Method and apparatus for designing flow channel of liquid cooling plate, storage medium, and electronic device

Abstract

The present application relates to the technical field of heat dissipation, and relates to a method and apparatus for designing a flow channel of a liquid cooling plate, a storage medium, and an electronic device. The method comprises: obtaining a first flow channel distribution of a liquid cooling plate, a heat exchange flow channel in the first flow channel distribution going back and forth multiple times between a heating area of an electronic product and another area different from the heating area; determining an initial design domain of a flow channel topology optimization model on the basis of the first flow channel distribution; and performing topology optimization on a flow channel distribution corresponding to the initial design domain, and determining a target flow channel distribution of the liquid cooling plate. The target flow channel distribution designed on the basis of the method of the present embodiment can adapt to heat dissipation requirements of an electronic product and improve temperature uniformity of the liquid cooling plate.

Description

Liquid cooling plate flow channel design method and device, storage medium and electronic equipment

[0001] The present application claims priority to the Chinese patent application No. 202411390019.1, filed on September 30, 2024, and entitled "Liquid cooling plate flow channel design method and device, storage medium and electronic equipment", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, and more particularly, to a liquid cooling plate flow channel design method, a liquid cooling plate flow channel design device, a storage medium and an electronic equipment. BACKGROUND

[0003] With the increasing demand for performance of consumer electronics, the heat dissipation problem of electronic products has gradually become one of the key concerns. The traditional heat dissipation technology is to design a flow channel on a liquid cooling plate, and the heat of the heat generation area of the electronic product is taken away by the flow of the fluid in the flow channel.

[0004] There are objective limitations such as small space, thin heat exchange plate, and narrow designable space in consumer electronics, which makes the existing liquid cooling plate design unable to play a good heat dissipation role in electronic products. In addition, there is a significant uneven heating phenomenon in consumer electronics. Due to the different heating characteristics of different functional areas, there is a phenomenon that the local heat generation of the electronic product is extremely large, while some areas hardly heat. This limits the effective transfer of heat, resulting in low heat dissipation efficiency, which easily causes local overheating of the electronic product. Therefore, it is necessary to improve the heat dissipation device applied to consumer electronics to meet the heat dissipation needs in electronic products. SUMMARY

[0005] The present application provides a liquid cooling plate flow channel design method, a liquid cooling plate flow channel design device, a storage medium and an electronic equipment. The target flow channel distribution designed by the method of the present application can adapt to the heat dissipation needs of the electronic product and improve the uniformity of the liquid cooling plate.

[0006] In a first aspect, the present application provides a liquid cooling plate flow channel design method, comprising:

[0007] obtaining a first flow channel distribution of a liquid cooling plate, wherein the heat exchange flow channel in the first flow channel distribution repeatedly goes back and forth between a heat generation area of an electronic product and other areas different from the heat generation area;

[0008] determining an initial design domain of a flow channel topology optimization model according to the first flow channel distribution;

[0009] topology optimizing the flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.

[0010] Optionally, the determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises:

[0011] obtaining at least one sub-flow channel distribution in the first flow channel distribution, the heat exchange flow channel in the sub-flow channel distribution completing one round trip between the heat generation area and the other area;

[0012] respectively taking the first area corresponding to the sub-flow channel distribution as the initial design domain.

[0013] Optionally, the determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises:

[0014] determining to take all or part of the areas of the first flow channel distribution as the initial design domain according to the performance result corresponding to the first flow channel distribution; wherein the performance result is the result of the performance index indicated by the design requirement.

[0015] Optionally, the determining to take all or part of the areas of the first flow channel distribution as the initial design domain according to the performance result corresponding to the first flow channel distribution comprises:

[0016] obtaining the performance result corresponding to at least one sub-flow channel distribution in the first flow channel distribution, the heat exchange flow channel in the sub-flow channel distribution completing one round trip between the heat generation area and the other area;

[0017] in the case that the performance result corresponding to the sub-flow channel distribution characterizes that the performance of the sub-flow channel distribution does not meet the design requirement, determining to take the first area corresponding to the sub-flow channel distribution as the initial design domain.

[0018] Optionally, the initial design domain is part of the areas of the first flow channel distribution, and the topology optimization is performed on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate, comprising:

[0019] performing topology optimization on the flow channel distribution corresponding to the initial design domain to obtain a second flow channel distribution;

[0020] splicing other flow channel distributions outside the part of the areas in the first flow channel distribution and the second flow channel distribution to obtain the target flow channel distribution.

[0021] Optionally, the determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises:

[0022] obtaining a second area corresponding to the position of the heat source in the first flow channel distribution;

[0023] taking the second area as the initial design domain.

[0024] Optionally, the determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises:

[0025] obtaining a third region in the first flow channel distribution, the third region being a region in the first flow channel distribution other than the bending flow channel region;

[0026] taking the third region as the initial design domain.

