Substrate for component placement

Abstract

The present invention comprises: a flat plate member (1) on which a plurality of electronic components (C1) are disposed; a plurality of permanent magnets (2) that are disposed along a first direction (x-axis direction) on a surface of the flat plate member (1) and that have polarities oriented in the same direction; and a rotation mechanism (3) that rotates the flat plate member (1) about a first axis (x-axis) and a second axis (y-axis).

Description

Component placement board

[0001] This disclosure relates to a component placement substrate for arranging electronic components.

[0002] Space structures such as space stations and satellites orbiting in outer space are exposed to cosmic radiation caused by solar flares and other factors. When cosmic radiation irradiates electronic components such as LSIs, problems such as malfunctions can occur.

[0003] Non-patent document 1 discloses a technique for protecting electronic components from cosmic radiation, which involves generating a magnetic field using a solenoid to change the direction of incoming radiation.

[0004] Valerio Calvelli, A Novel Configuration for Superconducting SpaceRadiation Shields, IEEE TRANSACTIONS, Internet [Retrieved September 13, 2024] <https: / / ieeexplore.ieee.org / document / <7792167> <000000>

[0005] The magnetic field generated by a magnetic field source decreases rapidly as the distance from the source increases. In the technology disclosed in Non-Patent Document 1, when protecting a substrate with many electronic components from radiation, it is necessary to set a large deflection angle for the radiation, which requires the generation of a very strong magnetic field, resulting in the problem of the magnetic field source becoming large.

[0006] This disclosure is made in view of the above circumstances, and its purpose is to provide a component placement substrate that can protect electronic components from cosmic radiation without increasing the size of the magnetic field source.

[0007] A component placement substrate according to one aspect of the present disclosure comprises a flat plate member on which a plurality of electronic components are arranged, a plurality of permanent magnets arranged along a first direction on the surface of the flat plate member and having the same polarity facing in the same direction, and a rotation mechanism for rotating the flat plate member about a first axis and a second axis.

[0008] According to this disclosure, it will be possible to protect electronic components from cosmic radiation without increasing the size of the magnetic field source.

[0009] Figure 1 is an explanatory diagram showing the Lorentz force acting on a charged particle entering a magnetic field. Figure 2 is an explanatory diagram showing the principle of changing the direction of incoming radiation by generating a magnetic field on the barrier surface. Figure 3A is an explanatory diagram showing how planar electronic components are arranged along a plane that is substantially perpendicular to the direction of incoming radiation. Figure 3B is an explanatory diagram showing how planar electronic components are arranged along a plane that is substantially parallel to the direction of incoming radiation. Figure 4 is a schematic perspective view showing the configuration of a component placement substrate and electronic components arranged on the component placement substrate according to an embodiment. Figure 5 is a side view of the component placement substrate shown in Figure 4. Figure 6 is a block diagram showing the configuration of the rotation mechanism. Figure 7 is a side view of the component placement substrate and is an explanatory diagram showing the direction of radiation propagation when radiation is directed towards the barrier surface in the z-axis direction.

[0010] The embodiments will be described below with reference to the drawings. First, the principle by which generating a magnetic field near a space structure deflects cosmic radiation (hereinafter abbreviated as "radiation") that is flying towards the space structure will be explained with reference to Figures 1 and 2.

[0011] Figure 1 is an explanatory diagram illustrating the Lorentz force acting on a charged particle m1 (radiation) when it arrives in a plane where a magnetic field B1 is present. As shown in Figure 1, when a charged particle m1 such as a proton arrives in a space where a magnetic field B1 is present from the direction of arrow Y1, a Lorentz force F acts on the charged particle m1 in a direction perpendicular to the magnetic field B1.

[0012] Figure 2 is a schematic diagram illustrating how a barrier surface S1 protects a space structure V1, such as an artificial satellite, from incoming cosmic radiation. As shown in Figure 2, a barrier surface S1 is formed by generating a magnetic field B1 around the space structure V1. Radiation h1, such as protons, flying towards the space structure V1 from the direction of arrow Y1 (z-axis direction) is affected by the Lorentz force F at the barrier surface S1, changing its direction of irradiation. That is, radiation flying towards the space structure V1 from the direction of arrow Y1 in outer space is deflected, for example, in the direction of arrow Y2. Therefore, the space structure V1 can be protected from radiation.

