Plate material processing method and processing device

Abstract

A plate material processing method according to the present invention is a method for processing a plate material having a plurality of patterns imparted thereto, and includes: a first clamping step for clamping the plate material, which has been conveyed to a first cutting position, on at least one side, in a first cutting direction, of the first cutting position; a slit forming step for forming slits that penetrate through the plate material in a plate thickness direction and do not reach either of the ends in the first cutting direction; a second clamping step for clamping the plate material, which has been conveyed to a second cutting position different from the first cutting position, on each of mutually opposite sides, in a second cutting direction, of the second cutting position; and a dividing step for conveying the plate material in which the slits have been formed to the second cutting position and cutting the plate material along the second cutting direction to divide the plate material.

Description

Method and apparatus for processing a plate material

[0001] The present invention relates to a method and an apparatus for processing a plate material.

[0002] Conventionally, in a method for processing a printed plate material on which a wiring pattern or the like is printed, a plurality of wiring patterns are printed on a single printed board, and a cutting process is performed to obtain a plurality of printed circuit boards (see, for example, Patent Documents 1 to 3). In Patent Documents 1 to 3, a perforation or a V-shaped groove is formed in the printed board by a cutting process, and the printed board is bent through the cutting position to divide the printed circuit board.

[0003] FIGS. 13 to 16 are diagrams for explaining a conventional method for manufacturing a substrate (printed board). In the drawings, the printing surface is arranged parallel to the XY plane, and the direction orthogonal to the XY plane is the Z direction (the thickness direction of the printed board). In the cutting process of the printed board 500 on which a plurality of wiring patterns are printed, the printed board 500 is sandwiched by the first cutter 601 and the second cutter 602 and moved in the Y direction to perform the cutting process (see FIG. 13). In this cutting process, for example, the process is performed at a plurality of locations along the broken line. At this time, the first cutter 601 and the second cutter 602 are separated in the Z direction, and bottomed grooves 500a, 500b (see FIG. 14) for dividing each wiring pattern are formed in the printed board 500 by the cutters.

[0004] When the grooves 500a, 500b are formed, the printed board 500 is divided by bending the grooves (see FIG. 15). By repeating this dividing process while changing the orientation of the printed board until it becomes a printed circuit board unit, a plurality of printed circuit boards 501 are obtained (see FIG. 16). In this dividing process, burrs and deformation of the substrate may occur due to bending.

[0005] To reduce the division process described above, it is conceivable to completely cut the printed circuit board with a cutter. Figures 17 and 18 illustrate a conventional method for manufacturing a substrate (printed circuit board). In this cutting process, the printed circuit board 500 is cut by clamping it with a first cutter 601 and a second cutter 602 and moving them in the X direction (see Figure 17). At this time, the first cutter 601 and the second cutter 602 overlap without interfering with each other in the Z direction, and the printed circuit board 500 is completely cut by the cutter (see Figure 18). By repeating this division process while changing the orientation of the printed circuit board until a printed circuit board unit is obtained, multiple printed circuit boards 501 (see Figure 16) can be obtained.

[0006] JP 7-164392 JP 8-64915 JP 2010-283120

[0007] However, if the circuit board is cut completely, it becomes difficult to recover the printed circuit board because the board is divided at the point of cutting with a cutter. In addition, complete cutting can cause the cut parts to separate and deform, resulting in misaligned cuts and making it impossible to properly divide the board.

[0008] The present invention has been made in view of the above, and aims to provide a method and apparatus for processing sheet materials that can appropriately divide sheet materials while suppressing the occurrence of burrs and deformation of the substrate.

[0009] To solve the above-mentioned problems and achieve the objective, the present invention provides a method for processing a sheet material to which a plurality of patterns have been applied, comprising: a first clamping step of clamping the sheet material, which has been transported to a first cutting position, at least one side of the sheet material relative to the first cutting position in a first cutting direction; a slit forming step of forming a slit in the sheet material that penetrates in the thickness direction and does not reach both ends in the first cutting direction; a second clamping step of clamping the sheet material, which has been transported to a second cutting position different from the first cutting position, on opposite sides of the sheet material via the second cutting position in a second cutting direction where the cutting direction to the sheet material is different from the first cutting direction; and a dividing step of transporting the sheet material with the slits formed thereon to a second cutting position and dividing the sheet material by cutting it along the second cutting direction.