[0027] Optionally, the number of return trips of the heat exchange flow channel is determined by:

[0028] obtaining the thickness of the heat exchange flow channel and the size of the heat generation region;

[0029] determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel;

[0030] determining the number of return trips of the heat exchange flow channel according to the width of the heat exchange flow channel and the size of the heat generation region.

[0031] Optionally, the determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel comprises:

[0032] obtaining a mapping relationship between the thickness of the flow channel and the width of the flow channel;

[0033] determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel and the mapping relationship.

[0034] Optionally, the topology optimization of the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate comprises:

[0035] obtaining a target function, the target function including any one of a heat transfer target function, a flow target function, and a coupling target function, the coupling target function being a target function obtained by coupling the heat transfer target function and the flow target function, the heat transfer target function being determined based on at least one of an ambient temperature and a heat generation coefficient of a corresponding heat source of the liquid cooling plate, the flow target function being determined based on at least one of a first fluid flow velocity corresponding to each grid in the flow channel distribution and a fluid domain proportion corresponding to each grid, the first fluid flow velocity including a horizontal velocity and a vertical velocity;

[0036] topology optimizing the flow channel distribution corresponding to the initial design domain according to the value of the target function to determine the target flow channel distribution of the liquid cooling plate.

[0037] In a second aspect, the embodiment provides a liquid cooling plate flow channel design device, comprising:

[0038] An acquisition module is configured to acquire a first flow channel distribution of the liquid cooling plate, and heat exchange flow channels in the first flow channel distribution repeatedly go back and forth between a heat generation area of the liquid cooling plate and an area other than the heat generation area.

[0039] A first determination module is configured to determine an initial design domain of a flow channel topology optimization model according to the first flow channel distribution.

[0040] A second determination module is configured to perform topology optimization on a flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.

[0041] In a third aspect, an embodiment of the present application provides a storage medium having a computer program stored thereon, where the computer program, when executed by a processor, implements the method according to any one of the first aspect of the present application.

[0042] In a fourth aspect, an embodiment of the present application provides an electronic device including a memory and a processor, where the memory is configured to store computer instructions, and the processor is configured to invoke the computer instructions from the memory to execute the method according to any one of the first aspect of the present application.

[0043] The embodiments of the present application first design heat exchange flow channels repeatedly going back and forth between a heat generation area of an electronic product and other areas to increase the number of cold fluids passing through the heat generation area, thereby improving the heat dissipation efficiency. In addition, according to the flow channel distribution corresponding to the heat exchange flow channels repeatedly going back and forth between the heat generation area and other areas, an initial design domain is determined, and topology optimization is further performed on the flow channel distribution, thereby further improving the heat dissipation efficiency and also improving the temperature uniformity of the liquid cooling plate.

[0044] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0045] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0046] FIG. 1 shows a schematic diagram of heat exchange flow channels repeatedly going back and forth between a heat generation area and other areas according to an embodiment of the present application.

[0047] FIG. 2 shows a schematic flowchart of a liquid cooling plate flow channel design method according to an embodiment of the present application.

[0048] FIG. 3 shows a schematic diagram of a sub-flow channel distribution according to an embodiment of the present application.

[0049] FIG. 4 shows a schematic diagram of a first flow channel distribution according to an embodiment of the present application.

[0050] FIG. 5 shows a schematic block diagram of a liquid cooling plate flow channel design device according to an embodiment of the present application.

[0051] FIG. 6 shows a schematic block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions, and numerical values set forth in these embodiments are not limitations on the scope of the present application unless otherwise specifically stated.

[0053] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the scope of the application or its application or uses.

[0054] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein, but should be considered as part of the specification, where appropriate.

[0055] In all of the examples shown and discussed herein, any specific values should be interpreted as merely illustrative and not as a limitation on the scope of the exemplary embodiments. Thus, other examples of the exemplary embodiments can have different values.

[0056] It should be noted that like references and characters herein relate to like items throughout the figures, and once an item is defined in one figure, it need not be discussed further in subsequent figures.

[0057] As people's increasing demand for the performance of consumer electronics, the heat dissipation of electronic products has gradually become one of the key concerns. The traditional heat dissipation technology is to design a flow channel on a liquid cooling plate, and the heat of the heat generation area (i.e. the area within the set range of the heat source of the electronic product) is taken away by the flow of the fluid in the flow channel.

[0058] However, there are objective limitations in consumer electronics, such as small space, thin heat exchange plate, and narrow designable space, which makes the existing liquid cooling plate design unable to play a good heat dissipation role in electronic products. In addition, there is a significant uneven heating phenomenon in consumer electronics. Due to the different heating characteristics of different functional areas, there is a phenomenon that the local heat generation is extremely large, while some areas hardly generate heat. This limits the effective transfer of heat, resulting in low heat dissipation efficiency, which easily causes local overheating of electronic products. Therefore, it is necessary to improve the heat dissipation devices applied in consumer electronics to meet the heat dissipation needs in electronic products.

