Thermal management assembly based on semiconductor cooling and energy storage container

Abstract

The present invention relates to the technical field of container energy storage. Provided are a thermal management assembly based on semiconductor cooling and an energy storage container. The thermal management assembly based on semiconductor cooling provided in the present invention applies to the energy storage container, comprising a semiconductor cooler, an internal heat sink, an external heat sink, a first heat-conducting member, a second heat-conducting member and a third heat-conducting member, wherein the internal heat sink is arranged on the inner side of the wall of the container and encloses to form a first cavity, in which the semiconductor cooler and the first heat-conducting member are arranged, the semiconductor cooler having a cooling surface and a heating surface; and the external heat sink is arranged on the outer side of the wall of the container and encloses to form a second cavity, in which the second heat-conducting member is arranged, the third heat-conducting member connecting the first heat-conducting member and the second heat-conducting member. The thermal management assembly based on semiconductor cooling and the energy storage container provided in the present invention have low energy consumption, low costs and strong environmental adaptability.

Description

Thermal management assembly based on semiconductor refrigeration and energy storage container

[0001] The present application claims priority to the Chinese patent application No. 202411297298.7, filed on September 14, 2024, and entitled "Thermal management assembly and energy storage container", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of container energy storage, and in particular to a thermal management assembly based on semiconductor refrigeration and an energy storage container. BACKGROUND

[0003] The energy storage container is a container that integrates energy storage batteries, energy management systems, power electronic converters and other devices, mainly used for storing and releasing electric energy. The thermal management system in the energy storage container is an important part of the energy storage container, which can adjust the temperature of the energy storage devices in the energy storage container, so that the battery works in the best environment, thereby improving the performance and service life of the energy storage devices.

[0004] In the prior art, the thermal management system of the energy storage container focuses on the thermal management of the battery body, mainly including air cooling and liquid cooling. Among them, the air cooling uses the convection generated by the fan to complete the heat exchange, which has the problem of high energy consumption. The liquid cooling system has the problems of complex structure and high cost. In addition, the existing air cooling and liquid cooling methods focus on the thermal management of the battery body, and cannot perform thermal management on the environment inside the energy storage container, which limits the implementation effect of thermal management and makes the container difficult to adapt to extreme cold or hot climate challenges. Therefore, how to provide an energy storage container comprehensive thermal management system with low energy consumption, low cost and strong environmental adaptability is a technical problem that needs to be solved in the field. SUMMARY

[0005] In order to solve at least one problem mentioned in the background art, the present application provides a thermal management assembly based on semiconductor refrigeration and an energy storage container, which has low energy consumption, low cost and strong environmental adaptability.

[0006] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0007] In a first aspect, the present application provides a heat management assembly based on semiconductor refrigeration, applied to an energy storage container, comprising a semiconductor refrigeration sheet, an internal heat sink, an external heat sink, a first heat conducting member, a second heat conducting member and a third heat conducting member, the internal heat sink is configured to be arranged on the inside of the container wall, the internal heat sink is surrounded to form a first cavity, the semiconductor refrigeration sheet and the first heat conducting member are arranged in the first cavity, the semiconductor refrigeration sheet has two opposite heat energy conversion surfaces, the two heat energy conversion surfaces include a refrigeration surface and a heating surface, one of the heat energy conversion surfaces is attached to the first heat conducting member, and the other heat energy conversion surface faces the internal heat sink.

[0008] The external heat sink is configured to be arranged on the outside of the container wall, the external heat sink is surrounded to form a second cavity, the second heat conducting member is arranged in the second cavity, the third heat conducting member is configured to be arranged in the container wall, and the first end of the third heat conducting member is wrapped in the first heat conducting member, and the second end of the third heat conducting member is wrapped in the second heat conducting member, so as to exchange heat between the first heat conducting member and the second heat conducting member through the third heat conducting member.

[0009] As an optional implementation, it further comprises a heat insulation member arranged between the internal heat sink and the non-heat energy conversion surface of the semiconductor refrigeration sheet.

[0010] As an optional implementation, a heat conducting silicone grease is arranged between the heat energy conversion surface of the semiconductor and the first heat conducting member.

[0011] As an optional implementation, the semiconductor refrigeration sheet has at least two, and the at least two semiconductor refrigeration sheets are arranged around the periphery of the first heat conducting member.