[0010] Furthermore, the method for processing a sheet material according to the present invention is characterized in that, in the above invention, the slit forming step is performed by cutting the sheet material from the side closer to the gripping side to form the slit.

[0011] Furthermore, the method for processing a sheet material according to the present invention is characterized in that, in the above invention, the dividing step involves cutting the sheet material from the side furthest from the gripping side to divide the sheet material.

[0012] Furthermore, the method for processing sheet material according to the present invention is characterized in that, in the above invention, the dividing step further includes a recovery step of cutting the sheet material while it is clamped by the second clamping step, and recovering the divided sheet material by chucking the side opposite to the second cut position relative to the clamping position.

[0013] Furthermore, the processing apparatus according to the present invention is a processing apparatus for processing a plate material to which a plurality of patterns have been applied, and is characterized by comprising: a first clamp that clamps at least one side of the plate material with respect to the first cut position in a first cutting direction when the plate material has been transported to a first cut position; a first cutter that penetrates the plate material in the thickness direction and forms slits that do not reach both ends in the first cut direction; a second clamp that clamps the plate material with opposite sides via the second cut position in a second cut direction in which the cutting direction to the plate material is different from the first cut direction when the plate material has been transported to a second cut position different from the first cut position; a second cutter that transports the plate material with the slits formed thereon to a second cut position and cuts the plate material along the second cut direction to divide the plate material; and a control device that controls the operation of the first and second clamps and the first and second cutters.

[0014] According to the present invention, the plate material can be appropriately divided while suppressing the occurrence of burrs and deformation of the substrate.

[0015] Figure 1 is a diagram (part 1) illustrating a method for processing sheet material according to one embodiment of the present invention. Figure 2 is a diagram showing the shape of the cut surface after cutting. Figure 3 is a diagram (part 2) illustrating a method for processing sheet material according to one embodiment of the present invention. Figure 4 is a diagram (part 3) illustrating a method for processing sheet material according to one embodiment of the present invention. Figure 5 is a diagram (part 1) illustrating the operation during cutting in the method for processing sheet material according to one embodiment of the present invention. Figure 6 is a diagram (part 2) illustrating the operation during cutting in the method for processing sheet material according to one embodiment of the present invention. Figure 7 is a diagram (part 3) illustrating the operation during cutting in the method for processing sheet material according to one embodiment of the present invention. Figure 8 is a diagram illustrating the arrangement of the cutter. Figure 9 is a flowchart showing the flow of the cutting process according to one embodiment of the present invention. Figure 10 is a diagram (part 4) illustrating the operation during cutting in the method for processing sheet material according to one embodiment of the present invention. Figure 11 is a diagram (part 5) illustrating the operation during cutting in the method for processing sheet material according to one embodiment of the present invention. Figure 12 is a diagram illustrating an example of picking a printed circuit board according to one embodiment of the present invention. Figure 13 is a diagram (1) illustrating a conventional method of processing board material. Figure 14 is a diagram (2) illustrating a conventional method of processing board material. Figure 15 is a diagram (3) illustrating a conventional method of processing board material. Figure 16 is a diagram (4) illustrating a conventional method of processing board material. Figure 17 is a diagram (5) illustrating a conventional method of processing board material. Figure 18 is a diagram (6) illustrating a conventional method of processing board material.

[0016] The following description will explain a method for processing sheet material and an apparatus for processing sheet material as embodiments for carrying out the present invention (hereinafter referred to as "embodiments"). Furthermore, the present invention is not limited to these embodiments. In addition, the same parts are denoted by the same reference numerals in the drawings. Furthermore, it should be noted that the drawings are schematic, and the relationship between the thickness and width of each component, the ratio of each component, etc., may differ from reality. Also, there are parts in the drawings where the dimensions and ratios differ from each other.

