHz and / or an RF signal having a frequency of about 900 MHz. For example, when a parasitic resonance due to parasitic components is formed at about 700 MHz or about 900 MHz, the efficiency of the antenna for an RF signal having a frequency of about 700 MHz or an RF signal having a frequency of about 900 MHz may be reduced. As the efficiency of the antenna is reduced, the communication performance of the foldable electronic device (200) may be degraded.

[0104] By controlling the capacitance formed between the first bracket (211), the second bracket (221), and the third bracket (231), the degradation of the communication performance of the foldable electronic device (200) can be reduced.

[0105] Referring again to FIG. 4, within the multi-folded state of the foldable electronic device (200), the front surface (401) of the first housing part (210) and the front surface (402) of the second housing part (220) may face each other. For example, the first part (241) of the flexible display (240), which forms at least a portion of the front surface (401) of the first housing part (210), and the second part (242) of the flexible display (240), which forms at least a portion of the front surface (402) of the second housing part (220), may face each other. Since the flexible display (240) is electrically connected to ground, it may be difficult to control the capacitance formed between the first bracket (211) disposed within the first housing part (210) and the second bracket (221) disposed within the second housing part (220).

[0106] A foldable electronic device (200) according to one embodiment may be configured to control a capacitance formed between a first bracket (211) in a first housing part (210) and a third bracket (231) in a third housing part (230) in order to shift parasitic resonance due to a parasitic component out of a frequency range of RF signals transmitted and / or received through an antenna. The foldable electronic device (200) may control the capacitance formed in the first bracket (211) by using a plate (610) disposed between the first bracket (211) and the rear surface (404) of the first housing part (210).

[0107] Hereinafter, components for controlling the capacitance of the foldable electronic device (200) are described.

[0108] FIG. 6 is a block diagram showing the components of a foldable electronic device according to one embodiment.

[0109] Referring to FIG. 6, a foldable electronic device (200) according to one embodiment may include at least one processor (120), a switch circuit (650), an impedance circuit (640), a printed circuit board (620), and a plate (610). The plate (610) may be referred to as one of the metal structures disposed within a first housing part (e.g., the first housing part (210) of FIG. 3B), as described below.

[0110] According to one embodiment, at least one processor (e.g., processor (120) of FIG. 1) may include a processing circuit. At least one processor (120) may include, but is not limited to, an application processor (AP, e.g., a central processing unit (CPU)) and / or a communication processor (CP, e.g., a modem). At least one processor (120) may include a graphics processing unit (e.g., a GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless-fidelity (Wi-Fi) chip, a Bluetooth chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display driving circuit, an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or a similar circuit.

[0111] According to one embodiment, the switch circuit (650) may be configured to electrically and optionally connect the plate (610) to ground (e.g., the first bracket (211) in FIG. 3b) by electrically and optionally connecting the contact (630) connected to the plate (610) and the impedance circuit (640). The plate (610) may be electrically connected to the first bracket (211), which functions as the ground of the first housing part (e.g., the first housing part (210) in FIG. 3b), through the switch circuit (650) and the impedance circuit (640). When the switch circuit (650) electrically connects the contact (630) and the impedance circuit (640), the plate (610) may be electrically connected to the ground of the first housing part (210). When the switch circuit (650) electrically separates the contact (630) and the impedance circuit (640), the plate (610) can be electrically separated from the ground of the first housing part (210).

[0112] According to one embodiment, the switch circuit (650) may include a first terminal (651) electrically connected to a contact (630) connected to a plate (610) and one or more second terminals (652, 653) electrically connected to an impedance circuit (640) electrically connected to the ground of the first housing part (210) (e.g., the first bracket (211)). For example, the impedance circuit (640) may be electrically connected to a ground layer of a printed circuit board (620) electrically connected to the ground.

[0113] For example, in an off state (or open state) of the switch circuit (650) in which the first terminal (651) is electrically isolated from one or more second terminals (652, 653), the contact (630) can be electrically isolated from the impedance circuit (640) that is electrically connected to the ground of the first housing part (210) (e.g., the first bracket (211)). In the off state of the switch circuit (650), as the contact (630) is electrically isolated from the impedance circuit (640), the plate (610) can be electrically isolated from the ground of the first housing part (210).

[0114] For example, in an on state (or closed state) of the switch circuit (650) in which the first terminal (651) is electrically connected to one or more second terminals (652, 653), the contact (630) may be electrically connected to a ground (e.g., the first bracket (211)) of the first housing part (210) through the switch circuit (650) and the impedance circuit (640). In the on state of the switch circuit (650), as the contact (630) is electrically connected to the impedance circuit (640), the plate (610) may be electrically connected to the ground of the first housing part (210). As described below, at least one processor (120) may be configured to control a switch circuit (650) to electrically connect a contact (630) and an impedance circuit (640) based on the state of the foldable electronic device (e.g., unfolded state or multi-folded state).

[0115] According to one embodiment, the impedance circuit (640) may include a lumped element (e.g., a capacitor (641) or an inductor (642)). In FIG. 6, for convenience of explanation, the impedance circuit (640) including one capacitor (641) and one inductor (642) is illustrated; however, the impedance circuit (640) according to the present disclosure is not limited thereto. For example, the impedance circuit (640) may include a plurality of capacitors or a plurality of inductors. For example, the impedance circuit (640) may include a single capacitor or a single inductor. The switch circuit (650) may be configured to electrically connect the contact (630) to one of the capacitor (641) or the inductor (642) of the impedance circuit (640). The impedance circuit (640) may be electrically connected to a ground layer of a printed circuit board (620), which is electrically connected to a ground (e.g., a first bracket (211)) of the first housing part (210).

[0116] According to one embodiment, the sensor (660) may be used to identify a state of the foldable electronic device (200). For example, at least one processor (120) may be configured to identify a distance (or angle) between the first housing part (210) and the second housing part (220) using the sensor (660). The at least one processor (120) may be configured to control the switch circuit (650) based on the distance (or angle) between the first housing part (210) and the second housing part (220) identified through the sensor (660). The sensor (660) may include, for example, but is not limited to, a grip sensor.

[0117] A foldable electronic device (200) according to one embodiment may include a plate (610). At least a portion of the plate (610) may include a metal material (e.g., stainless steel). According to one embodiment, the plate (610) may be disposed within the first housing part (210). For example, the plate (610) may be disposed within the first housing part (210) between a first bracket (e.g., the first bracket (211) of FIG. 4) and a rear surface (e.g., the rear surface (404) of FIG. 4) of the first housing part (e.g., the first housing part (210) of FIG. 4).

[0118] According to one embodiment, at least one processor (120), a switch circuit (650), an impedance circuit (640), and / or a sensor (660) may be disposed on a printed circuit board (620). The printed circuit board (620) may include a plurality of conductive layers and a plurality of non-conductive layers alternatively stacked with the plurality of conductive layers. The printed circuit board (620) may provide electrical connections between various electronic components using wires and conductive vias formed on the plurality of conductive layers.

[0119] A foldable electronic device (200) according to one embodiment may include a contact (630) electrically connected to a switch circuit (650) disposed on a printed circuit board (620). The plate (610) may be configured to electrically connect a ground layer of the printed circuit board (620) via the contact (630), the switch circuit (650), and the impedance circuit (640).

[0120] According to one embodiment, the switch circuit (650) may be configured to provide an electrical connection between the plate (610) and the ground layer of the printed circuit board (620) by providing an electrical connection between the plate (610) and the impedance circuit (640) based on the state of the foldable electronic device (200).

[0121] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, the switch circuit (650) may be configured to electrically isolate the contact (630) and the impedance circuit (640). In a state where the contact (630) and the impedance circuit (640) are electrically isolated, the plate (610) may be electrically isolated from the ground layer of the printed circuit board (620), thereby being isolated from the ground (e.g., the first bracket (211)) of the first housing part (210). For example, at least one processor (120) may be configured to control the switch circuit (650) so that the first terminal (651) and one or more second terminals (652, 653) are electrically isolated based on identifying the unfolded state of the foldable electronic device (200). As the first terminal (651) and one or more second terminals (652, 653) are electrically isolated, the plate (610) can be electrically isolated from the impedance circuit (640), which is electrically connected to the ground layer of the printed circuit board (620). As the plate (610) is electrically isolated from the impedance circuit (640), the plate (610) can be electrically isolated from the ground of the first housing part (210) (e.g., the first bracket (211)).

