Electroplating device

Abstract

Provided in the present application is an electroplating device for a substrate. The substrate comprises an electroplating region, which comprises a central region and an edge region enclosing the central region. The electroplating device comprises: a substrate holder configured to hold and rotate the substrate; and an edge plate connected below the substrate holder. The edge plate comprises an annular shielding portion. The full edge of the electroplating region falls within the range of the projection of the shielding portion on the substrate. The range of the projection of the shielding portion on the substrate gradually decreases from outside to inside, such that the electric-field shielding strength of the shielding portion against the edge region gradually decreases from outside to inside. As a result, the current density acting on the edge region and the current density acting on the central region are uniform, thereby achieving a uniform plating thickness in the edge region and the central region.

Description

Electroplating device TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and relates to an electroplating device. BACKGROUND

[0002] In the field of semiconductor manufacturing, electrochemical plating (ECP) is a very important process, which is often used to form metal interconnection structure. As shown in FIG. 1, the process of electrochemical plating (taking copper ECP as an example) is to place a substrate W connected to an electrode in an electroplating solution L mainly composed of sulfuric acid (H2SO4) and copper sulfate (CuSO4), and a current flows to the substrate W, and copper ions in the electroplating solution flow to the surface of the substrate W along the current to form a copper film, and the copper ECP is completed. During the electrochemical plating process, a large number of electric field lines often gather at the edge of the substrate, which is called edge effect. Due to the influence of the edge effect, the current density at the edge of the substrate is larger, and the non-uniformity of the current density leads to a higher electroplating rate at the edge of the substrate and a lower electroplating rate at the center of the substrate, thereby further causing the plated layer at the edge of the substrate to be thicker than other areas, and the thickness uniformity of the plated film is poor.

[0003] Therefore, an electroplating device is provided to improve the thickness uniformity of the plated film on the surface of the substrate. SUMMARY

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide an electroplating device for improving the thickness uniformity of the plated film on the substrate in the prior art.

[0005] To achieve the above-mentioned purpose and other related purposes, the present application provides an electroplating device for a substrate, the substrate including an electroplating area, the electroplating area including a center area and an edge area surrounding the center area, comprising:

[0006] a substrate support for holding and rotating the substrate;

[0007] an edge plate connected below the substrate support;

[0008] wherein the edge plate includes a ring-shaped shielding portion, a circle of edges of the electroplating area falls within a projection range of the shielding portion on the substrate, and the projection range of the shielding portion on the substrate gradually decreases from outside to inside so that the electric field shielding strength of the shielding portion to the edge area gradually decreases from outside to inside.

[0009] In an embodiment of the present application, the shielding portion includes a sawtooth.

[0010] In an embodiment of the present application, the sawtooth is a sharp-angle sawtooth.

[0011] In an embodiment of the present application, the profile of the sawtooth comprises two edges, the two edges intersect or the extensions of the two edges intersect.

[0012] In an embodiment of the present application, the two edges of the sawtooth are curved lines.

[0013] In an embodiment of the present application, the curvature of the curved line is positive.

[0014] In an embodiment of the present application, the curvature of the curved line is negative.

[0015] In an embodiment of the present application, the shielding portion is configured to adjust the projection range by setting the included angle of the sawtooth.

[0016] In an embodiment of the present application, the shielding portion comprises a plurality of openings, and the opening rate of the plurality of openings gradually decreases from the inner ring to the outer ring of the shielding portion.

[0017] In an embodiment of the present application, the plurality of openings have the same aperture, and the opening density gradually decreases from the inner ring to the outer ring of the shielding portion.

[0018] In an embodiment of the present application, the opening density of the plurality of openings is constant, and the aperture of the plurality of openings gradually decreases from the inner ring to the outer ring of the shielding portion.

[0019] In an embodiment of the present application, the substrate comprises a plurality of electroplating regions, and the edge plate comprises a number of shielding portions equal to the number of electroplating regions.

[0020] In an embodiment of the present application, the edge plate and the substrate support have a gap, and the gap is used for the electroplating solution to flow between the edge plate and the substrate support.

[0021] In an embodiment of the present application, the edge plate is mounted on the substrate support through a plurality of mounting portions, the plurality of mounting portions are located on the four corners and / or four edges of the edge plate, and the plurality of mounting portions are configured to connect the edge plate to the substrate support in a tensioned state.