[0017] (Embodiment) Figures 1, 3, and 4 are diagrams illustrating a method for processing a plate material (printed board) according to one embodiment of the present invention. Figure 2 is a diagram showing the shape of the cut surface after cutting. In the drawings, the printed surface is arranged parallel to the XY plane, and the direction perpendicular to the XY plane is defined as the Z direction (thickness direction of the printed board). In this embodiment, a printed board 100 on which multiple independent wiring patterns are printed is cut and divided according to the wiring patterns to obtain multiple printed circuit boards.

[0018] In the cutting process of the printing plate 100, first, the printing plate 100 is clamped from the Z direction by the first cutter 201 and the second cutter 202, and the first cutting process is performed on the printing plate 100 by moving the cutters in the X direction while rotating them. In this first cutting process, for example, the process is performed at multiple locations along the dashed line shown in Figure 1. At this time, the first cutter 201 and the second cutter 202 cut the printing plate 100 leaving both ends in the X direction intact. As a result, after the cutting process, slits 100a and 100b are formed in the printing plate 100 that extend from one end in the X direction to the other end, but do not reach (are not reached) both ends in the X direction (see Figure 3).

[0019] Subsequently, a second cutting process is performed, cutting along a direction perpendicular to the cutting direction of the first cutting process (in this case, the X direction) (in this case, the Y direction) (see Figure 3). In this second cutting process, for example, the process is performed at multiple locations along the dashed line shown in Figure 3. At this time, the first cutter 201 and the second cutter 202 pass through both ends of the printing board 100 in the Y direction, cutting the printing board 100 from one end to the other in the Y direction. As a result, multiple printed circuit boards 101 can be obtained from a single printing board 100 (see Figure 4). Although the above description of the second cutting process shows an example where the cutter passes through both ends of the printing board 100 to cut, it is also possible to leave both ends in the Y direction intact, similar to the first cutting process.

[0020] Next, the control during the cutting process will be explained with reference to Figures 5 to 10. First, the cutting process will be explained with reference to Figures 5 to 8. Figures 5 to 7 are diagrams illustrating the operation during the cutting process in a method for processing a plate material (printing board) according to one embodiment of the present invention. During the cutting process, one end of the printing board 100 in the Y direction is gripped by the first gripping part 301 and moved in the Y direction to be transported to the processing position (see Figure 5).

[0021] The printed plate 100, which has been transported to the processing position, is clamped by a first clamp 311 and a second clamp 321, which are located on opposite sides of the cutting position 102 in the Y direction. Specifically, the first clamp 311 is located on one side of the Y direction relative to the cutting position 102, and the second clamp 321 is located on the other side of the Y direction relative to the cutting position 102.

[0022] The first clamp 311 has a first contact portion 311A ​​located on one side of the Z-direction relative to the printing plate 100 and movable in the Z-direction, and a second contact portion 311B located on the other side of the Z-direction relative to the printing plate 100 and movable in the Z-direction. The second clamp 321 has a third contact portion 321A located on one side of the Z-direction relative to the printing plate 100 and movable in the Z-direction, and a fourth contact portion 321B located on the other side of the Z-direction relative to the printing plate 100 and movable in the Z-direction. It is preferable that the clamps contact and hold the printing plate 100 in the cutting direction, including at least the entire cutting range, from the viewpoint of suppressing vibration of the printing plate 100 during cutting.

[0023] The first clamp 311 and the second clamp 321 clamp the printing plate 100 by moving the first contact portion 311A, the second contact portion 311B, the third contact portion 321A, and the fourth contact portion 321B toward the printing plate 100 under the control of the control device (see Figure 6). Alternatively, the contact portion located below in the Z direction may be fixed, and only one of the contact portions may be driven to perform the clamping.