[0122] For example, in the unfolded state of the foldable electronic device (200), a first bracket (211) disposed within a first housing part (210), a second bracket (e.g., the second bracket (221) disposed within a second housing part (e.g., the second housing part (220) of FIG. 4), and a third bracket (e.g., the third bracket (231) disposed within a third housing part (e.g., the third housing part (230) of FIG. 4)) may be disposed on substantially the same plane. Since the first bracket (211), the second bracket (221), and the third bracket (231) are disposed on substantially the same plane, capacitance may not be formed between the brackets (e.g., the first bracket (211), the second bracket (221), and the third bracket (231) of FIG. 4). Since the above capacitance is not formed, the plate (610) can be electrically separated from the impedance circuit (640) so that the deterioration of the communication performance of the foldable electronic device (200) due to parasitic components may not occur.

[0123] According to one embodiment, when the foldable electronic device (200) is in a multi-folded state, the switch circuit (650) may be configured to electrically connect the contact (630) and the impedance circuit (640). In a state where the contact (630) and the impedance circuit (640) are electrically connected, the plate (610) may be electrically connected to the ground (e.g., the first bracket (211)) of the first housing part (210) by being electrically connected to the ground layer of the printed circuit board (620). For example, at least one processor (120) may be configured to control the switch circuit (650) so that the first terminal (651) and one or more second terminals (652, 653) are electrically connected based on identifying the multi-folded state of the foldable electronic device (200). As the first terminal (651) and one or more second terminals (652, 653) are electrically connected, the plate (610) can be electrically connected to an impedance circuit (640), which is electrically connected to a ground layer of a printed circuit board (620). As the plate (610) is electrically connected to the impedance circuit (640), the plate (610) can be electrically connected to a ground (e.g., a first bracket (211)) of the first housing part (210).

[0124] For example, as described above, in the multi-folded state of the foldable electronic device (200), the first bracket (211) disposed within the first housing part (210), the second bracket (221) disposed within the second housing part (220), and the third bracket (231) disposed within the third housing part (230) may overlap each other. For example, as the first bracket (211) and the third bracket (231) face each other, a capacitance may be formed between the first bracket (211) and the third bracket (231). Due to the capacitance, parasitic resonance due to a parasitic component may be induced in the first bracket (211) and the third bracket (231). The parasitic resonance may deteriorate the communication performance of the foldable electronic device (200) by interfering with RF signals having a frequency within the low band. According to one embodiment, when the foldable electronic device (200) is in a multi-folded state, the capacitance of the plate (610) may be controlled as the plate (610) disposed between the first bracket (211) and the rear surface of the first housing part (210) is electrically connected to an impedance circuit (640) electrically connected to the first bracket (211). Depending on the parameter value (e.g., capacitance or inductance) of the lumped element of the impedance circuit (640), the impedance of the plate (610) changes, and due to the change in the impedance, the parasitic resonance of the plate (610) may move out of the low band. As the parasitic resonance moves out of the frequency band of RF signals, interference due to the parasitic resonance may be reduced, and thus deterioration of the communication performance of the foldable electronic device (200) in the multi-folded state may be reduced.

[0125] Below, the structure of the plate (610) placed within the first housing part (210) is described.

[0126] Fig. 7 illustrates the interior of a first housing part according to one embodiment. Fig. 8 is an exploded perspective view of the first housing part of Fig. 7.

[0127] Referring to FIG. 7, the first housing part (210) may include a first bracket (211), a fourth bracket (701) and / or an enclosure (702).

[0128] According to one embodiment, the fourth bracket (701) may be positioned below (e.g., in the -z direction) the first housing part (210). For example, the fourth bracket (701) may be positioned between the first bracket (211) of the first housing part (210) and the rear surface (e.g., the rear surface (404) of FIG. 4) of the first housing part (210). The fourth bracket (701) may cover at least a portion of the printed circuit board (620). For example, the first bracket (211) may support one side of the printed circuit board (620), and the fourth bracket (701) may support the other side of the printed circuit board (620). For example, the fourth bracket (701) may include a metal material.

[0129] In one embodiment, the enclosure (702) may be referred to as a case of the speaker (720). For example, the speaker (720) may be enclosed by the enclosure (702). The enclosure (702) may be configured to protect the speaker (720) disposed within the enclosure (702) and provide a resonance space for audio signals output from the speaker (720). In one embodiment, the enclosure (702) may be spaced apart from the fourth bracket (701). For example, the fourth bracket (701) may be positioned at the top (e.g., in the +y direction) of the first housing part (210), and the enclosure (702) may be positioned at the bottom of the first housing part (210).

[0130] According to one embodiment, the fourth bracket (701) and the enclosure (702) may function as the aforementioned plate (610). For example, the foldable electronic device (200) may utilize at least one of the fourth bracket (701) or the enclosure (702) disposed within the first housing part (210) to control capacitance formed between the first bracket (211) and the third bracket (e.g., the third bracket (231) of FIG. 4) of the third housing part (e.g., the third housing part (230) of FIG. 4) in a multi-folded state of the foldable electronic device (200).

[0131] For example, in a multi-folded state of the foldable electronic device (200), if a separate metal structure is added inside the first housing part (210) to control the capacitance formed between the first bracket (211) of the first housing part (210) and the third bracket (231) of the third housing part (230), the thickness of the first housing part (210) may increase or the size of other electronic components (e.g., a battery) may decrease due to the internal space of the first housing part (210) occupied by the separate metal structure. Since grounding of the separate metal structure is required to control the capacitance between the first bracket (211) and the third bracket (231), it may be difficult to form a structure for grounding the separate metal structure in the limited internal space of the first housing part (210).

[0132] According to one embodiment, the foldable electronic device (200) may use the fourth bracket (701) or the enclosure (702) included in the first housing part (210) as the plate (610), rather than a separate metal structure. Since the fourth bracket (701) or the enclosure (702) included in the first housing part (210) is used as the plate (610), no space for a separate metal structure is required, and thus problems of increasing the thickness of the first housing part (210) or reducing the sizes of other electronic components may be resolved. According to one embodiment, another printed circuit board (710) may be arranged in the first housing part (210). A speaker (720) may be arranged on the another printed circuit board (710). Another switch circuit (730) and another impedance circuit (740) for the enclosure (702) may be arranged on the another printed circuit board (710).

[0133] Referring to FIG. 8, the rear (404) of the first housing part (210) may be defined by a rear cover (810). For example, the rear cover (810) may be formed of a non-conductive material. The rear cover (810) may be opposite to the first part (241) of the flexible display (240) which defines at least a portion of the front of the first housing part (210).

[0134] According to one embodiment, the fourth bracket (701) may be positioned between the first bracket (211) and the rear cover (810) defining the rear of the first housing part (210). The fourth bracket (701) may cover a printed circuit board (620) positioned on the first bracket (211).

[0135] According to one embodiment, the foldable electronic device (200) may further include another printed circuit board (710) disposed within the first housing part (210). For example, the printed circuit board (620) may be referred to as a main board of the first housing part (210), and the other printed circuit board (710) may be referred to as a sub-board of the first housing part (210). According to one embodiment, the speaker (720) may be disposed on the other printed circuit board (710). The enclosure (702) may cover the other printed circuit board (710), thereby at least partially covering the speaker (720) disposed on the other printed circuit board (710). The printed circuit board (620) and the other printed circuit board (710) may be electrically connected via a flexible printed circuit board (750). A battery (760) of the first housing part (210) may be placed on a flexible printed circuit board (750) (e.g., in the +z direction).

[0136] According to one embodiment, at least one of the fourth bracket (701) or the enclosure (702) may be used to control the capacitance formed between the first bracket (211) and the third bracket (231). For example, at least one of the fourth bracket (701) or the enclosure (702) may correspond to the plate (610) described above. The case where the fourth bracket (701) is used as the plate (610) is described later with reference to FIG. 10. The case where the enclosure (702) is used as the plate (610) is described later with reference to FIG. 16.

[0137] FIG. 9 is a flowchart showing the operation of a switch circuit of a foldable electronic device according to one embodiment.

[0138] Blocks of flowcharts and combinations of flowcharts within the present disclosure may be performed by one or more computer programs comprising computer-executable instructions. For example, operations illustrated in FIG. 9 may be performed by the foldable electronic device of FIG. 6 (e.g., the foldable electronic device (200) of FIG. 6). For example, at least some of the operations may be performed by at least one processor of the foldable electronic device (200) (e.g., at least one processor (120) of FIG. 6). For example, the operations may be referred to as operations performed by the electronic device when instructions stored in memory (e.g., memory (130) of FIG. 1) are executed individually or collectively by at least one processor (120).