[0022] In an embodiment of the present application, in the horizontal direction, the distance from the inner ring of the shielding portion to the center of the substrate is greater than or equal to the distance from the inner ring of the edge region to the center of the substrate, and the distance from the outer ring of the shielding portion to the center of the substrate is greater than or equal to the distance from the outer ring of the edge region to the center of the substrate.

[0023] In an embodiment of the present application, the substrate is square, and the shielding portion is square ring-shaped.

[0024] In an embodiment of the present application, the substrate is circular, and the shielding portion is circular ring-shaped.

[0025] To achieve the above object and other related objects, the present application further provides an electroplating device for a circular substrate, the substrate comprising an electroplating area, the electroplating area comprising a center area and an edge area surrounding the center area, comprising: an electroplating cavity for storing an electroplating solution; a diffusion plate installed in the electroplating cavity, comprising a plurality of holes allowing the electroplating solution to flow through; an edge plate installed above the diffusion plate and immersed in the electroplating solution; wherein the edge plate comprises a shielding portion in a circular ring shape, a circle of edges of the electroplating area falls within a projection range of the shielding portion on the substrate, and the projection range of the shielding portion on the substrate gradually decreases from outside to inside so that the shielding strength of the shielding portion to the edge area gradually decreases from outside to inside.

[0026] In an embodiment of the present application, the shielding portion comprises a sawtooth.

[0027] In an embodiment of the present application, the sawtooth is a sharp-angle sawtooth.

[0028] In an embodiment of the present application, the profile of the sawtooth comprises two edges intersecting or the extensions of the two edges intersecting.

[0029] In an embodiment of the present application, the profile of the sawtooth comprises two edges intersecting or the extensions of the two edges intersecting.

[0030] In an embodiment of the present application, the curvature value of the curve is positive.

[0031] In an embodiment of the present application, the curvature value of the curve is negative.

[0032] In an embodiment of the present application, the shielding portion is configured to adjust the projection range by setting the included angle of the sawtooth.

[0033] As described above, the electroplating device of the present application partially shields the electric field lines of a circle of edge areas of the electroplating area by setting the shielding portion, and the projection area of the shielding portion on the edge area decreases from outside to inside, so that the shielding strength of the shielding portion to the edge area gradually decreases from outside to inside, resulting in that the current density acting on the edge area and the current density acting on the center area are uniform, thereby making the film thickness of the edge area and the center area uniform.

[0034] SUMMARY

[0035] The features and performances of the present application are further described by the following embodiments and the accompanying drawings.

[0036] Fig. 1 is a structural schematic diagram of the electroplating device in the present application.

[0037] Fig. 2 is a structural schematic diagram of the edge plate in an embodiment of the present application.

[0038] Fig. 3(a), Fig. 3(b) and Fig. 3(c) are detail views of different edge plates in the present application.

[0039] Fig. 4 is a structural schematic view of an edge plate in another embodiment of the present application.

[0040] Fig. 5 is a detail view of the edge plate in the embodiment of Fig. 4.

[0041] Fig. 6 is a comparison of the coating effect of an edge plate and no edge plate.

[0042] Fig. 7 is a structural schematic view of an edge plate in another embodiment of the present application.

[0043] Fig. 8(a) is a schematic view of the edge plate completely shielding the electric field, and Fig. 8(b) is a schematic view of the edge plate partially shielding the electric field.

[0044] Fig. 9 is a structural schematic view of an edge plate including a circular ring-shaped shielding portion in an embodiment of the present application.

[0045] Fig. 10 is a structural schematic view of an edge plate including a circular ring-shaped shielding portion in the present application.

[0046] Preferred embodiments of the present application

[0047] The present application is described in detail below with specific reference being made to certain embodiments. Those skilled in the art will readily understand other advantages and benefits of the present application from the following description. The embodiments of the present application can be implemented or performed in different ways depending upon the specific application and it is therefore contemplated that other alternatives, modifications and equivalents can be used. It is the following detailed description and not the summary that accurately describes the true scope of the application.

[0048] In describing the embodiments of the present application, specific terminology is employed for the sake of clarity. The description is not intended to be limited to the details of the description. Rather, the description is intended to cover any and all modifications and alternatives that can be made within the spirit and scope of the present application. In addition, the use of "including", "comprising" or "having" and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms used herein are to be construed to have their broadest meaning merely by using such terms in conjunctive form.