[0059] Applicants have found that the existing flow channel only goes back and forth between the heat generating area and other areas (i.e. non-heat generating areas) once. In this way, the fluid flows from the flow channel inlet into other areas, and then enters the heat generating area, and returns to other areas from the heat generating area, and flows back to the pump from the flow channel outlet. Alternatively, the fluid flows from the flow channel inlet into the heat generating area, and then enters other areas, and returns to the heat generating area from other areas, and flows back to the micro-pump from the flow channel outlet. These flow channel structures are simple and easy to process. However, the liquid cooling plate using these flow channel structures has poor heat dissipation effect due to the limited flow of fluid in the flow channel.

[0060] Based on this, the embodiments of the present application first design a heat exchange flow channel that goes back and forth between the heat generating area and other areas of the electronic product multiple times. Each time the flow channel goes back and forth, the fluid flows from other areas into the heat generating area once. In this way, when the flow channel goes back and forth between the heat generating area and other areas multiple times, the flow of fluid flowing from other areas into the heat generating area at the same time increases by multiple times. Since the amount of cold fluid entering the heat generating area at the same time is greatly increased, the heat dissipation efficiency is greatly improved.

[0061] For ease of understanding, FIG. 1 shows a schematic flow channel simplified diagram. In FIG. 1, the entire area is schematically divided into a heat generating area A and other areas B by a line 1. The flow channel surrounded by the dashed box goes back and forth between the heat generating area A and other areas B once, and the flow channel goes back and forth between the heat generating area A and other areas B three times in the entire area. It should be noted that the line 1 is only displayed for ease of understanding, and does not exist in the actual flow channel distribution.

[0062] The embodiments of the present application greatly improve the heat dissipation efficiency by the heat exchange flow channel that goes back and forth between the heat generating area and other areas of the electronic product multiple times. However, there are multiple bending parts in the flow channel that goes back and forth multiple times, and the flow resistance of the fluid in the bending part is large, which affects the heat dissipation efficiency to some extent. Therefore, based on the first flow channel distribution designed by the multiple back and forth idea, the embodiments of the present application further topologically optimize the first flow channel distribution to further improve the heat dissipation efficiency.

[0063] As shown in FIG. 2, the liquid cooling plate flow channel design method of the embodiments of the present application can include steps S110 to S130.

[0064] Step S110, obtaining a first flow channel distribution of a liquid cooling plate, the heat exchange flow channel in the first flow channel distribution going back and forth between a heat generating area of an electronic product and other areas different from the heat generating area multiple times.

[0065] Step S120, determining an initial design domain of a flow channel topological optimization model according to the first flow channel distribution.

[0066] Step S130, topologically optimizing the flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.

[0067] The first flow channel distribution represents a path of fluid flow. As an example, FIG. 3 shows a partial schematic view of a first flow channel distribution, in which a region C with a material density value of 1 is a fluid region, forming a flow channel.

[0068] In this embodiment, the entire region corresponding to the first flow channel distribution can be used as an initial design domain for topology optimization, or part of the region corresponding to the first flow channel distribution can be used as an initial design domain for topology optimization. The entire region corresponding to the first flow channel distribution can be optimized at one time, or part of the region corresponding to the first flow channel distribution can be optimized in multiple times. Optimizing part of the region corresponding to the first flow channel distribution in multiple times can reduce the resource occupancy rate at the same time to some extent, and improve the optimization efficiency.

[0069] The embodiments of the present application first design heat exchange flow channels that repeatedly go back and forth between the heat generation area of the electronic product and other areas, to increase the amount of cold fluid passing through the heat generation area, thereby improving the heat dissipation efficiency. In addition, according to the flow channel distribution corresponding to the heat exchange flow channels that repeatedly go back and forth between the heat generation area and other areas, an initial design domain is determined, and the flow channel distribution is further optimized by topology, thereby further improving the heat dissipation efficiency and also improving the temperature uniformity of the liquid cooling plate.

[0070] Optionally, step S120 can include steps S121-S122.

[0071] In step S121, at least one sub-flow channel distribution in the first flow channel distribution is obtained, and the heat exchange flow channel in the sub-flow channel distribution completes one round trip between the heat generation area of the electronic product and other areas.

[0072] In step S122, the first region corresponding to each sub-flow channel distribution is used as an initial design domain.