[0139] Referring to FIG. 9, in operation 901, the foldable electronic device (200) may be configured to identify a state of the foldable electronic device (200).

[0140] According to one embodiment, at least one processor (120) of the foldable electronic device (200) may be configured to identify a state of the foldable electronic device (200) using a sensor (e.g., sensor (660) of FIG. 6). For example, the sensor (660) may be configured to identify an unfolded state or a multi-folded state of the foldable electronic device (200) based on capacitance formed in each of a first bracket (e.g., a first bracket (211) of FIG. 3A) in a first housing part (e.g., a first housing part (210) of FIG. 3A), a second bracket (e.g., a second bracket (221) of FIG. 3A) in a second housing part (e.g., a second housing part (220) of FIG. 3A), and a third bracket (e.g., a third bracket (231) of FIG. 3A) in a third housing part (e.g., a third housing part (230) of FIG. 3A). As described above, the sensor (660) may include, but is not limited to, a grip sensor. For example, the sensor (660) may also include a Hall sensor that identifies a magnetic field of a magnet. In addition, the sensor (660) may include sensors that can generate data indicating the status of the foldable electronic device (200) using various methods. At least one processor (120) may identify the status of the foldable electronic device (200) using the sensor (660).

[0141] In operation 903, the foldable electronic device (200) may be configured to identify whether the state of the foldable electronic device (200) is a multi-folded state or an unfolded state.

[0142] According to one embodiment, at least one processor (120) may be configured to identify whether the state of the foldable electronic device (200) identified through operation 901 is a folded state or an unfolded state. If the state of the identified foldable electronic device (200) is an unfolded state, operation 905 may be performed. If the state of the identified foldable electronic device (200) is a multi-folded state, operation 907 may be performed.

[0143] In operation 905, the foldable electronic device (200) may be configured to electrically isolate an impedance circuit (e.g., an impedance circuit (640) of FIG. 6) from a plate (e.g., a plate (610) of FIG. 6) when the foldable electronic device (200) is in an unfolded state.

[0144] According to one embodiment, at least one processor (120) may be configured to control a switch circuit (e.g., a switch circuit (650) of FIG. 6) to electrically isolate an impedance circuit (640) from a plate (610) based on identifying an unfolded state of the foldable electronic device (200). The switch circuit (650) may be configured to electrically isolate the impedance circuit (640) from the plate (610) by being controlled by the at least one processor (120). For example, a first terminal (e.g., a first terminal (651) of FIG. 6) of a switch circuit (650) electrically connected to a plate (610) may be electrically isolated from one or more second terminals (e.g., one or more second terminals (652, 653) of FIG. 6) of a switch circuit (650) electrically connected to a lumped element (e.g., a capacitor (641) or an inductor (642) of FIG. 6) of an impedance circuit (640). When the foldable electronic device (200) is in an unfolded state, the brackets of the foldable electronic device (200) do not overlap and are arranged on substantially the same plane, so that capacitance may not be formed between the brackets. Since the above capacitance is not formed, there is no need to control the capacitance of the first bracket (211), so the switch circuit (650) can be configured to electrically isolate the impedance circuit (640) from the plate (610).

[0145] In operation 907, the foldable electronic device (200) may be configured to electrically connect the impedance circuit (640) to the plate (610) when the foldable electronic device (200) is in a multi-folded state.

[0146] According to one embodiment, at least one processor (120) may be configured to control a switch circuit (650) so that the plate (610) and the impedance circuit (640) are electrically connected based on identifying the multi-folded state of the foldable electronic device (200). The switch circuit (650) may be configured to electrically connect the impedance circuit (640) to the plate (610) by being controlled by at least one processor (120). For example, a first terminal of a switch circuit (650) electrically connected to a plate (610) (e.g., the first terminal (651) of FIG. 6) may be electrically connected to one or more second terminals of the switch circuit (650) (e.g., one or more second terminals (652, 653) of FIG. 6) which are electrically connected to a lumped element (e.g., the capacitor (641) or inductor (642) of FIG. 6) of the impedance circuit (640). As previously described, the impedance circuit (640) may be electrically connected to a ground layer of a printed circuit board (620) which is electrically connected to a first bracket (211) corresponding to the ground of the first housing part (210). The plate (610) can be electrically connected to the first bracket (211) of the first housing part (210) through a contact (630), a switch circuit (650), and an impedance circuit (640). When the foldable electronic device (200) is in a multi-folded state, capacitance may be formed between the brackets because the brackets of the foldable electronic device (200) overlap. The switch circuit (650) can be configured to electrically connect the impedance circuit (640) and the plate (610) so that the parasitic resonance caused by the capacitance moves out of the frequency band of RF signals transmitted and / or received through the antenna of the foldable electronic device (200).

[0147] According to one embodiment, the plate (610) is electrically connected to the impedance circuit (640) via the switch circuit (650), so that the capacitance formed between the first bracket (211) and the third bracket (e.g., the third bracket (233) of FIG. 4) of the third housing part (e.g., the third housing part (230) of FIG. 4) can be changed. A parameter value (e.g., capacitance or inductance) of a lumped element (e.g., a capacitor (641) or an inductor (642) of FIG. 6) included in the impedance circuit (640) that is electrically connected to the plate (610) via the switch circuit (650) can correspond to a parameter value for moving the parasitic resonance out of the frequency band. The impedance of the plate (610) is changed by the impedance circuit (640), and according to the change in the impedance of the plate (610), the capacitance formed between the first bracket (211) and the third bracket (233) of the third housing part (230) may be changed. By changing the capacitance formed between the first bracket (211) and the third bracket (233), the parasitic resonance may move out of the frequency band. As the parasitic resonance moves out of the frequency band, interference with RF signals transmitted and / or received through the antenna may be reduced. According to one embodiment, deterioration of the communication performance of the foldable electronic device (200) due to the capacitance formed by the brackets may be reduced.

[0148] FIG. 10 illustrates the upper portion of the first housing part of a foldable electronic device according to one embodiment. FIG. 11 is an exploded view of the fourth bracket of FIG. 10. FIG. 12 is a plan view of the fourth bracket of FIG. 10.

[0149] Referring to FIG. 10, in one embodiment, the fourth bracket (701) may be used as a plate (610). Since the fourth bracket (701) covering the printed circuit board (620) may be used as the plate (610), even without adding a separate metal structure within the first housing part (210), the capacitance formed between the first bracket (211) and the third bracket (233) of the third housing part (e.g., the third housing part (230) of FIG. 4) may be controlled. In the example illustrated in FIG. 10, the fourth bracket (701) may correspond to the plate (610). For convenience of explanation, the following descriptions are based on the plate (610), but the plate (610) described below may correspond to the fourth bracket (701) of FIG. 10.

[0150] Referring to FIG. 11, the plate (610) may include a conductive portion (1110) and a non-conductive portion (1120). The conductive portion (1110) may be spaced apart from a first bracket (e.g., the first bracket (211) of FIG. 10) corresponding to a ground of a first housing part (e.g., the first housing part (210) of FIG. 10). For example, the conductive portion (1110) may be floated with respect to the first bracket (211). For example, the non-conductive portion (1120) may be in contact with the first bracket (211) to support the plate (610).

[0151] Referring to FIGS. 11 and 12, a manufacturing process of a plate (610) (e.g., the fourth bracket (701)) is described. Referring to FIG. 11, a conductive portion (1110) of the plate (610) can be manufactured. For example, the conductive portion (1110) of the plate (610) can have a substantially rectangular parallelepiped shape. After the conductive portion (1110) is manufactured, a portion of an edge portion of the conductive portion (1110) can be cut. A portion of the edge portion of the cut conductive portion (1110) can be referred to as a cut portion (1130). A portion (1140) surrounded by the cut portion (1130) can be insulated from the conductive portion (1110) by the cut portion (1130).