[0024] After clamping the printing plate 100, the first cutter 201 and the second cutter 202 cut the printing plate 100 (see Figure 7). In the case shown in Figure 7, the first cutter 201 and the second cutter 202 are moved in the X direction while rotating to cut the printing plate 100. At this time, the first cutter 201 and the second cutter 202 are rotated in sync with the motors that drive each cutter, under the control of the control device.

[0025] Figure 8 is a diagram illustrating the arrangement of the cutters. The first cutter 201 and the second cutter 202 overlap by a length OW in the Z direction. At this time, the first cutter 201 and the second cutter 202 rotate so that their blades do not interfere with each other. For example, as shown in Figure 8, when the first cutter 201 and the second cutter 202 rotate, the tooth 201a of the second cutter 202 fits between the teeth 201a and 201b of the first cutter 201, so that the blades do not interfere with each other. In this way, the rotation of the first cutter 201 and the second cutter 202 performs a cutting process that penetrates the printing plate 100 in the thickness direction.

[0026] Next, the operation of the printed board during the cutting process will be explained with reference to Figures 9 to 11. Figure 9 is a flowchart showing the flow of the cutting process according to one embodiment of the present invention. Figures 10 and 11 are diagrams illustrating the operation during the cutting process in the plate material (printed board) processing method according to one embodiment of the present invention. The processing device 110 that performs the cutting process comprises a processing unit 120 and a control device 130 that drives and controls each part of the processing unit 120.

[0027] The processing unit 120 includes a first gripping unit 301 capable of gripping the printing plate 100 and reciprocating in the Y direction, a second gripping unit 302 capable of gripping the printing plate 100 and reciprocating in the X direction, a first processing unit 310A that performs a first cutting process, and a second processing unit 310B that performs a second cutting process. In the example shown in Figures 10 and 11, the first processing unit 310A and the second processing unit 310B are shown to be arranged so that their cutting directions are perpendicular to each other.

[0028] The first gripping unit 301 includes a transport chuck structure that includes a gripping unit for gripping the printing plate 100. The first gripping unit 301 reciprocates in the Y direction under the control of the control device 130.

[0029] The second gripping section 302 includes a transport chuck structure that includes a gripping section for gripping the printing plate 100. The second gripping section 302 reciprocates in the X direction under the control of the control device 130. The gripping sections of the first gripping section 301 and the second gripping section 302 may grip the printing plate 100 by pressing them against the surface of the printing plate 100, or they may grip the printing plate 100 by adsorption to the surface of the printing plate 100 through suction or the like.

[0030] The first processing unit 310A includes the first cutter 201 and the second cutter 202 (first cutter: only the first cutter 201 is shown in Figures 10 and 11), as well as the first clamp 311 and the second clamp 321, and performs the cutting process by moving the cutter in the X direction while rotating it. The first processing unit 310A cuts the printing plate 100 between the first clamp 311 and the second clamp 321 and along the cutting position 102 that extends in the X direction. In the first cutting process (for example, the first cutting process) of an uncut printing plate 100 that has not been cut, the plate may be clamped by at least one of the first clamp 311 and the second clamp 321.

[0031] The second processing unit 310B includes two cutters (third cutter 203 and fourth cutter 204 (second cutter): only the third cutter 203 is shown in Figures 10 and 11) having the same shape as the first cutter 201 and second cutter 202 described above, as well as two clamps (third clamp 331 and fourth clamp 341) that clamp the printing plate 100, similar to the first clamp 311 and second clamp 321, and performs the cutting process by moving the cutter in the Y direction while rotating it. The third clamp 331 and fourth clamp 341 are provided on opposite sides of the cutting position 103 in the X direction. The second processing unit 310B cuts the printing plate 100 between the third clamp 331 and fourth clamp 341 and along the cutting position 103 that extends in the Y direction.

[0032] The control device 130 is configured using hardware such as a CPU (Central Processing Unit), GPU (Graphics Processing Unit), FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), and CPLD (Complex Programmable Logic Device), as well as memory on which various programs and other data are installed.