[0073] The first flow channel distribution includes a plurality of sub-flow channel distributions. The region corresponding to each sub-flow channel distribution can be used as an initial design domain. The sub-flow channel distribution is, for example, the flow channel distribution corresponding to region C in FIG. 2. In this embodiment, the target flow channel distribution can be obtained by topology optimization based on the region corresponding to only one of the sub-flow channel distributions, or the target flow channel distribution can be obtained by topology optimization based on the region corresponding to each of part of the sub-flow channel distributions of the plurality of sub-flow channel distributions, or the target flow channel distribution can be obtained by topology optimization based on the region corresponding to each of all the sub-flow channel distributions of the plurality of sub-flow channel distributions.

[0074] Taking the first flow channel distribution shown in FIG. 4 as an example, the first flow channel distribution includes three sub-flow channel distributions, and the corresponding regions are C1, C2, and C3 respectively. The target flow channel distribution can be obtained by topology optimization based on any one of the regions C1, C2, and C3, or the target flow channel distribution can be obtained by topology optimization based on any two of the regions C1, C2, and C3, or the target flow channel distribution can be obtained by topology optimization based on the regions C1, C2, and C3 respectively.

[0075] The process of topology optimization based on the initial design domain corresponding to each sub-flow channel distribution can be completed in parallel or in series.

[0076] In some embodiments, the importance level of the sub-regions corresponding to the first flow channel distribution can be set, and the region with a high importance level is preferentially selected as the initial design domain.

[0077] Considering that the region corresponding to the heat source position is seriously heated, the region can be taken as a key optimization object, and the region is preferentially selected as the initial design domain. Optionally, the step S120 can include steps S123-S124.

[0078] In step S123, a second region corresponding to the heat source position in the first flow channel distribution is obtained.

[0079] In step S124, the second region corresponding to the heat source position is taken as the initial design domain.

[0080] In this embodiment, the first flow channel distribution can include multiple second regions. Each second region can be taken as the initial design domain. The heat source can be understood as any electronic device that generates heat in the electronic product. The second region can be a region within a set range centered on the heat source position, or can be a region where the heat source position is located.

[0081] For some special regions, after multiple optimizations, the design requirements cannot be met, and these special regions can be taken as secondary optimization objects, and the regions in the region corresponding to the first flow channel distribution except the special regions are taken as the initial design domain. The special regions can include, for example, the bending region of the flow channel. Optionally, the step S120 can include steps S125-S126.

[0082] In step S125, a third region in the first flow channel distribution is obtained, and the third region is a region in the first flow channel distribution except the bending flow channel region.

[0083] In step S126, the third region is taken as the initial design domain.

[0084] In some embodiments, the step S120 can further include step S210.

[0085] In step S210, according to the performance result corresponding to the first flow channel distribution, it is determined that all or part of the regions of the first flow channel distribution are initial design domains; wherein the performance result is the result of the performance index indicated by the design requirement.

[0086] In this embodiment, the performance result corresponding to the first flow channel distribution can be obtained, such as one or more of heat transfer efficiency, flow rate, pressure drop, etc. By analyzing the performance result, it is determined whether all regions of the first flow channel distribution need to be initial design domains. As an example, the first flow channel distribution can be input into simulation software for simulation to obtain the corresponding performance result. In the case where the performance result represents that the performance of all regions of the first flow channel distribution does not meet the design requirement, all regions of the first flow channel distribution are initial design domains. In the case where the performance result represents that the performance of part of the regions of the first flow channel distribution does not meet the design requirement, the part of the regions are initial design domains.

[0087] In this embodiment, the performance result corresponding to the flow channel distribution is used to determine whether to perform topology optimization on all regions thereof. In the case where the performance result of part of the regions meets the design requirement, topology optimization is not performed, which can reduce the waste of computing resources as much as possible.

[0088] Optionally, step S210 can include steps S211 to S212.

[0089] In step S211, the performance result corresponding to at least one sub-flow channel distribution in the first flow channel distribution is obtained, and the heat exchange flow channel in the sub-flow channel distribution completes one round trip between the heat generation area and other areas.

[0090] In step S212, in the case where the performance result corresponding to the sub-flow channel distribution represents that the performance of the sub-flow channel distribution does not meet the design requirement, it is determined that the first region corresponding to the sub-flow channel distribution is an initial design domain.

[0091] In this embodiment, the performance result corresponding to each sub-flow channel distribution can be detected respectively, and in the case where the performance of the sub-flow channel distribution does not meet the design requirement, the first region corresponding to the sub-flow channel distribution is an initial design domain, and multiple topology optimizations are performed.

[0092] In the case where the initial design domain is part of the first flow channel distribution, step S130 of the present embodiment can include steps S131 to S132.

[0093] In step S131, topology optimization is performed on the flow channel distribution corresponding to the initial design domain to obtain a second flow channel distribution.

[0094] In step S132, other flow channel distributions outside the part of the regions of the first flow channel distribution and the second flow channel distribution are spliced to obtain a target flow channel distribution.