[0152] A non-conductive portion (1120) of the plate (610) can be formed by injecting a non-conductive material into a conductive portion (1110) having a cut portion (1130). The non-conductive portion (1120) of the plate (610) can be formed on a portion of the edge portion of the conductive portion (1110). For example, the conductive portion (1110) having the cut portion (1130) can be placed in a mold, and a non-conductive material in a semi-solid or liquid state can be injected into a cavity inside the mold. The injected non-conductive material can flow through the cut portion (1130) onto both sides of the edge portion of the conductive portion (1110). After the injection of the non-conductive material is completed, the non-conductive material hardens, thereby forming the non-conductive portion (1120) of the plate (610). Since the non-conductive material can be introduced into the cut portion (1130), when the non-conductive material hardens, the cut portion (1130) can be filled with a non-conductive portion (1120). For example, the non-conductive portion (1120) may include a first non-conductive portion (1121) formed at the first edge portion (1151) of the conductive portion (1110) and a second non-conductive portion (1122) formed at the second edge portion (1152) of the conductive portion (1110) opposite to the first edge portion (1151). The second non-conductive portion (1122) may be opposite to the first non-conductive portion (1121).

[0153] According to one embodiment, the conductive portion (1110) may include a first through hole (1141) disposed within the portion of the edge portion. When the non-conductive portion (1120) is injected, the non-conductive portion (1120) may include a second through hole (1142) aligned with the first through hole (1141). For example, the cavity of the mold for forming the non-conductive portion (1120) may have a shape for forming the second through hole (1142).

[0154] Referring to FIG. 12, when a plate (610) is manufactured with a non-conductive portion (1120) formed, the first through hole (1141) and the second through hole (1142) can be aligned with each other. A fastener for attaching the plate (610) to the first bracket of the first housing part (210) (e.g., the first bracket (211) of FIG. 10) can be inserted into the first through hole (1141) and the second through hole (1142). For example, the fastener may include a screw, but is not limited thereto. By passing the fastener through the first through hole (1141) and the second through hole (1142) and attaching to the first bracket (211), the plate (610) can be attached to the first bracket (211) through the fastener. Since the first through hole (1141) is formed within a portion of the edge of the conductive portion (1110) where the non-conductive portion (1120) is formed, the non-conductive portion (1120) of the plate (610) can be in contact with the first bracket (211), and the conductive portion (1110) of the plate (610) can be spaced apart from the first bracket (211).

[0155] The manufacturing process of the plate (610) illustrated in FIGS. 11 and 12 is merely exemplary, and the embodiments of the present disclosure are not limited thereto. For example, the plate (610) may comprise a metal sheet or a plate on which a conductive paint is deposited. For example, the plate (610) may be manufactured by depositing a conductive paint on a non-conductive plate. In addition, the plate (610) may be manufactured through various other methods.

[0156] FIG. 13 is a cross-sectional view of a foldable electronic device according to one embodiment taken along line AA' of FIG. 10.

[0157] Referring to FIG. 13, the conductive portion (e.g., the conductive portion (1110) of FIG. 11) of the plate (610) (e.g., the fourth bracket (701)) may be spaced apart from the first bracket (211). Although not shown in FIG. 13, the plate (610) may be coupled to the first bracket (211) through a fastening member that penetrates the non-conductive portion (e.g., the non-conductive portion (1120) of FIG. 11) and the conductive portion (1110) and is inserted into the first bracket (211). As the plate (610) is coupled to the first bracket (211), the plate (610) may be fixed. The plate (610) may be positioned between the first bracket (211) and the rear surface (404) of the first housing part (210). For example, the plate (610) may be placed between the first bracket (211) and the rear cover (810) defining the rear (404) of the first housing part (210).

[0158] According to one embodiment, the plate (610) may be electrically connected to a printed circuit board (620) through a switch circuit (650) that is electrically connected to a contact (630) and an impedance circuit (640). The printed circuit board (620) may be placed on a first bracket (211). For example, the printed circuit board (620) may be placed on one side of the first bracket (211), and a first part (241) of the flexible display (240) may be placed on the other side of the first bracket (211).

[0159] According to one embodiment, the switch circuit (650) and the impedance circuit (640) may be placed on a printed circuit board (620). For example, the switch circuit (650) may be configured to provide an electrical connection between the plate (610) and the impedance circuit (640) based on the state of the foldable electronic device (200). According to one embodiment, when the foldable electronic device (200) is in an unfolded state, the switch circuit (650) may be configured to electrically disconnect the impedance circuit (640) from the plate (610). For example, when the foldable electronic device (200) is in an unfolded state, the switch circuit (650) may be configured to operate in an off state (or open state) in which the first terminal (e.g., the first terminal (651) in FIG. 6) and one or more second terminals (e.g., one or more second terminals (652, 653) in FIG. 6) are electrically separated. When the foldable electronic device (200) is in a multi-folded state, the switch circuit (650) may be configured to electrically connect the plate (610) and the impedance circuit (640). For example, when the foldable electronic device (200) is in a multi-folded state, the switch circuit (650) may be configured to operate in an on state (or closed state) in which the first terminal (e.g., the first terminal (651) in FIG. 6) and one or more second terminals (652, 653) are electrically connected. When a plate (610) placed between the first bracket (211) and the rear surface (404) of the first housing part (210) is electrically connected to an impedance circuit (640) by a switch circuit (650), the capacitance formed between the first bracket (211) and the third bracket (e.g., the third bracket (231) of FIG. 4) may be changed. The capacitance may be based on a parameter value (e.g., capacitance or inductance) of a lumped element (e.g., the capacitor (641) or inductor (642) of FIG. 6) of the impedance circuit (640).According to one embodiment, the parameter values ​​of the lumped element may be referenced as values ​​for moving the parasitic resonance caused by the capacitance formed in the first bracket (211) out of the frequency band of RF signals transmitted and / or received through the antenna of the foldable electronic device (200).

[0160] According to one embodiment, the capacitor (641) or inductor (642) of the impedance circuit (640) may include a variable capacitor or a variable inductor. The variable capacitor or variable inductor may not have a fixed capacitance or inductance, but may have a changeable capacitance or inductance. The foldable electronic device (200) may be configured to adjust the capacitance of the variable capacitor or the inductance of the variable inductor so that parasitic components do not interfere with the frequency band of the RF signals.

[0161] Figures 14 and 15 illustrate the plate.

[0162] Referring to FIG. 14, a plate (610) (e.g., a fourth bracket (701)) may be electrically connected to a first bracket (e.g., a first bracket (211) in FIG. 7) corresponding to the ground of a first housing part (e.g., a first housing part (210) in FIG. 7) through a contact (630), a switch circuit (650), and an impedance circuit (640). For example, a printed circuit board (620) may include a ground layer electrically connected to the first bracket (211). A lumped element (1510) (e.g., a capacitor (641) or an inductor (642)) of the impedance circuit (640) may be electrically connected to the ground layer of the printed circuit board (620). The switch circuit (650) may include a first terminal (651) electrically connected to a contact (630) and one or more second terminals (652, 653) electrically connected to a lumped element (1520). For example, the impedance circuit (640) may include a capacitor (641) and / or an inductor (642), and one or more second terminals (652, 653) of the switch circuit (650) may include a terminal (652) electrically connected to the capacitor (641) and a terminal (653) electrically connected to the inductor (642). The impedance circuit (640) illustrated in FIG. 15 is merely exemplary, and the examples of the present disclosure are not limited thereto. The lumped element (1510) of the impedance circuit (640) can be electrically connected to the ground layer of a printed circuit board (620), which is electrically connected to the first bracket (211) corresponding to the ground of the first housing part (210).

[0163] According to one embodiment, the switch circuit (640) may be configured to electrically connect the plate (610) to the first bracket (211) by electrically connecting the contact (630) and the impedance circuit (640). For example, when the switch circuit (650) is in the ON state (or closed state) in which the first terminal (651) and one or more second terminals (652, 653) are electrically connected, the contact (630) may be electrically connected to the first bracket (211) through the impedance circuit (640) and the ground layer of the printed circuit board (620). The plate (610) may be electrically connected to the first bracket (211) through the contact (630) which is electrically connected to the first bracket (211).