[0013] Figure 3A is an explanatory diagram showing how an electronic component C1 having a planar shape is arranged on a plane that is substantially perpendicular to the direction of incoming radiation. The electronic component C1 is, for example, an LSI (Large Scale Integration). In this arrangement, radiation h1 arrives from a direction substantially normal to the substrate surface of the electronic component C1. By forming the barrier surface S1 shown in Figure 2 at the position where radiation h1 arrives on the electronic component C1, the radiation h1 arriving from the direction of arrow Y1 is deflected in the direction of arrow Y11 by the magnetic field B1. By deflecting the radiation h1, it is possible to avoid the radiation h1 irradiating the electronic component C1 and protect the electronic component C1 from radiation h1.

[0014] Figure 3B is an explanatory diagram showing how an electronic component C1 having a planar shape is arranged along a plane that is substantially parallel to the direction of incoming radiation. The electronic component C1 is, for example, an LSI. In this arrangement, radiation h1 is emitted from a direction substantially parallel to the substrate surface of the electronic component C1. By forming the barrier surface S1 shown in Figure 2 at the position where the radiation h1 is emitted onto the electronic component C1, the radiation h1 emitted from the direction of arrow Y1 is deflected in the direction of arrow Y13 by the magnetic field B1. By deflecting the radiation h1, it is possible to avoid the radiation h1 irradiating the electronic component C1 and to protect the electronic component C1 from radiation h1.

[0015] As can be understood by comparing Figures 3A and 3B above, when the substrate surface of the electronic component C1 is positioned approximately perpendicular to the direction Y1 from which radiation h1 is coming, it is necessary to generate a strong Lorentz force F with respect to the radiation h1. In detail, as shown in Figure 3A, in order to avoid radiation h1 irradiating the electronic component C1, it is necessary to increase the deflection angle to deflect the direction from which radiation h1 is coming in the direction of arrow Y11. That is, a strong Lorentz force is required.

[0016] On the other hand, if the substrate surface of the electronic component C1 is positioned approximately parallel to the direction Y1 from which the radiation h1 is coming, a weak Lorentz force F relative to the radiation h1 can prevent the radiation h1 from irradiating the electronic component C1. In detail, as shown in Figure 3B, in order to prevent the radiation h1 from irradiating the electronic component C1, the direction from which the radiation h1 is coming should be deflected in the direction of arrow Y13. That is, a small deflection angle is sufficient, so a strong Lorentz force is not required.

[0017] In this embodiment, the component placement substrate 100 avoids irradiation of each electronic component with radiation h1 at a small deflection angle by changing the position of the flat plate member 1 on which the electronic component C1 is placed so that the orientation of the substrate surface of the electronic component C1 substantially coincides with the direction of the incoming radiation h1. This reduces the size of the magnetic field source (permanent magnet). A detailed explanation follows below.

[0018] Figure 4 is a schematic perspective view showing the configuration of a component placement substrate 100 and an electronic component C1 arranged on the component placement substrate 100 according to the embodiment. Figure 5 is a side view of the component placement substrate 100 shown in Figure 4. As shown in Figure 4, the component placement substrate 100 according to the embodiment includes a flat plate member 1 having a flat rectangular shape, a plurality of long rectangular permanent magnets 2, and a rotating mechanism 3.

[0019] Multiple (three in the figure) electronic components C1 are arranged on the surface side of the flat plate member 1. The electronic components C1 are, for example, LSIs and are mounted on the flat plate-shaped substrate surface. That is, the substrate surface of the electronic components C1 is arranged parallel to the flat plate member 1.

[0020] Multiple permanent magnets 2 (seven in the figure) are arranged on both the front and back sides of the side edge H1 of the flat plate member 1. The spacing between adjacent permanent magnets 2 is approximately equal. That is, each permanent magnet 2 is positioned on the side edge H1 of the flat plate member 1 on the side facing the direction from which the radiation h1 is coming. Note that the spacing between each permanent magnet 2 does not have to be equal. It is preferable to arrange each permanent magnet 2 at a distance that does not affect the operation of the electronic component C1. For the material of the flat plate member 1, for example, FR4 (glass epoxy substrate) may be used. For the material of the permanent magnets 2, for example, neodymium may be used.