[0095] In this embodiment, before the topological optimization of the partial region in the first flow channel distribution, boundary conditions such as the inlet and outlet of the flow channel need to be set first, so that the second flow channel distribution obtained by the topological optimization can be spliced with other flow channel distributions outside the partial region to obtain the target flow channel distribution. After parallel topological optimization, when multiple second flow channel distributions are obtained, each second flow channel distribution can be spliced with other flow channel distributions outside the partial region.

[0096] Of course, in some embodiments, the second flow channel distribution can also directly cover the partial region before topological optimization.

[0097] Since the thickness of electronic products is usually thin, if the width of the heat exchange flow channel is too wide, the flow channel is prone to collapse. If the width of the heat exchange flow channel is too narrow, the resistance of the fluid flowing in the flow channel increases, resulting in an increase in pressure drop. Therefore, the width of the heat exchange flow channel needs to be limited in the embodiments of the present application. After the width of the flow channel is obtained, the maximum number of round trips of the heat exchange flow channel can be determined.

[0098] In this embodiment, the number of round trips of the heat exchange flow channel in the first flow channel distribution can be determined through steps S310 to S330.

[0099] In step S310, the thickness of the heat exchange flow channel and the size of the heat generation area of the electronic product are obtained.

[0100] In step S320, the width of the heat exchange flow channel is determined according to the thickness of the heat exchange flow channel.

[0101] In step S330, the number of round trips of the heat exchange flow channel is determined according to the width of the heat exchange flow channel and the size of the heat generation area.

[0102] In this embodiment, step S320 can include: obtaining a mapping relationship between the flow channel thickness and the flow channel width; and determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel and the mapping relationship.

[0103] The mapping relationship can be embodied by the one-to-one correspondence between the flow channel thickness and the flow channel width in the data table, or by the specific ratio of the flow channel thickness to the flow channel width, or by the form of the relationship area, which is not limited in this embodiment.

[0104] In this embodiment, the size of the heat generation region can be the length of the heat generation region in the extension direction of the flow channel, such as the size in the ab direction in FIG. 4. Step S330 can include determining the number of times of the flow channel in the extension direction according to the width of the heat exchange flow channel, the size of the heat generation region, and the width of the cross section of the flow channel support column. Specifically, first, the flow channel width corresponding to each time of extension is calculated, and then the length of the heat generation region in the extension direction of the flow channel is divided according to the flow channel width corresponding to each time of extension, thereby obtaining the maximum number of times of extension.

[0105] In some embodiments, a target function can also be established according to design requirements to make the performance results of the flow channel distribution after topology optimization closer to the design requirements. Generally, the design requirements include the heat transfer efficiency of the flow channel, the fluid flow rate, and the like. In this embodiment, based on the design requirements of the heat transfer efficiency and the fluid flow rate of the flow channel, new heat transfer target functions and flow target functions are respectively established to improve the accuracy of the target function values.

[0106] For the heat transfer target function, the temperature field information corresponding to the flow channel distribution is simulated by the finite element calculation method in the related art. The temperature field information includes the temperature at each grid in the flow channel distribution. The temperature corresponding to the simulated physical field information is directly used for the calculation of the heat transfer target function. However, in the actual application of the liquid cooling plate flow channel, the temperature of the liquid cooling plate is also affected by the environmental temperature and the heat generation coefficient of the heat source. The value of the heat transfer target function calculated directly by using the simulated temperature is obviously not accurate enough. Therefore, in this embodiment, the heat transfer target function is determined based on at least one of the environmental temperature and the heat generation coefficient of the corresponding heat source of the liquid cooling plate to improve the accuracy of the heat transfer target function value.

[0107] For the flow target function, the velocity field information corresponding to the flow channel distribution is also directly used to calculate the flow target function by the finite element calculation in the related art. The velocity field information includes the horizontal velocity at each grid in the flow channel distribution. However, in the simulation calculation of the liquid cooling plate flow channel, the fluid velocity is a two-dimensional variable, which includes not only the horizontal velocity but also the vertical velocity. The value of the flow target function calculated directly by using the horizontal velocity is obviously not accurate enough. In addition, in the simulation calculation, each grid in the flow channel distribution is not necessarily all solid regions or fluid regions, but includes partial solid regions and partial fluid regions. Therefore, the flow rate calculated by using all fluid regions as the flow rate corresponding to the grid including only partial fluid regions is also inaccurate. Therefore, in this embodiment, the flow target function is determined based on at least one of the first fluid flow velocity including the horizontal velocity and the vertical velocity corresponding to each grid in the flow channel distribution and the fluid domain proportion corresponding to each grid to improve the accuracy of the flow target function value.

[0108] In this embodiment, step S130 can include steps S410 to S420.