[0164] Referring to FIG. 15, the plate (610) may be electrically connected to a first bracket (e.g., the first bracket (211) of FIG. 7) corresponding to the ground of a first housing part (e.g., the first housing part (210) of FIG. 7). For example, a first point (P1) of the plate (610) may be electrically connected to the first bracket (211) through a contact (630), a switch circuit (650), and an impedance circuit (640). A second point (P2) of the plate (610) may be electrically connected to the first bracket (211). For example, a first point (P1) of the plate (610) may be adjacent to a first side (1501) of the plate (610), and a second point (P2) of the plate (610) may be adjacent to a second side (1502) of the plate (610). The second side (1502) of the plate (610) may be adjacent to a first hinge assembly (e.g., a first hinge assembly (250) of FIG. 2a) that rotatably connects a first housing part (210) and a second housing part (e.g., a second housing part (220) of FIG. 2a). For example, the first hinge assembly (250) may be closer to the second point (P2) of the plate (610) than to the first point (P1) of the plate (610). For example, the first point (P1) and the second point (P2) may be spaced apart and adjacent to each other's respective edges located on opposite sides of the plate (610).

[0165] According to one embodiment, in order to control the capacitance formed in the first bracket (211), the impedance of the plate (610) can be changed through the switch circuit (650) and the impedance circuit (640). The area where the impedance of the plate (610) is changed may be an area that is spaced far away from the second point (P2) electrically connected to the first bracket (211), which corresponds to the ground. For example, since the area of ​​the plate (610) around the second point (P2) electrically connected to the first bracket (211) is electrically connected to the first bracket (211), the impedance of the area may not be changed by the switch circuit (650) and the impedance circuit (640), or the change of the impedance may be difficult. For example, an area around a first point (P1) that is electrically connected to a printed circuit board (620) via a contact (630) can be easily changed in impedance by an impedance circuit (640) and a switch circuit (650). In order to adjust the capacitance formed in the first bracket (211), the first point (P1) can be located far from the second point (P2) so that an area around the first point (P1) where the impedance can be easily changed can be secured.

[0166] In one embodiment, the distance between the first point (P1) of the plate (610) and the second point (P2) of the plate (610) may be referred to as the first distance (D1). The distance between the first point (P1) of the plate (610) and the first side (1501) of the plate (610) adjacent to the first point (P1) may be referred to as the second distance (D2). The distance between the second point (P2) of the plate (610) and the second side (1502) of the plate (610) adjacent to the second point (P2) may be referred to as the third distance (D3). In one embodiment, the first distance (D1) may be longer than the second distance (D2) and the third distance (D3). As the first distance (D1) is formed longer than the second distance (D2) and the third distance (D3), the distance between the first point (P1) and the second point (P2) can be formed relatively long. As the first point (P1) is farther away from the second point (P2), an area of ​​the plate (610) around the first point (P1) where the impedance can be easily changed can be secured. As the area of ​​the plate (610) around the first point (P1) is secured, the capacitance of the first bracket (211) can be adjusted by changing the impedance of the plate (610).

[0167] FIG. 16 illustrates the lower portion of a first housing part of a foldable electronic device according to one embodiment.

[0168] Referring to FIG. 16, an enclosure (702) may be positioned at the lower part (e.g., in the -y direction) of the first housing part (210). The enclosure (702) may be positioned between the first bracket (211) and the rear of the first housing part (210) (e.g., the rear (404) in FIG. 4, or the rear cover (810)).

[0169] According to one embodiment, another printed circuit board (710) may be placed on the lower part of the first bracket (211). A speaker (720) may be placed on the other printed circuit board (710). The enclosure (702) may be configured to protect the speaker (720) by at least partially covering the speaker (720) and to provide a resonant space for an audio signal output from the speaker (720). The enclosure (702) can be used as a plate (610) for adjusting the capacitance between the first bracket (211) and the third housing part (e.g., the third bracket (231) of the third housing part (230) of FIG. 4) in a multi-folded state of the foldable electronic device (200). For convenience of explanation, the following descriptions are based on the plate (610), but the plate (610) described below may correspond to the enclosure (702) of FIG. 16.

[0170] According to one embodiment, another switch circuit (730) and another impedance circuit (740) may be disposed on another printed circuit board (710). The other switch circuit (730) may be configured to provide an electrical connection between the plate (610) and the other impedance circuit (740) based on the state of the foldable electronic device (200). The other impedance circuit (740) may be electrically connected to a ground layer of the other printed circuit board (710), which is electrically connected to a first bracket (211) corresponding to the ground of the first housing part (210).

[0171] According to one embodiment, when the foldable electronic device (200) is in an unfolded state, the other switch circuit (740) may be configured to electrically isolate the other impedance circuit (740) from the plate (610). When the foldable electronic device (200) is in a multi-folded state, the other switch circuit (730) may be configured to electrically connect the plate (610) and the other impedance circuit (740). When the plate (610) disposed between the first bracket (211) and the rear surface of the first housing part (210) is electrically connected to the other impedance circuit (740) by the other switch circuit (730), the plate (610) may be electrically connected to the first bracket (211) through the other switch circuit (730) and the other impedance circuit (740). As the plate (610) is electrically connected to the first bracket (211), a capacitance formed between the first bracket (211) and the third bracket (231) may be changed. The capacitance may be based on a parameter value (e.g., capacitance or inductance) of a lumped element (e.g., capacitor or inductor) of another impedance circuit (740). According to one embodiment, the parameter value of the lumped element may be referenced as a value for moving a parasitic resonance caused by the capacitance formed in the first bracket (211) out of the frequency band of RF signals transmitted and / or received through the antenna of the foldable electronic device (200).

[0172] A foldable electronic device (200) according to one embodiment may use at least one of a fourth bracket (e.g., the fourth bracket (701) of FIG. 7) or an enclosure (702) as a plate (610). As described above, the impedance of the plate (610) may be changed by an electrical connection between the plate (610) and an impedance circuit (e.g., the impedance circuit (640) of FIG. 6 or another impedance circuit (740) of FIG. 16). By changing the impedance of the plate (610), the capacitance formed between the first bracket (211) and the third bracket (231) in the multi-folded state of the foldable electronic device (200) can be adjusted. In one embodiment, the foldable electronic device (200) can shift parasitic resonance out of the frequency band of RF signals by adjusting the capacitance formed between the first bracket (211) and the third bracket (231) in the multi-folded state. According to one embodiment, the degradation of the communication performance of the foldable electronic device (200) can be reduced.

[0173] FIG. 17 is a graph showing the efficiency of an antenna of a foldable electronic device according to a frequency according to one embodiment.

[0174] The x-axis of the graph (1700) of FIG. 17 represents frequency (unit: GHz), and the y-axis of the graph (1700) represents antenna efficiency (unit: dB). The first graph (1701) represents antenna efficiency according to frequency when the foldable electronic device (200) is in an unfolded state. The second graph (1702) represents antenna efficiency according to frequency when the foldable electronic device (200) is in a multi-folded state, and the impedance circuit (640) and the fourth bracket (701) or enclosure (702) are electrically separated. The third graph (1703) shows the efficiency of the antenna as a function of frequency when the foldable electronic device (200) is in a multi-folded state and one of the fourth bracket (701) or the enclosure (702) is electrically connected to the ground (e.g., the first bracket (211) of FIG. 4) of the first housing part (e.g., the first housing part (210) of FIG. 4) through a capacitor (641) having 1 pF of the impedance circuit (640). The fourth graph (1704) shows the efficiency of the antenna as a function of frequency when the foldable electronic device (200) is in a multi-folded state and both the fourth bracket (701) and the enclosure (702) are electrically connected to the ground of the first housing part (210) (e.g., the first bracket (211) of FIG. 4) through a capacitor (641) having 1 pF of the impedance circuit (640).

[0175] When comparing the first graph (1701) and the second graph (1702), as the foldable electronic device (200) changes from an unfolded state to a multi-folded state, the efficiency of the antenna may decrease. For example, for a frequency of about 0.8 GHz to about 0.9 GHz, the efficiency of the antenna shown in the first graph (1701) is about -6 dB, and for a frequency of about 0.8 GHz to about 0.9 GHz, the efficiency of the antenna shown in the second graph (1702) is about -13 dB. As the state of the foldable electronic device (200) changes from an unfolded state to a multi-folded state, the efficiency of the antenna may decrease by about 7 dB. As described above, when the foldable electronic device (200) is in a multi-folded state, parasitic resonance may be caused by the overlap of the first bracket (211), the second bracket (221), and the third bracket (231). Since the parasitic resonance may overlap at least partially with the frequency band of RF signals transmitted and / or received through the antenna, the efficiency of the antenna may be reduced.