[0049] For the convenience of description, spatial relationship words such as "under", "below", "lower", "underneath", "above", "upper" and the like can be used herein to describe the relationship of one element or feature to another element or feature as shown in the drawings. It will be understood that these spatial relationship words are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present. "Between" as used herein is meant to include both endpoints.

[0050] In the context of the present application, a structure where a first feature is "on" a second feature can include embodiments where the first and second features are formed in direct contact, and can also include embodiments where additional features are formed between the first and second features, such that the first and second features can not be in direct contact.

[0051] It is to be noted that the drawings provided in the present embodiment only schematically illustrate the basic concept of the present application, and thus only relevant components in the present application are shown in the drawings, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be arbitrarily changed, and the layout pattern of the components can be more complex.

[0052] As shown in FIG. 1, the present embodiment provides an electroplating device, which includes an electroplating cavity 1 storing an electroplating solution L, a substrate holder 2 holding a substrate W, and an edge plate 3 connected to the lower portion of the substrate holder 2. The substrate W is square or circular, and the surface of the substrate W includes a back surface 51 and a front surface 50, which is the surface to be electroplated. The front surface 50 of the substrate W has a central region 53 and a peripheral region 52 near the outer edge 54 of the substrate W. During the electroplating operation, the substrate holder 2 is partially immersed in the electroplating solution L so that the electroplating solution wets the surface 50 of the substrate W to be electroplated, but does not wet the upper portion of the substrate holder 2. According to the preferred embodiment of the present application, the substrate holder 2 moves upward or downward along the Z direction indicated by the arrow 21 to change the height of the substrate W. During the electroplating operation, the substrate holder 2 is driven to rotate by a motor (not shown) so that the substrate holder 2 and the substrate W rotate clockwise or counterclockwise around the central axis 22, so that the front surface 50 of the substrate W is more uniformly contacted with the electroplating solution, which is beneficial to the uniform deposition of metal ions on the front surface 50 of the substrate W. However, during the electroplating, although the rotational movement of the substrate W can improve the uniformity of the contact between the electroplating solution and the front surface 50 of the substrate W to some extent, due to the existence of the edge effect, the electric field intensity of the peripheral region 52 of the substrate W is still higher than that of the central region 53, resulting in a higher current density of the peripheral region 52 of the substrate W, and the film thickness of the peripheral region 52 of the substrate is higher than that of the central region 53. In the present application, the peripheral region 52 refers to the region where the film thickness of the edge of the substrate increases. It should be noted that the central region 53 and the peripheral region 52 surrounding the central region 53 in the present application are the electroplating regions of the substrate W. Generally, there is a non-electroplating region around the electroplating region. In the embodiment shown in FIG. 1, the region where the substrate holder 2 contacts the front surface 50 of the substrate W is the non-electroplating region.