[0109] Step S410, obtaining a target function, the target function including any one of a heat transfer target function, a flow target function, and a coupling target function, the coupling target function being a target function obtained by coupling the heat transfer target function and the flow target function.

[0110] The coupling target function can be a target function obtained by weighted summation of the heat transfer target function and the flow target function. The formula of the coupling target function F can be: F=a*A+b*B

[0111] Wherein, A is the heat transfer target function, a is the weight of the heat transfer target function, B is the flow target function, and b is the weight of the flow target function.

[0112] Optionally, specific weights can be pre-set for the heat transfer target function and the flow target function respectively according to experience, to obtain the coupling target function.

[0113] Optionally, in the process of topology optimization iteration, the weights can be updated according to the quality of the current target function value after each iteration. For example, if the heat transfer target function value has reached a good level in the current iteration, the weight of the heat transfer target function can be reduced, and the weight of the flow target function can be increased. Through this method, the algorithm can be more flexible to explore the solution space, avoid concentrating on a certain specific target too early, and thus help to find a flow channel distribution closer to the design requirement.

[0114] Step S420, performing topology optimization on the flow channel distribution corresponding to the initial design domain according to the value of the target function, to determine the target flow channel distribution of the liquid cooling plate.

[0115] When the value of the first target function does not meet the preset target, the flow channel distribution is updated in the next iteration. Then, the value of the second target function corresponding to the updated flow channel distribution is calculated, and when the value of the second target function does not meet the preset target or the change of the value of the second target function compared with the value of the target function corresponding to the previous iteration is greater than a threshold, the next iteration is continued until the value of the target function meets the preset target or the change of the value of the target function compared with the value of the target function corresponding to the previous iteration is less than the threshold, and the flow channel distribution at this time is taken as the target flow channel distribution.

[0116] Through the method of the embodiments of the present application, the target function is established, and when topology optimization is performed, the value of the target function is more accurate, and a flow channel distribution closer to the design requirement can be obtained.

[0117] In some embodiments, step S410 can include steps S411 to S412.

[0118] Step S411, determining temperature field information corresponding to the flow channel distribution according to at least one of the ambient temperature and the heat source heat generation coefficient, the temperature field information including a temperature at each grid in the flow channel distribution.

[0119] In this embodiment, optionally, new temperature field information corresponding to the flow channel distribution can be determined according to at least one of the ambient temperature and the heat source heat generation coefficient. The new temperature field information replaces the temperature field information simulated by the finite element calculation directly in the existing objective function, so as to determine the objective function.

[0120] Optionally, in step S412, the objective function is determined according to a maximum temperature, a minimum temperature and a temperature of a set grid in the temperature field information obtained in step S411.

[0121] In some embodiments, step S410 can include steps S413 to S414.

[0122] Step S413, obtaining the ambient temperature, the heat source heat generation coefficient and the temperature of the set grid in the flow channel distribution.

[0123] Step S414, determining the objective function according to a product of a difference between the ambient temperature and the temperature of the set grid and the heat source heat generation coefficient.

[0124] In this embodiment, step S414 can take the product of the difference between the ambient temperature and the temperature of the set grid and the heat source heat generation coefficient as a temperature corresponding to each grid, and determine the objective function according to the temperature.

[0125] As an example, the formula of the heat transfer objective function A can be: A=(Ta-Tamin) / (Tamax-Tamin)

[0126] Wherein, Ta=theta*(TQ-T), theta is the heat source heat generation coefficient, TQ is the ambient temperature, and T is a temperature corresponding to each grid obtained by the finite element calculation.

[0127] In some embodiments, step S410 can include steps S415 to S417.

[0128] Step S415, determining flow velocity field information corresponding to the flow channel distribution according to at least one of a first fluid flow velocity corresponding to each grid and a fluid domain proportion corresponding to each grid, the flow velocity field information including a second fluid flow velocity of each grid in the flow channel distribution.

[0129] Step S416, determining a third fluid flow velocity according to the second fluid flow velocity, the third fluid flow velocity representing a fluid flow velocity corresponding to the flow channel distribution.

[0130] In this embodiment, the second fluid flow velocity is the fluid flow velocity corresponding to each grid in the flow channel distribution, and the third fluid flow velocity represents the global fluid flow velocity corresponding to the flow channel distribution. As an example, the second fluid flow velocities can be summed to obtain the third fluid flow velocity. As another example, the second fluid flow velocities can be integrated to obtain the third fluid flow velocity.

[0131] In step S417, a target function is determined according to the preset maximum fluid flow velocity, the preset minimum fluid flow velocity, and the third fluid flow velocity.

[0132] In this embodiment, the maximum fluid flow velocity and the minimum fluid flow velocity can be pre-set according to experience, and used to determine the target function in step S416.

[0133] In some embodiments, step S410 can include steps S418 to S419.