[0012] As an optional implementation, the plurality of semiconductor refrigeration sheets further form a stacked structure, and the refrigeration surface in one of the adjacent two layers of semiconductor refrigeration sheets is connected to the heating surface of the other semiconductor refrigeration sheet.

[0013] As an optional implementation, the outer side of the internal heat sink and the outer side of the external heat sink each have a plurality of heat dissipation fins.

[0014] As an optional implementation, the first heat conducting member and the second heat conducting member are copper block structures, and the third heat conducting member is a heat pipe structure.

[0015] As an optional implementation, it further comprises a power supply unit and a control unit, the power supply unit and the semiconductor refrigeration sheet are electrically connected with the control unit, the power supply unit is configured to output direct current to the semiconductor refrigeration sheet, and the control unit is used to control the current direction and size of the direct current.

[0016] In a second aspect, the present application also provides an energy storage container comprising a plurality of the semiconductor refrigeration-based thermal management assemblies of the first aspect, the plurality of semiconductor refrigeration-based thermal management assemblies being arranged on the container wall of the container.

[0017] As an optional implementation, the internal heat sink and the external heat sink are detachably arranged on the container wall of the container.

[0018] The semiconductor refrigeration-based thermal management assembly provided by the present application is applied to an energy storage container, and comprises a semiconductor refrigeration sheet, an internal heat sink, an external heat sink, a first heat conduction member, a second heat conduction member and a third heat conduction member. The internal heat sink is arranged on the inner side of the container wall of the container, and the internal heat sink is surrounded to form a first cavity. The semiconductor refrigeration sheet and the first heat conduction member are arranged in the first cavity. The semiconductor refrigeration sheet has two opposite heat energy conversion surfaces, including a refrigeration surface and a heating surface. One of the two heat energy conversion surfaces is attached to the first heat conduction member, and the other heat energy conversion surface faces the internal heat sink. The external heat sink is arranged on the outer side of the container wall of the container, and the external heat sink is surrounded to form a second cavity. The second heat conduction member is arranged in the second cavity. The third heat conduction member is arranged in the container wall of the container, and a first end of the third heat conduction member is wrapped in the first heat conduction member, and a second end of the third heat conduction member is wrapped in the second heat conduction member, so as to exchange heat between the first heat conduction member and the second heat conduction member through the third heat conduction member.

[0019] When the semiconductor refrigeration-based thermal management component provided by this invention is in operation, after the semiconductor refrigeration chip is powered on, its two heat conversion surfaces can simultaneously heat and cool. Specifically, when cooling is required inside the container, the heat conversion surface of the semiconductor refrigeration chip facing away from the first heat conductor can be used for cooling. This heat conversion surface can lower the temperature of the internal heat sink, allowing heat exchange between the internal heat sink and the air inside the container, thus lowering the container temperature. Simultaneously, the heat conversion surface of the semiconductor refrigeration chip attached to the first heat conductor can generate heat. Heat can be transferred from the semiconductor refrigeration chip to the first heat conductor, then from the first heat conductor to the third heat conductor, then from the third heat conductor to the second heat conductor, and finally from the second heat conductor to the external heat sink, thereby outputting the heat to the atmosphere outside the container through the external heat sink. When heating is required inside the container, it is only necessary to switch the heating surface of the semiconductor refrigeration chip to the cooling surface and vice versa. The heat transfer process is the reverse of the heating process described above, and will not be elaborated here. As can be seen, the semiconductor-based thermal management component provided by this invention achieves cooling or heating through a semiconductor cooling chip, possessing advantages such as simple structure, low cost and energy consumption, and high temperature control accuracy. Furthermore, the semiconductor-based thermal management component provided by this invention can directly adjust the internal ambient temperature of the energy storage container, enabling the container to adapt to more complex and variable environments such as extreme cold and extreme heat, thus improving the environmental adaptability of the energy storage container. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 is a schematic diagram of the structure of a thermal management component based on semiconductor refrigeration provided in an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of the energy storage container provided in an embodiment of the present invention.