[0033] When the cutting process begins, the first gripping unit 301 grips the printing plate 100 and transports the printing plate 100 to the first processing unit 310A (see Figure 10). At this time, the first processing unit 310A first transports the printing plate 100 to a position where the processing position closest to the gripping side by the first gripping unit 301 coincides with the cutting position 102. Then, the printing plate 100 is clamped by the first clamp 311 and the second clamp 321 (step S101: first clamping step), and the cutting process is performed by the first cutter 201 and the second cutter 202 (step S102: slit forming step). After that, the first gripping unit 301 sequentially positions the processing position and the cutting position 102 of the printing plate 100 in a direction away from the first processing unit 310A, and performs the cutting process by the first cutter 201 and the second cutter 202. In this way, the first clamping process and the slit forming process are repeated while moving the processing position according to the number of slits to be formed. As a result, multiple slits (slits 100a to 100d) are formed that penetrate the printing plate 100 in the thickness direction from the first gripping portion 301 side, and do not reach both ends in the X direction. The processing start position is not limited to the processing position closest to the gripping side, but can be set as appropriate to the furthest side, the center, etc.

[0034] After cutting in the X direction, the printing plate 100 is switched from being held by the first gripping part 301 to being held by the second gripping part 302 (see Figure 11). The second gripping part 302 then grips the printing plate 100 and transports it to the second processing unit 310B. At this time, the second gripping part 302 transports the printing plate 100 to a position where the processing position furthest from the gripping side by the second gripping part 302 coincides with the cutting position 103. Then, the printing plate 100 is clamped by the third clamp 331 and the fourth clamp 341 (step S103: second clamping step), and the printing plate 100 is divided by cutting with the third cutter 203 and the fourth cutter 204 (step S104: dividing step). Subsequently, the second gripping unit 302 moves towards the second processing unit 310B, sequentially aligning the processing position of the printed circuit board 100 with the cutting position 103, and performing the cutting process with the third cutter 203 and the fourth cutter 204. In this way, the second clamping process and the dividing process are repeated while moving the processing position according to the number of cuts required for dividing. As a result, the printed circuit board is divided starting from the side furthest from the second gripping unit 302. At this time, a container for receiving the printed circuit board is provided in the second processing unit 310B below the cutting position 103, and the multiple printed circuit boards generated after the cutting process are housed in this container.

[0035] The printed circuit boards contained in the container are picked up by, for example, a transport arm and transported to the processing recovery position. In addition to recovery by container, picking may also be performed by chucking the printed circuit board while a clamp is gripping it. Figure 12 is a diagram illustrating an example of picking a printed circuit board according to one embodiment of the present invention. For example, during the splitting process, the board material is cut while clamped by the second clamping process, and the side opposite to the cut position 103 (opposite to the second gripping part 302) relative to the clamping position by the fourth clamp 341 is chucked by the transport arm 303 to hold the split printed circuit board. After that, the clamp is separated from the printed board 100, and the chucked printed circuit board is transported to the recovery position by the transport arm 303 for recovery.

[0036] In the above-described embodiment, the printed board 100 is clamped at positions opposite to the cutting position, and a cutting process is performed to penetrate the printed board 100 in the thickness direction while it is clamped. According to this embodiment, when cutting with a cutter, both sides in the direction of the cutter's movement are clamped and fixed, so vibrations of the printed board 100 are suppressed, and the board material can be appropriately divided while suppressing the occurrence of burrs and deformation of the substrate. Furthermore, because the suppression of vibrations of the printed board 100 suppresses misalignment during cutting, the position where the length in the X direction or Y direction is longest in the thickness direction (corresponding to the Z direction) of the cut printed board (or printed circuit board) can be made to coincide with the center in the thickness direction (center of the thickness), that is, the end face (cut surface) can be made to pass through the center of the thickness and have a shape symmetrical with respect to a plane perpendicular to the thickness direction. Furthermore, by suppressing vibrations of the printing plate 100, the cutting process can be stabilized, allowing the cutting point to coincide with the center in the thickness direction as described above. In addition, it is possible to intentionally shift the position where the length in the X or Y direction is longest in the thickness direction (corresponding to the Z direction) relative to the thickness direction.