[0176] Referring to the third graph (1703), the efficiency of the antenna may be improved when one of the fourth bracket (701) or the enclosure (702) is used as a plate (610) that is electrically connected to the first bracket (211) via an impedance circuit (640). When the plate (610) corresponding to one of the fourth bracket (701) or the enclosure (702) is electrically connected to the first bracket (211) via a capacitor (641) having 1 pF, the impedance of the plate (610) may be changed. As the impedance of the plate (610) is changed, the capacitance between the first bracket (211) and the third bracket (231) may be changed in the multi-folded state of the foldable electronic device (200). By changing the capacitance between the first bracket (211) and the third bracket (231), the parasitic resonance can be shifted, thereby reducing interference with the antenna. As interference with the antenna is reduced, the efficiency of the antenna can be improved. For example, the efficiency of the antenna shown in the third graph (1703) for a frequency of about 0.8 GHz to about 0.9 GHz is about -7 dB. When the foldable electronic device (200) is in a multi-folded state, by using either the fourth bracket (701) or the enclosure (702) as the plate (610), the efficiency of the antenna can be improved from about -13 dB to about -7 dB.

[0177] Referring to the fourth graph (1704), since both the fourth bracket (701) and the enclosure (702) are used as plates (610) that are electrically connected to the first bracket (211) through an impedance circuit (640), the efficiency of the antenna can be improved. When each of the fourth bracket (701) and the enclosure (702) is electrically connected to the first bracket (211) through a capacitor (641) having 1 pF, the impedance of the fourth bracket (701) and the impedance of the enclosure (702) can be changed. According to the change in impedance, the capacitance between the first bracket (211) and the third bracket (231) can be changed in the multi-folded state of the foldable electronic device (200). By changing the capacitance between the first bracket (211) and the third bracket (231), the parasitic resonance can be shifted, so that interference to the antenna can be reduced. As interference to the antenna is reduced, the efficiency of the antenna can be improved. For example, the efficiency of the antenna shown in the fourth graph (1704) for a frequency of about 0.8 GHz to about 0.9 GHz is about -6 dB. When the foldable electronic device (200) is in a multi-folded state, if the fourth bracket (701) and the enclosure (702) are used as the plate (610), the communication performance of the foldable electronic device (200) in the multi-folded state can be provided at a level substantially equivalent to the communication performance of the foldable electronic device (200) in the unfolded state. For example, in a frequency range between about 0.8 GHz and about 0.9 GHz, the communication performance of the foldable electronic device (200) in a multi-folded state may be substantially the same or similar to the communication performance of the foldable electronic device (200) in an unfolded state.

[0178] The aforementioned foldable electronic device (200) is illustrated with a structure in which the first rotational direction of the first housing part (210) relative to the second housing part (220) and the second rotational direction of the third housing part (230) relative to the second housing part (220) are opposite, but embodiments of the present disclosure are not limited thereto. The operation of controlling the capacitance of the first bracket (211) using the plate (610), the switch circuit (650), and the matching circuit can be applied substantially identically to various multi-foldable electronic devices comprising three housing parts. In the case of the foldable electronic device (1800) described with reference to FIGS. 18 and 19, the first rotational direction and the second rotational direction may have the same structure.

[0179] FIG. 18 illustrates a foldable electronic device according to one embodiment. FIG. 19 is a cross-sectional view of the foldable electronic device according to one embodiment, cut along the BB' line of FIG. 18.

[0180] Referring to FIG. 18, the foldable electronic device (1800) may include a first housing part (1810), a second housing part (1820), and a third housing part (1830).

[0181] According to one embodiment, when the foldable electronic device (1800) is in an unfolded state (e.g., state (1800a) of FIG. 18), the first housing part (1810), the second housing part (1820), and the third housing part (1830) may be arranged on substantially the same plane. In the unfolded state of the foldable electronic device (1800), the first part (1841), the second part (1842) of the flexible display (1840), and the third part (1843) of the flexible display (1840) may be oriented in substantially the same direction.

[0182] According to one embodiment, in a foldable electronic device (1800) in an unfolded state, as the third housing part (1830) rotates counterclockwise with respect to the second housing part (1820) and the first housing part (1810) rotates counterclockwise with respect to the second housing part (1820), the state of the foldable electronic device (1800) can be changed from an unfolded state to a folded state.

[0183] The descriptions related to the aforementioned plate (610) may be substantially applicable to the foldable electronic device (1800) illustrated in FIG. 18. For example, when the foldable electronic device (1800) is in a multi-folded state (e.g., state (1800b) of FIG. 18), the front of the second housing part (1820) may face the front of the third housing part (1830), and the rear of the first housing part (1810) may face the rear of the second housing part (1820). A second part (1842) of the flexible display (1840) forming at least a portion of the front of the second housing part (1820) may face the third part (1843) of the flexible display (1840) forming at least a portion of the front of the third housing part (1830). Because the second part (1842) and the third part (1843) face each other, it may be difficult to apply the aforementioned plate (610) to the second housing part (1820) and the third housing part (1830). According to one embodiment, the aforementioned plate (e.g., the plate (610) of FIG. 19) may be applied to the first housing part (1810) facing the rear of the second housing part (1820) or to the second housing part (1820) facing the rear of the first housing part (1810).

[0184] Referring to FIG. 19, the first housing part (1810) may include a first bracket (211) and a fourth bracket (701). The fourth bracket (701) may be positioned between the first bracket (211) and the rear surface (1811) of the first housing part (1810). For example, the fourth bracket (701) may be positioned between the first bracket (211) and a rear cover (810) defining the rear surface (1811) of the first housing part (1810). The rear surface (1811) of the first housing part (1810) may face the rear surface (1821) of the second housing part (1820). The rear surface (1811) of the first housing part (1810) may be opposite to the first part (1841) of the flexible display (1840).

[0185] In one embodiment, the fourth bracket (701) may be used as a plate (610). For example, the fourth bracket (701) may be electrically connected to a printed circuit board (620) disposed within the first housing part (1810) via a contact (630). The fourth bracket (701) may be electrically connected to an impedance circuit (640) via a switch circuit (650) disposed on the printed circuit board (620). The switch circuit (650) may be configured to electrically connect the impedance circuit (640) to the fourth bracket (701) when the foldable electronic device (1800) is in a multi-folded state. The switch circuit (650) may be configured to electrically isolate the impedance circuit (640) from the fourth bracket (701) when the foldable electronic device (1800) is in an unfolded state. Although not shown, an enclosure (e.g., enclosure (702) of FIG. 7) that surrounds a speaker (e.g., speaker (720) of FIG. 7) disposed within the first housing part (1810) may be used as the plate (610).

[0186] FIG. 20a illustrates an example of a first state of an electronic device. FIG. 20b illustrates an example of a second state of an electronic device. FIG. 20c illustrates an example of a third state of an electronic device. FIG. 21 illustrates the interior of a first housing part according to one embodiment.

[0187] In the case of the foldable electronic device (200) described with reference to FIGS. 2a, 2b, and 2c, a camera (e.g., camera (275) of FIG. 2a) is positioned on the rear of a third housing part (230) and a display (e.g., display (270) of FIG. 2c) is positioned on the rear of a second housing part (220), but the examples of the present disclosure are not limited thereto.

[0188] Referring to FIGS. 20A, 20B, and 20C, a foldable electronic device (2000) may include a foldable housing (2001) including a first housing part (2010), a second housing part (2020), and a third housing part (2030). The foldable electronic device (2000) may include a camera (2040) disposed on the rear of the second housing part (2020) and a display (2050) disposed on the rear of the third housing part (2030). For example, in the first state (2000a) of the foldable electronic device (2000) illustrated in FIG. 20a, the front surface (2011) of the first housing part (2010), the front surface (2021) of the second housing part (2020), and the front surface (2031) of the third housing part (2030) may face substantially the same direction (e.g., +z direction). The first state (2000a) of the foldable electronic device (2000) may be referred to as an unfolded state of the foldable electronic device (2000). In the first state (2000a), as the first housing part (2010) rotates in the first rotational direction (e.g., clockwise) with respect to the second housing part (2020), the foldable electronic device (2000) can change from the first state (2000a) of FIG. 20a to the second state (2000b) of FIG. 20b.

[0189] Referring to FIG. 20b, in the second state (2000b) of the foldable electronic device (2000), the front side (2011) of the first housing part (2010) may face the front side (2021) of the second housing part (2020). The second state (2000b) of the foldable electronic device (2000) may be referred to as a single folded state or a half folded state of the foldable electronic device (2000). In the second state (2000b), as the third housing part (2030) rotates in a second rotational direction (e.g., counterclockwise) with respect to the second housing part (2020), the foldable electronic device (2000) may change from the second state (2000b) of FIG. 20c to the third state (2000c) of FIG. 20c.