[0023] Explanation of reference numerals in the attached drawings: 100-Thermal management component; 110-Semiconductor cooling chip; 111-Thermal energy conversion surface; 120-Internal heat sink; 130-External heat sink; 140-First heat conduction component; 150-Second heat conduction component; 160-Third heat conduction component; 170-Insulation component; 180-Heat dissipation fins; 200-Energy storage container; 210-Energy storage device. Detailed Implementation

[0024] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0025] In the application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0026] In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific circumstances.

[0027] In addition, the terms "mount", "set", "provided with", "connect", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two devices, elements or components. Those of ordinary skill in the art can understand the specific meaning of the above-mentioned terms in the present application according to the specific circumstances.

[0028] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific types and structures can be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "multiple" is two or more.

[0029] The existing thermal management system of the energy storage container focuses on the thermal management of the battery body, mainly including air cooling and liquid cooling. The air cooling uses the convection generated by the fan to complete heat exchange, which has the problem of high energy consumption. The liquid cooling system has the problems of complex structure and high cost. In addition, the existing air cooling and liquid cooling methods cannot manage the environment inside the energy storage container due to focusing on the thermal management of the battery body, which limits the implementation effect of thermal management and makes the container difficult to adapt to the challenges of extremely cold or hot climates. Therefore, how to provide an energy storage container comprehensive thermal management system with low energy consumption, low cost and strong environmental adaptability is a technical problem that needs to be solved in the field.

[0030] Therefore, the application provides a semiconductor refrigeration-based thermal management assembly 100. When working, the two heat energy conversion surfaces 111 of the semiconductor refrigeration sheet 110 can generate heat and refrigeration at the same time. When refrigeration is needed inside the container, the heat energy conversion surface 111 of the semiconductor refrigeration sheet 110 that is away from the first heat conduction member 140 can be used for refrigeration. This heat energy conversion surface 111 can reduce the temperature of the internal heat sink 120, and the internal heat sink 120 exchanges heat with the air inside the container to reduce the temperature of the container. At the same time, the heat energy conversion surface 111 of the semiconductor refrigeration sheet 110 that is attached to the first heat conduction member 140 can generate heat. The heat can be transferred from the semiconductor refrigeration sheet 110 to the first heat conduction member 140, and then from the first heat conduction member 140 to the third heat conduction member 160, and then from the third heat conduction member 160 to the second heat conduction member 150, and finally from the second heat conduction member 150 to the external heat sink 130. Thus, the heat is output to the atmosphere outside the container through the external heat sink 130. The semiconductor refrigeration-based thermal management assembly 100 has the advantages of simple structure, low cost and energy consumption, and high temperature control precision. In addition, the semiconductor refrigeration-based thermal management assembly 100 can directly adjust the internal environment temperature of the energy storage container 200, so that the energy storage container 200 can adapt to more complex and variable environments such as extremely cold and extremely hot environments, and the environmental adaptability of the energy storage container 200 is improved.

[0031] Fig. 1 is a structural schematic diagram of a semiconductor refrigeration-based thermal management assembly provided by an embodiment of the present application; and Fig. 2 is a schematic diagram of an energy storage container provided by an embodiment of the present application. With reference to Figs. 1 and 2, an embodiment of the present application provides a semiconductor refrigeration-based thermal management assembly 100 applied to an energy storage container 200, which includes a semiconductor refrigeration sheet 110, an internal heat sink 120, an external heat sink 130, a first heat conducting member 140, a second heat conducting member 150, and a third heat conducting member 160. The internal heat sink 120 is configured to be arranged on the inner side of the container wall of the container, and the internal heat sink 120 is surrounded to form a first cavity. The semiconductor refrigeration sheet 110 and the first heat conducting member 140 are both arranged in the first cavity. The semiconductor refrigeration sheet 110 has two opposite heat energy conversion surfaces 111, which include a refrigeration surface and a heating surface. One of the two heat energy conversion surfaces 111 is attached to the first heat conducting member 140, and the other heat energy conversion surface 111 faces the internal heat sink 120. The external heat sink 130 is configured to be arranged on the outer side of the container wall of the container, and the external heat sink 130 is surrounded to form a second cavity. The second heat conducting member 150 is arranged in the second cavity. The third heat conducting member 160 is configured to be arranged in the container wall, and a first end of the third heat conducting member 160 is wrapped in the first heat conducting member 140, and a second end of the third heat conducting member 160 is wrapped in the second heat conducting member 150, so as to exchange heat between the first heat conducting member 140 and the second heat conducting member 150 through the third heat conducting member 160.