[0021] In the following, the direction along the side edge H1 of the flat plate member 1 is defined as the x-axis direction, and the normal direction of the flat plate member 1 (the direction perpendicular to the x-axis direction) is defined as the y-axis direction. The direction perpendicular to the x-y plane is defined as the z-axis direction. The positive and negative directions of each axis are the directions of the arrows shown in Figure 4. Furthermore, as shown in Figure 5, the surface perpendicular to the flat plate member 1 at the negative z-axis end face is defined as the barrier surface S1.

[0022] The permanent magnet 2 positioned on the front surface of the flat plate member 1 has an n-pole on the negative x-axis and an s-pole on the positive x-axis. The permanent magnet 2 positioned on the back surface of the flat plate member 1 has an s-pole on the negative x-axis and an n-pole on the positive x-axis. Therefore, the permanent magnet 2 positioned on the front surface of the flat plate member 1 generates a magnetic field D1 directed toward the negative x-axis in Figure 4. The permanent magnet 2 positioned on the back surface of the flat plate member 1 generates a magnetic field D2 directed toward the positive x-axis in Figure 4. The magnetic fields D1 and D2 form a barrier surface S1 (see Figure 5).

[0023] Specifically, each permanent magnet 2 is arranged along the x-axis direction (first direction) on the surface side (plane) of the flat plate member 1, and its polarity is oriented in the same direction. In addition, each permanent magnet 2 is arranged along the x-axis direction (first direction) on the back side (plane) of the flat plate member 1, and its polarity is oriented in the same direction. Multiple permanent magnets 2 are arranged on both the surface side and the back side of the flat plate member 1, and the polarity in the first direction on the surface side is reversed compared to the polarity in the first direction on the back side.

[0024] With the above configuration, a Lorentz force directed toward the positive y-axis acts on the surface side of the flat plate member 1 due to the magnetic field D1, against radiation h1 flying in from the z-axis direction to the barrier surface S1 of the flat plate member 1. Therefore, the radiation h1 is deflected in the positive y-axis direction as indicated by the symbol h2. That is, by arranging the permanent magnet 2, the radiation h1 is deflected from the direction indicated by the symbol h3 to the direction indicated by the symbol h2.

[0025] Although not shown in the diagram, a Lorentz force acting on the back side of the flat plate member 1 acts on the radiation h1 coming from the z-axis direction towards the flat plate member 1, with the force directed toward the negative y-axis. That is, the magnetic field D2 generated on the back side of the flat plate member 1 is in the opposite direction to the magnetic field D1 generated on the front side, so the direction in which the Lorentz force acts is reversed, and a Lorentz force acting toward the negative y-axis direction acts on the radiation h1.

[0026] With the above configuration, the amount of radiation h1 flying from the z-axis direction to the flat plate member 1 that irradiates the electronic component C1 placed on the flat plate member 1 can be reduced or avoided, thereby protecting the electronic component C1 from radiation h1.

[0027] Figure 6 is a block diagram showing the configuration of the rotation mechanism 3. The rotation mechanism 3 efficiently deflects the radiation h1 by changing the direction of the flat plate member 1 so that the barrier surface S1 is perpendicular to the direction in which the radiation h1 is coming. This will be explained in detail below. As shown in Figure 6, the rotation mechanism 3 includes an acquisition unit 31, a control unit 32, and two motors M1 and M2.

[0028] The acquisition unit 31 acquires predicted information on the direction from which radiation h1 is coming, for example, from an information source such as a space weather forecast. Alternatively, it acquires the direction of radiation input by the operator. In other words, the acquisition unit 31 acquires information on the direction of radiation h1. The acquisition unit 31 outputs the information on the direction of radiation to the control unit 32.

[0029] Motors M1 and M2 rotate the flat plate member 1 around a rotation axis set along the x-axis direction and a rotation axis set along the y-axis direction, respectively. As shown in Figure 6, motor M1 is set approximately at the center of the flat plate member 1 in the z-axis direction and rotates the rotation axis Q1, which faces the x-axis direction, in the direction of arrow d1. Motor M2 rotates the rotation axis Q2, which faces the y-axis direction at the center of the flat plate member 1, in the direction of arrow d2. In other words, the rotation mechanism 3 rotates the flat plate member 1 around the rotation axis Q1 (first axis) and the rotation axis Q2 (second axis). The first axis faces the first direction (x-axis direction), and the second axis faces the normal direction of the planar member (y-axis direction).