[0190] Referring to FIG. 20c, in the third state (2000c) of the foldable electronic device (2000), the front side of the first housing part (2010) may face the front side of the second housing part (2020), and the front side (2031) of the third housing part (2030) may face the rear side (2012) of the first housing part (2010). The third state (2000c) of the foldable electronic device (2000) may be referred to as a multi-folded state of the foldable electronic device (2000). Within the multi-folded state of the foldable electronic device (2000), the first housing part (2010) may be positioned between the second housing part (2020) and the third housing part (2030).

[0191] Referring to FIG. 20c, within the multi-folded state of the foldable electronic device (2000), the first bracket (2013), the second bracket (2023), and the third bracket (2033) may overlap each other. A parasitic effect may be caused by the capacitance formed between the overlapping brackets. As described above, the structure for controlling the capacitance formed between the brackets may be substantially identically applied to the foldable electronic device (2000) illustrated in FIGS. 20a, 20b, and 20c.

[0192] Referring to FIG. 21, the above-described structure can be substantially identically applied to the first housing part (2010) of FIG. 21. For example, in a multi-folded state of the foldable electronic device (2000), the fourth bracket (701) and / or the enclosure (702) can be used to control the capacitance formed between the first bracket (2013) of the first housing part (2010) and the third bracket (2033) of the third housing part (2030). The fourth bracket (701) and / or the enclosure (702) of the first housing part (2010) can be used as the plate (610) described above.

[0193] For example, the fourth bracket (701) may be electrically connected to a ground layer of a printed circuit board (620) via a switch circuit (650) and an impedance circuit (640). The ground layer of the printed circuit board (620) may be electrically connected to the first bracket (2013) corresponding to the ground of the first housing part (2010). As the fourth bracket (701) is electrically connected to the ground layer of the printed circuit board (620), the fourth bracket (701) may be electrically connected to the first bracket (2013). Depending on the parameter value of the lumped element of the impedance circuit (640), the capacitance between the first bracket (2013) and the third bracket (2033) may be adjusted. Depending on the above parameter value, parasitic resonance caused by the capacitance may be shifted out of the frequency band of RF signals transmitted and / or received through the antenna of the foldable electronic device (2000).

[0194] For example, the enclosure (702) can be electrically connected to a ground layer of another printed circuit board (710) through another switch circuit (730) and another impedance circuit (740). The ground layer of the other printed circuit board (710) can be electrically connected to the first bracket (2013) corresponding to the ground of the first housing part (2010). As the enclosure (702) is electrically connected to the ground layer of the other printed circuit board (710), the enclosure (702) can be electrically connected to the first bracket (2013). Depending on the parameter value of the lumped element of the other impedance circuit (740), the capacitance between the first bracket (2013) and the third bracket (2033) can be adjusted. Depending on the above parameter value, parasitic resonance caused by the capacitance may be shifted out of the frequency band of RF signals transmitted and / or received through the antenna of the foldable electronic device (2000).

[0195] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0196] A foldable electronic device (101, 200, 2000) is described. The foldable electronic device (101, 200, 2000) may include a foldable housing (201) including a first housing part (210), a second housing part (220) configured to rotate with respect to the first housing part (210), and a third housing part (230) configured to rotate with respect to the second housing part (220). A multi-folded state of the foldable electronic device (101, 200, 2000) has a front side of the second housing part (220) facing the front side of the first housing part (210) and a front side of the third housing part (230) facing the rear side of the first housing part (210). The above foldable electronic device (101, 200, 2000) may include a flexible display (240) including a first part (241) defining a part of the front surface of the first housing part (210), a second part (242) defining a part of the front surface of the second housing part (220), and a third part (243) defining a part of the front surface of the third housing part (230). The first housing part (210) may include a bracket (211) corresponding to the ground of the first housing part (210), a plate (610) disposed between the bracket (211) of the first housing part (210) and the rear surface of the first housing part (210), a printed circuit board (620) disposed on the bracket (211), an impedance circuit (640) disposed on the printed circuit board (620) and electrically connected to a ground layer of the printed circuit board (620) that is electrically connected to the bracket (211), and a switch circuit (650) disposed on the printed circuit board (620). The switch circuit (650) may be configured to electrically connect the impedance circuit (640) and the plate (610) based on a state of the foldable electronic device (101, 200, 2000).For example, the switch circuit may be configured to electrically connect or electrically disconnect the impedance circuit (640) and the plate (610) depending on whether the state of the foldable electronic device (101, 200, 2000) is in an unfolded state or a multi-folded state. When the plate (610) is electrically connected to the impedance circuit (640) through the switch circuit (650), the plate (610) and the bracket (211) may be electrically connected.

[0197] According to one embodiment, the plate (610) may include a conductive portion (1110) spaced apart from the bracket (211), and a non-conductive portion (1120) that is coupled to a portion of the edge portion of the conductive portion (1110), contacts the bracket (211), and supports the plate (610).

[0198] According to one embodiment, the conductive portion (1110) of the plate (610) may include a first through hole (1141) disposed within the portion of the edge portion of the conductive portion (1110). The non-conductive portion (1120) of the plate (610) may include a second through hole (1142) aligned with the first through hole (1141) of the conductive portion (1110). The first housing part (210) may include a fastener that secures the plate (610) to the bracket (211) by being inserted into the first through hole (1141) of the conductive portion (1110) and the second through hole (1142) of the non-conductive portion (1120) and coupled to the bracket (211).

[0199] According to one embodiment, the portion of the edge portion of the conductive portion (1110) may include a cut portion (1130) that is at least partially cut. The cut portion may be filled with the non-conductive portion (1120).

[0200] According to one embodiment, the plate (610) may be one of a metal sheet or a plate on which a conductive paint is deposited.

[0201] According to one embodiment, the foldable electronic device (101, 200, 2000) may further include a sensor (660) for identifying a distance between the first housing part (210) and the second housing part (220). The switch circuit (650) may be configured to provide electrical connection or electrical separation between the plate (610) and the impedance circuit (640) based on the distance between the first housing part (210) and the second housing part (220) identified through the sensor (660).

[0202] According to one embodiment, the switch circuit (650) may be configured to electrically isolate the plate (610) and the bracket (211) by electrically isolating the impedance circuit (640) from the plate (610) when the foldable electronic device (101, 200, 2000) is in the unfolded state. The switch circuit (650) may be configured to electrically connect the plate (610) and the bracket (211) by electrically connecting the impedance circuit (640) to the plate (610) when the foldable electronic device (101, 200, 2000) is in the multi-folded state.

[0203] According to one embodiment, the foldable electronic device (101, 200, 2000) may further include another bracket (701) covering the printed circuit board (620). The plate (610) may correspond to the other bracket (701).

[0204] According to one embodiment, the foldable electronic device (101, 200, 2000) may further include a speaker (720) disposed within the first housing part (210) and an enclosure (702) that at least partially encloses the speaker (720). The plate (610) may correspond to the enclosure (702).

[0205] According to one embodiment, a first point (P1) of the plate (610) may be electrically connected to the bracket (211) through the switch circuit (650) and the impedance circuit (640). A second point (P2) of the plate (610) may be physically connected to the bracket (211).

[0206] According to one embodiment, the first distance (D1) between the first point (P1) of the plate (610) and the second point (P2) of the plate (610) may be longer than the second distance (D2) between the first point (P1) of the plate (610) and the first side (1501) of the plate (610) adjacent to the first point (P1) of the plate (610) or the third distance (D3) between the second point (P2) of the plate (610) and the second side (1502) of the plate (610) adjacent to the second point (P2) of the plate (610).

[0207] According to one embodiment, the foldable electronic device (101, 200, 2000) may further include a first hinge assembly (250) that rotatably connects the first housing part (210) and the second housing part (220). The foldable electronic device (101, 200, 2000) may further include a second hinge assembly (260) that rotatably connects the second housing part (220) and the third housing part (230). The first hinge assembly (250) may be closer to the second point (P2) of the plate (610) than to the first point (P1) of the plate (610).

[0208] According to one embodiment, the impedance circuit (640) may include a capacitor (641) or an inductor (642) for adjusting the capacitance formed on the bracket (211) by changing the impedance of the plate (610).