[0053] To solve the problem that the film thickness of the edge area 52 of the substrate is higher than that of the center area 53, in some embodiments, an edge plate 3 is arranged below the substrate support 2 and shields a ring of the edge area 52 of the substrate W in the vertical direction to weaken the electric field of the edge area 52 of the substrate W. The edge plate 3 is connected to the substrate support 2 below by a connecting piece 6, and the edge plate 3 has a height difference with the substrate support 2 to leave a gap 4 between the edge plate 3 and the substrate support 2, so that the electroplating solution L flows through the gap 4 to electroplate the film on the edge area 52. The size of the gap 4 affects the flow of the electroplating solution L through the edge area 52 and the current density of the edge area 52. In some embodiments, the gap 4 is not less than 0.5 mm, and is generally selected to be 2 mm to 5 mm. It can be understood that the smaller the gap 4 (i.e. the height difference between the edge plate 3 and the substrate support 2), the smaller the flow of the electroplating solution L through the edge area 52, and the smaller the current density of the edge area 52, and the smaller the film thickness of the edge area 52. That is, the film thickness of the edge area 52 can be adjusted by adjusting the size of the gap 4. As shown in FIG. 2, the edge plate 3 is connected to the substrate support 2 by a plurality of mounting portions 32 and the connecting piece 6, and the plurality of mounting portions 32 and the edge plate 3 can be an integral structure or a separate structure. In the embodiment shown in FIG. 2, the edge plate 3 is a square ring, and the plurality of mounting portions 32 can be arranged on the four corners of the edge plate 3 or on the four edges of the edge plate 3. Preferably, the mounting portions 32 are arranged on the four corners and the four edges of the edge plate 3, and the plurality of mounting portions 32 are located on the outer edges of the edge plate 3, and the mounting portions 32 on the four corners and the four edges simultaneously fix the edge plate 3 to connect the edge plate 3 and the connecting piece 6 in a tensioned state, so as to avoid the edge plate 3 from being in a sagging state during electroplating due to insufficient rigidity, which affects the shielding effect of the electric field by the edge plate 3. It should be noted that the edge plate 3 can also be designed as a circular ring as shown in FIG. 10. The edge plate 3 is generally made of an insulating material (such as polyvinyl chloride plastic), and due to the thin thickness, the rigidity is insufficient, and the fewer fixing points during fixing can cause the edge plate 3 to sag, so that the fixing effect of the plurality of point-symmetrically fixed edge plates is better. It can be conceived that in other embodiments, the edge plate can also be made of metal to increase the rigidity, but in order to avoid affecting the electroplating, an insulating coating needs to be formed on the surface of the metal. In this embodiment, due to the good rigidity of the edge plate, the fixing points of the edge plate can be appropriately reduced without affecting the fixing effect of the edge plate.

[0054] As shown in the curve "no EP" in Figure 6, without using the edge plate 3, the film thickness in the edge region is generally thicker at the outer edge and similar to the film thickness in the central region at the inner edge. Therefore, in some embodiments, the edge plate 3 is shaped as a square ring that fits the shape of the substrate W as shown in Figure 2, and in other embodiments, the edge plate 3 is shaped as a circular ring that fits the shape of the substrate W as shown in Figure 10. Different shapes of the edge plate can be designed to fit the shape of the substrate W, but in these two embodiments, only the shape of the edge plate 3 is different, and the design of the shielding portion 31 of the edge plate 3 is generally the same. Taking the embodiment shown in Figure 2 as an example, the edge plate 3 includes a shielding portion 31 extending outward from the inner circle by a certain width, the shielding portion 31 is a region extending from the inner circle to the outer circle of the edge plate 3 by a certain width, and the orthographic projection of the shielding portion 31 of the edge plate 3 overlaps with the orthographic projection of the edge region 52, that is, the shielding portion 31 has a projection in the horizontal direction of the substrate W. In order to ensure effective shielding of the edge region, in the horizontal direction, the distance from the inner circle of the shielding portion 31 to the center O of the substrate is greater than or equal to the distance from the inner circle of the edge region to the center of the substrate, and the distance from the outer circle of the shielding portion 31 to the center O of the substrate is greater than or equal to the distance from the outer circle of the edge region to the center O of the substrate. However, it is found through experiments that if only the shielding portion 31 is provided, the edge effect of the substrate after electroplating is eliminated, but there is a problem of edge film thickness in the inner circle of the edge region of the substrate to a certain range inward. That is, the shielding portion 31 does not solve the problem of the edge effect, but changes the position of the edge effect on the substrate, as shown in Figure 8(a), the complete shielding of the electric field by the shielding portion 31, the edge effect causes the current density to be larger at the inner circle of the edge region, and the electric field strength at this position is stronger. Therefore, during electroplating, referring to Figure 1 and combining with Figure 2, the shielding portion 31 is used to partially shield the electric field of a circle of the edge region 52, so that the shielding strength of the shielding portion 31 to the edge region 52 gradually decreases from outside to inside (the direction B indicated by the arrow), so as to weaken the electric field of the edge region 52 of the substrate W, and make the current density acting on the edge region 52 the same or similar to the current density acting on the central region 53, as shown in Figure 8(b), the electric field strength on the entire substrate W is uniform, so that the film thickness of the edge region 52 and the central region 53 is uniform.