[0030] The control unit 32 controls the driving of each motor M1 and M2. By driving each motor M1 and M2, the control unit 32 changes the orientation of the barrier surface S1 (see Figure 5) to a desired position. Based on the information on the direction of radiation arrival output from the acquisition unit 31, the control unit 32 can change the orientation of the barrier surface S1 so that the barrier surface S1 is perpendicular to the direction of radiation arrival h1.

[0031] In other words, the rotation mechanism 3 changes the position of the flat plate member 1 so that the radiation h1 flying from the outside is incident perpendicularly to the surface (barrier surface S1) where the side portion H1 along the x-axis direction (first direction) of the flat plate member 1 intersects. The rotation mechanism 3 changes the position of the flat plate member 1 based on the information on the direction of the incoming radiation h1 acquired by the acquisition unit 31.

[0032] The acquisition unit 31 and control unit 32 described above can be configured as an integrated computer consisting of, for example, a central processing unit (CPU) and storage means such as RAM, ROM, and hard disk.

[0033] Next, the operation of the component placement substrate 100 according to this embodiment, configured as described above, will be explained. Figure 7 is a view of the component placement substrate 100 from the side (x-axis direction), and is an explanatory diagram showing the direction of propagation of radiation h1 when radiation h1 is flying towards the barrier surface S1 in the z-axis direction.

[0034] As described above, multiple permanent magnets 2 are arranged along the x-axis on the side portion H1 of the flat plate member 1. Furthermore, the polarity (s pole, n pole) of each permanent magnet 2 is set so that the direction of the magnetic field is opposite on the front side and the back side of the flat plate member 1. Consequently, radiation h1 (e.g., protons) flying towards the front side of the flat plate member 1 is deflected in the positive direction of the y-axis, and radiation h1 flying towards the back side is deflected to the negative side of the y-axis.

[0035] Therefore, the region indicated by the symbol r1 in Figure 7 is a region of high radiation intensity, the region indicated by the symbol r3 is a region of low radiation intensity, and the region indicated by the symbol r2 is a region of intermediate radiation intensity. Consequently, the radiation irradiated onto the electronic component C1, which is positioned almost parallel to the flat plate member 1, can be reduced. In this case, since the substrate surface on which the electronic component C1 is mounted is positioned almost parallel to the flat plate member 1, the radiation h1 irradiated onto the electronic component C1 can be protected at a small deflection angle.

[0036] Furthermore, the control unit 32 shown in Figure 6 acquires information on the direction of incoming radiation acquired by the acquisition unit 31 and rotates motors M1 and M2 to change the orientation of the barrier surface S1. Specifically, it controls the driving of motors M1 and M2 so that the barrier surface S1 is perpendicular to the direction of incoming radiation h1. As a result, the radiation h1 that is coming towards the flat plate member 1 enters from a direction that is almost perpendicular to the barrier surface S1 (normal direction), making it possible to deflect the radiation more efficiently and avoid irradiating the electronic component C1.

[0037] As described above, the component placement substrate 100 according to this embodiment includes a flat plate member 1 on which a plurality of electronic components C1 are arranged, a plurality of permanent magnets 2 arranged along a first direction (x-axis direction) on the surface of the flat plate member 1 and having the same polarity, and a rotation mechanism 3 that rotates the flat plate member 1 about a first axis (x-axis) and a second axis (y-axis).

[0038] In this embodiment, a barrier surface S1 is formed by arranging multiple permanent magnets 2 on a flat plate member 1 as a magnetic field source. Furthermore, an electronic component C1 having a flat plate-shaped substrate is arranged along the plane of the flat plate member 1. Therefore, when radiation is emitted from the z-axis direction, the Lorentz force generated by the magnetic field of the permanent magnets 2 can deflect the radiation to the positive and negative sides of the y-axis, thereby preventing radiation from irradiating the electronic component C1.

[0039] Therefore, it is possible to avoid problems such as damage or malfunction of the electronic component C1 due to irradiation of the electronic component C1 with cosmic radiation such as protons.

[0040] Furthermore, since a magnetic field is generated using permanent magnets 2, power consumption can be reduced compared to cases where electromagnets are used.

[0041] Furthermore, as shown in Figure 3B, since the radiation h1 is irradiated along a nearly planar direction to the electronic component C1, there is no need to increase the deflection angle of the radiation h1. Therefore, there is no need to enlarge the permanent magnet 2, making it possible to reduce the size and weight of the device.