[0134] In step S418, the sum of the squares of the horizontal velocity and the sum of the squares of the vertical velocity corresponding to each grid are obtained.

[0135] In step S419, a target function is determined according to the product of the sum of the squares of the horizontal velocity and the sum of the squares of the vertical velocity and the fluid domain proportion.

[0136] In this embodiment, in step S419, the product of the sum of the squares of the horizontal velocity and the sum of the squares of the vertical velocity and the fluid domain proportion can be taken as the second fluid flow velocity corresponding to each grid. The target function is determined according to the second fluid flow velocity.

[0137] As an example, the formula of the flow target function B can be: B = (Fa-Famin) / (Famax-Famin)

[0138] Wherein, r is the proportion of the solid volume in the grid to the grid volume, (1-r) is the proportion of the fluid volume in the grid to the grid volume, i.e. the fluid domain proportion, u is the horizontal velocity, and v is the vertical velocity.

[0139] Embodiments of the present application also provide a liquid cooling plate flow channel design device, as shown in FIG. 5, which can include an acquisition module 110, a first determination module 120, and a second determination module 130.

[0140] The acquisition module 110 is configured to acquire a first flow channel distribution of a liquid cooling plate. The heat exchange flow channels in the first flow channel distribution repeatedly go back and forth between a heat generation area of an electronic product and other areas different from the heat generation area.

[0141] The first determination module 120 is configured to determine an initial design domain of a flow channel topology optimization model according to the first flow channel distribution.

[0142] The second determining module 130 is configured to perform topology optimization on the flow channel distribution corresponding to the initial design domain, and determine a target flow channel distribution of the liquid cooling plate.

[0143] The embodiment of the application further provides a storage medium, which has a computer program stored thereon, and the computer program is used to implement the method in any one of the above method embodiments when executed by a processor.

[0144] The embodiment of the application further provides an electronic device, as shown in Figure 6, which comprises a memory 210 and a processor 220,

[0145] The memory 210 is configured to store computer instructions, and the processor 220 is configured to call the computer instructions from the memory 210 to execute the method in any one of the above method embodiments.

[0146] Each of the embodiments in the application is described in a progressive manner, and the same or similar parts of each of the embodiments can be referred to each other. Each of the embodiments mainly describes the difference from other embodiments. Especially, the device and equipment embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the part of the method embodiments.

[0147] The above describes specific embodiments of the application. Other embodiments are within the scope of the appended claims. In some cases, the acts or steps recited in the claims can be performed in a different order than the order in which they are recited and still accomplish desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous.

[0148] The application can be a system, a method, and / or a computer program product. The computer program product can include a computer readable storage medium having computer readable program instructions embodied therewith, and the computer readable program instructions are used to cause a processor to implement various aspects of the application.

[0149] Computer readable storage media can be tangible storage media which can retain and store instructions for use by an instruction execution device. Computer readable storage media can be, for example, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of computer readable storage media include the following: a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanically encoded device such as punch-cards or raised structures in a groove having instructions recorded thereon, and any suitable combination of the foregoing. A computer readable storage medium, as used herein, is not to be construed as being transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission media (e.g., light pulses passing through a fiber-optic cable), or electrical signals transmitted through a wire.

[0150] Computer readable program instructions described herein can be downloaded to respective computing / processing devices from a computer readable storage medium or to an external computer or external storage device via a network, for example, the Internet, a local area network, a wide area network and / or a wireless network. The network can comprise copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and / or edge servers. A network adapter card or network interface in each computing / processing device receives computer readable program instructions from the network and forwards the computer readable program instructions for storage in a computer readable storage medium within the respective computing / processing device.

[0151] Computer readable program instructions for carrying out operations of the present application can be assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state-setting data, or either source code or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The computer readable program instructions can execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, through the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, programmable logic circuitry, field-programmable gate array (FPGA), or programmable logic array (PLA) can execute the computer readable program instructions by utilizing state information of the computer readable program instructions to personalize the electronic circuitry, in order to perform aspects of the present application.

[0152] The computer readable program instructions can also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable apparatus or other device to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions / acts specified in the flowchart and / or block diagram block or blocks.

[0153] These computer readable program instructions can be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions / acts specified in the flowchart and / or block diagram block or blocks. These computer readable program instructions can also be stored in a computer readable storage medium that can include random access memory (RAM), read only memory (ROM), electrically erasable programmable read only memory (EEPROM), flash memory or other data storage device. When the computer readable program instructions are loaded into the computer and other programmable data processing apparatus, a series of operational steps are implemented that provide processes such that the computer or other programmable apparatus provide processes for implementing the functions / acts specified in the flowchart and / or block diagram block or blocks.

[0154] The computer readable program instructions can also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus or other device to produce a computer implemented process such that the instructions which execute on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in the flowchart and / or block diagram block or blocks.