[0032] When the semiconductor refrigeration-based thermal management assembly 100 provided by an embodiment of the present application works, the two heat energy conversion surfaces 111 of the semiconductor refrigeration sheet 110 can heat and refrigerate at the same time after being powered on. Specifically, when refrigeration is needed in the container, the heat energy conversion surface 111 of the semiconductor refrigeration sheet 110 that is away from the first heat conducting member 140 can refrigerate, so as to reduce the temperature of the internal heat sink 120. The internal heat sink 120 exchanges heat with the air in the container, so as to reduce the temperature of the container. Meanwhile, the heat energy conversion surface 111 of the semiconductor refrigeration sheet 110 that is attached to the first heat conducting member 140 can heat, and the heat can be transferred from the semiconductor refrigeration sheet 110 to the first heat conducting member 140, and then transferred from the first heat conducting member 140 to the third heat conducting member 160, and then transferred from the third heat conducting member 160 to the second heat conducting member 150, and finally transferred from the second heat conducting member 150 to the external heat sink 130, so as to output the heat to the atmosphere outside the container through the external heat sink 130. When heating is needed in the container, it is only needed to switch the heating surface of the semiconductor refrigeration sheet 110 to the refrigeration surface and switch the refrigeration surface to the heating surface, and the heat transfer process is opposite to the above-mentioned heating process, which is not described herein.

[0033] Compared with the air cooling and liquid cooling in the prior art, the semiconductor refrigeration-based thermal management assembly 100 has the advantages of no noise or extremely small noise, simple structure, low cost and low energy consumption. In addition, the semiconductor refrigeration-based thermal management assembly 100 can control the temperature of the energy storage container 200 more conveniently and accurately by controlling the current in the semiconductor refrigeration sheet 110, and can extremely conveniently realize the switching between heating and cooling in the energy storage container 200 by controlling the current direction. In addition, the semiconductor refrigeration-based thermal management assembly 100 can directly adjust the internal environment temperature of the energy storage container 200, so that the energy storage container 200 can adapt to more complex and variable environments such as extremely cold and extremely hot environments, and the environmental adaptability of the energy storage container 200 is improved.

[0034] In the above embodiment, the heat insulation member 170 can be further included, and the heat insulation member 170 is arranged between the internal heat dissipation sheet 120 and the non-thermal energy conversion surface 111 of the semiconductor refrigeration sheet 110. As shown in FIG. 1, the non-thermal energy conversion surface 111 of the semiconductor refrigeration sheet 110 can be a side surface thereof, which can be perpendicular to the thermal energy conversion surface 111. Since the heating area and the cooling area exist simultaneously in the surface, if the surface directly contacts the internal heat dissipation sheet 120, the heat transfer will be uneven, which will result in a decrease in the control precision of the internal temperature of the container. Therefore, by arranging the heat insulation member 170, the non-thermal energy conversion surface 111 of the semiconductor refrigeration sheet 110 can avoid directly contacting the internal heat dissipation sheet 120, the uniformity of heat exchange of the internal heat dissipation sheet 120 is improved, and the precision of the temperature control of the container is improved.

[0035] In the above embodiment, the heat-conducting silicone grease can be arranged between the thermal energy conversion surface 111 of the semiconductor and the first heat-conducting member 140. The heat-conducting silicone grease can fill the gap between the thermal energy conversion surface 111 of the semiconductor and the first heat-conducting member 140, so that the thermal energy conversion surface 111 and the first heat-conducting member 140 can be more fully contacted, and the heat transfer efficiency between the thermal energy conversion surface 111 and the first heat-conducting member 140 is improved. In addition, the heat-conducting silicone grease can also have the functions of dustproof, corrosion prevention and buffering. It can be understood that, in addition to the heat-conducting silicone grease being arranged between the thermal energy conversion surface 111 of the semiconductor and the first heat-conducting member 140, the heat-conducting silicone grease can also be applied between other elements that can contact and transfer heat, such as between the semiconductor refrigeration sheet 110 and the internal heat dissipation sheet 120, between the first heat-conducting member 140 and the third heat-conducting member 160, between the third heat-conducting member 160 and the second heat-conducting member 150, and between the second heat-conducting member 150 and the external heat dissipation sheet 130.