[0042] In other words, to effectively protect electronic components C1 from cosmic radiation, the smaller the size of electronic components C1 relative to the direction in which the cosmic radiation is deflected, the smaller the deflection angle of the cosmic radiation will be. Since electronic components C1 usually have a thin plate shape and are arranged parallel to each other on the flat plate member 1, it becomes possible to protect electronic components C1 from cosmic radiation h1 with a small deflection angle. This makes it possible to reduce the size of the permanent magnet 2.

[0043] In this embodiment, the acquisition unit 31 acquires the direction of the incoming radiation h1, and the drive of each motor M1 and M2 is controlled so that this incoming direction is perpendicular to the barrier surface S1. Therefore, it becomes possible to more effectively deflect the radiation h1 with the magnetic field generated by the permanent magnet 2 and avoid irradiating the electronic component C1.

[0044] In this embodiment, since the polarity of the permanent magnet 2 arranged on the front surface side of the flat plate member 1 is set to be opposite to that of the permanent magnet 2 arranged on the back surface side, the radiation flying toward the front surface side (the plus side of the y-axis) of the flat plate member 1 can be deflected toward the plus side of the y-axis, and the radiation flying toward the back surface side (the minus side of the y-axis) of the flat plate member 1 can be deflected toward the minus side of the y-axis. Therefore, it becomes possible to protect each electronic component C1 arranged on the front surface side and the back surface side of the flat plate member 1 from radiation.

[0045] In this embodiment, the flat plate member 1 is rotated by the motor M1 having a rotation axis facing the x-axis direction, which is one direction set on the flat plate member 1, and the motor M2 having a rotation axis facing the y-axis direction, which is a direction orthogonal to the flat plate member 1. Therefore, it becomes possible to easily control so that the barrier surface S1 is in a direction orthogonal to the flying direction of the radiation h1.

[0046] In this embodiment, as shown in FIG. 4, since each permanent magnet 2 is arranged along the side portion H1 on the radiation flying direction side in the flat plate member 1, it becomes possible to surely protect the electronic component C1 from the radiation flying from around the flat plate member 1.

[0047] In the above-described embodiment, an example in which the permanent magnet 2 is arranged on both the front surface side and the back surface side of the flat plate member 1 has been described. However, a configuration in which the permanent magnet 2 is arranged on either the front surface side or the back surface side may be adopted.

[0048] In this embodiment, an example in which the flat plate member 1 is rotated using the motor M1 having the x-axis direction as the rotation axis and the motor M2 having the y-axis direction as the rotation axis has been described. However, the direction of the rotation axis is not limited to the above directions, and may be set in other directions. Further, in addition to the x-axis direction and the y-axis direction, a motor for rotating the flat plate member 1 around a rotation axis set in the z-axis direction may be installed.

[0049] Note that the present disclosure is not limited to the above embodiment, and various modifications are possible within the scope of the gist.

[0050] 1 Flat plate member 2 Permanent magnet 3 Rotation mechanism 31 Acquisition unit 32 Control unit 100 Component placement substrate C1 Electronic component h1 Cosmic radiation (radiation) H1 Side portion M1, M2 Motor Q1 Rotation axis (first axis) Q2 Rotation axis (second axis) S1 Barrier surface

Claims

1. A component placement substrate comprising: a flat plate member on which multiple electronic components are arranged; multiple permanent magnets arranged along a first direction on the surface of the flat plate member and having the same polarity; and a rotation mechanism for rotating the flat plate member about a first axis and a second axis.

2. The component placement substrate according to claim 1, wherein a plurality of permanent magnets are arranged on both the front and back sides of the flat plate member, and the polarity of the first direction on the front side and the polarity of the first direction on the back side are reversed.

3. The component placement substrate according to claim 1 or 2, wherein the rotation mechanism rotates the flat plate member so that radiation flying from the outside is incident perpendicularly to a plane on which the side portion of the flat plate member along the first direction is perpendicular to the plane.

4. The component placement substrate according to claim 3, wherein the rotating mechanism includes an acquisition unit that acquires information on the direction of the incoming radiation, and the flat plate member is rotated based on the information on the direction of the incoming radiation acquired by the acquisition unit.

5. The component placement substrate according to claim 1 or 2, wherein the first axis is oriented in the first direction and the second axis is oriented in the direction normal to the flat plate member.

6. The component placement substrate according to claim 1 or 2, wherein each permanent magnet is arranged on the side edge of the flat plate member facing the direction of arrival of cosmic radiation.

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