[0155] The computer readable program instructions can also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus or other device to produce a computer implemented process such that the instructions which execute on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in the flowchart and / or block diagram block or blocks.

[0156] Embodiments of the present application have been described above, and the description is intended to be illustrative, and not restrictive, of the various embodiments of the present application. Many modifications and variations of the described embodiments of the present application are possible, given the benefit of the present disclosure, without departing from the scope and spirit of the described embodiments of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A liquid-cooled plate flow channel design method, characterized in that, The method comprises the following steps: obtaining a first flow channel distribution of a liquid cooling plate, the heat exchange flow channel in the first flow channel distribution repeatedly goes back and forth between a heat generation area of an electronic product and another area different from the heat generation area; determining an initial design domain of a flow channel topology optimization model according to the first flow channel distribution; topology optimizing the flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.

2. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: obtaining at least one sub-flow channel distribution in the first flow channel distribution, the heat exchange flow channel in the sub-flow channel distribution completes one round trip between the heat generation area and the other area; respectively taking the first area corresponding to the sub-flow channel distribution as the initial design domain.

3. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: determining to take all or part of the areas of the first flow channel distribution as the initial design domain according to the performance result corresponding to the first flow channel distribution; wherein the performance result is the result of the performance index indicated by the design requirement.

4. The method of claim 3, wherein, The step of determining to take all or part of the areas of the first flow channel distribution as the initial design domain according to the performance result corresponding to the first flow channel distribution comprises the following steps: obtaining the performance result corresponding to at least one sub-flow channel distribution in the first flow channel distribution, the heat exchange flow channel in the sub-flow channel distribution completes one round trip between the heat generation area and the other area; in the case that the performance result corresponding to the sub-flow channel distribution represents that the performance of the sub-flow channel distribution does not meet the design requirement, taking the first area corresponding to the sub-flow channel distribution as the initial design domain.

5. The method of claim 3, wherein, The initial design domain is part of the areas of the first flow channel distribution, and the step of topology optimizing the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate comprises the following steps: topology optimizing the flow channel distribution corresponding to the initial design domain to obtain a second flow channel distribution; splicing other flow channel distributions outside the part of the areas in the first flow channel distribution and the second flow channel distribution to obtain the target flow channel distribution.

6. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: obtaining a second area corresponding to the position of the heat source in the first flow channel distribution; taking the second area as the initial design domain.

7. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: obtaining a third area in the first flow channel distribution, the third area is an area in the first flow channel distribution except the area of the bent flow channel; taking the third area as the initial design domain.

8. The method of claim 1, wherein, The number of round trips of the heat exchange flow channel is determined through the following steps: obtaining the thickness of the heat exchange flow channel and the size of the heat generation area; determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel; determining the number of round trips of the heat exchange flow channel according to the width of the heat exchange flow channel and the size of the heat generation area.

9. The method of claim 1, wherein, The step of determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel comprises the following steps: obtaining a mapping relationship between the thickness of the flow channel and the width of the flow channel; According to the thickness of the heat exchange channel and the mapping relationship, the width of the heat exchange channel is determined.

10. The method of claim 1, wherein, The topology optimization is performed on the flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate. A target function is obtained, the target function including any one of a heat transfer target function, a flow target function, and a coupling target function, the coupling target function being a target function obtained by coupling the heat transfer target function and the flow target function, the heat transfer target function being determined based on at least one of an ambient temperature and a heat generation coefficient of a corresponding heat source of the liquid cooling plate, the flow target function being determined based on at least one of a first fluid flow velocity corresponding to each grid in the flow channel distribution and a proportion of a fluid domain corresponding to each grid, the first fluid flow velocity including a horizontal velocity and a vertical velocity. The topology optimization is performed on the flow channel distribution corresponding to the initial design domain according to a value of the target function to determine a target flow channel distribution of the liquid cooling plate.

11. A liquid cold plate flow channel design apparatus, comprising: The method comprises: The obtaining module is configured to obtain a first flow channel distribution of a liquid cooling plate, heat exchange channels in the first flow channel distribution repeatedly going back and forth between a heat generation area of the liquid cooling plate and an area other than the heat generation area. The first determining module is configured to determine an initial design domain of a flow channel topology optimization model according to the first flow channel distribution. The second determining module is configured to perform topology optimization on a flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.

12. A storage medium, characterized by A computer program is stored thereon, the computer program being executed by a processor to implement the method of any one of claims 1 to 10.

13. An electronic device, comprising: The memory is configured to store computer instructions, and the processor is configured to call the computer instructions from the memory to execute the method of any one of claims 1 to 10. The memory is configured to store computer instructions, and the processor is configured to call the computer instructions from the memory to execute the method of any one of claims 1 to 10.

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