[0209] According to one embodiment, the switch circuit (650) may be configured to electrically connect the plate (610) and the impedance circuit (640) so as to shift the parasitic resonance of the parasitic component induced by the bracket (211) outside the frequency band of the RF (radio frequency) signals transmitted or received through the foldable electronic device (101, 200, 2000).

[0210] According to one embodiment, the second housing part (220) may include another bracket (221) corresponding to the ground of the second housing part (220). The plate (610) of the first housing part (210) may be positioned between the bracket (211) of the first housing part (210) and the other bracket (221) of the second housing part (220) within the multi-folded state of the foldable electronic device (101, 200, 2000).

[0211] According to one embodiment, the plate (610) of the first housing part (210) can be used to control the capacitance formed in the bracket (211) of the first housing part (210) within the multi-folded state of the foldable electronic device (101, 200, 2000).

[0212] A foldable electronic device (101, 1800) is described. The foldable electronic device (101, 1800) may include a foldable housing (201) including a first housing part (1810), a second housing part (1820) configured to rotate relative to the first housing part (1810), and a third housing part (1830) configured to rotate relative to the second housing part (1820). A multi-folded state of the foldable electronic device (101, 1800) may have a rear side of the first housing part (1810) facing the rear side of the second housing part (1820) and a front side of the third housing part (1830) facing the front side of the second housing part (1820). The foldable electronic device (101, 1800) may include a flexible display (1840) including a first part (1841) defining a portion of the front surface of the first housing part (1810), a second part (1842) defining a portion of the front surface of the second housing part (1820), and a third part (1843) defining a portion of the front surface of the third housing part (1830). The first housing part (1810) may include a bracket (211) corresponding to the ground of the first housing part (1810), a plate (610) disposed between the bracket (211) and the rear surface of the first housing part (1810), a printed circuit board (620) disposed on the bracket (211), an impedance circuit (640) disposed on the printed circuit board (620) and electrically connected to a ground layer of the printed circuit board (620) electrically connected to the bracket (211), and a switch circuit (650) disposed on the printed circuit board (620). The switch circuit (650) may be configured to electrically disconnect the impedance circuit (640) from the plate (610) when the foldable electronic device (101, 1800) is in an unfolded state.The above switch circuit (650) may be configured to electrically connect the impedance circuit (640) to the plate (610) when the foldable electronic device (101, 1800) is in the multi-folded state.

[0213] According to one embodiment, the plate (610) may include a conductive portion (1110) spaced apart from the bracket (211), and a non-conductive portion (1120) that is coupled to a portion of the edge portion of the conductive portion (1110), contacts the bracket (211), and supports the plate (610). The conductive portion (1110) of the plate (610) may include a first through hole (1141) disposed within the portion of the edge portion of the conductive portion (1110), and the non-conductive portion (1120) of the plate (610) may include a second through hole (1142) aligned with the first through hole (1141) of the conductive portion (1110). The first housing part (1810) may include a fastener that is inserted into the first through hole (1141) of the conductive part (1110) and the second through hole (1142) of the non-conductive part (1120) and is coupled to the bracket (211), thereby fixing the plate (610) to the bracket (211).

[0214] According to one embodiment, the foldable electronic device (101, 1800) may further include a sensor (660) for identifying the distance between the first housing part (1810) and the second housing part (1820). The switch circuit (650) may be configured to provide an electrical connection or electrical separation between the plate (610) and the impedance circuit (640) based on the distance between the first housing part (1810) and the second housing part (1820) identified through the sensor (660).

[0215] According to one embodiment, the foldable electronic device (101, 1800) may further include another bracket (701) covering the printed circuit board (620). The plate (610) may correspond to the other bracket (701).

[0216] According to one embodiment, the foldable electronic device (101, 1800) may further include a speaker (720) disposed within the first housing part (1810) and an enclosure (702) that at least partially encloses the speaker (720). The plate (610) may correspond to the enclosure (702).

[0217] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0218] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0219] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0220] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0221] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0222] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as the memory (130) of the manufacturer's server, the application store's server, or the relay server.

[0223] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In foldable electronic devices, A foldable housing comprising a first housing part, a second housing part configured to rotate relative to the first housing part, and a third housing part configured to rotate relative to the second housing part, wherein a multi-folded state of the foldable electronic device has a front side of the second housing part facing the front side of the first housing part and a front side of the third housing part facing the rear side of the first housing part; and A flexible display comprising a first portion defining a portion of the front surface of the first housing part, a second portion defining a portion of the front surface of the second housing part, and a third portion defining a portion of the front surface of the third housing part, The above first housing part, A bracket corresponding to the ground of the above first housing part, A plate disposed between the bracket of the first housing part and the rear surface of the first housing part; A printed circuit board placed on the above bracket, An impedance circuit disposed on the printed circuit board and electrically connected to a ground layer of the printed circuit board, which is electrically connected to the bracket, and comprising a switch circuit arranged on the printed circuit board; The above switch circuit, Based on the state of the above foldable electronic device, configured to electrically connect the impedance circuit and the plate, Foldable electronic devices.

2. In paragraph 1, The above plate, a conductive portion spaced apart from the above bracket, and A non-conductive portion that is joined to a portion of the edge portion of the conductive portion, contacts the bracket, and supports the plate, Foldable electronic devices.

3. In paragraph 2, The conductive portion of the above plate, comprising a first through hole disposed within the part of the edge portion of the conductive portion; The non-conductive portion of the above plate is, comprising a second through hole aligned with the first through hole of the above conductive portion, The above first housing part, A fastener inserted into the first through hole of the conductive portion and the second through hole of the non-conductive portion and coupled to the bracket, thereby fixing the plate to the bracket. Foldable electronic devices.

4. In paragraph 2, The above part of the edge portion of the above conductive portion, Including a cut portion that is at least partially cut, The above cut part is, Filled with the above non-conductive portion, Foldable electronic devices.

5. In any one of paragraphs 1 to 4, The above plate, One of the metal sheets or plates on which conductive paint has been deposited, Foldable electronic devices.

6. In any one of paragraphs 1 to 5, The above switch circuit, When the above foldable electronic device is in an unfolded state, the plate and the bracket are electrically separated by electrically isolating the impedance circuit from the plate, When the above foldable electronic device is in the multi-folded state, the plate and the bracket are electrically connected by electrically connecting the impedance circuit to the plate, Foldable electronic devices.

7. In any one of paragraphs 1 to 6, Further comprising another bracket covering the printed circuit board; The above plate, Corresponding to the other brackets above, Foldable electronic devices.

8. In any one of paragraphs 1 to 7, Further comprising a speaker disposed within the first housing part and an enclosure at least partially surrounding the speaker, The above plate, Corresponding to the above enclosure, Foldable electronic devices.

9. In any one of paragraphs 1 to 8, The first point of the above plate is, Electrically connected to the bracket through the above switch circuit and the above impedance circuit, The second point of the above plate is, Physically connected to the above bracket, Foldable electronic devices.

10. In paragraph 9, The first distance between the first point of the plate and the second point of the plate is, Longer than a second distance between the first point of the plate and a first side of the plate adjacent to the first point of the plate or a third distance between the second point of the plate and a second side of the plate adjacent to the second point of the plate, Foldable electronic devices.

11. In paragraph 9, A first hinge assembly that rotatably connects the first housing part and the second housing part; and Further comprising a second hinge assembly that rotatably connects the second housing part and the third housing part, The above first hinge assembly, closer to the second point of the plate than to the first point of the plate, Foldable electronic devices.

12. In any one of paragraphs 1 to 11, The above impedance circuit, A capacitor or inductor for controlling the capacitance formed in the bracket by changing the impedance of the plate, Foldable electronic devices.

13. In any one of paragraphs 1 to 12, The above switch circuit, The plate and the impedance circuit are configured to be electrically connected so as to shift the parasitic resonance of the parasitic component induced by the bracket, which is included in the frequency band of RF (radio frequency) signals transmitted or received through the foldable electronic device, out of the frequency band. Foldable electronic devices.

14. In any one of paragraphs 1 to 13, The above second housing part, Including another bracket corresponding to the ground of the second housing part, The above plate of the above first housing part, Within the multi-folded state of the foldable electronic device, positioned between the bracket of the first housing part and the other bracket of the second housing part, Foldable electronic devices.

15. In paragraph 14, The above plate of the above first housing part, In the multi-folded state of the foldable electronic device, a capacitance formed in the bracket of the first housing part is used to control the capacitance. Foldable electronic devices.

Images