[0055] In order to realize the gradually decreasing shielding strength of the shielding part 31 to the edge area from outside to inside, in some embodiments, the shielding part 31 comprises sawteeth 311 as shown in Fig. 2. In some embodiments, at least part of the inner circle of the shielding part 31 is defined as sawteeth. During the electroplating operation, the electric field can pass through the gap 312 between two adjacent sawteeth 311 as shown in Fig. 3(a), while the sawteeth 311 shield the electric field so that the electric field cannot pass through the sawteeth 311 to the edge area 52, thus the shielding part 31 can realize partial and gradually changing shielding to the electric field of the edge area 52. Since the central area 53 of the substrate W is not shielded by the shielding part 31, the sawteeth 311 are preferably sharp sawteeth, so that the shielding strength of the shielding part 31 to the electric field of the edge area 52 gradually decreases from outside to inside, and the electric field on the inner circle line of the projection area of the substrate W is not shielded by the shielding part 31, and there is no jump between the central area 53, and the shielding strength is more uniform. In order to meet the different film thickness changes in the edge area 52, the two edges of the sawteeth can be designed in different shapes, such as straight lines as shown in Fig. 3(a) to meet the linearly changing film thickness in the edge area 52, or curves as shown in Figs. 3(b) and 3(c) to meet the non-linearly changing film thickness in the edge area 52. In some embodiments, when the two edges of the sawteeth are straight lines, the sawteeth are trapezoidal sawteeth or sharp sawteeth, and accordingly, the two edges of the sawteeth intersect or the extensions of the two edges intersect. Further, the curvature of the two edges of the sawteeth can be positive as shown in Fig. 3(b) or negative as shown in Fig. 3(c), and the application does not limit the shape of the sawteeth. When the film thickness is uneven in the central area 53 and the edge area 52 of the substrate W, the film thickness in the edge area 52 after the film plating is completed can be used to select different sizes of the edge plate 3 of the projection area to re-plate other substrates W to improve the edge effect, so as to realize the uniform film thickness in the central area and the edge area of the substrate W. The size of the projection area can not only adjust the two edges of the sawteeth to be straight lines or curves, but further, the size of the projection area can also design the two edges of the sawteeth to be curves, select the shielding part 31 with a curvature close to that of the film thickness in the edge area 52 to adjust the film thickness in the edge area 52. In addition, regardless of whether the two edges of the sawteeth are straight lines or curves, the size of the projection area can also be adjusted by the size of the included angle A of the sawteeth and the length of the sawteeth as shown in Fig. 3(a), to further change the shielding strength and shielding range of the shielding part 31.

[0056] As shown in FIG. 4, in order to realize the shielding strength of the shielding part 31 to the edge area 52 gradually decreases from the edge to the center (indicated by arrow B), in other embodiments, the shielding part 31 comprises a plurality of openings 313. During the electroplating operation, electric field lines can pass through the plurality of openings 313 of the shielding part 31 shown in FIG. 5, and cannot pass through the unopened area between the openings 313 to the edge area 52 shown in FIG. 1, so the shielding part 31 can partially shield the electric field of the edge area 52. Further, in order to improve the edge effect, the opening rate of the shielding part 31 gradually decreases from the inside to the outside in the radial direction. Here, it can be understood that the opening rate of the shielding part 31 gradually decreases from the inside to the outside in the radial direction (indicated by arrow C) can be manifested as the opening density of the same aperture gradually decreases from the inside to the outside in the radial direction, or as the aperture of the opening 313 shown in FIG. 5 gradually decreases from the inside to the outside in the radial direction, and the present application does not limit the manifestation form of the opening rate of the shielding part 31 gradually decreasing from the inside to the outside in the radial direction. It can be understood that only the unopened area has a projection in the substrate W horizontal direction, and the opening has no projection in the substrate W horizontal direction. Therefore, the higher the opening rate of the shielding part 31 from the outside to the inside (indicated by arrow B), the smaller the projection area from the outside to the inside, and the shielding of the electric field of the edge area 52 by the shielding part 31 gradually decreases from the outside to the inside. In order to meet the different film thickness changes in the edge area 52, the shielding part 31 can be designed with different opening rates. The lower the opening rate of the edge area 52, the better the shielding effect of the electric field by the shielding part 31, resulting in a weaker electric field strength in the edge area 52, and a thinner film thickness in the edge area 52. Therefore, in the present embodiment, the film thickness of the edge area 52 can be changed by changing the opening rate of the shielding part 31. However, it should be pointed out that no matter how the opening rate changes, the opening rate of the shielding part 31 always gradually decreases from the inside to the outside in the radial direction. The thickness distribution of the substrate W after plating is shown in FIG. 6, where the abscissa is the substrate position and the center is the substrate center, and the ordinate is the plating thickness, with units of μm. During the electroplating operation, no edge plate 3 is installed, and the thickness after plating is shown as the curve "no EP" in FIG. 6, and the plating thickness of the edge area of the substrate is obviously higher than that of the center area. The thickness after plating with the edge plate 3 installed is shown as the curve "with EP" in the figure, the shielding part 31 of the edge plate 3 comprises a plurality of openings 313, and the opening rate gradually decreases from the inside to the outside in the radial direction, the plating thickness of the edge area of the substrate is reduced, and the film thickness of the center area and the edge area of the substrate W is close or consistent, improving the film thickness uniformity on the substrate in the prior art.