[0036] In the above embodiment, the semiconductor refrigeration piece 110 can be at least two, and the at least two semiconductor refrigeration pieces 110 are arranged around the periphery of the first heat conduction piece 140, so that the semiconductor refrigeration piece 110 and the first heat conduction piece 140 can be in more sufficient contact, and the heat transfer efficiency between the semiconductor refrigeration piece 110 and the first heat conduction piece 140 is improved.

[0037] In the above embodiment, the plurality of semiconductor refrigeration pieces 110 can also form a stacked structure, and the cooling surface in one of the semiconductor refrigeration pieces 110 and the heating surface of the other semiconductor refrigeration piece 110 are connected. It can be understood that one side of the first heat conduction piece 140 can be attached to a plurality of semiconductor refrigeration pieces 110, and by designing the plurality of semiconductor refrigeration pieces 110 in series (stacked design), the refrigeration or heating effect of the semiconductor refrigeration piece 110 can be enhanced, and the temperature adjustment efficiency of the energy storage container 200 is improved.

[0038] As shown in FIG. 1, in the above embodiment, the outer side of the internal heat dissipation fin 120 and the outer side of the external heat dissipation fin 130 can have a plurality of heat dissipation fins 180. These heat dissipation fins 180 can increase the contact area with the air inside and outside the container, thereby accelerating the heat exchange efficiency between the heat dissipation fin and the air.

[0039] In the above embodiment, the first heat conduction piece 140 and the second heat conduction piece 150 can be copper block structures, and the third heat conduction piece 160 can be a heat pipe structure to improve the heat conduction efficiency of the first heat conduction piece 140, the second heat conduction piece 150 and the third heat conduction piece 160. Specifically, the third heat conduction piece 160 can use a copper pipe or an aluminum pipe, which has better heat conduction. In addition, the third heat conduction piece 160 can be provided in plurality, and the plurality of third heat conduction pieces 160 can be arranged side by side to improve the heat conduction efficiency of the third heat conduction piece 160.

[0040] In the above embodiment, a power supply unit and a control unit can also be included, and the power supply unit and the semiconductor refrigeration piece 110 are electrically connected to the control unit. The power supply unit is configured to output direct current to the semiconductor refrigeration piece 110, and the control unit is used to control the current direction and size of the direct current. The control unit can be arranged outside or inside the energy storage container 200 for the convenience of the staff, and the power supply unit can be electrically connected to the energy storage device 210 inside the energy storage container 200 to provide power through the energy storage device 210.

[0041] In addition, the embodiment of the present application also provides an energy storage container 200, comprising a plurality of the above-mentioned semiconductor refrigeration-based thermal management assemblies 100, the plurality of semiconductor refrigeration-based thermal management assemblies 100 are arranged on the walls of the container, and the thermal management assembly 100 comprises a semiconductor refrigeration sheet 110, an internal heat sink 120, an external heat sink 130, a first heat conduction member 140, a second heat conduction member 150 and a third heat conduction member 160. The internal heat sink 120 is arranged on the inner side of the wall of the container, and the internal heat sink 120 surrounds to form a first cavity. The semiconductor refrigeration sheet 110 and the first heat conduction member 140 are arranged in the first cavity. The semiconductor refrigeration sheet 110 has two opposite heat energy conversion surfaces 111, which include a refrigeration surface and a heating surface. One of the two heat energy conversion surfaces 111 is attached to the first heat conduction member 140, and the other heat energy conversion surface 111 faces the internal heat sink 120. The external heat sink 130 is arranged on the outer side of the wall of the container, and the external heat sink 130 surrounds to form a second cavity. The second heat conduction member 150 is arranged in the second cavity. The third heat conduction member 160 is arranged through the wall of the container, and the first end of the third heat conduction member 160 is wrapped in the first heat conduction member 140, and the second end of the third heat conduction member 160 is wrapped in the second heat conduction member 150. Compared with the existing air cooling and liquid cooling methods, the thermal management assembly 100 has the advantages of no noise or extremely small noise, simple structure, low cost, low energy consumption and strong environmental adaptability. In addition, the thermal management assembly 100 can realize more convenient and accurate control of the temperature of the energy storage container 200 by controlling the current size in the semiconductor refrigeration sheet 110, and can realize the switching between heating and cooling in the energy storage container 200 by controlling the current direction.