[0037] Furthermore, according to this embodiment, when the cutting process is performed in the first processing unit 310A, slits are formed that do not reach both ends of the printing board 100 in the cutting direction, and the printing board 100 is transported to the second processing unit 310B without being completely separated. As a result, the printing board 100, on which multiple wiring patterns are printed, can be efficiently and quickly divided into multiple printed circuit boards.

[0038] Furthermore, according to this embodiment, if a conventional V-shaped groove with a closed bottom (grooves 500a, 500b (see Figure 14)) is used in the cutting process, the plate is not completely cut, so there is no escape route for the chips generated during cutting, and the chips tend to re-adhere to the plate. In contrast, in this embodiment, where the plate is completely cut by the cutting process, the re-adhesion of chips to the plate is reduced, and the quality of the substrate due to cutting can be improved.

[0039] Thus, the present invention may include various embodiments not described herein, and various design modifications can be made without departing from the technical idea specified by the claims. In the embodiments described above, an example was given in which a rectangular printed circuit board is cut by cutting in mutually orthogonal directions, but the cutting direction and the number of processing areas can be adjusted according to the outer edge shape of the printed circuit board.

[0040] Furthermore, although the above-described embodiment explained an example of dividing a printed board on which a wiring pattern is printed, it can also be applied to a cutting process that divides a board material into multiple divided boards.

[0041] As described above, the plate material processing method and processing apparatus according to the present invention are suitable for appropriately dividing plate material while suppressing the occurrence of burrs and deformation of the substrate.

[0042] 100 Printed board 100a-100d Slit 101 Printed circuit board 110 Processing unit 120 Processing unit 130 Control unit 201 First cutter 202 Second cutter 203 Third cutter 204 Fourth cutter 301 First gripping unit 302 Second gripping unit 303 Transport arm 311 First clamp 311A ​​First contact unit 311B Second contact unit 321 Second clamp 321A Third contact unit 321B Fourth contact unit 331 Third clamp 341 Fourth clamp

Claims

1. A method for processing a plate material to which multiple patterns have been applied, comprising: a first clamping step of clamping at least one side of the plate material, which has been transported to a first cutting position, with respect to the first cutting position in a first cutting direction; a slit forming step of forming slits in the plate material that penetrate in the thickness direction and do not reach both ends in the first cutting direction; a second clamping step of clamping the plate material, which has been transported to a second cutting position different from the first cutting position, with respect to the plate material, on opposite sides via the second cutting position in a second cutting direction where the cutting direction to the plate material is different from the first cutting direction; and a dividing step of transporting the plate material with the slits formed thereon to a second cutting position and dividing the plate material by cutting it along the second cutting direction.

2. The method for processing a sheet material according to claim 1, characterized in that the slit forming step is performed by cutting the sheet material from the side closer to the gripping side to form the slit.

3. The method for processing a sheet material according to claim 1, characterized in that the dividing step involves cutting the sheet material from the side furthest from the gripping side.

4. The method for processing a sheet material according to claim 1, wherein the dividing step further includes a collection step of cutting the sheet material while it is clamped by the second clamping step, and chucking the side opposite to the second cut position relative to the clamping position to collect the divided sheet material.

5. A processing apparatus for processing a plate material to which multiple patterns have been applied, comprising: a first clamp that clamps the plate material, which has been transported to a first cutting position, at least one side of the plate material relative to the first cutting position in a first cutting direction; a first cutter that penetrates the plate material in the thickness direction and forms slits that do not reach both ends in the first cutting direction; a second clamp that clamps the plate material, which has been transported to a second cutting position different from the first cutting position, on opposite sides of the plate material via the second cutting position in a second cutting direction where the cutting direction to the plate material is different from the first cutting direction; a second cutter that transports the plate material with the slits formed thereon to a second cutting position and cuts the plate material along the second cutting direction to divide the plate material; and a control device that controls the operation of the first and second clamps and the first and second cutters.

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