[0057] In addition, the edge plate 3 can be designed according to the shape and number of the electroplating area on the substrate W. In the above-mentioned embodiment, the electroplating area of the substrate W is a whole square, and the edge plate 3 includes a square ring-shaped shielding portion 31 and acts on the edge area of the electroplating area of the substrate W. In another embodiment, the substrate W has non-electroplating areas, which divide the substrate W into a plurality of square electroplating areas, as shown in Fig. 7, and the edge plate 3 includes a plurality of square ring-shaped shielding portions 31 and acts on the edge area of the plurality of electroplating areas of the substrate W. In another embodiment, the electroplating area of the substrate W is a whole circle, and the edge plate 3 includes a circular ring-shaped shielding portion 31, as shown in Fig. 10. The inner circle of the shielding portion 31 includes a plurality of sawteeth, which are designed in the same way as those in the embodiment shown in Fig. 3. The edge of the electroplating area of the substrate falls within the projection range of the shielding portion on the substrate, and the projection range of the shielding portion on the substrate gradually decreases from outside to inside so that the electric field shielding strength of the shielding portion on the edge area gradually decreases from outside to inside. In another embodiment not shown, the shape and number of the shielding portion 31 on the edge plate 3 can be other forms, which are determined according to the shape and number of the electroplating area of the substrate W.

[0058] To solve the problem that the film thickness of the edge area 52 of the substrate is higher than that of the center area 53, in some embodiments, as shown in Fig. 9, an electroplating device is provided, which includes an electroplating cavity 1 for storing an electroplating solution L, a substrate support 2 for holding a substrate W, and a diffusion plate 7 installed in the electroplating cavity 1, wherein the diffusion plate 7 includes a plurality of holes 71 for allowing the electroplating solution to flow through. Different from the embodiment shown in Fig. 1, in which the edge plate 3 is connected to the substrate support 2, in the present embodiment, the edge plate 3 of the electroplating device is installed in the electroplating cavity 1 and above the diffusion plate 7, and the edge plate 3 is immersed in the electroplating solution. Therefore, when the electroplating device is used to electroplate the substrate W, different from the embodiment shown in Fig. 1, in which the edge plate 3 rotates synchronously with the substrate support 2, in the present embodiment, the edge plate 3 does not rotate synchronously with the substrate W. In the present embodiment, the substrate W is circular, and the inner circle of the edge plate 3 extends outwardly by a certain width to form a shielding portion 31, which includes a plurality of sawteeth and is designed in the same way as the embodiment shown in Fig. 1. The edge of the electroplating area of the substrate falls within the projection range of the shielding portion on the substrate, and the projection range of the shielding portion on the substrate gradually decreases from outside to inside so that the electric field shielding strength of the shielding portion on the edge area gradually decreases from outside to inside. The design of the sawteeth is the same as that in the embodiments shown in Figs. 1 and 3, and thus will not be described herein.

[0059] The above embodiments are only illustrative of the principles of the present application and its effects, and are not intended to limit the present application. Any modification or change made by any person skilled in the art without departing from the spirit and scope of the present application shall be covered by the claims of the present application.

Claims

1. An electroplating apparatus for a substrate, the substrate comprising an electroplating area, the electroplating area comprising a center area and an edge area surrounding the center area, characterized in that, The application relates to a substrate support device for electroplating a substrate, comprising: a substrate support for holding and rotating the substrate; an edge plate connected below the substrate support; wherein the edge plate comprises a ring-shaped shielding part, a circle of edges of the electroplating area falls within the projection range of the shielding part on the substrate, and the projection range of the shielding part on the substrate gradually decreases from outside to inside so that the electric field shielding strength of the shielding part to the edge area gradually decreases from outside to inside.