[0042] Among them, a plurality of thermal management assemblies 100 can be distributed according to the specific situation of the energy storage equipment 210 inside the energy storage container 200, so that each thermal management assembly 100 can better cooperate with each other, thereby further improving the thermal management effect in the energy storage container 200. For example, if the energy storage equipment at a certain position in the container dissipates more heat, several thermal management assemblies 100 can be considered to be arranged on the wall of the container on that side, and vice versa. In this way, the total number of thermal management assemblies 100 can be minimized to further save costs, and the temperature in the container can be more reasonably controlled to further improve the effect of the heat pipe.

[0043] In the above embodiment, the internal heat sink 120 and the external heat sink 130 can be detachably arranged on the wall of the container to facilitate the installation and disassembly of the thermal management assembly 100. Specifically, the internal heat sink 120 and the external heat sink 130 can be arranged on the wall of the container by pasting.

[0044] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor refrigeration-based thermal management assembly, comprising: The application is applied to energy storage container, including semiconductor refrigerating sheet, internal heat dissipation sheet, external heat dissipation sheet, first heat conduction piece, second heat conduction piece and third heat conduction piece, the internal heat dissipation sheet is configured to be arranged on the inside of the container wall, the internal heat dissipation sheet is surrounded to form a first cavity, the semiconductor refrigerating sheet and the first heat conduction piece are arranged in the first cavity, the semiconductor refrigerating sheet has two opposite heat energy conversion surfaces, two heat energy conversion surfaces include refrigeration surface and heating surface, one of the heat energy conversion surfaces is attached to the first heat conduction piece, and the other heat energy conversion surface faces the internal heat dissipation sheet. The external heat dissipation sheet is configured to be arranged on the outside of the container wall, the external heat dissipation sheet is surrounded to form a second cavity, the second heat conduction piece is arranged in the second cavity, the third heat conduction piece is configured to be arranged in the container wall, and the first end of the third heat conduction piece is wrapped in the first heat conduction piece, and the second end of the third heat conduction piece is wrapped in the second heat conduction piece, so as to exchange heat between the first heat conduction piece and the second heat conduction piece through the third heat conduction piece.

2. The semiconductor refrigeration-based thermal management assembly of claim 1, wherein, Further comprising a heat insulation piece arranged between the internal heat dissipation sheet and the non-heat energy conversion surface of the semiconductor refrigerating sheet.

3. The semiconductor refrigeration-based thermal management assembly of claim 2, wherein, Thermal conductive silicone grease is arranged between the heat energy conversion surface of the semiconductor and the first heat conduction piece.

4. The semiconductor refrigeration-based thermal management assembly of claim 3, wherein, The semiconductor refrigerating sheet has at least two, and at least two semiconductor refrigerating sheets are arranged around the periphery of the first heat conduction piece.

5. The semiconductor refrigeration-based thermal management assembly of claim 4, wherein, A plurality of semiconductor refrigerating sheets also form a stacked structure, and the refrigeration surface of one of the semiconductor refrigerating sheets and the heating surface of the other semiconductor refrigerating sheet are connected.

6. The semiconductor refrigeration based thermal management assembly of any of claims 1-5, wherein, The outside of the internal heat dissipation sheet and the outside of the external heat dissipation sheet both have a plurality of heat dissipation fins.

7. The semiconductor refrigeration based thermal management assembly of any of claims 1-5, wherein, The first heat conduction piece and the second heat conduction piece are copper block structures, and the third heat conduction piece is a heat pipe structure.

8. The semiconductor refrigeration based thermal management assembly of any of claims 1-5, wherein, Further comprising a power supply unit and a control unit, the power supply unit and the semiconductor refrigerating sheet are electrically connected with the control unit, the power supply unit is configured to output direct current to the semiconductor refrigerating sheet, and the control unit is used to control the current direction and size of the direct current.

9. An energy storage container, characterized by A plurality of semiconductor refrigeration-based thermal management assemblies described in any one of claims 1-8 are arranged on the container wall.

10. The energy storage container of claim 9, wherein, The internal heat dissipation sheet and the external heat dissipation sheet are detachably arranged on the container wall.

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