2. The electroplating apparatus of claim 1, wherein The shielding part comprises sawteeth.

3. The electroplating apparatus of claim 2, wherein The sawteeth are sharp-angle sawteeth.

4. The electroplating apparatus of claim 2, wherein The profile of the sawteeth comprises two edges intersecting or the extensions of the two edges intersecting.

5. The electroplating apparatus of claim 2, wherein The two edges of the sawteeth are curved lines.

6. The electroplating apparatus of claim 5, wherein The curvature of the curved line is positive.

7. The electroplating apparatus of claim 5, wherein The curvature of the curved line is negative.

8. The electroplating apparatus according to any one of claims 5 to 7, wherein The shielding part is configured to adjust the projection range by setting the included angle of the sawteeth.

9. The electroplating apparatus of claim 1, wherein The shielding part comprises a plurality of openings, and the opening rate of the plurality of openings gradually decreases from the inner circle to the outer circle of the shielding part.

10. The electroplating apparatus of claim 9, wherein The plurality of openings have the same aperture, and the opening density gradually decreases from the inner circle to the outer circle of the shielding part.

11. The electroplating apparatus of claim 9, wherein The plurality of openings have the same opening density, and the aperture gradually decreases from the inner circle to the outer circle of the shielding part.

12. The electroplating apparatus of claim 1, wherein The number of the electroplating areas is plural, and the edge plate comprises shielding parts equal in number to the electroplating areas.

13. The electroplating apparatus of claim 1, wherein The edge plate and the substrate support have a gap for allowing the electroplating solution to flow between the edge plate and the substrate support.

14. The electroplating apparatus of claim 1, wherein Further comprising a plurality of mounting parts for mounting the edge plate on the substrate support through the plurality of mounting parts, the plurality of mounting parts are located on the four corners and / or four edges of the edge plate, and the plurality of mounting parts are configured to connect the edge plate to the substrate support in a tensioned state.

15. The electroplating apparatus of claim 1, wherein, In the horizontal direction, the distance from the inner circle of the shielding part to the center of the substrate is greater than or equal to the distance from the inner circle of the edge area to the center of the substrate, and the distance from the outer circle of the shielding part to the center of the substrate is greater than or equal to the distance from the outer circle of the edge area to the center of the substrate.

16. The electroplating apparatus of claim 1, wherein The substrate is square, and the shielding part is square ring-shaped.

17. The electroplating apparatus of claim 1, wherein The substrate is circular, and the shielding part is circular ring-shaped.

18. An electroplating apparatus for a circular substrate, the substrate comprising an electroplating area, the electroplating area comprising a central area and an edge area surrounding the central area, characterized in that, The application relates to a substrate support device for electroplating a substrate, comprising: an electroplating cavity for storing an electroplating solution; a diffusion plate installed in the electroplating cavity and comprising a plurality of holes allowing the electroplating solution to flow through; an edge plate installed above the diffusion plate and immersed in the electroplating solution; wherein the edge plate comprises a circular ring-shaped shielding part, a circle of edges of the electroplating area falls within the projection range of the shielding part on the substrate, and the projection range of the shielding part on the substrate gradually decreases from outside to inside so that the electric field shielding strength of the shielding part to the edge area gradually decreases from outside to inside.

19. The electroplating apparatus of claim 18, wherein, The shielding part comprises sawteeth.

20. The electroplating apparatus of claim 19, wherein, The sawteeth are sharp-angle sawteeth.

21. The electroplating apparatus of claim 19, wherein, The profile of the sawteeth comprises two edges intersecting or the extensions of the two edges intersecting.

22. The electroplating apparatus of claim 19, wherein, The two edges of the sawteeth are curved lines.

23. The electroplating apparatus of claim 22, wherein, The curvature of the curved line is positive.

24. The electroplating apparatus of claim 22, wherein, The curvature of the curved line is negative.

25. The electroplating apparatus of any one of claims 19-24, wherein, The shielding part is configured to adjust the projection range by setting the included angle of the sawteeth.

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